Laser plasma-based cleaning method for micro-nano particles in water environment

Abstract

The present application relates to a method for cleaning micro-nano particles in an aqueous environment based on laser plasma, comprising: constructing an aqueous environment simulation model; performing a cleaning simulation of the particle model in the aqueous environment based on laser plasma, obtaining first evolution law information of particles in different force angle regions under the influence of shock waves, and second evolution law information of particles in different force angle regions under the influence of particle diameter; based on the first evolution law information and the second evolution law information, obtaining a first relationship diagram between the stress, force angle, and particle diameter of the particles during the underwater cleaning process, and a second relationship diagram between the degree of particle fragmentation, force angle, and particle diameter; analyzing the first relationship diagram and the second relationship diagram to obtain the optimal force angle regions for particles of different particle diameters, and performing particle cleaning based on the optimal force angle regions for particles of different particle diameters. The present method can improve the cleaning effect of micro-nano particles.

Description

Technical Field

[0001] The present application relates to the field of laser cleaning technology, and in particular to a method, apparatus, computer equipment, storage medium, and computer program product for cleaning micro-nano particles in an aqueous environment based on laser plasma. Background Art

[0002] Laser plasma cleaning utilizes laser-generated plasma, where shockwaves from the plasma react physically or chemically with the surface of the product to achieve cleaning results. Compared to traditional laser cleaning, plasma shockwave removal offers several advantages, including high efficiency, environmental friendliness, and the ability to avoid substrate damage. It has become a research hotspot.

[0003] Currently, research on laser plasma cleaning methods focuses on the forces acting on particles during removal and the effects after removal. However, there is relatively little research on the removal objects themselves—the "particles." Furthermore, the focus is on removal in an air environment. Therefore, the factors considered in cleaning methods based on existing research results are relatively limited. In particular, there is even less research on the phase change, evolution, and removal patterns of particles under the action of laser plasma. The lack of water environment cleaning makes it difficult to guarantee the cleaning effect on particles. Summary of the Invention

[0004] Based on this, it is necessary to provide a method, device, computer equipment, computer-readable storage medium and computer program product for cleaning micro-nano particles based on laser plasma in an aqueous environment to address the technical problem that the above method is difficult to ensure the cleaning effect of particles.

[0005] In a first aspect, the present application provides a method for cleaning micro-nanoparticles in an aqueous environment based on laser plasma. The method comprises:

[0006] Constructing a water environment simulation model; the water environment simulation model includes a particle model, a substrate model and a water model, the water model is arranged above the particle model and the substrate model, and an area for simulating a plasma explosion is set in the water of the water model;

[0007] Based on the laser plasma, a cleaning simulation of the particle model in a water environment is performed to obtain first evolution law information of the particles in different force angle regions under the influence of shock waves, and second evolution law information of the particles in different force angle regions under the influence of particle diameter;

[0008] Obtaining, based on the first evolution law information and the second evolution law information, a first relationship diagram between the stress on the particles, the stress angle, and the particle diameter during the underwater cleaning process, and a second relationship diagram between the degree of particle breakage, the stress angle, and the particle diameter;

[0009] The first relationship diagram and the second relationship diagram are analyzed to obtain optimal force angle regions for particles with different particle diameters, and particle cleaning is performed based on the optimal force angle regions for particles with different particle diameters.

[0010] In one embodiment, the laser plasma-based cleaning simulation of the particle model in a water environment to obtain first evolution law information of particles in different force angle regions under the influence of shock waves includes:

[0011] Performing a cleaning simulation of the particle model in an aqueous environment based on laser plasma to obtain a first stress and temperature distribution diagram of the water in the regions with different force angles, and a second stress and temperature distribution diagram of the particles in the regions with different force angles during the underwater cleaning process;

[0012] Performing simulation analysis on particles in each force angle region to obtain an evolution diagram of the particles in each force angle region;

[0013] Based on the first stress and temperature distribution diagram, the second stress and temperature distribution diagram and the evolution diagram, first evolution law information of particles in different force angle regions under the influence of shock waves is analyzed and obtained.

[0014] In one embodiment, the simulation analysis of particles in each force angle region to obtain an evolution diagram of particles in each force angle region includes:

[0015] Performing simulation analysis on particles in each force-bearing angle region to obtain force diagrams and crushing diagrams of the particles in each force-bearing angle region;

[0016] Based on the force diagram and the crushing diagram, a physical evolution diagram of the particles in each force angle region is obtained.

[0017] In one embodiment, the laser plasma-based cleaning simulation of the particle model in a water environment is performed to obtain second evolution law information of particles in different force angle regions under the influence of particle diameter, including:

[0018] Based on the laser plasma, a cleaning simulation is performed on the particles in each stress angle region to obtain a particle size variation pattern of the particles in each stress angle region; the particle size variation pattern shows the relationship between the degree of particle fragmentation, the stress experienced, and the particle diameter;

[0019] The particle size variation regularity diagram of the particles in each force angle region is analyzed to obtain the second evolution regularity information of the particles in the different force angle regions under the influence of the particle diameter.

[0020] In one embodiment, the method further comprises:

[0021] Obtaining an experimental substrate with experimental particles, and placing the experimental substrate in a container filled with deionized water;

[0022] emitting laser light through an experimental device to perform a cleaning experiment on the experimental particles on the experimental substrate in water, and obtaining surface morphology images and energy spectrum images of the experimental substrate before and after cleaning;

[0023] Based on the surface morphology and energy spectrum of the experimental substrate before and after cleaning, the removal effect of the experimental particles in different force angle areas is analyzed;

[0024] Based on the removal effect, the optimal removal angle regions for particles with different particle diameters are verified.

[0025] In one embodiment, the particle cleaning based on the optimal force angle area of ​​the particles with different particle diameters includes:

[0026] Obtaining the particle diameter and particle position of the particles to be cleaned; the particle position represents the position of the particles to be cleaned in the substrate to be cleaned;

[0027] Determining a target force angle corresponding to the particles to be cleaned based on the particle diameter and the optimal force angle range for particles with different particle diameters; the target force angle is the angle between the explosion point of the plasma generated by the laser in water and the particle position of the particles to be cleaned;

[0028] The irradiation direction of the laser is determined according to the target force angle and the position of the particle, and the laser is emitted according to the irradiation direction to clean the particles to be cleaned in a water environment.

[0029] In a second aspect, the present application also provides a device for cleaning micro-nano particles in an aqueous environment based on laser plasma. The device comprises:

[0030] A construction module is used to construct a water environment simulation model; the water environment simulation model includes a particle model, a substrate model and a water model, the water model is arranged above the particle model and the substrate model, and an area for simulating a plasma explosion is set in the water of the water model;

[0031] a simulation module for performing a cleaning simulation of the particle model in a water environment based on laser plasma, to obtain first evolution law information of the particles in different force angle regions under the influence of shock waves, and second evolution law information of the particles in different force angle regions under the influence of particle diameters;

[0032] a determination module configured to obtain, based on the first evolution law information and the second evolution law information, a first relationship diagram between the stress exerted on the particles, the force angle, and the particle diameter, and a second relationship diagram between the degree of particle fragmentation, the force angle, and the particle diameter during the underwater cleaning process;

[0033] An analysis module is used to analyze the first relationship diagram and the second relationship diagram to obtain the optimal force angle areas of particles with different particle diameters, and perform particle cleaning based on the optimal force angle areas of particles with different particle diameters.

[0034] In a third aspect, the present application further provides a computer device. The computer device includes a memory and a processor, wherein the memory stores a computer program, and when the processor executes the computer program, the following steps are performed:

[0035] Constructing a water environment simulation model; the water environment simulation model includes a particle model, a substrate model and a water model, the water model is arranged above the particle model and the substrate model, and an area for simulating a plasma explosion is set in the water of the water model;

[0036] Based on the laser plasma, a cleaning simulation of the particle model in a water environment is performed to obtain first evolution law information of the particles in different force angle regions under the influence of shock waves, and second evolution law information of the particles in different force angle regions under the influence of particle diameter;

[0037] Obtaining, based on the first evolution law information and the second evolution law information, a first relationship diagram between the stress on the particles, the stress angle, and the particle diameter during the underwater cleaning process, and a second relationship diagram between the degree of particle breakage, the stress angle, and the particle diameter;

[0038] The first relationship diagram and the second relationship diagram are analyzed to obtain optimal force angle regions for particles with different particle diameters, and particle cleaning is performed based on the optimal force angle regions for particles with different particle diameters.

[0039] In a fourth aspect, the present application further provides a computer-readable storage medium having a computer program stored thereon, which, when executed by a processor, implements the following steps:

[0040] Constructing a water environment simulation model; the water environment simulation model includes a particle model, a substrate model and a water model, the water model is arranged above the particle model and the substrate model, and an area for simulating a plasma explosion is set in the water of the water model;

[0041] Based on the laser plasma, a cleaning simulation of the particle model in a water environment is performed to obtain first evolution law information of the particles in different force angle regions under the influence of shock waves, and second evolution law information of the particles in different force angle regions under the influence of particle diameter;

[0042] Obtaining, based on the first evolution law information and the second evolution law information, a first relationship diagram between the stress on the particles, the stress angle, and the particle diameter during the underwater cleaning process, and a second relationship diagram between the degree of particle breakage, the stress angle, and the particle diameter;

[0043] The first relationship diagram and the second relationship diagram are analyzed to obtain optimal force angle regions for particles with different particle diameters, and particle cleaning is performed based on the optimal force angle regions for particles with different particle diameters.

[0044] In a fifth aspect, the present application further provides a computer program product. The computer program product includes a computer program that, when executed by a processor, implements the following steps:

[0045] Constructing a water environment simulation model; the water environment simulation model includes a particle model, a substrate model and a water model, the water model is arranged above the particle model and the substrate model, and an area for simulating a plasma explosion is set in the water of the water model;

[0046] Based on the laser plasma, a cleaning simulation of the particle model in a water environment is performed to obtain first evolution law information of the particles in different force angle regions under the influence of shock waves, and second evolution law information of the particles in different force angle regions under the influence of particle diameter;

[0047] Obtaining, based on the first evolution law information and the second evolution law information, a first relationship diagram between the stress on the particles, the stress angle, and the particle diameter during the underwater cleaning process, and a second relationship diagram between the degree of particle breakage, the stress angle, and the particle diameter;

[0048] The first relationship diagram and the second relationship diagram are analyzed to obtain optimal force angle regions for particles with different particle diameters, and particle cleaning is performed based on the optimal force angle regions for particles with different particle diameters.

[0049] The above-mentioned method, device, computer equipment, storage medium and computer program product for cleaning micro-nano particles based on laser plasma in an aqueous environment, by constructing a water environment simulation model to perform particle cleaning simulation, obtain first evolution law information of particles in different force angle regions under the influence of shock waves, and second evolution law information of particles in different force angle regions under the influence of particle diameter. Further, based on the first evolution law information and the second evolution law information, a first relationship diagram between the stress, force angle and particle diameter of the particles during the underwater cleaning process, and a second relationship diagram between the degree of particle fragmentation, force angle and particle diameter are obtained. The mapping relationship between particle diameter and force angle is analyzed by the first relationship diagram and the second relationship diagram. Therefore, for the cleaning of any particles to be cleaned, the optimal laser irradiation direction to ensure the cleaning effect can be determined in advance based on the mapping relationship, thereby improving the cleaning effect and cleaning efficiency of micro-nano particles in an aqueous environment. BRIEF DESCRIPTION OF THE DRAWINGS

[0050] Figure 1 1 is a schematic flow chart of a method for cleaning micro-nanoparticles in an aqueous environment based on laser plasma in one embodiment;

[0051] Figure 2 Schematic diagram of a first relationship diagram and a second relationship diagram in one embodiment, wherein (a) is the first relationship diagram and (b) is the second relationship diagram;

[0052] Figure 3 Schematic diagram of the phase change and evolution of particles in different force angle regions in one embodiment;

[0053] Figure 4 A diagram showing simulation results obtained by simulating cleaning of a particle model in a water environment based on laser plasma in one embodiment;

[0054] Figure 5.1 This is a physical evolution diagram of particles in the 0° region in one embodiment;

[0055] Figure 5.2 This is a chemical evolution diagram of particles in the 0° region in one embodiment;

[0056] Figure 6 This is a physical evolution diagram of particles in the 45° region in one embodiment;

[0057] Figure 7 This is a physical evolution diagram of particles in the 60° region in one embodiment;

[0058] Figure 8.1 A graph showing the particle size variation of particles in the 0° region in one embodiment;

[0059] Figure 8.2A graph showing the particle size variation of particles in the 45° region in one embodiment;

[0060] Figure 8.3 A graph showing the particle size variation of particles in the 60° region in one embodiment;

[0061] Figure 9 A schematic diagram of an experimental device in one embodiment;

[0062] Figure 10 Schematic diagram of the surface morphology of an experimental substrate before and after cleaning in one embodiment;

[0063] Figure 11.1 This is a diagram showing the removal effect of particles in the 0-30° region in one embodiment;

[0064] Figure 11.2 This is an energy spectrum diagram of particles in the 0-30° region in one embodiment;

[0065] Figure 11.3 This is a diagram showing the particle removal effect in the 30-45° region in one embodiment;

[0066] Figure 11.4 This is a diagram showing the particle removal effect in the 45-60° region in one embodiment;

[0067] Figure 12 Schematic diagram of a process for cleaning micro-nanoparticles in an aqueous environment based on laser plasma in one embodiment;

[0068] Figure 13 1 is a block diagram of a device for cleaning micro-nano particles in an aqueous environment based on laser plasma in one embodiment;

[0069] Figure 14 FIG. 1 is a diagram showing the internal structure of a computer device in one embodiment. DETAILED DESCRIPTION

[0070] In order to make the purpose, technical solutions and advantages of this application more clear, the following further describes this application in detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain this application and are not intended to limit this application.

[0071] It should be noted that the terms "first," "second," and the like in the specification and claims of this application and the accompanying drawings are used to distinguish similar objects and are not necessarily used to describe a specific order or precedence. It should be understood that the terms used in this manner are interchangeable where appropriate, such that the embodiments of the present application described herein can be implemented in an order other than that illustrated or described herein.

[0072] Research on the removal of micro- and nanoparticles by laser plasma shock waves in air has revealed various issues, including poor removal of smaller particles, a large amount of residue remaining on the substrate after removal, and secondary contamination caused by the shattered particles scattered across the substrate. Underwater laser plasma shock wave removal can effectively improve these issues. Currently, research on laser plasma shock waves is limited, both domestically and internationally, and falls into two main categories: the first focuses on the generation of plasma cavitation by laser breakdown in liquids, and the second focuses on the characteristics of plasma shock waves in liquids. However, both types of research primarily focus on theoretical derivations and summaries, and in practical applications, are primarily used for underwater communications and seabed exploration. Currently, this technology has not been applied to the cleaning of micro- and nanoparticles. There is no summary of the cleaning effectiveness of laser plasma shock waves in liquids, nor the evolution of particles in liquids under the action of shock waves.

[0073] Therefore, based on air plasma shock wave removal, this application places silicon wafers in water. By observing the morphological distribution of the substrate after cleaning and theoretically analyzing the physical and chemical effects on particles during removal, a complete particle removal process is obtained. At the same time, by comparing the removal process and results of particles of different sizes in different regions, a set of particle evolution processes and corresponding removal thresholds are summarized, which can provide a reference for plasma shock wave cleaning technology in liquids.

[0074] In one embodiment, Figure 1 As shown, a method for cleaning micro-nanoparticles based on laser plasma in an aqueous environment is provided. This embodiment uses the method applied to a terminal as an example for illustration. It is understandable that the method can also be applied to a server, and can also be applied to a system including a terminal and a server, and is implemented through the interaction between the terminal and the server. Among them, the terminal can be, but is not limited to, various personal computers, laptops, smart phones, tablets, Internet of Things devices and portable wearable devices. The Internet of Things devices can be smart speakers, smart TVs, smart air conditioners, smart car-mounted devices, etc. Portable wearable devices can be smart watches, smart bracelets, head-mounted devices, etc. The server can be implemented as an independent server or a server cluster consisting of multiple servers. In this embodiment, the method includes the following steps:

[0075] Step S110, constructing a water environment simulation model; the water environment simulation model includes a particle model, a substrate model and a water model, the water model is set above the particle model and the substrate model, and an area for simulating plasma explosion is set in the water of the water model.

[0076] In this step, the simulation model is a finite element model, and the water environment simulation model can be constructed by finite element software to analyze the phase change of the particles.

[0077] For example, the substrate can be a Si (silicon) substrate, and the particles can be Al (aluminum) particles. During the construction process, the Si substrate is first constructed. The Si substrate measures 50μm × 50μm × 30μm, with the bottom surface set as a fixed point. The Al particles are then built on the Si substrate. Next, a water model is built above the particles and the substrate, with the same length and width as the substrate but a height of 6μm. At the same time, a region is added to the water to simulate the area of ​​the plasma explosion. This region can be a hemispherical region with a radius of 2μm.

[0078] In step S120, a cleaning simulation of the particle model in a water environment is performed based on laser plasma to obtain first evolution law information of particles in different force angle regions under the influence of shock waves, and second evolution law information of particles in different force angle regions under the influence of particle diameters.

[0079] The force angle region is a region divided according to the different action angles of the laser plasma shock wave. Specifically, the force angle region can be divided into three regions: 0-30°, 30-45°, and 45-60°.

[0080] In a specific implementation, stress can be applied to a region designed to simulate a plasma explosion, and the position of particles below the explosion region can be moved accordingly. This can simulate the stress conditions of particles in regions with different stress angles. Further analysis based on the stress conditions can reveal the first evolution law of particles in regions with different stress angles under the influence of shock waves, as well as the second evolution law of particles in regions with different stress angles under the influence of particle diameter. The various water parameters are shown in Table 1 below.

[0081] Table 1 Water related parameters

[0082]

[0083] In step S130, based on the first evolution law information and the second evolution law information, a first relationship diagram between the stress on the particles, the force angle and the particle diameter during the underwater cleaning process is obtained, as well as a second relationship diagram between the degree of particle breakage, the force angle and the particle diameter.

[0084] Specifically, the first evolutionary pattern of particles in different stress-angle regions under the influence of shock waves includes: Particles in the 0-45° region show similar levels of damage, but undergo different phase transitions. The phase transition for particles in the 0-30° region is primarily characterized by high-temperature melting and stress failure at the base, while the phase transition for particles in the 30-45° region is primarily characterized by friction and stress failure at the base. Particles in the 60° region experience minimal damage, as the shock wave travels a short distance, resulting in a rapid decrease in stress and almost no noticeable phase transition.

[0085] The second evolution law information of particles in different force angle areas under the influence of particle diameter may include: as the particle size increases, it shows a trend of first getting bigger and then getting smaller in the small angle area and the 0-30° area, while it shows a trend of first getting smaller and then getting bigger in the medium angle and 30-45° area, and the outer angles basically do not change because the force is too small.

[0086] Based on the evolution law information of particles of different sizes in different regions obtained from the above simulation, and by summarizing more data, a first relationship diagram between the stress, force angle and particle diameter of the particles during the underwater cleaning process can be obtained. After obtaining the first relationship diagram, the yield stress curve can be added to the first relationship diagram, and the two can be combined for analysis to obtain a second relationship diagram between the degree of particle fragmentation, force angle and particle diameter.

[0087] Step S140 , analyzing the first relationship diagram and the second relationship diagram to obtain optimal force angle regions for particles with different particle diameters, and performing particle cleaning based on the optimal force angle regions for particles with different particle diameters.

[0088] Specifically, refer to Figure 2 , Figure 2 (a) and (b) in the figure respectively represent the first relationship diagram between the stress, the angle of force and the particle diameter, and the second relationship diagram between the degree of particle crushing, the angle of force and the particle diameter. Figure 2 Take the first relationship diagram and the second relationship diagram shown in (a) and (b) as an example, for the first relationship diagram, from Figure 2Figure (a) shows that the average stress at all angles decreases with increasing particle size. The curve from 0° to 30° is steeper and more rapid, while the remaining curves show a more gradual decline. Overall, the stress is lowest in the 50° to 60° region, likely due to excessive energy loss from the shock wave's long travel distance, resulting in a low stress on the particles. The curves of 0-30° and 40-45° can be divided into two parts at around 500nm. The stress on particles with a diameter of less than 500nm in the 0-30° region is significantly greater than that on particles in the 40-45° region. This is because the former are located in the central region and are directly impacted by the shock wave, and the stress they are subjected to is greater than that of particles outside the 45° region with a certain transmission distance. For particles larger than 500nm, as the particle size increases, the contact area is positively correlated with the square of the particle size. The increase in contact area will rapidly reduce the influence of the stress on the particles at the bottom of the substrate. However, for particles in the 40-45° region, when they are supported by the bottom substrate, they will also be affected by the friction force of the bottom. On the one hand, the support stress will decrease with the increase of contact area, and on the other hand, the friction force will increase with the increase of contact area. The combination of the two will alleviate the stress drop on the particles. Therefore, as the particle size increases, the stress on particles in the farther area will gradually become equal to or even exceed the stress on particles in the central area.

[0089] For the second relationship diagram, Figure 2 The first relationship diagram in (a) is added with the yield stress curve, and the two are combined to obtain Figure 2 The second relationship diagram shown in (b) in FIG. Figure 2As can be seen in (b), the trend of the curve is different from the stress distribution. Except for the 0-30° region, the degree of damage in all other regions increases with the increase of particle size. The degree of crushing represented by the curve in the 0° region first increases and then decreases with the increase of particle size, while the curve in the 30° region decreases with the increase of particle size before the particle size reaches 600nm. However, after the particle size exceeds 600nm, the degree of crushing increases with the increase of particle size, which is consistent with the curves in other regions. This is because although the 30° region is still in the central area, at the junction, the particles here are also affected by the main friction force of the substrate. The presence of friction will slow down the trend of stress reduction, so that the stress of the large particles in the 30° region will be greater than their yield stress, so the degree of crushing will also increase. The degree of crushing corresponding to the curve distribution in the 40-45° region increases with the increase of particle size. In the 50-60° region, while the degree of fragmentation at 50° increases slightly compared to 45°, there is still a sign of an increase. As a boundary region, the stress on the particles in this region has been reduced due to the transmission distance, but the influence of particle size still exists. The 60° region shows almost no signs of fragmentation. Regarding the overall size, the 50-60° region shows the least fragmentation, with almost no fragmentation at all. The curves for the other two regions can also be divided at 200nm and 600nm. For small particles (less than 200nm), the stress in the central region is greater than the yield stress at this point, while the stress in the more distant regions is less than the yield stress, resulting in the greatest degree of fragmentation in the central region. For medium particles (between 200nm and 600nm), as the stress and yield stress decrease, the fragmentation degree of the two regions is similar. However, for particles in the 0-30° region, the degree of fragmentation decreases with increasing particle size, while the opposite is true for particles in the 40-45° region. The stress on the final large particles (particle size greater than 600nm) in the 0° region is less than the yield stress, while the stress on the particles at 40-45° is still greater than the yield stress. Therefore, the degree of crushing alternates between the two, and the particles at 40-45° are larger.

[0090] Based on the above research and analysis, we can roughly classify and organize the removal of underwater particles, as follows: Figure 3 Schematic diagram of phase change and evolution of particles in different force angle regions shown.

[0091] First, the particles in the 0-30° area have a very good removal effect on small particles, which are mainly crushed and then swept into water for cleaning; the degree of crushing of medium particles has decreased, but there are still obvious signs of crushing. When the particles are bounced up by force, fragments will remain on the base to form residues, appearing as various square and round black spots, and the undamaged parts will be washed away by the water flow and will not remain on the base; the large particles have a reduced degree of crushing, but due to the overall large stress, most of them will be directly removed by the scouring of water, and the remaining particles will undergo a melting oxidation reaction at the top due to the small degree of crushing and the surface is affected by excessive high temperature, forming "round cap-shaped" particles.

[0092] For particles in the 30-45° region, small particles cannot be crushed and removed due to the low force and high yield stress. Furthermore, the small shock wave also means the water flow is slow, which cannot effectively wash away the small particles, resulting in a large amount of residue on the substrate. Medium particles, on the other hand, show obvious signs of damage at the bottom due to the support and friction of the substrate. At the same time, due to sliding and rolling removal, the residue will draw a line on the substrate, forming a "comet"-shaped black spot. Some of the remaining fragments are carried away by the water flow, while others move to more peripheral areas. Large particles are most severely broken. After being broken, the large particles will become various small particles and fragments, which will then cluster together to form the residue that has not been removed on the substrate.

[0093] Finally, there is the 45-60° area. The small, medium and large particles in this area cannot be effectively affected by the shock wave, so there is almost no breakage and reaction. Only some particles tend to be removed under the action of water flow, and often a black spot at the original position is left on the substrate. However, since the particles do not leave the substrate itself, there is no cleaning effect.

[0094] Based on the above conclusions, we can find the optimal removal angles for different particles. For example, the optimal removal angle range for large particles (d>500nm) is 30-45 degrees, while the optimal removal range for small particles (d<500nm) is 0-30 degrees. This is significantly different from the removal results in air. After determining the optimal removal angle ranges for different particle sizes, subsequent particle cleaning can be performed based on this correspondence, using the optimal removal angles for different particle sizes to improve particle cleaning effectiveness.

[0095] In the above-mentioned method for cleaning micro-nano particles based on laser plasma in an aqueous environment, a water environment simulation model is constructed to simulate the cleaning of particles, and the first evolution law information of particles in different force angle areas under the influence of shock waves and the second evolution law information of particles in different force angle areas under the influence of particle diameter are obtained. Further, based on the first evolution law information and the second evolution law information, a first relationship diagram between the stress, force angle and particle diameter of the particles during the underwater cleaning process and a second relationship diagram between the degree of particle fragmentation, force angle and particle diameter are obtained. The mapping relationship between particle diameter and force angle is analyzed by the first relationship diagram and the second relationship diagram. Therefore, for the cleaning of any particles to be cleaned, the optimal laser irradiation direction to ensure the cleaning effect can be determined in advance according to the mapping relationship, thereby improving the cleaning effect and cleaning efficiency of micro-nano particles in an aqueous environment.

[0096] In an exemplary embodiment, in step S120, the cleaning simulation of the particle model in a water environment is performed based on the laser plasma to obtain first evolution law information of the particles in different force angle regions under the influence of the shock wave, including:

[0097] Step S121, based on laser plasma, a cleaning simulation is performed on the particle model in an aqueous environment to obtain a first stress and temperature distribution diagram of water in different stress angle regions during the underwater cleaning process, as well as a second stress and temperature distribution diagram of particles in different stress angle regions.

[0098] Specifically, refer to Figure 4 , is a simulation result diagram obtained by performing a cleaning simulation of a particle model in a water environment based on laser plasma in one embodiment, Figure 4 The upper part is the first stress and temperature distribution diagram of water corresponding to the areas of 0°, 45°, 60°, etc., and the lower part is the second stress and temperature distribution diagram of particles corresponding to the areas of 0°, 45°, 60°, etc. The analysis of the first stress and temperature distribution diagram and the second stress and temperature distribution diagram is as follows.

[0099] for Figure 4The upper part shows the first stress and temperature distribution of water in different regions. Based on the stress distribution diagram, it can be seen that the 0° region, located directly below the explosion area, is the main stress-bearing part, close to 50MPa. Going to the right, it can be seen that the 45° region can also receive a certain shock wave stress, but the value is reduced to around 40MPa. However, if it goes further to the right, when it reaches the 60° region, the shock wave has hardly propagated there, and the stress there is almost 0. This is because the density of water is much greater than that of air. For the transmission of shock waves, the transmission of longitudinal waves relies on the propagation method of one particle colliding with the next particle. The energy of the shock wave will decrease after each collision with a particle. The more particles per unit space, the faster the shock wave energy decreases. Therefore, for the farther 60° region, the shock wave has already traveled a long distance and most of its energy has been absorbed by the water molecules, so there is no obvious stress distribution. As for the temperature distribution, in the center, the temperature propagates vertically downward rapidly, reaching the base immediately, similar to the stress. The highest temperature here is close to 550K. However, the temperature in the 45° region drops very rapidly, reaching only around 450K. Further out, the temperature in the 60° region drops even more sharply, only reaching around 340K. This is because temperature propagates via thermal radiation. Due to the large specific heat capacity of water and its boiling point of only 400K, the propagation of temperature in water rapidly dissipates heat. Furthermore, water with excessively high temperatures will evaporate without further propagation. Therefore, the temperature underwater is much lower than in air.

[0100] for Figure 4The second stress and temperature distribution diagram of particles in different areas shown in the lower half corresponds to the previous water propagation. In the 0° area, the stress on the particles is the largest, and because the particles are in contact with the substrate and the contact area is small, there will be a larger stress part at the bottom of the particles. At the same time, the particles receive stress directly above, so both sides of the bottom will receive the same magnitude of reaction force; the particles in the 45° area are subjected to force at an inclination angle, so the part of the particles relative to the substrate is also mainly subjected to the reaction force on the side opposite to the shock wave, so only one side of the bottom of the particle has a more obvious stress distribution, but because the overall 45° shock wave stress is smaller, the stress on the particles is also significantly smaller than that of the particles in the 0° area; and the particles in the last 60° area are subjected to very small stress due to the small shock wave stress themselves, so there is no obvious effect on the stress distribution of the particles themselves. The temperature distribution of the particles also corresponds to the propagation of temperature in water. The temperature of the particles in the 0° area propagates from top to bottom, and the temperature of the top part that is first affected is the highest. The particles in the 45° area propagate from the upper left to the lower left, and the overall temperature decreases significantly. The temperature propagation method of the 60° area is similar to that of 45°, except that the temperature drops again.

[0101] The main reason for the above distribution is that the shock wave propagates rapidly underwater, so we can further perform separate simulation analysis on particles in different areas.

[0102] Step S122 , performing simulation analysis on the particles in each force angle region to obtain an evolution diagram of the particles in each force angle region.

[0103] Furthermore, in an exemplary embodiment, step S122 performs simulation analysis on the particles in each force angle region to obtain an evolution diagram of the particles in each force angle region, including: performing simulation analysis on the particles in each force angle region to obtain a force diagram and a fragmentation diagram of the particles in each force angle region; and obtaining an evolution diagram of the particles in each force angle region based on the force diagram and the fragmentation diagram.

[0104] Among them, in the 0° region, the evolution diagram of the particles may include a physical evolution diagram and a chemical evolution diagram, while in the 45° region and the 60° region, due to the influence of the transmission distance and the heat dissipation of water when the shock wave is transmitted to these regions, the temperature of the particles in these two regions is lower than their melting threshold, so there will be no melting oxidation reaction. Therefore, the evolution diagram of the particles in these two regions mainly includes a physical evolution diagram.

[0105] Specifically, separate simulation analysis is performed on the particles in each force angle area, and the simulation results are as follows:

[0106] refer to Figure 5.1, is a physical evolution diagram of particles in the 0° region shown in an embodiment. First, the stresses received by the particles are decomposed into two forces to obtain stresses in the vertical direction (Z direction) and stresses in the horizontal direction (X direction). After respectively mapping the stresses in the two directions, it can be seen that for the stress in the vertical direction, the top of the particle is subjected to positive stress (tensile stress) and stress in the vertical direction downward. This is because the particle is just at the bottom of the shock wave; the bottom of the particle is subjected to negative stress (compressive stress) and stress in the vertical direction upward. When the particle is squeezed by the shock wave and the base is squeezed, the base will also give the particle a supporting force in one direction, so the particle will also be subjected to a reaction force from the base, and since the particle is uniformly stressed vertically, the base also has a uniform reaction force on the particle, so the forces received by both sides of the bottom of the particle are symmetrical. As for the horizontal direction, since the particles are mainly subjected to vertical stress, there is no obvious stress distribution in the horizontal direction. Combining the forces in the two directions, it can be obtained that the particles in the 0° region are mainly subjected to the pressure of the shock wave from top to bottom and the support force of the base from bottom to top. Using the particle's yield stress as a threshold value in the particle's stress intensity cloud, the portion exceeding the threshold will appear gray, indicating that the stress at this location has exceeded its yield limit, indicating physical fracture and breakage. The figure shows severe signs of breakage at the bottom of the particle. This is because the contact area between the particle and the substrate is small. Under the pressure from the top, the stress at the contact point between the substrate and the particle also increases significantly. Therefore, compared to the top of the particle, which is directly subjected to the stress, the stress at the bottom of the particle is greater, and therefore the bottom of the particle is also the primary site of damage.

[0107] Combining the particle force diagram and particle crushing diagram, we can get Figure 5.1 The physical evolution diagram of the particles on the right shows that the particles in this area are first affected by the vertically downward shock wave. Then, under the action of the reverse support force of the base, the particles will have a certain bounce, similar to the bounce removal in the air. The bottom of the particles are subjected to greater stress and break. The residue will form a black spot on the base, and the remaining particles will be swept into the flowing water and washed away. Therefore, there will only be a more obvious residue black spot on the base, and the particles around the black spot will be washed by the flowing water, so there is no excessive residue.

[0108] refer to Figure 5.2, is a chemical evolution diagram of particles in the 0° region shown in an embodiment. Analyzing the temperature cloud diagram of the particles in this region, the melting point of aluminum particles (922.6K) is also substituted as the threshold. The gray part at the top means that the temperature is higher than the threshold, that is, melting has occurred. It can be seen that only the top of the particle is melted to a certain extent. Therefore, the particles in this region will quickly heat up and melt under the high temperature of the shock wave, but because they are in water and the high temperature itself lasts for a very short time, the melted part of the particle will cool and solidify into a new spherical structure before it can be removed. The solidified part is at the top of the original particle, thus forming Figure 5.2 The "round cap" shaped particles on the right.

[0109] refer to Figure 6 , is a physical evolution diagram of particles in a 45° region shown in an embodiment. The same method is used to decompose the particles in the 45° region. First, in terms of vertical stress, it can be seen that the stress-bearing part of the particle has changed from the positive stress at the top to the left side, while the negative stress at the bottom has changed to the right side. This is because the particle is not directly below the shock wave but forms a 45° angle with the shock wave. The shock wave stress it receives is also correspondingly biased to the left. Since the shock wave is mainly on the left side, the right side of the base will be subjected to more pressure and will also give the particle an equal reaction force. As for horizontal stress, due to the inclination of the force applied to the particle, the top also has a horizontal positive stress (tensile stress) directed to the right. When the particle has a tendency to move to the right, the base will give the particle a frictional resistance to the left, and the bottom will correspondingly have a horizontal negative stress (compressive stress) directed to the left. Combining the two forces, it can be obtained that the particles in the 45° region are mainly subjected to a shock wave stress from the upper right to the lower left, and an equivalent stress of friction plus support force from the lower left to the upper right. The fragmentation diagram shows that the particle breaks primarily on the right side of the base, where the particle is subject to friction and support from the substrate, and the degree of fragmentation decreases significantly. This is because the total stress in this area decreases as the shock wave propagates, and the force on the base of the particle becomes less uniform, with the focus on the right side.

[0110] Combining the two analyses, we can obtain Figure 6 In the evolution diagram on the right, when the particles are subjected to a shock wave with a 45° inclination angle, the particles will roll and slide on the base to a certain extent, similar to the rolling and sliding removal in the air. The bottom fragments will also be left in the process of particle movement, so there will be a black spot with a "tail". Similarly, under the impact of the water flow, the particles as a whole will be dispersed by the water, so there will be no particles remaining in the black spot.

[0111] As for the temperature, due to the transmission of the shock wave and the heat dissipation of water, the temperature of the particles here is obviously lower than the melting threshold of the aluminum particles, so there will be no melting oxidation reaction.

[0112] refer to Figure 7 , is a physical evolution diagram of particles in the 60° region shown in an embodiment, from Figure 7 It can be seen that due to the fact that the particles in the 60° area are too far away from the explosion point of the shock wave, and the shock wave is too consumed in the water, the shock wave received by the particles at this time is also very small, so there is no obvious stress distribution in the vertical and horizontal directions. At the same time, as for the degree of crushing, the stress is too small to exceed its crushing limit, so there is no obvious sign of crushing. At the same time, in terms of temperature, the temperature of the particles in the 45° area is too low, and the temperature of the particles in this area is even lower, and no melting oxidation reaction will occur. In the end, we will get the following Figure 7 In the evolution diagram on the right, the particles move after being subjected to a certain impact stress. However, because the stress is too small, the particles cannot break and cannot roll too far, leaving only a black spot of the original particle and an incompletely removed particle next to the black spot on the substrate.

[0113] Step S123 , based on the first stress and temperature distribution graph, the second stress and temperature distribution graph and the evolution graph, first evolution law information of particles in different stress angle regions under the influence of the shock wave is analyzed and obtained.

[0114] Specifically, analysis of the first and second stress and temperature distributions and evolution diagrams above reveals that while the extent of damage to particles within the 0-45° region is similar, the phase transitions within these regions differ. For particles within the 0-30° region, the phase transition is primarily driven by high-temperature melting and stress failure at the base, while for particles within the 30-45° region, the phase transition is primarily driven by friction and stress failure at the base. For particles within the 60° region, the stress rapidly decreases due to the insufficient shock wave transmission distance, resulting in almost no noticeable phase transition. Consequently, there is virtually no sign of damage, resulting in minimal damage. This conclusion serves as information on the first evolutionary law of particles within different stress angles under the influence of shock waves.

[0115] In this embodiment, laser plasma is used to simulate the cleaning of a particle model in an aqueous environment to obtain the first stress and temperature distribution diagrams of water in different force angle regions during the underwater cleaning process, as well as the second stress and temperature distribution diagrams of particles in different force angle regions, and the force diagrams and crushing diagrams of particles in each force angle region, thereby obtaining an evolution diagram of the particles. Based on the result diagrams obtained by these simulations, the first evolution law information of particles in different force angle regions under the influence of shock waves can be analyzed, thereby facilitating the determination of factors affecting the particle cleaning effect based on the first evolution law information, and then improving the particle cleaning method to improve the particle cleaning quality.

[0116] In an exemplary embodiment, in step S120, the cleaning simulation of the particle model in a water environment is performed based on the laser plasma to obtain the second evolution law information of the particles in different force angle regions under the influence of the particle diameter, including:

[0117] Step S124: performing a cleaning simulation on the particles in each stress angle region based on the laser plasma to obtain a particle size variation pattern diagram of the particles in each stress angle region; the particle size variation pattern diagram represents the relationship between the degree of particle breakage, the stress experienced, and the particle diameter;

[0118] Step S125 , analyzing the particle size variation regularity diagram of the particles in each force angle region, and obtaining the second evolution regularity information of the particles in the different force angle regions under the influence of the particle diameter.

[0119] Specifically, the impact of the shock wave on particles in different impact zones yielded a general regional division and information on the particles' primary evolution patterns. However, in the actual removal process, particles vary in size, and similar to air, particles of different sizes experience different stresses. Therefore, this example also performed separate cleaning simulations based on particle size, according to the particles in different zones. The following simulation results were obtained.

[0120] refer to Figure 8.1 , is a diagram showing the particle size variation pattern of particles in the 0° region according to an embodiment. Figure 8.1 The average stress diagram and crushing degree of particles of different particle sizes in the 0° region are listed. Among them, the average stress is obtained by extracting the stress value of each node of the particle and finally taking the weighted average; and the crushing degree is obtained by dividing the number of nodes greater than the yield stress limit by the total number of nodes; the dotted line is the yield stress curve of different particle sizes. Figure 8.1 It can be seen that the average stress generally decreases as the size of the particles increases. This is based on the contact theorem. The contact area between the particles and the substrate increases as the particle size increases. Under the same shock wave, the larger the contact area, the smaller the pressure on the particles. Therefore, the larger the particles, the smaller the stress. However, after combining with the yield stress curve, the particles can be roughly divided into three types. The first type is particles smaller than 200nm. Here, the stress on the particles gradually decreases as the particle size decreases. Since the yield stress decreases faster, the degree of particle crushing at this stage increases as the particle size increases. Specifically, Figure 8.1(A) (B) Two figures; The second type, particles larger than 200nm and smaller than 600nm, at this time, as the particle size gradually increases, the particle contact area also increases exponentially, and the stress reduction rate of the particles also increases accordingly, which is greater than the reduction rate of the yield stress of the particles. Therefore, the crushing success of particles of this particle size will gradually decrease with the increase of particle size, and at 600nm, the average stress is equal to the yield stress, which is specifically manifested as follows: Figure 8.1 (B) (C) Two figures; Finally, for particles larger than 600nm, due to the continuous decrease in average stress, although it has fallen below the yield stress, there are still traces of breakage in local areas of the particles, but only in the contact areas and on the surface of the particles. The degree of particle breakage is significantly reduced. This is also the main particle size of the residual particles in the 0° area, specifically as follows: Figure 8.1 (C)(D).

[0121] Summarize Figure 8.1 It can be seen that for small particles with a particle size of less than 200nm, the removal and destruction effect is particularly obvious, and there is almost no corresponding residue on the substrate; for medium particles between 200nm and 600nm, the removal effect is also relatively obvious, but due to the insufficient degree of crushing and the large size of the particles themselves, residues such as black spots will be left on the substrate, which is also one of the main residues in this area; for larger particles, the degree of crushing is smaller, but the shock wave stress itself is larger, and there is also the assistance of water flow in the environment, so the larger particles will go out directly with the flow of water, and a small amount of large particles cannot be crushed and remain on the substrate, which is the main part of the particle residue.

[0122] refer to Figure 8.2 , is a diagram showing the particle size variation pattern of particles in the 45° region according to an embodiment. Figure 8.2 The average stress diagram and degree of crushing of particles of different sizes in the 45° area are listed. Similarly, the average stress decreases with the increase of particle size, but unlike the 0° area, the downward trend is smaller. This is because the particles at 45° are still subject to the friction resistance given by the substrate, and the sliding friction is positively correlated with the contact area, that is, the larger the contact area, the greater the sliding friction, so the stress of the particles affected by the contact area will be offset to a certain extent, thereby reducing the downward trend of the average stress. Combined with the yield stress, the particles can be divided into two parts. For small particles less than 200nm, due to the reduction of shock wave stress, the total stress on the particles is also reduced, so the average stress of the particles is smaller than the yield stress, so the degree of damage is also significantly reduced. Only the lower right part in contact with the substrate has obvious signs of crushing. At the same time, the degree of crushing gradually increases with the size of the particles, which is specifically manifested as follows: Figure 8.2(A)(B). For medium and large particles larger than 200 nm, the yield stress decreases as the particle size increases. However, because the particles are also affected by the friction of the base, the stress of the particles does not decrease as quickly as that of the 0° particles. Therefore, in this region, as the particle size increases, the difference between the average stress and the yield stress gradually increases, and the degree of damage also gradually increases. The damage is also mainly at the bottom of the particle, which is specifically manifested as follows: Figure 8.2 (C)(D)

[0123] Summarize Figure 8.2 It can be seen that for the particles in the 45° area, smaller particles are less broken under smaller shock wave stress, so there will be an obvious distribution on the substrate; for larger particles, under the action of the friction and support force of the substrate, the degree of destruction is aggravated, and at the same time, they are removed by rolling and sliding, so "comet"-shaped black spots will be left. At the same time, the broken large particles will become more small particles, clustering together, so that there will be more particles distributed on the substrate.

[0124] refer to Figure 8.3 Figure 2 shows the particle size variation of particles in the 60° region, illustrating an embodiment. The average stress still decreases with increasing particle size, but the downward trend is less pronounced. This is because this region is too far from the center of the shock wave, resulting in minimal shock wave stress on the particles and minimal feedback from the substrate. Therefore, the contact area and particle size have little effect on stress changes. Furthermore, because the average stress is significantly lower than the yield stress of the particles, the degree of fragmentation is almost zero. Figure 8.3 (A) (B) (C) (D) show no signs of damage. The result is that there is almost no sign of removal on the substrate, and both large and small particles are clearly distributed.

[0125] In this embodiment, the particle size change law diagram in each force angle area obtained by cleaning simulation is analyzed to obtain the second evolution law information of particles in different force angle areas under the influence of particle size, which can be combined with the first evolution law information to determine the factors affecting the particle cleaning effect, and then improve the particle cleaning method to improve the particle cleaning quality.

[0126] In an exemplary embodiment, the method further includes: obtaining an experimental substrate with experimental particles, and placing the experimental substrate in a container filled with deionized water; emitting a laser through an experimental device to perform a cleaning experiment on the experimental particles on the experimental substrate in water, and obtaining a surface morphology image and an energy spectrum image of the experimental substrate before and after cleaning; based on the surface morphology image and the energy spectrum image of the experimental substrate before and after cleaning, analyzing the removal effect of the experimental particles in different force angle areas; based on the removal effect, verifying the optimal removal angle area of ​​particles with different particle diameters.

[0127] Specifically, refer to Figure 9 , is a schematic diagram of an experimental device shown in one embodiment. A silicon wafer with aluminum particles is placed in a beaker filled with deionized water. The beaker is then placed on a three-dimensional platform, and the three-dimensional platform is moved to move the silicon wafer below the laser's focal point. That is, when the laser is turned on, its focal point is exactly in the water above the silicon wafer. Under the action of the high-energy laser, it will quickly break down the water molecules, thereby generating a plasma explosion, forming a shock wave in the water that impacts the silicon wafer, achieving the goal of removing micro-nano impurity particles underwater using plasma shock waves. After the sample is removed, it is placed in a drying oven to evaporate the surface water to obtain a cleaned experimental substrate. The cleaned experimental substrate is placed in a scanning electron microscope (SEM) for observation to obtain a surface morphology image after cleaning, and then placed in an energy spectrometer for observation to obtain an energy spectrum image. Similarly, the experimental substrate can be observed with a scanning electron microscope and an energy spectrometer before cleaning to obtain a surface morphology image and energy spectrum image before cleaning.

[0128] refer to Figure 10 , is a surface morphology diagram of an experimental substrate before and after cleaning, shown in an embodiment, wherein, Figure 10 Figures (1) and (2) show the original sample before cleaning. It can be seen that various aluminum particles of varying sizes are distributed on the surface. The large particles range in size from 500nm to 1μm, while the small particles range in size from 100nm to 500nm. This is primarily due to the aggregation of small particles during sample preparation. Figure 10 (3) and (4) in FIG10 are the distribution diagrams of particles after removal. It can be seen from (3) in FIG10 that the removed area is still an arc area, the cleaning effect of the central area is more obvious, and the removal effect of the edge area gradually decreases. By enlarging the area of ​​​​the plasma effect, we can get Figure 10 The distribution diagram in (4) is similar to the effect in air. The area of ​​action is still divided into 0-30°, 30-45°, and 45-60° according to the action area of ​​the plasma shock wave. The removal effect is the best in the 0-30° area, with only a few small particles remaining. The removal effect in the 30-45° area is reduced, and a large number of particles of different sizes remain in the area. The removal effect in the 45-60° area and beyond is very small. Except for a slight decrease in particle density, most particles still remain. The following is a more detailed observation of each area.

[0129] refer to Figure 11.1 , is a diagram showing the removal effect of particles in the 0-30° region according to an embodiment. Figure 11.1As can be seen from (1) and (2) in the figure, the removal effect is particularly obvious in the area directly below the plasma. Only scattered aluminum particles with a particle size of less than 500nm remain on the silicon surface, and all larger particles are removed. At the same time, there are still some black spots on the silicon surface. By magnifying the remaining black marks, we can get Figure 11.1 From (3) and (4) in the figure, we can see that the black spots are mainly round and square. They are the residues left on the silicon substrate after the aluminum particles are removed. Their main chemical component is aluminum, and their size is about 3μm. The area around the black spots is relatively clean without many other particles remaining. Figure 11.1 In (5) and (6), the particles in the central region all have a protruding round cap on the top, which is confirmed by observation and element measurement using an energy spectrometer (e.g. Figure 11.2 As shown in the figure, its chemical composition can be determined to be aluminum and oxygen elements, that is, these particles have melted and oxidized at high temperatures, and the melted part has solidified to form the round cap part on the top of the particle.

[0130] refer to Figure 11.3 , is a diagram showing the removal effect of particles in the 30-45° region according to an embodiment. Figure 11.3 From (1) and (2) in the above, we can see that Figure 11.1 The cleaning effect is obviously reduced compared with the center removal, and the density of the particles remaining on the surface increases. There are also black spots similar to the center area on the surface. Figure 11.3 (3) and (4) in Figure 11.1 The difference between (3) and (4) is that the black spots here are no longer square or round, but have a trailing trace behind them, similar to the "comet" shape removed from the air. However, unlike in the air, the surface of the removed particles does not have many scratches and removal marks. When observing the remaining particles, you will find that there are various types of particles remaining, such as Figure 11.3 The particles in (5) are like "crushed particles", which are assembled from the broken pieces of various small particles; Figure 11.3 The particles in (6) are in a "depressed" shape, which is similar to squeezing the surface of the particle into the interior of the particle with force.

[0131] refer to Figure 11.4 , is a diagram showing the removal effect of particles in the 45-60° region according to an embodiment. Figure 11.4 It can be seen that the particle removal phenomenon on the outside becomes less obvious. Figure 11.4 From (1), (2), and (3), we can see that the silicon surface is covered with various particles. Compared with the surface of the original sample, there is almost no removal effect or trace. At the same time, the particles on the surface can also be seen by magnifying them. Figure 11.4There are signs of black spot removal in (4) and (5), but the black spots are next to the large particles that have been removed. That is, the large particles only move under the action of the shock wave and leave traces on the substrate after movement, but the particles themselves do not leave the substrate, which proves that the removal effect has not been achieved. Figure 11.4 The particles in (6) have certain movement scratches, but they are also consistent with the previous ones. The particles only move on the substrate but are not removed. A large number of particles still remain on the substrate.

[0132] In this embodiment, an experimental substrate and experimental particles are prepared, and the experimental particles on the experimental substrate are cleaned in a water environment using experimental equipment to obtain surface morphology images and energy spectrum images of the experimental substrate before and after cleaning. Based on the surface morphology images and energy spectrum images, the removal effects of the experimental particles in different force angle areas are analyzed, and further based on the removal effects, the optimal removal angle areas of particles with different particle diameters are verified, thereby further ensuring the accuracy and reliability of the determined optimal removal angle areas of particles with different particle diameters.

[0133] In an exemplary embodiment, Figure 12 As shown, the above step S140 performs particle cleaning based on the optimal force angle area of ​​particles with different particle diameters, including:

[0134] Step S1210 , obtaining the particle diameter and particle position of the particles to be cleaned; the particle position indicates the position of the particles to be cleaned in the substrate to be cleaned.

[0135] The particles to be cleaned may be micro-nano particles.

[0136] In specific implementations, the particle diameter and particle position affect the particle removal characteristics. Therefore, in order to improve the particle removal effect, before cleaning the particles to be cleaned, the particle diameter and particle position of the particles to be cleaned can be obtained first, so that the cleaning method that can improve the removal effect of the particles to be cleaned can be selected based on the particle diameter and particle position.

[0137] Step S1220, determining the target force angle corresponding to the particles to be cleaned based on the particle diameter and the optimal force angle range of particles with different particle diameters; the target force angle is the angle between the explosion point position of the plasma generated by the laser in water and the particle position of the particles to be cleaned.

[0138] The explosion point of the plasma in the water is located directly above the substrate to be cleaned.

[0139] The target force angle can be understood as the optimal angle for removing the particles to be cleaned, and the removal effect of the particles to be cleaned is best at this target force angle.

[0140] In a specific implementation, each particle diameter interval has a corresponding force angle region, and there are multiple force angle regions, namely, the 0-30° region, the 30-45° region, and the 45-60° region. After determining the particle diameter of the particles to be cleaned, the target particle diameter range corresponding to the particle diameter can be determined from the multiple particle diameter intervals. Further, a force angle is selected from the force angle regions corresponding to the target particle diameter interval as the target force angle corresponding to the particles to be cleaned.

[0141] Step S1230 , determining the irradiation direction of the laser according to the target force angle and the particle position, emitting the laser according to the irradiation direction, and cleaning the particles to be cleaned in a water environment.

[0142] In practice, micro-nanoparticles are cleaned by emitting a laser parallel to the substrate to be cleaned. The laser generates plasma in water, which explodes directly above the substrate, generating shock waves in different directions that act on each particle on the substrate to be cleaned, effectively removing each particle. Therefore, after determining the target force angle and particle position, the location of the plasma explosion point can be determined based on the target force angle and particle position. The laser irradiation direction is then determined based on the location of the plasma explosion point. Finally, the laser is fired in this irradiation direction to remove the particles.

[0143] This embodiment takes into account the influence of particle diameter and particle position on the particle cleaning effect. Therefore, it is proposed to determine the target force angle of the particle based on the particle diameter before cleaning. The target force angle is the optimal angle to ensure the particle cleaning effect. Therefore, the laser emitted according to the irradiation direction determined by the target force angle and the particle position is used to clean the particles to be cleaned, which can improve the cleaning effect of the particles to be cleaned.

[0144] It should be understood that, although the various steps in the flowcharts involved in the various embodiments described above are displayed in sequence according to the instructions of the arrows, these steps are not necessarily executed in sequence in the order indicated by the arrows. Unless otherwise specified herein, there is no strict order restriction on the execution of these steps, and these steps can be executed in other orders. Moreover, at least a portion of the steps in the flowcharts involved in the various embodiments described above can include multiple steps or multiple stages, and these steps or stages are not necessarily executed and completed at the same time, but can be executed at different times, and the execution order of these steps or stages is not necessarily to be carried out in sequence, but can be executed in turn or alternately with other steps or at least a portion of steps or stages in other steps.

[0145] Based on the same inventive concept, the embodiments of the present application also provide a device for cleaning micro-nano particles in an aqueous environment based on laser plasma, which is used to implement the aforementioned method for cleaning micro-nano particles in an aqueous environment based on laser plasma. The solution to the problem provided by this device is similar to the solution described in the aforementioned method. Therefore, the specific limitations of one or more embodiments of the device for cleaning micro-nano particles in an aqueous environment based on laser plasma provided below can be found in the above-mentioned limitations of the method for cleaning micro-nano particles in an aqueous environment based on laser plasma, and will not be repeated here.

[0146] In one embodiment, Figure 13 As shown, a device for cleaning micro-nano particles in an aqueous environment based on laser plasma is provided, comprising: a construction module 1310, a simulation module 1320, a determination module 1330 and an analysis module 1340, wherein:

[0147] Construction module 1310 is used to construct a water environment simulation model; the water environment simulation model includes a particle model, a substrate model, and a water model, the water model is arranged above the particle model and the substrate model, and an area for simulating a plasma explosion is set in the water of the water model;

[0148] Simulation module 1320 is used to perform a cleaning simulation of a particle model in a water environment based on laser plasma, to obtain first evolution law information of particles in different force angle regions under the influence of shock waves, and second evolution law information of particles in different force angle regions under the influence of particle diameter;

[0149] a determination module 1330 configured to obtain, based on the first evolution law information and the second evolution law information, a first relationship diagram between the stress on the particles, the stress angle, and the particle diameter, and a second relationship diagram between the degree of particle fragmentation, the stress angle, and the particle diameter during the underwater cleaning process;

[0150] The analysis module 1340 is configured to analyze the first relationship diagram and the second relationship diagram to obtain optimal force angle regions for particles with different particle diameters, and perform particle cleaning based on the optimal force angle regions for particles with different particle diameters.

[0151] In one embodiment, the simulation module 1320 is also used to perform cleaning simulation of the particle model in an aqueous environment based on laser plasma, and obtain the first stress and temperature distribution diagram of the water in different force angle regions during the underwater cleaning process, as well as the second stress and temperature distribution diagram of the particles in different force angle regions; simulate and analyze the particles in each force angle region to obtain the evolution diagram of the particles in each force angle region; based on the first stress and temperature distribution diagram, the second stress and temperature distribution diagram and the evolution diagram, analyze and obtain the first evolution law information of the particles in the different force angle regions under the influence of the shock wave.

[0152] In one embodiment, the simulation module 1320 is also used to perform simulation analysis on the particles in each force angle region to obtain the force diagram and the fragmentation diagram of the particles in each force angle region; based on the force diagram and the fragmentation diagram, a physical evolution diagram of the particles in each force angle region is obtained.

[0153] In one embodiment, the simulation module 1320 is also used to perform cleaning simulation on particles in each force angle region based on laser plasma to obtain a particle size change pattern diagram of the particles in each force angle region; the particle size change pattern diagram represents the relationship between the degree of particle fragmentation, the stress suffered and the particle diameter; the particle size change pattern diagram of the particles in each force angle region is analyzed to obtain the second evolution law information of the particles in different force angle regions under the influence of particle diameter.

[0154] In one embodiment, the method also includes an experimental module for obtaining an experimental substrate with experimental particles and placing the experimental substrate in a container filled with deionized water; emitting a laser through an experimental device to perform a cleaning experiment on the experimental particles on the experimental substrate in water, and obtaining a surface morphology image and an energy spectrum image of the experimental substrate before and after cleaning; based on the surface morphology image and the energy spectrum image of the experimental substrate before and after cleaning, analyzing the removal effect of the experimental particles in different force angle areas; based on the removal effect, verifying the optimal removal angle area of ​​particles with different particle diameters.

[0155] In one embodiment, the analysis module also includes a cleaning submodule for obtaining the particle diameter and particle position of the particles to be cleaned; the particle position represents the position of the particles to be cleaned in the substrate to be cleaned; the target force angle corresponding to the particles to be cleaned is determined based on the particle diameter and the optimal force angle area of ​​particles with different particle diameters; the target force angle is the angle between the explosion point position of the plasma generated by the laser in water and the particle position of the particles to be cleaned; the irradiation direction of the laser is determined based on the target force angle and the particle position, and the laser is emitted according to the irradiation direction to clean the particles to be cleaned in a water environment.

[0156] Each module in the aforementioned apparatus for laser plasma cleaning of micro- and nanoparticles in an aqueous environment may be implemented in whole or in part through software, hardware, or a combination thereof. Each module may be embedded in or independent of a processor in a computer device in the form of hardware, or may be stored in a memory in the computer device in the form of software, so that the processor can call and execute the corresponding operations of each module.

[0157] In one embodiment, a computer device is provided. The computer device may be a terminal, and its internal structure diagram may be as follows: Figure 14 As shown. The computer device includes a processor, a memory, a communication interface, a display screen and an input device connected via a system bus. The processor of the computer device is used to provide computing and control capabilities. The memory of the computer device includes a non-volatile storage medium and an internal memory. The non-volatile storage medium stores an operating system and a computer program. The internal memory provides an environment for the operation of the operating system and the computer program in the non-volatile storage medium. The communication interface of the computer device is used to communicate with an external terminal in a wired or wireless manner, and the wireless manner can be achieved through WIFI, a mobile cellular network, NFC (near field communication) or other technologies. When the computer program is executed by the processor, a method for cleaning micro-nanoparticles based on laser plasma in an aqueous environment is implemented. The display screen of the computer device can be a liquid crystal display screen or an electronic ink display screen, and the input device of the computer device can be a touch layer covering the display screen, or a button, trackball or touchpad provided on the computer device housing, or an external keyboard, touchpad or mouse.

[0158] Those skilled in the art will understand that Figure 14 The structure shown in the figure is only a block diagram of a part of the structure related to the solution of the present application, and does not constitute a limitation on the computer device to which the solution of the present application is applied. The specific computer device may include more or fewer components than shown in the figure, or combine certain components, or have a different component arrangement.

[0159] In one embodiment, a computer device is further provided, including a memory and a processor. The memory stores a computer program, and the processor implements the steps in the above method embodiments when executing the computer program.

[0160] In one embodiment, a computer-readable storage medium is provided, on which a computer program is stored. When the computer program is executed by a processor, the steps in the above-mentioned method embodiments are implemented.

[0161] In one embodiment, a computer program product is provided, including a computer program, which implements the steps in the above method embodiments when executed by a processor.

[0162] It should be noted that the user information (including but not limited to user device information, user personal information, etc.) and data (including but not limited to data used for analysis, stored data, displayed data, etc.) involved in this application are all information and data authorized by the user or fully authorized by all parties, and the collection, use and processing of relevant data must comply with the relevant laws, regulations and standards of relevant countries and regions.

[0163] Those skilled in the art will appreciate that all or part of the processes in the above-mentioned embodiment methods can be implemented by instructing the relevant hardware through a computer program, and the computer program can be stored in a non-volatile computer-readable storage medium. When the computer program is executed, it can include the processes of the embodiments of the above-mentioned methods. Among them, any reference to memory, database or other media used in the embodiments provided in this application may include at least one of non-volatile and volatile memory. Non-volatile memory may include read-only memory (ROM), magnetic tape, floppy disk, flash memory, optical memory, high-density embedded non-volatile memory, resistive random access memory (ReRAM), magnetic random access memory (MRAM), ferroelectric random access memory (FRAM), phase change memory (PCM), graphene memory, etc. Volatile memory may include random access memory (RAM) or external cache memory, etc. By way of illustration and not limitation, RAM can be in various forms, such as static random access memory (SRAM) or dynamic random access memory (DRAM). The database involved in the various embodiments provided herein may include at least one of a relational database and a non-relational database. Non-relational databases may include, but are not limited to, distributed databases based on blockchains. The processor involved in the various embodiments provided herein may be, but are not limited to, a general-purpose processor, a central processing unit, a graphics processing unit, a digital signal processor, a programmable logic unit, a data processing logic unit based on quantum computing, and the like.

[0164] The technical features of the above embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0165] The above-described embodiments merely represent several implementation methods of the present application. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the present application. It should be noted that a person of ordinary skill in the art may make various modifications and improvements without departing from the spirit of the present application, and these modifications and improvements fall within the scope of protection of the present application. Therefore, the scope of protection of the present application shall be determined by the appended claims.

Claims

1. A method for cleaning micro-nano particles in an aqueous environment based on laser plasma, characterized in that: The method comprises: Constructing a water environment simulation model; the water environment simulation model includes a particle model, a substrate model and a water model, the water model is arranged above the particle model and the substrate model, and an area for simulating a plasma explosion is set in the water of the water model; Based on the laser plasma, a cleaning simulation of the particle model in a water environment is performed to obtain first evolution law information of the particles in different force angle regions under the influence of shock waves, and second evolution law information of the particles in different force angle regions under the influence of particle diameter; Based on the first evolution law information and the second evolution law information, a first relationship diagram of the stress on the particles, the force angle, and the particle diameter during the underwater cleaning process, and a second relationship diagram of the degree of particle fragmentation, the force angle, and the particle diameter are obtained; the force angle is the angle between the horizontal plane and the line connecting the explosion point of the laser-generated plasma in water and the particle position; The first relationship diagram and the second relationship diagram are analyzed to obtain optimal force angle regions for particles with different particle diameters, and particle cleaning is performed based on the optimal force angle regions for particles with different particle diameters.

2. The method according to claim 1, characterized in that The laser plasma-based cleaning simulation of the particle model in a water environment is performed to obtain first evolution law information of particles in different force angle regions under the influence of shock waves, including: Performing a cleaning simulation of the particle model in an aqueous environment based on laser plasma to obtain a first stress and temperature distribution diagram of the water in the regions with different force angles, and a second stress and temperature distribution diagram of the particles in the regions with different force angles during the underwater cleaning process; Performing simulation analysis on particles in each force angle region to obtain an evolution diagram of the particles in each force angle region; Based on the first stress and temperature distribution diagram, the second stress and temperature distribution diagram and the evolution diagram, first evolution law information of particles in different force angle regions under the influence of shock waves is analyzed and obtained.

3. The method according to claim 2, characterized in that The simulation analysis of the particles in each force angle region is performed to obtain an evolution diagram of the particles in each force angle region, including: Performing simulation analysis on particles in each force-bearing angle region to obtain force diagrams and crushing diagrams of the particles in each force-bearing angle region; Based on the force diagram and the crushing diagram, a physical evolution diagram of the particles in each force angle region is obtained.

4. The method according to claim 1, wherein The laser plasma-based cleaning simulation of the particle model in a water environment is performed to obtain second evolution law information of particles in different force angle regions under the influence of particle diameter, including: Based on the laser plasma, a cleaning simulation is performed on the particles in each stress angle region to obtain a particle size variation pattern of the particles in each stress angle region; the particle size variation pattern shows the relationship between the degree of particle fragmentation, the stress experienced, and the particle diameter; The particle size variation regularity diagram of the particles in each force angle region is analyzed to obtain the second evolution regularity information of the particles in the different force angle regions under the influence of the particle diameter.

5. The method according to claim 1, wherein The method further comprises: Obtaining an experimental substrate with experimental particles, and placing the experimental substrate in a container filled with deionized water; emitting laser light through an experimental device to perform a cleaning experiment on the experimental particles on the experimental substrate in water, and obtaining surface morphology images and energy spectrum images of the experimental substrate before and after cleaning; Based on the surface morphology and energy spectrum of the experimental substrate before and after cleaning, the removal effect of the experimental particles in different force angle areas is analyzed; Based on the removal effect, the optimal removal angle regions for particles with different particle diameters are verified.

6. The method according to claim 1, characterized in that The particle cleaning is performed based on the optimal force angle area of ​​the particles with different particle diameters, including: Obtaining the particle diameter and particle position of the particles to be cleaned; the particle position represents the position of the particles to be cleaned in the substrate to be cleaned; Determining a target force angle corresponding to the particles to be cleaned according to the particle diameter and the optimal force angle ranges of the particles with different particle diameters; The irradiation direction of the laser is determined according to the target force angle and the position of the particle, and the laser is emitted according to the irradiation direction to clean the particles to be cleaned in a water environment.

7. A device for cleaning micro-nano particles in an aqueous environment based on laser plasma, characterized in that: The device comprises: A construction module is used to construct a water environment simulation model; the water environment simulation model includes a particle model, a substrate model and a water model, the water model is arranged above the particle model and the substrate model, and an area for simulating a plasma explosion is set in the water of the water model; a simulation module for performing a cleaning simulation of the particle model in a water environment based on laser plasma, to obtain first evolution law information of the particles in different force angle regions under the influence of shock waves, and second evolution law information of the particles in different force angle regions under the influence of particle diameters; a determination module configured to obtain, based on the first evolution law information and the second evolution law information, a first relationship diagram of the stress exerted on the particles, the force angle, and the particle diameter, and a second relationship diagram of the degree of particle fragmentation, the force angle, and the particle diameter during the underwater cleaning process; the force angle being the angle between a line connecting the explosion point of the laser-generated plasma in water and the particle position and a horizontal plane; An analysis module is used to analyze the first relationship diagram and the second relationship diagram to obtain the optimal force angle areas of particles with different particle diameters, and perform particle cleaning based on the optimal force angle areas of particles with different particle diameters.

8. A computer device comprising a memory and a processor, wherein the memory stores a computer program, wherein: When the processor executes the computer program, the steps of the method for cleaning micro-nanoparticles in an aqueous environment based on laser plasma are implemented as claimed in any one of claims 1 to 6.

9. A computer-readable storage medium having a computer program stored thereon, characterized in that: When the computer program is executed by a processor, the steps of the method for cleaning micro-nanoparticles in an aqueous environment based on laser plasma are implemented as claimed in any one of claims 1 to 6.

10. A computer program product comprising a computer program, characterized in that When the computer program is executed by a processor, the steps of the method for cleaning micro-nano particles in an aqueous environment based on laser plasma are realized as claimed in any one of claims 1 to 6.

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