Connecting structures

Abstract

A connection structure comprises: a first component having a first surface; a first electrode arranged on the first surface; a second component having a second surface facing the first surface; a second electrode, which is opposite to the first electrode and arranged on the second surface; conductive particles and a first resin, arranged in a plurality of spaced-apart first regions, the plurality of spaced-apart first regions being regions located between the first electrode and the second electrode; and a second resin, arranged in the plurality of spaced-apart first regions, and arranged in a second region between and around the plurality of spaced-apart first regions being regions located between the first electrode and the second electrode; wherein: the first resin contacts the first electrode in the plurality of spaced-apart first regions; the second resin contacts the second electrode in the plurality of spaced-apart first regions; the second resin in the second region is thicker than the second resin in the plurality of spaced-apart first regions; and the first resin and the second resin have different compositions.

Description

Technical Field

[0001] One embodiment of the present invention relates to a connection structure having an electrode connection structure formed of a conductive composition, and a method for producing the connection structure. Background Art

[0002] When electronic components such as integrated circuits are mounted on substrates, such as COG (Chip on Glass) connections that directly connect integrated circuits to glass substrates of liquid crystal displays, and FOG (Film on Glass) connections that connect flexible printed substrates to glass substrates of flat panel displays, anisotropic conductive films (ACF) containing conductive particles are generally widely used. Anisotropic conductive films are films of thermosetting resins in which fine conductive particles are dispersed. By sandwiching the anisotropic conductive film between aligned electrodes and performing thermocompression bonding, the conductive particles located between the electrodes can form a conductive path. On the other hand, the insulating properties of thermosetting resins can suppress short circuits of adjacent electrodes in the surface direction of the substrate. That is, the anisotropic conductive film has the anisotropy of "forming conductivity in the pressurized direction (direction of the two electrodes) and maintaining insulation in the non-pressurized direction (surface direction of the substrate)". Due to such characteristics, the anisotropic conductive film can connect a plurality of electrodes provided on an integrated circuit, a printed substrate, a glass substrate, etc. in batches, and can maintain insulation between electrodes adjacent to each other in the surface direction of the substrate.

[0003] However, with the high precision and high density of the connection circuits in electronic devices in recent years, the reliability of the connection using anisotropic conductive films has become a problem. That is, if the size of the electrode to be connected becomes smaller, there will be a situation where the number of conductive particles that contribute to conduction between a pair of electrodes decreases, and the connection reliability between the electrodes cannot be fully obtained. In addition, if the distance between adjacent electrodes in the surface direction of the substrate becomes narrower, there will be a situation where the conductive particles and the adjacent electrodes are in contact with each other, and the insulation reliability cannot be fully obtained. For this reason, Patent Document 1 discloses an anisotropic conductive film in which the conductive particles are dispersed by applying a magnetic field or the like, thereby separating them from other conductive particles.

[0004] [Prior art literature]

[0005] [Patent Document]

[0006] Patent Document 1: Japanese Patent Application Publication No. 2015-167106 Summary of the invention

[0007] [Problems to be solved by the invention]

[0008] However, in anisotropic conductive films, when the substrates are thermally pressed together, the arrangement of the conductive particles is irregular and scattered, so that it is not possible to fully eliminate the poor conduction caused by the absence of conductive particles between electrodes and the short circuit caused by the conductive particles contacting between adjacent electrodes. Furthermore, since a heat curing connection method is adopted, in principle, a dimensional change caused by the difference in thermal expansion coefficients between the upper and lower substrates occurs, and it is not possible to eliminate the problem of the electrodes formed on the upper and lower substrates being offset from each other.

[0009] One embodiment of the present invention is completed in view of the existing problems as described above, and one of its purposes is to ensure the conductivity between opposing electrodes through a simple process and to prevent adjacent electrodes from short-circuiting even if the electrodes arranged on an integrated circuit, a printed substrate, a glass substrate, etc. are highly refined and highly dense.

[0010] [Means for solving the problem]

[0011] A method for producing a connection structure involved in one embodiment of the present invention includes: configuring conductive particles and a first composition on a first electrode configured on a first surface of a first component, configuring a second composition on the first electrode of the first surface and an area other than the first electrode, configuring the first surface and the second surface of a second component configured with a second electrode in a manner such that the first electrode and the second electrode are opposite to each other, pressing the first component and the second component, and curing the first composition and the second composition.

[0012] A method for producing a connecting structure according to another embodiment of the present invention includes: disposing conductive particles and a first composition on a first electrode disposed on a first surface of a first component, disposing a second composition on a second electrode disposed on a second surface of a second component and on an area other than the second electrode, disposing the first surface and the second surface in such a manner that the first electrode and the second electrode are opposite to each other, pressing the first component and the second component, and curing the first composition and the second composition.

[0013] A connection structure involved in one embodiment of the present invention includes: a first surface of a first component; a first electrode, which is arranged on the first surface; a second surface of a second component, which is opposite to the first surface; a second electrode, which is opposite to the first electrode and arranged on the second surface; a first resin and conductive particles, which are arranged between the first electrode and the second electrode; and a second resin, which is arranged between the first electrode and the second electrode, and between an area of ​​the first surface other than the first electrode and an area of ​​the second surface other than the second electrode; the first resin contacts the first electrode, the second resin contacts the second electrode, and the first resin is different from the second resin.

[0014] (Effects of the Invention)

[0015] According to one embodiment of the present invention, even if the electrodes arranged on the electronic components are highly refined and highly dense, the conductivity between the electrodes facing each other can be ensured by a simple process, and the short circuit between adjacent electrodes can be suppressed. Furthermore, since the heat curing connection method is not used, the electrodes of the upper and lower substrates with different thermal expansion coefficients can be connected to each other with high precision. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a figure which shows the structure of the connection structure body which concerns on one Embodiment of this invention.

[0017] Figure 2 It is a figure explaining the manufacturing method of the connection structure which concerns on one Embodiment of this invention.

[0018] Figure 3 It is a figure explaining the manufacturing method of the connection structure which concerns on one Embodiment of this invention.

[0019] Figure 4 It is a figure explaining the manufacturing method of the connection structure which concerns on one Embodiment of this invention.

[0020] Figure 5 It is a figure explaining the manufacturing method of the connection structure which concerns on one Embodiment of this invention.

[0021] Figure 6 It is a figure explaining the manufacturing method of the connection structure which concerns on one Embodiment of this invention.

[0022] Figure 7 It is a figure which shows the structure of the connection structure body which concerns on one Embodiment of this invention.

[0023] Figure 8 It is a figure explaining the manufacturing method of the connection structure which concerns on one Embodiment of this invention.

[0024] Fig. 9 It is a figure explaining the manufacturing method of the connection structure which concerns on one Embodiment of this invention.

[0025] Fig.10 It is a figure which shows the structure of the connection structure body which concerns on one Embodiment of this invention.

[0026] Fig.11 It is a figure explaining the manufacturing method of the connection structure which concerns on one Embodiment of this invention.

[0027] Fig.12 It is a figure explaining the manufacturing method of the connection structure which concerns on one Embodiment of this invention.

[0028] Fig.13 It is a figure explaining the manufacturing method of the connection structure which concerns on one Embodiment of this invention.

[0029] Fig.14 It is a figure explaining the manufacturing method of the connection structure which concerns on one Embodiment of this invention.

[0030] Fig.15 It is a figure explaining the manufacturing method of the connection structure which concerns on one Embodiment of this invention.

[0031] Fig.16 It is a figure which shows the structure of the connection structure body which concerns on one Embodiment of this invention.

[0032] Fig.17 It is a figure explaining the manufacturing method of the connection structure which concerns on one Embodiment of this invention.

[0033] Fig.18 It is a figure explaining the manufacturing method of the connection structure which concerns on one Embodiment of this invention.

[0034] Fig.19 It is a diagram showing an example of a connection structure according to an embodiment of the present invention.

[0035] Fig. 20 It is a diagram showing an example of a connection structure according to an embodiment of the present invention.

[0036] Fig.21 It is a diagram showing an example of a connection structure according to an embodiment of the present invention.

[0037] Fig. 22 It is a diagram showing an example of a connection structure according to an embodiment of the present invention.

[0038] Fig.23 It is a diagram showing an example of a connection structure according to an embodiment of the present invention.

[0039] Fig.24 It is a diagram showing an example of a connection structure according to an embodiment of the present invention.

[0040] Fig.25 It is a diagram showing an example of a connection structure according to an embodiment of the present invention. DETAILED DESCRIPTION

[0041] Hereinafter, the embodiments of the present invention will be described with reference to the accompanying drawings, etc. However, the present invention includes a variety of different forms and is not limited to the following exemplary embodiments. The drawings attached to this specification are sometimes schematically represented by the width, thickness, shape, etc. of each part compared with the actual form in order to make the description clearer, but it is only an example and does not necessarily limit the content of the present invention. In addition, in the present invention, when a specific element recorded in a certain figure is the same or corresponding to a specific element recorded in other figures, the same symbol is sometimes marked (or a, b, etc. are marked after the number recorded as a symbol), and repeated descriptions are appropriately omitted. Furthermore, the words "1st" and "2nd" marked on each element are convenient identifiers used to distinguish each element, and do not have further meaning unless otherwise specified.

[0042] In this specification, when a certain component or region is located "above (or below)" another component or region, unless otherwise specified, it includes not only the case where it is located directly above (or directly below) another component or region, but also the case where it is located above (or below) another component or region. That is, it also includes the case where another component is included between the above (or below) another component or region and the certain component or region.

[0043] In this specification, a connection structure in a COG connection in which an integrated circuit (second electronic component) is connected to a glass substrate of a liquid crystal display (first electronic component) is shown as an example. However, the present invention is not limited thereto, and a connection structure in a FOG connection in which a flexible printed substrate is connected to a glass substrate of a flat panel display may also be used. In this case, the second electronic component may also be a flexible printed substrate such as TAB (Tape Automated Bonding) or COF (Chip on Film).

[0044] <First embodiment>

[0045] [Structure of the connection structure]

[0046] Figure 1 The structure of a connection structure according to one embodiment of the present invention is shown. Figure 1(A) is a plan view of a connection structure according to one embodiment of the present invention. Figure 1 (B) Yes Figure 1 (A) AA' cross-section. Figure 1 (C) Yes Figure 1 (B) is an enlarged cross-sectional view of the conductive particles in the region B.

[0047] like Figure 1 As shown in (A) and (B), the first electronic component 101 includes a terminal 104, a first insulating film 106, a second insulating film 108, and a first electrode 110 on the connection surface (first surface) of the first member 102. The second electronic component 111 is mounted on the connection surface (first surface) of the first electronic component 101. The second electronic component 111 includes a second electrode 114 on the connection surface (second surface) of the second member 112. The first surface of the first electronic component 101 and the second surface of the second electronic component 111 are arranged facing each other. The connection structure 100 is responsible for the physical connection between the first electronic component 101 and the second electronic component 111, and the electrical connection between the first electrode 110 and the second electrode 114. The connection structure 100 includes the first surface of the first member 102, the first electrode 110, the second surface of the second member 112, the second electrode 114, the conductive particles 10, the first resin 20, and the second resin 30.

[0048] A plurality of first electrodes 110 are arranged on the first surface of the first member 102. A second insulating film 108 is arranged in a region other than the region where the first electrodes 110 are arranged on the first surface of the first member 102. A plurality of second electrodes 114 corresponding to the plurality of first electrodes 110 are arranged on the second surface of the second member 112. An insulating film may also be arranged in a region other than the region where the second electrodes 114 are arranged on the second surface of the second member 112.

[0049] A plurality of first electrodes 110 and a plurality of second electrodes 114 are arranged opposite to each other. A plurality of conductive particles 10, a first resin 20, and a second resin 30 are arranged between the first and second electrodes 110, 114. A plurality of conductive particles 10 are arranged in a plane direction (D2-D3 plane direction) between the first and second electrodes 110, 114. One conductive particle 10 is arranged in a direction (D1 direction) between the first and second electrodes 110, 114. Each conductive particle 10 contacts the first and second electrodes 110, 114. Figure 1As shown in (C), the conductive particle 10 is deformed by pressure in the direction of the electrodes facing each other (D1 direction) between the first electrode 110 and the second electrode 114 by the following method for producing a connection structure. That is, the distance between the first electrode 110 and the second electrode 114 in the direction of the electrodes facing each other (D1 direction) is approximately the same as the height of the conductive particle 10 in the direction of the electrodes facing each other (D1 direction). The height of the conductive particle 10 in the direction of the electrodes facing each other (D1 direction) is deformed by pressure by about 10% to 40%. By applying stress between the first electrode 110, the conductive particle 10, and the second electrode 114, the first resin 20 and the second resin 30 are excluded from the contact portion between the first electrode 110 and the conductive particle 10, and the contact portion between the second electrode 114 and the conductive particle 10. Furthermore, even if a natural oxide film is formed on the first electrode 110, the conductive particles 10, or the second electrode 114 and the surface is insulated, the natural oxide film can be broken and a conductive path can be formed by pressing the first electrode 110 and the second electrode 114 with the conductive particles 10 interposed therebetween. Furthermore, by deforming the conductive particles 10, the contact area between the first electrode 110 and the conductive particles 10 and the contact area between the second electrode 114 and the conductive particles 10 can be increased. By configuring in this way, the conductive particles 10 can electrically connect the first electrode 110 and the second electrode 114.

[0050] A plurality of conductive particles 10 are dispersed in the first resin 20 and the second resin 30 between the first electrode 110 and the second electrode 114. Each conductive particle 10 is surrounded by the first resin 20 in the surface direction (D2-D3 surface direction) on the first electrode 110. Each conductive particle 10 is surrounded by the second resin 30 in the surface direction (D2-D3 surface direction) on the second electrode 114. The first resin 20 and the second resin 30 are insulating resins. Therefore, the connection structure 100 has insulating properties in the surface direction (D2-D3 surface direction). However, the plurality of conductive particles 10 disposed between the first electrode 110 and the second electrode 114 facing each other and adjacent in the surface direction (D2-D3 surface direction) may also contact each other. When the conductive particles 10 adjacent in the surface direction (D2-D3 surface direction) contact each other, the adjacent conductive particles 10 are also electrically connected to each other. By arranging in this way, the conductive particles 10 can more reliably electrically connect the first electrode 110 and the second electrode 114 facing each other. The distance between adjacent conductive particles 10 can be appropriately controlled by the concentration of the conductive particles 10 mixed in the first composition 20' described below.

[0051] like Figure 1As shown in (A) and (B), a plurality of conductive particles 10 and a first resin 20 are arranged on the upper surface of a first electrode 110. When observed in the opposite direction of the electrodes (D1 direction), a plurality of conductive particles 10 and a first resin 20 are arranged in each certain area. In the present embodiment, the diameter of the conductive particles 10 observed in the opposite direction of the electrodes (D1 direction) is in the range of 2 μm or more and 10 μm or less. The number of areas where the conductive particles 10 and the first resin 20 are arranged on the upper surface of one first electrode 110 is preferably 1 or more, and each area is separated by 5 μm or more. The number of conductive particles 10 in one area where the conductive particles 10 and the first resin 20 are arranged is preferably 1 or more and 7 or less. The number of conductive particles 10 arranged in one area is more preferably 3, and the next preferably 7. When viewed in the opposing direction of the electrodes (direction D1), the number of the conductive particles 10 disposed between the first electrode 110 and the second electrode 114 that face each other is preferably 7 particles / 400 μm. 2 More than 20 pieces / 400μm 2 The number of the conductive particles 10 is less than 7 / 400 μm. 2 When the number of the conductive particles 10 is more than 20 / 400 μm, the connection resistance value may tend to vary. 2 In the case of , the pressure deformation of the conductive particles 10 may be reduced due to load dispersion, and the natural oxide film in the connection area may not be broken, resulting in increased connection resistance. 2 In the case of , the time-dependent change of the pressurized deformation amount is likely to occur, and thus the time-dependent change of the connection resistance is likely to occur. By configuring in this way, the conductive particles 10 can reliably connect the first electrode 110 and the second electrode 114 facing each other, and can prevent short circuits between a plurality of first electrodes 110 adjacent to each other in the plane direction (D2-D3 plane direction), between a plurality of second electrodes 114 adjacent to each other in the plane direction (D2-D3 plane direction), and between the first electrode 110 and the second electrode 114 not facing each other.

[0052] In the present embodiment, the shape of the region where the conductive particles 10 and the first resin 20 are arranged observed in the opposite direction of the electrodes (D1 direction) is circular. However, it is not limited to this, and the region where the conductive particles 10 and the first resin 20 are arranged can adopt any shape as long as the above conditions are met. In the present embodiment, two regions where the conductive particles 10 and the first resin 20 are arranged are arranged on the upper surface of one first electrode 110. In addition, 7 conductive particles 10 are arranged in one region. However, it is not limited to this, and the number of regions where the conductive particles 10 and the first resin 20 are arranged on the upper surface of one first electrode 110 can be adjusted appropriately according to the area of ​​the upper surface of the first electrode 110, the area of ​​the region where the conductive particles 10 and the first resin 20 are arranged, and the size of the conductive particles 10. In addition, the number of conductive particles 10 arranged in one region can be adjusted appropriately according to the size and concentration of the conductive particles 10 as long as the above conditions are met.

[0053] The second resin 30 is further arranged between the first surface of the first member 102 and the second surface of the second member 112. The second resin 30 is arranged in the region other than between the first electrode 110 and the second electrode 114 facing each other. The second resin 30 is arranged between the region other than the first electrode of the first surface and the region other than the second electrode of the second surface. That is, the second resin 30 is arranged between and around the plurality of first electrodes 110 adjacent in the surface direction (D2-D3 surface direction) (between and around the plurality of second electrodes 114 adjacent in the surface direction (D2-D3 surface direction)). Furthermore, the second resin 30 is also arranged in the region other than the region where the conductive particles 10 and the first resin 20 are arranged between the first electrode 110 and the second electrode 114. The second resin 30 is arranged between and around the plurality of regions where the conductive particles 10 and the first resin 20 are adjacent in the surface direction (D2-D3 surface direction). In other words, the conductive particles 10 and the first resin 20 are surrounded by the second resin 30 in the plane direction (D2-D3 plane direction). That is, when viewed from the direction opposite to the electrodes (D1 direction), on the first surface of the first electronic element 101, the plurality of conductive particles 10 are surrounded by the first resin 20, and the first resin 20 is surrounded by the second resin 30. Figure 1As shown in (B) and (C), the second resin 30 is further arranged in the region between the first electrode 110 and the second electrode 114 where the conductive particles 10 and the first resin 20 are arranged. The second resin 30 is arranged between the first resin 20 and the second electrode 114. That is, when observed in the opposite direction of the electrodes (D1 direction), on the second surface of the second electronic element 111, a plurality of conductive particles 10 are surrounded by the second resin 30. The second resin 30 is an insulating resin. Therefore, the connection structure 100 has insulating properties in the surface direction (D2-D3 surface direction). By configuring in this way, the second resin 30 can reliably insulate between a plurality of first electrodes 110 adjacent in the surface direction (D2-D3 surface direction), between a plurality of second electrodes 114 adjacent in the surface direction (D2-D3 surface direction), and between the first electrode 110 and the second electrode 114 that are not facing each other.

[0054] The first resin 20 and the second resin 30 are arranged between the first electrode 110 and the second electrode 114. They are arranged in such a manner that "the first resin 20 contacts the first electrode 110, and the second resin 30 contacts the second electrode 114". That is, the first resin 20 and the second resin 30 contact in the plane direction (D2-D3 plane direction) between the first electrode 110 and the second electrode 114, and are stacked in the direction (D1 direction) of the electrodes facing each other.

[0055] The boundary between the first resin 20 and the second resin 30 can be confirmed by observing the cross section of the connection structure 100. Since the first resin 20 and the second resin 30 have different compositions, the boundary between the first resin 20 and the second resin 30 can also be determined by using a processing / observation device such as a focused ion beam processing and observation device (FIB), a scanning electron microscope (SEM), or a transmission electron microscope (TEM).

[0056] When the first composition 20' and the second composition 30' described below are difficult to dissolve in each other, the boundary between the first resin 20 and the second resin 30 can be confirmed as an interface. When the first composition 20' and the second composition 30' have similar compositions and the interface disappears in the following steps, a boundary layer in which the first resin 20 and the second resin 30 are mixed may be observed.

[0057] The first electronic element 101 may be, for example, a flat panel display such as a liquid crystal display, an organic EL display, or a plasma display, and the first member 102 may be, for example, an insulating substrate such as a glass substrate or a transparent film substrate. The first electrode 110 may be, for example, an external connection terminal provided on the display. The first electrode 110 and the terminal 104 may be formed of transparent conductive materials such as ITO (indium tin oxide) and IZO (indium zinc oxide), metals such as copper (Cu), aluminum (Al), molybdenum (Mo), and titanium (Ti), and alloys containing at least one of them (Mo-Ti alloy, etc.), and laminated structures of these materials (Mo / Cu laminated structure, Mo-Ti alloy / Cu laminated structure, Mo / Al laminated structure, Mo / Al / Mo laminated structure, Al / Ti laminated structure, etc.).

[0058] The second electronic element 111 may be a Si chip formed with an integrated circuit. In this case, the second electrode 114 is equivalent to an external connection terminal (pad) provided on the integrated circuit. The second member 112 is preferably a silicon substrate, a SiC substrate, a sapphire substrate, a plastic substrate, etc. The second electrode 114 is preferably formed by gold (Au) or gold plating on the surface of copper (Cu). When the second electronic element 111 is, for example, a flexible printed substrate, the second member 112 is preferably an insulating polymer film such as polyimide or para-polyamide. The second electrode 114 is, for example, equivalent to an external connection terminal provided on a flexible printed substrate, generally formed of copper (Cu), and gold-plated on the surface.

[0059] There is no particular limitation on the size of each electrode of the first electrode 110 and the second electrode 114 observed in the opposite direction (D1 direction). There is no particular limitation on the distance between the plurality of first electrodes 110 adjacent to each other in the surface direction (D2-D3 surface direction) (the distance between the plurality of second electrodes 114 adjacent to each other in the surface direction), for example, it can be 5 μm or more. By adopting such a structure, the first electrode 110 and the second electrode 114 can be electrically connected without damaging the insulation. In the present embodiment, the first electrode 110 and the second electrode 114 are arranged in a row at one end of the first electronic component 101 and the second electronic component 111 with their short sides arranged side by side. However, this is not limited to this, and the first electrode 110 and the second electrode 114 can also be arranged in multiple columns, or in a zigzag lattice shape.

[0060] The conductive particles 10 included in the connection structure 100 may be oblate spherical. The diameter (major axis) of the conductive particles 10 observed in the direction opposite to the electrodes (D1 direction) is in the range of 2 μm to 10 μm. The conductive particles 10 may be originally spherical with the above-mentioned major axis as the diameter, and may be deformed to be flat in the direction opposite to the electrodes (D1 direction) in the range of 10% to 40% relative to 100% of the major axis by the following connection structure manufacturing method. The diameter (major axis) and the pressure deformation amount of the conductive particles 10 may be appropriately selected within the above range according to the types of the first electronic component 101 and the second electronic component 111, and the manufacturing method of each connection structure. In the present embodiment, the conductive particles 10 are as follows. Figure 1 (D) shows a perfect spherical shape. However, it is not limited to this, for example, Figure 1 (E) shows a spherical shape with a plurality of protrusions on the surface (spike-tooth spherical shape). By having fine protrusions on the surface of a spherical shape like this, it is more preferable because, for example, the natural oxide film in the connection area can be broken.

[0061] The material of the conductive particles 10 is not particularly limited, and can be appropriately selected from known conductive particles. Figure 1 As shown in (D) and (E), metal-coated particles may be used, and the metal-coated particles have coating layers 10b and 10c that coat a particle core 10a obtained by coating a high-hardness resin material with a rubber-like elastic resin or a high-hardness inorganic material with a rubber-like inorganic elastic body with a metal such as nickel (Ni), copper (Cu), and gold (Au). The metal coating can be formed into a Ni / Cu stacked structure, a Ni / Au stacked structure, or a Cu / Au stacked structure by, for example, a drum sputtering method, a metal nanoparticle plating method, an electroless plating method, an ultrasonic plating method, or the like.

[0062] The first resin 20 and the second resin 30 are formed by curing the first composition 20' and the second composition 30' containing different materials. The materials of the first composition 20' and the second composition 30' are not particularly limited, and can be appropriately selected from known curable resin materials. In the present embodiment, the curable resin materials of the first composition 20' and the second composition 30' both contain free radical polymerization resins. As free radical polymerization resin materials, (meth) acrylic monomers or (meth) acrylate oligomers are preferred, and ester-type bonds are more preferred. (Meth) acrylic oligomers have more than one (meth) acryloyl group, for example, epoxy acrylate, acrylic urethane, polyester acrylate, polybutadiene acrylate, polyol acrylate, polyether acrylate, silicone resin acrylate, melamine acrylate, etc. can be used. It can be any one of monofunctionality and multifunctionality, and more preferably contains multifunctional monomers or oligomers. The curable resin material can be composed of two or more selected from (meth)acrylate monomers and (meth)acrylate oligomers.

[0063] As the curable resin material of the second composition 30', a material with a low volume shrinkage during curing is particularly preferred. Therefore, the (meth)acrylic monomer compound may contain, for example, an amide hydroxymethyl structural part, and may also contain a dendritic polymer or a hyperbranched polymer structural part. During photocuring, the (meth)acrylic monomer compound having an amide hydroxymethyl structural part is polymerized with the carbon-carbon double bonds derived from the (meth)acrylic acid, and the methylene-oxygen of the amide hydroxymethyl structural part is cut. Therefore, the second composition 30' contains at least one -CO-NH-CH 2 By using a (meth) acrylic monomer compound having an amide hydroxymethyl structural part consisting of -O- as a curing component, the volume shrinkage of the second resin 30 caused by curing the second composition 30' can be further suppressed, and the warping caused by the difference in bending rigidity between the first electronic component 101 and the second electronic component 111 can be suppressed. By including a dendritic polymer or a hyperbranched polymer structural part having an acryloyl group arranged in the branch, the van der Waals distance between the branch branches is shorter than the van der Waals distance of a normal molecule. Therefore, by including a dendritic polymer or a hyperbranched polymer structural part having an acryloyl group arranged in the second composition 30' as a curing component, the volume shrinkage of the second resin 30 caused by curing the second composition 30' can be further suppressed, and the warping caused by the difference in bending rigidity between the first electronic component 101 and the second electronic component 111 can be suppressed.

[0064] As the curable resin material of the second composition 30', it is preferred to use a fluorene-based acrylate. The second composition 30' may include an ene / thiol-based curable resin as a curing component, and the ene / thiol-based curable resin contains a compound having an ethylenically unsaturated double bond and a thiol compound, and at least one of these components may include a compound having a 9,9-diarylfluorene skeleton. As a 9,9-diarylfluorene compound, a 9,9-diarylfluorene compound having an ethylenically unsaturated bond and / or a 9,9-diarylfluorene compound having a mercapto group may be included. As an ethylenically unsaturated compound, for example, 9,9-bis(4-acryloyloxyethoxyphenyl)fluorene (manufactured by Osaka Gas Chemical (Co., Ltd.), OGSOL EA-0200), phenoxyethyl acrylate (manufactured by Kyoeisha Chemical (Co., Ltd.), Light Acrylate POA) can be used. As a thiol compound, for example, pentaerythritol tetrakis(3-mercaptobutyrate) (manufactured by Showa Denko (Co., Ltd.), Karenz MT PE1) can be used. The second composition 30 ′ containing such a curable resin material can further suppress the volume shrinkage of the second resin 30 caused by curing the second composition 30 ′, and can suppress warping caused by the difference in flexural rigidity between the first electronic component 101 and the second electronic component 111 .

[0065] As the curable resin material of the second composition 30', a material obtained by treating an ene / thiol curable resin with an oxidizing compound may also be used. The ene / thiol curable resin includes: an ene compound having two or more functional groups selected from the group consisting of allyl ether groups, vinyl ether groups, acrylate groups and methacrylate groups in the molecule, or a mixture of two or more of the above ene compounds; and a thiol compound having two or more thiol groups in one molecule. As a compound having two or more mercapto groups in one molecule, esters of mercaptocarboxylic acid and polyols, aliphatic polythiols and aromatic polythiols, and other polythiols may be included, and one or more of them may be used. For the oxidizing compound treatment, it is preferably carried out using a gas with oxidizing ability. The gas with oxidizing ability is a compound that has the properties of a gas under the temperature and pressure conditions of the oxidizing compound treatment and has oxidizing ability. As the gas with oxidizing ability, air, oxygen, ozone, etc. may be used, and a mixed gas containing part of them may also be used. By treating the photocurable resin material with an oxidizing compound, the second composition 30' can improve its stability over time.

[0066] The materials of the first composition 20' and the second composition 30' further include a photocuring initiating component. The photocuring initiating component can be any compound that generates free radicals by irradiating ultraviolet rays or visible light as a photoradical initiator. As an ultraviolet free radical initiator, for example, acetophenone-based initiators, benzoin ether-based initiators, benzophenone-based initiators, α-diketone-based initiators, and thioxanthone-based initiators can be used. As a visible light free radical initiator, for example, camphorquinone-based compounds and acylphosphine oxide compounds can be used. In addition, it can also be a component that is classified as an ultraviolet free radical initiator but can be used together with a sensitizer to initiate visible light free radicals. The sensitizer can be used appropriately as needed. As a sensitizer, a known compound can be used, for example, an amine compound and (meth) acrylates of alkanolamines can be used. A variety of photocuring initiating components and sensitizers can be used together. For example, an ultraviolet free radical initiator and a visible light free radical initiator can be used together to expand the wavelength region in which curing can be performed. The photocuring initiating component is more preferably a photo-radical initiator that generates free radicals within a range of 300 nm to 500 nm of wavelength of irradiated light. The photocuring initiating component is formulated so that the curable resin material can be cured at room temperature within a light irradiation time of preferably about 3 seconds or less, more preferably 1 second or less. In addition, the curable resin material is also appropriately selected so that it can be cured at room temperature within such a time.

[0067] In the present embodiment, the first composition 20' and the second composition 30' further preferably include a shielding curing active compound, such as a chain transfer agent. The chain transfer agent transfers the free radicals generated by light irradiation to the shielding portion that the light does not directly reach. The chain transfer agent can, for example, use a compound containing at least one selected from a carbamate bond, a urea bond, or an isocyanate group, and at least one alkoxysilyl group. In the photocuring reaction using the above-mentioned chain transfer agent, a polyol having a hydroxyl group as an anion is produced as a by-product. The polyol causes an ester exchange reaction with the alkoxysilyl group contained in the chain transfer agent, thereby further curing. That is, by including a chain transfer agent, free radical curing and anion curing are simultaneously produced, and the shielding portion that the light does not directly reach can be cured.

[0068] By making the first composition 20' and the second composition 30' contain a shielding portion curable active compound, the first composition 20' and the second composition 30' can be reliably cured even under the conditions of the materials and connection methods of the first electronic component 101, the second electronic component 111, the first electrode 110, and the second electrode 114, which cannot cure the first composition 20' and the second composition 30' only by the action of the photocuring initiating component generated by light irradiation.

[0069] In the present embodiment, the material of the first composition 20' may further include an anaerobic curing initiation component. The anaerobic curing initiation component may use a known system including an organic peroxide and a curing accelerator. For example, the organic peroxide may use hydrogen peroxides, ketone peroxides, diacyl peroxides, peroxyesters, etc. As a curing accelerator, for example, o-benzoylsulfonyl imide (saccharin), hydrazine compounds, amine compounds, thiol compounds, etc. may be used. A variety of anaerobic curing initiation components and curing accelerators may also be used together.

[0070] In the present embodiment, the first composition 20' is surrounded by the first surface (including the first electrode 110), the second surface (including the second electrode 114), and the second composition 30'. Furthermore, the first composition 20' contacts the first electrode 110, the second electrode 114, and the conductive particles 10. When the first composition 20' includes an anaerobic curing initiating component, since the first electrode 110, the second electrode 114, and the conductive particles 10 contain a transition metal component, the peroxide is decomposed by the redox reaction of the curing accelerator and the transition metal ions, thereby initiating anaerobic curing of the first composition 20'.

[0071] By making the first composition 20' further include an anaerobic curing initiating component, the first composition 20' can be reliably cured even under conditions such as the materials and connection methods of the first electronic component 101, the second electronic component 111, the first electrode 110, and the second electrode 114, where the first composition 20' cannot be cured using only the action of the photocuring initiating component generated by light irradiation.

[0072] Additives can be used appropriately as needed to improve or change properties such as fluidity, coating characteristics, preservation, curing characteristics, and physical properties after curing. As additives, known compounds can be used, for example, silane coupling agents, diluents, modifiers, surfactants, storage stabilizers, defoamers, leveling agents, etc. can be listed, but are not limited to these. As silane coupling agents, for example, epoxy systems, amino systems, mercapto-sulfide systems, urea systems, etc. can be used, but are not particularly limited. By adding silane coupling agents, the adhesion on the interface of organic materials and inorganic materials is improved.

[0073] The viscosity of the first composition 20' is higher than the viscosity of the second composition 30'. The viscosity of the first composition 20' is 5×10 3 cP or more and 5×10 5 The viscosity of the second composition 30' is 2×10 3 cP or more and 2×10 5cP or less. The difference between the viscosity of the first composition 20' and the viscosity of the second composition 30' is 2 times or more. The viscosity of the first composition 20' and the second composition 30' can also be controlled by the degree of polymerization of the resin material contained in the first composition 20' and the second composition 30'. The viscosity of each composition can be appropriately selected from the above range according to the type of the first electronic component 101 and the second electronic component 111, the method for making the connection structure, the method for configuring the composition, etc. When the viscosity of the first composition 20' is less than 5×10 3 cP, the uniform dispersibility of the conductive particles 10 deteriorates, and sedimentation or aggregation is easily generated. By making the viscosity of the first composition 20' higher than the viscosity of the second composition 30', the flow of the conductive particles 10 mixed in the first composition 20' can be suppressed, so that the conductive particles 10 can be efficiently arranged between the first electrode 110 and the second electrode 114. Therefore, the connection reliability between the first electrode 110 and the second electrode 114 can be ensured.

[0074] The first resin 20 and the second resin 30 are formed by curing the first composition 20' and the second composition 30'. The volume shrinkage of the first resin 20 generated by curing the first composition 20' and the volume shrinkage of the second resin 30 generated by curing the second composition 30' are preferably 4% or less, and more preferably 2% or less. If the volume shrinkage of the first resin 20 and the second resin 30 is greater than 4%, internal shrinkage stress is generated, and warping is easily generated due to the difference in bending rigidity between the first electronic component 101 and the second electronic component 111, thereby reducing the physical connection reliability of the first electronic component 101 and the second electronic component 111.

[0075] The first resin 20 preferably has high adhesion to conductive materials such as metal materials and metal oxide materials. The first resin 20 preferably has high adhesion to metal materials forming the first electrode 110 and the second electrode 114, for example, preferably has high adhesion to Au and ITO. The second resin 30 preferably has high adhesion to resin materials. The second resin 30 preferably has high adhesion to insulating film materials forming the first surface of the first component 102 and the second surface of the second component 112, for example, preferably has high adhesion to insulating materials such as polyimide, para-polyamide film, P-SiNx, and glass. The adhesion of the first resin 20 is preferably within a range of 500 N / m or more. The adhesion of the second resin 30 is preferably within a range of 700 N / m or more. The adhesion, glass transition temperature, and hardness of each resin can be appropriately selected according to the types of the first electronic component 101 and the second electronic component 111, and the method for making the connection structure. By selecting the first resin 20 and the second resin 30 according to the materials of the adherends, the bonding strength between the first surface of the first member 102 and the second surface of the second member 112 can be further improved. Therefore, the physical connection reliability between the first electronic component 101 and the second electronic component 111 can be improved.

[0076] [Method for producing a connected structure]

[0077] Next, use Figures 2 to 5 , a method for manufacturing a connection structure according to an embodiment of the present invention is described. In addition, in this embodiment, since the existing first electronic component 101 and second electronic component 111 can be used, their description is omitted. Figures 2 to 5 Detailed description will be given of a method for forming the connection structure 100 .

[0078] First, a plurality of conductive particles 10 and a first composition 20' are arranged in a given area on the first electrode 110. The plurality of conductive particles 10 and the first composition 20' are mixed and arranged using an offset printing method. Since the mixture of the conductive particles 10 and the first composition 20' contains the conductive particles 10, a pad printing method using a pad to transfer the printed matter is particularly preferred. Figures 2 to 5 A method of arranging the plurality of conductive particles 10 and the first composition 20 ′ will be described.

[0079] Figure 2 This shows a step of arranging a mixture of a plurality of conductive particles 10 and a first composition 20 ′ on a plate 220 . Figure 3 yes Figure 2C-C' cross-sectional view. In the present embodiment, the plate 220 is, for example, a non-horizontal plate. The plate 220 has a recess 226 on the first surface of the first component 102 corresponding to the area where the plurality of conductive particles 10 and the first composition 20' are arranged. The plate 220 includes a lyophilic layer 222 and a lyophobic layer 224. The lyophobic layer 224 is arranged on the liquid contact surface and has an opening. The lyophobic layer 224 exposes the lyophilic layer 222 at the opening. That is, the lyophobic layer 224 is arranged on the upper surface of the plate 220, and the lyophilic layer 222 is arranged on the bottom surface of the recess 226.

[0080] The material of the lyophilic layer 222 can be, for example, aluminum oxide (Al 2 O 3 ). The material of the lyophobic layer 224 is preferably, for example, an elastic silicone resin. The depth of the recess 226 is approximately the same as the thickness of the lyophobic layer 224. The depth of the recess 226 only needs to be greater than the diameter of the conductive particle 10. In addition to the non-horizontal plate, the plate 220 can also be a glass flat concave plate, a stainless steel flat concave plate, a sapphire flat concave plate, or a zirconium oxide flat concave plate. The recesses 226 observed from the upper surface of the plate 220 are preferably spaced apart by more than 5 μm. When the recesses 226 are only less than 5 μm apart, the lyophobic layer 224 separating adjacent recesses 226 is sometimes easily damaged and the durability of the plate 220 is reduced.

[0081] In the present embodiment, the shape of the recess 226 observed in the opposite direction of the electrode (D1 direction) is circular. In addition, the recess 226 has the same shape in the depth direction. That is, the recess 226 has a shape obtained by cutting a cylinder from the plate 220. However, this is not limited to this, and the shape of the recess 226 can be any shape as long as the depth is within the above range.

[0082] In this embodiment, a mixture of the conductive particles 10 and the first composition 20' is placed on a plate 220 using a roller 210. Figure 2 (A)~(C) and Figure 3 As shown in (A) to (C), the roller 210 moves from one end to the other end of the plate 220 while rotating so that the outer peripheral surface of the roller 210 contacts the upper surface of the plate 220 (the upper surface of the liquid-repellent layer 224 ), thereby arranging the conductive particles 10 and the first composition 20 ′ in the recessed portions 226 .

[0083] The concentration of the conductive particles 10 mixed in the first composition 20' is preferably in the range of 20% by volume or more and 60% by volume or less relative to the total volume of the conductive particles 10 and the first composition 20'. If the amount of the conductive particles 10 blended is less than 20% by volume, it is difficult to fill a sufficient amount of the conductive particles 10 into the recess 226. If the amount of the conductive particles 10 blended is greater than 60% by volume, the workability is deteriorated, and it is difficult to fill the mixture of the conductive particles 10 and the first composition 20' into the recess 226. The conductive particles 10 and the first composition 20' are filled into the recess 226 of the plate 220 by placing the mixture of the conductive particles 10 and the first composition 20' using the roller 210. Since the recess 226 has a depth within the above range, one conductive particle 10 can be held in the depth direction (D1 direction) of the recess 226. The number of conductive particles 10 disposed in one concave portion 226 is preferably 1 or more and 7 or less. The number of conductive particles 10 disposed in one concave portion 226 is more preferably 3, and the next most preferably 7. By disposing in this way, in the step of transferring the mixture of the conductive particles 10 and the first composition 20' to the pad below, the conductive particles 10 and the first composition 20' can be efficiently transferred to the pad.

[0084] Since the recessed portion 226 has an opening of the elastic liquid-repellent layer 224, even if the conductive particles 10 abut against the liquid-repellent layer 224 due to the movement of the roller 210, the conductive particles 10 can be held in the recessed portion 226 without being damaged. Since the recessed portion 226 has the liquid-philic layer 222 at the bottom, the first composition 20' can be held. On the other hand, since the liquid-repellent layer 224 is disposed on the upper surface of the plate 220, the first composition 20' is repelled.

[0085] Figure 4 2 represents the step of transferring the mixture of the plurality of conductive particles 10 and the first composition 20' from the plate 220 to the pad 230. Figure 4 As shown in (A) to (C), the conductive particles 10 and the first composition 20' filled in the concave portion 226 are transferred to the glue head 230 by pushing the glue head 230 in a direction substantially perpendicular to the plate 220 and pulling it away in a direction substantially perpendicular to the plate 220. Since the viscosity of the first composition 20' is 5×10 3 cP or more and 5×10 5 Since the concentration of the conductive particles 10 mixed in the first composition 20 ′ is within the range of cP or less, the conductive particles 10 can be held on the surface of the pad 230 .

[0086] The material of the pad 230 is preferably, for example, a silicone resin having elasticity. The shape of the pad 230 preferably has at least a convex structure. The shape of the pad 230 can be appropriately selected according to the shapes of the first electronic component 101 and the plate 220 .

[0087] Figure 5 (A) to (B) represent the steps of transferring the mixture of the plurality of conductive particles 10 and the first composition 20' from the pad 230 to the first electrode 110. Figure 5 As shown in (A) to (B), the mixture of the conductive particles 10 and the first composition 20' transferred to the glue head 230 is transferred to the first electrode 110 by pushing the glue head 230 in a direction substantially perpendicular to the first electrode 110 and pulling the glue head 230 away in a direction substantially perpendicular to the first electrode 110. On the first surface of the first member 102, the conductive particles 10 and the first composition 20' form a convex structure in the direction opposite to the electrodes (direction D1). Since the viscosity of the curable resin material of the first composition 20' is 5×10 3 cP or more and 5×10 5 Since the concentration of conductive particles 10 mixed in the first composition 20' is within the range of cP or less, the conductive particles 10 can be held on the first electrode 110. By using such a method, the conductive particles 10 and the first composition 20' can be reliably arranged in a predetermined region on the first electrode 110.

[0088] Next, the second composition 30' is disposed on the first surface of the first member 102. Figure 5 As shown in (C), the second composition 30' is also arranged on the first surface of the first member 102, and the area outside the first electrode 110. That is, the second composition 30' is also arranged on the first electrode 110, and the area outside the area where the plurality of conductive particles 10 and the first composition 20' are arranged. Furthermore, the second composition 30' is also arranged on the area where the plurality of conductive particles 10 and the first composition 20' are arranged on the first electrode 110. That is, the second composition 30' is arranged on the first surface of the first member 102, and the area outside the first electrode 110 and the first electrode 110. In the present embodiment, the second composition 30' is in a paste form and is arranged using an inkjet method or a jet dispensing method. However, it is not limited thereto, and the method for configuring the second composition 30' can use an existing method. For example, inkjet or coating using a dispenser, screen printing, etc. can be used.

[0089] The viscosity of the second composition 30' is 2×10 3 cP or more and 2×10 5The viscosity of the first composition 20' only needs to be higher than the viscosity of the second composition 30' and the difference in viscosity is at least 2 times. Thus, the flow of the conductive particles 10 mixed in the first composition 20' can be suppressed, so that the conductive particles 10 can be retained on the first electrode 110.

[0090] Next, the second member 112 is mounted on the first surface of the first member 102. Figure 5 As shown in (D), the first surface of the first member 102 and the second surface of the second member 112 are arranged to face each other in such a manner that the corresponding plurality of first electrodes 110 and the plurality of second electrodes 114 are respectively opposed. The first member 102 and the second member 112 are pressed so that the first surface of the first member 102 and the second surface of the second member 112 are pressed in a direction substantially perpendicular to each surface. The first surface of the first member 102 and the second surface of the second member 112 are pressed against the conductive particles 10, the first composition 20', and the second composition 30'. At this time, the first composition 20' arranged on the first electrode 110 is held on the first electrode 110 together with the conductive particles 10 because of its higher viscosity than the second composition 30'. Since the second composition 30' arranged on the conductive particles 10 and the first composition 20' on the first electrode 110 has a lower viscosity than the first composition 20', most of it moves to a region other than the region where the conductive particles 10 and the first composition 20' are arranged. That is, by applying stress between the first surface of the first member 102 and the second surface of the second member 112, most (most) of the second composition 30' located between the second electrode 114 and the first composition 20' moves, thereby excluding the second composition 30' located between the second electrode 114 and the conductive particles 10. Furthermore, the first composition 20' and the conductive particles 10 forming the convex structure on the first surface of the first member 102 are buried by the second composition 30'. In other words, most of the second composition 30' is arranged on the first surface of the first member 102 in a region other than the region (convex structure) where the plurality of conductive particles 10 and the first composition 20' are arranged. The conductive particles 10 disposed on the first electrode 110 are in contact with the second electrode 114 , and the second composition 30 ′ is in contact with the first surface region other than the first electrode 110 and the second surface region other than the second electrode 114 and the second electrode 114 .

[0091] like Figure 5As shown in (E), the first member 102 and the second member 112 are further pressed, so that the first surface of the first member 102 and the second surface of the second member 112 are pushed in a direction substantially perpendicular to each surface. At this time, sufficient pressure is applied so that the first electrode 110 and the second electrode 114 facing each other contact the upper and lower parts of one conductive particle 10. The pressure for pushing the first surface of the first member 102 and the second surface of the second member 112 can be appropriately adjusted according to the repulsive force of the conductive particle 10 and the elastic force of the first composition 20' and the second composition 30'.

[0092] Here, the pressure is applied until the conductive particle 10 is deformed into an oblate spheroid due to the pressure from the first electrode 110 and the second electrode 114. The pressure deformation amount of the conductive particle 10 is controlled within a range of 10% or more and 40% or less relative to 100% of the major axis of the conductive particle 10. At this time, by applying stress between the first electrode 110, the conductive particle 10, and the second electrode 114, the first composition 20' and the second composition 30' between the first electrode 110 and the conductive particle 10, and between the second electrode 114 and the conductive particle 10 are excluded. Furthermore, even if a natural oxide film is formed on the first electrode 110, the conductive particle 10, or the second electrode 114 and the surface is insulated, the first electrode 110 and the second electrode 114 can be pressed and bonded with the conductive particle 10 sandwiched therebetween, thereby breaking through the natural oxide film and forming a conductive path. By deforming the conductive particles 10, the contact area between the first electrode 110 and the conductive particles 10 and the contact area between the second electrode 114 and the conductive particles 10 can be increased. By disposing the conductive particles 10 in this manner, the conductive particles 10 can electrically connect the first electrode 110 and the second electrode 114.

[0093] In a state where the first member 102 and the second member 112 are pressed, the connection structure 100 is irradiated with light. The wavelength region of the light is preferably ultraviolet light and / or visible light region, and ultraviolet light is more preferred. The wavelength region of the light can be appropriately selected according to the photocuring initiating components contained in the first composition 20' and the second composition 30'. The direction of light irradiation can be appropriately selected from the first electronic component 101 side or the second electronic component 111 side according to the wavelength region of the light and the materials of the first member 102 and the second member 112. In addition, it is also preferred to irradiate from both sides, and irradiation from the side without a shield is also effective. The irradiation time of light can be appropriately selected according to the photocuring initiating components and curable resin materials contained in the first composition 20' and the second composition 30'. Generally, it is preferably about 3 seconds or less, and more preferably about 1 second or less. In other words, the light irradiation intensity, photocuring initiating components, and curable resin materials are appropriately selected in such a way that room temperature curing can be performed within such a time.

[0094] By light irradiation, most of the first composition 20' and the second composition 30' contained in the connection structure 100 are cured at room temperature. However, there may be insufficient curing between the first electrode 110 and the second electrode 114 where the light does not fully reach. Therefore, the material of the first composition 20' more preferably includes a shielding portion curing active compound or an anaerobic curing initiating component. By including a shielding portion curing active compound or an anaerobic curing initiating component, room temperature curing can be promoted even in the portion where the light does not fully reach. By curing the first composition 20' and the second composition 30', the first resin 20 and the second resin 30 are formed. By adopting such a structure, the first surface of the first electronic component 101 can be physically connected to the second surface of the second electronic component 111.

[0095] According to this embodiment, a method for manufacturing a connection structure and a connection structure can be provided, which can ensure the conductivity between the electrodes facing each other and suppress the short circuit between adjacent connection electrodes even if the electrodes arranged on the electronic element are highly refined and highly dense by a simple process. Furthermore, since a heat curing connection method is not used, the electrodes of the upper and lower substrates with different thermal expansion coefficients can be connected to each other with high precision.

[0096] <Second embodiment>

[0097] The structure of the connection structure involved in this embodiment is the same as that of the connection structure involved in the first embodiment. The method for preparing the connection structure involved in this embodiment is the same as the method for preparing the connection structure involved in the first embodiment except that the second composition 30' is arranged on the second electrode 114 of the second surface and the area outside the second electrode 114. The same description as that of the first embodiment is omitted, and only the parts different from the method for preparing the connection structure involved in the first embodiment are described here.

[0098] [Method for producing a connected structure]

[0099] use Figure 6 A method for manufacturing a connection structure according to an embodiment of the present invention is described. In addition, in this embodiment, since the existing first electronic element 101 and second electronic element 111 can be used, their description is omitted. Figure 6 In the following, a method for forming the connection structure 100 is described in detail.

[0100] First, a plurality of conductive particles 10 and a first composition 20' are arranged in a given area on the first electrode 110. The plurality of conductive particles 10 and the first composition 20' are mixed and arranged using an offset printing method. Since the mixture of the conductive particles 10 and the first composition 20' contains the conductive particles 10, a pad printing method using a pad to transfer the printed matter is particularly preferred. The area and method for arranging the mixture of the plurality of conductive particles 10 and the first composition 20' are the same as the method for preparing the connection structure involved in the first embodiment, so they are omitted here.

[0101] Figure 6 (A) to (B) represent the steps of transferring the mixture of the plurality of conductive particles 10 and the first composition 20' from the pad 230 to the first electrode 110 by pad printing. Figure 6 As shown in (A) to (B), the mixture of the conductive particles 10 and the first composition 20' transferred to the glue head 230 is transferred to the first electrode 110 by pushing the glue head 230 in a direction substantially perpendicular to the first electrode 110 and pulling the glue head 230 away in a direction substantially perpendicular to the first electrode 110. On the first surface of the first member 102, the conductive particles 10 and the first composition 20' form a convex structure in the direction opposite to the electrodes (direction D1). Since the viscosity of the curable resin material of the first composition 20' is 5×10 3 cP or more and 5×10 5 Since the concentration of conductive particles 10 mixed in the first composition 20' is within the range of cP or less, the conductive particles 10 can be held on the first electrode 110. By using such a method, the conductive particles 10 and the first composition 20' can be reliably arranged in a predetermined region on the first electrode 110.

[0102] Next, the second composition 30' is disposed on the second surface of the second member 112. Figure 6 As shown in (C) to (D), the second composition 30' is arranged in an area other than the second electrode 114 on the second surface of the second member 112. Furthermore, the second composition 30' is also arranged in an area other than the area on the second electrode 114 where the plurality of conductive particles 10 and the first composition 20' are arranged as described below. The second composition 30' is also arranged in an area on the second electrode 114 where the plurality of conductive particles 10 and the first composition 20' are arranged as described below. That is, the second composition 30' is arranged on the second surface of the second member 112 on the second electrode 114 and in an area other than the second electrode 114. In the present embodiment, the second composition 30' is in a paste form and is arranged using an inkjet method or a jet dispensing method. However, it is not limited thereto, and the method for configuring the second composition 30' can use an existing method. For example, inkjet or coating using a dispenser, screen printing, etc. can be used.

[0103] The viscosity of the second composition 30' is 2×10 3 cP or more and 2×10 5 In this way, the flow of the second composition 30' can be suppressed.

[0104] Next, the second electronic component 111 is mounted on the first surface of the first electronic component 101. Figure 6 As shown in (E), the first surface of the first member 102 and the second surface of the second member 112 are arranged to face each other in such a manner that the corresponding plurality of first electrodes 110 and the plurality of second electrodes 114 are respectively opposed. The first member 102 and the second member 112 are pressed so that the first surface of the first member 102 and the second surface of the second member 112 are pressed in a direction substantially perpendicular to each surface. The first surface of the first member 102 and the second surface of the second member 112 are pressed against the conductive particles 10, the first composition 20', and the second composition 30'. At this time, the first composition 20' arranged on the first electrode 110 is held on the first electrode 110 together with the conductive particles 10 because of its higher viscosity than the second composition 30'. The second composition 30' arranged on the second electrode 114 is lower in viscosity than the first composition 20', so most of it moves to a region other than the region where the conductive particles 10 and the first composition 20' are arranged. That is, by applying stress between the first surface of the first member 102 and the second surface of the second member 112, the majority (most part) of the second composition 30' between the second electrode 114 and the first composition 20' moves, thereby excluding the second composition 30' between the second electrode 114 and the conductive particles 10. Furthermore, the first composition 20' and the conductive particles 10 forming the convex structure on the first surface of the first member 102 are buried by the second composition 30'. In other words, the second composition 30' is mostly arranged on the second surface of the second member 112 in the region other than the region (convex structure) where the plurality of conductive particles 10 and the first composition 20' are arranged. The arrangement is made in such a manner that "the conductive particles 10 arranged on the first electrode 110 contact the second electrode 114, and the second composition 30' contacts the region other than the first electrode 110 on the first surface and the region other than the second electrode 114 on the second surface and the second electrode 114".

[0105] like Figure 6As shown in (F), the first member 102 and the second member 112 are further pressed, so that the first surface of the first member 102 and the second surface of the second member 112 are pushed in the substantially perpendicular direction of each surface. At this time, sufficient pressure is applied so that the first electrode 110 and the second electrode 114 facing each other contact the upper and lower parts of one conductive particle 10. The pressure for pushing the first surface of the first member 102 and the second surface of the second member 112 can be appropriately adjusted according to the repulsive force of the conductive particle 10, the elastic force of the first composition 20' and the second composition 30'. By adopting such a structure, the first electrode 110 and the second electrode 114 can be electrically connected.

[0106] In a state where the first member 102 and the second member 112 are pressed, the connection structure 100 is irradiated with light to cure the first composition 20' and the second composition 30'. The method of curing the first composition 20' and the second composition 30' is the same as the method for preparing the connection structure involved in the first embodiment, so it is omitted here. By curing the first composition 20' and the second composition 30', the first resin 20 and the second resin 30 are formed. By adopting such a structure, the first surface of the first electronic component 101 and the second surface of the second electronic component 111 can be physically connected.

[0107] According to this embodiment, a method for manufacturing a connection structure and a connection structure can be provided, which can ensure the conductivity between the electrodes facing each other and suppress the short circuit between adjacent connection electrodes even if the electrodes arranged on the electronic element are highly refined and highly dense by a simple process. Furthermore, since a heat curing connection method is not used, the electrodes of the upper and lower substrates with different thermal expansion coefficients can be connected to each other with high precision.

[0108] <Third embodiment>

[0109] The structure of the connection structure according to the present embodiment is the same as that of the connection structure according to the first embodiment, except that the second resin 30 is arranged on the second electrode 114. The method for producing the connection structure according to the present embodiment is the same as that of the method for producing the connection structure according to the first embodiment, except that a mixture of a plurality of conductive particles 10 and a first composition 20' is arranged on the second electrode 114 on the second surface, and the second composition 30' is arranged on the first electrode 110 on the first surface and in an area other than the first electrode 110. The same description as that of the first embodiment is omitted, and only the parts different from the connection structure and the method for producing the connection structure according to the first embodiment are described here.

[0110] [Structure of the connection structure]

[0111] Figure 7The structure of a connection structure according to one embodiment of the present invention is shown. Figure 7 (A) is a plan view of a connection structure according to one embodiment of the present invention. Figure 7 (B) Yes Figure 7 (A) D-D' cross-section. Figure 7 (C) Yes Figure 7 (B) is an enlarged cross-sectional view of the conductive particles in the region E.

[0112] like Figure 7 As shown in (A) to (C), a plurality of conductive particles 10 are dispersed in the first resin 20 and the second resin 30 between the first electrode 110 and the second electrode 114. Each conductive particle 10 is surrounded by the first resin 20 in the surface direction (D2-D3 surface direction) on the second electrode 114. Each conductive particle 10 is surrounded by the second resin 30 in the surface direction (D2-D3 surface direction) on the first electrode 110. The first resin 20 and the second resin 30 are insulating resins. Therefore, the connection structure 100a has insulating properties in the surface direction (D2-D3 surface direction). However, a plurality of conductive particles 10 disposed between the first electrode 110 and the second electrode 114 facing each other and adjacent in the surface direction (D2-D3 surface direction) may also contact each other. When the conductive particles 10 adjacent in the surface direction (D2-D3 surface direction) contact each other, the adjacent conductive particles 10 are also electrically connected to each other. By arranging in this way, the conductive particles 10 can more reliably electrically connect the first electrode 110 and the second electrode 114 facing each other. The distance between adjacent conductive particles 10 can be appropriately controlled by the concentration of the conductive particles 10 mixed in the first composition 20' described below.

[0113] The second resin 30 is further arranged between the first surface of the first member 102 and the second surface of the second member 112. The second resin 30 is arranged in the region other than between the first electrode 110 and the second electrode 114 facing each other. The second resin 30 is arranged between the region other than the first electrode of the first surface and the region other than the second electrode of the second surface. That is, the second resin 30 is arranged between and around the plurality of first electrodes 110 adjacent in the surface direction (D2-D3 surface direction) (between and around the plurality of second electrodes 114 adjacent in the surface direction (D2-D3 surface direction)). Furthermore, the second resin 30 is also arranged in the region other than the region where the conductive particles 10 and the first resin 20 are arranged between the first electrode 110 and the second electrode 114. The second resin 30 is arranged between and around the region where the plurality of conductive particles 10 and the first resin 20 adjacent in the surface direction (D2-D3 surface direction) are arranged. In other words, the conductive particles 10 and the first resin 20 are surrounded by the second resin 30 in the plane direction (D2-D3 plane direction). That is, when viewed from the direction opposite to the electrodes (D1 direction), on the second surface of the second electronic element 111, the plurality of conductive particles 10 are surrounded by the first resin 20, and the first resin 20 is surrounded by the second resin 30. Figure 7 As shown in (B) and (C), the second resin 30 is further arranged in the region where the conductive particles 10 and the first resin 20 are arranged between the first electrode 110 and the second electrode 114. The second resin 30 is arranged between the first resin 20 and the first electrode 110. That is, when observed in the opposite direction of the electrodes (D1 direction), on the first surface of the first electronic element 101, a plurality of conductive particles 10 are surrounded by the second resin 30. The first resin 20 and the second resin 30 are insulating resins. Therefore, the connection structure 100a has insulating properties in the surface direction (D2-D3 surface direction). By configuring in this way, the second resin 30 can reliably insulate between a plurality of first electrodes 110 adjacent in the surface direction (D2-D3 surface direction), between a plurality of second electrodes 114 adjacent in the surface direction (D2-D3 surface direction), and between the first electrode 110 and the second electrode 114 that are not facing each other.

[0114] The first resin 20 and the second resin 30 are arranged between the first electrode 110 and the second electrode 114. They are arranged in such a manner that "the first resin 20 contacts the second electrode 114, and the second resin 30 contacts the first electrode 110". That is, the first resin 20 and the second resin 30 contact in the plane direction (D2-D3 plane direction) between the first electrode 110 and the second electrode 114, and are stacked in the direction (D1 direction) facing the electrodes.

[0115] [Method for producing a connected structure]

[0116] use Figure 8A method for manufacturing a connection structure according to an embodiment of the present invention is described. In addition, in this embodiment, since the existing first electronic element 101 and second electronic element 111 can be used, their description is omitted. Figure 8 Detailed description will be given of a method for forming the connection structure 100a.

[0117] First, a plurality of conductive particles 10 and a first composition 20' are arranged in a given area on the second electrode 114. The plurality of conductive particles 10 and the first composition 20' are mixed and arranged using an offset printing method. Since the mixture of the conductive particles 10 and the first composition 20' contains the conductive particles 10, a pad printing method using a pad to transfer the printed matter is particularly preferred. The area and method for arranging the mixture of the plurality of conductive particles 10 and the first composition 20' are the same as the method for preparing the connection structure involved in the first embodiment, so they are omitted here.

[0118] Figure 8 (A) to (B) show the steps of transferring the mixture of the plurality of conductive particles 10 and the first composition 20' from the pad 230 to the second electrode 114 by pad printing. Figure 8 As shown in (A) to (B), the mixture of the conductive particles 10 and the first composition 20' transferred to the glue head 230 is transferred to the second electrode 114 by pushing the glue head 230 in a direction substantially perpendicular to the second electrode 114 and pulling the glue head 230 away in a direction substantially perpendicular to the second electrode 114. On the second surface of the second member 112, the conductive particles 10 and the first composition 20' form a convex structure in the direction opposite to the electrodes (direction D1). Since the viscosity of the curable resin material of the first composition 20' is 5×10 3 cP or more and 5×10 5 Since the concentration of conductive particles 10 mixed in the first composition 20' is within the range of cP or less, the conductive particles 10 can be held on the second electrode 114. By using such a method, the conductive particles 10 and the first composition 20' can be reliably arranged in a predetermined region on the second electrode 114.

[0119] Next, the second composition 30' is disposed on the first surface of the first member 102. Figure 8As shown in (C) to (D), the second composition 30' is arranged in an area other than the first electrode 110 on the first surface of the first member 102. Furthermore, the second composition 30' is also arranged in an area other than the area on the first electrode 110 where a plurality of conductive particles 10 and the first composition 20' are arranged as described below. The second composition 30' is also arranged in an area on the first electrode 110 where a plurality of conductive particles 10 and the first composition 20' are arranged as described below. That is, the second composition 30' is arranged on the first surface of the first member 102 on the first electrode 110 and in an area other than the first electrode 110. In the present embodiment, the second composition 30' is in a paste form and is arranged using an inkjet method or a jet dispensing method. However, it is not limited thereto, and the method for configuring the second composition 30' can use an existing method. For example, inkjet or coating using a dispenser, screen printing, etc. can be used.

[0120] The viscosity of the second composition 30' is 2×10 3 cP or more and 2×10 5 In this way, the flow of the second composition 30' can be suppressed.

[0121] Next, the second electronic component 111 is mounted on the first surface of the first electronic component 101. Figure 8As shown in (E), the first surface of the first member 102 and the second surface of the second member 112 are arranged to face each other in such a manner that the corresponding plurality of first electrodes 110 and the plurality of second electrodes 114 are respectively opposed. The first member 102 and the second member 112 are pressed so that the first surface of the first member 102 and the second surface of the second member 112 are pressed in a direction substantially perpendicular to each surface. The first surface of the first member 102 and the second surface of the second member 112 are pressed against the conductive particles 10, the first composition 20', and the second composition 30'. At this time, the first composition 20' arranged on the second electrode 114 is held on the second electrode 114 together with the conductive particles 10 because it has a higher viscosity than the second composition 30'. The second composition 30' arranged on the first electrode 110 is lower in viscosity than the first composition 20', so most of it moves to a region other than the region where the conductive particles 10 and the first composition 20' are arranged. That is, by applying stress between the first surface of the first member 102 and the second surface of the second member 112, the majority (most part) of the second composition 30' between the first electrode 110 and the first composition 20' moves, thereby excluding the second composition 30' between the first electrode 110 and the conductive particles 10. Furthermore, the first composition 20' and the conductive particles 10 forming the convex structure on the second surface of the second member 112 are buried by the second composition 30'. In other words, the second composition 30' is mostly arranged on the first surface of the first member 102 in the region other than the region (convex structure) where the plurality of conductive particles 10 and the first composition 20' are arranged. The arrangement is made in such a manner that "the conductive particles 10 arranged on the second electrode 114 contact the first electrode 110, and the second composition 30' contacts the region other than the first electrode 110 on the first surface and the region other than the second electrode 114 on the second surface and the first electrode 110".

[0122] like Figure 8 As shown in (F), the first member 102 and the second member 112 are further pressed, so that the first surface of the first member 102 and the second surface of the second member 112 are pushed in the substantially perpendicular direction of each surface. At this time, sufficient pressure is applied so that the first electrode 110 and the second electrode 114 facing each other contact the upper and lower parts of one conductive particle 10. The pressure for pushing the first surface of the first member 102 and the second surface of the second member 112 can be appropriately adjusted according to the repulsive force of the conductive particle 10, the elastic force of the first composition 20' and the second composition 30'. By adopting such a structure, the first electrode 110 and the second electrode 114 can be electrically connected.

[0123] In a state where the first member 102 and the second member 112 are pressed, the connection structure 100a is irradiated with light to cure the first composition 20' and the second composition 30'. The method of curing the first composition 20' and the second composition 30' is the same as the method for preparing the connection structure involved in the first embodiment, so it is omitted here. By curing the first composition 20' and the second composition 30', the first resin 20 and the second resin 30 are formed. By adopting such a structure, the first surface of the first electronic component 101 and the second surface of the second electronic component 111 can be physically connected.

[0124] According to this embodiment, a method for manufacturing a connection structure and a connection structure can be provided, which can ensure the conductivity between the electrodes facing each other and suppress the short circuit between adjacent connection electrodes even if the electrodes arranged on the electronic element are highly refined and highly dense by a simple process. Furthermore, since a heat curing connection method is not used, the electrodes of the upper and lower substrates with different thermal expansion coefficients can be connected to each other with high precision.

[0125] <Fourth embodiment>

[0126] The structure of the connection structure involved in this embodiment is the same as that of the connection structure involved in the third embodiment. The method for preparing the connection structure involved in this embodiment is the same as the method for preparing the connection structure involved in the third embodiment, except that the second composition 30' is arranged on the second electrode 114 of the second surface and the area other than the second electrode 114. The same description as that of the first and third embodiments is omitted, and only the parts different from those of the method for preparing the connection structure involved in the first and third embodiments are described here.

[0127] [Method for producing a connected structure]

[0128] use Fig. 9 A method for manufacturing a connection structure according to an embodiment of the present invention is described. In addition, in this embodiment, since the existing first electronic element 101 and second electronic element 111 can be used, their description is omitted. Fig. 9 Detailed description will be given of a method for forming the connection structure 100a.

[0129] First, a plurality of conductive particles 10 and a first composition 20' are arranged in a given area on the second electrode 114. The plurality of conductive particles 10 and the first composition 20' are mixed and arranged using an offset printing method. Since the mixture of the conductive particles 10 and the first composition 20' contains the conductive particles 10, a pad printing method using a pad to transfer the printed matter is particularly preferred. The area and method for arranging the mixture of the plurality of conductive particles 10 and the first composition 20' are the same as the method for preparing the connection structure involved in the first embodiment, so they are omitted here.

[0130] Fig. 9 (A) to (B) show the steps of transferring the mixture of the plurality of conductive particles 10 and the first composition 20' from the pad 230 to the second electrode 114 by pad printing. Fig. 9 As shown in (A) to (B), the mixture of the conductive particles 10 and the first composition 20' transferred to the glue head 230 is transferred to the second electrode 114 by pushing the glue head 230 in a direction substantially perpendicular to the second electrode 114 and pulling the glue head 230 away in a direction substantially perpendicular to the second electrode 114. On the second surface of the second member 112, the conductive particles 10 and the first composition 20' form a convex structure in the direction opposite to the electrodes (direction D1). Since the viscosity of the curable resin material of the first composition 20' is 5×10 3 cP or more and 5×10 5 Since the concentration of conductive particles 10 mixed in the first composition 20' is within the range of cP or less, the conductive particles 10 can be held on the second electrode 114. By using such a method, the conductive particles 10 and the first composition 20' can be reliably arranged in a predetermined region on the second electrode 114.

[0131] Next, the second composition 30' is disposed on the second surface of the second member 112. Fig. 9 As shown in (C) to (D), the second composition 30' is arranged in an area other than the second electrode 114 on the second surface of the second member 112. Furthermore, the second composition 30' is also arranged in an area other than the area on the second electrode 114 where the plurality of conductive particles 10 and the first composition 20' are arranged. Furthermore, the second composition 30' is also arranged in the area on the second electrode 114 where the plurality of conductive particles 10 and the first composition 20 are arranged. That is, the second composition 30' is arranged on the second surface of the second member 112 on the second electrode 114 and in an area other than the second electrode 114. In the present embodiment, the second composition 30' is in a paste form and is arranged using an inkjet method or a jet dispensing method. However, it is not limited thereto, and the method for configuring the second composition 30' can use an existing method. For example, inkjet or coating using a dispenser, screen printing, etc. can be used.

[0132] The viscosity of the second composition 30' is 2×10 3 cP or more and 2×10 5 In this way, the flow of the second composition 30' can be suppressed.

[0133] Next, the second electronic component 111 is mounted on the first surface of the first electronic component 101. Fig. 9 As shown in (E), the first surface of the first member 102 and the second surface of the second member 112 are arranged to face each other so that the corresponding plurality of first electrodes 110 and the plurality of second electrodes 114 are respectively opposed. The first member 102 and the second member 112 are pressed so that the first surface of the first member 102 and the second surface of the second member 112 are pressed in a direction substantially perpendicular to each surface. The first surface of the first member 102 and the second surface of the second member 112 are pressed against the conductive particles 10, the first composition 20', and the second composition 30'. At this time, the first composition 20' arranged on the second electrode 114 is held on the second electrode 114 together with the conductive particles 10 because it has a higher viscosity than the second composition 30'. The second composition 30' arranged on the second electrode 114 is lower in viscosity than the first composition 20', so most of it moves to a region other than the region where the conductive particles 10 and the first composition 20' are arranged. That is, by applying stress between the first surface of the first member 102 and the second surface of the second member 112, the majority (most part) of the second composition 30' between the first electrode 110 and the first composition 20' moves, thereby excluding the second composition 30' between the first electrode 110 and the conductive particles 10. Furthermore, the first composition 20' and the conductive particles 10 forming the convex structure on the second surface of the second member 112 are buried by the second composition 30'. In other words, the second composition 30' is mostly arranged on the second surface of the second member 112 in the area other than the area (convex structure) where the plurality of conductive particles 10 and the first composition 20' are arranged. It is arranged in such a manner that "the conductive particles 10 arranged on the second electrode 114 contact the first electrode 110, and the second composition 30' contacts the area other than the first electrode 110 on the first surface and the area other than the second electrode 114 on the second surface and the first electrode 110".

[0134] like Fig. 9As shown in (F), the first member 102 and the second member 112 are further pressed, so that the first surface of the first member 102 and the second surface of the second member 112 are pushed in the substantially perpendicular direction of each surface. At this time, sufficient pressure is applied so that the first electrode 110 and the second electrode 114 facing each other contact the upper and lower parts of one conductive particle 10. The pressure for pushing the first surface of the first member 102 and the second surface of the second member 112 can be appropriately adjusted according to the repulsive force of the conductive particle 10, the elastic force of the first composition 20' and the second composition 30'. By adopting such a structure, the first electrode 110 and the second electrode 114 can be electrically connected.

[0135] In a state where the first member 102 and the second member 112 are pressed, the connection structure 100a is irradiated with light to cure the first composition 20' and the second composition 30'. The method of curing the first composition 20' and the second composition 30' is the same as the method for preparing the connection structure involved in the first embodiment, so it is omitted here. By curing the first composition 20' and the second composition 30', the first resin 20 and the second resin 30 are formed. By adopting such a structure, the first surface of the first electronic component 101 and the second surface of the second electronic component 111 can be physically connected.

[0136] According to this embodiment, a method for manufacturing a connection structure and a connection structure can be provided, which can ensure the conductivity between the electrodes facing each other and suppress the short circuit between adjacent connection electrodes even if the electrodes arranged on the electronic element are highly refined and highly dense by a simple process. Furthermore, since a heat curing connection method is not used, the electrodes of the upper and lower substrates with different thermal expansion coefficients can be connected to each other with high precision.

[0137] <Fifth embodiment>

[0138] The structure of the connection structure involved in this embodiment is the same as the structure of the connection structure involved in the first embodiment, except that the first resin 20 is also arranged in the area other than the first electrode of the first member 102. The method for making the connection structure involved in this embodiment is the same as the method for making the connection structure involved in the first embodiment, except that the first composition 20' is also arranged in the area other than the first electrode 110 of the first surface. The same description as the first embodiment is omitted, and only the parts different from the connection structure involved in the first embodiment and the method for making the connection structure are described here.

[0139] [Structure of the connection structure]

[0140] Fig.10 The structure of a connection structure according to one embodiment of the present invention is shown. Fig.10(A) is a plan view of a connection structure according to one embodiment of the present invention. Fig.10 (B) Yes Fig.10 (A) F-F' cross-section. Fig.10 (C) Yes Fig.10 (B) is an enlarged cross-sectional view of the conductive particles in the region G.

[0141] like Fig.10 As shown in (A) and (B), the connection structure 100b includes the first surface of the first member 102, the first electrode 110, the second surface of the second member 112, the second electrode 114, the conductive particles 10, the first resin 20, and the second resin 30. The plurality of first electrodes 110 and the plurality of second electrodes 114 are arranged opposite to each other. The plurality of conductive particles 10, the first resin 20, and the second resin 30 are arranged between the first electrode 110 and the second electrode 114 that are facing each other. The plurality of conductive particles 10 are arranged in the surface direction (D2-D3 surface direction) between the first electrode 110 and the second electrode 114 that are facing each other. One conductive particle 10 is arranged in the facing direction (D1 direction) between the first electrode 110 and the second electrode 114 that are facing each other. Each conductive particle 10 is in contact with the first electrode 110 and the second electrode 114 that are facing each other. like Fig.10 As shown in (C), the conductive particle 10 is deformed by pressure in the direction of the electrodes facing each other (D1 direction) between the first electrode 110 and the second electrode 114 by the following method for making a connected structure. That is, the distance between the first electrode 110 and the second electrode 114 in the direction of the electrodes facing each other (D1 direction) is approximately the same as the height of the conductive particle 10 in the direction of the electrodes facing each other (D1 direction). The height of the conductive particle 10 in the direction of the electrodes facing each other (D1 direction) is deformed by pressure by about 10% to 40%. By applying stress between the first electrode 110, the conductive particle 10, and the second electrode 114, the first resin 20 and the second resin 30 are excluded from the contact portion between the first electrode 110 and the conductive particle 10, and the contact portion between the second electrode 114 and the conductive particle 10. Furthermore, even if a natural oxide film is formed on the first electrode 110, the conductive particles 10, or the second electrode 114 and the surface is insulated, the natural oxide film can be broken and a conductive path can be formed by pressing the first electrode 110 and the second electrode 114 with the conductive particles 10 interposed therebetween. Furthermore, by deforming the conductive particles 10, the contact area between the first electrode 110 and the conductive particles 10 and the contact area between the second electrode 114 and the conductive particles 10 can be increased. By configuring in this way, the conductive particles 10 can electrically connect the first electrode 110 and the second electrode 114.

[0142] like Fig.10As shown in (A) and (B), a plurality of conductive particles 10, a first resin 20, and a second resin 30 are arranged between the first electrode 110 and the second electrode 114. In the present embodiment, when observed in the opposite direction of the electrodes (D1 direction), a plurality of conductive particles 10, a first resin 20, and a second resin 30 are arranged on substantially the entire surface of the upper surface of the first electrode 110. The diameter of the conductive particles 10 observed in the opposite direction of the electrodes (D1 direction) is within a range of 2 μm or more and 10 μm or less. In addition, when observed in the opposite direction of the electrodes (D1 direction), the number of conductive particles 10 arranged between the first electrode 110 and the second electrode 114 facing each other is preferably 7 / 400 μm. 2 More than 20 pieces / 400μm 2 By configuring in this way, the conductive particles 10 can reliably connect the first electrode 110 and the second electrode 114 that are opposite to each other, and can prevent short circuits between a plurality of first electrodes 110 adjacent to each other in the surface direction (D2-D3 surface direction), between a plurality of second electrodes 114 adjacent to each other in the surface direction (D2-D3 surface direction), and between the first electrode 110 and the second electrode 114 that are not opposite to each other.

[0143] In the present embodiment, the shape of the region where the conductive particles 10 and the first resin 20 are arranged as viewed in the direction opposite to the electrodes (D1 direction) is rectangular like the first electrode 110. However, the present invention is not limited thereto, and the shape of the region where the conductive particles 10 and the first resin 20 are arranged may be any shape as long as the area is within the above range.

[0144] The area of ​​the region where the conductive particles 10 and the first resin 20 are arranged on the upper surface of one first electrode 110 only needs to satisfy the above conditions, and can be appropriately adjusted according to the area of ​​the first electrode 110 and the size of the conductive particles 10. In addition, the number of conductive particles 10 arranged in the region where the conductive particles 10 and the first resin 20 are arranged only needs to satisfy the above conditions, and can be appropriately adjusted according to the size of the conductive particles 10 and the concentration of the conductive particles 10 mixed in the first composition 20' described below.

[0145] In the present embodiment, when observed in the opposing direction of the electrodes (D1 direction), the first resin 20 is also arranged in the region other than the first electrode 110 of the first surface. When observed in the opposing direction of the electrodes (D1 direction), the first resin 20 is also arranged between and around the plurality of first electrodes 110 of the first surface. On the other hand, when observed in the opposing direction of the electrodes (D1 direction), the first resin 20 is not arranged at the end of the first surface. At this time, when observed in the opposing direction of the electrodes (D1 direction), the conductive particles 10 are not arranged in the region other than the first electrode 110 of the first surface (the second electrode 114 of the second surface). That is, the conductive particles 10 are arranged on the first electrode 110 (or the second electrode 114).

[0146] A second resin 30 is also arranged between the first surface of the first component 102 and the second surface of the second component 112. The second resin 30 is arranged in an area other than between the opposing first electrode 110 and the second electrode 114. In the present embodiment, when observed in the opposing direction of the electrodes (D1 direction), the second resin 30 is arranged in an area other than the second electrode 114 on the second surface. That is, on the second surface of the second component 112, the second resin 30 is arranged between and around a plurality of second electrodes 114 adjacent in the surface direction (D2-D3 surface direction). When observed in the opposing direction of the electrodes (D1 direction), the second resin 30 is also arranged at the ends of the first surface and the second surface. As Fig.10 As shown in (B) and (C), the second resin 30 is further arranged in the region between the first electrode 110 and the second electrode 114 where the conductive particles 10 and the first resin 20 are arranged. The second resin 30 is arranged between the first resin 20 and the second electrode 114. That is, when observed in the opposite direction of the electrodes (D1 direction), on the second surface of the second member 112, the conductive particles 10 arranged on the second electrode 114 are surrounded by the second resin 30 in the surface direction (D2-D3 surface direction). The first resin 20 and the second resin 30 are insulating resins. Therefore, the connection structure 100b has insulating properties in the surface direction (D2-D3 surface direction). By such a configuration, the second resin 30 can reliably insulate between multiple first electrodes 110 adjacent to each other in the surface direction (D2-D3 surface direction), between multiple second electrodes 114 adjacent to each other in the surface direction (D2-D3 surface direction), and between non-facing first electrodes 110 and second electrodes 114.

[0147] The first resin 20 and the second resin 30 are arranged between the area other than the first electrode 110 on the first surface and the area other than the second electrode 114 on the second surface. The first resin 20 and the second resin 30 are arranged between and around the plurality of first electrodes 110 adjacent in the surface direction (D2-D3 surface direction) and between and around the plurality of second electrodes 114 adjacent in the surface direction (D2-D3 surface direction). Furthermore, the first resin 20 and the second resin 30 are also arranged between the first electrode 110 and the second electrode 114. They are arranged in such a manner that "the first resin 20 contacts the first surface and the second resin 30 contacts the second surface". That is, the first resin 20 and the second resin 30 contact in the surface direction (D2-D3 surface direction) between the first surface of the first electronic element 101 and the second surface of the second electronic element 111, and are stacked in the direction (D1 direction) in which the electrodes face each other. On the other hand, when viewed in the opposing direction of the electrodes (direction D1 ), the second resin 30 is disposed at the end portions of the first surface and the second surface.

[0148] [Method for producing a connected structure]

[0149] Second, use Figures 11 to 14 , a method for manufacturing a connection structure according to an embodiment of the present invention is described. In addition, in this embodiment, since the existing first electronic component 101 and second electronic component 111 can be used, their description is omitted. Figures 11 to 14 In the following, a method of forming the connection structure 100b is described in detail.

[0150] First, the first composition 20' is arranged on the first surface of the first member 102, and a plurality of conductive particles 10 are arranged on the upper surface of the first electrode 110. The plurality of conductive particles 10 are mixed with the first composition 20' and arranged using an offset printing method. Since the mixture of the conductive particles 10 and the first composition 20' contains the conductive particles 10, a pad printing method using a pad to transfer the printed matter is particularly preferred. Figures 11 to 14 A method of arranging the plurality of conductive particles 10 and the first composition 20 ′ will be described.

[0151] Fig.11 This shows a step of placing a mixture of a plurality of conductive particles 10 and a first composition 20 ′ on a plate 240 . Fig.12 yes Fig.11 H-H' cross-sectional view. In the present embodiment, the plate 240 is, for example, a flat gravure plate. In the present embodiment, the plate 240 has a recess 246 corresponding to the first electrode 110. However, this is not limited thereto, and the recess 246 only needs to correspond to the region where the plurality of conductive particles 10 and the first composition 20' are arranged on the first surface of the first member 102.

[0152] In this embodiment, the mixture of the conductive particles 10 and the first composition 20' is placed on the plate 240 using the scraper 250. However, the present invention is not limited thereto, and the mixture of the conductive particles 10 and the first composition 20' may be placed on the plate 240 using a roller or the like. Fig.11 (A)~(C) and Fig.12 As shown in (A) to (C), the scraper 250 is moved from one end to the other end of the plate 240 in a state where the front end is separated from the upper surface 244 of the plate 240. When the diameter of the conductive particles 10 is set to Yμm, the gap between the front end of the scraper 250 and the upper surface 244 of the plate 240 can be appropriately set within a range of greater than 0μm and less than Yμm. Since the distance of the gap is smaller than the diameter Yμm of the conductive particles 10, the conductive particles 10 are not arranged on the upper surface 244 of the plate 240, and the first composition 20' is arranged on the upper surface 244 of the plate 240.

[0153] When the diameter of the conductive particles 10 is Y, the depth from the tip of the scraper 250 to the bottom surface 242 of the recess 246 can be appropriately selected within a range greater than Y μm. Since the depth from the tip of the scraper 250 to the bottom surface 242 of the recess 246 is greater than the diameter Y μm of the conductive particles 10, the conductive particles 10 can be arranged in the recess 246 together with the first composition 20'.

[0154] When the distance from the front end of the scraper 250 to the bottom surface 242 of the recess 246 is less than Y μm, the front end of the scraper 250 is easy to contact the conductive particles 10, and there is a concern that the conductive particles 10 are not filled or the filled conductive particles 10 are damaged. When the distance between the front end of the scraper 250 and the upper surface 244 of the plate 240 is greater than Y μm, there is a possibility that the conductive particles 10 are arranged on the upper surface 244 of the plate 240.

[0155] like Fig.11 (A)~(C) and Fig.12 As shown in (A) to (C), the conductive particles 10 and the first composition 20' are arranged on the plate 240 by moving the scraper 250 from one end to the other end of the plate 240. In this embodiment, it is preferred that the scraper 250 is moved from one end to the other end of the plate 240 along the short side direction (D3 direction) of the recess 246. Thereby, the displacement of the conductive particles 10 arranged in one recess 246 can be suppressed.

[0156] The concentration of the conductive particles 10 mixed in the first composition 20' is preferably in a range of 20% by volume or more and 60% by volume or less relative to the total volume of the conductive particles 10 and the first composition 20'. If the amount of the conductive particles 10 blended is less than 20% by volume, it is difficult to fill a sufficient amount of the conductive particles 10 into the recess 246. If the amount of the conductive particles 10 blended is greater than 60% by volume, the workability is poor and it is difficult to fill the mixture of the conductive particles 10 and the first composition 20' into the recess 246. The mixture of the conductive particles 10 and the first composition 20' is arranged using the scraper 250, so that the conductive particles 10 and the first composition 20' are filled into the recess 246 of the plate 240, and the first composition 20' is arranged on the upper surface 244 of the plate 240.

[0157] Since the recess 246 has a depth within the above range, one conductive particle 10 can be held in the depth direction (D1 direction) of the recess 246. When viewed from the top surface of the plate 240, the number of conductive particles 10 disposed in one recess 246 is preferably 7 / 400 μm. 2 More than 20 pieces / 400μm 2 By disposing in this way, in the step of transferring the mixture of the conductive particles 10 and the first composition 20 ′ to the pad described below, the conductive particles 10 and the first composition 20 ′ can be efficiently transferred to the pad.

[0158] It is preferable that the recesses 246 are spaced apart by 5 μm or more. If the recesses 246 are spaced apart by less than 5 μm, the wall separating the adjacent recesses 246 may be easily damaged, and the durability of the plate 240 may be reduced.

[0159] In the present embodiment, the shape of the recess 246 observed in the opposite direction of the electrodes (D1 direction) is the same as the first electrode 110 (or the second electrode 114) and is rectangular. In addition, the recess 246 has the same shape in the depth direction. That is, the recess 246 has a shape obtained by cutting a rectangular parallelepiped from the plate 240. However, it is not limited to this, and the shape of the recess 246 can be any shape as long as the depth and area are within the above range. For example, it can also correspond to a complex shape.

[0160] The plate 240 may be, for example, a glass intaglio plate, a nickel plate intaglio plate, or a stainless steel plate intaglio plate, and may be subjected to plasma surface treatment using fluorine-based gas, nickel plating, or DLC (diamond-like carbon) treatment to improve the durability of the plate 240 as needed.

[0161] Fig.132 represents the step of transferring the mixture of the plurality of conductive particles 10 and the first composition 20' from the plate 240 to the pad 230. Fig.13 As shown in (A) to (C), the first composition 20' disposed on the upper surface 244 of the plate 240 and the conductive particles 10 and the first composition 20' filled in the concave portion 246 of the plate 240 are transferred to the glue head 230 by pushing the glue head 230 in a direction substantially perpendicular to the plate 240 and pulling the glue head 230 away in a direction substantially perpendicular to the plate 240. Since the viscosity of the first composition 20' is 5×10 3 cP or more and 5×10 5 Since the concentration of the conductive particles 10 mixed in the first composition 20 ′ is within the range of cP or less, the conductive particles 10 can be held on the surface of the pad 230 .

[0162] Fig.14 (A) to (B) represent the steps of transferring the mixture of the plurality of conductive particles 10 and the first composition 20' from the pad 230 to the first surface of the first member 102. Fig.14 As shown in (A) to (B), the mixture of the conductive particles 10 and the first composition 20' transferred to the rubber head 230 is transferred to the first surface by pushing the rubber head 230 in a direction substantially perpendicular to the first surface and pulling the rubber head 230 away in a direction substantially perpendicular to the first surface. Here, the first composition 20' transferred from the concave portion 246 of the plate 240 and the conductive particles 10 are arranged in contact with the first electrode 110. That is, the first composition 20' is arranged on the first surface of the first member 102, and the conductive particles 10 are arranged on the upper surface of the first electrode 110. Since the viscosity of the curable resin material of the first composition 20' is 5×10 3 cP or more and 5×10 5 Since the concentration of conductive particles 10 mixed in the first composition 20' is within the range of cP or less, the conductive particles 10 can be held on the first electrode 110. By using such a method, the conductive particles 10 and the first composition 20' can be reliably arranged in a predetermined region on the first electrode 110.

[0163] The first composition 20' and the conductive particles 10 transferred from the concave portion 246 of the plate 240 are arranged thicker on the first electrode 110 on the first member 102 in the direction facing the electrodes (the D1 direction) because they have the depth of the concave portion 246. On the other hand, the first composition 20' transferred from the upper surface 244 of the plate 240 does not have the depth of the concave portion 246, so it is arranged thinner in the region other than the first electrode 110 on the first member 102 in the direction facing the electrodes (the D1 direction). However, this is not limited to this, and the first composition 20' may not be transferred from the upper surface 244 of the plate 240 to the rubber head 230. On the first surface of the first member 102, the first composition 20' forms a concave-convex structure in the direction facing the electrodes (the D1 direction). On the first surface of the first member 102, the conductive particles 10 form a convex structure together with the first composition 20'. In the present embodiment, the plate 240 is smaller than the first surface (connection surface) of the first member 102. Therefore, the first composition 20' is not arranged at the end of the first surface.

[0164] Next, the second composition 30' is disposed on the first surface of the first member 102. Fig.14 As shown in (C), the second composition 30' is arranged in an area outside the first electrode 110 of the first surface. Furthermore, the second composition 30' is also arranged on the first electrode 110 of the first surface. Here, the first composition 20' transferred from the upper surface 244 of the plate 240 is arranged in the area outside the first electrode 110 of the first surface. In addition, the conductive particles 10 and the first composition 20' transferred from the concave portion 246 of the plate 240 are arranged on the first electrode 110 of the first surface. Therefore, the second composition 30' is arranged in an overlapping manner in contact with the conductive particles 10 and the first composition 20'. The second composition 30' is also arranged at the end of the first surface. In the present embodiment, the second composition 30' is in a paste form and is arranged using an inkjet method or a jet dispensing method. However, it is not limited to this, and the method for configuring the second composition 30' can use an existing method. For example, inkjet or coating using a dispenser, screen printing, etc. can be used.

[0165] The viscosity of the second composition 30' is 2×10 3 cP or more and 2×10 5 The viscosity of the first composition 20' only needs to be higher than the viscosity of the second composition 30' and the difference in viscosity is at least 2 times. Thus, the flow of the conductive particles 10 mixed in the first composition 20' can be suppressed, so that the conductive particles 10 can be retained on the first electrode 110.

[0166] Next, the second member 112 is mounted on the first surface of the first member 102. Fig.14As shown in (D), the first surface of the first member 102 and the second surface of the second member 112 are arranged to face each other so that the corresponding plurality of first electrodes 110 and the plurality of second electrodes 114 are respectively opposed. The first member 102 and the second member 112 are pressed, and the first surface of the first member 102 and the second surface of the second member 112 are pressed in a direction substantially perpendicular to each surface. The first surface of the first member 102 and the second surface of the second member 112 are pressed against the conductive particles 10, the first composition 20', and the second composition 30'. At this time, the first composition 20' arranged on the first electrode 110 is held on the first electrode 110 together with the conductive particles 10 because of its higher viscosity than the second composition 30'. The second composition 30' arranged on the first electrode 110 is lower in viscosity than the first composition 20', so most of it moves to a region other than the first electrode 110 where the conductive particles 10 and the first composition 20' are arranged. That is, by applying stress between the first surface of the first member 102 and the second surface of the second member 112, the majority (most part) of the second composition 30' located between the second electrode 114 and the first composition 20' moves, thereby excluding the second composition 30' located between the second electrode 114 and the conductive particles 10. Furthermore, the first composition 20' and the conductive particles 10 forming the concavo-convex structure on the first surface of the first member 102 are buried with the aid of the second composition 30'. In other words, the second composition 30' is mostly arranged on the second surface of the second member 112 in an area other than the area (convex structure) where a plurality of conductive particles 10 and the first composition 20' are arranged. The second composition 30' is arranged on the first surface of the first member 102 in an area (concave structure) where the first composition 20' is arranged. The conductive particles 10 disposed on the first electrode 110 are in contact with the second electrode 114 , and the second composition 30 ′ is in contact with the first composition 20 ′ disposed on the area other than the first electrode 110 on the first surface, the area other than the second electrode 114 on the second surface, and the second electrode 114 .

[0167] like Fig.14 As shown in (E), the first member 102 and the second member 112 are further pressed, so that the first surface of the first member 102 and the second surface of the second member 112 are pushed in the direction substantially perpendicular to each surface. At this time, sufficient pressure is applied so that the first electrode 110 and the second electrode 114 facing each other contact the upper and lower parts of one conductive particle 10. The pressure for pushing the first surface of the first member 102 and the second surface of the second member 112 can be appropriately adjusted according to the repulsive force of the conductive particle 10 and the elastic force of the first composition 20' and the second composition 30'.

[0168] In a state where the first member 102 and the second member 112 are pressed, the connection structure 100b is irradiated with light to cure the first composition 20' and the second composition 30'. The method of curing the first composition 20' and the second composition 30' is the same as the method for preparing the connection structure involved in the first embodiment, so it is omitted here. By curing the first composition 20' and the second composition 30', the first resin 20 and the second resin 30 are formed. By adopting such a structure, the first surface of the first electronic component 101 and the second surface of the second electronic component 111 can be physically connected.

[0169] According to this embodiment, a method for manufacturing a connection structure and a connection structure can be provided, which can ensure the conductivity between the electrodes facing each other and suppress the short circuit between adjacent connection electrodes even if the electrodes arranged on the electronic element are highly refined and highly dense by a simple process. Furthermore, since a heat curing connection method is not used, the electrodes of the upper and lower substrates with different thermal expansion coefficients can be connected to each other with high precision.

[0170] <Sixth embodiment>

[0171] The structure of the connection structure involved in this embodiment is the same as that of the connection structure involved in the fifth embodiment. The method for producing the connection structure involved in this embodiment is the same as the method for producing the connection structure involved in the fifth embodiment, except that the second composition 30' is arranged on the second electrode 114 of the second surface and the area other than the second electrode 114. The same description as that of the first embodiment and the fifth embodiment is omitted, and the parts different from the methods for producing the connection structure involved in the first embodiment and the fifth embodiment are described here.

[0172] [Method for producing a connected structure]

[0173] use Fig.15 , a method for manufacturing a connection structure according to an embodiment of the present invention is described. In addition, in this embodiment, since the existing first electronic component 101 and second electronic component 111 can be used, their description is omitted. Fig.15 In the following, a method for forming the connection structure 100b is described in detail.

[0174] First, the first composition 20' is arranged on the first surface of the first member 102, and a plurality of conductive particles 10 are arranged on the upper surface of the first electrode 110. The plurality of conductive particles 10 are mixed with the first composition 20' and arranged using an offset printing method. Since the mixture of the conductive particles 10 and the first composition 20' contains the conductive particles 10, a pad printing method using a pad to transfer the printed matter is particularly preferred. The area and method for arranging the mixture of the plurality of conductive particles 10 and the first composition 20' are the same as the method for preparing the connection structure involved in the fifth embodiment, so they are omitted here.

[0175] Fig.15 (A) to (B) represent the steps of transferring the mixture of the plurality of conductive particles 10 and the first composition 20' from the pad 230 to the first surface of the first member 102. Fig.15 As shown in (A) to (B), the mixture of the conductive particles 10 and the first composition 20' transferred to the rubber head 230 is transferred to the first surface by pushing the rubber head 230 in a direction substantially perpendicular to the first surface and pulling the rubber head 230 away in a direction substantially perpendicular to the first surface. Here, the first composition 20' transferred from the concave portion 246 of the plate 240 and the conductive particles 10 are arranged in contact with the first electrode 110. That is, the first composition 20' is arranged on the first surface of the first member 102, and the conductive particles 10 are arranged on the upper surface of the first electrode 110. Since the viscosity of the curable resin material of the first composition 20' is 5×10 3 cP or more and 5×10 5 Since the concentration of conductive particles 10 mixed in the first composition 20' is within the range of cP or less, the conductive particles 10 can be held on the first electrode 110. By using such a method, the conductive particles 10 and the first composition 20' can be reliably arranged in a predetermined region on the first electrode 110.

[0176] The first composition 20' and the conductive particles 10 transferred from the concave portion 246 of the plate 240 have the depth of the concave portion 246, so they are arranged thicker on the first electrode 110 on the first member 102 in the direction facing the electrodes (D1 direction). On the other hand, the first composition 20' transferred from the upper surface 244 of the plate 240 does not have the depth of the concave portion 246, so it is arranged thinner in the direction facing the electrodes (D1 direction) in the area other than the first electrode 110 on the first member 102. However, this is not limited to this, and the first composition 20' may not be transferred from the upper surface 244 of the plate 240 to the rubber head 230. On the first surface of the first member 102, the first composition 20' forms a concave-convex structure in the direction facing the electrodes (D1 direction). On the first surface of the first member 102, the conductive particles 10 form a convex structure together with the first composition 20'. In the present embodiment, the plate 240 is smaller than the first surface (connection surface) of the first member 102. Therefore, the first composition 20' is not arranged at the end of the first surface.

[0177] Next, the second composition 30' is disposed on the second surface of the second member 112. Fig.15 As shown in (C) to (D), the second composition 30' is arranged in the area outside the second electrode 114 of the second surface of the second member 112. Furthermore, the second composition 30' is also arranged on the second electrode 114 of the second surface. The second composition 30' is also arranged at the end of the second surface. In the present embodiment, the second composition 30' is in a paste form and is arranged using an inkjet method or a jet dispensing method. However, it is not limited to this, and the method for arranging the second composition 30' can use an existing method. For example, inkjet or coating using a dispenser, screen printing, etc. can be used.

[0178] The viscosity of the second composition 30' is 2×10 3 cP or more and 2×10 5 In this way, the flow of the second composition 30' can be suppressed.

[0179] Next, the second member 112 is mounted on the first surface of the first member 102. Fig.15As shown in (E), the first surface of the first member 102 and the second surface of the second member 112 are arranged to face each other so that the corresponding plurality of first electrodes 110 and the plurality of second electrodes 114 are respectively opposed. The first member 102 and the second member 112 are pressed so that the first surface of the first member 102 and the second surface of the second member 112 are pressed in a direction substantially perpendicular to each surface. The first surface of the first member 102 and the second surface of the second member 112 are pressed against the conductive particles 10, the first composition 20', and the second composition 30'. At this time, the first composition 20' arranged on the first electrode 110 is held on the first electrode 110 together with the conductive particles 10 because of its higher viscosity than the second composition 30'. The second composition 30' arranged on the second electrode 114 is lower in viscosity than the first composition 20', so most of it moves to a region other than the first electrode 110 where the conductive particles 10 and the first composition 20' are arranged. That is, by applying stress between the first surface of the first member 102 and the second surface of the second member 112, the majority (most part) of the second composition 30' located between the second electrode 114 and the first composition 20' moves, thereby excluding the second composition 30' located between the second electrode 114 and the conductive particles 10. Furthermore, the first composition 20' and the conductive particles 10 forming the concavo-convex structure on the first surface of the first member 102 are buried with the aid of the second composition 30'. In other words, the second composition 30' is mostly arranged on the second surface of the second member 112 in an area other than the area (convex structure) where a plurality of conductive particles 10 and the first composition 20' are arranged. The second composition 30' is arranged on the first surface of the first member 102 in an area (concave structure) where the first composition 20' is arranged. The conductive particles 10 disposed on the first electrode 110 are in contact with the second electrode 114 , and the second composition 30 ′ is in contact with the first composition 20 ′ disposed on the area other than the first electrode 110 on the first surface, the area other than the second electrode 114 on the second surface, and the second electrode 114 .

[0180] like Fig.15 As shown in (F), the first member 102 and the second member 112 are further pressed, so that the first surface of the first member 102 and the second surface of the second member 112 are pushed in a direction substantially perpendicular to each surface. At this time, sufficient pressure is applied so that the first electrode 110 and the second electrode 114 facing each other contact the upper and lower sides of one conductive particle 10. The pressure of pushing the first surface of the first member 102 and the second surface of the second member 112 can be appropriately adjusted according to the repulsive force of the conductive particle 10, the elastic force of the first composition 20' and the second composition 30'. By adopting such a structure, the first electrode 110 and the second electrode 114 can be electrically connected.

[0181] In a state where the first member 102 and the second member 112 are pressed, the connection structure 100b is irradiated with light to cure the first composition 20' and the second composition 30'. The method of curing the first composition 20' and the second composition 30' is the same as the method for preparing the connection structure involved in the first embodiment, so it is omitted here. By curing the first composition 20' and the second composition 30', the first resin 20 and the second resin 30 are formed. By adopting such a structure, the first surface of the first electronic component 101 and the second surface of the second electronic component 111 can be physically connected.

[0182] According to this embodiment, a method for manufacturing a connection structure and a connection structure can be provided, which can ensure the conductivity between the electrodes facing each other and suppress the short circuit between adjacent connection electrodes even if the electrodes arranged on the electronic element are highly refined and highly dense by a simple process. Furthermore, since a heat curing connection method is not used, the electrodes of the upper and lower substrates with different thermal expansion coefficients can be connected to each other with high precision.

[0183] <Seventh embodiment>

[0184] In the structure of the connection structure involved in this embodiment, the first resin 20 is also arranged in the area other than the second electrode of the second member 112, and the structure is the same as the structure of the connection structure involved in the third embodiment. The structure of the connection structure involved in this embodiment is the same as the structure of the connection structure involved in the fifth embodiment, except that the stacking order of the first resin 20 and the second resin 30 arranged between the first surface and the second surface is different. The method for making the connection structure involved in this embodiment is the same as the method for making the connection structure involved in the first and fifth embodiments, except that the first composition 20' is arranged in the area other than the second electrode 114 of the second surface and the second electrode 114, and the second composition 30' is arranged in the area other than the second electrode 114 of the second surface and the second electrode 114. The descriptions that are the same as those in the first and fifth embodiments are omitted, and the parts that are different from the connection structure involved in the first and fifth embodiments and the method for making the connection structure are described here.

[0185] [Structure of the connection structure]

[0186] Fig.16 The structure of a connection structure according to one embodiment of the present invention is shown. Fig.16 (A) is a plan view of a connection structure according to one embodiment of the present invention. Fig.16 (B) Yes Fig.16 (A) I-I' cross-sectional view. Fig.16 (C) Yes Fig.16(B) is an enlarged cross-sectional view of the conductive particles in region J.

[0187] like Fig.16 As shown in (A) and (B), the connection structure 100c includes the first surface of the first member 102, the first electrode 110, the second surface of the second member 112, the second electrode 114, the conductive particles 10, the first resin 20, and the second resin 30. The plurality of first electrodes 110 and the plurality of second electrodes 114 are arranged opposite to each other. The plurality of conductive particles 10, the first resin 20, and the second resin 30 are arranged between the first electrode 110 and the second electrode 114 that are facing each other. The plurality of conductive particles 10 are arranged in the plane direction (D2-D3 plane direction) between the first electrode 110 and the second electrode 114 that are facing each other. One conductive particle 10 is arranged in the facing direction (D1 direction) between the first electrode 110 and the second electrode 114 that are facing each other. Each conductive particle 10 is in contact with the first electrode 110 and the second electrode 114 that are facing each other. like Fig.16 As shown in (C), the conductive particle 10 is deformed by pressure in the opposing direction (D1 direction) of the electrodes between the first electrode 110 and the second electrode 114 by the following method for making a connection structure. That is, the distance between the first electrode 110 and the second electrode 114 in the opposing direction (D1 direction) of the electrodes and the height of the conductive particle 10 in the opposing direction (D1 direction) are approximately the same. The height of the conductive particle 10 in the opposing direction (D1 direction) of the electrodes is deformed by pressure by about 10% to 40%. By applying stress between the first electrode 110, the conductive particle 10, and the second electrode 114, the first resin 20 and the second resin 30 are excluded from the contact portion between the first electrode 110 and the conductive particle 10, and the contact portion between the second electrode 114 and the conductive particle 10. Furthermore, even if a natural oxide film is formed on the first electrode 110, the conductive particles 10, or the second electrode 114 and the surface is insulated, the natural oxide film can be broken and a conductive path can be formed by pressing the first electrode 110 and the second electrode 114 with the conductive particles 10 interposed therebetween. Furthermore, by deforming the conductive particles 10, the contact area between the first electrode 110 and the conductive particles 10 and the contact area between the second electrode 114 and the conductive particles 10 can be increased. By configuring in this way, the conductive particles 10 can electrically connect the first electrode 110 and the second electrode 114.

[0188] In the present embodiment, when observed in the opposing direction of the electrodes (D1 direction), the first resin 20 is also arranged in the area outside the second electrode 114 of the second surface. When observed in the opposing direction of the electrodes (D1 direction), the first resin 20 is also arranged between and around the plurality of second electrodes 114 of the second surface. On the other hand, when observed in the opposing direction of the electrodes (D1 direction), the first resin 20 is not arranged at the end of the second surface. At this time, when observed in the opposing direction of the electrodes (D1 direction), the conductive particles 10 are not arranged in the area outside the first electrode 110 of the first surface (the second electrode 114 of the second surface). That is, the conductive particles 10 are arranged on the first electrode 110 (or the second electrode 114).

[0189] The second resin 30 is further arranged between the first surface of the first component 102 and the second surface of the second component 112. The second resin 30 is arranged in an area other than between the first electrode 110 and the second electrode 114 that are opposite to each other. In the present embodiment, when observed in the opposite direction of the electrodes (D1 direction), the second resin 30 is arranged in an area other than the first electrode 110 of the first surface. That is, on the first surface of the first component 102, the second resin 30 is arranged between and around a plurality of first electrodes 110 that are adjacent in the surface direction (D2-D3 surface direction). When observed in the opposite direction of the electrodes (D1 direction), the second resin 30 is also arranged at the ends of the first surface and the second surface. As Fig.16 As shown in (B) and (C), the second resin 30 is further arranged in the region between the first electrode 110 and the second electrode 114 where the conductive particles 10 and the first resin 20 are arranged. The second resin 30 is arranged between the first resin 20 and the first electrode 110. That is, when observed in the opposite direction of the electrodes (D1 direction), on the first surface of the first member 102, the conductive particles 10 arranged on the first electrode 110 are surrounded by the second resin 30 in the surface direction (D2-D3 surface direction). The first resin 20 and the second resin 30 are insulating resins. Therefore, the connection structure 100c has insulating properties in the surface direction (D2-D3 surface direction). By such a configuration, the second resin 30 can reliably insulate between multiple first electrodes 110 adjacent to each other in the surface direction (D2-D3 surface direction), between multiple second electrodes 114 adjacent to each other in the surface direction (D2-D3 surface direction), and between non-facing first electrodes 110 and second electrodes 114.

[0190] The first resin 20 and the second resin 30 are arranged between the area other than the first electrode 110 of the first surface and the area other than the second electrode 114 of the second surface. The first resin 20 and the second resin 30 are arranged between and around the plurality of first electrodes 110 adjacent in the surface direction (D2-D3 surface direction) and between and around the plurality of second electrodes 114 adjacent in the surface direction (D2-D3 surface direction). Furthermore, the first resin 20 and the second resin 30 are also arranged between the first electrode 110 and the second electrode 114. They are arranged in such a manner that "the first resin 20 contacts the second surface and the second resin 30 contacts the first surface". That is, the first resin 20 and the second resin 30 contact in the surface direction (D2-D3 surface direction) between the first surface of the first electronic element 101 and the second surface of the second electronic element 111, and are stacked in the direction (D1 direction) in which the electrodes face each other. On the other hand, when viewed in the opposing direction of the electrodes (direction D1 ), the second resin 30 is disposed at the end portions of the first surface and the second surface.

[0191] [Method for producing a connected structure]

[0192] use Fig.17 A method for manufacturing a connection structure according to an embodiment of the present invention is described. In addition, in this embodiment, since the existing first electronic element 101 and second electronic element 111 can be used, their description is omitted. Fig.17 In the following, a method for forming the connection structure 100c is described in detail.

[0193] First, the first composition 20' is arranged on the second surface of the second member 112, and a plurality of conductive particles 10 are arranged on the upper surface of the second electrode 114. The plurality of conductive particles 10 are mixed with the first composition 20' and arranged using an offset printing method. Since the mixture of the conductive particles 10 and the first composition 20' contains the conductive particles 10, a pad printing method using a pad to transfer the printed matter is particularly preferred. The area and method for arranging the mixture of the plurality of conductive particles 10 and the first composition 20' are the same as the method for preparing the connection structure involved in the fifth embodiment, so they are omitted here.

[0194] Fig.17 (A) to (B) show the steps of transferring the mixture of the plurality of conductive particles 10 and the first composition 20' from the pad 230 to the second surface of the second member 112 by pad printing. Fig.17As shown in (A) to (B), the mixture of the conductive particles 10 and the first composition 20' transferred to the rubber head 230 is transferred to the second surface by pushing the rubber head 230 in a direction substantially perpendicular to the second surface and pulling the rubber head 230 away in a direction substantially perpendicular to the second surface. Here, the first composition 20' transferred from the concave portion 246 of the plate 240 and the conductive particles 10 are arranged in contact with the second electrode 114. That is, the first composition 20' is arranged on the second surface of the second member 112, and the conductive particles 10 are arranged on the upper surface of the second electrode 114. Since the viscosity of the curable resin material of the first composition 20' is 5×10 3 cP or more and 5×10 5 Since the concentration of conductive particles 10 mixed in the first composition 20' is within the range of cP or less, the conductive particles 10 can be held on the second electrode 114. By using such a method, the conductive particles 10 and the first composition 20' can be reliably arranged in a predetermined region on the second electrode 114.

[0195] Since the first composition 20' and the conductive particles 10 transferred from the concave portion 246 of the plate 240 have the depth of the concave portion 246, they are arranged thicker on the second electrode 114 on the second member 112 in the direction opposite to the electrodes (D1 direction). On the other hand, since the first composition 20' transferred from the upper surface 244 of the plate 240 does not have the depth of the concave portion 246, it is arranged thinner in the direction opposite to the electrodes (D1 direction) in the area other than the second electrode 114 on the second member 112. However, this is not limited to this, and the first composition 20' may not be transferred from the upper surface 244 of the plate 240 to the rubber head 230. On the second surface of the second member 112, the first composition 20' forms a concave-convex structure in the direction opposite to the electrodes (D1 direction). On the second surface of the second member 112, the conductive particles 10 form a convex structure together with the first composition 20'. In the present embodiment, the plate 240 is smaller than the second surface (connection surface) of the second member 112. Therefore, the first composition 20' is not arranged at the end of the second surface.

[0196] Next, the second composition 30' is disposed on the second surface of the second member 112. Fig.17As shown in (C), the second composition 30' is arranged in an area other than the second electrode 114 on the second surface of the second member 112. Furthermore, the second composition 30' is also arranged on the second electrode 114 on the second surface. Here, the first composition 20' transferred from the upper surface 244 of the plate 240 is arranged in the area other than the second electrode 114 on the second surface. In addition, the conductive particles 10 and the first composition 20' transferred from the concave portion 246 of the plate 240 are arranged on the second electrode 114 on the second surface. Therefore, the second composition 30' is arranged in an overlapping manner in contact with the conductive particles 10 and the first composition 20'. The second composition 30' is also arranged at the end of the second surface. In the present embodiment, the second composition 30' is in a paste state and is arranged using an inkjet method or a jet dispensing method. However, it is not limited thereto, and the method for configuring the second composition 30' can use an existing method. For example, inkjet or coating using a dispenser, screen printing, etc. can be used.

[0197] The viscosity of the second composition 30' is 2×10 3 cP or more and 2×10 5 The viscosity of the first composition 20' only needs to be higher than the viscosity of the second composition 30' and the difference in viscosity is at least 2 times. Thus, the flow of the conductive particles 10 mixed in the first composition 20' can be suppressed, so that the conductive particles 10 can be retained on the first electrode 110.

[0198] Next, the second electronic component 111 is mounted on the first surface of the first electronic component 101. Fig.17As shown in (D), the first surface of the first member 102 and the second surface of the second member 112 are arranged to face each other so that the corresponding plurality of first electrodes 110 and the plurality of second electrodes 114 are respectively opposed. The first member 102 and the second member 112 are pressed so that the first surface of the first member 102 and the second surface of the second member 112 are pressed in a direction substantially perpendicular to each surface. The first surface of the first member 102 and the second surface of the second member 112 are pressed against the conductive particles 10, the first composition 20', and the second composition 30'. At this time, the first composition 20' arranged on the second electrode 114 is held on the second electrode 114 together with the conductive particles 10 because of its higher viscosity than the second composition 30'. The second composition 30' arranged on the second electrode 114 is lower in viscosity than the first composition 20', so most of it moves to a region other than the second electrode 114 where the conductive particles 10 and the first composition 20' are arranged. That is, by applying stress between the first surface of the first member 102 and the second surface of the second member 112, the majority (most part) of the second composition 30' located between the first electrode 110 and the first composition 20' moves, thereby excluding the second composition 30' located between the first electrode 110 and the conductive particles 10. Furthermore, the first composition 20' and the conductive particles 10 forming the concavo-convex structure on the second surface of the second member 112 are buried with the aid of the second composition 30'. In other words, the second composition 30' is mostly arranged on the first surface of the first member 102 in an area other than the area (convex structure) where a plurality of conductive particles 10 and the first composition 20' are arranged. The second composition 30' is arranged on the first surface of the first member 102 in an area (concave structure) where the first composition 20' is arranged. The conductive particles 10 disposed on the second electrode 114 are in contact with the first electrode 110 , and the second composition 30 ′ is in contact with the first composition 20 ′ disposed on the second surface other than the second electrode 114 , the first surface other than the first electrode 110 , and the first electrode 110 .

[0199] like Fig.17 As shown in (E), the first member 102 and the second member 112 are further pressed, so that the first surface of the first member 102 and the second surface of the second member 112 are pushed in the substantially perpendicular direction of each surface. At this time, sufficient pressure is applied so that the first electrode 110 and the second electrode 114 facing each other contact the upper and lower parts of one conductive particle 10. The pressure for pushing the first surface of the first member 102 and the second surface of the second member 112 can be appropriately adjusted according to the repulsive force of the conductive particle 10, the elastic force of the first composition 20' and the second composition 30'. By adopting such a structure, the first electrode 110 and the second electrode 114 can be electrically connected.

[0200] In a state where the first member 102 and the second member 112 are pressed, the connection structure 100c is irradiated with light to cure the first composition 20' and the second composition 30'. The method of curing the first composition 20' and the second composition 30' is the same as the method for preparing the connection structure involved in the first embodiment, so it is omitted here. By curing the first composition 20' and the second composition 30', the first resin 20 and the second resin 30 are formed. By adopting such a structure, the first surface of the first electronic component 101 and the second surface of the second electronic component 111 can be physically connected.

[0201] According to this embodiment, a method for manufacturing a connection structure and a connection structure can be provided, which can ensure the conductivity between the electrodes facing each other and suppress the short circuit between adjacent connection electrodes even if the electrodes arranged on the electronic element are highly refined and highly dense by a simple process. Furthermore, since a heat curing connection method is not used, the electrodes of the upper and lower substrates with different thermal expansion coefficients can be connected to each other with high precision.

[0202] <Eighth embodiment>

[0203] The structure of the connection structure involved in this embodiment is the same as that of the connection structure involved in the seventh embodiment. The method for producing the connection structure involved in this embodiment is the same as the method for producing the connection structure involved in the seventh embodiment, except that the second composition 30' is arranged on the first electrode 110 of the first surface and the area other than the first electrode 110. The descriptions of the same as those of the first embodiment, the fifth embodiment, and the seventh embodiment are omitted, and only the parts different from the methods for producing the connection structures involved in the first embodiment, the fifth embodiment, and the seventh embodiment are described here.

[0204] [Method for producing a connected structure]

[0205] use Fig.18 A method for manufacturing a connection structure according to an embodiment of the present invention is described. In addition, in this embodiment, since the existing first electronic element 101 and second electronic element 111 can be used, their description is omitted. Fig.18 In the following, a method for forming the connection structure 100c is described in detail.

[0206] First, the first composition 20' is arranged on the second surface of the second member 112, and a plurality of conductive particles 10 are arranged on the upper surface of the second electrode 114. The plurality of conductive particles 10 are mixed with the first composition 20' and arranged using an offset printing method. Since the mixture of the conductive particles 10 and the first composition 20' contains the conductive particles 10, a pad printing method using a pad to transfer the printed matter is particularly preferred. The area and method for arranging the mixture of the plurality of conductive particles 10 and the first composition 20' are the same as the method for preparing the connection structure involved in the fifth embodiment, so they are omitted here.

[0207] Fig.18 (A) to (B) show the steps of transferring the mixture of the plurality of conductive particles 10 and the first composition 20' from the pad 230 to the second surface of the second member 112 by pad printing. Fig.18 As shown in (A) to (B), the mixture of the conductive particles 10 and the first composition 20' transferred to the rubber head 230 is transferred to the second surface by pushing the rubber head 230 in a direction substantially perpendicular to the second surface and pulling the rubber head 230 away in a direction substantially perpendicular to the second surface. Here, the first composition 20' transferred from the concave portion 246 of the plate 240 and the conductive particles 10 are arranged in contact with the second electrode 114. That is, the first composition 20' is arranged on the second surface of the second member 112, and the conductive particles 10 are arranged on the upper surface of the second electrode 114. Since the viscosity of the curable resin material of the first composition 20' is 5×10 3 cP or more and 5×10 5 Since the concentration of conductive particles 10 mixed in the first composition 20' is within the range of cP or less, the conductive particles 10 can be held on the second electrode 114. By using such a method, the conductive particles 10 and the first composition 20' can be reliably arranged in a predetermined region on the second electrode 114.

[0208] The first composition 20' and the conductive particles 10 transferred from the recess 246 of the plate 240 have the depth of the recess 246, so they are arranged thicker on the second electrode 114 on the second member 112 in the direction opposite to the electrodes (D1 direction). On the other hand, the first composition 20' transferred from the upper surface 244 of the plate 240 does not have the depth of the recess 246, so it is arranged thinner in the direction opposite to the electrodes (D1 direction) in the area other than the second electrode 114 on the second member 112. However, this is not limited to this, and the first composition 20' may not be transferred from the upper surface 244 of the plate 240 to the rubber head 230. On the second surface of the second member 112, the first composition 20' forms a concave-convex structure in the direction opposite to the electrodes (D1 direction). On the second surface of the second member 112, the conductive particles 10 form a convex structure together with the first composition 20'. In the present embodiment, the plate 240 is smaller than the second surface (connection surface) of the second member 112. Therefore, the first composition 20' is not arranged at the end of the second surface.

[0209] Next, the second composition 30' is disposed on the first surface of the first member 102. Fig.18 As shown in (C) to (D), the second composition 30' is arranged in an area other than the first electrode 110 of the first surface of the first member 102. Furthermore, the second composition 30' is also arranged on the first electrode 110 of the first surface. The second composition 30' is also arranged at the end of the first surface. In the present embodiment, the second composition 30' is in a paste form and is arranged using an inkjet method or a jet dispensing method. However, it is not limited thereto, and the method for arranging the second composition 30' can use an existing method. For example, inkjet or coating using a dispenser, screen printing, etc. can be used.

[0210] The viscosity of the second composition 30' is 2×10 3 cP or more and 2×10 5 In this way, the flow of the second composition 30' can be suppressed.

[0211] Next, the second electronic component 111 is mounted on the first surface of the first electronic component 101. Fig.18As shown in (E), the first surface of the first member 102 and the second surface of the second member 112 are arranged to face each other so that the corresponding plurality of first electrodes 110 and the plurality of second electrodes 114 are respectively opposed. The first member 102 and the second member 112 are pressed so that the first surface of the first member 102 and the second surface of the second member 112 are pressed in a direction substantially perpendicular to each surface. The first surface of the first member 102 and the second surface of the second member 112 are pressed against the conductive particles 10, the first composition 20', and the second composition 30'. At this time, the first composition 20' arranged on the second electrode 114 is held on the second electrode 114 together with the conductive particles 10 because of its higher viscosity than the second composition 30'. The second composition 30' arranged on the first electrode 110 is lower in viscosity than the first composition 20', so most of it moves to a region other than the second electrode 114 where the conductive particles 10 and the first composition 20' are arranged. That is, by applying stress between the first surface of the first member 102 and the second surface of the second member 112, the majority (most part) of the second composition 30' located between the first electrode 110 and the first composition 20' moves, thereby excluding the second composition 30' located between the first electrode 110 and the conductive particles 10. Furthermore, the first composition 20' and the conductive particles 10 forming the concavo-convex structure on the second surface of the second member 112 are buried with the aid of the second composition 30'. In other words, the second composition 30' is mostly arranged on the first surface of the first member 102 in an area other than the area (convex structure) where a plurality of conductive particles 10 and the first composition 20' are arranged. The second composition 30' is arranged on the first surface of the first member 102 in an area (concave structure) where the first composition 20' is arranged. The conductive particles 10 disposed on the second electrode 114 are in contact with the first electrode 110 , and the second composition 30 ′ is in contact with the first composition 20 ′ disposed on the second surface other than the second electrode 114 , the first surface other than the first electrode 110 , and the first electrode 110 .

[0212] like Fig.18 As shown in (F), the first member 102 and the second member 112 are further pressed, so that the first surface of the first member 102 and the second surface of the second member 112 are pushed in the substantially perpendicular direction of each surface. At this time, sufficient pressure is applied so that the first electrode 110 and the second electrode 114 facing each other contact the upper and lower parts of one conductive particle 10. The pressure for pushing the first surface of the first member 102 and the second surface of the second member 112 can be appropriately adjusted according to the repulsive force of the conductive particle 10, the elastic force of the first composition 20' and the second composition 30'. By adopting such a structure, the first electrode 110 and the second electrode 114 can be electrically connected.

[0213] In a state where the first member 102 and the second member 112 are pressed, the connection structure 100c is irradiated with light to cure the first composition 20' and the second composition 30'. The method of curing the first composition 20' and the second composition 30' is the same as the method for preparing the connection structure involved in the first embodiment, so it is omitted here. By curing the first composition 20' and the second composition 30', the first resin 20 and the second resin 30 are formed. By adopting such a structure, the first surface of the first electronic component 101 and the second surface of the second electronic component 111 can be physically connected.

[0214] According to this embodiment, a method for manufacturing a connection structure and a connection structure can be provided, which can ensure the conductivity between the electrodes facing each other and suppress the short circuit between adjacent connection electrodes even if the electrodes arranged on the electronic element are highly refined and highly dense by a simple process. Furthermore, since a heat curing connection method is not used, the electrodes of the upper and lower substrates with different thermal expansion coefficients can be connected to each other with high precision.

[0215] The present invention is not limited to the above-described embodiments, and can be appropriately modified within the scope of the gist. In addition, the various embodiments can be appropriately combined.

[0216] [Example 1]

[0217] Fig.19 It is a diagram showing an example of a connection structure according to an embodiment of the present invention. Fig.19 (A) is a diagram showing an arrangement pattern of conductive particles 10 and a first resin 20 in a connection structure according to Example 1 of the present invention. Fig.19 (B) is a diagram showing an arrangement pattern of the first resin 20 and the second resin 30 of the connection structure according to Example 1 of the present invention. The parameters of the connection structure of Example 1 are as follows.

[0218] Width (short side) of first electrode 110 (A1) = 9 μm

[0219] Distance between first electrodes 110 (B1) = 6 μm

[0220] · Span of the first electrode 110 (A1+B1=C1)=15 μm

[0221] Length (long side) of first electrode 110 (D1) = 105 μm

[0222] Area of ​​the first electrode 110 (A1×D1)=945 μm 2

[0223] The number of conductive particles 10 arranged per first electrode 110 = 19 particles.

[0224] [Example 2]

[0225] Fig. 20 It is a diagram showing an example of a connection structure according to an embodiment of the present invention. Fig. 20 (A) is a diagram showing an arrangement pattern of conductive particles 10 and a first resin 20 in a connection structure according to Example 2 of the present invention. Fig. 20 (B) is a diagram showing an arrangement pattern of the first resin 20 and the second resin 30 of the connection structure according to Example 2 of the present invention. The parameters of the connection structure of Example 2 are as follows.

[0226] Width (short side) of first electrode 110 (A2) = 9 μm

[0227] Distance between first electrodes 110 (B2) = 6 μm

[0228] · Span of the first electrode 110 (A2+B2=C2)=15 μm

[0229] Length (long side) of first electrode 110 (D2) = 105 μm

[0230] The area of ​​the first electrode 110 (A2×D2)=945 μm 2

[0231] The number of conductive particles 10 arranged per first electrode 110 = 26 particles.

[0232] [Example 3]

[0233] Fig.21 It is a diagram showing an example of a connection structure according to an embodiment of the present invention. Fig.21 (A) is a diagram showing an arrangement pattern of conductive particles 10 and a first resin 20 in a connection structure according to Example 3 of the present invention. Fig.21 (B) is a diagram showing an arrangement pattern of the first resin 20 and the second resin 30 of the connection structure according to Example 3 of the present invention. The parameters of the connection structure of Example 3 are as follows.

[0234] Width (short side) of first electrode 110 (A3) = 9 μm

[0235] Distance between first electrodes 110 (B3) = 6 μm

[0236] · Span of the first electrode 110 (A3+B3=C3)=15 μm

[0237] Length (long side) of first electrode 110 (D3) = 78 μm

[0238] Area of ​​the first electrode 110 (A3×D3)=702 μm 2

[0239] · Area of ​​one region where the conductive particles 10 and the first resin 20 are arranged = 40 μm 2

[0240] Total area of ​​the region where the conductive particles 10 and the first resin 20 are arranged per electrode = 280 μm 2

[0241] The number of regions where the conductive particles 10 and the first resin 20 are arranged per electrode = 7

[0242] The number of conductive particles 10 arranged per region where the conductive particles 10 and the first resin 20 are arranged = 2

[0243] The number of conductive particles 10 arranged per electrode = 14 particles.

[0244] [Example 4]

[0245] Fig. 22 It is a diagram showing an example of a connection structure according to an embodiment of the present invention. Fig. 22 (A) is a diagram showing an arrangement pattern of conductive particles 10 and a first resin 20 in a connection structure according to Example 4 of the present invention. Fig. 22 (B) is a diagram showing an arrangement pattern of the first resin 20 and the second resin 30 of the connection structure according to Example 4 of the present invention. The parameters of the connection structure of Example 4 are as follows.

[0246] Width (short side) of first electrode 110 (A4) = 12 μm

[0247] Distance between first electrodes 110 (B4) = 9 μm

[0248] · Span of the first electrode 110 (A4+B4=C4) = 21 μm

[0249] Length (long side) of first electrode 110 (D4) = 105 μm

[0250] Area of ​​the first electrode 110 (A4×D4)=1260 μm 2

[0251] · Area of ​​one region where the conductive particles 10 and the first resin 20 are arranged = 113 μm 2

[0252] Total area of ​​the region where the conductive particles 10 and the first resin 20 are arranged per electrode = 791 μm2

[0253] The number of regions where the conductive particles 10 and the first resin 20 are arranged per electrode = 7

[0254] The number of conductive particles 10 arranged per region where the conductive particles 10 and the first resin 20 are arranged = 7

[0255] The number of conductive particles 10 disposed per first electrode 110 = 49 particles.

[0256] [Example 5]

[0257] Fig.23 It is a diagram showing an example of a connection structure according to an embodiment of the present invention. Fig.23 (A) is a diagram showing an arrangement pattern of conductive particles 10 and a first resin 20 in a connection structure according to Example 5 of the present invention. Fig.23 (B) is a diagram showing an arrangement pattern of the first resin 20 and the second resin 30 of the connection structure according to Example 5 of the present invention. The parameters of the connection structure of Example 5 are as follows.

[0258] Width (short side) of first electrode 110 (A5) = 9 μm

[0259] Distance between first electrodes 110 (B5) = 6 μm

[0260] · Span of the first electrode 110 (A5+B5=C5)=15 μm

[0261] Length (long side) of first electrode 110 (D5) = 84 μm

[0262] Area of ​​the first electrode 110 (A5×D5)=756 μm 2

[0263] · Area of ​​one region where the conductive particles 10 and the first resin 20 are arranged = 64 μm 2

[0264] Total area of ​​the region where the conductive particles 10 and the first resin 20 are arranged per electrode = 448 μm 2

[0265] The number of regions where the conductive particles 10 and the first resin 20 are arranged per electrode = 7

[0266] The number of conductive particles 10 arranged per region where the conductive particles 10 and the first resin 20 are arranged = 3

[0267] The number of conductive particles 10 arranged per electrode = 21 particles.

[0268] [Example 6]

[0269] Fig.24 It is a diagram showing an example of a connection structure according to an embodiment of the present invention. Fig.24 (A) is a diagram showing an arrangement pattern of conductive particles 10 and a first resin 20 in a connection structure according to Example 6 of the present invention. Fig.24 (B) is a diagram showing an arrangement pattern of the first resin 20 and the second resin 30 of the connection structure according to Example 6 of the present invention. The parameters of the connection structure of Example 6 are as follows.

[0270] Width (short side) of first electrode 110 (A6) = 21 μm

[0271] Distance between first electrodes 110 (B6) = 10 μm

[0272] · Span of the first electrode 110 (A6+B6=C6)=31 μm

[0273] Length (long side) of first electrode 110 (D6) = 21 μm

[0274] Area of ​​the first electrode 110 (A6×D6)=441 μm 2

[0275] · Area of ​​region α where conductive particles 10 and first resin 20 are arranged = 64 μm 2

[0276] Total area of ​​region α where conductive particles 10 and first resin 20 are arranged per electrode = 128 μm 2

[0277] The number of regions α where the conductive particles 10 and the first resin 20 are arranged = 2

[0278] The number of conductive particles 10 arranged per region α = 3

[0279] · Area of ​​region β where conductive particles 10 and first resin 20 are arranged = 40 μm 2

[0280] Total area of ​​region β where conductive particles 10 and first resin 20 are arranged per electrode = 80 μm

[0281] The number of regions β where the conductive particles 10 and the first resin 20 are arranged = 2

[0282] The number of conductive particles 10 arranged per region β = 2

[0283] The number of conductive particles 10 arranged per electrode = 10 particles.

[0284] [Example 7]

[0285] Fig.25 It is a diagram showing an example of a connection structure according to an embodiment of the present invention. Fig.25 (A) is a diagram showing an arrangement pattern of conductive particles 10 and a first resin 20 in a connection structure according to Example 7 of the present invention. Fig.25 (B) is a diagram showing an arrangement pattern of the first resin 20 and the second resin 30 of the connection structure according to Example 7 of the present invention. The parameters of the connection structure of Example 7 are as follows.

[0286] Width (short side) of first electrode 110 (A7) = 15 μm

[0287] Distance between first electrodes 110 (B7) = 10 μm

[0288] · Span of the first electrode 110 (A7+B7=C7)=25 μm

[0289] Length (long side) of first electrode 110 (D7) = 30 μm

[0290] Area of ​​the first electrode 110 (A7×D7)=450 μm 2

[0291] · Area per region where the conductive particles 10 and the first resin 20 are arranged = 113 μm 2

[0292] Total area of ​​the region where the conductive particles 10 and the first resin 20 are arranged per electrode = 226 μm 2

[0293] The number of regions where the conductive particles 10 and the first resin 20 are arranged per electrode = 2

[0294] The number of conductive particles 10 arranged per region where the conductive particles 10 and the first resin 20 are arranged = 7

[0295] The number of conductive particles 10 arranged per electrode = 14 particles.

[0296] As shown in Examples 1 to 7, according to one embodiment of the present invention, even if the electrodes arranged on the electronic component are highly refined and highly dense, the conductivity between the opposing electrodes can be ensured by a simple process and short circuits between adjacent electrodes can be suppressed.

[0297] (Description of the label)

[0298] 10Conductive particles

[0299] 20 No.1 resin

[0300] 20' Composition 1

[0301] 30 2nd resin

[0302] 30' Composition 2

[0303] 100, 100a, 100b, 100c connection structure

[0304] 101 No.1 Electronic Components

[0305] 102 Component 1

[0306] 104 terminal

[0307] 106 1st insulating film

[0308] 108 2nd insulation film

[0309] 110 1st electrode

[0310] 111 No.2 Electronic Components

[0311] 112 Component 2

[0312] 114 Second electrode

[0313] 210 Roller

[0314] Version 220, 240

[0315] 222 Lyophilic layer

[0316] 224 Liquid-repellent layer

[0317] 226, 246 concave part

[0318] 230 Rubber Head

[0319] 250 Scraper

Claims

1. A connection structure comprising: a first member having a first surface; a first electrode disposed on the first surface; a second member having a second surface facing the first surface; a second electrode, which is opposite to the first electrode and is disposed on the second surface; Conductive particles and a first resin are disposed in a plurality of spaced-apart first regions, wherein the plurality of spaced-apart first regions are regions located between the first electrode and the second electrode; and The second resin is arranged in the plurality of spaced-apart first regions, and is arranged in a second region between and around the plurality of spaced-apart first regions which is a region between the first electrode and the second electrode; wherein The first resin is in contact with the first electrode in the plurality of spaced-apart first regions; The second resin is in contact with the second electrode in the plurality of spaced-apart first regions; The second resin is disposed between the first resin and the second electrode in the plurality of spaced-apart first regions; The second resin in the second region is thicker than the second resin in the plurality of spaced-apart first regions; and The first resin and the second resin have different compositions; The first electrode and the second electrode are in contact with the top and bottom of at least one of the conductive particles. At least one of the conductive particles is deformed into an oblate spheroid by pressure from the first electrode and the second electrode. The amount of compression deformation of the conductive particles is controlled within a range of 10% or more and 40% or less relative to 100% of the major diameter of the conductive particles. The distance between the first electrode and the second electrode is the same as the height of the conductive particles in the electrode-facing direction.

2. The connection structure according to claim 1, wherein The first electrode overlaps the plurality of spaced-apart first regions and the second region; and The second resin is in contact with the first electrode in the second region.

3. The connection structure according to claim 1, wherein: The first resin is further arranged in the second region, The thickness of the first resin in the second region is thinner than the thickness in the plurality of spaced-apart first regions.

4. The connection structure according to claim 3, wherein: The first resin is in contact with the first surface in the second region; The second resin is in contact with the second surface in the second region.

5. The connection structure according to claim 1, wherein: One or more and seven or less of the conductive particles are arranged in each of the plurality of spaced-apart first regions.

6. The connection structure according to claim 1, wherein: The plurality of spaced-apart first regions are separated from each other by 5 μm or more.

7. The connection structure according to claim 1, wherein: The conductive particles are 7 / 400 μm. 2 Above, 20 pieces / 400μm 2 The following range is included between the first electrode and the second electrode.

8. The connection structure according to claim 1, wherein: The conductive particles are elastic, spherical, have a plurality of protrusions on the surface, and are particles whose surfaces are covered with metal nickel (Ni), copper (Cu), or gold (Au).

9. The connection structure according to claim 1, wherein: The first electrode includes a plurality of first electrodes; An insulating film is arranged between the plurality of first electrodes on the first surface.

10. The connection structure according to claim 9, wherein: The second resin is in contact with the insulating film in the second region.

11. The connection structure according to claim 1, wherein: The first resin and the second resin include radical polymerizable resins.

12. The connection structure according to claim 1, wherein: The second resin includes a dendrimer or hyperbranched polymer structure having an acrylic group.

13. The connection structure according to claim 1, wherein: The second resin includes an ene / thiol curable resin containing an ethylenically unsaturated compound and a thiol compound, and at least one curing component of the ethylenically unsaturated compound and the thiol compound is a 9,9-diarylfluorene compound.

14. The connection structure according to claim 1, wherein: The first resin and the second resin contain a photocuring initiating component.

15. The connection structure according to claim 1, wherein: The first resin and the second resin contain a shielding portion curable active compound.

16. The connection structure according to claim 1, wherein: The first resin contains an anaerobic curing initiating component.

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