Low thermal expansion coefficient build-up adhesive film for FC-BGA package carrier board and its preparation method and application

Abstract

The present invention discloses a low-thermal-expansion-coefficient build-up film for FC-BGA package carriers, as well as its preparation method and application. The build-up film is prepared from the following raw materials, by weight: 50-60 parts of epoxy resin, 5-10 parts of phenoxy resin, 30-35 parts of curing agent, 0.1-0.5 parts of curing accelerator, and 80-100 parts of functionalized silica; the functionalized silica includes at least one of amino-, hydroxylated, and carboxylated silica. The present invention introduces the functionalized silica as a modified filler into the build-up film. By reacting the modified filler with specific functional groups in the resin system, an interconnected network structure is constructed, which restricts the movement of polymer chain segments in the build-up film, reduces thermal expansion, and achieves a lower thermal expansion coefficient for the build-up film. This avoids existing issues such as carrier warping caused by thermal expansion and packaging structure failure caused by thermal expansion coefficient mismatch.

Description

Technical Field

[0001] The present invention relates to the technical field of resin materials, and in particular to a build-up adhesive film for an FC-BGA package carrier board with a low thermal expansion coefficient, and a preparation method and application thereof. Background Art

[0002] Flip-chip ball grid array (FC-BGA) package substrates are the future development direction of semiconductor package substrates, with a wide range of applications and broad market prospects. FC-BGA package substrates are high-density package substrates that enable high-speed and multifunctional chips. Build-up film is one of the key core materials in the semi-additive manufacturing process (SAP) for FC-BGA package substrates. However, the build-up film in existing FC-BGA package substrates has an excessively large coefficient of thermal expansion, and the resin system in the build-up film exhibits significant thermal expansion, which can easily lead to carrier warping. At the same time, external thermal loads can cause dimensional changes in the material due to thermal expansion, and can also alter physical properties such as creep rate. This can lead to coefficient of thermal expansion mismatch (CTE mismatch), which can cause local stress and ultimately lead to package structure failure.

[0003] Therefore, the existing technology still needs to be improved and developed. Summary of the Invention

[0004] In view of the above-mentioned deficiencies in the prior art, the purpose of the present invention is to provide a low thermal expansion coefficient build-up adhesive film for FC-BGA package carrier boards, and its preparation method and application, aiming to solve the problem of excessively large thermal expansion coefficient of existing build-up adhesive films for FC-BGA package carrier boards.

[0005] The technical solutions of the present invention are as follows:

[0006] A first aspect of the present invention provides a low thermal expansion coefficient FC-BGA package carrier build-up adhesive film, wherein the low thermal expansion coefficient FC-BGA package carrier build-up adhesive film is prepared from raw materials including the following components in parts by weight:

[0007] 50-60 parts of epoxy resin, 5-10 parts of phenoxy resin, 30-35 parts of curing agent, 0.1-0.5 parts of curing accelerator and 80-100 parts of functionalized silica;

[0008] The functionalized silica includes at least one of amino silica, hydroxylated silica, and carboxylated silica.

[0009] Optionally, the particle size of the amino-silica is 600-800 nm, the particle size of the hydroxy-silica is 200-300 nm, and the particle size of the carboxy-silica is 600-800 nm.

[0010] Optionally, the curing agent includes at least one of an active ester curing agent, a carbodiimide curing agent, a phenol curing agent, a naphthol curing agent, a cyanate curing agent, and a benzoxazine curing agent.

[0011] Optionally, the curing accelerator includes at least one of 1-cyanoethyl-2-ethyl-4-methylimidazole, 2-phenyl-4,5-dihydroxymethylimidazole, 2-phenyl-4-methyl-5-hydroxymethylimidazole, 2-ethyl-4-methylimidazole, 4-dimethylaminopyridine, and 2-phenylimidazole.

[0012] A second aspect of the present invention provides a method for preparing a build-up adhesive film for a low thermal expansion coefficient FC-BGA package carrier, comprising the steps of:

[0013] providing a substrate;

[0014] By weight, 50-60 parts of epoxy resin, 5-10 parts of phenoxy resin, 30-35 parts of curing agent, 0.1-0.5 parts of curing accelerator and 80-100 parts of functionalized silica are mixed with 200-300 parts of a first organic solvent to obtain a slurry; the functionalized silica includes at least one of amino silica, hydroxylated silica and carboxylated silica;

[0015] The slurry is transferred to the substrate and dried to obtain the build-up adhesive film for the FC-BGA package carrier board with a low thermal expansion coefficient.

[0016] Optionally, the preparation method of the amino silicon dioxide comprises the steps of:

[0017] The silicon dioxide is ultrasonically dispersed in water, 3-aminopropyltriethoxysilane is added, the pH of the system is adjusted to 7.3-7.8, and the reaction is carried out at a first preset temperature for a first preset time to obtain the amino silicon dioxide.

[0018] Optionally, the preparation method of the hydroxylated silicon dioxide comprises the steps of:

[0019] Adding silicon dioxide into a sodium hydroxide solution and reacting at a second preset temperature for a second preset time to obtain the hydroxylated silicon dioxide.

[0020] Optionally, the method for preparing the carboxylated silica comprises the steps of:

[0021] Under stirring conditions, a silane coupling agent and succinic anhydride are added to the second organic solvent, and then silicon dioxide and water are added, and stirring is continued to obtain carboxylated silicon dioxide.

[0022] Optionally, the first organic solvent includes at least one of toluene, xylene, butanone, methyl ethyl ketone, cyclohexanone, ethyl acetate, and N,N-dimethylformamide;

[0023] The second organic solvent includes at least one of N,N-dimethylformamide, dimethylacetamide, and acetone.

[0024] The third aspect of the present invention provides a build-up adhesive film for a low thermal expansion coefficient FC-BGA package carrier board as described above and / or a build-up adhesive film for a low thermal expansion coefficient FC-BGA package carrier board prepared by the preparation method as described above in the present invention, and its application in a flip chip ball grid array package carrier board.

[0025] Beneficial effects: The present invention introduces modified fillers such as amino silica, hydroxylated silica and carboxylated silica into the build-up film. By means of the reaction between the modified fillers and specific functional groups in the resin system, an interconnected network structure is constructed to restrict the movement of polymer chain segments in the build-up film, so that the build-up film obtains a lower thermal expansion coefficient, reduces thermal expansion phenomenon, and avoids the existing carrier board warping caused by thermal expansion phenomenon and packaging structure failure caused by thermal expansion coefficient mismatch. DETAILED DESCRIPTION

[0026] The present invention provides a build-up adhesive film for FC-BGA package carriers with a low thermal expansion coefficient, as well as a preparation method and application thereof. To clarify the objectives, technical solutions, and effects of the present invention, the present invention is described in further detail below. It should be understood that the specific embodiments described herein are intended only to illustrate the present invention and are not intended to limit the present invention.

[0027] Unless otherwise defined, all technical terms and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art of the present invention. The terms used in the specification of the present invention herein are only for the purpose of describing specific embodiments and are not intended to limit the present invention.

[0028] An embodiment of the present invention provides a build-up adhesive film for a carrier board of an FC-BGA package with a low thermal expansion coefficient. The build-up adhesive film for a carrier board of an FC-BGA package with a low thermal expansion coefficient is prepared from raw materials comprising the following components, in parts by weight:

[0029] 50-60 parts of epoxy resin, 5-10 parts of phenoxy resin, 30-35 parts of curing agent, 0.1-0.5 parts of curing accelerator and 80-100 parts of functionalized silica;

[0030] The functionalized silica includes at least one of amino silica, hydroxylated silica, and carboxylated silica.

[0031] In an embodiment of the present invention, based on components such as epoxy resin, phenoxy resin, curing agent, and curing accelerator, modified fillers such as amino silica, hydroxylated silica, and carboxylated silica are introduced into the build-up film. By means of the reaction between the modified fillers and specific functional groups in the resin system of the build-up film, the energy resistance of the conformational change of the molecular segments in the mixed resin is increased, an interconnected network structure is constructed, and the movement of the polymer segments in the build-up film is restricted, so that the build-up film obtains a lower thermal expansion coefficient, reduces thermal expansion, and avoids the existing warping of the carrier board caused by thermal expansion and the failure of the packaging structure caused by the mismatch of the thermal expansion coefficient.

[0032] In this embodiment, the functionalized silica may be amino silica, hydroxylated silica, carboxylated silica, a mixture of amino silica and hydroxylated silica, a mixture of amino silica and carboxylated silica, a mixture of hydroxylated silica and carboxylated silica, or a mixture of amino silica, hydroxylated silica, and carboxylated silica. When the functionalized silica is selected from at least two of amino silica, hydroxylated silica, and carboxylated silica, the ratio of amino silica, hydroxylated silica, and carboxylated silica can be set according to actual needs.

[0033] Among them, the amino groups on silica can react with the epoxy groups in the epoxy resin, thereby improving the compatibility between silica and the resin matrix, improving the dispersibility of silica particles in the resin matrix, and constructing an interconnected network structure, thereby restricting the movement of the epoxy resin molecular segments and reducing the thermal expansion coefficient of the system; hydroxylated silica is mixed with epoxy resin and continuously reacts to form a highly cross-linked polyether structure, which uses the interconnected structure to restrict the movement of the polymer chain segments and reduce thermal expansion; the carboxyl groups of carboxylated silica can react with the epoxy groups in the epoxy resin, thereby increasing the stacking density of the molecular chain and silica. The denser the stacking, the smaller the free volume, and the movement space of the epoxy resin molecular segments is restricted, thereby reducing the thermal expansion coefficient of the system, thereby obtaining good thermal expansion performance.

[0034] In some embodiments, the particle size of the amino-silica is 600-800 nm, the particle size of the carboxylated silica is 600-800 nm, and the particle size of the hydroxylated silica is 200-300 nm. When the three are mixed and used as fillers, the bulk density of the large-particle amino-silica and hydroxylated silica is low, and there are more gaps between the fillers. After the small-particle hydroxylated silica is added, it can enter the gaps between the large-particle amino-silica and carboxylated silica, increasing the packing density of the fillers, further reducing the free space, and thus reducing the thermal expansion coefficient.

[0035] The present invention is not limited to the specific type of epoxy resin. For example, the epoxy resin can be selected from at least one of bisphenol epoxy resin, biphenyl epoxy resin, phenol epoxy resin, naphthol epoxy resin, linear phenolic epoxy resin, dicyclopentadiene epoxy resin, aralkyl phenolic epoxy resin, biphenyl aralkyl phenolic epoxy resin or naphthol phenolic epoxy resin, but is not limited thereto.

[0036] The present invention is not limited to the specific type of phenoxy resin. For example, the phenoxy resin can be selected from at least one of FX280 (Nippon Steel, Japan), FX293 (Nippon Steel, Japan), YX8100 (Mitsubishi Chemical, Japan), YX7553BH30 (Mitsubishi Chemical, Japan), YX7200B35 (Mitsubishi Chemical Corporation), and TER240C30 (Guangdong Tongyu).

[0037] In some embodiments, the curing agent includes at least one of an active ester curing agent, a carbodiimide curing agent, a phenol curing agent, a naphthol curing agent, a cyanate curing agent, and a benzoxazine curing agent, but is not limited thereto.

[0038] In some embodiments, the curing accelerator includes at least one of 1-cyanoethyl-2-ethyl-4-methylimidazole, 2-phenyl-4,5-dihydroxymethylimidazole, 2-phenyl-4-methyl-5-hydroxymethylimidazole, 2-ethyl-4-methylimidazole, 4-dimethylaminopyridine, and 2-phenylimidazole.

[0039] Of course, according to actual needs, the present invention can also add 3 to 9 parts by weight of other additives to the raw materials for preparing the low thermal expansion coefficient FC-BGA package carrier build-up adhesive film. The other additives are selected from at least one of a thickener, a defoamer, a leveling agent, a leveling agent, an adhesion-imparting agent, and a colorant.

[0040] In some embodiments, the thickener includes but is not limited to at least one of an inorganic salt thickener, a fat thickener, an alkanolamide thickener, and an ether thickener.

[0041] In some embodiments, the defoaming agent includes but is not limited to at least one of a silicone defoaming agent and a fluorine defoaming agent.

[0042] In some embodiments, the leveling agent includes but is not limited to at least one of a silicone-based leveling agent and an acrylic polymer-based leveling agent.

[0043] In some embodiments, the leveling agent includes but is not limited to at least one of polyoxyethylene alkyl ether leveling agents, polyoxyethylene alkylphenyl ether leveling agents, polyethylene glycol diester leveling agents, and sorbitan fatty acid ester leveling agents.

[0044] In some embodiments, the adhesion-imparting agent includes but is not limited to at least one of vinyltrimethoxysilane, vinyltriethoxysilane, 3-aminopropyltriethoxysilane, 3-glycidoxypropyltrimethoxysilane, and 3-glycidoxypropylmethyldimethoxysilane.

[0045] In some embodiments, the colorant includes but is not limited to at least one of phthalocyanine blue, phthalocyanine green, iodine green, disazo yellow, and carbon black.

[0046] In one embodiment, the thickness of the build-up adhesive film for the low thermal expansion coefficient FC-BGA package carrier is 10-100 μm, for example, 10, 20, 30, 40, 50, 60, 70, 80, 90 or 100 μm.

[0047] The embodiment of the present invention further provides a method for preparing a build-up adhesive film for a low thermal expansion coefficient FC-BGA package carrier, which comprises the following steps:

[0048] S1. providing a substrate;

[0049] S2. Mixing, by weight, 50-60 parts of an epoxy resin, 5-10 parts of a phenoxy resin, 30-35 parts of a curing agent, 0.1-0.5 parts of a curing accelerator, and 80-100 parts of a functionalized silica with 200-300 parts of a first organic solvent to obtain a slurry; the functionalized silica comprises at least one of amino silica, hydroxylated silica, and carboxylated silica;

[0050] S3. Transferring the slurry onto the substrate and drying it to obtain the build-up adhesive film for the FC-BGA package carrier with low thermal expansion coefficient.

[0051] The preparation method provided by the embodiment of the present invention is simple and efficient. In the process of preparing the build-up film, modified fillers such as amino silica, hydroxylated silica and carboxylated silica are introduced. With the help of the reaction between the modified fillers and specific functional groups in the resin system, an interconnected network structure is constructed to restrict the movement of the polymer chain segments in the build-up film, so that the build-up film has a lower thermal expansion coefficient and reduces thermal expansion phenomenon.

[0052] In step S1, in some embodiments, the thickness of the substrate is 10 to 150 μm, for example, 10 μm, 20 μm, 30 μm, 40 μm, 50 μm, 60 μm, 70 μm, 80 μm, 90 μm, 100 μm, 110 μm, 120 μm, 130 μm, 140 μm, or 150 μm, etc. In some specific embodiments, the thickness of the substrate is 25 to 50 μm.

[0053] The present invention does not specifically limit the choice of substrate; any commonly used substrate in the art can be used, including, but not limited to, polyethylene terephthalate (PET) release film, polyethylene film, polypropylene film, or polyvinyl chloride film. To facilitate subsequent removal of the substrate, the polyethylene film, polypropylene film, or polyvinyl chloride film can be corona treated before use.

[0054] In step S2, in some embodiments, the first organic solvent includes at least one of toluene, xylene, butanone, methyl ethyl ketone, cyclohexanone, ethyl acetate, and N,N-dimethylformamide.

[0055] In some embodiments, the method for preparing the amino-silica comprises the steps of:

[0056] The silicon dioxide is ultrasonically dispersed in water, 3-aminopropyltriethoxysilane is added, the pH of the system is adjusted to 7.3-7.8, and the reaction is carried out at a first preset temperature for a first preset time to obtain the amino silicon dioxide.

[0057] In some specific embodiments, the preparation method of the amino-silica specifically comprises the steps of:

[0058] Silica was ultrasonically dispersed in water, 3-aminopropyltriethoxysilane was added, and then the pH of the solution was adjusted to 7.5 using a buffer solution prepared from disodium hydrogen phosphate and sodium dihydrogen phosphate; the solution was stirred in a 70° C. water bath for 12 hours to obtain amino silica.

[0059] In some embodiments, the method for preparing hydroxylated silica comprises the steps of:

[0060] Adding silicon dioxide into a sodium hydroxide solution and reacting at a second preset temperature for a second preset time to obtain the hydroxylated silicon dioxide.

[0061] In some specific embodiments, the method for preparing hydroxylated silicon dioxide specifically comprises the steps of:

[0062] Add silicon dioxide into sodium hydroxide solution, stir and react at 80° C. for 2 hours to obtain the hydroxylated silicon dioxide.

[0063] In some embodiments, the method for preparing carboxylated silica comprises the steps of:

[0064] Under stirring conditions, a silane coupling agent and succinic anhydride are added to the second organic solvent, and then silicon dioxide and water are added, and stirring is continued to obtain carboxylated silicon dioxide.

[0065] In some embodiments, the second organic solvent includes but is not limited to at least one of N,N-dimethylformamide, dimethylacetamide, and acetone.

[0066] In some embodiments, the transfer method includes but is not limited to coating.

[0067] In some embodiments, the drying temperature is 80-130°C, for example, it can be 80°C, 85°C, 90°C, 95°C, 100°C, 105°C, 110°C, 115°C, 120°C, 125°C or 130°C, etc.; the drying time is 3-10 min, for example, it can be 3 min, 4 min, 5 min, 6 min, 7 min, 8 min, 9 min or 10 min, etc.

[0068] In one embodiment, the drying step further includes a post-processing step, and the post-processing method is to remove the substrate.

[0069] The embodiment of the present invention further provides a use of the build-up adhesive film for the low thermal expansion coefficient FC-BGA package carrier as described above in the embodiment of the present invention in a flip chip ball grid array package carrier.

[0070] The embodiment of the present invention further provides a use of a build-up adhesive film for a low thermal expansion coefficient FC-BGA package carrier prepared by the preparation method described above in the embodiment of the present invention in a flip chip ball grid array package carrier.

[0071] An embodiment of the present invention also provides a build-up adhesive film for a low thermal expansion coefficient FC-BGA package carrier as described above in the embodiment of the present invention, and the use of the build-up adhesive film for a low thermal expansion coefficient FC-BGA package carrier prepared by the preparation method described above in the embodiment of the present invention in a flip chip ball grid array package carrier.

[0072] The present invention introduces modified fillers such as amino silica, hydroxylated silica and carboxylated silica into the build-up film. By means of the reaction between the modified fillers and specific functional groups in the resin system, an interconnected network structure is constructed to restrict the movement of polymer chain segments in the build-up film, so that the build-up film has a lower thermal expansion coefficient, reduces thermal expansion, and meets the application of the build-up film in FC-BGA packaging carrier boards.

[0073] The following describes it in detail through specific examples.

[0074] The sources of some raw materials in the following examples and comparative examples are as follows:

[0075] Epoxy resins: bisphenol A epoxy resin (Mitsubishi Chemical Corporation's "828US"), biphenyl epoxy resin (Nippon Kayaku Corporation's "NC3000L"), and biphenyl aralkyl epoxy resin (Mitsubishi Chemical Corporation's "YX4000HK").

[0076] Phenoxy resin: "YL7553BH30" from Mitsubishi Chemical Corporation;

[0077] Curing agent: active ester curing agent (DIC Corporation's "HPC-8000-65T"), carbodiimide curing agent (Nisshinbo Chemical Co., Ltd.'s "V-03"), phenol curing agent (Meiwa Chemical Co., Ltd.'s "LA-3018-50P");

[0078] Curing accelerator: 4-dimethylaminopyridine (CAS No. 1122-58-3);

[0079] Inorganic fillers: silica (CAS No. 7631-86-9, no functional group on the surface), boron nitride (CAS No. 10043-11-5), amino silica, hydroxylated silica, and carboxylated silica.

[0080] The preparation method of the amino silica used in the following examples is as follows: 3 g of silica was added to 300 mL of deionized water, ultrasonically dispersed at room temperature for 30 minutes, and after the particles were evenly dispersed, 3 mL of 3-aminopropyltriethoxysilane was added to the solution, and then the pH of the solution system was adjusted to 7.5 using a buffer solution prepared from disodium hydrogen phosphate and sodium dihydrogen phosphate; the solution was transferred to a three-necked flask and stirred in a 70°C water bath for 12 hours. After the reaction, the nanoparticles were separated from the solvent by a centrifuge, repeatedly washed with deionized water three times, and dried in a vacuum drying oven at 120°C for 24 hours to remove moisture to obtain amino silica with a particle size of 600 nm.

[0081] The preparation method of hydroxylated silica used in the following examples is as follows: 10 g of silica was added to 500 mL of 5 wt% sodium hydroxide solution, heated in a water bath at 80°C with rapid stirring for 2 hours, and then cooled to room temperature. The residual sodium hydroxide was washed with deionized water, and the resulting product was dried at 60°C for 12 hours to obtain hydroxylated silica with a particle size of 300 nm.

[0082] The preparation method of carboxylated silica used in the following examples is as follows: 1 g of silane coupling agent KH550 and 1 g of succinic anhydride are uniformly dispersed in 500 mL of N,N-dimethylformamide, stirred for 3 h, 5 g of silica is added thereto, and 100 mL of deionized water is added thereto, and stirring is continued for 5 h. After stirring, the mixture is washed with anhydrous ethanol and deionized water, and dried at 60° C. for 12 h to obtain carboxylated silica with a particle size of 800 nm.

[0083] When amino silica, hydroxylated silica, and carboxylated silica are used, the amounts of the raw materials in the above preparation method can be increased or decreased in proportion according to the specific amounts used.

[0084] Example 1

[0085] This embodiment provides a build-up adhesive film for a low thermal expansion coefficient FC-BGA package carrier board. The raw materials of the build-up adhesive film for a low thermal expansion coefficient FC-BGA package carrier board include, by weight:

[0086] 10 parts of bisphenol A type epoxy resin (828US), 25 parts of biphenyl type epoxy resin (NC3000L), 25 parts of biphenyl aralkyl type epoxy resin (YX4000HK), 6 parts of phenoxy resin (YL7553BH30), 13 parts of active ester curing agent (HPC-8000-65T), 10 parts of carbodiimide curing agent (V-03), 7.5 parts of phenol curing agent (LA-3018-50P), 0.3 parts of 4-dimethylaminopyridine, 100 parts of amino silica and 300 parts of cyclohexanone.

[0087] The preparation method of the build-up film for the low thermal expansion coefficient FC-BGA package carrier is as follows:

[0088] The raw material components of the build-up film for the FC-BGA package carrier with low thermal expansion coefficient were mixed uniformly according to the above proportions, and then coated on a PET release film. After drying at 80°C for 10 minutes, the PET release film was removed to obtain a build-up film for the FC-BGA package carrier with low thermal expansion coefficient having a thickness of 100 μm.

[0089] Example 2

[0090] This embodiment provides a build-up adhesive film for a low thermal expansion coefficient FC-BGA package carrier board. The raw materials of the build-up adhesive film for a low thermal expansion coefficient FC-BGA package carrier board include, by weight:

[0091] 10 parts of bisphenol A type epoxy resin (828US), 25 parts of biphenyl type epoxy resin (NC3000L), 25 parts of biphenyl aralkyl type epoxy resin (YX4000HK), 10 parts of phenoxy resin (YL7553BH30), 13 parts of active ester curing agent (HPC-8000-65T), 10 parts of carbodiimide curing agent (V-03), 12 parts of phenol curing agent (LA-3018-50P), 0.5 parts of 4-dimethylaminopyridine, 100 parts of hydroxylated silica and 300 parts of cyclohexanone.

[0092] The preparation method of the build-up film for the low thermal expansion coefficient FC-BGA package carrier is as follows:

[0093] The raw material components of the build-up film for the FC-BGA package carrier with a low thermal expansion coefficient are mixed uniformly according to the above proportions, and then coated on a PET release film. After drying at 130°C for 3 minutes, the PET release film is removed to obtain a build-up film for the FC-BGA package carrier with a low thermal expansion coefficient having a thickness of 10 μm.

[0094] Example 3

[0095] This embodiment provides a build-up adhesive film for a low thermal expansion coefficient FC-BGA package carrier board. The raw materials of the build-up adhesive film for a low thermal expansion coefficient FC-BGA package carrier board include, by weight:

[0096] 10 parts of bisphenol A type epoxy resin (828US), 20 parts of biphenyl type epoxy resin (NC3000L), 20 parts of biphenyl aralkyl type epoxy resin (YX4000HK), 5 parts of phenoxy resin (YL7553BH30), 13 parts of active ester curing agent (HPC-8000-65T), 10 parts of carbodiimide curing agent (V-03), 7 parts of phenol curing agent (LA-3018-50P), 0.1 parts of 4-dimethylaminopyridine, 80 parts of carboxylated silica and 200 parts of cyclohexanone.

[0097] The preparation method of the build-up film for the low thermal expansion coefficient FC-BGA package carrier is as follows:

[0098] The raw material components of the build-up film for the FC-BGA package carrier with a low thermal expansion coefficient were mixed uniformly in the above proportions, coated on a PET release film, dried at 110°C for 5 minutes, and then the PET release film was removed to obtain a build-up film for the FC-BGA package carrier with a low thermal expansion coefficient having a thickness of 40 μm.

[0099] Example 4

[0100] This embodiment provides a build-up adhesive film for a low thermal expansion coefficient FC-BGA package carrier board. The raw materials of the build-up adhesive film for a low thermal expansion coefficient FC-BGA package carrier board include, by weight:

[0101] 10 parts of bisphenol A epoxy resin (828US), 25 parts of biphenyl epoxy resin (NC3000L), 25 parts of biphenyl aralkyl epoxy resin (YX4000HK), 6 parts of phenoxy resin (YL7553BH30), 13 parts of active ester curing agent (HPC-8000-65T), 10 parts of carbodiimide curing agent (V-03), 7.5 parts of phenol curing agent (LA-3018-50P), 0.3 parts of 4-dimethylaminopyridine, 60 parts of amino silica, 40 parts of carboxylated silica and 300 parts of cyclohexanone.

[0102] The preparation method of the build-up film for the low thermal expansion coefficient FC-BGA package carrier is as follows:

[0103] The raw material components of the build-up film for the FC-BGA package carrier with low thermal expansion coefficient were mixed uniformly according to the above proportions, and then coated on a PET release film. After drying at 80°C for 10 minutes, the PET release film was removed to obtain a build-up film for the FC-BGA package carrier with low thermal expansion coefficient having a thickness of 100 μm.

[0104] Example 5

[0105] This embodiment provides a build-up adhesive film for a low thermal expansion coefficient FC-BGA package carrier board. The raw materials of the build-up adhesive film for a low thermal expansion coefficient FC-BGA package carrier board include, by weight:

[0106] 10 parts of bisphenol A epoxy resin (828US), 25 parts of biphenyl epoxy resin (NC3000L), 25 parts of biphenyl aralkyl epoxy resin (YX4000HK), 6 parts of phenoxy resin (YL7553BH30), 13 parts of active ester curing agent (HPC-8000-65T), 10 parts of carbodiimide curing agent (V-03), 7.5 parts of phenol curing agent (LA-3018-50P), 0.3 parts of 4-dimethylaminopyridine, 30 parts of amino silica, 40 parts of hydroxylated silica, 30 parts of carboxylated silica and 300 parts of cyclohexanone.

[0107] The preparation method of the build-up film for the low thermal expansion coefficient FC-BGA package carrier is as follows:

[0108] The raw material components of the build-up film for the FC-BGA package carrier with low thermal expansion coefficient were mixed uniformly according to the above proportions, and then coated on a PET release film. After drying at 80°C for 10 minutes, the PET release film was removed to obtain a build-up film for the FC-BGA package carrier with low thermal expansion coefficient having a thickness of 100 μm.

[0109] Comparative Example 1

[0110] This comparative example provides a build-up adhesive film for an FC-BGA package carrier and a preparation method thereof. The only difference from Example 1 is that 100 parts of amino-silica are replaced with 100 parts of silicon dioxide (CAS No. 7631-86-9). Other conditions are the same as those in Example 1.

[0111] Comparative Example 2

[0112] This comparative example provides a build-up adhesive film for an FC-BGA package carrier and a preparation method thereof. The only difference from Example 1 is that 100 parts of amino-treated silicon dioxide are replaced with 100 parts of boron nitride (CAS No. 10043-11-5). Other conditions are the same as those in Example 1.

[0113] The performance of the build-up films for FC-BGA package carriers in the above embodiments and comparative examples was tested using the following method:

[0114] Thermal Expansion Coefficient: The build-up adhesive film for the FC-BGA package carrier with the PET release film provided in the above embodiments and comparative examples was first cured at 100°C for 30 minutes and then at 190°C for 90 minutes. The release film was then peeled off to obtain a test sample. The test sample was cut into test pieces with a width of approximately 3 mm and a length of approximately 20 mm. Thermomechanical analysis was performed using a thermomechanical analyzer ("TMA450" from TA Company, USA) under the conditions of a preload force of 0.02 N, a temperature rise range of 25°C to 260°C, and a temperature rise rate of 10°C / min. The temperature was increased twice to obtain the thermal expansion coefficient in the range of 25°C to 150°C in the second temperature rise curve.

[0115] Evaluation of warpage height: The FC-BGA package carriers with PET release films provided in the above examples and comparative examples were cut into 300×300 mm samples with build-up film. The samples were then pressed onto a 35 μm thick copper foil using a vacuum laminator. The samples were first cured at 100°C for 30 minutes and then at 190°C for 90 minutes. After cooling to room temperature, the samples were placed horizontally on a flat marble table and the maximum warpage value (in mm) was observed.

[0116] The test results are shown in Table 1 below.

[0117] Table 1 Test results

[0118]

[0119]

[0120] From the above results, it can be seen that the build-up adhesive film for FC-BGA package carrier provided by the present invention has a lower thermal expansion coefficient and warpage height.

[0121] It should be understood that the application of the present invention is not limited to the above examples. For those skilled in the art, improvements or changes can be made based on the above description. All these improvements and changes should fall within the scope of protection of the claims attached to the present invention.

Claims

1. A low thermal expansion coefficient FC-BGA package carrier build-up film, characterized in that: The low thermal expansion coefficient FC-BGA package carrier build-up adhesive film is prepared from raw materials including the following components in parts by weight: 50-60 parts of epoxy resin, 5-10 parts of phenoxy resin, 30-35 parts of curing agent, 0.1-0.5 parts of curing accelerator and 80-100 parts of functionalized silica; The functionalized silica includes amino silica, hydroxylated silica and carboxylated silica; or, the functionalized silica includes amino silica and carboxylated silica; The preparation method of the amino silicon dioxide comprises the steps of: Ultrasonic dispersion of silicon dioxide in water, addition of 3-aminopropyltriethoxysilane, adjustment of the pH of the system to 7.3-7.8, and reaction at a first preset temperature for a first preset time to obtain the amino silicon dioxide. The preparation method of the hydroxylated silicon dioxide comprises the steps of: adding silicon dioxide to a sodium hydroxide solution, reacting at a second preset temperature for a second preset time to obtain the hydroxylated silicon dioxide; The preparation method of the carboxylated silicon dioxide comprises the steps of: Under stirring conditions, a silane coupling agent and succinic anhydride are added to a second organic solvent, followed by silica and water, and the mixture is continuously stirred to obtain carboxylated silica; The particle size of the amino-silica is 600-800 nm, the particle size of the hydroxy-silica is 200-300 nm, and the particle size of the carboxy-silica is 600-800 nm.

2. The low thermal expansion coefficient build-up adhesive film for FC-BGA package carrier according to claim 1, characterized in that: The curing agent includes at least one of an active ester curing agent, a carbodiimide curing agent, a phenol curing agent, a naphthol curing agent, a cyanate curing agent, and a benzoxazine curing agent.

3. The low thermal expansion coefficient build-up adhesive film for FC-BGA package carrier according to claim 1, characterized in that: The curing accelerator includes at least one of 1-cyanoethyl-2-ethyl-4-methylimidazole, 2-phenyl-4,5-dihydroxymethylimidazole, 2-phenyl-4-methyl-5-hydroxymethylimidazole, 2-ethyl-4-methylimidazole, 4-dimethylaminopyridine, and 2-phenylimidazole.

4. A method for preparing a build-up adhesive film for a low thermal expansion coefficient FC-BGA package carrier, characterized in that: Including steps: providing a substrate; By weight, 50 to 60 parts of epoxy resin, 5 to 10 parts of phenoxy resin, 30 to 35 parts of curing agent, 0.1 to 0.5 parts of curing accelerator and 80 to 100 parts of functionalized silica are mixed with 200 to 300 parts of a first organic solvent to obtain a slurry; the functionalized silica includes amino silica, hydroxylated silica and carboxylated silica; or the functionalized silica includes amino silica and carboxylated silica; Transferring the slurry onto the substrate and drying it to obtain the build-up adhesive film for the FC-BGA package carrier with low thermal expansion coefficient; The preparation method of the amino silicon dioxide comprises the steps of: Ultrasonic dispersion of silicon dioxide in water, addition of 3-aminopropyltriethoxysilane, adjustment of the pH of the system to 7.3-7.8, and reaction at a first preset temperature for a first preset time to obtain the amino silicon dioxide. The preparation method of the hydroxylated silicon dioxide comprises the steps of: Adding silicon dioxide to sodium hydroxide solution and reacting at a second preset temperature for a second preset time to obtain the hydroxylated silicon dioxide The preparation method of the carboxylated silicon dioxide comprises the steps of: Under stirring conditions, a silane coupling agent and succinic anhydride are added to the second organic solvent, and then silicon dioxide and water are added, and stirring is continued to obtain carboxylated silicon dioxide.

5. The preparation method according to claim 4, characterized in that The first organic solvent comprises at least one of toluene, xylene, butanone, methyl ethyl ketone, cyclohexanone, ethyl acetate, and N,N-dimethylformamide; The second organic solvent includes at least one of N,N-dimethylformamide, dimethylacetamide, and acetone.

6. Use of a build-up adhesive film for a low thermal expansion coefficient FC-BGA package carrier according to any one of claims 1 to 3 and / or a build-up adhesive film for a low thermal expansion coefficient FC-BGA package carrier prepared by the preparation method according to claim 4 in a flip chip ball grid array package carrier.

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