Heat dissipation device with heat recovery function and electronic device

Abstract

The application relates to a heat dissipation device with a heat recovery function and an electronic device, wherein the heat dissipation device with the heat recovery function comprises a heat conduction box body with a first heat conduction box wall and a second heat conduction box wall; a thermoelectric conversion structure comprises a first thermoelectric conversion assembly arranged in the heat conduction box body, the first thermoelectric conversion assembly comprises at least one first thermoelectric conversion sheet, each first thermoelectric conversion sheet has a first cold surface and a first hot surface arranged oppositely, the first hot surface is attached to the inner surface of the first heat conduction box wall, and the first cold surface is adapted to indirectly contact the inner surface of the second heat conduction box wall; a heat dissipation assembly comprises a first heat dissipation fin, a substrate and a first heat conduction pipe group, the substrate is arranged between a heat source of the electronic device and the first heat conduction box wall, and two oppositely arranged surfaces are directly in contact with the heat source and the first heat conduction box wall respectively; the heat conduction box body is arranged between the first heat dissipation fin and the substrate, and the substrate is connected with the first heat dissipation fin through the first heat conduction pipe group; and the thermoelectric conversion effect and the heat dissipation efficiency are both high.

Description

Technical Field

[0001] This invention relates to the field of heat dissipation technology for electronic devices, and more specifically to heat dissipation devices and electronic devices with heat recovery functions. Background Technology

[0002] In recent years, the digital economy has been accounting for an increasing proportion of the total economy, and network data centers, as key infrastructure for data processing, have shown a rapid growth trend in both scale and number.

[0003] As a fundamental building block of network data centers, servers are the core of advanced computing power. With the ever-increasing demand for computing power, the data processing volume handled by the server's central processing unit (CPU) will increase significantly, leading to a corresponding increase in power consumption. Statistics show that the CPU's energy consumption accounts for approximately 60% of the server's total energy consumption, and the server's load itself accounts for approximately 40% of the network data center's total energy consumption.

[0004] As central processing units (CPUs) consume more power, they generate more heat, placing a greater burden on system cooling. Currently, advanced CPUs can dissipate up to 350 watts of heat, and in the future, a single CPU will consume kilowatts, with the thermal design power (TDP) of a single multi-processor server reaching several kilowatts. Recovering such a large amount of heat would undoubtedly have a significant impact. While thermoelectric conversion has a lower conversion efficiency compared to other energy conversion methods, its ease of miniaturization and integration makes it more suitable for implementation within the server chassis. Thermoelectric conversion is typically achieved using thermoelectric generators (TEGs).

[0005] In some related technologies, TEG sheets are directly attached to the chip surface to absorb heat. However, this method significantly hinders chip heat dissipation and increases the power consumption of the heat dissipation system. Other methods connect TEG sheets to heat dissipation components located far from the heat source. For example, the TEG sheet collects heat through a hot water tank or the first heat dissipation fin of the heat dissipation component as an indirect medium, thereby achieving heat conversion. This method reduces the impact on chip heat dissipation. However, due to the large thermal resistance and distance between the TEG sheet and the heat source, the heat collection efficiency is low, resulting in poor thermoelectric conversion effect. Summary of the Invention

[0006] Therefore, the technical problem to be solved by the present invention is to overcome the defects in the prior art where the thermoelectric conversion structure is close to the heat source, which hinders the heat dissipation of the chip, and the thermoelectric conversion structure connected on the heat dissipation component is far away from the heat source, resulting in poor thermoelectric conversion effect. Thus, a heat dissipation device and electronic device with heat recovery function that takes into account both efficient thermoelectric conversion and effective chip heat dissipation is provided.

[0007] To address the aforementioned technical problems, this invention provides a heat dissipation device with heat recovery function, comprising a heat-conducting box body, a thermoelectric conversion structure, and a heat dissipation assembly. The heat-conducting box body has a first heat-conducting box wall and a second heat-conducting box wall disposed opposite to each other. The thermoelectric conversion structure includes a first thermoelectric conversion assembly disposed within the heat-conducting box body. The first thermoelectric conversion assembly includes at least one first thermoelectric conversion plate, each of which has a first cold surface and a first hot surface disposed opposite to each other. The first hot surface is in contact with the inner surface of the first heat-conducting box wall, and the first cold surface is adapted to indirectly contact the inner surface of the second heat-conducting box wall. The heat dissipation assembly includes a first heat dissipation fin, a substrate, and a first heat pipe assembly. The substrate is disposed between the heat source of the electronic device and the first heat-conducting box wall, and two oppositely disposed surfaces of the substrate are in direct contact with the heat source and the first heat-conducting box wall, respectively. The heat-conducting box body is disposed between the first heat dissipation fin and the substrate, and the substrate is connected to the first heat dissipation fin through the first heat pipe assembly.

[0008] The heat dissipation device with heat recovery function provided by the present invention includes at least two first thermoelectric conversion plates, which are laid on the inner surface of the first heat conduction box wall and are arranged in series.

[0009] The heat dissipation device with heat recovery function provided by the present invention further includes a second thermoelectric conversion component in the thermoelectric conversion structure. The second thermoelectric conversion component is disposed in the heat conduction box. The second thermoelectric conversion component includes at least one second thermoelectric conversion plate. Each second thermoelectric conversion plate has a second cold surface and a second hot surface arranged opposite to each other. The second hot surface is in contact with the inner surface of the wall of the second heat conduction box.

[0010] The heat dissipation assembly further includes a first heat dissipation plate and a second heat pipe assembly. The first heat dissipation plate is disposed between the first thermoelectric conversion assembly and the second thermoelectric conversion assembly, and has a first heat dissipation surface and a second heat dissipation surface disposed opposite to each other. The first cold surface is attached to the first heat dissipation surface, and the second cold surface is attached to the second heat dissipation surface. The first heat dissipation plate is connected to the first heat dissipation fins through the second heat pipe assembly.

[0011] The heat dissipation device with heat recovery function provided by the present invention includes at least two second thermoelectric conversion plates, which are laid on the second heat dissipation surface and are arranged in series.

[0012] The heat dissipation device with heat recovery function provided by the present invention is formed by bending a solid metal heat-conducting plate or a capillary metal heat-conducting plate in sequence. It has openings on both sides, and the openings are flat rectangular openings. Two sets of second heat-conducting pipe groups are respectively connected to the two sides of the first heat dissipation plate. The two sets of second heat-conducting pipe groups extend from the heat dissipation box through the two openings and are connected to the first heat dissipation fins.

[0013] The heat dissipation device with heat recovery function provided by the present invention is configured in series with the second thermoelectric conversion component and the first thermoelectric conversion component.

[0014] The heat dissipation device with heat recovery function provided by the present invention further includes a third thermoelectric conversion component in the thermoelectric conversion structure. The third thermoelectric conversion component is disposed between the heat conduction box and the heat dissipation component. The third thermoelectric conversion component includes at least one third thermoelectric conversion plate. Each third thermoelectric conversion plate has a third cold surface and a third hot surface that are arranged opposite to each other. The third hot surface is in contact with the outer surface of the second heat conduction box wall.

[0015] The heat dissipation assembly further includes a second heat dissipation plate and a third heat pipe assembly. The second heat dissipation plate is disposed between the third thermoelectric conversion assembly and the heat dissipation assembly, and has a third heat dissipation surface and a fourth heat dissipation surface disposed opposite to each other. The third heat dissipation surface is attached to the third cold surface, and the fourth heat dissipation surface is connected to the first heat dissipation fins through the third heat pipe assembly, or the fourth heat dissipation surface is directly connected to the first heat dissipation fins.

[0016] The heat dissipation device with heat recovery function provided by the present invention comprises a first thermoelectric conversion component, a second thermoelectric conversion component, and a third thermoelectric conversion component arranged in series.

[0017] The heat dissipation device with heat recovery function provided by the present invention includes a third thermoelectric conversion component comprising at least two third thermoelectric conversion plates, which are laid on the outer surface of the second heat-conducting box wall, and the at least two third thermoelectric conversion plates are arranged in series.

[0018] The heat dissipation device with heat recovery function provided by the present invention has a first heat dissipation fin having a plurality of first heat dissipation fins arranged parallel to the heat source, and the plurality of first heat dissipation fins being distributed at intervals in sequence along a direction perpendicular to the heat source.

[0019] The thermoelectric conversion structure further includes at least two sets of fourth thermoelectric conversion components. The at least two sets of fourth thermoelectric conversion components are sequentially connected to at least two of the first heat dissipation fins near the heat conduction box. Each fourth thermoelectric conversion component includes at least one fourth thermoelectric conversion plate. Each fourth thermoelectric conversion plate has a fourth cold surface and a fourth hot surface that are arranged opposite to each other. The fourth hot surface is attached to the first heat dissipation fin, and the fourth cold surface is attached to the second heat dissipation fin.

[0020] The heat dissipation device with heat recovery function provided by the present invention has two sets of fourth thermoelectric conversion plates, each set having at least two fourth thermoelectric conversion plates. One set of fourth thermoelectric conversion plates is laid on the surface of the first heat dissipation fin facing the heat source, and the other set of fourth thermoelectric conversion plates is laid on the surface of the first heat dissipation fin facing away from the heat source. The two sets of fourth thermoelectric conversion plates are arranged in series.

[0021] And / or, the first thermoelectric conversion component, the second thermoelectric conversion component, the third thermoelectric conversion component and the fourth thermoelectric conversion component are arranged in series.

[0022] The heat dissipation device with heat recovery function provided by the present invention has a first thermally conductive silicone grease layer coated on the outer surface of the first thermally conductive box wall;

[0023] The heat dissipation device with heat recovery function provided by the present invention has a second thermally conductive silicone grease layer coated on the inner surface of the first thermally conductive box wall.

[0024] The heat dissipation device with heat recovery function provided by the present invention has a third thermally conductive silicone grease layer coated on the outer surface of the second heat-conducting box wall;

[0025] The heat dissipation device with heat recovery function provided by the present invention has a fourth thermally conductive silicone grease layer coated on the inner surface of the second heat-conducting box wall.

[0026] The heat dissipation device with heat recovery function provided by the present invention has a fifth thermally conductive silicone grease layer coated on the first heat dissipation surface.

[0027] The heat dissipation device with heat recovery function provided by the present invention has a sixth thermally conductive silicone grease layer coated on the second heat dissipation surface.

[0028] The heat dissipation device with heat recovery function provided by the present invention has a seventh thermally conductive silicone grease layer coated on the third heat dissipation surface.

[0029] The heat dissipation device with heat recovery function provided by the present invention has an eighth thermally conductive silicone grease layer coated between the fourth thermoelectric conversion plate and the first heat dissipation fin.

[0030] The heat dissipation device with heat recovery function provided by the present invention has a ninth thermally conductive silicone grease layer coated between the four thermoelectric conversion plates and the second heat dissipation fins.

[0031] The present invention also provides an electronic device, including the above-mentioned heat dissipation device with heat recovery function, wherein the bottom surface of the substrate of the heat dissipation device with heat recovery function is in contact with the heat source of the electronic device through a thermally conductive silicone grease layer, and the height of the heat dissipation device with heat recovery function and the electronic device is 2U or more.

[0032] The electronic device provided by this invention is preferably a passive cooling fanless server using the heat dissipation device with heat recovery function, such as a fanless edge server in some extreme environments and a fanless server for specific purposes. While taking into account chip heat dissipation, it can also realize heat recovery. For active cooling servers, such as air-cooled servers, the filling of thermoelectric conversion components in the heat dissipation device with heat recovery function will increase the thermal resistance of the device, affect chip heat dissipation, and increase fan power consumption. However, the above adverse effects can be offset by reducing the thermal resistance of other components (such as thermal grease, heat pipes, heat sink fins, etc.) in the heat dissipation device with heat recovery function, increasing the number of other heat dissipation components (such as heat pipes, heat sink fins, etc.), and increasing the size of the heat dissipation device with heat recovery function. Under the condition of offsetting, the relevant design scheme in this invention is applicable to active cooling servers, such as air-cooled and immersion liquid-cooled servers.

[0033] The electronic device provided by this invention is a server, in which multiple thermoelectric conversion structures are connected in series and then connected to the load within a single server chassis;

[0034] Alternatively, multiple thermoelectric conversion structures can be connected in parallel within a single server chassis and then connected to the load.

[0035] Alternatively, in multiple server chassis or a cabinet containing multiple server chassis, multiple thermoelectric conversion structures in each server chassis are connected in series and then connected to the load.

[0036] Alternatively, in multiple server chassis or a cabinet containing multiple server chassis, multiple thermoelectric conversion structures within each server chassis are connected in parallel and then connected to the load.

[0037] Alternatively, in multiple server chassis or racks containing multiple server chassis, multiple thermoelectric conversion structures within each server chassis are connected in series, forming a parallel structure among the multiple server chassis, which is then connected to the load.

[0038] The technical solution of this invention has the following advantages:

[0039] 1. The heat dissipation device with heat recovery function provided by the present invention includes a heat-conducting box body, a thermoelectric conversion structure, and a heat dissipation assembly. The heat-conducting box body has a first heat-conducting box wall and a second heat-conducting box wall disposed opposite to each other. The thermoelectric conversion structure includes a first thermoelectric conversion assembly disposed within the heat-conducting box body. The first thermoelectric conversion assembly includes at least one first thermoelectric conversion plate. Each first thermoelectric conversion plate has a first cold surface and a first hot surface disposed opposite to each other. The first hot surface is in contact with the inner surface of the first heat-conducting box wall, and the first cold surface is adapted to be in contact directly or indirectly with the inner surface of the second heat-conducting box wall. The heat dissipation assembly includes a first heat dissipation fin, a substrate, and a first heat pipe assembly. The substrate is disposed between the heat source of the electronic device and the first heat-conducting box wall, and two oppositely disposed surfaces of the substrate are in direct contact with the heat source and the first heat-conducting box wall, respectively. The heat-conducting box body is disposed between the first heat dissipation fin and the substrate, and the substrate is connected to the first heat dissipation fin through the first heat pipe assembly.

[0040] The heat dissipation device with heat recovery function provided by this invention is equipped with a heat-conducting box, which can be made of a solid metal plate or a capillary structure metal plate. The outer surface of the first heat-conducting box wall of the heat-conducting box is in close contact with the substrate. Since the first heat-conducting box wall and the substrate separate the first hot surface from the heat source, and the heat-conducting pipe assembly is connected to the substrate to dissipate heat from the heat source, the heat dissipation effect of the heat source is not hindered by the thermoelectric conversion plate. At the same time, the heat source can transfer heat to the first hot surface of the first thermoelectric conversion plate in a very short distance, and the heat exchange cross section is large, so that the first thermoelectric conversion plate obtains a lot of heat, thereby ensuring the thermoelectric conversion effect of the first thermoelectric conversion assembly. Furthermore, since the heat-conducting box is a box structure that can form a receiving cavity, although the first heat-conducting box wall and the second heat-conducting box wall are arranged opposite each other, they are connected to each other, resulting in good heat conduction. The second heat-conducting box wall can also have good heat conduction, increasing the heat conduction area.

[0041] 2. The heat dissipation device with heat recovery function provided by the present invention includes at least two first thermoelectric conversion plates, which are laid on the inner surface of the first heat conduction box wall and are arranged in series.

[0042] The installation of at least two first thermoelectric conversion plates can increase the thermoelectric conversion area, and the use of a series circuit for the at least two first thermoelectric conversion plates can achieve better thermoelectric conversion effect compared to a parallel circuit.

[0043] 3. The heat dissipation device with heat recovery function provided by the present invention further includes a second thermoelectric conversion component in the thermoelectric conversion structure; the second thermoelectric conversion component is disposed in the heat-conducting box, the second thermoelectric conversion component includes at least one second thermoelectric conversion plate, each second thermoelectric conversion plate has a second cold surface and a second hot surface arranged opposite to each other, the second hot surface is attached to the inner surface of the second heat-conducting box wall; the heat dissipation component further includes a first heat dissipation plate and a second heat-conducting pipe assembly, the first heat dissipation plate is disposed between the first thermoelectric conversion component and the second thermoelectric conversion component, and has a first heat dissipation surface and a second heat dissipation surface arranged opposite to each other, the first cold surface is attached to the first heat dissipation surface, and the second cold surface is attached to the second heat dissipation surface; the first heat dissipation plate is connected to the first heat dissipation fins through the second heat-conducting pipe assembly.

[0044] Although the first and second heat-conducting box walls of the heat-conducting box body are arranged opposite to each other, they are connected to each other, resulting in good heat conduction. Therefore, the second heat-conducting box wall can also quickly conduct the heat source temperature and can have a temperature close to that of the first heat-conducting box wall. Compared with the first heat-conducting box wall, the second heat-conducting box wall has less heat loss. The second thermoelectric conversion component includes a second thermoelectric conversion plate, the second hot surface of which is attached to the inner surface of the second heat-conducting box wall. This allows the heat of the second heat-conducting box wall to be utilized, ensuring that the second thermoelectric conversion component has a good thermoelectric conversion effect. The way the two surfaces are fitted together further enhances the thermoelectric conversion effect of the second thermoelectric conversion component. The first heat dissipation surface of the first heat sink is in contact with the first cold surface, and the second heat dissipation surface is in contact with the second cold surface. The heat from the first cold surface and the second cold surface can be conducted to the first heat dissipation fins outside the heat conduction box through the first heat sink and the second heat pipe assembly. This can increase the temperature difference between the hot and cold surfaces of the first thermoelectric conversion plate and the second thermoelectric conversion plate to obtain better thermoelectric conversion performance. It can also conduct excess heat out of the heat conduction box during the thermoelectric conversion process, avoiding damage to the first thermoelectric conversion assembly and the second thermoelectric conversion assembly due to excessively high internal temperature of the heat conduction box, so as to keep the internal temperature of the heat conduction box moderate.

[0045] 4. The heat dissipation device with heat recovery function provided by the present invention includes at least two second thermoelectric conversion plates, which are laid on the second heat dissipation surface and are arranged in series.

[0046] The installation of at least two second thermoelectric conversion plates can increase the thermoelectric conversion area, and the use of a series circuit for the at least two second thermoelectric conversion plates can also achieve a higher thermoelectric conversion effect.

[0047] 5. The heat dissipation device with heat recovery function provided by the present invention, wherein the heat conduction box is formed by bending a solid metal heat conduction plate or a capillary structure metal heat conduction plate in sequence, and has openings on both sides, wherein the openings are flat rectangular openings, and two sets of second heat conduction pipe groups are respectively connected to the two sides of the first heat dissipation plate, and the two sets of second heat conduction pipe groups extend from the heat conduction box through the two openings and are connected to the first heat dissipation fins.

[0048] The heat-conducting box has an opening, allowing the second heat pipe assembly to extend inside and connect to the first heat sink, thus dissipating heat from the first heat sink. The opening is a flat rectangular shape, indicating that the heat-conducting box is essentially a flat rectangular box. The distance between the first and second heat-conducting box walls is small, allowing the second heat-conducting box wall to quickly receive heat conducted from the first heat-conducting box wall through its side walls, resulting in good thermoelectric conversion performance. Furthermore, the heat-conducting box does not occupy excessive space, ensuring effective heat dissipation. Attached Figure Description

[0049] To more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0050] Figure 1 A schematic diagram of a first embodiment of the heat dissipation device with heat recovery function provided by the present invention;

[0051] Figure 2 A schematic diagram of the heat-conducting box body of the heat dissipation device with heat recovery function provided by the present invention;

[0052] Figure 3 A schematic diagram of one embodiment of the first thermoelectric conversion component of the heat dissipation device with heat recovery function provided by the present invention;

[0053] Figure 4 A schematic diagram of another embodiment of the first thermoelectric conversion component of the heat dissipation device with heat recovery function provided by the present invention;

[0054] Figure 5 A schematic diagram of a second embodiment of the heat dissipation device with heat recovery function provided by the present invention;

[0055] Figure 6 This is a schematic diagram of one embodiment of the heat source provided in this invention.

[0056] Figure 7This is a schematic diagram illustrating another embodiment of the heat source provided in this invention.

[0057] Figure 8 This is a schematic diagram of a TEG sheet placement method provided in an embodiment of the present invention;

[0058] Figure 9 This is another schematic diagram of the TEG sheet placement method provided in the embodiments of the present invention;

[0059] Figure 10 This is a schematic diagram of a TEG chip connection method provided in an embodiment of the present invention;

[0060] Figure 11 This is another schematic diagram of the TEG chip connection method provided in the embodiments of the present invention;

[0061] Figure 12 This is a schematic diagram of a TEG chip cold surface heat dissipation treatment provided in an embodiment of the present invention;

[0062] Figure 13 This is another schematic diagram of the TEG sheet cold surface heat dissipation treatment provided in an embodiment of the present invention;

[0063] Figure 14 This is a schematic diagram of a first power supply method for a heat dissipation device with heat recovery function in the electronic device of the present invention.

[0064] Figure 15 This is a schematic diagram of a second power supply method for a heat dissipation device with heat recovery function in the electronic device of the present invention;

[0065] Figure 16 This is a schematic diagram of a third power supply method for a heat dissipation device with heat recovery function in the electronic device of the present invention;

[0066] Figure 17 This is a schematic diagram of a fourth power supply method for a heat dissipation device with heat recovery function in the electronic device of the present invention;

[0067] Figure 18 This is a schematic diagram of a fifth power supply method for a heat dissipation device with heat recovery function in the electronic device of the present invention;

[0068] Explanation of reference numerals in the attached figures:

[0069] 1. Heat-conducting box body; 101. First heat-conducting box wall; 102. Second heat-conducting box wall; 201. First thermoelectric conversion assembly; 2011. First thermoelectric conversion plate; 202. Second thermoelectric conversion assembly; 203. Third thermoelectric conversion assembly; 204. Fourth thermoelectric conversion assembly; 3. Heat dissipation assembly; 301. First heat dissipation fins; 302. Substrate; 303. First heat pipe assembly; 304. First heat dissipation plate; 305. Second heat pipe assembly; 306. Second heat dissipation plate; 307. Third heat pipe assembly; 308. Second heat dissipation fins; 4. Heat source; 5. Copper sheet; 6. TEG sheet; 7. Thermal grease; 8. Heat dissipation device with heat recovery function; 9. Load. Detailed Implementation

[0070] The technical solution of the present invention will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0071] In the description of this invention, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing the invention and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0072] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0073] Furthermore, the technical features involved in the different embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0074] like Figures 1 to 4As shown, this embodiment discloses a heat dissipation device 8 with heat recovery function, including a heat-conducting box 1, a thermoelectric conversion structure, and a heat dissipation component 3. The heat-conducting box 1 has a first heat-conducting box wall 101 and a second heat-conducting box wall 102 arranged opposite to each other. The thermoelectric conversion structure includes a first thermoelectric conversion component 201, which is disposed inside the heat-conducting box 1. The first thermoelectric conversion component 201 includes at least one first thermoelectric conversion plate 2011. Each first thermoelectric conversion plate 2011 has a first cold surface and a first hot surface arranged opposite to each other. The first hot surface is perpendicular to the first heat-conducting box wall 101. The inner surfaces are bonded together, and the first cold surface indirectly contacts the inner surface of the second heat-conducting box wall 102; the heat dissipation assembly 3 includes a first heat dissipation fin 301, a substrate 302 and a first heat-conducting pipe group 303, the substrate 302 is disposed between the heat source 4 of the electronic device and the first heat-conducting box wall 101, and the two oppositely disposed surfaces of the substrate 302 are in direct contact with the heat source 4 and the first heat-conducting box wall 101 respectively; the heat-conducting box body 1 is disposed between the first heat dissipation fin 301 and the substrate 302, and the substrate 302 is connected to the first heat dissipation fin 301 through the first heat-conducting pipe group 303.

[0075] The heat dissipation device 8 with heat recovery function provided in this embodiment is provided with a heat-conducting box 1. The heat-conducting box 1 can be made of a solid metal plate or a capillary structure metal plate. The outer surface of the first heat-conducting box wall 101 of the heat-conducting box 1 is in close contact with the substrate 302. Since the first heat-conducting box wall 101 and the substrate 302 separate the first hot surface from the heat source 4, and the heat-conducting pipe group is connected to the substrate 302 to dissipate heat from the heat source 4, the heat dissipation effect of the heat source 4 is not hindered by the thermoelectric conversion plate. At the same time, the heat source 4 can transfer heat to the first hot surface of the first thermoelectric conversion plate 2011 in a very short distance, and the heat exchange cross section is large, so that the first thermoelectric conversion plate 2011 obtains a lot of heat, thereby ensuring the thermoelectric conversion effect of the first thermoelectric conversion component 201. Since the heat-conducting box 1 is a box structure that can form a cavity, the first heat-conducting box wall 101 and the second heat-conducting box wall 102 are arranged opposite to each other, but are connected to each other, resulting in a better heat conduction effect. The second heat-conducting box wall 102 can also have better heat conduction, increasing the heat conduction area.

[0076] In this embodiment, Figure 1 The heat dissipation device 8 with heat recovery function shown has a height of 4U. The height of the heat dissipation device 8 with heat recovery function can also be 2U, 3U or more. The height of the heat dissipation device 8 with heat recovery function with a height of 2U or more can be scaled up proportionally.

[0077] In this embodiment, the first thermoelectric conversion assembly 201 includes at least two first thermoelectric conversion plates 2011, which are laid on the inner surface of the first heat-conducting box wall 101, and the at least two first thermoelectric conversion plates 2011 are arranged in series.

[0078] The installation of at least two first thermoelectric conversion plates 2011 can increase the thermoelectric conversion area, and the at least two first thermoelectric conversion plates 2011 are arranged in series circuit, which can achieve better thermoelectric conversion effect compared with parallel arrangement.

[0079] In this embodiment, the first thermoelectric conversion assembly 201 may include one first thermoelectric conversion plate 2011, or it may include at least two first thermoelectric conversion plates 2011. The number of first thermoelectric conversion plates 2011 depends on the size of the first thermoelectric conversion plates 2011. If the surface area of ​​the first thermoelectric conversion plate 2011 is smaller than the area of ​​the inner surface of the first heat-conducting box wall 101, then multiple first thermoelectric conversion plates 2011 may be arranged in series.

[0080] Specifically, the outer shells of the first hot surface and the first cold surface of the first thermoelectric conversion element 2011 are made of ceramic, aluminum, or copper, with copper being preferred. The first thermoelectric conversion element 2011 contains P-N particles and other components that are responsible for thermoelectric conversion.

[0081] In a preferred embodiment, the first thermoelectric conversion assembly 201 includes four rectangular first thermoelectric conversion plates 2011, which are laid on the inner surface of the first heat-conducting box wall 101.

[0082] The heat dissipation device 8 with heat recovery function provided in this embodiment further includes a second thermoelectric conversion component 202 in the thermoelectric conversion structure. The second thermoelectric conversion component 202 is disposed in the heat-conducting box 1 and includes at least one second thermoelectric conversion plate. Each second thermoelectric conversion plate has a second cold surface and a second hot surface arranged opposite to each other. The second hot surface is attached to the inner surface of the second heat-conducting box wall 102. The heat dissipation component 3 further includes a first heat dissipation plate 304 and a second heat-conducting pipe group 305. The first heat dissipation plate 304 is disposed between the first thermoelectric conversion component 201 and the second thermoelectric conversion component 202 and has a first heat dissipation surface and a second heat dissipation surface arranged opposite to each other. The first cold surface is attached to the first heat dissipation surface and the second cold surface is attached to the second heat dissipation surface. The first heat dissipation plate 304 is connected to the first heat dissipation fins 301 through the second heat-conducting pipe group 305.

[0083] Although the first heat-conducting box wall 101 and the second heat-conducting box wall 102 of the heat-conducting box body 1 are arranged opposite to each other, they are connected to each other and have a good heat conduction effect. Therefore, the second heat-conducting box wall 102 can also quickly conduct the temperature of the heat source 4 and can have a temperature close to that of the first heat-conducting box wall 101. Compared with the first heat-conducting box wall 101, the second heat-conducting box wall 102 has a smaller heat loss. The second thermoelectric conversion component 202 includes a second thermoelectric conversion sheet. The second hot surface of the second thermoelectric conversion sheet is attached to the inner surface of the second heat-conducting box wall 102, which can utilize the heat of the second heat-conducting box wall 102 and ensure that the second thermoelectric conversion component 202 has a good thermoelectric conversion effect. The way the two surfaces are fitted together further enhances the thermoelectric conversion effect of the second thermoelectric conversion component 202. The first heat dissipation surface of the first heat dissipation plate 304 is in contact with the first cold surface, and the second heat dissipation surface is in contact with the second cold surface. The heat from the first cold surface and the second cold surface can be conducted to the first heat dissipation fins 301 outside the heat conduction box 1 through the first heat dissipation plate 304 and the second heat conduction pipe group 305. This can increase the temperature difference between the hot and cold surfaces of the first thermoelectric conversion plate 2011 and the second thermoelectric conversion plate to obtain better thermoelectric conversion performance. It can also conduct excess heat out of the heat conduction box 1 during the thermoelectric conversion process, avoid the internal temperature of the heat conduction box 1 from being too high, and help the heat source 4 dissipate heat.

[0084] In this embodiment, the second thermoelectric conversion component 202 includes at least two second thermoelectric conversion sheets, which are laid on the second heat dissipation surface, and the at least two second thermoelectric conversion sheets are arranged in series.

[0085] The installation of at least two second thermoelectric conversion plates can increase the thermoelectric conversion area, and the use of a series circuit for the at least two second thermoelectric conversion plates can also achieve a higher thermoelectric conversion effect.

[0086] In this embodiment, the second thermoelectric conversion assembly 202 may include one second thermoelectric conversion plate, or at least two second thermoelectric conversion plates. The number of second thermoelectric conversion plates depends on their size. If the surface area of ​​the second thermoelectric conversion plate is smaller than the area of ​​the inner surface of the second heat-conducting box wall 102, multiple second thermoelectric conversion plates may be connected in series.

[0087] Specifically, the outer shells of the second hot and second cold surfaces of the second thermoelectric conversion element are made of ceramic, aluminum, or copper, with copper being preferred. The second thermoelectric conversion element contains P-N particles and other components that are responsible for thermoelectric conversion.

[0088] The heat dissipation device 8 with heat recovery function provided in this embodiment is formed by bending a metal heat-conducting plate or a capillary metal heat-conducting plate in sequence. It has openings on both sides, and the openings are flat rectangular openings. Two sets of second heat-conducting pipe groups 305 are respectively connected to the two sides of the first heat dissipation plate 304. The two sets of second heat-conducting pipe groups 305 extend from the heat-conducting box 1 through the two openings and are connected to the first heat dissipation fins 301.

[0089] The heat-conducting box 1 has an opening, allowing the first heat-conducting pipe assembly 303 to extend inside the heat-conducting box 1 and connect with the first heat sink 304 to conduct heat away from the first heat sink 304. The opening is a flat rectangular opening, indicating that the heat-conducting box 1 is an overall flat rectangular box. The distance between the first heat-conducting box wall 101 and the second heat-conducting box wall 102 is small, allowing the second heat-conducting box wall 102 to quickly receive heat conducted by the first heat-conducting box wall 101 through its sidewall, resulting in good thermoelectric conversion performance. Furthermore, the heat-conducting box 1 does not occupy excessive space, ensuring effective heat dissipation.

[0090] The heat dissipation device 8 with heat recovery function provided in this embodiment has the outer surface of the first heat conduction box wall 101 in direct contact with the heat source 4 of the electronic device. Therefore, the heat conduction of the first heat conduction box wall 101 is faster and the temperature rises faster. The second heat conduction pipe group 305 is connected to the first heat conduction box wall 101 to conduct heat to the first heat dissipation fins 301 of the heat dissipation assembly 3. Heat can be conducted to the first heat dissipation fins 301 of the heat dissipation assembly 3 more quickly, ensuring that the heat dissipation assembly 3 has a better heat dissipation effect.

[0091] Alternatively, the second heat-conducting box wall 102 can be connected to the first heat dissipation fins 301 of the heat dissipation assembly 3 via the fifth heat-conducting pipe group. The heat from the second heat-conducting box wall 102 is conducted through the first heat-conducting box wall 101, ensuring that some heat undergoes thermoelectric conversion first, or is transferred to the first heat dissipation fins 301 of the heat dissipation assembly 3 during thermoelectric conversion, achieving a better thermoelectric conversion effect. Simultaneously, since the heat-conducting box body 1 is a flat box, the second heat-conducting box wall 102 can quickly conduct heat from the first heat-conducting box wall 101. Therefore, even if the heat dissipation assembly 3 is connected to the second heat-conducting box wall 102 via the second heat-conducting pipe group 305, it can quickly obtain the dissipated heat, and the heat dissipation assembly 3 can still achieve a good heat dissipation effect.

[0092] In one embodiment of this invention, the second thermoelectric conversion component 202 and the first thermoelectric conversion component 201 are connected in series.

[0093] Both the second thermoelectric conversion element of the second thermoelectric conversion component 202 and the first thermoelectric conversion element 2011 of the first thermoelectric conversion component 201 achieve good thermoelectric conversion, further increasing the thermoelectric conversion area. Furthermore, when at least two second thermoelectric conversion elements are connected in series and then connected in series with at least two first thermoelectric conversion elements 2011, or when one first thermoelectric conversion element 2011 is connected in series with one second thermoelectric conversion element, an even higher thermoelectric conversion effect can be obtained.

[0094] In this embodiment, the thermoelectric conversion structure further includes a third thermoelectric conversion component 203, which is disposed between the heat-conducting box 1 and the heat dissipation component 3. The third thermoelectric conversion component 203 includes at least one third thermoelectric conversion plate, each of which has a third cold surface and a third hot surface arranged opposite to each other. The third hot surface is in contact with the outer surface of the second heat-conducting box wall 102. The heat dissipation component 3 further includes a second heat dissipation plate 306 and a third heat pipe assembly 307. The second heat dissipation plate 306 is disposed between the third thermoelectric conversion component 203 and the first heat dissipation fin 301, and has a third heat dissipation surface and a fourth heat dissipation surface arranged opposite to each other. The third heat dissipation surface is in contact with the third cold surface, and the fourth heat dissipation surface is connected to the first heat dissipation fin 301 through the third heat pipe assembly 307, or the fourth heat dissipation surface is directly connected to the first heat dissipation fin 301.

[0095] Although the first heat-conducting box wall 101 and the second heat-conducting box wall 102 are arranged opposite to each other, they are connected to each other and have a good heat conduction effect. Therefore, the second heat-conducting box wall 102 can also quickly conduct the temperature of the heat source 4 and can have a temperature close to that of the first heat-conducting box wall 101. Compared with the first heat-conducting box wall 101, the second heat-conducting box wall 102 has a smaller heat loss. The third thermoelectric conversion component 203 includes at least one third thermoelectric conversion plate. The third hot surface of the third thermoelectric conversion plate is attached to the outer surface of the second heat-conducting box wall 102, which can utilize the heat of the second heat-conducting box wall 102 and ensure the thermoelectric conversion effect of the third thermoelectric conversion component 203. The third heat dissipation surface of the second heat sink 306 is attached to the third cold surface. Heat can be conducted to the first heat dissipation fins 301 through the fourth heat dissipation surface of the second heat sink 306 and the third heat pipe group 307. This can increase the temperature difference between the hot and cold surfaces of the third thermoelectric conversion sheet to obtain better conversion performance. In addition, the fourth heat dissipation surface is close to the heat dissipation component 3, and can transfer more heat to the heat dissipation component 3 through a larger area, further improving the heat dissipation effect of the heat dissipation component 3.

[0096] In this embodiment, the first thermoelectric conversion component 201, the second thermoelectric conversion component 202, and the third thermoelectric conversion component 203 are arranged in series.

[0097] The second thermoelectric conversion element of the second thermoelectric conversion component 202, the first thermoelectric conversion element 2011 of the first thermoelectric conversion component 201, and the third thermoelectric conversion element of the third thermoelectric conversion component 203 all achieve good thermoelectric conversion, further increasing the thermoelectric conversion area. Furthermore, when at least two second thermoelectric conversion elements are connected in series, and then connected in series with at least two first thermoelectric conversion elements 2011, and then connected in series with at least two third thermoelectric conversion elements, or when one second thermoelectric conversion element is connected in series with one first thermoelectric conversion element 2011 and one third thermoelectric conversion element, an even higher thermoelectric conversion effect can be obtained.

[0098] In this embodiment, the third thermoelectric conversion assembly 203 includes at least two third thermoelectric conversion plates, which are laid on the outer surface of the second heat-conducting box wall 102, and the at least two third thermoelectric conversion plates are arranged in series.

[0099] The installation of at least two third thermoelectric conversion plates can increase the thermoelectric conversion area, and the use of a series circuit for the at least two third thermoelectric conversion plates can also achieve a higher thermoelectric conversion effect.

[0100] In this embodiment, the third thermoelectric conversion assembly 203 may include one third thermoelectric conversion plate, or at least two third thermoelectric conversion plates. The number of third thermoelectric conversion plates depends on their size. If the surface area of ​​the third thermoelectric conversion plate is smaller than the area of ​​the inner surface of the second heat-conducting box wall 102, multiple third thermoelectric conversion plates may be connected in series.

[0101] Specifically, the outer shells of the third hot and third cold surfaces of the third thermoelectric converter are made of ceramic, aluminum, or copper, with copper being preferred. The third thermoelectric converter contains P-N particles and other components that are responsible for thermoelectric conversion.

[0102] like Figure 5 As shown, in this embodiment, the first heat dissipation fin 301 has multiple fins arranged parallel to the heat source 4, and the multiple first heat dissipation fins 301 are distributed at intervals in a direction perpendicular to the heat source 4; the thermoelectric conversion structure further includes at least two sets of fourth thermoelectric conversion components 204, and the at least two sets of fourth thermoelectric conversion components 204 are sequentially connected to at least two first heat dissipation fins 301 near the heat conduction box 1. The fourth thermoelectric conversion component 204 includes at least one fourth thermoelectric conversion plate, and each fourth thermoelectric conversion plate has a fourth cold surface and a fourth hot surface arranged opposite to each other. The fourth hot surface is in contact with the first heat dissipation fin 301; the heat dissipation component 3 further includes a second heat dissipation fin 308, which is in contact with the fourth cold surface.

[0103] The fourth thermoelectric conversion component 204 includes at least one fourth thermoelectric conversion plate. The fourth hot surface of the fourth thermoelectric conversion plate is attached to the first heat dissipation fin 301, which can utilize the heat of the first heat dissipation fin 301. A high temperature difference between the hot and cold surfaces is achieved through the second heat dissipation fin 308, ensuring the thermoelectric conversion effect of the fourth thermoelectric conversion component 204.

[0104] In this embodiment, the fourth thermoelectric conversion sheet has two sets, each set having at least two fourth thermoelectric conversion sheets. One set of the fourth thermoelectric conversion sheets is laid on the surface of the first heat dissipation fin 301 facing the heat source 4, and the other set of the fourth thermoelectric conversion sheets is laid on the surface of the first heat dissipation fin 301 facing away from the heat source 4. The two sets of the fourth thermoelectric conversion sheets are arranged in series, thereby increasing the thermoelectric conversion area and obtaining a higher thermoelectric conversion effect.

[0105] As an alternative implementation, the fourth thermoelectric conversion plate may be connected to the surface of the first heat dissipation fin 301 facing the heat source 4 or the surface away from the heat source 4.

[0106] In this embodiment, the first thermoelectric conversion component 201, the second thermoelectric conversion component 202, the third thermoelectric conversion component 203 and the fourth thermoelectric conversion component 204 are arranged in series to increase the thermoelectric conversion area and obtain a higher thermoelectric conversion effect.

[0107] In this embodiment, the fourth thermoelectric conversion assembly 204 may include one fourth thermoelectric conversion plate, or at least two fourth thermoelectric conversion plates. The number of fourth thermoelectric conversion plates depends on their size. If the surface area of ​​the fourth thermoelectric conversion plate is smaller than the surface area of ​​the first heat dissipation fin 301, multiple fourth thermoelectric conversion plates may be connected in series.

[0108] Specifically, the outer shells of the fourth hot and fourth cold surfaces of the fourth thermoelectric converter are made of ceramic, aluminum, or copper, with copper being preferred. The fourth thermoelectric converter contains P-N particles and other components that are responsible for thermoelectric conversion.

[0109] In this embodiment, a first thermally conductive silicone grease layer is coated on the outer surface of the first thermally conductive box wall 101; the setting of the first thermally conductive silicone grease layer can increase the thermal conductivity between the outer surface of the first thermally conductive box wall 101 and the heat source 4, and reduce heat loss.

[0110] In this embodiment, a second thermally conductive silicone grease layer is coated on the inner surface of the first thermally conductive box wall 101; the setting of the second thermally conductive silicone grease layer can increase the thermal conductivity between the inner surface of the first thermally conductive box wall 101 and the first hot surface, reduce heat loss, and enhance the thermoelectric conversion effect.

[0111] In this embodiment, a third thermally conductive silicone grease layer is coated on the outer surface of the second thermally conductive box wall 102; the setting of the third thermally conductive silicone grease layer can increase the thermal conductivity between the outer surface of the second thermally conductive box wall 102 and the third hot surface, reduce heat loss, and enhance the thermoelectric conversion effect.

[0112] In this embodiment, a fourth thermally conductive silicone grease layer is coated on the inner surface of the second thermally conductive box wall 102; the setting of the fourth thermally conductive silicone grease layer can increase the thermal conductivity between the inner surface of the second thermally conductive box wall 102 and the second hot surface, reduce heat loss, and enhance the thermoelectric conversion effect.

[0113] In this embodiment, the first heat dissipation surface is coated with a fifth thermally conductive silicone grease layer, which can increase the thermal conductivity of the first heat dissipation surface, reduce heat loss, and enhance the thermoelectric conversion effect.

[0114] The heat dissipation device 8 with heat recovery function provided by the present invention has a sixth thermally conductive silicone grease layer coated on the second heat dissipation surface, which can increase the thermal conductivity of the second heat dissipation surface, reduce heat loss, and enhance the thermoelectric conversion effect.

[0115] The heat dissipation device 8 with heat recovery function provided by the present invention has a seventh thermally conductive silicone grease layer coated on the third heat dissipation surface, which can increase the thermal conductivity of the third heat dissipation surface, reduce heat loss, and enhance the thermoelectric conversion effect.

[0116] The heat dissipation device 8 with heat recovery function provided by the present invention has an eighth thermally conductive silicone grease layer coated between the fourth thermoelectric conversion plate and the first heat dissipation fin 301, which can increase the thermal conductivity of the fourth thermoelectric conversion plate, reduce heat loss, and enhance the thermoelectric conversion effect.

[0117] The heat dissipation device 8 with heat recovery function provided by the present invention has a ninth thermally conductive silicone grease layer coated between the fourth thermoelectric conversion plate and the second heat dissipation fin 308, which can increase the heat dissipation efficiency of the fourth thermoelectric conversion plate, improve the temperature difference between the hot and cold surfaces of the fourth thermoelectric conversion plate, and enhance the thermoelectric conversion effect.

[0118] Specifically, in this embodiment, the first thermoelectric conversion sheet 2011, the second thermoelectric conversion sheet, the third thermoelectric conversion sheet, and the fourth thermoelectric conversion sheet are all TEG sheets 6. The TEG sheet 6 is a thermoelectric generator, and its working principle is the Seebeck effect. The hot and cold surface shells of the TEG sheet 6 are made of ceramic, aluminum, or copper. The internal structure consists of P-N particles connected in series and conductive copper sheets 5. The number of P-N particles determines the power of the generator; the more particles, the higher the voltage and current generated per unit temperature difference.

[0119] Since direct contact between the TEG sheet 6 and the heat source 4 of the electronic device would affect the latter's heat dissipation (as shown in Table 1), resulting in a net loss, an indirect contact method is needed to achieve the goal of both not affecting the heat dissipation of heat source 4 and extracting more heat from it. The heat source 4 of the electronic device can be either the CPU or the GPU. As shown in the experimental results in Table 2 and the simulation results in Table 3, unlike placing the TEG sheet 6 between the heatsink and the CPU, placing a layer of TEG sheet 6 on the heatsink substrate 302 yields more consistent experimental and simulation results. That is, placing it in this position has little or no impact on the CPU temperature. Furthermore, according to the simulation results in Table 4, increasing the number of heat pipes connected to the TEG cold-side heatsink can significantly reduce the CPU temperature to 56.5℃, almost identical to 56℃. This indicates that although the heatsink is filled with TEG sheet 6, the CPU's heat dissipation remains unaffected after optimized heat dissipation design. The TEG parameters used in the above simulations and experiments are: thickness 0.34 cm, thermal conductivity 15 × 10⁻⁶. －3 W / (℃·cm).

[0120] Table 1 shows a simulation result of the placement position of TEG chip 6 provided in this embodiment.

[0121] TEG film location TEG-free film Located between the heatsink and the CPU CPU power 350W 350W Fan airflow 150cfm 150cfm CPU temperature 56℃ 130℃

[0122] Table 2 shows the experimental results of the placement of TEG sheet 6 provided in this embodiment.

[0123] TEG location TEG-free film Located on the heat sink base plate CPU power, fan airflow constant constant CPU temperature 66℃ 66℃

[0124] Table 3 shows another simulation result of the placement position of TEG chip 6 provided in this embodiment.

[0125] TEG location TEG-free film Located on the heat sink base plate CPU power 350W 350W Fan airflow 150cfm 150cfm CPU temperature 56℃ 59℃

[0126] Table 4 shows the simulation results of the TEG plate 6 cold surface heat dissipation treatment provided in this embodiment.

[0127] TEG cold surface heat dissipation treatment No heat dissipation It has 3 heat pipes It has 7 heat pipes CPU power 350W 350W 350W Fan airflow 150cfm 150cfm 150cfm CPU temperature 59℃ 58℃ 56.5℃

[0128] Specifically, experimental tests have shown that... Figure 6 As shown, heat source 4 with a surface temperature of 48°C, after passing through a 1mm thick copper sheet 5 (without thermal grease 7 applied), ... Figure 7 As shown, the temperature dropped to 44℃, retaining nearly 92% of the heat. This indicates that the TEG sheet 6 can first contact the copper plate, and then the copper plate can contact the heat source 4, thereby obtaining sufficient heat in the vertical direction. At the same time, the temperature of 44℃ can be retained to 32℃ after being transmitted through a distance of 45mm in the copper sheet 5, with a retention rate of 73%. This demonstrates the rationality of the heat conduction box 1.

[0129] Specifically, such as Figure 8 As shown, when the core temperature of heat source 4 is T, heat is transferred to TEG plate 6 through copper plate 5, and its measured output power is P. TEG plate 6 is superimposed in the vertical direction, as shown... Figure 9 As shown, when TEG sheets 6 are connected in series or parallel, the measured output power is approximately 0.5P, indicating that a stacked structure in the vertical direction is not advisable as it reduces the thermoelectric conversion efficiency. Therefore, only one layer of TEG sheets 6 can be laid flat on one hot surface of the heat source 4. Figure 10 As shown, when the core temperature of heat source 4 is T, TEG plates 6 are laid flat in the horizontal direction and connected in parallel. The measured output power can reach 2P. Similarly, TEG plates 6 are laid flat in the horizontal direction and connected in series, as shown... Figure 11 As shown, the measured output power was as high as 3.2P, proving that laying and connecting TEG plates 6 in a horizontal plane can improve the thermoelectric conversion effect, and the thermoelectric conversion effect of the series mode is even higher than that of the parallel mode.

[0130] In summary, in this embodiment, the first thermoelectric conversion sheet 2011, the second thermoelectric conversion sheet, and the third thermoelectric conversion sheet, which are laid flat, can all significantly improve the thermoelectric conversion effect. In this embodiment, although the first thermoelectric conversion component 201, the second thermoelectric conversion component 202, and the third thermoelectric conversion component 203 appear to be vertically stacked, which may reduce the thermoelectric conversion effect, the use of a flat heat-conducting box 1 in this embodiment increases the thermoelectric conversion effect of the first thermoelectric conversion component 201 by utilizing the first heat-conducting box wall 101 of the heat-conducting box 1. The second heat-conducting box wall 102, which is connected to and close to the heat source 4, effectively increases the area of ​​contact with the heat source 4. Therefore, in addition to laying the first thermoelectric conversion plate 2011 of the first thermoelectric conversion component 201 on the heat source 4, it is also equivalent to laying the second thermoelectric conversion plate of the second thermoelectric conversion component 202 and the third thermoelectric conversion plate of the third thermoelectric conversion component 203 on the heat source 4. Thus, in this embodiment, the seemingly stacked arrangement achieves a flat laying effect, greatly improving the thermoelectric conversion effect.

[0131] Specifically, such as Figure 13 As shown, a heat dissipation component 3 was added to the cold side of TEG plate 6. Compared with the side without the heat dissipation component 3, as shown... Figure 12 As shown, when the core temperature of heat source 4 is x, the output power with heat dissipation component 3 is 11 times that without heat dissipation component 3, which fully demonstrates the importance of the cold-surface heat dissipation design for TEG plate 6 in the heat dissipation device 8 with heat recovery function. In summary, the thermoelectric conversion effect of the thermoelectric conversion structure of the heat dissipation device 8 with heat recovery function in this embodiment is greatly improved, and the heat dissipation effect can be guaranteed at the same time.

[0132] like Figure 1 Taking a 4U server as an example, the heat dissipation component 3 in this embodiment includes multiple first heat dissipation fins 301. The first heat dissipation fins 301 are arranged parallel to the heat source 4 and are distributed sequentially at intervals along a direction perpendicular to the heat source 4. The first heat pipe group 303, the second heat pipe group 305, and the third heat pipe group 307 can all be straight pipes and are sequentially connected to the multiple first heat dissipation fins 301. In this embodiment, the first heat dissipation plate 304 and the second heat dissipation plate 306 can both be metal plates or capillary metal plates, which have good thermal conductivity. The first heat dissipation fins 301 are metal fins, which have good thermal conductivity and heat dissipation performance.

[0133] This invention also provides an electronic device, including the aforementioned heat dissipation device 8 with heat recovery function. The bottom surface of the substrate 302 of the heat dissipation device 8 is in contact with the heat source 4 of the electronic device through a thermally conductive silicone grease layer. The height of the heat dissipation device 8 and the electronic device is 2U or more. The electronic device can be a server, computer, or other similar device. The heat source 4 can be a CPU or a GPU.

[0134] The electronic device provided by this invention is preferably a passive cooling fanless server using the heat dissipation device 8 with heat recovery function, such as a fanless edge server in some extreme environments and a fanless server for specific purposes. While taking into account chip heat dissipation, it can also realize heat recovery. For active cooling servers, such as air-cooled servers, the filling of thermoelectric conversion components in the heat dissipation device 8 with heat recovery function will increase the thermal resistance of the device, affect chip heat dissipation, and increase fan power consumption. However, the above adverse effects can be offset by reducing the thermal resistance of other components (such as thermal grease 7, heat pipes, heat sink fins, etc.) in the heat dissipation device 8 with heat recovery function, increasing the number of other heat dissipation components 3 (such as heat pipes, heat sink fins, etc.), and increasing the size of the heat dissipation device 8 with heat recovery function. Under the condition of offsetting, the relevant design scheme in this invention is applicable to active cooling servers, such as air-cooled and immersion liquid-cooled servers.

[0135] like Figure 14 - Figure 18 As shown, the electronic device provided by the present invention, which is a server, has the following connection methods between the thermoelectric conversion structure in the heat dissipation device 8 with heat recovery function and the external load 9:

[0136] like Figure 14 As shown, within a single server chassis, multiple thermoelectric conversion structures are connected in series to load 9. The thick dashed line in the figure represents the positive terminal, and the thin dashed line represents the negative terminal.

[0137] like Figure 15As shown, within a single server chassis, multiple thermoelectric conversion structures are connected in parallel and then connected to load 9.

[0138] like Figure 16 As shown, in multiple server chassis or a cabinet containing multiple server chassis, multiple thermoelectric conversion structures in each server chassis are connected in series and then connected to the load 9.

[0139] like Figure 17 As shown, in multiple server chassis or a cabinet containing multiple server chassis, multiple thermoelectric conversion structures in each server chassis are connected in parallel and then connected to load 9.

[0140] like Figure 18 As shown, in multiple server chassis or a cabinet containing multiple server chassis, the thermoelectric conversion structures in each server chassis are connected in series, and the multiple server chassis form a parallel structure, which is connected to the load 9.

[0141] Obviously, the above embodiments are merely illustrative examples for clear explanation and are not intended to limit the implementation. Those skilled in the art will recognize that other variations or modifications can be made based on the above description. It is neither necessary nor possible to exhaustively list all possible implementations here. However, obvious variations or modifications derived therefrom are still within the scope of protection of this invention.

Claims

1. A heat dissipation device (8) with heat recovery function, characterized in that, include: The heat-conducting box body (1) has a first heat-conducting box wall (101) and a second heat-conducting box wall (102) disposed opposite to each other. The thermoelectric conversion structure includes a first thermoelectric conversion component (201), which is disposed inside the heat-conducting box (1). The first thermoelectric conversion component (201) includes at least one first thermoelectric conversion plate (2011). Each first thermoelectric conversion plate (2011) has a first cold surface and a first hot surface disposed opposite to each other. The first hot surface is in contact with the inner surface of the first heat-conducting box wall (101), and the first cold surface is in indirect contact with the inner surface of the second heat-conducting box wall (102). The heat dissipation assembly (3) includes a first heat dissipation fin (301), a substrate (302), and a first heat pipe assembly (303). The substrate (302) is disposed between the heat source (4) of the electronic device and the first heat-conducting box wall (101), and the two oppositely disposed surfaces of the substrate (302) are in direct contact with the heat source (4) and the first heat-conducting box wall (101), respectively. The heat-conducting box body (1) is disposed between the first heat dissipation fin (301) and the substrate (302), and the substrate (302) is connected to the first heat dissipation fin (301) through the first heat pipe assembly (303). The thermoelectric conversion structure further includes a second thermoelectric conversion component (202), which is disposed inside the heat-conducting box (1). The second thermoelectric conversion component (202) includes at least one second thermoelectric conversion plate. Each second thermoelectric conversion plate has a second cold surface and a second hot surface that are disposed opposite to each other. The second hot surface is attached to the inner surface of the second heat-conducting box wall (102). The heat dissipation assembly (3) further includes a first heat dissipation plate (304) and a second heat pipe assembly (305). The first heat dissipation plate (304) is disposed between the first thermoelectric conversion assembly (201) and the second thermoelectric conversion assembly (202), and has a first heat dissipation surface and a second heat dissipation surface disposed opposite to each other. The first cold surface is attached to the first heat dissipation surface, and the second cold surface is attached to the second heat dissipation surface. The first heat dissipation plate (304) is connected to the first heat dissipation fins (301) through the second heat pipe assembly (305).

2. The heat dissipation device (8) with heat recovery function according to claim 1, characterized in that, The first thermoelectric conversion assembly (201) includes at least two first thermoelectric conversion plates (2011), which are laid on the inner surface of the first heat-conducting box wall (101) and are arranged in series.

3. The heat dissipation device (8) with heat recovery function according to claim 1 or 2, characterized in that, The second thermoelectric conversion assembly (202) includes at least two second thermoelectric conversion plates, which are laid on the second heat dissipation surface, and the at least two second thermoelectric conversion plates are arranged in series.

4. The heat dissipation device (8) with heat recovery function according to claim 1 or 2, characterized in that, The heat-conducting box (1) is formed by bending a metal heat-conducting plate or a capillary metal heat-conducting plate in sequence. It has openings on both sides, and the openings are flat rectangular openings. Two sets of second heat-conducting pipe groups (305) are respectively connected to the two sides of the first heat dissipation plate (304). The two sets of second heat-conducting pipe groups (305) extend from the heat-conducting box (1) through the two openings and are connected to the first heat dissipation fins (301). And / or, the second thermoelectric conversion component (202) and the first thermoelectric conversion component (201) are connected in series.

5. The heat dissipation device (8) with heat recovery function according to claim 1, characterized in that, The thermoelectric conversion structure further includes a third thermoelectric conversion component (203), which is disposed between the heat-conducting box (1) and the first heat dissipation fins (301). The third thermoelectric conversion component (203) includes at least one third thermoelectric conversion plate, each of which has a third cold surface and a third hot surface arranged opposite to each other. The third hot surface is attached to the outer surface of the second heat-conducting box wall (102). The heat dissipation assembly (3) further includes a second heat dissipation plate (306) and a third heat pipe assembly (307). The second heat dissipation plate (306) is disposed between the third thermoelectric conversion assembly (203) and the first heat dissipation fin (301), and has a third heat dissipation surface and a fourth heat dissipation surface disposed opposite to each other. The third heat dissipation surface is attached to the third cold surface, and the fourth heat dissipation surface is connected to the first heat dissipation fin (301) through the third heat pipe assembly (307), or the fourth heat dissipation surface is directly connected to the first heat dissipation fin (301).

6. The heat dissipation device (8) with heat recovery function according to claim 5, characterized in that, The first thermoelectric conversion component (201), the second thermoelectric conversion component (202), and the third thermoelectric conversion component (203) are arranged in series. And / or, the third thermoelectric conversion assembly (203) includes at least two third thermoelectric conversion plates, which are laid on the outer surface of the second heat-conducting box wall (102), and the at least two third thermoelectric conversion plates are arranged in series.

7. The heat dissipation device (8) with heat recovery function according to claim 5 or 6, characterized in that, The first heat dissipation fin (301) has multiple fins arranged parallel to the heat source (4), and the multiple first heat dissipation fins (301) are distributed sequentially at intervals along a direction perpendicular to the heat source (4); The thermoelectric conversion structure further includes at least two sets of fourth thermoelectric conversion components (204). The at least two sets of fourth thermoelectric conversion components (204) are sequentially connected to at least two first heat dissipation fins (301) near the heat conduction box (1). The fourth thermoelectric conversion component (204) includes at least one fourth thermoelectric conversion plate. Each fourth thermoelectric conversion plate has a fourth cold surface and a fourth hot surface that are arranged opposite to each other. The fourth hot surface is in contact with the first heat dissipation fins (301). The heat dissipation assembly (3) also includes a second heat dissipation fin (308) which is attached to the fourth cold surface.

8. The heat dissipation device (8) with heat recovery function according to claim 7, characterized in that, The fourth thermoelectric conversion sheet has two sets, each set having at least two fourth thermoelectric conversion sheets. One set of the fourth thermoelectric conversion sheets is laid on the surface of the first heat dissipation fin (301) facing the heat source (4), and the other set of the fourth thermoelectric conversion sheets is laid on the surface of the first heat dissipation fin (301) facing away from the heat source (4). The two sets of the fourth thermoelectric conversion sheets are arranged in series. And / or, the first thermoelectric conversion component (201), the second thermoelectric conversion component (202), the third thermoelectric conversion component (203) and the fourth thermoelectric conversion component (204) are arranged in series.

9. The heat dissipation device (8) with heat recovery function according to claim 7, characterized in that, A first thermally conductive silicone grease layer is coated on the outer surface of the first thermally conductive box wall (101); And / or, a second thermally conductive silicone grease layer is coated on the inner surface of the first thermally conductive box wall (101); And / or, a third thermally conductive silicone grease layer is coated on the outer surface of the second thermally conductive box wall (102); And / or, a fourth thermally conductive silicone grease layer is coated on the inner surface of the second thermally conductive box wall (102); And / or, the first heat dissipation surface is coated with a fifth thermally conductive silicone grease layer; And / or, the second heat dissipation surface is coated with a sixth thermally conductive silicone grease layer; And / or, the third heat dissipation surface is coated with a seventh thermally conductive silicone grease layer; And / or, an eighth thermally conductive silicone grease layer is coated between the fourth thermoelectric conversion sheet and the first heat dissipation fin (301); And / or, a ninth thermally conductive silicone grease layer is coated between the fourth thermoelectric conversion component (204) and the second heat dissipation fin (308).

10. An electronic device, characterized in that, The device includes a heat dissipation device (8) with heat recovery function as described in any one of claims 1-9, wherein the bottom surface of the substrate (302) of the heat dissipation device (8) with heat recovery function is in contact with the heat source (4) of the electronic device through a thermally conductive silicone grease layer.

11. The electronic device according to claim 10, characterized in that, The electronic device is a server, and multiple thermoelectric conversion structures are connected in series and then connected to the load (9) within a single server chassis; Alternatively, within a single server chassis, multiple thermoelectric conversion structures are connected in parallel and then connected to the load (9); Alternatively, in multiple server chassis or a cabinet containing multiple server chassis, multiple thermoelectric conversion structures in each server chassis are connected in series and then connected to the load (9); Alternatively, in multiple server chassis or a cabinet containing multiple server chassis, multiple thermoelectric conversion structures in each server chassis are connected in parallel and then connected to the load (9); Alternatively, in multiple server chassis or a cabinet containing multiple server chassis, multiple thermoelectric conversion structures in each server chassis are connected in series, and multiple server chassis form a parallel structure, which is connected to the load (9).

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