A film coating method for a film substrate and a film product

Abstract

The present application provides a film coating method and film product, the film coating method comprising: taking a film substrate; using a suspension type coating method to perform first evaporation on the film substrate in a first coating device; using a roller type coating method to perform second evaporation on the film substrate after the first evaporation in a second coating device. Alternatively, the film substrate is first wound in a first coating device to perform first evaporation using a roller type coating method, and then the film substrate after the first evaporation is wound in a second coating device to perform second evaporation using a suspension type coating method. In the embodiments of the present application, the first coating device uses a suspension type coating method, and the second coating device uses a roller type coating method; or the first coating device uses a roller type coating method, and the second coating device uses a suspension type coating method. Using this double control mode can not only solve the problems of edge curling and edge bulging, but also reduce film holes and improve film ductility.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of thin film preparation, in particular to a thin film substrate plating method and a thin film product. BACKGROUND

[0002] Conductive metal thin film is a kind of material with many good properties, which has been widely used in batteries as positive or negative current collector. With the development of vacuum plating technology, the production process of flexible conductive material is gradually replaced by traditional electroplating, coating and chemical treatment method, which reduces the pollution produced by traditional process method, and has the advantages of high purity of plating layer, good adhesion and good uniformity. There are two types of plating equipment on the market, one is a paste roller type evaporation equipment, and the other is a suspension type evaporation equipment. The existing plating methods are as follows:

[0003] 1. Only use the suspension plating method in production, because the suspension plating uses evaporation boat heating, and the aluminum wire is continuously fed by the motor, it is easy to form splashing aluminum in the process of melting and evaporation of aluminum wire, and the splashing aluminum is uncontrollable, which can easily lead to film surface hole burning, resulting in more holes in the produced thin film product, which leads to poor extensibility of the thin film product.

[0004] 2. Only use the paste roller plating method in production, but the heating in the paste roller plating is by crucible evaporation, the energy loss is high in the heating process, and the plating film cannot be taken out immediately after plating, the aluminum material in the crucible that has not been evaporated needs to be evaporated completely, and the cooling time is also relatively long, close to 2 hours, so the whole paste roller plating production cycle is long and the efficiency is low.

[0005] 3. In the patent No. CN113981376A, the name is plating assembly, plating device and plating method, the suspension type and the paste roller type are carried out at the same time in one evaporation equipment, because the suspension type and the paste roller type share one evaporation source, the product hole problem cannot be solved due to uncontrollable current, and the production efficiency is greatly reduced. In addition, in the plating method of suspension and paste roller plating in the same equipment, the evaporation state of the aluminum wire cannot be checked during the plating process, because the aluminum wire is melted by the evaporation boat in the suspension plating process, and the aluminum wire is sent into the boat surface of the evaporation boat by the sending motor during the plating process. The aluminum wire is easy to deviate, and it is inevitable to avoid the contact between the aluminum wire and the evaporation electrode to cause short circuit, which will inevitably form splashing aluminum and cause a large increase in the hole of the film surface. In addition, in the plating method of suspension and paste roller plating in the same equipment, if the aluminum wire deviates, after turning off a single evaporation boat, it is easy to cause uneven square resistance of the film surface.

[0006] However, the film products produced by the method of using the coating roller coating alone or the suspension coating alone are prone to have holes, resulting in the technical problem of poor extensibility of the film products. SUMMARY

[0007] Therefore, the purpose of embodiments of the present application is to provide a film substrate coating method and a film product to solve the technical problem of poor extensibility of the film products produced by the coating method used in the prior art.

[0008] To achieve the above purpose, the first aspect of the present application provides a film substrate coating method, which comprises:

[0009] taking a film substrate;

[0010] coiling the film substrate in a first coating equipment to perform first evaporation by using a suspension coating method;

[0011] coiling the film substrate after the first evaporation in a second coating equipment to perform second evaporation by using a coating roller coating method.

[0012] In some possible embodiments, the first coating equipment is a suspension vacuum evaporation equipment, which comprises a first coiling device, a first winding device, an evaporation boat, a plurality of guide rollers, a first tension roller and a first cooling roller arranged in a vacuum chamber, the plurality of guide rollers are used to guide the film substrate, the first tension roller is used to control the tension of the film substrate, and the first cooling roller is used to cool the film substrate; wherein the film substrate has a film running speed of 100 m / min to 400 m / min, and the evaporation boat has a wire feeding speed of 300 mm / min to 500 mm / min.

[0013] In some possible embodiments, the second coating equipment is a coating roller vacuum evaporation equipment, which comprises a second coiling device and a second winding device, a second cooling roller, a flattening roller, a second tension roller and a crucible arranged in the vacuum chamber, the second cooling roller is used to cool the film substrate, the flattening roller is used to flatten the film substrate, and the second tension roller is used to control the tension of the film substrate; wherein the film substrate has a film running speed of 70 m / min to 100 m / min.

[0014] In some possible embodiments, before the film substrate is coiled in the first coating equipment to perform first evaporation by using the suspension coating method, the method further comprises:

[0015] preprocessing the film substrate to form a bonding layer on the film substrate.

[0016] In a second aspect, embodiments of the present application provide another film coating method for a film substrate, the film coating method comprising:

[0017] taking a film substrate;

[0018] coating the film substrate in a first coating device by using a kiss roll coating method to perform a first evaporation;

[0019] coating the film substrate after the first evaporation in a second coating device by using a suspension coating method to perform a second evaporation.

[0020] In some possible embodiments, the first coating device is a kiss roll vacuum evaporation device, a crucible is used as an evaporation source in the kiss roll vacuum evaporation device, and the film substrate has a film running speed of 70 m / min to 100 m / min.

[0021] In some possible embodiments, the second coating device is a suspension vacuum evaporation device, an evaporation boat is used as an evaporation source in the suspension vacuum evaporation device, the film substrate has a film running speed of 100 m / min to 400 m / min, and the evaporation boat has a wire feeding speed of 300 mm / min to 500 mm / min.

[0022] In some possible embodiments, before the film substrate is coated in the first coating device by using the kiss roll coating method to perform the first evaporation, the method further comprises:

[0023] preprocessing the film substrate to form a bonding layer on the film substrate.

[0024] In a third aspect, embodiments of the present application further provide a film product produced by using the above method, the film product has holes that simultaneously satisfy 100 um pinhole frequency ≤ 0.2 and 500 um pinhole frequency ≤ 0.2, and simultaneously satisfy longitudinal elongation ≥ 50% and transverse elongation ≥ 40%.

[0025] In a fourth aspect, embodiments of the present application further provide another film product produced by using the above method, the film product has holes that simultaneously satisfy 100 um pinhole frequency (ea / m2) ≤ 0.1 and 500 um pinhole frequency (ea / m2) ≤ 0.2, and simultaneously satisfy longitudinal elongation ≥ 55% and transverse elongation ≥ 36%.

[0026] The above technical solution has the following beneficial technical effects:

[0027] The film coating method and the film product provided by the embodiment of the present application, the film coating method comprises: taking a film substrate; adopting a suspension type film coating method to perform first evaporation on the film substrate in a first film coating device; adopting a sticking roller type film coating method to perform second evaporation on the film substrate after the first evaporation in a second film coating device. Alternatively, the film substrate is first taken to the first film coating device to perform first evaporation by adopting the sticking roller type film coating method, and then the film substrate after the first evaporation is taken to the second film coating device to perform second evaporation by adopting the suspension type film coating method. In the embodiment of the present application, the first film coating device adopts the suspension type film coating method, and then the product formed after the suspension type film coating is transported to the second film coating device, and the second film coating device adopts the sticking roller type film coating method; or the first film coating device adopts the sticking roller type, and the second film coating device adopts the suspension type. By adopting the double control mode, the problem of edge curling and edge bulging can be solved, the film holes can be reduced, and the film extensibility can be improved. BRIEF DESCRIPTION OF DRAWINGS

[0028] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or the prior art description. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can also be obtained by those skilled in the art without any creative effort.

[0029] Figure 1 is a flow chart of a film coating method of a film substrate according to an embodiment of the present application;

[0030] Figure 2 is a flow chart of another film coating method of a film substrate according to an embodiment of the present application;

[0031] Figure 3 is a structural schematic diagram of a suspension type film coating device according to an embodiment of the present application;

[0032] Figure 4 is a structural schematic diagram of a sticking roller type film coating device according to an embodiment of the present application.

[0033] Explanation of reference signs:

[0034] 31, first unwinding device; 32, first winding device; 33, evaporation boat; 34, passing roller; 35, first tension roller; 36, first cooling roller; 37, main roller;

[0035] 41, second unwinding device; 42, second winding device; 43, second cooling roller; 44, flattening roller; 45, second tension roller; 46, crucible. DETAILED DESCRIPTION

[0036] Features and exemplary embodiments of various aspects of the present application will be described in detail below. In the following detailed description, numerous specific details are set forth in order to provide a thorough understanding of the present application. However, it will be apparent to one of ordinary skill in the art that the present application can be practiced without some or all of these specific details. In other instances, well known structures and functions have not been described in detail in order to avoid obscuring the application. The description of the embodiments is merely intended to provide a better understanding of the application, by showing example examples of the application. In the drawings and the following description, at least some of the known structures and techniques are not shown in order to avoid unnecessary obscuring of the application; and, the dimensions of some structures can be exaggerated for clarity. Furthermore, features, structures or characteristics described below can be combined in any suitable manner in one or more embodiments.

[0037] Embodiment One

[0038] Figure 1 is a flow chart of a film coating method of a film substrate according to an embodiment of the present application, as shown in Figure 1 The film coating method comprises the following steps:

[0039] Step S11, taking the film substrate;

[0040] Step S12, coiling the film substrate in the first film coating equipment to perform the first evaporation by using the suspension type film coating method;

[0041] Step S13, coiling the film substrate after the first evaporation in the second film coating equipment to perform the second evaporation by using the paste roller type film coating method.

[0042] Specifically, in the embodiment of the present application, the suspension type film coating method is used to perform the first evaporation on the film substrate, and then the paste roller type film coating method is used to perform the second evaporation. By using this double control mode, the problem of the edge curling and the edge bulging can be solved, the film holes can be reduced, and the film extensibility can be improved.

[0043] In the prior art, if only the suspended plating method is used, the suspended plating itself has a high plating speed and a thin deposited metal layer because the suspended plating has a poor cooling effect and can only reduce the heating of the film surface by increasing the plating speed to avoid hole burning. If evaporation is performed below the cooling roller, string bubbles and convex points are easily formed on the film surface. In addition, the temperature of the cooling liquid is -30 degrees, and the cooling and heating time out of the warehouse is long, and the energy consumption is large. Therefore, if only the suspended plating method is used, the suspended plating has a poor cooling effect, resulting in many holes, and the performance in terms of product elongation is poor. If the entire plating is performed using the pasting roller method, the edges of the film blocked by the side are not plated with metal, and thus the heating is poor. Since the evaporation environment is high temperature, the edges will definitely be drummed and warped, affecting the product quality. In the present embodiment, a high film speed and low wire feeding are used during the suspended plating, and only one pass of production is performed. The film layer is thin, the heat received by the film surface is low, the holes formed are small holes, and the number is extremely small. When the pasting roller plating is used, the evaporation amount is large and the cooling effect is good. The micro-holes generated by the suspended plating can also be repaired during the pasting roller plating. In addition, the suspended plating has a small evaporation amount, and does not need to use a side. The entire width can be plated with a layer of metal (such as aluminum), the film surface is uniformly heated, and drumming and warping of the edges are not easy to occur. In addition, in the prior art, if only the pasting roller plating method is used, the cooling roller is above the evaporation area, the length of the roller is greater than the width of the film, and the excess part is easy to accumulate aluminum. If the side is too small, the film edge will easily form a warped edge after contacting the aluminum area of the roller. If the size of the side is too large, the heating is uneven and the drumming of the edge is easy to occur.

[0044] The film coating method of the present application uses a suspension coating method in the first evaporation, and the evaporation area is wider than the width of the film, so that the entire width of the film is coated with metal, such as aluminum, to enhance the heat resistance of the film surface. Because the film substrate can withstand higher temperatures after being coated with aluminum, it is then transferred to a second coating device for roll coating. After suspension coating, the entire width of the film surface is coated with an aluminum film, and when suspension coating is performed again, the edge position is less likely to deform and shrink due to the aluminum layer. Therefore, the edge can be reduced. Roll coating will always have an edge because the roll means that the film is attached to the roll, and then coated. Since the film is attached to the roll, the roll must be wider than the film, otherwise part of the film will be suspended, resulting in unqualified film tension and other properties. Since the width of the roll is greater than the width of the film, the excess part of the roll is not in contact with the film. If there is no edge, the evaporated metal will accumulate on the excess roll. To solve this problem, an edge, which is a device that can block the excess roll, is used. Of course, the edge must cover the edge of the film, because if it does not cover the edge, the part of the roll that is not covered will be coated with metal. In the present embodiment, the film substrate is first coated by suspension coating. After being coated with aluminum, the film substrate not only increases the heat resistance of the film substrate, but also the thermal conductivity of the aluminum layer is much greater than that of the pure film. Therefore, during the suspension coating process, even if aluminum vapor evaporates to the edge position, it can be quickly cooled to avoid the risk of edge bulging and edge warping. In addition, the roll coating method is used in the second evaporation. At this time, the film surface is completely wrapped around the roll surface. The inside of the roll is filled with cooling liquid at a certain temperature, and the crucible evaporation method is used to reduce the risk of aluminum splashing. Even with a large evaporation amount, roll coating can quickly cool the film surface to avoid the problem of film surface burning holes. It can also increase the elongation of the film product.

[0045] Furthermore, if suspension and roll coating are used simultaneously in the same device, the suspension and roll coating share one evaporation source, which still cannot solve the problem of product holes, and once there is a problem, it cannot be corrected, which greatly reduces production efficiency. The production method of the present application can adjust the running speed of the first coating device to control the production speed. After the film product is produced, the film can be easily checked and corrected when the film product has a problem because the film is processed separately. Mixed coating in the same device is limited by the edge, and if production is continued after the edge is bulged, it is easy to cause the film roll to relax, resulting in wrinkles on the film surface and causing the film to be scrapped.

[0046] In some embodiments, the evaporation boat is used as the evaporation source in the suspended coating method, the film substrate has a film running speed of 100-400 m / min, and the evaporation boat has a wire feeding speed of 300-500 mm / min. In the roll coating method, the crucible is used as the evaporation source, and the film substrate has a film running speed of 70-100 m / min.

[0047] In the present embodiment, the first coating device can include a unwinding device, an evaporation zone and a winding device, and the evaporation zone is provided with an evaporation boat. In the present embodiment, the crucible cannot be used because the crucible has a large capacity, while the evaporation boat has a moderate capacity. The use of the evaporation boat can further reduce the holes in the film. Because there is no cooling roller above the suspended coating area at this time, the use of the evaporation boat needs to be matched with the film running speed to reduce the damage of the evaporated metal to the film. In the first coating device, the film substrate has a film speed of 100-400 m / min, and the wire feeding speed is 300-500 mm / min. In the second coating device, a unwinding device, an evaporation zone and a winding device are also provided, and the evaporation zone is mainly provided with a crucible. The crucible is mainly used because it can evaporate a large amount of metal at one time, which can quickly thicken the metal on the film. At this time, there is no need to worry about the problem of film heating. At this time, the film running speed is 70-100 m / min. It is found through experiments that the use of the above wire feeding speed matched with the film running speed and the evaporation device using the evaporation boat in the first coating device, and the use of the above film running speed in the second coating device can greatly improve the holes and elongation of the film substrate compared with the use of the suspended type and the roll type alone, and the use of the suspended type and the roll type in one cavity. The present application tests two samples. The suspended type and the roll type combination mentioned in the present application are tested respectively. The suspended film has a film running speed of 100 m / min and a wire feeding speed of 300 mm / min. The roll type film has a film running speed of 70 m / min. The test results are shown in Table 1. The product film produced through the above process simultaneously satisfies 100 um pinhole frequency (ea / m2) ≤0.2, 500 um pinhole frequency (ea / m2) ≤0.2, elongation MD≥50%, and TD≥40%. MD is the longitudinal elongation, and TD is the transverse elongation. It can be seen that the film product produced by the method of first evaporating by the suspended coating method and then evaporating by the roll coating method not only has fewer holes, but also has greatly increased elongation.

[0048] Table 1:

[0049]

[0050]

[0051] In some embodiments, before the first evaporation of the thin film substrate in the first coating device by using the suspension coating method, the method further comprises: pretreating the thin film substrate to form a bonding layer on the thin film substrate. Since the connection between the polymer material and the metal is through molecular bond, the combination of the two molecular bonds is relatively poor. By using the metal oxide as the primer, the problem of poor bonding force between the polymer and the metal due to direct contact is solved. Therefore, in this embodiment, a bonding force improving layer is arranged on the thin film. At this time, the bonding force improving layer can be a metal oxide layer or an alloy layer or other metal capable of improving the bonding force between the metal and the thin film substrate during the evaporation process.

[0052] Embodiment two

[0053] Figure 2 is a flowchart of another thin film substrate coating method according to an embodiment of the present application, as shown in the figure, the coating method comprises the following steps: Figure 2

[0054] Step S21, taking the thin film substrate;

[0055] Step S22, winding the thin film substrate in the first coating device to perform the first evaporation by using the paste roller coating method;

[0056] Step S23, winding the thin film substrate after the first evaporation in the second coating device to perform the second evaporation by using the suspension coating method.

[0057] In some embodiments, the crucible is used as the evaporation source in the first coating device, and the film running speed of the thin film substrate is 70 m / min to 100 m / min. The evaporation boat is used as the evaporation source in the second coating device, and the film running speed of the thin film substrate is 100 m / min to 400 m / min, and the wire feeding speed of the evaporation boat is 300 mm / min to 500 mm / min.

[0058] In this embodiment, the first coating device is a paste roller coating, and the evaporation zone uses the crucible evaporation method. Since the cooling effect is good in the paste roller coating, the crucible evaporation can be used in this embodiment to improve the coating efficiency. At this time, the film running speed of the thin film substrate can be 70 m / min to 100 m / min. Of course, since the crucible is used at this time, the wire feeding mechanism is not needed. By using the above combination, that is, the film running speed and the crucible, the film surface holes caused by splashing aluminum can be avoided as much as possible.

[0059] ​In the prior art, the film is plated by the pasting roller plating method. Since the cooling roller is above the evaporation zone and the length of the roller is greater than the width of the film, the extra part is prone to accumulate aluminum. If the size of the baffle is too small, the film edge is prone to form a curled edge after being in contact with the aluminum part of the roller. If the size of the baffle is too large, uneven heating is prone to form a drum edge. In the embodiment, the film substrate is first pasted and evaporated, and then the film substrate is plated by the suspension plating method. Even if the suspension plating is prone to splash metal, the metal liquid is not easy to break the film surface, thereby reducing the hole probability. At the same time, the suspension plating method can also compensate for the problem of thin aluminum layer on the edge of the pasting roller. Of course, although the above characteristics exist, the film speed and wire feeding speed in the second film plating device still need to be set. At this time, the film speed of the film substrate can still be set to 100 m / min-400 m / min, and the wire feeding speed can be set to 300 m / min-500 mm / min. At this time, the hole probability of the produced film product can still be reduced, and the elongation of the film product can be improved.

[0060] In addition, when the film product is produced by using the film plating method provided in the embodiment, trial production is generally first performed. The slight curled edge can be corrected by the suspension plating method, and the product can be slightly trimmed. If it cannot be corrected, it needs to be stopped in time. For example, if a drum edge appears after the first plating, the embodiment can be flattened in the subsequent pasting roller plating process, and the film surface can be continuously produced after being flattened. In addition, after the first evaporation, the film can be measured by a square resistance meter. After the measurement, the wire feeding amount can be adjusted according to the resistance value change. For example, if a slight drum edge and curled edge appear in the pasting roller plating process, they can be transferred to the suspension plating device for correction. If they are relatively serious, they can only be trimmed. In addition, since the suspension plating method does not need a baffle, the edge position is plated with an aluminum layer during the evaporation process, and the edge position can be flattened under the action of tension during the plating process.

[0061] In the embodiment, two samples are also tested. The pasting roller type and the suspension type combination mentioned in the application are tested. The film speed of the pasting roller type is 70 m / min, the film speed of the suspension type is 100 m / min, and the wire feeding speed is 300 mm / min. The test results are shown in Table 2. The product film produced by the above process satisfies 100 um pinhole frequency (ea / m2)≤0.1, 500 um pinhole frequency (ea / m2)≤0.2, elongation MD≥55%, and TD≥36%. MD is the longitudinal elongation, and TD is the transverse elongation. It can be seen that the film product produced by the method of first evaporating by the pasting roller plating method and then evaporating by the suspension plating method has fewer holes and greatly increased elongation.

[0062] Table 2:

[0063] Test samples 100um pinhole frequency 500um pinhole frequency Product elongation Coated roll sample 1 0.6 0.8 MD=30%, TD=25% Coated roll + suspension sample 1 0.1 0.1 MD=55%, TD=36% Coated roll sample 2 0.5 0.9 MD=33%, TD=24% Coated roll + suspension sample 2 0.1 0.2 MD=59%, TD=38%

[0064] In this embodiment, before the thin film substrate is unwound in the first coating equipment for the first evaporation deposition using a suspension coating method, the process further includes: pre-treating the thin film substrate and depositing an adhesive layer on the thin film substrate. Since the polymer material and the metal are connected by molecular bonds, and the bonding between these two types of molecular bonds is relatively weak, using a metal oxide underlayer solves the problem of weak direct contact and adhesion between the polymer and the metal. Therefore, in this embodiment, an adhesion-enhancing layer is deposited on the thin film. This adhesion-enhancing layer can be a metal oxide layer, an alloy layer, or other metal that can improve the adhesion between the metal and the thin film substrate during the evaporation deposition process.

[0065] As an example, Figure 3 This is a schematic diagram of the structure of a suspension coating device according to an embodiment of the present invention, as shown below. Figure 3 As shown, the suspended coating equipment is set in a vacuum chamber and includes a first unwinding device 31, a first winding device 32, and an evaporation boat 33, as well as several guide rollers 34 for guiding the film during the evaporation process, a first tension roller 35 for controlling the film tension, a first cooling roller 36, and a main roller 37, etc. This coating equipment can coat one side of the film, and can coat the film twice, thus coating both sides of the film. Of course, the suspended coating equipment is not limited to the embodiment shown in this example. Figure 3 The structure shown can also be any other structure used for suspension evaporation deposition, as long as it can be used for suspension coating. During the evaporation deposition process, after the thin film substrate is unwound by the first unwinding device 31, it passes through the guide roller 34, the first tension roller 35, the first cooling roller 36 and the main roller 37 on the film path, and is then wound up by the first winding device 32.

[0066] Figure 4 This is a schematic diagram of the structure of a roller coating device according to an embodiment of the present invention, as shown below. Figure 4 As shown, the device includes a second unwinding device 41 and a second winding device 42. Along the unwinding and winding paths, there are multiple evaporation zones, a second cooling roller 43, a flattening roller 44, and a second tension roller 45. In this equipment, the evaporation zone generally uses a crucible 46 as the evaporation source. During evaporation coating, the thin film substrate is bonded to the second cooling roller 43 for coating. In this embodiment, six evaporation zones sequentially perform metal coating on two surfaces of the thin film substrate, greatly improving the evaporation efficiency of the thin film. Of course, other existing roller-type coating equipment can also be used for coating; this embodiment does not impose specific limitations. Example 3

[0067] The embodiment of the present application further provides a film product obtained by using the first method, wherein the holes on the film product satisfy the conditions that the frequency of 100um pinholes is less than or equal to 0.2, the frequency of 500um pinholes is less than or equal to 0.2, the elongation rate satisfies the conditions that the longitudinal shrinkage is greater than or equal to 50% and the transverse shrinkage is greater than or equal to 40%.

[0068] The embodiment of the present application further provides a film product obtained by using the second method, wherein the holes on the film product satisfy the conditions that the frequency of 100um pinholes (ea / m2) is less than or equal to 0.1 and the frequency of 500um pinholes (ea / m2) is less than or equal to 0.2, and the elongation rate satisfies the conditions that the longitudinal shrinkage is greater than or equal to 55% and the transverse shrinkage is greater than or equal to 36%.

[0069] The film product produced by the method provided by the embodiment of the present application not only has a low probability of holes, but also greatly improves the elongation of the film, thereby improving the production quality of the film.

[0070] In the description of the embodiment of the present application, it should be noted that the terms "upper, lower, inner and outer" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first, second or third" are only for the purpose of description and cannot be understood as indicating or implying relative importance.

[0071] Unless otherwise specifically defined and limited, the terms "mounting, connecting, connection" in the embodiment of the present application should be understood broadly, for example: it can be fixed connection, detachable connection or integral connection; it can also be mechanical connection, electrical connection or direct connection, it can also be indirectly connected through an intermediate medium, or it can be the communication between two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0072] Although the present application has been described with reference to the preferred embodiments, various modifications can be made and equivalents can be substituted for the components thereof without departing from the scope of the present application. In particular, the technical features mentioned in each embodiment can be combined in any way as long as there is no structural conflict. The present application is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

1. A film forming method for a film substrate, characterized by, The coating method comprises: taking a film substrate; unwinding the film substrate in a first coating device to perform first evaporation on the film substrate by using a suspension coating method to form a metal film on the film substrate; unwinding the film substrate after the first evaporation in a second coating device to perform second evaporation on the basis of the metal film by using a paste roller coating method.

2. The coating method of the film substrate according to claim 1, wherein the first coating device is a suspension vacuum evaporation device, and the suspension vacuum evaporation device comprises a first unwinding device, a first winding device, an evaporation boat, a plurality of guide rollers, a first tension roller and a first cooling roller arranged in a vacuum chamber, the plurality of guide rollers are used to guide the film substrate, the first tension roller is used to control the tension of the film substrate, and the first cooling roller is used to cool the film substrate.

3. The coating method of the film substrate according to claim 1, wherein the second coating device is a paste roller vacuum evaporation device, and the paste roller vacuum evaporation device comprises a second unwinding device, a second winding device, a second cooling roller, a flattening roller, a second tension roller and a crucible arranged in a vacuum chamber, the second cooling roller is used to cool the film substrate, the flattening roller is used to flatten the film substrate, and the second tension roller is used to control the tension of the film substrate.

4. The coating method of the film substrate according to claim 1, wherein the film substrate has a film running speed of 100 m / min to 400 m / min, and the evaporation boat has a wire feeding speed of 300 mm / min to 500 mm / min.

5. The coating method of the film substrate according to claim 1, wherein the film substrate has a film running speed of 70 m / min to 100 m / min.

6. The coating method of the film substrate according to claim 1, wherein before the film substrate is unwound in the first coating device to perform the first evaporation by using the suspension coating method, the method further comprises: performing pretreatment on the film substrate to form a bonding layer on the film substrate.

4. The method of claim 1, wherein the film is formed on a surface of the film substrate.

7. The coating method of the film substrate according to claim 5, wherein the first coating device is a paste roller vacuum evaporation device, the paste roller vacuum evaporation device uses a crucible as an evaporation source, and the film substrate has a film running speed of 70 m / min to 100 m / min.

8. The coating method of the film substrate according to claim 6, wherein the second coating device is a suspension vacuum evaporation device, the suspension vacuum evaporation device uses an evaporation boat as an evaporation source, the film substrate has a film running speed of 100 m / min to 400 m / min, and the evaporation boat has a wire feeding speed of 300 mm / min to 500 mm / min.

5. A film forming method for a film substrate, characterized by, ​ ​ ​ ​ ​ ​ ​ ​ 8. The method of claim 5, wherein the film is formed by a method selected from the group consisting of sputtering, vacuum deposition, and ion plating. Before the first evaporation is carried out by adopting the pasting roller type coating method in the first coating equipment, the method further comprises the following steps: The film base material is pretreated, and a bonding layer is arranged on the film base material.

9. A film product produced by the film coating method of any one of claims 1 to 4, wherein the film product is characterized by, The holes on the film product meet 100um pinhole frequency ea / m 2 Less than or equal to 0.2 and 500um pinhole frequency ea / m 2 Less than or equal to 0.2, and the elongation meets longitudinal elongation greater than or equal to 50% and transverse elongation greater than or equal to 40%.

10. A film product produced by the film coating method of any one of claims 5 to 8, wherein the film product is characterized by, The holes on the film product meet 100um pinhole frequency ea / m 2 Less than or equal to 0.1 and 500um pinhole frequency ea / m 2 Less than or equal to 0.2, and the elongation meets longitudinal elongation greater than or equal to 55% and transverse elongation greater than or equal to 36%.

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