A high-shield, sealed outdoor heat dissipation chassis

Abstract

This invention relates to a highly shielded, sealed outdoor heat dissipation enclosure, comprising an inner enclosure and an outer enclosure. The inner enclosure is located inside the outer enclosure. Heat dissipation channels are provided on both sides of the inner enclosure along its length, connecting it to the outer enclosure. Heat dissipation holes are provided on the outer enclosure shell, communicating with the heat dissipation channels. Multiple heat dissipation plates are arranged along the height of the inner enclosure, each plate dividing the inner enclosure into multiple sealed storage spaces. Multiple heat dissipation ducts are provided on the heat dissipation plates, distributed along their length, opening on both sides of the heat dissipation plates and communicating with the heat dissipation channels. This heat dissipation enclosure allows electronic components to be placed within sealed storage spaces, ensuring high shielding and sealing of the components. Heat generated by the electronic components is transferred through the heat dissipation plates to the heat dissipation channels between the inner and outer enclosures, and then discharged outside the enclosure through the heat dissipation holes on the outer enclosure shell, ensuring timely dissipation of heat generated by the electronic components within the enclosure.

Description

Technical Field

[0001] This application relates to the field of heat dissipation chassis technology, and in particular to a highly shielded, sealed outdoor heat dissipation chassis. Background Technology

[0002] Currently, portable combat chassis for individual soldiers are enclosed chassis. Enclosed chassis offer advantages such as good sealing and high shielding, making them suitable for use in special situations such as field operations. However, the higher the enclosure's sealing, the greater the difficulty in heat dissipation. Poor heat dissipation can lead to electronic component malfunctions. Current heat dissipation methods primarily employ natural cooling and a combination of conductive cooling and air cooling, resulting in low power consumption per board. However, with the development of electronic technology, the heat flux density of heat-generating chips is increasing, and the total power consumption of modules is also growing. Traditional natural cooling and conductive cooling combined with air cooling are no longer sufficient to meet product usage requirements. Summary of the Invention

[0003] In order to improve the heat dissipation effect of the chassis while ensuring high airtightness, the present invention provides a highly shielded, airtight outdoor heat dissipation chassis.

[0004] The present invention provides a highly shielded, sealed outdoor heat dissipation enclosure using the following technical solution:

[0005] A highly shielded, sealed outdoor heat dissipation enclosure includes an inner enclosure and an outer enclosure. The inner enclosure is located inside the outer enclosure. Heat dissipation channels are provided between the inner enclosure and the outer enclosure on both sides along the length direction. Heat dissipation holes are provided on the outer enclosure shell, and the heat dissipation holes communicate with the heat dissipation channels. The inner enclosure has multiple heat dissipation plates arranged along its height direction. Each heat dissipation plate divides the inner enclosure into multiple sealed storage spaces. Multiple heat dissipation ducts are provided on the heat dissipation plates, distributed along the length direction of the heat dissipation plates. The heat dissipation ducts open on both sides along the length direction of the heat dissipation plates and communicate with the heat dissipation channels.

[0006] The above technical solution divides the inner chassis into multiple sealed storage spaces using a heat sink, allowing electronic components to be placed within these sealed spaces, thus ensuring high shielding and sealing performance. Heat generated during operation is transferred through the heat sink to the heat dissipation channel between the inner and outer chassis, and finally exhausted outside the chassis through ventilation holes on the outer chassis. This ensures that the heat generated by the electronic components inside the chassis can be dissipated in a timely manner, enabling the electronic components to operate normally in a highly sealed space.

[0007] In one specific implementation scheme, a fan is provided in one of the heat dissipation channels, and the airflow direction of the fan is set along the length of the heat dissipation plate.

[0008] The above technical solution involves installing a fan within the heat dissipation channel. The fan blows air along the length of the heat sink, allowing airflow through the heat dissipation channel of the heat sink. This quickly dissipates heat from the heat sink into the heat dissipation channel and exhausts it to the outside of the chassis through the ventilation holes on the outer casing, thus improving the overall heat dissipation effect.

[0009] In one specific implementation scheme, a through groove is provided on each of the two side panels of the inner chassis along the length direction of the inner chassis. The two ends of the heat sink block the through groove, and the heat dissipation air duct of each heat sink is connected to the through groove.

[0010] The above technical solution allows for the separate design and installation of the heat sink by setting through grooves on the side panel of the inner chassis and sealing them with heat sinks.

[0011] In one specific implementation scheme, a support plate for mounting the heat sink is provided on the side of the inner chassis away from the heat dissipation channel, and the lower end face of the heat sink abuts against the support plate.

[0012] The above technical solution, by setting up a tray, makes it easy to insert the heat sink from above the tray into the side panel of the inner chassis, while the tray also serves as a positioning tool.

[0013] In one specific implementation scheme, a locking block is provided on the side of the inner chassis away from the heat dissipation channel. The locking block is provided with a second through slot communicating with the through slot. The two sides of the heat dissipation plate along the length direction are engaged with the locking block.

[0014] The above technical solution, by setting a locking block, allows the heat sink to be easily locked and fixed to the locking block, thereby facilitating the quick installation and fixing of the heat sink.

[0015] In one specific implementation, the length of the heat sink gradually decreases from the outer shell of the inner chassis to the midpoint of the inner chassis.

[0016] With the above technical solution, the length of the heat sink gradually decreases from the outer shell of the inner chassis to the middle position of the inner chassis. As the heat sink is inserted into the inner chassis, it becomes increasingly tighter with the locking block, thus ensuring a secure fixation between the heat sink and the locking block. In addition, it also improves the sealing performance between the heat sink and the locking block, thereby enhancing the airtightness of the storage space.

[0017] In one specific implementation, the heat sink includes an upper plate and a lower plate, with multiple partitions disposed between the upper plate and the lower plate, and a heat dissipation duct formed between two adjacent partitions.

[0018] Through the above technical solution, the upper and lower plates are used for heat conduction of electronic devices in the storage space, transferring heat to multiple partitions, and then the heat is transferred through the partitions to the heat dissipation ducts between the partitions, and finally discharged from the heat dissipation ducts.

[0019] In one specific implementation scheme, a detachable water-cooling structure is provided within the heat dissipation channel. The water-cooling structure includes an inlet pipe, a return pipe, and a connecting pipe. An inlet plug is provided on the inlet pipe and is inserted into one heat dissipation duct on the heat sink plate. A return plug is provided on the return pipe and is inserted into another heat dissipation duct on the same side of the heat sink plate. The connecting pipe is located on the other side of the heat sink plate and has connecting plugs that connect to the inlet plug and the return plug inserted into the heat dissipation duct.

[0020] The above technical solution, by setting up a detachable water-cooling heat dissipation device, can assist in heat dissipation when encountering large heat generation and poor air cooling effect, thereby improving the heat dissipation effect; and the water-cooling heat dissipation device can be inserted into the heat dissipation air duct through the water inlet plug, water return plug and connecting plug, which can utilize the existing heat dissipation air duct as a water cooling channel, without the need for an additional water cooling structure, thus saving costs.

[0021] In one specific implementation scheme, a mounting base is also provided inside the outdoor unit casing, and the water cooling heat dissipation mechanism is fixed to the mounting base by bolts. A water inlet and a water outlet are provided on the shell of the outdoor unit casing. The water inlet is connected to the water inlet pipe through a pipe fitting, and the water outlet is connected to the water outlet pipe through a pipe.

[0022] The above technical solution allows the water-cooling heat dissipation mechanism to be fixed to the mounting base with bolts, enabling it to be installed on the mounting base when needed and removed from the mounting base when not in use.

[0023] In one specific implementation scheme, the water inlet plug, the water return plug, and the connecting plug all include a socket portion, the cross-section of which is conical, and the socket portion is inserted into the inlet of the end of the heat dissipation duct. A sealing sleeve is also provided between the socket portion and the heat dissipation duct.

[0024] The above technical solution involves inserting a tapered plug into the end of the heat dissipation duct and using a sealing sleeve to achieve a good seal between the water inlet plug, water return plug, and connecting plug and the heat dissipation duct, thus keeping the inside of the chassis dry.

[0025] In summary, this application includes at least one of the following beneficial technical effects:

[0026] 1. The internal chassis is divided into multiple sealed storage spaces by a heat sink, allowing electronic components to be placed within these sealed spaces, thus ensuring high shielding and sealing of the components. The heat generated by the electronic components during operation is transferred through the heat sink to the heat dissipation channel between the internal and external chassis, and finally exhausted outside the chassis through the heat dissipation holes on the external chassis shell. This ensures that the heat generated by the electronic components inside the chassis can be dissipated in a timely manner, enabling the electronic components to operate normally in a highly sealed space. Furthermore, by incorporating fans to exhaust air along the heat dissipation channel, the heat dissipation efficiency can be improved.

[0027] 2. The heat sink is fixed to the inner chassis by insertion and mounting. The length of the heat sink gradually decreases from the outer shell to the middle of the inner chassis. This ensures that the heat sink becomes increasingly tighter with the retaining block as it moves into the inner chassis, thus guaranteeing a secure fixation between the heat sink and the retaining block. In addition, it also ensures good sealing between the heat sink and the retaining block, thereby improving the airtightness of the storage space.

[0028] 3. By setting up a detachable water-cooling device, when encountering a large amount of heat generation and poor air cooling effect, the water-cooling device can be installed to assist in heat dissipation, which can improve the heat dissipation effect; and the water-cooling device can be inserted into the heat dissipation air duct through the water inlet plug, water outlet plug and connecting plug, which can utilize the existing heat dissipation air duct as a water cooling channel, eliminating the need for an additional water cooling structure and saving costs. Attached Figure Description

[0029] Figure 1 This is a schematic diagram of the overall structure of the highly shielded, sealed outdoor heat dissipation chassis in Example 1.

[0030] Figure 2 This invention illustrates the connection diagram between the heat sink and the internal chassis.

[0031] Figure 3 This is a schematic diagram of the heat sink of the present invention.

[0032] Figure 4 This is a top view of the heat sink of the present invention.

[0033] Figure 5 This is a structural schematic diagram of Embodiment 2 of the present invention.

[0034] Figure 6 This is a schematic diagram showing one side of the connecting pipe in Example 2.

[0035] Figure 7 This is a schematic diagram illustrating the structure of the water-cooled heat dissipation mechanism, specifically the inlet pipe and return pipe, as shown in Example 2.

[0036] Figure 8 yes Figure 7 Enlarged view of part A.

[0037] The attached diagram shows the following reference numerals: 1. Heat sink; 2. Top plate; 3. Bottom plate; 4. Front cover; 5. Rear cover; 6. Heat dissipation hole; 7. External chassis side panel; 8. Heat dissipation channel; 9. Internal chassis side panel; 10. Through slot; 11. Support plate; 12. Locking block; 13. Second through slot; 14. Storage space; 15. Water inlet pipe; 16. Water return pipe; 17. Connecting pipe; 18. Water inlet plug; 19. Water return plug; 20. Connecting plug; 21. Mounting base; 22. Socket; 101. Upper plate; 102. Lower plate; 103. Partition; 104. Heat dissipation duct; 105. Fixing pin. Detailed Implementation

[0038] The following is in conjunction with the appendix Figure 1-7 The present invention will be described in further detail below.

[0039] Example 1:

[0040] Reference Figures 1 to 3 This embodiment discloses a highly shielded, sealed outdoor heat dissipation chassis, including an inner chassis and an outer chassis. The inner chassis is located inside the outer chassis, and there is a certain space between the inner chassis and the outer chassis on both sides along the length direction, which serves as heat dissipation channels 8. In this embodiment, the inner chassis and the outer chassis share a top plate 2 and a bottom plate 3, that is, the bottom plate 3 of the outer chassis also serves as the bottom plate 3 of the inner chassis, and the top plate 2 of the outer chassis also serves as the top plate 2 of the inner chassis. The front cover plate 4 and the rear cover plate 5 of the outer chassis serve as the front cover plate 4 and the rear cover plate 5 of the inner chassis, respectively.

[0041] A heat dissipation hole 6 is provided on the outer chassis shell. Specifically, in this embodiment, the heat dissipation hole 6 is located on the side panels 7 of the outer chassis on both sides (left and right directions) along the length of the outer chassis. The heat dissipation hole 6 penetrates through the side panels 7 of the outer chassis, thus communicating with the heat dissipation channel 8. Through the heat dissipation hole 6, the heat in the heat dissipation channel 8 can be discharged to the outside of the chassis. In this embodiment, a dustproof pad (not shown in the figure) is also provided on the side panel 7 of the outer chassis near the inner chassis to ensure the cleanliness of the inside of the chassis.

[0042] Multiple heat sinks 1 are installed along the height of the internal chassis, and each heat sink 1 divides the internal chassis into multiple enclosed storage spaces 14 (the specific number is determined according to the height of the internal chassis and actual needs). (See reference...) Figure 3In this embodiment, the heat sink 1 includes an upper plate 101 and a lower plate 102. Multiple partitions 103 are disposed between the upper plate 101 and the lower plate 102, and a heat dissipation duct 104 is formed between two adjacent partitions 103. In this embodiment, a through groove 10 is provided on each of the two inner chassis side plates 9 along the length direction of the inner chassis. The two ends of the heat sink 1 along the length direction block the through groove 10, and the heat dissipation duct 104 of each heat sink 1 communicates with the through groove 10.

[0043] To facilitate the installation of the heat sink 1, in this embodiment, a support plate 11 for installing the heat sink 1 is provided on the side of the inner chassis side panel 9 away from the heat dissipation channel 8. A locking block 12 is also provided on the side of the inner chassis side panel 9 away from the heat dissipation channel 8, and the locking block 12 has a second through groove 13 communicating with the through groove 10. The support plate 11 is positioned below the locking block 12. During installation, the heat sink 1 is inserted from above the support plate 11, with the lower plate 102 of the heat sink 1 abutting against the support plate 11. The support plate 11 also serves a positioning function. After the heat sink 1 is inserted from the front cover towards the middle of the inner chassis, the two sides of the heat sink 1 along its length engage with the locking block 12. This allows the heat sink 1 to be easily engaged and fixed with the locking block 12, facilitating the quick installation and fixation of the heat sink 1.

[0044] To ensure a tight connection between the heat sink 1 and the clip 12, refer to Figure 4 The length of the heat sink 1 gradually decreases from the position on the outer shell (front cover 4) of the inner chassis to the midpoint of the inner chassis. Simultaneously, the locking block 12, which is adapted to the heat sink 1, gradually increases in length from the position on the outer shell (front cover 4) of the inner chassis to the midpoint of the inner chassis. This ensures that as the heat sink 1 is inserted into the inner chassis, the distance between the heat sink 1 and the locking block 12 increases, guaranteeing a secure fixation and improving the airtightness of the storage space. Furthermore, a fixing pin 105 is provided on the heat sink 1, and a fixing groove is provided inside the inner chassis. When the heat sink 1 is inserted into the inner chassis, the fixing pin 105 also engages with the fixing groove, thus achieving the installation and fixation of the heat sink 1.

[0045] In this embodiment, a fan is installed in the heat dissipation channel 8 on one side of the chassis, and the airflow direction of the fan is set along the length of the heat sink 1. In this way, airflow passes through the heat dissipation channel 104 of the heat sink 1 through the fan, so that the heat on the heat sink 1 can be quickly flowed from the heat dissipation channel 104 to the heat dissipation channel 8 on the other side, and discharged to the outside of the chassis through the heat dissipation holes 6 of the outer chassis shell on that side, thereby improving the overall heat dissipation effect.

[0046] The working principle of this embodiment is as follows:

[0047] The electronic components are housed within a storage space 14 on the inner chassis, separated by a heat sink 1. This storage space 14 is sealed by the heat sink 1, top plate 2, bottom plate 3, inner chassis side plate 9, front cover 4, and rear cover 5, achieving a high shielding effect. In this embodiment, the electronic components are VPX boards. Positioning slots for fixing the VPX boards are provided inside the inner chassis, and interfaces are provided on the rear cover 5 of the inner chassis. During operation, the heat generated by the electronic components (VPX boards) is transferred to the heat sink 1, then through the upper plate 101 and lower plate 102 of the heat sink 1 to the partition 103, and finally enters the cooling air duct 104.

[0048] A fan (not shown in the figure) blows air through the heat dissipation channel 8 on one side. The air flows along the length of the heat dissipation channel 104 of the heat sink 1 into the heat dissipation channel 8 on the other side, and is discharged from the external chassis through the heat dissipation holes 6 on the side panel 7 of the external chassis. This achieves good heat dissipation of the electronic components (VPX board) and ensures the normal operation of the electronic components (VPX board).

[0049] Example 2:

[0050] Reference Figures 5 to 7 The rest of this embodiment is the same as that of Embodiment 1. The difference is that the use of some high-power electronic devices also generates a lot of heat. In order to dissipate the heat more quickly and effectively, this embodiment adds a detachable (optional) water-cooling heat dissipation mechanism. Specifically, the water-cooling heat dissipation mechanism is set in the heat dissipation channel 8.

[0051] The water-cooled heat dissipation structure includes an inlet pipe 15, a return pipe 16, and a connecting pipe 17. An inlet plug 18 is provided on the inlet pipe 15. In this embodiment, the number of inlet plugs 18 is the same as the number of heat sinks 1. Each inlet plug 18 is distributed along the height direction of the inner chassis, and each inlet plug 18 is inserted into a heat dissipation duct 104 of one heat sink 1. A return plug 19 is provided on the return pipe 16. The number of return plugs 19 is the same as the number of heat sinks 1. Each return plug 19 is distributed along the height direction of the inner chassis, and each return plug 19 is inserted into a heat dissipation duct 104 of one heat sink 1. The return plug 19 is inserted into another heat dissipation duct 104 on the same side of the heat sink 1. The inlet pipe 15 and the return pipe 16 are respectively connected to the inlet and return ports on the outer chassis via flexible hoses. The inlet and return ports are used to connect to external cooling water pipes.

[0052] The connecting pipe 17 is located on the other side of the heat sink 1 (not on the same side as the water inlet pipe 15 and the water return pipe 16). The connecting pipe 17 is provided with the same number of connecting plug assemblies as the heat sink 1. Each connecting plug assembly includes two connecting plugs 20. The two connecting plugs 20 are respectively inserted into the heat dissipation air duct 104 and are respectively connected to the water inlet plug 18 and the water return plug 19.

[0053] In this embodiment, a mounting base 21 is provided inside the heat dissipation channel 8, and the water inlet pipe 15, the water return pipe 16, and the connecting pipe 17 are all fixedly installed through the mounting base 21. When a water cooling mechanism is required, the water inlet pipe 15, the water return pipe 16, and the connecting pipe 17 are fixed on the mounting base 21. When not needed, they can be removed. At the same time, they can be selected and configured according to the power requirements of the actual electronic devices.

[0054] Reference Figure 8 In this embodiment, the water inlet plug 18, the water return plug 19, and the connecting plug 20 all include a socket portion 22. The socket portion 22 has a conical cross-section and is inserted into the inlet of the end of the heat dissipation duct 104. A sealing sleeve (not shown in the figure) is also provided between the socket portion 22 and the heat dissipation duct 104. This method can achieve good sealing between the water inlet plug 18, the water return plug 19, and the connecting plug 20 and the heat dissipation duct 104, and can keep the inside of the chassis dry.

[0055] The embodiments described in this specific implementation are preferred embodiments of this application and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. A highly shielded, sealed outdoor heat dissipation chassis, characterized in that: The device includes an inner chassis and an outer chassis. The inner chassis is located inside the outer chassis. Heat dissipation channels are provided between the inner chassis and the outer chassis on both sides along the length direction. Heat dissipation holes are provided on the outer chassis shell, and the heat dissipation holes are connected to the heat dissipation channels. The inner chassis has multiple heat dissipation plates along its height direction. Each heat dissipation plate divides the inner chassis into multiple sealed storage spaces. Multiple heat dissipation air ducts are provided on the heat dissipation plates along their length direction. The heat dissipation air ducts open on both sides along the length direction of the heat dissipation plates and are connected to the heat dissipation channels. A detachable water-cooling structure is provided within the heat dissipation channel. The water-cooling structure includes an inlet pipe, a return pipe, and a connecting pipe. An inlet plug is provided on the inlet pipe and is inserted into one heat dissipation duct on the heat dissipation plate. A return plug is provided on the return pipe and is inserted into another heat dissipation duct on the same side of the heat dissipation plate. The connecting pipe is located on the other side of the heat dissipation plate and has connecting plugs that connect to the inlet plug and the return plug inserted into the heat dissipation duct. An installation base is also provided inside the external chassis. The water-cooled heat dissipation structure is fixed to the installation base by bolts. An inlet and an outlet are provided on the shell of the external chassis. The inlet is connected to the inlet pipe through a fitting, and the outlet is connected to the outlet pipe through a pipe.

2. The high-shield sealed outdoor heat dissipation enclosure according to claim 1, characterized in that: A fan is installed in one of the heat dissipation channels, and the airflow direction of the fan is set along the length of the heat dissipation plate.

3. The high-shield sealed outdoor heat dissipation enclosure according to claim 1, characterized in that: Both inner chassis side panels along the length of the inner chassis are provided with through slots that pass through the inner chassis side panels. The two ends of the heat sink block the through slots, and the heat dissipation air duct of each heat sink is connected to the through slot.

4. The high-shield sealed outdoor heat dissipation enclosure according to claim 3, characterized in that: A support plate for mounting the heat sink is provided on the side of the inner chassis away from the heat dissipation channel, and the lower end face of the heat sink abuts against the support plate.

5. The high-shield sealed outdoor heat dissipation enclosure according to claim 4, characterized in that: A locking block is also provided on the side of the inner chassis away from the heat dissipation channel. The locking block is provided with a second through slot that communicates with the through slot. The two sides of the heat dissipation plate along the length direction are engaged with the locking block.

6. The high-shield sealed outdoor heat dissipation enclosure according to claim 5, characterized in that: The length of the heat sink gradually decreases from the outer shell of the inner chassis to the midpoint of the inner chassis.

7. The high-shield sealed outdoor heat dissipation enclosure according to claim 1, characterized in that: The heat sink includes an upper plate and a lower plate, with multiple partitions between the upper and lower plates, and a heat dissipation duct is formed between two adjacent partitions.

8. The high-shield sealed outdoor heat dissipation enclosure according to claim 1, characterized in that: The water inlet plug, water return plug, and connecting plug all include a socket portion. The cross-section of the socket portion is conical. The socket portion is inserted into the inlet of the end of the heat dissipation duct. A sealing sleeve is also provided between the socket portion and the heat dissipation duct.

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