A semiconductor silicon wafer processing cooling apparatus

Abstract

The application relates to the technical field of semiconductor processing, in particular to a semiconductor silicon wafer processing cooling device, which comprises a processing table, a cooling base for placing a wafer is arranged at the upper end of the processing table, a vertical guide rail is fixedly arranged at one end of the moving side plate close to the processing table, a mounting seat is slidably arranged on the vertical guide rail, a cylinder seat is fixedly arranged at one side of the mounting seat, a rotary cylinder is fixedly arranged in the cylinder seat, a grinding cutter seat is fixedly connected to the output end of the rotary cylinder, a plurality of grinding teeth edges are equidistantly arranged at the bottom edge of the grinding cutter seat in the circumferential direction, the top end of the grinding cutter seat is rotatably arranged in a fixing seat, and grinding cooling assemblies are symmetrically arranged at the two sides of the fixing seat. In the application, the grinding teeth edges in the grinding area can be quickly cooled after grinding and then used for the next grinding, the cooling effect is good, and the grinding performance of the grinding teeth edges can be effectively prevented from being reduced due to overheating during grinding.

Description

Technical Field

[0001] This invention relates to the field of semiconductor processing technology, and in particular to a cooling device for semiconductor silicon wafer processing. Background Technology

[0002] Silicon wafers, also known as silicon ingots, are made from silicon ingots. Through specialized processes, millions of transistors can be etched onto silicon wafers, which are widely used in the manufacture of integrated circuits.

[0003] To control the thickness and flatness of silicon wafers, grinding is required. The grinding process can meet the very high flatness requirements of highly integrated semiconductor devices. Currently, in the grinding process of semiconductor silicon wafers, the high-speed rotation of the grinding blades generates a large amount of heat, which is concentrated on the grinding blades, causing the grinding blades to overheat and seriously affecting the grinding quality, and may even damage the wafers. Summary of the Invention

[0004] The purpose of this invention is to provide a semiconductor silicon wafer processing cooling device to solve the above-mentioned technical problems.

[0005] The objective of this invention can be achieved through the following technical solutions:

[0006] A semiconductor silicon wafer processing cooling device includes a processing table, a cooling base for placing wafers is provided on the upper end of the processing table, slide rails are provided on both sides of the processing table, and movable side plates are slidably mounted on the slide rails via sliders. A vertical guide rail is fixedly provided at the end of the movable side plate near the processing table, and a mounting seat is slidably mounted on the vertical guide rail. A cylinder seat is fixedly provided on one side of the mounting seat, and a rotary cylinder is fixedly provided inside the cylinder seat. A grinding tool holder is fixedly connected to the output end of the rotary cylinder. A plurality of grinding teeth are evenly spaced along the circumferential direction on the bottom edge of the grinding tool holder. The top end of the grinding tool holder is rotatably mounted in a fixed seat. The fixed seat is fixedly connected to the cylinder seat via a fixing rod. Grinding cooling components are symmetrically arranged on both sides of the fixed seat. A wafer cooling component is provided inside the cooling base. A material handling component is provided on one side of the cooling base on the upper end of the processing table.

[0007] The grinding cooling assembly includes an arc-shaped cooling block and a coolant storage tank. The arc-shaped cooling block is fixedly installed at the bottom of the fixed base. One side of the arc-shaped cooling block is bent to form a cooling groove that is arranged along the rotation path of the grinding teeth. Pressure nozzles are provided on the side wall and bottom of the cooling groove. A cooling cavity is provided inside the arc-shaped cooling block. The coolant storage tank is fixedly installed at the upper end of the fixed base. The coolant storage tank and the cooling cavity are connected by a conduit.

[0008] As a further aspect of the present invention: a first threaded sleeve is provided at the bottom of the movable side plate, and a horizontal screw is provided through the internal thread of the first threaded sleeve. The two ends of the horizontal screw are rotatably installed in a rotating seat fixedly provided at the upper end of the processing table, and the horizontal screw is driven to rotate by a first motor.

[0009] As a further aspect of the present invention: the cooling base is fixedly mounted on the mounting base, the bottom projection portion of the mounting base is located on the moving path of the reciprocating linear motion of the grinding tool holder, and the minimum distance between the two arc-shaped cooling blocks is greater than the diameter of the mounting base.

[0010] As a further embodiment of the present invention: a second threaded sleeve is fixedly provided on one side of the mounting base, the internal thread of the second threaded sleeve passes through the vertical screw rod, the bottom end of the vertical screw rod is rotatably connected to the rotating base, and the top end of the vertical screw rod is connected to a second motor, which is fixedly mounted on the top end of the movable side plate through a motor base.

[0011] As a further aspect of the present invention: the wafer cooling assembly includes an air inlet cavity, a liquid cooling cavity, and a vacuum tank. The upper end of the cooling base is provided with a wafer positioning port. The upper end of the wafer positioning port is provided with multiple concentric first ventilation grooves and multiple second ventilation grooves arranged radially along the first ventilation grooves. The first ventilation grooves are connected to the vacuum tank. The air inlet cavity is located inside the cooling base. The air inlet cavity is connected to one of the first ventilation grooves through multiple evenly arranged air inlet holes. The liquid cooling cavity is arranged around the outside of the air inlet cavity.

[0012] As a further aspect of the present invention: an air intake pipe is connected to the bottom of the air intake chamber, a first valve is provided on the air intake pipe, a coolant pipe is connected to the bottom of the liquid cooling chamber, a vacuum nozzle is provided in the vacuum tank, the vacuum nozzle is connected to the vacuum pipe at the bottom, and a second valve is provided on the vacuum pipe.

[0013] As a further aspect of the present invention: the material handling and unloading assembly includes a transfer robotic arm, which is fixedly mounted on the upper end of the processing table. A material handling bin and a material storage bin are respectively provided on both sides of the transfer robotic arm. A transition positioning frustum is provided at one end of the transfer robotic arm near the cooling base. A material unloading adsorption rotating rod and a material handling adsorption rotating rod are provided between the transition positioning frustum and the cooling base.

[0014] The beneficial effects of this invention are:

[0015] (1) By setting up a grinding cooling component, during the grinding process, the coolant in the cooling storage tank is pumped into the cooling chamber through the conduit and then sprayed out through the pressure nozzle. During the rotation of the grinding tool holder, it passes through the cooling grooves at both ends. During this process, the sprayed coolant can quickly cool down the grinding edge. Since the grinding cooling component is symmetrically set at both ends, the grinding edge in the grinding area can be quickly cooled after grinding before the next grinding. The cooling effect is good, thus effectively avoiding the grinding performance degradation caused by the grinding edge overheating during grinding.

[0016] (2) By setting up a wafer cooling component, when the wafer needs to be cooled after grinding, the first valve is opened and the second valve is closed. At this time, the gas source pumps the gas medium into the gas inlet chamber through the gas inlet pipe, and at the same time, the liquid cooling chamber is also filled with coolant through the coolant pipe, so that the gas in the gas inlet chamber can be cooled. The cooled gas is instantly dispersed into the first ventilation slot and the second ventilation slot through the gas inlet hole, so that the wafer can be cooled quickly over a large area. The cooling speed is fast and the cooling effect is good. Attached Figure Description

[0017] The invention will now be further described with reference to the accompanying drawings.

[0018] Figure 1 This is a schematic diagram of the overall structure of the present invention.

[0019] Figure 2 This is a schematic diagram of the movable side plate in this invention.

[0020] Figure 3 This is a schematic diagram of the installation of the grinding tool holder in this invention.

[0021] Figure 4 yes Figure 3 A magnified schematic diagram of the structure at point A in the middle.

[0022] Figure 5 This is a schematic diagram showing the positional relationship between the arc-shaped cooling block and the cooling base in this invention.

[0023] Figure 6 This is a bottom view showing the positional relationship between the arc-shaped cooling block and the cooling base in this invention.

[0024] Figure 7 This is a schematic diagram of the cooling base structure in this invention.

[0025] Figure 8 This is a schematic diagram of the internal structure of the cooling base in this invention.

[0026] In the diagram: 1. Processing table; 101. Slide rail; 102. Horizontal screw; 103. First motor; 2. Cooling base; 201. Mounting base; 202. Wafer positioning port; 3. Moving side plate; 301. Slider; 302. Vertical guide rail; 303. Mounting seat; 304. Cylinder seat; 305. First threaded sleeve; 306. Second threaded sleeve; 307. Second motor; 4. Rotary cylinder; 401. Grinding tool holder; 402. Grinding tooth edge; 403. Fixed seat; 404. Fixed rod; 5. Arc-shaped cooling block; 501. Cooling tank; 502. Pressure nozzle; 503. Cooling chamber; 504. Coolant storage tank; 505. Conduit; 6. Air inlet chamber; 601. Liquid cooling chamber; 602. Vacuum tank; 603. First venting slot; 604. Second venting slot; 605. Air inlet; 606. Air inlet pipe; 607. Coolant pipe; 608. Vacuum nozzle; 609. Vacuum pipe; 7. Transfer robotic arm; 701. Material handling bin; 702. Material storage bin; 703. Transition positioning frustum; 704. Material discharge suction rotating rod; 705. Material handling suction rotating rod. Detailed Implementation

[0027] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0028] Please see Figure 1 and Figure 2 As shown, this invention is a semiconductor silicon wafer processing cooling device, including a processing table 1. A cooling base 2 for placing wafers is provided on the upper end of the processing table 1. Slide rails 101 are provided on both sides of the processing table 1. Movable side plates 3 are slidably mounted on the slide rails 101 via sliders 301. A vertical guide rail 302 is fixedly provided at one end of the movable side plate 3 near the processing table 1. A mounting seat 303 is slidably mounted on the vertical guide rail 302. A cylinder seat 304 is fixedly provided on one side of the mounting seat 303. A cooling device is fixedly installed inside the cylinder seat 304. A rotary cylinder 4 is provided, and a grinding tool holder 401 is fixedly connected to the output end of the rotary cylinder 4. Several grinding teeth 402 are evenly spaced along the circumferential direction on the bottom edge of the grinding tool holder 401. The top of the grinding tool holder 401 is rotatably installed in the fixed seat 403. The fixed seat 403 is fixedly connected to the cylinder seat 304 through the fixed rod 404. Grinding cooling components are symmetrically arranged on both sides of the fixed seat 403. A wafer cooling component is provided inside the cooling base 2. A material picking and unloading component is provided on one side of the cooling base 2 at the top of the processing table 1.

[0029] like Figure 3 and Figure 4As shown, the grinding cooling assembly includes an arc-shaped cooling block 5 and a coolant storage tank 504. The arc-shaped cooling block 5 is fixedly installed at the bottom of the fixed base 403. One side of the arc-shaped cooling block 5 is bent to form a cooling groove 501 that is arranged along the rotation path of the grinding tooth cutting edge 402. Pressure nozzles 502 are provided on the side wall and bottom of the cooling groove 501. A cooling chamber 503 is provided inside the arc-shaped cooling block 5. The coolant storage tank 504 is fixedly installed at the upper end of the fixed base 403. The coolant storage tank 504 and the cooling chamber 503 are connected by a conduit 505.

[0030] Specifically, the movable side plate 3 can move linearly back and forth along the slide rail 101, while the rotary cylinder 4 can drive the grinding tool holder 401 and the grinding teeth 402 to rotate at high speed, thereby realizing the reciprocating grinding of the wafer. Combined with the vertical lifting movement of the mounting base 303, the grinding depth can be controlled and adjusted. During grinding, the coolant in the cooling storage tank is pumped into the cooling chamber 503 through the conduit 505 and then sprayed out through the pressure nozzle 502. As the grinding tool holder 401 rotates, it passes through the cooling grooves 501 at both ends. During this process, the sprayed coolant can quickly cool the grinding teeth 402. Because the grinding cooling components are symmetrically arranged at both ends, the grinding teeth 402 in the grinding area can be quickly cooled after grinding before the next grinding cycle, resulting in good cooling effect and effectively preventing the grinding teeth 402 from overheating and causing a decrease in grinding performance.

[0031] like Figure 1 As shown, a first threaded sleeve 305 is provided at the bottom of the movable side plate 3. A horizontal screw 102 is provided through the internal thread of the first threaded sleeve 305. The two ends of the horizontal screw 102 are rotatably installed in the rotating seat fixedly set on the upper end of the processing table 1. The horizontal screw 102 is driven to rotate by the first motor 103.

[0032] Specifically, when the first motor 103 starts, it drives the horizontal screw 102 to rotate. The horizontal screw 102, through the first screw sleeve 305, drives the entire movable side plate 3 to move horizontally and linearly along the slide rail 101, thereby enabling the grinding tool holder 401 to reciprocate as a whole. During the movement, the rotary cylinder 4 drives the grinding teeth 402 to rotate at high speed, thereby achieving the grinding process on the wafer. Combined with the vertical feed movement of the mounting base 303, the grinding depth can also be controlled and adjusted. In actual application, a guide rod (not shown in the figure) is also slidably installed at the bottom of the movable side plate 3 through a rotating sleeve. The movable side plate 3 always slides along the guide rod during the movement. The function of the guide rod is to limit and guide the linear displacement of the movable side plate 3 to ensure its stability and balance during the displacement process.

[0033] like Figure 5 and Figure 6As shown, the cooling base 2 is fixedly mounted on the mounting base 201. The bottom projection of the mounting base 201 is located on the reciprocating linear motion path of the grinding tool holder 401, and the minimum distance between the two arc-shaped cooling blocks 5 is greater than the diameter of the mounting base 201.

[0034] Specifically, the minimum distance between the two arc-shaped cooling blocks 5 is L, and the diameter of the mounting base 201 is D. Since L > D, the mounting base 201 will always pass back and forth between the two arc-shaped cooling blocks 5 during the reciprocating linear cutting of the wafer by the grinding tool holder 401, effectively avoiding the problem of structural interference.

[0035] like Figure 2 As shown, a second threaded sleeve 306 is fixedly installed on one side of the mounting base 303. The internal thread of the second threaded sleeve 306 passes through the vertical screw rod. The bottom end of the vertical screw rod is rotatably connected to the rotating seat. The top end of the vertical screw rod is connected to a second motor 307. The second motor 307 is fixedly installed on the top end of the movable side plate 3 through a motor seat.

[0036] Specifically, when the second motor 307 starts, it drives the vertical screw to rotate. The vertical screw drives the mounting base 303 to move up and down along the vertical guide rail 302 through the second screw sleeve 306. This, in conjunction with the grinding tooth 402, performs a reciprocating linear cutting process on the wafer. The grinding depth is controlled and adjusted by controlling the displacement of the grinding tooth 402 in the vertical direction.

[0037] like Figure 7 and Figure 8 As shown, the wafer cooling assembly includes an air inlet chamber 6, a liquid cooling chamber 601, and a vacuum tank 602. The upper end of the cooling base 2 is provided with a wafer positioning port 202. The upper end of the wafer positioning port 202 is provided with multiple concentric first ventilation grooves 603 and multiple second ventilation grooves 604 arranged radially along the first ventilation grooves 603. The first ventilation grooves 603 are connected to the vacuum tank 602. The air inlet chamber 6 is located inside the cooling base 2. The air inlet chamber 6 is connected to one of the first ventilation grooves 603 through multiple evenly arranged air inlets 605. The liquid cooling chamber 601 is arranged around the outside of the air inlet chamber 6.

[0038] Specifically, the diameter of the wafer positioning port 202 is adapted to the size of the wafer to be processed. During processing, the wafer is locked and fixed by the wafer positioning port 202. By setting the first venting groove 603 and the second venting groove 604 that are interconnected, the vacuuming area and the cooling area can be effectively increased, which can not only ensure the stability during vacuuming and adsorption, but also effectively improve the cooling rate and cooling effect.

[0039] like Figure 7 and Figure 8As shown, an air intake pipe 606 is connected to the bottom of the air intake chamber 6, and a first valve is installed on the air intake pipe 606. A coolant pipe 607 is connected to the bottom of the liquid cooling chamber 601. A vacuum nozzle 608 is installed in the vacuum tank 602. The vacuum nozzle 608 is connected to the vacuum pipe 609 at the bottom, and a second valve is installed on the vacuum pipe 609.

[0040] Specifically, the air intake pipe 606 is connected to an external air source, and the vacuum pipe 609 is connected to an external vacuum system. The air source and the vacuum system can be installed inside the processing table 1. The structural components of the air source and the vacuum system are known in the prior art and will not be described in detail here. During the grinding process, the wafer needs to be adsorbed and fixed. Therefore, the first valve is closed and the second valve is opened. The vacuum system draws air through the vacuum nozzle 608 and forms a negative pressure adsorption area in the first venting groove 603 and the second venting groove 604, so that the wafer is firmly adsorbed in the wafer positioning port 202 during the grinding process. When the wafer needs to be cooled after the grinding process, the first valve is opened and the second valve is closed. At this time, the gas source pumps gas medium into the air intake chamber 6 through the air intake pipe 606. At the same time, the liquid cooling chamber 601 is also filled with coolant through the coolant pipe 607, thereby cooling the gas in the air intake chamber 6. The cooled gas is instantly dispersed into the first venting groove 603 and the second venting groove 604 through the air intake hole 605, so that the wafer can be rapidly cooled over a large area. The cooling speed is fast and the cooling effect is good.

[0041] like Figure 1 As shown, the material handling and unloading assembly includes a transfer robotic arm 7, which is fixedly mounted on the upper end of the processing table 1. A material handling bin 701 and a material storage bin 702 are respectively provided on both sides of the transfer robotic arm 7. A transition positioning frustum 703 is provided at one end of the transfer robotic arm 7 near the cooling base 2. A material unloading adsorption rotating rod 704 and a material handling adsorption rotating rod 705 are provided between the transition positioning frustum 703 and the cooling base 2.

[0042] Specifically, the picking bin 701 contains unprocessed wafers. During processing, the transfer robotic arm 7 removes the wafer from the picking bin 701 and places it into the transition positioning frustum 703. Multiple radially movable positioning posts are slidably mounted on the upper end of the transition positioning frustum 703. These posts move synchronously to accurately position the wafer at its axis, ensuring that the feeding suction rod 704 reaches the precise suction position when rotating at a preset angle. The feeding suction rod 704 then holds the wafer and rotates in the opposite direction by a preset angle so that the wafer is precisely aligned with the cooling plate. The wafer positioning port 202 on the base 2 is used to realize the feeding process. After the wafer grinding is completed, the pick-up suction rod 705 picks up the processed wafer from the wafer positioning port 202 and rotates it at a preset angle to place the wafer back into the transition positioning frustum 703. The positioning column positions the processed wafer again so that the transfer robot arm 7 can accurately pick it up. After the transfer robot arm 7 picks up the processed wafer, it places it into the storage bin 702, thus completing one cycle of feeding and picking. This process is repeated continuously to achieve efficient wafer processing.

[0043] Among them, the transfer robotic arm 7 is a conventional robotic arm structure used in the field of mechanical production, which can realize the functions of clamping and moving workpieces. Its specific structure is known in the prior art and will not be described in detail here. The structure of the unloading adsorption rotor 704 and the picking adsorption rotor 705 are both composed of a rotary motor, a connecting rod and an adsorption plate. The transition positioning frustum 703 and the cooling base 2 are located on the rotation path of the two connecting rods to ensure that the unloading adsorption rotor 704 and the picking adsorption rotor 705 can be accurately rotated and positioned.

[0044] The working principle of this invention is as follows: Figures 1-8As shown, during processing, the transfer robotic arm 7 takes the wafer to be processed from the material hopper 701 and places it into the transition positioning frustum 703. The material release suction rod 704 suctions the wafer and rotates it in the opposite direction at a preset angle so that the wafer is aligned with the wafer positioning port 202 on the cooling base 2 to realize the material release process. At this time, the first valve is closed and the second valve is opened. The vacuum system draws air through the vacuum nozzle 608 and forms a negative pressure suction area in the first ventilation groove 603 and the second ventilation groove 604, so that the wafer is firmly suctioned in the wafer positioning port 202 during the grinding process. The first motor 103 starts and drives the moving side plate 3 to move horizontally and linearly along the slide rail 101 through the horizontal screw 102. At the same time, the rotary cylinder 4 drives the grinding tooth 402 to rotate at high speed, thereby realizing the grinding process of the wafer. With the feed movement of the mounting base 303 in the vertical direction, the grinding depth can be controlled and adjusted. During the grinding process, the coolant in the cooling storage tank is pumped into the cooling chamber 503 through the conduit 505 and then sprayed out through the pressure nozzle 502. As the grinding tool holder 401 rotates, it passes through the cooling grooves 501 at both ends. During this process, the sprayed coolant can quickly cool down the grinding cutting edge 402. After grinding is completed, the first valve is opened and the second valve is closed. At this time, the gas source pumps gas medium into the air intake chamber 6 through the air intake pipe 606. At the same time, the liquid cooling chamber 601 is also filled with coolant through the coolant pipe 607, which can cool the gas in the air intake chamber 6. The cooled gas is instantly dispersed into the first ventilation groove 603 and the second ventilation groove 604 through the air intake hole 605, so that the wafer can be rapidly cooled over a large area. Then, the pick-up and suction rotating rod 705 picks up the processed wafer from the wafer positioning port 202 and rotates it at a preset angle to place the wafer back into the transition positioning frustum 703. Then, the transfer robotic arm 7 takes out the processed wafer and places it into the storage bin 702, completing the entire cooling process.

[0045] The foregoing has provided a detailed description of one embodiment of the present invention, but this description is merely a preferred embodiment and should not be construed as limiting the scope of the invention. All equivalent variations and modifications made within the scope of the claims of this invention should still fall within the patent coverage of this invention.

Claims

1. A semiconductor silicon wafer processing cooling device, comprising a processing table (1), the upper end of which is provided with a cooling base (2) for placing a wafer, characterized in that, The processing platform (1) is provided with slide rails (101) on both sides, a movable side plate (3) is slidably installed on the slide rails (101) through a sliding block (301), a vertical guide rail (302) is fixedly arranged at one end of the movable side plate (3) close to the processing platform (1), an installation seat (303) is slidably installed on the vertical guide rail (302), a pneumatic cylinder seat (304) is fixedly arranged on one side of the installation seat (303), a rotary pneumatic cylinder (4) is fixedly arranged in the pneumatic cylinder seat (304), a grinding tool seat (401) is fixedly connected to the output end of the rotary pneumatic cylinder (4), a plurality of grinding tooth edges (402) are equidistantly arranged on the bottom edge of the grinding tool seat (401) in the circumferential direction, the grinding tool seat (401) is rotatably installed in a fixed seat (403), the fixed seat (403) is fixedly connected with the pneumatic cylinder seat (304) through a fixed rod (404), and grinding cooling assemblies are symmetrically arranged on both sides of the fixed seat (403); a wafer cooling assembly is arranged in the cooling base (2), and a material taking and placing assembly is arranged on one side of the cooling base (2) and on the upper end of the processing platform (1). The grinding cooling assembly comprises arc-shaped cooling blocks (5) and a cooling liquid storage tank (504), the arc-shaped cooling blocks (5) are fixedly arranged at the bottom of the fixed seat (403), a cooling groove (501) is arranged on one side of the arc-shaped cooling block (5) and is arranged along the rotary path of the grinding tooth edge (402), the side wall and the bottom of the cooling groove (501) are provided with a pressure nozzle (502), the arc-shaped cooling block (5) is provided with a cooling cavity (503) in the inside, and the cooling liquid storage tank (504) is fixedly arranged on the upper end of the fixed seat (403) and is in communication with the cooling cavity (503) through a pipeline (505). A first screw sleeve (305) is arranged at the bottom of the movable side plate (3), a horizontal screw rod (102) is threadedly penetratingly arranged in the first screw sleeve (305), the horizontal screw rod (102) is rotatably installed in a rotating seat fixedly arranged on the upper end of the processing platform (1), and the horizontal screw rod (102) is driven to rotate by a first motor (103). The cooling base (2) is fixedly arranged on an installation base (201), the projection of the installation base (201) on the bottom view is located on the movement path of the reciprocating linear motion of the grinding tool seat (401), and the minimum distance between the two arc-shaped cooling blocks (5) is greater than the diameter of the installation base (201).

2. The apparatus according to claim 1, wherein A second screw sleeve (306) is fixedly arranged on one side of the installation seat (303), a vertical screw rod is threadedly penetratingly arranged in the second screw sleeve (306), the bottom end of the vertical screw rod is rotatably connected with the rotating seat, the top end of the vertical screw rod is connected with a second motor (307), and the second motor (307) is fixedly arranged on the top end of the movable side plate (3) through a motor seat.

3. The apparatus according to claim 1, wherein The wafer cooling assembly comprises an air inlet cavity (6), a liquid cooling cavity (601) and a vacuumizing groove (602), the upper end of the cooling base (2) is provided with a wafer positioning opening (202), the upper end of the wafer positioning opening (202) is provided with a plurality of first air passage grooves (603) arranged concentrically and a plurality of second air passage grooves (604) arranged radially along the first air passage grooves (603), the first air passage grooves (603) are communicated with the vacuumizing groove (602), the air inlet cavity (6) is arranged inside the cooling base (2), the air inlet cavity (6) is communicated with one of the first air passage grooves (603) through a plurality of uniformly arranged air inlet holes (605), and the liquid cooling cavity (601) is arranged outside the air inlet cavity (6).

4. The apparatus according to claim 3, wherein The bottom of the air inlet cavity (6) is communicated with an air inlet pipeline (606), the air inlet pipeline (606) is provided with a first valve, the bottom of the liquid cooling cavity (601) is communicated with a cooling liquid pipeline (607), the vacuumizing groove (602) is provided with a vacuumizing air nozzle (608), the vacuumizing air nozzle (608) is communicated with a vacuumizing pipeline (609) at the bottom, and the vacuumizing pipeline (609) is provided with a second valve.

5. The apparatus according to claim 1, wherein The material taking and discharging assembly comprises a transfer mechanical arm (7), the transfer mechanical arm (7) is fixedly arranged at the upper end of the machining table (1), the two sides of the transfer mechanical arm (7) are respectively provided with a material taking bin (701) and a material storage bin (702), one end of the transfer mechanical arm (7) close to the cooling base (2) is provided with a transition positioning circular table (703), and the transition positioning circular table (703) and the cooling base (2) are provided with a material discharging adsorption rotating rod (704) and a material taking adsorption rotating rod (705).

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