A basalt fiber laminate and a method of making the same

Abstract

The present application belongs to the technical field of laminated composite materials, and specifically discloses a basalt fiber laminated plate and a preparation method thereof, which comprises n layers of basalt fiber layers, a group of electromagnetic shielding components and two groups of damage positioning components; the electromagnetic shielding component comprises at least one layer of a first LIG film layer, the first LIG film layer and the basalt fiber layer have the same size; the first LIG film layer is inserted into the laid basalt fiber layer; each group of damage positioning components comprises m groups of second LIG film layers, and the lateral spacing c of one group of damage positioning components is arranged in parallel into the basalt fiber layer; the longitudinal spacing c of the other group of damage positioning components is arranged in parallel into the basalt fiber layer; the two groups of damage positioning components and the first LIG film layer are respectively located in different layers of the basalt fiber layer. The present application can improve the electromagnetic shielding efficiency and the damage positioning capability while maintaining the interlaminar fracture toughness of the basalt fiber laminated plate.

Description

Technical Field

[0001] This invention belongs to the field of laminate composite material technology, and particularly relates to a basalt fiber laminate and its preparation method. Background Technology

[0002] Basalt fiber composite laminates, due to their excellent mechanical properties, chemical stability, electrical insulation, and relatively low cost, have shown great promise in aerospace, protective materials, and other fields, attracting the research interest of many scientists and finding widespread application in aerospace, sports equipment, and other areas. However, basalt fiber inevitably needs to withstand harsh operating environments in practical use, making it susceptible to interference and damage from external conditions. Therefore, how to enhance the functionality of basalt fiber to resist external environmental interference and enable damage localization has become a problem that needs to be solved. The relatively poor electrical conductivity of basalt fiber also presents challenges for functional design and damage detection.

[0003] Existing research methods for electromagnetic shielding and damage localization of basalt fiber laminates mainly include: Electromagnetic shielding is achieved by introducing electromagnetic shielding materials into the basalt fiber laminate through methods such as chemical vapor deposition, electroless plating, and surface coating. However, these methods suffer from drawbacks such as low deposition rates, environmental pollution, complex operation, high cost, and surface inhomogeneity. Damage localization in basalt fiber laminates can be detected using acoustic waves, artificial intelligence, or piezoresistive impedance methods, but these methods are technically challenging, require highly skilled personnel, and are costly. Summary of the Invention

[0004] The purpose of this invention is to provide a basalt fiber laminate and its preparation method, to solve the problems of high cost, complex operation, and uneven surface caused by existing methods for electromagnetic shielding and damage localization of basalt fiber laminates. This invention prepares the laminate by inserting a LIG film into the middle of basalt fibers, completely impregnating it with an epoxy resin solution, and then using hot pressing. The above objectives are achieved by utilizing the rough surface morphology, porous internal structure, and excellent conductivity of LIG. The rough surface morphology of LIG allows it to maintain the interlaminar fracture toughness of the basalt fiber laminate, while the excellent conductivity and porous internal structure of graphene provide good electromagnetic shielding capabilities. Furthermore, the damage location of the laminate can be located by detecting the relative resistance change rate of the LIG film at different locations.

[0005] To achieve the above objectives, the present invention provides a basalt fiber laminate, comprising n basalt fiber layers, a set of electromagnetic shielding components, and two sets of damage localization components; the basalt fiber layers are basalt fibers impregnated with epoxy resin solution; the n basalt fiber layers are laid layer by layer; the length and width of each basalt fiber layer are x1 and y1, respectively.

[0006] The electromagnetic shielding assembly includes at least one first LIG film layer, which is a double-sided printed LIG film. The first LIG film layer and the basalt fiber layer have the same size. The first LIG film layer is inserted into the laid basalt fiber layer.

[0007] Each damage localization component includes m sets of second LIG film layers, the second LIG film layers being double-sided printed LIG films; the length and width of the second LIG film layers are x2 and y2, respectively; the m sets of second LIG film layers of one set of damage localization components are arranged in parallel with a lateral spacing c between two adjacent basalt fiber layers; the m sets of second LIG film layers of another set of damage localization components are arranged in parallel with a longitudinal spacing c between two adjacent basalt fiber layers; c, m, x1, y1, x2, and y2 satisfy the following formulas: m*y2+(m-1)*c<y1,x2>x1; m*y2+(m-1)*c<x1,x2>y1;

[0008] The two sets of damage localization components and the first LIG film layer are located in different layers of the basalt fiber layer.

[0009] Furthermore, the first LIG thin film layer is located at the equally spaced positions of the nth basalt fiber layer.

[0010] Furthermore, the two sets of damage localization components are located on both sides of two adjacent sets of basalt fiber layers at the bisection position of the nth basalt fiber layer.

[0011] Furthermore, the mass ratio of epoxy resin to curing agent in the epoxy resin solution is 100:26.7.

[0012] To achieve the above objectives, the present invention provides a method for preparing basalt fiber laminates, characterized by comprising the following steps:

[0013] Preparation of a first LIG thin film layer and a second LIG thin film layer: A first LIG thin film layer and a second LIG thin film layer are prepared on a PI thin film; the length and width of the first LIG thin film layer are x1 and y1, respectively; the length and width of the second LIG thin film layer are x2 and y2, respectively.

[0014] Cutting the basalt fiber layer: Cut the basalt fiber layer to the same size as the first LIG film layer;

[0015] Laying basalt fiber laminate: Each layer of basalt fiber is impregnated in an epoxy resin solution, and the impregnated basalt fiber layers are laid one by one. During the laying process, the first LIG film layer and the second LIG film layer are inserted into the corresponding layers to form a LIG / BF / EP laminate.

[0016] Curing LIG / BF / EP laminate: Place the LIG / BF / EP laminate in a sealed bag, seal it, and vacuum it before curing.

[0017] Furthermore, the insertion method of the second LIG film layer is as follows: the 2m LIG film layer is divided into two groups on average. The LIG film layers of one group are inserted into the space between two adjacent basalt fiber layers with a horizontal spacing c. The LIG film layers of the other group are inserted into the space between two adjacent basalt fiber layers with a vertical spacing c. The two groups are located in different layers of the basalt fiber layer. c, m, x1, y1, x2 and y2 satisfy the following formulas: m*y2+(m-1)*c<y1,x2>x1; m*y2+(m-1)*c<x1,x2>y1.

[0018] Furthermore, the specific curing method is as follows: the LIG / BF / EP laminate is placed on a hot press, and under the support of a mold, it is pressed and cured at 120°C for 17 hours and at 180°C for 2 hours.

[0019] Furthermore, the specific method for preparing the first LIG thin film layer and the second LIG thin film layer on the PI thin film is as follows:

[0020] Draw the LIG graphic to be printed in CorelDRAW software;

[0021] Import the drawn LIG pattern into the laser printer, set the laser parameters, and print a LIG film on both sides of a PI substrate with a thickness of 150 micrometers.

[0022] Furthermore, the laser parameters include a laser power of 7.5W, a laser scanning speed of 0.19 m / s, a pixel density of 700 PPI, and a Z-axis distance of 0.039".

[0023] The beneficial effects of this invention are as follows:

[0024] ① Addressing the issues of low electromagnetic shielding effectiveness, harsh operating environments, and susceptibility to damage in basalt fiber laminates, this invention aims to improve electromagnetic shielding effectiveness and damage localization capabilities while maintaining the interlaminar fracture toughness of basalt fiber laminates. This is achieved by inserting a first and second LIG film layer between basalt fiber layers, fully impregnating them with an epoxy resin solution (EP), and then fabricating the laminate using hot pressing. The rough surface morphology, porous internal structure, and excellent conductivity of the first and second LIG film layers are utilized to achieve the above objectives. The rough surface morphology of the first and second LIG film layers allows them to maintain the interlaminar fracture toughness of the basalt fiber layer; the excellent conductivity and porous internal structure of graphene provide good electromagnetic shielding capabilities; and the damage location of the laminate can be located by detecting the relative resistance change rate of the second LIG film layer at different locations. This invention solves the problem of poor electromagnetic shielding in basalt fiber laminates and enables damage localization, expanding the application of basalt laminates as functional materials.

[0025] ②The conductivity of the first LIG thin film layer was not damaged after the basalt fiber layer was inserted. The improvement in electromagnetic shielding effectiveness is mainly due to the porous internal structure and excellent conductivity of the first LIG thin film layer.

[0026] ③ The second LIG films are arranged longitudinally and laterally in parallel, respectively, and inserted into different BF layers (basalt fiber layers). They are then fully impregnated with EP (epoxy resin solution) and hot-pressed to prepare a laminate, thus enabling damage localization of the laminate. The damage is understood by measuring the resistance change of the second LIG film layers inserted into the basalt fiber laminate before and after damage; the area where the damaged second LIG film layers intersect is the location of the damage. Attached Figure Description

[0027] Figure 1 This is a schematic diagram of the structure of a basalt fiber laminate of the present invention, which includes a first LIG film layer;

[0028] Figure 2 This is a schematic diagram of the structure of a basalt fiber laminate of the present invention, which includes three first LIG film layers;

[0029] Figure 3 A schematic diagram showing the generation of the first and second LIG thin film layers;

[0030] Figure 4 Scanning electron microscope (SEM) images of the first and second LIG thin film layers;

[0031] Figure 5 Raman spectra of the first and second LIG thin film layers;

[0032] Figure 6 Mode I interlaminar fracture toughness diagrams for BF / EP laminate, PI / BF / EP laminate and LIG / BF / EP laminate;

[0033] Figure 7 Mode II interlaminar fracture toughness diagrams for BF / EP laminate, PI / BF / EP laminate, and LIG / BF / EP laminate;

[0034] Figure 8 The graph shows the electromagnetic shielding effectiveness test data for Example 1, Example 2, and Comparative Example 1.

[0035] Figure 9 The graph shows the conductivity test data for Example 1, Example 2, and Comparative Example 1.

[0036] Figure 10 This is a diagram showing the arrangement of the second LIG film layer between layers 7 and 8 of the basalt fiber layer.

[0037] Figure 11 This is a diagram showing the arrangement of the second LIG film layer between layers 9 and 10 of the basalt fiber layer.

[0038] Figure 12 Diagram of the damage localization mechanism. Detailed Implementation

[0039] The following detailed description illustrates the specific implementation method:

[0040] The reference numerals in the accompanying drawings include: basalt fiber layer 1, first LIG film layer 2, and second LIG film layer 3.

[0041] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0042] LIG (Laser-Induced Graphene) technology is a technique that generates graphene on a substrate by laser irradiation. The principle involves irradiating a polyimide (PI) substrate with a laser, causing localized high temperatures that break chemical bonds and allow aromatic groups to recombine, thus generating graphene. The method first involves drawing the dimensions and shape of the graphene to be printed in CorelDRAW software, then connecting a laser printer and setting the printing parameters, and finally generating the graphene on the PI substrate through laser radiation.

[0043] A basalt fiber laminate includes n basalt fiber layers 1, a set of electromagnetic shielding components, and two sets of damage localization components; the basalt fiber layer 1 is basalt fiber impregnated with epoxy resin solution, and the mass ratio of epoxy resin to curing agent in the epoxy resin solution is 100:26.7; the n basalt fiber layers 1 are laid layer by layer; the length and width of each basalt fiber layer 1 are x1 and y1, respectively.

[0044] The electromagnetic shielding assembly includes at least one first LIG film layer 2, which is a double-sided printed LIG film. The first LIG film layer 2 and the basalt fiber layer 1 have the same dimensions. The first LIG film layer 2 is inserted into the laid basalt fiber layer 1. The first LIG film layer 2 is located at the equally divided positions (e.g., bisection, trisection) of the n-layer basalt fiber layer 1. A basalt fiber laminate with one layer of the first LIG film layer 2 is shown below. Figure 1 As shown, a basalt fiber laminate with three layers of the first LIG thin film layer 2 is as follows: Figure 2 As shown.

[0045] Each damage localization assembly includes m sets of second LIG film layers 3, each second LIG film layer 3 being a double-sided printed LIG film; the length and width of the second LIG film layer 3 are x2 and y2, respectively; the m sets of second LIG film layers 3 of a damage localization assembly are arranged in parallel with a lateral spacing c between them, extending to the space between two adjacent basalt fiber layers 1, such as... Figure 10 As shown; the longitudinal spacing c of the second LIG film layer 3 of another set of damage localization components is arranged parallel to the longitudinal spacing c between two adjacent basalt fiber layers 1, as shown. Figure 11 As shown; the two sets of damage localization components are located on both sides of the two adjacent sets of basalt fiber layers 1 at the bisection position of the nth layer of basalt fiber layer 1; c, m, x1, y1, x2 and y2 satisfy the following formulas: m*y2+(m-1)*c<y1,x2>x1; m*y2+(m-1)*c<x1,x2>y1.

[0046] The two sets of damage localization components and the first LIG thin film layer 2 are located in different layers of the basalt fiber layer 1.

[0047] A method for preparing a basalt fiber laminate includes the following steps:

[0048] S1: Prepare the first LIG thin film layer 2 and the second LIG thin film layer 3, as follows Figure 3 As shown, a first LIG thin film layer 2 and a second LIG thin film layer 3 are prepared on a PI thin film; the length and width of the first LIG thin film layer 2 are x1 and y1, respectively; the length and width of the second LIG thin film layer 3 are x2 and y2, respectively; the specific method for preparing the first LIG thin film layer 2 and the second LIG thin film layer 3 on a PI thin film is as follows:

[0049] S11: Draw the LIG graphic to be printed in CorelDRAW software;

[0050] S12: Import the drawn LIG pattern into the laser printer, set the laser parameters including laser power of 7.5W, laser scanning speed of 0.19 m / s, pixel density of 700 PPI, and Z-axis distance of 0.039". Print the first and second LIG films double-sided on a 150-micron-thick PI substrate. The scanning electron microscope (SEM) images and Raman spectra of the first and second LIG film layers are shown below. Figure 4 , 5 As shown.

[0051] S2: Cutting basalt fiber layer 1: Cutting basalt fiber layer 1 to the same size as the first LIG film layer 2;

[0052] S3: Laying Basalt Fiber Laminate: Each basalt fiber layer 1 is impregnated in an epoxy resin solution (the epoxy resin solution is evenly applied to the surface of the basalt fiber layer 1). The impregnated basalt fiber layers 1 are laid layer by layer. During the laying process, the first LIG film layer 2 and the second LIG film layer 3 are inserted into the corresponding layers to form a LIG / BF / EP laminate. The insertion method of the second LIG film layer 3 is as follows: the 2m LIG film layer is divided into two groups. The LIG film layers of one group are inserted into the space between two adjacent basalt fiber layers 1 with a horizontal spacing c. The LIG film layers of the other group are inserted into the space between two adjacent basalt fiber layers 1 with a vertical spacing c. The two groups are located in different layers of the basalt fiber layer 1. c, m, x1, y1, x2, and y2 satisfy the following formula: m*y2+(m-1)*c<y1,x2>x1; m*y2+(m-1)*c<x1,x2>y1;

[0053] S4: Curing LIG / BF / EP laminate: Place the LIG / BF / EP laminate in a sealed bag, seal it, and vacuum it for 1 hour. Then, cure it. The specific curing method is as follows: Place the LIG / BF / EP laminate on a hot press, and under the support of the mold, press and cure it at 120°C for 17 hours and at 180°C for 2 hours.

[0054] The following explanation uses the following case: n=16, m=3, x1 and y1 are both 100mm, x2 and y2 are 10mm and 200mm respectively, and c is 10mm.

[0055] Example 1: A first LIG film layer 2 is set and inserted between the 8th and 9th basalt fiber layers 1; after the epoxy resin solution completely impregnates the 16 layers of basalt fiber fabric, it is placed in a sealed bag, sealed and vacuumed, and then placed on a hot press. Under the support of a 3.6mm mold, it is pressed and cured at 120°C for 17 hours and at 180°C for 2 hours.

[0056] Example 2: Three layers of first LIG film 2 were set up, and the first LIG film 2 were inserted between the 4th and 5th basalt fiber layers 1, between the 8th and 9th basalt fiber layers 1, and between the 12th and 13th basalt fiber layers 1, respectively. After the epoxy resin solution completely impregnated the 16 layers of basalt fiber fabric, it was placed in a sealed bag, sealed and vacuumed, and then placed on a hot press. Under the support of a 3.6mm mold, it was pressed and cured at 120°C for 17 hours and at 180°C for 2 hours.

[0057] Comparative Example 1: BF / EP laminate, without PI film substrate, without insertion of first LIG film layer 2 and second LIG film layer 3.

[0058] Comparative Example 2: PI / BF / EP laminate, without the first LIG thin film layer 2 inserted.

[0059] The electromagnetic shielding effectiveness of Examples 1, 2, and 1 was tested, and the results were obtained. Figure 8 The electromagnetic shielding effectiveness of the BF / EP laminate is below 5dB. The laminate in Example 1 achieves an average electromagnetic shielding effectiveness of over 15dB in the X-band (frequency: 8.2-12.4GHz), while the laminate in Example 2 achieves an average electromagnetic shielding effectiveness of over 45dB in the X-band. The more LIG thin film layers inserted, the better the overall electromagnetic shielding effectiveness. The conductivity of the first LIG thin film layer and the first LIG thin film layer is not damaged after the insertion of the basalt fiber layer. Figure 9 As shown.

[0060] The rectangular second LIG thin film layer 3 is arranged in parallel longitudinally and in parallel transversely, and inserted into different BF layers, such as... Figure 10 , 11 As shown in the diagram, a laminate is prepared by fully impregnating the laminate with EP and then hot-pressing it, thus achieving damage localization. The damage is understood by measuring the change in resistance of the second LIG film inserted into the laminate before and after damage; the area where the damaged second LIG films intersect is the location of the damage. The damage localization mechanism is illustrated in the diagram below. Figure 12 As shown.

[0061] Laminates GIC Init (Initial crack value for type I interlaminar toughness) and G IC Prop The test standard for (Type I interlaminar toughness crack propagation value) is based on ASTM D5528 DCB. ， The laminates were cut into standard DCB test specimens using a cutting machine. Each DCB specimen was tested on an MTS CMT5105 instrument using a 5KN load cell. The crosshead speed was maintained at 1mm / min. Three specimens were tested for each type of laminate. IC The formula for calculating (Type I interlaminar toughness) is:

[0062] ,

[0063] Where P represents the fracture load (N), δ represents the displacement at the load point (mm), b1 represents the sample width (mm), and a1 represents the delamination length (mm), which is derived from the formula a1 = (a0 + Δa), where Δa is the crack propagation length and a0 is the initial length.

[0064] Laminates G IIC The testing standard is based on the ENF of the ESIS protocol. ， The laminates were cut into ENF test specimens of standard size using a cutting machine. Each ENF specimen was tested on an MTS CMT5105 equipment using a 5KN load cell. The crosshead speed was maintained at 1mm / min. Three specimens were tested for each type of laminate. IIC The formula for calculating (Type II interlaminar toughness) is:

[0065] ,

[0066] Where P represents the maximum load (N), δ represents the displacement at the load point (mm), b2 represents the average specimen width (mm), and a2 represents the crack length (mm), which is derived from the formula a2 = (a0 + Δa), where Δa is the crack propagation length, a0 is the initial length, and L is the half-span length (mm).

[0067] G was performed on Example 1, Comparative Example 1, and Comparative Example 2. IC G IIC The test was conducted, and the results were as follows: Figure 6 , 7 As shown, compared with BF / EP laminate and PI / BF / EP laminate, the G of LIG / BF / EP laminate is... ICInit and G ICProp The basic situation was maintained, G IICThe damage was reduced. This indicates that LIG / BF / EP laminates can significantly improve electromagnetic shielding and damage localization capabilities by inserting LIG films, while essentially maintaining interlaminar fracture toughness.

[0068] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0069] The above descriptions are merely embodiments of the present invention. Commonly known structures and characteristics are not described in detail here. Those skilled in the art are aware of all common technical knowledge in the field prior to the application date or priority date, are aware of all existing technologies in that field, and have the ability to apply conventional experimental methods prior to that date. Those skilled in the art can, under the guidance of this application, improve and implement this solution in combination with their own capabilities. Some typical known structures or methods should not be obstacles for those skilled in the art to implement this application. It should be noted that those skilled in the art can make several modifications and improvements without departing from the structure of the present invention. These should also be considered within the scope of protection of the present invention, and will not affect the effectiveness of the implementation of the present invention or the practicality of the patent. The scope of protection claimed in this application should be determined by the content of its claims, and the specific embodiments described in the specification can be used to interpret the content of the claims.

Claims

1. A basalt fiber laminate panel, characterized by: It includes n layers of basalt fiber (1), a set of electromagnetic shielding components and two sets of damage localization components; the basalt fiber (1) is basalt fiber impregnated with epoxy resin solution; the n layers of basalt fiber (1) are laid layer by layer; the length and width of each layer of basalt fiber (1) are x1 and y1, respectively. The electromagnetic shielding assembly includes at least one first LIG film layer (2), which is a double-sided printed LIG film. The first LIG film layer (2) and the basalt fiber layer (1) have the same size. The first LIG film layer (2) is inserted into the laid basalt fiber layer (1). Each group of the damage localization components includes m groups of second LIG film layers (3), the second LIG film layers (3) being double-sided printed LIG films; the length and width of the second LIG film layers (3) are x2 and y2 respectively; the m groups of second LIG film layers (3) of one group of the damage localization components are arranged in parallel with a lateral spacing c between two adjacent basalt fiber layers (1); the m groups of second LIG film layers (3) of another group of the damage localization components are arranged in parallel with a longitudinal spacing c between two adjacent basalt fiber layers (1); c, m, x1, y1, x2 and y2 satisfy the following formulas: m*y2+(m-1)*c<y1,x2>x1; m*y2+(m-1)*c<x1,x2>y1; The two sets of damage localization components and the first LIG film layer (2) are located in different layers of the basalt fiber layer (1).

2. A basalt fiber laminate panel according to claim 1, characterized in that: The first LIG thin film layer (2) is located at the equal positions of the nth basalt fiber layer (1).

3. A basalt fiber laminate panel according to claim 1, characterized in that: The two sets of damage localization components are located on both sides of the two adjacent sets of basalt fiber layers (1) at the bisection position of the nth layer of the basalt fiber layer (1).

4. The basalt fiber laminate panel of claim 1, wherein: The mass ratio of epoxy resin to curing agent in the epoxy resin solution is 100:26.

7.

5. A process for the preparation of a basalt fiber laminate panel for the preparation of a basalt fiber laminate panel according to any one of claims 1 to 4, characterized in that: Includes the following steps: Preparation of a first LIG thin film layer (2) and a second LIG thin film layer (3): A first LIG thin film layer (2) and a second LIG thin film layer (3) are prepared on a PI film; the length and width of the first LIG thin film layer (2) are x1 and y1, respectively; the length and width of the second LIG thin film layer (3) are x2 and y2, respectively. Cutting the basalt fiber layer (1): Cut the basalt fiber layer (1) to the same size as the first LIG film layer (2); Laying basalt fiber laminate: Each basalt fiber layer (1) is impregnated in an epoxy resin solution, and the impregnated basalt fiber layer (1) is laid layer by layer. During the laying process, the first LIG film layer (2) and the second LIG film layer (3) are inserted into the corresponding layers to form a LIG / BF / EP laminate. Curing LIG / BF / EP laminate: Place the LIG / BF / EP laminate in a sealed bag, seal it, and vacuum it before curing.

6. A method of manufacturing a basalt fiber laminate panel according to claim 5, characterized in that: The insertion method of the second LIG film layer (3) is as follows: the 2m LIG film layer is divided into two groups. The LIG film layer of one group is inserted into the two adjacent basalt fiber layers (1) with the horizontal spacing c in parallel. The LIG film layer of the other group is inserted into the two adjacent basalt fiber layers (1) with the vertical spacing c in parallel. The two groups are located in different layers of the basalt fiber layer (1). c, m, x1, y1, x2 and y2 satisfy the following formulas: m*y2+(m-1)*c<y1,x2>x1; m*y2+(m-1)*c<x1,x2>y1.

7. The method for preparing a basalt fiber laminate according to claim 5, characterized in that: The specific curing method is as follows: the LIG / BF / EP laminate is placed on a hot press, and under the support of a mold, it is pressed and cured at 120°C for 17 hours and at 180°C for 2 hours.

8. The method for preparing a basalt fiber laminate according to claim 5, characterized in that: The specific method for preparing the first LIG thin film layer (2) and the second LIG thin film layer (3) on the PI thin film is as follows: Draw the LIG graphic to be printed in CorelDRAW software; Import the drawn LIG pattern into the laser printer, set the laser parameters, and print a LIG film on both sides of a PI substrate with a thickness of 150 micrometers.

9. A method of manufacturing a basalt fiber laminate panel according to claim 8, characterized in that: The laser parameters include a laser power of 7.5W, a laser scanning speed of 0.19 m / s, a pixel density of 700 PPI, and a Z-axis distance of 0.039".

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