High-viscosity high-strength epoxy mortar composition, preparation method and application thereof

Abstract

The application provides a high-stick high-strength epoxy mortar composition, a preparation method and application thereof. The composition comprises the following raw materials in parts by mass: 20-50 parts of an epoxy resin, the epoxy resin comprising a first epoxy resin and a second epoxy resin, the first epoxy resin having a functionality of 2, the second epoxy resin having a functionality greater than 2, and the mass ratio of the first epoxy resin to the second epoxy resin being 1:0.2-5, 10-30 parts of a curing agent, and 30-120 parts of a filler. The high-stick high-strength epoxy mortar composition has good adhesion and compressive strength.

Description

Technical Field

[0001] This application relates to the field of polymer materials technology, specifically to a high-viscosity, high-strength epoxy putty composition, its preparation method, and its application. Background Technology

[0002] Epoxy putty composition is an adhesive made primarily of epoxy resin. It has many significant advantages, exhibiting excellent bonding effects on various metals and non-metals, and has been applied in multiple fields.

[0003] However, with changes in substrates, new raw materials, and usage environments, higher requirements are placed on the performance of epoxy putty compositions. Therefore, it is necessary to improve the adhesion and compressive strength of epoxy putty compositions. Summary of the Invention

[0004] This application provides a high-adhesion, high-strength epoxy putty composition, its preparation method, and its application. The epoxy putty composition has good adhesion and compressive strength.

[0005] In a first aspect, this application provides a high-viscosity, high-strength epoxy putty composition, comprising the following raw materials in parts by weight: 20-50 parts epoxy resin, wherein the epoxy resin comprises a first epoxy resin and a second epoxy resin, the first epoxy resin having a functionality of 2, the second epoxy resin having a functionality greater than 2, the mass ratio of the first epoxy resin to the second epoxy resin being 1:0.2-5, 10-30 parts curing agent, and 30-120 parts filler.

[0006] According to this application, an epoxy putty composition can be obtained by mixing a certain proportion of first epoxy resin and second epoxy resin with a curing agent and filler and then curing. The epoxy putty composition has a high crosslinking density and contains a large number of hydroxyl functional groups. The high crosslinking density combined with the filler can effectively improve the compressive strength of the epoxy putty composition, while the large number of hydroxyl functional groups can effectively improve the adhesion of the epoxy putty composition. Therefore, the epoxy putty composition provided by this application has good adhesion and compressive strength.

[0007] In some embodiments of this application, the first epoxy resin comprises a bisphenol-type epoxy resin, which includes at least one of bisphenol A epoxy resin, bisphenol F epoxy resin, hydrogenated bisphenol A epoxy resin, and bisphenol S epoxy resin, and / or the second epoxy resin comprises at least one of tetraglycidylamine-type epoxy resin, tetraglycidyl ether tetraphenylethane, and tetrafunctional bisphenol C epoxy resin, wherein the tetraglycidylamine-type epoxy resin includes at least one of 4,4-diaminodiphenylmethane tetraglycidylamine, N,N,N',N'-tetraglycidyl-4,4'-diaminodiphenyl ether, and N,N,N',N'-tetraglycidyl-m-phenylenediamine.

[0008] In some embodiments of this application, the curing agent includes at least one of polyamine curing agents and polyamide curing agents.

[0009] In some embodiments of this application, the raw materials of the high-viscosity, high-strength epoxy putty composition further include 1 to 20 parts by weight of an active diluent. The active diluent includes a first active diluent and a second active diluent. The first active diluent includes an epoxy-containing glycidyl ether, and the second active diluent includes at least one of an enamine diluent and a polyetheramine diluent. The epoxy-containing glycidyl ether includes at least one of alkylene glycidyl ether, ethylene glycol diglycidyl ether, benzyl glycidyl ether, and polypropylene glycol diglycidyl ether. The enamine diluent includes at least one of diethylenetriamine, triethylenetetramine, and tetraethylenepentamine, and the polyetheramine diluent includes at least one of polyetheramine 300, polyetheramine 400, and polyetheramine 500.

[0010] In some embodiments of this application, the filler includes at least one of quartz powder, alumina powder, titanium dioxide, calcium carbonate powder, lithopone, and clay; and / or the raw materials of the high-viscosity and high-strength epoxy putty composition, by weight, also include 1 to 20 parts of thixotropic agent, the thixotropic agent including at least one of fumed silica, organobentonite, hydrogenated castor oil, and polyamide wax.

[0011] In some embodiments of this application, the raw materials of the high-viscosity, high-strength epoxy putty composition, by weight, further include 0.1 to 2 parts of pigment, wherein the pigment includes at least one of iron oxide red, iron oxide yellow, iron blue, and iron black; and / or the raw materials of the high-viscosity, high-strength epoxy putty composition, by weight, further include 0.1 to 5 parts of functional additives, wherein the functional additives include at least one of wetting agents and defoamers.

[0012] Secondly, this application provides a method for preparing a high-viscosity, high-strength epoxy putty composition, comprising the following steps:

[0013] A curable high-viscosity, high-strength epoxy putty composition is obtained by mixing the raw materials of the high-viscosity, high-strength epoxy putty composition according to any embodiment of the first aspect.

[0014] According to this application, a curable high-viscosity and high-strength epoxy mortar composition can be obtained by mixing the raw materials of the high-viscosity and high-strength epoxy mortar composition in any embodiment of the first aspect. Therefore, the preparation method is simple, the application range is large, and it has the beneficial effects of any embodiment of the first aspect.

[0015] In some embodiments of this application, the preparation method specifically includes the following steps:

[0016] S10: Component A is obtained by mixing epoxy resin, first reactive diluent, some filler and some thixotropic agent;

[0017] S20: Mix the curing agent, the second reactive diluent, another portion of filler, and another portion of thixotropic agent to obtain component B;

[0018] S30: Mix component A and component B to obtain a curable, high-viscosity, high-strength epoxy putty composition.

[0019] Thirdly, this application provides a liquefied natural gas carrier, including a hull, and

[0020] An insulating box is fixedly bonded to the hull using a high-viscosity, high-strength epoxy putty composition obtained according to any embodiment of the first aspect or the preparation method described in any embodiment of the second aspect.

[0021] According to this application, in a liquefied natural gas (LNG) carrier, the hull and insulation box are bonded using a high-viscosity, high-strength epoxy putty composition according to any embodiment of the first aspect or a high-viscosity, high-strength epoxy putty composition prepared by any method according to any embodiment of the second aspect. Since the epoxy putty composition has good adhesion and compressive strength, it can ensure that the two are stably bonded and not easily displaced, thereby improving the safety of the LNG carrier.

[0022] In some embodiments of this application, the interior of the insulation box includes laminated wood, a weight plate, a saddle panel, and a high-viscosity, high-strength epoxy putty composition prepared according to any embodiment of the first aspect or the preparation method described in any embodiment of the second aspect, which fills the space between the laminated wood, the weight plate, and the saddle panel. Attached Figure Description

[0023] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application.

[0024] Figure 1 This is a cross-sectional schematic diagram of the liquefied natural gas storage tank in the liquefied natural gas carrier of this application.

[0025] Explanation of reference numerals in the attached figures:

[0026] 1. Insulation layer, 11. Main shielding protective film, 12. Main insulation layer, 13. Secondary shielding protective film, 14. Secondary insulation layer, 2. Adhesive layer, 3. Hull.

[0027] The accompanying drawings illustrate specific embodiments of this application, which will be described in more detail below. These drawings and descriptions are not intended to limit the scope of the concept in any way, but rather to illustrate the concept of this application to those skilled in the art through reference to particular embodiments. Detailed Implementation

[0028] The various embodiments or implementation schemes in this specification are described in a progressive manner, with each embodiment focusing on the differences from other embodiments.

[0029] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with an embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0030] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0031] As described in the background section above, with the increasingly widespread application of epoxy putty compositions, the requirements for their adhesion and compressive strength are becoming increasingly stringent. Currently available epoxy putty compositions suffer from low adhesion strength, leading to unstable bonding and resulting in displacement or even peeling at the bond joint. Therefore, it is necessary to improve the adhesion and compressive strength of epoxy putty compositions.

[0032] In view of this, this application provides a high-viscosity, high-strength epoxy putty composition with a high crosslinking density and containing a large number of hydroxyl functional groups, exhibiting good adhesion and compressive strength. The following provides a detailed description of the high-viscosity, high-strength epoxy putty composition, its preparation method, and its applications. The high-viscosity, high-strength epoxy putty composition may be referred to simply as epoxy putty composition.

[0033] In a first aspect, this application provides a high-viscosity, high-strength epoxy putty composition, comprising the following raw materials in parts by weight: 20-50 parts epoxy resin, the epoxy resin comprising a first epoxy resin and a second epoxy resin, the first epoxy resin having a functionality of 2, the second epoxy resin having a functionality greater than 2, the mass ratio of the first epoxy resin and the second epoxy resin being 1:0.2-5, 10-30 parts curing agent, and 30-120 parts filler.

[0034] According to this application, the high-viscosity, high-strength epoxy putty composition includes a certain mass of epoxy resin, curing agent, and filler. The epoxy resin includes a first epoxy resin and a second epoxy resin. The first epoxy resin is a commonly used epoxy resin with a functionality of 2. The second epoxy resin has a functionality greater than 2, which is higher than the first epoxy resin and can effectively increase the content of polar functional groups such as hydroxyl groups in the epoxy putty composition. The inventors have found that by mixing a certain proportion of the first and second epoxy resins with the curing agent and filler and then curing, an epoxy putty composition is obtained. This epoxy putty composition has a high crosslinking density and contains more hydroxyl functional groups. The high crosslinking density combined with the filler can effectively improve the compressive strength of the epoxy putty composition, while the more hydroxyl functional groups can effectively improve the adhesion of the epoxy putty composition. Therefore, the epoxy putty composition provided by this application has good adhesion and compressive strength.

[0035] In this application, the mass ratio of the first epoxy resin to the second epoxy resin is 1:0.2 to 5. This is because if the content of the second epoxy resin is too low, the cross-linking density of the epoxy putty composition will be low and the content of hydroxyl functional groups will be low, which will not effectively improve the adhesion and compressive strength of the epoxy putty composition. On the other hand, if the content of the second epoxy resin is too high, the local cross-linking density in the epoxy putty composition may be too high, which will restrict the movement of molecular chains, resulting in a low degree of epoxy resin reaction and insufficient cross-linking, which will also not effectively improve the adhesion and compressive strength of the epoxy putty composition. For example, the mass ratio of the first epoxy resin to the second epoxy resin can be 1:0.2, 1:0.3, 1:0.4, 1:0.5, 1:0.6, 1:0.7, 1:0.8, 1:0.9, 1:1, 1:1.5, 1:2, 1:2.5, 1:3, 1:3.5, 1:4, 1:4.5, 1:5, or any of the above values. Preferably, when the mass ratio of the first epoxy resin to the second epoxy resin is 1:0.3 to 0.9, the resulting epoxy putty composition exhibits better adhesion and compressive strength. The epoxy resin content in the epoxy putty composition is 20 to 50 parts, at which point the epoxy putty composition exhibits good adhesion and compressive strength. For example, the epoxy resin content can be 20 parts, 25 parts, 30 parts, 35 parts, 40 parts, 45 parts, 50 parts, or any range of the above values.

[0036] This application does not further limit the type of curing agent; any curing agent known in the art for curing crosslinked epoxy resins can be used. The curing agent promotes the crosslinking and curing of the epoxy resin. The curing agent content in the epoxy putty composition is 10 to 30 parts. If the curing agent content is too low, the curing and crosslinking speed will be too slow, which may result in a low crosslinking density, leading to poor adhesion and compressive strength. If the curing agent content is too high, i.e., the content relative to the epoxy resin is too low, even if the crosslinking is fully cured, the adhesion and compressive strength of the resulting epoxy putty composition will still be poor. For example, the curing agent content can be 10 parts, 11 parts, 12 parts, 13 parts, 14 parts, 15 parts, 16 parts, 17 parts, 18 parts, 19 parts, 20 parts, 21 parts, 22 parts, 23 parts, 24 parts, 25 parts, 26 parts, 27 parts, 28 parts, 29 parts, 30 parts, or any range of the above values.

[0037] This application does not further limit the type of filler; fillers known in the art for epoxy putty compositions can be used. The filler can be dispersed within the epoxy putty composition, and in conjunction with the network structure formed by the curing and cross-linking of the epoxy resin, it can effectively disperse stress, improve the adhesion, compressive strength, and hardness of the epoxy putty composition, and save costs. The filler content in the epoxy putty composition is 30–120 parts. If the filler content is too low, it will not effectively achieve the above-mentioned effects, leading to a decrease in the adhesion, compressive strength, and hardness of the epoxy putty composition. If the filler content is too high, the cured and cross-linked epoxy resin may not be able to stably bond the filler, resulting in pulverization of the epoxy putty composition and a decrease in adhesion and compressive strength. For example, the filler content can be 30 parts, 40 parts, 50 parts, 60 parts, 70 parts, 80 parts, 90 parts, 100 parts, 110 parts, 120 parts, or any range of the above values.

[0038] Therefore, the epoxy putty composition provided in this application has good adhesion and compressive strength, making it suitable for various fields, ensuring stable bonding of various materials, and improving the stability and safety of bonded parts. It should also be noted that, in the context of this application, unless otherwise specified, the functionality of epoxy resin refers to the number of epoxy groups in one molecule of epoxy resin.

[0039] In some embodiments of this application, the first epoxy resin includes a bisphenol-type epoxy resin, which includes at least one of bisphenol A epoxy resin, bisphenol F epoxy resin, hydrogenated bisphenol A epoxy resin, and bisphenol S epoxy resin, and / or the second epoxy resin includes at least one of tetraglycidylamine-type epoxy resin, tetraglycidyl ether tetraphenylethane, and tetrafunctional bisphenol C epoxy resin, wherein the tetraglycidylamine-type epoxy resin includes at least one of 4,4-diaminodiphenylmethane tetraglycidylamine, N,N,N',N'-tetraglycidyl-4,4'-diaminodiphenyl ether, and N,N,N',N'-tetraglycidyl-m-phenylenediamine.

[0040] In some of the above embodiments, the first epoxy resin is specifically defined as including bisphenol type epoxy resin, and several commonly used bisphenol type epoxy resins in the art are specifically listed. It is understood that bisphenol type epoxy resins are not limited to the above-mentioned types, and those skilled in the art can select bisphenol type epoxy resins known in the prior art as needed.

[0041] Furthermore, the second epoxy resin is specifically defined as including at least one of tetraglycidylamine type epoxy resin, tetraglycidyl ether tetraphenylethane, and tetrafunctional bisphenol C epoxy resin. These epoxy resins are commonly used in the art for epoxy resins with a functionality greater than 2. Preferably, the second epoxy resin can be a tetraglycidylamine type epoxy resin, which contains more polar groups, thereby further improving the adhesion of the epoxy putty. The above embodiments also specifically list several commonly used tetraglycidylamine type epoxy resins in the art. It is understood that tetraglycidylamine type epoxy resins include, but are not limited to, the above-mentioned types, and those skilled in the art can select tetraglycidylamine type epoxy resins known in the prior art as needed.

[0042] In some embodiments of this application, the curing agent includes at least one of polyamine curing agents and polyamide curing agents.

[0043] In some of the above embodiments, the curing agent may include at least one of polyamine curing agents and polyamide curing agents. It is understood that the curing agent is not limited to these types, and those skilled in the art can select according to actual needs. Preferably, in some embodiments of this application, a polyamide curing agent is used because although the activity of polyamide curing agents is lower than that of polyamine curing agents, they contain more polar groups. Therefore, the epoxy putty composition obtained by curing and crosslinking has better adhesion. Furthermore, since this application uses a certain proportion of two epoxy resins, where the second epoxy resin has higher reactivity, it can effectively increase the crosslinking density of the epoxy putty. To prevent excessively high crosslinking density from causing significant molecular chain movement and resulting in low reactivity, using an amide curing agent with lower curing and crosslinking activity can increase the reactivity of the epoxy putty, thereby more effectively increasing the crosslinking density of the epoxy putty composition. In some embodiments, the polyamide curing agent may include at least one of polyamide 300, polyamide 650, and polyamide 651.

[0044] In some embodiments of this application, the raw materials of the epoxy putty composition, by weight, further include 1 to 20 parts of reactive diluent, the reactive diluent including a first reactive diluent and a second reactive diluent, the first reactive diluent including an epoxy-containing glycidyl ether, the second reactive diluent including at least one of an enamine diluent and a polyetheramine diluent; the epoxy-containing glycidyl ether including at least one of alkylene glycidyl ether, ethylene glycol diglycidyl ether, benzyl glycidyl ether, and polypropylene glycol diglycidyl ether; the enamine diluent including at least one of diethylenetriamine, triethylenetetramine, and tetraethylenepentamine, and the polyetheramine diluent including at least one of polyetheramine 300, polyetheramine 400, and polyetheramine 500.

[0045] In some of the above embodiments, to improve the applicability of the epoxy putty composition, 1 to 20 parts of reactive diluent may be included. The reactive diluent can effectively reduce the viscosity of the epoxy putty composition before curing, which is more conducive to the uniform dispersion of each component in the epoxy putty composition. In turn, it promotes the movement of molecular chains during the crosslinking process. Therefore, the epoxy putty composition with better dispersion has a higher crosslinking density after curing, resulting in better adhesion and compressive strength. In addition, the reactive diluent used in the above embodiments can participate in the curing crosslinking reaction. Therefore, compared with the use of ordinary diluent, it has no volatile components, zero VOC, and is environmentally friendly. Furthermore, it can further improve the crosslinking density of the epoxy putty composition after curing.

[0046] The reactive diluent may further include a first reactive diluent and a second reactive diluent, wherein the first reactive diluent includes glycidyl ether containing epoxy groups, and the second reactive diluent includes at least one of enamine diluents and polyetheramine diluents. This is because, before curing, the epoxy resin and curing agent in the epoxy putty composition need to be stored separately. Therefore, the first reactive diluent and epoxy resin can be mixed, and the second reactive diluent and curing agent can be mixed. Mixing the two components further improves the dispersion of each raw material and increases the crosslinking density of the cured epoxy putty composition. Furthermore, both the first and second reactive diluents can participate in the curing and crosslinking reaction, increasing the crosslinking density of the cured epoxy putty composition.

[0047] Furthermore, the above embodiments list several common epoxy-containing glycidyl ethers, enamine diluents, and polyetheramine diluents in the art, which can be selected by those skilled in the art according to actual needs. It is understood that reactive diluents include, but are not limited to, the above-mentioned types, and those skilled in the art can use known reactive diluents in the prior art that can be used in epoxy putty compositions according to actual needs.

[0048] In some embodiments of this application, the filler includes at least one of quartz powder, alumina powder, titanium dioxide, calcium carbonate powder, lithopone, and clay; and / or the raw materials of the epoxy putty composition, by weight, also include 1 to 20 parts of thixotropic agent, which includes at least one of fumed silica, organobentonite, hydrogenated castor oil, and polyamide wax.

[0049] In some of the above embodiments, several fillers commonly used in the art are listed, and those skilled in the art can select them according to actual needs. It is understood that the fillers include, but are not limited to, the above-mentioned types, and those skilled in the art can use fillers known in the prior art that can be used in epoxy putty compositions according to actual needs.

[0050] Furthermore, the epoxy mortar composition may also include 1 to 20 parts of thixotropic agent. Adding a thixotropic agent to the epoxy mortar composition can further improve its processability before curing, i.e., it has lower viscosity at high shear rates during mixing and coating, making the epoxy mortar composition easier to apply. Additionally, since the curing and crosslinking rate of the epoxy mortar composition is relatively slow in order to increase the reactivity of the epoxy resin and improve the crosslinking density of the cured epoxy mortar composition, the use of a thixotropic agent can prevent the sedimentation of components during the crosslinking process. This ensures that the epoxy resin in the epoxy mortar composition is fully crosslinked and synergistically improves its compressive strength and adhesion with the filler and thixotropic agent.

[0051] In some of the above embodiments, several thixotropic agents commonly used in the art are listed, and those skilled in the art can select them according to actual needs. It is understood that thixotropic agents include, but are not limited to, the above-mentioned types, and those skilled in the art can use thixotropic agents known in the prior art that can be used in epoxy putty compositions according to actual needs.

[0052] In some embodiments of this application, the raw materials of the epoxy putty composition, by weight, further include 0.1 to 2 parts of pigment, including at least one of iron oxide red, iron oxide yellow, iron blue, and iron black; and / or the raw materials of the epoxy putty composition, by weight, further include 0.1 to 5 parts of functional additives, including at least one of wetting agents and defoamers.

[0053] In some of the above embodiments, the raw materials of the epoxy mortar composition may also include pigments. On the one hand, this allows for the preparation of epoxy mortar compositions of different colors according to actual needs, thereby improving their decorative properties. On the other hand, in order to determine the degree of mixing of the epoxy mortar composition and thus improve its crosslinking density, different types of pigments can be added to the epoxy resin and curing agent, or pigments can be added to only one of the components. During the mixing process, the presence of tiger stripes in the composition can be observed to determine whether it is mixed evenly, thereby improving construction efficiency.

[0054] Furthermore, other functional additives can be added to the epoxy putty composition to further improve its processability. These functional additives include, but are not limited to, wetting agents or defoamers, which can be selected by those skilled in the art according to actual needs.

[0055] Secondly, this application provides a method for preparing an epoxy putty composition, comprising the following steps:

[0056] A curable epoxy putty composition is obtained by mixing the raw materials of the epoxy putty composition according to any embodiment of the first aspect.

[0057] According to this application, a curable epoxy putty composition can be obtained by mixing the raw materials of the epoxy putty composition in any embodiment of the first aspect. Therefore, the preparation method is simple, the application range is large, and it has the beneficial effects of any embodiment of the first aspect.

[0058] According to this application, no specific method of mixing is limited, and any mixing method known in the art can be used. As an example, the raw materials can be mixed in a double planetary mixer.

[0059] In some embodiments of this application, the preparation method specifically includes the following steps:

[0060] S10: Component A is obtained by mixing epoxy resin, first reactive diluent, some filler and some thixotropic agent;

[0061] S20: Mix the curing agent, the second reactive diluent, another portion of filler, and another portion of thixotropic agent to obtain component B;

[0062] S30: Mix component A and component B to obtain a curable epoxy putty composition.

[0063] In some of the above embodiments, the raw materials are divided into two components. Since the epoxy resin and the curing agent will undergo a cross-linking reaction after mixing, the two are first mixed with other raw materials to obtain component A and component B. Then, component A and component B are mixed to further improve the dispersion effect of the epoxy putty composition before curing. The epoxy putty composition with better dispersion has a higher cross-linking density after curing, and better adhesion and compressive strength.

[0064] The clean nature of natural gas as a fossil fuel, coupled with global efforts to protect the environment and reduce emissions of greenhouse gases such as carbon dioxide, has led to a significant increase in both global natural gas supply and demand. Natural gas is widely recognized as one of the cleanest energy sources on Earth, primarily composed of methane. It is colorless, odorless, non-toxic, and non-corrosive, possessing clean and safe characteristics. It condenses into a liquid when cooled to -163°C. Transportation, as a crucial link in the liquefied natural gas (LNG) supply chain, directly impacts the economics of natural gas supply and consumption. Furthermore, LNG, with its advantages of safe storage and ease of transportation, has become a vital link in the entire natural gas industry chain, further driving the development of global natural gas trade.

[0065] The transportation of liquefied natural gas (LNG) mainly consists of three parts: liquefaction stations at the source, LNG ship transportation, and LNG land storage tank reception. Due to the extremely low temperature requirements of natural gas (-163°C), both LNG carriers and LNG land storage tanks require cryogenic insulation treatment. Figure 1 As shown, the LNG storage tank (or cargo hold) containment system consists of an insulation layer 1 stably bonded to the hull 3 via an adhesive layer 2. The insulation layer 1 comprises a primary shielding layer 11, a primary insulation layer 12, a secondary shielding layer 12, and a secondary insulation layer 14. The insulation layer is composed of numerous insulating boxes, with the secondary insulating boxes fixed to the hull's inner shell via an adhesive layer. Therefore, to ensure a stable bond between the insulation layer 1 and the hull 3 and to improve the safety of LCG transportation, an adhesive with good adhesion and compressive strength is needed as the adhesive layer 2.

[0066] Based on this, in a third aspect, this application provides a liquefied natural gas (LNG) carrier, including a hull, and

[0067] An insulating box for fixing and bonding an epoxy putty composition obtained by the preparation method according to any embodiment of the first aspect or any embodiment of the second aspect to the hull.

[0068] According to this application, in a liquefied natural gas (LNG) carrier, an epoxy putty composition prepared according to any embodiment of the first aspect or any embodiment of the second aspect is used to bond the hull and the insulation box. Since the epoxy putty composition has good adhesion and compressive strength, it can ensure that the two are stably bonded and not easily displaced, thereby improving the safety of the LNG carrier.

[0069] In some embodiments of this application, the interior of the insulation box includes laminated wood, a weight plate, a saddle panel, and an epoxy putty composition prepared according to the preparation method of any embodiment of the first aspect or any embodiment of the second aspect, which fills the space between the laminated wood, the weight plate, and the saddle panel.

[0070] In some of the above embodiments, the epoxy putty composition can also be filled between the laminated wood, weight plate, and saddle panel inside the insulation box. Due to its good adhesion and compressive strength, it can make the insulation box flatter and more stable, further improving the safety of LCG transport ships.

[0071] The following describes embodiments of this application. The embodiments described below are exemplary and are only used to explain this application, and should not be construed as limiting this application. Where specific techniques or conditions are not specified in the embodiments, they are performed according to the techniques or conditions described in the literature in this field or according to the product instructions. Reagents or instruments used, unless otherwise specified, are all conventional products that can be obtained commercially.

[0072] Example 1

[0073] Preparation of component A: 20 parts epoxy resin E44, 10 parts 4,4-diaminodiphenylmethane tetraglycidylamine, 5 parts ethylene glycol diglycidyl ether, 55 parts titanium dioxide, 9.5 parts silica, 0.1 parts color paste, 0.25 parts defoamer, and 0.25 parts wetting agent were mixed to obtain component A for later use.

[0074] Preparation of component B: Mix 30 parts of polyamide 651, 5 parts of polyetheramine 400, 55 parts of calcium carbonate, 9.5 parts of polyamide wax, and 0.5 parts of additives to obtain component B for later use.

[0075] Preparation of epoxy putty composition: Component A and component B with a mass ratio of 100:70 are mixed to obtain a curable epoxy putty composition.

[0076] Example 2

[0077] Preparation of component A: 25 parts epoxy resin E44, 5 parts 4,4-diaminodiphenylmethane tetraglycidylamine, 5 parts ethylene glycol diglycidyl ether, 55 parts titanium dioxide, 9.5 parts silica, 0.1 parts color paste, 0.25 parts defoamer, and 0.25 parts wetting agent were mixed to obtain component A for later use.

[0078] Preparation of component B: Mix 30 parts of polyamide 651, 5 parts of polyetheramine 400, 55 parts of calcium carbonate, 9.5 parts of polyamide wax, and 0.5 parts of additives to obtain component B for later use.

[0079] Preparation of epoxy putty composition: Component A and component B with a mass ratio of 100:70 are mixed to obtain a curable epoxy putty composition.

[0080] Example 3

[0081] Preparation of component A: 15 parts epoxy resin E44, 15 parts 4,4-diaminodiphenylmethane tetraglycidylamine, 5 parts ethylene glycol diglycidyl ether, 55 parts titanium dioxide, 9.5 parts silica, 0.1 parts color paste, 0.25 parts defoamer, and 0.25 parts wetting agent were mixed to obtain component A for later use.

[0082] Preparation of component B: Mix 30 parts of polyamide 651, 5 parts of polyetheramine 400, 55 parts of calcium carbonate, 9.5 parts of polyamide wax, and 0.5 parts of additives to obtain component B for later use.

[0083] Preparation of epoxy putty composition: Component A and component B with a mass ratio of 100:70 are mixed to obtain a curable epoxy putty composition.

[0084] Example 4

[0085] Preparation of component A: Mix 10 parts epoxy resin E44, 20 parts 4,4-diaminodiphenylmethane tetraglycidylamine, 5 parts ethylene glycol diglycidyl ether, 55 parts titanium dioxide, 9.5 parts silica, 0.1 parts color paste, 0.25 parts defoamer, and 0.25 parts wetting agent to obtain component A for later use.

[0086] Preparation of component B: Mix 30 parts of polyamide 651, 5 parts of polyetheramine 400, 55 parts of calcium carbonate, 9.5 parts of polyamide wax, and 0.5 parts of additives to obtain component B for later use.

[0087] Preparation of epoxy putty composition: Component A and component B with a mass ratio of 100:70 are mixed to obtain a curable epoxy putty composition.

[0088] Example 5

[0089] Preparation of component A: Mix 5 parts epoxy resin E44, 25 parts 4,4-diaminodiphenylmethane tetraglycidylamine, 5 parts ethylene glycol diglycidyl ether, 55 parts titanium dioxide, 9.5 parts silica, 0.1 parts color paste, 0.25 parts defoamer, and 0.25 parts wetting agent to obtain component A for later use.

[0090] Preparation of component B: Mix 30 parts of polyamide 651, 5 parts of polyetheramine 400, 55 parts of calcium carbonate, 9.5 parts of polyamide wax, and 0.5 parts of additives to obtain component B for later use.

[0091] Preparation of epoxy putty composition: Component A and component B with a mass ratio of 100:70 are mixed to obtain a curable epoxy putty composition.

[0092] Comparative Example 1

[0093] Preparation of component A: Mix 30 parts epoxy resin E44, 5 parts ethylene glycol diglycidyl ether, 55 parts titanium dioxide, 9.5 parts silica, 0.1 parts color paste, 0.25 parts defoamer, and 0.25 parts wetting agent to obtain component A for later use.

[0094] Preparation of component B: Mix 30 parts of polyamide 651, 5 parts of polyetheramine 400, 55 parts of calcium carbonate, 9.5 parts of polyamide wax, and 0.5 parts of additives to obtain component B for later use.

[0095] Preparation of epoxy putty composition: Component A and component B with a mass ratio of 100:70 are mixed to obtain a curable epoxy putty composition.

[0096] Comparative Example 2

[0097] Preparation of component A: Mix 30 parts of 4,4-diaminodiphenylmethane tetraglycidylamine, 5 parts of ethylene glycol diglycidyl ether, 55 parts of titanium dioxide, 9.5 parts of silica, 0.1 parts of color paste, 0.25 parts of defoamer, and 0.25 parts of wetting agent to obtain component A for later use.

[0098] Preparation of component B: Mix 30 parts of polyamide 651, 5 parts of polyetheramine 400, 55 parts of calcium carbonate, 9.5 parts of polyamide wax, and 0.5 parts of additives to obtain component B for later use.

[0099] Preparation of epoxy putty composition: Component A and component B with a mass ratio of 100:70 are mixed to obtain a curable epoxy putty composition.

[0100] Test section

[0101] 1. According to GB / T27595-2011 "Test Method for Tensile Shear Fatigue Properties of Structural Adhesives", samples were prepared and single shear tensile tests were performed using a universal testing machine. Three average samples were taken to obtain the bonding strength of the sample.

[0102] 2. The compressive strength was tested using a universal testing machine in accordance with GB / T 2569-1995 "Test Method for Compression Properties of Resin Castings".

[0103] The epoxy putty compositions in Examples 1-5 and Comparative Examples 1-3, as well as a commercially available epoxy putty composition (JM-98), were subjected to performance tests. The test results are shown in Table 1.

[0104] Table 1

[0105] Bond strength (MPa) Compressive strength (MPa) Example 1 17.93 47.68 Example 2 16.27 44.35 Example 3 18.13 45.32 Example 4 19.97 44.27 Example 5 17.67 42.83 Comparative Example 1 13.48 36.44 Comparative Example 2 15.06 33.25 Commercially available products 13.50 34.12

[0106] According to Table 1, the bonding strength and compressive strength of each embodiment are significantly improved compared with each comparative example and commercially available products, indicating that the epoxy putty composition provided in this application has better bonding and compressive strength. The possible reasons have been analyzed above and will not be repeated here.

[0107] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A high-sticky high-strength epoxy mortar composition, characterized by, The raw materials include the following by mass parts: 20-50 parts of epoxy resin, the epoxy resin including a first epoxy resin and a second epoxy resin, the first epoxy resin having a functionality of 2, the second epoxy resin having a functionality greater than 2, the mass ratio of the first epoxy resin to the second epoxy resin being 1:0.5-1, 10-30 parts of curing agent, 30-120 parts of filler; 1-20 parts of active diluent, the active diluent including a first active diluent and a second active diluent, the first active diluent including glycidyl ether containing epoxy group, the second active diluent including at least one of enamine diluent, polyether amine diluent.

2. The high-sticky high-strength epoxy mortar composition according to claim 1, characterized in that, The first epoxy resin includes at least one of bisphenol type epoxy resin, the bisphenol type epoxy resin including bisphenol A epoxy resin, bisphenol F epoxy resin, hydrogenated bisphenol A epoxy resin, bisphenol S epoxy resin, and / or The second epoxy resin includes at least one of tetraglycidyl amine type epoxy resin, tetraglycidyl ether tetraphenyl ethane, tetrafunctional bisphenol C epoxy resin, the tetraglycidyl amine type epoxy resin including at least one of 4,4-diamino diphenyl methane tetraglycidyl amine, N,N,N',N'-tetraglycidyl-4,4'-diamino diphenyl ether, N,N,N',N'-tetraglycidyl-m-phenylenediamine.

3. The high-strength high-tack epoxy mastic composition of claim 1, wherein, The curing agent includes at least one of polyamine curing agent, polyamide curing agent.

4. The high-strength high-tack epoxy mastic composition of claim 1, wherein The glycidyl ether containing epoxy group includes at least one of alkylene glycidyl ether, ethylene glycol diglycidyl ether, benzyl glycidyl ether, polypropylene glycol diglycidyl ether; The enamine diluent includes at least one of diethylene triamine, triethylene tetramine, tetraethylene pentamine, The polyether amine diluent includes at least one of polyether amine 300, polyether amine 400, polyether amine 500.

5. The high-strength high-tack epoxy mastic composition of claim 1, wherein The filler includes at least one of quartz powder, alumina powder, titanium white powder, calcium carbonate powder, lithopone, clay; and / or The raw materials of the high-viscosity high-strength epoxy mortar composition by mass parts further include 1-20 parts of thixotropic agent, the thixotropic agent including at least one of fumed silica, organic bentonite, hydrogenated castor oil, polyamide wax.

6. The high-strength high-tack epoxy mastic composition of claim 1, wherein The raw materials of the high-viscosity high-strength epoxy mortar composition by mass parts further include 0.1-2 parts of pigment, the pigment including at least one of iron oxide red, iron oxide yellow, iron blue, iron black; and / or The raw materials of the high-viscosity high-strength epoxy mortar composition by mass parts further include 0.1-5 parts of functional auxiliary agent, the functional auxiliary agent including at least one of wetting agent, defoaming agent.

7. A method for preparing a high-sticky high-strength epoxy mortar composition, characterized by, The method includes the following steps: Mixing the raw materials of the high-viscosity high-strength epoxy mortar composition according to any one of claims 1-6 to obtain a curable high-viscosity high-strength epoxy mortar composition.

8. The preparation method according to claim 7, characterized in that, The method specifically includes the following steps: S10: mixing the epoxy resin, the first active diluent, part of the filler, and part of the thixotropic agent to obtain component A; S20: mixing the curing agent, the second active diluent, another part of the filler, and another part of the thixotropic agent to obtain component B; S30: mixing component A and component B to obtain a high-viscosity high-strength epoxy mortar composition.

9. A liquefied natural gas carrier, characterized in that comprising a hull, and an insulated box fixedly bonded to the hull by the high-viscosity high-strength epoxy mortar composition according to any one of claims 1-6 or prepared by the method of claim 7 or 8.

10. The liquefied natural gas carrier of claim 9, wherein, the interior of the insulated box comprises laminated wood, heavy plates, saddle panels, and the high-viscosity high-strength epoxy mortar composition according to any one of claims 1-6 or prepared by the method of claim 7 or 8 filled between the laminated wood and the heavy plates, saddle panels. the interior of the insulated box comprises laminated wood, heavy plates, saddle panels, and the high-viscosity high-strength epoxy mortar composition according to any one of claims 1-6 or prepared by the method of claim 7 or 8 filled between the laminated wood and the heavy plates, saddle panels.

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