Display panel, display device and related manufacturing method

Abstract

The present application provides a display panel, which includes a display area and a non-display area surrounding the display area. The display panel also includes a stacked array substrate, a frame-sealing glue assembly and a color film substrate, and the frame-sealing glue assembly is located in the non-display area. The frame-sealing glue assembly includes a frame-sealing glue and a plurality of curing elements dispersed in the frame-sealing glue, and the curing element includes a shell and a reaction substance arranged in the shell. The array substrate and the color film substrate are boxed, the shell is broken by force, and the reaction substance contacts and reacts with the frame-sealing glue, so that the temperature of the reaction substance increases to cure the frame-sealing glue. Therefore, the technical solution of the present application does not require pre-curing of the frame-sealing glue, simplifies the manufacturing process of the display panel, avoids the contamination of liquid crystal molecules caused by incomplete pre-curing, and thus improves the reliability of the display panel. The present application also provides a display device, a method for manufacturing a curing element, and a method for manufacturing a frame-sealing glue assembly.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display panel, a display device having the display panel, a method for manufacturing a curing element, and a method for manufacturing a frame-sealing adhesive assembly. Background Art

[0002] Liquid crystal displays occupy an increasingly important position in people's lives and work. They have the advantages of thin body, power saving, and low price, so they have been widely used. Liquid crystal displays usually include a display panel and a backlight module. The display panel includes a color filter substrate, an array substrate, a liquid crystal, and a frame sealant. The liquid crystal is arranged in the display area of ​​the display panel, and the frame sealant is arranged in the non-display area of ​​the display panel. The frame sealant seals the liquid crystal between the color filter substrate and the array substrate. After applying the frame sealant, it is usually necessary to perform an ultraviolet (UV) light pre-curing process and a high-temperature heating curing process on the frame sealant in sequence to solidify the frame sealant to bond the color filter substrate and the array substrate.

[0003] However, in the prior art, due to the dense signal lines designed around the periphery of the display panel, the amount of UV light irradiated to the frame sealant is insufficient, resulting in incomplete pre-curing of the frame sealant, which in turn causes the color filter substrate to separate from the array substrate. Moreover, the incompletely pre-cured frame sealant is easily mixed with the diffused liquid crystal, causing the liquid crystal to be contaminated, resulting in poor display around the display panel.

[0004] Therefore, how to solve the problem of incomplete pre-curing of the frame sealant in the prior art is an urgent problem to be solved by those skilled in the art. Summary of the invention

[0005] In view of the above-mentioned deficiencies in the prior art, the purpose of the present application is to provide a display panel, a display device having the display panel, a method for manufacturing a curing element, and a method for manufacturing a frame-sealing glue assembly, aiming to solve the problem of incomplete pre-curing of the frame-sealing glue in the prior art.

[0006] In order to solve the above technical problems, an embodiment of the present application provides a display panel, which includes a display area and a non-display area surrounding the display area. The display panel also includes a stacked array substrate, a frame sealant component and a color film substrate, the frame sealant component is located in the non-display area, and the frame sealant component includes a frame sealant and a plurality of curing elements dispersed in the frame sealant, each of the curing elements includes a shell and a reaction material arranged in the shell. By aligning the array substrate with the color film substrate, the shells of the plurality of curing elements are ruptured by force, and the reaction material in the shell contacts and reacts with the frame sealant, so that the temperature of the reaction material increases to cure the frame sealant.

[0007] In summary, when the display panel provided by the embodiment of the present application is boxed with the array substrate and the color film substrate, the outer shell of the plurality of curing elements is broken by force, the reaction substance overflows from the outer shell, contacts and reacts with the frame-sealing glue, and the temperature of the reaction substance rises to cure the frame-sealing glue. Therefore, the technical solution of the present application does not need to pre-cure the frame-sealing glue, simplifies the manufacturing process, and avoids the contamination of the liquid crystal molecules due to incomplete pre-curing. Moreover, the area with increased temperature is only the area where the frame-sealing glue component is located, and there is no need to heat the entire display panel at high temperature, which avoids the failure of the liquid crystal molecules at high temperature, thereby improving the display effect and reliability of the display panel.

[0008] In an exemplary embodiment, the frame sealant assembly further includes a plurality of supporting elements dispersed in the frame sealant, and the supporting elements are used to maintain a distance between the array substrate and the color filter substrate located in the non-display area.

[0009] In an exemplary embodiment, the curing element further includes a support, the support is disposed in the reaction material, and the support is used to maintain a distance between the array substrate and the color filter substrate located in the non-display area.

[0010] In an exemplary embodiment, the doping ratio of the solidifying element is 5% to 15%.

[0011] In an exemplary embodiment, the diameter of the solidifying element is 1 um to 10 um, and the thickness of the shell is less than or equal to one tenth of the diameter of the solidifying element.

[0012] In an exemplary embodiment, the material of the reaction mass includes calcium oxide, calcium carbide or sodium hydroxide.

[0013] Based on the same inventive concept, an embodiment of the present application further provides a display device, which includes a backlight module and the above-mentioned display panel, and the display panel is arranged on the light-emitting side of the backlight module.

[0014] In summary, the display device provided by the embodiment of the present application includes a backlight module and a display panel. When the array substrate and the color film substrate are aligned, the outer shell of the plurality of curing elements is broken by force, and the reaction substance overflows from the outer shell, contacts and reacts with the frame-sealing glue, and the temperature of the reaction substance rises to cure the frame-sealing glue. Therefore, the technical solution of the present application does not need to pre-cure the frame-sealing glue, simplifies the manufacturing process, and avoids the contamination of the liquid crystal molecules due to incomplete pre-curing. Moreover, the area with increased temperature is only the area where the frame-sealing glue assembly is located, and there is no need to heat the entire display panel at high temperature, which avoids the failure of the liquid crystal molecules at high temperature, thereby improving the display effect and reliability of the display panel.

[0015] Based on the same inventive concept, the embodiment of the present application further provides a method for manufacturing a curing element, which is used to manufacture the curing element of the above-mentioned display panel. The method for manufacturing the curing element includes:

[0016] placing a plurality of reactive substances in a liquid resin;

[0017] stirring the liquid resin mixed with the reaction material;

[0018] Allowing the liquid resin mixed with the reaction substance to stand for a preset time so that the liquid resin forms a protective layer on the surface of the reaction substance;

[0019] A plurality of the reaction materials are taken out, and the protective layer is solidified to form a shell, wherein the shell and the reaction materials constitute a solidified element.

[0020] In summary, the manufacturing method of the curing element provided in the embodiment of the present application includes: placing a plurality of reaction substances in a liquid resin; stirring and mixing the liquid resin with the reaction substances; standing the liquid resin mixed with the reaction substances for a preset time so that the liquid resin forms a protective layer on the surface of the reaction substances; taking out a plurality of the reaction substances, and solidifying the protective layer to form a shell, wherein the shell and the reaction substances constitute a curing element. When the array substrate and the color film substrate are boxed, the shells of the plurality of curing elements are broken by force, the reaction substances overflow from the shells, and contact and react with the sealant, and the temperature of the reaction substances rises to cure the sealant. Therefore, the curing element formed by the manufacturing method of the curing element does not need to pre-cure the sealant, simplifies the process, and thus avoids the contamination of the liquid crystal molecules due to incomplete pre-cure. Moreover, the area where the temperature rises is only the area where the sealant assembly is located, and there is no need to heat the entire display panel at high temperature, which avoids the failure of the liquid crystal molecules at high temperature, thereby improving the display effect and reliability of the display panel.

[0021] In an exemplary embodiment, the preset time is 10 minutes to 20 minutes.

[0022] Based on the same inventive concept, the embodiment of the present application further provides a method for manufacturing a frame-sealing adhesive assembly, which is used to manufacture the frame-sealing adhesive assembly of the above-mentioned display panel. The method for manufacturing the frame-sealing adhesive assembly includes:

[0023] Provide frame sealing glue;

[0024] Adding a plurality of curing elements into the frame sealing adhesive;

[0025] The frame sealing adhesive and the plurality of curing elements dispersed in the frame sealing adhesive are stirred to form a frame sealing adhesive assembly.

[0026] In summary, the method for manufacturing a frame sealant assembly provided in an embodiment of the present application includes: providing a frame sealant; adding a plurality of curing elements to the frame sealant; stirring the frame sealant and the plurality of curing elements dispersed in the frame sealant to form a frame sealant assembly. Therefore, the frame sealant assembly formed by the method for manufacturing a frame sealant assembly does not require pre-curing of the frame sealant, which simplifies the manufacturing process and avoids contamination of the liquid crystal molecules due to incomplete pre-curing. Moreover, the area where the temperature rises is only the area where the frame sealant assembly is located, and there is no need to heat the entire display panel at a high temperature, which avoids the failure of the liquid crystal molecules at high temperatures, thereby improving the display effect and reliability of the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0028] Figure 1 A schematic diagram of the layer structure of a display device disclosed in the first embodiment of the present application;

[0029] Figure 2 It is a front view structural schematic diagram of a display panel disclosed in the second embodiment of the present application;

[0030] Figure 3 This is a schematic diagram of a first layer structure of a display panel disclosed in the second embodiment of the present application;

[0031] Figure 4 for Figure 3 The internal structure schematic diagram of the curing element of the display panel is shown;

[0032] Figure 5It is a schematic diagram showing the influence of the doping ratio of the curing element and the shell thickness of the curing element on the curing rate disclosed in the embodiment of the present application;

[0033] Figure 6 This is a schematic diagram of a second layer structure of a display panel disclosed in the second embodiment of the present application;

[0034] Figure 7 for Figure 6 The internal structure schematic diagram of the curing element of the display panel is shown;

[0035] Figure 8 A schematic flow chart of a method for manufacturing a curing element disclosed in the third embodiment of the present application;

[0036] Fig. 9 It is a schematic flow chart of a method for manufacturing a frame sealing adhesive assembly disclosed in the fourth embodiment of the present application.

[0037] Description of reference numerals:

[0038] 1-display area; 2-non-display area; 10-display panel; 10a-display panel; 11-array substrate; 13-liquid crystal layer; 15-color filter substrate; 17-frame sealant assembly; 30-backlight module; 100-display device; 111-first substrate; 113-driving circuit layer; 115-metal element; 117-insulating layer; 118-pixel electrode; 131-liquid crystal molecule; 151-second substrate; 153-black matrix layer ; 154-light-shielding layer; 155-first color resistance; 156-second color resistance; 157-third color resistance; 158-flat layer; 159-common electrode layer; 171-frame-sealing glue; 173-curing element; 173a-housing; 173b-reacting substance; 173c-support; 175-support element; S10-S40-steps of the method for making the curing element; S110-S130-steps of the method for making the frame-sealing glue assembly. DETAILED DESCRIPTION

[0039] In order to facilitate the understanding of the present application, the present application will be described more fully below with reference to the relevant drawings. The preferred embodiments of the present application are given in the drawings. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present application more thoroughly and comprehensively understood.

[0040] The following descriptions of the embodiments are with reference to the attached diagrams to illustrate specific embodiments that the present application can be used to implement. The serial numbers for the components herein, such as "first", "second", etc., are only used to distinguish the objects described and do not have any order or technical meaning. The "connection" and "coupling" mentioned in the present application, unless otherwise specified, include direct and indirect connections (couplings). The directional terms mentioned in the present application, such as "upper", "lower", "front", "back", "left", "right", "inside", "outside", "side", etc., are only with reference to the directions of the attached drawings. Therefore, the directional terms used are for better and clearer explanation and understanding of the present application, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation to the present application.

[0041] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be fixedly connected, detachably connected, or integrally connected; it can be mechanically connected; it can be directly connected, or indirectly connected through an intermediate medium, or it can be the internal communication of two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances. It should be noted that the terms "first", "second", etc. in the specification and claims of this application and the drawings are used to distinguish different objects, rather than to describe a specific order. In addition, the terms "including", "may include", "include", or "may include" used in this application indicate the existence of the corresponding functions, operations, elements, etc. disclosed, and do not limit one or more other functions, operations, elements, etc. In addition, the terms "including" or "include" indicate the existence of the corresponding features, numbers, steps, operations, elements, components, or combinations thereof disclosed in the specification, and do not exclude the existence or addition of one or more other features, numbers, steps, operations, elements, components, or combinations thereof, and are intended to cover non-exclusive inclusions. It should also be understood that "at least one" described herein means one or more, such as one, two or three, etc., and "plurality" means at least two, such as two or three, etc., unless otherwise clearly defined.

[0042] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used herein in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application.

[0043] See also Figure 1 , Figure 1Schematic diagram of the layer structure of the display device disclosed in the first embodiment of the present application. In the embodiment of the present application, the display device 100 may include a stacked display panel 10 and a backlight module 30, wherein the display panel 10 is arranged on the light emitting side of the backlight module 30, and the display panel 10 is used to display an image under the backlight provided by the backlight module 30.

[0044] In the implementation manner of the present application, the backlight module 30 may be an edge-lit backlight module or a direct-lit backlight module, and the present application does not impose any specific limitation on this.

[0045] It can be understood that the display device 100 can be used in electronic devices including but not limited to tablet computers, laptop computers, desktop computers, mobile phones, car displays, etc. According to the embodiment of the present invention, the specific type of the display device 100 is not particularly limited, and those skilled in the art can design it accordingly according to the specific use requirements of the display device 100, which will not be repeated here.

[0046] In an exemplary embodiment, the display device 100 may also include other necessary components and parts such as a driving board, a power board, a high-voltage board, and a key control board. Those skilled in the art may make corresponding supplements based on the specific type and actual functions of the display device 100, which will not be repeated here.

[0047] See also Figure 2 , Figure 2 The front view of the display panel disclosed in the second embodiment of the present application is a schematic diagram. In the embodiment of the present application, the display panel 10 includes a display area 1 and a non-display area 2 arranged around the display area 1. The display area 1 is used to perform image display, and the non-display area 2 is used to set other auxiliary display components or modules and signal lines.

[0048] In the implementation mode of this application, please refer to Figure 3 , Figure 3 This is a schematic diagram of the first layer structure of the display panel disclosed in the second embodiment of the present application. The display panel 10 includes an array substrate 11, a liquid crystal layer 13, and a color filter substrate 15 which are stacked in sequence. That is, the array substrate 11 and the color filter substrate 15 are opposite and spaced apart, and the liquid crystal layer 13 is disposed between the array substrate 11 and the color filter substrate 15. The liquid crystal layer 13 is located in the display area 1, and the liquid crystal layer 13 includes a plurality of liquid crystal molecules 131. The array substrate 11 and the color filter substrate 15 are used to form a preset electric field, and the preset electric field is used to drive the plurality of liquid crystal molecules 131 to deflect, so as to control the transmittance of the liquid crystal layer 13, so that the display panel 10 displays different grayscales.

[0049] In the embodiment of the present application, the display panel 10 further includes a sealant component 17 located in the non-display area 2, and the sealant component 17 is disposed between the array substrate 11 and the color filter substrate 15, and is located on the periphery of the liquid crystal layer 13 to seal the liquid crystal layer 13 between the array substrate 11 and the color filter substrate 15. The sealant component 17 includes a sealant 171 and a plurality of curing elements 173 dispersed in the sealant 171.

[0050] In the exemplary embodiment, please refer to Figure 3 and Figure 4 , Figure 4 for Figure 3 The schematic diagram of the internal structure of the curing element of the display panel is shown. Each of the curing elements 173 includes a shell 173a and a reaction substance 173b arranged in the shell 173a. When the array substrate 11 and the color film substrate 15 are aligned, the shells 173a of the multiple curing elements 173 are broken by force, and then the reaction substance 173b in the shell 173a contacts and reacts with the sealant 171, and the temperature of the reaction substance 173b rises to solidify the sealant 171. Among them, the alignment refers to: aligning the array substrate 11 with the color film substrate 15, and bonding the array substrate 11 and the color film substrate 15 together through the sealant assembly 17. The curing refers to: the liquid sealant 171 is changed into the solid sealant 171.

[0051] It is understandable that the sealant 171 is a liquid with a certain viscosity before being cured, and it is cured after being heated. The shell 173a of the curing element 173 is squeezed and broken by the array substrate 11 and the color filter substrate 15, and the reaction substance 173b reacts with the water in the sealant 171 and generates a large amount of heat, thereby causing the sealant 171 to be thermally cured. In the prior art, due to insufficient light of ultraviolet (UV) light, the sealant is not pre-cured completely, which easily causes the color filter substrate to separate from the array substrate. Moreover, when the display panel with incomplete pre-curing of the sealant is transported to the thermal curing station, the diffused liquid crystal will mix with the sealant, thereby causing liquid crystal contamination. At the same time, thermal curing requires high-temperature heating of the entire display panel, and the liquid crystal will reach the phase change node at high temperature and fail. The technical solution of the present application does not need to pre-cure the sealant 171, simplifies the process of the display panel 10, and saves costs. Moreover, since the sealant 171 is directly heat-cured, the sealant 171 will not mix with the liquid crystal molecules 131, and the liquid crystal molecules 131 will not be contaminated, so as to avoid poor display around the display panel 10. At the same time, the temperature increase of the reaction material 173b will only increase the temperature of the area where the sealant component 17 is located, and will not increase the temperature of the entire display panel 10. Therefore, the liquid crystal molecules 131 will not fail, and the display effect of the display panel 10 will not be reduced.

[0052] In an exemplary embodiment, the material of the sealant 171 includes but is not limited to heat-curable materials such as single liquid resin and phenol resin. The material of the housing 173a includes but is not limited to resins. The material of the reactive material 173b includes but is not limited to calcium oxide, calcium carbide, sodium hydroxide or other materials that generate high temperatures when in contact with water.

[0053] In summary, when the display panel 10 provided in the embodiment of the present application is boxed with the array substrate 11 and the color film substrate 15, the outer shell 173a of the plurality of curing elements 173 is broken by force, and the reaction substance 173b overflows from the outer shell 173a, contacts and reacts with the frame sealant 171, and the temperature of the reaction substance 173b rises to cure the frame sealant 171. Therefore, the technical solution of the present application does not need to pre-cure the frame sealant 171, simplifies the manufacturing process, and avoids the contamination of the liquid crystal molecules 131 due to incomplete pre-curing. Moreover, the area where the temperature rises is only the area where the frame sealant component 17 is located, and there is no need to heat the entire display panel 10 at a high temperature, which avoids the failure of the liquid crystal molecules 131 at high temperatures, thereby improving the display effect and reliability of the display panel 10.

[0054] In the implementation mode of this application, please refer to Figure 3 The frame-sealing glue assembly 17 also includes a plurality of supporting elements 175 dispersed in the frame-sealing glue 171, and the supporting elements 175 are used to maintain the thickness of the periphery of the display panel 10, that is, the supporting elements 175 are used to maintain the spacing between the array substrate 11 and the color film substrate 15 located in the non-display area 2.

[0055] It is understandable that when the array substrate 11 and the color filter substrate 15 are assembled, the area where the sealant 171 is located (i.e., the periphery of the display panel 10) is prone to uneven thickness, which in turn causes poor display of the display panel 10. Therefore, by providing the support element 175 in the sealant 171, the thickness of the area where the sealant 171 is located is kept consistent.

[0056] In an exemplary embodiment, the overall shape of the support element 175 may be spherical. The material of the support element 175 may be fiberglass, silicon, or plastic.

[0057] In the embodiment of the present application, the doping ratio of the curing element 173 is 5% to 15%, for example, 5%, 6%, 8%, 9%, 11%, 14%, 15%, or other values, and the present application does not impose any specific restrictions on this. The doping ratio of the curing element 173 refers to: the weight ratio of the curing element 173 to the frame sealant 171.

[0058] In the embodiment of the present application, the overall shape of the curing element 173 may be spherical, and its diameter is 1um to 10um, for example, 1um, 3um, 5um, 6um, 8um, 10um, or other values, and the present application does not impose specific restrictions on this. The thickness of the shell 173a may be 0.1um to 1um, for example, 0.1um, 0.2um, 0.4um, 0.7um, 0.9um, 1um, or other values, and the present application does not impose specific restrictions on this. Among them, the thickness of the shell 173a refers to the wall thickness of the hollow spherical shell 173a. It is understandable that the thickness of the shell 173a is not greater than one tenth of the diameter of the curing element 173, so as to avoid the shell 173a being too thick and unable to break after being subjected to force.

[0059] In order to verify the influence of the doping ratio of the curing element 173 and the thickness of the shell 173a on the curing rate of the frame sealant 171, the present application conducts an experimental verification test with the curing element 173 having a diameter of 5um. Among them, curing rate = (enthalpy value of liquid frame sealant - enthalpy value of cured frame sealant) / enthalpy value of liquid frame sealant × 100%, and enthalpy value represents heat.

[0060] See also Figure 5 Compared with Table 1, Figure 5 1 is a schematic diagram showing the effect of the doping ratio of the curing element and the shell thickness of the curing element on the curing rate disclosed in the embodiment of the present application, and Table 1 shows the effect of the doping ratio of the curing element and the shell thickness of the curing element on the curing rate. Figure 5 As can be seen from Table 1, when the doping ratio of the curing element 173 is at least 5%, the curing rate of the frame sealant 171 is high. The larger the doping ratio of the curing element 173, the higher the cost of the frame sealant assembly 17. When the doping ratio of the curing element 173 is greater than 5%, the increase in the curing rate of the frame sealant 171 is small or the curing rate no longer increases. Therefore, in order to save costs, the doping ratio of the curing element 173 is not greater than 15%. That is, in order to save the manufacturing cost of the frame sealant assembly 17 and obtain a higher curing rate of the frame sealant 171, the doping ratio of the curing element 173 ranges from 5% to 15%.

[0061] Moreover, from Figure 5 It can be seen from Table 1 that when the thickness of the outer shell 173a of the curing element 173 is thinner and the doping ratio of the curing element 173 is the same, the curing rate of the frame sealant 171 is higher. When the thickness of the outer shell 173a is greater than 0.5um (one tenth of the diameter of the curing element 173), the pressure when the array substrate 11 and the color film substrate 15 are assembled cannot cause the outer shell 173a of all the curing elements 173 to break, thereby resulting in a low curing rate of the frame sealant 171.

[0062] Table 1 Effect of doping ratio of curing element and shell thickness of curing element on curing rate

[0063]

[0064] In the implementation mode of this application, please refer to Figure 3 , the array substrate 11 includes a first substrate 111, a driving circuit layer 113 and a plurality of metal components 115. The first substrate 111 is disposed on the side of the sealant component 17 facing away from the color film substrate 15, and is located in the display area 1 and the non-display area 2, and is spaced apart from the sealant component 17. The driving circuit layer 113 is disposed on the side of the first substrate 111 facing the liquid crystal layer 13 and is located in the display area 1, and the metal component 115 is disposed on the side of the first substrate 111 facing the sealant component 17 and is located in the non-display area 2. The metal component 115 can be directly in contact with the driving circuit layer 113 to be electrically connected or can be electrically connected to the driving circuit layer 113 through a wire, and the metal component 115 is used to transmit an electrical signal to the driving circuit layer 113.

[0065] In an exemplary embodiment, the array substrate 11 further includes an insulating layer 117, and the insulating layer 117 covers the plurality of metal elements 115 and the driving circuit layer 113 on the first substrate 111, and the liquid crystal layer 13 is located between the insulating layer 117 and the color filter substrate 15. The insulating layer 117 is used to insulate the driving circuit layer 113 from the liquid crystal layer 13 and to insulate the plurality of metal elements 115 from the frame sealant assembly 17.

[0066] In an exemplary embodiment, the array substrate 11 further includes a plurality of pixel electrodes 118, which are arrayed on a side of the insulating layer 117 facing away from the driving circuit layer 113 and located in the display area 1. The driving circuit layer 113 is electrically connected to the plurality of pixel electrodes 118 to control the potential of the pixel electrodes 118.

[0067] In an exemplary embodiment, the driving circuit layer 113 can control the potential of the plurality of pixel electrodes 118 by passive driving (Passive Matrix, PM) or active driving (Active Matrix, AM). Passive driving means that the driving circuit layer 113 directly applies a pulse current to the pixel electrode 118; active driving means that the driving circuit layer 113 is equipped with a thin film transistor with a switching function and a capacitor for storing charge for each pixel electrode 118.

[0068] In an exemplary embodiment, the insulating layer 117 is provided with a plurality of via holes (not shown) penetrating the insulating layer 117, and a conductive element (not shown) is disposed in the via holes. The conductive element is respectively connected to the pixel electrode 118 and the driving circuit layer 113 to electrically connect the pixel electrode 118 and the driving circuit layer 113.

[0069] In the implementation mode of this application, please refer to Figure 3 , the color film substrate 15 includes a second substrate 151, a black matrix layer 153 and a light shielding layer 154. The second substrate 151 is arranged on the side of the sealant assembly 17 facing away from the array substrate 11, and is located in the display area 1 and the non-display area 2, and is spaced from the sealant assembly 17. The black matrix layer 153 is arranged on the side of the second substrate 151 facing the liquid crystal layer 13, and is located in the display area 1. The light shielding layer 154 is arranged on the side of the second substrate 151 facing the sealant assembly 17, and is located in the non-display area 2. The light shielding layer 154 is used to block light to prevent the display panel 10 from having a bright edge.

[0070] In an exemplary embodiment, see Figure 3, the color filter substrate 15 further includes a plurality of first color resists 155, a plurality of second color resists 156, and a plurality of third color resists 157. The plurality of first color resists 155, the plurality of second color resists 156, and the plurality of third color resists 157 are arranged on the side of the second substrate 151 facing the liquid crystal layer 13 and are located in the display area 1. The plurality of first color resists 155, the plurality of second color resists 156, and the plurality of third color resists 157 can be arranged alternately and spaced in sequence. That is, the plurality of first color resists 155, the plurality of second color resists 156, and the plurality of third color resists 157 can be arranged in the manner of: the first color resist 155, the second color resist 156, the third color resist 157, the first color resist 155, the second color resist 156, the third color resist 157, ..., the first color resist 155, the second color resist 156, the third color resist 157, and the adjacent color resists are arranged alternately. The black matrix layer 153 is arranged between adjacent color resists, that is, the black matrix layer 153 is arranged between the first color resist 155 and the second color resist 156 , the black matrix layer 153 is arranged between the second color resist 156 and the third color resist 157 , and the black matrix layer 153 is arranged between the third color resist 157 and the first color resist 155 .

[0071] In an exemplary embodiment, the first color resist 155 is used to convert the backlight provided by the backlight module 30 into a first color light, the second color resist 156 is used to convert the backlight provided by the backlight module 30 into a second color light, and the third color resist 157 is used to convert the backlight provided by the backlight module 30 into a third color light. The black matrix layer 153 is used to prevent color crosstalk between adjacent color resists, that is, the black matrix layer 153 can be used to prevent color crosstalk between the first color resist 155, the second color resist 156, and the third color resist 157.

[0072] In an exemplary embodiment, the backlight may be white light, the first color resist 155 may be red color resist, the second color resist 156 may be green color resist, and the third color resist 157 may be blue color resist. Accordingly, the first color light may be red light, the second color light may be green light, and the third color light may be blue light to achieve full-color display.

[0073] In an exemplary embodiment, the black matrix layer 153 and the light shielding layer 154 may be integrally formed.

[0074] In the implementation mode of this application, Figure 3As shown, the color filter substrate 15 further includes a flat layer 158, which is disposed on the side of the black matrix layer 153 facing away from the second substrate 151 and the side of the light shielding layer 154 facing away from the second substrate 151, and is located in the display area 1 and the non-display area 2. The flat layer 158 is used to make the surface of the color filter substrate 15 facing the liquid crystal layer 13 and the frame sealant assembly 17 flat.

[0075] In an exemplary embodiment, the frame sealing glue assembly 17 is connected between the planar layer 158 and the insulating layer 117 .

[0076] In the embodiment of the present application, the color filter substrate 15 further includes a common electrode layer 159 , which is disposed on a side of the planar layer 158 facing away from the black matrix layer 153 , and the common electrode layer 159 and the plurality of pixel electrodes 118 form the preset electric field.

[0077] In an exemplary embodiment, the display panel 10 may be a display panel in a vertical alignment mode (VA). In other embodiments, the display panel 10 may be a display panel in an in-plane switching mode (IPS) or a display panel in a fringe field switching mode (FFS), that is, the common electrode layer 159 and the pixel electrode 118 are disposed on the same side. The present application does not specifically limit the display mode of the display panel 10.

[0078] This application also provides a second display panel, see Figure 6 , Figure 6 This is a schematic diagram of the second layer structure of the display panel disclosed in the second embodiment of the present application. The difference between the display panel 10a of the second structure and the display panel 10 of the first structure is that the frame sealant component 17 of the display panel 10a of the second structure does not include the support element 175, and the curing element 173 of the display panel 10a of the second structure includes a support 173c. For the description of the similarities between the display panel 10a of the second structure and the display panel 10 of the first structure, please refer to the relevant description of the display panel 10 of the first structure, which will not be repeated here.

[0079] In the implementation mode of this application, please refer to Figure 7 , Figure 7 for Figure 6The schematic diagram of the internal structure of the curing element of the display panel is shown. The curing element 173 includes a shell 173a, a reaction material 173b and a support 173c. The support 173c is arranged in the shell 173a and keeps a distance from the shell 173a. The reaction material 173b is arranged between the shell 173a and the support 173c. That is, the reaction material 173b is arranged in the shell 173a, and the support 173c is arranged in the reaction material 173b. The support 173c is used to maintain the thickness of the periphery of the display panel 10, that is, the support 173c is used to maintain the distance between the array substrate 11 and the color film substrate 15 located in the non-display area 2.

[0080] It can be understood that by forming the support 173c in the shell 173a, the manufacturing process of the frame sealant assembly 17 is simplified. If there is a larger-sized support element 175, since the support element 175 has already achieved support between the array substrate 11 and the color film substrate 15, the force on the curing element 173 is small and it is not easy to break. Therefore, by arranging the support 173c in the shell 173a, the force on the curing element 173 is large, making the shell 173a more likely to break under force, ensuring the curing rate of the frame sealant 171; at the same time, the support 173c can also achieve support between the array substrate 11 and the color film substrate 15, ensuring that the thickness of the area where the frame sealant 171 is located is consistent.

[0081] In an exemplary embodiment, the overall shape of the support 173c may be spherical. The material of the support 173c may be glass fiber, silicon or plastic.

[0082] In the embodiment of the present application, the overall shape of the solidifying element 173 may be spherical, and its diameter is 1um to 10um, for example, 1um, 3um, 5um, 6um, 8um, 10um, or other values, and the present application does not make specific restrictions on this. The thickness of the shell 173a may be 0.1um to 1um, for example, 0.1um, 0.2um, 0.4um, 0.7um, 0.9um, 1um, or other values, and the present application does not make specific restrictions on this. The thickness of the reaction material 173b may be 0.1 to 3um, for example, 0.1um, 0.5um, 1um, 1.7um, 2.1um, 2.5um, 2.8um, 3um, or other values, and the present application does not make specific restrictions on this. Wherein, the thickness of the reaction material 173b refers to: the distance between the outer side and the inner side of the reaction material 173b.

[0083] In summary, when the display panel 10a provided in the embodiment of the present application is boxed with the array substrate 11 and the color film substrate 15, the outer shell 173a of the plurality of curing elements 173 is subjected to force and ruptures, and the reaction substance 173b overflows from the outer shell 173a, contacts and reacts with the frame sealant 171, and the temperature of the reaction substance 173b rises to cure the frame sealant 171. The technical solution of the present application does not require pre-curing of the frame sealant 171, simplifies the manufacturing process, and avoids contamination of the liquid crystal molecules 131 due to incomplete pre-curing. Moreover, the area where the temperature rises is only the area where the frame sealant component 17 is located, and there is no need to heat the entire display panel 10a at high temperature, which avoids the failure of the liquid crystal molecules 131 at high temperature, thereby improving the display effect and reliability of the display panel 10.

[0084] Based on the same inventive concept, the third embodiment of the present application provides a method for manufacturing a curing element, for manufacturing Figures 3 to 7 The curing element 173 shown. For the relevant contents of the curing element involved in the method for making the curing element provided in the third embodiment of the present application, please refer to the relevant description of the curing element in the second embodiment, which will not be repeated here. Figure 8 , Figure 8 This is a schematic flow chart of a method for manufacturing a curing element disclosed in the third embodiment of the present application. The method for manufacturing a curing element may include the following steps.

[0085] S10, placing a plurality of reaction materials 173b in liquid resin.

[0086] Specifically, a reaction container is provided, liquid resin is added into the reaction container, and spherical reaction material 173b is added into the reaction container. The reaction material 173b may be solid, or a support 173c is provided inside the reaction material 173b.

[0087] It is understandable that the water content of the liquid resin is extremely low and the reaction material 173b will not react with the liquid resin.

[0088] S20, stirring and mixing the liquid resin with the reaction material 173b.

[0089] Specifically, the liquid resin mixed with the reaction substance 173 b is stirred at a uniform speed so that the reaction substance 173 b is fully in contact with the liquid resin, so that the surface of the reaction substance 173 b is covered by the liquid resin as much as possible.

[0090] S30, leaving the liquid resin mixed with the reaction material 173b to stand for a preset time, so that the liquid resin forms a protective layer on the surface of the reaction material 173b.

[0091] Specifically, in an exemplary embodiment, the liquid resin mixed with the reaction material 173b is left to stand for a preset time so that the liquid resin forms a protective layer on the surface of each reaction material 173b, wherein the preset time is 10 minutes to 20 minutes.

[0092] It is understandable that the thickness of the protective layer formed after standing for 10 minutes is 0.1um, and the thickness of the protective layer formed after standing for 20 minutes is 1um. To prevent the thickness of the protective layer from exceeding 0.1um to 1um, the preset time is set to 10min to 20min.

[0093] S40 , taking out a plurality of the reaction materials 173 b , and solidifying the protective layer to form a shell 173 a , wherein the shell 173 a and the reaction materials 173 b constitute a solidified element 173 .

[0094] Specifically, the plurality of reaction substances 173b are taken out from the reaction container and placed in an environment of 35 degrees Celsius, and the protective layer on the surface of the reaction substance 173b solidifies to form a shell 173a. The shell 173a and the reaction substance 173b constitute a solidified element 173. The thickness of the shell 173a is the same as the thickness of the protective layer.

[0095] In summary, the manufacturing method of the curing element provided in the embodiment of the present application includes: placing a plurality of reaction substances 173b in a liquid resin; stirring and mixing the liquid resin with the reaction substances 173b; allowing the liquid resin mixed with the reaction substances 173b to stand for a preset time so that the liquid resin forms a protective layer on the surface of the reaction substances 173b; taking out a plurality of the reaction substances 173b, and solidifying the protective layer to form a shell 173a, wherein the shell 173a and the reaction substances 173b constitute a curing element 173. When the array substrate 11 and the color film substrate 15 are assembled, the shells 173a of the plurality of curing elements 173 are broken by force, the reaction substances 173b contact and react with the frame sealant 171, and the temperature of the reaction substances 173b rises to cure the frame sealant 171. The curing element 173 formed by the manufacturing method of the curing element does not need to pre-cure the frame sealant 171, which simplifies the manufacturing process and avoids the contamination of the liquid crystal molecules 131 due to incomplete pre-cure. Moreover, the area where the temperature rises is only the area where the frame sealant component 17 is located, and there is no need to heat the entire display panel at a high temperature, which avoids the failure of the liquid crystal molecules 131 at high temperatures, thereby improving the display effect and reliability of the display panel.

[0096] Based on the same inventive concept, the fourth embodiment of the present application provides a method for manufacturing a frame sealing adhesive assembly, for manufacturing Figures 3 to 7 The frame sealant assembly 17 shown. For the relevant contents of the frame sealant assembly 17 involved in the manufacturing method of the frame sealant assembly provided in the fourth embodiment of the present application, please refer to the relevant description of the frame sealant assembly 17 in the second embodiment, which will not be repeated here. Fig. 9 , Fig. 9 This is a schematic flow chart of a method for manufacturing a frame sealing adhesive assembly disclosed in a fourth embodiment of the present application. The method for manufacturing a frame sealing adhesive assembly may include at least the following steps.

[0097] S110, providing frame sealing glue 171;

[0098] Specifically, in the embodiment of the present application, a cold-sealed frame sealant is prepared, and the cold-sealed frame sealant 171 is thawed at room temperature, and the thawed frame sealant 171 is loaded into a sealant tube.

[0099] S120 , adding a plurality of curing elements 173 into the frame sealing adhesive 171 .

[0100] Specifically, in an embodiment of the present application, a plurality of curing elements 173 of a first weight and a plurality of supporting elements 175 of a second weight are added to the thawed frame-sealing glue 171 in the rubber tube, wherein the curing element 173 includes an outer shell 173a and a reaction substance 173b located in the outer shell 173a; or, a plurality of curing elements 173 of a third weight are added to the thawed frame-sealing glue 171 in the rubber tube, wherein the curing element 173 includes an outer shell 173a, a reaction substance 173b located in the outer shell 173a, and a support 173c located in the reaction substance 173b.

[0101] In an exemplary embodiment, the weight of the frame sealing glue 171 in the glue tube is 50g to 150g, for example, 50g, 70g, 80g, 100g, 130g, 140g, 150g, or other values, which is not specifically limited in the present application.

[0102] In an exemplary embodiment, the mass ratio of the first weight to the frame sealant 171 may be greater than or equal to 5%, the mass ratio of the second weight to the frame sealant 171 may be 1%, and the mass ratio of the third weight to the frame sealant 171 may be greater than or equal to 6%.

[0103] S130 , stirring the frame sealant 171 and the plurality of curing elements 173 dispersed in the frame sealant 171 to form a frame sealant assembly 17 .

[0104] Specifically, the rubber tube is placed in a centrifuge and the centrifuge is started, and the materials in the rubber tube are evenly mixed by the uniform rotation of the centrifuge to form the frame sealing glue assembly 17 , thereby completing the preparation of the frame sealing glue assembly 17 .

[0105] In an exemplary embodiment, the frame-sealing glue 171, the curing element 173, and the supporting element 175 are stirred to form a frame-sealing glue assembly 17, wherein the curing element 173 includes a shell 173a and a reaction substance 173b located in the shell 173a; or, the frame-sealing glue 171 and the curing element 173 are stirred to form a frame-sealing glue assembly 17, wherein the curing element 173 includes a shell 173a, a reaction substance 173b located in the shell 173a, and a support 173c located in the reaction substance 173b.

[0106] In summary, the method for manufacturing a sealant assembly provided in an embodiment of the present application includes: providing a sealant 171; adding a plurality of curing elements 173 to the sealant 171; stirring the sealant 171 and the plurality of curing elements 173 dispersed in the sealant 171 to form a sealant assembly 17. When the array substrate 11 and the color film substrate 15 are assembled, the shells 173a of the plurality of curing elements 173 are broken by force, the reaction material 173b contacts and reacts with the sealant 171, and the temperature of the reaction material 173b rises to cure the sealant 171. The sealant assembly 17 formed by the method for manufacturing the sealant assembly does not require pre-curing of the sealant 171, simplifies the manufacturing process, and avoids contamination of the liquid crystal molecules 131 due to incomplete pre-curing. Moreover, the area where the temperature rises is the area where the frame sealant assembly 17 is located, and there is no need to heat the entire display panel at high temperature, thereby avoiding the failure of the liquid crystal molecules 131 at high temperature, thereby improving the display effect and reliability of the display panel.

[0107] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples" or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0108] It should be understood that the application of this application is not limited to the above examples. For ordinary technicians in this field, they can make improvements or changes based on the above description, and all these improvements and changes should fall within the scope of protection of the claims attached to this application. Ordinary technicians in this field can understand that all or part of the processes of the above embodiments are implemented, and equivalent changes made according to the claims of this application still fall within the scope covered by this application.

Claims

1. A display panel, comprising a display area and a non-display area surrounding the display area, characterized in that: The display panel comprises an array substrate, a frame sealant assembly and a color film substrate which are stacked, the frame sealant assembly is located in the non-display area, the frame sealant assembly comprises a frame sealant and a plurality of curing elements dispersed in the frame sealant, each of the curing elements comprises a shell and a reaction substance arranged in the shell; By aligning the array substrate with the color filter substrate, the outer shells of the plurality of curing elements are ruptured by force, and the reaction material in the outer shell contacts and reacts with the frame sealant, so that the temperature of the reaction material increases to cure the frame sealant; The curing element further includes a support, which is disposed in the reaction material and is used to maintain a distance between the array substrate and the color filter substrate located in the non-display area.

2. The display panel according to claim 1, wherein: The doping ratio of the solidifying element is 5% to 15%.

3. The display panel according to claim 1, wherein: The diameter of the curing element is 1 um to 10 um, and the thickness of the shell is less than or equal to one tenth of the diameter of the curing element.

4. The display panel according to claim 1, wherein: The material of the reaction mass includes calcium oxide, calcium carbide or sodium hydroxide.

5. A display device, characterized in that: It comprises a backlight module and a display panel as claimed in any one of claims 1 to 4, wherein the display panel is arranged on the light emitting side of the backlight module.

6. A method for manufacturing a curing element, characterized in that: A curing element for manufacturing a display panel according to any one of claims 1 to 4, wherein the manufacturing method of the curing element comprises: placing a plurality of reactive substances in a liquid resin; stirring the liquid resin mixed with the reaction material; Allowing the liquid resin mixed with the reaction substance to stand for a preset time so that the liquid resin forms a protective layer on the surface of the reaction substance; A plurality of the reaction materials are taken out, and the protective layer is solidified to form a shell, wherein the shell and the reaction materials constitute a solidified element.

7. The method for manufacturing a curing element according to claim 6, characterized in that: The preset time is 10 minutes to 20 minutes.

8. A method for manufacturing a frame sealing adhesive assembly, characterized in that: A frame-sealing adhesive component for manufacturing a display panel according to any one of claims 1 to 4, wherein the manufacturing method of the frame-sealing adhesive component comprises: Provide frame sealing glue; Adding a plurality of curing elements into the frame sealing adhesive; The frame sealing adhesive and the plurality of curing elements dispersed in the frame sealing adhesive are stirred to form a frame sealing adhesive assembly.

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