Incision equipment

Abstract

The present invention relates to a cutting device that can solve the problem of poor cutting quality by reducing the sensitivity of the cutting relative to laser alignment by minimizing the distance between the ablation laser and the cutting laser, and can reduce space and investment costs by performing two existing processes with only one device. The cutting device according to the present invention relates to a cutting device for cutting electrode sheets used in secondary batteries, the cutting device including an ablation laser source unit, the ablation laser source unit being configured to irradiate an ablation laser that performs an ablation operation on the electrode sheet; a cutting laser source unit, the cutting laser source unit being configured to irradiate a cutting laser, wherein the cutting laser is emitted to a place where the ablation laser has performed an ablation operation to cut the electrode sheet; and an integrated scanner unit, the ablation laser irradiated from the ablation laser source unit and the cutting laser irradiated from the cutting laser source unit being incident on the integrated scanner unit. The integrated scanner unit causes the ablation laser and the cutting laser to be emitted to positions adjacent to each other on the electrode sheet.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority from Korean Patent Application No. 10-2020-0183967, filed on December 24, 2020, and Korean Patent Application No. 10-2021-0169526, filed on November 30, 2021, which are hereby incorporated by reference in their entirety. Technical Field

[0003] The present invention relates to a cutting device that can solve the problem of poor cutting quality by minimizing the distance between the ablation laser and the cutting laser to reduce the sensitivity of the cutting relative to the laser alignment, and can reduce space and investment costs by performing the existing two processes with only one device. Background Art

[0004] Secondary batteries are environmentally friendly energy sources that can reduce product size and cause less environmental pollution. Recently, demand for secondary batteries has been increasing due to these advantages. In terms of shape, secondary batteries can be divided into prismatic and pouch types. In terms of materials, secondary batteries can be divided into lithium secondary batteries, such as lithium-ion batteries and lithium-ion polymer batteries, which have high energy density, high discharge voltage, and high output stability.

[0005] Typically, such secondary batteries are manufactured in the following manner: an electrode assembly is manufactured by applying electrode active materials to the surface of a current collector to form a positive electrode plate and a negative electrode plate, and inserting a separator between them; the electrode assembly is mounted inside a cylindrical or prismatic metal can or a bag-type case made of an aluminum laminate; a liquid electrolyte is mainly injected into the electrode assembly, or the electrode assembly is impregnated with a liquid electrolyte, or a solid electrolyte is used.

[0006] The electrode body is processed to have an exposed portion that serves as an electrode terminal for connecting the positive electrode and the negative electrode to the outside when forming an electrode assembly (positive electrode, negative electrode, and separator). This processing is achieved by using a cutting device.

[0007] A cutting machine is used to form a terminal portion by cutting the exposed portion of an electrode sheet and the portion of the coating to which the electrode active material is applied. To this end, the cutting machine forms the terminal portion by cutting the exposed portion using a stamping press or laser. Recently, laser cutting has become more widely used than stamping equipment for cutting electrode sheets. Laser cutting equipment is increasing in use due to its ability to achieve efficient production while minimizing damage to the electrode.

[0008] Figure 1 (a) is a perspective view illustrating a laser cutting apparatus according to the related art. Figure 1(b) is a cross-sectional view illustrating a cross section of an electrode sheet cut by a laser cutting apparatus according to the related art.

[0009] Reference Figure 1 (a), while the electrode sheet is traveling in the moving direction, ablation laser A irradiated from the ablation laser light source unit 10 is first emitted to the electrode sheet S. Then, slitting laser N irradiated from the slitting laser light source unit 30 is secondarily emitted to the region of the electrode sheet S from which the ablation laser has been emitted. In this case, the ablation laser unit 1 and the slitting laser unit 3 operate in separate states and at separate positions.

[0010] Reference Figure 1 (b) of the present invention, a cutting laser N may be emitted to the region where the ablation laser A has been emitted to perform an ablation operation. Figure 1 As shown in (b), the ablation operation may be intended to reduce the thickness of a portion of the electrode sheet S by removing a relevant portion of the electrode active material coating portion S2 applied to the current collector S1. Furthermore, subsequently, when the notch laser N is emitted, the electrode sheet S may be notched. Notching the electrode sheet may indicate that the electrode sheet S is completely cut at the relevant portion as designed.

[0011] In laser cutting processes, the aforementioned laser cutting technology using ablation reduces thickness through laser ablation prior to cutting, thereby improving cutting process productivity. However, the laser ablation and laser cutting processes are separate, requiring alignment of the two laser beams. Misalignment prevents proper cutting. Therefore, there is a need for cutting equipment and methods that can reduce the distance between the ablation and cutting processes and are less sensitive to alignment. Summary of the Invention

[0012] Technical issues

[0013] The present invention is made to solve the above problems. The purpose of the present invention is to provide a cutting device that can solve the problem of poor incision quality by minimizing the distance between the ablation laser and the incision laser to reduce the sensitivity of the incision relative to the laser alignment, and can reduce space and investment costs by performing the existing two processes with only one device.

[0014] Technical Solution

[0015] The cutting device according to the present invention relates to a cutting device for cutting an electrode sheet used in a secondary battery, the cutting device comprising: an ablation laser light source unit, the ablation laser light source unit being configured to irradiate an ablation laser for performing an ablation operation on the electrode sheet; a cutting laser light source unit, the cutting laser light source unit being configured to irradiate a cutting laser, wherein the cutting laser light is emitted to a place where an ablation operation has been performed by the ablation laser to cut the electrode sheet; and an integrated scanner unit, the ablation laser irradiated from the ablation laser light source unit and the cutting laser irradiated from the cutting laser light source unit are incident on the integrated scanner unit, wherein the integrated scanner unit causes the ablation laser and the cutting laser to be emitted to positions adjacent to each other on the electrode sheet.

[0016] The incision apparatus may further include a reflector unit transmitting or reflecting laser light therethrough, wherein the ablation laser light and the incision laser light are respectively from the ablation laser light source unit and the incision laser light source unit and enter the integrated scanner unit via the reflector unit.

[0017] The ablation laser can be emitted in a direction parallel to the moving direction of the electrode sheet and then incident on the integrated scanner unit via the reflector unit, and the cutting laser can be emitted in a direction perpendicular to the moving direction of the electrode sheet and then incident on the integrated scanner unit via the reflector unit.

[0018] The transmittance or reflectance of the laser light in the reflector unit may be adjusted according to the wavelength of the incident laser light.

[0019] The wavelength of the ablation laser may be 512 nm to 532 nm, and the wavelength of the incision laser may be 1060 nm to 1080 nm.

[0020] The wavelength of the incision laser may be 512 nm to 532 nm, and the wavelength of the ablation laser may be 1060 nm to 1080 nm.

[0021] The reflector unit may reflect the ablation laser therefrom and transmit the incision laser therethrough.

[0022] At least one of a beam size adjustment unit for adjusting the laser beam size and a separate scanner unit for transmitting the laser beam to a desired place may be provided on the path along which the ablation laser travels between the ablation laser source unit and the reflector unit, and the ablation laser is transmitted to the reflector unit after passing through at least one of the beam size adjustment unit and the separate scanner unit.

[0023] At least one of a beam size adjustment unit for adjusting the laser beam size and a separation scanner unit for transmitting the laser beam to a desired place may be provided on the path along which the incision laser travels between the incision laser source unit and the reflector unit, and the incision laser is transmitted to the reflector unit after passing through at least one of the beam size adjustment unit and the separation scanner unit.

[0024] The ablation laser source unit, the incision laser source unit, the reflector unit, and the integrated scanner unit may be integrated and mounted in one structure.

[0025] The ablation laser can be emitted in a direction perpendicular to the moving direction of the electrode sheet and then incident on the integrated scanner unit via the reflector unit, and the cutting laser can be emitted in a direction parallel to the moving direction of the electrode sheet and then incident on the integrated scanner unit via the reflector unit.

[0026] Beneficial effects

[0027] The cutting device according to the present invention relates to a cutting device for cutting an electrode sheet used in a secondary battery, the cutting device comprising: an ablation laser source unit, the ablation laser source unit being used to irradiate an ablation laser for performing an ablation operation on the electrode sheet; a cutting laser source unit, the cutting laser source unit being used to irradiate a cutting laser, wherein the cutting laser is emitted to a place where the ablation laser has performed an ablation operation to cut the electrode sheet; and an integrated scanner unit, the ablation laser irradiated from the ablation laser source unit and the cutting laser irradiated from the cutting laser source unit are incident on the integrated scanner unit. The integrated scanner unit causes the ablation laser and the cutting laser to be emitted to positions adjacent to each other on the electrode sheet. Therefore, the problem of poor cutting quality can be solved by minimizing the distance between the ablation laser and the cutting laser to reduce the sensitivity of the cutting relative to the laser alignment, and the space and investment costs can be reduced by performing the existing two processes with only one device. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 (a) is a perspective view illustrating a laser cutting apparatus according to the related art.

[0029] Figure 1 (b) is a cross-sectional view illustrating a cross section of an electrode sheet cut by a laser cutting apparatus according to the related art.

[0030] Figure 2 is a perspective view illustrating an incision device according to Embodiment 1 of the present invention.

[0031] Figure 3 is a perspective view illustrating an incision device according to Embodiment 2 of the present invention. DETAILED DESCRIPTION

[0032] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings so that they can be easily implemented by those skilled in the art. However, the present invention can be implemented in various forms and is not limited or restricted by the following embodiments.

[0033] In order to clearly describe the present invention, parts not related to the description are omitted, and descriptions related to well-known functions or configurations are excluded to avoid unnecessary confusion of the subject matter of the present invention. In this application, when reference numerals are given to components in each figure, the same or similar components will be represented by the same or similar reference numerals throughout the application.

[0034] Furthermore, the terms or words used in this specification and the claims should not be restrictively interpreted as ordinary meanings or dictionary-based meanings, but should be interpreted as meanings and concepts that are consistent with the technical ideas of the present invention based on the principle that the inventor can appropriately define the concepts of the terms to describe his or her invention in the best manner.

[0035] Implementation Method 1

[0036] Figure 2 is a perspective view illustrating an incision device according to Embodiment 1 of the present invention.

[0037] Reference Figure 2 The incision device 100 according to the present invention may be a device for incision of an electrode sheet S used in a secondary battery. However, the present invention is not limited to the electrode sheet S. Objects that can be processed by incision, such as electrode bodies and electrode films, may also be included in the scope of the present invention.

[0038] The incision apparatus 100 according to Embodiment 1 of the present invention may include an ablation laser source unit 110 , an incision laser source unit 130 , and an integrated scanner unit 170 .

[0039] The ablation laser source unit 110 may be configured to irradiate an ablation laser A for performing an ablation operation on the electrode sheet S. Figure 1 As shown in (b), an ablation operation may be intended to reduce the thickness of a portion of the electrode sheet S by removing a relevant portion of the active material coating portion.

[0040] The notch laser source unit 130 may be configured to irradiate a notch laser N, and the notch laser is emitted to a location where the ablation laser A has performed an ablation operation, so as to notch the electrode sheet S. When the notch laser N is emitted, the electrode sheet S may be notched. The notch of the electrode sheet S may indicate that the electrode sheet S is completely cut at the relevant portion as designed.

[0041] The integrated scanner unit 170 can be configured so that the ablation laser A irradiated from the ablation laser light source unit 110 and the slitting laser N irradiated from the slitting laser light source unit 130 are incident on the integrated scanner unit 170. The scanner unit can be configured to transmit the laser beam to a desired location. In particular, the integrated scanner unit 170 can cause the ablation laser A and the slitting laser N to be emitted to positions adjacent to each other on the electrode sheet S. That is, the ablation laser A and the slitting laser N can be emitted to positions adjacent to each other on the electrode sheet S after passing through the integrated scanner unit 170. Here, emitting to positions adjacent to each other can mean that a state in which poor incision quality is not caused by misalignment between the ablation laser A and the slitting laser N occurs. That is, positions adjacent to each other can mean positions that are close enough to ensure that the incision is performed without problems. For example, the distance between the emission position of the ablation laser A and the emission position of the slitting laser N can be 0.1 mm to 50 mm.

[0042] The incision apparatus 100 having the above-described configuration according to Embodiment 1 of the present invention can solve the problem of poor incision quality by reducing the sensitivity of the incision with respect to laser alignment by minimizing the distance between the ablation laser A and the incision laser N.

[0043] The incision device 100 according to embodiment 1 of the present invention may further include a reflector unit 150 for transmitting or reflecting laser light therethrough. The ablation laser A and the incision laser N may be respectively emitted from the ablation laser source unit 110 and the incision laser source unit 130 and enter the integrated scanner unit 170 via the reflector unit 150.

[0044] Reference Figure 2 , the ablation laser A is emitted in a direction parallel to the traveling direction F of the electrode sheet S, and then can be incident on the integrated scanner unit 170 via the reflector unit 150. The ablation laser A is emitted from the reference Figure 2 The upper side of the travels to the lower side and is reflected from the reflector unit 150, and then can be turned to refer to Figure 2 , and proceeds toward the electrode sheet S. In addition, the ablation laser may pass through the integrated scanner unit 170 before reaching the electrode sheet S.

[0045] The ablation laser A can be Figure 2 The ablation laser A passes through the beam size adjustment unit 111 and the separation scanner unit 112, which will be described below, while traveling from the upper side to the lower side. The ablation laser A that has passed through the beam size adjustment unit 111 and the separation scanner unit 112 is reflected by the reflector unit 150 positioned 45 degrees relative to the traveling direction, so that its traveling direction is bent 90 degrees and then points in the direction toward the electrode sheet S.

[0046] The slit laser N is emitted in a direction perpendicular to the traveling direction F of the electrode sheet S and may then be incident on the integrated scanner unit 170 via the reflector unit 150. Here, the slit laser N may pass through the beam size adjustment unit 131 to be described later when it is incident on the reflector unit 150 after exiting the slit laser source unit 130.

[0047] Cut laser N from reference Figure 2 The slit laser N is emitted from the left side toward the right side, moves and directly passes through the reflector unit 150, and then may be incident on the integrated scanner unit 170 and reach the electrode sheet S. The traveling direction of the slit laser N when irradiated from the slit laser light source unit 130 may not be bent at the reflector unit 150. That is, the slit laser N may pass through the reflector unit 150 while maintaining the traveling direction before and after passing through the reflector unit 150.

[0048] The transmittance or reflectance of the laser light in the reflector unit 150 can be adjusted according to the wavelength of the incident laser light. Therefore, the reflector unit 150 can be configured to reflect the ablation laser light A therefrom and transmit the cutting laser light N therefrom, or to transmit the ablation laser light A therefrom and reflect the cutting laser light N therefrom.

[0049] In the incision apparatus 100 according to Embodiment 1 of the present invention, the reflector unit 150 may cause the ablation laser A to be reflected therefrom and the incision laser N to be transmitted therethrough according to the wavelength.

[0050] For example, the wavelength of the ablation laser A can be 512nm to 532nm, and the wavelength of the slitting laser N can be 1060nm to 1080nm. Furthermore, the reflector unit 150 can be configured to have high transmittance and low reflectance when the wavelength is large. In this case, when the wavelength is small, the transmittance is low and the reflectance is high. Therefore, the ablation laser A having a wavelength of 512nm to 532nm can be reflected by the reflector unit 150, while the slitting laser N having a wavelength of 1060nm to 1080nm can be transmitted through the reflector unit 150.

[0051] The wavelengths of the ablation laser A and the incision laser N can be defined as regions distinguished from each other.

[0052] In the incision apparatus 100 according to the present invention, at least one of a beam size adjustment unit 111 for adjusting the laser beam size and a separation scanner unit 112 for transmitting the laser beam to a desired location may be provided on a path along which the ablation laser A travels between the ablation laser source unit 110 and the reflector unit 150. Therefore, the ablation laser A may be transmitted to the reflector unit 150 after passing through at least one of the beam size adjustment unit 111 and the separation scanner unit 112.

[0053] Reference Figure 2 In particular, the incision apparatus 100 according to Embodiment 1 of the present invention may include a beam size adjustment unit 111 and a scanner unit 112 between the ablation laser source unit 110 and the reflector unit 150. The ablation laser A may pass through the beam size adjustment unit 111 and the separation scanner unit 112 before entering the reflector unit 150.

[0054] The beam size adjustment unit 111 can adjust the size of the laser beam and, by adjusting the laser beam size as needed, can be used to perform the desired ablation. The size or depth of the ablation can be adjusted as necessary. The separate scanner unit 112 can be used to transmit the laser light to the desired location. The transmittance of the ablation laser A can be adjusted so that the ablation laser A reaches the exact position of the reflector unit 150.

[0055] At least one of a beam size adjustment unit for adjusting the laser beam size and a separation scanner unit for transmitting the laser beam to a desired position may also be provided on a path along which the slit laser N travels between the slit laser source unit 130 and the reflector unit 150. In this case, the slit laser N may be transmitted to the reflector after passing through at least one of the beam size adjustment unit and the separation scanner unit.

[0056] Reference Figure 2 Specifically, the slitting apparatus 100 according to Embodiment 1 of the present invention may include a beam size adjustment unit 131 between the slitting laser source unit 130 and the reflector unit 150. The slitting laser A may pass through the beam size adjustment unit 131 before entering the reflector unit 150. The degree, intensity, or speed of slitting may be adjusted by adjusting the beam size of the slitting laser N.

[0057] like Figure 2 As shown in FIG, after being emitted from the slit laser light source unit 130, the direction of the slit laser N is not bent before reaching the electrode sheet S, and this case can be configured so that the slit laser does not pass through the separate scanner unit 112. However, this is only an example, and the separate scanner unit 112 can be added as needed so that the slit laser N passes through the separate scanner unit 112 located between the beam size adjustment unit 131 and the reflector unit 150.

[0058] Furthermore, in the slitting apparatus 100 according to Embodiment 1 of the present invention, the ablation laser source unit 110, the slitting laser source unit 130, the reflector unit 150, and the integrated scanner unit 170 can be integrated and installed in a single structure. Furthermore, the ablation laser source unit 110, the slitting laser source unit 130, the beam size adjustment units 111 and 131, the separation scanner unit 112, the reflector unit 150, and the integrated scanner unit 170 can all be integrated and installed in a single structure. When integrated and installed in a single structure in this manner, unlike the related art in which slitting is performed in two steps, the slitting apparatus 100 can be obtained using a single device. Consequently, space and investment costs can be reduced.

[0059] Implementation Method 2

[0060] Figure 3 is a perspective view illustrating an incision device according to Embodiment 2 of the present invention.

[0061] Embodiment 2 of the present invention differs from Embodiment 1 in that the laser light reflected from the reflector unit 250 and having a bent traveling direction is the notch laser light N, and the laser light transmitted through the reflector unit 250 and maintaining the traveling direction is the ablation laser light A.

[0062] The description of Embodiment 2 will focus on the differences, and will omit as much as possible the features common to Embodiment 1. That is, features not described in Embodiment 2 can of course also be considered as features of Embodiment 1 as needed.

[0063] Reference Figure 3 , the incision apparatus 200 according to embodiment 2 of the present invention may include an ablation laser source unit 210 , an incision laser source unit 230 , a reflector unit 250 , and an integrated scanner unit 270 .

[0064] The ablation laser light source unit 210 can be configured to irradiate an ablation laser A that performs an ablation operation on the electrode sheet S. The incision laser light source unit 230 can be configured to irradiate an incision laser N, and the incision laser is emitted to a place where the ablation laser A has performed an ablation operation to incise the electrode sheet S. The reflector unit 250 can be configured to allow the laser to be transmitted therethrough or reflected therefrom according to the wavelength. The integrated scanner unit 270 can be configured so that the ablation laser A irradiated from the ablation laser light source unit 210 and the incision laser N irradiated from the incision laser light source unit 230 are incident on the integrated scanner unit 270. The integrated scanner unit 270 can cause the ablation laser A and the incision laser N to be emitted to positions adjacent to each other on the electrode sheet S. Here, emitting to positions adjacent to each other can mean that a state in which poor incision quality is not caused by misalignment between the ablation laser A and the incision laser N occurs. That is, positions adjacent to each other can mean positions that are close enough to ensure that incision is performed without problems. For example, the distance between the emission position of the ablation laser A and the emission position of the incision laser N may be 0.1 mm to 50 mm.

[0065] like Figure 3 As shown in FIG, in the incision device 200 according to Embodiment 2 of the present invention, the ablation laser A can be configured to be emitted in a direction perpendicular to the traveling direction R of the electrode sheet S and then incident on the integrated scanner unit 270 via the reflector unit 250. In addition, the incision laser N can be emitted in a direction parallel to the traveling direction R of the electrode sheet S and then incident on the integrated scanner unit 270 via the reflector unit 250.

[0066] Reference Figure 3 The cutting laser N is emitted in a direction parallel to the traveling direction R of the electrode sheet S, and then can be incident on the integrated scanner unit 270 via the reflector unit 250. The cutting laser N is emitted from the reference Figure 3 The upper side of the travels to the lower side and is reflected from the reflector unit 250, and then can be turned to the reference Figure 3 , and proceeds toward the electrode sheet S. In addition, the incision laser may pass through the integrated scanner unit 270 before reaching the electrode sheet S.

[0067] In addition, the cut laser N can be Figure 3 The slit laser N passes through the beam size adjustment unit 231 and the separation scanner unit 232 while traveling from the upper side to the lower side. The slit laser N passing through the beam size adjustment unit 231 and the separation scanner unit 232 is reflected by the reflector unit 250 placed at 45 degrees relative to the traveling direction, so that its traveling direction is bent 90 degrees and then points in the direction toward the electrode sheet S.

[0068] The ablation laser A is emitted in a direction perpendicular to the traveling direction R of the electrode sheet S and then may be incident on the integrated scanner unit 270 via the reflector unit 250. Here, the ablation laser A may pass through the beam size adjustment unit 211 after exiting the ablation laser source unit 210 and before being incident on the reflector unit 250.

[0069] Ablation laser A from reference Figure 3 The ablation laser light A is emitted from the left side toward the right side, moves and directly passes through the reflector unit 250, and then may be incident on the integrated scanner unit 270 and reach the electrode sheet S. The traveling direction of the ablation laser light A when irradiated from the ablation laser light source unit 210 may not be bent at the reflector unit 250. That is, the ablation laser light A may pass through the reflector unit 250 while maintaining the traveling direction before and after passing through the reflector unit 250.

[0070] In the incision apparatus 200 according to Embodiment 2 of the present invention, the reflector unit 250 may cause the incision laser N to be reflected therefrom and the ablation laser A to be transmitted therethrough according to the wavelength.

[0071] For example, the wavelength of the slitting laser N can be 512nm to 532nm, and the wavelength of the ablation laser A can be 1060nm to 1080nm. Furthermore, the reflector unit 250 can be configured to have high transmittance and low reflectance when the wavelength is large. In this case, when the wavelength is small, the transmittance is low and the reflectance is high. Therefore, the slitting laser N with a wavelength of 512nm to 532nm can be reflected by the reflector unit 250, while the ablation laser A with a wavelength of 1060nm to 1080nm can be transmitted through the reflector unit 250.

[0072] Since the wavelengths of the slitting laser N and the ablation laser A are defined as distinct regions, the two laser beams can be incident from the reflector unit 250 to the integrated scanner unit 270. In addition, the integrated scanner unit 270 can emit the ablation laser A and the slitting laser N to positions adjacent to each other on the electrode sheet S.

[0073] By doing so, the cutting device 200 according to embodiment 2 of the present invention can solve the problem of poor cutting quality by reducing the sensitivity of the cutting relative to the laser alignment by minimizing the distance between the ablation laser A and the cutting laser N, and can reduce space and investment costs by using only one device to perform the existing two processes.

[0074] Although the present invention has been described with reference to specific embodiments and the accompanying drawings, the present invention is not limited thereto, and those skilled in the art may make various changes and modifications to the present invention within the technical scope of the present invention and the equivalent scope of the appended claims.

[0075] [Description of labels]

[0076] 1: Ablation laser unit

[0077] 3: Cutting laser unit

[0078] 10: Ablation laser source unit

[0079] 30: Incision laser source unit

[0080] 100, 200: incision equipment

[0081] 110, 210: Ablation laser source unit

[0082] 111, 211: Beam size adjustment unit

[0083] 112, 232: Separate scanner unit

[0084] 130, 230: Incision laser source unit

[0085] 131, 231: Beam size adjustment unit

[0086] 150, 250: Reflector unit

[0087] 170, 270: Integrated scanner unit

[0088] S: Electrode sheet

[0089] S1: Current collector

[0090] S2: Electrode active material coating part

[0091] A: Ablation laser

[0092] N: Incisional laser.

Claims

1. A cutting device for cutting an electrode sheet used in a secondary battery, the cutting device comprising: an ablation laser source unit configured to irradiate an ablation laser for performing an ablation operation on the electrode sheet; an incision laser source unit configured to irradiate an incision laser, wherein the incision laser is emitted to a location where the ablation laser has performed an ablation operation, so as to incise the electrode sheet; an integrated scanner unit to which the ablation laser irradiated from the ablation laser light source unit and the slitting laser irradiated from the slitting laser light source unit are incident; and a reflector unit that transmits or reflects laser light therethrough, wherein the integrated scanner unit causes the ablation laser and the incision laser to be emitted to positions adjacent to each other on the electrode sheet, wherein the ablation laser and the incision laser come from the ablation laser source unit and the incision laser source unit respectively, and enter the integrated scanner unit via the reflector unit, wherein the ablation laser is emitted in a direction parallel to the traveling direction of the electrode sheet and then incident on the integrated scanner unit via the reflector unit, and The slitting laser is emitted in a direction perpendicular to the traveling direction of the electrode sheet and then enters the integrated scanner unit via the reflector unit. 2 . The incision apparatus according to claim 1 , wherein transmittance or reflectance of the laser light in the reflector unit is adjusted according to a wavelength of the incident laser light. 3 . The incision apparatus according to claim 2 , wherein the wavelength of the ablation laser is 512 nm to 532 nm, and the wavelength of the incision laser is 1060 nm to 1080 nm. 4 . The incision apparatus according to claim 2 , wherein the wavelength of the incision laser is 512 nm to 532 nm, and the wavelength of the ablation laser is 1060 nm to 1080 nm. 5 . The incision apparatus according to claim 3 , wherein the reflector unit causes the ablation laser to be reflected therefrom and causes the incision laser to be transmitted therethrough.

6. The incision apparatus according to claim 1 , wherein at least one of a beam size adjustment unit for adjusting a laser beam size and a separate scanner unit for transmitting the laser beam to a desired place is provided on a path along which the ablation laser travels between the ablation laser source unit and the reflector unit, and The ablation laser is transmitted to the reflector unit after passing through at least one of the beam size adjustment unit and the separation scanner unit.

7. The incision apparatus according to claim 6 , wherein at least one of a beam size adjustment unit for adjusting a laser beam size and a separate scanner unit for transmitting the laser beam to a desired place is provided on a path along which the incision laser travels between the incision laser source unit and the reflector unit, and The slit laser is transmitted to the reflector unit after passing through at least one of the beam size adjustment unit and the separation scanner unit.

8. The incision apparatus according to claim 7, wherein the ablation laser light source unit, the incision laser light source unit, the reflector unit, and the integrated scanner unit are integrated and mounted in one structure.

9. A cutting device for cutting an electrode sheet used in a secondary battery, the cutting device comprising: an ablation laser source unit configured to irradiate an ablation laser for performing an ablation operation on the electrode sheet; an incision laser source unit configured to irradiate an incision laser, wherein the incision laser is emitted to a location where the ablation laser has performed an ablation operation, so as to incise the electrode sheet; an integrated scanner unit to which the ablation laser irradiated from the ablation laser light source unit and the slitting laser irradiated from the slitting laser light source unit are incident; and a reflector unit that transmits or reflects laser light therethrough, wherein the integrated scanner unit causes the ablation laser and the incision laser to be emitted to positions adjacent to each other on the electrode sheet, wherein the ablation laser and the incision laser come from the ablation laser source unit and the incision laser source unit respectively, and enter the integrated scanner unit via the reflector unit, wherein the ablation laser is emitted in a direction perpendicular to the traveling direction of the electrode sheet and then incident on the integrated scanner unit via the reflector unit, and The slitting laser is emitted in a direction parallel to the traveling direction of the electrode sheet and then enters the integrated scanner unit via the reflector unit.

Images