Thermosetting resin composition and use thereof

Abstract

The present application provides a kind of thermosetting composition and its application, the thermosetting resin composition includes the following weight percentage of components: anthracene type epoxy resin 3~25%, active ester 3~30%, benzoxazine resin 4~20%, poly maleimide compound 5~30%, fused silica 40~85%;The benzoxazine resin is at least one of benzoxazine resin containing double bond or bisphenol bisamine type benzoxazine resin.The thermosetting resin composition of the present application can simultaneously realize the Tg of laminated board above 250 DEG C, has low XY-CTE and low DK and Df, and pre-preg resin fluidity is good, satisfies the requirement of multilayer board filling glue.

Description

TECHNICAL FIELD

[0001] The present application belongs to the technical field of laminates, and relates to a thermosetting resin composition and application thereof. BACKGROUND

[0002] Generally, it is relatively difficult to simultaneously achieve TMA (Thermal Mechanical Analysis) Tg above 250℃, low DK, low Df and low XY-CTE of laminates. For example, a hydrocarbon system can achieve TMA Tg above 250℃, low DK and low Df, but XY-CTE is obviously larger due to long-chain structure, and high temperature curing above 250℃ is generally required, which is difficult to meet the curing conditions below 220℃ of general multilayer boards. A general epoxy resin, active ester and benzoxazine combination can achieve low Df, low DK and low CTE by adding silica, but XY-CTE is generally difficult to reduce to 11 ppm, and TMA Tg generally cannot be above 250℃. A general packaging substrate can easily achieve higher Tg and lower XY-CTE, but DK or Df is higher, TMA Tg is generally below 250℃, and a Low CTE cloth (non-E cloth) is generally used to achieve lower XY-CTE, and the adhesive performance is poor, which cannot be used for multilayer boards and the like.

[0003] CN110300493A discloses a crystalline epoxy resin and a curing agent active ester thereof, but it cannot meet the requirements of simultaneously reducing XY-CTE and DK / Df. CN1636987A discloses a crystalline epoxy resin, which can provide extremely low melt viscosity and excellent curing property, as well as excellent mechanical properties, heat resistance and moisture resistance, but does not disclose how to achieve lower DK, Df and XY-CTE.

[0004] Therefore, in the field, it is desirable to develop a resin composition capable of simultaneously achieving Tg above 250℃, low XY-CTE and low DK and Df of laminates. SUMMARY

[0005] In view of the deficiencies of the prior art, the present application aims to provide a thermosetting resin composition and application thereof. The thermosetting resin composition of the present application can simultaneously achieve Tg above 250℃, low XY-CTE and low DK and Df of laminates, and the prepreg resin has good flowability, meeting the requirements of multilayer board filling.

[0006] To achieve the above-mentioned purpose, the present application adopts the following technical solutions:

[0007] In one aspect, the present application provides a thermosetting resin composition, which comprises the following components in weight percentage:

[0008]

[0009] The benzoxazine resin is at least one of a benzoxazine resin containing a double bond or a bisphenol bisamine type benzoxazine resin.

[0010] In the present application, by matching components through anthracene type epoxy resin, active ester, benzoxazine resin containing a double bond or bisphenol bisamine type benzoxazine resin, poly-maleimide compound and fused silica, the obtained thermosetting resin composition can simultaneously achieve Tg of the laminate board above 250℃, low XY-CTE and low DK and Df, and good resin flowability of the prepreg, meeting the requirements of multi-layer board filling.

[0011] In the present application, the benzoxazine resin containing a double bond or the benzoxazine resin of bisphenol bisamine type and the active ester synergistically act to reduce the Df of the thermosetting resin composition; the anthracene type epoxy resin and the poly-maleimide compound synergistically act to increase the glass transition temperature of the thermosetting resin composition and reduce the CTE of the resin composition; the viscosity of the anthracene type epoxy resin is low, and the prepared prepreg has good flow performance and filling function by matching with high filling amount of fused silica, and can further reduce the CTE of the thermosetting resin composition.

[0012] In the thermosetting resin composition of the present application, the weight percentage content of the anthracene type epoxy resin can be 3%, 5%, 8%, 10%, 13%, 15%, 18%, 20%, 23% or 25%.

[0013] In the thermosetting resin composition of the present application, the weight percentage content of the active ester can be 3%, 5%, 8%, 10%, 13%, 15%, 18%, 20%, 23%, 25%, 28% or 30%.

[0014] In the thermosetting resin composition of the present application, the weight percentage content of the benzoxazine resin containing a double bond or the benzoxazine resin of bisphenol bisamine type can be 5%, 8%, 10%, 13%, 15%, 18% or 20%.

[0015] In the thermosetting resin composition of the present application, the weight percentage content of the poly-maleimide compound can be 5%, 8%, 10%, 13%, 15%, 18%, 20%, 23%, 25%, 28% or 30%.

[0016] Of course, other types of poly-maleimide compounds, bis-maleimide compounds or mono-maleimide compounds can also be appropriately used without affecting the main performance of the thermosetting resin composition of the present application.

[0017] In the thermosetting resin composition of the present application, the weight percentage content of the fused silica can be 40%, 45%, 48%, 50%, 55%, 60%, 65%, 70%, 75%, 80% or 85%.

[0018] In the present application, the fused silica can be a fused spherical silica or a fused non-spherical silica. Preferably, the fused spherical silica can make the whole system reach a compact packing structure, which is beneficial to reduce the XY-CTE, and can also increase the flowability of the thermosetting composition to meet the requirements of multi-layer board filling.

[0019] Preferably, the anthracene type epoxy resin has the following structure:

[0020]

[0021] wherein R 9 , R 10 each independently is selected from a substituted or unsubstituted C1-C10 (e.g., C1, C2, C3, C4, C5, C7, C9 or C10) straight chain or branched alkyl group, a hydrogen atom or a halogen atom (e.g., fluorine, chlorine, bromine or iodine), r and s are independently an integer from 0 to 8 (e.g., 0, 1, 3, 5 or 8).

[0022] Preferably, the active ester includes an active ester having a structure as shown in Formula I and / or an active ester having a structure as shown in Formula II:

[0023]

[0024] wherein X is a phenyl group or a naphthyl group, R3, R4 are each independently selected from a hydrogen atom or a methyl group, k is 0 or 1, n has an average value of 0.2-2.0 (e.g., 0.2, 0.5, 0.8, 1.0, 1.2, 1.5, 1.8 or 2.0), and n represents an average polymerization degree which can not be an integer;

[0025]

[0026] wherein La is a phenyl group or a naphthyl group, Y in (Y) q is selected from a methyl group, a hydrogen atom or an ester group, q is 1, 2 or 3, j is 1-10 (e.g., 1, 2, 3, 4, 5, 6, 7, 8, 9 or 10), m is 1-10 (e.g., 1, 2, 3, 4, 5, 6, 7, 8, 9 or 10), and m represents an average polymerization degree which can not be an integer.

[0027] Preferably, the double bond containing benzoxazine resin is an allyl group or a vinyl group containing benzoxazine resin.

[0028] Of course, other types of benzoxazine resins, such as any one of or a combination of at least two of bisphenol A type benzoxazine resins, bisphenol F type benzoxazine resins, diamine type benzoxazine resins, phenolphthalein type benzoxazine resins, dicyclopentadiene type benzoxazine resins, or bisphenol fluorene type benzoxazine resins, can also be appropriately used without affecting the main properties of the thermosetting resin composition of the present application.

[0029] Preferably, the poly-maleimide compound has a structure as shown in Formula III:

[0030]

[0031] In Formula III, A9is selected from a group having a structure of Formula (1) or Formula (2), R6is each independently selected from a hydrogen atom or an aliphatic hydrocarbon group having a carbon number of 1 to 5 (e.g., 1, 2, 3, 4, or 5), R6may be the same as or different from each other, and 1 < b < 10 (b can be, for example, 1.01, 1.2, 1.5, 2, 3, 4, 5, 6, 7, 8, 9, or 10), b represents the average degree of polymerization of the poly-maleimide compound shown in III, and can not be an integer;

[0032]

[0033] In Formula (1), R1is each independently selected from a hydrogen atom, an aliphatic hydrocarbon group having a carbon number of 1 to 5 (e.g., 1, 2, 3, 4, or 5), or a halogen atom (e.g., fluorine, chlorine, bromine, or iodine), R1may be the same as or different from each other, and o is selected from an integer of 0 to 4 (e.g., 0, 1, 2, 3, or 4);

[0034]

[0035] In Formula (2), R 2a , R 2b , R 3a , R 3b are each independently selected from a hydrogen atom, an aliphatic hydrocarbon group having a carbon number of 1 to 5 (e.g., 1, 2, 3, 4, or 5), or a halogen atom (e.g., fluorine, chlorine, bromine, or iodine), A2is selected from a linear or branched alkylene group having a carbon number of 1 to 5 (e.g., 1, 2, 3, 4, or 5), an ether group, a sulfide group, a sulfonyl group, a ketone group, a single bond, or a group having a structure of Formula (2-1), pa, pb, qa, qb are each independently selected from an integer of 0 to 4, such as 0, 1, 2, 3, or 4;

[0036]

[0037] In formula (2-1), R4, R5are each independently selected from a hydrogen atom, an aliphatic hydrocarbon group having a carbon number of 1 to 5 (for example, 1, 2, 3, 4, or 5), or a halogen atom (for example, fluorine, chlorine, bromine, or iodine), A3is selected from a linear or branched alkylene group having a carbon number of 1 to 5 (for example, 1, 2, 3, 4, or 5), an ether group, a sulfide group, a sulfonyl group, a ketone group, or a single bond, x, y are each independently selected from an integer of 0 to 4 (for example, 0, 1, 2, 3, or 4);

[0038] The poly-maleimide compound can use a commercially available product, exemplarily including, but not limited to, MIR-3000-70MT or MIR-5000-60T of Japan Energy Corporation.

[0039] Preferably, the thermosetting resin composition further includes 0.01 to 6.0% of a flame retardant, for example, 0.1%, 0.5%, 1.0%, 1.5%, 2.0%, 2.5%, 3.0%, 3.5%, 4.0%, 4.5%, 5.0%, 5.5%, or 6.0%.

[0040] Preferably, the flame retardant includes a bromine-containing flame retardant and / or a halogen-free flame retardant.

[0041] Preferably, the halogen-free flame retardant includes any one or a combination of at least two of a phosphorus-containing flame retardant, a nitrogen-containing flame retardant, or a silicon-containing flame retardant.

[0042] Preferably, the bromine-containing flame retardant includes any one or a combination of at least two of decabromodiphenyl ether, decabromodiphenyl ethane, ethylene bis-tetrabromophthalimide, or brominated polycarbonate. The bromine-containing flame retardant can use a commercially available product, exemplarily including, but not limited to, BT-93, BT-93W, HP-8010, or HP-3010.

[0043] Preferably, the halogen-free flame retardant includes any one or a combination of at least two of tris(2,6-dimethylphenyl)phosphine, 10-(2,5-dihydroxyphenyl)-9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide, 2,6-bis(2,6-dimethylphenyl)phosphinobenzene, 10-phenyl-9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide, phenoxyphosphine cyanide compound, phosphate ester, or polyphosphate ester. The halogen-free flame retardant can use a commercially available product, exemplarily including, but not limited to, SPB-100, PX-200, PX-202, LR-202, LR-700, OP-930, OP-935, LP-2200, XP-7866.

[0044] Preferably, the thermosetting resin composition further comprises 0.01 to 0.20% of a curing accelerator, such as 0.01%, 0.02%, 0.03%, 0.05%, 0.08%, 0.10%, 0.12%, 0.15%, 0.18%, or 0.20%.

[0045] Preferably, the curing accelerator comprises any one of or a combination of at least two of an imidazole-based accelerator and its derivatives, a Lewis acid, triphenylphosphine, or a pyridine-based accelerator.

[0046] Preferably, the imidazole-based accelerator comprises any one of or a combination of at least two of 2-methylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, or 2-undecylimidazole.

[0047] In another aspect, the present application provides a resin sizing solution obtained by dissolving or dispersing the thermosetting resin composition described above in a solvent.

[0048] As the solvent in the present application, there is no particular limitation, and as specific examples, alcohols such as methanol, ethanol, and butanol; ethers such as ethyl cellosolve, butyl cellosolve, ethylene glycol-methyl ether, carbitol, and butyl carbitol; ketones such as acetone, butanone, methyl ethyl ketone, methyl isobutyl ketone, and cyclohexanone; aromatic hydrocarbons such as toluene, xylene, and mesitylene; esters such as ethoxyethyl acetate and ethyl acetate; and nitrogen-containing solvents such as N,N-dimethylformamide, N,N-dimethylacetamide, and N-methyl-2-pyrrolidone can be given. The above-mentioned solvents can be used singly or in combination of two or more, and preferably, aromatic hydrocarbon solvents such as toluene, xylene, and mesitylene are used in combination with ketone solvents such as acetone, butanone, methyl ethyl ketone, methyl isobutyl ketone, and cyclohexanone. The amount of the solvent used can be selected by a person skilled in the art based on his or her experience so that the resulting resin sizing solution has a viscosity suitable for use.

[0049] In another aspect, the present application provides a prepreg comprising a reinforcing material and the thermosetting resin composition described above attached to the reinforcing material by impregnation and drying.

[0050] Preferably, the reinforcing material comprises any one of a glass fiber cloth, an organic fiber cloth, or a glass fiber paper.

[0051] Among them, the glass fiber cloth comprises Q-glass cloth, E-glass cloth, D-glass cloth, L-glass cloth, M-glass cloth, S-glass cloth, T-glass cloth, or NE-glass cloth, etc.

[0052] In another aspect, the present application provides a laminate comprising at least one prepreg described above.

[0053] In another aspect, the present application provides a metal-clad laminate, which comprises one or at least two laminated prepregs as described above, and a metal foil on one or both sides of the laminated prepregs.

[0054] Preferably, the metal foil comprises a copper foil, a nickel foil, an aluminum foil or a SUS foil, and further preferably a copper foil.

[0055] In another aspect, the present application provides a high-frequency high-speed circuit substrate, which comprises one or at least two laminated prepregs as described above.

[0056] Compared with the prior art, the present application has the following beneficial effects:

[0057] The thermosetting resin composition of the present application can simultaneously achieve a Tg of the laminate of 250°C or higher, low XY-CTE and low DK and Df, and good prepreg resin flowability, meeting the requirements of multi-layer board filling. DETAILED DESCRIPTION

[0058] The technical solutions of the present application will be further described below through specific embodiments. It should be understood by those skilled in the art that the embodiments are only to help understand the present application and should not be regarded as specific limitations of the present application.

[0059] The materials and grade information involved in the following examples and comparative examples are as follows:

[0060] (A) Epoxy resin

[0061] A-1: Anthracene-type epoxy resin, YX8800, Mitsubishi Chemical;

[0062] A-2: Biphenyl crystalline-type epoxy resin, YX4000, Mitsubishi Chemical;

[0063] (B) Active ester

[0064] B-1: Dicyclopentadiene-type active ester, HPC-8000-65T, DIC, Japan;

[0065] B-2: Naphthalene ring-containing active ester, HPC-8150-62T, DIC, Japan;

[0066] (C) Benzoxazine resin

[0067] C-1: Double-bond-containing benzoxazine resin, 8298, Huntsman;

[0068] C-2: Bisphenol bisamine-type benzoxazine resin, DFE149, Sichuan Dongcai;

[0069] C-3: Bisphenol A-type benzoxazine resin, 8290, Huntsman;

[0070] (D) Polymaleimide compound

[0071] D-1: MIR-3000-70MT, Japan Chemical;

[0072] D-2: MIR-5000-60T, Japan Chemical;

[0073] D-3: BMI-2300, Benzylmaleimide polymer, Japan Dainichiseika Color & Chemicals;

[0074] (E) Silica

[0075] E-1: Fused silica, SC2050, Japan admateches;

[0076] E-2: Angular silica, 525, Silicco;

[0077] (F) Curing accelerator

[0078] F-1: Dimethylimidazole, 2-MI, Japan Shikoku Chemicals.

[0079] Example 1

[0080] A thermosetting resin composition and prepreg and metal-clad laminate containing the same are prepared as follows:

[0081] (1) 15 parts by weight of epoxy resin A-1, 10 parts by weight of active ester B-1, 10 parts by weight of benzoxazine resin C-1, 15 parts by weight of polymaleimide compound D-1, 50 parts by weight of silica E-1, and 0.1 parts by weight of dimethylimidazole F-1 are mixed uniformly in a MEK solvent to obtain a resin solution of the thermosetting resin composition, and the solid content of the resin solution is adjusted to 65% with MEK. The above resin solution is impregnated into 2116 glass cloth (Shanghai Honghe) and then baked in an oven at 165°C for 5 min to prepare a prepreg with a thickness of 0.10 mm.

[0082] (2) One (or 5, or 8) prepreg is stacked together, and 18 μm of HTE copper foil (Mitsui, Malaysia) is stacked on the upper and lower surfaces of the prepreg, and a metal-clad laminate with a core thickness of 0.10 mm (or 0.50 mm, or 0.80 mm) is obtained under the conditions of a curing temperature of 210°C, a curing pressure of 35 Kg / cm 2 , and a curing time of 90 min.

[0083] After etching the copper foil of the above-mentioned copper-clad laminate, a laminate with a thickness of 0.10 mm (or 0.50 mm, or 0.80 mm) prepared by stacking 1 (or 5, or 8) prepreg together was obtained (different numbers of prepregs were stacked together to prepare the copper-clad laminate, which was used for testing different properties, wherein 1 was used for the determination of the coefficient of thermal expansion XY-CTE, 5 was used for the determination of DK and Df, and 8 was used for the determination of other properties).

[0084] Examples 2-6, Comparative Examples 1-13

[0085] A thermosetting resin composition, a prepreg and a metal-clad laminate comprising the same, the components and contents of the thermosetting resin composition are shown in Tables 1-3, and the preparation method of the prepreg and the metal-clad laminate is the same as in Example 1; the weight contents referred to in Examples 1-6, Comparative Examples 1-13 all refer to the solid weight parts without solvent.

[0086] The properties of the laminates, metal-clad laminates of Examples 1-6, Comparative Examples 1-13 were tested, and the results are shown in Tables 1-3.

[0087] Table 1

[0088]

[0089] Table 2

[0090]

[0091]

[0092] Table 3

[0093]

[0094] The testing methods for the properties of the laminates, metal-clad laminates are as follows:

[0095] (1) Glass transition temperature (T g ), coefficient of thermal expansion (Z-CTE): determined according to the TMA test method specified in IPC-TM-650 2.4.24;

[0096] (2) Coefficient of thermal expansion (XY-CTE): determined according to the CTE test method specified in IPC-TM-650 2.4.24C;

[0097] (3) Dielectric constant (Dk) and dielectric loss factor (Df): using the flat plate capacitance method, the dielectric constant and dielectric loss factor at 1 GHz were determined according to the method of IPC-TM-650 2.5.5.9;

[0098] (4) Peel strength: The peel strength of the copper foil laminated plate with a core plate thickness of 0.80 mm was measured according to the method specified in IPC-TM-650 2.4.8;

[0099] (5) Heat delamination time (T-288): The heat delamination time was measured according to the T-288 test method specified in IPC-TM-650 2.4.24.1;

[0100] (6) PCT: The laminated plate was sampled into three pieces with a size of 100 mm x 100 mm, and was placed in a pressure cooker under a pressure of 105 ± 3 KPa for 1 hour. Then, the laminated plate was immersed in solder at 288℃, and the average value of the time to delamination and bubbling was taken;

[0101] (7) Flowability test: Four pieces of 100 cm 2 long prepreg were stacked together, and were placed in a flowability press at 171℃ for 10 min. Then, a 50 cm 2 long sample was punched out, and the weight reduction percentage was calculated by multiplying the weight by 2 times, so as to obtain the flowability.

[0102] As shown in Table 1, the thermosetting resin composition of the embodiments 1-6 of the present application can simultaneously achieve a Tg of the laminated plate of more than 250℃, low XY-CTE and low DK and Df, and good prepreg resin flowability, which meets the requirements of multi-layer board filling. Among them, Tg≥250℃, DK≤4.32, Df≤0.0090, Z-CTE≤1.30%, XY-CTE≤12.5 ppm / ℃, peel strength≥0.52 N / mm, heat delamination time T-288 is greater than 60 min, PCT (1h) of moisture resistance and heat resistance is greater than 300 s, and flowability≥10%.

[0103] Comparative Examples 1-4 respectively use biphenyl crystalline epoxy resin, bisphenol A type benzoxazine resin, benzyl methane maleimide polymer, and angular silica to replace the anthracene type epoxy resin, benzoxazine resin, multi-maleimide compound, and fused silica in Example 1, and the comprehensive performance of the obtained laminated plate and metal foil laminated plate is not as excellent as that of Example 1.

[0104] Compared with Example 1, the glass transition temperature, CTE of the obtained laminated plate, metal-clad laminated plate of Comparative Example 5, Comparative Example 11 are greatly deteriorated due to not using anthracene type epoxy resin, multi-maleimide compound respectively, which shows that anthracene type epoxy resin and multi-maleimide compound have synergistic effect; the Df of the obtained laminated plate, metal-clad laminated plate of Comparative Example 7, Comparative Example 9 are obviously deteriorated due to not using active ester, benzoxazine resin respectively, which shows that benzoxazine resin and active ester in the application have synergistic effect; the amount of anthracene type epoxy resin, active ester, benzoxazine resin, multi-maleimide compound in Comparative Example 6, Comparative Example 8, Comparative Example 10, Comparative Example 12 are too much respectively, and the comprehensive performance of the obtained laminated plate, metal-clad laminated plate is not as excellent as that of Example 1.

[0105] Compared with Example 1, the glass transition temperature, Df, CTE, heat resistance and moisture resistance of the obtained laminated plate, metal-clad laminated plate of Comparative Example 13 are deteriorated in different degrees due to the amount of fused silica being too little.

[0106] The applicant declares that the thermosetting resin composition and the application thereof of the present application are illustrated by the above examples, but the present application is not limited to the above examples, that is, it does not mean that the present application must rely on the above examples to be implemented. It should be understood by those skilled in the art that any improvement of the present application, equivalent replacement of each raw material of the product of the present application, addition of auxiliary ingredients, selection of specific mode, etc. fall within the protection scope and disclosure scope of the present application.

Claims

1. A thermosetting resin composition, characterized by, The thermosetting resin composition comprises components in the following weight percentages: anthracene type epoxy resin 3~25% active ester 3~30% benzoxazine resin 4~20% polymaleimide compound 5~30% fused silica 40~85%; The benzoxazine resin is at least one of a benzoxazine resin containing a double bond or a bisphenol bisamine type benzoxazine resin; The active ester comprises an active ester having a structure as shown in Formula I and / or an active ester having a structure as shown in Formula II; ； wherein X is a phenyl group or a naphthyl group, R3, R4 are each independently selected from a hydrogen atom or a methyl group, k is 0 or 1, and the average value of n is 0.2-2.0; ； wherein La is a phenyl or naphthyl group, (Y) q Y in (Y) is selected from a methyl group, a hydrogen atom or an ester group, q is 1, 2 or 3, j is 1-10, and m is 1-10; The polymaleimide compound has a structure as shown in Formula III: ； In Formula III, A9 is selected from a group having a structure as shown in Formula (1) or Formula (2), R6 is each independently selected from a hydrogen atom or an aliphatic hydrocarbon group having a carbon number of 1-5, and 1 ； In Formula (1), R1 is each independently selected from a hydrogen atom, an aliphatic hydrocarbon group having a carbon number of 1-5, or a halogen atom, and o is selected from an integer of 0-4. ； In formula (2), R 2a , R 2b , R 3a , R 3b each independently is selected from a hydrogen atom, an aliphatic hydrocarbon group having a carbon number of 1 to 5, or a halogen atom, A2is selected from a linear or branched alkylene group having a carbon number of 1 to 5, an ether group, a sulfide group, a sulfonyl group, a ketone group, a single bond, or a group of formula (2-1), and pa, pb, qa, and qb each independently are selected from an integer of 0 to 4. ； In Formula (2-1), R4, R5 are each independently selected from a hydrogen atom, an aliphatic hydrocarbon group having a carbon number of 1-5, or a halogen atom, A3 is selected from a linear or branched alkylene group having a carbon number of 1-5, an ether group, a sulfide group, a sulfonyl group, a ketone group, or a single bond, and x, y are each independently selected from an integer of 0-4.

2. The thermosetting resin composition according to claim 1, characterized by The anthracene type epoxy resin has the following structure: ； wherein R 9 , R 10 each independently is selected from substituted or unsubstituted C1-C10 straight chain or branched alkyl, a hydrogen atom or a halogen atom, and r and s independently are integers from 0 to 8.

3. The thermosetting resin composition according to claim 1, characterized by The benzoxazine resin containing a double bond is a benzoxazine resin containing an allyl group or a vinyl group.

4. The thermosetting resin composition according to claim 1, characterized by The thermosetting resin composition further comprises 0.01-6.0% of a flame retardant.

5. The thermosetting resin composition according to claim 4, characterized by The flame retardant comprises a bromine-containing flame retardant and / or a halogen-free flame retardant.

6. The thermosetting resin composition according to claim 5, characterized by The halogen-free flame retardant comprises any one or at least two combinations of a phosphorus-containing flame retardant, a nitrogen-containing flame retardant, or a silicon-containing flame retardant.

7. The thermosetting resin composition according to claim 5, wherein The bromine-containing flame retardant comprises any one or at least two combinations of decabromodiphenyl ether, decabromodiphenyl ethane, ethylene bis-tetrabromophthalimide, or brominated polycarbonate.

8. The thermosetting resin composition according to claim 1, wherein The thermosetting resin composition further comprises 0.01-0.20% of a curing accelerator.

9. The thermosetting resin composition according to claim 8, characterized by The curing accelerator comprises any one or at least two combinations of an imidazole-based accelerator and its derivatives, a Lewis acid, triphenylphosphine, or a pyridine-based accelerator.

10. A resin glue solution, characterized by, It is obtained by dissolving or dispersing the thermosetting resin composition as claimed in any one of claims 1-9 in a solvent.

11. A prepreg, characterized by, The prepreg comprises a reinforcing material and the thermosetting resin composition as claimed in any one of claims 1-9 attached to the reinforcing material after impregnation and drying.

12. A laminate characterized by The laminate comprises at least one prepreg as claimed in claim 11.

13. A metal-clad laminate characterized by comprising: The metal-clad laminate comprises one or at least two prepregs as claimed in claim 11 stacked together, and a metal foil on one side or both sides of the stacked prepregs.

14. A high-frequency high-speed circuit substrate, characterized by comprising: The high-frequency high-speed circuit substrate comprises one or at least two prepregs as claimed in claim 11 stacked together.

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