Cutting path generation method, cutting method, system, electronic device, and medium

Abstract

Embodiments of the present application relate to the field of data processing, and disclose a cutting path generation method, a cutting method, a system, an electronic device and a medium. The cutting path generation method of a tooth corrector comprises: acquiring cutting path information of a to-be-cut pressure film assembly and a target cutting position of the pressure film assembly, the cutting path information containing cutting speeds of each cutting point; when the cutting speeds of each cutting point meet preset change conditions, acquiring point offset information of each cutting point according to preset laser cutting parameters, the cutting speeds of each cutting point and the target cutting position; adding the point offset information to the cutting path information to generate updated cutting path information. In this way, when the cutting speed meets the conditions, the cutting point is offset, the laser spot power density at the offset cutting point is reduced, the energy accumulation problem caused by the slow cutting speed can be eliminated, and a tooth corrector that meets the user's correction requirements and has a complete shape can be generated.

Description

Technical Field

[0001] This application relates to the field of data processing, more specifically to the field of dental instrument data processing, and particularly to a cutting path generation method, cutting method, system, electronic device, and medium. Background Technology

[0002] The manufacturing process of orthodontic appliances typically involves steps such as 3D printing of dental models, mold preparation, mold pressing, appliance cutting, and cleaning. Currently, most orthodontic appliance cutting is done manually, but due to its low efficiency, automated cutting is becoming increasingly popular. A common automated cutting solution uses a fixed laser as the cutting tool. A robot picks up the mold pressing assembly using a gripper. The mold pressing assembly includes a dental model and the appliance to be cut. The dental model is divided into a base area and an appliance area. The robot then moves the mold pressing assembly, causing the laser to cut along the target cutting position on the assembly according to the cutting path (involving rotation, offset, and acceleration / deceleration), ultimately yielding the finished orthodontic appliance.

[0003] Due to the complex gingival margin morphology, the cutting path of orthodontic appliances is also highly complex. To obtain a satisfactory finished appliance, the cutting speed of the robot-driven pressing assembly needs to be adjusted in real time according to the gingival margin morphology. Ideally, the matching laser should be able to adjust its output power in real time according to the cutting speed to prevent over-melting of the appliance's cut marks, damage to the appliance, or cutting through the appliance area of ​​the dental impression. However, adjusting the laser output power requires a series of hardware and software control processes, which have a relatively long time delay. Since the appliance cutting speed is fast and continuous, it is difficult to achieve the desired cutting effect. Real-time adjustment of the laser output power requires a complex laser control system, placing high demands on both the laser itself and the control system. Furthermore, real-time changes in laser output power can reduce the laser's lifespan. Therefore, in practical applications, fixed-power lasers are usually used, but these also present several problems: 1. In areas with slower cutting speeds, over-melting of the appliance's cut marks or damage to the appliance can easily occur, leading to damage or scrapping. 2. In areas with slower cutting speeds, molten black marks can easily appear at the appliance's cut, increasing the workload of subsequent polishing processes. 3. In areas with slower cutting speeds, the orthodontic appliance area of ​​the dental mold is easily damaged, rendering the dental mold unusable. If the appliance needs to be remade, the dental mold also needs to be reprinted, increasing the production cycle and costs. In addition, during the process inspection of the appliance, it is necessary to install the appliance on the dental mold and compare it with the target cutting position to determine whether it is qualified. If the appliance area of ​​the dental mold is damaged, it will affect the inspection results. Summary of the Invention

[0004] The purpose of this application is to provide a cutting path generation method, cutting method, system, electronic device and medium, which enables the cutting of the orthodontic appliance on the dental mold to be cut while ensuring the integrity of the appliance area of ​​the dental mold of the pressure film assembly, thereby generating a dental appliance that meets the user's orthodontic needs and has a complete shape.

[0005] To address the aforementioned technical problems, embodiments of this application provide a cutting path generation method, comprising: acquiring cutting path information of a pressure film assembly to be cut and a target cutting position of the pressure film assembly, wherein the cutting path information includes the cutting speed of each cutting point; when the cutting speed of each cutting point meets a preset change condition, acquiring point offset information of each cutting point according to preset laser cutting parameters, the cutting speed of each cutting point, and the target cutting position; and adding the point offset information to the cutting path information to generate updated cutting path information.

[0006] In addition, the cutting path generation method provided in this application embodiment includes laser power and laser beam cone angle as the cutting parameters of the laser; the step of obtaining point offset information of each cutting point according to the preset laser cutting parameters, the cutting speed of each cutting point and the target cutting position includes: obtaining the point offset information according to the laser power, the laser beam cone angle, the cutting speed of each cutting point and the target cutting position.

[0007] Furthermore, the cutting path generation method provided in this application embodiment, wherein obtaining the point offset information based on the laser power, the laser beam cone angle, the cutting speed of each cutting point, and the target cutting position includes: determining the required first spot power density for each cutting point based on the cutting speed of each cutting point; determining the energy density distribution information of the laser beam based on the laser power and the laser beam cone angle; and determining the point offset information based on the first spot power density and the energy density distribution of the laser beam.

[0008] In addition, the cutting path generation method provided in this application embodiment includes the energy density distribution information including the second spot power density of the laser at the laser focal point and the spot power density attenuation at the laser divergence point when the laser beam diverges; the spot power density offset of the cutting point is determined according to the first spot power density and the second spot power density; and the point offset information is determined according to the spot power density attenuation and the spot power density offset.

[0009] In addition, the cutting path generation method provided in this application embodiment includes energy density distribution information including the second spot power density and spot power density attenuation factor of the laser at the laser focus; the spot power density attenuation factor refers to the attenuation of spot power density within a unit distance from the laser focus; and the point offset information of the cutting point is obtained based on the first spot power density, the second spot power density and the spot power density attenuation factor.

[0010] In addition, the cutting path generation method provided in this application embodiment obtains the membrane thickness and membrane characteristics of the pressing assembly; the step of obtaining the point offset information of each cutting point according to the preset laser cutting parameters, the cutting speed of each cutting point and the target cutting position includes: obtaining the point offset information according to the laser cutting parameters, the cutting speed of each cutting point, the target cutting position, the membrane thickness and the membrane characteristics.

[0011] In addition, the cutting path generation method provided in this application embodiment further includes: obtaining the laser power according to the specified cutting speed of the pressing assembly, the film thickness and the film characteristics, wherein the laser power remains constant during the cutting of the pressing assembly.

[0012] In addition, the cutting path generation method provided in this application embodiment includes the cutting path information further including the cutting angle of each cutting point; the step of obtaining the point offset information of each cutting point according to the preset laser cutting parameters, the cutting speed of each cutting point and the target cutting position includes: obtaining the point offset information according to the laser cutting parameters, the cutting speed of each cutting point, the cutting angle of each cutting point and the target cutting position.

[0013] Furthermore, the cutting path generation method provided in this application embodiment includes a cutting path information that further comprises the cutting angle and cutting path of each cutting point; the step of adding the offset information of each point to the cutting path information to generate updated cutting path information includes: obtaining path offset information of the cutting path of each cutting point based on the offset information of the point, the cutting angle, and the target cutting position; the step of adding the offset information of each point to the cutting path information to generate updated cutting path information includes: adding the offset information of each point and the path offset information to the cutting path information to generate the updated cutting path information.

[0014] In addition, the cutting path generation method provided in this application embodiment includes a pressure film assembly comprising a dental mold and an orthodontic appliance to be cut on the dental mold; the point offset information is used to maintain the laser energy applied by the laser to the target cutting position within a preset energy range, and the laser energy within the energy range can cut through the orthodontic appliance to be cut to form a complete orthodontic appliance while maintaining the integrity of the appliance area of ​​the dental mold.

[0015] An embodiment of this application also provides a cutting method, comprising: obtaining updated cutting path information generated by the cutting path generation method described above; and cutting the pressure film assembly to be cut according to the updated cutting path information to generate a dental appliance.

[0016] Furthermore, the method provided in this application embodiment includes updating the path information, which includes the cutting path, point offset information, and path offset information for each cutting point. The step of cutting the pressure-film assembly according to the updated cutting path information to generate a dental appliance includes: for each of the cutting points, moving the pressure-film assembly according to the point offset information to move the cutting point to a specified cutting position indicated by the point offset information; determining a specified cutting path for the cutting point according to the path offset information and the cutting path; and after the pressure-film assembly has moved, using the specified cutting position as the cutting starting point, cutting the pressure-film assembly according to the specified cutting path to generate the dental appliance.

[0017] An embodiment of this application also provides a cutting path generation system, characterized in that the system includes: a first acquisition module, a second acquisition module, and a first generation module; the first acquisition module is used to acquire cutting path information of a pressure film assembly to be cut and a target cutting position of the pressure film assembly, the cutting path information including the cutting speed of each cutting point; the second acquisition module is used to acquire point offset information of each cutting point according to preset laser cutting parameters, the cutting speed of each cutting point, and the target cutting position when the cutting speed of each cutting point meets preset change conditions; the first generation module is used to add the point offset information to the cutting path information to generate updated cutting path information.

[0018] In addition, the cutting path generation system provided in this application embodiment also includes a sending module, which is used to send the updated cutting path information to a preset cutting system so that the cutting system can cut the pressure film assembly according to the updated cutting path information to generate a dental appliance.

[0019] Embodiments of this application also provide an electronic device, including: at least one processor; and a memory communicatively connected to the at least one processor; wherein the memory stores instructions executable by the at least one processor, the instructions being executed by the at least one processor to enable the at least one processor to perform the above-described cutting path generation method or cutting method.

[0020] Embodiments of this application also provide a computer-readable storage medium storing a computer program that, when executed by a processor, implements the above-described cutting path generation method or cutting method.

[0021] In this embodiment, during the generation of the cutting path for the orthodontic appliance, the cutting path information of the pressure film assembly to be cut and the target cutting position of the pressure film assembly are obtained. The cutting path information includes the cutting speed of each cutting point. When the cutting speed of each cutting point meets a preset change condition, the point offset information of each cutting point is obtained according to the preset laser cutting parameters, the cutting speed of each cutting point, and the target cutting position. The point offset information is added to the cutting path information to generate updated cutting path information. This allows the application to offset the cutting points when the cutting speed meets certain conditions. The laser spot power density at the offset cutting point is reduced, which can eliminate the energy accumulation problem caused by the slowed cutting speed. This enables the application to cut through the orthodontic appliance on the dental mold while ensuring the integrity of the appliance area of ​​the dental mold of the pressure film assembly, thereby generating an orthodontic appliance that meets the user's orthodontic needs and has a complete shape. This solves the technical problems in the prior art such as over-melting or damage to the orthodontic appliance cut marks, molten black marks at the orthodontic appliance cut, and damage to the dental mold caused by laser energy accumulation at the cutting points. Attached Figure Description

[0022] One or more embodiments are illustrated by way of example with reference to the accompanying drawings, and these illustrative descriptions do not constitute a limitation on the embodiments.

[0023] Figure 1 This is a schematic diagram of the structure of the pressure film assembly provided in the embodiments of this application;

[0024] Figure 2 This is a flowchart of the cutting path generation method provided in the embodiments of this application;

[0025] Figure 3 This is a schematic diagram of the structure of the laser provided in the embodiments of this application;

[0026] Figure 4 This is a flowchart illustrating the generation of the cutting path provided in an embodiment of this application;

[0027] Figure 5 This is a schematic diagram of laser divergence provided in an embodiment of this application;

[0028] Figure 6A This is a schematic diagram of the cutting point before offset provided in the embodiments of this application;

[0029] Figure 6B This is a schematic diagram of the cutting point offset provided in the embodiments of this application;

[0030] Figure 6C This is another schematic diagram showing the offset of the cutting point provided in the embodiment of this application;

[0031] Figure 7 This is a flowchart illustrating the generation of the cutting path provided in an embodiment of this application;

[0032] Figure 8 This is a flowchart illustrating the generation of the cutting path provided in an embodiment of this application;

[0033] Figure 9 This is a flowchart of the cutting method provided in the embodiments of this application;

[0034] Figure 10 yes Figure 9 The flowchart shown is a step 502 of the cutting method provided in the embodiment of this application;

[0035] Figure 11 This is a schematic diagram of the cutting path generation system provided in the embodiments of this application;

[0036] Figure 12 This is a schematic diagram of the cutting system provided in the embodiments of this application;

[0037] Figure 13 This is a schematic diagram of the structure of the electronic device provided in the embodiments of this application. Detailed Implementation

[0038] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the various embodiments of this application will be described in detail below with reference to the accompanying drawings. However, those skilled in the art will understand that many technical details have been provided in the various embodiments of this application to help readers better understand this application. However, the technical solutions claimed in this application can be implemented even without these technical details and various changes and modifications based on the following embodiments. The division of the various embodiments below is for the convenience of description and should not constitute any limitation on the specific implementation of this application. The various embodiments can be combined with and referenced by each other without contradiction.

[0039] The pressure film assembly 1 mentioned in the embodiments of this application is as follows: Figure 1As shown, the pressure film assembly 1 includes a dental mold 11 and an orthodontic appliance 12 formed on the dental mold 11. The dental mold 11 includes a base region 13 and an appliance region 14. The appliance region 14 is above the target cutting position 16, and the base region 13 is below the target cutting position 16. In one specific embodiment, the target cutting position 16 is the gingival line. In another specific embodiment, the target cutting position 16 may also be located below the gingival line. At the same time, the pressure film assembly 1 is provided with a pressure film assembly identifier 15. The orthodontic appliance 12 of the pressure film assembly 1 is usually a diaphragm to be cut. The embodiments of this application can be applied to any terminal, server, or electronic device that can perform data processing. The terminal, server, or electronic device can communicate with the device that controls the movement of the pressure film assembly 1, or the terminal, server, or electronic device can be embedded in the device that controls the movement of the pressure film assembly 1.

[0040] Embodiments of this application relate to a cutting method for orthodontic appliances, such as... Figure 2 As shown, the specific steps include:

[0041] Step 101: Obtain the cutting path information and the target cutting position of the film pressing component 1 to be cut. The cutting path information includes the cutting speed of each cutting point.

[0042] In one example implementation, once the pressure film assembly 1 to be cut is determined, the pressure film assembly 1 can be scanned and its information identified to obtain the pressure film assembly identifier 15. After obtaining the pressure film assembly identifier 15, the cutting path information and the target cutting position 16 of the pressure film assembly 1 can be obtained from the preset pressure film assembly database based on the pressure film assembly identifier 15. The membrane thickness and membrane characteristics of the pressure film assembly 1 can also be obtained based on the pressure film assembly identifier 15. The membrane thickness and membrane characteristics are related information of the dental appliance 12 to be cut in the pressure film assembly 1.

[0043] In one example implementation, the cutting path information of the pressure film assembly 1 is composed of the cutting information of each cutting point. The cutting information of each cutting point includes, but is not limited to, cutting speed, cutting angle, and cutting path; wherein, the cutting path of a cutting point refers to the path generated by moving from the current cutting point to the next cutting point, such as... Figure 1 As shown, the cutting path of cutting point A is the path generated by moving from cutting point A to cutting point B, and the cutting path of cutting point B is the path generated by moving from cutting point B to cutting point C; the cutting speed of the cutting point refers to the speed when moving on the cutting path of the cutting point; the cutting angle of the cutting point refers to the angle between the laser beam of laser 3 and the pressure film assembly 1 when moving on the cutting path of the cutting point.

[0044] Step 102: When the cutting speed of each cutting point meets the preset change conditions, obtain the point offset information of each cutting point according to the preset cutting parameters of laser 3, the cutting speed of each cutting point and the target cutting position.

[0045] In one example implementation, the cutting method used in this application is laser cutting, such as... Figure 3 As shown, the basic principle of laser cutting is to focus the laser emitted by the laser emitting part 31 into a very small spot (laser focus 32) through a lens. The spot has a high power density. When the spot irradiates the material, the irradiated material melts, vaporizes, ablates, or reaches its ignition point and forms a hole. As the beam moves relative to the material, the holes become continuous, thus achieving cutting. The laser emitted by the laser 3 is focused by the lens, and the power density is the largest and the spot diameter is the smallest at the focal point P. When the cutting point 33 is far away from the laser focus, the laser beam diverges, the power density decreases, and the spot diameter increases.

[0046] In one example implementation, due to the complex morphology of the gingival line, the cutting speed used in the molar region is slower than that used in the anterior region. Furthermore, the output power of the laser 3 used in this application is constant. When the cutting speed is slow, laser energy will accumulate at the cutting point, leading to over-melting or damage to the orthodontic appliance incision, molten black marks at the orthodontic appliance incision, and damage to the dental model 11. Therefore, when the cutting speed at the cutting point meets the preset change conditions, this application will determine the point offset information of the cutting point based on the laser cutting parameters and the target cutting position. The change conditions can be that the cutting speed is lower than the preset speed threshold. The cutting parameters of the laser 3 include, but are not limited to, the laser power and the laser beam cone angle.

[0047] In one example implementation, when determining the point offset information of the cutting point, the laser power is considered because the laser power determines the power density of the light spot, and the laser beam cone angle α is considered because the laser beam cone angle determines the diameter of the light spot when the laser beam diverges. After the cutting point is offset according to the point offset information, the cutting point is also far away from the laser focus, causing the laser beam to diverge and the power density of the light spot to decrease. This ensures that the laser energy applied by the laser 3 to the target cutting position 16 is maintained within the preset energy range. The laser energy within the energy range can cut through the orthodontic appliance 12 to be cut to form a complete orthodontic appliance while maintaining the integrity of the appliance area 13 of the dental model.

[0048] Step 103: Add the offset information of each point to the cutting path information to generate updated cutting path information.

[0049] In one example implementation, each cutting point in the cutting path information of the film pressing component 1 is traversed. For cutting points with point offset information, the point offset information is added to the cutting information corresponding to that cutting point. For cutting points without point offset information, the cutting information corresponding to that cutting point remains unchanged. After traversing all cutting points, the updated cutting path information is generated.

[0050] In this embodiment, during the cutting process of the orthodontic appliance, the cutting path information of the pressure film assembly 1 to be cut and the target cutting position 16 of the pressure film assembly 1 are obtained. The cutting path information includes the cutting speed of each cutting point. When the cutting speed of each cutting point meets the preset change conditions, the point offset information of each cutting point is obtained according to the preset cutting parameters of the laser 3, the cutting speed of each cutting point and the target cutting position 16. The point offset information is added to the cutting path information to generate updated cutting path information. This invention enables the cutting point to be offset to a certain extent when the cutting speed meets certain conditions. The laser spot power density at the offset cutting point is reduced, which can eliminate the energy accumulation problem caused by the slow cutting speed. This allows the invention to cut through the orthodontic appliance to be cut on the dental mold 11 while ensuring the integrity of the appliance area 13 of the dental mold 11 of the pressure film assembly 1. This results in the generation of a dental appliance that meets the user's orthodontic needs and has a complete shape. This solves the technical problems in the prior art, such as over-melting or damage to the dental appliance cut marks, molten black marks at the dental appliance cut, and damage to the dental mold caused by laser energy accumulation at the cutting point.

[0051] Embodiments of this application relate to a cutting method for orthodontic appliances, such as... Figure 4 As shown, the specific steps include:

[0052] Step 201: Obtain the cutting path information of the pressure film assembly 1 to be cut and the target cutting position 16 of the pressure film assembly 1. The cutting path information includes the cutting speed of each cutting point.

[0053] In one example implementation, this step is largely the same as step 101 in the embodiments of this application, and will not be described in detail here.

[0054] Step 202: When the cutting speed of each cutting point meets the preset change conditions, obtain the point offset information of each cutting point based on the laser power, laser beam cone angle, cutting speed of each cutting point and target cutting position 16.

[0055] In one example implementation, the cutting parameters of laser 3 include, but are not limited to, laser power and laser beam cone angle. When the cutting speed at the cutting point meets the change conditions, it indicates that the power density of the laser spot at the laser focus 32 of laser 3 is too high, and the cutting point of the pressure film assembly 1 needs to be adjusted. When determining the point offset information of the cutting point, the required first spot power density of the cutting point can be determined according to the cutting speed of the cutting point, and then the energy density distribution information of the laser beam of the laser can be determined according to the laser power and the laser beam cone angle. Then, the point cutting information of the cutting point can be determined by combining the first spot power density and the energy density distribution information of the laser beam of the laser.

[0056] In one example implementation, the energy density distribution information includes the second spot power density of the laser at the laser focus and the attenuation of the spot power density at the laser divergence points. When determining the point cutting information of the cutting point by combining the first spot power density and the energy density distribution information of the laser beam, it is first necessary to determine the spot power density offset of the cutting point based on the first and second spot power densities. Then, the point offset information is determined based on the spot power density attenuation and the spot power density offset. The spot power density attenuation at each laser divergence point refers to the change in spot power density as the laser beam diverges from the laser focus outwards, such as... Figure 5 As shown, the acquired beam power density attenuation amounts include beam power density attenuation X, beam power density attenuation Y, beam power density attenuation Z, and beam power density attenuation L. Beam power density attenuation X is the change in beam power density from laser focus 51 to the first laser divergence point 52, and so on. Beam power density attenuation Y is the change in beam power density from laser focus 51 to the second laser divergence point 53, beam power density attenuation Z is the change in beam power density from laser focus 51 to the second laser divergence point 54, and beam power density attenuation L is the change in beam power density from laser focus 51 to the fourth laser divergence point 55. When the beam power density offset of the cutting point is the same as the beam power density attenuation of a certain laser divergence point, the position of that laser divergence point can be considered as the position of the cutting point. That is, the point offset information of the cutting point can be determined based on the position of the laser divergence point.

[0057] In one example implementation, the energy density distribution information includes the second spot power density and spot power density attenuation factor of the laser 3 at the laser focus 32; the spot power density attenuation factor refers to the amount of attenuation of the spot power density per unit distance from the laser focus; when determining the point cutting information of the cutting point by combining the first spot power density and the energy density distribution information of the laser beam of the laser, the point offset information of the cutting point is calculated based on the first spot power density, the second spot power density and the spot power density attenuation factor.

[0058] In one example implementation, since the cutting angle of each cutting point also affects the position of the cutting point, if the cutting angle is too small, it is necessary to add a part of the point offset information error to the original point offset information to avoid errors in the cutting of the orthodontic appliance. This application can pre-set an information table of the point offset information error required under various cutting angles. When using it, the point offset information error corresponding to the cutting angle can be obtained from the corresponding information table according to the cutting angle.

[0059] In one example implementation, such as Figure 6A As shown, before the pressure film assembly 1 moves, the laser focus 61 and the laser cutting point 62 coincide, and both the laser focus 61 and the laser cutting point 62 coincide with the target cutting position 63. Above the target cutting position 63 is the aligner area 64, and below the target cutting position 63 is the base area 65. After the laser cutting point 62 cuts along the target cutting position 63, the orthodontic appliance is generated. After the pressure film assembly moves the cutting point according to the point offset information, as shown... Figure 6B As shown, the laser cutting point 62 is the position where the outer contour 66 of the laser spot of the laser is tangent to the target cutting position 63. At this time, the laser focus 61 and the laser cutting point 62 do not coincide, so that the laser spot generated by the laser can penetrate the orthodontic appliance to be cut along the target cutting position 63 to obtain a complete orthodontic appliance.

[0060] In one example implementation, such as Figure 6C As shown, after moving the cutting point according to the point offset information, the target cutting position 63 is located within the preset error range inside and outside the outer contour 66 of the laser spot of the laser; in a specific implementation, the error range can be 0 to 1 mm.

[0061] Step 203: Add the offset information of each point to the cutting path information to generate updated cutting path information.

[0062] In one example implementation, this step is largely the same as step 103 in the embodiments of this application, and will not be described in detail here.

[0063] In this embodiment of the application, based on other embodiments, the laser power and laser beam cone angle factors that affect the laser spot power density can be considered when generating the point offset information of each cutting point. This ensures that the point offset information obtained in this application can guarantee that the laser spot power density at the offset cutting point can cut through the orthodontic appliance 12 on the dental mold 11 while ensuring the integrity of the appliance area 13 of the dental mold 11 of the pressure film assembly 1.

[0064] Embodiments of this application relate to a cutting method for orthodontic appliances, such as... Figure 7 As shown, the specific steps include:

[0065] Step 301: Obtain the cutting path information of the pressure film assembly 1 to be cut, the target cutting position 16 of the pressure film assembly 1, and the film thickness and film characteristics of the pressure film assembly 1. The cutting path information includes the cutting speed of each cutting point.

[0066] In one example implementation, this step is largely the same as step 101 in the embodiments of this application, and will not be described in detail here.

[0067] Step 302: When the cutting speed of each cutting point meets the preset change conditions, obtain the point offset information of each cutting point according to the preset cutting parameters of laser 3, the cutting speed of each cutting point, the target cutting position 16, the film thickness and film characteristics.

[0068] In one example implementation, this step is largely the same as the two methods for obtaining point offset information mentioned in step 202. The difference is that in this step, the first spot power density required for the cutting point is obtained based on the cutting speed, diaphragm thickness, and diaphragm characteristics.

[0069] In one example implementation, the laser power is obtained based on the specified cutting speed, diaphragm thickness, and diaphragm characteristics of the pressure assembly 1. The laser power remains constant during the cutting of the pressure assembly 1. The specified cutting speed is the maximum value among the cutting speeds at each cutting point of the pressure assembly 1. The maximum cutting speed is selected to ensure that the maximum spot power density emitted by the laser 3 can penetrate the orthodontic appliance 12 to be cut when the cutting speed is maximum.

[0070] Step 303: Add the offset information of each point to the cutting path information to generate updated cutting path information.

[0071] In one example implementation, this step is largely the same as step 103 in the embodiments of this application, and will not be described in detail here.

[0072] In this embodiment of the application, based on other embodiments, factors such as the membrane thickness and membrane characteristics of the orthodontic appliance to be cut can be considered when generating the point offset information of each cutting point. This ensures that the point offset information obtained in this application can guarantee that the laser spot power density at the offset cutting point can cut through the orthodontic appliance 12 to be cut on the dental mold 11 while ensuring the integrity of the appliance area 13 of the dental mold 11 of the pressure mold assembly 1.

[0073] Embodiments of this application relate to a cutting method for orthodontic appliances, such as... Figure 8 As shown, the specific steps include:

[0074] Step 401: Obtain the cutting path information of the pressure film assembly 1 to be cut and the target cutting position 16 of the pressure film assembly 1. The cutting path information includes the cutting speed, cutting angle and cutting path of each cutting point.

[0075] In one example implementation, this step is largely the same as step 101 in the embodiments of this application, and will not be described in detail here.

[0076] Step 402: When the cutting speed of each cutting point meets the preset change conditions, obtain the point offset information of each cutting point according to the preset cutting parameters of laser 3, the cutting speed of each cutting point and the target cutting position.

[0077] In one example implementation, this step is largely the same as step 102 in the embodiments of this application, and will not be described in detail here.

[0078] Step 403: Obtain the path offset information of the cutting path of each cutting point based on the point offset information, cutting angle and target cutting position 16.

[0079] In one example implementation, after the cutting point offset, due to the increased diameter of the laser spot on the pressure film assembly 1, in order to avoid the orthodontic appliance being shortened, it is necessary to obtain the path offset information of the cutting path of each cutting point based on the point offset information, the cutting angle, and the target cutting position.

[0080] In one example implementation, the light spot diameter is first obtained based on the preset correspondence between point offset information and light spot diameter. Then, the first path offset information is determined based on the distance between the cutting point and the target cutting position 16 and the distance between the cutting point and the outer contour of the light spot (i.e., the light spot radius). Since the gingival line has a complex shape, different cutting angles need to be used during cutting. After determining the first path offset information, the corresponding second path offset information is also obtained from the preset cutting angle and offset information table based on the cutting angle. The path offset information of the cutting point is obtained by combining the first path offset information and the second path offset information.

[0081] Step 404: Add the offset information of each point and the offset information of each path to the cutting path information to generate updated cutting path information.

[0082] In one example implementation, each cutting point in the cutting path information of the film pressing component 1 is traversed. For cutting points with both point offset information and path offset information, the point offset information and path offset information are added to the cutting information corresponding to that cutting point. For cutting points without both point offset information and path offset information, the cutting information corresponding to that cutting point remains unchanged. After traversing all cutting points, the updated cutting path information is generated.

[0083] In this embodiment of the application, based on other embodiments, the cutting point can be offset while the corresponding cutting path is also offset. Due to the offset of the cutting point, the laser spot size increases, and the cutting path needs to be offset to a certain extent to prevent the orthodontic appliance from being cut too short. The increased spot size may damage the base area 14 of the molding and pressing assembly 1, but this area itself is an unwanted waste area, so it has no impact on the orthodontic appliance cutting production.

[0084] Embodiments of this application relate to a cutting method for orthodontic appliances, such as... Figure 9 As shown, the specific steps include:

[0085] Step 501: Obtain the updated cutting path information generated by the cutting path generation method described above;

[0086] In one example implementation, the updated cutting path information obtained in this step is the updated cutting path information generated by any of the cutting path generation methods in the above embodiments.

[0087] Step 502: Cut the pressure film component 1 to be cut according to the updated cutting path information to generate a dental appliance.

[0088] In one example implementation, updating the cutting path information includes the cutting speed, cutting angle, cutting path, point offset information, and path offset information for each cutting point. The pressure film assembly 1 to be cut is as follows: Figure 1 As shown, this step actually involves cutting... Figure 1 The shown orthodontic appliance 12 is cut. During the cutting process of the pressure film assembly 1 according to the updated cutting path information, for cutting points without point offset information and path offset information, the laser focus 32 of the laser 3 is used to cut along the target cutting position. For cutting points with point offset information, the pressure film assembly is moved according to the point offset information, so that the cutting point after the pressure film assembly moves away from the laser focus 32. Because the moving cutting point is away from the laser focus 32, the power density of the laser spot at the moving cutting point is reduced. The power density of the laser spot at the moving cutting point can cut through the orthodontic appliance 12 while maintaining the integrity of the appliance area 13 of the dental model 11, thereby avoiding laser energy accumulation caused by slow cutting speed. After the cutting of the pressure film assembly 1 is completed according to the last cutting point, an orthodontic appliance that meets the user's orthodontic needs and has a complete shape is generated. The specific cutting steps are as follows: Figure 10 As shown, it includes:

[0089] Step 601: For each cutting point, move the pressure film assembly according to the point offset information so that the cutting point moves to the specified cutting position indicated by the point offset information.

[0090] In one example implementation, each cutting point in the lamination assembly 1 is traversed. If the point offset information or path offset information of the cutting point is empty, it is considered that the cutting point does not have point offset information or path offset information, and cutting is performed according to the original cutting point or the original cutting path. If the cutting point has point offset information or path offset information, the lamination assembly needs to be moved according to the point offset information so that the cutting point moves to the specified cutting position indicated by the offset information. At the specified cutting position, the outer contour of the laser spot coincides with the target cutting position or the shortest distance between the outer contour of the laser spot and the target cutting position is within the error range, which can be 0-1mm.

[0091] Step 602: Determine the specified cutting path for the cutting point based on the path offset information and the cutting path.

[0092] In one example implementation, the path offset information indicates the amount of deviation of the path. After the cutting path of the cutting point is offset in a specified direction according to the path offset information, the specified cutting path corresponding to the cutting point is obtained.

[0093] Step 603: After the pressure film assembly 1 has moved, the specified cutting position is used as the cutting starting point, and the pressure film assembly 1 is cut according to the specified cutting path to generate a dental appliance.

[0094] In one example implementation, after the pressure film assembly has moved, a cutting position is specified as the cutting start point. Starting from this cutting start point, the pressure film assembly is moved according to the specified cutting path to complete the cutting corresponding to that cutting point. After completing the cutting corresponding to each cutting point, a dental appliance can be generated.

[0095] In this embodiment, based on other embodiments, the robot can autonomously move the pressure film assembly 1 according to the point offset information and path offset information during the cutting process of the orthodontic appliance, thereby realizing the automated cutting of the orthodontic appliance.

[0096] The steps of the various methods described above are only for clarity. In practice, they can be combined into one step or some steps can be split into multiple steps. As long as they include the same logical relationship, they are all within the scope of protection of this patent. Adding insignificant modifications or introducing insignificant designs to the algorithm or process, but without changing the core design of the algorithm and process, are also within the scope of protection of this patent.

[0097] The embodiments of this application relate to a cutting path generation system. The details of the cutting path generation system in this embodiment are described below. The following content is merely for ease of understanding and is not essential for implementing this example. Figure 11This is a schematic diagram of the cutting path generation system of this embodiment, including: a first acquisition module 701, a second acquisition module 702 and a first generation module 703.

[0098] The first acquisition module 701 is used to acquire the cutting path information of the mold component 1 to be cut and the target cutting position 16 of the mold component 1. The cutting path information includes the cutting speed of each cutting point.

[0099] The second acquisition module 702 is used to acquire the point offset information of each cutting point according to the preset cutting parameters of the laser 3, the cutting speed of each cutting point and the target cutting position when the cutting speed of each cutting point meets the preset change conditions.

[0100] The first generation module 703 is used to add the offset information of each point to the cutting path information to generate and update the cutting path information.

[0101] It is not difficult to see that this embodiment is a system embodiment corresponding to the above method embodiments, and this embodiment can be implemented in conjunction with the above method embodiments. The relevant technical details and technical effects mentioned in the above embodiments are still valid in this embodiment, and will not be repeated here to reduce repetition. Accordingly, the relevant technical details mentioned in this embodiment can also be applied to the above embodiments.

[0102] The embodiments of this application relate to a cutting system. The details of the cutting system in this embodiment are described below. The following content is merely for ease of understanding and is not essential for implementing this example. Figure 12 This is a schematic diagram of the cutting system of this embodiment, including: an acquisition module 801 and a cutting module 802.

[0103] The acquisition module 801 is used to acquire the updated cutting path information generated by the cutting path generation method described above.

[0104] The cutting module 802 is used to cut the pressure film assembly 1 to be cut according to the updated cutting path information to generate a dental appliance.

[0105] It is not difficult to see that this embodiment is a system embodiment corresponding to the above method embodiments, and this embodiment can be implemented in conjunction with the above method embodiments. The relevant technical details and technical effects mentioned in the above embodiments are still valid in this embodiment, and will not be repeated here to reduce repetition. Accordingly, the relevant technical details mentioned in this embodiment can also be applied to the above embodiments.

[0106] This application relates to an electronic device, such as... Figure 13As shown, it includes: at least one processor 901; and a memory 902 communicatively connected to the at least one processor 901; wherein the memory 902 stores instructions executable by the at least one processor 901, the instructions being executed by the at least one processor 901 to enable the at least one processor 901 to execute the cutting path generation method or cutting method in the above embodiments.

[0107] The memory and processor are connected via a bus, which can include any number of interconnecting buses and bridges, connecting various circuits of one or more processors and memories. The bus can also connect various other circuits, such as peripheral devices, voltage regulators, and power management circuits, which are well known in the art and will not be described further herein. The bus interface provides an interface between the bus and the transceiver. The transceiver can be a single element or multiple elements, such as multiple receivers and transmitters, providing a unit for communicating with various other devices over a transmission medium. Data processed by the processor is transmitted over the wireless medium via an antenna, which further receives data and transmits it to the processor.

[0108] The processor manages the bus and general processing, and also provides various functions, including timing, peripheral interfaces, voltage regulation, power management, and other control functions. Memory is used to store data used by the processor during operation.

[0109] This application relates to a computer-readable storage medium storing a computer program. When the computer program is executed by a processor, it implements the method embodiments described above.

[0110] That is, those skilled in the art will understand that all or part of the steps in the methods of the above embodiments can be implemented by a program instructing related hardware. This program is stored in a storage medium and includes several instructions to cause a device (which may be a microcontroller, chip, etc.) or processor to execute all or part of the steps of the methods described in the various embodiments of this application. The aforementioned storage medium includes various media capable of storing program code, such as a USB flash drive, a portable hard drive, a read-only memory (ROM), a random access memory (RAM), a magnetic disk, or an optical disk.

[0111] Those skilled in the art will understand that the above embodiments are specific embodiments for implementing this application, and in practical applications, various changes can be made to them in form and detail without departing from the spirit and scope of this application.

Claims

1. A method for generating cutting paths, characterized in that, The method includes: Obtain the cutting path information of the pressure film assembly to be cut and the target cutting position of the pressure film assembly, wherein the cutting path information includes the cutting speed of each cutting point; When the cutting speed of each cutting point meets the preset change conditions, the point offset information of each cutting point is obtained according to the preset laser cutting parameters, the cutting speed of each cutting point, and the target cutting position; wherein, the point offset information is used to make the cutting point deviate from the laser focus of the laser. The offset information of each point is added to the cutting path information to generate updated cutting path information.

2. The cutting path generation method according to claim 1, characterized in that, The cutting parameters of the laser include laser power and laser beam cone angle; The step of obtaining the point offset information of each cutting point based on the preset laser cutting parameters, the cutting speed of each cutting point, and the target cutting position includes: The point offset information is obtained based on the laser power, the laser beam cone angle, the cutting speed of each cutting point, and the target cutting position.

3. The cutting path generation method according to claim 2, characterized in that, The step of obtaining the point offset information based on the laser power, the laser beam cone angle, the cutting speed of each cutting point, and the target cutting position includes: The required first spot power density for each cutting point is determined based on the cutting speed of each cutting point. The energy density distribution information of the laser beam is determined based on the laser power and the laser beam cone angle. The point offset information is determined based on the power density of the first spot and the energy density distribution of the laser beam from the laser.

4. The cutting path generation method according to claim 3, characterized in that, The energy density distribution information includes the second spot power density of the laser at the laser focal point and the attenuation of the spot power density at the laser divergence point when the laser beam diverges. The spot power density offset of the cutting point is determined based on the first spot power density and the second spot power density; The point offset information is determined based on the light spot power density attenuation and the light spot power density offset.

5. The cutting path generation method according to claim 3, characterized in that, The energy density distribution information includes the second spot power density and spot power density attenuation factor of the laser at the laser focus; the spot power density attenuation factor refers to the amount of attenuation of the spot power density per unit distance from the laser focus; The point offset information of the cutting point is obtained based on the first spot power density, the second spot power density, and the spot power density attenuation factor.

6. The cutting path generation method according to claim 1, characterized in that, The method further includes: obtaining the membrane thickness of the membrane assembly and the membrane characteristics of the membrane assembly; The step of obtaining the point offset information of each cutting point based on the preset laser cutting parameters, the cutting speed of each cutting point, and the target cutting position includes: The point offset information is obtained based on the laser cutting parameters, the cutting speed of each cutting point, the target cutting position, the membrane thickness, and the membrane characteristics.

7. The cutting path generation method according to claim 6, characterized in that, The method further includes: The laser power is obtained based on the specified cutting speed of the pressure film assembly, the film thickness, and the film characteristics, wherein the laser power remains constant during the cutting of the pressure film assembly.

8. The cutting path generation method according to claim 1, characterized in that, The cutting path information also includes the cutting angle of each cutting point; The step of obtaining the point offset information of each cutting point based on the preset laser cutting parameters, the cutting speed of each cutting point, and the target cutting position includes: The point offset information is obtained based on the laser's cutting parameters, the cutting speed of each cutting point, the cutting angle of each cutting point, and the target cutting position.

9. The cutting path generation method according to any one of claims 1 to 7, characterized in that, The cutting path information also includes the cutting angle of each cutting point and the cutting path of each cutting point; The step of adding the offset information of each point to the cutting path information to generate updated cutting path information includes, prior to: The path offset information of the cutting path of each cutting point is obtained based on the offset information of the point, the cutting angle, and the target cutting position; The step of adding the offset information of each point to the cutting path information to generate updated cutting path information includes: The point offset information and the path offset information are added to the cutting path information to generate the updated cutting path information.

10. The cutting path generation method according to any one of claims 1 to 8, characterized in that, The pressure molding assembly includes a dental mold and an orthodontic appliance for the teeth to be cut on the dental mold; The point offset information is used to maintain the laser energy applied by the laser to the target cutting position within a preset energy range. The laser energy within the energy range can cut through the tooth to be cut to form a complete orthodontic appliance while maintaining the integrity of the appliance area of ​​the dental model.

11. A cutting method, characterized in that, The method includes: Obtain the updated cutting path information generated by the cutting path generation method as described in any one of claims 1-10; The pressure film assembly to be cut is cut according to the updated cutting path information to generate a dental appliance.

12. The cutting method according to claim 11, characterized in that, The updated cutting path information includes the cutting path, point offset information, and path offset information for each cutting point; The step of cutting the pressure-film assembly to be cut according to the updated cutting path information to generate a dental appliance includes: For each of the cutting points, the pressure film assembly is moved according to the point offset information so that the cutting point is moved to the specified cutting position indicated by the point offset information; The specified cutting path for the cutting point is determined based on the path offset information and the cutting path. After the pressure film assembly has moved, the designated cutting position is used as the cutting starting point, and the pressure film assembly is cut according to the designated cutting path to generate the orthodontic appliance.

13. A cutting path generation system, characterized in that, The system includes: a first acquisition module, a second acquisition module, and a first generation module; The first acquisition module is used to acquire the cutting path information of the pressure film assembly to be cut and the target cutting position of the pressure film assembly, wherein the cutting path information includes the cutting speed of each cutting point; The second acquisition module is used to acquire point offset information of each cutting point according to preset laser cutting parameters, the cutting speed of each cutting point and the target cutting position when the cutting speed of each cutting point meets preset change conditions; wherein, the point offset information is used to make the cutting point deviate from the laser focus of the laser. The first generation module is used to add the offset information of each point to the cutting path information to generate updated cutting path information.

14. The cutting path generation system according to claim 13, characterized in that, The system also includes a sending module, which is used to send the updated cutting path information to a preset cutting system, so that the cutting system can cut the pressure film assembly according to the updated cutting path information to generate a dental appliance.

15. An electronic device, characterized in that, include: At least one processor; as well as, A memory communicatively connected to the at least one processor; wherein, The memory stores instructions executable by the at least one processor, which, when executed by the at least one processor, enables the at least one processor to perform the cutting path generation method as claimed in any one of claims 1 to 10 or the cutting method as claimed in any one of claims 11 to 12.

16. A computer-readable storage medium storing a computer program, characterized in that, When the computer program is executed by a processor, it implements the cutting path generation method of any one of claims 1 to 10 or the cutting method of any one of claims 11 to 12.

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