Electronic assembly aid positioning device for semiconductor mounting

Abstract

The application provides a kind of electronic assembly auxiliary positioning device for semiconductor installation, it is related to the field of semiconductor positioning, including L-shaped main frame A;The L-shaped main frame A is connected with L-shaped main frame B, and the both ends of the L-shaped main frame B are respectively provided with large movable blocks, and the large movable blocks are connected with the L-shaped main frame A;The both ends of the L-shaped main frame A are respectively provided with long screw rods, and the long screw rods are connected with the large movable blocks;The top of the L-shaped main frame A is provided with a cross bar, and the top of the L-shaped main frame B is provided with a movable connecting piece.Adaptability adjustment can be carried out according to the different length and width specifications of circuit board and semiconductor chip, which better meets the needs of different specifications of circuit board and different specifications of semiconductor chip assembly and fixation.The problem that the traditional electronic assembly auxiliary positioning device for semiconductor installation is difficult to adapt to the different specifications of circuit board and the different specifications of semiconductor chip during use is solved, and the use limitation is high.

Description

Technical Field

[0001] This invention relates to the field of semiconductor positioning technology, and in particular to an electronic assembly auxiliary positioning device for semiconductor mounting. Background Technology

[0002] Semiconductors are materials with electrical conductivity between that of insulators and conductors. Their conductivity is easily controlled and they can be used as components for information processing. Semiconductor chips are semiconductor devices that can perform certain functions by etching and wiring on semiconductor wafers. To ensure the installation accuracy of semiconductor chips on circuit boards, auxiliary positioning devices are needed to assist in the installation of semiconductor chips.

[0003] Existing electronic assembly auxiliary positioning devices for semiconductor mounting are only suitable for auxiliary positioning of specific circuit boards and semiconductor chips. They are difficult to adapt to different circuit board and semiconductor chip specifications, resulting in high limitations in their use. Summary of the Invention

[0004] In view of this, the present invention provides an electronic assembly auxiliary positioning device for semiconductor mounting, to solve the problem that existing electronic assembly auxiliary positioning devices for semiconductor mounting are difficult to adapt to different circuit board specifications and semiconductor chip specifications, resulting in high limitations in use.

[0005] This invention provides an electronic assembly auxiliary positioning device for semiconductor mounting, specifically including an L-shaped main frame A; the L-shaped main frame A is connected to an L-shaped main frame B, and large movable blocks are respectively installed at both ends of the L-shaped main frame B, which are connected to the L-shaped main frame A; long screws are respectively installed at both ends of the L-shaped main frame A, and the long screws are connected to the large movable blocks; a crossbar is installed at the top of the L-shaped main frame A, and a movable connector is installed at the top of the L-shaped main frame B, and the crossbar is connected to the movable connector; a movable bracket is installed at the bottom of the crossbar, and an L-shaped auxiliary frame A is fixedly installed at the bottom of the movable bracket; the L-shaped auxiliary frame A is connected to the L-shaped auxiliary frame B, and small movable blocks are respectively installed at both ends of the L-shaped auxiliary frame B, which are connected to the L-shaped auxiliary frame A; short screws are respectively installed at both ends of the L-shaped auxiliary frame A, and the short screws are connected to the small movable blocks.

[0006] Furthermore, the L-shaped main frame A has movable holes A at both ends, the L-shaped main frame B is slidably connected to the two movable holes A at both ends, the L-shaped main frame B has movable holes B at both ends, and the large movable block is located in the movable holes B.

[0007] Furthermore, the movable hole A is provided with an outer sliding hole A on the upper and lower sides respectively, and the movable hole B is provided with an inner sliding hole A on the upper and lower sides respectively. The inner sliding hole A is connected to the outer sliding hole A. The large movable block is provided with a protrusion A on the upper and lower sides respectively. The protrusion A is slidably connected in the inner sliding hole A and the outer sliding hole A.

[0008] Furthermore, the long screw is rotatably connected to the movable hole A, and the long screw is threadedly connected to the large movable block.

[0009] Furthermore, the L-shaped auxiliary frame A has movable holes C at both ends, the L-shaped auxiliary frame B is slidably connected to the two movable holes C at both ends, and the L-shaped auxiliary frame B has movable holes D at both ends, with the small movable block located in the movable holes D.

[0010] Furthermore, the movable hole C has an outer sliding hole B on its upper and lower sides, and the movable hole D has an inner sliding hole B on its upper and lower sides. The inner sliding hole B is connected to the outer sliding hole B. The small movable block has a protrusion B on its upper and lower sides, and the protrusion B is slidably connected in the inner sliding hole B and the outer sliding hole B.

[0011] Furthermore, the short screw is rotatably connected to the movable hole C, and the short screw is threadedly connected to the small movable block.

[0012] Furthermore, the L-shaped main frame A is provided with a slide rail A at its top, and a longitudinal sliding hole A is provided at one end of the crossbar. The crossbar is slidably connected to the slide rail A through the longitudinal sliding hole A. One end of the crossbar is threaded to a bolt, and the inner end of the bolt connected to the crossbar is in contact with the slide rail A. The L-shaped main frame B is provided with a slide rail B at its top, and a longitudinal sliding hole B is provided in the top of the movable connector. The movable connector is slidably connected to the L-shaped main frame B through the longitudinal sliding hole B. The top of the movable connector is threaded to a bolt, and the inner end of the bolt connected to the top of the movable connector is in contact with the slide rail B.

[0013] Furthermore, a transverse sliding hole A is provided in the bottom of the movable connector, and the other end of the crossbar is slidably connected in the transverse sliding hole A. Two transverse sliding holes B are provided in the top of the movable bracket, and the movable bracket is slidably connected to the crossbar through the transverse sliding holes B. Bolts are connected to the outside of the movable bracket, and the inner end of the bolts connected to the outside of the movable bracket is in contact with the crossbar. Beneficial effects

[0014] 1. According to the different length and width specifications of the circuit board, the present invention rotates two long screws respectively, and drives the large movable block to move through the long screws. This achieves the sliding adjustment effect of the connection part of the L-shaped main frame A and L-shaped main frame B, so that the L-shaped main frame A and L-shaped main frame B come into contact with the periphery of the circuit board, thereby limiting the circuit board and ensuring the stability of the circuit board state, and better meeting the assembly and fixing requirements of circuit boards of different specifications.

[0015] 2. According to the different length and width specifications of semiconductor chips, the present invention rotates two short screws respectively, which drive the small movable block to move, thereby achieving the sliding adjustment effect of the connection part of L-shaped auxiliary frame A and L-shaped auxiliary frame B, so that L-shaped auxiliary frame A and L-shaped auxiliary frame B come into contact with the periphery of the semiconductor chip, thereby achieving the limiting effect of semiconductor chip, ensuring the stability of semiconductor chip state, and better meeting the assembly limiting requirements of semiconductor chips of different specifications.

[0016] 3. According to the different assembly positions of semiconductor chips on the circuit board, the present invention moves the crossbar, movable connector and movable bracket, and fixes the crossbar, movable connector and movable bracket with bolts to change the position of L-shaped auxiliary bracket A and L-shaped auxiliary bracket B, thereby changing the assembly position of semiconductor chips, ensuring the accuracy of semiconductor chip assembly and positioning on the circuit board, and better meeting the needs of semiconductor chip assembly and positioning at different positions on the circuit board. Attached Figure Description

[0017] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings of the embodiments will be briefly described below.

[0018] The accompanying drawings described below are only related to some embodiments of the invention and are not intended to limit the invention.

[0019] In the attached diagram:

[0020] Figure 1 This is a schematic diagram of the overall axonometric structure of an embodiment of the present invention;

[0021] Figure 2 This is a schematic diagram of the connection structure between the L-shaped main frame A and the L-shaped main frame B according to an embodiment of the present invention;

[0022] Figure 3 This is a schematic diagram of the crossbar axial structure according to an embodiment of the present invention;

[0023] Figure 4 This is a schematic diagram of the axial structure of the movable connector according to an embodiment of the present invention;

[0024] Figure 5 This is a schematic diagram of the axial structure of the movable support according to an embodiment of the present invention;

[0025] Figure 6 This is a schematic diagram of the connection structure between L-shaped auxiliary frame A and L-shaped auxiliary frame B according to an embodiment of the present invention;

[0026] Figure 7 This is a schematic diagram of the A-axis structure of the L-shaped auxiliary frame according to an embodiment of the present invention;

[0027] Figure 8 This is a schematic diagram of the L-shaped auxiliary frame B-axis structure according to an embodiment of the present invention.

[0028] List of reference numerals

[0029] 1. L-shaped main frame A; 101. Movable hole A; 1011. External sliding hole A; 102. Slide rail A; 2. L-shaped main frame B; 201. Movable hole B; 2011. Internal sliding hole A; 202. Slide rail B; 3. Large movable block; 301. Protrusion A; 4. Long screw; 5. Crossbar; 501. Longitudinal sliding hole A; 6. Movable connector; 601. Longitudinal sliding hole B; 602. Transverse sliding hole A; 7. Movable bracket; 701. Transverse sliding hole B; 8. L-shaped auxiliary frame A; 801. Movable hole C; 8011. External sliding hole B; 9. L-shaped auxiliary frame B; 901. Movable hole D; 9011. Internal sliding hole B; 10. Small movable block; 1001. Protrusion B; 11. Short screw; 12. Bolt. Detailed Implementation

[0030] To make the objectives, solutions, and advantages of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Unless otherwise stated, the terms used herein have their ordinary meanings in the art. The same reference numerals in the drawings represent the same parts.

[0031] Example: Please refer to Figures 1 to 8 As shown:

[0032] This invention provides an electronic assembly auxiliary positioning device for semiconductor mounting, comprising an L-shaped main frame A1; the L-shaped main frame A1 is connected to an L-shaped main frame B2, and large movable blocks 3 are respectively installed at both ends inside the L-shaped main frame B2, the large movable blocks 3 being connected to the L-shaped main frame A1; movable holes A101 are respectively opened at both ends of the L-shaped main frame A1, and both ends of the L-shaped main frame B2 are slidably connected to the two movable holes A101; movable holes B201 are respectively opened at both ends of the L-shaped main frame B2, and the large movable blocks 3 are located in the movable holes B201. 1. Inside; External sliding holes A1011 are respectively opened on the upper and lower sides of the movable hole A101, and internal sliding holes A2011 are respectively opened on the upper and lower sides of the movable hole B201. The internal sliding holes A2011 and the external sliding holes A1011 are connected. Protrusions A301 are respectively provided on the upper and lower sides of the large movable block 3. The protrusions A301 are slidably connected to the internal sliding holes A2011 and the external sliding holes A1011. Long screws 4 are respectively installed in the two ends of the L-shaped main frame A1, and the long screws 4 are connected to the large movable block 3. The long screws 4 are rotatably connected to the movable block. Inside hole A101, a long screw 4 is threaded into a large movable block 3. Depending on the length and width of the circuit board, rotating the two long screws 4 causes the large movable block 3 to move, thus adjusting the sliding connection between the L-shaped main frame A1 and the L-shaped main frame B2. This allows the L-shaped main frames A1 and B2 to contact the periphery of the circuit board, providing a limiting effect and ensuring the stability of the circuit board, better meeting the assembly and fixing needs of circuit boards of different specifications. The top of the L-shaped main frame A1... A crossbar 5 is installed, and a movable connector 6 is installed on the top of the L-shaped main frame B2, with the crossbar 5 connected to the movable connector 6; a movable bracket 7 is installed at the bottom of the crossbar 5, and an L-shaped auxiliary frame A8 is fixedly installed at the bottom of the movable bracket 7; the L-shaped auxiliary frame A8 is connected to the L-shaped auxiliary frame B9, and small movable blocks 10 are installed at both ends inside the L-shaped auxiliary frame B9, with the small movable blocks 10 connected to the L-shaped auxiliary frame A8; short screws 11 are installed at both ends of the L-shaped auxiliary frame A8, with the short screws 11 connected to the small movable blocks 10.

[0033] Among them, the L-shaped auxiliary frame A8 has movable holes C801 at both ends, the L-shaped auxiliary frame B9 is slidably connected to the two movable holes C801 at both ends, the L-shaped auxiliary frame B9 has movable holes D901 at both ends, the small movable block 10 is located in the movable hole D901, the movable hole C801 has an outer sliding hole B8011 on the upper and lower sides, the movable hole D901 has an inner sliding hole B9011 on the upper and lower sides, the inner sliding hole B9011 is connected to the outer sliding hole B8011, the small movable block 10 has a protrusion B1001 on the upper and lower sides, the protrusion B1001 is slidably connected to the inner sliding hole B9011 and the outer sliding hole B8011, the short screw 11 is rotatably connected to the movable hole C801, and the short screw 11 is threadedly connected to the small movable block 10;

[0034] By adopting the above technical solution, two short screws 11 can be rotated according to the different length and width specifications of the semiconductor chip. The short screws 11 drive the small movable block 10 to move, which achieves the sliding adjustment effect of the connection part of L-shaped auxiliary frame A8 and L-shaped auxiliary frame B9. This allows L-shaped auxiliary frame A8 and L-shaped auxiliary frame B9 to contact the periphery of the semiconductor chip, thereby limiting the semiconductor chip and ensuring the stability of the semiconductor chip state. This better meets the assembly and limiting requirements of semiconductor chips of different specifications.

[0035] Among them, the L-shaped main frame A1 is equipped with a slide rail A102 at the top, and a longitudinal sliding hole A501 is opened at one end of the crossbar 5. The crossbar 5 is slidably connected to the slide rail A102 through the longitudinal sliding hole A501. One end of the crossbar 5 is threaded to a bolt 12, and the inner end of the bolt 12 connected to the crossbar 5 is in contact with the slide rail A102. The L-shaped main frame B2 is equipped with a slide rail B202 at the top, and a longitudinal sliding hole B601 is opened in the top of the movable connector 6. The movable connector 6 is slidably connected to the L-shaped main frame B2 through the longitudinal sliding hole B601. The top of the connecting piece 6 is threaded to the bolt 12. The inner end of the bolt 12 connected to the top of the movable connecting piece 6 is in contact with the slide rail B202. A transverse sliding hole A602 is opened in the bottom of the movable connecting piece 6. The other end of the crossbar 5 is slidably connected in the transverse sliding hole A602. Two transverse sliding holes B701 are opened on the top of the movable bracket 7. The movable bracket 7 is slidably connected to the crossbar 5 through the transverse sliding holes B701. Bolt 12 is connected to the outside of the movable bracket 7. The inner end of the bolt 12 connected to the outside of the movable bracket 7 is in contact with the crossbar 5.

[0036] By adopting the above technical solution, the crossbar 5, movable connector 6 and movable bracket 7 can be moved according to the different assembly positions of semiconductor chips on the circuit board, and the crossbar 5, movable connector 6 and movable bracket 7 can be fixed by bolts 12 to change the position of L-shaped auxiliary bracket A8 and L-shaped auxiliary bracket B9, thereby changing the assembly position of semiconductor chips, ensuring the accuracy of semiconductor chip assembly and positioning on the circuit board, and better meeting the needs of semiconductor chip assembly and positioning at different positions on the circuit board.

[0037] The specific usage and function of this embodiment are as follows: In this invention, firstly, according to the different length and width specifications of the circuit board, two long screws 4 are rotated respectively. The long screws 4 drive the large movable block 3 to move, which achieves the sliding adjustment effect of the connection part between the L-shaped main frame A1 and the L-shaped main frame B2, so that the L-shaped main frame A1 and the L-shaped main frame B2 come into contact with the periphery of the circuit board, which achieves the limiting effect of the circuit board, ensures the stability of the circuit board state, and better meets the assembly and fixing requirements of circuit boards of different specifications; nextly, according to the different length and width specifications of the semiconductor chip, two short screws 11 are rotated respectively. The short screws 11 drive the small movable block 10 to move, which achieves the sliding of the connection part between the L-shaped auxiliary frame A8 and the L-shaped auxiliary frame B9. The adjustment effect allows L-shaped auxiliary brackets A8 and B9 to contact the periphery of the semiconductor chip, thus limiting the position of the semiconductor chip and ensuring its stability. This better meets the positioning requirements for assembling semiconductor chips of different specifications. Finally, depending on the assembly position of the semiconductor chip on the circuit board, the crossbar 5, movable connector 6, and movable bracket 7 are moved and fixed with bolts 12. This changes the position of L-shaped auxiliary brackets A8 and B9, thereby changing the semiconductor chip assembly position and ensuring the accuracy of semiconductor chip assembly positioning on the circuit board. This better meets the positioning requirements for semiconductor chips at different positions on the circuit board.

[0038] The above description is merely an exemplary embodiment of the present invention and is not intended to limit the scope of protection of the present invention, which is determined by the appended claims.

Claims

1. An electronic assembly auxiliary positioning device for semiconductor mounting, comprising an L-shaped main frame A (1), characterized in that: The L-shaped main frame A (1) is connected to the L-shaped main frame B (2), and large movable blocks (3) are installed at both ends of the L-shaped main frame B (2), which are connected to the L-shaped main frame A (1); long screws (4) are installed at both ends of the L-shaped main frame A (1), and the long screws (4) are connected to the large movable blocks (3); a crossbar (5) is installed on the top of the L-shaped main frame A (1), and a movable connector (6) is installed on the top of the L-shaped main frame B (2), and the crossbar (5) is connected to the movable connector (6); a movable bracket is installed at the bottom of the crossbar (5). (7), and an L-shaped auxiliary frame A (8) is fixedly installed at the bottom of the movable bracket (7); the L-shaped auxiliary frame A (8) is connected to the L-shaped auxiliary frame B (9), and small movable blocks (10) are installed at both ends of the L-shaped auxiliary frame B (9), and the small movable blocks (10) are connected to the L-shaped auxiliary frame A (8); short screws (11) are installed at both ends of the L-shaped auxiliary frame A (8), and the short screws (11) are connected to the small movable blocks (10); the top of the L-shaped main frame A (1) is provided with a slide rail A (102), and a longitudinal sliding hole A (501) is opened at one end of the crossbar (5). The crossbar (5) is slidably connected to the slide rail A (102) through the longitudinal sliding hole A (501). One end of the crossbar (5) is threaded to the bolt (12). The inner end of the bolt (12) connected to the crossbar (5) is in contact with the slide rail A (102). The top of the L-shaped main frame B (2) is provided with the slide rail B (202). The top of the movable connector (6) is provided with the longitudinal sliding hole B (601). The movable connector (6) is slidably connected to the L-shaped main frame B (2) through the longitudinal sliding hole B (601). The top of the movable connector (6) is threaded to the bolt (12). (6) The inner end of the bolt (12) connected to the top is in contact with the slide rail B (202); the bottom of the movable connector (6) is provided with a transverse sliding hole A (602), and the other end of the crossbar (5) is slidably connected in the transverse sliding hole A (602). The top of the movable bracket (7) is provided with two transverse sliding holes B (701). The movable bracket (7) is slidably connected to the crossbar (5) through the transverse sliding holes B (701). The movable bracket (7) is connected to the outside with bolts (12), and the inner end of the bolts (12) connected to the outside of the movable bracket (7) is in contact with the crossbar (5).

2. The electronic assembly auxiliary positioning device for semiconductor mounting as described in claim 1, characterized in that: The L-shaped main frame A (1) has movable holes A (101) at both ends. The L-shaped main frame B (2) is slidably connected to the two movable holes A (101) at both ends. The L-shaped main frame B (2) has movable holes B (201) at both ends. The large movable block (3) is located in the movable hole B (201).

3. The electronic assembly auxiliary positioning device for semiconductor mounting as described in claim 2, characterized in that: The movable hole A (101) is provided with an outer sliding hole A (1011) on the upper and lower sides respectively, and the movable hole B (201) is provided with an inner sliding hole A (2011) on the upper and lower sides respectively. The inner sliding hole A (2011) is connected to the outer sliding hole A (1011). The large movable block (3) is provided with a protrusion A (301) on the upper and lower sides respectively. The protrusion A (301) is slidably connected in the inner sliding hole A (2011) and the outer sliding hole A (1011).

4. The electronic assembly auxiliary positioning device for semiconductor mounting as described in claim 2, characterized in that: The long screw (4) is rotatably connected to the movable hole A (101), and the long screw (4) is threadedly connected to the large movable block (3).

5. The electronic assembly auxiliary positioning device for semiconductor mounting as described in claim 1, characterized in that: The L-shaped auxiliary frame A (8) has movable holes C (801) at both ends, and the L-shaped auxiliary frame B (9) is slidably connected to the two movable holes C (801) at both ends. The L-shaped auxiliary frame B (9) has movable holes D (901) at both ends, and the small movable block (10) is located in the movable hole D (901).

6. The electronic assembly auxiliary positioning device for semiconductor mounting as described in claim 5, characterized in that: The movable hole C (801) is provided with an outer sliding hole B (8011) on the upper and lower sides respectively, and the movable hole D (901) is provided with an inner sliding hole B (9011) on the upper and lower sides respectively. The inner sliding hole B (9011) is connected to the outer sliding hole B (8011). The small movable block (10) is provided with a protrusion B (1001) on the upper and lower sides respectively. The protrusion B (1001) is slidably connected in the inner sliding hole B (9011) and the outer sliding hole B (8011).

7. The electronic assembly auxiliary positioning device for semiconductor mounting as described in claim 5, characterized in that: The short screw (11) is rotatably connected to the movable hole C (801), and the short screw (11) is threadedly connected to the small movable block (10).

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