Compact micro-platform for optical transceiver assembly

Abstract

An optical transceiver assembly (100) for transmitting and detecting a plurality of optical signals, integrated with a silicon photonics platform having a folded optical path, includes a housing cavity (105) and a top cover (110) to enclose elements in the optical transceiver assembly (100) other than the housing cavity (105) and the top cover (110), a bottom housing module (115) housing an optical micro-integration (130). In particular, the optical transceiver assembly (100) is operatively configured to establish optical electrical communication with an external environment.

Description

TECHNICAL FIELD

[0001] Embodiments of the present invention relate to the field of optical assemblies, and more particularly to optical assemblies for transmitting and detecting optical signals. BACKGROUND

[0002] There are many advantages to transmitting optical signals through optical waveguides, and thus many uses. A single or multiple optical waveguides can be used to transmit visible light to a remote location. Complex telecommunication and data communication systems can transmit multiple specific optical signals. Data communication systems include devices that couple optical fibers in an end-to-end relationship, the devices including optoelectronic or photonic devices that include optical components and electronic elements that can be used to find, detect, and / or control light, to convert between optical and electrical signals, to achieve high speed and high capacity data communication capabilities.

[0003] Data communication network traffic is now increasing substantially at a rate of 30% per year. Such a large and rapid growth will not be sustainable from an economic and environmental point of view if current technologies are used. A breakthrough technology for handling this information explosion is high-density photonic integration on ultra-small photonic devices.

[0004] Integration as the last step to realize the entire functionality plays an important role in the system. Monolithic integration has been realized by using standard complementary CMOS fabrication processes and has been continuously developed to achieve commercialization. Despite the advantages of monolithic integration for being more compact and low cost, there are always challenges in implementing this technology in silicon photonics on a monolithic silicon. The key issue for such monolithic lasers is that it is very difficult to efficiently couple light from the laser active region into the silicon photonic PIC. This is the reason why hybrid approaches still dominate the current silicon photonic system integration technology. Most of the complex functionalities and structures have to be built by hybrid integration.

[0005] In hybrid integration, both the laser source and the PIC are independently integrated on a specific platform, which serves as a pedestal to provide mechanical support for them. Electrical interconnections are also implemented on the platform. Since both the laser and the PIC are sensitive to external stress and ambient temperature, the platform should not only provide stable support, but also protect them from external mechanical or thermal disturbances. Humidity and dust should be more robustly maintained, which can affect the lifetime of the optical components and block the optical path, respectively.

[0006] As an active component with high heat density, the laser tends to cause high temperature when operating, affecting its own performance. How to make the laser reach thermal stability is a new challenge. The active cooling solution is usually achieved by adding a thermoelectric cooler (TEC). In a general photonic integrated circuit (PIC) package, including a PIC as a function executor and a laser as a light source, careful design of thermal management in operation is needed to keep the system working normally.

[0007] To prevent external interference, a mechanical isolation system is preferred. This system should have the ability to isolate the stress caused by external mechanical interference such as bending, extrusion, impact and vibration. An independent system will provide a stable environment for the laser and PIC to work according to its design point without the attenuation caused by external disturbance.

[0008] To implement the active cooling system, the TEC is usually attached to the platform below with its cold surface. The heat generated by the laser or other active components can be propagated through the heat dissipation path of the platform. Then, the TEC brings the heat to its hot surface through electricity. The efficiency of the TEC is affected by its active area with peltier pillars. In general, compared with components with length and width aspect ratio greater than 1, peltier pillars uniformly distributed in the component area with length and width aspect ratio close to 1 show good performance, which means that the closer to the square area is the preferred shape to achieve better heat dissipation performance. Therefore, for the platform supporting the PIC and the laser, a similar square shape is also preferred. In the integration of the laser source and the PIC, it is simple to align the laser source and the PIC in the same optical path in a straight line. However, the length along the optical path will be the combination of the length of the laser source and the length of the PIC, resulting in a longer dimension along the optical path, which requires the supporting platform to have a larger aspect ratio. This is not expected because the TEC with such a large aspect ratio has an effective active area only near the center, and the heat far from the center is not effectively dissipated. Therefore, the need for compact integration of the laser and the PIC poses a challenge to the integration of some lasers with longer dimensions, such as external cavity lasers.

[0009] Therefore, a compact transceiver assembly with a hermetic environment is proposed, which can overcome the effects of humidity and dust to ensure product reliability when assembled in a module. SUMMARY

[0010] Various aspects of the disclosed embodiments seek to provide an optical transceiver assembly for an optical transceiver and a method for transmitting and detecting optical signals thereof. The optical transceiver assembly for transmitting and detecting optical signals is integrated with a silicon photonics platform having a folded optical path. The optical transceiver assembly includes a housing cavity with a top cover to enclose the optical transceiver assembly with an optical micro-integration having an optical micro-platform, a light source, a photonic integrated circuit (PIC), a cradle, a prism, and a thermoelectric temperature controller (TEC). The optical micro-platform is configured to deposit the photonic integrated circuit (PIC), the light source, a plurality of passive optical components, and a printed circuit board (PCB). In particular, the prism folds the light from the laser source in an opposite direction from the original path, the cradle secures the optical micro-platform and supports the optical micro-integration, and the thermoelectric temperature controller (TEC) cools the heat-generating elements in the optical transceiver assembly. Further, the optical micro-platform has a coefficient of thermal expansion that is the same as the photonic integrated circuit (PIC).

[0011] According to embodiments of the present invention, the thermoelectric temperature controller (TEC) is deposited on the cradle. In particular, the cold surface of the thermoelectric temperature controller (TEC) is placed towards the optical micro-platform.

[0012] According to embodiments of the present invention, the light source is configured to emit an output optical signal. In particular, the light source is a laser source. Further, the laser source is located on one side of the photonic integrated circuit (PIC). Moreover, the laser source emits light in an opposite direction from the photonic integrated circuit (PIC) optical path.

[0013] The photonic integrated circuit (PIC) manipulates the light beam to produce an optical signal and emit the optical signal to passive optical components for output, such as a circulator and a polarizing beam splitter (PBS). The circulator distributes the received light beam to the "Rx" input of the photonic integrated circuit (PIC). Further, the polarizing beam splitter (PBS) reflects light rays while allowing light in one polarization (P) to pass unimpeded.

[0014] The plurality of passive optical components can include, but is not limited to, a lens or a lens array.

[0015] The flexible printed circuit board (PCB) establishes signal connections between the internal printed circuit board (PCB) and the external printed circuit board (PCB) located on the bottom housing module. Further, the internal printed circuit board (PCB) can house a transimpedance amplifier and other electronic components to amplify the optical signal.

[0016] According to embodiments of the present invention, the optical micro-platform can further include critical electrical components and flexible electrical connectors.

[0017] According to embodiments of the present application, the housing chamber includes a top housing module with a top cover enclosing the housing chamber with the optical transceiver assembly, a bottom housing module at the bottom of the housing chamber, a transparent optical window establishing electrical and optical communication with the outside, and one or more securing features at the bottom cover of the bottom housing module securing the optical transceiver assembly to the bottom housing module.

[0018] According to embodiments of the present application, the housing chamber and the top cover can have one or more slots at the electrical inlet and / or electrical outlet points. In particular, the one or more slots are filled with epoxy to hermetically seal the optical transceiver assembly.

[0019] According to embodiments of the present application, the housing chamber is secured to the bottom housing module by a hard securing method. Further, the optical micro-integration is secured to the housing chamber by a soft epoxy, and the cradle is secured to the chamber at the bottom housing module by a soft securing method.

[0020] The optical transceiver assembly is configured to establish optical electrical communication with the outside. In particular, the electrical connection is made through a flexible printed circuit board (PCB) and a transparent optical window for the light beam.

[0021] Another embodiment of the present application relates to a method for transmitting and detecting optical signals through an optical transceiver assembly integrated with a silicon photonics platform having a folded optical path. The method includes the steps of placing laser light sources emitting light in opposite directions next to a photonic integrated circuit (PIC), folding the light beams from the laser light sources in the opposite direction of the original path through a prism, directing the light beams folded through the prism and a plurality of passive optical components to the input of the photonic integrated circuit (PIC), manipulating the light beams through the photonic integrated circuit (PIC) to form a plurality of optical signals, emitting the plurality of optical signals to the output passive optical components, distributing the light beams received by the circulator to the "Rx" input of the photonic integrated circuit (PIC), and analyzing the plurality of optical signals through a transimpedance amplifier of an internal printed circuit board (PCB).

[0022] According to embodiments of the present application, the method further includes laying out the photonic integrated circuit (PIC), the light sources, the plurality of passive optical components, and the printed circuit board (PCB) onto an optical micro-platform, securing the optical micro-integration to the housing chamber using a soft epoxy, and securing the cradle to the chamber at the bottom housing module by a soft securing method.

[0023] According to embodiments of the present application, the method further includes clamping the flexible PCB at the edges of the housing chamber and the top cover edges, filling one or more slots at the electrical inlet and / or electrical outlet points on the housing chamber and the top cover with epoxy, and curing the one or more slots to form a hermetic seal to seal the optical transceiver assembly.

[0024] Other aspects of the application will be in part apparent and in part pointed out below. BRIEF DESCRIPTION OF DRAWINGS

[0025] To more clearly visualize the above and other features of the present application, a more detailed description of the application will be rendered by reference to specific embodiments thereof, which are illustrated in the appended drawings and described in the following description. It is appreciated that these drawings depict only typical embodiments of the application and are therefore not to be considered limiting of its scope, for the application can admit to other equally effective embodiments.

[0026] FIG. 1A is a graphical snapshot illustrating an optical transceiver assembly according to an embodiment of the application;

[0027] FIG. 1B is a graphical snapshot illustrating an exploded view of components of an optical transceiver assembly according to an embodiment of the application;

[0028] FIG. 2A is a graphical snapshot illustrating a cross-sectional view of an optical transceiver assembly according to an embodiment of the application;

[0029] FIG. 2B is a graphical snapshot illustrating a top view of an optical transceiver assembly according to an embodiment of the application;

[0030] FIG. 3 is a graphical snapshot illustrating a perspective view of an optical micro-platform according to an embodiment of the application;

[0031] FIG. 4 is a graphical snapshot illustrating a folded optical path of an optical transceiver assembly according to an embodiment of the application;

[0032] FIG. 5 is a graphical snapshot illustrating an assembly process of an optical transceiver assembly according to an embodiment of the application;

[0033] FIG. 6 is a graphical snapshot illustrating a housing cavity and a slot on a top cover of an optical transceiver assembly according to an embodiment of the application;

[0034] FIG. 7 is a graphical snapshot illustrating assembly of an optical transceiver assembly into a transceiver module according to an embodiment of the application;

[0035] FIG. 8 is a graphical snapshot illustrating a cross-sectional view of assembly of an optical transceiver assembly into a transceiver module according to an embodiment of the application;

[0036] FIG. 9is a graphical snapshot illustrating a complete optical transceiver assembly assembled on a bottom housing module according to an embodiment of the present application;

[0037] FIG. 10 is a flowchart illustrating a method for transmitting and detecting optical signals through an optical transceiver assembly according to an embodiment of the present application.

[0038] Reference numerals

[0039] Optical transceiver assembly - 100

[0040] Housing chamber - 105

[0041] Top cover - 110

[0042] Bottom housing module - 115

[0043] Transparent optical window - 120

[0044] Multiple mounting features - 125 1-N

[0045] Optical micro-integration - 130

[0046] Optical micro-platform - 135

[0047] Electrical connection slot - 140

[0048] Prism - 155

[0049] Photonic integrated circuit (PIC) - 160

[0050] Light source - 165

[0051] Multiple passive optical components - 170

[0052] Internal printed circuit board (PCB) - 175

[0053] External printed circuit board (PCB) - 177

[0054] Flexible printed circuit board (PCB) - 179

[0055] Lens - 180

[0056] Cradle - 185

[0057] Thermoelectric temperature controller (TEC) - 190

[0058] Critical electrical components - 195 DETAILED DESCRIPTION

[0059] The present application relates to compact micro-platforms for optical transceiver assemblies. By referring to FIGS. 1A-10The principles of the present application and their advantages are best understood. In the following detailed description of the disclosure, illustrative or exemplary embodiments of the disclosure are described in sufficient detail to enable one skilled in the art to practice the disclosed embodiments.

[0060] The following detailed description is, therefore, not to be taken in a limiting sense, and the scope of the present disclosure is defined by the appended claims and their equivalents. Reference in the specification to "one embodiment", "an embodiment", "an example embodiment" or "one or more embodiments", wherein specific features, structures, or characteristics are described, is intended to mean that a particular feature, structure, or characteristic is included in at least one embodiment of the disclosure.

[0061] In the present document, the terms fixing feature and mounting feature can be used interchangeably for the sake of convenience.

[0062] In the present document, the term electrical connection slot can be used interchangeably with electrical inlet slot or electrical outlet slot or epoxy slot for the sake of convenience.

[0063] FIG. 1A and FIG. 1B is a graphical snapshot showing an optical transceiver assembly 100 according to an embodiment of the present disclosure. In particular, the optical transceiver assembly 100 is integrated with a silicon photonics platform having a folded optical path for transmitting and detecting optical signals. The optical transceiver assembly 100 comprises a housing chamber 105, a top cover 110 configured to engage with the housing chamber 105 and containing other elements in the optical transceiver assembly 100 other than the housing chamber 105 and the top cover 110, and a bottom housing module 115 housing an optical micro-integration 130.

[0064] FIG. 2A and FIG. 2B is a graphical snapshot showing a cross-sectional view and a top view of an optical transceiver assembly 100 according to an embodiment of the present disclosure. The optical transceiver assembly 100 comprises an electrical connection slot 140 and a transparent optical window 120 for establishing electrical and optical communication with the external environment and a plurality of mounts 125 1-N on the bottom housing module 115. In addition, a flexible printed circuit board (PCB) 179 electrically connects between an internal printed circuit board (PCB) 175 and an external printed circuit board (PCB) 177 (to be mentioned later) through the electrical connection slot 140. The transparent optical window 120 is optically connected through its transparency to light.

[0065] FIG. 3is a graphical snapshot showing a perspective view of an optical micro-integration 130 according to an embodiment of the present application. In particular, the optical micro-integration 130 includes an optical micro-platform 135 configured to house and support a photonic integrated circuit (PIC) 160, a light source 165, a plurality of passive optical components 170 (such as, but not limited to, a lens 180 or a lens array), an isolator, and an internal printed circuit board (PCB) 175. In particular, the optical micro-platform 135 is made of a material having a good thermal conductivity and a thermal expansion coefficient that matches that of the silicon photonic integrated circuit (PIC). Furthermore, the optical micro-platform 135 has a structural configuration for electrical and optical component height compensation.

[0066] Furthermore, the optical micro-integration 130 also includes a cradle 185 that can be used as a support for holding the optical micro-integration 130 and a thermoelectric temperature controller (TEC) 190 for cooling heat generating elements in the optical transceiver assembly. In particular, the optical micro-integration 130 includes a prism 155 that folds light from the laser source / light source 165 in an opposite direction from the original path.

[0067] According to an embodiment of the present application, the light source 165 is configured to emit an output optical signal. In particular, the light source 165 is a laser source. Furthermore, the laser source is located on one side of the photonic integrated circuit (PIC). Moreover, the laser source emits light in an opposite direction from the photonic integrated circuit (PIC).

[0068] The photonic integrated circuit (PIC) 160 manipulates the light beam to produce an optical signal and emits the optical signal to an output passive optical component 170 such as, but not limited to, a circulator and a polarizing beam splitter (PBS). The circulator distributes the received light beam to the "Rx" input of the photonic integrated circuit (PIC). Furthermore, the polarizing beam splitter (PBS) allows light in one polarization (P) to pass unhindered as it reflects the light.

[0069] The thermoelectric temperature controller (TEC) 190 is housed on the cradle 185. In particular, the cold surface of the thermoelectric temperature controller (TEC) 190 is placed towards the optical micro-platform 135.

[0070] According to an embodiment of the present application, the flexible printed circuit board (PCB) 179 is configured to establish a signal connection between the internal printed circuit board (PCB) 175 on the optical micro-platform 135 and the external printed circuit board (PCB) 177 located on the bottom housing module 115. Furthermore, the internal printed circuit board (PCB) 175 can house a transimpedance amplifier and other electrical components to amplify the optical signal.

[0071] An internal printed circuit board (PCB) 175 serves as a routing path to get all the driving and sensing circuits to the laser source and photonic integrated circuit (PIC) 160. This configuration allows the integration to shrink its length and confine all the components on an area with length and width aspect ratio close to 1. In addition, this configuration makes the underlying thermoelectric temperature controller (TEC) 190 work in a more efficient working range, and all the important electrical and optical components can be easily enclosed in a hermetically sealed cavity.

[0072] According to embodiments of the present application, the internal printed circuit board (PCB) 175 can further include critical electrical components 195 that can house a transimpedance amplifier to convert current to voltage, and a flexible printed circuit board 179 that goes out of the housing chamber 105 through an epoxy slot to create a mechanically sealed electrical communication.

[0073] FIG. 4 is a graphical snapshot showing the folded light path of the optical transceiver assembly 100 according to embodiments of the present application. In particular, the folded light path makes the entire optical transceiver assembly 100 more compact. The laser source is deposited at one side of the photonic integrated circuit (PIC) 160, with the light emission direction opposite to the photonic integrated circuit (PIC) transmitter direction. In addition, the light beam and passive optical components 170 folded by the prism 155 are precisely directed to the input end of the photonic integrated circuit (PIC) 160. The photonic integrated circuit (PIC) 160 manipulates the light beam to generate certain optical signals and emits the optical signals to passive optical components for output, such as but not limited to circulators and PBS.

[0074] The circulator distributes the received light beam to the Rx input end of the photonic integrated circuit (PIC) 160. The optical signals are sensed and analyzed by the sensing circuits of the PIC. The electrical components, such as but not limited to the transimpedance amplifier in the internal printed circuit board (PCB) 175, amplify the optical signals to be analyzed.

[0075] FIG. 5is a graphical snapshot showing the assembly process of the optical transceiver assembly according to embodiments of the present application. The optical micro-integration 130 is placed at the bottom of the housing chamber 105 and is fixed using a soft fixing method by soft epoxy. Although the larger mechanical movement is restricted by the housing chamber 105, the optical micro-platform 135 without firm fixation can allow for slight movement like floating inside the chamber. Therefore, the configuration avoids the optical micro-platform 135 from being subjected to any mechanical disturbance from the outside and ensures that the photonic integrated circuit (PIC) 160 and the laser work in a stable environment, thus not causing internal stress in the photonic integrated circuit (PIC). After assembling the top cover 110 onto the housing chamber 105, the optical transceiver assembly 100 is hermetically encapsulated to protect the optical transceiver assembly 100 from humidity and dust. Furthermore, the electrical and optical connection is made through a flexible printed circuit board (PCB) 179 for electrical signals and a transparent optical window for optical beams to establish communication with the outside. The optical connection has a transparent optical window 120 for light only, and the electrical connection slot 140 has a physical space to accommodate the flexible printed circuit board (PCB) 179 to form electrical connection and communication.

[0076] FIG. 6 is a graphical snapshot showing the slot on the housing chamber 105 and the top cover 110 of the optical transceiver assembly 100 according to embodiments of the present application. The electrical connection slot 140 on the housing chamber 105 and the top cover 110 of the optical transceiver assembly 100 is for electrical ingress and / or electrical egress. In particular, the flexible printed circuit board (PCB) 179 is used for signal connection between the internal printed circuit board (PCB) 175 and the external printed circuit board (PCB) 177. Furthermore, the flexible printed circuit board (PCB) 179 is sandwiched by the edges of the housing chamber and the cover, and the electrical connection slot 140 is filled with epoxy. The epoxy slot not only fixes the flexible traces but also forms a hermetic seal after curing. Moreover, the slot 140 can control the amount of epoxy to be filled and form an effective seal.

[0077] FIG. 7 is a graphical snapshot showing the assembly of the optical transceiver assembly 100 into a transceiver module according to embodiments of the present application. The optical transceiver assembly 100 is fixed to the bottom housing module 115 through the mounting features 125 at the four corners of the housing chamber 105. Furthermore, the flexible PCB 179 connects the internal PCB 175 to the external PCB 177 on the bottom housing module 115. 1-N

[0078] FIG. 8 ​is a graphical snapshot showing a cross-sectional view of the optical transceiver assembly 100 assembled into a transceiver module according to an embodiment of the present application. In particular, the carrier 185 is fixed to the bottom of the housing chamber by a soft fixation method. The housing chamber 105 is fixed to the bottom housing module 115 by mounting features 125 1-N by a hard fixation method. Furthermore, the flexible PCB 179 passes through the slot filled with epoxy to connect the external PCB 177 and the internal PCB 175.

[0079] FIG. 9 is a graphical snapshot showing the assembly of the optical transceiver assembly 100 according to an embodiment of the present application onto the top cover 110 assembled onto the bottom housing module 115.

[0080] FIG. 10 is a flowchart showing a method for transmitting and detecting optical signals through an optical transceiver assembly according to an embodiment of the present application. The method starts from step 1005 and continues until step 1035.

[0081] In step 1005, a laser source is placed on one side of a photonic integrated circuit (PIC) 160 on the optical micro-platform 135. The laser source emits light in the opposite direction of the photonic integrated circuit (PIC) 160.

[0082] In step 1010, the light beam from the laser source is folded in the opposite direction of the original path by the prism 155.

[0083] In step 1015, the light beam folded by the prism and the plurality of passive optical components 170 are directed to the input of the photonic integrated circuit (PIC) 160.

[0084] In step 1020, the light beam is manipulated by the photonic integrated circuit (PIC) 160 to form a plurality of optical signals.

[0085] In step 1025, the plurality of optical signals are emitted to the output passive optical components, such as but not limited to circulators and PBS.

[0086] In step 1030, the light beam received by the circulator is distributed to the “Rx” input of the photonic integrated circuit (PIC) 160.

[0087] In step 1035, the plurality of optical signals are sensed and analyzed by the transimpedance amplifier of the internal printed circuit board (PCB) 175.

[0088] According to embodiments of the present application, the method includes laying a photonic integrated circuit (PIC) 160, a light source 165, a plurality of passive optical components 170, and a printed circuit board (PCB) 175 on the optical micro-platform 135, and soft fixing the optical micro-platform 130 into the housing chamber 105 using a soft epoxy resin.

[0089] According to embodiments of the present application, the method further includes clamping the flexible PCB 179 at the edges of the housing chamber 105 and the top cover 110, filling the one or more slots 140 at the electrical inlet and / or electrical outlet points on the housing chamber 105 and the top cover 110 with an epoxy resin, and curing the one or more slots 140 to form a hermetic seal to seal the optical transceiver assembly 100.

[0090] Advantageously, the independent compact optical micro-platform prevents environmental mechanical interference, thereby enabling the TEC to work with good efficiency. The hermetic packaging with optical windows ensures integration and avoids dust and humidity from the environment.

[0091] From the foregoing, it will be appreciated that the elements of the block diagrams and flow diagrams, and combinations thereof, support combinations of devices for performing the specified functions and combinations of steps for performing the specified functions and program instruction means for performing the specified functions and processes, and the like.

[0092] The functions, systems, and methods described herein can be used and presented in a variety of languages. A single system can be presented in one or more languages, and the language can be easily changed at any point in the above-described processes or methods. One of ordinary skill in the art will be able to understand that systems can be provided in multiple languages, and embodiments of the present disclosure are contemplated to be used in any language.

[0093] Many modifications can be made to the application in various obvious aspects, without departing from the spirit and scope of the disclosure. Accordingly, the drawings and descriptions are to be regarded as illustrative in nature, and not restrictive.

[0094] Features described herein can be combined to form further embodiments, and sub-elements of certain embodiments can form further embodiments. The above summary of the present disclosure of preferred embodiments should not be construed as a limitation on the scope or periphery of the application. It should be understood and be apparent to those skilled in the art that further modifications of the embodiments described can be made without departing from the spirit and scope of the application.

Claims

1. An optical transceiver assembly for transmitting and detecting a plurality of optical signals, integrated with a silicon photonics platform having a folded optical path, the assembly comprising: a housing chamber; a top cover configured to engage with the housing chamber to enclose elements in the optical transceiver assembly other than the housing chamber and the top cover; a bottom housing module housing an optical micro-integration; a transparent optical window to establish optical communication with an external environment; one or more slots configured at electrical inlet and / or electrical outlet points on the housing chamber and the top cover; wherein the one or more slots are epoxy slots configured to hermetically seal the optical micro-integration; a plurality of securing features at a bottom of the housing chamber to secure the bottom housing module; a cradle configured to hold and provide support for the optical micro-integration; a thermoelectric temperature controller (TEC) deposited on the cradle for cooling heat generating elements in the optical transceiver assembly; the optical micro-integration comprising: an optical micro-platform configured to deposit a photonic integrated circuit (PIC), a light source, a plurality of passive optical components, and an internal printed circuit board (PCB), wherein a cold surface of the TEC is placed facing the optical micro-platform; the light source being a laser source and emitting an output optical signal; the PIC manipulating an optical beam to form the plurality of optical signals and emit the plurality of optical signals to one of the plurality of passive optical components as an output passive optical component; and a prism configured to fold the output optical signal from the light source in a direction opposite to an original path; wherein the optical transceiver assembly is operatively configured to establish optical electrical communication with the external environment.

2. The optical transceiver assembly of claim 1, wherein the laser source is located on a side of the PIC.

3. The optical transceiver assembly of claim 1, wherein the laser source emits light in a direction opposite to the PIC.

4. The optical transceiver assembly of claim 1, wherein the housing chamber is secured with the bottom housing module by a hard securing method.

5. The optical transceiver assembly of claim 1, wherein the cradle is secured to the housing chamber by a soft securing method.

6. The optical transceiver assembly of claim 1, wherein the optical micro-integration is secured to the housing chamber by a soft epoxy.

7. The optical transceiver assembly of claim 1, wherein electrical connections are made through a flexible PCB and the transparent optical window for optical beams.

8. The optical transceiver assembly of claim 1, wherein a coefficient of thermal expansion of the optical micro-platform and the PIC are similar.

9. The optical transceiver assembly of claim 1, wherein the plurality of passive optical components comprises a lens or a lens array.

10. The optical transceiver assembly of claim 1, wherein the output passive optical component comprises a circulator and a polarizing beam splitter (PBS).

11. The optical transceiver assembly of claim 1, wherein a flexible PCB is configured to establish a signal connection between the internal printed circuit board on the optical micro-platform and an external PCB on the bottom housing module.

12. The optical transceiver assembly of claim 1, wherein the internal printed circuit board comprises a transimpedance amplifier to sense and analyze the plurality of optical signals.

13. A method for transmitting and detecting optical signals through an optical transceiver assembly integrated with a silicon photonic platform having a folded optical path, wherein the method comprises: placing a laser source next to a photonic integrated circuit (PIC) on an optical micro-platform, wherein the laser source emits light in an opposite direction to the photonic integrated circuit (PIC); folding a light beam from the laser source in an opposite direction to the original path through a prism; directing the light beam folded through the prism and a plurality of passive optical components to an input of the PIC; manipulating the light beam through the PIC to form a plurality of optical signals; emitting the plurality of optical signals to an output passive optical component; distributing the light beam received through a circulator to an "Rx” input of the PIC; sensing and analyzing the plurality of optical signals through a transimpedance amplifier of an internal printed circuit board (PCB), wherein the optical transceiver assembly establishes optical electrical communication with an external.

14. The method of claim 13, wherein the method comprises: depositing the PIC, light source, plurality of passive optical components, and the internal printed circuit board on an optical micro-platform; and softly fixing the optical micro-integration to a housing chamber using a soft epoxy.

15. The method of claim 14, wherein the method further comprises: clipping a flexible PCB at the edges of the housing chamber and a top cover; filling one or more slots at electrical inlet and / or electrical outlet points on the housing chamber and the top cover with epoxy; and curing the one or more slots to form an air-tight seal to seal the optical transceiver assembly.

16. The method of claim 14, wherein the method comprises fixing the housing chamber to a bottom housing module through a hard fixing method.

17. The method of claim 13, wherein the plurality of passive optical components comprises a lens or lens array, and the output passive optical component comprises a circulator and a polarizing beam splitter (PBS).

18. The method of claim 13, wherein a flexible PCB is configured to establish a signal connection between the internal printed circuit board on the micro-optical platform and an external PCB on the bottom housing module.

Images