A method and device for determining installation pre-pressure of a domain controller and related products

Abstract

The application discloses a kind of domain controller installation pre-pressure determination method, device and related product.The method comprises: the target rebound force of conductive glue is obtained, and the target locking force for locking target domain controller is obtained, then it is judged whether target rebound force is greater than the target locking force, if yes, according to the maximum rebound force and the target locking force, determine the target pre-pressure of installing the target controller. Wherein, since conductive glue has certain elasticity, it can cause locking part to not lock domain controller, therefore, additional pressure is needed to assist locking part to lock domain controller, by judging the size of the rebound force of conductive glue and the locking force of locking part, further determine the pre-pressure required, realize locking domain controller, guarantee the safety and reliability of domain controller.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of domain controller installation, in particular to a method and device for determining installation pre-pressure of a domain controller and related products. BACKGROUND

[0002] At present, the domain controller is one of important components for realizing intelligentization in the field of automobiles, which can manage network and identity security. However, with the increasing complexity of functions realized by the domain controller, the transmitting power of the corresponding chip signal is also increasing. In order to realize electromagnetic shielding, the domain controller will adopt conductive glue to realize electromagnetic shielding during installation. However, since the conductive glue has a certain elasticity, it is possible that the locking part cannot lock the domain controller due to the excessive elasticity of the conductive glue during the installation process of the domain controller.

[0003] Therefore, how to lock the domain controller is a technical problem to be solved by those skilled in the art. SUMMARY

[0004] In view of the above problems, the present application provides a method and device for determining installation pre-pressure of a domain controller and related products to realize locking of the domain controller.

[0005] The embodiments of the present application disclose the following technical solutions:

[0006] In a first aspect, the embodiments of the present application provide a method for determining installation pre-pressure of a domain controller, which comprises:

[0007] obtaining a target rebound force of conductive glue; the conductive glue is arranged between an upper cover plate and a lower cover plate of a target domain controller;

[0008] obtaining a target locking force for locking the target domain controller;

[0009] determining whether the target rebound force is greater than the target locking force;

[0010] if the target rebound force is greater than the target locking force, determining a target pre-pressure for installing the target controller according to the maximum rebound force and the target locking force.

[0011] Optionally, the method for obtaining the target rebound force of the conductive glue comprises:

[0012] determining the target rebound force of the conductive glue according to a material height of the conductive glue and a target limiting height.

[0013] Optionally, the method for obtaining the target limiting height comprises:

[0014] obtaining a material height, a maximum limit compression amount and a minimum limit compression amount of the conductive glue;

[0015] determining a target compression amount according to the maximum limit compression amount and the minimum limit compression amount;

[0016] determining a target limit height according to the material height and the target compression amount.

[0017] Optionally, the determining a target limit height according to the material height and the target compression amount comprises:

[0018] determining a first limit height according to the material height and the target compression amount;

[0019] judging whether the first limit height meets a preset limit standard;

[0020] if yes, taking the first limit height as a target limit height;

[0021] if no, determining a second limit height according to the first limit height, and judging whether the second limit height meets the preset limit standard until the second limit height meets the preset limit standard, and taking the second limit height as the target limit height.

[0022] Optionally, the obtaining a target locking force for locking the target domain controller comprises:

[0023] determining a minimum locking force of a single locking part for locking the target domain controller;

[0024] the judging whether the target rebound force is greater than the target locking force comprises:

[0025] judging whether the target rebound force is greater than the minimum locking force.

[0026] Optionally, before the judging whether the target rebound force is greater than the target locking force, the method further comprises:

[0027] obtaining a total number of locking parts;

[0028] determining a target total locking force according to the minimum locking force and the total number;

[0029] judging whether the target total locking force is greater than the target rebound force;

[0030] if the target total locking force is greater than the target rebound force, performing a subsequent step;

[0031] if the target total locking force is less than the target rebound force, replacing conductive glue or locking parts.

[0032] Optionally, the obtaining mode of the conductive glue comprises:

[0033] Obtain the maximum rebound force and the resistivity of the conductive glue; the conductive glue is arranged between the upper cover plate and the lower cover plate of the target domain controller;

[0034] Determine whether the maximum rebound force and the resistivity meet the first selection criterion, respectively;

[0035] If the maximum rebound force and the resistivity both meet the first selection criterion, age the conductive glue, and determine the maximum aged rebound force and the target aged resistivity of the aged conductive glue;

[0036] Determine whether the maximum aged rebound force and the target aged resistivity meet the second selection criterion, respectively;

[0037] If the maximum aged rebound force and the target aged resistivity both meet the second selection criterion, take the conductive glue as the target conductive glue; the target conductive glue is the conductive glue to be replaced when the target total locking force is less than the target rebound force.

[0038] In a second aspect, an embodiment of the present application provides a device for determining installation pre-pressure of a domain controller, and the device comprises:

[0039] A first obtaining module is configured to obtain a target rebound force of conductive glue; the conductive glue is arranged between an upper cover plate and a lower cover plate of a target domain controller;

[0040] A second obtaining module is configured to obtain a target locking force for locking the target domain controller;

[0041] A judging module is configured to determine whether the target rebound force is greater than the target locking force;

[0042] A pre-pressure determining module is configured to, if the target rebound force is greater than the target locking force, determine a target pre-pressure for installing the target controller according to the maximum rebound force and the target locking force.

[0043] In a third aspect, an embodiment of the present application provides a computer device, which comprises a memory, a processor, and a computer program stored in the memory and executable on the processor; when the processor executes the computer program, the installation pre-pressure determining method of the domain controller is implemented.

[0044] In a fourth aspect, an embodiment of the present application provides a computer readable storage medium, which stores instructions; when the instructions are executed on a terminal device, the terminal device executes the installation pre-pressure determining method of the domain controller.

[0045] Compared with the prior art, the application has the following beneficial effects: the application obtains the target rebound force of the conductive glue and the target locking force for locking the target domain controller, and then judges whether the target rebound force is greater than the target locking force, and if so, determines the target pre-pressing force for installing the target controller according to the maximum rebound force and the target locking force. Since the conductive glue has a certain elasticity, it may cause the locking part to fail to lock the domain controller, and therefore, additional pressure is needed to assist the locking part in locking the domain controller. By judging the rebound force of the conductive glue and the locking force of the locking part, the required pre-pressing force is further determined, the domain controller is locked, and the safety and reliability of the domain controller are ensured. BRIEF DESCRIPTION OF DRAWINGS

[0046] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the drawings needed to be used in the embodiments or the prior art description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor.

[0047] Figure 1 A partial cross-sectional view of a domain controller containing conductive glue is provided for the embodiments of the present application.

[0048] Figure 2 A schematic diagram of the pre-pressing force pressing direction is provided for the embodiments of the present application.

[0049] Figure 3 A flowchart of a method for determining the installation pre-pressing force of a domain controller is provided for the embodiments of the present application.

[0050] Figure 4 A partial cross-sectional view of a domain controller is provided for the embodiments of the present application.

[0051] Figure 5 A flowchart of the selection of conductive glue for a domain controller is provided for the embodiments of the present application.

[0052] Figure 6 A structural schematic diagram of a device for determining the installation pre-pressing force of a domain controller is provided for the embodiments of the present application. DETAILED DESCRIPTION

[0053] As described above, in the research on the installation of domain controllers, it is found that at present, the domain controller is one of the important components for realizing intelligentization in the automotive field, which can manage network and identity security. However, as the functions realized by the domain controller become more and more complex, the transmission power of the corresponding chip signal also becomes larger and larger. In order to realize electromagnetic shielding, the domain controller will use conductive glue to realize electromagnetic shielding during installation.

[0054] Referring to Figure 1 , the figure is a schematic diagram of a part of a domain controller containing conductive glue provided by an embodiment of the present application, in combination with Figure 1 , A is conductive glue, B is the upper cover plate of the domain controller, C is a PCB (Printed Circuit Board, also known as a printed wiring board), D is the lower cover plate of the domain controller, and E is a locking part used to lock the domain controller. Since A has a certain elasticity, when E locks B and D, E may not be able to lock B and D, which will further cause the domain controller to fail to achieve electromagnetic shielding, or reduce the safety and reliability of the domain controller.

[0055] To solve the above problems, an installation pre-pressure determination method, device and related product of a domain controller are provided by embodiments of the present application. The method comprises: obtaining a target rebound force of conductive glue and a target locking force of a locking part used to lock a target domain controller, then determining whether the target rebound force is greater than the target locking force, and if so, determining a target pre-pressure for installing the target controller according to the maximum rebound force and the target locking force.

[0056] In this way, since the conductive glue has a certain elasticity, it may cause the locking part to fail to lock the domain controller, so additional pressure is needed to assist the locking part in locking the domain controller. By determining the rebound force of the conductive glue and the locking force of the locking part, the required pre-pressure is further determined, the domain controller is locked, and the safety and reliability of the domain controller are ensured. The target rebound force of the conductive glue and the target locking force of the locking part used to lock the target domain controller are obtained, then it is determined whether the target rebound force is greater than the target locking force, and if so, the target pre-pressure for installing the target controller is determined according to the maximum rebound force and the target locking force. Since the conductive glue has a certain elasticity, it may cause the locking part to fail to lock the domain controller, so additional pressure is needed to assist the locking part in locking the domain controller. By determining the rebound force of the conductive glue and the locking force of the locking part, the required pre-pressure is further determined, the domain controller is locked, and the safety and reliability of the domain controller are ensured.

[0057] Meanwhile, the following points need to be explained in the present application:

[0058] A1: Referring to Figure 2 , the figure is a schematic diagram of the pre-pressure pressing direction provided by an embodiment of the present application, in combination with Figure 2 , in the following embodiments, the pre-pressure (which can also be referred to as the installation pre-pressure) means the pressure applied to the domain controller before the locking part locks the domain controller. The pre-pressure can be provided by pressing a pressure device or a weight on the upper cover plate of the domain controller, and specific details can be found in Figure 2The direction of D1 in the figure; the upper cover plate and the lower cover plate can also be pressed by a pressure device respectively to provide a pre-pressure, which can be seen in detail from Figure 2 The directions of D1 and D2 in the figure.

[0059] A2: The method of the present application can be applied to a domain controller, and can also be applied to a machine / container / airtight container containing elastic material that needs to be locked, and changes or substitutions that can be easily thought of by those skilled in the art are within the protection scope of the present application.

[0060] A3: The locking part described in the following embodiments means a part for locking a domain controller, which can be a screw, a locking ring, a locking structure, etc., but the locking part is not specifically limited, and the foregoing examples are not used as the basis for limiting the protection scope of the present application.

[0061] A4: The conductive glue described in the following embodiments is an adhesive that has a certain conductivity after curing or drying, which can connect various conductive materials together to form an electrical path between the connected materials.

[0062] In order for those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the accompanying drawings of the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, not all. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor are within the protection scope of the present application.

[0063] Referring to Figure 3 , the figure is a flowchart of a method for determining the installation pre-pressure of a domain controller provided by an embodiment of the present application, and in combination with Figure 3 , the method for determining the installation pre-pressure of a domain controller provided by an embodiment of the present application can include the following steps.

[0064] S301: Obtain a target rebound force of conductive glue.

[0065] In the embodiment, the conductive glue is arranged between the upper cover plate and the lower cover plate of the target domain controller, which can be seen in detail from Figure 1 .

[0066] The target rebound force means the rebound force of the conductive glue when compressed from a natural height to a limit height, or the rebound force of the conductive glue when compressed from a natural height to an actual height, or the maximum rebound force of the conductive glue obtained by calculation. It should be noted that in the embodiments of the present application, the target rebound force can be the maximum rebound force or the rebound force under other conditions, which is not specifically limited herein.

[0067] It should be noted that in the embodiments of the present application, the target rebound force of the conductive adhesive is obtained, and the force borne by the locking part when locking the target domain controller is determined.

[0068] S302: Obtain a target locking force for locking the target domain controller.

[0069] The target locking force means the force required by the locking part to lock the target domain controller, which can be the maximum locking force, the minimum locking force, or the average of the maximum locking force and the minimum locking force required to lock the target domain controller, and is not limited in particular.

[0070] It should be noted that the target locking force is further obtained based on the target rebound force obtained in step S301. Since the conductive adhesive has elasticity, when the target rebound force is greater than the target locking force, the locking part will not be able to lock the domain controller, and therefore it is necessary to determine the size relationship between the target rebound force and the target locking force.

[0071] S303: Determine whether the target rebound force is greater than the target locking force.

[0072] It should be noted that by determining the size relationship between the target rebound force and the target locking force, it can be determined whether additional pre-pressing force is required to assist the locking part in locking the domain controller when locking the target domain controller.

[0073] S304: If the target rebound force is greater than the target locking force, determine a target pre-pressing force for installing the target controller according to the maximum rebound force and the target locking force.

[0074] It should be noted that when the target rebound force is greater than the target locking force, it indicates that pre-pressing force is required to assist the locking part in locking the domain controller; when the target rebound force is equal to the target locking force, it indicates that no pre-pressing force is required, and the locking part can lock the domain controller.

[0075] The method for determining the pre-pressing force for installing the domain controller provided in the embodiments of the present application obtains the target rebound force of the conductive adhesive and the target locking force for locking the target domain controller, and then determines whether the target rebound force is greater than the target locking force. If so, a target pre-pressing force for installing the target controller is determined according to the maximum rebound force and the target locking force. Since the conductive adhesive has a certain elasticity, it can cause the locking part to be unable to lock the domain controller, and therefore additional pre-pressing force is required to assist the locking part in locking the domain controller. By determining the size of the rebound force of the conductive adhesive and the locking force of the locking part, the required pre-pressing force is further determined, the domain controller is locked, and the safety and reliability of the domain controller are ensured.

[0076] Based on the installation pre-pressing force determination method of the domain controller provided in the above embodiment, since the inner surface of the domain controller is not a completely flat plane during installation, and may have grooves or plate surface differences, when the locking part locks the domain controller, different locking forces may cause the surface of the domain controller to be uneven, and may also cause the conductive glue to be excessively deformed, thereby reducing the safety and reliability of the domain controller.

[0077] Referring to Figure 4 , the figure is a schematic diagram of a partial section of a domain controller provided in an embodiment of the application, in combination Figure 4 , N1 is conductive glue, N2 is a water-cooled plate, N3 is a PCB circuit board, N4 is a bottom shell, and H represents the absolute difference between the highest position and the lowest position of the inner surface of N2 or N4. Since the inner surfaces of N2 and N4 are not flat surfaces, the inner plane has a certain height difference, which is used as a compression limit. Since the domain controller is locked, if it is locked too tightly, it may cause damage to the conductive glue, or if the locking force is not enough, it may cause the domain controller to be unable to be sealed, thereby reducing the safety and reliability of the domain controller; therefore, a reasonable limit height needs to be set to ensure the safety and reliability of the domain controller.

[0078] Therefore, as a realizable implementation, in order to improve the safety and reliability of the domain controller, step S301 can specifically be: determining a target rebound force of the conductive glue according to a material height of the conductive glue and a target limit height.

[0079] It should be noted that the target limit height means the height of the conductive glue after being compressed during installation of the domain controller; and the material height means the natural height of the conductive glue before being compressed.

[0080] In the embodiment, by obtaining the material height of the conductive glue and the target limit height, the rebound force of the conductive glue after being compressed to the target limit height can be determined, so that the conductive glue is not excessively compressed, and the safety and reliability of the domain controller are improved.

[0081] In order to further illustrate the determination method of the target limit height, in a realizable implementation, the obtaining method of the target limit height can specifically include:

[0082] B1: obtaining a material height, a maximum limit compression amount, and a minimum limit compression amount of the conductive glue.

[0083] Among them, the maximum limit compression amount means the maximum value of the compressible conductive glue obtained by theoretical calculation; and the minimum limit compression amount is the critical compression amount of the conductive glue obtained by theoretical calculation, that is, the compression amount corresponding to the rebound force of the conductive glue.

[0084] It should be noted that by determining the maximum limit compression amount and the minimum limit compression amount of the conductive glue, the allowable compression range of the conductive glue can be determined, and the set limit height is prevented from exceeding the range.

[0085] B2: determining a target compression amount according to the maximum limit compression amount and the minimum limit compression amount.

[0086] The target compression amount means a compression amount within the range of the maximum limit compression amount and the minimum limit compression amount, which can be, for example, the average of the maximum limit compression amount and the minimum limit compression amount, or other values.

[0087] B3: determining a target limit height according to the material height and the target compression amount.

[0088] The target limit height of the domain controller during installation can be determined according to the material height of the conductive glue and the target compression amount, and the compression degree of the conductive glue can be determined by determining the target limit height, and the target rebound force of the conductive glue is further determined, thereby improving the safety and reliability of the domain controller.

[0089] As an implementable embodiment, the above step B3 can specifically include:

[0090] C1: determining a first limit height according to the material height and the target compression amount.

[0091] The first limit height means the compression height of the compressed conductive glue, and since the first limit height is calculated, it needs to be verified to determine whether the first limit height is available.

[0092] C2: determining whether the first limit height meets a preset limit standard.

[0093] The preset limit standard means a standard for determining whether the first limit height is qualified, and in an implementable embodiment, the preset limit standard can be specifically: determining the actual maximum compression amount and the actual minimum compression amount of the conductive glue at the first limit height, and comparing the actual maximum compression amount with the maximum limit compression amount and comparing the actual minimum compression amount with the minimum limit compression amount, determining whether the actual maximum compression amount is less than the maximum limit compression amount and whether the actual minimum compression amount is greater than the minimum limit compression amount, thereby determining whether the first limit height is qualified. It should be noted that the actual compression amount means the actual maximum or minimum compression amount at the first limit height, which can be understood as an actual value; the limit compression amount can be understood as a calculated theoretical value. By judging the limit height by the preset limit standard, the determined limit height can be more accurate, and the actual requirements are avoided.

[0094] C3: if yes, the first limit height is taken as the target limit height.

[0095] C4: If no, the second limiting height is determined according to the first limiting height, and whether the second limiting height meets the preset limiting standard is determined until the second limiting height meets the preset limiting standard, and the second limiting height is taken as the target limiting height.

[0096] It should be noted that when the first limiting height does not meet the preset limiting standard, the value of the limiting height can be further adjusted to obtain the second limiting height, and the second limiting height is further determined according to the above determination of the first limiting height until the target limiting height is determined.

[0097] Based on the determination process of the target limiting height provided in the above embodiment, in order to further improve the accuracy of the target limiting height, in this embodiment, the error, that is, the tolerance of the conductive adhesive and the tolerance of the limiting height, is also considered. The specific determination process of the target limiting height can be:

[0098] D1: Determine the maximum limit compression amount X and the minimum limit compression amount Y of the conductive adhesive.

[0099] D2: Determine the target compression amount Z of the conductive adhesive according to X and Y, which can be specifically

[0100] D3: Determine the material height D and the tolerance ΔD of the conductive adhesive, and the tolerance ΔH of the limiting height.

[0101] D4: Determine the first limiting height H1 according to Z, D, ΔD and ΔH, which can be specifically

[0102] D5: Determine the actual maximum compression amount X1 and the actual minimum compression amount Y1 of the conductive adhesive under H1, which can be specifically

[0103] D6: Determine whether X1 is less than X and Y1 is greater than Y. If yes, the first limiting height is taken as the target limiting height.

[0104] D7: If no, adjust the first limiting height and repeat D3-D6 until the target limiting height is obtained.

[0105] Based on the installation pre-pressure determination method of the domain controller provided in the above embodiment, since there is more than one locking part for locking the domain controller, in an implementable embodiment, the step S302 can specifically include: determining the minimum locking force of a single locking part for locking the target domain controller.

[0106] Correspondingly, the step S303 specifically can include: judging whether the target rebound force is greater than the minimum locking force.

[0107] It should be noted that, since the locking parts of the domain controller are not only one, in the embodiment, the locking forces of all the locking parts are set to the same value, thus, only the minimum locking force of a single locking part needs to be considered to determine whether the pre-pressing force is needed, and the value of the pre-pressing force can be determined more accurately, and the accuracy of the pre-pressing force is improved.

[0108] Further, in another implementable embodiment, the locking forces of all the locking parts also need to be considered to improve the efficiency of the determined pre-pressing force, thus, before the step S303, the method can further include:

[0109] E1: obtaining the total number of locking parts.

[0110] E2: determining a target total locking force according to the minimum locking force and the total number.

[0111] E3: judging whether the target total locking force is greater than the target rebound force.

[0112] E4: if the target total locking force is greater than the target rebound force, performing the subsequent step.

[0113] E5: if the target total locking force is less than the target rebound force, replacing the conductive glue or the locking part.

[0114] It should be noted that, in the embodiment, through the judgment of the locking forces of all the locking parts, a rough judgment can be performed before the judgment of a single locking part, that is, whether the locking forces of all the locking parts can lock the domain controller, if not, the conductive glue with a smaller rebound force or the locking part with a larger locking force needs to be replaced, the judgment process is simple and convenient, and the efficiency of the determination of the pre-pressing force is improved.

[0115] Based on the installation pre-pressing force determination method of the domain controller provided in the above embodiment, in the process of determining the pre-pressing force, not only the locking force of the locking part needs to be considered, but also the rebound force of the conductive glue needs to be considered, however, the rebound forces of different conductive glues are different, and the qualities are also different, thus, before the determination of the pre-pressing force, the conductive glue meeting the standard also needs to be selected, thus, referring to Figure 5 , which is a flowchart of the selection of the conductive glue of the domain controller provided in the embodiment of the application, in combination with Figure 5 , the acquisition process of the conductive glue specifically can include:

[0116] S501: obtaining the maximum rebound force and the resistivity of the conductive glue.

[0117] The conductive glue is arranged between the upper cover plate and the lower cover plate of the target domain controller.

[0118] The maximum rebound force refers to the elastic force generated by the conductive glue under the maximum pressure.

[0119] The resistivity refers to the resistance of the conductive glue when the current flows.

[0120] In the embodiment, in order to ensure the quality of the conductive glue, two factors, the rebound force and the resistivity, are mainly considered. If the rebound force of the conductive glue is too small, the locking part may damage the conductive glue when locking. If the resistivity of the conductive glue is too large, the conductive performance of the conductive glue will be affected.

[0121] S502: respectively judge whether the maximum rebound force and the resistivity meet the first selection standard.

[0122] The first selection standard refers to a standard for judging whether the maximum rebound force and the resistivity of the conductive glue are qualified. In an implementable embodiment, step S502 can specifically include:

[0123] F1: obtaining the maximum locking force for locking the target domain controller.

[0124] F2: judging whether the maximum rebound force is less than the maximum locking force.

[0125] F3: judging whether the resistivity is less than a standard resistivity.

[0126] F4: if the maximum rebound force is less than the maximum locking force, and the resistivity is less than the standard resistivity, the first selection standard is met.

[0127] The maximum locking force refers to the maximum locking force of the locking part for locking the domain controller.

[0128] The standard resistivity refers to a resistivity value meeting the EMC shielding requirement. EMC (Electromagnetic Compatibility) refers to the ability of a device or system to function in its electromagnetic environment without causing intolerable electromagnetic disturbance to the environment. Therefore, EMC includes two aspects of requirements: on the one hand, it refers to that the electromagnetic disturbance generated by the device in the normal operation process cannot exceed a certain limit value in the environment; on the other hand, it refers to that the device has a certain degree of anti-interference to the electromagnetic disturbance existing in the environment, i.e. electromagnetic susceptibility (EMS).

[0129] It should be noted that in the above steps F1-F4, F2 and F3 are taken as the first selection standard, and when the maximum rebound force is less than the maximum locking force and the resistivity is less than the standard resistivity, it meets

[0130] The first selection standard. That is, in this embodiment, a preliminary judgment needs to be made when the conductive adhesive is not used, and if either the maximum rebound force or the resistivity of the conductive adhesive does not meet the first selection standard, the conductive adhesive needs to be replaced.

[0131] S503: If the maximum rebound force and the resistivity meet the first selection standard, the conductive adhesive is aged, and the maximum aged rebound force and the target aged resistivity of the aged conductive adhesive are determined.

[0132] It should be noted that after the preliminary judgment of the conductive adhesive in step S502, further consideration needs to be given to the fact that the rebound force and resistivity of the conductive adhesive will change to varying degrees in actual use due to the influence of time and temperature, which may affect the reliability and service life of the domain controller. Therefore, a secondary judgment needs to be made on the aged conductive adhesive.

[0133] S504: Determine whether the maximum aged rebound force and the target aged resistivity meet the second selection standard, respectively.

[0134] The second selection standard means a standard for judging whether the maximum aged rebound force and the target aged resistivity of the aged conductive adhesive are qualified. In one possible implementation, step S504 can specifically include:

[0135] G1: Determine whether the maximum aged rebound force is less than the maximum locking force.

[0136] G2: Determine whether the target aged resistivity is less than the standard aged resistivity.

[0137] G3: If the maximum aged rebound force is less than the maximum locking force and the target aged resistivity is less than the standard aged resistivity, the second selection standard is met.

[0138] It should be noted that the maximum aged rebound force means the maximum rebound force that the conductive adhesive can generate after aging. Since the conductive adhesive will increase the rebound force over time and temperature in the uninstalled state, it is determined whether the maximum aged rebound force of the aged conductive adhesive is less than the maximum locking force of the locking part to ensure that the rebound force of the conductive adhesive after installation meets the requirements.

[0139] In another implementable embodiment, the conductive adhesive can also be arranged on the domain controller as a sample, and the domain controller is subjected to aging test, and then the maximum aging rebound force of the conductive adhesive after aging is obtained. Since the conductive adhesive is bonded on the sample for aging test, the rebound force thereof decreases with time and temperature, and thus the corresponding second selection criterion can be that whether the maximum aging rebound force is greater than a preset aging rebound force, and if yes, it is considered that the conductive adhesive meets the criterion.

[0140] It should be noted that the difference between the two judgment criteria for the maximum aging rebound force of the conductive adhesive after aging is that the rebound force of the conductive adhesive increases with time and temperature in a natural state, while the rebound force of the conductive adhesive decreases with time and temperature when the conductive adhesive is coated on the domain controller and subjected to the locking force of the locking part, and thus the judgment criteria of the conductive adhesive under different conditions are different.

[0141] It should be noted that in the embodiments of the present application, the aging process adopts a double 85 aging test. The double 85 test refers to aging test of a test body under the condition that the environment is set to 85℃ in temperature and 85% in humidity, and the test time is usually 1000 hours, which mainly tests the limit that the product can withstand in a harsh environment of high temperature and high humidity. The double 85 test is a performance test for the moisture resistance of the product.

[0142] S505: If the maximum aging rebound force and the target aging resistivity both meet the second selection criterion, the conductive adhesive is selected as the target conductive adhesive.

[0143] The target conductive adhesive is the conductive adhesive to be replaced when the target total locking force is less than the target rebound force.

[0144] It should be noted that after the target conductive adhesive meeting the condition is selected through the above steps S501-S505, it is necessary to judge whether the target rebound force of the current conductive adhesive is greater than the rebound force of the target conductive adhesive to be replaced when the target total locking force is less than the target rebound force, and if yes, the replacement is performed; and if no, the target conductive adhesive meeting the condition is replaced again.

[0145] The conductive glue obtaining process provided by the embodiment of the application obtains the maximum rebound force and the resistivity of the conductive glue, and respectively judges whether the maximum rebound force and the resistivity meet the first selection standard. When the maximum rebound force and the resistivity both meet the first selection standard, the conductive glue is aged, and respectively judges whether the maximum aged rebound force and the target aged resistivity of the aged conductive glue meet the second selection standard. If both meet the second selection standard, the conductive glue is selected as the conductive glue selection result. In the process, the rebound force and the resistivity of the conductive glue are used as the standard for measuring the quality of the conductive glue. The rebound force and the resistivity of the conductive glue before aging are preliminarily judged to determine whether the quality of the conductive glue is qualified. In addition, the rebound force and the resistivity of the conductive glue change with time and temperature, so the conductive glue is subjected to an aging test to determine whether it meets the second selection standard, so as to ensure the quality of the conductive glue and improve the reliability and service life of the domain controller.

[0146] Based on the installation pre-pressure determination method of the domain controller provided in the above embodiment, the embodiment of the application further provides a device for determining the installation pre-pressure of a domain controller, which is shown in Figure 6 The figure is a structural schematic diagram of the device for determining the installation pre-pressure of a domain controller provided by the embodiment of the application, which is shown in Figure 6 The device 600 can include the following components:

[0147] The first obtaining module 601 is configured to obtain a target rebound force of conductive glue; the conductive glue is arranged between the upper cover plate and the lower cover plate of a target domain controller.

[0148] The second obtaining module 602 is configured to obtain a target locking force for locking the target domain controller.

[0149] The judging module 603 is configured to judge whether the target rebound force is greater than the target locking force.

[0150] The pre-pressure determination module 604 is configured to determine a target pre-pressure for installing the target controller according to the maximum rebound force and the target locking force if the target rebound force is greater than the target locking force.

[0151] As an example, the first obtaining module 601 is specifically configured to:

[0152] Determine the target rebound force of the conductive glue according to the material height of the conductive glue and a target limiting height.

[0153] As an example, the target limiting height can be obtained in the following way:

[0154] The first obtaining unit is configured to obtain the material height, the maximum limit compression amount and the minimum limit compression amount of the conductive glue.

[0155] A target compression amount determination unit is configured to determine a target compression amount according to the maximum limit compression amount and the minimum limit compression amount.

[0156] A target limiting height determination unit is configured to determine a target limiting height according to the material height and the target compression amount.

[0157] As an example, the target limiting height determination unit is specifically configured to:

[0158] determine a first limiting height according to the material height and the target compression amount;

[0159] determine whether the first limiting height meets a preset limiting standard;

[0160] if yes, the first limiting height is taken as the target limiting height;

[0161] if no, a second limiting height is determined according to the first limiting height, and it is determined whether the second limiting height meets the preset limiting standard, until the second limiting height meets the preset limiting standard, and the second limiting height is taken as the target limiting height.

[0162] As an example, the second acquisition module 602 is specifically configured to:

[0163] determine a minimum locking force of a single locking part for locking the target domain controller;

[0164] The determination module 603 is specifically configured to:

[0165] determine whether the target rebound force is greater than the minimum locking force.

[0166] As an example, before the determination module 603, the device further comprises:

[0167] A second acquisition unit is configured to acquire a total number of locking parts;

[0168] A determination unit is configured to determine a target total locking force according to the minimum locking force and the total number;

[0169] A first determination unit is configured to determine whether the target total locking force is greater than the target rebound force;

[0170] An execution unit is configured to execute a subsequent step if the target total locking force is greater than the target rebound force;

[0171] A replacement unit is configured to replace conductive glue or locking parts if the target total locking force is less than the target rebound force.

[0172] As an example, the acquisition mode of the conductive glue comprises:

[0173] The third acquisition unit is configured to acquire a maximum rebound force and a resistivity of the conductive glue; the conductive glue is arranged between the upper cover plate and the lower cover plate of the target domain controller.

[0174] The second judgment unit is configured to respectively judge whether the maximum rebound force and the resistivity meet a first selection criterion.

[0175] The aging unit is configured to age the conductive glue if the maximum rebound force and the resistivity both meet the first selection criterion, and determine a maximum aged rebound force and a target aged resistivity of the conductive glue after aging.

[0176] The third judgment unit is configured to respectively judge whether the maximum aged rebound force and the target aged resistivity meet a second selection criterion.

[0177] The conductive glue determination unit is configured to take the conductive glue as a target conductive glue if the maximum aged rebound force and the target aged resistivity both meet the second selection criterion; the target conductive glue is the conductive glue to be replaced when the target total locking force is less than the target rebound force.

[0178] The device for determining the installation pre-pressure of the domain controller provided in the embodiments of the present application has the same beneficial effects as the method for determining the installation pre-pressure of the domain controller provided in the above embodiments, and thus will not be described again.

[0179] The embodiments of the present application also provide a corresponding device and a computer storage medium for implementing the schemes provided in the embodiments of the present application.

[0180] The device includes a memory and a processor, the memory is configured to store instructions or codes, and the processor is configured to execute the instructions or codes, so that the device executes the method for determining the installation pre-pressure of the domain controller provided in any of the embodiments of the present application.

[0181] The computer storage medium stores codes, and when the codes are executed, a device running the codes implements the method for determining the installation pre-pressure of the domain controller provided in any of the embodiments of the present application.

[0182] It should be noted that each of the embodiments in the specification adopts a progressive manner, and the same and similar parts between each embodiment can be referred to each other. Each embodiment focuses on the difference from other embodiments. Especially, the device and equipment embodiments are described more simply because they are basically similar to the method embodiments. The relevant parts can be referred to the part of the method embodiments. The above-described device and equipment embodiments are only illustrative, and the units described as separate components can be or can not be physically separated, and the components indicated as units can be or can not be physical units, that is, they can be located in one place or distributed on multiple network units. Part or all of the modules can be selected to achieve the purpose of the embodiments according to the actual needs. Those skilled in the art can understand and implement it without creative labor.

[0183] The "first" and "second" in the names of "first" and "second" mentioned in the embodiments of the application are only used for name identification, and do not represent the first and second in order.

[0184] From the above description of the embodiments, those skilled in the art can clearly understand that all or part of the steps in the above-mentioned embodiment methods can be implemented by means of software plus a general hardware platform. Based on this understanding, the technical solutions of the present application can be embodied in the form of a software product. The computer software product can be stored in a storage medium, such as a read-only memory (English: read-only memory, ROM) / RAM, a magnetic disk, an optical disk, etc., and includes a number of instructions to make a computer device (which can be a personal computer, a server, or a network communication device such as a router) execute the method described in each embodiment or some parts of the embodiments of the present application.

[0185] The above is only one specific embodiment of the present application, but the protection scope of the present application is not limited to this. Any skilled person in the art can easily think of changes or replacements within the technical scope disclosed in the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. A method for determining the pre-installation pressure of a domain controller, characterized in that, The method includes: The target rebound force of the conductive adhesive is obtained; the conductive adhesive is disposed between the upper and lower cover plates of the target domain controller. Determine the minimum locking force for a single locking component used to lock the target domain controller, and obtain the total number of the locking components; The target total locking force of all locking parts is determined based on the minimum locking force of each locking part and the total number of them. Determine whether the total locking force of the target is greater than the target rebound force; If the total locking force of the target is less than the target rebound force, replace the conductive adhesive or the locking parts; If the total target locking force is greater than the target rebound force, then determine whether the target rebound force is greater than the minimum locking force of each locking component; If the target rebound force is greater than at least one of the minimum locking forces of each of the locking parts, then the target preload for installing the target controller is determined based on the maximum rebound force and the minimum locking force of each of the locking parts.

2. The method according to claim 1, characterized in that, The process of obtaining the target rebound force of the conductive adhesive includes: The target rebound force of the conductive adhesive is determined based on the material height of the conductive adhesive and the target limiting height.

3. The method according to claim 2, characterized in that, The methods for obtaining the target limiting height include: Obtain the material height, maximum ultimate compression, and minimum ultimate compression of the conductive adhesive; The target compression is determined based on the maximum and minimum compression limits. The target limiting height is determined based on the material height and the target compression amount.

4. The method according to claim 3, characterized in that, Determining the target limiting height based on the material height and the target compression amount includes: The first limit height is determined based on the material height and the target compression amount; Determine whether the height of the first limit switch meets the preset limit standard; If so, then the first limit height shall be taken as the target limit height; If not, then determine the second limit height based on the first limit height, and determine whether the second limit height meets the preset limit standard, until the second limit height meets the preset limit standard, and take the second limit height as the target limit height.

5. The method according to claim 1, characterized in that, The conductive adhesive is obtained in the following ways: The maximum rebound force and resistivity of the conductive adhesive are obtained; the conductive adhesive is disposed between the upper and lower cover plates of the target domain controller. Determine whether the maximum rebound force and the resistivity meet the first selection criterion; If the maximum rebound force and the resistivity both meet the first selection criteria, then the conductive adhesive is aged, and the maximum aging rebound force and target aging resistivity of the aged conductive adhesive are determined. Determine whether the maximum aging rebound force and the target aging resistivity meet the second selection criteria; If both the maximum aging rebound force and the target aging resistivity meet the second selection criteria, then the conductive adhesive is selected as the target conductive adhesive; the target conductive adhesive is the conductive adhesive that is replaced when the target total locking force is less than the target rebound force.

6. A device for determining the pre-installation pressure of a domain controller, characterized in that, The device includes: The first acquisition module is used to acquire the target rebound force of the conductive adhesive; the conductive adhesive is disposed between the upper and lower cover plates of the target domain controller. The second acquisition module is used to determine the minimum locking force for a single locking part used to lock the target domain controller; The second acquisition unit is used to acquire the total number of locking parts; A determining unit is configured to determine the target total locking force of all the locking parts based on the minimum locking force of each of the locking parts and the total number of them; The first judgment unit is used to determine whether the total locking force of the target is greater than the target rebound force; A replacement unit is used to replace the conductive adhesive or locking parts if the total locking force of the target is less than the target rebound force. An execution unit is configured to execute a judgment module if the total locking force of the target is greater than the rebound force of the target. The judgment module is used to determine whether the target rebound force is greater than the minimum locking force of each of the locking parts; The pre-pressure determination module is used to determine the target pre-pressure for installing the target controller based on the maximum rebound force and the minimum locking force of each of the locking parts if the target rebound force is greater than at least one of the minimum locking forces of each of the locking parts.

7. A computer device, characterized in that, include: A memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor, when executing the computer program, implements the method for determining the pre-installation stress of a domain controller as described in any one of claims 1-5.

8. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores instructions that, when executed on a terminal device, cause the terminal device to perform the pre-stress determination method for the domain controller as described in any one of claims 1-5.

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