Heat dissipation structure and mobile phone signal shield having the same

Abstract

The present invention discloses a heat dissipation structure and a mobile phone signal blocker having the same, and relates to the technical field of mobile phone signal blockers. The present invention comprises a shell and a mounting frame for mounting the shell; a heat dissipation plate is provided on the back of the shell, an air inlet and an air outlet are provided on the shell on both sides of the heat dissipation plate, and a circuit board is mounted on the heat dissipation plate inside the shell; a heat dissipation fan is installed at the air inlet and / or air outlet inside the shell; and a wind shield boss is provided on the shell between the air outlet and the heat dissipation plate. During use, the present invention drives ambient air into the shell through the air inlet through a heat dissipation fan, and drives another heat dissipation fan to discharge the air inside the shell through the air outlet. The air flow flows through the surface of the circuit board when flowing inside the shell, thereby completing the function of cooling the circuit board inside the shell. At the same time, when used in conjunction with the heat dissipation plate, the overall heat dissipation effect is improved, solving the problems raised by the existing background technology.

Description

Technical Field

[0001] The invention belongs to the technical field of mobile phone signal blockers, and in particular relates to a heat dissipation structure and a mobile phone signal blocker having the same. Background Art

[0002] Cell phone signal jammers are primarily designed for use in places where cell phone use is prohibited, such as exam halls, schools, gas stations, churches, courtrooms, libraries, conference centers (rooms), theaters, hospitals, and financial institutions. Typically, a cell phone signal jammer's operating time is very long, often upwards of four hours. This is because the jammers contain numerous components, and the heat dissipation efficiency of current jammers is not ideal. After prolonged operation, the heat generated within the jammers exceeds the appropriate temperature, causing damage to the components, which in turn compromises the jammer's lifespan.

[0003] For example, CN216566138U discloses a heat dissipation housing for a mobile phone signal jammer, comprising a lower housing, a connection slot formed in the interior of the top of the lower housing, an upper housing disposed at the top of the lower housing, a connection plate disposed at the bottom of the upper housing to match the connection slot, and a locking assembly disposed between the connection plate and the connection slot. During use, the heat conduction plate transfers heat to a first heat dissipation plate, and the heat conduction rod transfers heat to a second heat dissipation plate, through a heat dissipation assembly, a micro fan, and a vent. Also, CN209845636U discloses a closed portable mobile phone signal jammer housing, comprising an upper housing, a lower housing, a folding plate, an antenna mounting base, an antenna socket, a PLC board mounting post, a PLC board, a thermally conductive silicone pad, a jammer switch, a heat pipe heat dissipation plate, a battery, a charging socket, an antenna, a rotating shaft, and a heat sink. Heat is dissipated from the heat sink via the heat pipe heat dissipation plate disposed between the battery and the PLC board, thereby improving the heat dissipation efficiency of the jammer and reducing the temperature within the sealed cavity. In the above-mentioned devices, heat is dissipated by a single heat transfer method, resulting in a slow overall heat dissipation effect. Summary of the Invention

[0004] The object of the present invention is to provide a heat dissipation structure and a mobile phone signal blocker having the same. During use, a heat dissipation fan drives ambient air into the interior of a housing through an air inlet, and drives another heat dissipation fan to discharge the air inside the housing through an air outlet. The airflow flows through the surface of the circuit board when flowing inside the housing, thereby completing the function of cooling the circuit board inside the housing. At the same time, when used in conjunction with a heat sink, the overall heat dissipation effect is improved, thereby solving the problems raised by the existing background technology.

[0005] To solve the above technical problems, the present invention is achieved through the following technical solutions:

[0006] The present invention is a heat dissipation structure, comprising a shell and a mounting bracket for mounting the shell; a heat dissipation plate is provided on the back of the shell, an air inlet and an air outlet are respectively provided on the shell on both sides of the heat dissipation plate, and a circuit board is installed on the heat dissipation plate inside the shell; a heat dissipation fan is installed at the air inlet and / or air outlet inside the shell; and a wind shield boss is provided on the shell between the air outlet and the heat dissipation plate; an air inlet duct and an air outlet duct are formed between the mounting bracket and the shell, and a thermal conductive adhesive layer / thermal conductive foam is provided between the circuit board and the heat dissipation plate.

[0007] Furthermore, a plurality of mutually parallel heat dissipation fins are provided on the outer side surface of the heat dissipation plate, the cross section of the heat dissipation fins is an isosceles trapezoid, and the wider ends of the heat dissipation fins are connected to the heat dissipation plate.

[0008] Furthermore, the heat dissipation fins and the heat dissipation plate are integrally formed and made of aluminum or copper; the length direction of the heat dissipation fins is perpendicular to the length direction of the wind shield boss.

[0009] Furthermore, the heat dissipating fins are provided with a plurality of through holes at equal intervals along their length direction, the axial direction of the through holes is perpendicular to the length direction of the heat dissipating fins, and the heights of the plurality of heat dissipating fins gradually decrease from the middle to both sides.

[0010] Furthermore, the housing includes a lower housing and an upper housing that are buckled together, and the heat dissipation plate, air inlet and air outlet are all arranged on the lower housing;

[0011] Furthermore, a support column for mounting a cooling fan and a circuit board is provided in the lower shell, and a threaded hole is provided at the end of the support column.

[0012] Furthermore, the mounting frame includes a rectangular bottom plate provided with a mounting hole, and each of the four corner sides of the rectangular bottom plate is provided with a side clamping plate that abuts against the corner side of the shell.

[0013] Furthermore, a chamfer is provided on the corner side of the shell, and the inner side wall of the side clamp is provided with an arc surface that cooperates with the chamfer, and a number of flexible protrusions are provided on the arc surface along its length direction; a stop portion is provided on the inner wall of the bottom of the side clamp that rests against the back of the shell; when the shell is installed on the mounting frame, foam tape is pasted on the windshield boss, and one side of the foam tape is pasted on the upper surface of the rectangular bottom plate.

[0014] A mobile phone signal blocker includes a heat dissipation structure as described above; a power module is also installed in a housing located on one side of the circuit board, and a shielding signal generating module is provided on the circuit board; the housing is also provided with a charging port, an operating indicator light, a power indicator light, a power switch, a frequency band control switch, and a display screen; after installation, a frame is provided between the housing and a mounting frame, the frame having an opening A at the end located at the air outlet, and openings B on both sides of the frame located at the heat dissipation plate.

[0015] The present invention has the following beneficial effects:

[0016] During use of the present invention, a cooling fan drives ambient air into the shell through the air inlet, and drives another cooling fan to discharge the air inside the shell out of the shell through the air outlet. The air flow flows through the surface of the circuit board when flowing inside the shell, thereby completing the effect of cooling the circuit board inside the shell.

[0017] Of course, any product implementing the present invention does not necessarily need to achieve all of the advantages described above at the same time. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for describing the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0019] Figure 1 The structure of the mobile phone shield of the present invention is shown as follows: Figure 1 ;

[0020] Figure 2 This is a diagram showing the internal structure of the housing of the present invention;

[0021] Figure 3 This is a schematic diagram of the shell structure of the present invention;

[0022] Figure 4 for Figure 1 The main view;

[0023] Figure 5 This is a schematic diagram of the mounting frame structure of the present invention;

[0024] Figure 6 The structure of the mobile phone shield of the present invention is shown as follows: Figure 2 . DETAILED DESCRIPTION

[0025] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making any creative efforts shall fall within the scope of protection of the present invention.

[0026] In the description of the present invention, it should be understood that the terms "opening", "upper", "lower", "thickness", "top", "middle", "length", "inside", "around" and the like indicating orientation or positional relationship are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the components or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0027] See also Figure 1-3 As shown, the present invention is a heat dissipation structure, comprising a shell 1 and a mounting frame 2 for mounting the shell 1; a heat dissipation plate 10 is provided on the back of the shell 1, and the two surfaces of the heat dissipation plate 10 are respectively located inside and outside the shell 1, and a circuit board 3 is installed on the heat dissipation plate 10 located inside the shell 1, and a thermal conductive adhesive layer is provided between the circuit board 3 and the heat dissipation plate 10. By utilizing the provision of the thermal conductive adhesive layer, the heat generated by the circuit board 3 during operation can be promptly and quickly transferred to the heat dissipation plate 10 through the thermal conductive adhesive layer, and dissipated through the heat dissipation plate 10.

[0028] In the present invention, an air inlet 11 and an air outlet 12 are respectively provided on the shell 1 on both sides of the heat dissipation plate 10, and a cooling fan located inside the shell 1 is respectively installed at the air inlet 11 and the air outlet 12; during use, one cooling fan drives the ambient air to enter the shell 1 through the air inlet 11, and drives the other cooling fan to discharge the air inside the shell 1 through the air outlet 12, and utilizes the air flow to flow through the surface of the circuit board 3 when flowing inside the shell 1, thereby completing the function of cooling the circuit board 3 inside the shell 1.

[0029] In the present invention, to better utilize the heat dissipation of the heat sink 10, the heat dissipation rate of the heat sink 10 can be increased during use. A windshield boss 13 is provided on the housing between the air outlet 12 and the heat sink 10. An air inlet duct and an air outlet duct are formed between the mounting frame 2 and the housing 1. When the cooling fan is started, ambient air enters the housing 1 through the air inlet duct and is then discharged from the housing 1 into the air outlet duct. The provision of the windshield boss 13 prevents the hot air flowing out of the air outlet 12 from flowing onto the surface of the heat sink 10 and affecting the heat dissipation of the heat sink 10. At the same time, when the cooling fan located at the air inlet 11 is running to draw air, it drives air flow on the surface of the heat sink 10, thereby enhancing the heat dissipation effect.

[0030] In order to improve the heat dissipation effect of the heat sink 10, a number of parallel heat dissipation fins 14 are provided on the outer side of the heat sink 10. The cross-section of the heat dissipation fins 14 is an isosceles trapezoid, and the wider end of the heat dissipation fins 14 is connected to the heat sink 10. The heat dissipation fins 14 and the heat dissipation plate 10 are integrally formed and made of aluminum; the length direction of the heat dissipation fins 14 is perpendicular to the length direction of the wind shield boss 13; the setting of the heat dissipation fins 14 enhances the overall contact area of ​​the heat sink 10 with the air, thereby facilitating the improvement of the heat dissipation effect.

[0031] A plurality of through holes are provided on the heat dissipation fins 14 at equal intervals along the length direction thereof, the axial direction of the through holes is perpendicular to the length direction of the heat dissipation fins 14, and the heights of the plurality of heat dissipation fins 14 gradually decrease from the middle to the sides. By utilizing the design of the through holes and the heat dissipation fins 14 with different heights, it is convenient for the ambient air on the surrounding side to pass through the through holes and the heat dissipation fins 14 and enter the heat dissipation fins 14 in the middle during use, thereby improving the heat dissipation effect and avoiding the heat dissipation fins 14 in the middle position being blocked by the heat dissipation fins 14 on the surrounding side, resulting in no airflow during operation.

[0032] It can be understood that in some inventive methods, the shell 1 includes a lower shell 101 and an upper shell 102 that are interlocked, and the heat sink 10, the air inlet 11 and the air outlet 12 are all arranged on the lower shell 101; and a support column 15 for installing a cooling fan and a circuit board 3 is also provided in the lower shell 101, and a threaded hole is provided at the end of the support column 15.

[0033] It is understandable that in some inventive methods, in order to facilitate the installation of the housing 1 and to form a better heat dissipation structure with the housing 1, such as Figure 5 The mounting bracket 2 of the present invention includes a rectangular base plate 4 provided with a mounting hole 41, and the four corner sides of the rectangular base plate 4 are each provided with a side clamping plate 42 that rests against the corner side of the shell 1, and in the present invention, the corner side of the shell 1 is chamfered, and the inner side wall of the side clamping plate 42 is provided with an arc surface 43 that cooperates with the chamfer, and a number of flexible protrusions 431 are provided on the arc surface 43 along its length direction; the flexible protrusions 431 are used to provide a deformation effect, which facilitates the interference fit between the control shell 1 and the mounting bracket 2, and thus facilitates the installation and removal of the shell 1 on the mounting bracket 2; of course, the flexible protrusion 431 is made of rubber, its cross-section is semicircular, and the protruding height is not higher than 0.25 cm.

[0034] On the basis of the above, the flexible protrusion 431 may not be provided on the arc surface 43, and a rigid protrusion or no protrusion may be used. In this case, during installation, the side clamping plate 42 needs to be controlled to open to a certain angle outward, that is, the side clamping plate 42 needs to be quite flexible, that is, the mounting frame 2 can be integrally formed of plastic material.

[0035] like Figure 4A stopper 433 is provided on the inner wall of the bottom of the side clamping plate 42, which abuts against the back of the shell 1; when the shell 1 is installed on the mounting frame 2, the foam tape 131 is pasted on the wind shield boss 13, and one side of the foam tape 131 is pasted on the upper surface of the rectangular bottom plate 4. The stopper 433 is used to limit the installation position of the shell 1, and the gap formed between the rectangular bottom plate 4 and the shell 1 is sealed by the foam tape 131 to prevent the air on both sides of the wind shield boss 13 from blowing through the above-mentioned gap when the fan is started.

[0036] A mobile phone signal blocker includes the above heat dissipation structure; a power module is also installed in the housing 1 located on one side of the circuit board 3, and a shielding signal generating module is set on the circuit board 3; the housing 1 is also provided with a charging port, a working indicator light, a power indicator light, a power switch, a frequency band control switch and a display screen 17; after installation, Figure 6 A frame 5 is provided between the housing 1 and the mounting frame 2. An opening A51 is provided at the end of the frame 5 located at the air outlet 12. Openings B52 are provided on both sides of the frame 5 located at the heat sink 10. The setting of the frame 5 is used to control the hot air outlet direction and the cold air inlet direction to be perpendicular and far apart when the mobile phone signal jammer is in use. At the same time, the setting of the opening B52 facilitates the air to first enter the heat dissipation fins 14 through the opening B52, and then enter the air inlet 11 through the heat dissipation fins 14. This method can maximize the heat dissipation through the heat dissipation fins 14.

[0037] Throughout this specification, references to terms such as "one embodiment," "example," or "specific example" indicate that the specific features, structures, materials, or characteristics described in conjunction with that embodiment or example are included in at least one embodiment or example of the present invention. In this specification, schematic representations of these terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

[0038] The preferred embodiments of the present invention disclosed above are intended only to help illustrate the present invention. These preferred embodiments do not exhaustively describe all details, nor do they limit the present invention to the specific embodiments described. Obviously, many modifications and variations are possible based on the content of this specification. These embodiments are selected and described in detail in this specification to better explain the principles and practical applications of the present invention, thereby enabling those skilled in the art to better understand and utilize the present invention. The present invention is limited only by the claims and their full scope and equivalents.

Claims

1. A heat dissipation structure, characterized in that: It comprises a shell (1) and a mounting frame (2) for mounting the shell (1); a heat sink (10), an air inlet (11) and an air outlet (12) are provided on the back of the shell (1); the air inlet (11) and the air outlet (12) are respectively located on the shell (1) on both sides of the heat sink (10); and a circuit board (3) is installed on the heat sink (10) located inside the shell (1); A cooling fan is installed at the air inlet (11) and / or the air outlet (12) in the housing (1); and a wind shield boss (13) is provided on the housing between the air outlet (12) and the heat dissipation plate (10); An air inlet duct and an air outlet duct are formed between the mounting frame (2) and the housing (1); The outer side surface of the heat dissipation plate (10) is provided with a plurality of mutually parallel heat dissipation fins (14), and the heat dissipation fins (14) are provided with a plurality of through holes at equal intervals along the length direction thereof, the axial direction of the through holes is perpendicular to the length direction of the heat dissipation fins (14), and the height of the plurality of heat dissipation fins (14) gradually decreases from the middle to both sides; The mounting frame (2) comprises a rectangular bottom plate (4) provided with a mounting hole (41), and each of the four corner sides of the rectangular bottom plate (4) is provided with a side clamping plate (42) that abuts against the corner side of the shell (1); the corner side of the shell (1) is provided with a chamfer, and the inner side wall of the side clamping plate (42) is provided with an arc surface (43) that matches the chamfer, and a plurality of flexible protrusions (431) are provided on the arc surface (43) along its length direction; and a stopper (433) is provided on the inner wall of the bottom of the side clamping plate (42) that abuts against the back side of the shell (1); When the housing (1) is mounted on the mounting frame (2), a foam tape (131) is adhered to the windshield boss (13), and one side of the foam tape (131) is adhered to the upper surface of the rectangular bottom plate (4).

2. A heat dissipation structure according to claim 1, characterized in that: A thermally conductive adhesive layer / thermal conductive foam is provided between the circuit board (3) and the heat dissipation plate (10).

3. The heat dissipation structure according to claim 1, characterized in that: The cross section of the heat dissipation fin (14) is an isosceles trapezoid, and the wider end of the heat dissipation fin (14) is connected to the heat dissipation plate (10).

4. The heat dissipation structure according to claim 1, characterized in that: The heat dissipation fins (14) and the heat dissipation plate (10) are integrally formed and are made of aluminum or copper; the length direction of the heat dissipation fins (14) is perpendicular to the length direction of the windshield boss (13).

5. The heat dissipation structure according to claim 1, characterized in that: The housing (1) comprises a lower housing (101) and an upper housing (102) that are engaged with each other, and the heat dissipation plate (10), the air inlet (11) and the air outlet (12) are all arranged on the lower housing (101); Furthermore, a support column (15) for mounting a cooling fan and a circuit board (3) is provided in the lower housing (101), and a threaded hole is provided at the end of the support column (15).

6. A mobile phone signal jammer, characterized in that: A heat dissipation structure comprising any one of claims 1 to 5; A power module is also installed in the housing (1) located on one side of the circuit board (3), and a shielding signal generating module is provided on the circuit board (3); The housing (1) is also provided with a charging interface (16), a working indicator light, a power indicator light, a power switch, a frequency band control switch and a display screen (17).

7. The mobile phone signal jammer according to claim 6, characterized in that: After installation, a frame (5) is provided between the housing (1) and the mounting frame (2); an opening A (51) is provided at the end of the frame (5) located at the air outlet (12); and openings B (52) are provided on both sides of the frame (5) located at the heat dissipation plate (10).

Images