Installation system and installation method

Abstract

The mounting system disclosed herein comprises: a component supply section that supplies components from a holding component that holds a plurality of components; a mounting section that assembles a pickup component that picks up components from the component supply section; a measuring section that measures the upper surface height of the components held on the holding component; and a lifting mechanism that lifts and lowers the pickup component by a pressing amount that is greater than the upper surface height of the component measured by the measuring section.

Description

Technical Field

[0001] In this manual, an installation system and an installation method are disclosed. Background Art

[0002] In the past, a mounting device has been proposed that uses mounting conditions including height to determine positional information of electronic components to be held or assembled, uses multiple pieces of determined positional information to determine positional deviations of the electronic components for each mounting condition, and uses the determined deviations to determine new mounting conditions for the electronic components (for example, see Patent Document 1). In this device, the height of the suction nozzle is changed based on the positional deviations of the components during holding and assembly, thereby improving the accuracy of holding and assembling the components.

[0003] Prior art literature

[0004] Patent Literature

[0005] Patent Document 1: Japanese Patent Application Laid-Open No. 2014-96509. Summary of the Invention

[0006] Problems to be solved by the invention

[0007] However, in Patent Document 1, although the accuracy of holding and mounting components is improved by changing the height of the suction nozzle, this is still insufficient, and there is a demand for picking up components with higher accuracy.

[0008] The present disclosure has been made in view of such problems, and a main object thereof is to provide a mounting system and a mounting method capable of performing pickup of components with higher accuracy.

[0009] Technical solutions to problems

[0010] In order to achieve the above main objectives, the present disclosure adopts the following technical solutions.

[0011] The installation system disclosed herein has:

[0012] a component supply section that supplies components from a holding member that holds a plurality of components;

[0013] a mounting portion equipped with a pickup component for picking up the component from the component supply portion;

[0014] a measuring unit that measures the height of the upper surface of the component held by the holding member; and

[0015] The lifting mechanism lifts and lowers the pickup member by a pressing amount greater than the upper surface height of the component measured by the measuring unit.

[0016] In this mounting system, the height of the top surface of a component held by a holding member is measured, and a pickup member that picks up the component from a component supply unit is raised or lowered by a press-in amount greater than the measured top surface height of the component. In mounting systems, for example, depending on the type of component, the dimensional accuracy of the component or the gap between the holding member and the component may be relatively large, which can affect the accuracy of component pickup when the pickup member is used. In this mounting system, since the pickup member is raised or lowered by a press-in amount greater than the measured top surface height of the component, it is possible to pick up the component with higher accuracy. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 This is a schematic explanatory diagram showing an example of the mounting system 10 .

[0018] Figure 2 It is an explanatory diagram showing an example of the mounting section 20 and the component supply section 14 .

[0019] Figure 3 It is an explanatory diagram showing an example of information stored in the storage unit 33 .

[0020] Figure 4 This is a flowchart showing an example of an installation processing routine.

[0021] Figure 5 This is a flowchart showing an example of an offset setting processing routine.

[0022] Figure 6 It is an explanatory diagram of the permissible range of the offset value according to the holding member 16 .

[0023] Figure 7 1 is an explanatory diagram showing an example of the offset value display screen 60 . DETAILED DESCRIPTION

[0024] Hereinafter, this embodiment will be described with reference to the drawings. Figure 1 1 is a schematic explanatory diagram showing a mounting system 10 as an example of the present disclosure. Figure 2 It is an explanatory diagram showing an example of the mounting section 20 and the component supply section 14 . Figure 3 This is an explanatory diagram showing an example of mounting condition information 34 and offset information 35 stored in a storage unit 33. The mounting system 10 is configured as a production line in which mounting devices 11 are arranged in the conveying direction of the substrate S for mounting components P on a substrate S as a processing object. Here, the processing object is described as a substrate S, but it is not particularly limited as long as it is a substrate on which components P are mounted, and it may also be a three-dimensional base material. Figure 1 As shown in FIG. 1 , the installation system 10 is composed of an installation device 11, a management device 40, etc. Figure 1Only one mounting device 11 is shown in FIG. In addition, in this embodiment, the left-right direction (X axis), the front-back direction (Y axis) and the up-down direction (Z axis) are as shown in FIG. Figure 1 、 2 shown.

[0025] like Figure 1 As shown, the mounting device 11 includes a substrate processing unit 12, a component supply unit 14, a component imaging unit 18, a mounting unit 20, a control unit 31, and an operation panel 36. The substrate processing unit 12 is a unit that carries out the loading, conveying, fixing at the mounting position, and unloading of the substrate S. The substrate processing unit 12 has two Figure 1 A pair of conveyor belts are provided at intervals in front and behind and are stretched along the left and right directions. The substrate S is transported by the conveyor belts.

[0026] The component supply unit 14 is a unit that supplies components P to the mounting unit 20. This unit includes multiple feeders 15 equipped with reels, each of which is wound with a holding member 16 (tape member) that holds the components. The holding member 16 has holding portions 17 formed at equal intervals as storage spaces, and the holding portions 17 hold the components P. Furthermore, this unit includes a tray unit having a holding member 16B (tray) that arranges and places multiple components P.

[0027] The component imaging unit 18 is a device that captures an image of one or more components P picked up and held by the mounting head 22 from below. When the mounting head 22 that has picked up a component P passes above the component imaging unit 18, the component imaging unit 18 captures an image of the component P and outputs the captured image to the control unit 31. The control unit 31 can use this captured image to detect whether the component P has been properly picked up.

[0028] The mounting section 20 is a unit that picks up components P from the component supply section 14 and arranges the components P on the substrate S fixed to the substrate processing section 12. The mounting section 20 includes a head moving section 21, a mounting head 22, and a suction nozzle 23. In addition, the mounting section 20 includes a lifting mechanism 24 and a measuring section 25. The head moving section 21 includes: a slider that is guided by a guide rail and moves in the XY direction; and a motor that drives the slider. The mounting head 22 picks up one or more components P and moves in the XY direction by the head moving section 21. The mounting head 22 is detachably mounted on the slider. On the lower surface of the mounting head 22, one or more suction nozzles 23 are detachably mounted. The suction nozzle 23 is a picking component that picks up components by using negative pressure. In addition, in addition to the suction nozzle 23, the picking component that picks up the component P may also be a mechanical chuck that mechanically holds the component P.

[0029] like Figure 2As shown, the lifting mechanism 24 is a device that engages with the flange portion of the cylinder body equipped with the suction nozzle 23 to lift the suction nozzle 23 in the vertical direction. The lifting mechanism 24 can be a ball screw mechanism or a linear motor. When the suction nozzle 23 is lowered to the lowest point, the lifting mechanism 24 can fine-tune the position of the front end of the suction nozzle 23 in the vertical direction. The measuring unit 25 measures the upper surface height H of the component P held by the holding member 16 of the component supply unit 14. Figure 2 As shown, the measuring unit 25 is disposed on the lower surface side of the mounting head 22. The measuring unit 25 can measure the distance to the upper surface of the component P by detecting reflected light obtained by irradiation with laser light, for example.

[0030] The control unit 31 is configured as a microprocessor centered around a CPU 32 and includes a storage unit 33 for storing various data. The control unit 31 outputs control signals to the substrate processing unit 12, the component supply unit 14, the operation panel 36, and the mounting unit 20, and inputs signals from the mounting unit 20, the component supply unit 14, the operation panel 36, and the mounting unit 20. The storage unit 33 stores mounting condition information 34 and offset information 35. The mounting condition information 34 is information including the order in which components P are mounted on the substrate S, identification information (ID) of the components P, information on the type of components, and the configuration position (XY coordinates) on the substrate S. The offset information 35 is information including an offset value that indicates the amount of pressure the suction nozzle 23 is pressed from the reference height Hb of the component P when picking up the component P from the holding member 16. In addition to the ID of the holding member 16, the type of the holding member 16, the ID of the component P being held, the type of the component P, and the offset value, the offset information 35 also includes information on the success rate of picking up the component P, that is, the pickup rate, corresponding to the holding member 16. In the mounting device 11, depending on the type of the component P, for example, in the case of a square chip or a micro molded part, the dimensional accuracy and the gap C of the holding portion 17 of the holding member 16 may be relatively large for components P larger than the predetermined size. Figure 2As shown, for example, in component Pa, the top surface is lower than the reference height Hb, resulting in a larger gap Ca. Similarly, some components P have top surfaces higher than the reference height Hb. Therefore, in the mounting device 11, an offset range F is defined, between an upper limit Fa and a lower limit Fb, as the permissible range for setting offset values. This offset range F can be defined as the permissible range for the top surface height H of component P, for which offset values ​​can be set. The upper limit Fa can be, for example, a value that is 10% or 20% of the thickness t of component P upward from the reference height Hb. The lower limit Fb can be, for example, a value that is 20% or 30% of the thickness t of component P downward from the reference height Hb. The offset information 35 includes both designated values ​​input and specified by the operator and values ​​set by the control unit 31 during the offset setting process as offset values. As described above, the type of retaining component is stored in the offset information 35 to estimate the impact on the top surface height H of component P.

[0031] The operation panel 36 is a unit for exchanging information with an operator, and includes a display unit 37 for displaying a screen and an operation unit 38 for the operator to operate.

[0032] The management device 40 is a computer that manages information of each device in the installation system 10. Figure 1 As shown, the management device 40 includes a control unit 41, a storage unit 43, a display unit 47, and an input device 48. The control unit 41 is configured as a microprocessor centered around a CPU 42. The storage unit 43 is a device such as a hard disk drive (HDD) that stores various data, including processing programs. Storage unit 43 stores installation condition information 44, similar to installation condition information 34, and offset information 45, similar to offset information 35. The display unit 47 is a liquid crystal screen that displays various information. The input device includes a keyboard and mouse, etc., for the operator to input various commands.

[0033] Next, the operation of the mounting system 10 of the present embodiment configured as described above, particularly the process of setting the offset value and performing the mounting process, will be described. Figure 4 This is a flowchart showing an example of a mounting process routine executed by the CPU 32 of the control unit 31. This routine is stored in the storage unit 33 and is executed in response to instructions from the operator. When this routine is executed, the CPU 32 reads and obtains the mounting condition information 34 (S100) and executes the offset setting process (S110).

[0034] Figure 5This is a flowchart showing an example of an offset setting processing routine executed by the CPU 32 of the control unit 31. The routine is stored in the storage unit 33 and is executed in S110 of the installation processing routine. When executing the routine, the CPU 32 reads out and obtains the offset information 35 from the storage unit 33 (S200), and determines whether there are components of a predetermined component category among the components P for which the installation processing is performed (S210). The predetermined component category can be determined empirically as a category that affects the picking accuracy when the component P is picked up using a picking component such as a suction nozzle 23. In addition, the predetermined component category can also be a component that is larger than a predetermined size. The "predetermined size" can be determined empirically as a size that affects the picking accuracy when the gap C between the holding component 16 and the component itself is larger than that of other components P, and is a size that affects the picking up of the component P using a picking component such as a suction nozzle 23. As such a component category, it can also be a large square chip component, a micro-molded component, etc. that is manufactured in a relatively rough size. This component category may be, for example, a component category empirically determined to have a low pick-up rate, with the pick-up rate being below a predetermined threshold value when being picked up by the mounting unit 20. In other words, the predetermined component category may be a component category for which the offset value needs to be appropriately adjusted. If no component P of the predetermined component category exists among the components P to be mounted, the CPU 32 immediately terminates this routine and executes the processes from S120 onwards of the mounting process routine.

[0035] On the other hand, in S210, when there is a component P of a predetermined component category among the components P to be mounted, the CPU 32 extracts the corresponding component P and sets the component P as the processing object for setting the offset value from among them (S220). Next, the CPU 32 determines whether an offset value has been specified for the set component P based on the storage content of the offset information 35 (S230). When the offset value has been specified, the CPU 32 omits the offset setting process and executes the processes after S310. In the case of a component P with a low pick-up rate, the operator sometimes specifies the offset value based on experience. In this case, the CPU 32 gives priority to the specified offset value.

[0036] On the other hand, if the offset value is not specified in S230, the CPU 32 executes the height measurement process of the component P (S240). In this process, the CPU 32 moves the measuring unit 25 to the upper side of the component P and measures the distance to the upper surface of the component P (see Figure 2). The CPU 32 can use this measurement result to determine the upper surface height H of the component P and the difference between the upper surface height H and the reference height Hb. Next, the CPU 32 investigates whether the type of the holding member 16 holding the component P whose height has been measured is low or high in dimensional accuracy based on the offset information 35 (S250). Examples of types of holding members 16 with high dimensional accuracy include paper members. Examples of types of holding members 16 with low dimensional accuracy include embossed resin members.

[0037] When the component P is held by the holding member 16a having low dimensional accuracy, the CPU 32 sets a first allowable range, ie, a first deviation range F1, to match the component P and determines whether the measured top surface height H is within the first allowable range (S260). Figure 6 16 is an explanatory diagram of the permissible range of the offset value corresponding to the holding member 16. Figure 6 A is an explanatory diagram of a holding member 16a having low dimensional accuracy. Figure 6 B is an explanatory diagram of the retaining component 16b with high dimensional accuracy. The first offset range F1 is set to a range between an upper limit value Fa1 and a lower limit value Fb1 (for example, +0.1mm to -0.3mm relative to the reference height Hb). When the measured upper surface height H is not within the first allowable range, that is, when the measured upper surface height H is outside the first allowable range, the CPU 32 sets the offset value within the first allowable range (S270) taking into account the reliability of the measured value. When the measured upper surface height H exceeds the upper limit value Fa1, the CPU 32 sets the upper limit value Fa1 as the offset value, and when the measured upper surface height H is lower than the lower limit value Fb1, the CPU 32 sets the lower limit value Fb1 as the offset value. In this way, the CPU 32 can set the offset value within the range of common sense. On the other hand, when the upper surface height H measured in S260 is within the first allowable range, the CPU 32 sets the offset value based on the measured value (S300). The CPU 32 sets the offset value so that the front end of the suction nozzle 23 reaches a position with a predetermined margin added to the measured upper surface height H.

[0038] On the other hand, when the component P is held by the holding member 16b with high dimensional accuracy in S250, the CPU 32 sets a second allowable range, namely, a second offset range F2, to match the allowable range, and determines whether the measured top surface height H is within the second allowable range (S280). The second offset range F2 is set to a range between an upper limit value Fa2 and a lower limit value Fb2. Furthermore, the second offset range F2 is set to a range narrower than the first offset range F1 (e.g., +0.1 mm to -0.2 mm relative to the reference height Hb). The absolute value of the upper limit value Fa2 is less than the absolute value of the upper limit value Fa1, and the absolute value of the lower limit value Fb2 is set to be less than the absolute value of the lower limit value Fb1. For the height of the component P held by the holding member 16b with high dimensional accuracy, a smaller offset range can be set because the deviation in the gap is reduced accordingly. When the measured top surface height H is not within the second allowable range, that is, when the measured top surface height H is outside the second allowable range, the CPU 32 sets the offset value within the second allowable range (S290), taking into account the reliability of the measured value. For example, when the measured top surface height H exceeds the upper limit value Fa2, the CPU 32 sets the upper limit value Fa2 as the offset value, and when the measured top surface height H is lower than the lower limit value Fb2, the CPU 32 sets the lower limit value Fb2 as the offset value. In this way, the CPU 32 can set the offset value within the range of common sense. On the other hand, when the top surface height H measured in S280 is within the second allowable range, the CPU 32 sets the offset value based on the measured value (S300). The CPU 32 sets the offset value so that the tip of the suction nozzle 23 reaches a position with a predetermined margin added to the measured top surface height H. The CPU 32 can set the offset value to a value that is a greater pressing amount than the top surface height H of the component P measured by the measuring unit, for example, any value between 0.1 mm and 0.3 mm or between 0.1 mm and 0.2 mm.

[0039] After S270, S290, and S300, CPU 32 determines whether there is a next component P to be processed (S310). If there is a next component P to be processed, the process from S220 onwards is executed. Specifically, CPU 32 sets the next component P of the predetermined component category. If no offset value has been specified, the process of measuring the height of the top surface of component P and setting the offset value is repeated. On the other hand, if there is no next component to be processed in S310, CPU 32 displays the set offset value (S320) and ends the routine.

[0040] Figure 7This is an explanatory diagram showing an example of an offset value display screen 60 displayed on the display unit 37 of the operation panel 36. The offset value display screen 60 includes a cursor 61, an offset value display bar 62, and a confirmation key 63. The cursor 61 is used to select a column to be modified. The offset value display bar 62 displays the offset value contained in the offset information 35. The offset value display bar 62 includes information such as the ID of the holding component 16 for which the offset value is currently set, the ID of the component P held, the component type, the type of the holding component 16, and the offset values ​​before and after the setting. The confirmation key 63 is pressed to close the screen after confirming the set value. The operator can confirm the changed offset value through this offset value display screen 60. The offset value display screen 60 can be displayed and output by any device of the mounting system 10 and can also be displayed by the display unit 47 of the management device 40 in addition to the display unit 37.

[0041] When the offset setting process is completed in S110 of the installation process routine, the CPU 32 transports and fixes the substrate S (S120), and uses the offset value to make the suction nozzle 23 pick up the component P (S130) based on the configuration order of the installation condition information 34. The CPU 32 uses the offset value corresponding to the component P to lower and raise the suction nozzle 23 to a position where the pressing amount is larger than the upper surface height H of the component P (for example, 0.1mm to 0.3mm, 0.1mm to 0.2mm, etc.). At this time, since the appropriate offset value is specified or set in the offset information 35, the installation unit 20 can further improve the accuracy of picking up the component P. For example, in the past, for components P with low pickup rates such as large square chips and micro-molded components, the operator changed the offset value based on experience to increase the pickup rate. In this installation device 11, since the offset value of the component P that is difficult to pick up is automatically set, the component P can be picked up more reliably without relying on the operator's experience.

[0042] After S130, the CPU 32 moves the picked-up component P and arranges it at a predetermined position on the substrate S (S140). During the movement of the component P, the CPU 32 causes the component imaging unit 18 to photograph the component P picked up by the mounting head 22 to detect whether the component P is properly picked up. The CPU 32 stores the detection result in the storage unit 33. When the component P is arranged on the substrate S, the CPU 32 determines whether there is a next component P to be arranged on the substrate S based on the mounting condition information 34 (S150). When the next component P exists, the CPU 32 executes the processing after S130. That is, the process of picking up the component P and arranging it on the substrate S using the offset value corresponding to the component P is repeated.

[0043] On the other hand, when there is no next component P in S150, the CPU 32 regards that the configuration of the component P to the substrate S is completed, calculates the pick-up rate of each component P configured on the substrate S, and reflects it in the offset information 35 (S160). The CPU 32 may regard the incomplete picking of the component P as a picking failure, or may count the deviation exceeding the threshold when picking up the component P as a picking failure. The picking rate is calculated as the number of successful picks / total number of picks. Next, the CPU 32 determines whether there are components P whose picking rate is lower than the predetermined allowable accuracy (S170). When there are components P whose picking rate is lower than the predetermined allowable accuracy, the offset value (specified value or set value) of the corresponding component P is reset and set to the initial value (S180). The predetermined allowable accuracy can be obtained empirically according to the pick-up rate of other general components, the yield rate of the substrate S, etc. (for example, 0.995, 0.9995, etc.).

[0044] After S180, or when there are no components P with a pickup rate lower than the predetermined allowable accuracy in S170, the CPU 32 determines whether the production of the substrate S is completed (S190). If the production of the substrate S is not completed, the CPU 32 regards the existence of the next substrate S and executes the processing after S120. That is, the process of discharging the mounted substrate S, transporting and fixing the next substrate S, and picking up and arranging the components P using the offset value is repeatedly executed. On the other hand, when production is completed in S190, the CPU 32 ends the routine.

[0045] Here, the correspondence between the components of this embodiment and the components of the present disclosure is clarified. The component supply unit 14 of this embodiment corresponds to the component supply unit of the present disclosure, the mounting unit 20 corresponds to the mounting unit, the measuring unit 25 corresponds to the measuring unit, the lifting mechanism 24 corresponds to the lifting mechanism, the control unit 31 corresponds to the control unit, the holding member 16 corresponds to the holding member, and the suction nozzle 23 corresponds to the pickup member. In addition, in this embodiment, by explaining the operation of the control unit 31, an example of the mounting method of the present disclosure is also clarified.

[0046] The mounting system 10 of the present embodiment described above measures the top surface height H of the component P held by the holding member 16 and raises and lowers the suction nozzle 23, which serves as a pickup member for picking up the component P from the component supply unit 14, by a pressure-increasing amount greater than the measured top surface height H of the component. In the mounting system 10, for example, depending on the type of component P, the dimensional accuracy of the component P or the gap between the portion of the holding member 16 holding the component P may be relatively large, which may affect the pickup accuracy when the pickup member picks up the component P. In this mounting system 10, since the pickup member is raised and lowered by a pressure-increasing amount greater than the measured top surface height H of the component P, the component P can be picked up with higher accuracy. In addition, in the mounting system 10, when the type of component P is a predetermined component type, the measuring unit 25 measures the top surface height H of the component P in the holding member 16, and the offset value used by the lifting mechanism 24 to adjust the pickup height of the mounting unit 20 is set based on the measured top surface height H of the component P. In this mounting system, the top surface height H of the component P is measured for a specific component type to determine the offset value, thereby enabling the picking of the component P with greater accuracy. In this case, the control unit 31 does not perform measurement by the measuring unit 25 or set the offset value if the component P type obtained does not match the predetermined component type. By limiting processing in this control unit 31, processing efficiency can be further improved.

[0047] In addition, when the component P is larger than a predetermined size, the control unit 31 causes the measuring unit 25 to measure the upper surface height H of the component P to set the offset value. In the mounting system 10, for example, when the component P is larger than a predetermined size, the dimensional accuracy of the component P may be rough, which may affect the picking up of the component P using a pickup component such as the suction nozzle 23. In this mounting system 10, for components P larger than a specific size, the upper surface height H of the component P is measured to determine the offset value, so that the component P can be picked up with higher accuracy. At this time, when the component P is smaller than the predetermined size, the control unit 31 does not perform the measurement by the measuring unit 25 and the setting of the offset value. In this mounting system 10, by limiting the processing, the processing efficiency can be further achieved.

[0048] Furthermore, the control unit 31 obtains the type of the holding component 16. When the obtained type of the holding component 16 is a predetermined type with high dimensional accuracy, the control unit 31 sets the offset value using a narrower offset range. In this mounting system 10, a more appropriate offset value can be set according to the type of the holding component 16. Furthermore, when the top surface height H of the component P measured by the measuring unit 25 is outside a predetermined allowable range, the control unit 31 sets the offset value within the allowable range. In this mounting system 10, by setting an offset value within the allowable range, more appropriate component P picking processing can be performed, further improving component P picking accuracy. Furthermore, when an offset value is specified, the control unit 31 does not change the offset value. In this mounting system 10, when an offset value has already been specified, the specified value can be prioritized for component P picking. Furthermore, when an offset value has already been specified, the control unit 31 does not perform measurement by the measuring unit 25. In this mounting system 10, when an offset value has already been specified, processing can be further simplified.

[0049] In addition, the control unit 31 causes the mounting unit 20 to pick up the component P from the holding member 16 at a pickup height obtained using the set offset value. In this mounting system 10, using the set offset value allows the component P to be picked up with higher accuracy. In addition, when the pickup rate of the component P falls below a predetermined allowable pickup accuracy during the pickup process of the component P using the set offset value, the control unit 31 resets the set offset value. In this mounting system 10, by resetting the set offset value, a decrease in the component pickup accuracy can be further suppressed. Furthermore, the control unit 31 uses the offset value display screen 60 to display the offset values ​​before and after being set in the offset setting process routine, so that the operator can confirm the offset value.

[0050] In addition, it goes without saying that the present disclosure is not limited to the above-mentioned embodiments, and can be implemented in various ways as long as it falls within the technical scope of the present disclosure.

[0051] For example, in the above-described embodiment, when the component P is of a predetermined component type, for example, when the component P is larger than a predetermined size, or when it is a square chip or a micro molded part, the upper surface height H of the component P is measured, but the present invention is not particularly limited to this. For example, the control unit 31 may measure the upper surface height H of the component P held by the holding member 16 using the measuring unit 25 regardless of the component type, and cause the lifting mechanism 24 to lift and lower the pickup member with a greater pressing amount than the upper surface height H of the component P measured by the measuring unit 25. In this mounting system 10, the upper surface height H of the component P is measured, and the pickup member is lifted and lowered with a pressing amount that matches it, thereby enabling the component P to be picked up with higher accuracy. In addition, the control unit 31 may also measure the upper surface height H and set the offset value for components other than square chips or micro molded parts.

[0052] In the above embodiment, the offset range F is changed according to the dimensional accuracy of the type of the holding component, but the present invention is not particularly limited to this. This process may also be omitted. In this mounting system 10, the process can be further simplified.

[0053] In the above-mentioned embodiment, when the upper surface height H of the component P measured by the measuring unit 25 exceeds the upper limit value Fa of the predetermined allowable range, the upper limit value Fa is set as the offset value, and when it is lower than the lower limit value Fb, the lower limit value Fb is set as the offset value, but it is not particularly limited to this, and any value within the allowable range may be set as the offset value. With this mounting system 10, it is also possible to perform the picking up of the component P with higher precision. Alternatively, in the above-mentioned embodiment, when the upper surface height H of the component P measured by the measuring unit 25 is outside the predetermined allowable range, the offset value is set within the allowable range, but it is not particularly limited to this, and this processing may be omitted. In this mounting system 10, by relying on and using the measurement value of the measuring unit 25, it is possible to perform the picking up of the component P with higher precision.

[0054] In the above embodiment, when the offset value of the offset information 35 is specified, the offset value is not changed. However, the present invention is not limited to this. Even if the offset value is set, the offset value can be set by measuring the top surface height H of the component P. In this mounting system 10, by giving priority to the measured value, the component P can be picked up with higher accuracy.

[0055] In the above embodiment, when the pickup rate obtained during the picking process of components P using the offset value falls below the predetermined permissible pickup accuracy, the set offset value is reset. However, this is not particularly limiting, and resetting the offset value may be omitted. In this case, the control unit 31 may cause the display unit 37 to display a warning to inform the operator that the validity of the offset value is unclear and that there are components P with a low pickup rate.

[0056] In the above-described embodiment, the set offset value is displayed and output as the offset value display screen 60, but this is not particularly limiting. The display and output of the offset value display screen 60 may also be omitted. This mounting system 10 can simplify processing. Furthermore, the control unit 31 displays the offset values ​​before and after setting, but this is not particularly limiting. The ID of the holding component 16 for which the offset value has been set may be notified, or only the offset value after setting may be notified to the operator. This mounting system 10 allows the operator to identify which holding component 16 has had its offset value changed.

[0057] In the above embodiment, the height H of the top surface of the component P held by the holding member 16 (the belt member attached to the feeder 15) is measured and the offset value of the component P is set. However, the present invention is not particularly limited to this method as long as the holding member holds the component P. For example, the control unit 31 may also measure the height H of the top surface of the component P held by the tray of the tray unit (the holding member 16B) and set the offset value of the component P. In this mounting system 10, the offset value can also be used to more accurately pick up the component P.

[0058] In the above embodiment, the offset value is set by the control unit 31 of the mounting device 11. However, as long as it is performed by a device of the mounting system 10, the offset value is not particularly limited to this. For example, the offset value may be set by the control unit 41 of the management device 40. In this case, the control unit 41 may output a measurement instruction for the top surface height H of the component P to the mounting device 11 and obtain the measurement result from the mounting device 11. In this mounting system 10, as in the above embodiment, it is possible to perform picking up of the component P with higher accuracy.

[0059] In the above-described embodiment, the mounting system of the present disclosure is described as the mounting device 11 , but is not particularly limited thereto and may be a mounting method or a program for executing the mounting method on a computer.

[0060] The mounting system and mounting method disclosed herein may be configured as follows. For example, the mounting system disclosed herein may include a control unit that, when the component category is a predetermined component category, causes the measuring unit to measure the height of the component within the holding member and, based on the measured component height, sets an offset value for adjusting the pickup height of the mounting unit by the lifting mechanism. In this mounting system, when the component category is a predetermined component category, the offset value for adjusting the pickup height of the mounting unit is set based on the height of the component within the holding member measured by the measuring unit. In this mounting system, the offset value is determined by measuring the height of the component within a specific component category, thereby enabling higher accuracy in component pickup. In this case, the control unit may not perform the measurement by the measuring unit and the setting of the offset value when the component category obtained is not the predetermined component category. In this mounting system 10, processing efficiency can be further improved by limiting processing. Here, the "predetermined component category" can be, for example, empirically determined to be a category that affects the pickup accuracy when the pickup unit is used to pick up the component. Examples of such component types include square chip components and micro molded components.

[0061] In the mounting system disclosed in the present invention, the control unit may cause the measuring unit to measure the height of the component to set the offset value when the component is larger than a predetermined size. In the mounting system, for example, when the component is larger than a predetermined size, the dimensional accuracy of the component is sometimes rough, which affects the picking up of the component using a pickup component. In this mounting system, among components larger than a specific component size, the height of the component is measured to determine the offset value, so that the picking up of the component can be performed with higher accuracy. At this time, the control unit may not perform the measurement of the measuring unit and the setting of the offset value when the component is smaller than the predetermined size. In this mounting system, by limiting the processing, the efficiency of the processing can be further achieved. Here, the "predetermined size" can be determined empirically, for example, as a size that has an impact when the component is picked up using a pickup component, by keeping the gap between the component and itself larger than that of other components.

[0062] In the mounting system disclosed herein, the control unit may further obtain the type of the holding component, and when the obtained type of the holding component is a predetermined type with high dimensional accuracy, the control unit may set the offset value using a narrower offset range. In this mounting system, a more appropriate offset value can be set based on the type of the holding component. Examples of types of holding components with high dimensional accuracy include paper components.

[0063] In the mounting system disclosed herein, the control unit may set the offset value to within a predetermined allowable range when the height of the component measured by the measuring unit is outside the allowable range. In this mounting system, by setting the offset value within the allowable range, more appropriate component picking can be performed, further improving component picking accuracy.

[0064] In the mounting system disclosed herein, the control unit may not change the offset value when the offset value is specified. In this mounting system, when an offset value is specified, the specified value can be prioritized for component picking. In this case, the control unit may not perform measurement by the measurement unit when the offset value is specified. Alternatively, the offset value may be specified by an operator.

[0065] In the mounting system disclosed herein, the control unit may cause the mounting unit to pick up the component from the holding member at a pickup height obtained using the set offset value. In this mounting system, the set offset value can be used to perform component pickup with higher accuracy.

[0066] In the mounting system disclosed herein, the control unit may reset the offset value when the component picking process performed using the set offset value falls below a predetermined allowable picking accuracy. In this mounting system, by resetting the set offset value, a decrease in component picking accuracy can be further suppressed.

[0067] The mounting method disclosed herein is used for a mounting device, the mounting device comprising: a component supply portion for supplying components from a holding member holding a plurality of components; a mounting portion for assembling a pickup member for picking up the components from the component supply portion; and a measuring portion for measuring the height of the upper surface of the components held by the holding member. The mounting method includes:

[0068] The setting step sets an offset value for adjusting a pickup height of the mounting portion based on the height of the component on the holding member measured by the measuring portion when the type of the component is a predetermined component type.

[0069] In this mounting method, similar to the aforementioned mounting system, the component height is measured to determine the offset value, thereby enabling component pickup to be performed with greater accuracy. Furthermore, this mounting method may employ any of the aforementioned mounting systems and may include steps utilizing any of the aforementioned mounting systems' functions.

[0070] The installation method disclosed herein may further include a display step of displaying the offset value set in the setting step and the offset value before setting in the setting step. In this installation method, the operator can confirm the offset value.

[0071] Industrial Applicability

[0072] The mounting system and mounting method disclosed herein can be used, for example, in the field of mounting electronic components.

[0073] Description of Reference Numerals

[0074] 10 Mounting system, 11 Mounting device, 12 Substrate processing unit, 14 Component supply unit, 15 Feeder, 16, 16a, 16b, 16B holding member, 17 Holding unit, 18 Component imaging unit, 20 Mounting unit, 21 Head moving unit, 22 Mounting head, 23 Suction nozzle, 24 Lifting mechanism, 25 Measuring unit, 31 Control unit, 32 CPU, 33 Storage unit, 34 Mounting condition information, 35 Offset information, 36 Operation panel, 37 Display unit, 38 Operation unit, 40 Management device , 41 control unit, 42 CPU, 43 storage unit, 44 installation condition information, 45 offset information, 47 display unit, 48 input device, 60 offset value display screen, 61 cursor, 62 offset value display bar, 63 confirmation key, C, Ca gap, F offset range, F1 first offset range, F2 second offset range, Fa, Fa1, Fa2 upper limit value, Fb, Fb1, Fb2 lower limit value, H upper surface height, Hb reference height, P, Pa components, S substrate, t thickness.

Claims

1. A mounting system comprising: a component supply section that supplies components from a holding member that holds a plurality of components; a mounting portion equipped with a pickup component for picking up the component from the component supply portion; a measuring unit for measuring a height of an upper surface of the component held by the holding member; a lifting mechanism for lifting and lowering the pickup member by a pressing amount greater than the upper surface height of the component measured by the measuring section; and a control unit that causes the measuring unit to measure the height of the component on the holding member when the type of the component is a predetermined type of component, and sets an offset value for the lifting mechanism to adjust the pickup height of the mounting unit based on the measured height of the component; The control unit obtains the type of the holding member and sets the offset value using a narrower offset range when the type of the holding member is a predetermined type having high dimensional accuracy.

2. The mounting system of claim 1, wherein: The control unit causes the measuring unit to measure the height of the component and set the offset value when the component has a predetermined size or larger.

3. The mounting system of claim 1, wherein: The control unit sets the offset value within a predetermined allowable range when the height of the component measured by the measuring unit is outside the allowable range. The control unit sets the offset value in any of the following ways: when the height of the component measured by the measuring unit exceeds the upper limit value of a predetermined allowable range, the upper limit value is set as the offset value; when the height of the component measured by the measuring unit is lower than the lower limit value, the lower limit value is set as the offset value; when the height of the component measured by the measuring unit is outside the predetermined allowable range, any value within the allowable range is set as the offset value.

4. The mounting system of claim 2, wherein: The control unit sets the offset value within a predetermined allowable range when the height of the component measured by the measuring unit is outside the allowable range. The control unit sets the offset value in one of the following ways: when the height of the component measured by the measuring unit exceeds the upper limit value of a predetermined allowable range, the upper limit value is set as the offset value; when the height of the component measured by the measuring unit is lower than the lower limit value, the lower limit value is set as the offset value; when the height of the component measured by the measuring unit is outside the predetermined allowable range, any value within the allowable range is set as the offset value.

5. The mounting system according to any one of claims 1 to 4, wherein: The control unit does not change the offset value when the offset value is specified.

6. The mounting system according to any one of claims 1 to 4, wherein: The control unit causes the mounting unit to pick up the component from the holding member at a pickup height obtained using the set offset value.

7. The mounting system of claim 5, wherein: The control unit causes the mounting unit to pick up the component from the holding member at a pickup height obtained using the set offset value.

8. The mounting system according to any one of claims 1 to 4, wherein: The control unit resets the set offset value to an initial value when a predetermined permissible pickup accuracy is lower than a predetermined permissible pickup accuracy in a component pickup process performed using the set offset value.

9. The mounting system of claim 5, wherein: The control unit resets the set offset value to an initial value when a predetermined permissible pickup accuracy is lower than a predetermined permissible pickup accuracy in a component pickup process performed using the set offset value.

10. The mounting system of claim 6, wherein: The control unit resets the set offset value to an initial value when a predetermined permissible pickup accuracy is lower than a predetermined permissible pickup accuracy in a component pickup process performed using the set offset value.

11. The mounting system of claim 7, wherein: The control unit resets the set offset value to an initial value when a predetermined permissible pickup accuracy is lower than a predetermined permissible pickup accuracy in a component pickup process performed using the set offset value.

12. A method for installing a device, The mounting device comprises: a component supply section that supplies components from a holding member that holds a plurality of components; A mounting portion equipped with a pickup member that picks up the component from the component supply portion; and a measuring unit for measuring the height of the upper surface of the component held by the holding member; The installation method includes: a setting step of setting an offset value for adjusting the pickup height of the mounting portion based on the height of the component on the holding member measured by the measuring portion when the category of the component is a predetermined category of the component; In the setting step, the type of the holding member is acquired, and when the type of the holding member is a predetermined type with high dimensional accuracy, the offset value is set using a narrower offset range.

13. The installation method according to claim 12, wherein: The mounting method includes a display step of displaying the offset value set in the setting step and the offset value before being set in the setting step.

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