High-temperature-resistant composite board substrate and preparation method thereof

Abstract

The present application relates to the field of composite board substrate, especially to a high-temperature-resistant composite board substrate and a preparation method thereof.The high-temperature-resistant composite board substrate comprises, by mass fraction, at least: 100-120 parts of a base resin, 5-15 parts of a modified resin, 1-10 parts of an additive, and 10-30 parts of a filler.The composite board substrate provided in the present application maintains excellent self light transmittance, and the modified resin and glass fiber are added, so that the mechanical properties of the composite substrate can be effectively improved, the thermal stability and high-temperature resistance of the composite substrate can be further enhanced, and the application possibility of the composite substrate in the solar backboard field is ensured.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of composite board substrates, in particular to a high-temperature-resistant composite board substrate and a preparation method thereof. BACKGROUND

[0002] Transparent composite materials, as a new type of decorative and assembly materials, are widely used in various fields such as decorative furniture, ground light columns, various shaped countertops and ornaments, etc. compared with traditional glass and stone materials, because of their excellent toughness, plasticity and low density characteristics. In recent years, in order to further improve the performance of transparent composite materials, functional fillers are added to the composite material system, which expands the application field of composite materials and can be widely used in aerospace, sports goods and household appliance parts, etc.

[0003] However, at the same time, the light transmittance of the composite filler after adding the filler is low, and the light transmittance can only be maintained at about 30-40%, which is not suitable for use in the field of solar cell panels. Therefore, in recent years, high-transparency resin materials have been gradually applied to the field of transparent composite board substrates. The prior art (CN111978459A) provides a PMMA / glass fiber composite material, which mainly adds a large amount of alkali-free glass fiber to the PMMA resin, while maintaining good light transmittance, improving the shrinkage rate matching of the composite material, the structural strength and the impact strength, but the use of the scheme will obviously reduce the thermal stability and high-temperature resistance of the composite material system.

[0004] Therefore, in order to solve the above technical problems, the present application provides a high-temperature-resistant composite board which can have excellent light transmittance and mechanical properties, and further improve the corrosion resistance and waterproof performance of the composite material. SUMMARY

[0005] In order to solve the above problems, the present application provides a high-temperature-resistant composite board substrate, which comprises, by mass fraction, at least: 100-120 parts of a base resin, 5-15 parts of a modified resin, 1-10 parts of an additive, and 10-30 parts of a filler.

[0006] As a preferred scheme, the base resin is at least one of polyurethane resin, polycarbonate resin, vinyl resin, epoxy resin, and polyester resin.

[0007] As a preferred scheme, the base resin is polycarbonate resin and / or polyester resin.

[0008] As a preferred scheme, the base resin is polycarbonate resin.

[0009] As a preferred solution, the modified resin is at least one of a modified epoxy resin, a modified bismaleimide resin, a modified polyurethane acrylate resin, and a low-hydroxyl acrylic resin.

[0010] As a preferred solution, the modified resin is a mixture of a modified epoxy resin and a low-hydroxyl acrylic resin.

[0011] As a preferred solution, the mass ratio of the modified epoxy resin and the low-hydroxyl acrylic resin is 3-6:1-2.

[0012] As a preferred solution, the mass ratio of the modified epoxy resin and the low-hydroxyl acrylic resin is 4:1.5.

[0013] As a preferred solution, the modified epoxy resin is a multifunctional 6100D-85 modified epoxy resin.

[0014] In the present application, by selecting a multifunctional modified epoxy resin and a low-hydroxyl acrylic resin, the heat resistance of the composite material system can be effectively improved, while good mechanical strength and corrosion resistance and waterproof performance are also achieved. The present applicant believes that the multifunctional modified epoxy resin used in the present application can interact with the multifunctional groups in the polycarbonate matrix resin to form connection sites, not only improving the toughness of the system, but also serving as a concentration point for shrinkage stress, thereby absorbing the shrinkage strength in the system and converting it into a crazing state, thereby reducing the upper limit of the propagation of shrinkage stress in the system and strengthening the consistency of shrinkage of the glass fiber and the resin system. On the other hand, the addition of the low-hydroxyl acrylic resin not only serves as a temperature-resistant additive, but also forms good hydrophobic sites in the composite material system, and when in contact with the glass fiber, it can form a good cover film layer to form a low-surface-energy surface, thereby enhancing the dispersion effect of the glass fiber. Especially when the mass ratio of the modified epoxy resin and the low-hydroxyl acrylic resin is 4:1.5, the combined action of the two can effectively maintain the system in a dispersed and stable environment. If the content of the modified epoxy resin is too high, it not only affects the corrosion resistance and waterproofness of the composite material, but also easily forms local phases, thereby reducing the overall performance of the composite material.

[0015] As a preferred solution, the additive is at least one of a waterproofing agent, a flame retardant, an ultraviolet absorber, an anti-dripping agent, a dispersant, a leveling agent, and a leveling aid.

[0016] As a preferred solution, the additive is at least one of an ultraviolet absorber and a waterproofing agent.

[0017] As a preferred solution, the filler is glass fiber.

[0018] As a preferred solution, the visible light transmittance of the substrate is 40-70%.

[0019] As a preferred scheme, the visible light transmittance of the substrate is 50-60%; the tensile strength of the substrate is 80-100 MPa.

[0020] As a preferred scheme, the shrinkage of the substrate is 0.05-0.2%.

[0021] As a preferred scheme, the mass ratio of the base resin, the modified resin and the filler is 105-110:10-12:15-25.

[0022] As a preferred scheme, the mass ratio of the base resin, the modified resin and the filler is 106-108:11-12:16-18.

[0023] As a preferred scheme, the mass ratio of the base resin, the modified resin and the filler is 108:11:16.

[0024] As a preferred scheme, the single-fiber diameter of the glass fiber is 2-10 μm; the refractive index of the glass fiber is 1.2-1.8.

[0025] As a preferred scheme, the single-fiber diameter of the glass fiber is 3-5 μm.

[0026] As a preferred scheme, the refractive index of the glass fiber is 1.5-1.6.

[0027] As a preferred scheme, the refractive index of the base resin is 1.55-1.6.

[0028] The second aspect of the present application provides a preparation method of the above-mentioned high-temperature-resistant composite board substrate, which comprises: co-melting and granulating a base resin and a modified resin to obtain a mixture, further melting the mixture for the second time, adding required additives and fillers, and then solidifying and forming to obtain the composite board substrate.

[0029] The third aspect of the present application provides an application of the above-mentioned high-temperature-resistant composite board substrate, which comprises an application of the composite board substrate in the field of solar cell back plates.

[0030] Advantages:

[0031] 1. The composite board substrate provided in the present application maintains excellent self transmittance, and the modified resin and the glass fiber are added, which can effectively improve the mechanical properties of the composite substrate, further strengthen the thermal stability and high-temperature resistance of the composite substrate, ensure the possibility of application in the field of solar back plates, and on the other hand, the back plate substrate prepared from the composite substrate has excellent weather resistance and waterproof performance, and has very excellent application prospect in the field of back plates.

[0032] 2、The composite board substrate provided in the application can effectively improve the heat resistance of the composite material system while having good mechanical strength and corrosion resistance and waterproof performance by selecting a multi-function modified epoxy resin and a low-hydroxy acrylic resin. When the mass ratio of the modified epoxy resin and the low-hydroxy acrylic resin is 4:1.5, the combined action of the two can effectively maintain the system in a dispersed stable environment, not only improve the toughness of the system, but also serve as a shrinkage stress concentration point, thereby absorbing the shrinkage strength in the system and converting it into a crazing state, thereby reducing the upper limit of the propagation of shrinkage stress in the system and strengthening the shrinkage consistency of the glass fiber and the resin system. On the other hand, the addition of the low-hydroxy acrylic resin not only serves as a temperature-resistant additive, but also forms good hydrophobic sites in the composite material system due to its low-hydroxy characteristics, and forms a good cover film layer when in contact with the glass fiber to form a low-surface-energy surface, thereby strengthening the dispersion effect of the glass fiber. DETAILED DESCRIPTION

[0033] Example 1

[0034] The first aspect of the embodiment provides a high-temperature-resistant composite board substrate, which comprises, in parts by mass, 108 parts of a base resin, 11 parts of a modified resin, 1.5 parts of an additive, and 16 parts of a filler.

[0035] The base resin is a polycarbonate resin with a refractive index of 1.58 and is commercially available as PC2467 from Covestro.

[0036] The modified resin is a mixture of a modified epoxy resin and a low-hydroxy acrylic resin in a mass ratio of 4:1.5. The modified epoxy resin is a multi-function 6100D-85 modified epoxy resin commercially available from Hengzhiguang, and the low-hydroxy acrylic resin is a 7122-XT-50 brand.

[0037] The additive is an ultraviolet absorber, 2,4-dihydroxybenzophenone.

[0038] The filler is glass fiber with a single filament diameter of 3.5 μm and a refractive index of 1.54.

[0039] The high-temperature-resistant composite board substrate prepared in this embodiment has a visible light transmittance of 70.2%, a tensile strength of 92.4 MPa, and a shrinkage rate of 0.12%.

[0040] The second aspect of the embodiment provides a preparation method of the above-mentioned high-temperature-resistant composite board substrate, which comprises: co-melting and granulating the base resin and the modified resin to obtain a mixture, further melting the mixture twice, adding the required additive and filler, and then solidifying and forming to obtain the granules.

[0041] Example 2

[0042] The specific implementation of the present example is the same as that of Example 1, except that the modified resin is a mixture of modified epoxy resin and low-hydroxyl acrylic resin, with a mass ratio of 5:1.

[0043] Comparative Example 1

[0044] The specific implementation of the present example is the same as that of Example 1, except that the modified resin is a mixture of modified epoxy resin and low-hydroxyl acrylic resin, with a mass ratio of 5:1.

[0045] Comparative Example 2

[0046] The specific implementation of the present example is the same as that of Example 1, except that the modified resin is a mixture of modified epoxy resin and low-hydroxyl acrylic resin, with a mass ratio of 5:1.

[0047] Comparative Example 3

[0048] The specific implementation of the present example is the same as that of Example 1, except that the modified resin is a mixture of modified epoxy resin and low-hydroxyl acrylic resin, with a mass ratio of 5:1.

[0049] Performance evaluation

[0050] Heat distortion temperature: The heat distortion temperature of the composite materials prepared in the examples and comparative examples was tested according to the test method of ISO-75f, with an experimental condition of 1.82 MPa. Ten samples were tested for each example and comparative example, and the average value of the measured values was recorded in Table 1.

[0051] Tensile strength: The test speed was 50 mm / min according to the method of GB / T 1040.2-2006.

[0052] Shrinkage: The shrinkage of the product was tested according to the method of ASTM D 955-2008.

[0053] Table 1

[0054]

[0055] As can be seen from Examples 1-2, Comparative Examples 1-3 and Table 1, the composite substrate provided by the present application has good light transmittance and can meet the use of solar backsheet, and at the same time can enhance the heat resistance and waterproofness of the substrate system, avoid the reduction of the two performances in the existing situation, is suitable for popularization in the field of solar backsheet, and has broad development prospects.

Claims

1. A high temperature resistant composite panel substrate, characterized by: The base material comprises, in mass parts, at least 100-120 parts of a base resin, 5-15 parts of a modified resin, 1-10 parts of an additive, and 10-30 parts of a filler; the filler is glass fiber; The modified resin is a mixture of modified epoxy resin and low-hydroxyl acrylic resin; the mass ratio of the modified epoxy resin to the low-hydroxyl acrylic resin is 3-6:1-2; the modified epoxy resin is of the type 6100D-85; and the low-hydroxyl acrylic resin is of the type 7122-XT-50; The base material has a visible light transmittance of 40-70%; and the base resin is polycarbonate resin. The mass ratio of the base resin, the modified resin, and the filler is 105-110:10-12:15-25.

2. The high temperature resistant composite panel substrate of claim 1, wherein: The additive is at least one of waterproof agent, flame retardant, ultraviolet absorber, anti-dripping agent, dispersant, leveling agent, leveling aid, and the like.

3. The high temperature resistant composite panel substrate of claim 2, wherein: The glass fiber has a single-fiber diameter of 2-10 microns and a refractive index of 1.2-1.

8.

4. A method for preparing the high temperature resistant composite board substrate according to any one of claims 1-3, characterized in that: The preparation method comprises: co-melting and granulating the base resin and the modified resin to obtain a mixture, further melting the mixture for the second time, adding the required additive and the filler, and then solidifying and forming to obtain the granules.

5. Use of the high-temperature-resistant composite board substrate according to any one of claims 1-3, characterized in that: The application of the composite board base material in the field of solar cell backboard.

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