Laminate, electronic component, and capacitor

Abstract

The present invention provides a multilayer body having good water vapor barrier property while exhibiting excellent adhesion between a base material layer and a clay layer. The multilayer body 30 includes a base material layer 33, an adhesive layer 32, and a clay layer 31. The base material layer 33 contains a crystalline resin. The adhesive layer 32 is disposed on one surface of the base material layer 33 while containing a resin different from the crystalline resin. The clay layer 31 is disposed on one surface of the base material layer 33 with the adhesive layer 32 interposed therebetween. The viscosity of the adhesive layer 32 exhibits a temperature of 130°C or lower.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to a laminate, an electronic component, and a capacitor, and particularly relates to a laminate including a clay layer, and an electronic component and a capacitor including the laminate. BACKGROUND

[0002] Patent Literature 1 describes a method of manufacturing a clay film. The method includes: a first step of preparing a first clay material including a plurality of layers and cations present between the plurality of layers, the plurality of layers including octahedral sheet layers mainly including an octahedral crystal structure including aluminum ions and / or magnesium ions and oxygen ions and / or hydroxyl ions; a second step of substituting at least some of the cations with lithium ions to obtain a second clay material; a third step of shaping the second clay material into a film shape to obtain a film material; and a fourth step of heat-treating the film material to move at least some of the lithium ions from positions between the plurality of layers into the octahedral sheet layers.

[0003] Patent Literature 2 describes a clay film composite. The clay film composite includes: a clay film composed only of clay or composed of clay and an additive, and a water vapor barrier layer provided on at least one surface of the clay film and having a water vapor permeability of 1.0 g / m 2 ·day or less, wherein the water vapor barrier layer and the clay film are fusion-bonded.

[0004] REFERENCE LIST

[0005] PATENT LITERATURE

[0006] Patent Literature 1: JP 4973856 B2

[0007] Patent Literature 2: JP 5563289 B2 SUMMARY

[0008] One object of the present disclosure is to provide a laminate that has good water vapor barrier properties and excellent adhesion between a substrate layer and a clay layer.

[0009] Further, one object of the present disclosure is to provide an electronic component and a capacitor including the laminate.

[0010] A laminate according to one aspect of the present disclosure includes a substrate layer, an adhesive layer, and a clay layer. The substrate layer contains a crystalline resin. The adhesive layer contains a resin different from the crystalline resin and is provided on one face of the substrate layer. The clay layer is provided on the adhesive layer on the one face of the substrate layer. The viscosity of the adhesive layer exhibits a temperature of less than or equal to 130°C.

[0011] An electronic component according to one aspect of the present disclosure includes: an electronic component element; and a barrier film covering at least a part of a peripheral portion of the electronic component element. The barrier film includes the laminate.

[0012] A capacitor according to one aspect of the present disclosure includes the electronic component, and the electronic component element of the electronic component includes a capacitor element. BRIEF DESCRIPTION OF DRAWINGS

[0013] Figure 1 A is a cross-sectional view of one embodiment of a laminate according to the present embodiment;

[0014] Figure 1 B is a schematic perspective view of one example of a mineral particle;

[0015] Figure 1 C is a schematic cross-sectional view of one example of a clay layer;

[0016] Figure 2 A to 2D are cross-sectional views of one embodiment of an electronic component according to the present embodiment;

[0017] Figure 3 A and 3B are cross-sectional views of other embodiments of an electronic component according to the present embodiment;

[0018] Figure 4 A is a view (perspective view) of one step in a manufacturing method of a wound-type capacitor element;

[0019] Figure 4 B is a perspective view of the wound-type capacitor element;

[0020] Figure 5 A is a view (perspective view) of one step in a manufacturing method of a stacked-type capacitor element;

[0021] Figure 5 B is a view (cross-sectional view) of one step in the manufacturing method of the stacked-type capacitor element;

[0022] Figure 5 C is Figure 5 B is a partial cross-sectional perspective view of the stacked-type capacitor element;

[0023] Figure 5 D is a perspective view of the stacked-type capacitor element; and

[0024] Figure 6 is a cross-sectional view of a measurement method of a viscosity manifestation temperature. DETAILED DESCRIPTION

[0025] (1) SUMMARY

[0026] First, the background of the inventors' completion of the laminate of this embodiment will be described.

[0027] Clay (typically montmorillonite) is left to dry statically, thereby forming a clay film containing layered mineral particles and exhibiting air-barrier properties. Therefore, clay films and clay film composites, each comprising a clay layer, as described in Patent Documents 1 and 2, have been proposed.

[0028] However, in Patent Document 1, the heat treatment at a temperature of approximately 350 to 500°C requires several hours, which significantly limits the use of the film as a substrate. For example, in some cases, polypropylene, with a melting point close to 160°C, cannot be used as a substrate. Furthermore, when water-based binders are used as additives, the performance may be impaired due to the swelling of the binder at high temperatures and high humidity.

[0029] Furthermore, in Patent Document 2, the water vapor barrier layer and the clay film, which serve as the substrate film, are fused together by hot-press bonding. However, such hot-press bonding must be performed at a temperature exceeding the melting point of the substrate film, thus the process in Patent Document 2 lacks simplicity. Additionally, to improve properties, a water vapor transmission rate of less than or equal to 1 g / mm is used. 2 The substrate film is made of a certain type of material, therefore, in some cases, cost-effective and widely applicable films cannot be used.

[0030] Therefore, the laminate of this embodiment includes a substrate layer containing a crystalline resin with good water vapor barrier properties to reduce water vapor reaching the clay layer. Thus, a laminate with good water vapor barrier properties is obtained. Furthermore, the laminate according to this embodiment includes an adhesive layer between the substrate layer and the clay layer; therefore, the low-temperature process allows the substrate layer and the clay layer to be bonded without the use of fusion bonding. This improves the adhesion between the substrate layer and the clay layer, thereby reducing the occurrence of anomalies such as crack formation in the clay layer.

[0031] (2) Detailed content

[0032] (2-1) Laminate

[0033] like Figure 1 As shown in Figure A, the laminate 30 according to this embodiment includes a substrate layer 33, an adhesive layer 32, and a clay layer 31. The substrate layer 33 contains a crystalline resin. The adhesive layer 32 contains a resin different from the crystalline resin contained in the substrate layer 33. Furthermore, the adhesive layer 32 is disposed on one side (surface) of the substrate layer 33. The clay layer 31 is disposed on the adhesive layer 32 located on one side of the substrate layer 33. The laminate 30 is, for example, in the form of a film, sheet, or plate.

[0034] <Substrate Layer>

[0035] The base material layer 33 includes a crystalline resin. Examples of the resin used as the base material layer 33 include polyethylene, polypropylene, polyethylene terephthalate, polyamide, a fluororesin, an acrylic resin, polyimide, polyethylene naphthalate, polymethylpentene, a cyclic olefin, a polyacrylate, polyether ether ketone, polyphenylene sulfide, syndiotactic polystyrene-based resin, and an epoxy resin. The base material layer 33 includes one or more kinds of the crystalline resins listed in the above examples. Among the plurality of kinds of the crystalline resins listed in the above examples, the base material layer 33 preferably includes polypropylene having a good water vapor barrier property. The water vapor barrier property refers to a property that water vapor is hardly permeable. For example, a film made of polypropylene has a water vapor permeability of about 4 to 5 g / (m 2 • d) a water vapor permeability of 4 to 5 g / (m

[0036] The base material layer 33 is, for example, a film, a sheet, a plate, or the like. The thickness of the base material layer 33 is set in consideration of electrical insulation, flexibility, and the like, and is, for example, preferably several tens of μm, and more preferably greater than or equal to 10 μm and less than or equal to 30 μm.

[0037] The base material layer 33 is preferably a biaxially oriented polypropylene film. Thus, the water vapor barrier property is improved compared to a base material layer 33 made of a general polypropylene film that is not biaxially oriented.

[0038] <Adhesive Layer>

[0039] The adhesive layer 32 is a layer for joining the base material layer 33 and the clay layer 31. The base material layer 33 and the clay layer 31 are joined to each other via the adhesive layer 32, and thus the adhesion is excellent. Here, the "adhesion is excellent" means that the clay layer 31 does not peel from the adhesive layer 32 and the base material layer 33 when evaluated by a method based on JIS K 5600-5-6 (cross-cut test).

[0040] The adhesive layer 32 includes a resin different from the crystalline resin included in the base material layer 33. For example, when the crystalline resin included in the base material layer 33 is crystalline polypropylene, the adhesive layer 32 includes a resin different from the crystalline polypropylene.

[0041] The viscosity manifestation temperature of the adhesive layer 32 is lower than or equal to 130°C. The viscosity manifestation temperature refers to a temperature at which the adhesive layer 32 manifests viscosity. That is, the adhesive layer 32 manifests viscosity due to heat fusion, and the temperature at which the adhesive layer 32 is heat fused when the viscosity is increased compared to before the heat fusion is the viscosity manifestation temperature. Specifically, as the viscosity manifestation temperature, a temperature at which the viscosity of the adhesive layer 32 is increased to 1000 mPa·s or more is preferable. Figure 6As shown, a pair of test samples each including the base material layer 33 and the adhesive layer 32 is sandwiched between a pair of hot plates H and heated at a predetermined temperature, thereby performing heat pressure bonding of the adhesive layer 32. At this time, the pressure bonding force can be 0.3 MPa, and the pressure bonding time can be 10 minutes. Then, the heating temperature of the hot plates H can be regarded as the viscosity expression temperature if a finite pull strength is measured when the pair of test samples bonded to each other are peeled from each other. Note that, as a method of peeling the pair of test samples from each other, a 180-degree peeling test based on JIS Z 0237:2009 can be employed. The viscosity expression temperature of the adhesive layer 32 is preferably lower than the heat fusion temperature of the base material layer 33. In this case, heating that causes the adhesive layer 32 to express viscosity hardly causes the base material layer 33 to melt. Note that, the lower limit of the viscosity expression temperature of the adhesive layer 32 is not particularly limited, but can be, for example, higher than or equal to 80°C. This is because, for example, forming the clay layer 31 by coating with a roll-to-roll process has the following problem: if the temperature of the adhesive layer 32 expresses viscosity during the process, workability is impaired.

[0042] In order to form the adhesive layer 32 having a viscosity expression temperature lower than or equal to 130°C, the adhesive layer 32 contains a resin different from the crystalline resin contained in the base material layer 33. As the resin different from the crystalline resin contained in the base material layer 33, a hot melt resin can be used. The hot melt resin is a resin that is melted by heating and reversibly hardened when the heating is removed. As the hot melt resin, a low-melting-point hot melt resin is preferable. Examples of the hot melt resin include: an ethylene-vinyl acetate (EVA) resin, an olefin resin, a rubber-based resin, a polyamide-based resin, a nylon-based resin, a polyurethane-based resin, and an acrylic-based resin.

[0043] When the base material layer 33 is made of crystalline polypropylene, the adhesive layer 32 is preferably made of an olefin resin having high affinity to crystalline polypropylene. As the olefin resin having high affinity to crystalline polypropylene, an amorphous resin is preferably contained in the adhesive layer 32. When the base material layer 33 is made of crystalline polypropylene, the adhesive layer 32 is preferably made of amorphous polypropylene having lower crystallinity than crystalline polypropylene. The amorphous polypropylene is, for example, polypropylene that does not include a polar group and is highly branched or polypropylene obtained by copolymerization of ethylene, butene, or the like. The density of the amorphous polypropylene is generally lower than or equal to 0.855 g / cm 3 .

[0044] In the case of a low-melting-point polypropylene having low crystallinity, its stability is low, and thus, a polar group (hydroxyl group and carbonyl group) can be generated on the surface of the adhesive layer 32 during the corona treatment. Therefore, wettability at the time of coating a treatment liquid containing clay to form the clay layer 31 is improved, thereby improving the adhesion between the clay layer 31 and the adhesive layer 32.

[0045] Further, the adhesive layer 32 preferably contains a resin containing a polar group. As the resin including a polar group, a modified polyolefin can be used. For example, the modified polyolefin can be a modified polyolefin containing modified polypropylene as a maximum content component. As the modified polyolefin, an acid-modified polyolefin can be used. The acid-modified polyolefin is a polyolefin modified by an acid and an acid anhydride thereof, and examples of the acid include maleic acid, maleic anhydride, fumaric acid, citraconic acid, citraconic anhydride, mesaconic acid, crotonic acid, itaconic acid, itaconic anhydride, aconitic acid, and aconitic anhydride. As the acid-modified polyolefin, a carboxylic anhydride-modified polyolefin can be used, and examples of the acid-modified polyolefin include a maleic anhydride-modified polyolefin, an acrylic acid-modified polyolefin, and an imine-modified polyolefin. In the case of the modified polyolefin, even if the crystallinity is high, the polar group exists due to the modification. Thus, wettability at the time of coating a treatment liquid containing clay to form the clay layer 31 is improved, thereby improving the adhesion between the clay layer 31 and the adhesive layer 32.

[0046] As explained above, the laminate 30 according to the present embodiment includes the adhesive layer 32 as explained above, and thus the adhesion of the clay layer 31 to the adhesive layer 32 and the substrate layer 33 is also high without heat-fusing the clay layer 31 and the substrate layer 33. In particular, heating the adhesive layer 32 at a temperature higher than or equal to the viscosity manifestation temperature at the time of forming the clay layer 31 further improves the adhesion between the clay layer 31 and the adhesive layer 32, which reduces the peeling of the clay layer 31 and damage thereon.

[0047] The thickness of the adhesive layer 32 is not particularly limited, but in view of properties such as the bonding strength, the adhesion, and the ease of formation, the thickness is preferably less than or equal to 5 μm, and more preferably less than or equal to 1 μm.

[0048] <Clay Layer>

[0049] The clay layer 31 contains clay, and is in a layer shape. In the present disclosure, the clay is an aggregate of a plurality of mineral particles 311. The clay can contain a small amount of water in the aggregate of the plurality of mineral particles 311. The mineral particles 311 include at least one mineral selected from the group consisting of mica, vermiculite, montmorillonite, iron montmorillonite, beidellite, saponite, hectorite, stevensite, and nontronite. Among them, it is preferable that the mineral particles 311 contain montmorillonite, which is a highly moisture-resistant clay material.

[0050] In the crystal structure of the montmorillonite, unit cells including tetrahedral structures and octahedral structures sandwiched between the tetrahedral structures are defined as unit layers, in which the octahedral structures include Al (aluminum atoms) at their centers, and the tetrahedral structures each include Si (silicon atoms) at their centers. Specifically, some of the trivalent Al are substituted with divalent Mg or Fe, and thus the unit layers are negatively charged. Therefore, to compensate for the charge, cation hydrates (such as Na + or Ca 2+ ) are present in the crystal structure. When the montmorillonite is dispersed in water, hydration of the cationic portion of the montmorillonite proceeds, and the montmorillonite can be separated into units of the unit layers. Therefore, the montmorillonite is dispersed in water, so that the montmorillonite is easily separated into the unit layers. Thus, in a state in which the montmorillonite is separated into the unit layers, the montmorillonite is easily contained in the clay layer 31, and it is easy to form the labyrinth structure including the mineral particles 311 in the clay layer 31.

[0051] In the montmorillonite, ion exchange of the interlayer exchangeable ions with other inorganic cations and other organic cations is possible. Thus, it is possible to impart affinity to organic solvents and to intercalate various compounds between the layers. Further, there are hydroxyl groups on the end faces of the montmorillonite crystals, and thus modification by various silanization reagents is possible. In an attempt to achieve high moisture resistance of the clay layer 31, it is desirable to hydrophobize the clay layer 31. For example, the exchangeable cations (for example, Na + ) have high affinity to water, and if the exchangeable cations are present between the layers, the exchangeable cations can be detrimental to the hydrophobization of the clay layer 31. Therefore, it is considered to replace the exchangeable cations with Li and protons. For example, when the montmorillonite is subjected to heat treatment, the ions move to the inside and the surface of the crystal, so that it is easy to hydrophobize the clay layer 31.

[0052] Figure 1 B shows a schematic perspective view of one mineral particle 311. In the present embodiment, the mineral particle 311 is a plate-like or flake-like particle. That is, the mineral particle 311 is a particle shaped so that the thickness a is smaller than the lateral width b. Here, the lateral width b is the dimension at the longest portion of the mineral particle 311 when the mineral particle 311 is viewed from the front (directly viewed in the thickness direction defined with respect to the mineral particle 311). When the mineral particle 311 is, for example, a disc, the diameter is the lateral width b. The thickness a is the dimension in the direction perpendicular to the lateral width b, and is the dimension between two opposite faces of the mineral particle 311.

[0053] In the present embodiment, the mineral particles 311 have a high aspect ratio. That is, the aspect ratio defined by the "lateral width b / thickness a" is high. The aspect ratio is obtained by measuring the thickness a and the lateral width b of the mineral particles 311. For example, the thickness a is measured using a transmission electron microscope (TEM), but the thickness of the single-layer mineral particles 311 is substantially uniform for each type, so it is not necessary to measure a large number of mineral particles 311. For example, in the case of montmorillonite, the thickness a is about 1 nm. For example, the lateral width b is measured using atomic force microscopy (AFM). A flat portion of the mineral particle 311 is observed, and the longest dimension is estimated as the lateral width b.

[0054] Figure 1 C shows a schematic cross-sectional view of the clay layer 31. The clay layer 31 contains the mineral particles 311 and the binder 312. That is, the clay layer 31 can include the mineral particles 311 and the binder 312, or can contain the mineral particles 311, the binder 312, and other additives. The binder 312 includes one or more materials selected from the group consisting of polyethylene, polypropylene, polyethylene sulfide, polyimide, polyamide, polyethylene terephthalate, epoxy resin, fluororesin, polyester resin, polyurethane resin, acrylic resin, phenoxy resin, polyformaldehyde, and polyvinyl alcohol. Furthermore, the binder 312 can be a binder resin that can be used as a coating or a slurry varnish. Among them, polyamide, polyimide, polyurethane resin, epoxy resin, or phenoxy resin is preferable as the binder 312 in view of the ease of formation and adhesion to the mineral particles 311 of the clay layer 31. Furthermore, a hardener (crosslinking agent) suitable for the above-described resin can be used. In this case, the binder 312 is made of a crosslinked resin, and the moisture resistance of the clay layer 31 can be improved.

[0055] The clay layer 31 includes a binder 312 and a plurality of mineral particles 311 dispersed in the binder 312. The mineral particles 311 are dispersed in a state in which a thickness direction defined for the mineral particles 311 substantially coincides with a thickness direction defined for the clay layer 31. Between the plurality of mineral particles 311 adjacent to each other in the thickness direction, a gap is provided, and the gap is filled with the binder 312. Further, between the plurality of mineral particles 311 adjacent to each other in a direction perpendicular to the thickness direction, a gap is also provided, and the gap is filled with the binder 312. Thus, the clay layer 31 has a labyrinth-like structure (labyrinth structure) in which the gaps between the plurality of mineral particles 311 are formed as paths. That is, in the clay layer 31, the plurality of mineral particles 311 are dispersed in a state in which the thickness direction defined for the plurality of mineral particles 311 coincides with the thickness direction defined for the clay layer 31 while the plurality of mineral particles 311 are positioned randomly in a width direction. Thus, the gaps between the mineral particles 311 adjacent to each other are formed as paths like zigzags. Thus, when the moisture W permeates the clay layer 31 in the thickness direction, the moisture W cannot move straight but has to move in a zigzag manner through the gaps between the mineral particles 311 adjacent to each other (see the dotted line in FIG. 13C). Thus, the clay layer 31 is hardly permeable to the moisture W compared to a resin layer not including mineral particles (a layer including only a binder), and the moisture resistance of the capacitor 10 can be ensured even when the thickness of the laminate 30 is reduced. For example, even when the clay layer 31 is a clay layer having a thickness of several μm to several tens of μm, the capacitor 10 having the moisture resistance equivalent to that of a resin layer including only an epoxy resin and having a thickness of 2 mm can be obtained. Thus, the moisture resistance of the capacitor 10 of the present embodiment can be 1000 times or more the moisture resistance of a laminate including only a resin. Figure 1 The theoretical formula of the labyrinth structure of the clay layer 31 is shown by the following formula (1).

[0056] P / P0 = (1 − Φ) / (1 + 0.5 AΦ) … (1)

[0057] P / P0 = (1 − Φ) / (1 + 0.5 AΦ) … (1)

[0058] In formula (1), "P / P0" is a specific permeability, Φ is a volume fraction of the mineral particles 311 in the clay layer 31, and A is an aspect ratio of the mineral particles 311.

[0059] The smaller the value of "P / P0", the smaller the permeability of the clay layer 31 to moisture, and the larger the value of "P / P0", the larger the permeability of the clay layer 31 to moisture. Therefore, in the formula (1), the larger the value of Φ, the more difficult it is for moisture to permeate the clay layer 31, and the smaller the value of Φ, the easier it is for moisture to permeate the clay layer 31. Further, in the formula (1), the larger the value of A, the more difficult it is for moisture to permeate the clay layer 31, and the smaller the value of A, the easier it is for moisture to permeate the clay layer 31. Therefore, in order to obtain the laminate 30 that is hardly permeable to moisture to improve the moisture resistance of the capacitor 10, it is preferable to increase the volume fraction of the mineral particles 311 in the clay layer 31, and further, it is preferable to increase the content of the mineral particles 311 having a high aspect ratio.

[0060] The aspect ratio of the mineral particles 311 is preferably greater than or equal to 20. In order to obtain the clay layer 31 that is hardly permeable to moisture, it is preferable to use the mineral particles 311 having a further increased aspect ratio, but the above range is preferable when other properties of the clay layer 31 (for example, the strength, the adhesion, the ease of formation, and the like of the clay layer 31) are also taken into consideration. The aspect ratio of the mineral particles 311 is more preferably greater than or equal to 100, and further more preferably greater than or equal to 150. Note that the upper limit of the aspect ratio of the mineral particles 311 is not particularly limited, but is set in correspondence with the dispersibility and the like of the mineral particles 311 in the clay layer 31.

[0061] Further, as the mineral particles 311, a high aspect ratio material and a low aspect ratio material can be used in combination. In this case, the low aspect ratio material (small diameter mineral particles) easily enters between the high aspect ratio materials, thereby increasing the packing factor of the mineral particles 311 in the clay layer 31. When both the high aspect ratio material and the low aspect ratio material are used at the same time, the high aspect ratio material preferably accounts for at least half or more of the total amount of the mineral particles 311 contained in the clay layer 31.

[0062] The percentage content of the mineral particles 311 in the clay layer 31 is preferably greater than or equal to 50 mass%. For example, when the clay layer 31 contains the mineral particles 311 and the binder 312, the percentage content of the mineral particles 311 is preferably greater than or equal to 50 mass% and less than or equal to 95 mass% with respect to the total amount of the clay layer 31, and the percentage content of the binder 312 is preferably greater than or equal to 5 mass% and less than or equal to 50 mass% with respect to the clay layer 31. Therefore, while the properties (such as the strength, the adhesion, and the ease of formation) of the clay layer 31 are ensured, the clay layer 31 that is hardly permeable to moisture is easily obtained.

[0063] The thickness of the clay layer 31 is preferably greater than or equal to 0.5 μm and less than or equal to 5 μm. In order to reduce the water permeation amount through the clay layer 31, it is preferable to increase the thickness of the clay layer 31, but the range is preferable in view of the properties of the clay layer 31 such as strength, adhesion, and ease of formation. The thickness of the clay layer 31 is more preferably greater than or equal to 1.0 μm and less than or equal to 3 μm.

[0064] Note that the clay layer 31 not only has low moisture permeability but also has low gas permeability, and thus the laminate 30 easily ensures gas barrier properties.

[0065] <Manufacture of Laminate>

[0066] The laminate 30 is manufactured by forming the adhesive layer 32 on the surface of the substrate layer 33, and forming the clay layer 31 on the surface of the adhesive layer 32.

[0067] The adhesive layer 32 is obtained by supplying a treatment liquid containing a resin constituting the adhesive layer 32 to the surface of the substrate layer 33, and drying the treatment liquid on the surface of the substrate layer 33. The treatment liquid is obtained by dispersing or dissolving the resin constituting the adhesive layer 32 into a solvent. Examples of the solvent include water, organic solvents, and mixed solvents thereof, but the solvent is preferably water in terms of ease of handling, for example, in terms of waste liquid treatment.

[0068] The treatment liquid can be supplied to the surface of the substrate layer 33 by a coating method and an immersion method such as gravure coating, roll coating, die coating, brush coating, spray coating, and immersion. In this case, the treatment liquid can be easily supplied along the surface even when the surface of the substrate layer 33 is not uniform, and the adhesive layer 32 is easily formed. In order to dry the treatment liquid, natural drying, heat drying, or the like can be employed.

[0069] The clay layer 31 is obtained by supplying a treatment liquid containing the mineral particles 311 and the binder 312 to the surface of the adhesive layer 32, and drying the treatment liquid on the surface of the adhesive layer 32. The treatment liquid contains a solvent, and the mineral particles 311 and the binder 312 dispersed in the solvent. Examples of the solvent include water, organic solvents, and mixed solvents thereof, but the solvent is preferably water in terms of ease of handling, for example, in terms of waste liquid treatment.

[0070] In order to supply the treatment liquid to the surface of the adhesive layer 32, a coating method such as brush coating and spray coating, or an immersion method such as immersion can be employed. In this case, the treatment liquid can be easily supplied along the surface even when the surface of the adhesive layer 32 is not uniform, and the clay layer 31 is easily formed. In order to dry the treatment liquid, natural drying, heat drying, or the like can be employed.

[0071] The manufacturing method as described below can realize a clay layer (layer containing a mineral) 31 capable of exhibiting high moisture resistance even in the case of a thin film (several to several tens of μm), and thus the manufacturing method as described above can ensure the moisture resistance of the laminate 30.

[0072] After the adhesive layer 32 is formed on the substrate layer 33, and before the clay layer 31 is formed, the adhesive layer 32 is preferably subjected to a corona treatment. This forms a polar group (hydrophilic functional group) on the surface of the adhesive layer 32, thereby improving the adhesion between the adhesive layer 32 and the clay layer 31. The corona treatment is performed by causing a corona discharge in air. The corona discharge dissociates oxygen molecules into oxygen ions and oxygen radicals. The oxygen ions and oxygen radicals chemically react with each other on the surface of the adhesive layer 32, and thus a hydrophilic functional group is generated on the surface of the adhesive layer 32. Examples of the hydrophilic functional group include a carbonyl group and a hydroxyl group.

[0073] The laminate 30 preferably includes an aluminum layer or a polyvinyl alcohol layer on the other face. The other face refers to a surface on which the adhesive layer 32 and the clay layer 31 are not provided among the two faces aligned in the thickness direction defined for the substrate layer 33. In other words, the laminate 30 preferably includes an aluminum layer or a polyvinyl alcohol layer provided on the surface of the substrate layer 33 opposite to the adhesive layer 32 and the clay layer 31. This further reduces the moisture permeability of the laminate 30.

[0074] (2-2) Electronic component

[0075] As Figure 2 As shown in A to 2D, the electronic component 1 according to the present embodiment includes an electronic component element 2 and a barrier film. The barrier film includes the laminate 30. That is, the laminate 30 including the substrate layer 33, the adhesive layer 32, and the clay layer 31 is used as the barrier film.

[0076] The electronic component element 2 is a component or a portion for exhibiting an intended function of the electronic component 1. The electronic component element 2 includes an external electrode 24 at both ends.

[0077] The laminate 30 has a function of protecting the electronic component element 2. The laminate 30 has a function of protecting the electronic component element 2 from moisture. The laminate 30 can also have a function of protecting the electronic component element 2 from heat, light, electromagnetic waves, impact, or chemicals, and the like. The laminate 30 covers at least a portion of a peripheral portion of the electronic component element 2. For example, the laminate 30 covers the entire electronic component element 2 except for a portion where the external electrode 24 is provided. The laminate 30 can be provided in contact with a surface of the electronic component element 2.

[0078] The laminate 30 is preferably arranged so that the clay layer 31 faces the electronic component element 2. That is, the laminate 30 preferably covers a peripheral portion of the electronic component element 2 so that the clay layer 31 is located on the inner side (the side close to the electronic component element 2) when viewed from a position at which the base material layer 33 is present. In the laminate 30, the clay layer 31 has a higher adhesion to the electronic component element 2 than the base material layer 33. Therefore, arranging the laminate 30 so that the clay layer 31 faces the electronic component element 2 facilitates the adhesion of the clay layer 31 to the electronic component element 2, thereby easily reducing the moisture that enters the electronic component element 2.

[0079] The electronic component 1 according to the present embodiment can further include an external resin layer 4 that covers the electronic component element 2 and the laminate 30. The external resin layer 4 has a function of protecting the electronic component element 2 and the laminate 30 from moisture. In addition, the external resin layer 4 can have a function of protecting the electronic component element 2 and the laminate 30 from heat, light, electromagnetic waves, impact, or chemicals, and the like. The external resin layer 4 includes one or both of a case (container) and a molded resin.

[0080] The electronic component 1 according to the present embodiment can further include a bus bar 6. The bus bar 6 is a terminal that connects the electronic component 1 to a circuit board or the like. Each bus bar 6 has one end portion (a bottom end) that is electrically and mechanically connected to a corresponding one of the external electrodes 24 of the electronic component element 2. Each bus bar 6 has one end portion (a tip end) that is located outside the external resin layer 4. Each bus bar 6 is made of, for example, copper or a copper alloy, and is plate-shaped. The electronic component 1 of the present embodiment includes a pair of bus bars 6, the tip ends of each bus bar 6 protruding outward (for example, upward) from the same face (for example, the top face) of the external resin layer 4, but is not limited to such a shape and structure.

[0081] The electronic component 1 according to the present embodiment includes the clay layer 31 containing clay in the laminate 30 that covers the electronic component element 2, and thus the amount of moisture that permeates through the laminate 30 is easily reduced compared to a resin layer made of only resin and having the same thickness as the clay layer 31. Therefore, the moisture that reaches the electronic component element 2 from the outside of the electronic component 1 is reduced, and the moisture is less likely to affect the electronic component element 2, and thus an electronic component 1 with excellent moisture resistance is easily obtained. In addition, the clay layer 31 can be formed on the surface of the base material layer 33 by a simple means such as coating, and thus the manufacturing steps of the electronic component 1 are unlikely to be complicated, and thus the cost is easily reduced.

[0082] (2-3) Capacitor

[0083] The electronic component 1 as the capacitor 10 will be described below. The electronic component 1 as the capacitor 10 includes the capacitor element 20 as the electronic component element 2. That is, the electronic component element 2 in the capacitor 10 is the capacitor element 20.

[0084] As the capacitor element 20, various types of capacitor elements are used depending on the type of the capacitor 10. In the present embodiment, examples of the capacitor 10 include a film capacitor, a ceramic capacitor, and an electrolytic capacitor. Among them, the capacitor 10 is preferably a film capacitor, and particularly preferably a film capacitor including a wound-type capacitor element 20. In this case, the capacitor element 20 with the laminate 30 wound therearound can be easily manufactured by using similar devices and procedures to those for manufacturing the wound-type capacitor element 20. Note that the capacitor element 20 can be a stacked film capacitor.

[0085] The capacitor element 20 includes an external electrode 24 at each of both ends in the axial direction thereof. The external electrode 24 is preferably formed by thermal spraying of a metal material. Further, the external electrode 24 preferably contains tin in a percentage of greater than or equal to 50% by weight. This type of external electrode 24 is often formed by thermal spraying of zinc in many cases, but the external electrode 24 made of zinc is more likely to be porous and can allow moisture to enter. Therefore, in the present embodiment, the percentage of tin in the external electrode 24 is increased, and thus the metal structure constituting the external electrode 24 becomes dense, thereby making it difficult for moisture to enter the capacitor element 20 through the external electrode 24. Further, increasing the percentage of tin in the external electrode 24 makes the metal structure included in the external electrode 24 dense, thereby increasing the adhesion between the laminate 30 and the external electrode 24 and further reducing the moisture entering the capacitor element 20. The percentage of tin in the external electrode 24 is at least in a range of greater than or equal to 50% by weight to less than or equal to 100% by weight.

[0086] The laminate 30 is a barrier film. That is, the laminate 30 has a function of preventing the capacitor element 20 from being affected by moisture. The laminate 30 can also have a function of protecting the capacitor element 20 from heat, light, electromagnetic waves, impact, or chemicals, and the like.

[0087] As Figure 2As shown in A to 2D, the laminate 30 covers at least a portion of the peripheral portion of the capacitor element 20. The peripheral portion of the capacitor element 20 refers to a portion of the capacitor element 20 around an axis, provided that the axis is a direction in which the pair of external electrodes 24 face each other. When the capacitor element 20 is substantially cylindrical, the laminate 30 is disposed to face the outer peripheral surface of the capacitor element 20. Thus, the laminate 30 covers the entire capacitor element 20 except for the portion where the external electrodes 24 are provided. That is, the capacitor element 20 is almost entirely covered by the laminate 30 except for the portion where the external electrodes 24 are provided. Thus, it is difficult for moisture to enter the capacitor element 20 from the entire peripheral portion, thereby improving the moisture resistance of the capacitor 10. In particular, in many cases, the outer peripheral surface (surface around the axis) of the capacitor element 20 has a larger area than the end surface (surface in the axial direction), and thus the laminate 30 is preferably provided to at least surround the outer peripheral surface of the capacitor element 20. As explained above, the laminate 30 is provided to cover at least a portion of the peripheral portion of the capacitor element 20. As used herein, "at least a portion" preferably means, for example, greater than or equal to 80% of the surface area of the outer surface of the capacitor element 20 except for the external electrodes 24.

[0088] The laminate 30 is preferably disposed to form a plurality of layers on the peripheral portion of the capacitor element 20. That is, a plurality of laminates 30 that overlap each other in the thickness direction are preferably provided on the peripheral portion of the capacitor element 20. In this case, a plurality of clay layers 31 are laminated to each other, and the moisture resistance of the capacitor 10 is improved as compared to the case where the clay layer 31 is a single layer. Furthermore, the clay layer 31 can have a defect such as a pinhole, but another clay layer 31 overlapping the clay layer 31 covers the defect, and thus the moisture resistance of the capacitor 10 is less likely to be impaired.

[0089] The external resin layer 4 covers at least a portion of the capacitor element 20 and the laminate 30. The external resin layer 4 preferably completely covers the capacitor element 20 and the laminate 30, and in this case, the capacitor element 20 and the laminate 30 are completely sealed by the external resin layer 4. The clay layer 31 and the external resin layer 4 are laminated to each other. That is, the clay layer 31 and the external resin layer 4 are disposed to face each other in the thickness direction defined for the laminate 30. The thickness of the external resin layer 4 is preferably greater than the thickness of the clay layer 31. Thus, the clay layer 31, which is small in thickness and easily broken, is easily protected by the external resin layer 4. The thickness of the external resin layer 4 is preferably greater than or equal to 1 mm and less than or equal to 6 mm. Thus, the external resin layer 4 easily reduces the moisture permeability of the clay layer 31 in addition to the clay layer 31, thereby improving the moisture resistance of the capacitor 10. The thickness of the external resin layer 4 is preferably greater than or equal to 1 mm and less than or equal to 4.5 mm, and more preferably greater than or equal to 1 mm and less than or equal to 3 mm.

[0090] Examples of the resin included in the outer resin layer 4 include epoxy-based resins, unsaturated polyester resins, and polyimide resins, and epoxy resins are preferable in view of moldability and the like when the outer resin layer 4 covers the capacitor element 20. In addition, the outer resin layer 4 can be made of only a resin, or the outer resin layer 4 can be made of a composite material including a resin and a filler. In this case, the filler can be, for example, silicon dioxide, and the content of the filler with respect to the total amount of the outer resin layer 4 can be greater than or equal to 1 mass% and less than or equal to 99 mass%.

[0091] Figure 3 A shows a capacitor 10 in which the position of the laminate 30 is different from that of Figure 2 A. The capacitor 10 includes the laminate 30 and the outer resin layer 4. However, the laminate 30 does not come into contact with the surface of the capacitor element 20, but covers the surrounding portion of the outer resin layer 4. In this case, the outer resin layer 4 is positioned between the capacitor element 20 and the laminate 30. Therefore, the outer resin layer 4 is positioned closer to the electronic component element 2 (capacitor element 20) than the laminate 30. The laminate 30 is positioned on the surface of the outer resin layer 4.

[0092] In addition, in the capacitor 10, the capacitor element 20 is covered by the laminate 30 with the outer resin layer 4 interposed therebetween, and therefore the laminate 30 makes it difficult for moisture to reach the capacitor element 20, thereby reducing moisture absorbed by the capacitor element 20 and improving the moisture resistance of the capacitor 10.

[0093] Figure 3 B shows a capacitor 10 in which the position of the laminate 30 is different from that of Figure 2 A and 3A. The capacitor 10 includes the laminate 30 on the surface of the capacitor element 20 and on the surface of the outer resin layer 4. That is, the laminate 30 includes a first laminate 30a arranged to come into contact with the surface of the capacitor element 20 and a second laminate 30b arranged to come into contact with the surface of the outer resin layer 4. Therefore, the outer resin layer 4 is provided between the first laminate 30a and the second laminate 30b.

[0094] In the capacitor 10, the capacitor element 20 is covered by the first laminate 30a, the second laminate 30b, and the outer resin layer 4. The two laminates 30 make it difficult for moisture to reach the capacitor element 20, and further reduce moisture absorbed by the capacitor element 20 and improve the moisture resistance of the capacitor 10.

[0095] (2-4) Method for manufacturing electronic component (capacitor)

[0096] The manufacturing method of the electronic component 1 includes a step of forming the electronic component element 2, and a step of winding the laminate 30 around at least a part of the peripheral portion of the electronic component element 2. When the electronic component 1 is the capacitor 10, the manufacturing method of the capacitor 10 includes a step of forming the capacitor element 20, and a step of winding the laminate 30 around at least a part of the peripheral portion of the capacitor element 20. The manufacturing method of the electronic component 1 or the capacitor 10 according to the present embodiment can further include a step of covering the capacitor element 20 with the outer resin layer 4.

[0097] The manufacturing of the wound-type capacitor element 7 as the capacitor element 20 includes a step of winding the metalized films 71 and 72 into a wound body 73, a step of winding the laminate 30 around at least a part of the peripheral portion of the wound body 73, and a step of forming the outer electrode 24 by thermal spraying of a metal material onto both ends of the wound body 73 having the laminate 30 wound therearound. Specifically, the wound-type capacitor element 7 can be manufactured as explained below.

[0098] First, the first metalized film 71 and the second metalized film 72 are arranged (see Figure 4 A). The first metalized film 71 includes a first dielectric film 701 and a first conductive layer 711. The first dielectric film 701 is an elongated object. The first dielectric film 701 has a surface on which the first conductive layer 711 is formed except for a first edge portion 721. The first edge portion 721 is a portion of the first dielectric film 701 exposed. The first edge portion 721 is formed in a strip shape narrower than the first conductive layer 711 along one long side of the first dielectric film 701.

[0099] The second metalized film 72 is formed to have a similar configuration to the first metalized film 71. That is, the second metalized film 72 includes a second dielectric film 702 and a second conductive layer 712. The second dielectric film 702 is an elongated object having the same width as the first dielectric film 701. The second dielectric film 702 has a surface on which the second conductive layer 712 is formed except for a second edge portion 722. The second edge portion 722 is a portion of the second dielectric film 702 exposed. The second edge portion 722 is formed in a strip shape narrower than the second conductive layer 712 along one long side of the second dielectric film 702.

[0100] The first dielectric film 701 and the second dielectric film 702 contain the same type of resin as the base material layer 33 of the laminate 30. For example, the first dielectric film 701 and the second dielectric film 702 contain polypropylene, polyethylene terephthalate, polyethylene naphthalate, polyphenylene sulfide, polystyrene, or the like. The first conductive layer 711 and the second conductive layer 712 are formed, for example, by a vapor deposition method or a sputtering method. The first conductive layer 711 and the second conductive layer 712 are made of, for example, aluminum, zinc, and magnesium.

[0101] As Figure 4 A), and then the first metallized film 71 and the second metallized film 72 are stacked on each other so that the two long sides of the first metallized film 71 are aligned with the two long sides of the second metallized film 72. Here, the first dielectric film 701 or the second dielectric film 702 is positioned between the first conductive layer 711 and the second conductive layer 712. In addition, the long side on which the first edge portion 721 is formed and the long side on which the second edge portion 722 is formed are on opposite sides. The first metallized film 71 and the second metallized film 72 that are stacked on each other in this way are wound into a cylindrical winding body 73. The winding body 73 is wound with the laminated body 30 on the outer peripheral surface thereof, and therefore the winding body 73 is covered with the laminated body 30. At this time, the laminated body 30 can be wound only once (one turn), or can be wound multiple times. Then, the side surface of the winding body 73 is pressed from both sides, and is processed to have an oblong cross section (see Figure 4 B). The flattening in this way saves space. In this way, the element body 2a formed of the winding body 73 can be covered with the laminated body 30.

[0102] Then, the first external electrode 21 and the second external electrode 22 are formed as external electrodes 24 by metalikon (thermal spraying, metal splaying) at both ends of the winding body 73, thereby obtaining a wound-type capacitor element 7. The first external electrode 21 is electrically connected to the first conductive layer 711 (first internal electrode). The second external electrode 22 is electrically connected to the second conductive layer 712 (second internal electrode). The first conductive layer 711 and the second conductive layer 712 form a pair of internal electrodes. The first external electrode 21 and the second external electrode 22 are made of, for example, tin, zinc, or a metal material containing tin and zinc as main components.

[0103] Then, as shown in Figure 4 B, the first bus bar 61 is electrically connected to the first external electrode 21, and the second bus bar 62 is electrically connected to the second external electrode 22. Examples of the connection method include solder welding, resistance welding, and ultrasonic welding. The first bus bar 61 and the second bus bar 62 are made of, for example, copper or a copper alloy in a plate shape.

[0104] In the case of the wound-type capacitor element 7, after the step of winding the metalized films 71 and 72, the laminate 30 is wound around the wound body 73, and thus, the step is rational and can be simplified. Further, when metal chips attached to portions other than the positions at which the external electrodes 24 are formed (for example, the peripheral portions of the capacitor element 20) must be removed after the step of thermal spraying the metal material, the base material layer 33 of the laminate 30 is wound around the peripheral portions of the capacitor element 20 so that the base material layer 33 of the laminate 30 is located at the outermost side, and thus, the metal chips attached to the base material layer 33 can be easily removed. Note that such metal chips are removed by scrubbing or the like.

[0105] In contrast, the laminated-type capacitor element 8 as the capacitor element 20 can be manufactured, for example, by the following method. First, the first metalized film 81 and the second metalized film 82 are prepared (see Figure 5 A).

[0106] Each first metalized film 81 includes a first dielectric film 801 and a first conductive layer 811. The first dielectric film 801 is rectangular. The first dielectric film 801 has one surface on which the first conductive layer 811 is formed except for a first edge portion 821. The first edge portion 821 is formed in a strip shape narrower than the first conductive layer 811 along one edge of the first dielectric film 801.

[0107] Each second metalized film 82 has a configuration similar to that of each first metalized film 81. That is, each second metalized film 82 includes a second dielectric film 802 and a second conductive layer 812. The second dielectric film 802 is rectangular in a size identical to that of the first dielectric film 801. The second dielectric film 802 has one surface on which the second conductive layer 812 is formed except for a second edge portion 822. The second edge portion 822 is formed in a strip shape narrower than the second conductive layer 812 along one edge of the second dielectric film 802.

[0108] The first dielectric film 801 and the second dielectric film 802 contain the same type of resin as the base material layer 33 of the laminate 30. For example, the first dielectric film 801 and the second dielectric film 802 contain polypropylene, polyethylene terephthalate, polyethylene naphthalate, polyphenylene sulfide, polystyrene, or the like. The first conductive layer 811 and the second conductive layer 812 are formed, for example, by a vapor deposition method or a sputtering method. The first conductive layer 811 and the second conductive layer 812 are made of, for example, aluminum, zinc, and magnesium.

[0109] As Figure 5A and 5B, and then the first and second metallized films 81 and 82 are alternately laminated to each other while aligning the four edges of the first and second metallized films 81 and 82 with each other. Here, the first dielectric film 801 or the second dielectric film 802 is positioned between the first and second conductive layers 811 and 812. In addition, one edge on which the first edge portion 821 is formed and one edge on which the second edge portion 822 is formed are on opposite sides. The plurality of first metallized films 81 and the plurality of second metallized films 82 are laminated and integrated together in this way, which provides a laminate 83 as shown in Figure 5 A, the first edge portion 821 is arranged toward the back, and the second edge portion 822 is arranged toward the front. Laminating and integrating the plurality of first metallized films 81 and the plurality of second metallized films 82 in this way provides a laminate 83 as shown in Figure 5 B and 5C. The laminate 83 is covered with a protective film 84 except for the front and back of the laminate 83. The protective film 84 is an electrically insulating film. The protective film 84 can be formed of the laminate 30.

[0110] Then, a first external electrode 21 and a second external electrode 22 are formed on the front and back of the laminate 83, respectively, by metal spraying (thermal spraying, metal spraying), thereby obtaining a laminated capacitor element 8 (see Figure 5 D). The first external electrode 21 is electrically connected to the first conductive layer 811 (first internal electrode). The second external electrode 22 is electrically connected to the second conductive layer 812 (second internal electrode). The first and second conductive layers 811 and 812 form a pair of internal electrodes. The first and second external electrodes 21 and 22 are made of, for example, zinc.

[0111] After that, as shown in Figure 5 D, the first bus bar 61 is electrically connected to the first external electrode 21, and the second bus bar 62 is electrically connected to the second external electrode 22. Examples of the connection method include soldering, resistance welding, and ultrasonic welding. The first and second bus bars 61 and 62 are made of, for example, copper or a copper alloy in a plate shape.

[0112] After the capacitor element 20 is formed as described above, a step of forming an external resin layer 4 is performed. The step of forming the external resin layer 4 includes sealing the capacitor element 20 to which the bus bars 6 have been connected with a resin, thereby forming the external resin layer 4. Examples of the resin include: an epoxy-based resin, an unsaturated polyester resin, a polyimide resin, a polyurethane resin, and a silicone resin. Examples of the molding method for covering the capacitor element 20 include transfer molding, compression molding, and laminate molding. Furthermore, the capacitor element 20 can be housed and sealed in a case including the external resin layer 4. The external resin layer 4 is formed so as to completely cover the capacitor element 20 except for the connection portions of the capacitor element 20 and the bus bars 6. Each bus bar 6 has a tip end positioned on the outside of the external resin layer 4 (on the opposite side of the capacitor element 20). After the external resin layer 4 is formed, the laminate 30 is provided on the surface of the external resin layer 4 as needed.

[0113] In this way, the capacitor 10 including the laminate 30 as the barrier film is obtained.

[0114] (2-5) Variations

[0115] The above has described one embodiment in which the electronic component is a capacitor, but the electronic component is not limited to this embodiment. The present disclosure is also applicable to an embodiment in which the electronic component is a passive component or an active component other than a capacitor. The passive component or the active component other than a capacitor includes a passive element or an active element selected in accordance with the type of the electronic component, instead of the capacitor element.

[0116] The above has described an embodiment in which the laminate 30 covers the wound body 73 before the first external electrode 21 and the second external electrode 22 are formed by metal spraying (thermal spraying), but this should not be construed as limiting. The laminate 30 can cover the wound body 73 after the first external electrode 21 and the second external electrode 22 are formed. In the case where the laminate 30 covers the peripheral portions of the first external electrode 21 and the second external electrode 22, the first external electrode 21 and the second external electrode 22 are formed on the wound body 73, and then the laminate 30 can cover the wound body 73, the first external electrode 21, and the second external electrode 22.

[0117] Further, even in the case where the laminate 30 covers the peripheral portions of the first external electrode 21 and the second external electrode 22, the laminate 30 can cover the wound body 73 before the first external electrode 21 and the second external electrode 22 are formed. In this case, the width of the laminate 30 is made larger than the width of each of the metallized films 71 and 72 that form the wound body 73 by 1 to 2 mm, and the end portion of the laminate 30 protrudes beyond the axial end face of the wound body 73. The first external electrode 21 and the second external electrode 22 are formed by thermally spraying metal onto the axial end face of the wound body 73 in the space surrounded by the end portion of the laminate 30.

[0118] (3) SUMMARY

[0119] The laminate (30) of the first aspect includes a base material layer (33), an adhesive layer (32), and a clay layer (31). The base material layer (33) contains a crystalline resin. The adhesive layer (32) contains a resin different from the crystalline resin and is provided on one face of the base material layer (33). The clay layer (31) is provided on the adhesive layer (32) located on one face of the base material layer (33). The viscosity of the adhesive layer (32) exhibits a temperature lower than or equal to 130°C.

[0120] This aspect has the following advantage: the laminate (30) has good water vapor barrier properties due to the substrate layer (33) containing a crystalline resin, and the adhesion between the substrate layer (33) and the clay layer (31) is excellent due to the adhesive layer (32).

[0121] In the laminate (30) of the second aspect (reciting the first aspect), the adhesive layer (32) contains an amorphous resin.

[0122] This aspect has the following advantage: it is easy to improve the adhesion between the substrate layer (33) and the clay layer (31) without using heat fusion.

[0123] In the laminate (30) of the third aspect (reciting the first aspect), the adhesive layer (32) contains a resin containing a polar group.

[0124] This aspect has the following advantage: it is easy to improve the adhesion between the substrate layer (33) and the clay layer (31) without using heat fusion.

[0125] In the laminate (30) of the fourth aspect (reciting any one of the first to third aspects), the crystalline resin is polypropylene.

[0126] This aspect has the following advantage: the water vapor barrier properties of the laminate (30) are improved.

[0127] In the laminate (30) of the fifth aspect (reciting any one of the first to fourth aspects), the substrate layer (33) is a biaxially oriented polypropylene film.

[0128] This aspect has the following advantage: the water vapor barrier properties of the laminate (30) are improved.

[0129] The laminate (30) of the sixth aspect (reciting any one of the first to fifth aspects) further includes an aluminum layer or a polyvinyl alcohol layer on the other face of the substrate layer (33).

[0130] This aspect has the following advantage: the water vapor barrier properties of the laminate (30) are improved.

[0131] The electronic component (1) of the seventh aspect includes: an electronic component element (2), and a barrier film covering at least a part of a peripheral portion of the electronic component element (2). The barrier film includes a laminate (30).

[0132] This aspect has the following advantage: the laminate (30) reduces moisture reaching the electronic component element (2), thereby easily providing an electronic component (1) having high moisture-resistant reliability.

[0133] The capacitor (10) of the eighth aspect is the electronic component (1) of the seventh aspect, and the electronic component element (2) of the electronic component (1) is the capacitor element (20).

[0134] This aspect has the following advantage: the laminate (30) reduces moisture reaching the capacitor element (20), thereby easily providing a capacitor (10) having high moisture resistance reliability.

[0135] In the capacitor (10) of the ninth aspect (refer to the eighth aspect), the capacitor element (20) includes a pair of metallized films (71, 72, 81, 82) each including a dielectric film (701, 702, 801, 802) and a conductive layer (711, 712, 811, 812) on the dielectric film (701, 702, 801, 802), the pair of metallized films (71, 72, 81, 82) are wound such that the conductive layer (711, 712, 811, 812) of one of the pair of metallized films (71, 72, 81, 82) and the conductive layer (711, 712, 811, 812) of the other of the pair of metallized films (71, 72, 81, 82) face each other via the dielectric film (701, 702, 801, 802) of the one of the pair of metallized films (71, 72, 81, 82), and the dielectric film (701, 702, 801, 802) includes a resin of the same type as the crystalline resin included in the substrate layer (33).

[0136] This aspect has the following advantage: a capacitor (10) excellent in electrical insulation and water vapor barrier properties is obtained.

[0137] Embodiments

[0138] (Embodiments 1 and 2)

[0139] As the clay material, Kunipia F (manufactured by KUNIMINE INDUSTRIES CO., LTD.) was used. As the binder, water-soluble nylon A-90 (manufactured by Toray Industries, Inc.) was used. The clay material, the binder, and a solvent were mixed together, thereby preparing a treatment liquid (clay coating liquid). The contents of the treatment liquid were 6% by weight of the clay material and the binder in total, 81% by weight of water, and 13% by weight of ethanol. The mixing ratio (weight ratio) of the clay material to the binder is shown in Table 1.

[0140] Then, a polypropylene film (thickness 24 μm) including a base material layer and an adhesive layer was subjected to a corona treatment, and then a treatment liquid was applied to the surface of the adhesive layer by using an applicator, and then dried. The thickness of the clay layer after drying was 1 μm. Note that the adhesive layer was a low-melting polypropylene having a melting point of 130°C, and a viscosity performance temperature of 90°C. Further, the drying conditions were changed as shown in Table 1 for each of the examples.

[0141] Then, the adhesion evaluation of the clay layer (based on JIS K 5600-5-6) was performed. That is, the clay layer was cut at intervals of 2 mm, and the clay layer was peeled off by using a tape, and only the case where the clay layer was not peeled off (category 0) was indicated as "O", and the other cases were indicated as "X".

[0142] (Comparative Examples 1 and 2)

[0143] The adhesion evaluation was performed in a similar manner to the adhesion evaluation performed in Examples 1 and 2 except that a polypropylene film (only a base material layer) not including an adhesive layer was used.

[0144] [Table 1]

[0145]

[0146] As can be seen from Table 1, the adhesion of the clay layer was improved in Examples 1 and 2 including an adhesive layer compared to Comparative Examples 1 and 2 not including an adhesive layer. Further, in Examples 1 and 2, the adhesion of the clay layer was ensured by natural drying without heating. In addition, in Examples 1 and 2, the adhesion of the clay layer was ensured when drying was performed at a temperature lower than or equal to the viscosity performance temperature.

[0147] List of Reference Numerals

[0148] 1 electronic component

[0149] 10 capacitor

[0150] 2 electronic component element

[0151] 20 capacitor element

[0152] 30 laminate

[0153] 31 clay layer

[0154] 32 adhesive layer

[0155] 33 base material layer

[0156] 71, 72, 81, 82 metallized film

[0157] 701, 702, 801, 802 dielectric film

[0158] 711, 712, 811, 812 conductive layer

Claims

1. A laminate comprising: a substrate layer comprising a crystalline polypropylene; an adhesive layer comprising an amorphous olefin-based resin having a lower crystallinity than the crystalline polypropylene and disposed on one face of the substrate layer; and a clay layer disposed on the adhesive layer on the one face of the substrate layer, a viscosity manifestation temperature of the adhesive layer being lower than or equal to 130°C, wherein the viscosity manifestation temperature refers to a temperature at which the adhesive layer manifests a viscosity.

2. The laminate of claim 1, wherein the adhesive layer comprises a resin containing a polar group.

3. The laminate of claim 1 or 2, wherein the substrate layer is a biaxially oriented polypropylene film.

4. The laminate of claim 1 or 2, further comprising an aluminum layer or a polyvinyl alcohol layer on the other face of the substrate layer.

5. An electronic component comprising: an electronic component element; and a barrier film covering at least a portion of a peripheral portion of the electronic component element, the barrier film comprising the laminate of any one of claims 1 to 4.

6. A capacitor, which is the electronic component of claim 5, wherein the electronic component element of the electronic component is a capacitor element.

7. The capacitor of claim 6, wherein the capacitor element comprises a pair of metallized films each comprising a dielectric film and a conductive layer on the dielectric film, the pair of metallized films are wound such that the conductive layer of one of the pair of metallized films and the conductive layer of the other of the pair of metallized films face each other with the dielectric film of the one of the pair of metallized films therebetween, and the dielectric film comprises a resin of the same type as the crystalline resin comprised by the substrate layer. ​

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