Liquid cooling module, liquid cooling module and electronic equipment

Abstract

The present application provides a liquid cooling module, a liquid cooling module and an electronic device, wherein the liquid cooling module comprises a pump and a liquid cooling module. The pump base is integrally sealed and connected to the liquid cooling module. The liquid cooling module comprises a flexible membrane and a rigid base. The elongation at break of the pump base and the liquid cooling module material is greater than 10%, including materials such as polyethylene terephthalate copolymer, polyethylene naphthalate, polyethylene 2,5-furandicarboxylate, polyimide, polyetheretherketone, biaxially stretched polypropylene, etc.; the monomers of the polyethylene terephthalate copolymer include terephthalic acid, ethylene glycol and a hard segment molecular structure. The liquid cooling module of the present application is formed by stacking the pump and the liquid cooling module, selecting materials and integrated welding, and does not require pre-tightening force to achieve integrated sealing of the flexible system, without assembly leakage, and can dynamically adapt to bending use, changes in system pressure and volume, and higher tolerance temperature, and is suitable for mobile electronic devices such as straight-screen phones, folding mobile phones, folding PCs, wearables, accessories, etc.

Description

Technical Field

[0001] The present application relates to the technical field of electronic equipment, and in particular to a liquid cooling module, a liquid cooling module and an electronic equipment. Background Art

[0002] Mobile terminals, such as mobile phones, watches, tablets, wearable devices, etc., are limited by the volume and ultra-thin requirements. The main means of heat dissipation are thermal interface materials (TIM), artificial graphite film, graphene film, copper film and other heat-dissipating materials, heat pipes VC and micro fans. Folding mobile phones and folding PCs are a new type of mobile terminals that have emerged recently, are growing rapidly and are widely welcomed by users. However, for folding mobile phones, the hinge is required to pass the reliability test of ≥100,000 bends, while most of the current heat dissipation devices and materials, such as artificial graphite, copper film, heat pipes, VC, etc., cannot pass the reliability test requirements. This results in the hinge separating two or three screens, and the heat-generating devices SOC / CPU / GPU, charging chips, etc. are concentrated on the motherboard of one of the screens, making it difficult to transfer heat to other screens and single-board areas, and the temperature difference between screens can reach more than 10°C. The main heat-generating devices SOC / CPU / GPU, charging chips, etc. have insufficient heat dissipation capacity, and the heat is concentrated, which limits the performance and affects the user's thermal experience. There are similar problems in watches and bracelets. The heat generated by the dial cannot be extended to the strap, and there is a lack of flexible heat dissipation solutions.

[0003] CN114340305B provides a through-axis pump-driven liquid cooling and flexible heat dissipation solution that can be applied to PCs or mobile phones and watches. Compared with traditional liquid cooling systems, it is a relatively simplified liquid cooling system without a liquid collection tank, a liquid filling device, and an exhaust valve. However, the system includes ≥3 connecting hoses (made of bending-resistant PTFE metal-plated to prevent evaporation), 2 cold plates (made of stainless steel composite plates), 2 water nozzles connected to the cold plates (3D printed stainless steel), 1 mechanical pump (precision injection molded parts, containing 3 sealing rings, requiring multiple bolt connections to provide pre-tightening force), 1 four-way valve (to meet the needs of testing, debugging, testing and maintenance), etc. The system has a total of ≥12 sealing interfaces. The sealed pipe joints cannot be fully automatically assembled. After the incoming materials from different suppliers are inspected, they are assembled, filled with liquid and sealed for testing in the system factory; the system generally uses metal material pipelines, and O-ring sealing systems with pre-tightening force are used in many places. In engineering, the sealing effect of the interface is closely related to the resilience of the interface material itself, the contact pressure, the swelling amount of the sealing material to the liquid cooling medium, the assembly accuracy of the assembly parts, etc., involving materials from multiple suppliers and assembly of production lines. It is impossible to fully automate the production in engineering, and quality control is difficult and costly. For consumer products, the application scenarios are complex and changeable. In particular, mobile phones are often dropped and subjected to stress during daily use, or repeatedly bent and used, and the long-term reliability of the preload force and sealing of multiple interfaces cannot be guaranteed. At the same time, traditional liquid cooling modules are formed by flow channels of polymer PET, PP, PPS and other membrane materials. Small molecules such as water will penetrate the diaphragm made of polymer materials, and this amount increases exponentially with evaporation and temperature. In theory, adhesive sealing can be used between the pump and the liquid cooling module, and inside the liquid cooling module. Although it has the advantages of being ultra-thin and easy to process, glue bonding, as the third different material between the two sealing layers, is difficult to control accurately and reliably. Microbubbles are likely to form between the layers during bonding, and long-term temperature and weather resistance is very limited. It is especially not resistant to high temperature and humidity, and is prone to creep or moisture absorption. The adhesive strength of the glue layer decreases and fails, and it cannot be reliably sealed for a long time. Glue is basically not used for sealing liquid cooling systems in engineering. In summary, leakage and evaporation problems are the biggest bottlenecks for the application of traditional liquid cooling systems in massive mobile terminal consumer electronic products; for folding machines, wearables and other products, an innovative flexible liquid cooling system sealing and heat dissipation solution is needed. Summary of the invention

[0004] The present application provides a liquid cooling module, a liquid cooling module and an electronic device. The liquid cooling module includes a pump and a liquid cooling module. The pump is used to provide power for the cooling medium in the liquid cooling module, and the pump includes a pump base and a piezoelectric component. The pump base is provided with a pump inlet and a pump outlet. The liquid cooling module includes a liquid cooling outlet and a liquid cooling inlet, the liquid cooling outlet is used to communicate with the pump inlet, and the liquid cooling inlet is used to communicate with the pump outlet. The part of the liquid cooling module around the liquid cooling outlet is the same or similar to the part of the pump base around the pump inlet, and is an integrated sealed welding structure without solder paste or other third materials. The part of the liquid cooling module around the liquid cooling inlet is the same or similar to the part of the pump base around the pump outlet, and is an integrated sealed welding structure without solder paste or other third materials. The liquid cooling module is composed of a first flexible film, a second flexible film, a first rigid base, a second rigid base, a third rigid base, etc. The first rigid substrate, the second rigid substrate and the first flexible film, the second flexible film are made of the same or similar materials, and the seal therebetween adopts an integrated sealing welding structure without solder paste or other third materials. In the liquid cooling module provided in the present application, the stacking design, material selection and integrated welding of the pump and the liquid cooling film are used to achieve the integrated sealing of the flexible system without pre-tightening force, and can dynamically adapt to the changes and fluctuations of bending use, system pressure and volume, greatly simplify the design and manufacturing, and have no assembly leakage. It is suitable for mobile electronic devices such as straight-screen phones, folding mobile phones, folding PCs, wearables, accessories, etc.

[0005] In a first aspect, the present application provides a liquid cooling module, the liquid cooling module comprising a pump and a liquid cooling module, the pump comprising a pump base and a piezoelectric component fixed to the pump base, the pump base being provided with a pump inlet and a pump outlet. The liquid cooling module comprises a liquid cooling outlet and a liquid cooling inlet, the liquid cooling outlet is used to communicate with the pump inlet, the liquid cooling inlet is used to communicate with the pump outlet, the portion of the liquid cooling module around the liquid cooling outlet and the portion of the pump base around the pump inlet are an integrated sealing structure, the portion of the liquid cooling module around the liquid cooling inlet and the portion of the pump base around the pump outlet are an integrated sealing structure.

[0006] Among them, the pump, as the power source of the liquid cooling module, can provide the power for the cooling medium in the liquid cooling module to flow and circulate, realize active liquid cooling, and thus achieve the effect of long-lasting heat dissipation. Compared with passive liquid cooling, active liquid cooling can adjust the speed of the pump as needed to achieve the best heat dissipation effect, while passive liquid cooling can only passively follow the changes in device temperature to dissipate heat, so active liquid cooling has better adjustability. It should be noted that the liquid cooling outlet is used to connect with the pump inlet, which does not mean that the liquid cooling outlet and the pump inlet are always connected, but only indicates that under certain conditions, the cooling medium can flow from the liquid cooling outlet into the pump inlet. The relationship between the liquid cooling inlet and the pump outlet is similar.

[0007] Among them, the piezoelectric component uses the inverse piezoelectric effect of piezoelectric materials. Piezoelectric materials refer to crystalline materials that will produce voltage between the two end faces when subjected to pressure. The inverse piezoelectric effect refers to the mechanical deformation or mechanical pressure of the piezoelectric component in a certain direction after an electric field is applied to the piezoelectric component. When the external electric field is removed, these deformations or stresses disappear. The use of piezoelectric components in pumps has the characteristics of small size, high energy density and no electromagnetic interference, and can realize the precise delivery and control of cooling media. In one embodiment, the piezoelectric component includes piezoelectric ceramics, a metal substrate and a plastic partition (to prevent liquid working fluid from corroding the metal substrate).

[0008] In this embodiment, part of the liquid cooling module on the side around the liquid cooling outlet and part of the pump base on the side around the pump inlet are an integrated sealing structure, and part of the liquid cooling module on the side around the liquid cooling inlet and part of the pump base on the side around the pump outlet are an integrated sealing structure. The formation of an integrated sealing structure means that there is no continuous interface between the two due to mutual fusion and penetration, and the side around the liquid cooling outlet refers to the adjacent area around the liquid cooling outlet. If the liquid cooling module and the pump base are fixed by screw connection, since the liquid cooling module and the pump base are separate devices in this case, the boundary between the two is continuous. Compared with screw fixing, the integrated sealing structure in the present application cannot be separated unless external force is applied to destroy it. However, when screw connection is adopted, the pump base and the liquid cooling module can be separated by simply removing the screws.

[0009] The fixing method using screw connection is not convenient for quality control because the tightness of the screw connection (i.e., the sealing effect) is limited by many factors such as assembly accuracy and the material's own resilience. In actual use, it may cause leakage of the cooling medium, thereby affecting the heat dissipation efficiency of the cooling medium and damaging the internal components. It is usually necessary to set a base in the pump, and the screws pass through the base and the liquid cooling module in turn to achieve fixation. The integrated sealing structure in this application integrates part of the liquid cooling module on the side of the liquid cooling outlet with part of the pump base on the side of the pump inlet, and the connection relationship is tighter, which is conducive to improving the sealing effect of the pump base and the liquid cooling module. There is no need to add an additional base, simplifying the structure of the liquid cooling module, reducing costs and processing difficulty, and achieving an ultra-thin design. In addition, the liquid cooling module provided in the present application can be applied to electronic equipment. When the electronic equipment is subjected to external force (such as falling to the ground and colliding with the ground), the use of screw fixation may cause the connection between the pump base and the liquid cooling module to loosen, or the O-ring to shift and the local seal to be loose. The integrated sealing structure makes it difficult for relative displacement to occur between the pump base and the liquid cooling module, which is beneficial to improving the stability of the overall structure of the liquid cooling module and increasing the service life of the electronic equipment.

[0010] In the present application, through the setting of a liquid cooling module: first, a pump is used to provide power for the flow and circulation of the cooling medium to achieve active heat dissipation in the liquid cooling module. Compared with passive liquid cooling, it can more effectively reduce the temperature of the device and improve the heat dissipation efficiency.

[0011] Second, the area around the liquid cooling outlet in the liquid cooling module and the area around the pump inlet in the pump base are an integrated sealing structure. The area around the liquid cooling inlet in the liquid cooling module and the area around the pump outlet in the pump base are an integrated sealing structure. Compared with screw fixation, the integrated sealing structure has a better sealing effect and can prevent leakage of the cooling medium, thereby avoiding reducing the heat dissipation efficiency of the cooling medium and protecting the device from damage.

[0012] In one embodiment, the centers of the liquid cooling outlet and the pump inlet are aligned in the thickness direction of the liquid cooling module, and the projections of the areas surrounded by the peripheral walls of the liquid cooling outlet and the pump inlet in the thickness direction overlap. This solution is conducive to reducing the flow resistance of the cooling medium when passing through the liquid cooling outlet and the pump inlet, and improving the cooling efficiency.

[0013] In one embodiment, the centers of the liquid cooling inlet and the pump outlet are aligned in the thickness direction of the liquid cooling module, and the projections of the areas surrounded by the peripheral walls of the liquid cooling inlet and the pump outlet along the thickness direction overlap. This solution is conducive to reducing the flow resistance of the cooling medium when passing through the liquid cooling inlet and the pump outlet, and improving the cooling efficiency.

[0014] In one implementation, at least a portion of the liquid cooling module around the liquid cooling outlet and at least a portion of the pump base around the pump inlet are continuously fused together along the circumference of the liquid cooling outlet to form an integrated sealing structure.

[0015] In this embodiment, in order to ensure the sealing effect between the pump base and the liquid cooling module, the integrated sealing structure needs to be continuously fused into an integrated sealing structure along the circumference of the liquid cooling outlet. In one embodiment, the integrated sealing structure can be an ellipse, a square, a triangle, or an irregular shape. In one embodiment, the circumference of the liquid cooling outlet forms an integrated sealing structure in the radial direction.

[0016] In one embodiment, in the radial direction of the liquid-cooling outlet, a part of the liquid-cooling module on the peripheral side of the liquid-cooling outlet and a part of the pump base on the peripheral side of the pump inlet may have a discontinuous interface, and the spacing between the interfaces is not limited, wherein the position without the interface is an integrated sealing structure. In a preferred embodiment, in the radial direction of the liquid-cooling outlet, a part of the liquid-cooling module on the peripheral side of the liquid-cooling outlet and a part of the pump base on the peripheral side of the pump inlet do not form an interface, which is the preferred processing technology with the best sealing effect.

[0017] It can be understood that in this implementation, the radial direction and the circumferential direction are determined based on the liquid cooling outlet being circular. When the liquid cooling outlet is in other shapes, the radial direction can be understood as the direction from the center of the liquid cooling outlet to a certain position on the circumferential side.

[0018] In one embodiment, at least part of the liquid cooling module on the side of the liquid cooling inlet and at least part of the pump base on the side of the pump outlet are continuously fused into one along the circumference of the liquid cooling inlet to form an integrated sealing structure. In this solution, the integrated sealing structure on the side of the liquid cooling inlet is continuously fused into one along the circumference of the liquid cooling inlet.

[0019] In one implementation, the pump base includes a pump bottom wall, and the pump bottom wall, the piezoelectric component, and a portion of the pump base therebetween form a pump cavity, the pump inlet and the pump outlet are arranged on the pump bottom wall and connected to the pump cavity, and the pump bottom wall and a portion of the liquid cooling module on the side surrounding the liquid cooling outlet and the side surrounding the liquid cooling inlet are an integrated sealing structure.

[0020] In the present embodiment, the connection relationship between the pump inlet and the pump cavity is similar to the connection relationship between the liquid cooling outlet and the pump inlet, that is, the pump inlet and the pump cavity are not always connected, but under the drive of the piezoelectric component, the cooling medium enters the pump cavity through the liquid cooling outlet and the pump inlet. The connection relationship between the pump outlet and the pump cavity is similar. In the present embodiment, the pump inlet and the pump outlet are both arranged on the bottom wall of the pump, and part of the pump bottom wall and part of the liquid cooling module located on the periphery of the pump inlet and the pump outlet are an integrated sealing structure, that is, there is no need to add a base to the pump. If a base is provided in the pump, on the one hand, the base and the liquid cooling module can only be fixed by screws, and the sealing effect is poor, which is easy to cause leakage of the cooling medium. On the other hand, it is usually necessary to arrange the pump inlet and the pump outlet on the outside of the base, which prolongs the flow path of the cooling medium and reduces the heat dissipation efficiency of the cooling medium.

[0021] In this embodiment, the liquid cooling module includes two parallel pumps, and the two pumps in parallel can achieve a larger flow rate. In another embodiment, the liquid cooling module includes two series pumps, and the two pumps in series can achieve a larger driving pressure. In another embodiment, the liquid cooling module may include multiple pumps, and the multiple pumps may be distributed in different positions in the liquid cooling module, which can be specifically set according to needs.

[0022] In one embodiment, the pump further comprises an inlet valve membrane and an outlet valve membrane fixed to the bottom wall of the pump, the inlet valve membrane is used to close or open the pump inlet, and the outlet valve membrane is used to close or open the pump outlet.

[0023] In this embodiment, in the liquid inlet scenario, the piezoelectric component is used to receive an electrical signal and then deform, the volume of the pump cavity increases, the inlet valve membrane is driven to open and the outlet valve membrane is driven to close, and power is provided for the cooling medium in the liquid cooling module, so that the cooling medium enters the pump cavity from the liquid cooling outlet and the pump inlet in turn. In the liquid outlet scenario, the piezoelectric component is used to receive an electrical signal and then deform, the volume of the pump cavity decreases, the inlet valve membrane is driven to close and the outlet valve membrane is driven to open, and power is provided for the cooling medium in the liquid cooling module, so that the cooling medium enters the liquid cooling module from the pump outlet and the liquid cooling inlet in turn.

[0024] In this embodiment, the inlet valve membrane is located on the side of the pump inlet away from the liquid cooling outlet along the thickness direction, and the outlet valve membrane is located between the pump outlet and the liquid cooling inlet along the thickness direction. In another embodiment, the inlet valve membrane is located between the pump inlet and the pump cavity along the thickness direction, and the outlet valve membrane is located on the side of the liquid cooling inlet away from the pump outlet along the thickness direction.

[0025] It is worth mentioning that if the piezoelectric component is in a high temperature state for a long time, it will age and cause performance degradation. Therefore, the liquid cooling module in this implementation method can not only cool the components of the electronic equipment, but also optimize the performance of the pump contained in the liquid cooling module itself.

[0026] In one implementation, the pump base also includes a pump side wall located between the pump bottom wall and the piezoelectric component, and the pump side wall is an integrated sealing structure. In this embodiment, the pump side wall extends along the thickness direction of the liquid cooling module. Since the pump side wall, the pump bottom wall, and the piezoelectric component together enclose a pump cavity, the pump side wall is set as an integrated sealing structure in this solution, which can effectively prevent the cooling medium from leaking from the pump side wall and improve the sealing performance of the pump base.

[0027] In one embodiment, the pump base includes a pump chamber layer, a first flow channel layer, a valve sheet layer and a second flow channel layer stacked along the thickness direction, a cavity hole is provided in the pump chamber layer, the pump outlet and the first guide channel corresponding to the pump inlet are provided in the first flow channel layer, the first flow channel layer is connected with the cavity hole in the pump chamber layer, the valve sheet layer is provided with the inlet valve membrane and the outlet valve membrane that can be opened and closed, the second flow channel layer is provided with the pump inlet and the second guide channel corresponding to the pump outlet, the second flow channel layer is connected with the liquid cooling module, and the pump chamber layer, the first flow channel layer, the valve sheet layer and the second flow channel layer are formed into an integrated sealing structure by hot pressing.

[0028] In this embodiment, the pump inlet, the inlet valve membrane and the first guide channel are correspondingly arranged in the thickness direction of the liquid cooling module, and the pump outlet, the outlet valve membrane and the second guide channel are correspondingly arranged in the thickness direction of the liquid cooling module. In this embodiment, when the inlet valve membrane is opened and the outlet valve membrane is closed, the cooling medium enters the pump cavity from the pump inlet through the inlet valve membrane and the first guide channel in sequence, and when the outlet valve membrane is opened and the inlet valve membrane is closed, the cooling medium enters the liquid cooling module from the pump outlet through the outlet valve membrane and the second guide channel in sequence. Among them, the projection area of ​​the area surrounded by the peripheral wall of the first guide channel along the thickness direction is larger than the projection area of ​​the area surrounded by the peripheral wall of the pump inlet along the thickness direction, which is conducive to preventing the cooling medium from flowing back to the pump inlet and exerting the guiding effect of the first guide channel on the cooling medium. The projection area of ​​the area enclosed by the peripheral wall of the second guide channel along the thickness direction is larger than the projection area of ​​the area enclosed by the peripheral wall of the pump outlet along the thickness direction, which is beneficial to prevent the cooling medium from flowing back to the pump inlet and outlet, and exert the guiding effect of the second guide channel on the cooling medium.

[0029] In this embodiment, the edges of the pump cavity layer, the first flow channel layer, the valve sheet layer and the second flow channel layer are hot pressed to form the pump side wall, so that each layer is sealed, thereby improving the sealing effect of the pump base.

[0030] In one implementation, the liquid cooling module includes a first flexible membrane, the liquid cooling outlet and the liquid cooling inlet are arranged on the first flexible membrane, and the pump bottom wall and the periphery of the liquid cooling outlet and a portion of the first flexible membrane around the liquid cooling inlet are an integrated sealing structure.

[0031] In this embodiment, the fixed connection between the liquid cooling module and the pump is actually the fixed connection between the first flexible membrane and the bottom wall of the pump. The first flexible membrane, which is located around the liquid cooling outlet and the liquid cooling inlet, forms an integrated sealing structure with the bottom wall of the pump. Since the first flexible membrane and the bottom wall of the pump are made of the same or similar materials, the difficulty of hot pressing is relatively small, which is conducive to forming an integrated sealing structure.

[0032] In this embodiment, there is a discontinuous interface between the first flexible membrane and the bottom wall of the pump. In one embodiment, at least part of the first flexible membrane and the bottom wall of the pump are continuously fused into one to form an integrated sealing structure. In another embodiment, the first flexible membrane is an integrated sealing structure with the bottom wall of the pump except for the liquid cooling outlet and the liquid cooling inlet, and there is no interface between the two. This sealing interface is a preferred sealing interface, which has stronger flexibility, sealing and impact resistance. However, it is difficult to achieve perfect processing in engineering, and it is mostly a partially continuous fusion interface, and there is a micro air gap or a non-welding area of ​​discontinuous contact between the interfaces.

[0033] In some embodiments, in order to assist in stabilizing the connection between the pump and the liquid cooling module, adhesive sealing may be used at the location where the pump is connected to the liquid cooling module 200 to improve sealing and reliability.

[0034] In one implementation, the difference between the glass transition temperature of the material of the pump bottom wall and the glass transition temperature of the material of the first flexible film is less than or equal to 20° C. In this embodiment, the difference between the glass transition temperatures of the material of the pump bottom wall and the material of the first flexible film is set to be small, which is conducive to sealing the pump bottom wall and the first flexible film into an integrated structure through hot pressing bonding, thereby improving the sealing effect of the two.

[0035] In one implementation, the difference between the melting temperature of the material of the pump bottom wall and the melting temperature of the material of the first flexible film is less than or equal to 20° C. In this embodiment, the difference between the melting temperatures of the material of the pump bottom wall and the material of the first flexible film is set to be small, which is conducive to sealing the pump bottom wall and the first flexible film into an integrated structure through hot pressing bonding, thereby improving the sealing effect of the two.

[0036] In one implementation, the material of the portion of the liquid-cooling module around the liquid-cooling outlet is the same as the material of the portion of the pump base around the pump inlet, and the material of the portion of the liquid-cooling module around the liquid-cooling inlet is the same as the material of the portion of the pump base around the pump outlet. This solution is conducive to forming an integrated sealing structure between the portion of the liquid-cooling module around the liquid-cooling outlet and the portion of the pump base, and forming an integrated sealing structure between the portion of the liquid-cooling module around the liquid-cooling inlet and the portion of the pump base, which is conducive to avoiding leakage of the cooling medium.

[0037] In one implementation, the material of the pump bottom wall is selected from a flexible heat-resistant polymer material with a breaking elongation greater than 10%, and the material of the pump bottom wall is selected from at least one of polyethylene terephthalate copolymer, polyethylene naphthalate, polyethylene 2,5-furandicarboxylate, polyimide, polyetheretherketone, and biaxially stretched polypropylene. The material of the first flexible film is selected from a flexible heat-resistant polymer material with a breaking elongation greater than 10%, and the material of the first flexible film is selected from at least one of polyethylene terephthalate copolymer, polyethylene naphthalate, polyethylene 2,5-furandicarboxylate, polyimide, polyetheretherketone, and biaxially stretched polypropylene. In this implementation, the material selected for the pump bottom wall and the first flexible film is conducive to the hot pressing between the pump bottom wall and the first flexible film to form an integrated sealing structure, wherein the pump bottom wall and the first flexible film can be made of different materials, as long as an integrated sealing structure can be formed between the pump bottom wall and the first flexible film.

[0038] In one implementation, the monomers of the polyethylene terephthalate copolymer include terephthalic acid, ethylene glycol and a hard segment molecular structure, and the mass percentage of the hard segment molecular structure in the polyethylene terephthalate copolymer is greater than or equal to 20% and less than or equal to 80%. This solution introduces a hard segment molecular structure into the structure of polyethylene terephthalate, which can increase the glass transition temperature of the polyethylene terephthalate copolymer. When the polyethylene terephthalate copolymer is used in a liquid cooling module, the liquid cooling module can be applied to medium and high temperature applications.

[0039] In this embodiment, the hard segment molecular structure is set to the above-mentioned ratio, which can improve the structural strength of the polyethylene terephthalate copolymer. When the polyethylene terephthalate copolymer is used in a liquid cooling module, it can improve the impact resistance and drop resistance of the liquid cooling module, and effectively protect other devices inside the electronic device.

[0040] In one implementation, the hard segment molecular structure is selected from at least one of 2,5-furandicarboxylic acid, dimethyl carbonate and 2,6-naphthalene dicarboxylic acid. In this implementation, the above materials are used as hard segment molecular structures to improve the structural strength of polyethylene terephthalate copolymer. When other hard segment molecular structures except dimethyl carbonate are used, the evaporation problem of the first flexible film and the second flexible film can be alleviated, and the water permeability and air permeability can be reduced.

[0041] In one implementation, the liquid-cooling module also includes a second flexible film and a first rigid substrate located between the first flexible film and the second flexible film, the first flexible film, the second flexible film and the first rigid substrate enclose an inner cavity of the liquid-cooling module, and the two ends of the first rigid substrate are respectively integrated with the first flexible film and the second flexible film to form a sealing structure.

[0042] In this embodiment, the sealing welding interface materials between the first rigid substrate and the first flexible film and the second flexible film are the same or similar, and the sealing and reliability between the first rigid substrate and the first flexible film and the second flexible film can be improved by adopting a welding method without solder paste or other third materials such as thermocompression bonding sealing welding, hot melt welding, ultrasonic welding, and ultra-frequency welding. If the sealing between the first rigid substrate and the first flexible film and the second flexible film leaks, the system performance will drop rapidly and fail quickly.

[0043] In this embodiment, the first flexible membrane and the second flexible membrane are flexible and have good bending performance, and are suitable for situations where the liquid-cooled module needs to be bent. A first rigid substrate is arranged between the first flexible membrane and the second flexible membrane, and the two ends of the first rigid substrate are used to support the first flexible membrane and the second flexible membrane, which is beneficial to improving the overall strength of the liquid-cooled module in the thickness direction. The cooling medium flows in the inner cavity surrounded by the first flexible membrane, the second flexible membrane and the first rigid substrate. In this solution, the two ends of the first rigid substrate are arranged to form an integrated sealing structure with the first flexible membrane and the second flexible membrane, respectively, which can improve the sealing of the inner cavity and prevent leakage of the cooling medium in the inner cavity.

[0044] In this embodiment, the two ends of the first rigid substrate are respectively discontinuous interfaces with the first flexible film and the second flexible film. In one embodiment, the two ends of the first rigid substrate and at least part of the first flexible film and the second flexible film are continuously fused into one, so as to form an integrated sealing structure. In another embodiment, the two ends of the first rigid substrate and the first flexible film and the second flexible film are all continuously fused into an integrated sealing structure, and there is no interface between the two ends of the first rigid substrate and the first flexible film, and there is no interface between the two ends of the first rigid substrate and the second flexible film, which is conducive to further improving the sealing effect.

[0045] In one embodiment, the first rigid substrate is arranged around the edges of the first flexible membrane and the second flexible membrane. This solution is conducive to improving the strength of the edge of the liquid cooling module in the thickness direction, and the integrated sealing structure can effectively prevent the cooling medium from leaking at the edge of the liquid cooling module.

[0046] In one embodiment, the thickness of the first flexible film and the second flexible film is less than the length and width of the liquid cooling module. Specifically, the ratio of the thickness of the first flexible film and the second flexible film to the length of the liquid cooling module is less than or equal to 0.2, and the ratio of the thickness of the first flexible film and the second flexible film to the width of the liquid cooling module is less than or equal to 0.2. When the liquid cooling module is applied to a folding device, this solution can ensure the flexibility of the first flexible film and the second flexible film in the bending direction, reducing the difficulty of bending the device.

[0047] In one embodiment, the first flexible membrane and the second flexible membrane are made of a material with a breaking elongation higher than 10% to adapt to system pressure fluctuations and bending. Preferably, the first flexible membrane and the second flexible membrane are made of a material with a breaking elongation higher than 50%. In one embodiment, the surfaces of the first flexible membrane and the second flexible membrane are treated with an anti-evaporation coating, such as coating a flexible inorganic oxide film on the surface of a polymer film to isolate water vapor.

[0048] In one implementation, the difference between the glass transition temperature of the material of the first rigid substrate and the glass transition temperature of the first flexible film is less than or equal to 20° C. In this embodiment, the difference between the glass transition temperatures of the material of the first rigid substrate and the material of the first flexible film is set to be small, which is conducive to sealing the first rigid substrate and the first flexible film into an integrated structure through hot pressing bonding, thereby improving the sealing effect of the two.

[0049] In one implementation, the difference between the glass transition temperature of the material of the first rigid substrate and the glass transition temperature of the second flexible film is less than or equal to 20° C. In this embodiment, the difference between the glass transition temperatures of the material of the first rigid substrate and the material of the second flexible film is set to be relatively small, which is conducive to sealing the first rigid substrate and the second flexible film into an integrated structure through hot pressing bonding, thereby improving the sealing effect of the two.

[0050] In one implementation, the difference between the melting temperature of the material of the first rigid substrate and the melting temperature of the material of the first flexible film is less than or equal to 20° C. Setting the difference between the melting temperatures of the material of the first rigid substrate and the material of the first flexible film to be relatively small is conducive to sealing the first rigid substrate and the first flexible film into an integrated structure through hot pressing bonding, thereby improving the sealing effect of the two.

[0051] In one implementation, the difference between the melting temperature of the material of the first rigid substrate and the melting temperature of the material of the second flexible film is less than or equal to 20° C. Setting the difference between the melting temperatures of the material of the first rigid substrate and the material of the second flexible film to be relatively small is conducive to sealing the first rigid substrate and the second flexible film into an integrated structure through hot pressing bonding, thereby improving the sealing effect of the two.

[0052] In one implementation, at least one of the first flexible film and the second flexible film includes two PET layers and an anti-evaporation layer located between the two PET layers, and the anti-evaporation layer includes at least one of a polyimide layer, a polyvinylidene chloride layer, or a metal film layer.

[0053] In this embodiment, at least one of the first flexible film and the second flexible film adopts a multi-layer film process, that is, the first flexible film and the second flexible film are arranged in a "PET-X-PET" sandwich structure, wherein the X layer refers to an anti-evaporation layer. Polyimide, polyvinylidene chloride and metal film are materials with low water vapor permeability, and the anti-evaporation layer adopts the above materials, which can reduce the evaporation of water vapor in the first flexible film and the second flexible film. In one embodiment, a multi-layer co-extrusion technology or a multi-layer film pressing technology is used to realize a multi-layer film structure in the first flexible film and the second flexible film.

[0054] In one embodiment, the metal film layer can be a copper film, a nickel film, an aluminum film or a metal-plastic composite film material, and the thickness is less than or equal to 10 microns. In this embodiment, when the liquid cooling module is applied to a folding device, this solution is conducive to ensuring that the first flexible film and the second flexible film meet the requirements of 100,000 to 400,000 bending tests at different bending angles.

[0055] In one implementation, at least one of the first flexible film and the second flexible film is provided with an inorganic oxide film on a surface away from the inner cavity. In this embodiment, although the surfaces of the first flexible film and the second flexible film away from the inner cavity are not in direct contact with the cooling medium, they are both interfaces that the cooling medium must pass through when evaporating to the outside. The provision of the inorganic oxide film is conducive to isolating water vapor and alleviating the evaporation problem of the cooling medium.

[0056] In one implementation, the liquid-cooling module also includes a second rigid substrate, which divides the inner cavity of the liquid-cooling module into a liquid inlet channel and a liquid outlet channel, the liquid cooling inlet is connected to the liquid inlet channel, the liquid cooling outlet is connected to the liquid outlet channel, and the two ends of the second rigid substrate are respectively integrated with the first flexible membrane and the second flexible membrane to form a sealing structure.

[0057] In this embodiment, the two ends of the second rigid substrate respectively adopt an integrated sealing structure with the first flexible membrane and the second flexible membrane to improve the sealing performance and reliability. If the segmentation and sealing between the second rigid substrate and the first flexible membrane and the second flexible membrane leaks, the performance of the liquid cooling system will be greatly reduced and gradually fail.

[0058] In this embodiment, the second rigid substrate is used to separate the flow channel of the inner cavity into an inlet channel and an outlet channel, and the inlet channel and the outlet channel are formed by the second rigid substrate and the first rigid substrate, the first flexible membrane and the second flexible membrane. The inlet channel is connected to the liquid cooling inlet, and the outlet channel is connected to the liquid cooling outlet. The inlet channel and the outlet channel are separated by the second rigid substrate, which helps to avoid mixing of the cooling medium in the inlet channel and the outlet channel, thereby reducing the cooling efficiency. Both ends of the second rigid substrate are integrated with the first flexible membrane and the second flexible membrane by hot pressing and sealing, which helps to improve the isolation effect between the inlet channel and the outlet channel, and can further improve the structural strength of the liquid cooling module.

[0059] It can be understood that the liquid inlet channel and the liquid outlet channel are not two completely isolated parts. The second rigid base only separates the liquid inlet channel and the liquid outlet channel adjacent to the pump. In order to allow the cooling medium to circulate in the liquid cooling module, the liquid inlet channel and the liquid outlet channel are connected in an area far away from the pump.

[0060] In this embodiment, the two ends of the second rigid substrate are respectively discontinuous interfaces with the first flexible film and the second flexible film. In one embodiment, the two ends of the second rigid substrate and at least part of the first flexible film and the second flexible film are continuously fused into one, so as to form an integrated sealing structure. In another embodiment, the two ends of the second rigid substrate are completely continuously fused with the first flexible film and the second flexible film to form an integrated sealing structure, and there is no interface between the two ends of the second rigid substrate and the first flexible film, and there is no interface between the two ends of the second rigid substrate and the second flexible film, which is conducive to further improving the sealing effect.

[0061] In one embodiment, the second rigid matrix includes a first sub-rigid matrix located below the pump and a second sub-rigid matrix located outside the pump, and the orthographic projection of the first sub-rigid matrix on the second flexible membrane does not overlap with the orthographic projection of the area enclosed by the edges of the liquid-cooling inlet and the liquid-cooling outlet on the second flexible membrane. Wherein, below the pump refers to the side of the pump close to the liquid cooling module along the thickness direction. In one embodiment, the orthographic projection of the first sub-rigid matrix on the second flexible membrane does not overlap with the orthographic projection of the area enclosed by the edges of the pump inlet and the pump outlet on the second flexible membrane. In one embodiment, for the convenience of processing or so that the first sub-rigid matrix can better divide the flow channels on both sides of the pump, the first sub-rigid matrix can be extended to a point outside the pump. The second rigid substrate mainly serves to separate the liquid inlet and outlet channels, but the second rigid substrate cannot cause obstacles to the cooling medium entering and exiting the pump chamber. Therefore, this scheme reduces the flow resistance of the cooling medium when passing through the liquid cooling inlet and the liquid cooling outlet by arranging the orthographic projection of the first sub-rigid substrate on the second flexible membrane and the area enclosed by the edges of the liquid cooling inlet and the liquid cooling outlet not overlapping with each other.

[0062] In one embodiment, the first sub-rigid substrate is made of the same material as the first rigid substrate. The first sub-rigid substrate is located below the pump. When the pump is working, the cooling liquid pumped out from the liquid cooling inlet and the liquid cooling outlet will exert impact pressure on the first sub-rigid substrate, which will cause the system performance to drop rapidly and fail quickly. The first sub-rigid substrate is made of the same material as the first rigid substrate, so that the sealing effect and structural strength between the first sub-rigid substrate and the first flexible membrane and the second flexible membrane are the same as the sealing effect and structural strength between the first rigid substrate and the first flexible membrane and the second flexible membrane, effectively improving the sealing effect and structural strength between the first sub-rigid substrate and the first flexible membrane and the second flexible membrane, and preventing the liquid near the pump from impacting the first sub-rigid substrate and affecting the sealing effect.

[0063] In one embodiment, the first sub-rigid substrate and the first rigid substrate are an integrated structure, which improves the sealing and reliability between the first sub-rigid substrate and the first rigid substrate. In one embodiment, the first sub-rigid substrate and the second sub-rigid substrate are an integrated structure, which improves the sealing and reliability between the first sub-rigid substrate and the second sub-rigid substrate.

[0064] In one embodiment, the first rigid sub-base is simultaneously heat-pressed and welded with the first rigid base and the first flexible film or the second flexible film. This solution can improve the sealing effect and structural strength between the first rigid sub-base and the first flexible film or the second flexible film.

[0065] In one embodiment, the second rigid substrate is in a strip shape as a whole. This solution can reduce processing costs, and the more regular shape of the second rigid substrate is conducive to reducing the flow resistance of the second rigid substrate to the cooling medium.

[0066] In one embodiment, the first flexible membrane corresponding to the second rigid substrate in the thickness direction is an integrated sealing structure with the pump bottom wall. This solution can further ensure that the cooling medium in the liquid inlet and outlet channels does not short-circuit and mix.

[0067] In one implementation, the liquid cooling module further includes a third rigid substrate, which is distributed in the liquid inlet channel and the liquid outlet channel, and the two ends of the third rigid substrate are respectively integrated with the first flexible membrane and the second flexible membrane to form a sealing structure. If the segmentation and sealing between the third rigid substrate and the first flexible membrane and the second flexible membrane leaks, the performance of the liquid cooling system will be slightly reduced, but the entire liquid cooling system will not fail.

[0068] In this embodiment, a plurality of third rigid substrates divide the liquid inlet flow channel into a plurality of interconnected liquid inlet sub-flow channels, and divide the liquid outlet flow channel into a plurality of interconnected liquid outlet sub-flow channels. The third rigid substrate plays a role of guiding flow in the liquid inlet flow channel and the liquid outlet flow channel, respectively, reducing flow resistance and avoiding eddy current loss, which is conducive to enhancing the heat exchange effect of the cooling medium. The third rigid substrate can be in a strip shape or a cylindrical shape as a whole. The third rigid substrate in a strip shape is conducive to guiding the flow of the cooling medium, and the third rigid substrate in a cylindrical shape is conducive to enhancing the mixing of the cooling medium.

[0069] In one embodiment, since the third rigid substrate plays the role of both guiding and mixing flow, the third rigid substrate can be set in the area where the width of the liquid inlet or outlet channel suddenly changes, the area where the cooling medium flow direction suddenly changes, and the area adjacent to the liquid cooling inlet.

[0070] In this embodiment, the two ends of the third rigid substrate are respectively discontinuous interfaces with the first flexible film and the second flexible film. In one embodiment, the two ends of the third rigid substrate and at least part of the first flexible film and the second flexible film are continuously fused into one, so as to form an integrated sealing structure. In another embodiment, the two ends of the third rigid substrate and the first flexible film and the second flexible film are all continuously fused into an integrated sealing structure, and there is no interface between the two ends of the third rigid substrate and the first flexible film, and there is no interface between the two ends of the second rigid substrate and the second flexible film, which can further improve the sealing effect.

[0071] In one embodiment, the thickness of the first rigid substrate, the second rigid substrate, and the third rigid substrate are all less than the width of the liquid cooling module. Specifically, the ratio range of the thickness of the first rigid substrate, the second rigid substrate, and the third rigid substrate to the width of the liquid cooling module is greater than or equal to 0.1 and less than or equal to 0.2. The thickness of the first rigid substrate, the second rigid substrate, and the third rigid substrate are all less than the length of the liquid cooling module. Specifically, the ratio range of the thickness of the first rigid substrate, the second rigid substrate, and the third rigid substrate to the length of the liquid cooling module is greater than or equal to 10-5 and less than or equal to 0.2. This solution is conducive to ensuring the high strength of the liquid cooling module in the thickness direction and the flexibility of the liquid cooling module in the length and width directions.

[0072] In one embodiment, the thicknesses of the first rigid substrate, the second rigid substrate, and the third rigid substrate are not equal. The thickness refers to the dimension in the thickness direction. In this embodiment, the three rigid substrates are designed with unequal thicknesses. When the liquid cooling module is applied to a folding device, it is beneficial to fully utilize the space in the folding device, avoid other devices in the device, and optimize the layout.

[0073] In one embodiment, the first flexible membrane or the second flexible membrane may also be provided with a liquid injection port and an air extraction port, etc., and the liquid injection port and the air extraction port are an integrated sealing structure with at least one of the three rigid substrates and the first flexible membrane or the second flexible membrane. In this embodiment, the liquid injection port is used to inject cooling medium into the inner cavity before cooling, and the air extraction port is used to extract the gas in the inner cavity to avoid negative effects on the heat dissipation effect. The liquid injection port and the air extraction port are integrally sealed and connected with at least one of the first rigid substrate, the second rigid substrate and the third rigid substrate, and the first flexible membrane or the second flexible membrane, which is conducive to avoiding leakage of the cooling medium in the liquid injection port and the air extraction port. In order to achieve an ultra-thin effect, the liquid injection port, the air extraction port and the liquid cooling module are in the same plane, that is, between the first flexible membrane and the second flexible membrane.

[0074] In one implementation, the liquid-cooling module includes a liquid-cooling film bending zone, the liquid-cooling module is folded through the liquid-cooling film bending zone, at least one of the first rigid substrate, the second rigid substrate and the third rigid substrate is provided with a flexibility-enhancing structure, the flexibility-enhancing structure is located in the liquid-cooling film bending zone, and the flexibility-enhancing structure is used to improve the flexibility of the liquid-cooling film bending zone.

[0075] In this embodiment, the first rigid substrate, the second rigid substrate and the third rigid substrate can enhance the strength of the liquid cooling module in the thickness direction due to their rigidity. When the liquid cooling module is applied to a folding device, the bending portion of the liquid cooling module needs to have a certain flexibility. Therefore, this solution sets a flexibility enhancement structure in the bending area of ​​the liquid cooling film of the liquid cooling module, which can reduce the resistance of the bending portion of the liquid cooling module when bending, and meet the folding requirements of the electronic device.

[0076] In one embodiment, the flexibility enhancement structure may be at least one of a groove, a through hole, a through hole, and an opening.

[0077] In one embodiment, the liquid cooling module further comprises a first liquid cooling film static area and a second liquid cooling film static area located on both sides of the liquid cooling film bending area. When the liquid cooling film bending area is bent, the first liquid cooling film static area and the second liquid cooling film static area do not deform.

[0078] In one implementation, the flexibility enhancement structure of the first rigid substrate includes a groove located on a side wall of the first rigid substrate, and the groove is located in a bending area of ​​the liquid-cooling film.

[0079] In this embodiment, the first rigid substrate is arranged around the edge of the liquid cooling module, and is a barrier between the cooling medium and the external environment. Therefore, the first rigid substrate needs to have a high structural strength to ensure the sealing effect, so that the cooling medium does not leak to the outside of the liquid cooling module. The first rigid substrate located in the bending area of ​​the liquid cooling film needs to take into account both structural strength and a certain degree of flexibility. Therefore, the flexibility enhancement structure arranged on the first rigid substrate is preferably a groove. If a through hole, through hole or opening is set on the first rigid substrate, there will be a risk of cooling medium leakage.

[0080] In one implementation, the flexibility enhancement structure of the second rigid substrate includes a through hole penetrating the second rigid substrate along a first direction, the through hole is located in the bending area of ​​the liquid cooling film, and the first direction is the arrangement direction of the first flexible film and the second flexible film.

[0081] In this embodiment, a through hole is provided in the second rigid substrate, which can improve the flexibility of the bent portion of the second rigid substrate. Since the two sides of the second rigid substrate are the liquid inlet channel and the liquid outlet channel respectively, the opening on the second rigid substrate cannot connect the cooling medium on both sides to avoid affecting the cooling effect due to mixed flow. Among them, the first direction A is also the thickness direction of the liquid cooling module.

[0082] In one implementation, the liquid-cooling module is provided with a through hole penetrating the second rigid substrate, the first flexible membrane and the second flexible membrane along the first direction, and the through hole is located in a bending area of ​​the liquid-cooling membrane.

[0083] In this embodiment, a through hole is provided in the second rigid substrate, which can improve the flexibility of the bending part of the second rigid substrate and reduce the rebound force and friction force of the bending area of ​​the liquid cooling module when bending. Among them, the first direction is the thickness direction of the liquid cooling module. The through hole penetrates the second rigid substrate along the first direction without causing short circuit and mixed flow of the cooling medium in the liquid inlet and outlet channels. The third rigid substrate can be opened to reduce the rebound force of the bending area of ​​the liquid cooling module and the friction force with the screen and the middle frame when bending, and will not cause short circuit of the cooling medium flow.

[0084] In one embodiment, the flexibility structure of the second rigid substrate includes through holes and through holes, or the flexibility structure of the second rigid substrate includes any one of through holes and through holes. In this solution, through holes and through holes can be flexibly arranged in the second rigid substrate according to actual conditions, thereby improving the practicality of the second rigid substrate in different application environments.

[0085] In one implementation, the flexibility enhancement structure of the third rigid substrate includes an opening located in the third rigid substrate, and the opening is connected to flow channels on both sides of the third rigid substrate.

[0086] In this embodiment, since the deformation of the bending area of ​​the liquid cooling film is relatively large when it is bent, this solution is set to set an opening in the third rigid substrate, which is equivalent to partially disconnecting the third rigid substrate at the position of the opening, inducing bending deformation at the designed position, and effectively reducing the stress generated during bending. Part of the third rigid substrate is distributed in the liquid inlet channel, and part of the third rigid substrate is distributed in the liquid outlet channel, that is, the channels on both sides of the third rigid substrate belong to the same liquid inlet channel or the same liquid outlet channel, so the opening connects the two sides of the third rigid substrate without affecting the heat dissipation efficiency, and can increase the mixing effect of the cooling medium in the same flow direction in the liquid inlet channel or the liquid outlet channel, thereby improving the cooling effect.

[0087] In one embodiment, the flexibility enhancement structure may extend along the flow direction of the cooling medium. In another embodiment, the flexibility enhancement structure may extend along the folding direction of the folding device. Setting the size of the flexibility enhancement structure in the extension direction to be larger can effectively improve the flexibility of the bending area of ​​the liquid cooling film, reduce the rebound force of the bending area of ​​the liquid cooling module and the friction force with the screen and the middle frame when bending, thereby improving the user experience of the folding device.

[0088] In one embodiment, a lubricating material layer is applied on the surface of the first flexible film and the second flexible film away from the inner cavity, and the lubricating material layer is located in the bending area of ​​the liquid-cooled film. In this embodiment, in order to improve the flexibility of the bending area of ​​the liquid-cooled film, in addition to providing a flexibility enhancement structure on the first rigid substrate, the second rigid substrate and the third rigid substrate, a lubricating material layer can also be provided on the outer surface of the first flexible film and the second flexible film to reduce the friction of the bending area of ​​the liquid-cooled film when bending, so that the bending process can be carried out more smoothly. Exemplarily, the lubricating material layer includes, but is not limited to, solid, liquid or paste lubricating materials such as Teflon film, graphite film, graphene film or grease. Among them, when the lubricating material layer adopts graphite film or graphene film, the lubricating material layer can be arranged only in the bending area of ​​the liquid-cooled film, or it can be arranged simultaneously in at least one of the first liquid-cooled film static area and the second liquid-cooled film static area and the liquid-cooled film bending area. At this time, in addition to lubricating and reducing friction in the static area of ​​the liquid-cooled film, since graphite and graphene themselves have a high thermal conductivity, the lubricating material layer can also enhance the heat dissipation effect and reduce the overall temperature of the cooling medium, thereby reducing the startup time and frequency of the pump.

[0089] In a second aspect, the present application provides a liquid-cooling module, comprising a first flexible film, a second flexible film, and a first rigid substrate located between the first flexible film and the second flexible film, the first flexible film, the second flexible film, and the first rigid substrate enclose an inner cavity of the liquid-cooling module, and the difference between the glass transition temperature of the first rigid substrate and the glass transition temperature of the material of the first flexible film is less than or equal to 20°C.

[0090] In this embodiment, the first flexible film and the second flexible film can reduce the difficulty of bending the electronic device. The first rigid substrate is used to enhance the structural strength of the liquid cooling module in the thickness direction. The first flexible film, the second flexible film and the first rigid substrate enclose an inner cavity, and the cooling medium flows in the inner cavity. The two ends of the first rigid substrate and the first flexible film and the second flexible film form an integrated sealing structure, which is conducive to improving the sealing performance of the first rigid substrate and avoiding leakage of the cooling medium.

[0091] In this embodiment, the difference in glass transition temperature between the material of the first rigid substrate and the material of the first flexible film is set to be small, which is conducive to sealing the first rigid substrate and the first flexible film into an integrated structure through hot pressing bonding, thereby improving the sealing effect of the two.

[0092] In one embodiment, the difference between the melting temperature of the material of the first rigid substrate and the melting temperature of the material of the first flexible film is less than or equal to 20° C. In this embodiment, the difference between the melting temperatures of the material of the first rigid substrate and the material of the first flexible film is set to be small, which is conducive to sealing the first rigid substrate and the first flexible film into an integrated structure through hot pressing bonding, thereby improving the sealing effect of the two.

[0093] In a third aspect, the present application provides a liquid-cooling module, comprising a first flexible film, a second flexible film and a first rigid substrate located between the first flexible film and the second flexible film, the first flexible film, the second flexible film and the first rigid substrate enclosing an inner cavity of the liquid-cooling module, the material of the first flexible film, the second flexible film and the first rigid substrate being selected from a flexible temperature-resistant polymer material having an elongation at break greater than 10%, the material of the first flexible film, the second flexible film and the first rigid substrate being independently selected from at least one of polyethylene terephthalate copolymer, polyethylene naphthalate, polyethylene 2,5-furandicarboxylate, polyimide, polyetheretherketone and biaxially stretched polypropylene.

[0094] In this embodiment, the first flexible film and the second flexible film can reduce the difficulty of bending the electronic device. The first rigid substrate is used to enhance the structural strength of the liquid cooling module in the thickness direction. The first flexible film, the second flexible film and the first rigid substrate enclose an inner cavity, and the cooling medium flows in the inner cavity. The two ends of the first rigid substrate and the first flexible film and the second flexible film form an integrated sealing structure, which is conducive to improving the sealing performance of the first rigid substrate and avoiding leakage of the cooling medium.

[0095] In this embodiment, the materials selected for the first rigid substrate and the first flexible film or the second flexible film are conducive to the first rigid substrate and the first flexible film or the second flexible film being hot pressed to form an integrated sealing structure. The first rigid substrate and the first flexible film or the second flexible film can be made of different materials as long as an integrated sealing structure can be formed between the first rigid substrate and the first flexible film or the second flexible film.

[0096] In a fourth aspect, the present application provides a liquid cooling module, the liquid cooling module comprising a first flexible film, a second flexible film and a rigid substrate located between the first flexible film and the second flexible film. The liquid cooling module comprises a liquid cooling film bending area, the liquid cooling module is folded through the liquid cooling film bending area, the rigid substrate is provided with a flexibility enhancement structure, the flexibility enhancement structure is located in the liquid cooling film bending area, and the flexibility enhancement structure is used to improve the flexibility of the liquid cooling film bending area.

[0097] In this embodiment, the two ends of the rigid substrate are used to support the first flexible membrane and the second flexible membrane. The provision of the rigid substrate in the liquid cooling module is beneficial to improving the structural strength of the liquid cooling module in the thickness direction. When the electronic device is bent, the bending area of ​​the liquid cooling film in the liquid cooling module undergoes a large deformation. Therefore, a flexibility enhancement structure needs to be provided on the rigid substrate located in the bending area of ​​the liquid cooling film to enhance the flexibility of the bending area of ​​the liquid cooling film. In one embodiment, the flexibility enhancement structure may be at least one of a groove, a through hole, a through hole, and an opening. In one embodiment, the rigid substrate may include a first rigid substrate, a second rigid substrate, and a third rigid substrate.

[0098] In a fifth aspect, the present application provides an electronic device, the electronic device comprising the liquid cooling module as described in any one of the implementations of the first aspect, the liquid cooling module being located in the electronic device. In one implementation, the liquid cooling module is located in an accessory of the electronic device. In one implementation, the electronic device comprises the liquid cooling module as described in any one of the second, third, and fourth aspects, the liquid cooling module being located in the electronic device. In one implementation, the liquid cooling module is located in an accessory of the electronic device.

[0099] In one implementation, the electronic device includes a first non-folding portion, a folding portion, and a second non-folding portion, the second non-folding portion can be folded toward the first non-folding portion through the folding portion, the liquid-cooling module includes a liquid-cooling film bending zone, and when the electronic device is folded, the liquid-cooling module is folded through the liquid-cooling film bending zone, and at least one of the first rigid substrate, the second rigid substrate, and the third rigid substrate is provided with a flexibility-enhancing structure, and the flexibility-enhancing structure is located in the liquid-cooling film bending zone, and the flexibility-enhancing structure is used to improve the flexibility of the liquid-cooling film bending zone.

[0100] The beneficial effects of the present application are as follows: On foldable electronic devices, the equivalent thermal conductivity of the liquid cooling film group can reach over 5000W / mK, which is more than 100% higher than the heat dissipation capacity of cross-axis / through-axis graphite heat dissipation materials; the liquid cooling system can be extremely simplified in processing and manufacturing, with no assembly leakage and high flexibility. BRIEF DESCRIPTION OF THE DRAWINGS

[0101] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the embodiments of the present application will be described below.

[0102] Figure 1a is a structural schematic diagram of a liquid cooling module provided in the first embodiment of the present application;

[0103] Figure 1b yes Figure 1a A partial enlarged view of the middle P part;

[0104] Figure 1cIt is a physical schematic diagram of the pump part of the liquid cooling module provided in the first embodiment of the present application;

[0105] Figure 2 is a cross-sectional view of a liquid cooling module provided in the first embodiment of the present application;

[0106] Figure 3 is a cross-sectional view of a liquid cooling module provided in the first embodiment of the present application;

[0107] Figure 4 is a top view of the liquid cooling module provided in the first embodiment of the present application;

[0108] Figure 5 is a cross-sectional view of a liquid cooling module provided in the first embodiment of the present application;

[0109] Figure 6 is a cross-sectional view of a liquid cooling module provided in the first embodiment of the present application;

[0110] Figure 7 is an exploded view of a stacked structure of a pump portion provided in the first embodiment of the present application;

[0111] Figure 8 is a cross-sectional view of a liquid cooling module provided in the first embodiment of the present application;

[0112] Fig. 9 is a cross-sectional view of a liquid cooling module provided in the first embodiment of the present application;

[0113] Fig.10 is a side view of the pump and the second rigid base provided in the first embodiment of the present application;

[0114] Fig.11 is a cross-sectional view of a liquid cooling module provided in the first embodiment of the present application;

[0115] Fig.12 is a cross-sectional view of a liquid cooling module provided in the first embodiment of the present application;

[0116] Fig.13 is a cross-sectional view of a first flexible film provided in the first embodiment of the present application;

[0117] Fig.14 is a cross-sectional view of a liquid cooling module provided in the first embodiment of the present application;

[0118] Fig.15 yes Figure 1a A partial enlarged view of the liquid cooling module shown;

[0119] Fig.16 is a cross-sectional view of a liquid cooling module provided in the first embodiment of the present application;

[0120] Fig.17 is a cross-sectional view of a liquid cooling module provided in the first embodiment of the present application;

[0121] Fig.18 is a cross-sectional view of a liquid cooling module provided in the first embodiment of the present application;

[0122] Fig.19 is a cross-sectional view of a liquid cooling module provided in the first embodiment of the present application;

[0123] Fig. 20 is a schematic diagram of the structure of an electronic device provided in the first embodiment of the present application;

[0124] Fig.21 is a structural schematic diagram of an electronic device provided in a second embodiment of the present application;

[0125] Fig. 22 is a structural schematic diagram of an electronic device provided in a second embodiment of the present application;

[0126] Fig.23 is a schematic structural diagram of an electronic device provided in a third embodiment of the present application;

[0127] Fig.24 It is a partial structural schematic diagram of a liquid cooling module provided in the third embodiment of the present application;

[0128] Fig.25 is a structural schematic diagram of a liquid cooling module and a flexible circuit board provided in the third embodiment of the present application;

[0129] Fig.26 is a structural schematic diagram of a liquid cooling module provided in the fourth embodiment of the present application;

[0130] Fig. 27 A schematic diagram of the structure of an electronic device provided in one embodiment of the present application;

[0131] Fig.28 is a schematic diagram of the structure of an electronic device provided in a fifth embodiment of the present application;

[0132] Fig.29 A schematic diagram of a liquid cooling module provided in one embodiment of the present application. DETAILED DESCRIPTION

[0133] The technical solutions in the embodiments of the present application will be described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all of the embodiments.

[0134] In this document, the terms "first", "second", etc. are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, unless otherwise specified, "plurality" means two or more.

[0135] In addition, in this article, directional terms such as "upper" and "lower" are defined relative to the orientation of the structure schematically placed in the drawings. It should be understood that these directional terms are relative concepts. They are used for relative description and clarification, and they can change accordingly according to the change of the orientation of the structure.

[0136] For ease of understanding, the English abbreviations and related technical terms involved in the embodiments of the present application are explained and described below.

[0137] PET: polyethylene terephthalate.

[0138] Glass transition temperature: refers to the temperature corresponding to the transition from glass state to highly elastic state. A high glass transition temperature indicates that the material has good heat resistance.

[0139] The embodiment of the present application provides a liquid cooling module, which includes a pump and a liquid cooling module. The pump is used to provide power for the cooling medium in the liquid cooling module. The pump includes a pump base and a piezoelectric component. The pump base is provided with a pump inlet and a pump outlet. The liquid cooling module includes a liquid cooling outlet and a liquid cooling inlet. The liquid cooling outlet is connected to the pump inlet. The liquid cooling inlet is connected to the pump outlet. Part of the liquid cooling module around the liquid cooling outlet is the same or similar to the part of the pump base around the pump inlet. It is an integrated sealed welding structure without solder paste or other third materials. Part of the liquid cooling module around the liquid cooling inlet is the same or similar to the part of the pump base around the pump outlet. It is an integrated sealed welding structure without solder paste or other third materials. This integrated sealed welding method includes welding methods without solder paste or other third materials such as hot press bonding sealing welding, hot melt welding, ultrasonic welding, and ultra-frequency welding. The liquid cooling module is composed of a first flexible film (elongation at break>10%), a second flexible film (elongation at break>10%), a first rigid substrate, a second rigid substrate, a third rigid substrate, etc. The first rigid substrate and the second rigid substrate are made of the same or similar materials as the first flexible film and the second flexible film, and the seal therebetween adopts an integrated sealing welding structure without solder paste or other third materials. This integrated sealing welding includes welding methods such as hot pressing bonding sealing welding, hot melt welding, ultrasonic welding, and ultra-frequency welding without solder paste or other third materials. In the liquid cooling module provided in the embodiment of the present application, the integrated welding seal between the pump and the liquid cooling module and the liquid cooling module has no assembly leakage, is resistant to bending and impact, adapts to changes in system pressure and volume, greatly simplifies design and manufacturing, and can avoid leakage of cooling medium due to sealing problems, thereby improving the stability of the overall structure of the liquid cooling module and the safety performance of electronic equipment.

[0140] The liquid cooling module provided in the embodiments of the present application will be described in detail below.

[0141] See also Figure 1a , Figure 1b , Figure 1c and Figure 2 , Figure 1a This is a schematic diagram of the structure of the liquid cooling module 10 provided in the first embodiment of the present application. Figure 1b yes Figure 1a A partial enlarged view of the middle P part; Figure 1c It is a physical schematic diagram of the pump part of the liquid cooling module provided in the first embodiment of the present application; Figure 2 This is a cross-sectional view of the liquid cooling module 10 provided in the first embodiment of the present application.

[0142] In one embodiment, the liquid cooling module 10 includes a pump 200 and a liquid cooling module 100 (eg, Figure 1a and Figure 2 As shown), the pump 200 includes a pump base 210 and a piezoelectric component 220, etc. The pump base 210 is provided with a pump inlet 211 and a pump outlet 212 (as shown in FIG. Figure 2 The liquid cooling module 100 includes a liquid cooling outlet 111 and a liquid cooling inlet 112 (as shown in FIG. Figure 2 As shown), the liquid cooling outlet 111 is used to communicate with the pump inlet 211, the liquid cooling inlet 112 is used to communicate with the pump outlet 212, and the part of the liquid cooling module 100 around the liquid cooling outlet 111 and the part of the pump base 210 around the pump inlet 211 are an integrated sealing structure (as shown in FIG. Figure 2 As shown), the liquid cooling module 100 on the side of the liquid cooling inlet 112 and the pump base 210 on the side of the pump outlet 212 are integrated into a sealing structure (as shown in FIG. Figure 2 The engineering pump and liquid cooling module can assist in dispensing and enhance the structural positioning and strength, but it is not a sealed welding surface.

[0143] Among them, the pump 200, as the power source of the liquid cooling module 10, can provide the power for the cooling medium in the liquid cooling module 100 to flow and circulate, realize active liquid cooling, and thus achieve the effect of long-lasting heat dissipation. Compared with passive liquid cooling, active liquid cooling can adjust the speed of the pump 200 as needed to achieve the best heat dissipation effect, while passive liquid cooling can only passively follow the change of device temperature to dissipate heat, so active liquid cooling has better adjustability. It should be noted that the liquid cooling outlet 111 is used to communicate with the pump inlet 211, which does not mean that the liquid cooling outlet 111 and the pump inlet 211 are always connected, but only indicates that under certain conditions, the cooling medium can flow from the liquid cooling outlet 111 into the pump inlet 211. The relationship between the liquid cooling inlet 112 and the pump outlet 212 is similar.

[0144] In this embodiment, part of the liquid cooling module 100 around the liquid cooling outlet 111 and part of the pump base 210 around the pump inlet 211 are an integrated sealing structure, and part of the liquid cooling module 100 around the liquid cooling inlet 112 and part of the pump base 210 around the pump outlet 212 are an integrated sealing structure. Among them, forming an integrated sealing structure means that there is no continuous interface between the two due to mutual fusion and penetration, and the surrounding side of the liquid cooling outlet 111 refers to the adjacent area around the liquid cooling outlet 111. If the liquid cooling module 100 and the pump base 210 are fixed by screw connection, since the liquid cooling module 100 and the pump base 210 are separate devices in this case, the boundary between the two is continuous. Compared with screw fixing, the integrated sealing structure in the embodiment of the present application cannot be separated unless external force is applied to destroy it. However, when screw connection is adopted, the pump base 210 can be separated from the liquid cooling module 100 by simply removing the screw.

[0145] The fixing method using screw connection is not convenient for quality control because the tightness of the screw connection (i.e., the sealing effect) is limited by various factors such as assembly accuracy and the resilience of the material itself. In actual use, it may cause leakage of the cooling medium, thereby affecting the heat dissipation efficiency of the cooling medium and damaging the internal components. In addition, it is usually necessary to set a base in the pump 200, and the screws pass through the base and the liquid cooling module 100 in turn to achieve fixation. The integrated sealing structure in the embodiment of the present application integrates part of the liquid cooling module 100 on the side of the liquid cooling outlet 111 and part of the pump base 210 on the side of the pump inlet 211 into one, and the connection relationship is tighter, which is conducive to improving the sealing effect of the pump base 210 and the liquid cooling module 100, and there is no need to add an additional base, simplifying the structure of the liquid cooling module 10, reducing costs and processing difficulty, and achieving an ultra-thin design. In addition, the liquid cooling module 10 provided in the embodiment of the present application can be applied to electronic equipment. When the electronic equipment is subjected to external force (such as falling to the ground and colliding with the ground), the use of screw fixation may cause the connection between the pump base 210 and the liquid cooling module 100 to loosen, or the O-ring to shift and the local seal to be loose. The integrated sealing structure makes it difficult for relative displacement to occur between the pump base 210 and the liquid cooling module 100, which is beneficial to improving the stability of the overall structure of the liquid cooling module 10 and increasing the service life of the electronic equipment.

[0146] In the present application, through the setting of the liquid cooling module 10: first, the pump 200 is used to provide power for the flow and circulation of the cooling medium, and active heat dissipation is achieved in the liquid cooling module 10. Compared with passive liquid cooling, it can more effectively reduce the temperature of the device and improve the heat dissipation efficiency.

[0147] Second, the area around the liquid cooling outlet 111 in the liquid cooling module 100 and the area around the pump inlet 211 in the pump base 210 are an integrated sealing structure, and the area around the liquid cooling inlet 112 in the liquid cooling module 100 and the area around the pump outlet 212 in the pump base 210 are an integrated sealing structure. Compared with screw fixation, the integrated sealing structure has a better sealing effect and can prevent leakage of the cooling medium, thereby avoiding reducing the heat dissipation efficiency of the cooling medium and protecting the device from damage.

[0148] In one embodiment, the centers of the liquid cooling outlet 111 and the pump inlet 211 are aligned in the thickness direction A of the liquid cooling module 10, and the projections of the areas surrounded by the peripheral walls of the liquid cooling outlet 111 and the pump inlet 211 along the thickness direction A overlap. This solution is conducive to reducing the flow resistance of the cooling medium when passing through the liquid cooling outlet 111 and the pump inlet 211, thereby improving the cooling efficiency.

[0149] In one embodiment, the centers of the liquid cooling inlet 112 and the pump outlet 212 are aligned in the thickness direction A of the liquid cooling module 10, and the projections of the areas surrounded by the peripheral walls of the liquid cooling inlet 112 and the pump outlet 212 along the thickness direction A overlap. This solution is conducive to reducing the flow resistance of the cooling medium when passing through the liquid cooling inlet 112 and the pump outlet 212, thereby improving the cooling efficiency.

[0150] See also Figure 3 and Figure 4 , Figure 3 This is a cross-sectional view of the liquid cooling module 10 provided in the first embodiment of the present application. Figure 4 1 is a top view of the liquid cooling module 10 provided in the first embodiment of the present application. In one embodiment, at least a portion of the liquid cooling module 100 on the side of the liquid cooling outlet 111 and at least a portion of the pump base 210 on the side of the pump inlet 211 are continuously integrated along the circumferential direction D of the liquid cooling outlet 111 (combined with Figure 3 and Figure 4 As shown), to form an integrated sealing structure.

[0151] In this embodiment, in order to ensure the sealing effect between the pump base 210 and the liquid cooling module 100, the integrated sealing structure needs to be continuously fused into an integrated sealing structure M along the circumference of the liquid cooling outlet 111, such as Figure 4 In one embodiment, M may be an ellipse, a square, a triangle, or an irregular shape. In one embodiment, the liquid-cooling outlet 111 is formed with an integrated sealing structure along the radial direction E. It should be noted that continuous fusion may be provided along the circumferential direction D only at one or several positions on the liquid-cooling outlet 111, without an integrated sealing welding structure of a third material.

[0152] Please refer to Figure 3 , Figure 5 and Figure 6 , Figure 5 This is a cross-sectional view of the liquid cooling module 10 provided in the first embodiment of the present application. Figure 6 This is a cross-sectional view of the liquid cooling module 10 provided in the first embodiment of the present application. In one embodiment, in the radial direction E of the liquid cooling outlet 111, a portion of the liquid cooling module 100 on the peripheral side of the liquid cooling outlet 111 and a portion of the pump base 210 on the peripheral side of the pump inlet 211 may have a discontinuous interface, and the spacing between the interfaces is not limited (e.g. Figure 3 and Figure 5 In a preferred embodiment, in the radial direction E of the liquid cooling outlet 111, no interface is formed between the part of the liquid cooling module 100 around the liquid cooling outlet 111 and the part of the pump base 210 around the pump inlet 211 (as shown in FIG. Figure 6 As shown), it is the preferred processing technology with the best sealing effect.

[0153] Understandably, in Figures 3 to 6 In the liquid cooling module 10 shown, the radial direction E and the circumferential direction D are determined based on the liquid cooling outlet 111 being circular. When the liquid cooling outlet 111 is in other shapes, the radial direction E can be understood as the direction from the center of the liquid cooling outlet 111 to a certain position on the circumferential side.

[0154] In one embodiment, at least a portion of the liquid cooling module 100 on the side of the liquid cooling inlet 112 and at least a portion of the pump base 210 on the side of the pump outlet 212 are continuously fused together along the circumference of the liquid cooling inlet 112 to form an integrated sealing structure. In this solution, the integrated sealing structure on the side of the liquid cooling inlet 112 is continuously fused together along the circumference of the liquid cooling inlet 112.

[0155] Please continue reading Figure 2 In one embodiment, the pump 200 also includes a piezoelectric component 220, which is fixed to the pump base 210. The pump base 210 includes a pump bottom wall 213. The pump bottom wall 213, the piezoelectric component 220, and a portion of the pump base 210 therebetween form a pump cavity 214. The pump inlet 211 and the pump outlet 212 are arranged on the pump bottom wall 213 and are connected to the pump cavity 214. The pump bottom wall 213 and a portion of the liquid cooling module 100 on the side surrounding the liquid cooling outlet 111 and the side surrounding the liquid cooling inlet 112 are an integrated sealing structure.

[0156] Among them, the piezoelectric component 220 utilizes the inverse piezoelectric effect of piezoelectric materials. Piezoelectric materials refer to crystalline materials that will produce voltage between the two end faces when subjected to pressure. The inverse piezoelectric effect refers to the mechanical deformation or mechanical pressure of the piezoelectric component 220 in a certain direction after an electric field is applied to the piezoelectric component 220. When the external electric field is removed, these deformations or stresses also disappear. The piezoelectric component 220 used in the pump 200 has the characteristics of small size, high energy density and no electromagnetic interference, and can realize the precise delivery and control of the cooling medium. In one embodiment, the piezoelectric component 220 includes piezoelectric ceramics, a metal substrate and a plastic partition (to prevent the metal substrate from being corroded by the liquid working medium).

[0157] In the present embodiment, the connection relationship between the pump inlet 211 and the pump cavity 214 is similar to the connection relationship between the liquid cooling outlet 111 and the pump inlet 211, that is, the pump inlet 211 and the pump cavity 214 are not always connected, but under the drive of the piezoelectric component 220, the cooling medium enters the pump cavity 214 through the liquid cooling outlet 111 and the pump inlet 211. The connection relationship between the pump outlet 212 and the pump cavity 214 is similar. In the present embodiment, the pump inlet 211 and the pump outlet 212 are both arranged on the pump bottom wall 213, and the part of the pump bottom wall 213 and the part of the liquid cooling module 100 located on the periphery of the pump inlet 211 and the pump outlet 212 are an integrated sealing structure, that is, there is no need to add an additional base to the pump 200. If a base is provided in the pump 200, on the one hand, the base can only be fixed to the liquid cooling module 100 by screws, which has a poor sealing effect and is prone to leakage of the cooling medium. On the other hand, it is usually necessary to provide the pump liquid inlet 211 and the pump liquid outlet 212 on the outside of the base, which lengthens the flow path of the cooling medium and reduces the heat dissipation efficiency of the cooling medium.

[0158] Please continue reading Figure 1a In this embodiment, the liquid cooling module 10 includes two pumps 200 connected in parallel, and the two pumps 200 connected in parallel can achieve a larger flow rate. In another embodiment, the liquid cooling module 10 includes two pumps 200 connected in series, and the two pumps 200 connected in series can achieve a larger driving pressure. In another embodiment, the liquid cooling module 10 may include multiple pumps 200, and the multiple pumps 200 may be distributed in different positions in the liquid cooling module 10, which can be specifically set according to needs.

[0159] Please continue reading Figure 2 In one embodiment, the pump 200 further includes a liquid inlet valve membrane 230 and a liquid outlet valve membrane 240 fixed to the pump bottom wall 213, the liquid inlet valve membrane 230 is used to close or open the pump liquid inlet 211, and the liquid outlet valve membrane 240 is used to close or open the pump liquid outlet 212. In this embodiment, in the liquid inlet scenario, the piezoelectric component 220 is used to receive an electrical signal and generate a deformation, the volume of the pump cavity 214 increases, the liquid inlet valve membrane 230 is driven to open and the liquid outlet valve membrane 240 is driven to close, and power is provided for the cooling medium in the liquid cooling module 100, so that the cooling medium enters the pump cavity 214 from the liquid cooling outlet 111 and the pump liquid inlet 211 in sequence. In the liquid discharge scenario, the piezoelectric component 220 is used to generate deformation after receiving the electrical signal, and the volume of the pump chamber 214 becomes smaller, driving the liquid inlet valve membrane 230 to close and the liquid outlet valve membrane 240 to open, providing power for the cooling medium in the liquid cooling module 100, so that the cooling medium enters the liquid cooling module 100 from the pump outlet 212 and the liquid cooling inlet 112 in turn.

[0160] exist Figure 2In the illustrated embodiment, the inlet valve membrane 230 is located along the thickness direction A on the side of the pump inlet 211 away from the liquid cooling outlet 111, and the outlet valve membrane 240 is located along the thickness direction A between the pump outlet 212 and the liquid cooling inlet 112. In another embodiment, the inlet valve membrane 230 is located along the thickness direction A between the pump inlet 211 and the pump chamber 214, and the outlet valve membrane 240 is located along the thickness direction A on the side of the liquid cooling inlet 112 away from the pump outlet 212.

[0161] It is worth mentioning that if the piezoelectric component 220 is in a high temperature state for a long time, it will age and cause performance degradation. Therefore, the liquid cooling module 10 in the embodiment of the present application can not only cool the components of the electronic device, but also optimize the performance of the pump 200 contained in the liquid cooling module 10 itself.

[0162] Please continue reading Figure 2 In one embodiment, the pump base 210 also includes a pump side wall 215 located between the pump bottom wall 213 and the piezoelectric component 220, and the pump side wall 215 is an integrated sealing structure. In this embodiment, the pump side wall 215 extends along the thickness direction A of the liquid cooling module 10. Since the pump side wall 215, the pump bottom wall 213, and the piezoelectric component 220 together enclose the pump cavity 214, the present solution sets the pump side wall 215 as an integrated sealing structure, which can effectively prevent the cooling medium from leaking from the pump side wall 215 and improve the sealing performance of the pump base 210. Exemplarily, the pump side wall 215 forms an integrated sealing structure by hot pressing. Hot pressing can be a welding method without solder paste or other third materials, such as hot pressing bonding sealing welding, hot melt welding, ultrasonic welding, and ultra-high frequency welding.

[0163] See also Figure 7 , Figure 7 The exploded view of the stacked structure of the pump provided in the first embodiment of the present application. The layers of the pump base body are sealed and welded by heat compression bonding, hot melt welding, ultrasonic welding, ultra-frequency welding and other sealing welding methods without solder paste or other third materials. In one embodiment, the pump base 210 includes a pump chamber layer 216, a first flow channel layer 217, a valve sheet layer 218 and a second flow channel layer 219 which are stacked along a thickness direction A, a cavity hole 2161 is provided in the pump chamber layer 216, a pump outlet 212 and a first guide channel 2171 corresponding to the pump inlet 211 are provided in the first flow channel layer 217, the first flow channel layer 217 is communicated with the cavity hole 2161 in the pump chamber layer 216, an openable and closable inlet valve membrane 230 and an outlet valve membrane 240 are provided in the valve sheet layer 218, a pump inlet 211 and a second guide channel 2191 corresponding to the pump outlet 212 are provided in the second flow channel layer 219, the second flow channel layer 219 is communicated with the liquid cooling module 100, and the pump chamber layer 216, the first flow channel layer 217, the valve sheet layer 218 and the second flow channel layer 219 are formed into an integrated sealing structure by hot pressing.

[0164] In this embodiment, the pump inlet 211, the inlet valve membrane 230 and the first guide channel 2171 are correspondingly arranged in the thickness direction A of the liquid cooling module 10, and the pump outlet 212, the outlet valve membrane 240 and the second guide channel 2191 are correspondingly arranged in the thickness direction A of the liquid cooling module 10. Figure 7 In the illustrated embodiment, when the inlet valve membrane 230 is open and the outlet valve membrane 240 is closed, the cooling medium enters the pump chamber 214 from the pump inlet 211 through the inlet valve membrane 230 and the first guide channel 2171 in sequence, and when the outlet valve membrane 240 is open and the inlet valve membrane 230 is closed, the cooling medium enters the liquid cooling module 100 from the pump outlet 212 through the outlet valve membrane 240 and the second guide channel 2191 in sequence. Among them, the projection area of ​​the area surrounded by the peripheral wall of the first guide channel 2171 along the thickness direction A is larger than the projection area of ​​the area surrounded by the peripheral wall of the pump inlet 211 along the thickness direction A, which is conducive to preventing the cooling medium from flowing back to the pump inlet 211 and giving full play to the guiding effect of the first guide channel 2171 on the cooling medium. The projected area of ​​the area enclosed by the peripheral wall of the second guide channel 2191 along the thickness direction A is larger than the projected area of ​​the area enclosed by the peripheral wall of the pump outlet 212 along the thickness direction A, which is beneficial to prevent the cooling medium from flowing back to the inlet and outlet of the pump 200, thereby giving full play to the guiding effect of the second guide channel 2191 on the cooling medium.

[0165] In this embodiment, the edges of the pump chamber layer 216, the first flow channel layer 217, the valve sheet layer 218 and the second flow channel layer 219 are hot pressed to form the pump side wall 215 (combined with Figure 2 and Figure 7 As shown), each layer is sealed, thereby improving the sealing effect of the pump base 210.

[0166] Please continue reading Figure 2 In one embodiment, the liquid cooling module 100 includes a first flexible membrane 110, a liquid cooling outlet 111 and a liquid cooling inlet 112 are arranged on the first flexible membrane 110, and the pump bottom wall 213 and a part of the first flexible membrane 110 around the liquid cooling outlet 111 and the liquid cooling inlet 112 are an integrated sealing structure.

[0167] In this embodiment, the fixed connection between the liquid cooling module 100 and the pump 200 is actually the fixed connection between the first flexible membrane 110 and the pump bottom wall 213. The first flexible membrane 110, which is located around the liquid cooling outlet 111 and the liquid cooling inlet 112, forms an integrated sealing structure with the pump bottom wall 213. Since the first flexible membrane 110 and the pump bottom wall 213 are made of the same or similar materials, the difficulty of hot pressing is relatively small, which is conducive to forming an integrated sealing structure.

[0168] In this embodiment, there is a discontinuous interface between the first flexible membrane 110 and the pump bottom wall 213. Figure 8 , Figure 8 This is a cross-sectional view of the liquid cooling module 10 provided in the first embodiment of the present application. In one embodiment, the first flexible membrane 110 and at least a portion of the pump bottom wall 213 are continuously fused together to form an integrated sealing structure. Fig. 9 , Fig. 9 This is a cross-sectional view of the liquid cooling module 10 provided in the first embodiment of the present application. In another embodiment, the first flexible membrane 110, except for the liquid cooling outlet 111 and the liquid cooling inlet 112, is an integrated sealing structure with the pump bottom wall 213, and there is no interface between the two. This sealing interface is a preferred sealing interface, which has stronger flexibility, sealing and impact resistance. However, it is difficult to achieve perfect processing in engineering, and it is more of a partially continuous fusion interface, with micro air gaps or non-welding areas of discontinuous contact between the interfaces.

[0169] In some embodiments, in order to assist in stabilizing the connection between the pump 200 and the liquid cooling module 100 , adhesive sealing may be used at the connection position between the pump 200 and the liquid cooling module 100 to improve the sealing performance and reliability.

[0170] Please continue reading Figure 2 In one embodiment, the liquid cooling module 100 further includes a second flexible film 120 and a first rigid substrate 130 located between the first flexible film 110 and the second flexible film 120. The first flexible film 110, the second flexible film 120 and the first rigid substrate 130 enclose an inner cavity 140 of the liquid cooling module 100. The two ends of the first rigid substrate 130 are respectively integrated with the first flexible film 110 and the second flexible film 120 to form a sealing structure. In one embodiment, if the seal between the first rigid substrate 130 and the first flexible film 110 and the second flexible film 120 leaks, the system performance will be rapidly degraded and fail quickly. The two interface materials of the sealing welding between the first rigid substrate 130 and the first flexible film 110 and the second flexible film 120 are the same or similar. The welding methods without solder paste or other third materials such as thermal compression bonding sealing welding, hot melt welding, ultrasonic welding, and ultra-frequency welding can improve the sealing and reliability between the first rigid substrate 130 and the first flexible film 110 and the second flexible film 120.

[0171] In this embodiment, the first flexible film 110 and the second flexible film 120 are flexible and have good bending performance, and are suitable for the case where the liquid cooling module 100 needs to be bent. A first rigid substrate 130 is arranged between the first flexible film 110 and the second flexible film 120, and the two ends of the first rigid substrate 130 are used to support the first flexible film 110 and the second flexible film 120, which is conducive to improving the overall strength of the liquid cooling module 100 in the thickness direction A. The cooling medium flows in the inner cavity 140 surrounded by the first flexible film 110, the second flexible film 120 and the first rigid substrate 130. In this solution, the two ends of the first rigid substrate 130 are respectively integrated with the first flexible film 110 and the second flexible film 120 to form a sealing structure, which can improve the sealing of the inner cavity 140 and prevent the cooling medium in the inner cavity 140 from leaking.

[0172] In this embodiment, the two ends of the first rigid substrate 130 are respectively formed as discontinuous interfaces with the first flexible film 110 and the second flexible film 120. In one embodiment, the two ends of the first rigid substrate 130 and at least part of the first flexible film 110 and the second flexible film 120 are continuously fused into one body to form an integrated sealing structure. In another embodiment, the two ends of the first rigid substrate 130 and the first flexible film 110 and the second flexible film 120 are all continuously fused into an integrated sealing structure, and there is no interface between the two ends of the first rigid substrate 130 and the first flexible film 110, and there is no interface between the two ends of the first rigid substrate 130 and the second flexible film 120.

[0173] In one embodiment, the first rigid substrate 130 is disposed around the edges of the first flexible film 110 and the second flexible film 120 (eg, Figure 1a This solution is conducive to improving the strength of the edge of the liquid cooling module 100 in the thickness direction A, and the integrated sealing structure can effectively prevent the cooling medium from leaking at the edge of the liquid cooling module 100.

[0174] In one embodiment, the thickness of the first flexible film 110 and the second flexible film 120 is less than the length and width of the liquid cooling module 10. Specifically, the ratio of the thickness of the first flexible film 110 and the second flexible film 120 to the length of the liquid cooling module 10 is less than or equal to 0.2, and the ratio of the thickness of the first flexible film 110 and the second flexible film 120 to the width of the liquid cooling module 10 is less than or equal to 0.2. When the liquid cooling module 10 is applied to a folding device, this solution can ensure the flexibility of the first flexible film 110 and the second flexible film 120 in the bending direction, reducing the difficulty of bending the device.

[0175] In one embodiment, the material of the first flexible film 110 and the second flexible film 120 is a material with an elongation at break higher than 10%, such as polymer PET, PP, PPS, PEN or modified film materials thereof, so as to adapt to system pressure fluctuations and bending. Preferably, the material of the first flexible film 110 and the second flexible film 120 is a material with an elongation at break higher than 50%. In one embodiment, the surface of the first flexible film 110 and the second flexible film 120 is treated with an anti-evaporation coating, such as coating a flexible inorganic oxide film on the surface of the polymer film to isolate water vapor. The specific coating method can be physical vapor deposition (PVD), chemical vapor deposition (CVD), atomic layer deposition (ALD) and other process means.

[0176] Please continue reading Figure 2 In one embodiment, the liquid cooling module 100 further includes a second rigid substrate 150, which divides the inner cavity 140 of the liquid cooling module 100 into a liquid inlet channel 141 and a liquid outlet channel 142. The liquid cooling inlet 112 is connected to the liquid inlet channel 141, and the liquid cooling outlet 111 is connected to the liquid outlet channel 142. The two ends of the second rigid substrate 150 are respectively integrated with the first flexible membrane 110 and the second flexible membrane 120 to form an integrated sealing structure. If leakage occurs in the division and sealing between the second rigid substrate 150 and the first flexible membrane 110 and the second flexible membrane 120, the performance of the liquid cooling system will be greatly reduced and gradually fail. In this embodiment, the two ends of the second rigid substrate 150 are respectively integrated with the first flexible membrane 110 and the second flexible membrane 120 to improve the sealing performance and reliability.

[0177] In this embodiment, the second rigid substrate 150 is used to separate the flow channel of the inner cavity 140 into an inlet channel 141 and an outlet channel 142, and the inlet channel 141 and the outlet channel 142 are formed by the second rigid substrate 150, the first rigid substrate 130, the first flexible membrane 110 and the second flexible membrane 120. The inlet channel 141 is connected to the liquid cooling inlet 112, and the outlet channel 142 is connected to the liquid cooling outlet 111. The inlet channel 141 and the outlet channel 142 are separated by the second rigid substrate 150, which is conducive to preventing the cooling medium in the inlet channel 141 and the outlet channel 142 from mixing and thus reducing the cooling efficiency. Both ends of the second rigid substrate 150 are integrally heat-pressed and sealed with the first flexible membrane 110 and the second flexible membrane 120 , which is beneficial to improving the isolation effect between the liquid inlet channel 141 and the liquid outlet channel 142 and can further improve the structural strength of the liquid cooling module 100 .

[0178] It can be understood that the liquid inlet channel 141 and the liquid outlet channel 142 are not two completely isolated parts. The second rigid base 150 only separates the liquid inlet channel 141 and the liquid outlet channel 142 adjacent to the pump 200. In order to allow the cooling medium to circulate in the liquid cooling module 100, the liquid inlet channel 141 and the liquid outlet channel 142 are connected in an area away from the pump 200. For example, Figure 1a In the liquid cooling module 10 shown, the liquid inlet channel 141 and the liquid outlet channel 142 are connected in a relatively narrow end region.

[0179] In this embodiment, the two ends of the second rigid substrate 150 are respectively formed as discontinuous interfaces with the first flexible film 110 and the second flexible film 120. In one embodiment, the two ends of the second rigid substrate 150 and at least part of the first flexible film 110 and the second flexible film 120 are continuously fused into one body to form an integrated sealing structure. In another embodiment, the two ends of the second rigid substrate 150 and the first flexible film 110 and the second flexible film 120 are all continuously fused into an integrated sealing structure, and there is no interface between the two ends of the second rigid substrate 150 and the first flexible film 110, and there is no interface between the two ends of the second rigid substrate 150 and the second flexible film 120.

[0180] Please refer to Figure 2 and Fig.10 , Fig.10 1 is a side view of the pump 200 and the second rigid substrate 150 provided in the first embodiment of the present application. In one embodiment, the second rigid substrate 150 includes a first sub-rigid substrate 151 located below the pump 200 and a second sub-rigid substrate 152 located outside the pump 200 (eg, Fig.10 The orthographic projection of the first sub-rigid matrix 151 on the second flexible membrane 120 does not overlap with the orthographic projection of the area enclosed by the edges of the liquid cooling inlet 112 and the liquid cooling outlet 111 on the second flexible membrane 120 (as shown in FIG. Figure 2 As shown). The lower side of the pump 200 refers to the side of the pump 200 close to the liquid cooling module 100 along the thickness direction A. In one embodiment, the orthographic projection of the first sub-rigid matrix 151 on the second flexible film 120 and the area enclosed by the edges of the pump inlet 211 and the pump outlet 212 on the second flexible film 120 do not overlap. In one embodiment, for the convenience of processing or so that the first sub-rigid matrix 151 can better divide the flow channels on both sides of the pump 200, the first sub-rigid matrix 151 can be extended to a point outside the pump 200, such as Figure 1a As shown, the first rigid sub-matrix 151 is Figure 1a The length of the center along the left-right direction is greater than the length of the pump 200 along the left-right direction.

[0181] In one embodiment, the first sub-rigid substrate 151 is made of the same material as the first rigid substrate 130 (eg Figure 1a and Figure 1b As shown). The first sub-rigid matrix 151 is located below the pump 200. When the cooling liquid pumped out by the pump 200 enters and exits the liquid cooling inlet 112 and the liquid cooling outlet 111 during operation, it will exert impact pressure on the first sub-rigid matrix 151, which will cause the system performance to drop rapidly and fail rapidly. The first sub-rigid matrix 151 is made of the same material as the first rigid matrix 130, so that the sealing effect and structural strength between the first sub-rigid matrix 151 and the first flexible membrane 110 and the second flexible membrane 120 are the same as the sealing effect and structural strength between the first rigid matrix 130 and the first flexible membrane 110 and the second flexible membrane 120, effectively improving the sealing effect and structural strength between the first sub-rigid matrix 151 and the first flexible membrane 110 and the second flexible membrane 120, and preventing the liquid near the pump 200 from impacting the first sub-rigid matrix 151 and affecting the sealing effect.

[0182] In one embodiment, the first sub-rigid substrate 151 and the first rigid substrate 130 are an integrated structure. Figure 1a As shown, the sealing and reliability between the first rigid sub-base 151 and the first rigid base 130 are improved. In one embodiment, the first rigid sub-base 151 and the second rigid sub-base 152 are an integrated structure. The sealing and reliability between the first rigid sub-base 151 and the second rigid sub-base 152 are improved.

[0183] In one embodiment, the first rigid sub-base 151 and the first rigid base 130 are simultaneously heat-pressed welded with the first flexible film 110 or the second flexible film 120 to improve the sealing effect and structural strength between the first rigid sub-base 151 and the first flexible film 110 or the second flexible film 120 .

[0184] In one embodiment, the second rigid substrate 150 is in a strip shape as a whole. This solution can reduce the processing cost, and the relatively regular shape of the second rigid substrate 150 is conducive to reducing the flow resistance of the second rigid substrate 150 to the cooling medium.

[0185] In one embodiment, an integrated sealing structure is formed between the first flexible membrane 110 and the pump bottom wall 213 which are arranged corresponding to the second rigid substrate 150 in the thickness direction A. This solution can further ensure that the cooling medium in the inlet channel 141 and the outlet channel 142 does not short-circuit or mix.

[0186] Please continue reading Figure 2In one embodiment, the liquid cooling module 100 further includes a third rigid substrate 160, which is distributed in the liquid inlet channel 141 and the liquid outlet channel 142, and the two ends of the third rigid substrate 160 are respectively integrated with the first flexible membrane 110 and the second flexible membrane 120 to form a sealed structure. If leakage occurs in the segmentation and sealing between the third rigid substrate 160 and the first flexible membrane 110 and the second flexible membrane 120, the performance of the liquid cooling system will be slightly reduced, but it will not cause the entire liquid cooling system to fail.

[0187] In this embodiment, the plurality of third rigid substrates 160 divide the liquid inlet channel 141 into a plurality of liquid inlet sub-channels connected to each other, and divide the liquid outlet channel 142 into a plurality of liquid outlet sub-channels connected to each other. The third rigid substrate 160 plays a role of guiding flow in the liquid inlet channel 141 and the liquid outlet channel 142, respectively, reducing flow resistance and avoiding eddy current loss, which is conducive to enhancing the heat exchange effect of the cooling medium. The third rigid substrate 160 can be strip-shaped or cylindrical in shape. The strip-shaped third rigid substrate 160 is conducive to guiding the flow of the cooling medium, and the cylindrical third rigid substrate 160 is conducive to enhancing the mixing of the cooling medium.

[0188] Please continue reading Figure 1a In one embodiment, since the third rigid substrate 160 plays the role of both guiding and mixing flow, the third rigid substrate 160 can be set in the area where the width of the liquid inlet channel 141 or the liquid outlet channel 142 suddenly changes, the area where the cooling medium flow direction suddenly changes, and the area adjacent to the liquid cooling inlet 112.

[0189] In this embodiment, the two ends of the third rigid substrate 160 are respectively formed as discontinuous interfaces with the first flexible film 110 and the second flexible film 120. In one embodiment, the two ends of the third rigid substrate 160 and at least part of the first flexible film 110 and the second flexible film 120 are continuously fused into one body to form an integrated sealing structure. In another embodiment, the two ends of the third rigid substrate 160 and the first flexible film 110 and the second flexible film 120 are all continuously fused into an integrated sealing structure, and there is no interface between the two ends of the third rigid substrate 160 and the first flexible film 110, and there is no interface between the two ends of the second rigid substrate 150 and the second flexible film 120.

[0190] In one embodiment, the thickness of the first rigid substrate 130, the second rigid substrate 150, and the third rigid substrate 160 is less than the width of the liquid cooling module 10. Specifically, the ratio of the thickness of the first rigid substrate 130, the second rigid substrate 150, and the third rigid substrate 160 to the width of the liquid cooling module 10 is greater than or equal to 0.1 and less than or equal to 0.2. The thickness of the first rigid substrate 130, the second rigid substrate 150, and the third rigid substrate 160 is less than the length of the liquid cooling module 10. Specifically, the ratio of the thickness of the first rigid substrate 130, the second rigid substrate 150, and the third rigid substrate 160 to the length of the liquid cooling module 10 is greater than or equal to 10. -5 , and is less than or equal to 0.2. This solution is conducive to ensuring the high strength of the liquid cooling module 10 in the thickness direction and the flexibility of the liquid cooling module 10 in the length direction and the width direction.

[0191] In one embodiment, the sum of the cross-sectional areas of the first rigid substrate 130, the second rigid substrate 150, and the third rigid substrate 160 is smaller than the area of ​​the first flexible film 110 or the second flexible film 120. The area of ​​the first flexible film 110 refers to the area of ​​the surface facing the rigid substrate, and the area of ​​the second flexible film 120 refers to the area of ​​the surface facing the rigid substrate.

[0192] In one embodiment, the width of the first rigid substrate 130 is greater than or equal to 1 mm and less than or equal to 10 mm. The width direction of the first rigid substrate 130 intersects with the thickness direction A and the extension direction of the first rigid substrate 130 .

[0193] In one embodiment, the width of the second rigid substrate 150 is greater than or equal to 1 mm and less than or equal to 10 mm. The width direction of the second rigid substrate 150 intersects with the thickness direction A and the extension direction of the second rigid substrate 150 .

[0194] In one embodiment, when the third rigid substrate 160 is in an elongated shape, the width of the third rigid substrate 160 is greater than or equal to 1 mm and less than or equal to 10 mm. The width direction of the third rigid substrate 160 intersects with the thickness direction A and the extension direction of the third rigid substrate 160 .

[0195] In one embodiment, the thickness of the first flexible film 110 is greater than or equal to 5 μm and less than or equal to 500 μm. For example, the thickness of the first flexible film 110 is 40 μm.

[0196] In one embodiment, the thickness of the second flexible film 120 is greater than or equal to 5 μm and less than or equal to 500 μm. For example, the thickness of the second flexible film 120 is 40 μm.

[0197] In one embodiment, the thickness of the first rigid substrate 130, the second rigid substrate 150 and the third rigid substrate 160 is greater than or equal to 0.1 mm and less than or equal to 1 mm. For example, the thickness of the first rigid substrate 130, the second rigid substrate 150 and the third rigid substrate 160 is 0.12 mm.

[0198] See also Fig.11 , Fig.11 This is a cross-sectional view of a liquid cooling module 100 provided in the first embodiment of the present application. In one embodiment, the thicknesses of the first rigid substrate 130, the second rigid substrate 150, and the third rigid substrate 160 are not equal. The thickness refers to the dimension in the thickness direction A. In this embodiment, the three rigid substrates are designed with unequal thicknesses. When the liquid cooling module 10 is applied to a folding device, it is beneficial to fully utilize the space in the folding device, avoid other devices in the device, and optimize the layout.

[0199] See also Fig.12 , Fig.12 The cross-sectional view of the liquid cooling module 100 provided in the first embodiment of the present application, in one embodiment, the first flexible membrane 110 or the second flexible membrane 120 may also be provided with a liquid injection port 113 and an air extraction port 114, etc., and the liquid injection port 113 and the air extraction port 114 are an integrated sealing structure with at least one of the three rigid substrates and the first flexible membrane 110 or the second flexible membrane 120. In this embodiment, the liquid injection port 113 is used to inject cooling medium into the inner cavity 140 before cooling, and the air extraction port 114 is used to extract the gas in the inner cavity 140 to avoid negative effects on the heat dissipation effect. The liquid injection port 113 and the air extraction port 114 are integrally sealed and connected with at least one of the first rigid substrate 130, the second rigid substrate 150 and the third rigid substrate 160, the first flexible membrane 110 or the second flexible membrane 120, which is conducive to avoiding leakage of cooling medium in the liquid injection port 113 and the air extraction port 114. To achieve an ultra-thin effect, the liquid injection port 113, the air extraction port 114 and the liquid cooling module 100 are in the same plane, that is, between the first flexible film 110 and the second flexible film 120. In engineering, the liquid injection port 113, the air extraction port 114 and the liquid cooling module 100 can be assisted with glue to enhance the structural positioning and strength, but it is not a sealed welding surface.

[0200] In one embodiment, the difference between the glass transition temperature of the material of the pump bottom wall 213 and the glass transition temperature of the material of the first flexible film 110 is less than or equal to 20°C; if they are the same material, the difference is zero. The glass transition temperature refers to the temperature corresponding to the transition from a glassy state to a highly elastic state. A high glass transition temperature indicates that the material has good heat resistance. In this embodiment, the difference between the glass transition temperatures of the material of the pump bottom wall 213 and the material of the first flexible film 110 is set to be small, which is conducive to sealing the pump bottom wall 213 and the first flexible film 110 into an integrated structure through hot pressing bonding, thereby improving the sealing effect of the two.

[0201] In one embodiment, the difference between the glass transition temperature of the material of the first rigid substrate 130 and the glass transition temperature of the material of the first flexible film 110 or the second flexible film 120 is less than or equal to 20° C. Setting the difference between the glass transition temperatures of the material of the first rigid substrate 130 and the material of the first flexible film 110 or the second flexible film 120 to be relatively small is conducive to sealing the first rigid substrate 130 and the first flexible film 110 or the second flexible film 120 into an integrated structure through hot pressing bonding, thereby improving the sealing effect of the two.

[0202] In one embodiment, the difference between the glass transition temperature of the material of the second rigid substrate 150 and the glass transition temperature of the material of the first flexible film 110 or the second flexible film 120 is less than or equal to 20° C. Setting the difference between the glass transition temperature of the material of the second rigid substrate 150 and the material of the first flexible film 110 or the second flexible film 120 to be relatively small is conducive to sealing the second rigid substrate 150 and the first flexible film 110 or the second flexible film 120 into an integrated structure through hot pressing bonding, thereby improving the sealing effect of the two.

[0203] In one embodiment, the difference between the glass transition temperature of the material of the third rigid substrate 160 and the glass transition temperature of the material of the first flexible film 110 or the second flexible film 120 is less than or equal to 20° C. Setting the difference between the glass transition temperature of the material of the third rigid substrate 160 and the material of the first flexible film 110 or the second flexible film 120 to be relatively small is conducive to sealing the third rigid substrate 160 and the first flexible film 110 or the second flexible film 120 into an integrated structure through hot pressing bonding, thereby improving the sealing effect of the two.

[0204] In one embodiment, the difference between the glass transition temperature of the material of the pump base 210 and the glass transition temperature of the material of the liquid cooling module 100 is less than or equal to 20° C.; if they are made of the same material, the difference is zero.

[0205] In one embodiment, the glass transition temperature of the material of the pump bottom wall 213 is greater than or equal to 69° C. and less than or equal to 243° C.

[0206] In one embodiment, the glass transition temperature of the material of the first flexible film 110 is greater than or equal to 69° C. and less than or equal to 243° C.

[0207] In one embodiment, the glass transition temperature of the material of the second flexible film 120 is greater than or equal to 69° C. and less than or equal to 243° C.

[0208] In one embodiment, the glass transition temperature of the material of the first rigid substrate 130 is greater than or equal to 69° C. and less than or equal to 243° C.

[0209] In one embodiment, the glass transition temperature of the material of the second rigid substrate 150 is greater than or equal to 69° C. and less than or equal to 243° C.

[0210] In one embodiment, the glass transition temperature of the material of the third rigid substrate 160 is greater than or equal to 69° C. and less than or equal to 243° C.

[0211] In the present embodiment, it should be noted that although the glass transition temperatures of the materials of the pump bottom wall 213, the first flexible membrane 110, the second flexible membrane 120, the first rigid substrate 130, the second rigid substrate 150 and the third rigid substrate 160 overlap in value ranges, in actual situations, it is not necessary for the glass transition temperatures of the materials of the pump bottom wall 213, the first flexible membrane 110, the second flexible membrane 120, the first rigid substrate 130, the second rigid substrate 150 and the third rigid substrate 160 to be completely equal, and it is only necessary to satisfy the condition that the difference is less than or equal to 20°C.

[0212] In one embodiment, the difference between the melting temperature of the material of the pump bottom wall 213 and the melting temperature of the material of the first flexible film 110 is less than or equal to 20° C. In this embodiment, the difference between the melting temperatures of the material of the pump bottom wall 213 and the material of the first flexible film 110 is set to be small, which is conducive to sealing the pump bottom wall 213 and the first flexible film 110 into an integrated structure through hot pressing bonding, thereby improving the sealing effect of the two.

[0213] In one embodiment, the difference between the melting temperature of the material of the first rigid substrate 130 and the melting temperature of the material of the first flexible film 110 or the second flexible film 120 is less than or equal to 20° C. Setting the difference between the melting temperatures of the material of the first rigid substrate 130 and the material of the first flexible film 110 or the second flexible film 120 to be relatively small is conducive to sealing the first rigid substrate 130 and the first flexible film 110 or the second flexible film 120 into an integrated structure through hot pressing bonding, thereby improving the sealing effect of the two.

[0214] In one embodiment, the difference between the melting temperature of the material of the second rigid substrate 150 and the melting temperature of the material of the first flexible film 110 or the second flexible film 120 is less than or equal to 20° C. Setting the difference between the melting temperatures of the material of the second rigid substrate 150 and the material of the first flexible film 110 or the second flexible film 120 to be relatively small is conducive to sealing the second rigid substrate 150 and the first flexible film 110 or the second flexible film 120 into an integrated structure through hot pressing bonding, thereby improving the sealing effect of the two.

[0215] In one embodiment, the difference between the melting temperature of the material of the third rigid substrate 160 and the melting temperature of the material of the first flexible film 110 or the second flexible film 120 is less than or equal to 20° C. Setting the difference between the melting temperatures of the material of the third rigid substrate 160 and the material of the first flexible film 110 or the second flexible film 120 to be relatively small is conducive to sealing the third rigid substrate 160 and the first flexible film 110 or the second flexible film 120 into an integrated structure through hot pressing bonding, thereby improving the sealing effect of the two.

[0216] In one embodiment, the melting temperature of the material of the pump bottom wall 213 is greater than or equal to 195° C. and less than or equal to 343° C.

[0217] In one embodiment, the melting temperature of the material of the first flexible film 110 is greater than or equal to 195° C. and less than or equal to 343° C.

[0218] In one embodiment, the melting temperature of the material of the second flexible film 120 is greater than or equal to 195° C. and less than or equal to 343° C.

[0219] In one embodiment, the melting temperature of the material of the first rigid substrate 130 is greater than or equal to 195° C. and less than or equal to 343° C.

[0220] In one embodiment, the melting temperature of the material of the second rigid substrate 150 is greater than or equal to 195° C. and less than or equal to 343° C.

[0221] In one embodiment, the melting temperature of the material of the third rigid substrate 160 is greater than or equal to 195° C. and less than or equal to 343° C.

[0222] In one embodiment, the difference between the melting temperature of the material of the pump base 210 and the melting temperature of the material of the first flexible film 110 is less than or equal to 20°C.

[0223] In this embodiment, it should be noted that although the melting temperatures of the materials of the above-mentioned pump bottom wall 213, the first flexible membrane 110, the second flexible membrane 120, the first rigid matrix 130, the second rigid matrix 150 and the third rigid matrix 160 overlap in value ranges, in actual situations, it is not necessary for the melting temperatures of the materials of the pump bottom wall 213, the first flexible membrane 110, the second flexible membrane 120, the first rigid matrix 130, the second rigid matrix 150 and the third rigid matrix 160 to be completely equal, and it is only necessary to meet the condition that the difference is less than or equal to 20°C.

[0224] In one embodiment, the pump base 210 and the pump bottom wall 213 are made of a flexible heat-resistant polymer material with a breaking elongation greater than 10%. In one embodiment, the pump base 210 and the pump bottom wall 213 are made of a flexible heat-resistant polymer material with a breaking elongation greater than 50%.

[0225] In one embodiment, the material of the pump base 210 and the pump bottom wall 213 is independently selected from at least one of polyethylene terephthalate copolymer, polyethylene naphthalate, polyethylene 2,5-furandicarboxylate, polyimide, polyetheretherketone, and biaxially stretched polypropylene.

[0226] In one embodiment, the materials of the first flexible film 110, the second flexible film 120, the first rigid substrate 130, the second rigid substrate 150, and the third rigid substrate 160 are independently selected from flexible heat-resistant polymer materials with a breaking elongation greater than 10%. In one embodiment, the materials of the first flexible film 110, the second flexible film 120, the first rigid substrate 130, the second rigid substrate 150, and the third rigid substrate 160 are independently selected from flexible heat-resistant polymer materials with a breaking elongation greater than 50%.

[0227] In one embodiment, the material of the first flexible film 110 is at least one selected from the group consisting of polyethylene terephthalate copolymer, polyethylene naphthalate, polyethylene 2,5-furandicarboxylate, polyimide, polyetheretherketone, and biaxially stretched polypropylene.

[0228] In one embodiment, the material of the first rigid substrate 130 is selected from at least one of polyethylene terephthalate copolymer, polyethylene naphthalate, polyethylene 2,5-furandicarboxylate, polyimide, polyetheretherketone, and biaxially stretched polypropylene.

[0229] In one embodiment, the material of the second flexible film 120 is at least one selected from polyethylene terephthalate copolymer, polyethylene naphthalate, polyethylene 2,5-furandicarboxylate, polyimide, polyetheretherketone, and biaxially stretched polypropylene.

[0230] In one embodiment, the material of the second rigid substrate 150 is at least one selected from polyethylene terephthalate copolymer, polyethylene naphthalate, polyethylene 2,5-furandicarboxylate, polyimide, polyetheretherketone, and biaxially stretched polypropylene.

[0231] In one embodiment, the material of the third rigid substrate 160 is selected from at least one of polyethylene terephthalate copolymer, polyethylene naphthalate, polyethylene 2,5-furandicarboxylate, polyimide, polyetheretherketone, and biaxially stretched polypropylene.

[0232] Among them, polyethylene terephthalate copolymer, polyethylene naphthalate, polyethylene 2,5-furandicarboxylate, polyimide and polyetheretherketone all contain rigid segments and have high glass transition temperatures.

[0233] In this embodiment, the material selected for the pump bottom wall 213 and the first flexible film 110 is conducive to the hot pressing of the pump bottom wall 213 and the first flexible film 110 to form an integrated sealing structure. The material selected for the first rigid substrate 130 and the first flexible film 110 or the second flexible film 120 is conducive to the hot pressing of the first rigid substrate 130 and the first flexible film 110 or the second flexible film 120 to form an integrated sealing structure. The material selected for the second rigid substrate 150 and the first flexible film 110 or the second flexible film 120 is conducive to the hot pressing of the second rigid substrate 150 and the first flexible film 110 or the second flexible film 120 to form an integrated sealing structure. The material selected for the third rigid substrate 160 and the first flexible film 110 or the second flexible film 120 is conducive to the hot pressing of the third rigid substrate 160 and the first flexible film 110 or the second flexible film 120 to form an integrated sealing structure. Hot pressing is a sealing welding method without solder paste or other third materials, such as hot pressing bonding sealing welding of polymer film materials, hot melt welding, ultrasonic welding, and ultra-frequency welding. The use of the above-mentioned materials for the first flexible film 110 and the second flexible film 120 is beneficial to improving the elongation at break, facilitating the release of stress of the electronic device when it is bent, and absorbing volume changes such as pressure fluctuations of the liquid cooling system and thermal expansion and contraction.

[0234] Exemplarily, the pump bottom wall 213 is made of the same material as the first flexible membrane 110. The first rigid base 130 is made of the same material as the first flexible membrane 110 or the second flexible membrane 120. The second rigid base 150 is made of the same material as the first flexible membrane 110 or the second flexible membrane 120. The third rigid base 160 is made of the same material as the first flexible membrane 110 or the second flexible membrane 120. Exemplarily, the material of the pump base 210 is the same as the material of the liquid cooling module 100.

[0235] Traditional liquid cooling modules, as shown in Table 1, are formed by flow channels of membrane materials such as polymer PET, PP, and PPS. Small molecules such as water will penetrate the membrane made of polymer materials, and this amount increases exponentially with evaporation and temperature.

[0236] Table 1: Changes in evaporation of polymer membrane sheets over time and temperature (working fluid is water, molecular weight 18)

[0237]

[0238] In this embodiment, the material of the first flexible film 110 and the second flexible film 120 is selected from at least one of polyethylene terephthalate copolymer, polyethylene naphthalate, polyethylene 2,5-furandicarboxylate, polyimide, polyetheretherketone, and biaxially stretched polypropylene. Since the water vapor permeability of the above materials is low, the use of the above materials for the first flexible film 110 and the second flexible film 120 is also conducive to alleviating the evaporation problem of the cooling medium in the first flexible film 110 and the second flexible film 120. If the first flexible film 110 and the second flexible film 120 use conventional PET materials, since the PET material has an extremely high polar ester group and has a strong absorption effect on water molecules, when the cooling medium flows in the inner cavity 140 of the liquid cooling module 100, it may evaporate and pass through the first flexible film 110 and the second flexible film 120, resulting in a reduction in the utilization rate of the cooling medium. In the process of the cooling medium evaporating outward, the small molecules of gas in the air will be replaced by the first flexible film 110 and the second flexible film 120 and dissolved in the cooling medium. When dissolved to saturation, air will exist in the circulation of the cooling medium in the form of bubbles. In addition to interfering with the liquid cooling cycle and affecting the heat dissipation efficiency, these bubbles may also be sucked into the pump 200, which not only affects the efficiency of the pump 200, but also makes the pump 200 produce noise when rotating, and even causes damage to the pump 200. Therefore, in this solution, the first flexible film 110 and the second flexible film 120 are set to the above materials, which is conducive to avoiding a series of hazards caused by the evaporation of the cooling medium.

[0239] In one embodiment, the evaporation level of the first flexible membrane 110 and the second flexible membrane 120 is reduced by more than one order of magnitude, so as to meet the evaporation requirements of different working fluids such as water and fluorinated liquid at different application temperatures.

[0240] It is worth mentioning that in order to realize the integrated sealing structure formed by hot pressing between the two flexible films and the three rigid substrates, the first flexible film 110, the second flexible film 120 and the first rigid substrate 130, the second rigid substrate 150, and the third rigid substrate 160 can be made of the same material. However, the flexible film and the rigid substrate have different requirements for flexibility. At this time, different flexibility can be achieved by adjusting the thickness of the flexible film and the rigid substrate.

[0241] In one embodiment, the glass transition temperature of polyethylene terephthalate copolymer is greater than or equal to 69°C and less than or equal to 77°C, and the melting temperature is greater than or equal to 250°C and less than or equal to 255°C. The glass transition temperature of polyethylene naphthalate is 122.4°C and the melting temperature is 211.6°C. The glass transition temperature of polyethylene 2,5-furandicarboxylate is 87.2°C, and the melting temperature is greater than or equal to 195°C and less than or equal to 265°C. The glass transition temperature of polyimide is 243°C and the melting temperature is 334°C. The glass transition temperature of polyetheretherketone is greater than or equal to 143°C and less than or equal to 150°C, and the melting temperature is 343°C. It should be noted that the glass transition temperature and melting temperature mentioned above are experimental values. Affected by various factors such as experimental conditions, instruments and equipment, and experimental operations, when the above-mentioned influencing factors change, the glass transition temperature and melting temperature of the above-mentioned materials may also change accordingly. As a person skilled in the art, it should be understood that such deviation is difficult to avoid. In the embodiment of the present application, as long as the difference in glass transition temperature or melting temperature between the two components that need to form an integrated sealing structure is less than or equal to 20°C, the present application does not make an absolute limitation on the specific values ​​of the glass transition temperature and melting temperature of the pump bottom wall 213, the pump base 210, the first flexible film 110, the second flexible film 120, the first rigid base 130, the second rigid base 150, and the third rigid base 160.

[0242] In one embodiment, the monomers of the polyethylene terephthalate copolymer include terephthalic acid, ethylene glycol and a hard segment molecular structure, and the mass percentage of the hard segment molecular structure in the polyethylene terephthalate copolymer is greater than or equal to 20% and less than or equal to 80%.

[0243] Among them, polyethylene terephthalate copolymer refers to a copolymer formed by copolymerization of PET (polyethylene terephthalate) monomer and another monomer block, wherein PET is polymerized from terephthalic acid and ethylene glycol. Due to the presence of -CH2-CH2- molecular chain segments in the structure of PET, the glass transition temperature of PET itself is relatively low, and glass transition is prone to occur in medium and high temperature application environments, which poses a risk of dimensional stability. This solution introduces a hard segment molecular structure into the structure of PET, which can increase the glass transition temperature of polyethylene terephthalate copolymer. When polyethylene terephthalate copolymer is used in the liquid cooling module 10, the liquid cooling module 10 can be suitable for medium and high temperature application scenarios.

[0244] In this embodiment, the hard segment molecular structure is set to the above-mentioned ratio, which can improve the structural strength of the polyethylene terephthalate copolymer. When the polyethylene terephthalate copolymer is used in the liquid cooling module 10, the impact resistance and drop resistance of the liquid cooling module 10 can be improved, and other devices inside the electronic device can be effectively protected.

[0245] In one embodiment, the hard segment molecular structure is selected from at least one of 2,5-furandicarboxylic acid, dimethyl carbonate and 2,6-naphthalene dicarboxylic acid. In this embodiment, 2,5-furandicarboxylic acid, dimethyl carbonate and 2,6-naphthalene dicarboxylic acid are monomers of polyethylene 2,5-furandicarboxylate, polycarbonate and polyethylene naphthalate, respectively. The use of the above materials as hard segment molecular structures can improve the structural strength of polyethylene terephthalate copolymers. When other hard segment molecular structures except dimethyl carbonate are used, the evaporation problem of the first flexible film 110 and the second flexible film 120 can also be alleviated, and the water permeability and air permeability can be reduced.

[0246] In the above embodiment, the molecular structures of some polymers are shown in Table 2.

[0247] Table 2 Structures of some polymer materials

[0248]

[0249]

[0250] In the above embodiment, the molecular structure G of part of the hard segment is shown in Table 3.

[0251] Table 3 Hard segment molecular structure

[0252]

[0253] See also Fig.13 , Fig.13 This is a cross-sectional view of the first flexible film 110 provided in the first embodiment of the present application. In one implementation, at least one of the first flexible film 110 and the second flexible film 120 includes two PET layers 115 and an anti-evaporation layer 116 located between the two PET layers, and the anti-evaporation layer 116 includes at least one of a polyimide layer, a polyvinylidene chloride layer, or a metal film layer.

[0254] In this embodiment, at least one of the first flexible film 110 and the second flexible film 120 adopts a multi-layer film process, that is, the first flexible film 110 and the second flexible film 120 are arranged in a "PET-X-PET" sandwich structure, wherein the X layer refers to the anti-evaporation layer 116. Polyimide, polyvinylidene chloride and metal film are materials with low water vapor permeability, and the anti-evaporation layer 116 adopts the above materials, which can reduce the evaporation of water vapor in the first flexible film 110 and the second flexible film 120. In one embodiment, a multi-layer co-extrusion technology or a multi-layer film pressing technology is used to realize a multi-layer film structure in the first flexible film 110 and the second flexible film 120.

[0255] In one embodiment, the metal film layer can be a copper film, a nickel film, an aluminum film or a metal-plastic composite film material, and the thickness is less than or equal to 10 microns. In this embodiment, when the liquid cooling module 10 is applied to a folding device, this solution is conducive to ensuring that the first flexible film 110 and the second flexible film 120 meet the requirements of 100,000 to 400,000 times of bending tests at different bending angles.

[0256] See also Fig.14 , Fig.14 This is a cross-sectional view of a liquid cooling module 100 provided in the first embodiment of the present application. In one implementation, an inorganic oxide film 117 is disposed on a surface of at least one of the first flexible film 110 and the second flexible film 120 away from the inner cavity 140 .

[0257] In this embodiment, although the surfaces of the first flexible film 110 and the second flexible film 120 away from the inner cavity 140 are not in direct contact with the cooling medium, they are interfaces that the cooling medium must pass through when evaporating to the outside. The inorganic oxide film 117 is provided to isolate water vapor and alleviate the evaporation problem of the cooling medium. Exemplarily, the coating method of the inorganic oxide film 117 can be any one of physical vapor deposition, chemical vapor deposition and atomic layer deposition.

[0258] Please refer to Figure 1a and Fig.15 , Fig.15 for Figure 1a The partial enlarged view of the liquid cooling module 10 shown in FIG. 1 shows, in one embodiment, the liquid cooling module 100 includes a liquid cooling film bending area 170 (such as Figure 1a As shown), the liquid cooling module 100 is folded by the liquid cooling film bending area 170, and at least one of the first rigid substrate 130, the second rigid substrate 150 and the third rigid substrate 160 is provided with a soft structure 131 (as shown Figure 1a and Fig.15 As shown), the flexibility enhancement structure 131 is located in the liquid cooling film bending area 170, and the flexibility enhancement structure 131 is used to improve the flexibility of the liquid cooling film bending area 170.

[0259] In this embodiment, the first rigid substrate 130, the second rigid substrate 150 and the third rigid substrate 160 can enhance the strength of the liquid cooling module 100 in the thickness direction A due to their rigidity. When the liquid cooling module 100 is applied to a folding device, the bending portion of the liquid cooling module 100 needs to have a certain flexibility. Therefore, this solution sets a flexibility enhancement structure 131 in the liquid cooling film bending area 170 of the liquid cooling module 100, which can reduce the resistance of the bending portion of the liquid cooling module 100 when bending, and meet the folding requirements of the electronic device.

[0260] In one embodiment, the flexibility enhancement structure 131 may be at least one of a groove, a through hole, a through hole, and an opening.

[0261] In one embodiment, the liquid cooling module 100 further includes a first liquid cooling film stationary area 180 and a second liquid cooling film stationary area 190 (eg, Figure 1a When the liquid-cooling film bending area 170 is bent, the first liquid-cooling film static area 180 and the second liquid-cooling film static area 190 are not deformed.

[0262] Please continue to refer to Figure 1a and Fig.15 In one embodiment, the flexibility enhancement structure 131 of the first rigid substrate 130 includes a groove 1311 located on the side wall of the first rigid substrate 130, and the groove 1311 is located in the liquid cooling film bending area 170 (combined with Figure 1a and Fig.15 shown).

[0263] In this embodiment, the first rigid substrate 130 is arranged around the edge of the liquid cooling module 10 and is a barrier between the cooling medium and the external environment. Therefore, the first rigid substrate 130 needs to have a high structural strength to ensure the sealing effect so that the cooling medium does not leak to the outside of the liquid cooling module 10. The first rigid substrate 130 located in the bending area 170 of the liquid cooling film needs to take into account both structural strength and certain flexibility. Therefore, the flexibility enhancement structure 131 arranged on the first rigid substrate 130 is preferably a groove 1311. If a through hole, through hole or opening is set on the first rigid substrate 130, there will be a risk of cooling medium leakage.

[0264] Please refer to Fig.15 and Fig.16 , Fig.16 A cross-sectional view of a liquid-cooled module 100 is provided for the first embodiment of the present application. In one embodiment, the flexibility structure 131 of the second rigid substrate 150 includes a through hole 1313 penetrating the second rigid substrate 150 along a first direction A, and the through hole 1313 is located in the bending area 170 of the liquid-cooled film. The first direction A is the arrangement direction of the first flexible film 110 and the second flexible film 120.

[0265] In this embodiment, the through hole 1313 is provided in the second rigid substrate 150, which can improve the flexibility of the bent portion of the second rigid substrate 150. Since the two sides of the second rigid substrate 150 are the liquid inlet channel 141 and the liquid outlet channel 142, the opening 1314 on the second rigid substrate 150 cannot connect the cooling medium on both sides to avoid affecting the cooling effect due to mixed flow. Among them, the first direction A is also the thickness direction of the liquid cooling module 100.

[0266] Please refer to Fig.15 and Fig.17 , Fig.17 This is a cross-sectional view of a liquid-cooled module 100 provided in the first embodiment of the present application. In one embodiment, the liquid-cooled module 100 is provided with a through hole 1312 that penetrates the second rigid substrate 150, the first flexible membrane 110 and the second flexible membrane 120 along a first direction, and the through hole 1312 is located in the bending area 170 of the liquid-cooled membrane.

[0267] In this embodiment, a through hole 1312 is provided in the second rigid substrate 150, which can improve the flexibility of the bending portion of the second rigid substrate 150 and reduce the rebound force and friction force of the bending area 170 of the liquid cooling film when bending. Among them, the first direction is the thickness direction A of the liquid cooling module 10. The through hole 1312 penetrates the second rigid substrate 150 along the first direction without causing short circuit and mixed flow of the cooling medium in the liquid inlet channel 141 and the liquid outlet channel 142. The third rigid substrate 160 can be opened with a hole 1314 to reduce the rebound force of the bending area 170 of the liquid cooling film and the friction force with the screen and the middle frame when bending, and will not cause a short circuit of the cooling medium flow.

[0268] In one embodiment, the flexibility structure 131 of the second rigid substrate 150 includes a through hole 1313 and a through hole 1312, or the flexibility structure 131 of the second rigid substrate 150 includes any one of the through hole 1313 and the through hole 1312. In this solution, the through hole 1313 and the through hole 1312 can be flexibly arranged in the second rigid substrate 150 according to actual conditions, thereby improving the practicality of the second rigid substrate 150 in different application environments.

[0269] In one implementation, the flexibility enhancement structure 131 on the second rigid substrate 150 may also be a groove 1311 .

[0270] Please continue reading Fig.15 In one embodiment, the flexibility enhancement structure 131 of the third rigid substrate 160 includes an opening 1314 located in the third rigid substrate 160 , and the opening 1314 connects flow channels on both sides of the third rigid substrate 160 .

[0271] In this embodiment, since the deformation of the bending area 170 of the liquid cooling film is relatively large when it is bent, this solution is set to set an opening 1314 in the third rigid substrate 160, which is equivalent to the third rigid substrate 160 being partially disconnected at the position of the opening 1314, inducing bending deformation at the designed position, and effectively reducing the stress generated during bending. Part of the third rigid substrate 160 is distributed in the liquid inlet channel 141, and part of the third rigid substrate 160 is distributed in the liquid outlet channel 142, that is, the channels on both sides of the third rigid substrate 160 belong to the same liquid inlet channel 141 or the same liquid outlet channel 142, so the opening 1314 connects the two sides of the third rigid substrate 160 without affecting the heat dissipation efficiency, and can increase the mixing effect of the cooling medium in the same flow direction in the liquid inlet channel 141 or the liquid outlet channel 142, thereby improving the cooling effect.

[0272] In one embodiment, the flexibility enhancement structure 131 may extend along the flow direction of the cooling medium. In another embodiment, the flexibility enhancement structure 131 may extend along the folding direction of the folding device. Setting the size of the flexibility enhancement structure 131 in its extension direction to be larger can effectively improve the flexibility of the liquid cooling film bending area 170, reduce the rebound force of the liquid cooling film bending area 170 and the friction force with the screen and the middle frame when bending, thereby improving the user experience of the folding device.

[0273] See also Fig.18 , Fig.18 The cross-sectional view of the liquid-cooled module 100 provided in the first embodiment of the present application, in one embodiment, the surface of the first flexible film 110 and the second flexible film 120 away from the inner cavity 140 is coated with a lubricating material layer 118, and the lubricating material layer 118 is located in the bending area of ​​the liquid-cooled film. In this embodiment, in order to improve the flexibility of the bending area of ​​the liquid-cooled film, in addition to providing a flexibility enhancement structure 131 on the first rigid substrate 130, the second rigid substrate 150 and the third rigid substrate 160, a lubricating material layer 118 can also be provided on the outer surface of the first flexible film 110 and the second flexible film 120 to reduce the friction force of the bending area of ​​the liquid-cooled film when bending, so that the bending process can be carried out more smoothly. Exemplarily, the lubricating material layer 118 includes but is not limited to solid, liquid or paste lubricating materials such as Teflon film, graphite film, graphene film or grease. Among them, when the lubricating material layer 118 adopts graphite film or graphene film, the lubricating material layer 118 can be arranged only in the bending area of ​​the liquid-cooled film, or it can be arranged simultaneously in at least one of the first liquid-cooled film static area and the second liquid-cooled film static area and the liquid-cooled film bending area. At this time, in addition to lubricating and reducing friction in the static area of ​​the liquid-cooled film, the lubricating material layer 118 can also enhance the heat dissipation effect and reduce the overall temperature of the cooling medium, thereby reducing the startup time and frequency of the pump because graphite and graphene themselves have a high thermal conductivity.

[0274] See also Fig.19 , Fig.19 This is a cross-sectional view of a liquid-cooled module 100 provided in the first embodiment of the present application. In one embodiment, the liquid-cooled module 100 includes a first flexible film 110, a second flexible film 120, and a first rigid substrate 130 located between the first flexible film 110 and the second flexible film 120. The first flexible film 110, the second flexible film 120, and the first rigid substrate 130 enclose an inner cavity 140 of the liquid-cooled module 100. The difference between the glass transition temperature of the first rigid substrate 130 and the glass transition temperature of the material of the first flexible film 110 is less than or equal to 20°C.

[0275] In this embodiment, the first flexible film 110 and the second flexible film 120 can reduce the difficulty of bending the electronic device. The first rigid substrate 130 is used to enhance the structural strength of the liquid cooling module 100 in the thickness direction A. The first flexible film 110, the second flexible film 120 and the first rigid substrate 130 enclose an inner cavity 140, and the cooling medium flows in the inner cavity 140. The two ends of the first rigid substrate 130 and the first flexible film 110 and the second flexible film 120 are an integrated sealing structure, which is conducive to improving the sealing performance of the first rigid substrate 130 and avoiding leakage of the cooling medium.

[0276] In this embodiment, the difference in glass transition temperature between the material of the first rigid substrate 130 and the material of the first flexible film 110 is set to be small, which is conducive to sealing the first rigid substrate 130 and the first flexible film 110 into an integrated structure through hot pressing bonding, thereby improving the sealing effect of the two.

[0277] In one embodiment, the difference between the melting temperature of the material of the first rigid substrate 130 and the melting temperature of the material of the first flexible film 110 is less than or equal to 20° C. In this embodiment, the difference between the melting temperatures of the material of the first rigid substrate 130 and the material of the first flexible film 110 is set to be small, which is conducive to the first rigid substrate 130 and the first flexible film 110 being sealed into an integrated structure through hot pressing bonding, thereby improving the sealing effect of the two.

[0278] It should be noted that the achievable manner, size, positional relationship, and structural description of the first flexible film 110, the second flexible film 120, the first rigid substrate 130, the second rigid substrate 150, and the third rigid substrate 160 in the foregoing are applicable to the achievable manner, size, positional relationship, and structural description of the first flexible film 110, the second flexible film 120, the first rigid substrate 130, the second rigid substrate 150, and the third rigid substrate 160 in this embodiment, and will not be repeated here.

[0279] Please continue reading Fig.19In one embodiment, the liquid-cooling module 100 includes a first flexible film 110, a second flexible film 120 and a first rigid substrate 130 located between the first flexible film 110 and the second flexible film 120. The first flexible film 110, the second flexible film 120 and the first rigid substrate 130 enclose an inner cavity 140 of the liquid-cooling module 100. The materials of the first flexible film 110, the second flexible film 120 and the first rigid substrate 130 are selected from a flexible temperature-resistant polymer material with a breaking elongation greater than 10%. The materials of the first flexible film 110, the second flexible film 120 and the first rigid substrate 130 are independently selected from at least one of polyethylene terephthalate copolymer, polyethylene naphthalate, polyethylene 2,5-furandicarboxylate, polyimide, polyetheretherketone, and biaxially stretched polypropylene.

[0280] In this embodiment, the first flexible film 110 and the second flexible film 120 can reduce the difficulty of bending the electronic device. The first rigid substrate 130 is used to enhance the structural strength of the liquid cooling module 100 in the thickness direction A. The first flexible film 110, the second flexible film 120 and the first rigid substrate 130 enclose an inner cavity 140, and the cooling medium flows in the inner cavity 140. The two ends of the first rigid substrate 130 and the first flexible film 110 and the second flexible film 120 are an integrated sealing structure, which is conducive to improving the sealing performance of the first rigid substrate 130 and avoiding leakage of the cooling medium.

[0281] In this embodiment, the materials selected for the first rigid substrate 130 and the first flexible film 110 or the second flexible film 120 are conducive to hot pressing the first rigid substrate 130 and the first flexible film 110 or the second flexible film 120 to form an integrated sealing structure. The first rigid substrate 130 and the first flexible film 110 or the second flexible film 120 can be made of different materials as long as the first rigid substrate 130 and the first flexible film 110 or the second flexible film 120 can form an integrated sealing structure.

[0282] It should be noted that the achievable manner, size, positional relationship, and structural description of the first flexible film 110, the second flexible film 120, the first rigid substrate 130, the second rigid substrate 150, and the third rigid substrate 160 in the foregoing are applicable to the achievable manner, size, positional relationship, and structural description of the first flexible film 110, the second flexible film 120, the first rigid substrate 130, the second rigid substrate 150, and the third rigid substrate 160 in this embodiment, and will not be repeated here.

[0283] Please continue reading Figure 1aIn one embodiment, the liquid cooling module 100 includes a first flexible film 110, a second flexible film 120, and a rigid substrate 101 located between the first flexible film 110 and the second flexible film 120. The liquid cooling module 100 includes a liquid cooling film bending area 170, and the liquid cooling module 100 is folded through the liquid cooling film bending area 170. The rigid substrate 101 is provided with a flexibility enhancement structure 131, and the flexibility enhancement structure 131 is located in the liquid cooling film bending area 170. The flexibility enhancement structure 131 is used to improve the flexibility of the liquid cooling film bending area 170 and reduce the rebound force of the liquid cooling film bending area 170 and the friction force with the screen and the middle frame when bending.

[0284] In this embodiment, the two ends of the rigid substrate 101 are used to support the first flexible film 110 and the second flexible film 120. The rigid substrate 101 is provided in the liquid cooling module 100 to improve the structural strength of the liquid cooling module 100 in the thickness direction A. When the electronic device is bent, the liquid cooling film bending area 170 in the liquid cooling module 100 produces a large deformation, so a flexible structure 131 needs to be provided on the rigid substrate 101 located in the liquid cooling film bending area 170 to enhance the flexibility of the liquid cooling film bending area 170. In one embodiment, the flexible structure 131 may be at least one of a groove 1311, a through hole 1312, a through hole 1313 and an opening 1314. In one embodiment, the rigid substrate 101 may include a first rigid substrate 130, a second rigid substrate 150 and a third rigid substrate 160.

[0285] It should be noted that the achievable methods, sizes, positional relationships, and structural descriptions of the first flexible film 110, the second flexible film 120, the first rigid substrate 130, the second rigid substrate 150, the third rigid substrate 160, and the flexibility enhancement structure 131 in the foregoing text are applicable to the achievable methods, sizes, positional relationships, and structural descriptions of the first flexible film 110, the second flexible film 120, the first rigid substrate 130, the second rigid substrate 150, the third rigid substrate 160, and the flexibility enhancement structure 131 in this embodiment, and are not repeated here.

[0286] The liquid cooling module 10 provided in the embodiment of the present application can be applied to electronic devices.

[0287] See also Fig. 20 , Fig. 20 This is a schematic diagram of the structure of an electronic device 1 provided in the first embodiment of the present application. In one embodiment, the electronic device 1 includes a housing 20 , an electronic functional component 30 located in the housing 20 , and a liquid cooling module 10 , and the liquid cooling module 10 is located outside the housing 20 .

[0288] In this embodiment, illustratively, the electronic device 1 can be an electronic product such as a mobile phone, a tablet computer, a laptop computer, and a wearable device. The electronic functional components 30 in the electronic device 1 include but are not limited to a processor, an internal memory, a charging management module, a power management module, a battery, an antenna, a communication module, a camera, an audio module, a speaker, a receiver, a microphone, a sensor module, a motor, and an indicator. Among them, the electronic device 1 may have more or fewer electronic functional components 30 than described above. Various electronic functional components 30 can be implemented in hardware, software, or a combination of hardware and software including one or more signal processing and / or application-specific integrated circuits. The electronic functional component 30 releases heat when it is in working state. When the temperature inside the electronic device 1 is too high, it will affect the working efficiency of the electronic functional component 30 and the service life of the electronic device 1, so it is necessary to set a liquid cooling module 10 to control the temperature rise of the electronic functional component 30.

[0289] In one embodiment, the liquid cooling module 10 is located between the housing 20 and the electronic functional component 30 .

[0290] exist Fig. 20 In the first embodiment shown, the electronic device 1 is a foldable device having a flattened state and a folded state. The electronic device 1 includes a first non-folding portion 11, a folding portion 12, and a second non-folding portion 13, and the second non-folding portion 13 can be folded toward the first non-folding portion 11 through the folding portion 12. Among them, the liquid cooling module 10 can be divided into a first liquid cooling film static area 180, a liquid cooling film bending area 170, and a second liquid cooling film static area 190 in sequence along the length direction B. When the electronic device 1 is in the folded state, the liquid cooling module 100 is folded through the liquid cooling film bending area 170, the liquid cooling film bending area 170 is bent, and the first liquid cooling film static area 180 and the second liquid cooling film static area 190 are not deformed. If the folding machine has three or more N folding screens, there can be a maximum of three or N liquid cooling modules, 2 or N-1 bending areas; at least 2 liquid cooling films, 1 bending area, where N is an integer greater than 2. If it is a straight-plate machine, there may be no bending area and one or more liquid cooling membranes. According to the performance requirements of the liquid cooling system, one or more liquid pumps can be set up, which can be connected in parallel, series or mixed, and can be set up adjacently or not, such as near the motherboards of different screens. The pump may have pressure fluctuations, 2-50um slight vibrations and certain noise during operation. Flexible liquid cooling modules help absorb pressure fluctuations, volume changes and less vibration and noise.

[0291] The first rigid substrate 130 surrounds the edges of the first liquid-cooled film static area 180, the liquid-cooled film bending area 170 and the second liquid-cooled film static area 190 in a closed arrangement. The pump 200 is located in the second liquid-cooled film static area 190 and is arranged close to the first rigid substrate 130 along the width direction C, and the third rigid substrate 160 is provided on both sides of the pump 200 along the length direction B, wherein the third rigid substrates 160 on both sides of the pump 200 along the length direction B are columnar and strip-shaped, respectively. In this embodiment, the pump 200 and the adjacent first flexible film 110, the second flexible film 120 and other structural parts in the electronic device 1 are usually spaced or additionally provided with damping materials, wherein the damping material can be bonded to the first flexible film 110, the second flexible film 120 or the structural part. Exemplarily, the structural part can be at least one of a display screen, a housing 20, a battery, and a camera.

[0292] A second rigid substrate 150 is provided on one side of the pump 200 away from the first rigid substrate 130 along the width direction C. The second rigid substrate 150 divides the inner cavity 140 of the second liquid-cooled film static zone 190, the liquid-cooled film bending zone 170 and part of the first liquid-cooled film static zone 180 into a liquid inlet channel 141 and a liquid outlet channel 142. Specifically, in the second liquid-cooled film static zone 190, part of the second rigid substrate 150 extends along the width direction C, and part of the second rigid substrate 150 extends along the length direction B, wherein the second rigid substrate 150 extending along the length direction B divides the inner cavity 140 located on both sides along the width direction C into a liquid inlet channel 141 and a liquid outlet channel 142, and the second rigid substrate 150 extending along the width direction C is used to guide the flow of the cooling medium flowing out of the pump 200 together with the third rigid substrate 160. In the liquid inlet channel 141 of the second liquid-cooled film static zone 190, the third rigid substrate 160 may be in a strip shape or a column shape, wherein the strip-shaped third rigid substrate 160 extends along the width direction C, and a column-shaped third rigid substrate 160 is provided on both sides of the strip-shaped third rigid substrate 160 along the width direction C. In the liquid outlet channel 142 of the second liquid-cooled film static zone 190, the third rigid substrate 160 is in a strip shape and extends along the length direction B. The area enclosed by the first rigid substrate 130 of the second liquid-cooled film static zone 190 is substantially rectangular or square.

[0293] In the liquid-cooling film bending area 170, the second rigid substrate 150 extends along the length direction B, and the second rigid substrate 150 divides the inner cavity 140 located on both sides of the second rigid substrate 150 along the width direction C into a liquid inlet channel 141 and a liquid outlet channel 142, wherein the third rigid substrate 160 in the liquid inlet channel 141 and the liquid outlet channel 142 are both strip-shaped and extend along the length direction B. The area enclosed by the first rigid substrate 130 of the liquid-cooling film bending area 170 is basically strip-shaped. In this embodiment, the liquid-cooling module 10 in the liquid-cooling film bending area 170 adopts a cross-axis setting, that is, the liquid-cooling module 10 spans the main axis of the liquid-cooling film bending area 170.

[0294] In the first liquid-cooling film static zone 180, part of the second rigid substrate 150 is in an "inverted C-shape", and part of the second rigid substrate 150 is in a strip shape and extends along the width direction C. The second rigid substrate 150 in an "inverted C-shape" divides the inner cavity 140 into a liquid inlet channel 141 and a liquid outlet channel 142, and the third rigid substrates 160 on both sides of the second rigid substrate 150 in an "inverted C-shape" are also in an "inverted C-shape". A columnar third rigid substrate 160 is provided at one side of the end of the strip-shaped second rigid substrate 150 along the width direction C, and the liquid inlet channel 141 and the liquid outlet channel 142 are connected in the third rigid substrate 160 to form a cooling cycle.

[0295] In one embodiment, the thicknesses of the first rigid substrate 130, the second rigid substrate 150, and the third rigid substrate 160 are not equal, and the thickness of any one of the first rigid substrate 130, the second rigid substrate 150, and the third rigid substrate 160 may be 0.1 mm to 1 mm. This solution is conducive to meeting the architectural space requirements of the liquid cooling module 10 in different application environments. Preferably, the thickness of any one of the first rigid substrate 130, the second rigid substrate 150, and the third rigid substrate 160 may be 0.15 mm to 0.3 mm.

[0296] In one embodiment, the density of the first flexible film 110 and the second flexible film 120 is less than or equal to 2 g / ml. This solution is conducive to reducing the overall weight of the liquid cooling module 10, while allowing the first flexible film 110 and the second flexible film 120 to be more flexibly adapted to different architectural environments.

[0297] See also Fig.21 , Fig.21The schematic diagram of the structure of the electronic device 1 provided for the second embodiment of the present application is different from the first embodiment in that, in the second embodiment, the liquid cooling module 10 may present a shape different from that of the first embodiment. In one embodiment, in the second liquid cooling film static zone 190, the first rigid substrate 130 is arranged around the edge of the liquid cooling module 10, and the second rigid substrate 150 is in the shape of two "cross" shapes connected end to end, and one of the "cross"-shaped second rigid substrates 150 is arranged in a curved shape at both ends along the width direction C, so that the inner cavity 140 finally presents a shape of multiple "C" shapes connected end to end with different openings. The pump 200 is located at one end of the second liquid cooling film static zone 190 along the width direction C, and the third rigid substrate 160 in the second liquid cooling film static zone 190 is columnar, and one end of the second rigid substrate 150 with curved ends is arranged adjacent to the pump 200, and the inner cavity 140 is divided into a liquid inlet channel 141 and a liquid outlet channel 142. In the liquid-cooling film bending area 170, the liquid-cooling module 10 is in an elongated strip shape as a whole, wherein the second rigid substrate 150 is arranged in a strip shape and extends along the length direction B, and the third rigid substrates 160 located on both sides of the second rigid substrate 150 along the width direction C are arranged in a strip shape and extend along the length direction B. In the first liquid-cooling film static area 180, the liquid-cooling module 10 is in an elongated strip shape as a whole, wherein the second rigid substrate 150 is arranged in a strip shape and extends along the length direction B, and the third rigid substrates 160 located on both sides of the second rigid substrate 150 along the width direction C are arranged in a strip shape and extend along the length direction B, and the liquid inlet channel 141 and the liquid outlet channel 142 are connected in the first liquid-cooling film static area 180 to form a cooling cycle.

[0298] See also Fig. 22 , Fig. 22This is a structural schematic diagram of an electronic device 1 provided in the second embodiment of the present application. In another embodiment, in the second liquid-cooling film static area 190, the first rigid substrate 130 is arranged around the edge of the liquid-cooling module 10, and the pump 200 is located in the second liquid-cooling film static area 190 and is arranged close to the first rigid substrate 130 along the length direction B and the width direction C. The second rigid substrate 150 first extends along the length direction B, then extends along the width direction C, and then extends along the length direction B to the liquid-cooling film bending area 170, wherein the second rigid substrate 150 is away from the liquid-cooling film bending area 170 and one end extending along the length direction B is arranged close to the pump 200, dividing the inner cavity 140 into a liquid inlet channel 141 and a liquid outlet channel 142, and the third rigid substrate 160 is not arranged in the liquid inlet channel 141. In the liquid outlet channel 142, the third rigid substrate 160 extends along the length direction B and is arranged at staggered intervals, so that the liquid outlet channel 142 finally presents a "C"-shaped shape with multiple openings facing different directions and connected end to end. In the liquid-cooled film bending area 170, the second rigid substrate 150 is arranged in a strip shape and extends along the length direction B. In the first liquid-cooled film static area 180, the liquid inlet channel 141 and the liquid outlet channel 142 are connected to form a cooling cycle, wherein the third rigid substrate 160 in the first liquid-cooled film static area 180 and the third rigid substrate 160 in the second liquid-cooled film static area 190 are similar in shape and distribution characteristics, which will not be repeated here.

[0299] It should be noted that the feasible manner, size, positional relationship, and structural description of the pump 200, the first flexible membrane 110, the second flexible membrane 120, the first rigid substrate 130, the second rigid substrate 150, and the third rigid substrate 160 in the first embodiment are applicable to the feasible manner, size, positional relationship, and structural description of the pump 200, the first flexible membrane 110, the second flexible membrane 120, the first rigid substrate 130, the second rigid substrate 150, and the third rigid substrate 160 in the second embodiment, and will not be repeated here.

[0300] In the existing VC / HP design scheme of mobile phones, the VC cover plate or heat pipe material is copper alloy or stainless steel, with a density of 8.9g / ml and 7.8g / mL, which cannot pass the 100,000-200,000 bending test (R~1.5mm), and cannot achieve through-axis or cross-axis heat dissipation. When using cross-axis / through-axis graphite materials for heat dissipation, the equivalent thermal conductivity is ≤2000W / m·K. Using the flexible liquid cooling membrane group scheme of the embodiment of the present application, the equivalent thermal conductivity can also reach 5000W / m·K, and the thickness can be locally designed, and the thickness of 0.15mm can be achieved locally to meet the requirements of chip and architecture space. The liquid cooling membrane material is modified PET, etc., with a density of ≤2g / mL, which can achieve a more flexible architecture design, and the heat dissipation capacity is increased by more than 50% compared to graphite. The liquid cooling membrane group provided in the embodiment of the present application has a heat dissipation capacity that is more than 50% higher than that of cross-axis / through-axis graphite.

[0301] See also Fig.23 and Fig.24 , Fig.23 This is a schematic diagram of the structure of an electronic device 1 provided in the third embodiment of the present application. Fig.24 The schematic diagram of the partial structure of the liquid cooling module 10 provided for the third embodiment of the present application is different from the first embodiment in that, in the third embodiment, the liquid cooling module 10 in the liquid cooling film bending area 170 is arranged with a through-axis. In the present embodiment, the liquid cooling module 10 includes a first surface 300 and a second surface 400 arranged opposite to each other along the thickness direction A, and the liquid cooling module 10 located in the liquid cooling film bending area 170 is provided with two spaced-apart curved portions 310, and the area of ​​the liquid cooling module 10 other than the curved portions 310 is a base 320, and the first surface 300 and the second surface 400 of the two curved portions 310 are bent toward the second surface 400 of the base 320 along the thickness direction A away from the first surface 300, and the two curved portions 310 and the base 320 located between the two curved portions 310 are arranged in a corrugated shape, and the area enclosed by the two curved portions 310 and the base 320 between the two curved portions 310 is used for the through-axis. During the folding and unfolding of the electronic device 1, this solution can reduce the stress generated by the deformation of the liquid cooling film bending area 170, thereby improving the user experience. In actual product design, there may be multiple bending parts 310 and base parts 320, and the design may be asymmetrical.

[0302] See also Fig.25 , Fig.25 The schematic diagram of the structure of the liquid cooling module 10 and the flexible circuit board 40 provided in the third embodiment of the present application, in one embodiment, the electronic device also includes a flexible circuit board 40, and the flexible circuit board 40 is used to be electrically connected to the electronic functional components, wherein the flexible circuit board 40 and the liquid cooling module 10 are jointly arranged in a through-axis configuration. In this embodiment, the liquid cooling module 10 located in the bending area 170 of the liquid cooling film is arranged in a close fit, and the flexible circuit board 40 and the liquid cooling module 10 are both corrugated and share the through-axis space, which is conducive to reducing the friction, collision and abnormal noise between the liquid cooling module 10 and the flexible circuit board 40. In one embodiment, the flexible circuit board 40 can be kept in a corrugated shape by a plastic deformation method.

[0303] In one embodiment, an air gap is partially or completely provided between the flexible circuit board 40 and the liquid cooling module 10. The provision of the air gap in this solution can effectively avoid the problem of bending rebound force.

[0304] It should be noted that the feasible manner, size, positional relationship, and structural description of the pump 200, the first flexible membrane 110, the second flexible membrane 120, the first rigid substrate 130, the second rigid substrate 150, and the third rigid substrate 160 in the first embodiment are applicable to the feasible manner, size, positional relationship, and structural description of the pump 200, the first flexible membrane 110, the second flexible membrane 120, the first rigid substrate 130, the second rigid substrate 150, and the third rigid substrate 160 in the third embodiment, and will not be repeated here.

[0305] See also Fig.26 and Fig. 27 , Fig.26 This is a schematic diagram of the structure of the liquid cooling module 10 provided in the fourth embodiment of the present application. Fig. 27 A schematic diagram of the structure of an electronic device provided in an embodiment of the present application. Different from the first embodiment, in the fourth embodiment, the liquid cooling module 10 is an external accessory relative to the electronic device 1. In this embodiment, the liquid cooling module 10 includes a first liquid cooling film static area 180, a liquid cooling film bending area 170 and a second liquid cooling film static area 190, wherein the liquid cooling film bending area 170 includes two first bending portions 171 and a second bending portion 172, the second bending portion 172 is located between the two first bending portions 171, and the bending degree of the second bending portion 172 is greater than the first bending portion 171. When the electronic device is folded, the deformed part of the electronic device moves to the accommodation space formed by the surface of the second bending portion 172, and the first bending portion 171 follows the deformation of the electronic device. This solution decouples the liquid cooling module 10 from sensitive devices such as the display screen and battery of the electronic device by setting the liquid cooling module 10 as an external accessory, so that the design of the liquid cooling module 10 is flexible and the replacement is more convenient.

[0306] It should be noted that the feasible manner, size, positional relationship, and structural description of the pump 200, the first flexible membrane 110, the second flexible membrane 120, the first rigid substrate 130, the second rigid substrate 150, and the third rigid substrate 160 in the first embodiment are applicable to the feasible manner, size, positional relationship, and structural description of the pump 200, the first flexible membrane 110, the second flexible membrane 120, the first rigid substrate 130, the second rigid substrate 150, and the third rigid substrate 160 in the fourth embodiment, and will not be repeated here.

[0307] See also Fig.28 , Fig.28The structural diagram of the electronic device 1 provided for the fifth embodiment of the present application is different from the first embodiment in that, in the second embodiment, the electronic device 1 is a non-foldable device, and the electronic device 1 has no folded state. In this embodiment, the liquid cooling module 100 includes a first flexible film, a second flexible film, a first rigid substrate 130 and a second rigid substrate 150, and the first rigid substrate 130 is arranged in a closed manner around the edge of the liquid cooling module 10. The pump is arranged near the first rigid substrate 130 along the length direction B. The second rigid substrate 150 is provided on the side of the pump 200 away from the first rigid substrate 130 along the length direction B, and the second rigid substrate 150 extends along the length direction B. The inner cavity 140 located on both sides of the second rigid substrate 150 along the width direction C is divided into a liquid inlet channel 141 and a liquid outlet channel 142. The liquid inlet channel 141 and the liquid outlet channel 142 are connected on the side of the second rigid substrate 150 away from the pump 200 along the length direction B to form a cooling cycle. Fig.28 The flow direction of the liquid working medium is shown in the figure. The two pumps are designed in parallel to form a circulating flow.

[0308] In one embodiment, the thickness of the first rigid substrate 130 and the second rigid substrate 150 are not equal, and the thickness of any one of the first rigid substrate 130 and the second rigid substrate 150 may be 0.1 mm to 1 mm. This solution is conducive to meeting the architectural space requirements of the liquid cooling module 10 in different application environments. Preferably, the thickness of any one of the first rigid substrate 130 and the second rigid substrate 150 may be 0.15 mm to 0.3 mm.

[0309] In one embodiment, the density of the first flexible film 110 and the second flexible film 120 is less than or equal to 2 g / ml. This solution is conducive to reducing the overall weight of the liquid cooling module 10, while allowing the first flexible film 110 and the second flexible film 120 to be more flexibly adapted to different architectural environments.

[0310] It should be noted that the feasible manner, positional relationship and structural description of the pump 200, the first flexible membrane 110, the second flexible membrane 120, the first rigid substrate 130 and the second rigid substrate 150 in the first embodiment are applicable to the feasible manner, positional relationship and structural description of the pump 200, the first flexible membrane 110, the second flexible membrane 120, the first rigid substrate 130 and the second rigid substrate 150 in the fifth embodiment, and will not be repeated here.

[0311] Most existing straight-screen machines use the VC / HP design scheme. VC / HP refers to a variable electrical conductivity heat pipe with an equivalent thermal conductivity of 5000W / m·K, equal thickness design, and a thickness ≥0.25mm. The VC cover or heat pipe is made of copper alloy or stainless steel with a density of 8.9g / ml or 7.8g / mL. In the embodiment of the present application, a flexible liquid cooling film solution is adopted, and the equivalent thermal conductivity can also reach 5000W / m·K. It can be locally designed with no thickness, and the thickness of 0.15mm can be achieved locally to meet the requirements of chip and architecture space. The material of the liquid cooling module is modified PET, etc., with a density of ≤2g / mL, which can achieve a more flexible architecture design, lighter and higher heat dissipation capacity. In other words, under the same single-body heat dissipation capacity as VC, it can be designed with unequal thickness, and the weight reduction is >50%.

[0312] See also Fig.29 , Fig.29 A schematic diagram of a liquid cooling module provided in one embodiment of the present application. In one embodiment, the cooling medium in the liquid cooling module 100 can be a single-phase cooling medium, or two or more colors of incompatible cooling medium, so that the flow of the cooling medium is more visualized and the user experience is improved.

[0313] The liquid cooling module, liquid cooling module and electronic device provided in the embodiments of the present application are introduced in detail above. Specific examples are used in this article to illustrate the principles and embodiments of the present application. The description of the above embodiments is only used to help understand the method of the present application and its core idea; at the same time, for general technical personnel in this field, according to the idea of ​​the present application, there will be changes in the specific embodiments and application scope. In summary, the content of this specification should not be understood as a limitation on the present application.

Claims

1. A liquid cooling module (10), characterized in that: The liquid cooling module (10) comprises: A pump (200), the pump (200) comprising a pump base (210) and a piezoelectric component (220) fixed to the pump base (210), the pump base (210) being provided with a pump liquid inlet (211) and a pump liquid outlet (212); A liquid cooling module (100), the liquid cooling module (100) comprising a liquid cooling outlet (111) and a liquid cooling inlet (112), the liquid cooling outlet (111) being used to communicate with the pump inlet (211), the liquid cooling inlet (112) being used to communicate with the pump outlet (212), the portion of the liquid cooling module (100) around the liquid cooling outlet (111) and the portion of the pump base (210) around the pump inlet (211) being an integrated sealing structure, and the portion of the liquid cooling module (100) around the liquid cooling inlet (112) and the portion of the pump base (210) around the pump outlet (212) being an integrated sealing structure.

2. The liquid cooling module (10) according to claim 1, characterized in that: At least a portion of the liquid cooling module (100) on the peripheral side of the liquid cooling outlet (111) and at least a portion of the pump base (210) on the peripheral side of the pump inlet (211) are continuously fused together along the circumferential direction (D) of the liquid cooling outlet (111) to form an integrated sealing structure.

3. The liquid cooling module (10) according to claim 1, characterized in that: The pump base (210) includes a pump bottom wall (213), and the pump bottom wall (213) and the piezoelectric component (220) and a portion of the pump base (210) therebetween are arranged to form a pump cavity (214); the pump liquid inlet (211) and the pump liquid outlet (212) are arranged on the pump bottom wall (213) and are connected to the pump cavity (214); the pump bottom wall (213) and a portion of the liquid cooling module (100) on the side surrounding the liquid cooling outlet (111) and the side surrounding the liquid cooling inlet (112) are an integrated sealing structure.

4. The liquid cooling module (10) according to claim 1, characterized in that: The pump base (210) further comprises a pump side wall (215) located between the pump bottom wall (213) and the piezoelectric component (220), and the pump side wall (215) is an integrated sealing structure.

5. The liquid cooling module (10) according to claim 3, characterized in that: The liquid cooling module (100) comprises a first flexible membrane (110), the liquid cooling outlet (111) and the liquid cooling inlet (112) are arranged on the first flexible membrane (110), and the pump bottom wall (213) and the peripheral side of the liquid cooling outlet (111) and the part of the first flexible membrane (110) around the liquid cooling inlet (112) form an integrated sealing structure.

6. The liquid cooling module (10) according to claim 3, characterized in that: The difference between the glass transition temperature of the material of the pump bottom wall (213) and the glass transition temperature of the material of the first flexible film (110) is less than or equal to 20° C.; or The difference between the melting temperature of the material of the pump bottom wall (213) and the melting temperature of the material of the first flexible film (110) is less than or equal to 20° C.; or The material of the portion of the liquid cooling module (100) around the liquid cooling outlet (111) is the same as the material of the portion of the pump base (210) around the pump inlet (211), and the material of the portion of the liquid cooling module (100) around the liquid cooling inlet (112) is the same as the material of the portion of the pump base (210) around the pump outlet (212).

7. The liquid cooling module (10) according to claim 3, characterized in that: The material of the pump bottom wall (213) is selected from a flexible temperature-resistant polymer material with a breaking elongation greater than 10%, and the material of the pump bottom wall (213) is selected from at least one of polyethylene terephthalate copolymer, polyethylene naphthalate, polyethylene 2,5-furandicarboxylate, polyimide, polyetheretherketone, and biaxially stretched polypropylene; The material of the first flexible film (110) is selected from a flexible temperature-resistant polymer material with a breaking elongation greater than 10%, and the material of the first flexible film (110) is selected from at least one of polyethylene terephthalate copolymer, polyethylene naphthalate, polyethylene 2,5-furandicarboxylate, polyimide, polyetheretherketone, and biaxially stretched polypropylene.

8. The liquid cooling module (10) according to claim 7, characterized in that: The monomers of the polyethylene terephthalate copolymer include terephthalic acid, ethylene glycol and a hard segment molecular structure, and the mass percentage of the hard segment molecular structure in the polyethylene terephthalate copolymer is greater than or equal to 20% and less than or equal to 80%.

9. The liquid cooling module (10) according to claim 8, characterized in that: The hard segment molecular structure is selected from at least one of 2,5-furandicarboxylic acid, dimethyl carbonate and 2,6-naphthalene dicarboxylic acid.

10. The liquid cooling module (10) according to claim 5, characterized in that: The liquid-cooling module (100) further comprises a second flexible film (120) and a first rigid substrate (130) located between the first flexible film (110) and the second flexible film (120); the first flexible film (110), the second flexible film (120) and the first rigid substrate (130) enclose an inner cavity (140) of the liquid-cooling module (100); and two ends of the first rigid substrate (130) are respectively integrated with the first flexible film (110) and the second flexible film (120) to form a sealed structure.

11. The liquid cooling module (10) according to claim 10, characterized in that: The difference between the glass transition temperature of the material of the first rigid substrate (130) and the glass transition temperature of the material of the first flexible film (110) or the second flexible film (120) is less than or equal to 20° C.; or The difference between the melting temperature of the material of the first rigid substrate (130) and the melting temperature of the material of the first flexible film (110) or the second flexible film (120) is less than or equal to 20°C.

12. The liquid cooling module (10) according to claim 10, characterized in that: At least one of the first flexible film (110) and the second flexible film (120) comprises two PET layers (115) and an anti-evaporation layer (116) located between the two PET layers (115), wherein the anti-evaporation layer (116) comprises at least one of a polyimide layer, a polyvinylidene chloride layer or a metal film layer.

13. The liquid cooling module (10) according to claim 10, characterized in that: An inorganic oxide film (117) is provided on a surface of at least one of the first flexible film (110) and the second flexible film (120) away from the inner cavity (140).

14. The liquid cooling module (10) according to claim 10, characterized in that: The liquid-cooling module (100) further comprises a second rigid substrate (150), wherein the second rigid substrate (150) divides the inner cavity (140) of the liquid-cooling module (100) into a liquid inlet channel (141) and a liquid outlet channel (142); the liquid-cooling liquid inlet (112) is connected to the liquid inlet channel (141); the liquid-cooling liquid outlet (111) is connected to the liquid outlet channel (142); and the two ends of the second rigid substrate (150) are respectively integrated with the first flexible membrane (110) and the second flexible membrane (120) to form a sealing structure.

15. The liquid cooling module (10) according to claim 14, characterized in that: The liquid cooling module (100) further comprises a third rigid substrate (160), wherein the third rigid substrate (160) is distributed in the liquid inlet channel (141) and the liquid outlet channel (142), and the two ends of the third rigid substrate (160) are respectively integrated with the first flexible membrane (110) and the second flexible membrane (120) to form a sealing structure.

16. The liquid cooling module (10) according to claim 15, characterized in that: The liquid-cooling module (100) comprises a liquid-cooling film bending zone (170), the liquid-cooling module (100) is folded through the liquid-cooling film bending zone (170), at least one of the first rigid substrate (130), the second rigid substrate (150) and the third rigid substrate (160) is provided with a flexibility enhancement structure (131), the flexibility enhancement structure (131) is located in the liquid-cooling film bending zone (170), and the flexibility enhancement structure (131) is used to improve the flexibility of the liquid-cooling film bending zone (170).

17. The liquid cooling module (10) according to claim 16, characterized in that: The flexibility enhancement structure (131) of the first rigid substrate (130) comprises a groove (1311) located on a side wall of the first rigid substrate (130), and the groove (1311) is located in the liquid cooling film bending area (170).

18. The liquid cooling module (10) according to claim 16, characterized in that: The flexibility enhancement structure (131) of the second rigid substrate (150) comprises a through hole (1313) penetrating the second rigid substrate (150) along a first direction (A), wherein the through hole (1313) is located in the bending area (170) of the liquid cooling film, and the first direction (A) is the arrangement direction of the first flexible film (110) and the second flexible film (120); or The liquid-cooling module (100) is provided with a through hole (1312) penetrating the second rigid substrate (150), the first flexible membrane (110) and the second flexible membrane (120) along the first direction (A); the through hole (1312) is located in the bending area (170) of the liquid-cooling membrane.

19. The liquid cooling module (10) according to claim 16, characterized in that: The flexibility enhancement structure (131) of the third rigid substrate (160) comprises an opening (1314) located in the third rigid substrate (160), wherein the opening (1314) connects flow channels on both sides of the third rigid substrate (160).

20. An electronic device (1), characterized in that: It comprises a liquid cooling module (10) as described in any one of claims 1 to 19, wherein the liquid cooling module (10) is located in the electronic device (1) or in an accessory of the electronic device (1).

21. The electronic device (1) according to claim 20, characterized in that The electronic device (1) comprises a first non-folding portion (11), a folding portion (12) and a second non-folding portion (13); the second non-folding portion (13) can be folded toward the first non-folding portion (11) through the folding portion (12); the liquid-cooling module (100) comprises a liquid-cooling film bending zone (170); when the electronic device (1) is folded, the liquid-cooling module (100) is folded through the liquid-cooling film bending zone (170); at least one of the first rigid substrate (130), the second rigid substrate (150) and the third rigid substrate (160) is provided with a flexibility enhancement structure (131); the flexibility enhancement structure (131) is located in the liquid-cooling film bending zone (170); and the flexibility enhancement structure (131) is used to enhance the flexibility of the liquid-cooling film bending zone (170).

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