A hotspot positioning assistance apparatus and method

Abstract

The application provides a hotspot positioning auxiliary device and method, which is applied to the chip detection technical field and comprises a support, a first lens, a second lens and a processing unit. The first lens is arranged on the front side of the support, and the second lens is arranged on the back side of the support. The support is used for carrying a chip to be tested. The first lens is used for collecting front imaging information of the chip to be tested, and the second lens is used for collecting hotspot imaging information of the chip to be tested. The processing unit is used for superimposing the hotspot imaging information on the front imaging information to generate a target image and obtaining position information of the hotspot after processing the target image. In the application, the defect position can be positioned without destructive processing of the chip, and the accuracy and success rate of chip defect positioning are improved.

Description

Technical Field

[0001] This application relates to the field of chip detection technology, specifically to a hotspot positioning auxiliary device and method. Background Technology

[0002] Emission microscopy (EMMI) is a tool used in chip failure analysis for locating fault points and finding hot spots. It typically employs a highly sensitive InGaAs lens to detect signals in the wavelength range of 900-1700 nm, which is the same as the IR (infrared) spectrum wavelength, allowing for the detection of photons emitted from within the chip.

[0003] Currently, EMMI is widely used to detect leakage currents caused by various component defects, including gate oxide defects, ESD failures, latch-up, leakage current, junction leakage, forward bias, and transistors operating in the saturation region. Therefore, EMMI can be used to locate bright / hot spots, thereby revealing the cause of the defects and aiding in further failure analysis.

[0004] A detection scheme that places a lens on the front of the chip to capture hotspot signals is called front-side EMMI. Because the front of the chip usually has a metal layer (such as an aluminum layer) that reflects the hotspot signal (near-infrared light), front-side EMMI requires removing the aluminum layer. However, removing the aluminum layer is a destructive process; for example, with SiC chips, applying high voltage after removing the aluminum layer can cause the chip to break down.

[0005] Therefore, using a front-side EMM not only requires destructive processing of the chip, but even after such destructive processing, it is still impossible to locate and analyze the fault points of the chip. Summary of the Invention

[0006] In view of this, embodiments of this specification provide a hotspot location assistance device and method to form a new backside EMMI scheme, thereby locating the fault point of the chip.

[0007] The embodiments in this specification provide the following technical solutions:

[0008] This specification provides a hotspot positioning auxiliary device, including: a platform, a first lens, a second lens, and a processing unit;

[0009] A first lens and a second lens, wherein the first lens is disposed on one side of the front of the platform and the second lens is disposed on one side of the back of the platform, and the relative positions of the first lens and the second lens are fixed.

[0010] The platform is used to support the chip to be tested and to move the chip in a plane so that the chip to be tested is located in the field of view of the first lens and the second lens;

[0011] The first lens is used to acquire frontal imaging information of the chip under test, and the second lens is used to acquire hotspot imaging information of the chip under test.

[0012] The processing unit is used to superimpose the hotspot imaging information onto the frontal imaging information to generate a target image, and to process the target image to obtain the location information of the hotspot.

[0013] Optionally, the hotspot positioning device further includes several calibration plates, each with several calibration patterns. The calibration patterns on the calibration plates are used for calibration of the first lens and the second lens before imaging the same object in the field of view.

[0014] Optionally, the processing unit is further configured to set corresponding coordinate points for each pixel in the field of view of the first lens and the second lens, and based on the first coordinate result of the calibration pattern acquired by the first lens for the calibration patch in the field of view, and the second coordinate result of the calibration pattern acquired by the second lens for the same calibration patch in the field of view, superimpose the hotspot imaging information onto the frontal imaging information to generate a target image: if the coordinates in the first coordinate result coincide with the coordinates in the second coordinate result, then the hotspot imaging information is superimposed onto the frontal imaging information; if the coordinates in the first coordinate result do not coincide with the coordinates in the second coordinate result, then the coordinate difference data is recorded as a displacement compensation amount, and the hotspot imaging information is superimposed onto the corresponding coordinate position of the frontal imaging information according to the displacement compensation amount.

[0015] Optionally, the size of the calibration pattern corresponds to the magnification of the first lens;

[0016] And / or, the thickness of the calibration piece corresponds to the thickness of the chip under test;

[0017] And / or, the calibration piece is fixedly mounted on the stage.

[0018] Optionally, the first lens includes a first high-magnification lens and a first low-magnification lens, and the second lens includes a second high-magnification lens and a second low-magnification lens, wherein the magnification of the first high-magnification lens is the same as that of the second high-magnification lens, and the magnification of the first low-magnification lens is the same as that of the second low-magnification lens.

[0019] And / or, the first lens is an optical lens or an infrared lens, and the second lens is an infrared lens equipped with an InGaAs detector.

[0020] Optionally, a glass substrate is provided at the position in the stage for supporting the chip to be tested, and the glass substrate is used to support the chip to be tested.

[0021] Optionally, the hotspot location device further includes a power supply system for applying a test voltage to the chip under test.

[0022] This specification also provides a hotspot location method, including:

[0023] The test chip is captured by a first frontal imaging information of the chip under test through a first lens and by a second lens through a second lens. The chip under test is placed on a platform and moved from the platform into the field of view of the first and second lenses. The first lens is set on the front side of the platform and the second lens is set on the back side of the platform.

[0024] The first hotspot imaging information is superimposed on the first frontal imaging information to generate a target image;

[0025] The location information of hotspots is obtained after processing the target image.

[0026] Optionally, before the first and second lenses acquire data, the hotspot localization method further includes:

[0027] The calibration plate is moved into the field of view of the first lens and the second lens. The calibration plate has several calibration patterns on it. The magnification of the first lens is the same as that of the second lens.

[0028] Adjust the focal lengths of the first and second lenses respectively so that the first lens captures a clear frontal image corresponding to the calibration pattern, and the second lens captures a clear rear image corresponding to the calibration pattern.

[0029] Each pixel in the field of view of the first and second lenses is assigned a corresponding coordinate point. It is determined whether the coordinates of the calibration pattern located in the front image and the back image coincide. If the coordinates do not coincide, the coordinate difference data is used as the displacement compensation amount. The displacement compensation amount is used to perform displacement compensation when the first hotspot imaging information is superimposed on the first front imaging information.

[0030] Optionally, the corresponding front image and the back image are first obtained based on the first lens and the second lens being low-magnification lenses; then the first lens and the second lens are switched to high-magnification lenses to obtain the corresponding front image and the back image.

[0031] Based on the front image and the back image obtained by the first and second lenses with high magnification, it is determined whether the coordinates of the calibration patterns located in the front image and the back image coincide.

[0032] Optionally, after acquiring the hotspot imaging information, the hotspot localization method further includes:

[0033] Under the field of view of the first lens, a first mark is made on the front of the chip under test according to the identified imaging information. The first mark is used to characterize the approximate location of the hot spot.

[0034] The first lens acquires second frontal imaging information of the chip under test with a first mark, and the second lens acquires second hotspot imaging information of the chip under test.

[0035] The second hotspot imaging information is superimposed on the second frontal image information to generate a new target image;

[0036] Obtaining the location information of hotspots after processing the target image includes: obtaining the location information of hotspots by measuring the distance between the hotspots and the first marker in the new target image.

[0037] Optionally, preliminary location information of the hotspot can be obtained first using low-magnification lenses for both the first and second lenses, and then, based on the preliminary location information, the first and second lenses can be switched to high-magnification lenses to obtain the final location information of the hotspot.

[0038] Compared with the prior art, the beneficial effects that can be achieved by at least one of the above-mentioned technical solutions adopted in the embodiments of this specification include: this application can locate the defect location without destructive processing of the chip, thereby improving the accuracy and success rate of chip defect location. Attached Figure Description

[0039] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0040] Figure 1 This is a schematic diagram of the structure of a hotspot positioning auxiliary device according to this application;

[0041] Figure 2 This is a top view of the platform in a hotspot positioning auxiliary device of this application;

[0042] Figure 3 This is a schematic diagram of a calibration plate calibrating the positions of the first and second probes in a hotspot positioning auxiliary device according to this application;

[0043] Figure 4 This is a schematic diagram of the calibration pattern on the calibration chip in a hotspot positioning auxiliary device of this application;

[0044] Figure 5 This is a calibration schematic diagram of calibration plates of different thicknesses in a hotspot positioning auxiliary device of this application;

[0045] Figure 6 This is a flowchart illustrating a hotspot location assistance method according to this application.

[0046] Figure 7 This is a schematic diagram of a hotspot captured by the second lens in a hotspot positioning assistance method of this application;

[0047] Figure 8 This is a schematic diagram of the markers in the top view captured by the first lens in a hotspot positioning assistance method of this application;

[0048] Figure 9 This is a schematic diagram of the hotspot location captured again by the second lens in a hotspot location assistance method of this application;

[0049] Figure 10 This is a top view with hotspots and markers obtained after overlaying images in a hotspot localization auxiliary method of this application.

[0050] The components include: 1. Stage; 2. Glass slide; 3. First lens; 4. Second lens; 5. Calibration slide; 6. Power supply system; 7. Motor. Detailed Implementation

[0051] The embodiments of this application will now be described in detail with reference to the accompanying drawings.

[0052] The following specific examples illustrate the implementation of this application. Those skilled in the art can easily understand other advantages and effects of this application from the content disclosed in this specification. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. This application can also be implemented or applied through other different specific embodiments, and the details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of this application. It should be noted that, in the absence of conflict, the following embodiments and features in the embodiments can be combined with each other. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0053] It should be noted that various aspects of embodiments within the scope of the appended claims are described below. It will be apparent that the aspects described herein can be embodied in a wide variety of forms, and any particular structure and / or function described herein is merely illustrative. Based on this application, those skilled in the art will understand that one aspect described herein can be implemented independently of any other aspect, and two or more of these aspects can be combined in various ways. For example, any number and aspects set forth herein can be used to implement the device and / or practice the method. Additionally, this device and / or method can be implemented using structures and / or functionalities other than one or more of the aspects set forth herein.

[0054] It should also be noted that the illustrations provided in the following embodiments are only schematic representations of the basic concept of this application. The drawings only show the components related to this application and are not drawn according to the actual number, shape and size of the components in the actual implementation. In the actual implementation, the form, quantity and proportion of each component can be arbitrarily changed, and the layout of the components may also be more complex.

[0055] Additionally, specific details are provided in the following description to facilitate a thorough understanding of the examples. However, those skilled in the art will understand that practice can be carried out without these specific details.

[0056] Although optical microscopy (EMMI) is widely used for the localization and analysis of chip fault defects, especially front-side EMMI, the aluminum metal on the front side of the chip reflects the hot spot signal (near-infrared light) emitted by the defect. Therefore, when implementing the front-side EMMI approach, it is necessary to remove the aluminum metal layer on the front side of the chip. This requires destructive processing of the aluminum metal layer on the front side of the chip. After this destructive processing, such as for power devices (such as SiC devices), the chip breaks down when a high voltage is applied after removing the metal layer on the front side of the chip, making it impossible to proceed with the next step of hot spot localization.

[0057] Based on this, the embodiments of this specification propose a hotspot location assistance device: such as Figure 1 and Figure 2 As shown, it includes: a platform 1, a first lens 3, a second lens 4, and a processing unit (not shown in the figure);

[0058] A first lens 3 and a second lens 4 are provided. The first lens 3 is located on the front side of the platform 1, and the second lens 4 is located on the back side of the platform 1. The relative positions of the first lens 3 and the second lens 4 are fixed.

[0059] The stage 1 is used to support the chip 8 to be tested and to move the chip 8 to be tested in the plane so that the chip 8 to be tested is in the field of view of the first lens 3 and the second lens 4.

[0060] Specifically, the first lens 3 and the second lens 4 can be fixedly set relative to the chip 8 under test, or the first lens 3 and the second lens 4 can be moved relative to the chip 8 under test.

[0061] The first lens 3 is used to acquire frontal imaging information of the chip 8 under test, and the second lens 4 is used to acquire hotspot imaging information of the chip 8 under test.

[0062] The processing unit is used to superimpose hotspot imaging information onto frontal imaging information to generate a target image, and to process the target image to obtain the location information of the hotspots. Those skilled in the art should understand that the processing unit can be an independent functional unit or a functional unit integrated into the first or second lens; no limitation is made here.

[0063] like Figure 3 As shown, the acquisition results of the second lens 4 (i.e., hotspot imaging information) are superimposed on the acquisition results of the first lens 3 (i.e., frontal imaging information) to form an overlay image. Therefore, by performing image processing on the overlay image, the location of the hotspot can be obtained from the overlay image.

[0064] By setting the first lens 3 and the second lens 4 to be relatively stationary in the positioning device, it is not easy to cause errors due to relative displacement, resulting in high positioning accuracy. Moreover, the hot spot signal position detected by the second lens 4 is superimposed on the top view acquired by the first lens 3, and the hot spot position information is obtained from the superimposed image. Therefore, based on the chip information acquired by the two lenses, even if the chip is not subjected to destructive processing, the defect point position can be located, which makes it very convenient to perform defect point location operation on the chip.

[0065] The hotspot location device also includes a power supply system 6, which is used to apply a test voltage to the chip 8 under test.

[0066] Specifically, Figure 1 In this diagram, G represents the gate, S represents the source, and D represents the drain.

[0067] Specifically, the platform 1 moves in the horizontal plane driven by the motor 7.

[0068] In the embodiments of this application, the chip under test can be detected by hot spot signals of wavelengths from visible light to near infrared, such as silicon carbide chips.

[0069] Specifically, a glass carrier 2 is provided in the stage 1 at the position used to support the chip 8 to be tested. The glass carrier 2 is used to support the chip 8 to be tested.

[0070] like Figure 3 and Figure 4 As shown, the hotspot positioning device also includes several calibration plates 5, which are fixedly mounted on the stage 1. The calibration plates 5 and the chip are located on the same plane. Several calibration patterns are provided on the calibration plates 5. The calibration patterns on the calibration plates 5 are used for calibration of the same object in the field of view by the first lens 3 and the second lens 4 before imaging.

[0071] Specifically, the calibration graphics are triangles, rectangles, and other shapes.

[0072] The calibration plate 5 calibrates the first lens 3 and the second lens 4 to avoid the difficulty in marking hot spots due to the large chip area and lack of reference objects, thereby improving the accuracy of the first lens 3 and the second lens 4 in locating the chip hot spots.

[0073] The processing unit is also used to set corresponding coordinate points for each pixel in the field of view of the first lens 3 and the second lens 4, and to acquire the first coordinate result of the calibration pattern of the calibration patch 5 in the field of view based on the first lens 3, and the second coordinate result of the calibration pattern of the same calibration patch 5 in the field of view based on the second lens 4, and to superimpose the hotspot imaging information on the frontal imaging information to generate the target image:

[0074] If the coordinates in the first coordinate result coincide with the coordinates in the second coordinate result, then the hotspot imaging information will be superimposed on the frontal imaging information.

[0075] If the coordinates in the first coordinate result do not coincide with the coordinates in the second coordinate result, the coordinate difference data is recorded as a displacement compensation amount, and the hotspot imaging information is superimposed on the corresponding coordinate position on the frontal imaging information according to the displacement compensation amount. This calibrates the first lens 3 and the second lens 4, ensuring that the fields of view acquired by the first lens 3 and the second lens 4 correspond, thereby improving the accuracy of hotspot positioning of the chip 8 under test.

[0076] Specifically, during the testing of the chip 8, the magnification of the first lens 3 is the same as that of the second lens 4, and the size of the calibration pattern corresponds to the magnification of the first lens 3 and the second lens 4.

[0077] Specifically, during the testing process, the thickness of the calibration piece 5 corresponds to the thickness of the chip 8 under test. The chip 8 under test and the calibration piece 5 are on the same plane.

[0078] like Figure 5 As shown, when the thickness of the calibration piece 5 is different, the positions of the first lens 3 and the second lens 4 in the vertical direction of the calibration piece 5 are also different. The thickness of the calibration piece 5 is the same as the thickness of the chip 8 under test, thereby reducing the influence of the deviation of the hotspot detection position of the first lens 3 and the second lens 4 due to the different chip thickness.

[0079] The first lens 3 includes a first high-magnification lens and a first low-magnification lens, and the second lens 4 includes a second high-magnification lens and a second low-magnification lens. The magnification of the first high-magnification lens is the same as that of the second high-magnification lens, and the magnification of the first low-magnification lens is the same as that of the second low-magnification lens.

[0080] The first low-magnification lens and the second low-magnification lens are both 1X and 5X magnification lenses, respectively, while the first high-magnification lens and the second high-magnification lens are both 20X and 50X lenses.

[0081] The first low-magnification lens and the second low-magnification lens perform preliminary positioning of the hotspots on the chip to determine the approximate location of the hotspots. The first high-magnification lens and the second high-magnification lens perform precise positioning of the hotspots on the chip to determine the precise location of the hotspots, thereby improving the positioning speed and accuracy.

[0082] Specifically, the first and second low-magnification lenses have a wide field of view, allowing a view of the entire chip. Under these lenses, hotspots can be roughly located. However, due to the low resolution of the first and second low-magnification lenses, the detected hotspot location may deviate from the actual defect location by tens of micrometers. Therefore, the first and second low-magnification lenses are used to roughly determine the hotspot location first. Then, the first and second high-magnification lenses are moved to the location of the hotspot under the low-magnification lens, and the hotspot location is accurately determined under the high-magnification lens, improving the accuracy of the hotspot location and reducing the positional error to approximately 1µm.

[0083] The first lens 3 is an optical lens or an infrared lens, and the second lens 4 is an infrared lens equipped with an InGaAs detector.

[0084] This specification also provides a hotspot location method in its embodiments, such as... Figure 6 As shown, it includes:

[0085] Step 1: Calibrate the objects in the field of view of the first lens 3 and the second lens 4. Select the corresponding calibration piece 5 according to the thickness of the chip 8 to be tested, and move the calibration piece 5 into the field of view of the first lens 3 and the second lens 4. The calibration piece 5 is provided with several calibration patterns. The magnification of the first lens 3 and the second lens 4 are the same.

[0086] like Figure 7 , Figure 8 and Figure 9 As shown, the focal lengths of the first lens 3 and the second lens 4 are adjusted respectively so that the first lens 3 captures a clear frontal image corresponding to the calibration pattern, and the second lens 4 captures a clear back image corresponding to the calibration pattern.

[0087] First, using low-magnification lenses (first lens 3 and second lens 4), obtain the corresponding front and back images; then switch to high-magnification lenses (first lens 3 and second lens 4) to obtain the corresponding front and back images.

[0088] Based on the front and back images obtained by the first lens 3 and the second lens 4 under high magnification, it is determined whether the coordinates of the calibration patterns located in the front and back images coincide.

[0089] Each pixel in the field of view of the first lens 3 and the second lens 4 is assigned a corresponding coordinate point. It is determined whether the coordinates of the calibration pattern located in the front image and the back image are coincident. If the coordinates are not coincident, the coordinate difference data is used as the displacement compensation amount. The displacement compensation amount is used to perform displacement compensation when the first hotspot imaging information is superimposed on the first front imaging information.

[0090] The chip 8 to be tested is placed on the stage 1 and moved from the stage 1 into the field of view of the first lens 3 and the second lens 4. The first lens 3 is located on the front side of the stage 1, and the second lens 4 is located on the back side of the stage 1. Voltage is applied to the chip under test through the power system 6. The first front imaging information of the chip 8 to be tested is acquired through the first lens 3, and the first hot spot imaging information of the chip 8 to be tested is acquired through the second lens 4.

[0091] Step two, as Figure 10 As shown, the first hotspot imaging information is superimposed on the first frontal imaging information to generate the target image;

[0092] Step 3: Process the target image to obtain the location information of the hotspots.

[0093] After acquiring hotspot imaging information, the hotspot localization method also includes:

[0094] Under the field of view of the first lens 3, a first mark is made on the front of the chip 8 to be tested based on the identified imaging information. The first mark is used to characterize the approximate location of the hot spot.

[0095] The second frontal imaging information of the chip under test 8 with the first mark is acquired through the first lens 3, and the second hot spot imaging information of the chip under test 8 is acquired through the second lens 4.

[0096] The second hotspot imaging information is superimposed on the second frontal image information to generate a new target image;

[0097] Obtaining the location information of hotspots after processing the target image includes: obtaining the location information of hotspots by measuring the distance between the hotspots and the first marker in the new target image.

[0098] First, the initial location information of the hotspot is obtained based on the low-magnification lenses of the first lens 3 and the second lens 4. Then, based on the initial location information, the first lens 3 and the second lens 4 are switched to high-magnification lenses to obtain the final location information of the hotspot.

[0099] In this specification, the same or similar parts between the various embodiments can be referred to mutually. Each embodiment focuses on describing the differences from other embodiments. In particular, the descriptions of the embodiments described later are relatively simple, and relevant parts can be referred to the descriptions of the foregoing embodiments.

[0100] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A hotspot location device, characterized in that, include: Stage, first lens, second lens, processing unit, and several calibration plates; A first lens and a second lens, wherein the first lens is disposed on one side of the front of the platform and the second lens is disposed on one side of the back of the platform, and the relative positions of the first lens and the second lens are fixed. The calibration plate is fixedly mounted on the platform, and the calibration plate and the chip under test are located on the same plane; wherein, the calibration plate is provided with a plurality of calibration patterns, which are used for the first lens and the second lens to calibrate the same object in the field of view before imaging; The platform is used to support the chip to be tested and to move the chip in a plane so that the chip to be tested is located in the field of view of the first lens and the second lens; The first lens is used to acquire frontal imaging information of the chip under test, and the second lens is used to acquire hotspot imaging information of the chip under test. The processing unit is used to superimpose the hotspot imaging information onto the frontal imaging information to generate a target image, and to process the target image to obtain the location information of the hotspot. The processing unit is further configured to set corresponding coordinate points for each pixel in the field of view of the first lens and the second lens, and based on the first coordinate result of the calibration pattern acquired by the first lens for the calibration patch in the field of view, and the second coordinate result of the calibration pattern acquired by the second lens for the same calibration patch in the field of view, superimpose the hotspot imaging information onto the frontal imaging information to generate a target image: If the coordinates in the first coordinate result coincide with the coordinates in the second coordinate result, then the hotspot imaging information is superimposed on the frontal imaging information; If the coordinates in the first coordinate result do not coincide with the coordinates in the second coordinate result, the coordinate difference data is recorded as a displacement compensation amount, and the hotspot imaging information is superimposed on the corresponding coordinate position of the frontal imaging information according to the displacement compensation amount.

2. The hotspot positioning device according to claim 1, characterized in that, The size of the calibration pattern corresponds to the magnification of the first lens; And / or, the thickness of the calibration piece corresponds to the thickness of the chip under test; And / or, the calibration piece is fixedly mounted on the stage.

3. The hotspot positioning device according to claim 1, characterized in that, The first lens includes a first high-magnification lens and a first low-magnification lens, and the second lens includes a second high-magnification lens and a second low-magnification lens. The magnification of the first high-magnification lens is the same as that of the second high-magnification lens, and the magnification of the first low-magnification lens is the same as that of the second low-magnification lens. And / or, the first lens is an optical lens or an infrared lens, and the second lens is an infrared lens equipped with an InGaAs detector.

4. The hotspot positioning device according to claim 1, characterized in that, A glass substrate is provided in the stage for supporting the chip to be tested.

5. The hotspot positioning device according to claim 1, characterized in that, The hotspot location device also includes a power supply system, which is used to apply a test voltage to the chip under test.

6. A hotspot location method, characterized in that, include: The test chip is captured by a first frontal imaging information of the chip under test through a first lens and by a second lens through a second lens. The chip under test is placed on a platform and moved from the platform into the field of view of the first and second lenses. The first lens is set on the front side of the platform and the second lens is set on the back side of the platform. The calibration plate is moved into the field of view of the first lens and the second lens. The calibration plate is provided with several calibration patterns, which are used by the first lens and the second lens to calibrate the same object in the field of view before imaging. For each pixel in the field of view of the first and second lenses, a corresponding coordinate point is set. Based on the first coordinate result of the calibration pattern acquired by the first lens and the second coordinate result of the calibration pattern acquired by the second lens, it is determined whether the coordinates in the first coordinate result and the coordinates in the second coordinate result coincide. If the coordinates do not coincide, the coordinate difference data is recorded as a displacement compensation amount. The displacement compensation amount is used to perform displacement compensation when the first hotspot imaging information is superimposed on the first frontal imaging information. If the coordinates are determined to coincide, the first hotspot imaging information is superimposed on the first frontal imaging information to generate a target image; if the coordinates are determined to not coincide, the first hotspot imaging information is superimposed on the corresponding coordinate position of the first frontal imaging information according to the displacement compensation amount to generate a target image. The location information of hotspots is obtained after processing the target image.

7. The hotspot location method according to claim 6, characterized in that, Before the first and second shots are captured, the hotspot localization method further includes: Adjust the magnification of the first lens and the second lens to be the same; Adjust the focal lengths of the first and second lenses respectively so that the first lens captures a clear frontal image corresponding to the calibration pattern, and the second lens captures a clear rear image corresponding to the calibration pattern.

8. The hotspot location method according to claim 7, characterized in that, First, based on the first and second lenses being low-magnification lenses, the corresponding front image and the back image are obtained; then, the first and second lenses are switched to high-magnification lenses to obtain the corresponding front image and the back image. Based on the front image and the back image obtained by the first and second lenses with high magnification, it is determined whether the coordinates of the calibration patterns located in the front image and the back image coincide.

9. The hotspot location method according to claim 6, characterized in that, After acquiring the hotspot imaging information, the hotspot localization method further includes: Under the field of view of the first lens, a first mark is made on the front of the chip under test according to the hotspot imaging information. The first mark is used to characterize the approximate location of the hotspot. The first lens acquires second frontal imaging information of the chip under test with a first mark, and the second lens acquires second hotspot imaging information of the chip under test. The second hotspot imaging information is superimposed on the second frontal imaging information to generate a new target image; Obtaining the location information of hotspots after processing the target image includes: obtaining the location information of hotspots by measuring the distance between the hotspots and the first marker in the new target image.

10. The hotspot location method according to any one of claims 6-9, characterized in that, First, the initial location information of the hotspot is obtained using low-magnification lenses, and then, based on the initial location information, the first and second lenses are switched to high-magnification lenses to obtain the final location information of the hotspot.

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