A high-power and efficient heat dissipation LED light bar

Abstract

The present invention relates to the technical field of LED light strips, and in particular to a high-power and high-efficiency heat dissipation LED light strip, comprising a film-type light strip body, a heat dissipation adhesive, a chip resistor and an LED lamp bead. The film-type light strip body and the heat dissipation adhesive are used to replace a traditional hard aluminum substrate, so as to reduce the heat conduction distance between the heat dissipation adhesive and the film-type light strip body, increase the heat flux density, promote the heat dissipation of the film-type light strip body, and the film-type light strip body is lighter and the LED light strip is bendable. The heat dissipation adhesive is used to dissipate the heat of the film-type light strip body, which not only avoids the light strip being damaged due to drilling holes or screwing during installation, but also facilitates installation and has a heat dissipation effect. In addition, the side wall of the film-type light strip body is protruded with a first heat dissipation fin evenly arranged at intervals, and the side wall of the heat dissipation adhesive is protruded with a second heat dissipation fin evenly arranged at intervals and corresponding to the first heat dissipation fin one by one, thereby increasing the heat dissipation area between the high-power and high-efficiency heat dissipation LED light strip and the air, and further improving the heat dissipation efficiency.

Description

Technical Field

[0001] The invention relates to the technical field of LED light bars, and in particular to a high-power and efficient heat dissipation LED light bar. Background Art

[0002] LED light strip refers to LEDs assembled on a strip-shaped FPC (flexible circuit board) or PCB hard board, and is named because its product shape is like a strip. It is gradually emerging in various decoration industries because of its long service life (normal life is generally 80,000 to 100,000 hours), energy saving and green environmental protection.

[0003] High-power LED light strips usually have a power of 8-15W, high brightness, and pure light color. Most of them use hard aluminum substrates with LED lamp beads, resistors and other electronic components. Although the brightness is high and the light color is pure, the aluminum substrate includes a circuit layer, an insulating layer and a metal base layer. It is relatively thick and cannot be bent. The heat dissipation effect is also limited, which is not enough to meet the needs of existing high-power LED light strips. Summary of the invention

[0004] In order to overcome the shortcomings and deficiencies in the prior art, an object of the present invention is to provide a high-power and efficient heat dissipation LED light bar.

[0005] The objective of the present invention is achieved through the following technical scheme: a high-power and high-efficiency heat-dissipating LED light strip, comprising a film-type light strip body, a heat-dissipating adhesive bonded to the back of the film-type light strip body, a plurality of chip resistors spaced apart on the film-type light strip body, and a plurality of LED lamp beads spaced apart on the film-type light strip body, the side wall of the film-type light strip body protruding with first heat-dissipating fins spaced apart and arranged evenly, the side wall of the heat-dissipating adhesive bonded with second heat-dissipating fins spaced apart and corresponding one-to-one with the first heat-dissipating fins.

[0006] Preferably, the film-type light strip body comprises a first insulating film, an aluminum foil circuit and a second insulating film which are sequentially bonded together, and the LED lamp beads and the chip resistors both penetrate the first insulating film and are electrically connected to the aluminum foil circuit.

[0007] Preferably, first solder pads are provided at both ends of the first aluminum foil circuit, and a first solder pad is attached to the first solder pad that penetrates the first insulating film, and the first solder pad is used to electrically connect to an adjacent LED light strip or power line.

[0008] Preferably, the first aluminum foil circuit is further provided with a plurality of second solder pad positions arranged at intervals, the second solder pad positions are attached with a second solderable coating, and the LED lamp bead is electrically connected to the second solderable coating.

[0009] Preferably, the first aluminum foil circuit is further provided with a plurality of third solder pad positions arranged at intervals, the third solder pad positions are attached with a third solderable coating, and the chip resistor is electrically connected to the third solderable coating.

[0010] Preferably, the first insulating film and the second insulating film are both polyimide films, and the average film thickness of the first insulating film and the average film thickness of the second insulating film are both 10-50 μm; the aluminum foil circuit is an etched aluminum layer, and the average thickness of the aluminum foil circuit is 10-20 μm.

[0011] Preferably, the first insulating film and the aluminum foil circuit, as well as the aluminum foil circuit and the second insulating film are bonded by thermosetting adhesive.

[0012] Preferably, the ratio of the area of ​​the first heat dissipation convex fin to the gap area between two adjacent first heat dissipation convex fins is 1-4:1.

[0013] Preferably, the thickness of the heat dissipation adhesive is 0.2-0.8 mm.

[0014] Preferably, the heat dissipation adhesive backing is an acrylic heat dissipation double-sided adhesive.

[0015] The beneficial effects of the present invention are as follows: the high-power and high-efficiency heat dissipation LED light strip of the present invention adopts a film-type light strip body and a heat dissipation adhesive bonded to the back of the film-type light strip body to replace the traditional hard aluminum substrate, which is thinner, reduces the heat conduction distance between the heat dissipation adhesive and the film-type light strip body, increases the heat flux density, and is more conducive to promoting the heat dissipation of the film-type light strip body, and is lighter in weight and the LED light strip is bendable. The heat dissipation of the film-type light strip body by the heat dissipation adhesive can avoid damage to the light strip caused by drilling holes in the light strip or tightening screws during installation, which is convenient to install and can achieve heat dissipation effect; in addition, the side wall of the film-type light strip body protrudes with first heat dissipation fins arranged evenly at intervals, and the side wall of the heat dissipation adhesive protrudes with second heat dissipation fins arranged evenly at intervals and bonded to the first heat dissipation fins one-to-one, which increases the heat dissipation area of ​​the high-power and high-efficiency heat dissipation LED light strip and the air, and further improves the heat dissipation efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the structure of the present invention;

[0017] Figure 2 It is a cross-sectional view of the present invention.

[0018] The accompanying drawings are marked as follows: 1. heat dissipation adhesive; 2. film-type light strip body; 21. first insulating film; 22. aluminum foil circuit; 23. second insulating film; 3. chip resistor; 4. LED lamp bead; 5. first heat dissipation fin; 6. first solderable coating; 7. thermosetting adhesive. DETAILED DESCRIPTION

[0019] In order to facilitate the understanding of those skilled in the art, the present invention is further described below in conjunction with embodiments and drawings. The contents mentioned in the implementation modes are not intended to limit the present invention.

[0020] like Figure 1-2 As shown, in a typical embodiment of the present application, a high-power and high-efficiency heat-dissipating LED light strip is provided, comprising a film-type light strip body 2, a heat-dissipating adhesive 1 adhered to the back of the film-type light strip body 2, a plurality of chip resistors 3 spaced apart on the film-type light strip body 2, and a plurality of LED lamp beads 4 spaced apart on the film-type light strip body 2, the side wall of the film-type light strip body 2 protruding with first heat-dissipating fins 5 spaced apart and arranged evenly, the side wall of the heat-dissipating adhesive 1 protruding with second heat-dissipating fins spaced apart and spaced apart and corresponding one-to-one with the first heat-dissipating fins 5.

[0021] The high-power and high-efficiency heat dissipation LED light strip adopts a film-type light strip body 2 and a heat dissipation adhesive 1 attached to the back of the film-type light strip body 2 to replace the traditional hard aluminum substrate. The film-type light strip body 2 is thinner, which reduces the heat conduction distance between the heat dissipation adhesive 1 and the film-type light strip body 2, increases the heat flux density, and is more conducive to promoting the heat dissipation of the film-type light strip body 2. The film-type light strip body 2 is also lighter and the LED light strip is bendable. The heat dissipation adhesive 1 is used to dissipate heat from the film-type light strip body 2, which not only avoids damage to the light strip due to drilling holes or screwing during installation, but also facilitates installation and has a heat dissipation effect. In addition, the side wall of the film-type light strip body 2 has first heat dissipation fins 5 evenly arranged at intervals, and the side wall of the heat dissipation adhesive 1 has second heat dissipation fins evenly arranged at intervals and attached to the first heat dissipation fins 5 one-to-one, which increases the heat dissipation area between the high-power and high-efficiency heat dissipation LED light strip and the air, further improves the heat dissipation efficiency, and expands the scope of use.

[0022] In one embodiment, the film-type light bar body 2 includes a first insulating film 21, an aluminum foil circuit 22, and a second insulating film 23 bonded in sequence, and the LED lamp beads 4 and the chip resistors 3 all penetrate the first insulating film 21 and are electrically connected to the aluminum foil circuit 22. The aluminum foil circuit 22 is bonded between the first insulating film 21 and the second insulating film 23 to provide a carrier for the aluminum foil circuit 22 and effectively protect the aluminum foil circuit 22 to prevent the aluminum foil circuit 22 from leaking or being pulled and damaged during the processing and installation of the LED light bar. With the aluminum foil circuit 22, the specific heat capacity of aluminum is higher than that of copper, and the heat absorbed or dissipated for every 1°C change is higher, which is conducive to avoiding the temperature rising too fast and affecting the overall performance of the LED light bar; moreover, aluminum has a lower density and lower cost than copper.

[0023] In one embodiment, first solder pads are provided at both ends of the first aluminum foil circuit 22, and a first solder pad is attached to the first solder pad having a first solderable coating 6 penetrating the first insulating film 21, and the first solderable coating 6 is used to electrically connect to an adjacent LED light strip or power line.

[0024] In one embodiment, the first aluminum foil circuit 22 is further provided with a plurality of second solder pads arranged at intervals, the second solder pads are attached with a second solderable coating, and the LED lamp bead 4 is electrically connected to the second solderable coating.

[0025] In one embodiment, the first aluminum foil circuit 22 is further provided with a plurality of third solder pads arranged at intervals, the third solder pads are attached with a third solderable coating, and the chip resistor 3 is electrically connected to the third solderable coating.

[0026] Furthermore, the first solderable coating 6, the second solderable coating and the third solderable coating are all electroplated layers used to improve the nail welding performance of metal parts, such as lead-tin alloy coating or silver coating, to prevent the aluminum foil circuit 22 from being directly welded and causing high temperature deformation of the aluminum foil circuit 22. The first solderable coating 6 is at both ends of the film-type light bar body 2, which is convenient for electrical connection with adjacent LED light bars through a solder-free adapter or a welding adapter line, or welding a power line with one end of the LED light bar.

[0027] In one embodiment, the first insulating film 21 and the second insulating film 23 are both polyimide films, and the average film thickness of the first insulating film 21 and the average film thickness of the second insulating film 23 are both 10-50μm; the aluminum foil circuit 22 is an etched aluminum layer, and the average thickness of the aluminum foil circuit 22 is 10-20μm. The polyimide film has excellent high and low temperature resistance, electrical insulation, adhesion, radiation resistance and dielectric resistance, and can be used for a long time in the temperature range of -269℃ to 280℃, and can reach a high temperature of 400℃ in a short time, effectively protecting the aluminum foil circuit 22, avoiding leakage of the aluminum foil circuit 22 or pulling damage during the processing and installation of the LED light strip, and the average film thickness of the polyimide film is only 10-50μm, which reduces the heat conduction distance between the heat dissipation adhesive 1 and the film-type light strip body 2, increases the heat flux density, and is more conducive to promoting the heat dissipation of the film-type light strip body 2.

[0028] In one embodiment, the first insulating film 21 and the aluminum foil circuit 22, as well as the aluminum foil circuit 22 and the second insulating film 23 are bonded by thermosetting adhesive 7. Preferably, the thermosetting adhesive 7 is epoxy thermosetting adhesive 7, with a curing temperature of 120-130° C. and a curing time of 10-15 min.

[0029] In one embodiment, the ratio of the area of ​​the first heat dissipating fin 5 to the gap area between two adjacent first heat dissipating fins 5 is 1-4:1, and the first heat dissipating fin 5 and the second heat dissipating fin are used to further promote the heat dissipation of the film-type light strip body 2 and the heat dissipating adhesive 1; and research has found that the larger or smaller the ratio of the area of ​​the first heat dissipating fin 5 to the gap area between two adjacent first heat dissipating fins 5 is, the weakened heat dissipation effect will be caused, and it is easy to cause tearing damage to the film-type light strip body 2 during processing or installation. Controlling the ratio of the area of ​​the first heat dissipating fin 5 to the gap area between two adjacent first heat dissipating fins 5 to be 1-4:1 is more conducive to ensuring the air flow speed and heat exchange area between the two adjacent first heat dissipating fins 5 during the heat dissipation process.

[0030] In one embodiment, the thickness of the heat dissipation adhesive 1 is 0.2-0.8 mm, preferably 0.2 mm, 0.3 mm, 0.4 mm, 0.45 mm, 0.5 mm, 0.55 mm, 0.6 mm, 0.65 mm, 0.7 mm, 0.75 mm or 0.8 mm.

[0031] In one embodiment, the heat dissipation adhesive 1 is an acrylic heat dissipation double-sided adhesive, and this special heat dissipation double-sided adhesive has excellent heat dissipation effect.

[0032] Specifically, the acrylic heat dissipation double-sided adhesive comprises the following raw materials in parts by weight:

[0033]

[0034] The acrylic heat dissipation double-sided adhesive tape uses acrylic ester monomers and acrylic acid as main monomers, and adds a diluent, an initiator and an isocyanate curing agent to react to obtain an acrylic resin adhesive, which has excellent bonding strength, shear resistance, creep resistance, cohesion and holding force; under the action of the diluent, the graphite modifier is evenly dispersed in the acrylic resin adhesive, giving full play to the excellent heat dissipation and thermal conductivity effect of the graphite modifier, and the graphite modifier prepared by a special method of the present invention has better heat dissipation effect than copper material, lighter weight, better long-term heat dissipation stability, is more suitable for acrylic heat dissipation double-sided adhesive tape, and has lower cost than graphene.

[0035] Furthermore, the acrylic acid ester monomer is a mixture of methyl methacrylate, butyl acrylate, isooctyl acrylate and hydroxyethyl acrylate in a weight ratio of 1-2:7-8:8-10:0.5.

[0036] Furthermore, the acrylic acid is methacrylic acid.

[0037] Acrylate monomers and acrylic acid provide cross-linking points, imparting greater peeling force, while methyl methacrylate and hydroxyethyl acrylate work together to improve system stability, resulting in a double-sided adhesive with a more uniform molecular weight distribution, a more uniform dispersion of graphite modifiers, and a more uniform viscosity.

[0038] Furthermore, the preparation method of the graphite modification body comprises the following steps:

[0039] (R1), 30-50 parts by weight of graphite powder, 1-2 parts of copper powder and 5-10 parts of silicon carbide powder are mixed evenly, and passed through an 80-100 mesh sieve to obtain a mixed powder;

[0040] (R2) Under argon protection, the mixed powder is first heated to 500-550°C and kept warm for 1-2 hours, then heated to 800-850°C and kept warm for 1-2 hours, and then heated to 1000-1200°C and kept warm for 1-2 hours. After cooling to room temperature, the mixed powder is ball-milled to a powder particle size of 30-60 μm to obtain a graphite modified body.

[0041] The preparation method of the graphite modification body adopts graphite powder, copper powder and silicon carbide powder as main heat dissipation raw materials, and is subjected to high-temperature impurity removal and sintering under argon protection, so as to promote the combination of graphite powder, copper powder and silicon carbide powder, and the graphite powder is smoother and has a higher degree of non-porous crystallization, and the copper powder has better stability and anti-oxidation effect, thereby greatly improving the heat dissipation effect and long-term stability of the graphite modification body.

[0042] Furthermore, the diluent is acetone, ethyl acetate or toluene.

[0043] Furthermore, the initiator is benzoyl peroxide or lauroyl peroxide.

[0044] Furthermore, the isocyanate curing agent is an aliphatic isocyanate curing agent, the mass fraction of the -NCO group is 18-21%, and the mass fraction of the non-volatile component is 85-93%.

[0045] Furthermore, the preparation method of the acrylic heat dissipation double-sided adhesive comprises the following steps:

[0046] (S1), taking acrylate monomer, acrylic acid, graphite modifier, diluent, initiator and isocyanate curing agent according to weight parts for later use;

[0047] (S2), taking a portion of the diluent, adding the initiator and mixing evenly to obtain a diluted initiator;

[0048] (S3), taking another portion of the diluent, adding the acrylate monomer and acrylic acid to the mixture, stirring and heating to 70-80° C. under nitrogen protection, adding a portion of the diluted initiator, heating to 90-95° C. and reacting for 15-20 minutes to obtain a prepolymer;

[0049] (S4), adding the graphite modifier to another part of the diluted initiator and mixing evenly, then adding it to the prepolymer and mixing evenly, heating it to 92-95° C. and keeping it for 2 hours, then cooling it to room temperature, removing the nitrogen protection, and then adding the isocyanate curing agent and mixing evenly to obtain an adhesive;

[0050] (S5), applying the adhesive to one side of the release film, curing it at 100-120° C. for 3-5 minutes, and then transferring it to another side of the release film to obtain an acrylic heat dissipation double-sided adhesive.

[0051] During assembly, tear off one of the release films of the acrylic heat dissipation double-sided adhesive tape and adhere it to the back of the film-type light strip body; when installing the LED light strip, tear off the other release film and attach and fix it.

[0052] Example 1

[0053] like Figure 1-2 As shown, a high-power and high-efficiency heat-dissipating LED light strip comprises a film-type light strip body 2, a heat-dissipating adhesive 1 adhered to the back of the film-type light strip body 2, a plurality of chip resistors 3 spaced apart on the film-type light strip body 2, and a plurality of LED lamp beads 4 spaced apart on the film-type light strip body 2, the side wall of the film-type light strip body 2 protrudes with first heat-dissipating convex fins 5 spaced apart and arranged evenly, the side wall of the heat-dissipating adhesive 1 protrudes with second heat-dissipating convex fins spaced apart and adhered to the first heat-dissipating convex fins 5 one-to-one.

[0054] The film-type light bar body 2 includes a first insulating film 21 , an aluminum foil circuit 22 and a second insulating film 23 which are sequentially bonded. The LED lamp beads 4 and the chip resistors 3 both penetrate the first insulating film 21 and are electrically connected to the aluminum foil circuit 22 .

[0055] Both ends of the first aluminum foil circuit 22 are provided with first solder pads, and the first solder pads are attached with a first solderable coating 6 penetrating the first insulating film 21 , and the first solderable coating 6 is used for electrically connecting with adjacent LED light strips or power lines.

[0056] The first aluminum foil circuit 22 is further provided with a plurality of second solder pads arranged at intervals, the second solder pads are attached with a second solderable coating, and the LED lamp bead 4 is electrically connected to the second solderable coating.

[0057] The first aluminum foil circuit 22 is further provided with a plurality of third solder pads arranged at intervals, the third solder pads are attached with a third solderable coating, and the chip resistor 3 is electrically connected to the third solderable coating.

[0058] The first insulating film 21 and the second insulating film 23 are both polyimide films, and the average film thickness of the first insulating film 21 and the average film thickness of the second insulating film 23 are both 30 μm; the aluminum foil circuit 22 is an etched aluminum layer, and the average thickness of the aluminum foil circuit 22 is 15 μm.

[0059] The first insulating film 21 and the aluminum foil circuit 22, as well as the aluminum foil circuit 22 and the second insulating film 23 are bonded by epoxy thermosetting adhesive 7, with a curing temperature of 125°C and a curing time of 13 minutes.

[0060] The ratio of the area of ​​the first heat dissipation convex fin 5 to the gap area between two adjacent first heat dissipation convex fins 5 is 3:1.

[0061] The thickness of the heat dissipation adhesive 1 is 0.5 mm.

[0062] The heat dissipation adhesive backing is an acrylic heat dissipation double-sided adhesive.

[0063] The acrylic heat dissipation double-sided adhesive comprises the following raw materials in parts by weight:

[0064]

[0065] The acrylic acid ester monomer is a mixture of methyl methacrylate, butyl acrylate, isooctyl acrylate and hydroxyethyl acrylate in a weight ratio of 1.5:7.5:9:0.5.

[0066] The acrylic acid is methacrylic acid.

[0067] The preparation method of the graphite modification body comprises the following steps:

[0068] (R1), 40 parts of graphite powder, 1.5 parts of copper powder and 8 parts of silicon carbide powder were mixed uniformly by weight, and passed through a 100-mesh sieve to obtain a mixed powder;

[0069] (R2) Under argon protection, the mixed powder was first heated to 530°C and kept warm for 1.5 hours, then heated to 830°C and kept warm for 1.5 hours, and then heated to 1100°C and kept warm for 1.5 hours. After cooling to room temperature, it was ball-milled to a powder particle size of 50 μm to obtain a graphite modified body.

[0070] The diluent is ethyl acetate.

[0071] The initiator is benzoyl peroxide.

[0072] The isocyanate curing agent is an aliphatic isocyanate curing agent, the mass fraction of -NCO groups is 20%, and the mass fraction of non-volatile components is 90%.

[0073] The preparation method of the acrylic heat dissipation double-sided adhesive comprises the following steps:

[0074] (S1), taking acrylate monomer, acrylic acid, graphite modifier, diluent, initiator and isocyanate curing agent according to weight parts for later use;

[0075] (S2), taking a portion of the diluent, adding the initiator and mixing evenly to obtain a diluted initiator;

[0076] (S3), taking another portion of the diluent, adding the acrylate monomer and acrylic acid to the mixture, stirring and heating to 75° C. under nitrogen protection, adding a portion of the diluted initiator, heating to 92° C. and reacting for 17 minutes to obtain a prepolymer;

[0077] (S4), adding the graphite modifier to another part of the diluted initiator and mixing evenly, then adding it to the prepolymer and mixing evenly, heating it to 94° C. and keeping it for 2 hours, then cooling it to room temperature, removing the nitrogen protection, and then adding the isocyanate curing agent and mixing evenly to obtain an adhesive;

[0078] (S5), applying the adhesive to one side of the release film, curing it at 110° C. for 4 minutes, and then transferring it to another side of the release film to obtain an acrylic heat dissipation double-sided adhesive.

[0079] Example 2

[0080] The difference between this embodiment and embodiment 1 is that:

[0081] The average film thickness of the first insulating film and the average film thickness of the second insulating film are both 10 μm; the average thickness of the aluminum foil circuit is 10 μm.

[0082] The ratio of the area of ​​the first heat dissipation convex fin to the gap area between two adjacent first heat dissipation convex fins is 1:1.

[0083] The thickness of the heat dissipation adhesive is 0.2 mm.

[0084] The acrylic heat dissipation double-sided adhesive comprises the following raw materials in parts by weight:

[0085]

[0086] The acrylic acid ester monomer is a mixture of methyl methacrylate, butyl acrylate, isooctyl acrylate and hydroxyethyl acrylate in a weight ratio of 1:7:8:0.5.

[0087] The acrylic acid is methacrylic acid.

[0088] The preparation method of the graphite modification body comprises the following steps:

[0089] (R1), 30 parts by weight of graphite powder, 1 part of copper powder and 5 parts of silicon carbide powder were mixed evenly, and passed through an 80-mesh sieve to obtain a mixed powder;

[0090] (R2) Under argon protection, the mixed powder was first heated to 500°C and kept warm for 1 hour, then heated to 800°C and kept warm for 1 hour, and then heated to 1000°C and kept warm for 1 hour. After cooling to room temperature, it was ball-milled to a powder particle size of 30 μm to obtain a graphite modified body.

[0091] The diluent is ethyl acetate.

[0092] The initiator is benzoyl peroxide.

[0093] The isocyanate curing agent is an aliphatic isocyanate curing agent, the mass fraction of -NCO groups is 18%, and the mass fraction of non-volatile components is 85%.

[0094] The preparation method of the acrylic heat dissipation double-sided adhesive comprises the following steps:

[0095] (S1), taking acrylate monomer, acrylic acid, graphite modifier, diluent, initiator and isocyanate curing agent according to weight parts for later use;

[0096] (S2), taking a portion of the diluent, adding the initiator and mixing evenly to obtain a diluted initiator;

[0097] (S3), taking another portion of the diluent, adding the acrylate monomer and acrylic acid to the mixture, stirring and heating to 70° C. under nitrogen protection, adding a portion of the diluted initiator, heating to 90° C. and reacting for 15 minutes to obtain a prepolymer;

[0098] (S4), adding the graphite modifier to another part of the diluted initiator and mixing evenly, then adding it to the prepolymer and mixing evenly, heating it to 92° C. and keeping it for 2 hours, then cooling it to room temperature, removing the nitrogen protection, and then adding the isocyanate curing agent and mixing evenly to obtain an adhesive;

[0099] (S5), applying the adhesive to one side of the release film, curing it at 100° C. for 3 minutes, and then transferring it to another side of the release film to obtain an acrylic heat dissipation double-sided adhesive.

[0100] Example 3

[0101] The difference between this embodiment and embodiment 1 is that:

[0102] The average film thickness of the first insulating film and the average film thickness of the second insulating film are both 50 μm; the average thickness of the aluminum foil circuit is 20 μm.

[0103] The ratio of the area of ​​the first heat dissipation convex fin to the gap area between two adjacent first heat dissipation convex fins is 4:1.

[0104] The thickness of the heat dissipation adhesive is 0.8 mm.

[0105] The acrylic heat dissipation double-sided adhesive comprises the following raw materials in parts by weight:

[0106]

[0107] The acrylic acid ester monomer is a mixture of methyl methacrylate, butyl acrylate, isooctyl acrylate and hydroxyethyl acrylate in a weight ratio of 2:8:10:0.5.

[0108] The acrylic acid is methacrylic acid.

[0109] The preparation method of the graphite modification body comprises the following steps:

[0110] (R1), 50 parts by weight of graphite powder, 2 parts of copper powder and 10 parts of silicon carbide powder were mixed evenly, and passed through a 100-mesh sieve to obtain a mixed powder;

[0111] (R2) Under argon protection, the mixed powder was first heated to 550°C and kept warm for 2 hours, then heated to 850°C and kept warm for 2 hours, and then heated to 1200°C and kept warm for 2 hours. After cooling to room temperature, it was ball-milled to a powder particle size of 60 μm to obtain a graphite modified body.

[0112] The diluent is ethyl acetate.

[0113] The initiator is lauroyl peroxide.

[0114] The isocyanate curing agent is an aliphatic isocyanate curing agent, the mass fraction of -NCO groups is 21%, and the mass fraction of non-volatile components is 93%.

[0115] The preparation method of the acrylic heat dissipation double-sided adhesive comprises the following steps:

[0116] (S1), taking acrylate monomer, acrylic acid, graphite modifier, diluent, initiator and isocyanate curing agent according to weight parts for later use;

[0117] (S2), taking a portion of the diluent, adding the initiator and mixing evenly to obtain a diluted initiator;

[0118] (S3), taking another portion of the diluent, adding the acrylate monomer and acrylic acid to the mixture, stirring and heating to 80° C. under nitrogen protection, adding a portion of the diluted initiator, heating to 95° C. and reacting for 20 minutes to obtain a prepolymer;

[0119] (S4), adding the graphite modifier to another part of the diluted initiator and mixing evenly, then adding it to the prepolymer and mixing evenly, heating it to 95° C. and keeping it for 2 hours, then cooling it to room temperature, removing the nitrogen protection, and then adding the isocyanate curing agent and mixing evenly to obtain an adhesive;

[0120] (S5), applying the adhesive to one side of the release film, curing it at 120° C. for 5 minutes, and then transferring it to another side of the release film to obtain an acrylic heat dissipation double-sided adhesive.

[0121] Example 4

[0122] The difference between this embodiment and embodiment 1 is that:

[0123] The average film thickness of the first insulating film and the average film thickness of the second insulating film are both 20 μm; the average thickness of the aluminum foil circuit is 18 μm.

[0124] The ratio of the area of ​​the first heat dissipation convex fin to the gap area between two adjacent first heat dissipation convex fins is 3:1.

[0125] The thickness of the heat dissipation adhesive is 0.6 mm.

[0126] The acrylic heat dissipation double-sided adhesive comprises the following raw materials in parts by weight:

[0127]

[0128] The acrylic acid ester monomer is a mixture of methyl methacrylate, butyl acrylate, isooctyl acrylate and hydroxyethyl acrylate in a weight ratio of 1.6:7.3:8.5:0.5.

[0129] The acrylic acid is methacrylic acid.

[0130] The preparation method of the graphite modification body comprises the following steps:

[0131] (R1), 35 parts of graphite powder, 1.3 parts of copper powder and 6 parts of silicon carbide powder are mixed uniformly by weight, and passed through an 80-mesh sieve to obtain a mixed powder;

[0132] (R2) Under argon protection, the mixed powder was first heated to 520°C and kept warm for 1.8 hours, then heated to 820°C and kept warm for 1.2 hours, and then heated to 1050°C and kept warm for 1.2 hours. After cooling to room temperature, it was ball-milled to a powder particle size of 50 μm to obtain a graphite modified body.

[0133] The diluent is toluene.

[0134] The initiator is benzoyl peroxide.

[0135] The isocyanate curing agent is an aliphatic isocyanate curing agent, the mass fraction of -NCO groups is 20%, and the mass fraction of non-volatile components is 88%.

[0136] The preparation method of the acrylic heat dissipation double-sided adhesive comprises the following steps:

[0137] (S1), taking acrylate monomer, acrylic acid, graphite modifier, diluent, initiator and isocyanate curing agent according to weight parts for later use;

[0138] (S2), taking a portion of the diluent, adding the initiator and mixing evenly to obtain a diluted initiator;

[0139] (S3), taking another portion of the diluent, adding the acrylate monomer and acrylic acid to the mixture, stirring and heating to 76° C. under nitrogen protection, adding a portion of the diluted initiator, heating to 91° C. and reacting for 16 minutes to obtain a prepolymer;

[0140] (S4), adding the graphite modifier to another part of the diluted initiator and mixing evenly, then adding it to the prepolymer and mixing evenly, heating it to 94° C. and keeping it for 2 hours, then cooling it to room temperature, removing the nitrogen protection, and then adding the isocyanate curing agent and mixing evenly to obtain an adhesive;

[0141] (S5), applying the adhesive to one side of the release film, curing it at 110° C. for 5 minutes, and then transferring it to another side of the release film to obtain an acrylic heat dissipation double-sided adhesive.

[0142] Comparative Example 1

[0143] An LED light bar comprises a strip-shaped 1060 series aluminum substrate, a plurality of chip resistors arranged at intervals on a film-type light bar body, and a plurality of LED lamp beads arranged at intervals on the film-type light bar body.

[0144] Comparative Example 2

[0145] The difference between this comparative example and Example 1 is:

[0146] The graphite modification is replaced by graphite powder, and the powder particle size is 50 μm.

[0147] Comparative Example 3

[0148] The difference between this comparative example and Example 1 is:

[0149] The graphite modification is replaced by copper powder, and the powder particle size is 50 μm.

[0150] Performance Testing:

[0151] Take the film-type light bar body and the heat dissipation adhesive bonded light bar of Examples 1-4 and Comparative Examples 2-3, and the strip-shaped 1060 aluminum substrate of Comparative Example 1, and test their thermal conductivity according to ASTM D5470, the unit is W / m·k;

[0152] Take the heat dissipation adhesives of Examples 1-4 and Comparative Examples 2-3, and test their bonding strength according to ASTM D1002, with the unit of N / cm;

[0153] The test results are shown in the following table:

[0154] Thermal conductivity W / m·k Adhesion strength N / cm Example 1 6.3 11.5 Example 2 6 10.8 Example 3 6.6 12.1 Example 4 6.2 11.2 Comparative Example 1 1.1 / Comparative Example 2 1.8 11 Comparative Example 3 2.4 7.3

[0155] It can be seen from the above table that the heat dissipation effect of the light bar with a film-type light bar body and a heat dissipation adhesive bonded together in the present invention is better than the heat dissipation effect of the traditional 1060 series aluminum substrate, and the acrylic heat dissipation double-sided adhesive uses a graphite modifier to greatly promote the heat dissipation effect of the light bar.

[0156] The above embodiments are preferred implementation schemes of the present invention. In addition, the present invention may also be implemented in other ways. Any obvious replacement without departing from the concept of the present invention is within the protection scope of the present invention.

Claims

1. A high-power and efficient heat dissipation LED light bar, Features: The invention comprises a film-type light bar body, a heat dissipation adhesive bonded to the back of the film-type light bar body, a plurality of chip resistors spaced apart on the film-type light bar body, and a plurality of LED lamp beads spaced apart on the film-type light bar body, the side wall of the film-type light bar body protrudes with first heat dissipation convex fins spaced apart and arranged evenly, the side wall of the heat dissipation adhesive bonded with second heat dissipation convex fins spaced apart and spaced apart and corresponding to the first heat dissipation convex fins one by one; the heat dissipation adhesive bonded with the acrylic heat dissipation double-sided adhesive; the acrylic heat dissipation double-sided adhesive bonded with the following raw materials in parts by weight: 200 parts of acrylic acid monomer Acrylic acid 8-12 parts 10-20 parts of graphite modification Diluent 150-180 parts Initiator 0.05-0.1 parts 1-2 parts of isocyanate curing agent; The acrylic acid ester monomer is a mixture of methyl methacrylate, butyl acrylate, isooctyl acrylate and hydroxyethyl acrylate in a weight ratio of 1-2:7-8:8-10:0.5; the acrylic acid is methacrylic acid; The preparation method of the graphite modification body comprises the following steps: (R1), 30-50 parts by weight of graphite powder, 1-2 parts of copper powder and 5-10 parts of silicon carbide powder are mixed evenly, and passed through an 80-100 mesh sieve to obtain a mixed powder; (R2), under argon protection, the mixed powder is first heated to 500-550°C and kept warm for 1-2 hours, then heated to 800-850°C and kept warm for 1-2 hours, and then heated to 1000-1200°C and kept warm for 1-2 hours. After cooling to room temperature, the mixed powder is ball-milled to a powder particle size of 30-60 μm to obtain a graphite modified body; The diluent is acetone, ethyl acetate or toluene; the initiator is benzoyl peroxide or lauroyl peroxide; the isocyanate curing agent is an aliphatic isocyanate curing agent, the mass fraction of -NCO groups is 18-21%, and the mass fraction of non-volatile components is 85-93%.

2. A high-power and high-efficiency heat dissipation LED light strip according to claim 1, Features: The film-type light bar body comprises a first insulating film, an aluminum foil circuit and a second insulating film which are sequentially bonded, and the LED lamp beads and the chip resistors both penetrate the first insulating film and are electrically connected to the aluminum foil circuit.

3. A high-power and high-efficiency heat dissipation LED light strip according to claim 2, Features: Both ends of the aluminum foil circuit are provided with first solder pads, and the first solder pads are attached with a first solderable coating that penetrates the first insulating film, and the first solderable coating is used for electrically connecting with an adjacent LED light bar or power line.

4. A high-power and high-efficiency heat dissipation LED light strip according to claim 2, Features: The aluminum foil circuit is also provided with a plurality of second solder pads arranged at intervals, the second solder pads are attached with a second solderable coating, and the LED lamp beads are electrically connected to the second solderable coating.

5. A high-power and high-efficiency heat dissipation LED light strip according to claim 2, Features: The aluminum foil circuit is also provided with a plurality of third solder pads arranged at intervals, the third solder pads are attached with a third solderable coating, and the chip resistor is electrically connected to the third solderable coating.

6. A high-power and high-efficiency heat dissipation LED light strip according to claim 2, Features: The first insulating film and the second insulating film are both polyimide films, and the average film thickness of the first insulating film and the average film thickness of the second insulating film are both 10-50 μm; the aluminum foil circuit is an etched aluminum layer, and the average thickness of the aluminum foil circuit is 10-20 μm.

7. A high-power and high-efficiency heat dissipation LED light strip according to claim 2, Features: The first insulating film and the aluminum foil circuit, as well as the aluminum foil circuit and the second insulating film are bonded together by thermosetting adhesive.

8. The high-power and high-efficiency heat dissipation LED light strip according to claim 1, Features: The ratio of the area of ​​the first heat dissipation convex fin to the gap area between two adjacent first heat dissipation convex fins is 1-4:

1.

9. The high-power and high-efficiency heat dissipation LED light strip according to claim 1, Features: The thickness of the heat dissipation adhesive is 0.2-0.8 mm.

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