Electronic devices and methods for controlling electronic devices

Abstract

This application discloses an electronic device and a control method for the electronic device. The electronic device includes: a housing, a display screen, and a circuit board; the housing and the display screen form a receiving cavity, the circuit board is disposed within the receiving cavity, a first heat-conducting element is disposed on the side of the circuit board facing the display screen, and a second heat-conducting element is disposed on the side of the circuit board facing the housing, the thermal conductivity of the first heat-conducting element and the second heat-conducting element are adjustable; when the ambient temperature of the electronic device is higher than a first temperature, the thermal conductivity of the first heat-conducting element is adjusted to be lower than the thermal conductivity of the second heat-conducting element; when the ambient temperature of the electronic device is lower than a second temperature, the thermal conductivity of the first heat-conducting element is adjusted to be greater than the thermal conductivity of the second heat-conducting element; the first temperature is higher than the second temperature.

Description

Technical Field

[0001] This application belongs to the field of heat dissipation technology for communication equipment, specifically relating to an electronic device and a control method for the electronic device. Background Technology

[0002] With the development of communication technology and the improvement of user needs, the size of electronic device displays is getting larger and larger. The screen is the core of the entire electronic device, and the reliability of the screen is one of the important factors affecting the performance of electronic devices.

[0003] Existing electronic devices primarily dissipate heat by attaching flexible heat dissipation materials, such as flexible graphite, to the screen. However, this method can only dissipate heat from the screen and cannot protect it at low temperatures, thus affecting the reliability of the electronic devices. Summary of the Invention

[0004] This application aims to provide an electronic device and a control method for the electronic device, solving the current problem that electronic devices cannot achieve compatibility between high-temperature heat dissipation and low-temperature screen protection.

[0005] To solve the above-mentioned technical problems, this application is implemented as follows:

[0006] In a first aspect, embodiments of this application provide an electronic device, comprising:

[0007] Housing, display screen, and circuit board;

[0008] The housing and the display screen form a receiving cavity, the circuit board is disposed in the receiving cavity, a first heat-conducting element is disposed on the side of the circuit board facing the display screen, and a second heat-conducting element is disposed on the side of the circuit board facing the housing, and the thermal conductivity of the first heat-conducting element and the second heat-conducting element is adjustable;

[0009] When the ambient temperature of the electronic device is higher than the first temperature, the thermal conductivity of the first thermal conductive element is adjusted to be lower than that of the second thermal conductive element.

[0010] When the ambient temperature of the electronic device is lower than the second temperature, the thermal conductivity of the first thermal conductive element is adjusted to be greater than that of the second thermal conductive element.

[0011] The first temperature is higher than the second temperature.

[0012] Secondly, embodiments of this application also provide a control method for an electronic device, wherein the electronic device is the aforementioned electronic device, and the control method includes:

[0013] Obtain the ambient temperature of the electronic device;

[0014] When the ambient temperature is higher than the first temperature, the thermal conductivity of the first thermal conductive element is adjusted to be less than that of the second thermal conductive element, and the heat of the circuit board is transferred to the housing through the second thermal conductive element;

[0015] When the ambient temperature is lower than the second temperature, the thermal conductivity of the first thermal conductive element is adjusted to be greater than that of the second thermal conductive element, and the heat of the circuit board is transferred to the screen through the first thermal conductive element.

[0016] The first temperature is higher than the second temperature.

[0017] In embodiments of this application, an electronic device and a control method for the electronic device are provided. The electronic device comprises a housing and a display screen, which together form a cavity for accommodating other functional components. The display screen displays information required by the user. A circuit board is disposed within the cavity. A first heat-conducting element is provided on the side of the circuit board facing the display screen, and a second heat-conducting element is provided on the side of the circuit board facing the housing. When the ambient temperature of the electronic device is higher than a first temperature, the thermal conductivity of the first heat-conducting element is adjusted to be lower than that of the second heat-conducting element; when the ambient temperature of the electronic device is lower than a second temperature, the thermal conductivity of the first heat-conducting element is adjusted to be higher than that of the second heat-conducting element. The first temperature is higher than the second temperature. By adjusting the thermal conductivity of the first and second heat-conducting elements, this application enables the display screen to dissipate heat at high temperatures and protect the screen at low temperatures, making the display screen temperature more stable, improving the reliability of the display screen, and enhancing the user experience of the electronic device.

[0018] Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application. Attached Figure Description

[0019] The above and / or additional aspects and advantages of the present invention will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0020] Figure 1 An exploded view of the electronic device in an embodiment of this application is shown;

[0021] Figure 2 One of the schematic diagrams of the internal structure of the electronic device in the embodiments of this application is shown;

[0022] Figure 3 This is a second schematic diagram of the internal structure of the electronic device in an embodiment of this application;

[0023] Figure 4 A schematic cross-sectional view of the electronic device motherboard in an embodiment of this application is shown;

[0024] Figure 5This paper shows a partially enlarged cross-sectional view of the motherboard of an electronic device in an embodiment of this application;

[0025] Figure 6 This paper shows a partially enlarged cross-sectional view of the cover plate of the electronic device in an embodiment of this application;

[0026] Figure 7 A schematic cross-sectional view of the cover plate of the electronic device in an embodiment of this application is shown;

[0027] Figure 8 A schematic diagram of the first motherboard structure of the electronic device in an embodiment of this application is shown;

[0028] Figure 9 A schematic diagram of the second motherboard structure of the electronic device in an embodiment of this application is shown;

[0029] Figure 10 A schematic diagram of the structure of the first heat-conducting sheet of the electronic device in an embodiment of this application is shown;

[0030] Figure 11 A schematic diagram of the third heat-conducting sheet structure of the electronic device in an embodiment of this application is shown;

[0031] Figure 12 A schematic diagram of the structure of the second heat-conducting sheet of the electronic device in an embodiment of this application is shown;

[0032] Figure 13 A schematic diagram of the fourth heat-conducting sheet structure of the electronic device in an embodiment of this application is shown;

[0033] Figure 14 A schematic diagram of an electronic device temperature sensor in an embodiment of this application is shown;

[0034] Figure 15 A schematic diagram of the atomic structure of strontium cobalt oxide in an electronic device according to an embodiment of this application is shown;

[0035] Figure 16 A flowchart illustrating the control method provided in an embodiment of this application is shown;

[0036] Figure 17 A schematic diagram of the control system of the control method provided in the embodiment of this application is shown;

[0037] Figure 18 A schematic diagram of the structure of the electronic device provided in this application is shown.

[0038] Figure label:

[0039] 1. Housing; 10. Receiving cavity; 11. First housing; 110. First receiving cavity; 12. Second housing; 120. Second receiving cavity; 2. Display screen; 3. Circuit board; 30. First heat-conducting component; 300. First interface; 31. Second heat-conducting component; 310. Second interface; 32. First circuit board; 33. Second circuit board; 330. Third heat-conducting component; 3300. Third interface; 331. Fourth heat-conducting component; 3310. Fourth interface; 4. Temperature sensor; 5. Functional module; 6. Sub-screen; 7. Cover plate; 71. First battery; 72. Second battery; 8. Hinge shaft; 171. Acquisition module; 172. First adjustment module; 173. Second adjustment module; 1010. Processor; 1020. Communication interface; 1030. Memory; 1040. Communication bus. Detailed Implementation

[0040] Embodiments of the present invention will now be described in detail. Examples of these embodiments are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention. All other embodiments obtained by those skilled in the art based on the embodiments in this application without inventive effort are within the scope of protection of this application.

[0041] The terms "first," "second," etc., used in this application's specification are used to distinguish similar objects and not to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that embodiments of this application can be implemented in orders other than those illustrated or described herein, and the objects distinguished by "first," "second," etc., are generally of the same class and the number of objects is not limited; for example, a first object can be one or more.

[0042] To address the above issues, the following will be discussed in conjunction with... Figures 1-18 This application describes an electronic device and a control method for the electronic device provided according to embodiments of the present application.

[0043] like Figure 1 As shown, the electronic device provided in this application embodiment includes a housing 1, a display screen 2, and a circuit board 3. The housing 1 and the display screen 2 form a receiving cavity 10, which is used to house at least some of the electronic components on the electronic device. The display screen 2 is used to display information that the user needs to obtain on the screen for convenient viewing. The circuit board 3 is disposed within the receiving cavity 10 and is used to provide a mounting base for other electronic components.

[0044] Furthermore, a first heat-conducting element 30 is provided on the side of the circuit board 3 facing the display screen 2, and a second heat-conducting element 31 is provided on the side of the circuit board 3 facing the housing 1, wherein the thermal conductivity of the first heat-conducting element 30 and the second heat-conducting element 31 can be adjusted.

[0045] When the ambient temperature of the electronic device is higher than the first temperature, the screen of the electronic device becomes too hot, which may cause the user to burn their hands. At this time, the thermal conductivity of the first heat-conducting component 30 is adjusted to be lower than that of the second heat-conducting component 31. When the ambient temperature of the electronic device is lower than the second temperature, the display screen 2 may break due to the low temperature. At this time, the thermal conductivity of the first heat-conducting component 30 is adjusted to be higher than that of the second heat-conducting component 31. In this embodiment, the first temperature is higher than the second temperature.

[0046] It should be noted that in this embodiment, the shapes of the first heat-conducting element 30 and the second heat-conducting element 31 are adapted to the circuit board 3, and can be square or circular, without specific limitation. In this embodiment, the processor adjusts the voltage on the circuit board 3 to regulate the thermal conductivity of the first heat-conducting element 30 and the second heat-conducting element 31, thereby keeping the temperature of the display screen 2 stable and improving the user experience.

[0047] Specifically, the operation of the electronic device in this embodiment is as follows:

[0048] When the ambient temperature of the electronic device provided in this application embodiment is higher than the first temperature, the temperature of the display screen 2 rises. The thermal conductivity of the first heat-conducting component 30 is adjusted to be less than that of the second heat-conducting component 31. At this time, the heat inside the electronic device diffuses away from the display screen 2 (along the first heat dissipation channel), that is, the heat on the display screen 2 diffuses towards the housing 1. The temperature of the display screen 2 gradually decreases, so as to avoid the display screen 2 overheating and affecting the user's experience.

[0049] In this embodiment, when the ambient temperature of the electronic device is lower than the second temperature, the temperature of the display screen 2 decreases. The thermal conductivity of the first heat-conducting component 30 is adjusted to be greater than that of the second heat-conducting component 31. The heat of the display screen 2 in the electronic device diffuses from the inside of the electronic device to the display screen 2 (along the second heat dissipation channel), raising the temperature of the display screen 2. This prevents the display screen 2 from breaking due to excessively low temperature while realizing the recovery and reuse of heat.

[0050] It should be noted that in this embodiment, the first temperature is -5℃ and the second temperature is 40℃. Alternatively, the first temperature can be set to -10℃ and the second temperature to 50℃. The temperature thresholds of the first heat-conducting element 30 and the second heat-conducting element 31 can be arbitrarily set in this embodiment, and no specific limitation is made.

[0051] In embodiments of this application, an electronic device is provided. This electronic device comprises a housing 1 and a display screen 2, which together form a cavity 10 for accommodating other functional components. The display screen 2 displays information required by the user. A circuit board 3 is disposed within the cavity 10. A first heat-conducting element 30 is provided on the side of the circuit board 3 facing the display screen 2, and a second heat-conducting element 31 is provided on the side of the circuit board 3 facing the housing 1. When the ambient temperature of the electronic device is higher than a first temperature, the thermal conductivity of the first heat-conducting element 30 is adjusted to be lower than that of the second heat-conducting element 31; when the ambient temperature of the electronic device is lower than a second temperature, the thermal conductivity of the first heat-conducting element 30 is adjusted to be higher than that of the second heat-conducting element 31. The first temperature is higher than the second temperature. By adjusting the thermal conductivity of the first heat-conducting element 30 and the second heat-conducting element 31, this application enables the display screen 2 to dissipate heat at high temperatures and protect the screen at low temperatures, making the temperature of the display screen 2 more stable, improving the reliability of the display screen 2, and enhancing the user experience of the electronic device.

[0052] According to the electronic device provided in the embodiments of this application, the first heat-conducting element 30 and the second heat-conducting element 31 are disposed on the circuit board 3 and electrically connected to the circuit board 3. The electronic device is provided with a processor, which is used to adjust the voltage on the first heat-conducting element 30 and the second heat-conducting element 31 accordingly by changing the voltage on the circuit board 3, so as to adjust the thermal conductivity of the first heat-conducting element 30 and the second heat-conducting element 31.

[0053] Specifically, when the ambient temperature of the electronic device is higher than the first temperature, the temperature of the display screen 2 rises. The processor in the electronic device reduces the voltage across the first heat-conducting component 30, causing the thermal conductivity of the first heat-conducting component 30 to decrease. The voltage across the second heat-conducting component 31 is increased, causing the thermal conductivity of the second heat-conducting component 31 to increase. The thermal conductivity of the first heat-conducting component 30 is less than that of the second heat-conducting component 31. The heat on the display screen 2 diffuses towards the housing 1 (along the first heat dissipation channel), and the temperature of the display screen 2 gradually decreases.

[0054] When the ambient temperature of the electronic device is lower than the second temperature, the temperature of the display screen 2 decreases. The processor in the electronic device increases the voltage across the first heat-conducting component 30, increasing the thermal conductivity of the first heat-conducting component 30. The voltage across the second heat-conducting component 31 decreases, decreasing the thermal conductivity of the second heat-conducting component 31. Heat in the electronic device diffuses from the inside of the electronic device towards the display screen 2 (along the second heat dissipation channel), raising the temperature of the display screen 2. This prevents the display screen 2 from breaking due to excessively low temperature while simultaneously recovering and reusing heat.

[0055] It should be noted that in the embodiments of this application, the first heat-conducting element 30 and the second heat-conducting element 31 are both thin films made of strontium cobalt oxide material. When the voltage applied to the two sides of the thin film is different, the crystal form of the strontium cobalt oxide material is different.

[0056] Specifically, such as Figure 15 As shown in Part A, strontium cobalt oxide exists naturally in an atomic configuration called hedonicite. When strontium cobalt oxide is brought into contact with a solid electrolyte, and a voltage is applied across the thin film, the electrolyte provides negative oxygen ions or positive hydrogen ions (protons) to the strontium cobalt oxide material. Figure 15 As shown in Part B, when oxygen ions are added, it becomes more ordered and its thermal conductivity increases; as... Figure 15 As shown in section C, when hydrogen ions are added, it becomes irregular and its thermal conductivity decreases. A heatsink made of strontium cobalt oxide can change its thermal conductivity by applying voltage.

[0057] In this embodiment, when different voltages are applied to the first heat-conducting element 30 and the second heat-conducting element 31, the solid electrolyte provides oxygen ions to the first heat-conducting element 30, increasing its thermal conductivity, and provides hydrogen ions to the second heat-conducting element 31, decreasing its thermal conductivity. Thus, the thermal conductivity of the first heat-conducting element 30 and the second heat-conducting element 31 can be adjusted according to different usage conditions by regulating the voltage applied to both sides of the thin film.

[0058] like Figure 8 and Figure 14 As shown, the electronic device also includes a temperature sensor 4; the temperature sensor 4 is disposed on the circuit board 3 and electrically connected to the circuit board 3, and is used to detect the ambient temperature. The processor in the electronic device controls the voltage of the circuit board 3 according to the ambient temperature, thereby controlling the thermal conductivity of the first heat-conducting element 30 and the second heat-conducting element 31.

[0059] Specifically, the temperature sensor 4 is used to sense the ambient temperature and convert the sensed temperature into an output electrical signal, which is then transmitted to the processor in the electronic device. After receiving the electrical signal transmitted by the temperature sensor 4, the processor in the electronic device adjusts the voltage on the circuit board 3 according to different situations to adjust the thermal conductivity of the first heat-conducting element 30 and the second heat-conducting element 31.

[0060] The electronic device provided according to the embodiments of this application, such as Figure 1 As shown, the electronic device also includes a functional module 5, which is disposed on the circuit board 3 and electrically connected to the circuit board 3; the functional module 5 in this application generates a certain amount of heat during operation, and this part of the heat can be recovered and reused.

[0061] For example, in some other embodiments, when the electronic device is in a low-temperature environment, the display screen 2 may crack due to the low ambient temperature. At this time, the functional module 5 is in working state. Since the background operation generates some heat, the processor in the electronic device applies voltage to the circuit board 3. Some of the heat in the electronic device is conducted to the display screen 2 through the first heat conductor 30, raising the temperature of the display screen 2. This prevents the display screen 2 from breaking due to excessively low temperature and realizes the recovery and reuse of heat from the functional module 5. In addition, another part of the heat generated by the functional module 5 is conducted towards the housing 1 through the second heat conductor 31, causing the temperature of the functional module 5 to drop. This increases the operating speed of the functional module 5 while preventing the display screen 2 from overheating, thus improving the user experience.

[0062] It should be noted that the functional module 5 in this application includes at least one of a camera, a processor, or an audio device, all of which generate a certain amount of heat during operation. In order to prevent the generated heat from affecting its normal operation, this part of the heat can be transferred to the outside of the display screen 2 or the housing 1 by adjusting the thermal conductivity of the first heat-conducting element 30 and the second heat-conducting element 31. While reducing its heat and ensuring its normal operation, it can also improve the reliability of the display screen 2.

[0063] In existing technologies, the flexible screens of foldable electronic devices harden at low temperatures, reducing their flexibility and making them prone to breakage, thus affecting the reliability of the foldable screen. Furthermore, after the foldable screen hardens at low temperatures, its stiffness and internal tension increase, enhancing its bending strength. Since the damping torque of the hinge axis 8 and the magnetic attraction force of the magnet in the foldable electronic device are fixed, if the hinge torque and magnetic attraction force are designed according to the characteristics of the flexible screen at room temperature, the opening force of a foldable electronic device that is closed for extended periods will increase at low temperatures, posing a risk that the foldable electronic device will be unable to close properly if it is extended for extended periods.

[0064] To address the aforementioned issues, in the embodiments of this application, as follows: Figure 4 and Figure 7 As shown, the electronic device is a foldable electronic device. Further, as... Figure 1 and Figure 3 As shown, the housing 1 includes: a first housing 11 and a second housing 12 hinged together; specifically, the first housing 11 and the second housing 12 are connected by a hinge pivot 8, enabling folding and unfolding; as Figure 2 As shown, there are two circuit boards 3, namely the first circuit board 32 and the second circuit board 33. The electronic device also includes a third heat-conducting component 330 and a fourth heat-conducting component 331. The thermal conductivity of the third heat-conducting component 330 and the fourth heat-conducting component 331 is adjustable. The thermal conductivity of the third heat-conducting component 330 and the fourth heat-conducting component 331 can be adjusted by adjusting the voltage on the circuit board 3.

[0065] It should be noted that the first housing 11 and the display screen 2 form a first receiving cavity 110, the second housing 12 and the display screen 2 form a second receiving cavity 120, the first circuit board 32 is disposed in the first receiving cavity 110, and the second circuit board 33 is disposed in the second receiving cavity 120; wherein, the first housing 11 is specifically a first middle frame, and the second housing 12 is specifically a second middle frame.

[0066] Furthermore, a first heat-conducting element 30 is provided on the side of the first circuit board 32 facing the display screen 2, a second heat-conducting element 31 is provided on the side of the first circuit board 32 facing the first housing 11, a third heat-conducting element 330 is provided on the side of the second circuit board 33 facing the display screen 2, and a fourth heat-conducting element 331 is provided on the side of the second circuit board 33 facing the second housing 12. The thermal conductivity of the third heat-conducting element 330 and the fourth heat-conducting element 331 can be adjusted.

[0067] Specifically, such as Figure 8 and Figure 10 As shown, one end of the first circuit board 32 is connected to the first interface 300 on the first heat-conducting component 30 via a board-to-board (BTB) interface, for outputting voltage to it, such as... Figure 8 and Figure 12 As shown, the other end of the first circuit board 32 is connected via a BTB interface and a second interface 310 on the second heat-conducting component 31, and a voltage is applied to it; similarly, as... Figure 9 and Figure 11 As shown, one end of the second circuit board 33 is connected to the third interface 3300 on the third heat conductor 330 via a BTB interface, for outputting voltage to the third heat conductor 330, as shown. Figure 9 and Figure 13 As shown, the other end of the second circuit board 33 is connected to the fourth interface 3310 on the fourth heat conductor 331 via the BTB interface, and outputs voltage to the fourth heat conductor 331.

[0068] The first circuit board 32 is electrically connected to the first heat-conducting element 30 and the second heat-conducting element 31, and is used to apply voltage to the first heat-conducting element 30 and the second heat-conducting element 31 to change their thermal conductivity. The second circuit board 3 is electrically connected to the third heat-conducting element 330 and the fourth heat-conducting element 331, and is used to apply voltage to the third heat-conducting element 330 and the fourth heat-conducting element 331 to change their thermal conductivity.

[0069] According to the electronic device provided in the embodiments of this application, the display screen 2 is a flexible screen. Because of its bendable characteristics, the flexible screen does not have a glass cover. Therefore, the surface strength of the flexible screen is much weaker than that of a flat screen with a glass cover.

[0070] The electronic device provided according to the embodiments of this application, such as Figure 5, Figure 6 , Figure 7 As shown, the electronic device also includes a secondary screen 6 and a cover plate 7; the secondary screen 6 is disposed on the side of the first housing 11 away from the display screen 2, and the cover plate 7 is disposed on the side of the second housing 12 away from the display screen 2; wherein, in this embodiment, the secondary screen 6 is used by the user when the display screen 2 is in a folded state, and the cover plate 7 is specifically a battery cover plate, which not only prevents the first battery 71 and the second battery 72 from falling off, but also protects the electronic device.

[0071] Furthermore, the first heat-conducting element 30 and the second heat-conducting element 31 are both disposed on the side of the display screen 2 near the first housing 11, the third heat-conducting element 330 is disposed on the side of the display screen 2 near the second housing 12, and the fourth heat-conducting element 331 is disposed on the side of the cover plate 7 near the second housing 12.

[0072] Specifically, such as Figure 4 and Figure 7 As shown, the first heat-conducting component 30 is attached to the inner side of the first housing 11, the third heat-conducting component 330 is attached to the inner side of the second housing 12, the second heat-conducting component 31 is attached to the inner side of the sub-screen 6, and the fourth heat-conducting component 331 is attached to the inner side of the cover plate 7.

[0073] In some embodiments, the display screen 2 is a flexible screen and the secondary screen 6 is a flat screen. In this case, the secondary screen 6 is arranged around the rear camera. In order to avoid the camera, the secondary screen 6 is arranged in an "L" shape on the upper half of the first housing 11.

[0074] In other embodiments, the display screen 2 is a flat screen, and the electronic device is a non-foldable electronic device. The secondary screen 6 can be a flat screen or a flexible screen.

[0075] In other embodiments, both the display screen 2 and the secondary screen 6 can be configured as flexible screens, in which case the secondary screen 6 can be foldably disposed on the back of the first housing 11.

[0076] In addition, such as Figure 1 and Figure 6 As shown, a first battery 71 for supplying power to the first circuit board 32 is disposed below the first circuit board 32, and a second battery 72 for supplying power to the second circuit board 33 is disposed below the second circuit board 33.

[0077] This application also provides a method for controlling an electronic device, wherein the electronic device is the aforementioned electronic device, which will not be described in detail here. Figure 16 As shown, the control methods include:

[0078] Step S101: Obtain the ambient temperature of the electronic device;

[0079] Step S102: When the ambient temperature is higher than the first temperature, adjust the thermal conductivity of the first heat-conducting component to be lower than that of the second heat-conducting component, and the heat of the circuit board is transferred to the housing through the second heat-conducting component;

[0080] Step S103: When the ambient temperature is lower than the second temperature, the thermal conductivity of the first heat-conducting component is adjusted to be greater than that of the second heat-conducting component, and the heat of the circuit board is transferred to the display screen through the first heat-conducting component.

[0081] The first temperature is higher than the second temperature.

[0082] Specifically, the electronic device obtains the ambient temperature of the electronic device through the temperature sensor 4, converts the detected ambient temperature information into an electrical signal and outputs it to the circuit board 3. The circuit board 3 receives the electrical signal transmitted by the temperature sensor 4. When the ambient temperature is detected to be higher than the first temperature, the processor in the electronic device applies a reduction in voltage to the circuit board 3, thereby adjusting the thermal conductivity of the first heat-conducting element 30 to be lower than the thermal conductivity of the second heat-conducting element 31. The heat of the circuit board 3 is transferred to the housing 1 through the second heat-conducting element 31, reducing the temperature on the screen.

[0083] When the detected ambient temperature is lower than the second temperature, the processor in the electronic device applies voltage to the circuit board 3 and adjusts the thermal conductivity of the first heat-conducting component 30 to be greater than that of the second heat-conducting component 31. The heat of the circuit board 3 is transferred to the screen through the first heat-conducting component 30, which heats up the display screen 2, preventing the display screen 2 from breaking due to excessively low temperature and realizing the recovery and reuse of heat.

[0084] Furthermore, when the detected ambient temperature is higher than the first temperature but lower than the second temperature, the voltage applied to the circuit board 3 by the processor in the electronic device is adjusted to the median value, and the thermal conductivity of the first heat-conducting component 30 is adjusted to be equal to that of the second heat-conducting component 31. Part of the heat inside the electronic device diffuses towards the display screen 2, heating the display screen 2, while the other part of the heat diffuses towards the casing 1. This prevents the user from getting burned during use, while reducing the heat of the entire electronic device, making the electronic device run faster and improving its performance.

[0085] In embodiments of this application, a control method for an electronic device is provided. The electronic device comprises a housing 1 and a display screen 2, which together form a cavity 10 for accommodating other functional components. The display screen 2 displays information required by the user. A circuit board 3 is disposed within the cavity 10. A first heat-conducting element 30 is provided on the side of the circuit board 3 facing the display screen 2, and a second heat-conducting element 31 is provided on the side of the circuit board 3 facing the housing 1. When the ambient temperature of the electronic device is higher than a first temperature, the thermal conductivity of the first heat-conducting element 30 is adjusted to be lower than that of the second heat-conducting element 31; when the ambient temperature of the electronic device is lower than a second temperature, the thermal conductivity of the first heat-conducting element 30 is adjusted to be higher than that of the second heat-conducting element 31. The first temperature is higher than the second temperature. By adjusting the thermal conductivity of the first heat-conducting element 30 and the second heat-conducting element 31, this application enables the display screen 2 to dissipate heat at high temperatures and protect the screen at low temperatures, making the temperature of the display screen 2 more stable, improving the reliability of the display screen 2, and enhancing the user experience.

[0086] It should be noted that adjusting the thermal conductivity of the first heat-conducting element 30 to be less than that of the second heat-conducting element 31 includes reducing the voltage across the first heat-conducting element 30 and increasing the voltage across the second heat-conducting element 31; adjusting the thermal conductivity of the first heat-conducting element 30 to be greater than that of the second heat-conducting element 31 includes increasing the voltage across the first heat-conducting element 30 and decreasing the voltage across the second heat-conducting element 31.

[0087] Furthermore, adjusting the thermal conductivity of the third heat-conducting element 330 to be less than that of the fourth heat-conducting element 331 includes reducing the voltage across the third heat-conducting element 330 and increasing the voltage across the fourth heat-conducting element 331; adjusting the thermal conductivity of the third heat-conducting element 330 to be greater than that of the fourth heat-conducting element 331 includes increasing the voltage across the third heat-conducting element 330 and decreasing the voltage across the fourth heat-conducting element 331.

[0088] Specifically, when the ambient temperature of the electronic device is higher than the first temperature, the temperature of the display screen 2 rises. The processor in the electronic device adjusts the voltage across the first circuit board 32, causing the thermal conductivity of the first heat-conducting component 30 to decrease and the thermal conductivity of the second heat-conducting component 31 to increase. The thermal conductivity of the first heat-conducting component 30 is less than that of the second heat-conducting component 31. The heat on the display screen 2 diffuses towards the housing 1 (along the first heat dissipation channel), and the temperature of the display screen 2 gradually decreases.

[0089] Similarly, the processor in the electronic device adjusts the voltage across the second circuit board 33, causing the thermal conductivity of the third heat conductor 330 to decrease and the thermal conductivity of the fourth heat conductor 331 to increase. The thermal conductivity of the third heat conductor 330 is less than that of the fourth heat conductor 331, and the heat on the display screen 2 diffuses towards the cover plate 7 (along the third heat dissipation channel), and the temperature of the display screen 2 gradually decreases.

[0090] When the ambient temperature of the electronic device is lower than the second temperature, the temperature of the display screen 2 decreases. The processor in the electronic device adjusts the voltage across the first circuit board 32, the thermal conductivity of the first heat-conducting component 30 increases, and the thermal conductivity of the second heat-conducting component 31 decreases. The heat in the electronic device diffuses from the inside of the electronic device toward the display screen 2 (along the second heat dissipation channel), raising the temperature of the display screen 2. This prevents the display screen 2 from breaking due to excessively low temperature while simultaneously recovering and reusing the heat.

[0091] Similarly, the processor in the electronic device adjusts the voltage across the second circuit board 33, the thermal conductivity of the third heat-conducting component 330 increases, and the thermal conductivity of the fourth heat-conducting component 331 decreases. Heat in the electronic device diffuses from the inside of the electronic device toward the display screen 2 (along the fourth heat dissipation channel), raising the temperature of the display screen 2. This prevents the display screen 2 from breaking due to excessively low temperature while simultaneously recovering and reusing the heat.

[0092] It should be noted that this application can achieve the following beneficial effects:

[0093] (1) Adjust the thermal conductivity of the heat-conducting component according to the ambient temperature to improve the reliability of the display screen 2 and prevent it from breaking due to low temperature or failing to close due to excessive force when opening the phone in a low temperature environment, and causing excessive temperature to affect its use in a high temperature environment.

[0094] (2) Make full use of the heat generated inside electronic devices to achieve heat energy recovery and reuse.

[0095] The electronic devices in this application embodiment can be mobile phones, tablets, laptops, ultra-mobile personal computers (UMPCs), handheld computers, netbooks, personal digital assistants (PDAs), wearable electronic devices, virtual reality devices, and other electronic devices with display functions. This application embodiment does not impose any restrictions on them.

[0096] In this embodiment, the heat dissipation channel of the electronic device can be changed according to the ambient temperature, and any structure that can achieve heat energy recovery while making the temperature of the display screen 2 more stable is acceptable. No specific structure is limited.

[0097] Furthermore, the control system of the control method provided in this application is described below, and the control system of the control method described below can be referred to in correspondence with the control method described above.

[0098] In this embodiment, as Figure 17As shown, the control system of the control method includes: an acquisition module 171, a first adjustment module 172, and a second adjustment module 173.

[0099] The acquisition module 171 is used to acquire the ambient temperature of the electronic device. The first adjustment module 172 is used to adjust the thermal conductivity of the first heat-conducting element 30 to be less than the thermal conductivity of the second heat-conducting element 31 when the ambient temperature is higher than a first temperature, so that the heat from the circuit board 3 is transferred to the housing 1 via the second heat-conducting element 31. The second adjustment module 173 is used to adjust the thermal conductivity of the first heat-conducting element 30 to be greater than the thermal conductivity of the second heat-conducting element 31 when the ambient temperature is lower than a second temperature, so that the heat from the circuit board 3 is transferred to the display screen 2 via the first heat-conducting element 30. The first temperature is higher than the second temperature.

[0100] The control system in this application embodiment can be an electronic device or a component within an electronic device, such as an integrated circuit or a chip. The electronic device can be a terminal or other devices besides a terminal. For example, the electronic device can be a mobile phone, tablet computer, laptop computer, PDA, in-vehicle electronic device, mobile internet device (MID), augmented reality (AR) / virtual reality (VR) device, robot, wearable device, ultra-mobile personal computer (UMPC), netbook, or personal digital assistant (PDA), etc. It can also be a personal computer (PC), television (TV), ATM, or self-service machine, etc. This application embodiment does not specifically limit the scope of the electronic device.

[0101] Figure 18 An example is a schematic diagram of the physical structure of an electronic device, such as... Figure 18As shown, the electronic device may include a processor 1010, a communications interface 1020, a memory 1030, and a communication bus 1040. The processor 1010, communications interface 1020, and memory 1030 communicate with each other via the communication bus 1040. The processor 1010 can call logic instructions in the memory 1030 to execute a control method. This control method includes: acquiring the ambient temperature of the electronic device; when the ambient temperature is higher than a first temperature, adjusting the thermal conductivity of the first heat-conducting element 30 to be lower than the thermal conductivity of the second heat-conducting element 31, so that the heat from the circuit board 3 is transferred to the housing 1 via the second heat-conducting element 31; when the ambient temperature is lower than a second temperature, adjusting the thermal conductivity of the first heat-conducting element 30 to be greater than the thermal conductivity of the second heat-conducting element 31, so that the heat from the circuit board 3 is transferred to the display screen 2 via the first heat-conducting element 30; wherein the first temperature is higher than the second temperature.

[0102] Furthermore, the logical instructions in the aforementioned memory 1030 can be implemented as software electronic components and, when sold or used as independent products, can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of this application, in essence, or the part that contributes to the prior art, or a portion of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute all or part of the steps of the methods in the various embodiments of this application. The aforementioned storage medium includes various media capable of storing program code, such as USB flash drives, portable hard drives, read-only memory (ROM), random access memory (RAM), magnetic disks, or optical disks.

[0103] On the other hand, this application also provides a computer program product, which includes a computer program that can be stored on a computer-readable storage medium. When the computer program is executed by a processor, the computer can execute the control methods provided by the above methods. The control method includes: acquiring the ambient temperature of the electronic device; when the ambient temperature is higher than a first temperature, adjusting the thermal conductivity of the first heat-conducting element 30 to be less than the thermal conductivity of the second heat-conducting element 31, so that the heat of the circuit board 3 is transferred to the housing 1 through the second heat-conducting element 31; when the ambient temperature is lower than a second temperature, adjusting the thermal conductivity of the first heat-conducting element 30 to be greater than the thermal conductivity of the second heat-conducting element 31, so that the heat of the circuit board 3 is transferred to the display screen 2 through the first heat-conducting element 30; wherein the first temperature is higher than the second temperature.

[0104] In another aspect, this application also provides a computer-readable storage medium, which includes a stored program, wherein the program executes the control methods provided by the above methods when it runs. The control method includes: acquiring the ambient temperature of the electronic device; when the ambient temperature is higher than a first temperature, adjusting the thermal conductivity of the first heat-conducting element 30 to be less than the thermal conductivity of the second heat-conducting element 31, so that the heat of the circuit board 3 is transferred to the housing 1 through the second heat-conducting element 31; when the ambient temperature is lower than a second temperature, adjusting the thermal conductivity of the first heat-conducting element 30 to be greater than the thermal conductivity of the second heat-conducting element 31, so that the heat of the circuit board 3 is transferred to the display screen 2 through the first heat-conducting element 30; wherein the first temperature is higher than the second temperature.

[0105] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0106] Although embodiments of this application have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of this application, the scope of which is defined by the claims and their equivalents.

Claims

1. An electronic device, characterized in that, include: The device comprises a housing, a display screen, a functional module, and a circuit board, wherein the functional module is mounted on the circuit board, and the display screen is a flexible screen. The electronic device is a foldable electronic device. The housing includes a first housing and a second housing that are hinged to each other. The circuit board includes a first circuit board and a second circuit board. The electronic device also includes a first heat-conducting component, a second heat-conducting component, a third heat-conducting component, and a fourth heat-conducting component. The first housing and the display screen form a first receiving cavity, the second housing and the display screen form a second receiving cavity, the first circuit board is disposed in the first receiving cavity, and the second circuit board is disposed in the second receiving cavity; The first heat-conducting component is provided on the side of the first circuit board facing the display screen, the second heat-conducting component is provided on the side of the first circuit board facing the first housing, the third heat-conducting component is provided on the side of the second circuit board facing the display screen, and the fourth heat-conducting component is provided on the side of the second circuit board facing the second housing. The thermal conductivity of the first heat-conducting component, the second heat-conducting component, the third heat-conducting component, and the fourth heat-conducting component is adjustable. The electronic device further includes a secondary screen and a cover plate; the secondary screen is disposed on the side of the first housing opposite to the display screen, and the cover plate is disposed on the side of the second housing opposite to the display screen; When the ambient temperature of the electronic device is higher than the first temperature, the thermal conductivity of the first heat-conducting component is adjusted to be less than that of the second heat-conducting component, and the heat of the display screen diffuses along the first heat dissipation channel through the second heat-conducting component toward the housing; and the thermal conductivity of the third heat-conducting component is adjusted to be less than that of the fourth heat-conducting component, and the heat of the display screen diffuses along the third heat dissipation channel through the fourth heat-conducting component toward the cover plate. When the ambient temperature of the electronic device is lower than the second temperature, the thermal conductivity of the first thermal conductive element is adjusted to be greater than that of the second thermal conductive element, and the heat in the electronic device diffuses along the second heat dissipation channel through the first thermal conductive element toward the display screen; and the thermal conductivity of the third thermal conductive element is adjusted to be greater than that of the fourth thermal conductive element, and the heat in the electronic device diffuses along the fourth heat dissipation channel through the third thermal conductive element toward the display screen; and when the functional module is in working state, the heat generated by the functional module is conducted to the display screen through the first thermal conductive element. The first temperature is higher than the second temperature.

2. The electronic device according to claim 1, characterized in that, The first and second thermal conductive components are electrically connected to the circuit board. The thermal conductivity of the first and second thermal conductive components is adjusted by regulating the voltage on the circuit board.

3. The electronic device according to claim 2, characterized in that, The first and second thermal conductive elements are thin films made of strontium cobalt oxide material; The crystal form of the strontium cobalt oxide material differs when different voltages are applied to both sides of the thin film.

4. The electronic device according to claim 2, characterized in that, The electronic device also includes a temperature sensor, which is mounted on the circuit board and is used to detect the ambient temperature.

5. The electronic device according to claim 4, characterized in that, The functional module includes at least one of a camera, a processor, or an audio device.

6. A control method for an electronic device, characterized in that, The electronic device is the electronic device according to any one of claims 1-5, and the control method includes: Obtain the ambient temperature of the electronic device; When the ambient temperature is higher than the first temperature, the thermal conductivity of the first thermal conductive element is adjusted to be less than that of the second thermal conductive element, and the heat of the circuit board is transferred to the housing through the second thermal conductive element; When the ambient temperature is lower than the second temperature, the thermal conductivity of the first thermal conductive element is adjusted to be greater than that of the second thermal conductive element, and the heat of the circuit board is transferred to the display screen through the first thermal conductive element. The first temperature is higher than the second temperature.

7. The control method for an electronic device according to claim 6, characterized in that, Adjusting the thermal conductivity of the first thermal conductive element to be less than that of the second thermal conductive element includes reducing the voltage across the first thermal conductive element and increasing the voltage across the second thermal conductive element. Adjusting the thermal conductivity of the first thermally conductive element to be greater than that of the second thermally conductive element includes increasing the voltage across the first thermally conductive element and decreasing the voltage across the second thermally conductive element.

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