Supply control system for multiple tanks

Abstract

Disclosed is a supply control system for a tank used in a semiconductor manufacturing process. The supply control system for a tank of the present disclosure embodiment includes a plurality of tanks for storing a large amount of process material used for manufacturing a semiconductor; a main supply pipe configured to communicate with a sub-supply pipe respectively coupled to the plurality of tanks and to supply the process material to a semiconductor manufacturing device; a plurality of flow control devices respectively included in the sub-supply pipes and configured to control a flow rate of the process material discharged from each of the plurality of tanks; a sensor included in the main supply pipe and configured to measure the flow rate of the process material supplied from each of the plurality of tanks to the semiconductor manufacturing device and a process material supply pressure in real time; a backup portion coupled to the main supply pipe and configured to additionally discharge the stored process material so that the process material is stably supplied to the semiconductor manufacturing device; and a controller configured to control the plurality of flow control devices and the backup portion based on information on the flow rate of the process material or information on the process material supply pressure measured by the sensor so that a set flow rate of the process material is supplied to the semiconductor manufacturing device through the main supply pipe.

Description

[0001] Cross-references to related applications

[0002] This application claims priority to U.S. Provisional Patent Application No. 63 / 080,282, filed September 18, 2020, entitled “Supply Control System for ISO Cans”, and Korean Patent Application No. 10-2020-0120450, filed September 18, 2020, entitled “Supply Control System for ISO Cans”, the entire contents of which are incorporated herein by reference. Background of the Invention 1. Technical Field

[0004] The present invention relates to a supply control system for multiple tanks, wherein the multiple tanks are configured to stably supply process materials from multiple tanks used for storing process materials for manufacturing semiconductors to a semiconductor manufacturing apparatus. 2. Background Technology

[0006] Currently, process material supply systems installed in semiconductor manufacturing plants are typically configured to couple multiple tanks to the semiconductor manufacturing unit via a single supply line. The disadvantages are that it is difficult to individually control multiple tanks to regulate the discharge rates of chemicals supplied to the semiconductor manufacturing unit, and process materials are supplied only from specific tanks.

[0007] Furthermore, in the above-mentioned cases, when the periodic management of multiple tanks is not integrated and systematic, the disadvantage is that it is difficult for operators to accurately identify when the stored process materials are depleted and to arbitrarily adjust the time when any tank must be replaced.

[0008] Therefore, due to these drawbacks, the entire production line may come to a halt when several tanks must be replaced simultaneously, even though a continuous supply of chemicals is critical in semiconductor manufacturing processes. Summary of the Invention

[0009] This disclosure aims to provide a supply control system for a process material delivery system, wherein, relative to a plurality of tanks installed to supply process materials for manufacturing semiconductors to a semiconductor manufacturing apparatus, the flow rate of process material discharged from each of the plurality of tanks can be controlled, the replacement cycle of each of the plurality of tanks can be effectively managed by checking and controlling the remaining amount of process material, and a fixed amount of process material required by the semiconductor manufacturing apparatus can be stably supplied to the semiconductor manufacturing apparatus even if a particular tank is replaced or an abnormality occurs in the pipeline.

[0010] This can be achieved by a supply control system for cans according to an embodiment of the present disclosure, comprising: a plurality of cans storing process materials for manufacturing semiconductors; a main supply pipe configured to communicate with branch supply pipes respectively coupled to the plurality of cans and supplying process materials to a semiconductor manufacturing apparatus; a plurality of flow control devices respectively included in the branch supply pipes and configured to control the flow rate of process materials discharged from each of the plurality of cans; a sensor included in the main supply pipe and configured to measure in real time the flow rate and the process material supply pressure of the process materials supplied to the semiconductor manufacturing apparatus from each of the plurality of cans; a backup portion coupled to the main supply pipe and configured to supplementally discharge the stored process materials, thereby ensuring a stable supply of process materials to the semiconductor manufacturing apparatus; and a controller configured to control the plurality of flow control devices and the backup portion based on information about the flow rate of the process materials or information about the supply pressure of the process materials measured by the sensor, such that a set flow rate of process materials is supplied to the semiconductor manufacturing apparatus through the main supply pipe.

[0011] The controller can be configured to control the plurality of flow control devices to operate at different opening rates, such that process material stored in the plurality of tanks is discharged from each of the plurality of tanks at different flow rates, and the plurality of tanks are sequentially depleted.

[0012] The plurality of tanks and the backup section may include at least one of a load sensor or a pressure sensor to estimate the remaining amount of stored process material, wherein the load sensor is configured to measure the weight of each of the plurality of tanks and the backup section, the weight varying as the stored process material is discharged, and the pressure sensor is configured to measure the internal pressure of each of the plurality of tanks and the backup section, the internal pressure varying as the stored process material is discharged.

[0013] The controller can be configured to control the backup to supplement the supply of process material when there are abnormalities in the information measured by sensors regarding the flow rate of process material and the supply pressure of process material.

[0014] The controller can be configured to control the operation of the backup section to supplement the supply of process materials when a specific tank among the plurality of tanks is replaced due to the depletion of process materials in the order of the plurality of tanks.

[0015] When multiple tanks include a first tank, a second tank, a third tank, and a fourth tank, the controller can be configured to control each of the multiple flow control devices based on the process material flow rate set to be supplied to the semiconductor manufacturing apparatus via the main supply pipe, such that the first, second, third, and fourth tanks discharge 40%, 30%, 20%, and 10% of the process material flow rate, respectively.

[0016] The controller can be configured to control each of the plurality of flow control devices based on the flow rate of the process material supplied to the semiconductor manufacturing apparatus via the main supply pipe, such that when the replacement of the first container is completed according to the depletion of the process material stored in the first container, the first, second, third and fourth containers discharge 10%, 40%, 30% and 20% of the process material flow rate, respectively.

[0017] According to the embodiments of this disclosure, the supply control system for tanks includes multiple flow control devices, each included in a sub-supply pipe and configured to control the flow rate of process material discharged from each of a plurality of tanks (which store process materials for manufacturing semiconductors), and a backup portion coupled to the main supply pipe and configured to supplementally discharge process material to stably supply process material. These backup portions can be controlled by the controller based on the process material flow rate and process material supply pressure, respectively, measured in real time by sensors on the main supply pipe. Therefore, the remaining amount of process material in each of the plurality of tanks can be checked and controlled. Replacement cycles for each of the plurality of tanks can be effectively managed, and a fixed amount of process material required by the semiconductor manufacturing apparatus can be stably supplied even if any of the plurality of tanks is replaced or an anomaly occurs in the pipe. Attached Figure Description

[0018] Figure 1 This is a block diagram schematically illustrating the overall configuration of a supply control system for tanks according to an embodiment of the present disclosure.

[0019] Figure 2 It shows the basis Figure 1 A flowchart of a series of processes in an implementation scheme, wherein process materials stored in a tank are supplied to a semiconductor manufacturing apparatus.

[0020] Figure 3 It shows the basis Figure 1 A diagram illustrating the operational status of the implementation scheme, wherein process materials stored in multiple tanks are discharged from each of the multiple tanks at different flow rates, such that the multiple tanks are sequentially depleted.

[0021] Figure 4 It shows the basis Figure 3 The diagram illustrates the operational status of the backup portion of the implementation scheme, where an anomaly occurs while process materials are being supplied to the semiconductor manufacturing apparatus.

[0022] Figure 5 It shows the basis Figure 3 A view of the operational status of the implementation scheme, wherein the process material is delivered at a varying flow rate after a tank is changed due to the supply of process material. Detailed Implementation

[0023] Preferred embodiments of the present disclosure will be described in detail below with reference to the accompanying drawings. Detailed descriptions of related known technologies will be omitted to avoid obscuring the subject matter of embodiments according to the present disclosure.

[0024] For clarity, the term "can" as used before or after this designation can include any enclosed container constructed of stainless steel, Cr-Mo steel alloys (such as Alloy 4130), nickel, aluminum, or other suitable materials capable of withstanding pressures ranging from 0 Torr to >3000 psig. The internal volume of a can can range from less than 1 liter to 22,500 liters or more.

[0025] For clarity, any material referred to previously or hereafter as "process material" can be any material used in the manufacture of semiconductors. This may include materials stored or transported in a solid, liquid, gaseous, liquefied compressed gas, or supercritical fluid phase.

[0026] Finally, and for clarity, the components referred to previously or hereafter as "flow control devices" may include any means of altering the quantity or pressure of process material flowing through or out of a process material delivery system used in semiconductor manufacturing. These components may include mass flow controllers, proportional control valves, pressure control valves (regulators), orifices, and pneumatic valves. The controlled flow rate can range from 0 liters per minute to greater than 2000 liters per minute. The pressure range can be from 0 Torr to >3000 psig.

[0027] Figure 1 This is a block diagram schematically illustrating the overall configuration of a supply control system for tanks according to an embodiment of the present disclosure. Figure 2 It shows the basis Figure 1 The flowchart illustrates a series of processes in the implementation scheme, in which process materials stored in a tank are supplied to a semiconductor manufacturing apparatus. Figure 3 Is it showing stored Figure 1 The diagram shows the operating state in which process materials in multiple tanks are discharged from each of the multiple tanks at different flow rates, such that the multiple tanks are sequentially depleted. Figure 4 It shows the basis Figure 3 The implementation scheme is illustrated in the diagram of the backup unit's operating status in the event of an anomaly while supplying process materials to the semiconductor manufacturing equipment. Figure 5 It shows the basis Figure 3A diagram illustrating the operational status of the implementation scheme, wherein the process material is delivered at a varying flow rate after a tank is replaced due to the supply of process material.

[0028] The terms “above,” “below,” “left and right,” “front,” and “rear,” etc., used to specify directions in the description and claims of this disclosure are not intended to limit the scope of protection of this disclosure, but are defined based on the relative positions of the figures and components for ease of description. The three axes can be interchanged by rotation to correspond to each other, and this is the case unless otherwise specifically defined.

[0029] Since the supply control system 100 for cans according to the embodiments of this disclosure is not applicable to conventional small-volume point supply methods (which supply process materials G (chemicals) stored in each small gas cylinder to the semiconductor manufacturing apparatus 10 via a supply cabinet), but is applicable to large-volume centralized supply methods (which utilize multiple cans 110a-110d), the flow rate GF of process materials discharged from each can 110a-110d can be controlled individually, the replacement cycle of each can 110a-110d can be effectively managed, and a fixed amount of process materials required by the semiconductor manufacturing apparatus 10 can be stably supplied even if any of the cans 110a-110d is replaced or an anomaly occurs in the pipeline.

[0030] To specifically achieve the functions and features described above, the supply control system 100 for tanks according to embodiments of this disclosure includes, for example, Figure 1 The system includes multiple tanks 110a-110d, a main supply pipe 120a, branch supply pipes 120b, flow control devices 130a-130d, a sensor 140, a flow meter 142, a backup unit 150, and a controller 160, and performs... Figure 2 The series of processes shown enables a stable supply of process materials (chemicals) to the semiconductor manufacturing apparatus 10.

[0031] Here, the semiconductor manufacturing apparatus 10 may be, for example, a chemical vapor deposition (CVD) apparatus for receiving process materials and for chemically depositing coating materials on a substrate surface; an etching apparatus for etching the deposited portions; or an apparatus for cleaning the etched portions.

[0032] In this disclosure, multiple tanks with the same storage capacity can be provided to ensure a stable supply of process materials to the semiconductor manufacturing apparatus 10 over a long period of time.

[0033] Tanks 110a-110d may each include, for example, an outlet coupled to the supply pipe 120b and configured to discharge stored process material to the outside, a cylindrical structural frame (not shown) for supporting the edges, a load sensor 112 for estimating the remaining amount of stored process material, and a pressure sensor 114.

[0034] At this point, the load sensor 112 may be a component for estimating the remaining amount of stored process material by measuring the weight of each of the tanks 110a-110d, the weight of which changes according to the discharge of the stored process material, and the load sensor 112 may be a variety of commercial products including, for example, piezoelectric elements, located on the mounting surface of which the tanks 110a-110d are placed between the tanks 110a-110d and the tanks 110a-110d.

[0035] The estimation of the remaining amount of process material stored in each tank 110a-110d by using load sensor 112 can be made by controller 160, which will be described below, and is electrically coupled to load sensor 112. Controller 160 receives information about the weight of each tank 110a-110d as measured by load sensor 112 in real time or at set time intervals.

[0036] As an example, the controller 160 can estimate the amount of remaining process material in each of the tanks 110a-110d by calculating the weight ratio between the tanks 110a-110d based on the initial weight of each of the tanks 110a-110d filled with process material, the weight ratio being measured in real time as the process material is discharged.

[0037] Pressure sensor 114 may be a component for measuring the internal pressure of each of tanks 110a-110d in order to supplement the estimation of the remaining amount of process material stored in tanks 110a-110d in cooperation with load sensor 112, the internal pressure being able to change according to the discharge of stored process material from each of tanks 110a-110d, and may be any of a variety of commercial products that are installed to communicate with the internal space of each of tanks 110a-110d and generate a predetermined electrical signal based on the internal pressure of each of tanks 110a-110d.

[0038] The estimation of the remaining amount of process material in each tank 110a-110d can also be made by a controller 160, which will be described below, in real time or at predetermined time intervals, to receive information about the pressure between tanks 110a-110d, which is measured by a load sensor 114 electrically coupled to the pressure sensor 114.

[0039] As an example, the controller 160 can estimate the amount of remaining process material in each of the tanks 110a-110d by calculating the pressure ratio of each of the tanks 110a-110d based on the initial pressure of each of the tanks 110a-110d filled with process material, the pressure ratio being measured in real time as the process material is discharged.

[0040] The main supply pipe 120a may be a component corresponding to the pipe used to couple the plurality of tanks 110a-110d to the manufacturing apparatus 10 to ensure that process materials discharged from the plurality of tanks 110a-110d are supplied to the manufacturing apparatus 10. Specifically, as Figure 1 As shown, the main supply pipe 120a can supply process materials to the semiconductor manufacturing apparatus 10 by communicating with a plurality of sub-supply pipes 120b, each sub-supply pipe 120b being coupled to the outlet of each of the plurality of tanks 110a-110d.

[0041] The main supply pipe 120a may include, for example, multiple pipes divided into predetermined lengths, multiple VCRs (fasteners) for sealingly engaging the multiple pipes, and regulators and manual / automatic valves disposed between the multiple pipes.

[0042] The flow control devices 130a-130d may be components installed in each of the distribution supply pipes 120b to control the flow rate GF of the process material discharged from each of the plurality of tanks 110a-110d, and may be operated according to control commands from the controller 160 when electrically coupled to control the flow rate GF of the process material discharged from the respective tank 110a-110d or to prevent the discharge of process material.

[0043] The multiple flow control devices 130a-130d can be commercially available electronically controlled valves implemented in various ways, such as by changing the cross-sectional dimensions (i.e., the opening ratio) of the pipe through which fluids such as process materials flow, or by variably forming a bypass pipe.

[0044] On the other hand, preferably, the aforementioned flow control devices 130a-130d are commercial products integrated with a flow meter 142 for measuring the flow rate GF of the process material flowing through the distribution supply pipe 120b, and are configured to send information about the corresponding process material flow rate GF to the controller 160. For example... Figure 3 As shown, when the process material in each tank 110a-110d is set and discharged at different flow rates, it is checked whether the process material corresponding to the specific flow rate is discharged.

[0045] Sensor 140 may be a component disposed in the main supply pipe 120a to check whether the process material flow rate GF required by the semiconductor manufacturing apparatus 10 is accurately supplied from each tank 110a-10d, and may be operable to measure in real time the process material flow rate GF and the process material supply pressure actually supplied to the semiconductor manufacturing apparatus 10 through the main supply pipe 120a by controlling the flow control devices 130a-130d as described above.

[0046] like Figure 1As shown, sensor 140 may include, for example, a flow meter 142 and a pressure sensor 144. The flow meter 142 is used to measure the amount of process material flowing into the semiconductor manufacturing apparatus 10 through the main supply pipe 120a, and the pressure sensor 144 is used to measure the internal pressure of the main supply pipe 120a to supplement the estimation of whether there are any anomalies in the process material flow rate GF in coordination with the flow meter 142.

[0047] At this time, the flow meter 142 can be any of various types of commercial products that use differential pressure, area, electronic methods, or ultrasonic waves, and the pressure sensor 144 can be any of various types of commercial products that generate a predetermined electrical signal based on the internal pressure of the main supply pipe 120a as described above.

[0048] As described above, information about the process material flow rate GF measured by flow meter 142 and information about the process material supply pressure measured by pressure sensor 144 can be transmitted to controller 160 and can be used to determine malfunction or failure of flow control devices 130a-130d or, for example, process material leakage in pipe connections.

[0049] The backup section 150 may be a component for reliably supplying process materials to the semiconductor manufacturing apparatus 10, and may include, for example, a backup tank 150a, a flow control device 150b, a load sensor 152, and a pressure sensor 154, such as... Figure 1 As shown.

[0050] Here, the backup tank 150a may be a component for discharging stored process materials in the event of an anomaly in the supply of process materials to the semiconductor manufacturing apparatus 10, and may be installed to communicate with the main supply pipe 120a, while storing process materials therein, such as in tanks 110a-110d.

[0051] At this time, the storage capacity of the backup tank 150a can be the same as that of the tanks 110a-110d, and can be appropriately changed if necessary, taking into account, for example, the number of tanks 110a-110d and the flow rate GF of the process materials supplied to the semiconductor manufacturing apparatus 10.

[0052] The flow control device 150b is a component for controlling the flow rate GF of the process material discharged from the backup tank 150a, the load sensor 152 is a component for measuring the weight of the backup tank 150a, and the pressure sensor 154 is a component for sensing the internal pressure of the backup tank 150a. These components can have the same configuration as the flow control devices 130a-130d, load sensor 112, and pressure sensor 114 described above, except for the parts on which they are mounted.

[0053] The backup section 150 can be electrically coupled to the controller 160, and according to the determination and operation control of the controller 160, the stored process material can be selectively and supplementarily discharged to the main supply pipe 120a via the flow control device 150b. As a result, the backup section 150 can stably supply a set fixed amount of process material at a flow rate GF to the semiconductor manufacturing apparatus 10.

[0054] On the other hand, a load sensor 152 and a pressure sensor 154, included in the backup section 150, can be provided to estimate the remaining amount of process material stored in the backup tank 150a, such as in tanks 110a-110d.

[0055] The controller 160 may be a component electrically connected to, for example, load sensors 112, 152 and pressure sensors 114, 144, 154 of tanks 110a-110d, flow control devices 130a-130d, sensor 140 and backup unit 150, respectively, to apply control forces and signals to these components to control their operation, and to receive and process measured information or data. The controller 160 may include, for example, a modular information processing unit such as a microcontroller unit (MCU), microcomputer, Arduino or programmable logic controller (PLC); a display (not shown) for conveying, for example, processed information; and an input device (not shown) for user settings.

[0056] A series of processes and algorithms, such as those that allow the controller 160 to control each component coupled thereto and to process transmitted and received data, can be encoded in programming languages ​​such as C, C++, JAVA, and machine language and can be read by the information processing unit.

[0057] At this point, the encoding algorithms used for the series of operations and data processing performed by the controller 160 can be implemented by those skilled in the art in various ways and forms, and therefore their detailed description will be omitted.

[0058] However, the following will refer to Figure 2-5 To explain what series of control operations the controller 160 uses to stably supply and manage the set process material flow rate GF from multiple tanks 110a-110d to the semiconductor manufacturing apparatus 10 according to the embodiments of this disclosure.

[0059] First, such as Figure 2 As shown, the controller 160 receives information about the flow rate GF of the process material to be continuously supplied to the semiconductor manufacturing apparatus 10 via an input device and stores the received information. At this time, the operator can set or determine the flow rate GF of the process material to be continuously supplied to the semiconductor manufacturing apparatus 10 by considering, for example, the overall scale or operating conditions of the semiconductor manufacturing apparatus 10.

[0060] For example, when the daily flow rates GF of the process materials supplied within a week are 50, 55, 50, 60, 55, 55, and 55 (in GPM or LPM), the final flow rate GF of the process materials to be supplied can be set to 65.14 = 54.28 (average) × 1.2 (safety factor) (see...). Figure 3 100% GF in it.

[0061] As described above, the flow rate GF of the process material to be supplied to the semiconductor manufacturing apparatus 10 is set to a set value, which can be converted into a corresponding process material supply pressure and changed arbitrarily as needed, and can therefore be used as a reference for the control operation of the controller 160 (S100).

[0062] Next, as Figure 2 As shown, when the flow rate GF of the process material to be continuously supplied to the semiconductor manufacturing apparatus 10 is set, the controller 160 controls each flow control device 130a-130d according to the flow ratio of each tank 110a-110d, so that the process material is supplied to the semiconductor manufacturing apparatus 10.

[0063] At this time, when Figure 3 When four tanks, namely the first, second, third and fourth tanks 110a-110d, are provided, assuming that the process material flow rate GF previously set to be supplied to the semiconductor manufacturing apparatus 10 is 100%, each tank 110a-110d can be set to supply process material at rates of 40%, 30%, 20% and 10%, respectively.

[0064] As described above, discharging the process material stored in each of the four tanks 110a-110d at different flow rates is to allow tanks 110a-110d to experience the depletion and replacement of the process material sequentially rather than simultaneously.

[0065] As canisters 110a-110d are replaced sequentially, process materials can be supplied to the semiconductor manufacturing apparatus 10 effectively and stably without interruption, and multiple canisters 110a-110d can be effectively maintained.

[0066] The controller 160 controls multiple flow control devices 130a-130d to operate at different opening rates, so that the flow ratio of each tank 110a-110d can be reflected as set as described above (S200).

[0067] Next, as Figure 2 As shown, the controller 160 measures and monitors the flow rate GF and the supply pressure of the process material supplied to the semiconductor manufacturing apparatus 10 through the main supply pipe 120a via the sensor 140. At this time, the measurement by the sensor 140 can be performed in real time or at regular time intervals under the control of the controller 160 (S300).

[0068] Next, as Figure 2 As shown, during the process of monitoring the process material flow rate GF and process material supply pressure supplied to the semiconductor manufacturing apparatus 10 through the main supply pipe 120a, the controller 160 determines whether there is an anomaly, that is, whether the measured process material flow rate GF (or the measured process material supply pressure) is the same as the set process material flow rate GF (or the set process material supply pressure) within a predetermined range.

[0069] Here, the predetermined range can be changed depending on the manufacturing process or field operation, and can generally be determined within the range of 5% to 10% based on the process material flow rate GF (or process material supply pressure) set to be supplied to the semiconductor manufacturing apparatus 10.

[0070] First, in this step, when the controller 160 determines that the measured process material flow rate GF (or the measured process material supply pressure) is lower than the set process material flow rate GF (or the set process material supply pressure) by a predetermined range or more, the controller 160 controls the operation of the backup unit 150, such as... Figure 4 As shown. That is, the controller 160 controls the backup unit 150 to open the flow control device 150b, so that the flow rate GF corresponding to the insufficient process material flow rate (see Figure 160). Figure 4 15% of the GF) is replenished from the backup tank 150a to the main supply pipe 120a.

[0071] When the measured process material flow rate GF (measured process material supply pressure) is insufficient based on the set process material flow rate GF (set process material supply pressure) (see...) Figure 4 When 15%GF is reached, this control on the backup section 150 is immediately executed.

[0072] However, when the subsequent insufficient process material flow rate GF is not temporary and persists for a predetermined period of time or longer (e.g., 1 minute), the controller 160 cancels the aforementioned control over the backup section 150 and switches to control for increasing the opening rate of the respective flow control devices 130a-130d installed in each of the tanks 110a-110d, so that the flow rate GF corresponding to the insufficient process material flow rate (see...) Figure 4 15% of the GF) was added to the main supply pipe 120a.

[0073] Here, for all flow control devices 130a-130d, the opening rate of each flow control device 130a-130d in each tank 110a-110d can be increased simultaneously in a ratio of 4:3:2:1 corresponding to the flow ratios of tanks 110a-110d: 40%, 30%, 20%, and 10%. When the process material of a specific tank 110a-110d that is preferentially required is depleted, control can be executed to increase the opening rate of only one of the flow control devices 130a-130d corresponding to that specific tank 110a-110d.

[0074] The insufficient process material flow rate GF described above may occur due to various factors, such as temporary delays occurring in the semiconductor manufacturing apparatus 10, improper fastening in the connection of the main supply pipe 120a or the branch supply pipe 120b, internal problems of the tanks 110a-110d, and temperature changes in the surrounding environment (S410).

[0075] Conversely, in this step, when the controller 160 determines that the measured process material flow rate GF (or the measured process material supply pressure) is greater than the set process material flow rate GF (or the set process material supply pressure) by a predetermined range or greater, the controller 160 controls the respective flow control devices 130a-130d installed in each of the tanks 110a-110d.

[0076] That is, the controller 160 reduces the opening rate of the flow control devices 130a-130d installed in each tank 110a-110d, thereby fundamentally preventing the excessive discharge of process material flow rate GF from tanks 110a-110d into the main supply pipe 120a.

[0077] Here, for all flow control devices 130a-130d, the opening rate of each flow control device 130a-130d in each tank 110a-110d can be reduced in a ratio of 4:3:2:1 corresponding to the flow ratios of 40%, 30%, 20%, and 10% of the simultaneous tanks 110a-110d. When it is necessary to suppress the depletion of process material in a specific tank 110a-110d, control can be executed to reduce the opening rate of only one of the flow control devices 130a-130d corresponding to that specific tank 110a-110d.

[0078] Excessive supply of process material flow rate GF as described above may also occur due to various factors, such as operating conditions in the semiconductor manufacturing apparatus 10, improper fastening of the connection between the main supply pipe 120a or the branch supply pipe 120b, internal problems of the tanks 110a-110d, and temperature changes in the surrounding environment (S420).

[0079] When the replenishment and control of the process material flow rate GF as described above are performed, the controller 160 also measures the process material flow rate GF and the process material supply pressure supplied to the semiconductor manufacturing apparatus 10 through the main supply pipe 120a via the sensor 140, thereby monitoring whether the replenishment and control of the process material flow rate GF is being implemented normally (S400).

[0080] Next, as Figure 2 As shown, the controller 160 estimates or calculates the remaining amount of process material in each of the plurality of tanks 110a-110d by receiving information about the weight of each of the plurality of tanks 110a-110d and information about the internal pressure respectively, measured by the load sensor 112 and the pressure sensor 114 installed in each of the plurality of tanks 110a-110d in real time or at predetermined time intervals, and then continues to monitor the remaining amount of process material in each of the plurality of tanks 110a-110d (S500).

[0081] At this point, the remaining amount of process material estimated using load sensor 112 can be estimated by comparing the weight of each tank 110a-110d measured in real time while the process material is being discharged with the initial weight of each tank 110a-110d measured when the process material is completely filled therein, and by calculating the ratio obtained by applying predetermined parameters to the comparison result.

[0082] Furthermore, the remaining amount of process material estimated using pressure sensors 114 and 154 can be estimated by comparing the pressure in each tank 110a-110d, which will be measured in real time while the process material is being discharged, with the initial pressure in each tank 110a-110d, which will be measured when the process material is completely filled into it, and by calculating the ratio obtained by applying predetermined parameters to the comparison results.

[0083] Next, as Figure 2 and 5 As shown, the controller 160 determines whether the process material in a specific tank 110a is exhausted, while monitoring the remaining amount of process material in each tank 110a-110d (S600).

[0084] At this point, when it is determined that the process material in a specific tank 110a has been depleted, the controller 160 may perform the operation required to allow the replacement of the specific tank 110a. As an example, the controller 160 may send a signal or notification to inform the central system (not shown) or the person in charge of operating the semiconductor manufacturing apparatus 10 that the specific tank 110a needs to be replaced (S610).

[0085] When a specific tank 110a (first tank) is replaced in response to the replacement signal or notification from the controller 160, the controller 160 further controls the remaining semiconductor manufacturing apparatus 10 so that each of the remaining semiconductor manufacturing apparatus 10 maintains a set process material flow rate GF.

[0086] Here, additional control of the controller 160 can be achieved by controlling the backup unit 150, so that the process materials are replenished by the backup unit 150.

[0087] At this time, controller 160 controls the flow control device 150b of backup tank 150a, such that backup tank 150a supplies process material at a ratio to that previously supplied by the replaced tank 110a (first tank) (e.g., see...). Figure 3 The process material flow rate GF (e.g., 40% GF) corresponding to 40% GF is discharged into the main supply pipe 120a.

[0088] In addition, unlike the above, this additional control performed by the controller 160 can be achieved by controlling the remaining tanks 110b-110d, so that process materials are replenished from the remaining tanks 110b-110d other than the replaced tank 110a (the first tank).

[0089] At this time, controller 160 increases the opening rate of a specific flow control device among flow control devices 130b-130d, causing a specific tank among the remaining tanks 110b-110d to discharge the process material previously supplied by the replaced tank 110a (first tank) into the main supply pipe 210a at a rate (e.g., see...). Figure 3 40% of GF). This discharge can be achieved by allocating flow rates based on the distribution ratio of each remaining tank 110b-110d (see Figure 3 The additional flow rate ratios (reference 30%GF, 20%GF, 10%GF) are allocated to each remaining tank 110b-110d. Figure 3 This is achieved by successively adding 20% ​​GF to 30% GF, adding 13.3% GF to 20% GF, and adding 6.7% GF to 10% GF.

[0090] Finally, when the replacement of tank 110a (the first tank) is complete, as follows: Figure 2 and 5 As shown, controller 160 controls each of flow control devices 130a-130d according to a predetermined flow ratio of each of tanks 110a-110d, so that process materials are supplied to semiconductor manufacturing apparatus 10.

[0091] At this time, as Figure 5 As shown above, Figure 3In contrast, when four tanks 110a-110d are set, namely the first, second and fourth tanks 110a-110d, the determined flow rate ratio of each tank 110a-110d can be changed by the controller 160 so that the process material in the remaining tanks 110b-110d, except for the first tank 110a which is replaced, is depleted sequentially.

[0092] In other words, controller 160 controls each flow control device 130a-130d such that the first, second, third and fourth tanks 110a-110d discharge 10%, 40%, 30% and 20% of the process material flow rate GF, respectively, based on the process material flow rate GF (100% GF) supplied to the semiconductor manufacturing apparatus 10 through the main supply pipe 120a.

[0093] As mentioned above, with Figure 3 The process material stored in each of the four tanks 110a-110d is discharged at a different flow rate to prevent two or more of the four tanks 110a-110d from being replaced simultaneously. As a result, since the tanks 110a-110d may experience the depletion and replacement of process material not simultaneously but sequentially, the process material can be supplied to the semiconductor manufacturing apparatus 10 efficiently and stably without interruption.

[0094] The change in the flow rate ratio of each of the tanks 110a-110d as described above can be reflected by controlling multiple flow control devices 130a-130d by the controller 160, so that the multiple flow control devices 130a-130d operate at different opening rates, and subsequent processes can be continuously executed by repeating the above process, such as... Figure 2 As shown.

[0095] By operating the supply control system 100 for tanks disclosed herein according to a series of control operations of the controller 160 as described above, for example, the problem of unbalanced process material discharge caused by internal pressure differences between multiple tanks 110a-110d, and the problem of process material quality in some tanks 110a-110d due to long-term non-use or low use can be effectively solved.

[0096] While the invention has been described with respect to preferred embodiments, it should be understood that various modifications of the invention will become apparent to those skilled in the art upon reading this specification. Therefore, it should be understood that the disclosure herein is intended to cover such modifications or variations falling within the scope of the appended claims.

[0097] [Symbol Explanation]

[0098] 10: Semiconductor manufacturing equipment

[0099] G: Process Materials

[0100] GF: Process material flow rate

[0101] 100: Supply control system for tanks

[0102] 110a-110d: Tanks, namely, the first, second, third, and fourth tanks.

[0103] 112,152: Load sensor

[0104] 114, 144, 154: Pressure sensors

[0105] 120a: Main supply pipe

[0106] 120b: Sub-supply pipe

[0107] 130a-130d: Flow control device

[0108] 140: Sensor

[0109] 142: Flow meter

[0110] 150: Backup Part

[0111] 150a: Rear Spare Tank

[0112] 150b: Flow control device

[0113] 160: Controller

Claims

1. A supply control system for tanks, comprising: a plurality of tanks storing a large amount of process materials for manufacturing semiconductors; a main supply pipe configured to communicate with sub-supply pipes respectively coupled to the plurality of tanks, and to supply process materials to a semiconductor manufacturing apparatus; a plurality of flow control devices respectively included in the sub-supply pipes, and configured to control a flow rate of process materials discharged from each of the plurality of tanks; a sensor included in the main supply pipe, and configured to measure a flow rate of process materials and a process material supply pressure supplied from each of the plurality of tanks to the semiconductor manufacturing apparatus in real time; a backup portion coupled to the main supply pipe, and configured to complementarily discharge stored process materials so that process materials are stably supplied to the semiconductor manufacturing apparatus; and a controller configured to control the plurality of flow control devices and the backup portion based on information about the flow rate of process materials or information about the process material supply pressure measured by the sensor, so that a set flow rate of process materials is supplied to the semiconductor manufacturing apparatus through the main supply pipe.

2. The supply control system for tanks according to claim 1, wherein the controller is configured to control the plurality of flow control devices so as to operate at different opening rates, so that process materials stored in the plurality of tanks are discharged from the plurality of tanks at different flow rates, and the plurality of tanks are sequentially depleted.

3. The supply control system for tanks according to claim 2, wherein the plurality of tanks and the backup portion include at least one of a load sensor configured to measure a weight of each of the plurality of tanks and the backup portion, the weight varying according to discharge of stored process materials, or a pressure sensor configured to measure an internal pressure of each of the plurality of tanks and the backup portion, the internal pressure varying according to discharge of stored process materials, to estimate a remaining amount of stored process materials.

4. The supply control system for tanks according to claim 2, wherein the controller is configured to control the backup portion to complementarily supply process materials when there is an abnormality in the information about the flow rate of process materials and the information about the process material supply pressure measured by the sensor.

5. The supply control system for tanks according to claim 2, wherein the controller is configured to control the backup portion to complementarily supply process materials when a specific one of the plurality of tanks is replaced according to sequential process material depletion of the plurality of tanks.

6. The supply control system for tanks according to claim 2, wherein when the plurality of tanks include a first tank, a second tank, a third tank, and a fourth tank, the controller is configured to control each of the plurality of flow control devices based on the flow rate of process materials set to be supplied to the semiconductor manufacturing apparatus through the main supply pipe, so that the first tank, the second tank, the third tank, and the fourth tank respectively discharge 40%, 30%, 20%, and 10% of the flow rate of process materials.

7. The supply control system for tanks of claim 6, wherein the controller is configured to control each of the plurality of flow control devices based on a set flow rate of process material supplied to the semiconductor manufacturing device through the main supply line such that when a changeover of the first tank is completed according to depletion of process material stored in the first tank, the first, second, third, and fourth tanks discharge 10%, 40%, 30%, and 20% of the process material flow rate, respectively.

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