High-strength heat-conducting silica gel

Abstract

This invention discloses a high-strength thermally conductive silicone rubber, comprising, from bottom to top, a lower silicone layer, a lower glass fiber layer, a resin layer, an upper glass fiber layer, and an upper silicone layer. The resin layer has a copper wire mesh laid flat inside, and at least two protrusions extending to and fixed to the edge of the resin layer are provided around the copper wire mesh. On the side of the resin layer connecting to the upper glass fiber layer, at least two upper insertion strips with protrusions penetrating the upper glass fiber layer and extending into the interior of the upper silicone layer are provided. The upper insertion strips have upper limit blocks with protrusions embedded and fixed inside the upper silicone layer. On the side of the resin layer connecting to the lower glass fiber layer, at least two lower insertion strips with protrusions penetrating the lower glass fiber layer and extending into the interior of the lower silicone layer are provided. The lower insertion strips have lower limit blocks with protrusions embedded and fixed inside the lower silicone layer. Adding a copper wire mesh inside the resin layer not only improves the internal thermal conductivity but also enhances the stability of the internal structure and prevents deformation of the thermally conductive silicone rubber.

Description

Technical Field

[0001] This invention relates to the field of silicone technology, specifically to a high-strength thermally conductive silicone. Background Technology

[0002] In daily life, people use a wide variety of electronic products, and all electronic products involve heat dissipation issues. This is because the temperature of electronic components in electronic products will rise during use, especially transistors and some semiconductor components, which are particularly prone to heat generation. When the operating temperature of electronic components is very high, it will lead to a decrease in the performance of electronic components, so it is necessary to dissipate heat from electronic components.

[0003] When connecting heat dissipation components and heat generation components, it is usually necessary to fill the gap between the heat generation components and heat dissipation components with filler materials and thermally conductive materials. However, existing thermally conductive silicone materials have insufficient internal compactness and rely entirely on the properties of silicone itself for heat conduction, resulting in poor heat conduction. In addition, when the silicone moves between components during connection and friction occurs, it is easily deformed due to compression and has insufficient pressure resistance. Summary of the Invention

[0004] To overcome the shortcomings of existing technical solutions, this invention provides a high-strength thermally conductive silicone, which can effectively solve the problems of poor thermal conductivity and poor compressive strength of current silicone.

[0005] The technical solution adopted by this invention to solve its technical problem is:

[0006] A high-strength thermally conductive silicone rubber includes, from bottom to top, a lower silicone rubber layer, a lower glass fiber layer, a resin layer, an upper glass fiber layer, and an upper silicone rubber layer. The resin layer has a copper wire mesh laid flat inside, and the copper wire mesh has at least two protrusions extending to the edge of the resin layer and fixed around its perimeter. The side of the resin layer connected to the upper glass fiber layer has at least two upper insertion strips with protrusions penetrating the upper glass fiber layer and extending into the interior of the upper silicone rubber layer. The upper insertion strips have upper limit blocks with protrusions embedded in the interior of the upper silicone rubber layer and fixed. The side of the resin layer connected to the lower glass fiber layer has at least two lower insertion strips with protrusions penetrating the lower glass fiber layer and extending into the interior of the lower silicone rubber layer. The lower insertion strips have lower limit blocks with protrusions embedded in the interior of the lower silicone rubber layer and fixed.

[0007] Furthermore, the resin layer is also provided with a loading groove for placing copper wire mesh.

[0008] Furthermore, both the upper and lower insert strips have copper rings that are tightly fitted and fixed to their outer surfaces.

[0009] Furthermore, the width of the upper limit block is greater than the width of the upper insertion bar, and the width of the lower limit block is greater than the width of the lower insertion bar.

[0010] Furthermore, both the upper and lower silicone layers are covered with a removable protective film.

[0011] Compared with the prior art, the beneficial effects of the present invention are:

[0012] This invention adds a copper wire mesh inside the resin layer. In addition to improving the internal heat conduction through its own properties, the copper wire mesh can also enhance the stability of the internal structure, prevent the thermally conductive silicone from deforming, and improve its compressive strength. At the same time, the upper and lower sides of the resin layer are reinforced with insert strips and limiting blocks that are fixed inside the silicone layers on both sides, thereby improving the thermal conductivity. The overall structure is simple and highly practical. Attached Figure Description

[0013] Figure 1 This is a schematic diagram of the external structure of a high-strength thermally conductive silicone rubber according to the present invention;

[0014] Figure 2 This is a schematic diagram of the internal cross-sectional structure of a high-strength thermally conductive silicone rubber according to the present invention;

[0015] Figure 3 This is a schematic diagram of the distribution structure of a high-strength thermally conductive silicone copper wire mesh according to the present invention;

[0016] Figure 4 This is a schematic diagram of a high-strength thermally conductive silicone pad storage groove according to the present invention;

[0017] Numbering on the map:

[0018] 1-Lower silicone layer, 2-Lower glass fiber layer, 3-Resin layer, 4-Upper glass fiber layer, 5-Upper silicone layer, 6-Copper wire mesh, 7-Protrusion, 8-Upper insertion strip, 9-Upper limit block, 10-Lower insertion strip, 11-Lower limit block, 12-Loading groove, 13-Copper ring, 14-Protective film layer. Detailed Implementation

[0019] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0020] like Figure 1-4As shown, this invention provides a high-strength thermally conductive silicone, mainly used for heat conduction. It can be adhered to adjacent components where heat conduction is required. It includes a lower silicone layer 1, a lower glass fiber layer 2, a resin layer 3, an upper glass fiber layer 4, and an upper silicone layer 5 stacked sequentially from bottom to top. These five layers are the main base layer of the silicone. The resin layer 3 can be a thermally conductive epoxy resin, which has high thermal conductivity and excellent insulation. The thermal conductivity is further improved by combining the glass fiber layers on both sides with the silicone layer.

[0021] The resin layer 3 is provided with a copper wire mesh 6 laid flat inside. The copper wire mesh 6 has at least two protrusions 7 extending to the edge of the resin layer 3 and fixed around its perimeter. The copper wire mesh 6 laid flat inside the resin layer 3 forms a mesh structure. The structure of the copper wire mesh 6 spreading out on all four sides of the resin layer 3 improves the internal compressive strength. In order to fix the copper wire mesh 6 more firmly inside the resin layer 3, a placement groove 12 for placing the copper wire mesh 6 is provided inside the resin layer 3. In this way, the copper wire mesh 6 placed inside can further strengthen and enhance the overall performance.

[0022] The resin layer 3, on the side connected to the upper glass fiber layer 4, has at least two protrusions that penetrate the upper glass fiber layer 4 and extend into the interior of the upper silicone layer 5, forming an upper insertion strip 8. The upper insertion strip 8 has an upper limit block 9 whose protrusion is embedded and fixed inside the upper silicone layer 5. The resin layer 3, on the side connected to the lower glass fiber layer 2, has at least two protrusions that penetrate the lower glass fiber layer 2 and extend into the interior of the lower silicone layer 1, forming a lower insertion strip 10. The lower insertion strip 10 has a lower limit block 11 whose protrusion is embedded and fixed inside the lower silicone layer 1. The upper and lower parts of the resin layer 3 have these structures. To form a symmetrical structure, the resin layer 3 must be tightly connected to the silicone layers on both sides. An upper insertion strip 8 and a lower insertion strip 10 extending into the upper silicone layer 5 and the lower silicone layer 1, respectively, are provided and fixed by a wider upper limit block 9 and a lower limit block 11. The upper insertion strip 8 and the lower insertion strip 10 can be cylindrical or cuboid. At the same time, copper rings 13 are fitted on the outside of the insertion strips at both ends. In addition to enhancing the heat conduction effect, the copper rings 13 also provide good anti-compression effect and prevent the silicone from deforming after being squeezed to a certain extent.

[0023] Both the upper silicone layer 5 and the lower silicone layer 1 are covered with a removable protective film layer 14. The protective film layer 14 can be a transparent film. When the thermal conductive silicone needs to be used, the protective film layer 14 on the surface can be peeled off. This also prevents the thermal conductive silicone from getting dusty before it is used, which would affect its performance.

[0024] Compared with traditional technology, this technical solution adds copper wire mesh 6 inside the resin layer 3. In addition to improving the internal heat conduction effect through its own performance, the copper wire mesh 6 can also enhance the stability of the internal structure, prevent the thermally conductive silicone from deforming, and improve its compressive strength. At the same time, the upper and lower sides of the resin layer 3 are reinforced with insert strips and limiting blocks that are fixed inside the silicone layers on both sides, thereby improving the tightness between them and enhancing the heat conduction effect.

[0025] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the invention can be implemented in other specific forms without departing from its spirit or essential characteristics. Therefore, the embodiments should be considered in all respects as exemplary and non-limiting, and the scope of the invention is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be included within the present invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. A high-strength thermally conductive silicone rubber, comprising a lower silicone rubber layer, a lower glass fiber layer, a resin layer, an upper glass fiber layer, and an upper silicone rubber layer stacked sequentially from bottom to top, characterized in that: The resin layer has a copper wire mesh laid flat inside, and the copper wire mesh has at least two protrusions extending to the edge of the resin layer and fixed around its perimeter. The side of the resin layer connected to the upper glass fiber layer has at least two protrusions that penetrate the upper glass fiber layer and extend into the upper silicone layer as upper insertion strips. The upper insertion strips have upper limit blocks with protrusions that are fixed inside the upper silicone layer. The side of the resin layer connected to the lower glass fiber layer has at least two protrusions that penetrate the lower glass fiber layer and extend into the lower silicone layer as lower insertion strips. The lower insertion strips have lower limit blocks with protrusions that are fixed inside the lower silicone layer.

2. The high-strength thermally conductive silicone according to claim 1, characterized in that: The resin layer is also provided with a loading groove for placing copper wire mesh.

3. The high-strength thermally conductive silicone according to claim 1, characterized in that: Both the upper and lower insert strips have copper rings fitted tightly to their outer surfaces.

4. The high-strength thermally conductive silicone according to claim 1, characterized in that: The width of the upper limit block is greater than the width of the upper insertion bar, and the width of the lower limit block is greater than the width of the lower insertion bar.

5. The high-strength thermally conductive silicone according to claim 1, characterized in that: Both the upper and lower silicone layers are covered with a removable protective film.

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