A multi-package MOS tube test device

Abstract

The present invention discloses a multi-package MOS tube testing device; the multi-package MOS tube testing device includes: an upper cover and a base; the upper cover is provided with a pressure regulating assembly, and the base is provided with a detection assembly; the detection assembly is used to place the MOS tube, and the pressure regulating assembly is used to provide pressure to the MOS tube; the detection assembly includes a PCB board and a storage plate, the storage plate is provided with an open groove for placing the MOS tube, and the MOS tube is electrically connected to the PCB board. The present invention places the MOS tube in the detection assembly, and the pressure regulating assembly can adjust the pressure provided to the MOS tube, thereby adjusting the contact effect between the MOS tube and the solder joint on the PCB board, quantifying the pressing force of the MOS tube, and can be applied to the performance testing of MOS tubes of various package types, thereby improving the test efficiency, while also protecting the MOS tube, making it less susceptible to damage during the test process, and reducing the test cost.

Description

Technical Field

[0001] The present invention relates to the technical field of MOS tube testing, and in particular to a multi-package MOS tube testing device. Background Art

[0002] Currently, there are many types of MOS tubes, and performance testing is relatively complicated. Common devices on the market can only test a certain type of MOS tube, and have poor versatility. In addition, the contact force of the device is fixed, which can easily damage the MOS tube and increase the testing cost. Summary of the Invention

[0003] The purpose of the present invention is to overcome the deficiencies of the prior art and provide a multi-package MOS tube testing device.

[0004] In order to solve the above technical problems, the present invention adopts the following technical solutions:

[0005] An embodiment of the present invention provides a multi-package MOS tube testing device, comprising: an upper cover and a base; the upper cover is provided with a pressure adjustment assembly, and the base is provided with a detection assembly; the detection assembly is used to place the MOS tube, and the pressure adjustment assembly is used to provide pressure to the MOS tube; the detection assembly includes a PCB board and a placement plate, the placement plate is provided with an open groove for placing the MOS tube, and the MOS tube is electrically connected to the PCB board.

[0006] In a specific embodiment, the pressure adjustment assembly includes an adjusting screw, an elastic member and a pressure member; the upper cover is provided with a through cavity, the pressure member is arranged in the through cavity, the upper end of the pressure member is connected to the adjusting screw, and the lower end protrudes from the through cavity and corresponds to the position of the opening groove, the elastic member is sleeved on the adjusting screw and the lower end of the elastic member is in contact with the pressure member.

[0007] In a specific embodiment, the pressure regulating assembly further includes a pressure head, which is disposed at the lower end of the pressure member.

[0008] In a specific embodiment, the pressure adjustment assembly further includes a screw disk, which is embedded in the upper cover, and the adjustment screw passes through the screw disk and is connected to the pressure member.

[0009] In a specific embodiment, the screw disk is provided with scale markings.

[0010] In a specific embodiment, the PCB board includes a first PCB board and a second PCB board, and the storage board includes a first storage board and a second storage board; the first storage board and the second storage board are both provided with the opening groove, and the second PCB board is provided with a notch corresponding to the opening groove, the second storage board, the second PCB board, the first storage board and the first PCB board are stacked in sequence from top to bottom, and the MOS tube is electrically connected to the first PCB board or the second PCB board.

[0011] In a specific embodiment, the detection component further includes a data line, the second PCB board is electrically connected to the first PCB board, and the first PCB board is electrically connected to the data line.

[0012] In a specific embodiment, the base is provided with a groove, the first PCB board is placed in the groove, one end of the data line is electrically connected to the first PCB board, and the other end protrudes from the groove.

[0013] In a specific embodiment, the upper cover is further provided with a lock assembly, the base is provided with a buckle, and the lock assembly cooperates with the buckle.

[0014] In a specific embodiment, the upper cover and the base are rotatably connected via a pin.

[0015] The multi-package MOS tube testing device of the present invention has the following advantages compared with the prior art: by placing the MOS tube in the detection assembly, the pressure regulating assembly can adjust and provide the required pressure to the MOS tube, thereby adjusting the contact effect between the MOS tube and the solder joint on the PCB board, quantifying the pressing force of the MOS tube, and being applicable to performance testing of MOS tubes of various package types. It has strong versatility, improves test efficiency, and also protects the MOS tube, making it less likely to be damaged during the test process, thereby reducing test costs.

[0016] The present invention will be further described below with reference to the accompanying drawings and specific embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0018] Figure 1 A schematic diagram of the structure of the multi-package MOS tube testing device provided by the present invention;

[0019] Figure 2 A schematic cross-sectional view of a multi-package MOS tube testing device provided by the present invention;

[0020] Figure 3 This is an exploded diagram of the multi-package MOS tube testing device provided by the present invention;

[0021] Figure 4 This is a schematic structural diagram of the upper cover provided by the present invention.

[0022] Icons: 10. Upper cover; 11. Through cavity; 12. Lock assembly; 121. Lock shaft; 122. Lock spring; 123. Baffle; 124. Hook; 20. Base; 21. Groove; 22. Buckle; 30. Pressure adjustment assembly; 31. Adjusting screw; 32. Elastic member; 33. Pressure member; 34. Pressure head; 35. Screw disk; 351. Scale mark; 40. Detection assembly; 41. PCB board; 411. First PCB board; 412. Second PCB board; 413. Notch; 42. Storage board; 421. First storage board; 422. Second storage board; 423. Open slot; 43. Data cable; 50. Pin; 60. MOS tube. DETAILED DESCRIPTION

[0023] In order to make the purpose, technical solutions and advantages of the present invention more clear, the present invention is further described in detail below with reference to the accompanying drawings and specific embodiments.

[0024] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without making any creative efforts shall fall within the scope of protection of the present invention.

[0025] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like to indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0026] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature identified as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, "plurality" means two or more, unless otherwise specifically defined.

[0027] In the present invention, unless otherwise expressly specified or limited, terms such as "mounted," "connected," "connect," and "fixed" should be understood broadly. For example, they may refer to connection, detachable connection, or integration; mechanical connection or electrical connection; direct connection or indirect connection through an intermediate medium; and internal communication between two components or interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on specific circumstances.

[0028] In the present invention, unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may include the first and second features being in direct contact, or may include the first and second features being in contact not directly but through another feature between them. Furthermore, a first feature being "above," "above," and "above" a second feature may include the first feature being directly above or obliquely above the second feature, or may simply mean that the first feature is higher in level than the second feature. A first feature being "below," "below," and "below" a second feature may include the first feature being directly below or obliquely below the second feature, or may simply mean that the first feature is lower in level than the second feature.

[0029] In the description of this specification, the reference terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" mean that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic expressions of the above terms should not be understood as necessarily referring to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art can combine and combine different embodiments or examples described in this specification.

[0030] See also Figures 1 to 3As shown, the present invention discloses a specific embodiment of a multi-package MOS tube testing device, including: an upper cover 10 and a base 20; the upper cover 10 is provided with a pressure adjustment component 30, and the base 20 is provided with a detection component 40; the detection component 40 is used to place the MOS tube 60, and the pressure adjustment component 30 is used to provide pressure to the MOS tube 60. The detection component 40 includes a PCB board 41 and a placement plate 42, and the placement plate 42 is provided with an open groove 423 for placing the MOS tube 60, and the MOS tube 60 is electrically connected to the PCB board 41.

[0031] Specifically, the MOS transistor 60 is placed in the open groove 423, and the pressure regulating assembly 30 presses the MOS transistor 60 so that the MOS transistor 60 contacts the solder joint on the PCB board 41 to implement performance testing of the MOS transistor 60. The pressure regulating assembly 30 can adjust and provide different pressures to the MOS transistor 60, quantifying the pressing force of the MOS transistor 60. This is applicable to performance testing of MOS transistors 60 of various package types, has strong versatility, and improves test efficiency. At the same time, since the pressing force is adjustable, the pressure on the MOS transistor 60 is not excessive, thereby protecting the MOS transistor 60 and making it less likely to be damaged during the test process, thereby reducing test costs.

[0032] In one embodiment, the pressure adjustment assembly 30 includes an adjusting screw 31, an elastic member 32 and a pressure member 33; the upper cover 10 is provided with a through cavity 11, and the pressure member 33 is provided in the through cavity 11. The upper end of the pressure member 33 is connected to the adjusting screw 31, and the lower end protrudes from the through cavity 11 and corresponds to the position of the opening groove 423. The elastic member 32 is sleeved on the adjusting screw 31 and the lower end of the elastic member 32 is in contact with the pressure member 33.

[0033] Specifically, the lower end of the pressure member 33 protrudes from the through cavity 11 and is used to contact the MOS tube 60 to provide pressing force so that the MOS tube 60 contacts the solder joints on the PCB board 41. For packaged MOS tubes 60 of different heights, the pressing force of the pressure member 33 is adjusted by screwing the adjustment screw 31 to provide the required different pressing forces to the MOS tube 60, thereby meeting the testing requirements of packaged MOS tubes 60 of different heights.

[0034] Preferably, the elastic member 32 is a spring, which has strong elasticity, provides stable elastic force and has low cost.

[0035] In one embodiment, the pressure regulating assembly 30 further includes a pressure head 34 , which is disposed at the lower end of the pressure member 33 .

[0036] Specifically, the pressure head 34 is fixed to the lower end of the pressure member 33 via threads. The lower surface of the pressure head 34 contacts the MOS transistor 60 to provide a pressing force. Preferably, the lower surface of the pressure head 34 is curved so that the pressing force acting on the MOS transistor 60 is evenly distributed, thereby improving the testing effect and preventing scratches on the MOS transistor 60.

[0037] In one embodiment, the pressure adjustment assembly 30 further includes a screw disk 35 . The screw disk 35 is embedded in the upper cover 10 . The adjustment screw 31 passes through the screw disk 35 and is connected to the pressure member 33 .

[0038] Specifically, a slot is provided on the upper surface of the upper cover 10, into which a screw plate 35 is embedded. The adjustment screw 31 passes through the screw plate 35 and is connected to the pressure member 33. The screw plate 35 serves to limit the adjustment screw 31, preventing it from shifting, thereby providing a stable pressing force on the MOS transistor 60. In this embodiment, the screw plate 35 is fixed to the upper cover 10 by four screws, providing a secure connection and easy assembly and disassembly.

[0039] In one embodiment, a scale mark 351 is provided on the screw disk 35 .

[0040] Specifically, the scale mark 351 allows precise control of the force when the pressing force needs to be adjusted by turning the adjustment screw 31. Furthermore, after adjusting a type of MOS tube 60, the scale data range can be recorded, and the data on the scale mark 351 can be quantified to calibrate the appropriate adjustment range.

[0041] Preferably, an indicator arrow is provided on the adjusting screw 31 , and the indicator arrow cooperates with the scale mark 351 to more accurately control the magnitude of the adjusting force.

[0042] In one embodiment, the PCB board 41 includes a first PCB board 411 and a second PCB board 412, and the storage board 42 includes a first storage board 421 and a second storage board 422; the first storage board 421 and the second storage board 422 are both provided with the opening groove 423, and the second PCB board 412 is provided with a notch 413 corresponding to the opening groove 423. The second storage board 422, the second PCB board 412, the first storage board 421 and the first PCB board 411 are stacked in sequence from top to bottom, and the MOS tube 60 is electrically connected to the first PCB board 411 or the second PCB board 412.

[0043] Specifically, the second storage plate 422, the second PCB board 412, the first storage plate 421 and the first PCB board 411 are stacked in sequence from top to bottom, and the MOS tube 60 is electrically connected to the first PCB board 411 or the second PCB board 412. A vertical layout structure is adopted, which allows for spatially staggered testing of MOS tubes 60 of different package types.

[0044] Preferably, the second storage plate 422, the second PCB board 412 and the first storage plate 421 are all square in shape, and the second storage plate 422, the second PCB board 412 and the first storage plate 421 have the same size. Four screws pass through the second storage plate 422, the second PCB board 412, the first storage plate 421 and the first PCB board 411 in sequence and are fixed to the base 20, so that the second storage plate 422, the second PCB board 412, the first storage plate 421 and the first PCB board 411 form an integrated structure, which is stable and not prone to displacement, thereby avoiding affecting the test accuracy and saving space.

[0045] In one embodiment, the detection component 40 further includes a data line 43 , the second PCB board 412 is electrically connected to the first PCB board 411 , and the first PCB board 411 is electrically connected to the data line 43 .

[0046] Specifically, the second PCB board 412 is electrically connected to the first PCB board 411 through wires or pins, and the first PCB board 411 is electrically connected to the data line 43. The test data of the second PCB board 412 and the MOS tube 60 is first transmitted to the first PCB board 411, and then transmitted to the external host computer through the data line 43. The test data of the first PCB board 411 and the MOS tube 60 is directly transmitted to the external host computer through the data line 43.

[0047] In one embodiment, the base 20 is provided with a groove 21 , the first PCB board 411 is placed in the groove 21 , one end of the data line 43 is electrically connected to the first PCB board 411 , and the other end protrudes from the groove 21 .

[0048] Specifically, the second placement plate 422, the second PCB board 412, the first placement plate 421 and the first PCB board 411 are stacked in sequence from top to bottom in the groove 21, and the data line 43 protrudes from the groove 21 and is electrically connected to the external host computer, saving space and reducing the overall volume of the multi-package MOS tube testing device.

[0049] In one embodiment, the upper cover 10 is further provided with a lock assembly 12 , and the base 20 is provided with a buckle 22 , and the lock assembly 12 cooperates with the buckle 22 .

[0050] Specifically, the lock assembly 12 includes a lock shaft 121, a lock spring 122 and a baffle 123; the lock spring 122 is sleeved on the lock shaft 121, one end of the lock shaft 121 is embedded in the upper cover 10, and the other end protrudes from the upper cover 10 and is provided with a hook 124, the baffle 123 is used to fix the lock shaft 121, and the hook 124 is used to cooperate with the buckle 22 to lock the upper cover 10 and the base 20.

[0051] Preferably, the hook 124 and the lock shaft 121 are integrally formed, which has high strength and only requires one set of molds, thereby reducing production costs.

[0052] Preferably, the buckle 22 and the base 20 are integrally formed, which has high strength and only requires one set of molds, thereby reducing production costs.

[0053] In one embodiment, the upper cover 10 and the base 20 are rotatably connected via a pin 50 .

[0054] Specifically, the upper cover 10 can rotate around the pin 50 to facilitate opening or closing of the upper cover 10 .

[0055] The above embodiments are preferred implementation schemes of the present invention. In addition, the present invention can also be implemented in other ways. Any obvious replacement without departing from the concept of the present technical solution is within the scope of protection of the present invention.

Claims

1. A multi-package MOS tube testing device, characterized in that: include: Upper cover and base; the upper cover is provided with a pressure regulating assembly, and the base is provided with a detection assembly; the detection assembly is used to place the MOS tube, and the pressure regulating assembly is used to provide pressure to the MOS tube, the detection assembly includes a PCB board and a placement plate, the placement plate is provided with an open groove for placing the MOS tube, and the MOS tube is electrically connected to the PCB board; the pressure regulating assembly includes an adjusting screw, an elastic member and a pressure member; the upper cover is provided with a through cavity, the pressure member is provided in the through cavity, the upper end of the pressure member is connected to the adjusting screw, and the lower end protrudes from the through cavity and corresponds to the position of the open groove, the elastic member The elastic member is sleeved on the adjusting screw and the lower end of the elastic member is in contact with the pressure member; the PCB board includes a first PCB board and a second PCB board, and the storage plate includes a first storage plate and a second storage plate; the first storage plate and the second storage plate are both provided with the opening groove, and the second PCB board is provided with a notch corresponding to the opening groove, the second storage plate, the second PCB board, the first storage plate and the first PCB board are stacked in sequence from top to bottom, and the MOS tube is electrically connected to the first PCB board or the second PCB board; the upper cover is also provided with a lock assembly, the base is provided with a buckle, and the lock assembly cooperates with the buckle.

2. The multi-package MOS tube testing device according to claim 1, characterized in that: The pressure regulating assembly further includes a pressure head, which is arranged at the lower end of the pressure piece.

3. The multi-package MOS transistor testing device according to claim 1, characterized in that: The pressure adjustment assembly further includes a screw disk, which is embedded in the upper cover, and the adjustment screw passes through the screw disk and is connected to the pressure piece.

4. The multi-package MOS transistor testing device according to claim 3, characterized in that: The screw disk is provided with a scale mark.

5. The multi-package MOS transistor testing device according to claim 1, characterized in that: The detection component further includes a data line, the second PCB board is electrically connected to the first PCB board, and the first PCB board is electrically connected to the data line.

6. The multi-package MOS transistor testing device according to claim 5, characterized in that: The base is provided with a groove, the first PCB board is placed in the groove, one end of the data line is electrically connected to the first PCB board, and the other end protrudes from the groove.

7. The multi-package MOS transistor testing device according to claim 1, characterized in that: The upper cover and the base are rotatably connected via a pin shaft.

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