Substrate handling, exposure apparatus and method, flat panel display and component manufacturing method

Abstract

The present invention provides a substrate handling and exposure apparatus, method, flat panel display, and component manufacturing method to shorten the time spent on substrate replacement. The substrate handling apparatus transports a substrate to a holding device and includes: a first holding part that holds the substrate above the holding device; a second holding part that holds a portion of the substrate held by the first holding part; and a driving part that moves one of the holding device and the second holding part relative to the first holding part relative to the other, such that the first holding part retracts from above the holding device; and the holding device, the first holding part, and the second holding part hold the substrate during the relative movement performed by the driving part.

Description

[0001] Related divisional application

[0002] This application is a divisional application of the invention patent application filed on September 29, 2017, with application number 201780095223.2, entitled "Substrate handling apparatus, exposure apparatus, manufacturing method of flat panel display, component manufacturing method, substrate handling method and exposure method". Technical Field

[0003] This invention relates to a substrate handling apparatus, an exposure apparatus, a method for manufacturing a flat panel display, a method for manufacturing components, a substrate handling method, and an exposure method. Background Technology

[0004] In the photolithography process for manufacturing electronic components such as liquid crystal display devices and semiconductor devices, an exposure device is always used. The exposure device uses an energy beam to transfer the pattern formed on the mask (or photomask) onto the substrate (a substrate made of glass or plastic, a semiconductor wafer, etc.).

[0005] In this type of exposure apparatus, the exposed substrate is removed from the platform device holding the substrate, and a new substrate is placed onto the platform device. Methods for handling the substrate, such as those described in Patent Document 1, are already known.

[0006] Existing technical documents

[0007] Patent documents

[0008] Patent Document 1: International Publication No. 2013 / 150787 Summary of the Invention

[0009] According to a first embodiment, a substrate transport apparatus is provided that transports a substrate to a holding device, and includes: a first holding portion that holds the substrate above the holding device; a second holding portion that holds a portion of the substrate held by the first holding portion; and a driving portion that moves one of the holding device and the second holding portion relative to the other relative to the first holding portion, such that the first holding portion retracts from above the holding device; and the holding device, the first holding portion, and the second holding portion hold the substrate during the relative movement performed by the driving portion.

[0010] According to a second embodiment, an exposure apparatus is provided, comprising: the substrate transport device; and an optical system for exposing the substrate to an energy beam after it has been transported to the holding device.

[0011] According to a third embodiment, a method for manufacturing a flat panel display is provided, comprising: exposing a substrate using the exposure apparatus; and developing the exposed substrate.

[0012] According to a fourth embodiment, a method for manufacturing a component is provided, comprising: exposing a substrate using the exposure apparatus; and developing the exposed substrate.

[0013] According to a fifth embodiment, a substrate transport method is provided, which transports a substrate to a holding device, and includes: holding the substrate above the holding device by means of a first holding portion and a second holding portion; and moving one of the holding device and the second holding portion relative to the other with the first holding portion retracting from above the holding device; and during the relative movement, the holding device, the first holding portion and the second holding portion hold the substrate.

[0014] According to a sixth embodiment, an exposure method is provided, comprising: transporting the substrate to the holding device by the substrate transport method; and irradiating the substrate with an energy beam to expose the substrate.

[0015] According to a seventh embodiment, a method for manufacturing a flat panel display is provided, comprising: exposing a substrate using the exposure method; and developing the exposed substrate.

[0016] According to an eighth embodiment, a method for manufacturing a component is provided, comprising: exposing a substrate using the exposure method; and developing the exposed substrate.

[0017] Furthermore, the configuration of the following embodiments can be appropriately modified, and at least some components can be replaced with other components. Moreover, the configuration elements are not particularly limited in their arrangement and are not limited to the configuration disclosed in the embodiments; they can be configured in positions where their functions can be achieved. Attached Figure Description

[0018] Figure 1 This diagram is a schematic representation of the configuration of the exposure apparatus according to the first embodiment.

[0019] Figure 2 for Figure 1 A plan view of the platform device and substrate handling device of the exposure apparatus (partially omitted).

[0020] Figure 3 (a) is a plan view of the platform device according to the first embodiment. Figure 3 (b) is a side view. Figure 3 (c) is Figure 3AA section view of (a).

[0021] Figure 4 (a)~ Figure 4 (c) is a side view (one) of an exposure apparatus used to explain the substrate replacement operation of the first embodiment.

[0022] Figure 5 (a)~ Figure 5 (c) is a side view (second part) of the exposure apparatus used to explain the substrate replacement operation of the first embodiment.

[0023] Figure 6 (a)~ Figure 6 (c) is a side view (third) of the exposure apparatus used to explain the substrate replacement operation of the first embodiment.

[0024] Figure 7 (a)~ Figure 7 (c) is a side view (fourth) of the exposure apparatus used to explain the substrate replacement operation of the first embodiment.

[0025] Figure 8 (a)~ Figure 8 (c) is a side view (fifth) of the exposure apparatus used to explain the substrate replacement operation of the first embodiment.

[0026] Figure 9 (a)~ Figure 9 (c) is a side view of the exposure apparatus used to explain the substrate replacement operation of the first variant of the first embodiment.

[0027] Figure 10 (a) is a perspective view of the substrate handling hand in the second variation of the first embodiment. Figure 10 (b) is a side view.

[0028] Figure 11 (a) and Figure 11 (b) is a side view of the exposure apparatus used to explain the substrate replacement operation of the third variation of the first embodiment.

[0029] Figure 12 (a) is a top view of the substrate handling hand in the fourth variation of the first embodiment. Figure 12 (b) is Figure 12 AA section view of (a).

[0030] Figure 13 (a) and Figure 13 (b) is a diagram used to explain the substrate loading operation of the substrate loading hand using the fourth variation of the first embodiment.

[0031] Figure 14 (a) and Figure 14 (b) is a cross-sectional view of a substrate handling hand, schematically representing a fifth variation of the first embodiment.

[0032] Figure 15 (a) and Figure 15 (b) are a top view and a side view of the exposure apparatus of the second embodiment, respectively.

[0033] Figure 16 (a) and Figure 16 (b) is a perspective view of the substrate handling hand of the second embodiment.

[0034] Figure 17 (a) and Figure 17 (b) are a top view and a side view (one) of the exposure apparatus used to explain the substrate replacement operation of the second embodiment.

[0035] Figure 18 (a) and Figure 18 (b) are a top view and a side view (second) of the exposure apparatus used to explain the substrate replacement operation of the second embodiment.

[0036] Figure 19 (a) and Figure 19 (b) are a top view and a side view (third) of the exposure apparatus used to explain the substrate replacement operation of the second embodiment.

[0037] Figure 20 (a) and Figure 20 (b) are a top view and a side view (fourth) of the exposure apparatus used to explain the substrate replacement operation of the second embodiment.

[0038] Figure 21 (a) and Figure 21 (b) are a top view and a side view (fifth) of the exposure apparatus used to explain the substrate replacement operation of the second embodiment.

[0039] Figure 22 (a) and Figure 22 (b) are a top view and a side view (sixth) of the exposure apparatus used to explain the substrate replacement operation of the second embodiment.

[0040] Figure 23 (a) and Figure 23 (b) are a top view and a side view (seventh) of the exposure apparatus used to explain the substrate replacement operation of the second embodiment.

[0041] Figure 24 (a) and Figure 24 (b) are a top view and a side view (eighth) of the exposure apparatus used to explain the substrate replacement operation of the second embodiment.

[0042] Figure 25 (a) and Figure 25 Figures (b) are used to explain the advantages of the substrate handling hand in the second embodiment.

[0043] Figure 26 (a) and Figure 26 (b) are a top view and a side view of the exposure apparatus used to explain the substrate replacement operation of the first variant of the second embodiment.

[0044] Figure 27 (a) and Figure 27 (b) are a top view and a side view (one) of the exposure apparatus used to explain the substrate replacement operation of the second variation of the second embodiment.

[0045] Figure 28 (a) and Figure 28 (b) are a top view and a side view (second) of the exposure apparatus used to explain the substrate replacement operation of the second variation of the second embodiment.

[0046] Figure 29 (a) and Figure 29 (b) are a top view and a side view (third) of the exposure apparatus used to explain the substrate replacement operation of the second variation of the second embodiment.

[0047] Figure 30 (a) and Figure 30 (b) are a top view and a side view (fourth) of the exposure apparatus used to explain the substrate replacement operation of the second variation of the second embodiment.

[0048] Figure 31 (a) and Figure 31 (b) is a side view of a substrate handling device used to explain the transfer of a substrate from a beam unit to a substrate in a third variation of the second embodiment.

[0049] Figure 32 (a) and Figure 32 (b) are a top view and a side view (one of them) of the exposure apparatus used to explain the transfer of the substrate from the crossbeam unit to the substrate in the fourth variation of the second embodiment.

[0050] Figure 33 (a) and Figure 33(b) are a top view and a side view (second) of the exposure apparatus used to explain the transfer of the substrate from the crossbeam unit to the substrate in the fourth variation of the second embodiment.

[0051] Figure 34 (a) and Figure 34 (b) are a top view and a side view (one of them) of the exposure apparatus used to explain the transfer of the substrate from the external transport device to the substrate in the fifth variation of the second embodiment.

[0052] Figure 35 (a) and Figure 35 (b) are a top view and a side view (second) of the exposure apparatus used to explain the transfer of the substrate from the external transport device to the substrate in the fifth variation of the second embodiment.

[0053] Figure 36 This is a perspective view showing the substrate handling hand of the sixth variation of the second embodiment.

[0054] Figure 37 (a) and Figure 37 Figure (b) illustrates an example of the configuration of the substrate handling hand.

[0055] Figure 38 This diagram illustrates an example of the configuration of the substrate transport section.

[0056] Figure 39 This is a diagram used to illustrate the configuration of the mounting plate.

[0057] Figure 40 (a) and Figure 40 (b) are a top view and a side view showing the configuration of the platform device in the first embodiment, the second embodiment, and their variations.

[0058] Figure 41 (a) is a top view showing other examples of platform devices. Figure 41 (b) and Figure 41 (c) is Figure 41 AA section view of (a).

[0059] Figure 42 (a) is a top view representing another example of a platform device. Figure 42 (b) is Figure 42 AA section view of (a).

[0060] Figure 43 (a)~ Figure 43 (c) is used to... Figure 42 (a) and Figure 42(b) is a side view illustrating the substrate mounted on the platform device.

[0061] Explanation of symbols

[0062] 10A~10L: Exposure apparatus

[0063] 20A, 20G, 20M, 20N: Platform devices

[0064] 28A, 28G, 28M, 28N: Substrate holders

[0065] 100A~100L: Substrate handling device

[0066] 160A~160L: Substrate handling section

[0067] 161A~161L: Substrate Handling

[0068] 164: X-axis drive unit

[0069] 182A, 182G, 182M: Substrate loading and support device

[0070] 184a: Retaining pad

[0071] P, P1, P2, P3: Substrate Detailed Implementation

[0072] First Implementation Method

[0073] First, according to Figures 1 to 8 (c) will describe the first embodiment of the present invention.

[0074] Figure 1 The configuration of the exposure apparatus 10A according to the first embodiment is shown in a simplified manner. Furthermore, Figure 2 for Figure 1 A plan view of the platform device 20A and the substrate transport device 100A included in the exposure apparatus 10A (partially omitted). Additionally, Figure 3 (a) is a plan view of platform device 20A. Figure 3 (b) is a side view of platform device 20A. Figure 3 (c) is Figure 3 AA section view of (a).

[0075] Exposure apparatus 10A is, for example, a projection exposure apparatus using a step and scan method that takes a rectangular (square) glass substrate P (hereinafter referred to as substrate P) used in liquid crystal display devices (flat panel displays) as the object of exposure, also known as a scanner.

[0076] like Figure 1As shown, the exposure apparatus 10A includes an illumination system 12, a mask platform 14 for holding a mask M on which a circuit pattern or other pattern is formed, a projection optical system 16, and a surface holding ( Figure 1 The system includes a platform device 20A, a substrate handling device 100A, and a control system for a substrate P on the +Z side (the side facing the center) coated with a resist (sensor). The following are examples of such systems. Figure 1 As shown, the exposure apparatus 10A is configured with mutually orthogonal X-axis, Y-axis, and Z-axis (optical axes AX of the illumination system 12 and the projection optical system 16) so that during exposure, the mask M and the substrate P are scanned relative to the projection optical system 16 along the X-axis direction, and the Y-axis is set in a horizontal plane. Furthermore, the rotation (tilt) directions around the X-axis, Y-axis, and Z-axis are defined as θx, θy, and θz directions, respectively. Additionally, the positions related to the X-axis, Y-axis, and Z-axis directions are defined as X position, Y position, and Z position, respectively.

[0077] The illumination system 12 is configured similarly to the illumination system disclosed in U.S. Patent No. 5,729,331, etc., illuminating the mask M with illumination light (illumination light) IL for exposure. The illumination light IL can be light containing at least one wavelength selected from i-rays (wavelength 365 nm), g-rays (wavelength 436 nm), and h-rays (wavelength 405 nm). Furthermore, the light source used in the illumination system 12 and the wavelength of the illumination light IL illuminating from said light source are not particularly limited; for example, it can be ultraviolet light such as ArF excimer laser (wavelength 193 nm), KrF excimer laser (wavelength 248 nm), or vacuum ultraviolet light such as F2 laser (wavelength 157 nm).

[0078] The mask platform 14 holds the light-transmitting mask M. The mask platform 14 is driven, for example, by a mask platform drive system (not shown) including a linear motor, with a predetermined stroke at least in the scanning direction (X-axis direction). Additionally, to adjust its relative position to at least any of the illumination system 12, platform device 20A, and projection optics system 16, the mask platform 14 is driven by a micro-motion drive system that moves its X or Y position by a stroke. The position information of the mask platform 14 is obtained, for example, by a mask platform position measurement system (not shown) including a linear encoder system or an interferometer system.

[0079] The projection optical system 16 is disposed below the mask platform 14. The projection optical system 16 may be, for example, a so-called multi-lens type projection optical system with the same configuration as that disclosed in U.S. Patent No. 6,552,775, etc., including, for example, multiple optical systems telecentrically positioned on both sides to form an upright image. Alternatively, the projection optical system 16 may not be multi-lens type. It may also be a single projection optical system like that used in semiconductor exposure apparatuses.

[0080] In the exposure apparatus 10A, if a mask M located within a predetermined illumination area of ​​the illumination light IL from the illumination system 12 is illuminated, a projected image (image of a partial pattern) of the pattern of the mask M within the illumination area is formed in the exposure area by the projection optical system 16. Furthermore, by moving the mask M relative to the illumination area (illumination light IL) in the scanning direction and by moving the substrate P relative to the exposure area in the scanning direction, scanning exposure is performed on the substrate P, and the pattern formed on the mask M (the entire pattern corresponding to the scanning range of the mask M) is transferred.

[0081] (Platform Device 20A)

[0082] The platform device 20A includes a platen 22, a substrate stage 24, a support device 26, and a substrate holder 28A.

[0083] The mounting plate 22 is composed of a rectangular plate-like member (viewed from the +Z side) arranged with its surface (+Z plane) parallel to the XY plane, and is mounted on the ground F via a vibration damping device (not shown). The support device 26 is placed on the mounting plate 22 in a non-contact manner and supports the substrate stage 24 from below in a non-contact manner. The substrate holder 28A is disposed on the substrate stage 24, and the substrate stage 24 and the substrate holder 28A are driven integrally by a platform drive system (not shown) included in the platform device 20A. The platform drive system includes: a coarse motion system, such as a linear motor, which drives the substrate stage 24 in the X and Y axis directions (along the upper surface of the mounting plate 22) with a predetermined stroke; and a micro motion system, such as a voice coil motor, which drives the substrate stage 24 slightly in six degrees of freedom (X-axis, Y-axis, Z-axis, θx, θy, and θz). In addition, the platform device 20A includes a platform measurement system, which includes, for example, an optical interferometer system or an encoder system, for determining the position information of the six degrees of freedom of the substrate stage 24.

[0084] like Figure 3 As shown in (a), the substrate holder 28A has a rectangular upper surface TS (the +Z side surface) on which the substrate P is mounted when viewed from above. The aspect ratio of the upper surface TS is basically the same as that of the substrate P. As an example, the lengths of the long and short sides of the upper surface TS are set to be slightly shorter than the lengths of the long and short sides of the substrate P, respectively.

[0085] The upper surface TS of the substrate holder 28A is machined to be flat across its entire surface. Furthermore, multiple micro-holes (not shown) for air blowing and vacuum suction (not shown) are formed on the upper surface of the substrate holder 28A. Moreover, the micro-holes for air blowing and vacuum suction can also share common holes. The substrate holder 28A can use vacuum suction force supplied from a vacuum device (not shown) to suction air between the upper surface and the substrate P through the multiple holes, causing the substrate P to adhere to the upper surface TS (for planar correction). The substrate holder 28A is a so-called pin-clamping type holder, and multiple pins (very small pins with a diameter of, for example, about 1 mm) are arranged at approximately equal intervals. By having these multiple pins, the substrate holder 28A reduces the possibility of debris or foreign objects being trapped on the back side of the substrate P for support, thereby reducing the possibility of deformation of the substrate P caused by such foreign objects. The substrate P is held (supported) on the upper surface of the multiple pins. The XY plane formed by the upper surfaces of the plurality of pins is designated as the upper surface of the substrate holder 28A. Furthermore, the substrate holder 28A can supply pressurized gas (e.g., air) from a pressurized gas supply device (not shown) through the holes between the upper surface TS and the substrate P (gas supply), thereby causing the back surface of the substrate P adsorbed on the substrate holder 28A to move away from the upper surface TS (causing the substrate P to float). Additionally, by utilizing the plurality of holes formed in the substrate holder 28A to create a time difference in the timing of pressurized gas supply, or by appropriately changing the positions of the holes used for vacuum suction and the holes used for supplying pressurized gas, or by appropriately varying the air pressure during suction and gas supply, the grounding state of the substrate P can be controlled (e.g., preventing air accumulation between the back surface of the substrate P and the upper surface of the substrate holder 28A).

[0086] Furthermore, the substrate holder 28A can also perform planar correction of the substrate in a floating, supported state without adhering it to the upper surface TS. In this case, the substrate holder 28A supplies pressurized gas (e.g., air) from a pressurized gas supply device (not shown) to the back side of the substrate P through the orifice (gas supply), thereby creating a gas film between the lower surface of the substrate P and the upper surface of the substrate holder 28A. Additionally, the substrate holder 28A uses a vacuum suction device to suction the gas between the substrate holder 28A and the substrate P through a vacuum suction orifice, applying a downward force (preload) in the direction of gravity to the substrate P, thus imparting gravitational rigidity to the gas film. Furthermore, the substrate holder 28A can balance the pressure and flow rate of the pressurized gas with the vacuum suction force, thereby levitating the substrate P in the Z-axis direction through a tiny gap and holding it in a non-contact manner (supporting it), while simultaneously applying a force to control its flatness (e.g., a force to correct or adjust flatness) to the substrate P. Moreover, the holes can be formed by machining the substrate holder 28A, or by using a porous material to form the substrate holder 28A, allowing for air supply or suction. Additionally, the upper surface TS of the substrate holder 28A that supports the floating substrate P is not the surface with holes; instead, the lower surface of the substrate after planar correction, an imaginary surface located above the aforementioned surface by the gap, is designated as the upper surface TS.

[0087] In addition, such as Figure 3 As shown in (a), two notches 28b are formed, for example, at the +X side end of the upper surface TS of the substrate holder 28A, moving away in the Y-axis direction. Figure 3 As shown in (c), the notch 28b opens on the upper surface TS and the side of the +X side of the substrate holder 28A, respectively.

[0088] (Substrate handling device 100A)

[0089] like Figure 1 As shown, the substrate transport apparatus 100A includes a port section 150A, a substrate transport section 160A, and a transport device 180A. The port section 150A and the substrate transport section 160A are disposed on the +X side relative to the platform device 20A. For example, the transfer of substrate P between an external device (not shown) such as a coater / developer and the exposure apparatus is performed by the substrate transport apparatus 100A. The substrate transport section 160A is used to transport an exposed substrate P (P1) from the substrate holder 28A to the port section 150A, and to transport a new substrate P (P2) to be exposed from the port section 150A to the substrate holder 28A. Furthermore, substrate P2 can be an unexposed substrate (never exposed before) or a substrate to be exposed a second or subsequent time.

[0090] Furthermore, the transfer of substrate P between the external device and the exposure apparatus 10A is performed by an external transport device 300, which is disposed outside a chamber (not shown) housing the illumination system 12, mask platform 14, projection optics system 16, platform device 20A, and substrate transport device 100A. The external transport device 300 has a forked robotic arm that can transport the substrate P from the external device to the port portion 150A within the exposure apparatus 10A. Moreover, as described above, the substrate transport section 160A transports substrate P from the port portion 150A to the substrate holder 28A. The external transport device 300 can transport the exposed substrate P, which has been transported from the substrate transport device 100A to the port portion 150A, from within the chamber to the external device.

[0091] like Figure 2 As shown, the port portion 150A has a crossbeam unit 152, which is composed of a plurality of crossbeams 153 (e.g., eight in this first embodiment) arranged at predetermined intervals in the Y-axis direction. A plurality of tiny holes (not shown) for air blowing are formed on the upper surface of each crossbeam 153. The crossbeam unit 152 can supply pressurized gas (e.g., air) supplied from a pressurized gas supply device (not shown) through the holes to the space between the back surface of the substrate P and the upper surface of the crossbeam unit 152 (air supply), thereby causing the back surface of the substrate P to move away from the upper surface of the crossbeam unit 152 (causing the substrate P to float). The Y-axis spacing of the plurality of crossbeams 153 is set such that the substrate P can be supported from below by the crossbeam unit 152, and when the robot arm of the external handling device 300 is positioned at the same height as the crossbeam unit 152, a plurality of fingers 310 of the robot arm can be disposed (inserted / removed) between the plurality of crossbeams 153.

[0092] The length of each crossbeam 153 in the long side direction (X-axis direction) is slightly longer than the length of the long side direction of the substrate P, and the length in the width direction (Y-axis direction) is set to be, for example, about 1 / 50 of the length of the width direction of the substrate P, or for example, about 10 to 50 times the thickness of the substrate P.

[0093] like Figure 1 As shown, multiple crossbeams 153 ( Figure 1The crossbeams 152 are supported from below by multiple (e.g., two) rod-shaped feet 154 at positions further inward than their ends in the X-axis direction (overlapping in the depth direction of the paper). The lower ends of each foot 154 supporting the crossbeams 153 are connected to the base 157 via a connector 155a, and the upper ends are connected to the crossbeams 153 via a connector 155b. In the substrate handling device 100A, the position of the crossbeam unit 152 in the X-axis and Z-axis directions can be changed integrally using a linkage mechanism composed of the crossbeams 153, feet 154, connectors 155a and 155b, and the base 157. The linkage mechanism is configured such that when the crossbeam unit 152 stops at the substrate transfer position with the substrate holder 28A, the upper surface TS of the substrate holder 28A, the upper surface of the offset crossbeam 185a (described later), and the upper surface of the crossbeam unit 152 are substantially contained within the same plane.

[0094] Back Figure 2 The substrate transport unit 160A has a connection with the external transport device 300 (see reference). Figure 1 and Figure 2 The same fork-shaped hand 161A (hereinafter referred to as substrate handling hand 161A) has a plurality of fingers 162A (for example, 7 fingers in this first embodiment), which form a holding surface for holding the substrate P (hereinafter referred to as substrate holding surface).

[0095] The multiple fingers 162A are connected to each other near their +X side ends by a connecting member 163A. In contrast, the multiple fingers 162A's -X side (substrate holder 28A (see reference...) Figure 2 The end of the (etc.) side becomes the free end, and the adjacent fingers 162A are open on the substrate holder 28A side.

[0096] like Figure 1As shown, the substrate holding surface formed by the plurality of fingers 162A is inclined relative to the holding surface of the substrate held by the substrate holder 28A (hereinafter referred to as the holder substrate holding surface). That is, the substrate handling hand 161A has a substrate holding surface that is inclined relative to the holder substrate holding surface of the substrate holder 28A and holds the substrate P (P2). Therefore, the substrate handling hand 161A holds the +X side end of the substrate P2 at a position higher than the -X side end (+Z side) of the substrate P2. Regarding the Z position of the substrate handling hand 161A, the -X side end of the substrate handling hand 161A is closer to the substrate holder 28A than the +X side end. In addition, near the front end (-X side) of the plurality of fingers 162A, the thickness of the fingers 162A becomes thinner the closer to the front end. In other words, the fingers 162A have a conical shape with a conical tip. Because the multiple fingers 162A have a conical shape, compared to the case where the fingers 162A have a uniform thickness, the -X side end of the substrate P2 can be closer to the upper surface TS of the substrate holder 28A. In addition, the area of ​​the substrate handle 161A at the Z position close to the substrate holder 28A can be reduced, thus reducing the risk of contact between the substrate handle 161A and the substrate holder 28A.

[0097] With the robotic arm of the external handling device 300 (see reference) Figure 2 Similarly, the fingers 162A of the substrate handling hand 161A are arranged in the Y-axis direction in a manner that does not overlap with the beam 153 of the beam unit 152 when viewed from above. Furthermore, each finger 162A is fitted with a plurality of support pads 164A for supporting the back surface of the substrate P, and these support pads 164A form the substrate holding surface of the substrate handling hand 161A. The substrate P may not be supported entirely on its back surface by the support pads 164A. The substrate holding surface is formed by a surface that imaginarily connects the support surfaces of the support pads 164A.

[0098] like Figure 2 As shown, the connecting member 163A is formed from a hollow member that is rectangular in shape and thin when viewed from above, extending in the Y-axis direction in which multiple crossbeams 153 are arranged. The two ends of the connecting member 163A in the Y-axis direction are connected to a pair of X-axis drive devices 164 for moving the substrate loading hand 161A in the X-axis direction. Furthermore, the pair of X-axis drive devices 164 can be driven independently, or they can be mechanically connected by gears or belts and simultaneously driven by a single drive motor. Alternatively, the connecting member 163A can be configured such that it moves in the Y-axis direction not limited to a pair, but only via a single X-axis drive device 164. Additionally, the pair of X-axis drive devices 164 can move vertically via a Z-axis drive device (not shown). Thus, the substrate loading hand 161A can move between a position higher than the upper surface of the crossbeam unit 152 (+Z side) and a position lower than the crossbeam unit 152 (-Z side).

[0099] In addition, the substrate transport unit 160A includes one or more (for example, two) substrate removal handles 170A. In this first embodiment, the two substrate removal handles 170A are arranged apart in the Y-axis direction.

[0100] Each substrate removal handle 170A is equipped with a holding pad 171A. The holding pad 171A can be held by vacuum suction force supplied from a vacuum device (not shown) to hold the lower surface of the substrate P.

[0101] The substrate handling arm 170A is constructed, for example, in the form of a multi-joint robot or a parallel link robot, and the X, Y, and Z positions of the holding pad 171A can be changed.

[0102] (Transportation device 180A)

[0103] The transport device 180A is a device that cooperates with the substrate transport unit 160A during substrate replacement. In other words, in the exposure apparatus 10A, the substrate transport unit 160A and the transport device 180A are used to transport the substrate P in and out of the substrate holder 28A. Furthermore, when the substrate P is placed on the substrate holder 28A, the transport device 180A is also used for positioning the substrate P. Figure 3 (a)~ Figure 3 (c) provides a detailed description of the conveying device 180A.

[0104] like Figure 3 (a)~ Figure 3 As shown in (c), the conveying device 180A includes a pair of substrate loading support devices 182A, a pair of substrate unloading support devices 183A, and an offset beam portion 185.

[0105] like Figure 3 As shown in (b), the substrate loading support device 182A includes a retaining pad 184a, an X actuator 186x and a Z actuator 186z.

[0106] The retaining pad 184a is composed of a rectangular plate-shaped member when viewed from above, and can be held in place by vacuum suction supplied from a vacuum device (not shown) to retain the lower surface of the substrate P. Additionally, as... Figure 3 As shown in (b), the retaining pad 184a can be driven in the Z-axis direction by the Z-actuator 186z. In addition, the retaining pad 184a and the Z-actuator 186z can be driven together in the X-axis direction by the X-actuator 186x mounted on the substrate stage 24.

[0107] like Figure 3 As shown in (c), the substrate removal support device 183A includes a retaining pad 184b, an X actuator 186x, and a Z actuator 186z. Figure 3 As shown in (c), a portion of the retaining pad 184b of one (+Y side) substrate removal support device 183A is inserted into one (+Y side) notch 28b of, for example, two notches 28b formed in the substrate holder 28A. Additionally, a portion of the retaining pad 184b of the other (-Y side) substrate removal support device 183A is inserted into the other (-Y side) notch 28b.

[0108] The retaining pad 184b is composed of a rectangular plate-shaped member when viewed from above, which can be adsorbed and retained on the lower surface of the substrate P by a vacuum suction force supplied from a vacuum device (not shown).

[0109] like Figure 3 As shown in (c), the retaining pad 184b can be driven in the Z-axis direction by the Z-actuator 186z. Additionally, the retaining pad 184b and the Z-actuator 186z can be integrally driven in the X-axis direction by the X-actuator 186x mounted on the substrate stage 24. The Z-actuator 186z includes a support post for supporting the retaining pad 184b, the support post being disposed outside the substrate holder 28A. The retaining pad 184b is driven by the Z-actuator 186z within the notch 28b, thereby allowing it to move between a position where it can be held in contact with the lower surface of the substrate P and a position away from the lower surface of the substrate P. Furthermore, the retaining pad 184b can be moved by the Z-actuator 186z between a position partially accommodated within the notch 28b and a position higher than the upper surface of the substrate holder 28A. Additionally, the retaining pad 184b is integrally driven by the X-actuator 186x along with the Z-actuator 186z, thereby allowing it to move in the X-axis direction.

[0110] The offset beam portion 185 has a plurality of offset beams 185a (e.g., eight in this first embodiment) arranged at predetermined intervals in the Y-axis direction. The offset beams 185a are supported by a support member 185b mounted on the substrate stage 24, and are arranged such that their upper surfaces are substantially contained in the same plane as the upper surface TS of the substrate holder 28A. A plurality of tiny holes (not shown) for air blowing are formed on the upper surface of the offset beams 185a. Pressurized gas (air) supplied from a pressurized gas supply device (not shown) is supplied through these holes between the upper surface of the offset beams 185a and the back surface of the substrate P (air supply). This causes the back surface of the substrate P to move away from the upper surface of the offset beams 185a (causing the substrate P to float).

[0111] The operation of the conveying device 180A will be described in detail below.

[0112] Furthermore, the configuration of the substrate loading support device 182A and the substrate unloading support device 183A can be appropriately modified. For example, in this embodiment, each support device 182A and support device 183A is mounted on the substrate stage 24, but it is not limited to this. For example, they can also be mounted on the substrate holder 28A, or on an XY platform device (not shown) used to drive the substrate stage 24 in the XY plane. In addition, the position and number of each support device 182A and support device 183A are not limited to this. For example, they can also be mounted on the +Y side and -Y side of the substrate stage 24.

[0113] In the exposure apparatus 10A constructed as described above (refer to...) Figure 1 In this process, under the management of a main control device (not shown), a mask M is loaded onto the mask platform 14 by a mask loader (not shown), and the substrate P is moved onto the substrate holder 28A by a substrate transport device 100A. Then, the main control device performs alignment measurements using an alignment detection system (not shown). After the alignment measurements are completed, a step-scan exposure operation is performed sequentially on multiple irradiation (shot) areas set on the substrate P. This exposure operation is the same as the previous step-scan exposure operation, so the X direction is set as the scanning direction. Furthermore, detailed descriptions related to the step-scan exposure operation are omitted. Next, the substrate P (P1) whose exposure process has been completed is removed from the substrate holder 28A by the substrate transport device 100A, and other substrates P (P2) to be exposed are moved into the substrate holder 28A, thereby changing the substrate P on the substrate holder 28A and performing a series of exposure operations on multiple substrates P.

[0114] (Substrate replacement operation)

[0115] The following uses Figures 4-8 The replacement operation of substrate P on substrate holder 28A of exposure apparatus 10A will be described. The substrate replacement operation described below is controlled by a main control device (not shown). Furthermore, the substrate replacement operation will be explained using... Figures 4-8 In the side views, the X-axis drive device 164 and the like are omitted to make the operation of the substrate transport unit 160A easier to understand.

[0116] Furthermore, the following description will explain the process of moving an exposed substrate P1 pre-loaded onto the substrate holder 28A of the platform apparatus 20A, removing the exposed substrate P1, and placing a substrate P2, different from substrate P1, into the substrate holder 28A. Moreover, in Figures 4-8 In the accompanying drawings, blank arrows are used schematically to indicate the direction of operation of the constituent elements for ease of understanding. Additionally, a group of black arrows schematically indicates the state of gas suction or gas supply (gas supply).

[0117] like Figure 4 (a) and Figure 4 As shown in (b), before the substrate P2 is transported to the port portion 150A by the external transport device 300, the substrate handling hand 161A moves such that its upper surface is located below the crossbeam unit 152. At this time, the port portion 150A drives the foot 154 to rotate in the θy direction. Thus, the substrate handling hand 161A is positioned below the crossbeam unit 152 in the Z direction, allowing the robot arm of the external transport device 300 to be positioned between the crossbeam unit 152 and the substrate handling hand 161A.

[0118] Furthermore, the position of the port portion 150A becomes the position for transferring the substrate to the external transport device 300.

[0119] The robotic arm of the external transport device 300, which holds the substrate P2, moves in the -X direction with the substrate P2 positioned above (on the +Z side) the beam unit 152. At this time, the robotic arm of the external transport device 300 is positioned relative to the beam unit 152 in the Y-axis direction by positioning the fingers of the forked robotic arm of the external transport device 300 within the gaps between adjacent beam units 152 when viewed from above.

[0120] Then, as Figure 4 As shown in (c), the robotic arm of the external transport device 300 is driven to descend, with each finger of the robotic arm passing through the gaps between the multiple beams of the beam unit 152, thereby transferring the substrate P2 onto the beam unit 152. The Z position of the robotic arm of the external transport device 300 is controlled in a manner that avoids contact with the substrate transport section 160A waiting below the beam unit 152. Then, the robotic arm of the external transport device 300 is driven in the +X direction, thereby retracting from the exposure apparatus 10A.

[0121] The substrate transport section 160A moves upward (in the +Z direction), thereby causing the holding pad 171A of the substrate transfer hand 170A to adhere to the lower surface of the substrate P2 on the holding beam unit 152. Then, as... Figure 5 As shown in (a), pressurized gas is supplied to the plurality of crossbeams 153 of the crossbeam unit 152 of the port portion 150A, and the pressurized gas is supplied (ejected) from the upper surface of each of the plurality of crossbeams 153 to the lower surface of the substrate P2. This causes the substrate P2 to be adsorbed and supported on the substrate transport section 160A, and the substrate P2 floats relative to the crossbeam unit 152 with a small gap (e.g., tens to hundreds of micrometers). Furthermore, by rotating the foot 154 of the port portion 150A in the θy direction, the crossbeam unit 152 is moved in the -X and -Z directions.

[0122] The holding pad 171A of the substrate removal hand 170A, which holds the lower surface of substrate P2, is appropriately driven slightly in the X, Y, and θz directions (three degrees of freedom in the horizontal plane), thereby adjusting (aligning) the position of substrate P2 relative to substrate loading hand 161A. Since substrate P2 is non-contactly supported by the beam unit 152, the position adjustment (minor movement) of substrate P2 in the three degrees of freedom in the horizontal plane can be performed with low friction. Furthermore, the position adjustment (alignment) of substrate P2 described here can be omitted or controlled as needed.

[0123] Then, the substrate transport unit 160A is driven upward in the +Z direction to... Figure 5 The position shown in (b) is used to transfer the substrate P2 on the beam unit 152 to the substrate handling hand 161A. In other words, the substrate P2 on the beam unit 152 is picked up from below by the substrate handling hand 161A.

[0124] By further rotating foot 154 in the θy direction, the crossbeam unit 152 is further driven in the -X direction, moving to the substrate transfer position with substrate holder 28A for removing substrate P1 from substrate holder 28A. Figure 5 (The position shown in (c)).

[0125] Furthermore, simultaneously with the transfer operation (appropriately including alignment) of the substrate P2 via the port portion 150A from the external transport device 300 to the substrate transfer hand 161A, in the platform device 20A, the substrate stage 24 is moved in the +X direction in such a way that the substrate holder 28A, on which the exposed substrate P1 is placed, is positioned at a predetermined substrate replacement position (the substrate transfer position with respect to the port portion 150A). In this first embodiment, the substrate replacement position of the substrate holder 28A is a position relative to the port portion 150A on the -X side. Moreover, for ease of understanding, Figure 4 (a)~ Figure 5 In (b), the substrate holder 28A is shown in the same position. However, during the normal operation of the exposure apparatus 10A, the exposure operation of the substrate P1 is performed simultaneously with the transfer operation of the substrate P2 from the external transport device 300 to the substrate transfer hand 161A. At this time, the substrate holder 28A moves appropriately in the X and Y directions.

[0126] Additionally, simultaneously with the movement of the substrate holder 28A towards the substrate replacement position, the holding pads 184b of each pair of substrates are lifted out of the support device 183A. The holding pads 184b adsorb and hold a portion of the substrate P1 (displaced in the notch 28b, as shown in the reference numeral) that is held on the upper surface of the substrate holder 28A by vacuum adsorption from the back. Figure 3 (a) and Figure 3 (c) part).

[0127] Then, as Figure 5 As shown in (c), the substrate loading hand 161A, which supports the substrate P2, is moved in the -X direction. This causes the substrate loading hand 161A to move above the substrate holder 28A, which is positioned at the substrate replacement location. Furthermore, the Z-position of the upper surface of the beam unit 152 and the Z-position of the upper surface of the substrate holder 28A are set to approximately the same height. Moreover, while these are set to approximately the same height, the substrate holder 28A can be driven in the Z-axis direction to adjust its height.

[0128] In the offset beam section 185, pressurized gas is ejected from the upper surface of the offset beam 185a.

[0129] Furthermore, in the platform device 20A, pressurized gas is supplied (ejected) from the upper surface of the substrate holder 28A to the lower surface of the substrate P1. As a result, the substrate P1 floats up from the upper surface TS of the substrate holder 28A, and the friction between the lower surface of the substrate P1 and the upper surface TS of the substrate holder 28A becomes a low-friction state.

[0130] Furthermore, in the platform device 20A, the holding pad 184b of the substrate removal support device 183A is slightly driven upward in the +Z direction to follow the upward movement of the substrate P1, and while holding a portion of the substrate P1, it moves in the +X direction (towards the port portion 150A) with a predetermined stroke. The amount of movement of the holding pad 184b (i.e., the substrate P1) is set, for example, to be about 50mm to 100mm. As a result, the +X side end of the substrate P1 is supported non-contactly on the offset beam 185a, and the position of the substrate P1 is offset by a predetermined amount in the X direction from the substrate holder 28A towards the +X direction.

[0131] Furthermore, in the platform device 20A, a pair of substrates are moved in the +X direction by a predetermined stroke through the holding pad 184a of the support device 182A.

[0132] like Figure 6As shown in (a), the substrate loading handle 161A, supporting substrate P2, is positioned at a predetermined position above the substrate holder 28A. Thus, substrate P2 is located approximately directly above the substrate holder 28A, which is positioned at the substrate replacement location. At this time, the substrate loading handle 161A and the substrate holder 28A are positioned such that the Y-position of substrate P1 and the Y-position of substrate P2 are approximately the same. In contrast, substrate P1 and substrate P2 are positioned at different locations in the X direction. Specifically, because substrate P1 is offset from the substrate holder 28A towards the +X side as described above, the X positions of substrates P1 and P2 are relatively different, with the -X side end of substrate P2 positioned further towards the -X side (protruding) than the -X side end of substrate P1. Furthermore, substrate P2 on the substrate loading handle 161A can be held by the substrate unloading handle 170A, by the fingers 162A, or held by friction. Furthermore, it is also possible to omit the notch 28b in the substrate holder 28A. As described above, when the lengths of the long and short sides of the upper surface of the substrate holder 28A are set to be slightly shorter than the lengths of the long and short sides of the substrate P, as long as the substrate P extending from the substrate holder 28A can be moved in the +X axis direction while the retaining pad 184b holds it, causing the substrate P to shift from the upper surface TS of the substrate holder 28A towards the +X side, it is also possible to omit the notch 28b in the substrate holder 28A. In this case, planar correction on the substrate holder 28A can also be performed at the end of the substrate P.

[0133] Subsequently, as Figure 6 As shown in (b), the substrate loading hand 161A is driven in the -Z direction to a position where it does not contact the substrate holder 28A. The substrate loading hand 161A brings the -X side end (a portion of substrate P2) of substrate P2 into contact with the holding pad 184a of the substrate loading support device 182A. Subsequently, the holding pad 184a adsorbs and holds a portion of substrate P2 on the substrate loading hand 161A from below. The holding pad 184a is positioned in the Z-axis direction between the upper surface of the substrate holder 28A and the substrate holding surface of the substrate loading hand 161A, adsorbing and holding a portion of substrate P2. If the holding pad 184a adsorbs and holds substrate P2, it constrains the X and Y positions of substrate P2. This prevents substrate P2 from moving out of the substrate loading hand 161A. The substrate loading support device 182A holds the narrow area of ​​the -X side end of substrate P2. More specifically, this refers to the area where the substrate loading support device 182A alone cannot support the entire substrate P2. Furthermore, the X-direction dimension of the fingers of the substrate loading hand 161A is described as shorter than the X-direction dimension of the substrate P2, but it can be either the same size or longer than the X-direction dimension of the fingers of the substrate loading hand 161A. In this case, the holding pad 184a only needs to hold the area between the fingers of the substrate loading hand 161A.

[0134] Additionally, while the retaining pad 184a is holding the substrate P2 in place, the substrate removal handle 170A, which has released the substrate P2 from its grip, is driven to hold the lower surface of the portion of the substrate P1 that has shifted from the substrate holder 28A towards the +X side. Furthermore, the beam unit 152 ejects pressurized gas.

[0135] Then, as Figure 6 As shown in (c), with the holding pad 184a of the substrate loading support device 182A adsorbing and holding a portion (-X side end) of the substrate P2, the substrate transport section 160A is moved in the transport direction (+X direction). Furthermore, at this time, it is sufficient to reduce contact friction by supplying (ejecting) pressurized gas to the lower surface of the substrate P2 from the finger portion 162A of the substrate loading hand 161A.

[0136] The substrate transport section 160A is driven in the transport direction (+X direction), and the substrate transport handle 170A holding the substrate P1 is driven in the +X direction. As a result, the substrate P1 moves from the substrate holder 28A to the port section 150A (beam unit 152). At this time, since pressurized gas is ejected from the upper surface of each of the beams 153 of the beam unit 152, the substrate P1 is transported from the substrate holder 28A in a state of non-contact with the substrate holder 28A and the port section 150A (a floating state). Furthermore, the holding pads 184b of each of the pair of substrate transport support devices 183A are partially received in the notch 28b of the substrate holder 28A (see reference). Figure 3 (a) and Figure 3 Within (c) the manner, it is driven in the -Z and -X directions.

[0137] In addition, such as Figure 6 (c) and Figure 7 (a)~ Figure 7 As shown in (c), the substrate handling hand 161A is moved in the +X direction, thereby causing the substrate handling hand 161A to move relative to a portion of the substrate P2 held by the holding pad 184a in the X direction. Then, as... Figure 7As shown in (c), the substrate handling hand 161A is moved in the X direction to a position closer to the +X side than the substrate holder 28A, thereby retracting the substrate handling hand 161A from the space above the substrate holder 28A (the space on the +Z side) and below the substrate P2 (the space on the -Z side). In other words, the substrate handling hand 161A is moved closer to the +X side than the substrate holder 28A, thereby retracting from the space between the substrate P2, which is held by the holding pad 184a, and the substrate holder 28A. When the substrate handling hand 161A moves closer to the +X side than the substrate holder 28A, it moves above the substrate holder 28A, i.e., at a position where the Z position is higher than the upper surface of the substrate holder 28A. In this way, by retracting the substrate handling hand 161A from the space between the substrate P2 and the substrate holder 28A, the substrate P2 is transferred from the substrate handling hand 161A to the substrate holder 28A. That is, substrate P2 is moved from substrate loading hand 161A to substrate holder 28A. In substrate P2, the area between substrate loading hand 161A and holding pad 184a is held by substrate holder 28A.

[0138] Here, the retaining pad 184a holds a portion of the substrate P2, thereby fixing or restricting the relative position of the substrate P2 with respect to the substrate holder 28A in the X and Y directions to a predetermined small range of motion. This predetermined range of motion is set by the driving range of the retaining pad 184a relative to the substrate holder 28A (or substrate stage 24). Furthermore, as long as the retaining pad 184a has the function of setting the relative position (relative range of motion) of the substrate P2 with respect to the substrate holder 28A in at least one of the X and Y directions, it may not necessarily be located on the substrate stage 24 (or substrate holder 28A). For example, it may be configured as a structure such as a cylinder (not shown) provided on the exposure apparatus 10A and suspended above the substrate holder 28A. Furthermore, in this case, the retaining pad 184a may also hold the upper surface of the substrate P2.

[0139] As described above, the substrate handling hand 161A moves relative to the substrate holder 28A in the +X direction, that is, along the direction of the substrate holding surface of the substrate holder 28A and parallel to the substrate holding surface of the substrate holder 28A, thereby retracting from below the substrate P2. Simultaneously, a portion of the substrate P2 is sequentially placed onto the substrate holder 28A from the -X side. At this time, the area of ​​the substrate P2 held by the substrate handling hand 161A decreases, and the area of ​​the substrate P2 supported by the substrate holding surface of the substrate holder 28A increases. Therefore, during at least a portion of the period from when the front end of the substrate loading hand 161A on the -X side moves to a position closer to the +X side than the substrate holder 28A (i.e., until the substrate loading hand 161A completely retracts from the space between the substrate holder 28A and the substrate P2), the substrate loading hand 161A, the substrate holder 28A, and the holding pad 184a simultaneously support (or hold) different portions of the substrate P2. In other words, during said at least a portion of the period, the substrate loading hand 161A, the substrate holder 28A, and the holding pad 184a support approximately the entire surface of the substrate P2 (any portion of the substrate P2 is supported by any one of the substrate loading hand 161A, the substrate holder 28A, and the holding pad 184a). Furthermore, the support (or holding) of the substrate P2 by the substrate loading hand 161A and the substrate holder 28A is not limited to a contact state, but can also be a non-contact state of support (or holding) with a gas gap.

[0140] Furthermore, during the period when the front end of the substrate loading hand 161A on the -X side moves to a position closer to the +X side than the substrate holder 28A, the position (Z position) of the portion of substrate P2 supported by the substrate loading hand 161A in the Z-axis direction (the direction perpendicular to the holding surface of the substrate holder 28A) is higher than the Z position of the portion of substrate P2 held by the holding pad 184a. Additionally, as the substrate loading hand 161A retracts from the space between substrate P2 and substrate holder 28A in the +X direction as described, the position (Z position) of the supported portion of substrate P2 supported by substrate holder 28A gradually decreases. Furthermore, when the substrate P2 has low flexibility (it is rigid and difficult to bend), as the substrate loading hand 161A retracts, the substrate P2 is placed onto the substrate holder 28A in a circular motion in the θy direction with the portion held by the holding pad 184a as the axis. However, in this case, the Z position of the portion of the substrate P2 supported by the substrate loading hand 161A gradually decreases. Consequently, the X-axis position (X position) of the supported portion of the substrate P2 supported by the substrate holder 28A gradually moves towards the +X direction.

[0141] Furthermore, as the substrate loading hand 161A retracts from below the substrate P2 as described above, and the substrate P2 is sequentially placed onto the substrate holder 28A from the -X side, the position of the substrate P2 relative to the substrate holder 28A is measured by a position measuring device (not shown). Based on the measurement results, the holding pads 184a of each pair of substrates are driven in at least one of the X-axis and Y-axis directions of the substrate loading support device 182A. This adjusts the X-axis position, Y-axis position, and θz angle of the substrate P2 relative to the substrate holder 28A. When performing rotational adjustment in the θz direction, it is sufficient to drive each holding pad 184a by only different amounts. Moreover, the position measuring device (not shown) can be, for example, any one of the structures (not shown) such as cylinders provided in the platform device 20A (e.g., substrate holder 28A, substrate stage 24) or the exposure device 10A.

[0142] The substrate P2, transferred from substrate loading arm 161A to substrate holder 28A, is as follows: Figure 8 As shown in (a), except for the portion held by the retaining pad 184a, the substrate P2 is placed on the substrate holder 28A. Furthermore, the retaining pad 184a can be driven in the Z-axis direction to assist in the transfer of the substrate P2 to the substrate holder 28A. At this time, the supply (ejection) of pressurized gas from the substrate holder 28A becomes air resistance, preventing the substrate P2 from directly colliding with the substrate holder 28A, thereby preventing damage to the substrate P2. Additionally, even without the supply (ejection) of pressurized gas from the substrate holder 28A, the air between the upper surface of the substrate holder 28A and the substrate P2 also becomes air resistance, achieving the aforementioned effect. Then, the supply (ejection) of pressurized gas from the substrate holder 28A is stopped, causing the substrate P2 to fall onto the upper surface TS of the substrate holder 28A, becoming contact with the upper surface TS. Therefore, the X-axis position, Y-axis position, and θz angle of the substrate P2 relative to the substrate holder 28A do not change.

[0143] Additionally, the crossbeam unit 152 stops ejecting pressurized gas onto the substrate P1. The substrate removal handle 170A releases its grip on the substrate P1.

[0144] After the substrate removal handle 170A releases the substrate P1, the substrate transport unit 160A is driven upward. The beam unit 152 carrying the substrate P1 moves to the substrate transfer position with the external transport device 300.

[0145] like Figure 8As shown in (b), when substrate P2 is placed on substrate holder 28A, retaining pad 184a releases the substrate P2 from its adsorption and moves in the -X direction in a manner that retracts from below substrate P2. As a result, the portion of substrate P2 held by retaining pad 184a is placed on the upper surface of substrate holder 28A.

[0146] The robotic arm of the external handling device 300 is driven in the -X direction at a Z position lower than the crossbeam unit 152 and is positioned below the crossbeam unit 152.

[0147] Then, as Figure 8 As shown in (c), the platform device 20A moves to a predetermined exposure start position while the substrate P2 is held by the substrate holder 28A. The operation of the platform device 20A during the exposure of the substrate P2 is omitted from the description.

[0148] On the other hand, the robotic arm of the external transport device 300 moves upward and picks up the substrate P1 from the crossbeam unit 152 below. Holding the exposed substrate P1, the robotic arm of the external transport device 300 moves in the +X direction and exits from the exposure device 10A.

[0149] Then, at the port 150A, in order to avoid contact with the substrate loading hand 161A, the crossbeam unit 152 is moved in the -X direction, and the substrate loading hand 161A is moved in the +X direction.

[0150] After the exposed substrate P1 is transferred to an external device (not shown), such as a coating machine or a developing machine, the robot arm of the external transport device 300 holds the predetermined substrate P3 to be exposed after substrate P2 and moves it toward the port section 150A.

[0151] Then, as Figure 4 As described in (a), before the new substrate P3 is transported to the port section 150A by the external transport device 300, the substrate transport section 160A is moved downward (moved in the -Z direction) with the upper surface of the substrate loading hand 161A positioned below the lower surface of the beam unit 152. This process is repeated. Figure 4 (a)~ Figure 8 The operation shown in (c) allows for continuous exposure of multiple substrates P.

[0152] As detailed above, substrate P2 changes from being held solely by substrate loading handle 161A to being held by both substrate loading handle 161A and holding pad 184a. Then, as substrate loading handle 161A moves relative to substrate holder 28A, substrate P2 is held by substrate loading handle 161A, substrate loading support device 182A, and substrate holder 28A. Then, as... Figure 7As shown in (c), if the substrate loading hand 161A moves to a position where its X-axis position does not overlap with the substrate holder 28A, then the substrate P2 is held by the substrate loading support device 182A and the substrate holder 28A, and finally supported only by the substrate holder 28A. The substrate P2 is loaded into the substrate holder 28A while being held by any one of the substrate loading hand 161A, the substrate holder 28A, and the holding pad 184a.

[0153] As detailed above, at least a portion of the actions of removing substrate P1 from substrate holder 28A and inserting substrate P2 into substrate holder 28A can be performed simultaneously, thereby shortening the substrate replacement time of substrate holder 28A. Furthermore, when inserting substrate P2 into substrate holder 28A, substrate insertion hand 161A moves above substrate holder 28A (in the +Z side space), thus avoiding interference on its movement path and allowing for rapid operation. Therefore, the action of inserting substrate P2 into substrate holder 28A can be performed quickly, thereby shortening substrate replacement time. Additionally, by moving substrate insertion hand 161A above substrate holder 28A towards the +X side, substrate P1 can be removed from substrate holder 28A while substrate P2 is inserted into substrate holder 28A simultaneously. That is, a common drive system is used when the substrate is loaded and when the substrate is unloaded, so there is no need to set different drive systems when the substrate is loaded and when the substrate is unloaded, which can reduce the number of drive systems.

[0154] As detailed above, according to this first embodiment, the substrate transport apparatus 100A for transporting substrate P2 to substrate holder 28A includes: a substrate loading hand 161A that holds substrate P2 above substrate holder 28A; a substrate loading support device 182A that holds a portion of substrate P2 held by substrate loading hand 161A; and an X-axis drive device 164 that moves one of substrate holder 28A and substrate loading support device 182A relative to the other by retracting substrate loading hand 161A from above substrate holder 28A; and the substrate holder 28A, substrate loading hand 161A, and substrate loading support device 182A hold substrate P2 during the relative movement performed by the X-axis drive device 164. Therefore, the substrate P2 is sequentially placed on the substrate holder 28A starting from the -X side (the side opposite to the port portion 150A), thus preventing damage to the substrate holder 28A or the substrate P2, and reducing dust generated by contact. Furthermore, air accumulation between the substrate holder 28A and the substrate P2 is less likely, and the substrate P2 is less prone to wrinkling. Additionally, movement of the substrate P2 on the substrate holder 28A can be suppressed. Moreover, the placement of the substrate P2 on the substrate holder 28A can be controlled according to the retraction status (speed, position) of the substrate loading hand 161A (e.g., stopping the placement midway). Therefore, it is not necessary to spray pressurized gas onto the substrate P2 from the substrate loading hand 161A to reduce friction. Furthermore, the mechanism for driving the substrate loading support device 182A up and down can be omitted.

[0155] Furthermore, according to this first embodiment, the substrate transport apparatus 100A for transporting substrate P2 to the substrate holding surface of substrate holder 28A includes: a substrate loading hand 161A, disposed above the substrate holding surface, holding a portion of substrate P2 at a shorter distance from the substrate holding surface than the distance between other portions of substrate P2 and the substrate holding surface; a substrate loading support device 182A, holding other portions of substrate P2 held by the substrate loading hand 161A; and an X-axis drive device 164, which moves the substrate holder 28A and the substrate loading support device 182A relative to the substrate loading hand 161A in a direction along the substrate holding surface by retracting the substrate loading hand 161A from above the substrate holder 28A. Therefore, substrate P2 can be sequentially placed on substrate holder 28A starting from the -X side (the side opposite to port 150A), thus preventing damage to substrate holder 28A or substrate P2 and reducing dust generation due to contact. Furthermore, air accumulation between substrate holder 28A and substrate P2 is less likely, preventing substrate P2 from wrinkling. Additionally, movement of substrate P2 on substrate holder 28A can be suppressed. Moreover, the placement of substrate P2 on substrate holder 28A can be controlled according to the retraction status (speed, position) of substrate loading hand 161A (e.g., stopping the placement midway). Therefore, pressurized gas can be dispensed from substrate loading hand 161A to substrate P2 to reduce friction. Furthermore, the mechanism for moving substrate loading support device 182A up and down can be omitted.

[0156] Furthermore, according to this first embodiment, the substrate transport apparatus 100A for transporting substrate P2 to the substrate holding surface of the substrate holder 28A that can hold substrate P2 includes: a substrate loading hand 161A having a substrate holding surface that holds substrate P2 above the substrate holder 28A; a substrate loading support device 182A that holds a portion of substrate P2 held by the substrate loading hand 161A at a position between the substrate holding surface and the substrate holding surface in the vertical direction; and an X-axis drive device 164 that moves the substrate holder 28A and the substrate loading support device 182A relative to the substrate loading hand 161A in such a way that the substrate loading hand 161A retracts from above the substrate holder 28A while the substrate loading support device 182A holds a portion of substrate P2. Therefore, substrate P2 can be sequentially placed on substrate holder 28A starting from the -X side (the side opposite to port 150A), thus preventing damage to substrate holder 28A or substrate P2 and reducing dust generation due to contact. Furthermore, air accumulation between substrate holder 28A and substrate P2 is less likely, preventing substrate P2 from wrinkling. Additionally, movement of substrate P2 on substrate holder 28A can be suppressed. Moreover, the placement of substrate P2 on substrate holder 28A can be controlled according to the retraction status (speed, position) of substrate loading hand 161A (e.g., stopping the placement midway). Therefore, pressurized gas can be dispensed from substrate loading hand 161A onto substrate P2 to reduce friction. Furthermore, the mechanism for moving substrate loading support device 182A up and down can be omitted.

[0157] Furthermore, according to this first embodiment, the substrate transport apparatus 100A for transporting substrate P2 to the substrate holding surface of substrate holder 28A includes: a substrate loading hand 161A that holds substrate P2 above substrate holder 28A; a substrate loading support device 182A that holds a portion of substrate P2 held by substrate loading hand 161A; and an X-axis drive device 164 that moves substrate holder 28A and substrate loading support device 182A relative to substrate loading hand 161A in a predetermined direction along the substrate holding surface of substrate holder 28A by retracting substrate loading hand 161A from above substrate holder 28A; and during the relative movement by X-axis drive device 164, substrate loading hand 161A holds substrate P2 such that the vertical position of the area of ​​substrate P2 held by substrate loading hand 161A approaches substrate holder 28A. Therefore, substrate P2 can be sequentially placed on substrate holder 28A starting from the -X side (the side opposite to port 150A), thus preventing damage to substrate holder 28A or substrate P2 and reducing dust generation due to contact. Furthermore, air accumulation between substrate holder 28A and substrate P2 is less likely, preventing substrate P2 from wrinkling. Additionally, movement of substrate P2 on substrate holder 28A can be suppressed. Moreover, the placement of substrate P2 on substrate holder 28A can be controlled according to the retraction status (speed, position) of substrate loading hand 161A (e.g., stopping the placement midway). Therefore, pressurized gas can be dispensed from substrate loading hand 161A onto substrate P2 to reduce friction. Furthermore, the mechanism for moving substrate loading support device 182A up and down can be omitted.

[0158] Furthermore, in this first embodiment, the substrate holding surface of the substrate transfer hand 161A is inclined relative to the substrate holding surface of the holder. As a result, when the substrate transfer hand 161A retracts from between the substrate P2 and the substrate holder 28A, the substrate transfer hand 161A retracts in a direction away from the lower surface of the inclined substrate P2 (a direction different from the wiring direction of the lower surface of the substrate P2), thereby reducing contact wear.

[0159] Furthermore, in this first embodiment, the X-axis drive device 164 moves one of the substrate holder 28A, the substrate loading support device 182A, and the substrate loading hand 161A relative to the other in a direction along the holding surface of the substrate holder 28A that holds the substrate P2. As a result, the substrate loading hand 161A retracts in a direction away from the lower surface of the inclined substrate P2 (a direction different from the wiring direction of the lower surface of the substrate P2), thus reducing contact wear.

[0160] Furthermore, in this first embodiment, the X-axis drive device 164 moves the substrate handling hand 161A in a direction parallel to the substrate holding surface of the substrate holder 28A. As a result, the substrate handling hand 161A retracts in a direction away from the lower surface of the inclined substrate P2 (a horizontal direction different from the wiring direction of the lower surface of the substrate P2), thereby reducing contact wear.

[0161] (First variation)

[0162] The first variation is an example of changing the configuration of the substrate transport device. Specifically, the substrate transport device 100B of the exposure apparatus 10B in the first variation includes a drive system that switches between a state in which the upper surface of the substrate pick-up hand 161A is parallel to the substrate holding surface of the substrate holder 28A, and a state in which the upper surface of the substrate pick-up hand 161A is inclined relative to the substrate holding surface of the substrate holder 28A.

[0163] use Figure 9 (a)~ Figure 9 (c) describes the replacement operation of the substrate P on the substrate holder 28A of the substrate handling device 100B using the first modified example.

[0164] Furthermore, Figure 9 The state of (a) is represented in the first embodiment. Figure 5 After (a), the platform device 20A is positioned at the substrate transfer position with the port portion 150A.

[0165] like Figure 9 As shown in (a), a substrate P2 is placed on a substrate loading hand 161A. At this time, the upper surface of the substrate loading hand 161A is parallel to the substrate holding surface of the substrate holder 28A.

[0166] Then, as Figure 9 As shown in (b), while keeping the upper surface of the substrate loading hand 161A approximately parallel to the substrate holding surface of the substrate holder 28A, the substrate loading hand 161A, which supports the substrate P2 from below, is driven in the -X direction. Furthermore, the actions of the platform device 20A, the substrate loading support device 182A, the substrate unloading support device 183A, and the offset beam 185a are related to... Figure 5 The actions described in (c) are the same, so the description is omitted.

[0167] Then, the substrate transfer hand 161A, which supports the substrate P2 from below, is positioned at a predetermined position above the substrate holder 28A.

[0168] Then, as Figure 9As shown in (c), the substrate loading hand 161A is driven upward while simultaneously tilting its front end downward. That is, the substrate loading hand 161A is driven with its upper surface tilted relative to the holder substrate holding surface of the substrate holder 28A. As a result, the front end of the substrate P2 contacts the holding pad 184a of the substrate loading support device 182A. The holding pad 184a holds the substrate P2 near its -X side end. Furthermore, the substrate loading hand 161A can also be configured such that even when driven with its front end tilted downward, it moves in the -X direction at a Z position, parallel to the holder substrate holding surface of the substrate holder 28A, without risking contact between its front end and the upper surface of the substrate holder 28A.

[0169] The subsequent actions are basically the same as those in the first implementation method, so the description is omitted.

[0170] According to the first modified example, when transferring the substrate P2 between the port portion 150A and the substrate transfer hand 161A, the substrate P2 can be transferred from one to the other with the substrate placement surface of the port portion 150A parallel to the upper surface of the substrate transfer hand 161A, thereby reducing the possibility of damage to the substrate P2 during substrate transfer.

[0171] Furthermore, when the substrate loading handle 161A, which supports the substrate P2 from below, is moved in the -X direction, the distance in the Z direction between the port portion 150A and the substrate holder 28A and the substrate loading handle 161A is extended. As a result, the risk of contact between the port portion 150A and / or the substrate holder 28A and the substrate loading handle 161A is reduced when the substrate loading handle 161A is moved in the -X direction.

[0172] Furthermore, the substrate loading hand 161A can be moved relative to the substrate holder 28A in the +X direction while the tilt angle between the upper surface of the substrate loading hand 161A and the holding surface of the substrate holder 28A is slowly changed.

[0173] As in the first modified example, the substrate holding surface of the substrate loading hand 161A can also be tilted relative to the holder substrate holding surface of the substrate holder 28A by tilting the substrate loading hand 161A.

[0174] (Second variation)

[0175] The second variation is an example of changing the shape of the fingers of the hand that are used to pick up the substrate. Figure 10 (a) is a perspective view of the substrate transfer hand 161C of the second modified example. Figure 10 (b) is a side view of the substrate transfer hand 161C of the second modified example.

[0176] like Figure 10 (a) and Figure 10 As shown in (b), in the second modified example, the substrate is inserted into the hand 161C, and the finger portion 162C has an XZ cross-sectional triangular shape that is thicker at the +X side end and becomes thinner closer to the -X side end.

[0177] Furthermore, the replacement operation of the substrate on the substrate holder 28A is the same as in the first embodiment, so the description is omitted.

[0178] As in the second variation, the shape of the fingers of the substrate handling hand can also be set to an XZ cross-sectional triangular shape that is thicker at the +X side and thins towards the -X side. This increases the rigidity of the fingers of the substrate handling hand, reducing the wobbling of the substrate handling hand 161C during movement and minimizing the risk of it contacting the substrate holder 28A due to such wobbling. Furthermore, the tilting of the substrate handling hand 161A relative to the substrate holder 28A, as in the first variation (see reference...), can be omitted. Figure 9 (c) drive mechanism.

[0179] (Third variation)

[0180] In the first embodiment, after the substrate loading hand is moved to a predetermined position above the substrate holder 28A, it is lowered, thereby bringing the front end of the substrate P2 into contact with the holding pad 184a of the substrate loading support device 182A. In the third variation, the substrate unloading hand 170A is used to bring the front end of the substrate P2 into contact with the holding pad 184a of the substrate loading support device 182A.

[0181] use Figure 11 (a) and Figure 11 (b) describes the replacement operation of the substrate P on the substrate holder 28A of the substrate handling apparatus 100D using the third modification. Furthermore, Figure 11 (a) and the first embodiment Figure 6 The state corresponding to (a) Figure 11 (b) and the first embodiment Figure 6 The state corresponding to (b).

[0182] like Figure 11 (a) and Figure 11 As shown in (b), in the substrate handling apparatus 100D of the third variation, the substrate handling unit 160D includes the substrate loading hand 161C and the substrate unloading hand 170A of the second variation.

[0183] like Figure 11 As shown in (a), in the third variation, the substrate transfer position between the substrate handling hand 161C and the platform device 20A becomes relatively... Figure 6The substrate of (a) is moved into the substrate transfer position of 161A, which is closer to the +X side.

[0184] Furthermore, if the substrate loading handpiece 161C reaches the substrate transfer position, then as Figure 11 As shown in (b), the substrate removal hand 170A holding the lower surface of substrate P2 is driven in an extended arm manner. As a result, substrate P2 slides down along substrate loading hand 161C, and the front end of substrate P2 contacts the holding pad 184a of substrate loading support device 182A.

[0185] Furthermore, to ensure smooth movement of the substrate, the support pad 164D mounted on the upper surface of the finger portion 162C of the substrate handling hand 161C is preferably a rod-shaped pad extending in the extending direction of the finger portion 162C. Additionally, pressurized gas can be ejected from the support pad 164D when the substrate P2 is slid.

[0186] Furthermore, the substrate transport unit 160D may also include multiple substrate removal handles 170A. A portion of the multiple substrate removal handles 170A may be used to contact the front end of substrate P2 with the holding pad 184a, while the remaining substrate removal handles 170A hold the exposed substrate P1 on the substrate holder 28A. Thus, by holding the front end of substrate P2 against the holding pad 184a and holding the exposed substrate P1 with the remaining substrate removal handles 170A, the substrate infeed handle 161C can move in the +X direction, simultaneously performing substrate infeed and substrate removal operations.

[0187] According to the third variation, without moving the entire substrate transport section 160D, only the substrate P2 is lowered by the substrate removal handle 170A. Therefore, positioning can be performed more easily and accurately compared to moving the entire substrate transport section 160D. In addition, the travel distance of the substrate transport section 160D in the X-axis direction can be shortened. Furthermore, since the substrate P2 flexes due to gravity, even if the movement distance of the substrate entry handle 161C in the X-axis direction is shorter than the horizontal movement distance of the substrate P2 caused by the gradient of the substrate entry handle 161C, the front end of the substrate P2 can be brought close to the holding pad 184a of the substrate entry support device 182A.

[0188] Furthermore, in Figure 11 (a) and Figure 11 In the description of (b), the substrate loading hand 161C of the second variation is used, but the substrate loading hand 161A of the first embodiment can also be used.

[0189] (Fourth variation)

[0190] The fourth variation is an example of changing the configuration of the substrate handling hand. Figure 12 (a) is a top view of the substrate loading hand 161E of the fourth modified example. Figure 12(b) is Figure 12 AA section view of (a).

[0191] like Figure 12 As shown in (a), the substrate is inserted into the plurality of fingers 162E of the hand 161E, and the fingers 162E1 at both ends in the Y-axis direction have a band portion 166. Figure 12 As shown in (b), the belt portion 166 includes a belt 166a and a pair of pulleys 166b. The belt 166a is arranged in a manner that contacts the back side of the substrate P2, and its upper surface is arranged substantially parallel to the upper surface of the support pad 164E provided on the finger portion 162E1, so as to form a substantially coplanar plane with the upper surface of the support pad 164E provided on the finger portion 162E1. The belt 166a is made of a material with a high coefficient of friction that is difficult to slide, such as a material selected from stainless steel coated with urethane, silica, rubber, or flexible polyvinyl chloride (PVC).

[0192] Figure 13 (a) and Figure 13 (b) is a diagram showing the action of using the substrate handling hand 161E to move the substrate P2 into the substrate holder 28A.

[0193] like Figure 13 As shown in (a), after the front end of substrate P2 contacts the holding pad 184a of substrate loading support device 182A, while the holding pad 184a holds the front end of substrate P2, substrate loading hand 161E moves relative to substrate holder 28A in the +X direction. Therefore, since the strip 166a is formed of a material with a high coefficient of friction, as shown in (a), Figure 13 As shown in (b), as the substrate P2 moves relative to the substrate loading hand 161E, the belt 166a in contact with the substrate P2 moves cyclically via a pair of pulleys 166b. Thus, the belt 166a maintains the Y-axis position of the substrate P2 while descending obliquely on the substrate loading hand 161E. Therefore, the substrate P2 is loaded into the substrate holder 28A while constrained by the belt 166a just before the entire substrate P2 is about to leave the substrate loading hand 161E.

[0194] In the first embodiment and the first to third modifications, while the substrate loading support device 182A holds the -X side end of the substrate P2 in the holding pad 184a, the substrate loading hand is moved (retracted) in the +X direction (e.g., Figure 6 (c) etc.). At this time, the portion of the substrate P2 other than the -X side end is in a state of unrestricted movement in the Y-axis direction before being supported by the substrate holder 28A.

[0195] On the other hand, in the fourth modification, while the substrate loading hand 161E is moving in the +X direction with the holding pad 184a holding the -X side end of the substrate P2, the substrate P2 is placed on the substrate holder 28A while the substrate loading hand 161E holds the +X side end and the movement in the Y-axis direction is constrained. Therefore, according to the fourth modification, the substrate P2 can be constrained until the entire substrate P2 is about to leave the substrate loading hand 161E, thus preventing placement deviation of the substrate P2.

[0196] Furthermore, the feed of the belt 166 can also be controlled by a motor or the like. In this case, the belt 166a only needs to be fed out synchronously with the timing of the substrate loading hand 161E retracting. In addition, in this case, the belt 166a does not necessarily have to be a loop belt. Furthermore, if each belt 166a of the finger portions 162E1 at both ends is moved independently, the relative position (alignment) of the substrate P2 relative to the substrate holder 28A can be adjusted on the substrate loading hand 161E.

[0197] (Fifth variation)

[0198] The fifth variation alters the configuration of the fingers used to handle the substrate. Figure 14 (a) and Figure 14 (b) is a cross-sectional view schematically showing the substrate transfer hand 161F of the fifth modified example.

[0199] like Figure 14 As shown in (a), the finger portion 162F of the substrate handling hand 161F has a first finger portion 162F1 and a second finger portion 162F2. The first finger portion 162F1 is hollow, and a wire rope 169A for moving the second finger portion 162F2 is disposed inside. The second finger portion 162F2 is rotatably connected to the first finger portion 162F1 about the Y-axis via a pin 169B or the like. In addition, the wire rope 169A is connected to the second finger portion 162F2. By moving the wire rope 169A using a drive device (not shown), the second finger portion 162F2 rotates about the Y-axis with the pin 169B as the fulcrum. As a result, only a portion of the substrate P2 held by the second finger portion 162F2 can be tilted relative to the substrate holding surface of the substrate holder 28A.

[0200] The other components are the same as in the first embodiment, so the description is omitted.

[0201] Furthermore, the substrate handling hand 161F may not have a drive mechanism using the steel cable 169A, so that the second finger 162F2 is always tilted relative to the first finger 162F1.

[0202] According to the fifth modification, the tilting of the substrate-carrying hand 161A as in the first modification can be omitted (see reference). Figure 9(c) Drive mechanism. In addition, the front end of the second finger 162F2 can be thinned.

[0203] Second Implementation Method

[0204] Then, use Figure 15 (a)~ Figure 25 (b) The exposure apparatus of the second embodiment will be described. The structure of the exposure apparatus 10G of the second embodiment is the same as that of the first embodiment, except for some differences in the structure and operation of the substrate transport device. Therefore, only the differences will be described below. Components with the same structure and function as those in the first embodiment will be marked with the same symbols as those in the first embodiment, and their descriptions will be omitted.

[0205] Figure 15 (a) and Figure 15 (b) are a top view and a side view of the exposure apparatus 10G according to the second embodiment, respectively. Additionally, Figure 16 (a) and Figure 16 (b) is a perspective view of the substrate loading hand 161G of the second embodiment.

[0206] (Platform device 20G)

[0207] In the first embodiment, the substrate holder 28A has a notch 28b for receiving the holding pad 184b of the substrate removal support device 183A (see reference). Figure 3 (a) and Figure 3 (c)). The substrate holder 28G of the second embodiment is as follows. Figure 15 As shown in (a), in addition to the notch 28b, there is also a notch 28a for the holding pad 184a of the substrate loading support device 182G.

[0208] (Substrate handling device 100G)

[0209] In the substrate handling apparatus 100G of the second embodiment, the plurality of crossbeams 153 of the crossbeam unit 152 are supported from below by a plurality of (e.g., two) rod-shaped legs 154 extending in the Z-axis direction at positions further inward than the two ends in the X-axis direction. The lower ends of the plurality of legs 154 supporting each crossbeam 153 are connected near the base plate 156. In the substrate handling apparatus 100G, the base plate 156 is moved in the X-axis direction by a predetermined stroke using an X-actuator (not shown), thereby causing the crossbeam unit 152 to move integrally in the X-axis direction by a predetermined stroke. Furthermore, the base plate 156 is moved in the Z-axis direction by a Z-actuator 158, thereby causing the crossbeam unit 152 to move integrally up and down in the Z-axis direction. Moreover, in Figure 15 In (a) and subsequent top views, the base plate 156 is omitted.

[0210] In the substrate transport unit 160G of the second embodiment, such as Figure 15 As shown in (a), the substrate loading hand 161G has a plurality of fingers 162G (e.g., 8 in this embodiment). The -X side ends of the plurality of fingers 162G are connected to each other by a connecting member 163G. The connecting member 163G is configured to support the substrate P by supplying gas to the back side of the substrate P held by the substrate loading hand 161G. In contrast, the +X side ends of the plurality of fingers 162G are free ends, and adjacent fingers 162G are separated at the port portion 150G side. Furthermore, as... Figure 15 As shown in (a), each finger 162G is configured such that its position in the Y-axis direction does not overlap with the multiple beams of the beam unit 152 when viewed from above.

[0211] like Figure 16 (a) Figure 16 As shown in (b), among the plurality of fingers 162G, the fingers 162G1 at both ends in the Y-axis direction have a triangular shape that is thinner on the -X side (substrate holder 28G side) and thicker on the +X side (port portion 150G side) when viewed from the side. On the other hand, the inner fingers 162G2 are thinner on the port side than the fingers 162G1 at both ends.

[0212] In addition, such as Figure 16 (a) and Figure 16 As shown in (b), arms 168 of substrate loading hands 161G are mounted on the finger portions 162G1 at both ends. Figure 15 As shown in (a), the two ends of the arm 168 are connected to the X-axis drive device 164.

[0213] like Figure 15 (a) and Figure 15 As shown in (b), the substrate handling hand 161G has a pair of substrate picking hands 167G with fingers 162G1 at both ends in the Y-axis direction. The substrate picking hands 167G can be moved in the X-axis and Z-axis directions with a predetermined stroke by a drive device (not shown).

[0214] In addition, the substrate pick-up hand 167G can adsorb and hold the lower surface of the substrate P by means of vacuum suction force supplied from a vacuum device (not shown).

[0215] (Transportation device 180G)

[0216] The substrate loading support device 182G differs from the substrate loading support device 182A of the first embodiment in that it omits the X actuator 186x. For example... Figure 15As shown in (b), the retaining pad 184a of the substrate loading support device 182G moves within the notch 28a via the Z-actuator 186z, thereby moving between a position contacting the lower surface of the substrate P and a position away from the lower surface of the substrate P. Additionally, the retaining pad 184a can move between a position partially housed within the notch 28a and a position higher than the upper surface of the substrate holder 28G via the Z-actuator 186z.

[0217] (Substrate replacement operation)

[0218] The following uses Figure 17 (a)~ Figure 24 (b) describes the replacement operation of the substrate P on the substrate holder 28G of the exposure apparatus 10G in the second embodiment.

[0219] like Figure 17 (a) and Figure 17 As shown in (b), during the exposure process performed by the platform device 20G, the external transport device 300 is moved in the -Z direction to place the substrate P2 on the beam unit 152. Then, the external transport device 300 moves in the +X direction and exits from the exposure device.

[0220] The substrate loading hand 161G is driven in the +X direction and enters below the crossbeam unit 152 from the -X side (substrate holder 28G side).

[0221] Then, as Figure 18 (a) and Figure 18 As shown in (b), the platform device 20G, after the exposure process is completed, moves to the substrate transfer position with the substrate transport unit 160G.

[0222] The crossbeam unit 152 is driven down (in the -Z direction) to maintain the substrate P2 in a holding state via the Z-actuator 158. At this time, a portion of the substrate P2 on the crossbeam unit 152 comes into contact with the substrate pick-up hand 167G of the substrate loading hand 161G. The substrate pick-up hand 167G adheres to and holds the lower surface of the substrate P2.

[0223] Subsequently, as Figure 19 (a) and Figure 19 As shown in (b), in the platform device 20G, the substrate P1 on the substrate holder 28G is offset in the +X direction by the substrate removal support device 183A. At this time, the substrate holder 28G and the offset beam 185a supply gas to the back side of the substrate P1, so that the substrate P moves in a floating state.

[0224] Pressurized gas is ejected from each of the crossbeams 153 of the crossbeam unit 152. In addition, the crossbeam unit 152 descends slowly and continuously.

[0225] The substrate handling hand 161G slowly moves in the -X direction while the substrate picking hand 167G holds the substrate P2 on the crossbeam unit 152. The substrate P2 moves in the -X direction along with the substrate handling hand 161G.

[0226] Then, as Figure 20 (a) and Figure 20 As shown in (b), the substrate handling hand 161G moves in the -X direction to the X position where the root of the finger 162G does not overlap with the crossbeam unit 152 when viewed from above.

[0227] The crossbeam unit 152 moves down to below the substrate handling hand 161G, completely transferring the new substrate P2 to the substrate handling hand 161G. At this time, the relative position of the substrate P2 with respect to the substrate handling hand 161G can also be adjusted on the substrate handling hand 161G by a pair of substrate picking hands 167G.

[0228] Subsequently, as Figure 21 (a) and Figure 21 As shown in (b), the substrate transfer hand 161G moves in the -X direction while holding the substrate P2 and is positioned at a predetermined position above the substrate holder 28G.

[0229] In the platform device 20G, the substrate is lifted into the holding pad 184a of the support device 182G via the Z-actuator 186z. The substrate loading hand 161G pushes the substrate P2 downward at an angle via the substrate pickup hand 167G. As a result, the -X side end of the substrate P2 contacts the holding pad 184a. Thus, the holding pad 184a contacts the substrate P2 from below on the substrate loading hand 161G, which is waiting above the substrate holder 28G, and holds the substrate P2 near its -X side end. Furthermore, during this sequence, the substrate pickup hand 167G can also adjust the position of the substrate P2 relative to the substrate holder 28G.

[0230] In addition, while the holding pad 184a is adsorbing and holding the substrate P2, the substrate removal handle 170A is moved to adsorb and hold the lower surface of the portion of the substrate P1 that is offset from the substrate holder 28G towards the +X side.

[0231] The crossbeam unit 152 moves in the -X and -Z directions and stops at the substrate transfer position with the substrate holder 28G. Additionally, pressurized gas is ejected from each crossbeam 153 of the crossbeam unit 152. Thus, the crossbeam unit 152 becomes a guide supporting the substrate P1 being moved out of the substrate holder 28G.

[0232] Then, release the substrate pick-up hand 167G from the substrate loading hand 161G, as follows: Figure 22 (a) and Figure 22As shown in (b), with the holding pad 184a of the substrate loading support device 182G adsorbing and holding the -X side end of the substrate P2, the substrate transport unit 160G is driven in the transport direction (+X side). If the substrate transport unit 160G is driven in the transport direction (+X side), the substrate transport handle 170A holding the substrate P1 is also driven in the +X direction.

[0233] As a result, substrate P1 moves from substrate holder 28G to port portion 150G (beam unit 152). At this time, pressurized gas is ejected from the upper surface of beam unit 152, thereby floating and transporting substrate P1 on substrate holder 28G and port portion 150G in a non-contact state (except for the part held by substrate removal handle 170A).

[0234] Then, as Figure 23 (a) and Figure 23 As shown in (b), the substrate removal handle 170A releases the substrate P1 and moves in the -X direction together with the substrate receiving handle 161G. The port portion 150G moves in the +X direction while holding the substrate P2 on the crossbeam unit 152.

[0235] In the platform device 20G, after the substrate loading support device 182G adjusts the position of substrate P2 relative to substrate holder 28G, it moves in the -Z direction via Z actuator 186z, partially accommodating it within the notch 28a. Thus, substrate P2 is adsorbed onto the substrate holding surface of substrate holder 28G. Furthermore, the position adjustment (alignment) of substrate P2 described here can be omitted, or it can be controlled in a manner that is implemented as needed.

[0236] Subsequently, as Figure 24 (a) and Figure 24 As shown in (b), if the substrate handling hand 161G moves to a position where it does not interfere with the substrate P1, the beam unit 152 moves in the +Z direction to the substrate handover position with the external handling device 300.

[0237] After the external transport device 300 retrieves the substrate P1 from the beam unit 152, it transports the new substrate P3 to the port section 150A.

[0238] As detailed above, according to the second embodiment, the port portion 150G side is open between the adjacent fingers 162G of the substrate handling hand 161G. Therefore, the substrate handling hand 161G can directly enter below the crossbeam unit 152 from the substrate holder 28G side and be driven above the crossbeam unit 152, thereby picking up the substrate P2 on the crossbeam unit 152 and moving it to the substrate holder 28G side. Therefore, even when the substrate P2 is placed on the crossbeam unit 152, the substrate handling hand 161G can enter below the substrate P2 in the X-axis direction with a short moving distance. That is, the substrate handling hand 161G can accept the substrate P2 on the crossbeam unit 152 even without moving to the +X side position of the port portion 150G. Furthermore, the substrate handling hand 161G can transfer the exposed substrate P1 to the crossbeam unit 152 even without moving it to the +X side position of the port portion 150G. That is, the series of actions of loading substrate P2 and unloading substrate P1 can be performed without changing the positional relationship in the X direction of the external transport device 300, port 150G, substrate loading hand 161G, and substrate holder 28G. Furthermore, it is not necessary to set up a chamber with space until the substrate loading hand 161G moves to the +X side of the port 150G, thus reducing the footprint of the exposure device, i.e., the installation area of ​​the exposure device 10G. In addition, in the event of a defect in the exposure device or during initial setup operations, even without the external transport device 300, the substrate P that has been moved out to the port 150G (beam unit 152) can be transferred back to the substrate loading hand 161G and loaded into the substrate holder 28G.

[0239] Furthermore, according to this second embodiment, the ends of the plurality of fingers 162G of the substrate loading hand 161G on the -X side (substrate holder 28G side) are connected to each other by a connecting member 163G. Thus, compared with the substrate loading hand 161A, the substrate loading hand 161G of the second embodiment can place the substrate P2 on the substrate holder 28G without deformation.

[0240] Specifically, such as Figure 25 As shown in (a), in the substrate loading hand 161A of the first embodiment, there is a gap between the -X side fingers 162A. Therefore, the -X side edge of the substrate P2, which is to be placed before the substrate holder 28A, is sometimes like... Figure 25 As shown in (a), there are areas supported by the finger portion 162A and unsupported areas, resulting in slight undulations, making it difficult to secure the substrate P2 to the substrate holder 28A without deformation. On the other hand, as Figure 16 (a) and Figure 16As shown in (b), in the second embodiment, the substrate insertion hand 161G is continuous between the adjacent fingers 162G on the -X side without any gaps, allowing the -X side end of the substrate P2 to be supported in a surface form. Thus, as... Figure 25 As shown in (b), the -X side edge of the substrate P2, which is to be placed in front of the substrate holder 28G, is less prone to undulation. Therefore, compared with the substrate handling hand 161A, the substrate handling hand 161G of the second embodiment can place the substrate P2 on the substrate holder 28G without deformation.

[0241] Furthermore, according to this second embodiment, by moving the substrate transport unit 160G (substrate loading hand 161G) and the platform device 20G (substrate holder 28G) in opposite directions, the substrate loading hand 161G is retracted from between the substrate P2 and the substrate holder 28G. This shortens the loading time of the substrate P2 into the substrate holder 28G.

[0242] Furthermore, according to this second embodiment, in the finger portion 162G of the substrate handling hand 161G, the inner side of the finger portion 162G2 other than the finger portions 162G1 at both ends has a thinner thickness at the port portion compared to the finger portions 162G1 at both ends (see, for example, refer to...). Figure 16 (b)). This reduces the weight of the substrate handling hand by 161g.

[0243] Furthermore, according to this second embodiment, the arms 168 of the substrate loading hand 161G are mounted on the finger portions 162G1 at both ends, so the substrate loading hand 161G can support the central portion of the substrate P2, thereby reducing the size of the substrate loading hand 161G. Moreover, since the arms 168 of the substrate loading hand 161G are mounted on the finger portions 162G1 at both ends, the center of gravity of the entire substrate loading hand 161G is supported, thus suppressing the deflection of the substrate loading hand 161G.

[0244] (First variation)

[0245] In the second embodiment, the Z position (pass line) for transferring the substrate between the external transport device 300 and the beam unit 152 of the port portion 150G is set at a position higher than the upper surface of the substrate holder 28G, but the height of the pass line can be freely set (without limitation).

[0246] Figure 26 (a) and Figure 26 (b) is a diagram used to illustrate the substrate replacement operation of the first modified example.

[0247] like Figure 26 (a) and Figure 26 As shown in (b), the external transport device 300 places the substrate P2 on the beam unit 152, which stops at a position lower than the upper surface TS of the substrate holder 28G.

[0248] Then, as in the second embodiment Figure 17 (a) and Figure 17 As shown in (b), by raising the crossbeam unit 152 to a position higher than the highest part of the substrate loading hand 161G, the substrate P2 can be transferred to the substrate loading hand 161G even when there is no drive device for moving the substrate loading hand 161G up and down. Therefore, in cases such as when a defect occurs in the exposure apparatus or when performing initial setup operations, even without the external transport device 300, the substrate that has been moved to the port part 150G (crossbeam unit 152) can be transferred back to the substrate loading hand 161G and moved into the substrate holder 28G.

[0249] (Second variation)

[0250] The second variation is an example of changing the configuration of the substrate handling device.

[0251] In the second variation of the substrate handling apparatus 100I, the substrate handling unit 160I is equipped with a drive system that causes the substrate handling hand 161I to rotate about the Y-axis. That is, the substrate handling hand 161I can tilt the substrate holding surface about the Y-axis by means of the drive system.

[0252] In addition, in the second variation, such as Figure 27 As shown in (a), the travel of the substrate picking hand 167I provided by the substrate handling hand 161I is longer than that of the substrate picking hand 167G in the second embodiment. Furthermore, in the second modification, as... Figure 27 As shown in (a), the distance from the -X side end of the substrate loading hand 161I to the root of the finger portion 162I, i.e., the width of the connecting member 163I in the X-axis direction, is longer than that of the connecting member 163G in the second embodiment.

[0253] use Figure 27 (a)~ Figure 30 (b) The substrate replacement operation of the substrate handling apparatus 100I using the second modification will be described. Furthermore, Figure 27 (a) and Figure 27 The state of (b) is the same as that of the second embodiment. Figure 17 (a) and Figure 17 The states of (b) correspond to respectively.

[0254] like Figure 27 (a) and Figure 27 As shown in (b), during the exposure process of the platform device 20G, the external transport device 300 moves in the -Z direction to place a new substrate P2 on the beam unit 152, and then moves in the +X direction to exit from the exposure device 10I.

[0255] The substrate loading hand 161I moves in the +X direction and enters below the crossbeam unit 152 from the -X side (substrate holder 28G side). Moreover, it stops at a position where the root of the finger portion 162I of the substrate loading hand 161I and the -X side end of the crossbeam unit 152 do not overlap when viewed from above.

[0256] Then, as Figure 28 (a) and Figure 28 As shown in (b), the platform device 20G, after the exposure process is completed, moves to the substrate transfer position with the port portion 150G.

[0257] The substrate loading hand 161I is driven to rotate around the Y-axis with its substrate holding surface approximately parallel to the substrate P2 on the crossbeam unit 152. The crossbeam unit 152 moves downwards (in the -Z direction) while holding the substrate P2, stopping at a point where a portion of the substrate P2 on the crossbeam unit 152 contacts the substrate picking hand 167I of the substrate loading hand 161I. The substrate picking hand 167I then adsorbs and holds the back side of the substrate P2.

[0258] Then, as Figure 29 (a) and Figure 29 As shown in (b), in the platform device 20G, the substrate P1 on the substrate holder 28G is shifted in the +X direction by the substrate removal support device 183A.

[0259] The substrate pick-up hand 167I of the substrate loading hand 161I moves in the -X direction while holding the substrate P2 on the crossbeam unit 152. As a result, the substrate P2 moves onto the substrate loading hand 161I while being held by the substrate loading hand 161I and the crossbeam unit 152. At this time, pressurized gas is ejected from the crossbeam unit 152 and the substrate unloading hand 161I. The substrate pick-up hand 167I holds the substrate P2, so there is no risk of the substrate P2 falling from the crossbeam unit 152 or the substrate unloading hand 161I. Because the substrate P2 is held by the substrate loading hand 161I and the crossbeam unit 152, the load on the substrate P2 is less compared to the case where the substrate loading hand 161I moves in the +Z direction relative to the crossbeam unit 152 and places the substrate P2 onto the substrate loading hand 161I from the crossbeam unit 152. Therefore, when transferring substrate P2 between substrate handling hand 161I and beam unit 152, the risk of substrate P2 being damaged can be reduced.

[0260] Then, as Figure 30 (a) and Figure 30As shown in (b), the crossbeam unit 152 is driven down to below the substrate loading hand 161I, and the substrate P2 is completely transferred to the substrate loading hand 161I. If the substrate P2 is placed on the substrate loading hand 161I, the substrate loading hand 161I is driven to rotate about the Y-axis, and the substrate holding surface of the substrate loading hand 161I is tilted relative to the holder substrate holding surface of the substrate holder 28G. Figure 27 (the state of (b)).

[0261] The subsequent actions are the same as in the second embodiment, so the description is omitted.

[0262] According to the second variation, the substrate handling hand 161I is rotated about the Y-axis with its substrate holding surface approximately parallel to the substrate P2 on the crossbeam unit 152, and then the substrate P2 on the crossbeam unit 152 is transferred to the substrate handling hand 161I. This allows for reliable transfer of the substrate P2 to the substrate handling hand 161I without causing it to flex.

[0263] Furthermore, according to the second modified example, the width of the connecting member 163I in the X-axis direction is wide. As a result, the length of the finger portion 162I of the substrate handling hand 161I can be shortened, and the rigidity of the entire substrate handling hand 161I can be improved.

[0264] (Third variation)

[0265] In the second variation, the substrate P2 of the substrate moving hand 161I is moved from the crossbeam unit 152 to the substrate moving hand 161I by tilting the substrate moving hand 161I. However, in the third variation, the substrate P2 of the substrate moving hand 161I is moved from the crossbeam unit 152 to the substrate moving hand 161I by tilting the crossbeam unit 152.

[0266] like Figure 31 As shown in (a), in the substrate handling apparatus 100J of the third modification, the port portion 150J includes feet 154a and 154b of a crossbeam 153 connected at its upper end to the crossbeam unit 152. Furthermore, the port portion 150J includes Z-actuators 158a and 158b that can independently extend and retract feet 154a and 154b in the Z-axis direction. By changing the extension and retraction amount of feet 154a and 154b using the Z-actuators 158a and 158b, the inclination of the upper surface of the crossbeam unit 152 can be changed. Moreover, Figure 31 In (a), a beam unit 152 is shown between the finger portion 162I1 at both ends and the finger portion 162I2 on the inside.

[0267] Next, the transfer of substrate P2 from beam unit 152 to substrate transfer hand 161I will be described.

[0268] Figure 31(a) indicates the state in which the substrate P2 has been placed on the beam unit 152 by the external handling device 300. At this time, the substrate handling hand 161I moves from the -X side of the beam unit 152 in the +X direction and stops at a position where the root of the finger 162G does not overlap with the -X side end of the beam unit 152 when viewed from above.

[0269] Then, as Figure 31 As shown in (b), the extension and retraction of feet 154a and 154b are changed by Z-actuators 158a and 158b, so that the upper surface of the beam unit 152 is substantially the same as the substrate holding surface of the substrate loading hand 161I, thereby tilting the beam unit 152.

[0270] Subsequently, as the beam unit 152 descends, the substrate P2 held by the beam unit 152 is grasped by the substrate picker 167I, and the substrate position is moved by the movement of the substrate picker 167I while being transferred to the substrate loading hand 161I.

[0271] As in the third variation, the substrate P2 can also be moved from the beam unit 152 to the substrate transfer hand 161I by tilting the beam unit 152.

[0272] (Fourth variation)

[0273] The fourth variation is an example of changing the configuration of the fingers of the hand that handles the substrate.

[0274] like Figure 32 (a) and Figure 33 As shown in (a), the substrate handling hand 161K of the fourth modification has a finger portion 162K with a length in the X-axis direction that is substantially the same as the substrate size. Additionally, as... Figure 32 As shown in (b), the shape of the substrate loading hand 161K is a rhombus shape with two sharp front ends when viewed from the side, and an arm 168 is installed in the thick part of the central part.

[0275] use Figure 32 (a)~ Figure 33 (b) describes the transfer of the substrate from the crossbeam unit 152 to the substrate transfer hand 161K in the fourth modified example.

[0276] like Figure 32 (a) and Figure 32 As shown in (b), the substrate handling hand 161K is positioned at the root of the finger portion 162K and at the -X side end of the beam unit 152 in a position that does not overlap when viewed from above.

[0277] Then, if the external handling device 300 transfers the substrate P2 to the beam unit 152, then as Figure 33 (a) and Figure 33As shown in (b), the beam unit 152 moves in the -Z direction. Since the length of the finger 162K of the substrate loading hand 161K is approximately the same as the length of the substrate P2, the substrate P2 is placed on the substrate loading hand 161K by the movement of the beam unit 152 in the -Z axis direction. Thereafter, the substrate P2 is slid towards the inclined side by the substrate picking hand 167K. As a result, a portion of the substrate P2 becomes inclined relative to the holder substrate holding surface of the substrate holder 28G. Subsequent operations are essentially the same as in the second embodiment, so detailed descriptions are omitted.

[0278] According to the fourth variation, the length (length in the X-axis direction) of the finger portion 162K of the substrate handling hand 161K is basically the same as the length of the substrate. Therefore, when the substrate handling hand 161K is used to receive the substrate P2 placed on the crossbeam unit 152, the substrate P2 can be picked up simply by passing the substrate handling hand 161K through the crossbeam unit 152 from below. Thus, the operation is simple and it is less likely to cause damage to the substrate P2 or dust.

[0279] (Fifth variation)

[0280] The fifth variation is an example in which the substrate is directly transferred from the external handling device 300 to the substrate handling hand 161K.

[0281] In the fifth variation, such as Figure 34 As shown in (a), the fork of the external handling device 300 is configured such that its position in the Y-axis direction does not overlap with the fingers 162K of the substrate handling hand 161K when viewed from above. Similarly, the crossbeam 153 of the crossbeam unit 152 is configured such that its position does not overlap with the fork of the external handling device 300 when viewed from above. As a result, in the fifth modification, the fingers 162K of the substrate handling hand 161K and the crossbeam 153 of the crossbeam unit 152 are positioned to overlap when viewed from above.

[0282] The following uses Figure 34 (a)~ Figure 35 (b) describes the transfer of the substrate from the external handling device 300 to the substrate handling hand 161K in the fifth variation.

[0283] like Figure 34 (a) and Figure 34 As shown in (b), the substrate transfer hand 161K is driven in the +X direction to be positioned at the substrate transfer position with the external transport device 300. The external transport device 300 moves in the -X direction while holding the substrate P2 until it reaches the substrate transfer position with the substrate transfer hand 161K.

[0284] Then, as Figure 35 (a) and Figure 35As shown in (b), the platform device 20G, after the exposure process is completed, moves to the substrate transfer position with the beam unit 152. In addition, in the platform device 20G, the substrate P1 on the substrate holder 28G is offset in the +X direction by the substrate removal support device 183A.

[0285] If the external handling device 300 moves in the -Z direction, the lower surface of substrate P2 comes into contact with substrate pick-up hand 167K. Substrate pick-up hand 167K then adheres to and holds the lower surface of substrate P2.

[0286] The substrate pick-up hand 167K, which holds the lower surface of substrate P2, is driven in the -X direction. As a result, substrate P2 on the external transport device 300 moves toward substrate transfer hand 161K. If the external transport device 300 continues to transfer substrate P2 completely onto substrate transfer hand 161K via a downward drive, it is driven in the +X direction and withdraws from the exposure device 10L.

[0287] The beam unit 152 moves in the -Z and -X directions toward the position where it is transferred to the substrate of the platform device 20G.

[0288] The subsequent actions are basically the same as those in the second embodiment, so their detailed description is omitted.

[0289] As explained above, according to the fifth variation, when the substrate P2 is brought in, the substrate receiving hand 161K can directly receive the substrate P2 from the external transport device 300 without going through the port portion 150G. Therefore, compared to the previous two transfer operations of transferring the substrate P2 from the external transport device 300 to the port portion 150G and then transferring the substrate P2 from the port portion 150G to the substrate receiving hand 161K, only one transfer is needed, from the external transport device 300 to the substrate receiving hand 161K. This reduces the number of substrate P2 transfers, thus shortening the time spent bringing in the substrate P2 and preventing damage or dust to the substrate P2.

[0290] Furthermore, in the fifth variation, regarding the recycling (removal) of substrate P1, the same as in the second embodiment, substrate P1 is transferred from beam unit 152 to external transport device 300.

[0291] Furthermore, in the fifth variation, to prevent the crossbeam unit 152 from overlapping with the fingers of the robotic arm of the external handling device 300 when viewed from above, the crossbeam 153 of the crossbeam unit 152 and the fingers 162K of the substrate handling hand 161K are arranged such that they overlap when viewed from above, but this is not a limitation. The crossbeam 153 of the crossbeam unit 152 and the fingers 162K of the substrate handling hand 161K may also not overlap when viewed from above. In this case, the crossbeam unit 152 may also be offset by one finger 162K in the Y-axis direction. Thus, the substrate that has been moved from the substrate holder 28G to the port portion 150G can be picked up again using the substrate handling hand.

[0292] In the case of transferring the substrate, in order to prevent the crossbeam 153 from overlapping with the finger portion 162K when viewed from above, the crossbeam unit 152 can be prevented from deviating in the Y-axis direction, and the external handling device 300 can be deviated in the Y-axis direction. Alternatively, the substrate handling hand 161K can be deviated in the Y-axis direction.

[0293] (Sixth variation)

[0294] The sixth variation alters the configuration of the substrate handling hand.

[0295] Figure 36 A perspective view showing the substrate loading hand 161L of the sixth modified example. (See attached image.) Figure 36 As shown, the substrate handling hand 161L has a plate portion 263 with a triangular XZ cross-section and an arm portion 265 supporting the plate portion 263. The upper surface of the plate portion 263 is inclined relative to the XY plane.

[0296] As shown in the sixth variation, the substrate handling hand may not have fingers. That is, the substrate handling hand may not have a fork shape.

[0297] Furthermore, such as Figure 37 As shown in (a), the upper surface of the plate portion 263 of the substrate loading hand 161L can also be bent. In this way, by bending the upper surface of the plate portion 263 (the holding surface of the holder substrate), the section coefficient of the substrate can be increased. That is, the same effect as the substrate thickness being several to several hundred times larger than the substrate deflection can be obtained.

[0298] Through various settings, even if Figure 37 By placing the substrate P on the substrate carrier 161L with the -X end exposed as in (b), bending (sagging) at the -X end of the substrate P can be suppressed. In addition, since the bending (sagging) of the substrate P is suppressed, when the substrate P contacts the substrate holder, the substrate P can contact the center part of the Y-axis direction of the -X side, so that wrinkles are less likely to form at the -X end of the substrate P.

[0299] In addition, such as Figure 38As shown, the substrate transport section 160A to substrate transport section 160L may also be provided with a cover 199. By providing the cover 199, it is possible to prevent debris from adhering to the substrate P, and the temperature of the substrate P can be set to a constant.

[0300] Furthermore, in the second embodiment and its variations, the platform device 20A of the first embodiment can be used instead of the platform device 20G. Alternatively, the platform device 20G can also be applied to the first embodiment and its variations.

[0301] Furthermore, in the first embodiment, the second embodiment, and their variations, such as Figure 39 As shown, a partial chamfer (30a) can also be made near the +X side end of the fixed plate 30, which supports the projection optics system 16 or the mask platform 14, without interfering with the substrate handling. Furthermore, in Figure 39 The diagram shows the case where the substrate loading hand is the substrate loading hand 161G of the second embodiment. This allows for a reduction in the overall height of the exposure apparatus.

[0302] Furthermore, in the first embodiment, the second embodiment, and their variations, such as Figure 40 (a) and Figure 40 As shown in (b), platform devices 20A and 20G include charge-coupled device (CCD) cameras 31x and 31y (image processing edge detection) for detecting the edges of substrate P as the substrate position measurement devices described above. CCD camera 31x is configured to observe two points on the -X side of substrate P placed in front of substrate holders 28A and 28G. CCD camera 31y is configured to observe one point on the -Y side (or +Y side) of substrate P from below. Thus, the X, Y, and θz positions of substrate P relative to platform devices 20A and 20G can be obtained. This information can be used for platform control as position correction of substrate P2 before placement or position information of substrate P2 after placement. Alternatively, a known edge sensor including a light source and a light-receiving part can be used instead of CCD cameras 31x and 31y for detecting the edges of substrate P. The light source is positioned at the same location as the CCD cameras 31x and 31y, and the light-receiving unit is positioned facing the light source with respect to the substrate P. The cross-section orthogonal to the optical axis of the measurement light irradiated by the light source is linear, and the light-receiving unit detects the end of the substrate P by receiving the measurement light. Thus, based on the detection results of the end of the substrate P in the X-axis direction and the Y-axis direction, the X position, Y position, and θz position of the substrate P relative to the platform devices 20A and 20G can also be detected.

[0303] Additionally, in the first embodiment, the second embodiment, and their variations, the following methods may also be used: Figure 41 (a)~ Figure 41 The platform device 20M is shown in (c).

[0304] In the 20M platform device, such as Figure 41 As shown in (a), two substrate loading and supporting devices 182M are provided at the -X side end of the substrate holder 28M. Figure 41 As shown in (b), the substrate loading support device 182M is configured such that, with a portion of it housed in the notch 28a formed in the -X side end of the substrate holder 28M, the height of the upper surface of the retaining pad 184a is substantially the same as the height of the upper surface of the substrate holder 28M. Therefore, even after the substrate P2 is placed, the retaining pad 184a can retract from the substrate holder 28M without moving in the -X direction.

[0305] In addition, such as Figure 41 As shown in (c), the substrate loading support device 182M can be tilted in a way that reliably adsorbs and fixes the back side of the tilted substrate P2. In addition, the substrate loading support device 182M can move in the horizontal direction (X-axis direction or X-axis and Y-axis direction) in a way that allows for adjustment (alignment) of the relative position of the substrate P2 with respect to the substrate holder 28M.

[0306] According to the platform device 20M, the retaining pad 184a can be tilted, thus reliably adsorbing and fixing the back side of the substrate P2.

[0307] Additionally, in the first embodiment, the second embodiment, and their variations, the following methods may also be used: Figure 42 (a) and Figure 42 The platform device 20N shown in (b) is an example.

[0308] The platform device 20N does not have the substrate loading support device described in the first and second embodiments that can move independently. In the platform device 20N, one or more adsorption areas (support areas) 187 are provided near the -X side end face of the substrate holder for adsorbing and holding the front end of the loaded substrate, so that a part of the upper surface of the substrate holder 28N also serves as a holding pad 184a for adsorbing and holding the front end of the loaded substrate.

[0309] Furthermore, the platform device 20N does not have an independently movable substrate loading support, so it is impossible to adjust (align) the relative position of the loaded substrate P with respect to the substrate holder 28N using the substrate loading support. However, for example, the position of the substrate P can be adjusted using a pair of substrate removal handles on the substrate loading handles before the substrate is picked up using the support area 187. In addition, when it is necessary to adjust (align) the relative position of the substrate P with respect to the substrate holder 28N after the substrate P has been placed on the substrate holder 28N, it can be done using the substrate removal support device 183A.

[0310] Additionally, in cases where the platform device does not have an independently movable substrate loading and support device, such as... Figure 43 (a)~ Figure 43 As shown in (c), for example, when the substrate transfer hand 161A is retracted from between the substrate P and the substrate holder 28N, and when the substrate P2 is placed on the substrate holder 28N, air is drawn in by the substrate holder 28N to adsorb the substrate P2 onto the substrate holding surface of the holder, thereby stably transferring the substrate P2.

[0311] Furthermore, in the first embodiment, the second embodiment, and their variations, the support pad on the fingertips of the hand that holds the substrate can be omitted.

[0312] In addition, in each of the embodiments, an equal magnification system is used as the projection optical system 16, but it is not limited to this; a reduction system or a magnification system may also be used.

[0313] Regarding the applications of exposure apparatus, they are not limited to those used for transferring patterns of liquid crystal display devices onto square glass plates. For example, they can be widely used in exposure apparatuses for manufacturing organic-luminescent (EL) panels, semiconductor manufacturing, thin-film magnetic heads, micromachines, and deoxyribonucleic acid (DNA) chips. Furthermore, in addition to micro-components such as semiconductor devices, they can also be used to transfer circuit patterns onto glass substrates or silicon dioxide wafers for manufacturing masks or photomasks used in photoexposure apparatuses, extreme ultraviolet (EUV) exposure apparatuses, X-ray exposure apparatuses, and electron beam exposure apparatuses.

[0314] Furthermore, the substrate to be exposed is not limited to glass plates; it can be other objects such as wafers, ceramic substrates, film components, or mask blanks. Additionally, when the substrate to be exposed is a substrate for a flat panel display, the thickness of the substrate is not particularly limited, and it may include film-like (flexible sheet-like components). Moreover, the exposure apparatus of this embodiment is particularly effective when the substrate to be exposed has a side length or diagonal length of 500 mm or more. Furthermore, when the substrate to be exposed is a flexible sheet, the sheet may also be formed in a roller shape.

[0315] Component Manufacturing Methods

[0316] Next, a method for manufacturing micro-elements using the exposure apparatus 10A to 10L of each embodiment in the photolithography step will be described. By forming predetermined patterns (circuit patterns, electrode patterns, etc.) on a substrate using the exposure apparatus 10A to 10L of the embodiments, a liquid crystal display device as a micro-element can be obtained.

[0317] <Pattern Formation Steps>

[0318] First, a so-called photolithography step is performed to form a pattern image on a photosensitive substrate (such as a glass substrate coated with resist) using the exposure apparatus described in each of the embodiments. Through the photolithography step, a predetermined pattern including multiple electrodes is formed on the photosensitive substrate. Then, the exposed substrate is subjected to steps such as a development step, an etching step, and a resist stripping step, thereby forming the predetermined pattern on the substrate.

[0319] <Color Filter Formation Steps>

[0320] Subsequently, a color filter is formed by arranging multiple groups of three points corresponding to R (red), G (green), and B (blue) in a matrix or by arranging multiple groups of filters with three stripes of R, G, and B in the horizontal scan line direction.

[0321] <Unit Assembly Steps>

[0322] Subsequently, a liquid crystal panel (liquid crystal cell) is assembled using a substrate with a predetermined pattern obtained in the patterning step and a color filter obtained in the color filter forming step. For example, liquid crystal is injected between the substrate with a predetermined pattern obtained in the patterning step and the color filter obtained in the color filter forming step to manufacture a liquid crystal panel (liquid crystal cell).

[0323] <Module Assembly Steps>

[0324] Subsequently, the liquid crystal display device is completed by installing various components such as circuitry that enable the assembled liquid crystal panel (liquid crystal cell) to perform display operations, and backlighting.

[0325] In the aforementioned case, during the patterning step, the exposure apparatus of each embodiment is used to expose the substrate with high yield and high precision, thereby improving the productivity of the liquid crystal display device.

[0326] The described embodiments are preferred embodiments of the present invention. However, they are not limited thereto, and various modifications can be made without departing from the spirit of the present invention.

Claims

1. A substrate transport apparatus for transporting a substrate to a holding device, comprising: A first holding portion holds the substrate above the holding device; The second holding portion holds a portion of the substrate held by the first holding portion; as well as The driving unit moves one of the holding device and the second holding part relative to the other, such that the first holding part retracts from above the holding device; and The holding device, the first holding part, and the second holding part hold the substrate during the relative movement of the driving part. In the relative movement, a portion of the substrate held by the first holding portion is positioned higher in the vertical direction of the holding device than another portion of the substrate held by the second holding portion is positioned higher in the vertical direction.

2. The substrate handling apparatus according to claim 1, wherein the driving unit moves the first holding portion relative to the substrate in such a way that the area of ​​the substrate held by the first holding portion decreases and the area of ​​the substrate held by the holding device increases.

3. The substrate handling apparatus according to claim 1 or 2, wherein the driving unit moves the first holding portion in such a manner that the distance between the first holding portion and the second holding portion increases. The holding device holds the area between the region held by the first holding portion and the region held by the second holding portion in the substrate.

4. The substrate handling apparatus according to claim 3, wherein the driving unit, while the second holding unit is holding a portion of the substrate, moves the first holding unit to a position that does not overlap with the holding unit in the vertical direction, in a manner that retracts from above the holding device. The holding device holds the area of ​​the substrate where the holding portion of the first holding part has been released.

5. The substrate transport apparatus according to claim 1 or 2, wherein the second holding portion adsorbs and holds the substrate.

6. The substrate handling apparatus according to claim 1 or 2, wherein the second holding portion holds the short side of the substrate.

7. The substrate transport apparatus according to claim 1 or 2, wherein the second holding portion transports a portion of the substrate to the holding device.

8. The substrate transport apparatus according to claim 7, wherein the driving unit causes the first holding portion to move relative to the holding device and the second holding portion from one end of the holding device to the other end of the holding device.

9. The substrate handling apparatus according to claim 8, wherein the holding device holds other portions of the substrate at the other end of the holding device.

10. The substrate handling apparatus according to claim 1 or 2, wherein the first holding portion holds a portion of the substrate at a shorter vertical distance from the holding device than the distance between other portions of the substrate and the holding device.

11. The substrate handling apparatus according to claim 10, wherein the first holding portion has a substrate holding surface for holding the substrate. The substrate holding surface is configured to be inclined relative to the holding surface of the substrate held by the holding device.

12. The substrate handling apparatus according to claim 11, wherein the first holding portion includes an angle changing portion that changes the angle of the substrate holding surface.

13. The substrate handling apparatus according to claim 12, wherein the first holding portion holds the substrate on a substrate holding surface parallel to the holding surface. The angle changing unit rotates and drives the substrate holding surface of the substrate to tilt relative to the holding surface.

14. The substrate handling apparatus according to claim 10, wherein the first holding portion has a substrate holding surface for holding the substrate. The substrate holding surface includes a first surface and a second surface. The first surface is configured to hold other portions of the substrate and is inclined relative to the holding surface. The second surface has a surface that holds a portion of the substrate and is parallel to the holding surface.

15. The substrate handling apparatus according to claim 14, wherein the first holding portion has a tilting drive portion that drives the first surface to tilt relative to the second surface.

16. The substrate handling apparatus according to claim 1 or 2, wherein the driving unit causes one of the holding device and the second holding portion and the first holding portion to move relative to the other in a direction along the holding surface of the holding device that holds the substrate.

17. The substrate handling apparatus according to claim 1 or 2, wherein the first holding portion moves above the holding device during the relative movement.

18. The substrate handling apparatus according to claim 1 or 2, wherein the second holding portion is disposed in the holding apparatus.

19. The substrate handling apparatus according to claim 18, wherein the second holding portion is disposed on the upper surface of the holding apparatus.

20. The substrate handling apparatus according to claim 1 or 2, wherein the second holding portion adjusts the position of the substrate relative to the holding device while holding a portion of the substrate.

21. The substrate handling apparatus according to claim 1 or 2, further comprising a removal device for removing other substrates different from the substrate from the holding device. The removal device removes the other substrates during the relative movement of the holding device and the second holding part with the first holding part performed by the drive part.

22. The substrate handling apparatus according to claim 21, wherein the removal device moves the other substrate to a position between the first holding portion and the holding device in the vertical direction.

23. The substrate handling apparatus according to claim 21, further comprising a port portion that holds the other substrate moved out by the moving device.

24. The substrate handling apparatus according to claim 23, wherein the port portion includes a port surface capable of holding the substrate and a height adjustment portion capable of adjusting the height of the port surface. The removal device moves the other substrate from the holding device toward the port surface.

25. The substrate handling apparatus according to claim 24, wherein the height adjustment unit adjusts the height of the port surface to be the same as the height of the holding surface holding the substrate.

26. The substrate transport apparatus according to claim 23, wherein the port portion transports the substrate to the holding device.

27. The substrate handling apparatus according to claim 23, wherein the port portion has a port surface capable of holding the substrate and a port surface angle adjustment portion capable of adjusting the angle of the port surface.

28. The substrate handling apparatus according to claim 27, wherein the port face angle adjustment unit causes the holding device to rotate and drive the port face relative to the holding surface holding the substrate, thereby tilting the port face relative to the holding surface.

29. The substrate handling apparatus of claim 21, wherein the removal device removes the other substrate from the holding device by moving the other substrate relative to the holding device relative to the holding device while holding the held area of ​​the other substrate.

30. The substrate handling apparatus of claim 29, wherein the removal device adsorbs and holds the held area of ​​the other substrate.

31. The substrate handling apparatus according to claim 21, wherein the removal device is disposed in the first holding portion. The drive unit causes the first holding part to move relative to the second holding part and the holding device, and also causes the transfer device to move.

32. The substrate handling apparatus according to claim 21, wherein the holding device has an air intake for supplying gas to float the other substrates. The removal device causes the other substrates, which have been floated on the holding device, to move along the holding surface of the holding device.

33. An exposure apparatus, comprising: The substrate handling apparatus as described in any one of claims 1 to 32; as well as An optical system exposes the substrate by irradiating it with an energy beam after it has been transported to the holding device.

34. The exposure apparatus according to claim 33, wherein the substrate has a length of at least one side or a diagonal length of 500 mm or more, and is for use with a flat panel display.

35. A method for manufacturing a flat panel display, comprising: The substrate is exposed using the exposure apparatus as described in claim 34; as well as The exposed substrate is then developed.

36. A method for manufacturing a component, comprising: The substrate is exposed using the exposure apparatus as described in claim 33 or 34; as well as The exposed substrate is then developed.

37. A substrate handling method, comprising handling a substrate to a holding device, and including: The substrate is held above the holding device by a first holding portion and a second holding portion; and The first retaining part retracts from above the retaining device, causing one of the retaining device and the second retaining part to move relative to the other; and During relative movement, the holding device, the first holding portion, and the second holding portion hold the substrate. In the relative movement, a portion of the substrate held by the first holding portion is positioned higher in the vertical direction of the holding device than another portion of the substrate held by the second holding portion is positioned higher in the vertical direction.

38. The substrate handling method according to claim 37, wherein the first holding portion is moved relative to the substrate in such a way that the area of ​​the substrate held by the first holding portion decreases and the area of ​​the substrate held by the holding device increases, by the relative movement.

39. The substrate handling method according to claim 37 or 38, wherein the first holding portion is moved such that the distance between the first holding portion and the second holding portion increases by the relative movement, and the region between the region held by the first holding portion and the region held by the second holding portion of the substrate is held in the holding device.

40. The substrate handling method according to claim 39, wherein, by the relative movement, while a portion of the substrate is held by the second holding portion, the first holding portion is moved in a manner that retracts from above the holding device to a position that does not overlap with the holding device in the vertical direction, so that the area of ​​the substrate whose holding by the first holding portion has been released is held by the holding device.

41. The substrate handling method according to claim 37 or 38, comprising handling a portion of the substrate to the holding device via the second holding portion.

42. The substrate handling method according to claim 41, wherein the relative movement causes the first holding portion to move relative to the holding device and the second holding portion from one end of the holding device to the other end of the holding device.

43. The substrate handling method according to claim 37 or 38, wherein the substrate is held in the first holding portion such that a portion of the substrate is at a shorter vertical distance from the holding device than other portions of the substrate are at a shorter distance from the holding device.

44. The substrate handling method according to claim 43, wherein the first holding portion has a substrate holding surface for holding the substrate. The substrate holding surface is configured to be inclined relative to the holding surface of the substrate held by the holding device.

45. The substrate handling method according to claim 44, wherein the first holding portion includes an angle changing portion, the angle changing portion changing the angle of the substrate holding surface.

46. ​​The substrate handling method according to claim 37 or 38, wherein the relative movement causes one of the holding device and the second holding portion and the first holding portion to move relative to the other in a direction along the holding surface of the holding device that holds the substrate.

47. The substrate handling method according to claim 37 or 38, wherein the first holding portion is moved above the holding device by the relative movement.

48. The substrate handling method according to claim 37 or 38, comprising adjusting the position of the substrate relative to the holding device while the second holding portion holds a portion of the substrate.

49. The substrate handling method according to claim 37 or 38, further comprising removing other substrates different from the substrate from the holding device. The other substrates are removed by means of the removal, and by the relative movement of the holding device and the second holding part with the first holding part.

50. The substrate handling method according to claim 49, wherein the other substrate is moved to a position between the first holding portion and the holding device in the vertical direction by the removal.

51. The substrate handling method according to claim 49, wherein the other substrates that have been moved out are held through the port portion by the removal process.

52. The substrate handling method according to claim 51, wherein the substrate holding device holds the substrate being handled from the port portion.

53. The substrate handling method according to claim 49, wherein the removal means for holding the held area of ​​the other substrate is moved relative to the holding means to remove the other substrate from the holding means.

54. The substrate handling method according to claim 49, wherein the first holding portion is moved relative to the second holding portion and the holding device by the relative movement, and the other substrate is removed.

55. The substrate handling method according to claim 49, wherein the removal causes the other substrate, which has been floated on the holding device, to move along the holding surface of the holding device.

56. An exposure method, comprising: The substrate is transported to the holding device by the substrate transport method as described in any one of claims 37 to 55; as well as An energy beam is irradiated onto the substrate to expose it.

57. A method for manufacturing a flat panel display, comprising: The substrate is exposed using the exposure method as described in claim 56; as well as The exposed substrate is then developed.

58. A method for manufacturing a component, comprising: The substrate is exposed using the exposure method as described in claim 56; as well as The exposed substrate is then developed.

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