Magnetron sputtering system and method

Abstract

The present invention belongs to the field of magnetron sputtering, and specifically relates to a magnetron sputtering system and method, including a vacuum chamber, a material conveying device and at least two coating units; the coating unit includes a coating chamber and a coating mechanism arranged in the coating chamber; the material conveying device is used to convey the substrate through the at least two coating units; the vacuum chamber is connected to a vacuum pumping device, and each coating chamber is separately connected to a process gas filling device. The vacuum pumping device of the present invention is for exhausting air, while the process gas filling device is for filling air. Therefore, different process gas filling devices corresponding to different gas components will not enter other coating chambers. A vacuum pumping device can be used to ensure the coating environment of each coating unit, and each coating unit can have a suitable atmosphere without interfering with each other, which can greatly improve the multi-layer coating effect of the substrate.

Description

Technical Field

[0001] The present invention belongs to the field of magnetron sputtering, and in particular relates to a magnetron sputtering system and method. Background Art

[0002] Multilayer coatings are widely used in many applications, such as optical thin films, electronic devices, sensors, etc. The advantages of multilayer coatings include the ability to control the optical, electrical, and magnetic properties of materials to achieve different functional and performance requirements.

[0003] like Figure 1 As shown, in the prior art, one magnetron sputtering solution for multi-layer coating of substrates is to directly install multiple groups of sputtering targets in a vacuum chamber for sputtering coating. However, this method affects the air pressure atmosphere between different sputtering target units, which will lead to problems such as impurities and gas reactions during the sputtering process, thereby reducing the coating quality and affecting product performance. To address this problem, if better coating quality is required, another magnetron sputtering solution is to sequentially load the substrate into multiple independent magnetron sputtering devices for coating. However, this method has high equipment cost and complex procedures, which is both expensive and time-consuming.

[0004] Therefore, there is a need for an improved magnetron sputtering system for multi-layer coating of substrates, which can solve the problems in the prior art, realize independent coating between multiple groups of sputtering target units, and improve coating quality and production efficiency. Summary of the Invention

[0005] The technical problem to be solved by the present invention is to provide a magnetron sputtering system and method which can ensure that multiple coating units are independent of each other on the basis of simple and reliable structure.

[0006] The present invention provides a magnetron sputtering system, comprising a vacuum chamber, a material conveying device and at least two coating units;

[0007] The coating unit includes a coating chamber and a coating mechanism arranged in the coating chamber, and a substrate feed port and a substrate discharge port are respectively provided on both sides of the coating chamber. At least two coating units are sequentially arranged in the vacuum chamber, and the substrate feed ports and substrate discharge ports of adjacent coating units are correspondingly arranged;

[0008] The material conveying device is used to convey the substrate through at least two coating units;

[0009] The vacuum chamber is connected to a vacuum pumping device, and each coating chamber is individually connected to a process gas filling device.

[0010] Furthermore, the size of the substrate feed port and the substrate discharge port is larger than the size of the substrate.

[0011] Furthermore, the coating chamber is provided with air holes.

[0012] Furthermore, the coating mechanism includes a target material and a magnetron device.

[0013] Furthermore, the process gas filling device includes an inflation mechanism and an inflation tube connected to each other, the inflation mechanism is arranged outside the vacuum chamber, and the inflation tube passes through the vacuum chamber and is connected to the cavity of the coating chamber.

[0014] Furthermore, a plurality of vacuum pumping devices are equidistantly arranged along the length direction of the vacuum chamber, and the plurality of vacuum pumping devices correspond one to one to the coating units.

[0015] Furthermore, the material conveying device is a conveying roller arranged in the coating chamber and / or between two coating chambers, and the upper end surface of the conveying roller is located between the upper end surface and the lower end surface of the substrate feed port and the substrate discharge port.

[0016] Furthermore, the vacuum chamber is provided with a heater and / or a cold trap outside the coating chamber.

[0017] The present invention also provides a magnetron sputtering method, using a magnetron sputtering system, comprising the following steps:

[0018] S1, start the vacuum pumping device to evacuate the vacuum chamber and the coating chamber;

[0019] S2, according to the process requirements of each coating unit, the process gas filling device introduces the set gas composition and / or gas flow rate into the corresponding coating unit;

[0020] S3, the material conveying device conveys the substrate through at least two coating units. When the substrate enters the nth coating unit, the coating mechanism in the nth coating unit is in working state.

[0021] The beneficial effects of the present invention are:

[0022] First, the vacuum pumping device can simultaneously evacuate the vacuum chamber and the coating chamber, thereby improving the vacuum degree of the substrate coating and transportation environment, preventing oxygen, water vapor and other gases from interfering with the substrate film preparation process, and ensuring the coating effect;

[0023] Second, each coating chamber is individually connected to a process gas filling device, which provides a suitable atmosphere according to the process requirements of the process. That is, the process gas filling device fills different coating units with gas components and flow rates that are adapted to their processes, so that each coating chamber has a suitable atmosphere, thereby improving the quality of each coating of the substrate;

[0024] Third, since the vacuum device is for exhausting gas, while the process gas filling device is for filling gas, different process gas filling devices corresponding to different gas components will not enter other coating chambers. Ultimately, a vacuum device can ensure the coating environment of each coating unit, and each coating unit can have a suitable atmosphere without interfering with each other, which can greatly improve the multi-layer coating effect of the substrate;

[0025] Fourth, the method of evacuating gas by the vacuum pumping device and inflating gas by the process gas filling device requires that the coating chamber and the vacuum pumping device be connected. Therefore, the sealing requirements of each coating unit are low, which reduces the requirements and costs of the coating chamber. It is only necessary to ensure the sealing of the vacuum chamber, making the system structure simple and low-cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Attachment Figure 1 A schematic structural diagram of a magnetron sputtering system in the prior art;

[0027] Attachment Figure 2 It is a structural schematic diagram of the present invention.

[0028] In the figure, 1-vacuum chamber; 2-coating unit; 21-coating chamber; 211-substrate feed port; 212-substrate discharge port; 22-coating mechanism; 3-material conveying device; 4-vacuum pumping device; 5-inflating tube; 6-substrate. DETAILED DESCRIPTION

[0029] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments of the present invention without making any creative efforts shall fall within the scope of protection of the present invention.

[0030] It should be noted that all directional indications in the embodiments of the present invention (such as up, down, left, right, front, back, etc.) are only used to explain the relative position relationship, movement status, etc. between the various components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0031] In addition, the terms "first," "second," and so on, used in this disclosure are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referenced. Thus, a feature specified as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of this disclosure, "plurality" means at least two, such as two or three, unless otherwise specifically defined.

[0032] In the present invention, unless otherwise specified or limited, the terms "connection" and "fixation" should be understood in a broad sense. For example, "fixation" can mean fixed connection, detachable connection, or integration; it can mean mechanical connection, electrical connection, physical connection, or wireless communication connection; it can mean direct connection or indirect connection through an intermediate medium; it can mean internal communication between two elements or interaction between two elements, unless otherwise specified. For those skilled in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0033] In addition, the technical solutions between the various embodiments of the present invention can be combined with each other, but it must be based on the fact that ordinary technicians in this field can implement it. When the combination of technical solutions is mutually contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0034] As attached Figure 2 As shown, the present invention provides a magnetron sputtering system, comprising a vacuum chamber 1, a material conveying device 3 and at least two coating units 2;

[0035] The coating unit 2 includes a coating chamber 21 and a coating mechanism 22 disposed in the coating chamber 21. A substrate feed port 211 and a substrate discharge port 212 are respectively disposed on both sides of the coating chamber 21. At least two coating units 2 are sequentially disposed in the vacuum chamber 1, and the substrate feed ports 211 and substrate discharge ports 212 of adjacent coating units 2 are correspondingly disposed.

[0036] The material conveying device 3 is used to convey the substrate 6 through at least two coating units 2;

[0037] The vacuum chamber 1 is connected to a vacuum pumping device 4 , and each coating chamber 21 is individually connected to a process gas filling device.

[0038] The magnetron sputtering system provided by the present invention is suitable for application scenarios where a substrate 6 needs to be subjected to multi-layer coating. By separately providing a coating chamber 21 for each coating mechanism 22 in the vacuum chamber 1, and connecting the vacuum chamber 1 to the vacuum pumping device 4, and each coating chamber 21 is separately connected to the process gas filling device, the following effects are achieved:

[0039] First, the vacuum pumping device 4 can simultaneously evacuate the vacuum chamber 1 and the coating chamber 21, thereby improving the vacuum degree of the substrate coating and transportation environment, preventing oxygen, water vapor and other gases from interfering with the substrate film preparation process, and ensuring the coating effect;

[0040] Second, each coating chamber 21 is individually connected to a process gas filling device. The process gas filling device provides a suitable atmosphere according to the process requirements of the process. That is, the process gas filling device fills different coating units 2 with gas components and flow rates that are adapted to their respective processes, so that each coating chamber 21 has a suitable atmosphere, thereby improving the quality of each coating on the substrate 6.

[0041] Third, since the vacuum pumping device 4 is for exhausting gas, and the process gas filling device is for filling gas, different process gas filling devices corresponding to different gas components will not enter other coating chambers 21. Ultimately, a single vacuum pumping device 4 can ensure the coating environment of each coating unit 2, and each coating unit 2 can have a suitable atmosphere without interfering with each other, which can greatly improve the multi-layer coating effect of the substrate 6.

[0042] Fourth, the vacuuming device 4 evacuates air, and the process gas filling device inflates air. This requires that the coating chamber 21 and the vacuuming device 4 be connected. Therefore, the sealing requirements of each coating unit 2 are low, which reduces the requirements and costs of the coating chamber 21. It is only necessary to ensure the sealing of the vacuum chamber 1, which makes the system structure simple and low-cost.

[0043] In one embodiment, the size of the substrate feed port 211 and the substrate discharge port 212 is larger than the size of the substrate 6. In this embodiment, it can ensure that the substrate 6 can smoothly enter and exit the coating chamber 21, reducing the contact between the substrate 6 and the coating chamber 21, and the coating chamber 21 can be directly connected to the vacuum chamber 1 through the substrate feed port 211 and the substrate discharge port 212, so that the vacuum pumping device 4 can vacuum the coating chamber 21, and the process gas filled into the coating chamber 21 by the process gas filling device overflows into the vacuum chamber 1 and is discharged from the vacuum chamber 1 by the vacuum pumping device 4. In this embodiment, the coating chamber 21 does not need to be additionally provided with a pressure relief device, which can simplify the structure of the vacuum chamber 1.

[0044] In another embodiment, an air hole is provided on the coating chamber 21. In this embodiment, the vacuum chamber 1 and the coating chamber 21 are connected through the air hole. The air hole is used for the vacuum pumping device 4 to vacuum the coating chamber 21, and the process gas filled into the coating chamber 21 by the process gas filling device overflows into the vacuum chamber 1 and is discharged from the vacuum chamber 1 by the vacuum pumping device 4.

[0045] In one embodiment, the coating mechanism 22 includes a target material and a magnetron device, wherein the number and type of target materials of each coating mechanism 22 are determined according to the process requirements. The general principle is that targets with the same preparation process are installed in the coating chamber 21 in one or a pair; and targets with different processes are installed in different coating chambers 21.

[0046] In one embodiment, the process gas filling device includes an interconnected filling mechanism and a filling tube 5, the filling mechanism is arranged outside the vacuum chamber 1, and the filling tube 5 passes through the vacuum chamber 1 and is connected to the cavity of the coating chamber 21 to achieve a reasonable structural layout.

[0047] In one embodiment, a plurality of vacuum pumping devices 4 are equidistantly arranged along the length direction of the vacuum chamber 1, and the plurality of vacuum pumping devices 4 correspond one-to-one to the coating units 2, which can have a better isolation effect, improve the vacuum degree of the vacuum chamber 1, and provide a vacuum environment that meets the requirements for the vacuum chamber 1 and the coating chamber 21.

[0048] In one embodiment, the material conveying device 3 is a conveying roller arranged in the coating chamber 21 and / or between two coating chambers 21, and the upper end surface of the conveying roller is located between the upper end surface and the lower end surface of the substrate feed port 211 and the substrate discharge port 212. The conveying roller has a simple and reliable structure and can maintain horizontality and stability during the conveying of the substrate 6.

[0049] In one embodiment, the vacuum chamber 1 is provided with a heater and / or a cold trap outside the coating chamber 21, wherein a heater can be provided in each coating chamber 21, and the coating temperature of the coating unit 1 can be controlled individually.

[0050] The present invention also provides a magnetron sputtering method, using the above magnetron sputtering system, comprising the following steps:

[0051] S1, start the vacuum pumping device 4 to vacuum the vacuum chamber 1 and the coating chamber 21;

[0052] S2, according to the process requirements of each coating unit 2, the process gas filling device introduces the set gas composition and / or gas flow rate into the corresponding coating unit 2; if a specific stable temperature is required, the heater can also be turned on to control the temperature to further improve the coating effect;

[0053] S3, the material conveying device 3 conveys the substrate 6 through at least two coating units 2. When the substrate 6 enters the nth coating unit 2, the coating mechanism 22 in the nth coating unit 2 is in a working state. Among them, multiple coating units 2 can continue to maintain a working state, or can be opened before the substrate 6 enters.

[0054] The contents not described in detail in this specification belong to the prior art known to professional and technical personnel in this field.

Claims

1. A magnetron sputtering system, characterized in that: It comprises a vacuum chamber (1), a material conveying device (3), and at least two coating units (2); The coating unit (2) comprises a coating chamber (21) and a coating mechanism (22) arranged in the coating chamber (21); a substrate feed port (211) and a substrate discharge port (212) are respectively arranged on both sides of the coating chamber (21); at least two coating units (2) are sequentially arranged in the vacuum chamber (1), and the substrate feed ports (211) and substrate discharge ports (212) of adjacent coating units (2) are correspondingly arranged; The material conveying device (3) is used to convey the substrate (6) through at least two coating units (2); The vacuum chamber (1) is connected to a vacuum pumping device (4), and each coating chamber (21) is individually connected to a process gas filling device; The coating chamber (21) is provided with air holes, and a plurality of vacuum pumping devices (4) are provided at equal intervals along the length direction of the vacuum chamber (1), and the plurality of vacuum pumping devices (4) correspond one to one to the coating units (2).

2. The magnetron sputtering system according to claim 1, wherein: The sizes of the substrate feed port (211) and the substrate discharge port (212) are larger than the size of the substrate (6).

3. The magnetron sputtering system according to any one of claims 1 to 2, characterized in that: The coating mechanism (22) comprises a target material and a magnetron device.

4. The magnetron sputtering system according to any one of claims 1 to 2, wherein: The process gas filling device comprises an inflation mechanism and an inflation tube (5) connected to each other, the inflation mechanism is arranged outside the vacuum chamber (1), and the inflation tube (5) passes through the vacuum chamber (1) and is connected to the cavity of the coating chamber (21).

5. The magnetron sputtering system according to any one of claims 1 to 2, wherein: The material conveying device (3) is a conveying roller arranged in the coating chamber (21) and / or between two coating chambers (21), and the upper end surface of the conveying roller is located between the upper end surface and the lower end surface of the substrate feed port (211) and the substrate discharge port (212).

6. The magnetron sputtering system according to any one of claims 1 to 2, characterized in that: The vacuum chamber (1) is located outside the coating chamber (21) and is provided with a heater and / or a cold trap.

7. A magnetron sputtering method, characterized in that: Using the magnetron sputtering system according to any one of claims 1 to 6 comprises the following steps: S1, turning on the vacuum pumping device (4) to evacuate the vacuum chamber (1) and the coating chamber (21); S2, according to the process requirements of each coating unit (2), the process gas filling device introduces a set gas composition and / or gas flow rate into the corresponding coating unit (2); S3, the material conveying device (3) conveys the substrate (6) through at least two coating units (2), and when the substrate (6) enters the nth coating unit (2), the coating mechanism (22) in the nth coating unit (2) is in an operating state.

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