Optical module heat dissipation device and electronic equipment

Abstract

The present application provides an optical module heat sink and electronic device. The optical module heat sink comprises a cold plate and a heat conducting assembly. The cold plate has a recess, a portion of the heat conducting assembly is disposed within the recess and abuts against the inner surface of the recess, and a portion of the heat conducting assembly is abutted against an optical module mounted within the housing of an interface module. Embodiments of the present application improve the operational stability and heat dissipation performance of the optical module heat sink by increasing the contact area and connection stability between the heat conducting assembly and the cold plate.

Description

Technical Field

[0001] The present application relates to the technical field of electronic equipment, and in particular to an optical module heat dissipation device and electronic equipment. Background Art

[0002] Optical modules are optoelectronic devices that perform photoelectric and electro-optical conversion. They generate a large amount of heat during operation, so a heat sink is required to dissipate the heat. Liquid cooling plate heat sinks can effectively dissipate the heat for optical modules.

[0003] The cold plate heat dissipation device in the related technology mainly includes a heat-conducting component and a cold plate. The heat-conducting component is arranged between the cold plate and the interface module for plugging in the optical module. The interface module has a accommodating space for accommodating the optical module. The heat-conducting component is fixed to the interface module through a connecting part. One end of the heat-conducting component extends into the interface module and abuts against the optical module inserted into the interface module. The other end of the heat-conducting component abuts against the cold plate. The heat generated when the optical module is working is transferred to the cold plate through the heat-conducting component and the heat dissipation of the optical module is realized.

[0004] However, the contact stability between the heat conducting component and the cold plate in the above-mentioned related art is poor, and the contact area between the heat conducting component and the cold plate is small, resulting in poor heat dissipation effect of the optical module and affecting the working stability of the optical module. Summary of the Invention

[0005] The embodiments of the present application provide an optical module heat dissipation device and an electronic device, which are used to solve the problems in the above-mentioned related technologies such as poor contact stability between the heat-conducting component and the cold plate, and a small contact area between the heat-conducting component and the cold plate, which result in poor heat dissipation performance of the optical module heat dissipation device and affect the heat dissipation effect of the optical module.

[0006] In order to achieve the above objectives, the embodiments of the present application provide the following technical solutions:

[0007] A first aspect of an embodiment of the present application provides an optical module heat dissipation device, which includes a cold plate and a heat conducting component;

[0008] The cold plate has a recess, and a portion of the heat conducting component is arranged in the recess and abuts against an inner surface of the recess;

[0009] A portion of the heat conducting component is used to abut against the optical module installed in the accommodating space of the interface module.

[0010] Based on the above technical solution, this application can also be improved as follows.

[0011] In one possible implementation, the heat conducting assembly includes a heat conducting structure and a heat conducting pad;

[0012] The thermal pad is arranged on the outer surface of the thermal conductive structure so that the thermal conductive structure abuts against the inner surface of the recess through the thermal pad;

[0013] The end portion of the heat-conducting structure facing the interface module is penetrated through the accommodating space and is used for abutting against the optical module in the accommodating space.

[0014] In a possible implementation, the heat-conducting component further includes a heat-conducting film;

[0015] The thermal conductive film is arranged on the outside of the thermal conductive pad, and the thermal conductive pad abuts against the inner surface of the recess through the thermal conductive film; the friction resistance between the thermal conductive film and the inner surface of the recess is smaller than the sliding friction resistance between the thermal conductive pad and the inner surface of the recess.

[0016] In a possible implementation, the optical module heat dissipation device further includes an elastic member;

[0017] One end of the elastic member is connected to the heat conducting component, and the other end of the elastic member is connected to the cold plate. When the optical module is inserted into the accommodating space, the heat conducting component moves away from the interface module relative to the cold plate, and the elastic member is in a compressed state and presses the heat conducting component against the optical module.

[0018] In a possible implementation, the optical module heat dissipation device further includes a connecting member and an abutting member provided at one end of the connecting member;

[0019] A flange is provided on the outer side of the heat conducting component, the flange is spaced apart from the cold plate and the flange is connected to the cold plate via an elastic member;

[0020] The other end of the connector passes through the flange and is connected to the cold plate, and the heat conducting component can move along the axial direction of the connector;

[0021] The abutment member abuts against the surface of the flange facing the interface module to limit the distance that the heat conduction component moves toward the interface module.

[0022] In one possible implementation, the elastic member is a compression spring;

[0023] The compression spring is sleeved on the connecting piece, and one end of the compression spring in the elastic direction is connected to the flange, and the other end of the compression spring in the elastic direction is connected to the cold plate.

[0024] In a possible implementation, the cold plate has a plurality of recesses arranged at intervals;

[0025] There are multiple heat-conducting components, and a portion of each heat-conducting component is disposed in a recess.

[0026] In a possible implementation, the cold plate includes a liquid inlet and a liquid outlet, and a first flow channel, a second flow channel, and a plurality of third flow channels that are interconnected;

[0027] The first flow channel and the second flow channel are respectively arranged on both sides of the recess in the first direction; the two ends of each third flow channel are respectively connected to the first flow channel and the second flow channel, and each third flow channel is arranged on the side of the recess in the second direction, and the second direction is perpendicular to the first direction;

[0028] The liquid inlet end is communicated with the first flow channel, and the liquid outlet end is communicated with the second flow channel.

[0029] In a possible implementation, the cold plate further includes a fourth flow channel, the fourth flow channel extends along the first direction, and the fourth flow channel is parallel to the first flow channel and spaced apart;

[0030] One end of the fourth flow channel is in communication with the liquid inlet end, and the other end of the fourth flow channel is in communication with an end of the first flow channel away from the liquid inlet end, so that the first flow channel is in communication with the liquid inlet end through the fourth flow channel.

[0031] A second aspect of an embodiment of the present application provides an electronic device, comprising an optical module, a substrate, an interface module, and the optical module heat dissipation device as described above;

[0032] The interface module is arranged on the substrate, the interface module has an accommodating space, the optical module is inserted into the accommodating space, the optical module heat dissipation device is arranged on the side of the interface module away from the substrate, and the heat conductive component of the optical module heat dissipation device is passed through the accommodating space at one end facing the interface module and abuts against the optical module.

[0033] An embodiment of the present application provides an optical module heat dissipation device and an electronic device. The optical module heat dissipation device has a recess on the side of the cold plate facing the interface module, and a part of the heat-conducting component located between the interface module and the cold plate is arranged in the recess. Compared with the method of abutting the cold plate with one end away from the interface module in the prior art, the outer side surface of the heat-conducting component in the embodiment of the present application abuts the inner surface of the recess, which increases the contact area between the heat-conducting component and the cold plate, and increases the heat-conducting area of ​​the heat-conducting component to transfer heat to the cold plate, thereby improving the heat dissipation effect of the optical module. In addition, by abutting the outer side surface of the heat-conducting component with the inner surface of the recess on the cold plate, the connection stability between the heat-conducting component and the cold plate can be improved, and the use stability of the optical module heat dissipation device can be improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, a brief introduction will be given below to the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0035] Figure 1 A schematic cross-sectional view of an electronic device provided in an embodiment of the present application;

[0036] Figure 2 A cross-sectional schematic diagram of a heat dissipation device for an optical module provided in an embodiment of the present application;

[0037] Figure 3 A schematic cross-sectional view of a cold plate provided in an embodiment of the present application;

[0038] Figure 4 A schematic cross-sectional view of another cold plate provided in an embodiment of the present application.

[0039] Description of reference numerals:

[0040] 100- Optical module heat dissipation device;

[0041] 110 - cold plate; 120 - heat conducting assembly; 130 - elastic member; 140 - connecting member; 150 - abutting member; 160 - flange; 170 - liquid inlet connector; 180 - liquid outlet connector;

[0042] 111 - depression; 112 - liquid inlet; 113 - liquid outlet; 114 - first flow channel; 115 - second flow channel; 116 - third flow channel; 117 - fourth flow channel; 118 - first side; 119 - second side; 121 - heat-conducting structure; 122 - heat-conducting pad; 123 - heat-conducting film;

[0043] 200-interface module;

[0044] 210-accommodation space; 220-plug interface; 230-installation port;

[0045] 300-substrate;

[0046] 400-optical module;

[0047] 500-Support structure. DETAILED DESCRIPTION

[0048] As described in the background art, the prior art optical module heat dissipation device has poor contact stability between the heat conductive component and the cold plate, and the contact area between the heat conductive component and the cold plate is small, resulting in poor heat dissipation performance of the optical module heat dissipation device, which affects the heat dissipation effect of the optical module. The reason for this problem is that the cold plate in the prior art is flat and arranged above the interface module. One end of the heat conductive component extends into the interface module and abuts against the optical module, while the heat conductive component and the cold plate are abutted by the end of the heat conductive component away from the interface module. During the insertion and removal of the optical module, the optical module will repeatedly contact and separate from the heat conductive component, causing the heat conductive component to move up and down a certain distance in a vertical direction perpendicular to the insertion and removal direction of the optical module. After repeated insertion and removal, the connection stability between the heat conductive component and the cold plate will be reduced, resulting in a gap between the heat conductive component and the cold plate, and the heat transfer resistance between the heat conductive component and the cold plate will increase, so that the heat from the heat conductive component cannot be effectively transferred to the cold plate, thereby reducing the heat dissipation effect of the optical module.

[0049] Furthermore, since only the end face of the heat-conducting component facing the cold plate is in contact with the cold plate, the contact area between the heat-conducting component and the cold plate is small, resulting in a small heat conduction area between the heat-conducting component and the cold plate, affecting the efficiency of heat transfer from the heat-conducting component to the cold plate, thereby also affecting the heat dissipation efficiency of the optical module.

[0050] In response to the above technical problems, an embodiment of the present application provides an optical module heat dissipation device and an electronic device. The optical module heat dissipation device is configured by setting a recess on the side of the cold plate facing the interface module, and setting a part of the heat-conducting component located between the interface module and the cold plate in the recess. Compared with the method of abutting the cold plate with one end away from the interface module in the prior art, the outer side surface of the heat-conducting component in the embodiment of the present application abuts against the inner surface of the recess, which increases the contact area between the heat-conducting component and the cold plate, and increases the heat-conducting area of ​​the heat-conducting component to transfer heat to the cold plate, thereby improving the heat dissipation effect of the optical module. Moreover, by abutting the outer side surface of the heat-conducting component with the inner surface of the recess on the cold plate, the connection stability between the heat-conducting component and the cold plate can be improved, and the use stability of the optical module heat dissipation device can be improved.

[0051] In order to make the above-mentioned purposes, features and advantages of the embodiments of the present application more obvious and easy to understand, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.

[0052] refer to Figure 1According to a first aspect of an embodiment of the present application, an optical module heat dissipation device 100 is provided. The optical module heat dissipation device 100 may include a cold plate 110 and a heat conducting assembly 120. The cold plate 110 is disposed on a substrate 300 for mounting an interface module 200. The interface module 200 has an accommodating space 210 for inserting an optical module 400. The interface module 200 is disposed between the cold plate 110 and the substrate 300. In some embodiments, the substrate 300 may be a printed circuit board (PCB). The interface module 200 is primarily used to connect the optical module 400 to a device. The interface module 200 is disposed on the PCB and electrically connected to the device. One end of the interface module 200 has an insertion port 220. The accommodating space 210 communicates with the exterior of the interface module 200 via the insertion port 220. The optical module 400 can be inserted into the accommodating space 210 via the insertion port 220. The cold plate 110 is fixed to the base plate 300 and is located above the interface module 200. The cold plate 110 is spaced apart from the interface module 200 and can be connected to a support structure 500 provided on the base plate 300. In some embodiments, the support structure 500 can be a plurality of support rods provided on the base plate 300.

[0053] refer to Figure 1 and Figure 2 In some embodiments, the thermal conductive assembly 120 is positioned between the interface module 200 and the cold plate 110. The portion of the thermal conductive assembly 120 facing the interface module 200 extends through the accommodating space 210 and abuts the optical module 400 inserted into the accommodating space 210. A mounting opening 230 is defined on the upper wall of the interface module 200. The downwardly facing end of the thermal conductive assembly 120 is disposed within the accommodating space 210 of the interface module 200 through the mounting opening 230. The thermal conductive assembly 120 is capable of moving up and down relative to the mounting opening 230. When the optical module 400 is inserted into the accommodating space 210, the surface of the optical module 400 facing the thermal conductive assembly 120 abuts against the surface of the thermal conductive assembly 120 facing the substrate 300, and the optical module 400 presses the thermal conductive assembly 120 toward the cold plate 110, causing it to move a certain distance. When the optical module 400 is separated from the thermally conductive assembly 120, the thermally conductive assembly 120 moves toward the base plate 300 and returns to the position when the optical module 400 is not inserted into the interface module 200. It is understood that when the thermally conductive assembly 120 moves, the cold plate 110 does not move, that is, the thermally conductive assembly 120 moves relative to the cold plate 110.

[0054] The cold plate 110 has a recess 111 on the side facing the interface module 200. A portion of the thermal conductive component 120 is disposed within the recess 111, with the outer surface of the thermal conductive component 120 abutting the inner surface of the recess 111. The thermal conductive component 120 uses its outer surface as a heat transfer surface for heat transfer with the cold plate 110, transferring heat from the thermal conductive component 120 to the cold plate 110. The portion of the thermal conductive component 120 disposed within the recess 111 and the inner surface of the recess 111 can be an interference fit, so that the thermal conductive component 120 abuts the inner surface of the recess 111 through frictional resistance between its outer surface and the inner surface of the recess 111.

[0055] It should be noted that a certain distance may be provided between the end of the thermal conductive component 120 facing the cold plate 110 and the bottom of the recess 111 to provide space for the thermal conductive component 120 to move up and down. Alternatively, the recess 111 on the cold plate 110 may be a through-slot, i.e., the recess 111 is a through-slot structure that extends in the direction of the up and down movement of the thermal conductive component 120, and the portion of the thermal conductive component 120 located in the recess 111 can be removed from the through-slot away from the port of the substrate 300. Alternatively, the substrate 300 connected to the cold plate 110 can have a certain elastic deformation ability. When the optical module 400 is inserted into the interface module 200 and squeezes the thermal conductive component 120 to move toward the cold plate 110, the elastic deformation of the substrate 300 can increase the distance between the cold plate 110 and the substrate 300, thereby providing space for the thermal conductive component 120 to move toward the cold plate 110. When the optical module 400 is separated from the thermal conductive component 120, the substrate 300 returns to its original state and the distance between the cold plate 110 and the substrate 300 returns to its original state. At this time, the thermal conductive component 120 returns to the position when the optical module 400 is not inserted into the accommodating space 210 under the action of the restoring force of the substrate 300.

[0056] The embodiment of the present application provides an optical module heat dissipation device 100 and an electronic device. The optical module heat dissipation device 100 has a recess 111 on the side of the cold plate 110 facing the interface module 200, and a portion of the heat conductive component 120 located between the interface module 200 and the cold plate 110 is set in the recess 111. Compared with the method in the prior art where the end away from the interface module 200 abuts the cold plate 110, the outer side surface of the heat conductive component 120 in the embodiment of the present application abuts the inner surface of the recess 111, thereby increasing the contact area between the heat conductive component 120 and the cold plate 110, and increasing the heat conductive area for the heat conductive component 120 to transfer heat to the cold plate 110, thereby improving the heat dissipation effect of the optical module 400. In addition, by abutting the outer side surface of the heat conductive component 120 with the inner surface of the recess 111 on the cold plate 110, the connection stability between the heat conductive component 120 and the cold plate 110 can be improved, and the use stability of the optical module heat dissipation device 100 can be improved.

[0057] refer to Figure 1 and Figure 2 In one possible implementation, the thermally conductive assembly 120 may include a thermally conductive structure 121 and a thermally conductive pad 122. The thermally conductive pad 122 is disposed on the outer surface of the thermally conductive structure 121 so that the thermally conductive structure 121 abuts the inner surface of the recess 111 of the cold plate 110 through the thermally conductive pad 122. The end of the thermally conductive structure 121 facing the interface module 200 is inserted into the accommodating space 210 and abuts the optical module 400 in the accommodating space 210. The thermally conductive structure 121 may be a rectangular block structure, and the thermally conductive pad 122 is attached to the side of the thermally conductive structure 121. The thermally conductive pad 122 may have a certain elastic compression in the thickness direction, so that the thermally conductive assembly 120 can achieve an interference fit between the thermally conductive assembly 120 and the recess 111 of the cold plate 110 by changing the compression of the thermally conductive pad 122 in the thickness direction, thereby abutting the thermally conductive assembly 120 with the recess 111 of the cold plate 110 through the friction resistance between the thermally conductive pad 122 and the inner surface of the recess 111.

[0058] It should be noted that the thermal pad 122 in the prior art is arranged at the end of the thermal conductive structure 121 away from the interface module 200, and the end of the thermal conductive structure 121 is thermally connected to the cold plate 110 through the thermal pad 122. Since the thickness direction of the thermal pad 122 is the same as the displacement direction of the thermal conductive structure 121 under the extrusion of the optical module 400, the thermal pad 122 will produce creep after repeated compression, resulting in the thickness of the thermal pad 122 being reduced compared to the thickness before use, thereby resulting in poor contact between the thermal conductive structure 121 and the optical module 400, or between the thermal conductive structure 121 and the thermal pad 122, and further resulting in a reduction in the thermal conductivity of the thermal conductive structure 121, affecting the heat dissipation effect of the optical module 400. In the embodiment of the present application, the thermal pad 122 is arranged on the side of the thermal conductive structure 121. The up and down displacement of the thermal conductive structure 121 has little effect on the compression deformation of the thermal pad 122 in the thickness direction, thereby not affecting the connection stability between the thermal conductive structure 121 and the thermal conductive pad 122, nor affecting the connection stability between the thermal conductive structure 121 and the optical module 400, thereby improving the heat dissipation effect of the optical module 400.

[0059] In a specific implementation, the heat-conducting structure 121 has a trapezoidal boss at one end facing the interface module 200, the end with a larger cross-sectional dimension on the trapezoidal boss faces the cold plate 110, and the end with a smaller cross-sectional dimension on the trapezoidal boss faces the optical module 400 in the accommodating space 210, so that the optical module 400 can lift the heat-conducting component 120 toward the cold plate 110.

[0060] refer to Figure 1In one possible implementation, the thermally conductive assembly 120 may further include a thermally conductive film 123 disposed on the outside of the thermal pad 122. The thermal pad 122 abuts against the inner surface via the thermally conductive film 123, and the frictional resistance between the thermally conductive film 123 and the inner surface is less than the sliding frictional resistance between the thermal pad 122 and the inner surface. The provision of the thermally conductive film 123 can reduce the frictional resistance between the thermally conductive assembly 120 and the cold plate 110, facilitating displacement of the thermally conductive assembly 120 relative to the cold plate 110, thereby facilitating insertion of the optical module 400 into the accommodating space 210 of the interface module 200 and facilitating lifting of the thermally conductive structure 121 in the thermally conductive assembly 120.

[0061] In some examples, the thermally conductive film 123 can be a polyimide film (PI film). The polyimide film has excellent high and low temperature resistance, electrical insulation, adhesion, radiation resistance, and dielectric resistance. It can be used for a long time in the temperature range of -269°C to 280°C, and can reach a high temperature of 400°C for a short time.

[0062] refer to Figure 1 In a specific implementation, the optical module heat sink 100 may further include an elastic member 130. One end of the elastic member 130 is connected to the thermal conductive assembly 120, and the other end of the elastic member 130 is connected to the cold plate 110. When the optical module 400 is inserted into the accommodating space 210, the thermal conductive assembly 120 moves away from the substrate 300 relative to the cold plate 110, and the elastic member 130 is compressed, causing the thermal conductive assembly 120 to press against the optical module 400. The provision of the elastic member 130 improves the contact tightness between the thermal conductive assembly 120 and the optical module 400, reduces the heat transfer resistance between the thermal conductive assembly 120 and the optical module 400, improves the heat transfer efficiency between the optical module 400 and the thermal conductive assembly 120, and enhances the operational stability of the optical module heat sink 100.

[0063] It should be noted that when the optical module 400 in the accommodating space 210 is separated from the thermal conductive component 120, the elastic member 130 can also push the thermal conductive component 120 to move relative to the cold plate 110 toward the interface module 200, so that the thermal conductive component 120 returns to the position when the optical module 400 is not in contact with the thermal conductive component 120, thereby avoiding the thermal conductive component 120 being unable to return to its original position after repeated plugging and unplugging of the optical module 400, and avoiding the problem of poor contact stability between the optical module 400 and the thermal conductive component 120 when the optical module 400 is inserted into the accommodating space 210.

[0064] In an exemplary embodiment, if the thermally conductive assembly 120 includes a thermally conductive structure 121 and a thermally conductive pad 122, one end of the elastic member 130 is connected to the cold plate 110, and the other end of the elastic member 130 is connected to the thermally conductive structure 121. It is understood that the portion of the thermally conductive structure 121 that is connected to the elastic member 130 does not extend into the accommodating space 210, nor is it disposed within the recess 111 of the cold plate 110. Furthermore, the elastic restoring force of the elastic member 130 must be at least greater than the frictional resistance between the thermally conductive pad 122 and the inner surface of the recess 111 of the cold plate 110, so that the elastic member 130 can push the thermally conductive structure 121 and the thermally conductive pad 122 toward the interface module 200. Similarly, if the thermally conductive component 120 also includes a thermally conductive film 123, the elastic restoring force of the elastic member 130 needs to be at least greater than the friction resistance between the thermally conductive film 123 and the inner surface of the recess 111 of the cold plate 110, so that the elastic member 130 can push the thermally conductive structure 121, the thermally conductive pad 122 and the thermally conductive film 123 toward the interface module 200.

[0065] refer to Figure 1 In some examples, the optical module heat dissipation device 100 may further include a connector 140 and an abutment member 150 disposed at one end of the connector 140. A flange 160 is disposed on the outer side of the thermal conductive component 120. The flange 160 is spaced apart from the cold plate 110 and connected to the cold plate 110 via an elastic member 130. The other end of the connector 140 passes through the flange 160 and is connected to the cold plate 110. The thermal conductive component 120 moves axially along the connector 140, and the abutment member 150 abuts against the surface of the flange 160 facing the interface module 200 to limit the distance that the thermal conductive component 120 moves toward the substrate 300. By using the connecting member 140 and the abutment member 150, the displacement of the thermal conductive component 120 toward the interface module 200 can be limited, thereby preventing the thermal conductive component 120 from extending too far into the accommodating space 210 of the interface module 200 under the action of the restoring force of the elastic member 130, thereby reducing the risk of the optical module 400 and the thermal conductive component 120 being hindered from abutting against each other due to the thermal conductive component 120 extending too far into the accommodating space 210.

[0066] In a specific implementation, if the heat conducting assembly 120 includes a heat conducting structure 121, the flange 160 is disposed on the heat conducting structure 121, and the flange 160 extends in a direction away from the side of the heat conducting structure 121. The connecting member 140 and the abutting member 150 can be an integrally formed structure, and the connecting member 140 and the abutting member 150 together constitute a bolt. For example, the connecting member 140 can be a threaded section of the bolt, and the abutting member 150 can be the head of the bolt.

[0067] refer to Figure 1In one possible implementation, elastic member 130 is a compression spring that is sleeved onto connector 140. One end of the compression spring, in the direction of the spring force, is connected to flange 160, while the other end, in the direction of the spring force, is connected to cold plate 110. Sleeving the compression spring onto connector 140 improves space utilization between thermally conductive assembly 120 and cold plate 110, and enhances the integration of optical module heat dissipation device 100.

[0068] Continue to refer Figure 2 If the interface module 200 has multiple along the first direction (the first direction is as Figure 2 When the cold plate 110 includes accommodating spaces 210 spaced apart (indicated by the arrow x in the middle), the cold plate 110 has a plurality of recesses 111 spaced apart along a first direction, with each recess 111 corresponding to one of the accommodating spaces 210. The heat conducting components 120 may include a plurality of heat conducting components 120, one end of each heat conducting component 120 being disposed within one of the accommodating spaces 210, and the other end of each heat conducting component 120 being disposed within a recess 111 corresponding to the accommodating space 210. The first direction is perpendicular to the insertion direction of the optical module 400. In a specific implementation, each optical module 400 can be plugged into one of the accommodating spaces 210, thereby enabling the interface module 200 to simultaneously plug into multiple optical modules 400, and allowing the optical module heat dissipation device 100 to simultaneously dissipate heat for multiple optical modules 400.

[0069] refer to Figure 3 The cold plate 110 may include a liquid inlet 112 and a liquid outlet 113, as well as a first flow channel 114, a second flow channel 115, and a plurality of third flow channels 116 that are interconnected. The liquid inlet 112 and the liquid outlet 113 are located on the same side of the cold plate 110. The liquid in the cold plate 110 may be a coolant. The liquid inlet 112 is provided with a liquid inlet connector 170. The liquid inlet connector 170 is used to connect to an external cooling system and to deliver the coolant from the cooling system to the various flow channels in the cold plate 110 through the liquid inlet connector 170. The liquid outlet 113 of the cold plate 110 is provided with a liquid outlet connector 180. The liquid outlet connector 180 is connected to the cooling system and is used to deliver the coolant that has absorbed heat in the cold plate 110 to the cooling system through the liquid outlet connector 180, thereby allowing the coolant to circulate between the cold plate 110 and the cooling system through the liquid inlet connector 170 and the liquid outlet connector 180 for cooling.

[0070] refer to Figure 3 In some embodiments, the first flow channel 114 and the second flow channel 115 are respectively disposed in the first direction (the first direction is as shown in FIG. Figure 3The two sides of the first direction can be understood as the two opposite first side portions 118 of the recess 111. The two ends of each third flow channel 116 are respectively connected to the first flow channel 114 and the second flow channel 115, and each third flow channel 116 is arranged on the side of the recess 111 in the second direction, and the side in the second direction can be understood as the second side portion 119 of the recess 111. The second direction is perpendicular to the first direction. The liquid inlet end 112 is connected to the first flow channel 114, and the liquid outlet end 113 is connected to the second flow channel 115. The flow direction of the liquid in each flow channel is as shown in FIG. Figure 3 As shown by the arrows in the figure, the liquid in the first flow channel 114 flows in a direction away from the liquid inlet end 112 and the liquid outlet end 113, and the liquid in the second flow channel 115 flows toward the liquid inlet end 112 and the liquid outlet end 113, that is, the flow direction of the liquid in the first flow channel 114 is opposite to that of the liquid in the second flow channel 115.

[0071] In a specific implementation, liquid flows from the liquid inlet end 112 into the first flow channel 114, and further flows through the first flow channel 114 into each third flow channel 116 connected to the first flow channel 114, and then flows through each third flow channel 116 into the second flow channel 115. Finally, the liquid in the second flow channel 115 flows out of the cold plate 110 through the liquid outlet end 113. By providing flow channels on both first side portions 118 of the recess 111 and multiple second side portions 119 between adjacent recesses 111, the amount of heat absorbed by the cold plate 110 from the heat conducting component 120 can be increased, thereby improving the heat transfer efficiency of the heat conducting component 120, and further improving the heat dissipation efficiency of the optical module heat dissipation device 100.

[0072] refer to Figure 4 , the flow direction of the liquid in each channel is as follows Figure 4 As shown by the arrow in FIG. 1 , the cold plate 110 may further include a fourth flow channel 117, the fourth flow channel 117 extending in the first direction (the first direction is as shown in FIG. Figure 4 The fourth flow channel 117 extends in the direction of the arrow x in the middle, and is parallel to and spaced from the first flow channel 114. One end of the fourth flow channel 117 is in communication with the liquid inlet end 112, and the other end of the fourth flow channel 117 is connected to the end of the first flow channel 114 away from the liquid inlet end 112, so that the first flow channel 114 is connected to the liquid inlet end 112 through the fourth flow channel 117. By providing the fourth flow channel 117 and connecting the end of the fourth flow channel 117 away from the liquid inlet end 112 with the end of the first flow channel 114 away from the liquid inlet end 112, the liquid in the first flow channel 114 and the liquid in the second flow channel 115 can both flow toward the liquid outlet end 113. That is, the liquids in the first flow channel 114 and the second flow channel 115 flow in the same direction, so that the liquids in the first flow channel 114 and the second flow channel 115 can gradually flow toward the liquid inlet end 112 and the liquid outlet end 113 within the cold plate 110.

[0073] refer to Figure 1 According to a second aspect of an embodiment of the present application, an electronic device is provided. The electronic device may include an optical module 400, a substrate 300, an interface module 200, a support structure 500, and the optical module heat dissipation device 100 as described above. The interface module 200 is disposed on the substrate 300. The interface module 200 has an accommodating space 210. The optical module 400 is inserted into the accommodating space 210. One end of the support structure 500 is disposed on the substrate 300. The cold plate in the optical module heat dissipation device 100 is connected to the other end of the support structure 500 and is disposed on a side of the interface module 200 away from the substrate 300. The heat conducting component 120 of the optical module heat dissipation device 100 is disposed in the accommodating space 210 toward one end of the interface module 200 and abuts against the optical module 400. By using the optical module heat dissipation device 100, the electronic device can improve the connection stability between the thermal conductive component 120 and the optical module 400, thereby improving the thermal conductivity stability between the optical module 400 and the thermal conductive component 120, thereby improving the heat dissipation effect of the optical module 400 and the heat dissipation effect of the electronic device.

[0074] The various embodiments or implementation methods in this specification are described in a progressive manner. Each embodiment focuses on the differences from other embodiments, and the same or similar parts between the various embodiments can be referenced to each other.

[0075] It should be noted that phrases such as "in a specific implementation," "in some embodiments," "in this embodiment," and "exemplarily" mentioned in the specification indicate that the described embodiment may include a particular feature, structure, or characteristic, but not every embodiment necessarily includes that particular feature, structure, or characteristic. Furthermore, such phrases do not necessarily refer to the same embodiment. Furthermore, when a particular feature, structure, or characteristic is described in conjunction with an embodiment, it is within the knowledge of those skilled in the art to implement such a feature, structure, or characteristic in conjunction with other embodiments, whether explicitly described or not.

[0076] Generally speaking, terms should be understood, at least in part, based on the context in which they are used. For example, as used herein, the term "one or more" can be used to describe any feature, structure, or characteristic in the singular sense, or can be used to describe a combination of features, structures, or characteristics in the plural sense, depending at least in part on the context. Similarly, terms such as "a," "an," or "the" can also be understood to convey either singular or plural usage, depending at least in part on the context.

[0077] It should be readily understood that “on,” “above,” and “over” in this disclosure should be interpreted in the broadest manner, such that “on” means not only “directly on something,” but also includes “on something” with intervening features or layers therebetween, and “above” or “over” includes not only the meaning of “above” or “over,” but also includes “above” or “over” with no intervening features or layers therebetween (i.e., directly on something).

[0078] Additionally, spatially relative terms, such as "below," "beneath," "beneath," "above," and the like, may be used herein for ease of description to describe the relationship of one element or feature relative to other elements or features as shown in the figures. Spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. The device may be in other orientations (rotated 90 degrees or at other orientations), and the spatially relative descriptors used herein should be interpreted accordingly.

[0079] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some or all of the technical features therein. These modifications or replacements do not deviate the essence of the corresponding technical solutions from the scope of the technical solutions of the embodiments of the present application.

Claims

1. An optical module heat dissipation device, characterized in that: Includes cold plate and thermal conductive components; The cold plate has a recess, and a portion of the heat conducting component is arranged in the recess and abuts against an inner surface of the recess; A portion of the heat conducting component is used to abut against the optical module installed in the accommodation space of the interface module; The cold plate has a plurality of recesses arranged at intervals; There are multiple heat-conducting components, and a portion of each heat-conducting component is disposed in one of the recesses; The optical module heat dissipation device further includes an elastic member; One end of the elastic member is connected to the heat-conducting component, and the other end of the elastic member is connected to the cold plate. When the optical module is inserted into the accommodating space, the heat-conducting component moves away from the interface module relative to the cold plate, and the elastic member is in a compressed state and presses the heat-conducting component against the optical module.

2. The optical module heat dissipation device according to claim 1, characterized in that: The heat-conducting assembly includes a heat-conducting structure and a heat-conducting pad; The thermal pad is disposed on the outer surface of the thermally conductive structure, so that the thermally conductive structure abuts against the inner surface of the recess through the thermal pad; The end portion of the heat-conducting structure facing the interface module is penetrated through the accommodating space and is used for abutting against the optical module in the accommodating space.

3. The optical module heat dissipation device according to claim 2, characterized in that: The heat-conducting component further includes a heat-conducting film; The thermally conductive film is arranged on the outside of the thermally conductive pad, and the thermally conductive pad abuts against the inner surface of the recess through the thermally conductive film; the friction resistance between the thermally conductive film and the inner surface of the recess is smaller than the sliding friction resistance between the thermally conductive pad and the inner surface of the recess.

4. The optical module heat dissipation device according to any one of claims 1 to 3, characterized in that: The optical module heat dissipation device further includes a connecting member and an abutting member provided at one end of the connecting member; The outer side of the heat conducting component is provided with a flange, the flange is spaced apart from the cold plate and the flange is connected to the cold plate through the elastic member; The other end of the connecting member passes through the flange and is connected to the cold plate, and the heat conducting component can move along the axial direction of the connecting member; The abutment member abuts against the surface of the flange facing the interface module to limit the distance that the heat conduction component moves toward the interface module.

5. The optical module heat dissipation device according to claim 4, characterized in that: The elastic member is a compression spring; The compression spring is sleeved on the connecting member, and one end of the compression spring in the elastic direction is connected to the flange, and the other end of the compression spring in the elastic direction is connected to the cold plate.

6. The optical module heat dissipation device according to claim 1, characterized in that: The cold plate includes a liquid inlet and a liquid outlet, and a first flow channel, a second flow channel and a plurality of third flow channels that are interconnected; The first flow channel and the second flow channel are respectively arranged on both sides of the recess in the first direction; the two ends of each third flow channel are respectively connected to the first flow channel and the second flow channel, and each third flow channel is arranged on the side of the recess in the second direction, and the second direction is perpendicular to the first direction; The liquid inlet end is communicated with the first flow channel, and the liquid outlet end is communicated with the second flow channel.

7. The optical module heat dissipation device according to claim 6, characterized in that: The cold plate further includes a fourth flow channel, the fourth flow channel extending along the first direction, and the fourth flow channel is parallel to and spaced apart from the first flow channel; One end of the fourth flow channel is in communication with the liquid inlet end, and the other end of the fourth flow channel is in communication with an end of the first flow channel away from the liquid inlet end, so that the first flow channel is in communication with the liquid inlet end through the fourth flow channel.

8. An electronic device, characterized in that: It comprises an optical module, a substrate, an interface module, and an optical module heat dissipation device according to any one of claims 1 to 7; The interface module is arranged on the substrate, the interface module has an accommodating space, the optical module is inserted into the accommodating space, the optical module heat dissipation device is arranged on the side of the interface module away from the substrate, and the heat conductive component of the optical module heat dissipation device is passed through the accommodating space toward one end of the interface module and abuts against the optical module.

Images