A chip packaging defect detection method and device based on infrared thermal imaging

Abstract

The invention relates to the field of chip detection technology, and specifically to a chip packaging defect detection device based on infrared thermal imaging, comprising a carrier plate, the carrier plate being connected to a No. 1 air pump, a plurality of groups of No. 1 through grooves being provided on the upper end surface of the carrier plate, an adjustment component being provided on the groove wall of the No. 1 through groove, the adjustment component comprising an air bag, a pushing block, a traction bar and a telescopic mechanism, the air bag being connected to the No. 1 air pump through a first conduit, a pushing block being fixedly connected to the surface of the air bag, the pushing block and the traction bar being respectively arranged on both sides of the No. 1 through groove and being arranged oppositely, a telescopic mechanism being fixedly connected to the end surface of the traction bar, a guide component being further provided at the lower end of the carrier plate, a conveying device being provided below the guide component, and a detection module being provided at the output end of the conveying device, and when the present invention detects the chip, chips in different placement states can be adjusted to a unified placement state, thereby improving the detection efficiency of the chip and saving manpower.

Description

Technical Field

[0001] The present invention relates to the field of chip detection technology, and in particular to a chip packaging defect detection method and device based on infrared thermal imaging. Background Art

[0002] When existing chips are produced, they need to be packaged. The packaged chips are often inspected for defects in chip packaging through infrared thermal imaging. The following problems often exist when inspecting packaging defects of existing packaged chips: When inspecting packaging defects of existing packaged chips, in order to improve inspection efficiency, neatly arranged chips are often sent to inspection equipment for inspection. However, before the inspection, the existing chips are placed in different states and need to be placed manually, which increases the workload of employees. Summary of the invention

[0003] The present invention provides a chip packaging defect detection device based on infrared thermal imaging, which solves the technical problem of chip packaging defect detection in the related art.

[0004] According to one aspect of the present invention, there is provided a chip packaging defect detection device based on infrared thermal imaging, comprising a carrier plate, the carrier plate being connected to a No. 1 air pump, a plurality of groups of No. 1 through grooves being provided on the upper end surface of the carrier plate, the No. 1 through grooves being arranged at intervals along the length direction of the carrier plate, an adjustment component being provided on the groove wall of the No. 1 through groove, the adjustment component comprising an air bag, a pushing block, a traction bar and a telescopic mechanism, the air bag being connected to the No. 1 air pump through a first conduit, a pushing block being fixedly connected to the surface of the air bag, the pushing block and the traction bar being respectively arranged on both sides of the No. 1 through groove and being arranged oppositely, when the air bag is inflated, the pushing block moves toward the traction bar, the end surface of the traction bar being fixedly connected to the telescopic mechanism, the telescopic mechanism driving the traction bar to slide along the length direction of the No. 1 through groove, a guide component being further provided at the lower end of the carrier plate, the guide component A conveying device is arranged below the part, and a detection module is arranged at the output end of the conveying device; a No. 2 through groove for the carrier to move up and down is also arranged in the guide component, an arc-shaped sinking groove is opened on the upper end surface of the carrier, and the lower end of the carrier is connected to the lifting mechanism through a support rod, and the lifting mechanism drives the carrier to reciprocate up and down, the conveying device includes a base and a belt conveying mechanism, and a avoidance groove for the carrier to pass through is opened on the base, and the belt conveying mechanism includes a conveyor belt, which is arranged at intervals along the two ends of the avoidance groove, and a plurality of groups of material-shifting straight rods are fixedly connected to the surface of the conveyor belt, and the material-shifting straight rods are arranged at intervals along the conveying track of the conveyor belt, and a gap is left between two adjacent groups of material-shifting straight rods, and the conveyor belt is arranged above the base, and the telescopic end of the lifting mechanism passes through the gap between the base and the surface of the conveyor belt in sequence, and is inserted into the No. 1 through groove.

[0005] As a preferred technical solution of the present invention, the interior of the traction strip is hollow, and a plurality of blowing holes are provided on the plate surface of the traction strip near the No. 1 through groove. The blowing holes are arranged at intervals along the length direction of the traction strip, and the blowing holes are connected to the No. 1 air pump through a second conduit.

[0006] As a preferred technical solution of the present invention, a plurality of expansion members are provided on the plate surface of the traction strip near the No. 1 through groove, and the expansion members are arranged at intervals along the length direction of the traction strip. The expansion members are connected to the No. 1 air pump through a third conduit.

[0007] As a preferred technical solution of the present invention, a through hole is opened in the groove wall of the No. 2 through groove, and a through piece is slidably installed in the through hole, and the through piece can pass through the No. 2 through groove horizontally.

[0008] As a preferred technical solution of the present invention, the cross section of the No. 2 through groove is funnel-shaped.

[0009] As a preferred technical solution of the present invention, the through-piece is a shell structure, and a cam rod is rotatably installed in the through-piece, and the rotation angle of the cam rod is not greater than 90°. Two contact sliders are provided on opposite sides of the cam rod, and the contact sliders are arranged at intervals along the length direction of the through-piece. The contact sliders slide along the radial direction of the through-piece. A reset spring is connected between the contact slider and the through-piece, and an inner push rod is provided between the two contact sliders on the same side. A driving connecting rod is fixedly connected to one end of the cam rod, and a toothed disc is fixedly connected to the end face of the driving connecting rod, and the toothed disc is located on the outer side of the guide frame. The toothed disc is meshingly connected with a rack, and the rack slides along the side wall of the guide frame.

[0010] As a preferred technical solution of the present invention, the supporting member is plate-shaped, an arc-shaped groove is provided on the upper end surface of the supporting member, and yielding grooves are provided at the opposite ends of the supporting member. An extension member is slidably installed in the yielding groove, a restoring spring is connected between the extension member and the yielding groove, and a rotating roller is rotatably installed on the end of the extension member away from the supporting member.

[0011] As a preferred technical solution of the present invention, the ends of the first conduit, the second conduit and the third conduit are all provided with electromagnetic valve components, and the device is also provided with a control device, which is connected to the electromagnetic valve components.

[0012] As a preferred technical solution of the present invention, the detection module includes a thermal infrared imager, and the thermal infrared imager is installed above the base.

[0013] A chip packaging defect detection method based on infrared thermal imaging includes a chip packaging defect detection device based on infrared thermal imaging. The method also includes: passing a chip to be detected through a No. 1 through groove on the surface of a carrier plate, scattering the chip on the surface of a carrier, starting a No. 1 air pump, inflating an air bag through a first conduit, and the air bag expands, pushing a pushing block to slide along the width direction of the No. 1 through groove, the pushing block and a traction bar jointly clamp the chip to be detected, and a telescopic mechanism drives the traction bar to slide along the length direction of an adjustment component, the No. 1 air pump continues to work, the air bag continues to expand, and drives the pushing block to continue to move toward the traction bar, and horizontally rotates the chip to be detected; and then, through a second conduit, gas is introduced into the traction bar to flip the chip to be detected.

[0014] The beneficial effect of the present invention is that the present invention is provided with an adjustment component, which adjusts the chips to be detected scattered on the surface of the carrier, and uniformly adjusts the chips to be detected with different placement states into two states: pins facing down and pins facing up. Thereafter, the chips to be detected with pins facing down are flipped under the action of the penetration piece, and the chips to be detected are uniformly placed into a pin-up state, thereby increasing the chip detection efficiency when the chips are detected, and further reducing the workload of employees. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a structural schematic diagram of the present invention.

[0016] Figure 2 It is a front cross-sectional view of the structural schematic diagram of the present invention.

[0017] Figure 3 It is a schematic structural diagram of the penetration piece of the present invention.

[0018] Figure 4 It is a cross-sectional schematic diagram of the penetration piece of the present invention.

[0019] Figure 5 It is a schematic diagram of the arrangement of the blowing holes and the expansion member on the traction strip of the present invention.

[0020] Figure 6 It is a top view of the load-bearing plate and the structural schematic diagram of the present invention.

[0021] Figure 7 It is a schematic structural diagram of the bearing member of the present invention.

[0022] Figure 8 It is a schematic diagram of the connection between the conveyor belt and the material-shifting straight rod of the present invention.

[0023] Fig. 9 The present invention Figure 2 Schematic diagram of the chip status from perspective.

[0024] In the figure: 1, carrier plate; 11, No. 1 through slot; 12, No. 1 air pump; 2, adjustment assembly; 21, air bag; 22, first conduit; 23, pushing block; 24, traction strip; 241, blowing hole; 243, expansion piece; 25, telescopic mechanism; 3, guide assembly; 31, guide frame; 33, No. 2 through slot; 37, through hole; 38, through piece; 381, cam rod; 382, ​​slider; 383, return spring; 384 , inner push rod; 385, driving connecting rod; 386, toothed disc; 387, rack; 4, bearing member; 41, support rod; 42, lifting mechanism; 43, arc-shaped sink groove; 44, yielding sink groove; 45, extension member; 46, restoring spring; 47, rotating roller; 5, conveying device; 51, base; 52, avoidance groove; 53, conveying mechanism; 54, conveyor belt; 55, material-moving straight rod; 6, detection module; 61, thermal infrared imager. DETAILED DESCRIPTION

[0025] The subject matter described herein will now be discussed with reference to example embodiments. It should be understood that the discussion of these embodiments is only to enable those skilled in the art to better understand and implement the subject matter described herein, and is not a limitation of the scope of protection, applicability or examples set forth in the claims. The functions and arrangements of the elements discussed may be changed without departing from the scope of protection of the contents of this specification. Various examples may omit, replace or add various processes or components as needed. In addition, the features described relative to some examples may also be combined in other examples. Example 1

[0026] See also Figure 1 - Fig. 9As shown, a chip packaging defect detection device based on infrared thermal imaging includes a carrier plate 1, the carrier plate 1 is connected to a No. 1 air pump 12, a plurality of groups of No. 1 through grooves 11 are opened on the upper end surface of the carrier plate 1, and the No. 1 through grooves 11 are arranged at intervals along the length direction of the carrier plate 1, and the groove wall of the No. 1 through groove 11 is provided with an adjustment component 2, and the adjustment component 2 includes an air bag 21, a pushing block 23, a traction bar 24 and a telescopic mechanism 25. The air bag 21 is connected to the No. 1 air pump 12 through a first conduit 22, and the surface of the air bag 21 is fixedly connected with a pushing block 23, and the pushing block 23 and the traction bar 24 are respectively arranged on both sides of the No. 1 through groove 11 and are arranged oppositely. When the air bag 21 expands, the pushing block 23 moves toward the traction bar 24, and the end surface of the traction bar 24 is fixedly connected with the telescopic mechanism 25, and the telescopic mechanism 25 drives the traction bar 24 to slide along the length direction of the No. 1 through groove 11. The lower end of the carrier plate 1 is also provided with a guide component 3, and a guide component 3 is arranged below the guide component 3. There is a conveying device 5, and a detection module 6 is provided at the output end of the conveying device 5; a No. 2 through groove 33 for the carrier 4 to move up and down is also provided in the guide component 3, and an arc-shaped sinking groove 43 is provided on the upper end surface of the carrier 4. The lower end of the carrier 4 is connected to the lifting mechanism 42 through a support rod 41, and the lifting mechanism 42 drives the carrier 4 to reciprocate up and down. The conveying device 5 includes a base 51 and a belt conveying mechanism 53. The base 51 is provided with an avoidance groove 52 for the carrier 4 to pass through. The belt conveying mechanism 53 includes a conveyor belt 54, and the conveyor belt 54 is arranged at intervals along the two ends of the avoidance groove 52. A plurality of groups of material-shifting straight rods 55 are fixedly connected to the surface of the conveyor belt 54. The material-shifting straight rods 55 are arranged at intervals along the conveying track of the conveyor belt 54, and a gap is left between two adjacent groups of material-shifting straight rods 55. The conveyor belt 54 is arranged above the base 51, and the telescopic end of the lifting mechanism 42 sequentially passes through the gaps on the surfaces of the base 51 and the conveyor belt 54, and is inserted into the No. 1 through groove 11.

[0027] Among them, by providing a plurality of No. 1 through slots 11, when the chips to be detected are placed, multiple chips to be detected can be detected at one time, thereby further improving the detection efficiency of the chips to be detected.

[0028] It should be noted that the telescopic mechanism 25 can be any linear moving device, such as a cylinder, an electric telescopic rod, etc. In this embodiment, an electric telescopic rod is selected. The lifting mechanism 42 can be any linear moving device, such as a cylinder, an electric telescopic rod, etc. In this embodiment, a telescopic cylinder is selected.

[0029] In the specific operation, the chip to be tested passes through the first through slot 11 on the surface of the carrier plate 1 and is scattered on the surface of the carrier 4. The chips scattered on the surface of the carrier 4 are as follows: Fig. 9 As shown, there are eight states: A, B, C, D, E, F, G, and H. Fig. 9 The actual Figure 2Schematic diagram of various states of the chip in the No. 1 through groove 11 from the perspective, the above scheme can adjust the chip position in two situations: one, start the No. 1 air pump 12, and introduce gas into the traction strip 24 through the second conduit, and the gas is discharged from the blowing hole 241 on the surface of the traction strip 24, acting on the side of the chip to be detected in the state G and H (close to the upper end surface), the upper surface of the carrier 4 is provided with an arc-shaped sinking groove 43, and the chips are all located in the arc-shaped sinking groove 43. The chip to be detected in the G and H states is affected by the wind and slides in the arc-shaped sinking groove 43 (the arc surface easily causes the chip to tilt), resulting in tipping, so that the chip to be detected changes from the G and H states to the G1 and H1 states; second, the No. 1 air pump 12 inflates the airbag 21 through the first conduit 22, the airbag 21 expands, and pushes the pushing block 23 to slide along the width direction of the adjusting component 2, and the pushing block 23 and the traction strip 24 together clamp the chip to be detected in the A, B, C, D states, and then under the action of the electric telescopic rod, the traction bar 24 is driven to slide along the length direction of the adjustment component 2, and at the same time, the No. 1 air pump 12 continues to supply air, so that the airbag 21 continues to expand, driving the pushing block 23 to continue to move toward the traction bar 24, so that the chip to be detected in the A, B, C, D states rotates, and the chip to be detected is changed to the state of A1, B1, C1, D1. Then, the No. 1 air pump 12 inhales, the airbag 21 contracts, the pushing block 23 is reset, and the electric telescopic rod drives the traction bar 24 to reset. Then, the second conduit is switched to be connected with the No. 1 air pump 12, and then the side walls of the chips in the A1 and B1 states are blown through the blowing holes 241 on the traction bar 24, so that the chip to be detected changes from the A1 and B1 states to the A2 and B2 states, thereby completing the preliminary adjustment of the position of the chip to be detected.

[0030] Optimally, the chip is processed using the adjustment process in the second case.

[0031] Furthermore, the interior of the traction bar 24 is hollow, and a plurality of groups of blowing holes 241 are provided on the plate surface of the traction bar 24 close to the No. 1 through groove 11. The blowing holes 241 are arranged at intervals along the length direction of the traction bar 24, and the blowing holes 241 are connected to the No. 1 air pump 12 through a second conduit.

[0032] Furthermore, a plurality of expansion members 243 are provided on the plate surface of the traction bar 24 close to the No. 1 through groove 11. The expansion members 243 are arranged at intervals along the length direction of the traction bar 24. The expansion members 243 are connected to the No. 1 air pump 12 through a third conduit.

[0033] It should be noted that the No. 1 air pump 12 is connected to the third conduit through the electromagnetic valve component, and the third conduit is connected to the expansion member 243. When the airbag 21 expands and the pushing block 23 moves, the No. 1 air pump 12 inflates the expansion member 243 through the third conduit, so that it protrudes from the surface of the traction strip 24, which facilitates the traction strip 24 to slide along the length direction of the adjustment component 2, and when the pushing block 23 slides to one side of the traction strip 24, the protrusion of the expansion member 243 can assist the chip to be detected in the A, B, C, D state to rotate to the A1, B1, C1, D1 state, thereby improving the efficiency of the chip to be detected when the state changes.

[0034] Furthermore, a through hole 37 is formed in the groove wall of the No. 2 through groove 33 , and a through piece 38 is slidably installed in the through hole 37 . The through piece 38 can pass through the No. 2 through groove 33 horizontally.

[0035] It should be noted that the penetration piece 38 can be connected to a telescopic device, which can be any linear moving device, such as a cylinder, an electric telescopic rod, etc. The telescopic device drives the penetration piece 38 to pass through the through hole 37, the second through slot 33 and another through hole 37 in sequence.

[0036] Specifically, the cross section of the No. 2 through groove 33 is funnel-shaped.

[0037] When the carrier 4 moves downward with the chip to be detected, the continuously decreasing slot spacing of the second through slot 33 can push the chip to be detected on the carrier 4 to move toward the middle, thereby correcting the position of the offset chip to be detected.

[0038] Furthermore, the penetration member 38 is a shell structure, and a cam rod 381 is rotatably installed in the penetration member 38. The rotation angle of the cam rod 381 is not greater than 90°. Two contact sliders 382 are provided on opposite sides of the cam rod 381. The contact sliders 382 are arranged at intervals along the length direction of the penetration member 38, and the contact sliders 382 slide along the radial direction of the penetration member 38. A reset spring 383 is connected between the contact slider 382 and the penetration member 38, and an inner push rod 384 is provided between the two contact sliders 382 on the same side. A driving connecting rod 385 is fixedly connected to one end of the cam rod 381, and a toothed disc 386 is fixedly connected to the end face of the driving connecting rod 385. The toothed disc 386 is located on the outer side of the guide frame 31, and the toothed disc 386 is meshingly connected to a rack 387, and the rack 387 slides along the side wall of the guide frame 31 (the rack 387 can be connected to a set of driving devices, and the driving device can be any linear moving device, such as a cylinder, an electric telescopic rod, etc., which can drive the rack 387 to move linearly).

[0039] Furthermore, the supporting member 4 is plate-shaped, and an arc-shaped groove 43 is provided on the upper end surface of the supporting member 4. The opposite ends of the supporting member 4 are provided with a yielding groove 44. An extension member 45 is slidably installed in the yielding groove 44. A restoring spring 46 is connected between the extension member 45 and the yielding groove 44. A rotating roller 47 is rotatably installed on the end of the extension member 45 away from the supporting member 4.

[0040] After the initial adjustment of the position of the chip to be tested, the chip to be tested placed on the carrier 4 has the following two placement states: one is: the placement state with the pins facing up and the chip facing down; the other is: the placement state with the pins facing down and the chip facing up. The second state of the chip is now adjusted to the first state, as follows: start the telescopic cylinder to make the carrier 4 drive the chip to be tested to move downward. When the carrier 4 moves into the No. 2 through slot 33, the penetration piece 38 and the inner push rod 384 are inserted into the No. 2 through slot 33. The penetration piece 38 and the inner push rod 384 both pass between the two rows of pins of the chip (a single chip has two rows of pins). After that, the carrier 4 continues to move downward driven by the telescopic cylinder. The chip in the placement state with the pins facing up follows the carrier 4 to move downward to the surface of the base 51, and the chip with the pins facing down is penetrated. When the carrier 4 moves to the bottom of the conveyor belt 54, the conveyor belt 54 moves, and the material-shifting straight rod 55 on the conveyor belt 54 shifts the chip to be tested from the surface of the carrier 4 to the surface of the base 51. The material-shifting straight rod 55 continues to drive the chip until it is inside the detection module 6, and the thermal infrared imager 61 detects the chip to be tested, thereby completing the chip packaging defect detection operation. After that, the conveying device 5 stops working, and the carrier 4 moves upward under the drive of the telescopic cylinder, so that the carrier 4 is located below the chip with the pins facing downward, and then the rack 387 is used to move the chip to the bottom of the chip. The translational sliding drives the driving connecting rod 385 to rotate. The driving connecting rod 385 rotates and drives the cam rod 381 to rotate at the same time. When the cam rod 381 rotates to the maximum angle, the cam rod 381 pushes the contact slider 382 to move to both sides, so that the inner supporting rod 384 presses against the inner side of the pin of the chip to be detected, completing the internal clamping and fixing of the chip to be detected. After that, the rack 387 continues to mesh with the rack 387, and the cam rod 381 cannot rotate, thereby driving the penetration piece 38 to rotate as a whole, and the penetration piece 38 drives the chip to be detected with the pin facing down to be turned over to a position with the pin facing up. The rack 387 then moves in the opposite direction, the rack 387 meshes with the toothed disc 386, and drives the driving connecting rod 385 to rotate in the opposite direction, so that the cam rod 381 is separated from the contact slider 382, ​​and the contact slider 382 is reset under the action of the reset spring 383, driving the inner push rod 384 away from the pins of the chip to be detected. The chip to be detected falls onto the surface of the carrier 4 under the action of gravity, and then the above-mentioned conveying operation is repeated to convey the chip to be detected to the inside of the detection module 6. Then the thermal infrared imager 61 detects the chip to be detected, thereby completing the chip packaging defect detection operation.

[0041] During specific operation, when the carrier 4 is located at the top of the No. 2 through groove 33, the extension pieces 45 at both ends of the carrier 4 are pressed against the inner wall of the No. 2 through groove 33 under the action of the reset spring 383, and the extended extension pieces 45 and the carrier 4 jointly block the upper end of the No. 2 through groove 33 after being stretched. Thereafter, when the chip to be detected falls onto the carrier 4, the pins of the chip to be detected can be prevented from being inserted into the gap between the carrier 4 and the guide frame 31. When the extension piece 45 moves downward under the traction of the telescopic cylinder, the extension piece 45, under the action of the reset spring 383, enables the rotating roller 47 to always press against the inner side wall of the No. 2 through groove 33, thereby protecting the placement state of the chip to be detected on the carrier 4, and because the rotating roller 47 can rotate, the friction resistance between the carrier 4 and the No. 2 through groove 33 can be reduced when the carrier 4 moves downward.

[0042] Furthermore, the ends of the first conduit 22, the second conduit and the third conduit are all provided with electromagnetic valves, and the device is also provided with a control device, which is connected to the electromagnetic valves. The control device can be a single chip microcomputer, used in conjunction with the electromagnetic valves.

[0043] It should be noted that the connection between the No. 1 air pump 12 and the first conduit 22, the second conduit and the third conduit can be connected through three sets of solenoid valve components, or through multi-directional solenoid valve components, or other existing methods can be selected, as long as the first conduit 22 and the third conduit can be inhaled at the same time and the second conduit can be inhaled alone. If necessary, multiple air pumps can be set up for use with the above-mentioned conduits.

[0044] Furthermore, the detection module 6 includes a thermal infrared imager 61 and a push rod assembly. The thermal infrared imager 61 is installed above the base 51. The thermal infrared imager 61 performs thermal infrared imaging detection on the pins of the chip to be detected. By observing the display status on the display screen of the thermal infrared imager 61, when the thermal imaging of the pins and the chip is a whole, it is a qualified chip. When the thermal imaging of the pins and the chip is disconnected into two parts, it is judged as an unqualified chip. The push rod assembly includes a telescopic mechanism and a push plate. When an unqualified chip is detected, the telescopic mechanism pushes the push plate to push the unqualified chip away from the detection module 6. A collection box body can be set on the side of the detection module 6 different from the base 51, and the push plate pushes the unqualified chip away to the box body for storage.

[0045] The embodiment of the present embodiment is described above in conjunction with the accompanying drawings, but the present embodiment is not limited to the above-mentioned specific implementation methods. The above-mentioned specific implementation methods are merely illustrative and not restrictive. Under the enlightenment of the present embodiment, ordinary technicians in this field can also make many forms without departing from the purpose of the present embodiment and the scope of protection of the claims, all of which are within the protection of the present embodiment.

Claims

1. A chip packaging defect detection device based on infrared thermal imaging, characterized in that: The invention comprises a bearing plate (1), the bearing plate (1) is connected to a first air pump (12), the upper end surface of the bearing plate (1) is provided with a plurality of first through grooves (11), the first through grooves (11) are arranged at intervals along the length direction of the bearing plate (1), the groove wall of the first through groove (11) is provided with an adjustment component (2), the adjustment component (2) comprises an air bag (21), a pushing block (23), a traction bar (24) and a telescopic mechanism (25), the air bag (21) is connected to the first air pump (12) through a first conduit (22), and the surface of the air bag (21) is fixedly connected to the first air pump (12). A pushing block (23) is connected, and the pushing block (23) and the traction bar (24) are respectively arranged on both sides of the No. 1 through groove (11) and are arranged opposite to each other. When the airbag (21) expands, the pushing block (23) moves in the direction of the traction bar (24). The end surface of the traction bar (24) is fixedly connected with a telescopic mechanism (25). The telescopic mechanism (25) drives the traction bar (24) to slide along the length direction of the No. 1 through groove (11). The lower end of the carrying plate (1) is also provided with a guide component (3). A conveying device (5) is provided below the guide component (3). The conveying device The output end of the guide assembly (5) is provided with a detection module (6); a second through groove (33) for the carrier (4) to move up and down is also provided in the guide assembly (3); an arc-shaped sink groove (43) is provided on the upper end surface of the carrier (4); the lower end of the carrier (4) is connected to the lifting mechanism (42) through a support rod (41); the lifting mechanism (42) drives the carrier (4) to reciprocate up and down; the conveying device (5) comprises a base (51) and a belt conveying mechanism (53); the base (51) is provided with a avoidance groove (52) for the carrier (4) to pass through; the belt conveying mechanism (53) The conveying mechanism (53) comprises a conveying belt (54), which is arranged at intervals along the two ends of the avoidance groove (52), and a plurality of groups of material shifting straight rods (55) are fixedly connected to the surface of the conveying belt (54), and the material shifting straight rods (55) are arranged at intervals along the conveying track of the conveying belt (54), and a gap is left between two adjacent groups of material shifting straight rods (55). The conveying belt (54) is arranged above the base (51), and the telescopic end of the lifting mechanism (42) sequentially passes through the gaps on the base (51) and the surface of the conveying belt (54), and is inserted into the No. 1 through groove (11); The interior of the traction bar (24) is hollow, and a plurality of groups of air blowing holes (241) are provided on a plate surface of the traction bar (24) close to the first through groove (11). The air blowing holes (241) are arranged at intervals along the length direction of the traction bar (24), and the air blowing holes (241) are connected to the first air pump (12) through a second conduit; A plurality of expansion members (243) are provided on a plate surface of the traction bar (24) close to the first through groove (11). The expansion members (243) are arranged at intervals along the length direction of the traction bar (24). The expansion members (243) are connected to the first air pump (12) through a third conduit.

2. The chip packaging defect detection device based on infrared thermal imaging according to claim 1 is characterized in that: A through hole (37) is formed in the groove wall of the No. 2 through groove (33), and a through piece (38) is slidably mounted in the through hole (37). The through piece (38) can pass through the No. 2 through groove (33) in a transverse direction.

3. The chip packaging defect detection device based on infrared thermal imaging according to claim 2 is characterized in that: The cross section of the second through groove (33) is funnel-shaped.

4. The chip packaging defect detection device based on infrared thermal imaging according to claim 3 is characterized in that: The penetration member (38) is a shell structure. A cam rod (381) is rotatably mounted in the penetration member (38). The rotation angle of the cam rod (381) is not greater than 90 degrees. Two contact sliders (382) are provided on opposite sides of the cam rod (381). The contact sliders (382) are arranged at intervals along the length direction of the penetration member (38). The contact sliders (382) slide along the radial direction of the penetration member (38). A return spring (383) is connected between the contact slider (382) and the penetration member (38). An inner push rod (384) is provided between the two contact sliders (382) on the same side. A driving connecting rod (385) is fixedly connected to one end of the cam rod (381). A toothed disc (386) is fixedly connected to the end surface of the driving connecting rod (385). The toothed disc (386) is located on the outer side of the guide frame (31). The toothed disc (386) is meshingly connected to a rack (387). The rack (387) slides along the side wall of the guide frame (31).

5. The chip packaging defect detection device based on infrared thermal imaging according to claim 4 is characterized in that: The bearing member (4) is plate-shaped, and opposite ends of the bearing member (4) are provided with a clearance groove (44), an extension member (45) is slidably installed in the clearance groove (44), a restoring spring (46) is connected between the extension member (45) and the clearance groove (44), and a rotating roller (47) is rotatably installed at one end of the extension member (45) away from the bearing member (4).

6. The chip packaging defect detection device based on infrared thermal imaging according to claim 5, characterized in that: The ends of the first conduit (22), the second conduit and the third conduit are all provided with electromagnetic valve components, and the chip packaging defect detection equipment based on infrared thermal imaging is also provided with a control device, which is connected to the electromagnetic valve components.

7. The chip packaging defect detection device based on infrared thermal imaging according to claim 6 is characterized in that: The detection module (6) comprises a thermal infrared imager (61), and the thermal infrared imager (61) is installed above the base (51).

8. A chip packaging defect detection method based on infrared thermal imaging, characterized in that: The method comprises the chip packaging defect detection device based on infrared thermal imaging as claimed in claim 1, and further comprises: passing the chip to be detected through the No. 1 through groove (11) on the surface of the carrier plate (1) and scattering it on the surface of the carrier (4); starting the No. 1 air pump (12); the No. 1 air pump (12) inflates the air bag (21) through the first conduit (22); the air bag (21) expands, pushing the pushing block (23) to slide along the width direction of the No. 1 through groove (11); the pushing block (23) and the traction bar (24) jointly clamp the chip to be detected; the telescopic mechanism (25) drives the traction bar (24) to slide along the length direction of the adjustment component (2); the No. 1 air pump (12) continues to work, the air bag (21) continues to expand, driving the pushing block (23) to continue to move toward the traction bar (24), and horizontally rotating the chip to be detected; and then introducing gas into the traction bar (24) through the second conduit to flip the chip to be detected.

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