A high temperature resistant packaging adhesive for electronic components and its manufacturing process

Abstract

The invention relates to the technical field of packaging adhesives, and discloses a packaging adhesive for high-temperature resistant electronic components and a manufacturing process thereof. The packaging adhesive is prepared by mixing and grinding epoxy resin as a main material, polybutadiene benzoxazine resin as an auxiliary material, and additives such as adamantane modified silicone oil and a thixotropic agent. Since the polybutadiene benzoxazine resin and the adamantane modified silicone oil can participate in the curing process of the epoxy resin, a multiple cross-linked network structure of silicone oil-polybutadiene benzoxazine-epoxy resin can be formed by chemical bond connection. By utilizing special functional groups and network structures such as phosphorus flame retardants and adamantane rigid groups contained in each other's structures, the finally prepared epoxy resin packaging adhesive can exhibit comprehensive properties such as good toughness, heat resistance and flame retardancy, which is conducive to its further development and application in the field of electronic component packaging.

Description

Technical Field

[0001] The invention relates to the technical field of packaging adhesives, and in particular to a packaging adhesive for high-temperature resistant electronic components and a manufacturing process thereof. Background Art

[0002] In order to reduce the impact of external environmental conditions on electronic components such as resistor and capacitor circuit boards, it is often necessary to use encapsulation glue to fix them, which plays a role in shockproof, dustproof, confidentiality, etc., thereby improving the stability and service life of components. At present, common encapsulation glues mainly include epoxy encapsulation glues, silicone encapsulation glues, polyurethane encapsulation glues, and ultraviolet light curing encapsulation glues, among which epoxy encapsulation glues are mainly made of epoxy resin as the base material. Since epoxy resin has good electrical insulation, dielectric properties, small volume shrinkage and excellent chemical resistance, epoxy encapsulation glues occupy a large market in the field of electronic component packaging. Since electronic components will generate heat during use, the encapsulation glue needs to have good heat resistance. In addition, electronic components may also have electrical breakdown and cause fires. Therefore, the encapsulation glue used in electronic components has good heat resistance and flame retardant properties, but the heat resistance of epoxy resin is relatively poor, and the flame retardant property is not good, which leads to its application in the field of electronic component packaging being gradually limited.

[0003] In order to improve the above-mentioned shortcomings of epoxy resin encapsulation glue, inorganic fillers or organic flame retardants with flame retardant effects are often added to the epoxy resin matrix. For example, the invention patent with application number CN201910393294.1 discloses a thermally conductive flame retardant epoxy resin composite material and a preparation method thereof. By adding reduced graphene oxide-silver nanowire aerogel coated with molybdenum disulfide as a filler to the epoxy resin, the problem of poor flame retardant performance of electronic packaging materials can be solved. However, whether it is an inorganic filler or an organic flame retardant, there are certain interface problems between them and the epoxy resin matrix, and it is difficult to ensure that the packaging material has a long-term flame retardant effect. Summary of the invention

[0004] The purpose of the present invention is to provide a high temperature resistant packaging adhesive for electronic components and a manufacturing process thereof, so as to solve the problem that the epoxy resin packaging adhesive has poor heat resistance and flame retardancy.

[0005] The purpose of the present invention can be achieved by the following technical solutions:

[0006] A high temperature resistant packaging adhesive for electronic components, comprising the following raw materials in parts by weight: 40-60 parts of epoxy resin, 10-25 parts of polybutadiene benzoxazine resin, 5-12 parts of adamantane modified silicone oil, 2-4 parts of thixotropic agent, 4-8 parts of curing agent, and 2-5 parts of curing accelerator;

[0007] The polybutadiene benzoxazine resin is prepared from amino-terminated polybutadiene containing a grafted phosphorus flame retardant compound in its structure, formaldehyde and phenol as raw materials;

[0008] The adamantane-modified silicone oil is prepared by taking hydrogen-containing silicone oil and adamantane derivatives as raw materials.

[0009] Furthermore, the epoxy resin is any one of bisphenol A epoxy resin E-44 or bisphenol A epoxy resin E-51; the thixotropic agent is fumed silica; the curing agent is any one of amine curing agents; and the curing accelerator is any one of imidazole curing accelerators.

[0010] Furthermore, the preparation method of the polybutadiene benzoxazine resin comprises the following steps:

[0011] Step ①: amino-terminated polybutadiene and 1,4-dioxane are mixed and stirred, and then phosphorus-based flame retardant compounds and azobisisobutyronitrile are added and mixed, nitrogen is passed through for protection, the temperature is increased to 60-70° C., and the mixture is stirred for 6-12 hours under reduced pressure to remove the solvent and unreacted products, and the material is discharged to obtain a phosphorus-containing amino-terminated polybutadiene intermediate;

[0012] Step ②: Mix the phosphorus-containing amino-terminated polybutadiene intermediate, phenol and toluene, raise the system temperature to 50-55°C, stir evenly, add aldehyde compounds and mix evenly, continue to raise the temperature to 70-80°C, keep stirring for 4-8 hours, remove the solvent and unreacted products, cool and discharge, and obtain polybutadiene benzoxazine resin.

[0013] Furthermore, in step ①, the phosphorus-based flame retardant compound is any one of diphenyl phosphite, dibenzyl phosphite, dimethyl phosphite or diethyl phosphite.

[0014] Furthermore, in step ②, the aldehyde compound is any one of formaldehyde or paraformaldehyde.

[0015] Through the above technical scheme, under the action of azobisisobutyronitrile, the unsaturated olefin group in the amino-terminated polybutadiene structure can undergo addition reaction with the PH bond in the phosphorus-based flame retardant structure, thereby introducing the phosphorus-containing flame retardant into the amino-terminated polybutadiene structure to form a phosphorus-containing amino-terminated polybutadiene intermediate, which is used as a diamine monomer to react with phenol and aldehyde compounds to form a phosphorus-containing polybutadiene derivative of a double-terminated benzoxazine, namely a polybutadiene benzoxazine resin.

[0016] Furthermore, the preparation method of the adamantane-modified silicone oil is as follows:

[0017] The hydrogen-containing silicone oil is mixed with N,N-dimethylformamide, stirred evenly, and then adamantane derivatives and catalysts are added, and nitrogen is passed for protection. After being kept warm and stirred at 95-100°C for 4-12 hours, the nitrogen is removed, the solvent and low-boiling substances are removed by reduced pressure distillation, and the temperature is lowered to obtain adamantane-modified silicone oil.

[0018] Furthermore, the hydrogen mass fraction of the hydrogen-containing silicone oil is 0.27%, and the average molar mass is 750 g / mol.

[0019] Furthermore, the adamantane derivative is any one of 3-amino-1-adamantanol or 1-hydroxy-4-aminoadamantane.

[0020] Furthermore, the catalyst is trifluoroacetic acid.

[0021] Through the above technical scheme, under the action of a catalyst, the Si-H bond in the structure of the hydrogen-containing silicone oil can react with the active hydroxyl group in the structure of the adamantane derivative under the catalytic action of trifluoroacetic acid, thereby introducing the adamantane amine group into the silicone oil molecular chain to obtain adamantane-modified silicone oil.

[0022] A manufacturing process of a high temperature resistant packaging adhesive for electronic components, comprising the following steps:

[0023] Step 1: Weigh epoxy resin, polybutadiene benzoxazine resin, adamantane modified silicone oil, thixotropic agent, curing agent, and curing accelerator according to weight, place in a reaction kettle, and stir and mix evenly to form a mixture;

[0024] Step 2: Grind the mixture on three rollers until it is rolled into a paste-like material, and vacuum degasse it to obtain a packaging glue for electronic components.

[0025] Beneficial effects of the present invention:

[0026] 1) The present invention prepares polybutadiene benzoxazine resin as an auxiliary material of the encapsulating adhesive. During the curing process of the encapsulating adhesive, the presence of an amine curing agent can cause the polybutadiene benzoxazine resin to undergo a co-curing reaction with the epoxy resin base material, thereby chemically connecting the polybutadiene benzoxazine resin auxiliary material with the epoxy resin base material to form a resin mixture with a cross-linked structure, and utilizing the excellent heat resistance of the benzoxazine resin to make the prepared encapsulating adhesive have good heat resistance. In addition, since a phosphorus-based flame retardant is grafted into the structure of the polybutadiene benzoxazine resin, a phosphoric acid derivative can be produced when the encapsulating adhesive burns, catalyzing the surface of the encapsulating adhesive to form carbon, thereby isolating oxygen and the heat generated by combustion, and at the same time cooperating with the non-combustible gas formed by the combustion of the nitrogen element in the benzoxazine to dilute the concentration of oxygen and prevent the combustion from continuing, thereby making the prepared encapsulating adhesive have good flame retardant properties. At the same time, the polybutadiene molecular chain has a toughening effect, which can make the epoxy resin-based encapsulating adhesive show higher toughness.

[0027] 2) The present invention prepares adamantane-modified silicone oil as an additive for the encapsulant. Since the adamantane-modified silicone oil contains an adamantane group in its structure, the adamantane-modified silicone oil can be used as a curing agent during the curing process to participate in the curing reaction of the epoxy resin base material and the polybutadiene benzoxazine resin, thereby forming a multi-crosslinked network structure containing silicone oil-polybutadiene benzoxazine-epoxy resin, thereby effectively improving the heat resistance and mechanical properties of the epoxy resin-based encapsulant. After combustion, the silicon element in the silicone oil structure can produce a large amount of silicon oxide, which combines with the carbon layer to make the strength and barrier properties of the carbon layer more excellent, thereby producing a synergistic flame retardant effect, and further improving the flame retardant effect of the epoxy resin-based encapsulant.

[0028] 3) No organic solvent is added to the ingredients of the encapsulating adhesive of the present invention, thereby avoiding the environmental pollution problem caused by the volatilization of the organic solvent during the curing process of the encapsulating adhesive. Therefore, the encapsulating adhesive prepared by the present invention is more environmentally friendly.

[0029] Of course, any product implementing the present invention does not necessarily need to achieve all of the advantages described above at the same time. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings required for describing the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other accompanying drawings can be obtained based on these accompanying drawings without paying creative work.

[0031] Figure 1 : is the infrared spectrum of the polybutadiene benzoxazine resin in the embodiment of the present invention. DETAILED DESCRIPTION

[0032] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0033] In the following examples and comparative examples, the preparation method of polybutadiene benzoxazine resin is as follows:

[0034] Step ①: 3.5 g of amino-terminated polybutadiene and 1,4-dioxane were mixed and stirred, and then 0.8 g of diphenyl phosphite and 0.1 g of azobisisobutyronitrile were added and mixed, and nitrogen was passed through to protect the mixture. The temperature was raised to 70° C., and the mixture was stirred for 9 hours under reduced pressure to remove the solvent and unreacted products, and the material was discharged to obtain a phosphorus-containing amino-terminated polybutadiene intermediate;

[0035] Step ②: 2.6 g of phosphorus-containing amino-terminated polybutadiene intermediate, 0.8 g of phenol and toluene are mixed, the system temperature is raised to 50° C., and after stirring evenly, 4.5 g of formaldehyde is added and mixed evenly, and the temperature is continued to be raised to 80° C., and after stirring for 6 hours, the solvent and unreacted products are removed, and the temperature is lowered and the material is discharged to obtain a polybutadiene benzoxazine resin.

[0036] The polybutadiene benzoxazine resin was made into KBr tablets by potassium bromide tableting method and subjected to infrared spectroscopy at 4000-500 cm using MX-1 Fourier transform infrared spectrometer. -1 Scan, test results see Figure 1 ,Depend on Figure 1 It can be seen that polybutadiene benzoxazine resin has a peak at 3048 cm -1 The stretching vibration peak of the carbon-hydrogen bond on the benzene ring appears at 2800-3000cm -1 The absorption peak of methylene appears at 1249 cm -1 The characteristic absorption peak of P=O is 1113cm -1 The characteristic absorption peak of PO-Ph (benzene ring) is 952cm -1 The absorption peak at is the characteristic absorption peak of oxazine ring.

[0037] The preparation method of adamantane modified silicone oil is:

[0038] 1.8 g of hydrogen-containing silicone oil with a hydrogen mass fraction of 0.27% and an average molar mass of 750 g / mol was mixed with N,N-dimethylformamide, stirred evenly, and then 1.2 g of 3-amino-1-adamantanol and 0.2 g of trifluoroacetic acid were added, and nitrogen was passed through for protection. After stirring at 100° C. for 8 hours, the nitrogen was removed, the solvent and low-boiling substances were removed by reduced pressure distillation, and the temperature was lowered to obtain adamantane-modified silicone oil.

[0039] 1 g of adamantane-modified silicone oil sample was placed in a reactor, and 100 mL of a 0.1 M hydrochloric acid standard solution was added to the reactor, stirred and mixed, and soaked at 40°C for 2 h before being taken out. After it was naturally cooled, 25 mL of the soaking solution was taken and placed in a conical flask. 20 mL of deionized water and 0.1 mL of phenolphthalein were added to the conical flask as an indicator. A 0.1 M sodium hydroxide standard solution was used for titration until the solution changed color. The volume V of the sodium hydroxide standard solution consumed was recorded. The amino content T (mmol / g) of the sample was calculated using the formula T = [100×C1-4×C2×V] / 4m, where C1 is the concentration of the hydrochloric acid standard solution, M; C2 is the concentration of the sodium hydroxide standard solution, M; and m is the sample mass, g. After calculation, the amino content T of the sample was 0.219 mmol / g, which was formed by the introduction of adamantane amine due to the reaction of the Si-H bond in the hydrogen-containing silicone oil with the active hydroxyl group in the structure of 3-amino-1-adamantanol.

[0040] Example 1

[0041] A high temperature resistant packaging adhesive for electronic components, comprising the following raw materials in parts by weight: 40 parts of bisphenol A epoxy resin E-44, 10 parts of polybutadiene benzoxazine resin, 5 parts of adamantane modified silicone oil, 2 parts of thixotropic agent fumed silica, 4 parts of curing agent 4,4'-diaminodiphenylmethane, and 2 parts of curing accelerator imidazole;

[0042] The manufacturing process of the encapsulation adhesive includes the following steps:

[0043] Step 1: Weigh bisphenol A epoxy resin E-44, polybutadiene benzoxazine resin, adamantane modified silicone oil, thixotropic agent fumed silica, curing agent 4,4'-diaminodiphenylmethane, and curing accelerator imidazole according to weight, place in a reaction kettle, stir and mix evenly to form a mixture;

[0044] Step 2: Grind the mixture on three rollers, roll it into a paste-like material, and perform vacuum degassing on it to obtain the encapsulation glue.

[0045] Example 2

[0046] A high temperature resistant packaging adhesive for electronic components, comprising the following raw materials in parts by weight: 56 parts of bisphenol A epoxy resin E-51, 24 parts of polybutadiene benzoxazine resin, 10 parts of adamantane modified silicone oil, 3 parts of thixotropic agent fumed silica, 6 parts of curing agent 4,4'-diaminodiphenylmethane, and 3 parts of curing accelerator imidazole;

[0047] The manufacturing process of the encapsulation adhesive includes the following steps:

[0048] Step 1: Weigh bisphenol A epoxy resin E-51, polybutadiene benzoxazine resin, adamantane modified silicone oil, thixotropic agent fumed silica, curing agent 4,4'-diaminodiphenylmethane, and curing accelerator imidazole according to weight, place in a reaction kettle, stir and mix evenly to form a mixture;

[0049] Step 2: Grind the mixture on three rollers, roll it into a paste-like material, and perform vacuum degassing on it to obtain the encapsulation glue.

[0050] Example 3

[0051] A high temperature resistant packaging adhesive for electronic components, comprising the following raw materials in parts by weight: 60 parts of bisphenol A epoxy resin E-44, 25 parts of polybutadiene benzoxazine resin, 12 parts of adamantane modified silicone oil, 4 parts of thixotropic agent fumed silica, 8 parts of curing agent 4,4'-diaminodiphenylmethane, and 5 parts of curing accelerator imidazole;

[0052] The manufacturing process of the encapsulation adhesive includes the following steps:

[0053] Step 1: Weigh bisphenol A epoxy resin E-44, polybutadiene benzoxazine resin, adamantane modified silicone oil, thixotropic agent fumed silica, curing agent 4,4'-diaminodiphenylmethane, and curing accelerator imidazole according to weight, place in a reaction kettle, stir and mix evenly to form a mixture;

[0054] Step 2: Grind the mixture on three rollers, roll it into a paste-like material, and perform vacuum degassing on it to obtain the encapsulation glue.

[0055] Comparative Example 1

[0056] A packaging adhesive for electronic components, comprising the following raw materials in parts by weight: 56 parts of bisphenol A epoxy resin E-51, 24 parts of amino-terminated polybutadiene, 10 parts of adamantane-modified silicone oil, 3 parts of thixotropic agent fumed silica, 6 parts of curing agent 4,4'-diaminodiphenylmethane, and 3 parts of curing accelerator imidazole;

[0057] The manufacturing process of the encapsulation adhesive includes the following steps:

[0058] Step 1: Weigh bisphenol A epoxy resin E-51, amino-terminated polybutadiene, adamantane-modified silicone oil, thixotropic agent fumed silica, curing agent 4,4'-diaminodiphenylmethane, and curing accelerator imidazole according to weight, place in a reaction kettle, stir and mix evenly to form a mixture;

[0059] Step 2: Grind the mixture on three rollers, roll it into a paste-like material, and perform vacuum degassing on it to obtain the encapsulation glue.

[0060] Comparative Example 2

[0061] A packaging adhesive for electronic components, comprising the following raw materials in parts by weight: 56 parts of bisphenol A epoxy resin E-51, 10 parts of adamantane-modified silicone oil, 3 parts of thixotropic agent fumed silica, 6 parts of curing agent 4,4'-diaminodiphenylmethane, and 3 parts of curing accelerator imidazole;

[0062] The manufacturing process of the encapsulation adhesive includes the following steps:

[0063] Step 1: Weigh bisphenol A epoxy resin E-51, adamantane modified silicone oil, thixotropic agent fumed silica, curing agent 4,4'-diaminodiphenylmethane, and curing accelerator imidazole according to weight, place in a reaction kettle, stir and mix evenly to form a mixture;

[0064] Step 2: Grind the mixture on three rollers, roll it into a paste-like material, and perform vacuum degassing on it to obtain the encapsulation glue.

[0065] Comparative Example 3

[0066] A packaging adhesive for electronic components, comprising the following raw materials in parts by weight: 56 parts of bisphenol A epoxy resin E-51, 24 parts of polybutadiene benzoxazine resin, 3 parts of thixotropic agent fumed silica, 6 parts of curing agent 4,4'-diaminodiphenylmethane, and 3 parts of curing accelerator imidazole;

[0067] The manufacturing process of the encapsulation adhesive includes the following steps:

[0068] Step 1: Weigh bisphenol A epoxy resin E-51, polybutadiene benzoxazine resin, thixotropic agent fumed silica, curing agent 4,4'-diaminodiphenylmethane, and curing accelerator imidazole according to weight, place in a reaction kettle, stir and mix evenly to form a mixture;

[0069] Step 2: Grind the mixture on three rollers, roll it into a paste-like material, and perform vacuum degassing on it to obtain the encapsulation glue.

[0070] Comparative Example 4

[0071] A packaging adhesive for electronic components, comprising the following raw materials in parts by weight: 56 parts of bisphenol A epoxy resin E-51, 3 parts of thixotropic agent fumed silica, 6 parts of curing agent 4,4'-diaminodiphenylmethane, and 3 parts of curing accelerator imidazole;

[0072] The manufacturing process of the encapsulation adhesive includes the following steps:

[0073] Step 1: Weigh bisphenol A epoxy resin E-51, thixotropic agent fumed silica, curing agent 4,4'-diaminodiphenylmethane, and curing accelerator imidazole according to weight, place in a reaction kettle, stir and mix evenly to form a mixture;

[0074] Step 2: Grind the mixture on three rollers, roll it into a paste-like material, and perform vacuum degassing on it to obtain the encapsulation glue.

[0075] The encapsulation adhesive prepared in Examples 1 to 3 of the present invention and Comparative Examples 1 to 4 was placed in a mold, cured at 130° C. for 3 hours, then raised to 140° C. and cured for 2 hours, and then raised to 150° C. and cured for 5 hours to form an encapsulation adhesive film, which was made into test specimens that met various test standards, and the following performance tests were performed:

[0076] With reference to GB / T 7124-2008, the tensile shear properties of the test samples were tested; with reference to GB / T6328-1999, the impact strength of the test samples was tested; the flame retardancy of the test samples was tested using the UL-94 method; 0.5 g of each group of samples were taken and placed in a TGA-103 thermogravimetric analyzer, with nitrogen protection, and the heating rate was set to 10°C / min, from room temperature to 800°C, and the initial decomposition temperature of the samples was recorded. The test results are recorded in the following table:

[0077]

[0078]

[0079] It can be concluded from the data in the above table that the encapsulation adhesives prepared in Examples 1 to 3 of the present invention have good toughness, good flame retardancy, and excellent heat resistance.

[0080] In the encapsulation glue prepared in Comparative Example 1, unmodified amino-terminated polybutadiene is added as an auxiliary material, so the benzoxazine resin and the phosphorus-containing flame retardant cannot be introduced into the encapsulation glue during the curing process. Therefore, although good toughness is shown, the flame retardant and heat resistance performance are average.

[0081] The encapsulation adhesive prepared in Comparative Example 2 does not contain amino-terminated polybutadiene, so not only is the flame retardant and heat resistance poor, but the toughness is also average.

[0082] The encapsulation adhesive prepared in Comparative Example 3 does not contain adamantane-modified silicone oil, and therefore does not contain adamantane and silicone oil, resulting in significant impact on the toughness, heat resistance and flame retardancy of the encapsulation adhesive.

[0083] The encapsulation adhesive prepared in Comparative Example 4 did not contain any polybutadiene auxiliary material or adamantane-modified silicone oil, and therefore all performances were the worst.

[0084] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.

[0085] The above contents are merely examples and explanations of the concept of the present invention. The technicians in this technical field may make various modifications or additions to the specific embodiments described or replace them in a similar manner. As long as they do not deviate from the concept of the invention or exceed the scope defined by the claims, they should all fall within the protection scope of the present invention.

Claims

1. A high temperature resistant packaging adhesive for electronic components, characterized in that: The invention comprises the following raw materials in parts by weight: 40-60 parts of epoxy resin, 10-25 parts of polybutadiene benzoxazine resin, 5-12 parts of adamantane modified silicone oil, 2-4 parts of thixotropic agent, 4-8 parts of curing agent, and 2-5 parts of curing accelerator; The polybutadiene benzoxazine resin is prepared from amino-terminated polybutadiene containing a grafted phosphorus flame retardant compound in its structure, formaldehyde and phenol as raw materials; The adamantane-modified silicone oil is prepared using hydrogen-containing silicone oil and adamantane derivatives as raw materials; The preparation method of the adamantane-modified silicone oil is as follows: The hydrogen-containing silicone oil is mixed with N,N-dimethylformamide, stirred evenly, and then the adamantane derivative and the catalyst are added, and nitrogen is passed through for protection. After the mixture is kept warm and stirred at 95-100°C for 4-12 hours, the nitrogen is removed, the solvent and low-boiling substances are removed by vacuum distillation, and the temperature is lowered to obtain the adamantane-modified silicone oil. The adamantane derivative is any one of 3-amino-1-adamantanol and 1-hydroxy-4-aminoadamantane.

2. The high temperature resistant packaging adhesive for electronic components according to claim 1, characterized in that: The epoxy resin is any one of bisphenol A epoxy resin E-44 or bisphenol A epoxy resin E-51; the thixotropic agent is fumed silica; the curing agent is any one of amine curing agents; and the curing accelerator is any one of imidazole curing accelerators.

3. The high temperature resistant packaging adhesive for electronic components according to claim 1, characterized in that: The preparation method of the polybutadiene benzoxazine resin comprises the following steps: Step ①: amino-terminated polybutadiene and 1,4-dioxane are mixed and stirred, and then phosphorus-based flame retardant compounds and azobisisobutyronitrile are added and mixed, nitrogen is passed through for protection, the temperature is increased to 60-70° C., and the mixture is stirred for 6-12 hours under reduced pressure to remove the solvent and unreacted products, and the material is discharged to obtain a phosphorus-containing amino-terminated polybutadiene intermediate; Step ②: Mix the phosphorus-containing amino-terminated polybutadiene intermediate, phenol and toluene, raise the system temperature to 50-55°C, stir evenly, add formaldehyde and mix evenly, continue to raise the temperature to 70-80°C, keep stirring for 4-8 hours, remove the solvent and unreacted products, cool and discharge, and obtain a polybutadiene benzoxazine resin.

4. The high temperature resistant packaging adhesive for electronic components according to claim 3, characterized in that: In step ①, the phosphorus-based flame retardant compound is any one of diphenyl phosphite, dibenzyl phosphite, dimethyl phosphite or diethyl phosphite.

5. The high temperature resistant packaging adhesive for electronic components according to claim 1, characterized in that: The hydrogen mass fraction of the hydrogen-containing silicone oil is 0.27%, and the average molar mass is 750 g / mol.

6. The high temperature resistant packaging adhesive for electronic components according to claim 1, characterized in that: The catalyst is trifluoroacetic acid.

7. The manufacturing process of a high temperature resistant packaging adhesive for electronic components as claimed in claim 1, characterized in that: The following steps are involved: Step 1: Weigh epoxy resin, polybutadiene benzoxazine resin, adamantane modified silicone oil, thixotropic agent, curing agent, and curing accelerator according to weight, place in a reaction kettle, and stir and mix evenly to form a mixture; Step 2: Grind the mixture on three rollers, roll it into a paste-like material, and perform vacuum degassing on it to obtain packaging glue for electronic components.

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