Die cutting process in-line assembly with support members and production process of unequal height die cutting assemblies

By introducing support components into die-cut products, the problem of indentation caused by uneven product structure was solved, achieving high-precision and high-efficiency production, and improving product yield and production efficiency.

CN116460927BActive Publication Date: 2025-11-11DONGGUAN JPOND IND CO LTD
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Patent Information

Application Number
CN202310364797.2
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2023-04-06
Publication Date
2025-11-11
Estimated Expiration
2043-04-06

AI Technical Summary

Technical Problem

The uneven structural height of die-cut products causes uneven stress on the functional film covering them during production, which can easily lead to indentations and affect product yield and production efficiency.

Method used

The die-cutting assembly and production process employs a support component. The support component is set between the first and second components. The height of the support component is less than 28%-40% of the height of the higher component. The components are symmetrically distributed during the die-cutting process. The width of the cut is 3mm-5mm. The distance between the support component and the outer edge of the first or second component is 0.5mm-1mm. The planar projected area of ​​the support component is greater than 80% of the gap area to support the third component. Waste material from the support component is removed during the die-cutting process.

Benefits of technology

It achieves efficient control of product precision and production efficiency, with dimensional and positional tolerances controlled within ±0.1mm, reducing embossing, improving product yield, increasing production efficiency to 10K/H, and reducing processing difficulty and cost.

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Abstract

The present application relates to a die cutting process assembly with a supporting component, the process assembly comprising at least a backing film layer, a first component, a second component, a third component and a supporting component, wherein: the first component and the second component are attached on the backing film layer at intervals, the supporting component is also attached on the backing film layer and is arranged at intervals between the first component and the second component, that is, the supporting component does not contact the first component and the second component; the third component is simultaneously compounded on the surfaces of the first component, the supporting component and the second component, and does not contact the backing film layer. By arranging the supporting component between the first component and the second component, the third component will not deform excessively and the impression will be reduced during the die cutting process, avoiding the contact between the third component and the backing film layer to affect the product quality, so that the third component as a functional main material has better good product rate and product precision, and the production efficiency is higher.
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Description

Technical fields:

[0001] This invention relates to the field of die-cutting technology, specifically to a die-cutting assembly with supporting components and a production process for die-cutting assemblies with supporting components of unequal height during production. Background technology:

[0002] Die-cut products are mainly produced through processes such as die-cutting, lamination, and waste removal to meet the functional requirements of various electronic devices in confined spaces, including bonding, fixing, shielding, insulation, buffering, heat dissipation, and dust prevention. Some die-cut products have uneven structural heights, with gaps and height differences between components. This causes uneven stress on the functional film covering the product during production, easily resulting in indentations and affecting product yield and production efficiency.

[0003] The conventional approach is to manufacture components of varying heights separately and then assemble them. This method makes it difficult to guarantee the product's dimensional and positional tolerances, and the production efficiency is also low. Summary of the Invention:

[0004] The purpose of this invention is to overcome the above-mentioned shortcomings of the prior art and to provide a die-cutting component with supporting parts and a production process for die-cutting components with supporting parts of unequal height during production.

[0005] The technical solution adopted in this invention is: a die-cutting process component with a supporting member, the process component including at least a base film layer, a first component, a second component, a third component, and a supporting member, wherein: the first component and the second component are attached to the base film layer at intervals, the supporting member is also attached to the base film layer and is disposed at intervals between the first component and the second component, that is, the supporting member does not contact the first component and the second component; the third component is simultaneously laminated on the surface of the first component, the supporting member, and the second component, and does not contact the base film layer.

[0006] The heights of the first component and the second component are not equal, and the height of the supporting component is less than the height of the taller component.

[0007] Preferably, the height of the support component is 28%-40% of the height of the higher component; the planar projected area of ​​the support component is greater than 80% of the gap area between the first component and the second component.

[0008] The support component has at least one break.

[0009] The width of the disconnected portion is 3mm-5mm.

[0010] The support components are symmetrically distributed along the direction of travel of the production line and are divided into at least two parts.

[0011] The planar distance between the outer edge of the support component and the outer edge of the first or second component is 0.5mm to 1mm.

[0012] The first component is ring-shaped, the support component is also ring-shaped and located inside the first component, the second component is located inside the support component, and the third component is ring-shaped and its outer edge contour is similar to that of the first component.

[0013] The present invention also provides a production process for a die-cutting assembly with a support component during the production process. The finished die-cutting assembly includes a first component, a second component, and a third component, wherein the first component and the second component are arranged at intervals, and the third component covers the surfaces of the first component and the second component. In this production process, before the third component covers the surfaces of the first component and the second component, a support component is provided in the gap between the first component and the second component to support the portion of the third component located in the gap, and then the support component is removed in a subsequent process.

[0014] Furthermore, the first component of the die-cutting assembly is annular, the supporting component is also annular and located inside the first component, the second component is located inside the supporting component, and the third component is annular with an outer edge contour similar to the first component, wherein the first component is no higher than 4mm; its manufacturing process includes the following steps:

[0015] Step a: After the first component strip and the first release film strip are laminated, they are die-cut by the first flat die-cutting module, cutting through the first release film strip and forming the inner edge contour line of the first component on the first component strip, and removing the waste material of the first component strip and the first release film strip within the inner edge contour line; then, a layer of first support film strip is attached to the lower surface of the first release film strip.

[0016] Step b: Composite the support component strip from above the first component strip, so that the support component strip covers the hole formed by the inner edge contour line on the first component strip and is composited with the first backing film strip. Then, it is die-cut by the second flat die-cutting module, cutting through the support component strip and half-cutting to the first backing film strip. The outline of the support component is formed by die-cutting and the waste material outside the outline of the support component is removed. At this time, the support component is located in the hole of the inner edge contour line of the first component strip. The space inside the support component is formed to accommodate the second component. The composite strips from bottom to top are the first backing film strip, the first release film strip, the first component strip and the support component located in the hole of the inner edge contour line of the first component strip.

[0017] Step c: Separately composite the constituent materials of the first component to form the second component strip and composite the second support film strip. Die-cut the second component strip halfway through the third flat die-cutting module to the second support film strip, forming the outer contour line of the second component on the second component strip. Remove the waste material of the second component frame. Then align and composite the second support film strip and the second component on it into the composite strip of step b, so that the second component faces down and contacts the first support film strip and is located inside the support component. Then remove the second support film strip. At this time, from bottom to top, the components are: the first support film strip, the first release film strip, the first component strip and the support component located in the hole of the inner contour line of the first component strip, the second component located inside the support component, and the component covering the second component and the support component.

[0018] Step d: The third component strip is laminated on top of the composite strip after step c, and then die-cut using the fourth flat die-cutting module. This cuts through the third component strip and the first component strip, outlining the outer contours of both components. Waste material from both the third and first component strips is then removed from the top frame. During this die-cutting process, because the third component strip is supported by a supporting component below, indentations will not occur due to uneven force distribution. At this point, from bottom to top, the sequence is: first base film strip, first release film strip, the first component on the first release film strip, and the component on the first base film strip. The first component contains a support component and a second component, and a third component is located above the first component, the second component, and the support component. A first protective film strip is then laminated on top of the third component. Finally, the first bottom film strip and the first release film strip attached to it, and the support component are removed from below. Then, the second protective film strip is laminated from below, forming the following sequence from bottom to top: the second protective film strip, the first component and the second component located on the second protective film strip, the third component located on the first component and the second component, and the first protective film strip located above the third component. Finally, the components are cut or wound up as needed.

[0019] In the above process, the die-cutting blade of the second flat die-cutting module has an array of support component outline blades that are symmetrically distributed, and there are gaps between the support component outline blades so that the support component forms at least one break. The width of the break is 3mm-5mm. Setting the break can facilitate the removal of waste material from the support component strip at one time during die-cutting, without affecting the support function.

[0020] The present invention, employing the above-described structure and manufacturing process, has the following advantages:

[0021] Firstly, the present invention can be produced using a one-stop punching process, which, compared with the ordinary method of separate die cutting and reassembly, can more effectively control product precision and has higher production efficiency.

[0022] Secondly, the process of this invention adds a support component between the first component and the second component during the product manufacturing process. While maintaining the high efficiency (the production capacity is increased from 3K / H of assembly and bonding to 10K / H of one-piece molding) and high precision (the form and position tolerance is controlled within ±0.1mm) of the one-stop punching process, it effectively reduces the generation of imprints and improves the product yield.

[0023] Third, the preferred process of this invention is to have support components with symmetrically distributed disconnected parts along the direction of production line travel. This is beneficial for eliminating waste generated during the actual production process without affecting the appearance and position of the product. Alternatively, the support components can be further divided into two symmetrically distributed parts to minimize processing difficulty and control production costs.

[0024] Fourth, the height of the added support component can be lower than that of the lower second component. As long as the height is more than 28% of that of the first component, it can effectively prevent the formation of embossing. Attached image description:

[0025] Figure 1 This is a schematic diagram of the structure of the component with supporting parts in the die-cutting process of the present invention;

[0026] Figure 2 This is a plan view of the first component, the second component, and the supporting component in this invention;

[0027] Figure 3 This is a schematic diagram of the structure of a die-cutting assembly according to an embodiment of the present invention;

[0028] Figure 3-1 These are schematic diagrams of the supporting components in several other embodiments of the present invention;

[0029] Figure 4-1 , Figure 4-2 , Figure 4-3 , Figure 4-4 It is molding Figure 3 A schematic diagram of the flat die-cutting die plane of the die-cutting assembly shown in the embodiment;

[0030] Figure 4-5 yes Figures 4-1 to 4-4 Illustration of the overlay effect. Detailed implementation method:

[0031] like Figures 1-2As shown, the present invention relates to a die-cutting process assembly with a supporting component. This assembly includes at least a base film layer 5, a first component 1, a second component 2, a third component 3, and a supporting component 4. The first component 1 and the second component 2 are attached to the base film layer 5 at intervals. The supporting component 4 is also attached to the base film layer 5 and is spaced between the first component 1 and the second component 2, meaning the supporting component 4 does not contact the first component 1 or the second component 2. The third component 3 is simultaneously laminated to the surfaces of the first component 1, the supporting component 4, and the second component 2, and does not contact the base film layer 5. By providing the supporting component 4 between the first component 1 and the second component 2, the third component 3 at the gap between the first component 1 and the second component 2 during die-cutting will not undergo excessive deformation, and the generation of indentations will be reduced. This prevents it from contacting the base film layer 5 and affecting product quality, resulting in better yield and product precision for the third component 3, which is a functional main material.

[0032] The heights of the first component 1 and the second component 2 are not equal, and the height of the supporting component 4 is less than the height of the taller component.

[0033] The planar distance between the outer edge of the support component 4 and the outer edge of the first component 1 or the second component 2 is 0.5mm to 1mm.

[0034] The first component 1 is ring-shaped, the support component 4 is also ring-shaped and located inside the first component 1, the second component 2 is located inside the support component 4, and the third component 3 is ring-shaped and its outer edge contour is similar to that of the first component 1.

[0035] Preferably, the height of the support component 4 is 28%-40% of the height of the higher component; the planar projected area of ​​the support component 4 is greater than 80% of the gap area between the first component 1 and the second component 2, that is, while maintaining sufficient gap between the support component 4 and the first component 1 and the second component 2, the area occupied by the support component is maximized, which is more conducive to forming a better support effect for the third component 3.

[0036] Combination Figure 3 , Figure 3-1 As shown, the support component 4 has at least one break portion 41, and the support component 4 has a symmetrical structure. The width of the break portion 41 is 3mm-5mm. The break portion 41 can facilitate the removal of waste material from the support component strip at one time during die cutting, without affecting the support function.

[0037] The present invention also provides a manufacturing process for a die-cutting assembly with supporting components during the production process. The finished die-cutting assembly includes a first component 1, a second component 2, and a third component 3, wherein the first component 1 and the second component 2 are arranged at intervals, and the third component 3 covers the surfaces of the first component 1 and the second component 2. In this manufacturing process, before the third component 3 covers the surfaces of the first component 1 and the second component 2, a supporting component 4 is provided in the gap between the first component 1 and the second component 2 to support the portion of the third component 3 located in the gap, and then the supporting component 4 is removed in subsequent processes.

[0038] Furthermore, such as Figure 3 As shown, the first component 1 in the die-cutting assembly is annular, the support component 4 is also annular and located inside the first component 1, the second component 2 is located inside the support component 4, and the third component 3 is annular with its outer edge contour being similar to that of the first component 1, wherein the first component 1 is no higher than 4mm; combined with Figure 4-1 , Figure 4-2 , Figure 4-3 , Figure 4-4 , Figure 4-5 As shown, its production process includes the following steps:

[0039] Step a: After the first component material strip and the first release film material strip are combined, they are die-cut by the first flat die-cutting module M1, cutting through the first release film material strip and forming the inner edge contour line M101 of the first component 1 on the first component material strip, and removing the waste material of the first component material strip and the first release film material strip within the inner edge contour line M101; then, a layer of first support film material strip is attached to the lower surface of the first release film material strip;

[0040] Step b: Composite the support component strip from above the first component strip, so that the support component strip covers the hole formed by the inner edge contour line on the first component strip and is composited with the first backing film strip. Then, it is die-cut by the second flat die-cutting module M2, cutting through the support component strip and half-cutting to the first backing film strip, forming the support component contour line M201 and removing the waste material outside the support component contour line M201. At this time, the support component 4 is located in the hole of the inner edge contour line M101 of the first component strip, and the space inside the support component 4 is formed to accommodate the second component 2. The composite strips from bottom to top are the first backing film strip, the first release film strip, the first component strip and the support component located in the hole of the inner edge contour line of the first component strip.

[0041] Step c: Separately composite the constituent materials of the first component to form the second component strip and composite the second support film strip. Die-cut the second component strip halfway through the third flat die-cutting module M3 to the second support film strip, forming the outer edge contour line M301 of the second component 2 on the second component strip. Remove the waste material of the second component frame. Then align and composite the second support film strip and the second component on it into the composite strip of step b, so that the second component 2 faces down and contacts the first support film strip and is located inside the support component 4. Then remove the second support film strip. At this time, from bottom to top, the components are: the first support film strip, the first release film strip, the first component strip and the support component located in the inner edge contour line hole of the first component strip, the second component located inside the support component, and the component covering the second component and the support component.

[0042] Step d: The third component strip is laminated on top of the composite strip after step c, and then die-cut by the fourth flat die-cutting module M4, cutting through the third component strip and the first component strip and cutting out the outer contour lines M401 of the first and third components, forming the complete third component 3 and first component 1. Then, the waste material of the third component strip and the waste material of the first component strip outside the frame are removed from the top. In this die-cutting, since the third component strip is supported by the support component 4 below, there will be no indentation in the middle due to uneven force. At this time, from bottom to top, the sequence is the first bottom support film strip, the first release film strip, the first component 1 located on the first release film strip, and the first bottom support film strip. The first component 4 and the second component 2 are located on the film strip and inside the first component 1, and the third component 3 is located above the first component 1, the second component 2 and the support component 4. The first protective film strip is then laminated on the third component 3. Finally, the first bottom film strip (i.e. forming the bottom film layer 5) and the first release film strip and the support component attached thereto are removed from below. The second protective film strip is then laminated on from below, forming the following sequence from bottom to top: the second protective film strip, the first component and the second component located on the second protective film strip, the third component located on the first component and the second component, and the first protective film strip located above the third component. Finally, it is cut or wound up as needed.

[0043] In the above process, the die-cutting blade of the second flat die-cutting module M2 has an array of support component outline blades that are symmetrically distributed, and there are gaps between the support component outline blades so that the support component forms at least one break. The width of the break is 3mm-5mm. Setting the break can facilitate the removal of waste material from the support component strip at one time during die-cutting, without affecting the support function.

[0044] In the above process, the first flat die-cutting module is provided with positioning hole blade M102 and positioning post M103, and the second flat die-cutting module M2, the third flat die-cutting module M3 and the fourth flat die-cutting module M4 are all provided with corresponding positioning hole blades so as to align and composite the material strip;

[0045] The present invention, employing the above-described structure and manufacturing process, has the following advantages:

[0046] Firstly, the present invention can be produced using a one-stop punching process, which, compared with the ordinary method of separate die cutting and reassembly, can more effectively control product precision and has higher production efficiency.

[0047] Secondly, the process of this invention adds a support component between the first component and the second component during the product manufacturing process. While maintaining the high efficiency (the production capacity is increased from 3K / H of assembly and bonding to 10K / H of one-piece molding) and high precision (the form and position tolerance is controlled within ±0.1mm) of the one-stop punching process, it effectively reduces the generation of imprints and improves the product yield.

[0048] Third, the preferred process of this invention is to have support components with symmetrically distributed disconnected parts along the direction of production line travel. This is beneficial for eliminating waste generated during the actual production process without affecting the appearance and position of the product. Alternatively, the support components can be further divided into two symmetrically distributed parts to minimize processing difficulty and control production costs.

[0049] Fourth, the height of the added support component can be lower than that of the lower second component. As long as the height is more than 28% of that of the first component, it can effectively prevent the formation of embossing.

[0050] It is understood that the above embodiments are merely exemplary implementations used to illustrate the principles of the present invention, and the present invention is not limited thereto. For those skilled in the art, various modifications and improvements can be made without departing from the spirit and essence of the present invention, and these modifications and improvements are also considered to be within the scope of protection of the present invention.

Claims

1. A manufacturing process for a die-cut assembly with supporting components of unequal height, wherein the finished die-cut assembly comprises a first component, a second component, and a third component, wherein, The first component and the second component are arranged at intervals, and the third component covers the surfaces of the first component and the second component. The characteristic of this manufacturing process is that before the third component covers the surfaces of the first component and the second component, a support component is provided in the gap between the first component and the second component to support the portion of the third component located in the gap, and then the support component is removed in a subsequent process.

2. The production process of the unequal-height die-cut assembly with supporting components as described in claim 1, characterized in that: The first component of the die-cutting assembly is annular, the support component is also annular and located inside the first component, the second component is located inside the support component, and the third component is annular with an outer edge contour similar to the first component. The first component is no more than 4mm high. Its manufacturing process includes the following steps: Step a: After the first component strip and the first release film strip are laminated, they are die-cut by the first flat die-cutting module, cutting through the first release film strip and forming the inner edge contour line of the first component on the first component strip, and removing the waste material of the first component strip and the first release film strip within the inner edge contour line; then, a layer of first support film strip is attached to the lower surface of the first release film strip. Step b: Composite the support component strip from above the first component strip, so that the support component strip covers the hole formed by the inner edge contour line on the first component strip and is composited with the first backing film strip. Then, it is die-cut by the second flat die-cutting module, cutting through the support component strip and half-cutting to the first backing film strip. The outline of the support component is formed by die-cutting and the waste material outside the outline of the support component is removed. At this time, the support component is located in the hole of the inner edge contour line of the first component strip. The space inside the support component is formed to accommodate the second component. The composite strips from bottom to top are the first backing film strip, the first release film strip, the first component strip and the support component located in the hole of the inner edge contour line of the first component strip. Step c: Separately composite the constituent materials of the first component to form the second component strip and composite the second support film strip. Die-cut the second component strip halfway through the third flat die-cutting module to the second support film strip, forming the outer contour line of the second component on the second component strip. Remove the waste material of the second component frame. Then align and composite the second support film strip and the second component on it into the composite strip of step b, so that the second component faces down and contacts the first support film strip and is located inside the support component. Then remove the second support film strip. At this time, from bottom to top, the components are: the first support film strip, the first release film strip, the first component strip and the support component located in the hole of the inner contour line of the first component strip, the second component located inside the support component, and the component covering the second component and the support component. Step d: The third component strip is laminated on top of the composite strip after step c, and then die-cut using the fourth flat die-cutting module. This cuts through the third component strip and the first component strip, outlining the outer contours of both components. Waste material from both the third and first component strips is then removed from the top frame. During this die-cutting process, because the third component strip is supported by a supporting component below, indentations will not occur due to uneven force distribution. At this point, from bottom to top, the sequence is: first base film strip, first release film strip, the first component on the first release film strip, and the component on the first base film strip. The first component contains a support component and a second component, and a third component is located above the first component, the second component, and the support component. A first protective film strip is then laminated on top of the third component. Finally, the first bottom film strip and the first release film strip attached to it, and the support component are removed from below. Then, the second protective film strip is laminated from below, forming the following sequence from bottom to top: the second protective film strip, the first component and the second component located on the second protective film strip, the third component located on the first component and the second component, and the first protective film strip located above the third component. Finally, the components are cut or wound up as needed.

3. The production process of the unequal-height die-cut assembly with supporting components as described in claim 2, characterized in that: The second flat die-cutting module has a symmetrical array of support component outline blades, and there are gaps between the support component outline blades to form at least one break in the support component, with the break width being 3mm-5mm.

4. The production process of the unequal-height die-cut assembly with supporting components during the production process according to claim 1 or 2, characterized in that: The heights of the first component and the second component are not equal, and the height of the supporting component is less than the height of the taller component.

5. The production process of the unequal-height die-cut assembly with supporting components during the production process according to claim 4, characterized in that: The height of the supporting component is 28%-40% of the height of the higher component; the planar projected area of ​​the supporting component is greater than 80% of the gap area between the first component and the second component.

6. The production process of unequal-height die-cutting components with supporting parts according to claim 1, 2, or 3, characterized in that: The planar distance between the outer edge of the support component and the outer edge of the first or second component is 0.5mm to 1mm.

Citation Information

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