An airborne optoelectronic load-bearing device with a vibration-damping structure

Abstract

This invention discloses an airborne optoelectronic payload carrier with a vibration damping structure, including an optoelectronic payload module and a mounting frame. Mirror-shaped fixing plates are vertically fixed to both sides of the bottom of the mounting frame. Snap-fit ​​components are provided on both sides of the mirror-shaped fixing plates, and a carrier housing is snapped into place by these components. A vibration damping component is located inside the carrier housing, and the optoelectronic payload module is held in place by the vibration damping component. The mounting frame and the carrier housing are also equipped with a heat dissipation component. The airborne optoelectronic payload carrier of this invention is equipped with snap-fit ​​components, vibration damping components, and heat dissipation components. The snap-fit ​​components allow for one-step installation / removal of the airborne optoelectronic payload device, while the heat dissipation component can be used with flight platforms such as UAVs and helicopters to guide airflow during flight into the airborne optoelectronic payload device for ventilation and heat dissipation.

Description

Technical Field

[0001] This invention relates to the field of airborne optoelectronic payloads, and in particular to an airborne optoelectronic payload bearing device with a vibration damping structure. Background Technology

[0002] Airborne optoelectronic payloads are equipped on fixed-wing aircraft, helicopters, and unmanned aerial vehicles (UAVs), employing optoelectronic detection technology, laser imaging technology, image stabilization search technology, image processing technology, and target tracking and positioning technology to perform combat missions such as battlefield situational awareness, target detection and positioning, weapon guidance, and strike effect assessment. As a sensor for aircraft battlefield information, situational awareness, and guided weapon guidance, it has become crucial equipment for achieving "wide-area search, long-range detection, accurate positioning, rapid destruction, and real-time assessment" for aircraft. With advancements in aircraft platform combat performance—stealth, high-altitude, high-speed, and panoramic perception, intelligent decision-making, and collaborative operations—the development of airborne optoelectronic payloads should possess the following characteristics: precision in achieving multi-spectral detection, high-precision target positioning, and accurate aiming of guided weapons; miniaturization, with multiple types of optoelectronic sensors, high performance indicators, and small system size; intelligence in providing high-value, multi-dimensional battlefield situational awareness and target intelligence information for aircraft decision-making systems; and multi-tasking integration in achieving panoramic perception, optoelectronic countermeasures, air / air-to-air / area target search and tracking, and target positioning and aiming. Therefore, airborne optoelectronic payloads have become important information and weapon nodes of aircraft systems, carrying out the entire combat chain mission of "search-detection-lock-track-strike-assessment".

[0003] Airborne optoelectronic payload devices need to be replaced or maintained before performing different tasks on platforms such as drones and helicopters. However, the traditional installation method of airborne optoelectronic payload carrier equipment is time-consuming, and the internal heat dissipation problem of the various sensors inside the airborne optoelectronic payload needs to be solved. Summary of the Invention

[0004] In order to overcome the shortcomings of the prior art, the present invention provides an airborne optoelectronic load-bearing device with a vibration-damping structure to solve the problems mentioned in the background art, such as the time-consuming installation method of traditional airborne optoelectronic load-bearing devices and the urgent need to solve the internal heat dissipation problem.

[0005] To solve the above-mentioned technical problems, the present invention provides the following technical solution: an airborne optoelectronic load bearing device with a vibration damping structure, including an optoelectronic load module and a mounting frame. Mirror-shaped fixing plates are vertically fixed on both sides of the bottom of the mounting frame. Snap-fit ​​components are provided on both sides of the mirror-shaped fixing plates, and a bearing shell is snapped onto them through the snap-fit ​​components. Vibration damping components are provided inside the bearing shell, and the optoelectronic load module is clamped by the vibration damping components. The mounting frame and the bearing shell are also provided with heat dissipation components.

[0006] Preferably, the supporting shell is a horizontally arranged cylinder, and the top and bottom arc surfaces are respectively provided with planes.

[0007] Preferably, the snap-fit ​​assembly includes a first bearing and a turntable. The first bearing is mirror-mounted and fixed through the center of both sides of the bearing housing. The turntable is mirror-mounted and rotatably connected to the mirror-mounted first bearing. A snap-fit ​​groove is provided on the opposite side of the mirror-mounted turntable.

[0008] Preferably, the snap-fit ​​assembly further includes a through hole, a groove, a spring, a connecting plate, a second bearing, a rotating shaft, and a pull plate; the through hole is mirror-imagely formed on both sides of the mirror-image fixed plate and coaxial with the mirror-image snap-fit ​​groove; several grooves are provided and mirror-imagely formed on the opposite side of the mirror-image fixed plate, located on both sides of the through hole; several springs are provided and each is fixed at one end inside the groove and extends to the outside of the groove; the connecting plate is mirror-imagely set and fixed at the other end of several springs on the opposite side of the mirror-image fixed plate; the second bearing is mirror-imagely set and passes through both sides of the mirror-image connecting plate, and the inner diameter of the second bearing is the same as the diameter of the through hole; the rotating shaft is mirror-imagely set and rotatably connected to the second bearing at one end, and snaps into the snap-fit ​​groove through the through hole at the other end; the pull plate is mirror-imagely set and fixed to the outer side of the mirror-image connecting plate.

[0009] Preferably, both the slot and the shaft are regular hexagons, and the diameter of the through hole matches the maximum diameter of the regular hexagonal shaft.

[0010] Preferably, the vibration damping assembly includes vibration dampers, support plates, and silicone tubes; four vibration dampers are provided and fixed to the inner top and inner bottom of the bearing housing respectively; four support plates are L-shaped, and the four L-shaped support plates form a rectangle and are supported at the four corners of the photoelectric load module through their inner right angle surfaces, and are respectively installed with the four vibration dampers through their outer surfaces; the silicone tubes are mirror-shaped and fixed to the inner two sides of the bearing housing respectively, with one end of the mirror-shaped silicone tube being coaxial with the turntable of the snap-fit ​​assembly, and the other end abutting against both sides of the photoelectric load module.

[0011] Preferably, the inner diameter of the silicone tube is larger than the outer diameter of the turntable, and a motor is fixed inside by a fixing bracket, with the output shaft of the motor being coaxially fixed to one side of the turntable.

[0012] Preferably, the heat dissipation assembly includes a first air inlet, an air outlet, a ventilation cavity, a guide plate, a second air inlet, and heat dissipation holes; the first air inlet is mirror-imagely formed on the front of the mounting bracket; the air outlet is formed on the bottom of the mounting bracket; the ventilation cavity is formed inside the mounting bracket and communicates with the mirror-image first air inlet and air outlet respectively; the guide plate is fixed inside the ventilation cavity and located above the air outlet; the second air inlet is formed through the top of the supporting housing and corresponds to the air outlet; a plurality of heat dissipation holes are provided and are formed through the bottom of the supporting housing.

[0013] Preferably, the first air inlet and the second air inlet, as shown in the mirror image, are each equipped with rotatable fan blades.

[0014] Preferably, a mounting plate is fixed to the top of the mounting bracket, and several transparent observation ports are provided on the front of the supporting housing.

[0015] Compared with the prior art, the beneficial effects that the present invention can achieve are: the airborne optoelectronic payload carrying device of the present invention is provided with a snap-fit ​​component, a vibration damping component and a heat dissipation component. The snap-fit ​​component can realize one-step disassembly / assembly of the airborne optoelectronic payload device, and its heat dissipation component can be used with flight platforms such as UAVs and helicopters to guide the airflow during flight to the interior of the airborne optoelectronic payload device for ventilation and heat dissipation. Attached Figure Description

[0016] Figure 1 This is a front sectional view of the present invention;

[0017] Figure 2 This is a front view of the present invention;

[0018] Figure 3 For the present invention Figure 1 Enlarged view of point A;

[0019] Figure 4 This is a side view of the housing of the present invention;

[0020] Figure 5 This is a schematic diagram of the present invention after the supporting outer shell has been disassembled.

[0021] The components include: 1. Mounting bracket; 2. Fixing plate; 3. Bearing housing; 4. Photoelectric load module; 5. Snap-fit ​​assembly; 6. First bearing; 7. Turntable; 8. Perforation; 9. Groove; 10. Spring; 11. Connecting plate; 12. Second bearing; 13. Shaft; 14. Slot; 15. Pull plate; 16. Vibration damping assembly; 17. Vibration damper; 18. Support plate; 19. Silicone sleeve; 20. Fixing bracket; 21. Motor; 22. Heat dissipation assembly; 23. First air inlet; 24. Air outlet; 25. Second air inlet; 26. Heat dissipation hole; 27. Ventilation cavity; 28. Guide plate; 29. ​​Mounting plate; 30. Observation port. Detailed Implementation

[0022] To make the technical means, creative features, and achieved objectives and effects of this invention easier to understand, the invention is further described below with reference to specific embodiments. However, the following embodiments are merely preferred embodiments of this invention and not all of them. Other embodiments obtained by those skilled in the art based on the embodiments described herein without creative effort are all within the protection scope of this invention. Unless otherwise specified, the experimental methods in the following embodiments are conventional methods, and the materials and reagents used in the following embodiments are commercially available unless otherwise specified. Example

[0023] like Figure 1-5 As shown, the present invention provides an airborne optoelectronic load bearing device with a vibration damping structure, including an optoelectronic load module 4 and a mounting frame 1. The mounting frame 1 has mirrored fixing plates 2 vertically fixed on both sides of its bottom. The mirrored fixing plates 2 have snap-fit ​​components 5 on both sides, and a bearing shell 3 is snapped onto them through the snap-fit ​​components 5. The bearing shell 3 has a vibration damping component 16 inside, and the optoelectronic load module 4 is clamped by the vibration damping component 16. The mounting frame 1 and the bearing shell 3 are also provided with a heat dissipation component 22.

[0024] The optoelectronic payload module 4 is based on existing technology and includes an encapsulated optical system: this part consists of components such as a telescope, camera, infrared camera, laser rangefinder, and high-resolution camera; an electronic system: this part consists of electronic devices such as a signal processor, image processor, memory, and power supply; a data link: this part consists of space communication equipment and telemetry and remote control equipment; and a mechanical structure: this part consists of the payload's own protective cover, support structure, and stabilization device.

[0025] In this embodiment, specifically, the supporting outer shell 3 is a horizontally arranged cylinder, and the top and bottom arc surfaces are respectively provided with planes;

[0026] By setting a cylindrical support shell 3 and providing flat surfaces at the top and bottom, the drag of the shell during flight can be reduced, and the flat surfaces facilitate the placement of the support shell 3.

[0027] In this embodiment, specifically, the snap-fit ​​assembly 5 includes a first bearing 6 and a turntable 7. The first bearing 6 is mirror-mounted and fixed through the center of both sides of the bearing housing 3. The turntable 7 is mirror-mounted and rotatably connected to the mirror-mounted first bearing 6. A slot 14 is provided on the opposite side of the mirror-mounted turntable 7.

[0028] In this embodiment, specifically, the snap-fit ​​assembly 5 further includes a through hole 8, a groove 9, a spring 10, a connecting plate 11, a second bearing 12, a rotating shaft 13, and a pull plate 15; the through hole 8 is mirror-through and opened on both sides of the mirror-image fixing plate 2, and is coaxial with the mirror-image snap-fit ​​groove 14 respectively; several grooves 9 are provided, and are mirror-through and opened on the opposite side of the mirror-image fixing plate 2, and are located on both sides of the through hole 8; several springs 10 are provided, and are fixed at one end inside the groove 9, and the other end extends to the outside of the groove 9; the connecting plate 11 is mirror-image and is fixed to the other end of several springs 10 on the opposite side of the mirror-image fixing plate 2 respectively; the second bearing 12 is mirror-image and is fixed through both sides of the mirror-image connecting plate 11, and the inner diameter of the second bearing 12 is the same as the diameter of the through hole 8; the rotating shaft 13 is mirror-image and is rotatably connected to the second bearing 12 at one end, and is snap-fitted into the snap-fit ​​groove 14 through the through hole 8 at the other end; the pull plate 15 is mirror-image and is fixed to the outside of the mirror-image connecting plate 11 respectively;

[0029] The rotating shaft 13 mounted on the fixed plate 2 of the snap-fit ​​assembly 5 is snapped into the turntable 7 mounted on the carrier housing 3, thereby installing the carrier housing 3. The main body of the carrier device of the present invention includes a mounting frame 1, a fixed plate 2 and a carrier housing 3.

[0030] In this embodiment, specifically, both the slot 14 and the rotating shaft 13 are regular hexagons, and the diameter of the through hole 8 matches the maximum diameter of the regular hexagonal rotating shaft 13.

[0031] In this embodiment, specifically, the vibration damping assembly 16 includes vibration dampers 17, support plates 18, and silicone tubes 19; four vibration dampers 17 are provided and are respectively mirror-fixed to the inner top and inner bottom of the bearing housing 3; four support plates 18 are L-shaped and are provided, and the four L-shaped support plates 18 form a rectangle and are respectively supported at the four corners of the photoelectric load module 4 through the inner right angle surface, and are respectively installed with the four vibration dampers 17 through the outer side; the silicone tubes 19 are mirror-set and respectively fixed to the inner two sides of the bearing housing 3, one end of the mirror-set silicone tube 19 is coaxial with the turntable 7 of the snap-fit ​​assembly 5, and the other end abuts against the two sides of the photoelectric load module 4;

[0032] The vibration reduction structure of the present invention is a vibration reduction component 16, wherein the vibration damper 17 is the prior art. The vibration damper 17 and the support plate 18 provide vibration reduction support for the top and bottom of the packaged optoelectronic load module 4, and the silicone tube 19 provides vibration reduction support for both sides of the packaged optoelectronic load module 4.

[0033] In this embodiment, specifically, the inner diameter of the silicone tube 19 is larger than the outer diameter of the turntable 7, and a motor 21 is fixed inside by a fixing bracket 20. The output shaft of the motor 21 is coaxially fixed with one side of the turntable 7.

[0034] In this embodiment, specifically, the heat dissipation assembly 22 includes a first air inlet 23, an air outlet 24, a ventilation cavity 27, a guide plate 28, a second air inlet 25, and heat dissipation holes 26; the first air inlet 23 is mirror-imagely formed on the front of the mounting bracket 1; the air outlet 24 is formed on the bottom of the mounting bracket 1; the ventilation cavity 27 is formed inside the mounting bracket 1 and communicates with the mirror-image first air inlet 23 and air outlet 24 respectively; the guide plate 28 is fixed inside the ventilation cavity 27 and located above the air outlet 24; the second air inlet 25 is formed through the top of the supporting housing 3 and corresponds to the air outlet 24; several heat dissipation holes 26 are provided and are formed through the bottom of the supporting housing 3.

[0035] When the device of the present invention is installed on an aircraft, the airflow during flight enters the two first air inlets 23 and then enters the ventilation cavity 27. After being guided by the guide plate 28, it enters the second air inlet 25. After the airflow enters the supporting shell 3, it drives the internal heat to flow to the heat dissipation hole 26 for discharge.

[0036] In this embodiment, specifically, the first air inlet 23 and the second air inlet 25, as shown in the mirror image, are respectively provided with rotatable fan blades.

[0037] In this embodiment, specifically, the top of the mounting bracket 1 is fixed with a mounting plate 29, and the front of the bearing housing 3 is provided with several transparent observation ports 30.

[0038] Working principle: During use, the bearing housing 3 is disassembled and installed by using the snap-fit ​​assembly 5. During installation, pull the two pull plates 15 to both sides to move the connecting plate 11 and the rotating shaft 13 and stretch the spring 10, placing the bearing housing 3 between the two fixed plates 2. Then release the two pull plates 15 to reset the spring 10 and move the connecting plate 11 and the rotating shaft 13 to reset, so that one end of the rotating shaft 13 abuts against the turntable 7 of the bearing housing 3. Since the slot 14 of the rotating shaft 13 and the turntable 7 is a regular hexagon, it is not 100% perfectly snapped. The rotating shaft 7 is driven to rotate by the motor 21 until the hexagonal slot 14 of the turntable 7 matches the hexagonal rotating shaft 13, automatically snapping and completing the installation. During disassembly, pull the two pull plates 15 to remove the bearing housing 3 from the limit.

[0039] When installed on the aircraft via mounting plate 29, the airflow during flight enters the two first air inlets 23 and then enters the ventilation cavity 27. After being guided by the guide plate 28, it enters the second air inlet 25. After entering the supporting shell 3, the airflow drives the internal heat to the heat dissipation hole 26 for discharge, thus completing the heat dissipation.

[0040] The vibration damper 17 and silicone tube 19 inside the housing 3 provide vibration damping support for the encapsulated optoelectronic load module 4.

[0041] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. An airborne optoelectronic load-bearing device with a vibration-damping structure, comprising an optoelectronic load module (4), characterized in that: It also includes a mounting bracket (1), on which mirror-image fixing plates (2) are vertically fixed on both sides of the bottom. The mirror-image fixing plates (2) have snap-fit ​​components (5) on both sides, and a bearing housing (3) is snapped into place by the snap-fit ​​components (5). A vibration damping component (16) is provided inside the bearing housing (3), and the photoelectric load module (4) is held in place by the vibration damping component (16). The mounting bracket (1) and the bearing housing (3) are also provided with a heat dissipation component (22). The snap-fit ​​component (5) includes a first bearing (6) and a turntable (…). 7), the first bearing (6) is mirror-mounted and fixed to the center of both sides of the bearing housing (3), the turntable (7) is mirror-mounted and rotatably connected to the mirror-mounted first bearing (6), and the opposite side of the mirror-mounted turntable (7) is provided with a slot (14), the snap-fit ​​assembly (5) also includes a through hole (8), a groove (9), a spring (10), a connecting plate (11), a second bearing (12), a rotating shaft (13) and a pull plate (15); the through hole (8) is mirror-mounted through the fixed plate of the mirror-mounted (6). 2) Both sides, and coaxial with the mirrored slot (14); the groove (9) is provided in several places, and is opened on the opposite side of the mirrored fixing plate (2), and is located on both sides of the through hole (8); the spring (10) is provided in several places, and is fixed inside the groove (9) at one end and extends to the outside of the groove (9) at the other end; the connecting plate (11) is mirrored and fixed to the other end of the spring (10) on the opposite side of the mirrored fixing plate (2); the second bearing (12) is mirrored and is respectively The connecting plate (11) is fixed through both sides of the fixed mirror image, and the inner diameter of the second bearing (12) is the same as the diameter of the through hole (8); the rotating shaft (13) is mirror image set and is rotatably connected to the second bearing (12) through one end, and is engaged with the slot (14) through the through hole (8) through the other end; the pull plate (15) is mirror image set and is fixed to the outside of the mirror image connecting plate (11), the slot (14) and the rotating shaft (13) are both regular hexagons, and the diameter of the through hole (8) matches the maximum diameter of the regular hexagonal rotating shaft (13).

2. The airborne optoelectronic load-bearing device with a vibration-damping structure according to claim 1, characterized in that: The supporting outer shell (3) is a horizontally arranged cylinder, and the top and bottom arc surfaces are respectively provided with planes.

3. The airborne optoelectronic load-bearing device with a vibration-damping structure according to claim 1, characterized in that: The vibration damping assembly (16) includes a vibration damper (17), a support plate (18), and a silicone tube (19). The vibration damper (17) is provided in four parts and is fixed to the inner top and inner bottom of the bearing shell (3) respectively. The support plate (18) is L-shaped and is provided in four parts. The four L-shaped support plates (18) form a rectangle and are supported at the four corners of the photoelectric load module (4) through the inner right angle surface. They are installed with the four vibration dampers (17) through the outer side respectively. The silicone tube (19) is set in a mirror image and is fixed to the inner two sides of the bearing shell (3). One end of the silicone tube (19) is coaxial with the turntable (7) of the snap-fit ​​assembly (5) and the other end abuts against the two sides of the photoelectric load module (4).

4. The airborne optoelectronic load-bearing device with a vibration-damping structure according to claim 3, characterized in that: The inner diameter of the silicone tube (19) is larger than the outer diameter of the turntable (7), and a motor (21) is fixed inside by a fixing bracket (20). The output shaft of the motor (21) is coaxially fixed with one side of the turntable (7).

5. An airborne optoelectronic load-bearing device with a vibration-damping structure according to claim 1, characterized in that: The heat dissipation assembly (22) includes a first air inlet (23), an air outlet (24), a ventilation cavity (27), a guide plate (28), a second air inlet (25), and heat dissipation holes (26); the first air inlet (23) is mirror-image opened on the front of the mounting bracket (1); the air outlet (24) is opened at the bottom of the mounting bracket (1); the ventilation cavity (27) is opened inside the mounting bracket (1) and communicates with the mirror-image first air inlet (23) and air outlet (24) respectively; the guide plate (28) is fixed inside the ventilation cavity (27) and located above the air outlet (24); the second air inlet (25) is opened through the top of the supporting shell (3) and corresponds to the air outlet (24); a plurality of heat dissipation holes (26) are provided and are opened through the bottom of the supporting shell (3).

6. An airborne optoelectronic load-bearing device with a vibration-damping structure according to claim 5, characterized in that: The first air inlet (23) and the second air inlet (25) described in the mirror image are each equipped with rotatable fan blades.

7. An airborne optoelectronic load-bearing device with a vibration-damping structure according to claim 1, characterized in that: The mounting bracket (1) is fixed with a mounting plate (29) on top, and the front of the supporting shell (3) is provided with several transparent observation ports (30).

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