Relay board assembly for detecting image modules and its detection system

Abstract

This invention discloses a relay board assembly and its testing system for testing image modules. The relay board assembly includes an image acquisition card and an image test signal generation card. The image acquisition card includes an image signal receiver and a first switching module. The image test signal generation card includes a second and a third switching module and is equipped with a standard image signal processor. By controlling the transmission path through the first to third switching modules of the ATE, the switching between ATE electrical testing and high-speed image testing is achieved. The preset image data built into the standard image signal processor can be provided as a high-speed test signal to the image signal processor under test, so that ATEs that do not have the ability to provide high-speed image signals can also be used to perform high-speed image testing, thereby reducing the testing cost.

Description

[Technical Field]

[0001] This invention relates to a detection component for an image module, and more specifically, to a relay board assembly for detecting an image module and a detection system thereof. [Background Technology]

[0002] An image module may include an image sensor and an image signal processor (ISP), or one of these two. The image sensor acquires images of the environment and provides the raw image data to the image signal processor, which then performs analysis, correction, and processing procedures (e.g., white balance adjustment, exposure correction, sharpening, color conversion, noise reduction, and encoding) to generate high-quality images. With the ever-increasing volume of image data acquired by image sensors, the processing power of the image signal processor becomes increasingly important.

[0003] During the mass production of image modules, various tests are performed on the image modules using automated test equipment (ATE). In addition to performing electrical tests on each pin of the image sensor, the automated test equipment also provides a light source to the image sensor to test its sensing capabilities.

[0004] Automated testing equipment must also test image signal processors (ESPs). Furthermore, due to the massive amount of image data, the data transmission interface from the image sensor to the ESP must employ a high-speed interface, such as the Mobile Industry Processor Interface (MIPI), with transmission speeds exceeding 2.5 Gsps. To input test signals into the ESP, a matching transmission speed is required, necessitating an increase in the signal output capability of the automated testing equipment. However, automated testing equipment with transmission speeds exceeding 1 Gsps is already quite expensive, let alone those exceeding 2.5 Gsps. This keeps the testing cost of ESPs high. [Summary of the Invention]

[0005] One of the objectives of this invention is to reduce the testing cost of image signal processors.

[0006] To achieve the above and other objectives, the present invention provides a relay board assembly for detecting an image module, which is mounted on a detection interface and controlled by an automated testing device to provide preset image data built into a standard image signal processor to an image signal processor under test (DUT) within an object under test (AUT). The relay board assembly includes an image acquisition card and an image test signal generation card. The image acquisition card includes an image signal receiver and a first switching module coupled between the automated testing device, the image signal receiver, and the detection interface. The first switching module is controlled by the automated testing device to selectively switch to a first path or a second path. The image test signal generation card is used to mount a standard image signal processor and includes a second switching module and a third switching module coupled between the automated testing device, the detection interface, and the standard image signal processor. The second switching module is controlled by the automated testing device to selectively switch to the first path or the third path. The first path connects each switching module to the automated testing equipment, the second path connects the first switching module to the image signal receiver, and the third path connects the second switching module to the standard image signal processor. The image test signal generation card provides preset image data to an input terminal of the image signal processor under test through the third path. The first and second switching modules are coupled to the detection interface.

[0007] In one embodiment of the present invention, the third switching module is coupled between the automated testing equipment and the standard image signal processor and is floating with the detection interface. The third switching module is controlled by the automated testing equipment to switch to simultaneously conduct the first path and the third path, so that the automated testing equipment controls the standard image signal processor to cause the standard image signal processor to output preset image data.

[0008] In one embodiment of the present invention, when an automated testing device performs electrical testing on the input terminal of the image signal processor under test, the second switching module can be controlled to switch to the first path. Furthermore, the third switching module can be controlled to simultaneously disable both the first and third paths.

[0009] In one embodiment of the present invention, under an image detection program in which preset image data is provided to the image signal processor under test, the first switching module can be controlled to switch to the second path, so that the image signal receiver controls the image signal processor under test and receives an output signal from an output terminal of the image signal processor under test.

[0010] In one embodiment of the present invention, when the automated testing equipment performs electrical tests on the output terminal and multiple control terminals of the image signal processor under test, the first switching module can be controlled to switch to the first path.

[0011] To achieve the above and other objectives, the present invention also provides an image module detection system for detecting multiple devices under test (DUTs), each having an image signal processor under test. The detection system includes: a detection interface, a test substrate, automated testing equipment, and a relay array substrate assembly. The detection interface provides electrical connections for the DUTs. The automated testing equipment is coupled to the test substrate. The relay array substrate assembly includes multiple aforementioned relay board assemblies, each relay board assembly mounted on the detection interface and coupled to the test substrate. Each relay board assembly corresponds to one of the multiple DUTs, and is controlled by the automated testing equipment to perform a connection-end electrical detection program and a high-speed image detection program on the image signal processor under test.

[0012] In this way, the relay board assembly used for testing the image module can switch between electrical testing (connection electrical testing program) and high-speed image testing (high-speed image inspection program), thereby enabling the provision of high-speed transmission signals through a standard image signal processor. This allows automated test equipment (ATE) that does not have the capability to provide high-speed image signals to also be used to perform high-speed image testing (high-speed image inspection program), thus reducing the cost of image signal processor testing. [Attached Image Description]

[0013] Figure 1 This is a schematic diagram of an image module detection system according to an embodiment of the present invention;

[0014] Figure 2 This is a schematic diagram of a relay board assembly for detecting an image module according to an embodiment of the present invention;

[0015] Figure 3 This is a schematic diagram of a relay board assembly according to an embodiment of the present invention in a high-speed image detection program.

Detailed Implementation Methods

[0016] To fully understand the purpose, features, and effects of the present invention, the present invention will now be described in detail with reference to the following specific embodiments and accompanying drawings:

[0017] In this application, the terms "a" or "an" are used to describe units, components, structures, devices, modules, systems, parts, or regions, etc. This is used merely for ease of explanation and to provide a general meaning for the scope of the invention. Therefore, unless it is obvious otherwise, this description should be understood to include one or at least one, and the singular also includes the plural.

[0018] In this application, the terms "comprising," "including," "having," or any other similar terms used are not limited to the elements listed in this application, but may include other elements that are not expressly listed but are generally inherent in the unit, component, structure, device, module, system, part, or region.

[0019] In this application, the ordinal terms such as "first" or "second" are used to distinguish or refer to elements, structures, parts, or regions that are related to the same or similar entities, and do not necessarily imply a spatial order of these elements, structures, parts, or regions. It should be understood that in certain situations or configurations, ordinal terms may be used interchangeably without affecting the implementation of the invention.

[0020] Please refer to Figure 1 This is a schematic diagram of an image module detection system according to an embodiment of the present invention. The detection system includes a detection interface 110, a relay array carrier assembly 120, a test carrier board 130, and an automated test equipment (ATE) 140. The detection system provides detection data to the host computer 300 for subsequent calculation and analysis.

[0021] The probe interface 110 may be a probe interface board (PIB) or a socket, but is not limited thereto, for forming an electrical connection with the image module, which is the object under test 210. In addition, a relay array carrier assembly 120 is mounted on the probe interface 110, and the relay array carrier assembly 120 includes multiple boards that can be installed therein, for example, by means of plug-in cards.

[0022] The host 300 may include a host computer 310 and an image processing computer (IPC) 320. During the execution of the image module's testing program, the host computer 310 causes the automated test equipment (ATE) 140 to perform testing steps. The automated test equipment (ATE) 140 provides test signals through the test carrier board 130 to perform various testing items. The test carrier board 130 is mainly used as a medium between the relay array carrier board assembly 120, the device under test 210, and the automated test equipment (ATE) 140, and is responsible for the transmission of power and signals.

[0023] In the image module detection system disclosed in this embodiment of the invention, the device under test 210 can be an image module having an image sensor (CIS) and an image signal processor (ISP), or it can be an image module having an image signal processor (ISP) but not an image sensor (CIS), or it can be an image module having an image sensor (CIS) but not an image signal processor (ISP). To illustrate the detection of a high-speed image signal processor (ISP), in the following embodiments of the invention, an image module having both an image sensor (CIS) and an image signal processor (ISP) is used as an example.

[0024] The image module of the device under test (DUT) 210 includes an image sensor (CIS) 211 and an image signal processor (ISP) 212. In an embodiment of the invention, a detection path is established by switching the relay array carrier assembly 120 to allow the automated test equipment (ATE) 140 to test the CIS 211 and ISP 212 within each DUT 210. That is, each relay board assembly (first relay board assembly 121 or second relay board assembly 122) corresponds to one DUT 210. Figure 1 As shown, the first relay board assembly 121 is used to switch the detection path for one test object 210, and the second relay board assembly 122 is used to switch the detection path for another test object 210.

[0025] In addition to performing electrical testing procedures (e.g., detecting open circuits or short circuits) on the various connection terminals (pins) of the device under test (DUT) 210, the automated test equipment (ATE) 140 can also provide light through an additionally configured light source assembly (not shown) to test the sensing capability of the DUT 210 equipped with the image sensor 211. For tests related to image data (image detection procedures), each test transmits the image data acquired by the relay array carrier assembly 120 to the image processing computer (IPC) 320 for data processing and analysis, and transmits the results to the main computer 310 to complete the test item. In one embodiment where the device under test 210 has an image sensor (CIS) but no image signal processor (ISP), the automated test equipment (ATE) 140 can test the sensing capability of the device under test 210 through the aforementioned light source assembly; on the other hand, in another embodiment where the device under test 210 has an image signal processor (ISP) but no image sensor (CIS), there is no need to configure an additional light source assembly.

[0026] Next, please refer to the following: Figure 1 , Figure 2 and Figure 3 , Figure 2 This is a schematic diagram of a relay board assembly for detecting an image module according to an embodiment of the present invention. Figure 3 This is a schematic diagram of a relay board assembly according to an embodiment of the present invention under a high-speed image detection program. Each relay board assembly in the relay array carrier assembly 120 may include: an image acquisition card and an image test signal generation card. For ease of explanation, Figure 2 The coupling relationship between the first relay board assembly 121 and the probe interface 110, the automated test equipment (ATE) 140, the image processing computer (IPC) 320, and the image signal processor under test (ISP) 212 is illustrated. The automated test equipment (ATE) 140 can provide power to the power input terminal V of the image signal processor under test (ISP) 212 to drive the image signal processor under test (ISP) 212.

[0027] The image acquisition card 1211 within the first relay board assembly 121 includes an image signal receiver 12112 and a first switching module 12114.

[0028] The first switching module 12114 is coupled between three components: the automated test equipment (ATE) 140, the image signal receiver 12112, and the detection interface 110. The first switching module 12114 determines the connection relationship between these three components. Controlled by the automated test equipment (ATE) 140, the first switching module 12114 is operated to switch paths according to control commands, changing the transmission path to either a first path L1 or a second path L2. That is, since the first switching module 12114 is connected to the detection interface 110, it can determine whether the detection interface 110 is connected to the image signal receiver 12112 or to the automated test equipment (ATE) 140.

[0029] Please note that the first path L1 refers to the path through which the first switching module 12114 establishes a connection between the first switching module 12114 and the automated test equipment (ATE) 140 via switching within the first switching module 12114, allowing signal transmission between the automated test equipment (ATE) 140 and the probe interface 110. The second path L2 (please refer to...) Figure 3 This refers to the switching within the first switching module 12114, which establishes a connected path with the image signal receiver 12112, allowing signal transmission between the image signal receiver 12112 and the detection interface 110.

[0030] In addition, such as Figure 2 and 3As shown, when the first switching module 12114 is switched to the first path L1, the automated test equipment (ATE) 140 can connect to pin S of the image signal processor (ISP) 212 under test via the probe interface 110 to perform a connection electrical test procedure. For ease of explanation, pin S is... Figure 2 and 3 This is just a general example; in a real implementation, control point S may include SDA, SCL, MCLK, and RESETn. The SDA (serial data) pin is used to transmit the I2C (Inter-Integrated Circuit) data path signal. The SCL (serial clock) pin is used to transmit the I2C clock signal. The MCLK (Master Clock) pin is used to transmit the master clock signal. The RESETn pin is used to transmit the reset signal.

[0031] The image test signal generation card 1212 within the first relay board assembly 121 includes a standard image signal processor 12122, a second switching module 12124, and a third switching module 12126. The standard image signal processor 12122 can be mounted on the image test signal generation card 1212 via a slot or socket configured on the image test signal generation card 1212, or it can be mounted on the image test signal generation card 1212 by soldering or other means.

[0032] The standard image signal processor 12122 is defined as a standard of the test object, that is, the standard image signal processor 12122 is the test object being detected. Since the image signal processor itself has pre-set standard image data (e.g., test image data required for the image signal processor during manufacturing), in embodiments of the present invention, an automated testing equipment (ATE) 140 is connected to the standard image signal processor 12122, thereby enabling the standard image signal processor 12122 to output preset image data.

[0033] In this way, since the signal output by the standard image signal processor 12122 is a high-speed signal, such as a high-speed MIPI signal, the image test signal generation card 1212 equipped with the standard image signal processor 12122 can be used as a MIPI signal generation card. This configuration allows the automated test equipment (ATE) 140, which does not have the ability to generate high-speed signals, to achieve the ability to output high-speed signals, thereby completing the test of the object under test (image signal processor).

[0034] The second switching module 12124 is coupled between three components: the automated test equipment (ATE) 140, the standard image signal processor 12122, and the probe interface 110. The second switching module 12124 determines the connection relationship between these three components. Controlled by the automated test equipment (ATE) 140, the second switching module 12124 is operated to switch paths according to control commands, changing the transmission path to either the first path L1 or the third path L3. That is, since the second switching module 12124 is connected to the probe interface 110, it can determine whether the probe interface 110 is connected to the standard image signal processor 12122 or to the automated test equipment (ATE) 140.

[0035] Please note that the first path L1 refers to the path through which the second switching module 12124 connects to the automated test equipment (ATE) 140 via switching within the second switching module 12124. This allows signal transmission between the ATE 140 and the detection interface 110, enabling the ATE 140 to perform electrical connection testing on the input terminal Rx (image signal input terminal) of the image signal processor under test (ISP) 212. On the other hand, when the second switching module 12124 switches to the third path L3, the switching within the second switching module 12124 connects to the standard image signal processor 12122. This allows the signal of the preset image data to be transmitted from the standard image signal processor 12122 to the input terminal Rx (image signal input terminal) of the image signal processor under test (ISP) 212 for high-speed image detection.

[0036] Furthermore, the third switching module 12126 of the image test signal generation card 1212 has different operations. For example... Figure 2 and Figure 3 As shown in region A, the third switching module 12126, coupled to the automated test equipment (ATE) 140 and the standard image signal processor 12122, forms a floating connection with the detection interface 110. That is, the third switching module 12126 is not connected to the detection interface 110. However, during the high-speed image inspection process, the switching within the third switching module 12126 simultaneously establishes a communication path between the third switching module 12126 and the automated test equipment (ATE) 140 and the standard image signal processor 12122.

[0037] like Figure 3As shown, the third switching module 12126 simultaneously activates the first path L1 and the third path L3, allowing control commands from the automated test equipment (ATE) 140 to be transmitted to the standard image signal processor 12122 via the first path L1 and the third path L3. This enables the standard image signal processor 12122 to be controlled by the automated test equipment (ATE) 140 to execute a high-speed image inspection program. Simultaneously, the high-speed preset image data signal provided by the standard image signal processor 12122 is transmitted from the second switching module 12124 to the input terminal Rx (image signal input terminal) of the image signal processor under test (ISP) 212.

[0038] Furthermore, when a high-speed image detection procedure is not required, or when a connection terminal electrical detection procedure is required, the third switching module 12126 can be controlled to simultaneously deactivate both the first path L1 and the third path L3. The switching within the first switching module 12114 and the second switching module 12124 can be a three-contact switching control. Figure 2 and Figure 3 The Chinese system example uses a four-point switching control.

[0039] Furthermore, for ease of explanation, the switching modules described in the above embodiments are described in a simplified manner. Each switching module has more switches, and each switch is coupled one-to-one to a corresponding electrical connection point. These electrical connection points include, for example: the various I / O control points of the automated test equipment (ATE) 140; the pins of the image signal receiver 12112 used to set the pins of the image signal processor under test (ISP) 212 (such as SDA, SCL, MCLK, RESETn); and the receiving point of the image signal receiver 12112 used to receive image data transmitted from the output terminal Tx of the image signal processor under test (ISP) 212 (such as using a MIPI high-speed transmission interface). The differential signal receiving points MDP0-3 / MCP and MDN0-3 / MCN on the surface, and the standard image signal processor 12122 are used to control the pins (such as SDA, SCL, MCLK, RESETn) of the automated test equipment (ATE) 140, and the standard image signal processor 12122 is used to transmit preset image data and is coupled to the corresponding connection points (such as the differential signal receiving points MDP0-3 / MCP and MDN0-3 / MCN using the MIPI high-speed transmission interface) of the image signal processor under test (ISP) 212.

[0040] In one implementation, electrical tests (static electrical characteristics and dynamic readings) can be performed first using the automated test equipment (ATE) 140, and then the process can be switched to image testing. The ATE 140 supplies power to the image signal processor (ISP) under test via its power input terminal V. Next, the host computer 310 issues instructions to the image processing computer (IPC) 320 to control the image acquisition card 1211. Then, the image acquisition card 1211 sets the state of the ISP under test via an I2C interface according to the instructions from the IPC 320. Next, the ATE 140 sets the standard image signal processor 12122 on the image test signal generation card 1212 via a third switching module 12126, which is simultaneously connected to the first path L1 and the third path L3, to generate a high-speed MIPI signal. Simultaneously, this high-speed MIPI signal is output through a second switching module 12124, which is switched to the third path L3. Subsequently, the image signal receiver 12112 of the image acquisition card 1211 receives the output signal from the output terminal Tx of the image signal processor under test (ISP) through the first switching module 12114 which is switched to the second path, and provides this output signal to the image processing computer (IPC) 320 for data processing and analysis and transmits the results to the host computer 310.

[0041] In summary, the relay board assembly for testing image modules disclosed in this embodiment of the invention can switch between ATE electrical testing (connection terminal electrical testing program) and high-speed image testing (high-speed image detection program), providing an additional connection path. This enables the test system to configure additional signal generators, and based on the requirements of the test conditions, a corresponding standard image signal processor can be configured to provide the necessary test signals. This also reduces the requirements for automated test equipment (ATE) and effectively reduces the testing cost of image signal processors.

[0042] Preferred embodiments have been disclosed above. However, those skilled in the art should understand that these embodiments are merely illustrative and should not be construed as limiting the scope of the invention. It should be noted that all equivalent variations and substitutions to the embodiments are to be understood as falling within the scope of this invention. Therefore, the scope of protection of this invention is determined by the scope of the claims.

[0043] [Attached image labels]

[0044] 110 Detection Interface

[0045] 120 Relay Array Carrier Assembly

[0046] 121 First Relay Board Assembly

[0047] 1211 Image Acquisition Card

[0048] 12112 Image Signal Receiver

[0049] 12114 First Switching Module

[0050] 1212 Image Test Signal Generation Card

[0051] 12122 Standard Image Signal Processor

[0052] 12124 Second Switching Module

[0053] 12126 Third Switching Module

[0054] 122 Second Relay Board Assembly

[0055] 130 Test Carrier

[0056] 140 Automated Test Equipment (ATE)

[0057] 210 Test Item

[0058] 211 Image Sensor Under Test (CIS)

[0059] 212 Image Signal Processor (ISP) Under Test

[0060] 300 host

[0061] 310 Main Computer

[0062] 320 Image Processing Computer (IPC)

[0063] Area A

[0064] L1 First Path

[0065] L2 Second Path

[0066] L3 Third Path

[0067] Tx output terminal

[0068] Rx input terminal

[0069] S pin

[0070] V power input terminal

Claims

1. A relay board assembly for detecting an image module, mounted on a detection interface and controlled by an automated testing device, for providing a preset image data at high speed built into a standard image signal processor to a test image signal processor within an object under test for execution of a high-speed image detection program, the relay board assembly comprising: An image acquisition card includes an image signal receiver and a first switching module. The first switching module is coupled between the automated testing equipment, the image signal receiver, and the detection interface. The first switching module is controlled by the automated testing equipment to selectively switch to a first path or a second path. An image test signal generation card is used to mount the standard image signal processor, including a second switching module and a third switching module coupled between the automated test equipment, the detection interface, and the standard image signal processor. The second switching module is controlled by the automated test equipment to selectively switch to a first path or a third path. in, The first path is used to connect each switching module to the automated testing equipment, the second path is used to connect the first switching module to the image signal receiver, the third path is used to connect the second switching module to the standard image signal processor, the image test signal generation card provides the preset image data to an input terminal of the image signal processor under test through the third path, and the first switching module and the second switching module are coupled to the detection interface.

2. The relay board assembly for detecting an image module as described in claim 1, wherein, The third switching module is coupled between the automated testing equipment and the standard image signal processor and is floating with the detection interface. The third switching module is controlled by the automated testing equipment to switch to simultaneously conduct the first path and the third path, so that the automated testing equipment controls the standard image signal processor to output the preset image data.

3. The relay board assembly for detecting an image module as described in claim 1, wherein, When the automated testing equipment performs electrical tests on the input terminal of the image signal processor under test, the second switching module is controlled to switch to the first path.

4. The relay board assembly for detecting an image module as described in claim 3, wherein, The third switching module is controlled to simultaneously disable both the first path and the third path.

5. The relay board assembly for detecting an image module as described in any one of claims 1-4, wherein, When the preset image data is provided to the image signal processor under test in an image detection program, the first switching module is controlled to switch to the second path, so that the image signal receiver controls the image signal processor under test and receives an output signal from one of the output terminals of the image signal processor under test.

6. The relay board assembly for detecting an image module as described in claim 5, wherein, When the automated testing equipment performs electrical tests on the output terminal and multiple control terminals of the image signal processor under test, the first switching module is controlled to switch to the first path.

7. An image module detection system for detecting multiple objects to be tested, each having an image signal processor to be tested, the detection system comprising: A detection interface is provided for the electrical connection of the object under test; A test carrier board; An automated testing device coupled to the test carrier board; and A relay array carrier assembly includes a plurality of relay board assemblies for detecting image modules as described in any one of claims 1-6. Each relay board assembly is mounted on the detection interface and coupled to the test carrier. Each relay board assembly corresponds to one of the plurality of devices under test, and is controlled by the automated test equipment to perform a connection terminal electrical detection program and a high-speed image detection program on the image signal processor under test.

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