Device and method for bending large-size planar target copper backing plate

Abstract

The present invention discloses a device and method for bending a large-sized planar target copper backing plate. The device includes a plurality of support columns, a large-sized planar target copper backing plate arranged directly above the plurality of support columns, and a plurality of pressure columns arranged directly above the large-sized planar target copper backing plate. The plurality of support columns are evenly distributed in the binding area between the large-sized planar target copper backing plate and the planar target, and support columns are arranged at the starting point, center, and end point of the binding area. The top surfaces of the plurality of support columns form an arc-shaped contour, and the support column arranged at the center of the binding area has the lowest height, and the support columns arranged at the starting point and end point of the binding area have the highest height. The plurality of support columns between the first and last support columns are all arranged opposite to the pressure columns. The present invention solves the problem of bulging and bending of a planar target with a length of more than 2 meters after cooling due to the inconsistent thermal expansion coefficients of the large-sized planar target copper backing plate and the bound planar target during the binding process by performing bending pretreatment on the large-sized planar target copper backing plate.

Description

Technical Field

[0001] The invention relates to the technical field of target material manufacturing, in particular to a device and method for bending a copper back plate of a large-size planar target material. Background Art

[0002] Planar targets usually need to be bound to a copper backplane. The target binding technology is directly related to the quality of magnetron sputtering film formation. Conventional target binding technology directly binds the target to the copper backplane. There is nothing wrong with this method when binding small-sized planar targets. However, in recent years, with the increasing market demand for large-size display devices, the specifications of planar targets also need to increase accordingly.

[0003] Since the thermal expansion coefficient of the target material is much smaller than that of copper, if the traditional method is used to bind large-sized flat targets exceeding 2 meters, the copper backing plate will shrink by more than 0.8 cm after the target material is bound and cooled. However, since the target material has been welded to the copper backing plate as a whole, the side of the copper backing plate that is bonded to the target material cannot shrink due to the restriction of the target material, while the side that is not welded to the target material can continue to shrink. As a result, the lengths of the two sides of the copper backing plate are inconsistent, causing it to bend and bulge toward the side welded to the target material. Therefore, an improved method is often used to bind flat targets with a size greater than 2 meters.

[0004] The commonly used improvement method is to pile heavy objects on the target during the binding cooling process to suppress deformation. This binding method usually requires waiting for the target temperature to drop to room temperature before removing it from the binding platform, so it will occupy the binding platform for a long time. Even so, the method of piling heavy objects has a high probability of causing deformation that exceeds the production standard during the binding process of large-size flat targets, and the binding qualification rate is difficult to guarantee, which is not conducive to improving binding efficiency and equipment utilization. Summary of the Invention

[0005] The technical problem to be solved by the present invention is to provide a device and method for bending the copper backing plate of a large-size planar target. By performing bending pretreatment on the copper backing plate of the large-size planar target, the problem of bulging and bending of the backing plate after cooling after binding due to the inconsistent thermal expansion coefficients between the copper backing plate of the large-size planar target and the bound planar target during the binding process is solved. The binding qualification rate is improved, and the utilization efficiency of resources such as equipment and site is improved.

[0006] In order to solve the above technical problems, the technical solution adopted in the present invention is: a device for bending a large-size planar target copper backing plate, comprising a plurality of support columns, a large-size planar target copper backing plate arranged directly above the plurality of support columns, and a plurality of down-pressure columns arranged directly above the large-size planar target copper backing plate, wherein N support columns are provided and N is an odd number greater than 7, and N-2 down-pressure columns are provided. The plurality of support columns are evenly distributed in the binding area between the large-size planar target copper backing plate and the planar target, and support columns are provided at the starting point, center, and end point of the binding area. The top surfaces of the plurality of support columns form an arc-shaped contour, and the support column provided at the center of the binding area has the lowest height, and the support columns provided at the starting point and end point of the binding area have the highest height. The plurality of support columns between the head and tail support columns are arranged opposite to the down-pressure columns, and the plurality of support columns and the down-pressure columns are in rolling contact with the large-size planar target copper backing plate.

[0007] A further improvement of the technical solution of the present invention is that the size of the large-size planar target copper backing plate is greater than 2000 mm.

[0008] A further improvement of the technical solution of the present invention is that the contact parts of the plurality of support columns and the pressing column with the large-size planar target copper backing plate are all rotating rollers made of rigid materials.

[0009] A further improvement of the technical solution of the present invention is that the distance between adjacent support columns is greater than 250 mm, and the distance between adjacent lower pressure columns is equal to the distance between adjacent support columns.

[0010] A further improvement of the technical solution of the present invention is that the radius of the arc-shaped profile formed by the top surfaces of the plurality of support columns is in the range of 5-6 meters.

[0011] A further improvement of the technical solution of the present invention is: a method for bending a large-size planar target copper backing plate, comprising the following steps:

[0012] Step S1, placing a large-sized planar target copper backing plate horizontally on a plurality of evenly distributed support pillars, and support pillars are provided at the starting point, center, and end point of the binding area between the large-sized planar target copper backing plate and the planar target;

[0013] Step S2, moving the plurality of pressing columns downward until the lower surface of the large-size planar target copper backing plate contacts the support columns, then stopping the pressing and maintaining the contact for a period of time, at which point the binding area between the large-size planar target copper backing plate and the planar target is an arc with an included angle between the centers of the arcs ranging from 25° to 35°;

[0014] Step S3, fixing the processed large-size planar target copper backing plate on the binding platform to make it flat and meet the binding requirements;

[0015] Step S4: heating the bonding platform to a temperature of 175° C. to 185° C., and using liquid indium to braze the planar target onto the copper backing plate;

[0016] Step S5: After rapidly cooling to room temperature, loosen the clamp and place the large-size planar target copper backing plate bound with the planar target on a flat horizontal platform to measure the flatness. The acceptance standard is that the maximum unevenness is less than 2 mm from the horizontal platform inspection surface.

[0017] A further improvement of the technical solution of the present invention is that: in step S2, the multiple pressing columns stop pressing and maintain the pressure for 1-3 hours.

[0018] A further improvement of the technical solution of the present invention is that: in step S3, the large-size planar target copper backing plate is fixed on the binding platform by using a clamp to press the edge of the large-size planar target copper backing plate onto the binding platform, so that it is flattened and fits the binding platform under the pressure of the clamp.

[0019] Due to the adoption of the above technical solution, the technical advancements achieved by the present invention are:

[0020] 1. The present invention aims at the pretreatment method for deformation of the copper backing plate of large-sized planar target. By pre-bending the copper backing plate of large-sized planar target, the problem of bulging and bending of the copper backing plate of planar target with a length of more than 2 meters after binding and cooling due to the inconsistent thermal expansion coefficient between the copper backing plate of large-sized planar target and the bound planar target is solved. The binding qualification rate is improved, and the utilization efficiency of equipment, site and other resources is improved.

[0021] 2. In the present invention, the contact parts between the lower pressure column and the support column and the large-size flat target copper backing plate are rollers made of rigid materials. During the pressing process of the large-size flat target copper backing plate, the lower pressure column and the support column can roll relative to the surface of the large-size flat target copper backing plate, thereby providing pressure that is always perpendicular to the contact surface of the large-size flat target copper backing plate. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 This is a schematic diagram of the structure of the device for bending a large-sized flat target copper back plate of the present invention;

[0023] Among them, 1. Support column, 2. Large-size flat target copper backing plate, 3. Down-pressure column. DETAILED DESCRIPTION

[0024] The present invention is described in further detail below in conjunction with the embodiments:

[0025] like Figure 1As shown, a device for bending a large-sized planar target copper backing plate is designed for large-sized planar targets with a size of more than 2000mm. The specific structure includes multiple support columns 1, a large-sized planar target copper backing plate 2 arranged directly above the multiple support columns 1, and multiple pressure columns 3 arranged directly above the large-sized planar target copper backing plate 2. The support columns 1 are provided in N numbers, and N is an odd number greater than 7. The pressure columns 3 are provided in N-2 numbers. The multiple support columns 1 are evenly distributed in the binding area between the large-sized planar target copper backing plate 2 and the planar target, and support columns 1 are provided at the starting point, center, and end point of the binding area. The top surfaces of the multiple support columns 1 form an arc-shaped contour, and the radius of the arc-shaped contour formed by the top surfaces of the multiple support columns 1 is in the range of 5-6 meters. The support column 1 provided at the center of the binding area between the large-sized planar target copper backing plate 2 and the planar target is the lowest in height, and the support columns 1 provided at the starting point and end point of the binding area are the highest in height. The multiple support columns 1 between the head and tail support columns 1 are all arranged opposite to the down-pressing columns 3, and the distance between adjacent support columns 1 is more than 250 mm. The distance between adjacent down-pressing columns 3 is equal to the distance between adjacent support columns 1. The multiple support columns 1 and down-pressing columns 3 are all in rolling contact with the large-sized planar target copper backing plate 2. The contact parts of the multiple support columns 1 and down-pressing columns 3 with the large-sized planar target copper backing plate 2 are all rotating rollers made of rigid material. When the large-sized planar target copper backing plate 2 is pressed down, the down-pressing columns 3 and the support columns 1 can roll relative to the surface of the large-sized planar target copper backing plate 2, thereby providing pressure that is always perpendicular to the contact surface of the large-sized planar target copper backing plate 2.

[0026] A method for bending a large-size planar target copper backing plate comprises the following steps:

[0027] Step S1, placing a large-sized planar target copper backing plate 2 horizontally on a plurality of evenly distributed support columns 1, and support columns 1 are provided at the starting point, center, and end point of the binding area between the large-sized planar target copper backing plate 2 and the planar target;

[0028] Step S2, moving the plurality of pressing columns 3 downward until the lower surface of the large-size planar target copper backing plate 2 contacts each support column, then stopping the pressing, and maintaining the pressure for 1-3 hours. At this time, the binding area between the large-size planar target copper backing plate 2 and the planar target is an arc, and the angle between the center of the arc is in the range of 25°-35°;

[0029] Step S3, fixing the processed large-size planar target copper backing plate 2 on the binding platform so that it is flat and meets the binding requirements, and the large-size planar target copper backing plate 2 is fixed on the binding platform by using a clamp to press the edge of the large-size planar target copper backing plate 2 on the binding platform so that it is flat and fits the binding platform under the pressure of the clamp;

[0030] Step S4: heating the bonding platform to a temperature of 175° C. to 185° C., and using liquid indium to braze the planar target onto the copper backing plate;

[0031] Step S5: After rapidly cooling to room temperature, loosen the clamp and place the large-size planar target copper backing plate 2 bound with the planar target on a flat horizontal platform to measure the flatness. The acceptance standard is that the maximum unevenness is less than 2 mm from the horizontal platform inspection surface.

[0032] Example 1

[0033] The 3000*230*18mm large-scale flat target copper backing plate 2 used to bind a 2640mm long target is placed on the support pillars 1 used for bending. Seven support pillars 1 are provided, starting at one end of the binding area and ending at the other. Support pillars 1 are located at the starting point, center, end point, and equal points of the binding area. For example, for a 2640mm target, the contact points between the support pillars 1 and the large-scale flat target copper backing plate 2 are at 0mm, 440mm, 880mm, 1320mm, 1760mm, 2200mm, and 2640mm, respectively. The lower pressure pillars 3 are divided into five locations, and the contact points between the lower pressure pillars 3 and the large-scale flat target copper backing plate 2 are at 440mm, 880mm, 1320mm, 1760mm, and 2200mm, respectively. Adjust the position of the large-scale flat target copper backing plate 2 according to the corresponding positional relationship between the binding area and the corresponding support pillars 1.

[0034] The pressing column 3 is slowly pressed down until the lower surface of the large-sized planar target copper backing plate 2 contacts each support column 7, and then the pressing is stopped and maintained for 1-3 hours. At this time, the large-sized planar target copper backing plate 2 is pressed into an arc shape by the pressing column 7. The plane formed by the contact points of the support columns 1 at both ends of the binding area and the large-sized planar target copper backing plate 2 is used as the reference plane. The vertical heights of the contact points of the support columns 1 and the large-sized planar target copper backing plate 2 are 0mm, -24mm, -40mm, -54mm, -40mm, -24mm, and 0mm, respectively.

[0035] The large-scale planar target copper backing plate 2 was placed on the binding platform and secured with a fixture. The platform was heated to 175°C and the binding process began. After the bound target cooled to room temperature, it was untied from the binding platform and placed on a horizontal platform. Its flatness was measured using a feeler gauge. The maximum warpage of the large-scale planar target copper backing plate 2 was measured at approximately the center of the target copper backing plate 2, 1.51 mm from the horizontal platform surface, which was within the acceptable range and met the requirements.

[0036] Comparative Example 1

[0037] A flat, unbent, large-size planar target copper back plate 2 of 3000*230*18 mm was fixed on a binding platform, and the binding platform was heated to 175° C. to start binding.

[0038] High-temperature-resistant tape was applied to the bound target surface to prevent scratching. A 50kg stainless steel pressure block was placed on the taped target and evenly distributed across the target. Once the temperature dropped to 150°C, another 50kg stainless steel pressure block was added and evenly distributed across the target. After the target naturally cooled to room temperature, it was placed on a horizontal platform and measured for flatness. The maximum warpage was measured at the center of the copper backing plate, 3.9mm from the horizontal platform surface, falling outside the acceptable range and failing to meet the requirements.

Claims

1. A device for bending a large-size planar target copper backing plate, characterized by: The invention comprises a plurality of support columns (1), a large-size planar target copper backing plate (2) arranged directly above the plurality of support columns (1), and a plurality of pressure columns (3) arranged directly above the large-size planar target copper backing plate (2), wherein the length of the planar target is greater than 2000 mm, the support columns (1) are provided with N and N is an odd number greater than 7, the pressure columns (3) are provided with N-2, the distance between adjacent support columns (1) is greater than 250 mm, the distance between adjacent pressure columns (3) is equal to the distance between adjacent support columns (1), the plurality of support columns (1) are uniformly arranged in the binding area between the large-size planar target copper backing plate (2) and the planar target, and support columns (1) are provided at the starting point, center, and end point of the binding area, the top surfaces of the plurality of support columns (1) form an arc contour, and the binding area The support column (1) arranged at the center is the lowest in height, and the support columns (1) arranged at the starting point and the end point of the binding area are the highest in height. The radius of the arc profile formed by the top surfaces of the plurality of support columns (1) is 5-6 meters. The plurality of support columns (1) between the head and tail support columns (1) are all arranged relative to the down-pressing column (3). The plurality of support columns (1) and the down-pressing column (3) are all in rolling contact with the large-size planar target copper backing plate (2). The contact parts of the plurality of support columns (1) and the down-pressing column (3) with the large-size planar target copper backing plate (2) are all rotating rollers made of rigid materials, so that during the down-pressing process of the large-size planar target copper backing plate, the down-pressing column and the support columns can generate rolling relative to the surface of the large-size planar target copper backing plate, thereby providing pressure that is always perpendicular to the contact surface of the large-size planar target copper backing plate.

2. A method for bending a large-size planar target copper backing plate, characterized in that: The bending device for the large-size planar target copper backing plate according to claim 1 is used, and the specific method includes the following steps: Step S1, placing a large-sized planar target copper backing plate (2) horizontally on a plurality of evenly distributed support columns (1), and support columns (1) are provided at the starting point, center, and end point of the binding area between the large-sized planar target copper backing plate (2) and the planar target; Step S2, moving the plurality of pressing columns (3) downward until the lower surface of the large-size planar target copper backing plate (2) contacts the respective support columns, then stopping the pressing, and maintaining the pressing for a period of time, at which time the binding area between the large-size planar target copper backing plate (2) and the planar target is an arc, and the angle between the center of the arc is in the range of 25°-35°; Step S3, fixing the processed large-size planar target copper backing plate (2) on the binding platform so that it is flat and meets the binding requirements, and the large-size planar target copper backing plate (2) is fixed on the binding platform by using a clamp to press the edge of the large-size planar target copper backing plate (2) on the binding platform so that it is flat and fits the binding platform under the pressure of the clamp; Step S4: heating the bonding platform to a temperature of 175° C. to 185° C., and using liquid indium to braze the planar target onto the copper backing plate; Step S5: After rapidly cooling to room temperature, loosen the clamp and place the large-size planar target copper backing plate (2) bound with the planar target on a flat horizontal platform to measure the flatness. The acceptance standard is that the maximum unevenness is less than 2 mm from the horizontal platform inspection surface.

3. The method for bending a large-size planar target copper backing plate according to claim 2, characterized in that: In step S2, the plurality of pressing columns (3) stop pressing and maintain the pressure for 1-3 hours.

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