An optical module

Abstract

The optical module provided by the present disclosure is characterized in that a circuit board is provided with a notch; the optical transceiver component comprises: an optical transceiver shell, one side of which is formed with a first support plate, the other side of which is formed with a second support plate and a third support plate, the first support plate is located above the second support plate and a gap is arranged between the second support plate and the third support plate; the optical transceiver shell is located in the notch, and the gap is embedded in the circuit board connected to the edge of the notch; a first optical transmitting assembly is arranged on a first surface of the first support plate; a second optical transmitting assembly is arranged on a second surface of the first support plate; a first optical receiving assembly is arranged on the second support plate; a second optical receiving assembly is arranged on the third support plate; a first upper cover is connected to the optical transceiver shell and covers the first optical transmitting assembly and the first optical receiving assembly; and a second upper cover is connected to the optical transceiver shell and covers the second optical transmitting assembly and the second optical receiving assembly. The optical module provided by the present disclosure is used for realizing the transmission and reception of multiple-channel optical signals in the optical module.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to the field of optical fiber communication technology, and in particular to an optical module. BACKGROUND

[0002] With the development of new business and application modes such as cloud computing, mobile Internet, video, etc., the development and progress of optical communication technology becomes increasingly important. In optical communication technology, optical modules are tools for converting optical signals and electrical signals, and are one of the key devices in optical communication equipment. With the development of optical communication technology, the transmission rate of optical modules is continuously increasing. In some optical modules, high-transmission-rate optical modules have higher integration density than low-transmission-rate optical modules. For example, multi-channel optical transceiver technology is used to realize the emission and reception of multi-wavelength optical signals of optical modules. SUMMARY

[0003] Embodiments of the present disclosure provide an optical module for realizing the emission and reception of integrated multi-channel optical signals in the optical module.

[0004] The optical module provided by the present disclosure comprises:

[0005] A circuit board having a notch in the middle portion;

[0006] An optical transceiver component electrically connected to the circuit board; wherein the optical transceiver component comprises:

[0007] An optical transceiver housing having a first support plate on one side and a second support plate and a third support plate on the other side, the first support plate being located above the second support plate and a gap being provided between the second support plate and the third support plate; the optical transceiver housing is located in the notch, and the gap is embedded in the circuit board connected to the edge of the notch;

[0008] A first optical transmitting assembly arranged on a first surface of the first support plate;

[0009] A second optical transmitting assembly arranged on a second surface of the first support plate;

[0010] A first optical receiving assembly arranged on the second support plate;

[0011] A second optical receiving assembly arranged on the third support plate;

[0012] A first upper cover connected to the optical transceiver housing and covering the first optical transmitting assembly and the first optical receiving assembly;

[0013] A second upper cover connected to the optical transceiver housing and covering the second optical transmitting assembly and the second optical receiving assembly.

[0014] In the optical module provided by the present disclosure:

[0015] The light transceiver shell is formed with a first support plate on one side, a second support plate and a third support plate on the other side, the second support plate is above the third support plate and has a gap between the two; a first light emitting assembly is arranged on a first surface of the first support plate, a second light emitting assembly is arranged on a second surface of the first support plate, the second support plate supports a first light receiving assembly, and the third support plate supports a second light receiving assembly. The circuit board is provided with a notch, the light transceiver shell is arranged in the notch, and the gap between the second support plate and the third support plate is embedded with the circuit board connected to the edge of the notch. The first upper cover is connected to the light transceiver shell and covers the first light emitting assembly and the first light receiving assembly, and the second upper cover is connected to the light transceiver shell and covers the second light emitting assembly and the second light receiving assembly, realizing the packaging of the light emitting assembly and the light receiving assembly, and enabling the transmission and reception of multiple-channel optical signals in the optical module. BRIEF DESCRIPTION OF DRAWINGS

[0016] In order to more clearly illustrate the technical solutions in the present disclosure, the following will briefly introduce the drawings needed to be used in some embodiments of the present disclosure. Obviously, the drawings described below are only some of the drawings of the present disclosure, and other drawings can also be obtained by those skilled in the art according to these drawings. In addition, the drawings described below can be regarded as schematic diagrams, and are not limited to the actual size, actual process, actual timing of signals, etc. of the products involved in the embodiments of the present disclosure.

[0017] Figure 1 A partial architecture diagram of an optical communication system according to some embodiments of the present disclosure is provided.

[0018] Figure 2 A partial structure diagram of a host computer according to some embodiments of the present disclosure is provided.

[0019] Figure 3 A structure diagram of an optical module according to some embodiments of the present disclosure is provided.

[0020] Figure 4 An exploded schematic diagram of an optical module according to some embodiments of the present disclosure is provided.

[0021] Figure 5 An internal structure diagram of an optical module according to some embodiments of the present disclosure is provided.

[0022] Figure 6 A structure diagram of an optical transceiver component according to some embodiments of the present disclosure is provided.

[0023] Figure 7 An internal structure exploded view of an optical module according to some embodiments of the present disclosure is provided.

[0024] Figure 8An assembly view of an optical transceiver and a circuit board according to some embodiments of the present disclosure Figure 1 ;

[0025] Figure 9 An assembly view of an optical transceiver and a circuit board according to some embodiments of the present disclosure Figure 2 ;

[0026] Figure 10 An exploded view of an optical transceiver according to some embodiments of the present disclosure Figure 1 ;

[0027] Figure 11 An exploded view of an optical transceiver according to some embodiments of the present disclosure Figure 2 ;

[0028] Figure 12 A structural view of an optical transceiver housing according to some embodiments of the present disclosure Figure 1 ;

[0029] Figure 13 A structural view of an optical transceiver housing according to some embodiments of the present disclosure Figure 2 ;

[0030] Figure 14 A structural view of an optical transceiver housing according to some embodiments of the present disclosure Figure 3 ;

[0031] Figure 15 A structural view of a first upper cover according to some embodiments of the present disclosure Figure 1 ;

[0032] Figure 16 A structural view of a first upper cover according to some embodiments of the present disclosure Figure 2 ;

[0033] Figure 17 A structural view of a second upper cover according to some embodiments of the present disclosure

[0034] Figure 18 A structural view of another optical transceiver according to some embodiments of the present disclosure

[0035] Figure 19 A partial structural view of another circuit board according to some embodiments of the present disclosure

[0036] Figure 20 A partial assembly view of an optical transceiver and a circuit board according to some embodiments of the present disclosure

[0037] Figure 21Another partial structure schematic of a circuit board according to some embodiments of the present disclosure Figure 1 ;

[0038] Figure 22 An electrical connection state diagram of a first DSP chip according to some embodiments of the present disclosure

[0039] Figure 23 An electrical connection state diagram of a second DSP chip according to some embodiments of the present disclosure

[0040] Figure 24 A bending schematic of a circuit board according to some embodiments of the present disclosure

[0041] Figure 25 A partial structure schematic of a third circuit board according to some embodiments of the present disclosure

[0042] Figure 26 A partial structure schematic of a third circuit board according to some embodiments of the present disclosure Figure 2 ;

[0043] Figure 27 A partial structure schematic of a fourth circuit board according to some embodiments of the present disclosure

[0044] Figure 28 A partial structure schematic of a fourth circuit board according to some embodiments of the present disclosure Figure 27 ;

[0045] Figure 29 A structure schematic of a first elastic heat-conducting component according to some embodiments of the present disclosure Figure 1 ;

[0046] Figure 30 A structure schematic of a first elastic heat-conducting component according to some embodiments of the present disclosure Figure 2 ;

[0047] Figure 31 A use state diagram of a first elastic heat-conducting component according to some embodiments of the present disclosure DETAILED DESCRIPTION

[0048] The technical solutions in the embodiments of the present disclosure will be described clearly and detailedly below with reference to the drawings. Obviously, the described embodiments are only some of the embodiments of the present disclosure, but not all the embodiments. Based on the embodiments provided by the present disclosure, all other embodiments obtained by those skilled in the art belong to the scope of protection of the present disclosure.

[0049] In optical communication technology, in order to establish information transmission between information processing devices, information needs to be loaded onto light, and the transmission of information is achieved by using the propagation of light. Here, the light loaded with information is an optical signal. The optical signal can reduce the loss of optical power when transmitted in the information transmission device, so as to achieve high-speed, long-distance and low-cost information transmission. The signal that can be recognized and processed by the information processing device is an electrical signal. The information processing device usually includes an optical network unit (ONU), a gateway, a router, a switch, a mobile phone, a computer, a server, a tablet computer, a television, etc., and the information transmission device usually includes an optical fiber and an optical waveguide, etc.

[0050] The optical module can realize the mutual conversion between the optical signal and the electrical signal between the information processing device and the information transmission device. For example, at least one of the optical signal input end or the optical signal output end of the optical module is connected with an optical fiber, and at least one of the electrical signal input end or the electrical signal output end of the optical module is connected with an optical network unit; a first optical signal from the optical fiber is transmitted to the optical module, the optical module converts the first optical signal into a first electrical signal, and transmits the first electrical signal to the optical network unit; a second electrical signal from the optical network unit is transmitted to the optical module, the optical module converts the second electrical signal into a second optical signal, and transmits the second optical signal to the optical fiber. Since multiple information processing devices can transmit information through electrical signals, at least one of the multiple information processing devices needs to be directly connected with the optical module, without the need for all the information processing devices to be directly connected with the optical module. Here, the information processing device directly connected with the optical module is referred to as the host computer of the optical module. In addition, the optical signal input end or the optical signal output end of the optical module can be referred to as an optical port, and the electrical signal input end or the electrical signal output end of the optical module can be referred to as an electrical port.

[0051] Figure 1 A partial structure diagram of an optical communication system according to some embodiments of the present disclosure is provided. As shown in Figure 1 the optical communication system mainly includes a remote information processing device 1000, a local information processing device 2000, a host computer 100, an optical module 200, an optical fiber 101 and a network cable 103.

[0052] One end of the optical fiber 101 extends to the direction of the remote information processing device 1000, and the other end of the optical fiber 101 is connected with the optical module 200 through the optical port of the optical module 200. The optical signal can be totally reflected in the optical fiber 101, and the propagation of the optical signal in the total reflection direction can almost maintain the original optical power. The optical signal is totally reflected in the optical fiber 101 for multiple times, so as to transmit the optical signal from the remote information processing device 1000 to the optical module 200, or transmit the optical signal from the optical module 200 to the remote information processing device 1000, thereby realizing long-distance and low-power loss information transmission.

[0053] The optical communication system can include one or more optical fibers 101, and the optical fiber 101 is detachably connected with the optical module 200, or fixedly connected. The host computer 100 is configured to provide a data signal to the optical module 200, or receive a data signal from the optical module 200, or monitor or control the working state of the optical module 200.

[0054] The host computer 100 includes a housing in the shape of a cuboid, and an optical module interface 102 disposed on the housing. The optical module interface 102 is configured to access the optical module 200, so that the host computer 100 and the optical module 200 establish a unidirectional or bidirectional electrical signal connection.

[0055] The host computer 100 further includes an external electrical interface, which can access an electrical signal network. For example, the external electrical interface includes a Universal Serial Bus (USB) or a network cable interface 104, which is configured to access a network cable 103, so that the host computer 100 and the network cable 103 establish a unidirectional or bidirectional electrical signal connection. One end of the network cable 103 is connected to a local information processing device 2000, and the other end of the network cable 103 is connected to the host computer 100, so as to establish an electrical signal connection between the local information processing device 2000 and the host computer 100 through the network cable 103. For example, a third electrical signal from the local information processing device 2000 is transmitted to the host computer 100 through the network cable 103, and the host computer 100 generates a second electrical signal according to the third electrical signal. The second electrical signal from the host computer 100 is transmitted to the optical module 200, and the optical module 200 converts the second electrical signal into a second optical signal, and transmits the second optical signal to the optical fiber 101. The second optical signal is transmitted to a remote information processing device 1000 in the optical fiber 101. For example, a first optical signal from the remote information processing device 1000 is transmitted through the optical fiber 101, and the first optical signal from the optical fiber 101 is transmitted to the optical module 200. The optical module 200 converts the first optical signal into a first electrical signal, and transmits the first electrical signal to the host computer 100. The host computer 100 generates a fourth electrical signal according to the first electrical signal, and transmits the fourth electrical signal to the local information processing device 2000. It should be noted that the optical module is a tool for converting optical signals and electrical signals, and the information does not change in the conversion process of the optical signals and the electrical signals, and the encoding and decoding mode of the information can change.

[0056] The host computer 100 includes an optical network terminal, an optical line terminal (OLT), an optical network device (ONT), or a data center server, etc.

[0057] Figure 2 A partial structural diagram of a host computer according to some embodiments of the present disclosure is provided. In order to clearly show the connection relationship between the optical module 200 and the host computer 100, Figure 2 Only the structure of the host computer 100 related to the optical module 200 is shown. As Figure 2 shown, the host computer 100 further includes a PCB circuit board 105 arranged in the shell, a cage 106 arranged on the surface of the PCB circuit board 105, a heat sink 107 arranged on the cage 106, and an electrical connector arranged inside the cage 106. The electrical connector is configured to access the electrical port of the optical module 200; the heat sink 107 has a protruding structure such as fins to increase the heat dissipation area.

[0058] The optical module 200 is inserted into the cage 106 of the host computer 100, and the optical module 200 is fixed by the cage 106. The heat generated by the optical module 200 is conducted to the cage 106, and then diffused through the heat sink 107. After the optical module 200 is inserted into the cage 106, the electrical port of the optical module 200 is connected with the electrical connector inside the cage 106, so that the optical module 200 and the host computer 100 establish a bidirectional electrical signal connection. In addition, the optical port of the optical module 200 is connected with the optical fiber 101, so that the optical module 200 and the optical fiber 101 establish a bidirectional optical signal connection.

[0059] Figure 3 A structural diagram of an optical module according to some embodiments of the present disclosure is provided, Figure 4 An exploded schematic diagram of an optical module according to some embodiments of the present disclosure is provided. As Figure 3 and Figure 4 shown, the optical module 200 includes a shell, a circuit board 300 arranged in the shell, and an optical transceiver component 400.

[0060] The shell includes an upper shell 201 and a lower shell 202, and the upper shell 201 covers the lower shell 202 to form the above-mentioned shell with two openings 203 and 204; the outer contour of the shell generally presents a square body.

[0061] In some embodiments, the lower shell 202 includes a bottom plate 2021 and two lower side plates 2022 arranged perpendicularly to the bottom plate 2021 on both sides of the bottom plate 2021; the upper shell 201 includes a cover plate 2011, and the cover plate 2011 covers the two lower side plates 2022 of the lower shell 202 to form the above-mentioned shell.

[0062] In some embodiments, the lower shell 202 comprises a bottom plate 2021 and two lower side plates 2022 arranged perpendicularly to the bottom plate 2021 on both sides of the bottom plate 2021; the upper shell 201 comprises a cover plate 2011 and two upper side plates arranged perpendicularly to the cover plate 2011 on both sides of the cover plate 2011, and the two upper side plates and the two lower side plates 2022 are combined to realize the covering of the upper shell 201 on the lower shell 202.

[0063] The direction of the line connecting the two openings 203 and 204 can be consistent with the length direction of the optical module 200, or can be inconsistent with the length direction of the optical module 200. For example, the opening 203 is located at the end of the optical module 200 (the right end of the optical module 200), and the opening 204 is also located at the end of the optical module 200 (the left end of the optical module 200). Alternatively, the opening 203 is located at the end of the optical module 200, and the opening 204 is located at the side of the optical module 200. The opening 203 is an electrical port, and the gold fingers of the circuit board 300 extend from the electrical port and are inserted into the electrical connector of the host computer 100; the opening 204 is an optical port configured to access the external optical fiber 101, so that the optical fiber 101 is connected to the optical transceiver component 400 in the optical module 200. Figure 3 Figure 3

[0064] The combination of the upper shell 201 and the lower shell 202 facilitates the installation of the circuit board 300, the optical transceiver component 400 and the like into the above-mentioned shells, and the above-mentioned devices can be packaged and protected by the upper shell 201 and the lower shell 202. In addition, when the circuit board 300, the optical transceiver component 400 and the like are assembled, the positioning components, the heat dissipation components and the electromagnetic shielding components of these devices can be deployed, which is conducive to the automatic implementation of production.

[0065] In some embodiments, the upper shell 201 and the lower shell 202 are made of metal material, which is conducive to electromagnetic shielding and heat dissipation.

[0066] In some embodiments, the optical module 200 further comprises an unlocking component 600 located outside the shell of the optical module 200. The unlocking component 600 is configured to realize the fixed connection between the optical module 200 and the host computer, or to release the fixed connection between the optical module 200 and the host computer.

[0067] For example, the unlocking component 600 is located outside the two lower side plates 2022 of the lower shell 202, and comprises a clamping component matched with the cage 106 of the host computer 100. When the optical module 200 is inserted into the cage 106, the clamping component of the unlocking component 600 fixes the optical module 200 in the cage 106; when the unlocking component 600 is pulled, the clamping component of the unlocking component 600 moves, thereby changing the connection relationship between the clamping component and the host computer, to release the fixation between the optical module 200 and the host computer, so that the optical module 200 can be pulled out of the cage 106. ​​

[0068] Circuit board 300 includes circuit traces, electronic components, and chips. The circuit traces connect the electronic components and chips according to the circuit design to achieve functions such as power supply, electrical signal transmission, and grounding. Electronic components may include, for example, capacitors, resistors, transistors, and metal-oxide-semiconductor field-effect transistors (MOSFETs). Chips may include, for example, microcontroller units (MCUs), laser driver chips, transimpedance amplifiers (TIAs), limiting amplifiers, clock and data recovery (CDR) chips, power management chips, and digital signal processing (DSP) chips.

[0069] Circuit board 300 is generally a rigid circuit board. Due to its relatively hard material, the rigid circuit board can also perform a load-bearing function. For example, the rigid circuit board can stably support the aforementioned electronic components and chips. The rigid circuit board can also be inserted into the electrical connector in the cage 106 of the host computer 100.

[0070] The circuit board 300 also includes gold fingers formed on its end surfaces, each gold finger consisting of a plurality of independent pins. The circuit board 300 is inserted into a cage 106 and is electrically connected to an electrical connector within the cage 106 by the gold fingers. The gold fingers may be located only on one side of the surface of the circuit board 300 (e.g., ...). Figure 4 The upper surface shown can also be positioned on the upper and lower surfaces of the circuit board 300 to provide a greater number of pins, thus adapting to applications with high pin count requirements. The gold fingers are configured to establish an electrical connection with the host computer to achieve power supply, grounding, two-wire synchronous serial (Inter-Integrated Circuit, I2C) signal transmission, and data signal transmission. Of course, flexible circuit boards are also used in some optical modules. Flexible circuit boards are generally used in conjunction with rigid circuit boards as a supplement to rigid circuit boards.

[0071] In some embodiments, the optical transceiver 400 is physically separated from the circuit board 300, and then electrically connected to the circuit board 300 through a corresponding flexible circuit board or electrical connector.

[0072] In some embodiments, the optical transceiver component 400 includes optical transmitting assemblies for generating optical transmitting signals and optical receiving assemblies for receiving optical receiving signals. In some embodiments, in order to increase the transmission rate of the optical module, the optical transmitting assemblies and the optical receiving assemblies each include multiple transmission channels so that the optical transmitting assemblies generate optical transmitting signals of multiple wavelengths and the optical receiving assemblies receive optical receiving signals of multiple wavelengths. For example, the optical transmitting assemblies generate optical transmitting signals of four wavelengths and the optical receiving assemblies receive optical receiving signals of four wavelengths. When the number of transmission channels of the optical transmitting assemblies and the optical receiving assemblies increases, the volume of the optical transceiver component 400 will also be relatively large, and the space occupied in the optical module 200 will also increase. Therefore, when the number of transmission channels of the optical transmitting assemblies and the optical receiving assemblies reaches a certain number, it is difficult to further increase the number of transmission channels of the optical transmitting assemblies and the optical receiving assemblies.

[0073] In some embodiments, the optical transceiver component 400 includes two groups of optical transmitting assemblies and two groups of optical receiving assemblies, each group of optical transmitting assemblies generates optical transmitting signals of multiple wavelengths, and each group of optical receiving assemblies receives optical receiving signals of multiple wavelengths, so as to further increase the number of transmission channels of the optical transmitting assemblies and the optical receiving assemblies. Of course, in some embodiments, the optical transceiver component 400 is not limited to including two groups of optical transmitting assemblies and two groups of optical receiving assemblies. In some embodiments, each group of optical transmitting assemblies generates optical transmitting signals of four wavelengths, and each group of optical receiving assemblies receives optical receiving signals of four wavelengths. Of course, in some embodiments, each group of optical transmitting assemblies is not limited to generating optical transmitting signals of four wavelengths, such as generating optical transmitting signals of one or two wavelengths; and each group of optical receiving assemblies is not limited to receiving optical receiving signals of four wavelengths, such as receiving optical receiving signals of one or two wavelengths.

[0074] In some embodiments, the optical module 200 is provided with a fiber adapter 800 at the optical port, one end of the fiber adapter 800 is used to connect the optical fiber 101, and the other end of the fiber adapter 800 is connected to the optical transceiver component 400 through the optical fiber inside the optical module, so as to realize the transmission of the optical transmitting signals generated by the optical transceiver component 400 to the optical fiber 101 and the transmission of the optical receiving signals input through the optical fiber 101 to the optical transceiver component 400. In some embodiments, the optical module 200 is provided with multiple fiber adapters 800, such as two fiber adapters 800.

[0075] Figure 5 FIG. 1 is a schematic diagram of an optical module according to some embodiments of the present disclosure, Figure 6 FIG. 2 is a schematic diagram of an optical transceiver component according to some embodiments of the present disclosure. As shown in Figure 5 and Figure 6As shown, the optical module 200 is internally provided with the optical fiber 810, and the other end of the fiber adapter 800 is connected to the optical fiber 810, so that the fiber adapter 800 is connected to the optical transceiver component 400 through the optical fiber 810.

[0076] In some embodiments, the fiber adapter 800 includes four fiber adapters, and the optical fiber 810 includes four optical fibers; one end of the four optical fibers is connected to the four fiber adapters one by one, and the other end of the four optical fibers is connected to the optical transceiver component 400, respectively. For example, two of the four fiber adapters are used to transmit the emitted optical signal, and the other two fiber adapters are used to transmit the received optical signal; two of the four optical fibers are used to transmit the emitted optical signal, and the other two optical fibers are used to transmit the received optical signal; the fiber adapter for transmitting the emitted optical signal is connected to the optical fiber for transmitting the emitted optical signal one by one, and the fiber adapter for transmitting the received optical signal is connected to the optical fiber for transmitting the received optical signal one by one.

[0077] In some embodiments, the other end of the optical fiber 810 is provided with an optical fiber connector 820, one end of the optical fiber connector 820 is connected to the optical fiber 810, and the other end of the optical fiber connector 820 is connected to the optical transceiver component 400, so as to facilitate the connection between the optical fiber 810 and the optical transceiver component 400 through the optical fiber connector 820, and the transmission of the optical signal between the optical transceiver component 400 and the optical fiber 810 with high coupling efficiency.

[0078] Figure 7 An internal structure exploded view of an optical module according to some embodiments of the present disclosure is provided. As shown Figure 7 As shown, a notch 310 is formed on the circuit board 300, and the notch 310 causes the interruption of one side of the circuit board 300; the optical transceiver component 400 is arranged in the notch 310. In some embodiments, the optical transceiver component 400 is clamped in the notch 310, so that the top surface of the optical transceiver component 400 is not flush with the top surface of the circuit board 300, and the bottom surface of the optical transceiver component 400 is not flush with the bottom surface of the circuit board 300.

[0079] The optical transceiver component 400 includes an optical transceiver housing 500, and a plurality of support plates are formed on the optical transceiver housing 500, which are used to support the optical emitting assembly and the optical receiving assembly, so as to facilitate the packaging and assembly of the optical transceiver component 400. For example, the first support plate, the second support plate and the third support plate are formed on the optical transceiver housing 500, the first support plate is located on one side of the optical transceiver housing 500, and the second support plate and the third support plate are located on the other side of the optical transceiver housing 500; the first support plate is used to support the optical emitting assembly, and the second support plate and the third support plate are used to support the optical receiving assembly, respectively.

[0080] In some embodiments, the optical transceiver housing 500 is provided with an opening or gap, through which the optical transceiver housing 500 is fitted with the connecting circuit board 300, so as to facilitate the fitting of the connecting circuit board 300 into the optical transceiver housing 500. In some embodiments, the edge of the notch 310 extends into the optical transceiver housing 500 through the opening or gap, so as to facilitate the electrical connection of the optical emitting component and the optical receiving component to the circuit board 300.

[0081] Figure 8 This is a schematic diagram of the assembly of an optical transceiver component and a circuit board according to some embodiments of this disclosure. Figure 1 , Figure 9 This is a schematic diagram of the assembly of an optical transceiver component and a circuit board according to some embodiments of this disclosure. Figure 2 In some embodiments, a first support plate 510, a second support plate 520, and a third support plate 530 are formed on the optical transceiver housing 500. The second support plate 520 and the third support plate 530 are located on one side of the first support plate 510, and the second support plate 520 and the third support plate 530 are stacked vertically with a gap between them.

[0082] The first support plate 510 includes a first surface 511 and a second surface 512, which are two opposing main bearing surfaces on the first support plate 510. A first light emitting component 410a is disposed on the first surface 511, and a second light emitting component 410b is disposed on the second surface 512. In some embodiments, the first light emitting component 410a is used to emit a first emitted light signal, which includes light signals of multiple wavelengths; the second light emitting component 410b is used to emit a second emitted light signal, which also includes light signals of multiple wavelengths. For example, the first emitted light signal includes light signals of four wavelengths, and the second emitted light signal includes light signals of four wavelengths. Of course, in this embodiment of the present disclosure, the first emitted light signal is not limited to light signals of four wavelengths, and the second emitted light signal is not limited to light signals of four wavelengths. In some embodiments, the first light emitting component 410a may also emit multiple emitted light signals, and the second light emitting component 410b may also emit multiple emitted light signals.

[0083] The second support plate 520 supports the first light receiving assembly 420a, and the third support plate 530 supports the second light receiving assembly 420b. In some embodiments, the first light receiving assembly 420a is configured to receive a first received light signal, and the first received light signal includes a plurality of wavelengths of light signals. The second light receiving assembly 420b is configured to receive a second received light signal, and the second received light signal includes a plurality of wavelengths of light signals. For example, the first received light signal includes four wavelengths of light signals, and the second received light signal includes four wavelengths of light signals. However, the first received light signal is not limited to including four wavelengths of light signals, and the second received light signal is not limited to including four wavelengths of light signals in the embodiments of the present disclosure. In some embodiments, the first light receiving assembly 420a can also receive a plurality of received light signals, and the second light receiving assembly 420b can also receive a plurality of received light signals.

[0084] In some embodiments, the first support plate 510 is located in the notch 310, the second support plate 520 is suspended above the first surface of the circuit board 300, and the third support plate 530 is suspended above the second surface of the circuit board 300. The second support plate 520 and the third support plate 530 are suspended above the surfaces of the circuit board 300, so that the arrangement of the second support plate 520 and the third support plate 530 does not affect the wiring on the circuit board 300.

[0085] In some embodiments, the first light emitting assembly 410a includes a light emitting assembly 411a, a lens assembly 412a, a wavelength division multiplexing assembly 413a, a focusing lens 414a, and a Thermo Electric Cooler (TEC) 415a. The TEC 415a is disposed on the first surface 511, and the light emitting assembly 411a and the lens assembly 412a are disposed on the top of the TEC 415a. The light emitting assembly 411a includes a plurality of light emitting chips for generating different wavelengths of emitted light signals. The lens assembly 412a includes a plurality of collimating lenses, which are disposed on the output light paths of the light emitting chips, and the collimating lenses are configured to collimate the light signals emitted by the light emitting chips. The wavelength division multiplexing assembly 413a is disposed on the output light path of the lens assembly 412a, and is configured to combine a plurality of wavelengths of emitted light signals. The focusing lens 414a is disposed on the output light path of the wavelength division multiplexing assembly 413a, and is configured to converge the light signals.

[0086] In some embodiments, the second light emitting assembly 410b includes a light emitting assembly 411b, a lens assembly 412b, a wavelength division multiplexing assembly 413b, a focusing lens 414b, and a TEC 415b. The TEC 415b is disposed on the second surface 512, and the light emitting assembly 411b and the lens assembly 412b are disposed on top of the TEC 415b. The specific arrangement of the light emitting assembly 411b, the lens assembly 412b, the wavelength division multiplexing assembly 413b, and the focusing lens 414b in the second light emitting assembly 410b can refer to the specific arrangement of the light emitting assembly 411a, the lens assembly 412a, the wavelength division multiplexing assembly 413a, and the focusing lens 414a in the first light emitting assembly 410a. In some embodiments, the lens assembly 412b, the wavelength division multiplexing assembly 413b, the focusing lens 414b, and the TEC 415b in the second light emitting assembly 410b are symmetrically disposed with the light emitting assembly 411a, the lens assembly 412a, the wavelength division multiplexing assembly 413a, the focusing lens 414a, and the TEC 415a in the first light emitting assembly 410a with respect to the first support plate 510.

[0087] In some embodiments, the optical fiber connector 820 includes a first optical fiber connector 821 and a second optical fiber connector 822, and the optical fiber 810 includes a first optical fiber 811 and a second optical fiber 812. One end of the first optical fiber connector 821 is connected to the first optical fiber 811, and the other end of the first optical fiber connector 821 is connected to the optical transceiver housing 500. The first optical fiber connector 821 is used to fix the other end of the first optical fiber 811, and the first optical fiber connector 821 optically connects the other end of the first optical fiber 811 to the first light emitting assembly 410a, thereby facilitating the coupling of the optical signal output by the first light emitting assembly 410a into the first optical fiber 811. One end of the second optical fiber connector 822 is connected to the second optical fiber 812, and the other end of the second optical fiber connector 822 is connected to the optical transceiver housing 500. The second optical fiber connector 822 is used to fix the other end of the second optical fiber 812, and the second optical fiber connector 822 optically connects the other end of the second optical fiber 812 to the second light emitting assembly 410b, thereby facilitating the coupling of the optical signal output by the second light emitting assembly 410b into the second optical fiber 812.

[0088] In some embodiments, the side of the optical transceiver housing 500 is provided with a first through hole and a second through hole, the other end of the first optical fiber connector 821 is embedded in the first through hole, and the other end of the second optical fiber connector 822 is embedded in the second through hole.

[0089] In some embodiments, the first optical fiber connector 821 and the second optical fiber connector 822 are located in the gap 310 to avoid interference between the first optical fiber connector 821, the second optical fiber connector 822 and the circuit board 300, facilitating assembly of the optical module 200. In some embodiments, the first optical fiber connector 821 is arranged above the second optical fiber connector 822, and a gap is arranged between the first optical fiber connector 821 and the second optical fiber connector 822, so that the optical fiber connected by the first optical fiber connector 821 is located above the circuit board 300, and the optical fibers connected by the second optical fiber connector 822 are located below the circuit board 300, effectively avoiding bending of the optical fibers to avoid the circuit board 300. For example, the first optical fiber connector 821 and the second optical fiber connector 822 are symmetrically arranged in the gap 310.

[0090] In some embodiments, the first light receiving assembly 420a includes a first arrayed waveguide grating 421a, a first photodetector assembly 422a and a first transimpedance amplifier 423a. For example, the second support plate 520 supports the first arrayed waveguide grating 421a, the first photodetector assembly 422a and the first transimpedance amplifier 423a are arranged on the circuit board 300, the first photodetector assembly 422a is arranged below the light outlet of the first arrayed waveguide grating 421a, the first transimpedance amplifier 423a is located on the side of the first photodetector assembly 422a away from the first arrayed waveguide grating 421a, and the first photodetector assembly 422a is wire-connected to the first transimpedance amplifier 423a.

[0091] In some embodiments, the first photodetector assembly 422a includes a plurality of light receiving chips, such as a plurality of photodetectors; the first arrayed waveguide grating 421a divides the first received optical signal into a plurality of optical signals according to the wavelengths of the optical signals in the first received optical signal, each optical signal being of a wavelength, and each light receiving chip is used to receive a received optical signal of a wavelength.

[0092] In some embodiments, the second light receiving assembly 420b includes a second arrayed waveguide grating 421b, a second photodetector assembly 422b and a second transimpedance amplifier 423b. For example, the third support plate 530 supports the second arrayed waveguide grating 421b, the second photodetector assembly 422b and the second transimpedance amplifier 423b are arranged on the circuit board 300, the second photodetector assembly 422b is arranged below the light outlet of the second arrayed waveguide grating 421b, the second transimpedance amplifier 423b is located on the side of the second photodetector assembly 422b away from the second arrayed waveguide grating 421b, and the second photodetector assembly 422b is wire-connected to the second transimpedance amplifier 423b.

[0093] In some embodiments, the second photodetector component 422b includes a plurality of light receiving chips, such as a plurality of photodetectors; the second array waveguide grating 421b divides the second received light signal into multiple light signals according to the wavelength of the light signal in the second received light signal, each light signal being a wavelength, and each light receiving chip being used to receive a received light signal of one wavelength.

[0094] Figure 10 An exploded view of an optical transceiver component provided according to some embodiments of this disclosure. Figure 1 , Figure 11 An exploded view of an optical transceiver component provided according to some embodiments of this disclosure. Figure 2 In some embodiments, such as Figure 10 and Figure 11 As shown, the optical transceiver component 400 further includes a first upper cover 430 and a second upper cover 440. The first upper cover 430 covers and connects to a first surface of the optical transceiver housing 500, and the second upper cover 440 covers and connects to a second surface of the optical transceiver housing 500, so that the first upper cover 430, the optical transceiver housing 500, and the second upper cover 440 form accommodating cavities on the upper and lower sides. In some embodiments, the bottom of the first upper cover 430 and the second upper cover 440 is connected to the optical transceiver housing 500 and the circuit board 300.

[0095] Figure 12 This is a schematic diagram of the structure of an optical transceiver housing according to some embodiments of the present disclosure. Figure 1 , Figure 13 This is a schematic diagram of the structure of an optical transceiver housing according to some embodiments of the present disclosure. Figure 2 .like Figure 12 and Figure 13 As shown, the optical transceiver housing 500 also includes a first side plate 540, a second side plate 550 and a third side plate 560, which are connected in sequence and surround the three sides of the first support plate 510. For example, the second side plate 550 is close to the optical port end of the optical module 200. One end of the second side plate 550 is connected to one end of the first side plate 540, and the other end of the second side plate is connected to one end of the third side plate 560. Thus, the first side plate 540, the second side plate 550, and the third side plate 560 surround each other to form an optical emission cavity. The first support plate 510 is located inside the optical emission cavity. The first support plate 510 divides the optical emission cavity into upper and lower cavities. The first side plate 540 and the third side plate 560 extend along the length direction of the optical module 200, so that the first side plate 540 and the third side plate 560 are arranged opposite each other along the length direction of the optical module 200.

[0096] like Figure 12As shown, in some embodiments, the first side plate 540 is located at the right side of the optical transceiver housing 500, and the third side plate 560 is located at the left side of the optical transceiver housing 500, so that the first side plate 540 is located in the gap 310 and close to the outer edge of the gap 310, to be closer to the lower side plate 2022.

[0097] In some embodiments, the second support plate 520 and the third support plate 530 are located outside the optical transmitting cavity, and one side of the second support plate 520 and one side of the third support plate 530 are connected to the side of the third side plate 560 away from the first side plate 540, i.e. one side of the second support plate 520 and the third support plate 530 are connected to the left side of the third side plate 560. The second support plate 520 is located above the third support plate 530, and a gap 570 is provided between the second support plate 520 and the third support plate 530, and the gap 570 extends to the third side plate 560. When the optical transceiver component 400 is assembled with the circuit board 300, the edge of the gap 310 of the circuit board 300 extends into the gap 570, and the gap 570 is used to fit the connection of the circuit board 300, so as to facilitate the assembly of the optical transceiver component 400 and the circuit board 300 through the gap 570. For example, the gap 570 is in interference fit with the circuit board 300, so as to relatively fix the optical transceiver housing 500 and the circuit board 300.

[0098] In some embodiments, the first face 511 and the second face 512 of the first support plate 510 are stepped faces, and the stepped first face 511 and the second face 512 facilitate the coordination of the relative heights of the light emitting assembly 411, the lens assembly 412, the wavelength division multiplexing assembly 413, etc.

[0099] In some embodiments, the outer side of the second side plate 550 is provided with a first opening 551, and the first opening 551 is clamped to connect the circuit board 300, so as to assemble and connect the second side plate 550 and the circuit board 300 through the first opening 551, to facilitate the assembly of the optical transceiver housing 500 and the circuit board 300. For example, the first opening 551 is located at the same height as the gap 570.

[0100] In some embodiments, the side of the first side plate 540 away from the second side plate 550 is provided with a second opening 541, and the second opening 541 is clamped to connect the circuit board 300, so as to assemble and connect the first side plate 540 through the second opening 541, to facilitate the assembly of the optical transceiver housing 500 and the circuit board 300. For example, the second opening 541 is located at the same height as the gap 570, and the second opening 541 is in interference fit with the circuit board 300. Of course, in some embodiments, the connection between the second opening 541 and the circuit board 300 is filled with glue, and the second opening 541 and the circuit board 300 are sealed by the glue.

[0101] In some embodiments, the third side plate 560 is provided with a third opening 561 away from one side of the second side plate 550, the third opening 561 is clamped with the circuit board 300, so as to assemble the third side plate 560 through the third opening 561, and facilitate the optical transceiver shell 500 to assemble the circuit board 300. For example, the third opening 561 is located at the same height as the gap 570, and the third opening 561 is in interference fit with the circuit board 300. Of course, in some embodiments, the third opening 561 is filled with glue at the connection with the circuit board 300, and the third opening 561 is sealed and connected with the circuit board 300 through the glue.

[0102] In some embodiments, the other end of the first side plate 540 and the third side plate 560 extends beyond the other end of the first support plate 510, and the second opening 541 and the third opening 561 extend to the edge of the other end of the first support plate 510. When the first side plate 540 and the third side plate 560 are assembled with the circuit board 300, the circuit board 300 at the edge of the notch 310 extends to the edge of the other end of the first support plate 510, facilitating the electrical connection between the devices on the first support plate 510 and the circuit board 300.

[0103] In some embodiments, the second support plate 520 is provided with a first limiting block 521 and a second limiting block 522, the first limiting block 521 and the second limiting block 522 are arranged on the top surface of the end of the second support plate 520, and a first positioning interval 523 is formed between the first limiting block 521 and the second limiting block 522, and the light entrance end of the first arrayed waveguide grating 421a is arranged in the first positioning interval 523.

[0104] In some embodiments, the third support plate 530 is provided with a third limiting block 531 and a fourth limiting block 532, the third limiting block 531 and the fourth limiting block 532 are arranged on the top surface of the end of the third support plate 530, and a second positioning interval 533 is formed between the third limiting block 531 and the fourth limiting block 532, and the light entrance end of the second arrayed waveguide grating 421b is arranged in the second positioning interval 533.

[0105] In some embodiments, the length of the second support plate 520 and the length of the third support plate 530 are shorter than the length of the third side plate 560, so that the optical transceiver housing 500 forms an angular gap on the outer side of the third side plate 560, which helps to control the volume of the optical transceiver housing 500. For example, one end of the second support plate 520 and one end of the third support plate 530 respectively extend to the middle of the third side plate 560, and the other end of the second support plate 520 and the other end of the third support plate 530 respectively extend to the middle of the third side plate 560. In this way, it is convenient to control the volume occupied by the first light receiving assembly 420a and the second light receiving assembly 420b in the optical module 200, save the occupation of the circuit board 300 by the first light receiving assembly 420a and the second light receiving assembly 420b, and also facilitate the coordination of the length of the high-frequency signal lines connected to the first light receiving assembly 420a and the second light receiving assembly 420b.

[0106] Figure 14 Structure diagram of an optical transceiver housing according to some embodiments of the present disclosure Figure 3 As shown in Figure 14 , the outer side of the second side plate 550 is connected to the first optical fiber connector 821 and the second optical fiber connector 822. In some embodiments, the connection between the first optical fiber connector 821 and the second side plate 550 is located above the first opening 551, and the connection between the second optical fiber connector 822 and the second side plate 550 is located below the first opening 551. For example, the first optical fiber connector 821 and the second optical fiber connector 822 are symmetrically arranged on the upper and lower sides of the first opening 551.

[0107] Figure 15 Structure diagram of a first upper cover according to some embodiments of the present disclosure Figure 1 , Figure 16 Structure diagram of a first upper cover according to some embodiments of the present disclosure Figure 2 . As shown in Figure 15 and Figure 16 ​As shown, the first upper cover 430 includes a first upper cover body 431, a first baffle 432 and a second baffle 433, the top of the first baffle 432 and the top of the second baffle 433 are connected to the edges of the bottom surface of the first upper cover body 431 respectively, and the first baffle 432 and the second baffle 433 are connected, the bottom of the first baffle 432 and the bottom of the second baffle 433 are used to connect the circuit board 300. The edges of the bottom surface of the first upper cover body 431 which are not connected to the first baffle 432 and the second baffle 433 are used to connect the optical transceiver shell 500. As an example, the side of the first side plate 540, the side of the second side plate 550 and the side of the third side plate 560 which are on the same side of the first surface 511 are connected to the bottom surface of the first upper cover body 431 respectively, the top of the first limiting block 521 and the top of the second limiting block 522 are connected to the bottom surface of the first upper cover body 431; the inner side of the first baffle 432 is connected to the end surface of the first side plate 540 and the end surface of the third side plate 560, and the inner side of the second baffle 433 is connected to the side of the second limiting block 522. In some embodiments, the first baffle 432 and the second baffle 433 are connected at right angles.

[0108] In some embodiments, the bottom surface of the first upper cover body 431 is welded to connect the optical transceiver shell 500, and the bottom of the first baffle 432 and the bottom of the second baffle 433 are connected to the circuit board 300 by glue.

[0109] Figure 17 A structural schematic diagram of a second upper cover according to some embodiments of the present disclosure is provided. In some embodiments, as shown, Figure 17 the second upper cover 440 includes a second upper cover body 441, a third baffle 442 and a fourth baffle 443, the top of the third baffle 442 and the top of the fourth baffle 443 are connected to the edges of the bottom surface of the second upper cover body 441 respectively, and the third baffle 442 and the fourth baffle 443 are connected. The shape of the second upper cover body 441 is symmetrical to the shape of the first upper cover body 431 about the first support plate 510, the third baffle 442 is symmetrical to the first baffle 432 about the first support plate 510, and the fourth baffle 443 is symmetrical to the second baffle 433 about the first support plate 510. In some embodiments, the assembly of the second upper cover 440 and the optical transceiver shell 500 is referred to the assembly of the first upper cover 430 and the optical transceiver shell 500.

[0110] Figure 18 A structural schematic diagram of another optical transceiver component according to some embodiments of the present disclosure is provided. As shown, Figure 18As shown, when the first upper cover 430 and the second upper cover 440 are assembled to the optical transceiver housing 500, the bottom of the first baffle 432 and the bottom of the third baffle 442 form a first interval 571, the first interval 571 communicates with the gap 570, the bottom of the second baffle 433 and the bottom of the fourth baffle 443 form a second interval 572, the second interval 572 communicates with the first interval 571. The gap 570, the first interval 571 and the second interval 572 are respectively used for embedding the connection circuit board 300.

[0111] Figure 19 FIG. 6 is a schematic view of a partial structure of a circuit board according to some embodiments of the present disclosure, Figure 20 FIG. 7 is a schematic view of an assembly of an optical transceiver component and a circuit board according to some embodiments of the present disclosure. As shown in FIG. 7, Figure 19 and Figure 20 As shown, the notch 310 includes a first side 311, a second side 312, a third side 313, a fourth side 314 and a fifth side 315 connected in sequence, the first side 311, the third side 313 and the fifth side 315 are parallel to the end sides of the circuit board 300, and the second side 312 and the fourth side 314 are parallel to the lengthwise sides of the circuit board 300. The first side 311 and the second side 312 surround the side edges of the optical fiber connector 820, and the third side 313, the fourth side 314 and the fifth side 315 surround the side edges of the optical transceiver housing 500.

[0112] In some embodiments, the first opening 551 is used for embedding the connection circuit board 300, the gap 570 is used for embedding the connection circuit board 300, the second opening 541 is used for embedding the connection circuit board 300, and the third opening 561 is used for embedding the connection circuit board 300, so that the third side 313 is located in the first opening 551, the fourth side 314 is embedded in the gap 570 and the first interval 571, and the fifth side 315 is embedded in the second interval 572, and then the edges of the fourth side 314 and the fifth side 315 of the circuit board are located in the space formed by the optical transceiver housing 500, the first upper cover 430 and the second upper cover 440.

[0113] In some embodiments, the top surface of the first upper cover 430 contacts the upper housing 201, the heat generated by the optical transceiver component 400 is transmitted to the first upper cover 430, the first upper cover 430 transmits the heat to the cover plate 2011 of the upper housing 201, and then the heat is dissipated through the cover plate 2011 for the optical transceiver component 400.

[0114] In some embodiments, the top surface of the second upper cover 440 contacts the lower housing 202, the heat generated by the optical transceiver component 400 is transmitted to the second upper cover 440, the second upper cover 440 transmits the heat to the bottom plate 2021 of the lower housing 202, and then the heat is dissipated through the bottom plate 2021 for the optical transceiver component 400.

[0115] In some embodiments, the outer side wall of the first side plate 540 contacts the lower housing 202. Heat generated by the optical transceiver 400 is transferred to the first side plate 540, which then transfers the heat to the lower side plate 2022 of the lower housing 202, thereby dissipating heat from the optical transceiver 400. For example, the outer side wall of the first side plate 540 is flush with or extends beyond the side edge of the circuit board 300, and the outer side wall of the first side plate 540 contacts the lower side plate 2022 via a thermal pad.

[0116] In some embodiments, the outer walls of the first baffle 432 and the third baffle 442 contact the lower housing 202. Heat generated by the optical transceiver 400 is transferred to the first baffle 432 and the third baffle 442, which in turn transfer the heat to the lower side plate 2022 of the lower housing 202, thereby dissipating heat from the optical transceiver 400. Exemplarily, the outer walls of the first baffle 432 and the third baffle 442 are flush with or extend beyond the side edge of the circuit board 300, and the outer walls of the first baffle 432 and the third baffle 442 contact the lower side plate 2022 via thermal pads.

[0117] Figure 21 This is a schematic diagram of a partial structure of another circuit board provided according to some embodiments of the present disclosure. Figure 1 .like Figure 21 As shown, a first DSP chip 320 is disposed on the first surface 301 of the circuit board 300, and a second DSP chip 330 is disposed on the second surface 302 of the circuit board 300. The first DSP chip 320 and the second DSP chip 330 are electrically connected to the circuit board 300, and high-frequency traces are disposed on the circuit board 300. The first DSP chip 320 and the second DSP chip 330 are electrically connected to the high-frequency traces, and the high-frequency traces electrically connect the light emitting component, the light receiving component, and the gold fingers. In some embodiments, the first DSP chip 320 and the second DSP chip 330 are symmetrically disposed on the two surfaces of the circuit board 300.

[0118] Figure 22 This is an electrical connection state diagram of a first DSP chip provided according to some embodiments of the present disclosure. In some embodiments, such as Figure 20As shown, the end of the first surface 301 is provided with the first gold finger 340, and the circuit board 300 is provided with a first high-frequency signal line group 303, a second high-frequency signal line group 304, and a third high-frequency signal line group 305. The first high-frequency signal line group 303 includes a plurality of pairs of high-frequency signal lines, one end of the high-frequency signal lines in the first high-frequency signal line group 303 is electrically connected to the first DSP chip 320, and the other end of the high-frequency signal lines in the first high-frequency signal line group 303 is electrically connected to the first gold finger 340. One end of the second high-frequency signal line group 304 is electrically connected to the first light emitting component 410a, and the other end of the second high-frequency signal line group 304 is electrically connected to the first DSP chip 320; one end of the third high-frequency signal line group 305 is electrically connected to the first light receiving component 420a, and the other end of the third high-frequency signal line group 305 is electrically connected to the first DSP chip 320.

[0119] In some embodiments, the plurality of pairs of high-frequency signal lines in the first high-frequency signal line group 303 are located on the same layer of the circuit board 300, such as on the top layer of the circuit board 300. Of course, in some embodiments, the plurality of pairs of high-frequency signal lines in the first high-frequency signal line group 303 can also be located on different layers of the circuit board 300. For example, when the first gold finger 340 is a plurality of rows of gold fingers, the plurality of pairs of high-frequency signal lines in the first high-frequency signal line group 303 are located on different layers of the circuit board 300.

[0120] In some embodiments, the second high-frequency signal line group 304 includes a plurality of high-frequency signal lines or a plurality of pairs of high-frequency signal lines, and the plurality of high-frequency signal lines or the plurality of pairs of high-frequency signal lines in the second high-frequency signal line group 304 are located on the same layer of the circuit board 300. For example, the second high-frequency signal line group 304 includes four high-frequency signal lines, and the four high-frequency signal lines are provided on the top layer of the circuit board 300.

[0121] In some embodiments, the third high-frequency signal line group 305 includes a plurality of pairs of high-frequency signal lines, and the plurality of pairs of high-frequency signal lines in the third high-frequency signal line group 305 are located on the same layer of the circuit board 300. For example, the third high-frequency signal line group 305 includes four pairs of high-frequency signal lines, and the four pairs of high-frequency signal lines are provided on the top layer of the circuit board 300.

[0122] Figure 23 A second DSP chip electrical connection state diagram is provided according to some embodiments of the present disclosure. In some embodiments, as shown in FIG. 4, the second DSP chip 330 is provided on the second surface 302 of the circuit board 300, and the second surface 302 is provided with a second gold finger 350. The second high-frequency signal line group 304 includes a plurality of pairs of high-frequency signal lines, one end of the high-frequency signal lines in the second high-frequency signal line group 304 is electrically connected to the second DSP chip 330, and the other end of the high-frequency signal lines in the second high-frequency signal line group 304 is electrically connected to the second gold finger 350. Figure 23As shown, the end of the second surface 302 is provided with a second golden finger 350, and the circuit board 300 is provided with a fourth high-frequency signal line group 306, a fifth high-frequency signal line group 307 and a sixth high-frequency signal line group 308. The fourth high-frequency signal line group 306 includes a plurality of pairs of high-frequency signal lines, one end of the high-frequency signal lines in the fourth high-frequency signal line group 306 is electrically connected to the second DSP chip 330, and the other end of the high-frequency signal lines in the fourth high-frequency signal line group 306 is electrically connected to the second golden finger 350. One end of the fifth high-frequency signal line group 307 is electrically connected to the second light emitting component 410b, and the other end of the fifth high-frequency signal line group 307 is electrically connected to the second DSP chip 330; one end of the sixth high-frequency signal line group 308 is electrically connected to the second light receiving component 420b, and the other end of the sixth high-frequency signal line group 308 is electrically connected to the second DSP chip 330.

[0123] In some embodiments, the plurality of pairs of high-frequency signal lines in the fourth high-frequency signal line group 306 are located on the same layer of the circuit board 300, such as on the bottom layer of the circuit board 300. Of course, in some embodiments, the plurality of pairs of high-frequency signal lines in the fourth high-frequency signal line group 306 are located on different layers of the circuit board 300. For example, when the second golden finger 350 is a plurality of rows of golden fingers, the plurality of pairs of high-frequency signal lines in the fourth high-frequency signal line group 306 are located on different layers of the circuit board 300.

[0124] In some embodiments, the fifth high-frequency signal line group 307 includes a plurality of high-frequency signal lines or a plurality of pairs of high-frequency signal lines, and the plurality of high-frequency signal lines or the plurality of pairs of high-frequency signal lines in the fifth high-frequency signal line group 307 are located on the same layer of the circuit board 300. For example, the fifth high-frequency signal line group 307 includes four high-frequency signal lines, and the four high-frequency signal lines are provided on the bottom layer of the circuit board 300.

[0125] In some embodiments, the sixth high-frequency signal line group 308 includes a plurality of pairs of high-frequency signal lines, and the plurality of pairs of high-frequency signal lines in the sixth high-frequency signal line group 308 are located on the same layer of the circuit board 300. For example, the sixth high-frequency signal line group 308 includes four pairs of high-frequency signal lines, and the four pairs of high-frequency signal lines are provided on the bottom layer of the circuit board 300.

[0126] In some embodiments, the plurality of pairs of high-frequency signal lines in the first high-frequency signal line group 303 do not cross each other in layers, the high-frequency signal lines in the fourth high-frequency signal line group 306 do not cross each other in layers, and the high-frequency signal lines in the first high-frequency signal line group 303 do not cross the high-frequency signal lines in the fourth high-frequency signal line group 306 in layers, so as to help reduce signal crosstalk between the high-frequency signal lines.

[0127] In some embodiments, the pairs of high-frequency signal lines in the second high-frequency signal line group 304 do not cross each other in the vertical direction, the pairs of high-frequency signal lines in the fifth high-frequency signal line group 307 do not cross each other in the vertical direction, and the high-frequency signal lines in the second high-frequency signal line group 304 do not cross the high-frequency signal lines in the fifth high-frequency signal line group 307 in the vertical direction, so as to help reduce signal crosstalk between the high-frequency signal lines.

[0128] In some embodiments, the pairs of high-frequency signal lines in the third high-frequency signal line group 305 do not cross each other in the vertical direction, the pairs of high-frequency signal lines in the sixth high-frequency signal line group 308 do not cross each other in the vertical direction, and the high-frequency signal lines in the third high-frequency signal line group 305 do not cross the high-frequency signal lines in the fifth high-frequency signal line group 307 in the vertical direction, so as to help reduce signal crosstalk between the high-frequency signal lines.

[0129] In some embodiments, the assembly and fixation of the upper shell 201 and the lower shell 202 require screws, and the side of the circuit board 300 is provided with a groove 360 for avoiding the screws when the lower shell 202 is assembled. For example, a first groove 361 is arranged on one side of the circuit board 300, a second groove 362 is arranged on the other side of the circuit board 300, and the first groove 361 and the second groove 362 are symmetrically arranged. The symmetric arrangement of the first groove 361 and the second groove 362 facilitates the assembly of the circuit board 300 and the lower shell 202 and saves the internal space of the optical module 200 occupied by the fixation of the circuit board 300.

[0130] In some experiments of the optical module, it is found that due to the arrangement of the first groove 361 to the second groove 362, a stress concentration area A is formed between the first groove 361 and the second groove 362 on the circuit board 300, the stress concentration area A penetrates the circuit board 300 in the width direction of the circuit board 300, and the stress concentration area A is prone to bending or even breaking. Figure 24 A bending schematic diagram of a circuit board according to some embodiments of the present disclosure is shown in FIG. 3C. As shown in FIG. 3C, the circuit board 300 bends at the stress concentration area A between the first groove 361 and the second groove 362. Figure 24

[0131] In some embodiments, in order to reduce the bending of the circuit board 300 at the stress concentration area A, electrical components such as capacitors, resistors, etc. are arranged in the stress concentration area A to improve the bending resistance of the stress concentration area A.

[0132] Figure 25 A partial structure schematic diagram of a third circuit board according to some embodiments of the present disclosure is shown in FIG. 3D. In some embodiments, as shown in FIG. 3D, the circuit board 300 is provided with a stress concentration area A between the first groove 361 and the second groove 362. Figure 25 ​As shown, on the first surface 301 of the circuit board 300, in the stress concentration area A, a plurality of capacitors 3031 are arranged on the first high-frequency signal line group 303. The capacitors 3031 are ceramic structures with strong bending resistance, and therefore, arranging the capacitors 3031 in the stress concentration area A can effectively improve the bending resistance of the stress concentration area A by using the capacitors 3031, thereby reducing the bending deformation of the circuit board 300.

[0133] For example, in the stress concentration area A, the capacitors 3031 are arranged on each high-frequency signal line in the first high-frequency signal line group 303. Of course, in some embodiments, in the stress concentration area A, some high-frequency signal lines in the first high-frequency signal line group 303 are provided with the capacitors 3031, and some high-frequency signal lines are not provided with the capacitors 3031.

[0134] Figure 26 A third partial structure of a circuit board according to some embodiments of the present disclosure Figure 2 In some embodiments, as shown in FIG. 3, the first surface 301 of the circuit board 300 is provided with a plurality of capacitors 3031 arranged in parallel in the stress concentration area A, and the plurality of capacitors 3031 are respectively connected to the high-frequency signal lines in the first high-frequency signal line group 303. Figure 26

[0135] In some embodiments, on the second surface 302 of the circuit board 300, in the stress concentration area A, a plurality of capacitors are arranged on the third high-frequency signal line group 305. The arrangement of the plurality of capacitors on the third high-frequency signal line group 305 in the stress concentration area A can refer to the arrangement of the plurality of capacitors 3031 on the first high-frequency signal line group 303. In some embodiments, the capacitors arranged on the third high-frequency signal line group 305 are symmetrically arranged with the capacitors 3031 arranged on the first high-frequency signal line group 303 with respect to the circuit board 300, so as to balance the stress of the stress concentration area A on the first surface 301 and the second surface 302 of the circuit board 300, and effectively reduce the bending deformation of the circuit board 300.

[0136] In some embodiments of the present disclosure, the first DSP chip 320 and the second DSP chip 330 are the main heat-generating components in the optical module 200, and of course, the main heat-generating components in the optical module 200 provided by the embodiments of the present disclosure are not limited to the first DSP chip 320 and the second DSP chip 330, but also include the optical transceiver component 400, etc. When the first DSP chip 320 and the second DSP chip 330 are arranged on the first surface 301 and the second surface 302 of the circuit board 300, it is particularly important to dissipate heat from the first DSP chip 320 and the second DSP chip 330.

[0137] ​In some embodiments, to facilitate heat dissipation of major heat-generating components such as the first DSP chip 320 and the second DSP chip 330, heat-conducting protrusions are provided on the cover plate 2011 of the upper housing 201 and / or the base plate 2021 of the lower housing 202. These protrusions contact and connect with the major heat-generating components such as the first DSP chip 320 and the second DSP chip 330 to transfer the heat generated by these components to the upper housing 201 or the lower housing 202, whereby the heat is finally dissipated. Improper assembly can easily damage these heat-conducting protrusions on the cover plate 2011 of the upper housing 201 and / or the base plate 2021 of the lower housing 202.

[0138] Figure 27 This is a partial structural schematic diagram of a fourth type of circuit board provided according to some embodiments of the present disclosure. Figure 28 for Figure 27 An exploded view. In some embodiments, such as Figure 27 and Figure 28 As shown, a first elastic heat-conducting component 205 is disposed on the top of the first DSP chip 320. The bottom of the first elastic heat-conducting component 205 contacts and connects to the first DSP chip 320, and the bottom of the first elastic heat-conducting component 205 is used to contact and connect to the cover plate 2011 of the upper housing 201. Thus, the first DSP chip 320 contacts and connects to the upper housing 201 through the first elastic heat-conducting component 205 to transfer the heat generated by the first DSP chip 320 to the upper housing 201. The first elastic heat-conducting component 205 is an elastic heat-conducting component. When it is squeezed by the first DSP chip 320 and the cover plate 2011, it will deform, which can offset the force generated on the first DSP chip 320, thereby reducing the squeezing damage to the first DSP chip 320. In some embodiments, the first elastic heat-conducting component 205 is a metal part with a spring-like structure, which has good elasticity and good thermal conductivity.

[0139] In some embodiments, such as Figure 25 and Figure 26As shown, the top of the second DSP chip 330 is provided with a second elastic heat-conducting component 206. The bottom of the second elastic heat-conducting component 206 is in contact with the second DSP chip 330, and the top of the second elastic heat-conducting component 206 is used to contact the bottom plate 2021 of the lower shell 202. In this way, the second DSP chip 330 is in contact with the lower shell 202 through the second elastic heat-conducting component 206, so as to transmit the heat generated by the second DSP chip 330 to the lower shell 202. The second elastic heat-conducting component 206 is an elastic heat-conducting component. When being pressed by the second DSP chip 330 and the bottom plate 2021, the second elastic heat-conducting component 206 will deform, so as to reduce the force acting on the second DSP chip 330, thereby reducing the damage to the second DSP chip 330 caused by the pressing. In some embodiments, the second elastic heat-conducting component 206 is a spring-shaped metal component, which has good elasticity and good heat-conducting performance.

[0140] In some embodiments, the first DSP chip 320 and the second DSP chip 330 are symmetrically arranged on the first surface 301 and the second surface 302 of the circuit board 300, and the first elastic heat-conducting component 205 and the second elastic heat-conducting component 206 are symmetrically arranged on the top of the first DSP chip 320 and the top of the second DSP chip 330. Of course, in some embodiments, the first elastic heat-conducting component 205 and the second elastic heat-conducting component 206 can be adaptively adjusted according to the arrangement of the first DSP chip 320 and the second DSP chip 330.

[0141] Figure 29 A structure diagram of a first elastic heat-conducting component according to some embodiments of the present disclosure Figure 1 , Figure 30 A structure diagram of a first elastic heat-conducting component according to some embodiments of the present disclosure Figure 2 . As Figure 29 and Figure 30 shown, the first elastic heat-conducting component 205 includes a first contact portion 2051, a first elastic portion 2052, a second elastic portion 2053, and a second contact portion 2054. One end of the first elastic portion 2052 is connected to one end of the first contact portion 2051, and the other end of the first elastic portion 2052 is connected to one end of the second contact portion 2054. One end of the second elastic portion 2053 is connected to the other end of the first contact portion 2051, and the other end of the second elastic portion 2053 is connected to the other end of the second contact portion 2054. The first contact portion 2051 is used to contact the upper shell 201, and the second contact portion 2054 is used to contact the first DSP chip 320. When the upper shell 201 presses the first contact portion 2051 or the first DSP chip 320 presses the second contact portion 2054, the first elastic portion 2052 and the second elastic portion 2053 will contract and deform.

[0142] In some embodiments, the first elastic part 2052 is a " > " shaped structure with two ends up, and the pointed part faces the second elastic part 2053; the second elastic part 2053 is a " < " shaped structure with two ends up, and the pointed part faces the first elastic part 2052. When the upper shell 201 presses the first contact part 2051 or the first DSP chip 320 presses the second contact part 2054, the distance between the two ends of the first elastic part 2052 decreases, and the distance between the two ends of the second elastic part 2053 decreases, that is, the first elastic part 2052 and the second elastic part 2053 produce elastic deformation, reducing the damage to the first DSP chip 320 caused by the pressing force.

[0143] In some embodiments, a first thickening part 2055 is arranged on the inner side of the first contact part 2051, and the first thickening part 2055 is used to locally thicken the first contact part 2051; a second thickening part 2056 is arranged on the inner side of the second contact part 2054, and the second thickening part 2056 is used to locally thicken the second contact part 2054. The first elastic and heat-conducting part 205 is made of sheet metal with relatively thin thickness, and the first thickening part 2055 arranged on the first contact part 2051 and the second thickening part 2056 arranged on the second contact part 2054 effectively avoid the bending of the first contact part 2051 or the second contact part 2054 during the deformation of the first elastic and heat-conducting part 205, which affects the contact of the first contact part 2051 with the upper shell 201 and the contact of the second contact part 2054 with the first DSP chip 320, and reduces the heat dissipation performance of the first elastic and heat-conducting part 205.

[0144] In some embodiments, the first elastic and heat-conducting part 205 further includes a first supporting part 2057 and a second supporting part 2058, the first supporting part 2057 is a " < " shaped structure with two ends up, and the second supporting part 2058 is a " > " shaped structure with two ends up. The middle part of the first supporting part 2057 is connected to the first elastic part 2052, one end of the first supporting part 2057 is connected to the first thickening part 2055, and the other end of the first supporting part 2057 is connected to the second thickening part 2056; the middle part of the second supporting part 2058 is connected to the second elastic part 2053, one end of the second supporting part 2058 is connected to the first thickening part 2055, and the other end of the second supporting part 2058 is connected to the second thickening part 2056. The first supporting part 2057 and the second supporting part 2058 do not affect the elastic performance of the first elastic and heat-conducting part 205, and also reduce the bending of the first contact part 2051 or the second contact part 2054, so that the first contact part 2051 fully contacts the upper shell 201, and the second contact part 2054 fully contacts the first DSP chip 320.

[0145] In some embodiments, the middle tip of the first support portion 2057 is connected to the middle tip of the first elastic portion 2052, and the middle tip of the second support portion 2058 is connected to the middle tip of the second elastic portion 2053, so that the first elastic heat-conducting component 205 is subjected to uniform force, thereby ensuring its good heat dissipation capacity.

[0146] Figure 31 This is a usage diagram of a first elastic thermally conductive component provided according to some embodiments of the present disclosure. For example... Figure 31 As shown, when the upper housing 201 of the optical module 200 is assembled with the circuit board 300, the upper housing 201 presses against the first elastic heat-conducting component 205, causing the first elastic heat-conducting component 205 to deform. This causes the surface of the first contact portion 2051 to contact the cover plate 2011, and the surface of the second contact portion 2054 to fully contact the first DSP chip 320. The elastic deformation of the first elastic heat-conducting component 205 reduces the damage to the first DSP chip 320 caused by the pressure from the first elastic heat-conducting component 205. Thus, in this embodiment of the present disclosure, the first elastic heat-conducting component 205 can effectively dissipate heat from the first DSP chip 320 while reducing damage to the first DSP chip 320.

[0147] In some embodiments, the detailed structure of the second elastic heat-conducting component 206 may refer to the structure of the first elastic heat-conducting component 205. It may be the same as the structure of the first elastic heat-conducting component 205, or it may be adapted and modified based on the structure of the first elastic heat-conducting component 205.

[0148] In some embodiments, a structure similar to the first elastic thermally conductive component 205 may also be used to dissipate heat from other major heat-generating components in the optical module 200.

[0149] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this disclosure, and are not intended to limit them. Although this disclosure has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this disclosure.

Claims

1. An optical module characterized by comprising: The application relates to an optical transceiver, comprising: a circuit board with a gap in the middle; an optical transceiver component electrically connected to the circuit board, wherein the optical transceiver component comprises: an optical transceiver shell with a first support plate on one side and a second support plate and a third support plate on the other side, the first support plate being above the second support plate and a gap being arranged between the second support plate and the third support plate; the optical transceiver shell is arranged in the gap, and the gap is embedded in the circuit board connected to the edge of the gap; the optical transceiver shell comprises a first side plate, a second side plate and a third side plate connected in sequence, the first side plate, the second side plate and the third side plate surround a light emitting cavity, and the first support plate is arranged in the light emitting cavity; the second support plate and the third support plate are arranged outside the light emitting cavity, and the side edges of the second support plate and the third support plate are connected to the side surface of the third side plate; a first light emitting assembly arranged on the first surface of the first support plate; a second light emitting assembly arranged on the second surface of the first support plate; a first light receiving assembly arranged on the second support plate; a second light receiving assembly arranged on the third support plate; a first upper cover connected to the optical transceiver shell and covering the first light emitting assembly and the first light receiving assembly; a second upper cover connected to the optical transceiver shell and covering the second light emitting assembly and the second light receiving assembly.

2. The optical module according to claim 1, characterized by The gap extends to the outer side wall of the third side plate.

3. The optical module according to claim 2, characterized by The outer side of the second side plate is provided with a first opening, one end of the first side plate away from the second side plate is provided with a second opening, one end of the third side plate away from the second side plate is provided with a third opening, and one end of the second opening and one end of the third opening are flush with one end of the first support plate; the first opening, the second opening and the third opening are embedded in the circuit board connected to the edge of the gap.

4. The optical module according to claim 1, characterized by The first light receiving assembly comprises a first arrayed waveguide grating arranged on the second support plate; one end of the second support plate is provided with a first stop block and a second stop block, a first gap is arranged between the first stop block and the second stop block, and one end of the first arrayed waveguide grating is embedded in the first gap; The second light receiving assembly comprises a second arrayed waveguide grating arranged on the third support plate; one end of the third support plate is provided with a third stop block and a fourth stop block, a second gap is arranged between the third stop block and the fourth stop block, and one end of the second arrayed waveguide grating is embedded in the second gap.

5. The optical module of claim 1, wherein, The first upper cover comprises a first upper cover body, a first baffle and a second baffle, the top of the first baffle and the top of the second baffle are connected to the bottom surface of the first upper cover body and are located at the edge of the first upper cover body, the bottom of the first baffle and the bottom of the second baffle are connected to the circuit board, and the bottom surface edge of the first upper cover body, on which the first baffle and the second baffle are not connected, is connected to the optical transceiver shell. The second upper cover comprises a second upper cover body, a third baffle and a fourth baffle, the top of the third baffle and the fourth baffle is connected to the bottom surface of the second upper cover body and is located at the edge of the second upper cover body, the bottom of the third baffle and the bottom of the fourth baffle are connected to the circuit board, and the bottom edge of the second upper cover body, on which the third baffle and the fourth baffle are not connected, is connected to the optical transceiver shell.

6. The optical module of claim 1, wherein, The first surface of the circuit board is provided with a first digital signal processing chip and a first gold finger, and the second surface of the circuit board is provided with a second digital signal processing chip and a second gold finger. The first digital signal processing chip is electrically connected to the first gold finger, the first optical transmitting assembly and the first optical receiving assembly, and the second digital signal processing chip is electrically connected to the second gold finger, the second optical transmitting assembly and the second optical receiving assembly.

7. The optical module of claim 5, wherein, The bottom of the first baffle and the bottom of the third baffle form a first interval, the bottom of the second baffle and the bottom of the fourth baffle form a second interval, the first interval is communicated with the gap, and the second interval is communicated with the first interval; and the circuit board is embedded in the first interval and the second interval.

8. The optical module of claim 2, wherein, The outer side wall of the first side plate is flush with the side edge of the circuit board, and the outer side wall of the first side plate is in contact with the lower shell of the optical module.

9. The optical module of claim 6, wherein, The optical module further comprises a first elastic heat-conducting component, the first elastic heat-conducting component comprises a first contact part, a first elastic part, a second elastic part and a second contact part, one end of the first elastic part is connected to one end of the first contact part, the other end of the first elastic part is connected to one end of the second contact part, one end of the second elastic part is connected to the other end of the first contact part, and the other end of the second elastic part is connected to the other end of the second contact part. The first contact part is in contact with the upper shell of the optical module, the second contact part is in contact with the first digital signal processing chip, and the first elastic part and the second elastic part are deformed when being extruded by the first contact part and the second contact part.

10. The optical module of claim 2, wherein, The first optical fiber connecting part and the second optical fiber connecting part are provided on the first side plate, one end of the first optical fiber connecting part and one end of the second optical fiber connecting part are respectively connected to an optical fiber, the first optical fiber connecting part is located above the second optical fiber connecting part, and a gap is provided between the first optical fiber connecting part and the second optical fiber connecting part. The notch comprises a first side, a second side, a third side, a fourth side and a fifth side connected in sequence, the first side, the third side and the fifth side are parallel to the end side of the circuit board, and the second side and the fourth side are parallel to the lengthwise side of the circuit board. The first optical fiber connecting part and the second optical fiber connecting part are located at the side edges of the first side and the second side.

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