Backlight module and display device

Abstract

The application provides a backlight module and a display device. The backlight module comprises a back plate, a lamp plate, a heat dissipation assembly, a first heat conduction connecting layer and a second heat conduction connecting layer. The back plate has a plurality of heat dissipation channels. The lamp plate is arranged on one side of the back plate. The heat dissipation assembly comprises a heat absorption layer and a heat dissipation layer. The heat absorption layer is arranged between the back plate and the lamp plate and is used for absorbing heat generated by the lamp plate. The heat dissipation layer is arranged on the side of the back plate away from the lamp plate. The first heat conduction connecting layer connects the lamp plate and the heat absorption layer and covers the surface of the heat absorption layer close to the lamp plate, so as to conduct the heat generated by the lamp plate to the heat absorption layer. The second heat conduction connecting layer passes through the plurality of heat dissipation channels and covers the surface of the heat absorption layer close to the back plate, connects the heat absorption layer and the heat dissipation layer, and conducts the heat absorbed by the heat absorption layer to the heat dissipation layer. The backlight module can effectively improve the heat dissipation efficiency.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of display, in particular to a backlight module and a display device. BACKGROUND

[0002] In recent years, with the emergence and development of light-emitting diode (LED) display technology, it has brought revolutionary leap to the entire display industry. Especially the emergence of sub-millimeter light-emitting diode (Mini LED) and micrometer light-emitting diode (Micro LED) technology, which is superior in display quality, such as high brightness, high color gamut, high contrast ratio and other advantages, brings users a high-quality visual experience.

[0003] At present, the high dynamic range image (High-Dynamic Range) specification of the conventional Mini LED display device is basically within HDR1000, and to break through HDR1000 and above, one of the key technical points that must be broken through is the heat dissipation problem of the Mini LED lamp panel. If the Mini LED display device wants to achieve HDR1000 and above, the number of light-emitting elements of Mini LED increases dramatically, and the brightness of a single light-emitting element increases, so the heat generated by the lamp panel is also more, which brings great challenges to the heat dissipation design of the backlight module. The heat dissipation design of the lamp panel of the existing Mini LED backlight module is mostly pasted on the metal back plate using high-temperature adhesive tape, but this way has poor heat dissipation efficiency, which is easy to cause the service life of the light-emitting element to be shortened or burned out. SUMMARY

[0004] The backlight module and the display device provided by the present application aim to solve the problem that the heat dissipation efficiency of the lamp panel in the existing backlight module is poor, which is easy to cause the service life of the light-emitting element to be shortened or burned out.

[0005] To solve the above technical problems, one technical solution adopted by the present application is to provide a backlight module; the backlight module comprises:

[0006] a back plate having a plurality of heat dissipation channels;

[0007] a lamp panel arranged on one side of the lamp panel;

[0008] a heat dissipation assembly comprising a heat absorption layer and a heat dissipation layer; the heat absorption layer is arranged between the back plate and the lamp panel and is used to absorb the heat generated by the lamp panel; the heat dissipation layer is arranged on the side of the back plate away from the lamp panel;

[0009] a first heat-conducting connecting layer connecting the lamp panel and the heat absorption layer and covering the surface of the heat absorption layer close to the lamp panel, so as to conduct the heat generated by the lamp panel to the heat absorption layer;

[0010] a second thermally conductive connecting layer, which passes through the plurality of heat dissipation channels and covers the surface of the heat absorption layer close to the back plate, connecting the heat absorption layer and the heat dissipation layer to conduct the heat absorbed by the heat absorption layer to the heat dissipation layer.

[0011] The first thermally conductive connecting layer and the second thermally conductive connecting layer are connected, and the heat absorption layer is wrapped between the first thermally conductive connecting layer and the second thermally conductive connecting layer.

[0012] The heat absorption layer includes a plurality of heat absorption sheets and a plurality of first connecting parts, and adjacent heat absorption sheets are connected by the first connecting parts, which are in strip shape; the heat dissipation layer includes a plurality of heat dissipation sheets connected to each other and a second connecting part for connecting the heat dissipation sheets, and the side of the heat dissipation layer away from the back plate is exposed to air, and the surface area of the heat dissipation layer exposed to air is greater than the area of the heat absorption layer.

[0013] The plurality of heat absorption sheets are arranged in an array, and the plurality of heat dissipation sheets are also arranged in an array, and the orthographic projection of the heat absorption sheets on the back plate is arranged in a staggered manner with the orthographic projection of the heat dissipation sheets on the back plate.

[0014] The side of the back plate close to the heat absorption layer is provided with an inner groove, and the shape of the inner groove matches the shape of the heat absorption layer, so that the heat absorption layer is embedded in the inner groove.

[0015] The side of the back plate away from the lamp plate is provided with an outer groove, and the shape of the outer groove matches the shape of the heat dissipation sheet, so that the heat dissipation sheet is embedded in the outer groove, and the outer groove and the inner groove are arranged in a staggered manner, so that the orthographic projection of the heat absorption sheet on the back plate is arranged in a staggered manner with the orthographic projection of the heat dissipation sheet on the back plate.

[0016] The depth of the groove is greater than the thickness of the heat absorption layer, and the first thermally conductive connecting layer and the second thermally conductive connecting layer are arranged in the groove, so that the heat absorption layer is wrapped between the first thermally conductive connecting layer and the second thermally conductive connecting layer.

[0017] The heat dissipation channel is a through hole arranged on the back plate, and the heat dissipation layer covers at least part of the through hole.

[0018] The backlight module further includes a metal heat conduction member, which passes through the heat dissipation channel to connect the heat absorption layer and the heat dissipation layer, and is connected with the second thermally conductive connecting layer.

[0019] The heat absorption layer and the heat dissipation layer are fixed to the back plate by fasteners.

[0020] The heat-absorbing layer and the heat-dissipating layer are both copper sheets; the first heat-conducting connecting layer and the second heat-conducting connecting layer are heat-conducting silica gel layers; and the back plate is a metal back plate.

[0021] To solve the above technical problems, another technical solution adopted by the present application is to provide a display device, which comprises:

[0022] a display screen body for displaying images;

[0023] a backlight module arranged on one side of the display screen body and used for providing a backlight source for the display screen body, wherein the backlight module is the backlight module as described in the above technical solution.

[0024] The present application has the following beneficial effects: Different from the prior art, the present application provides a backlight module and a display device. The backlight module comprises a back plate, a lamp plate, a heat-dissipating assembly, a first heat-conducting connecting layer and a second heat-conducting connecting layer. In the present application, the heat-dissipating assembly comprises a heat-absorbing layer and a heat-dissipating layer, the heat-absorbing layer is arranged between the lamp plate and the back plate, and the heat-dissipating layer is arranged on the side of the back plate away from the lamp plate. In this way, the heat generated by the lamp plate can be conducted to the heat-dissipating layer outside the back plate through the heat-absorbing layer, and radiated outward through the heat-dissipating layer, so that the heat generated by the lamp plate is transferred to the outside and dissipated to the air, thereby avoiding the problem that the light-emitting elements on the lamp plate are burned out due to the excessively high heat of the lamp plate. Meanwhile, the first heat-conducting connecting layer is connected to the lamp plate and the heat-absorbing layer, so as to conduct the heat generated by the lamp plate to the heat-absorbing layer. Furthermore, the first heat-conducting connecting layer covers the surface of the heat-absorbing layer close to the lamp plate, so as to increase the contact area between the heat-absorbing layer and the first heat-conducting connecting layer and the contact area between the first heat-conducting connecting layer and the lamp plate, thereby enabling the heat-conducting connecting layer to quickly conduct the heat generated by the lamp plate to the heat-absorbing layer. Meanwhile, the second heat-conducting connecting layer is connected to the heat-absorbing layer and the back plate, and passes through the heat-dissipating channels in the back plate to connect the heat-absorbing layer and the heat-dissipating layer. In this way, not only can the heat absorbed by the heat-absorbing layer be conducted to the back plate through the second heat-conducting connecting layer, but also the second heat-conducting connecting layer can conduct the heat absorbed by the heat-absorbing layer to the heat-dissipating layer through the heat-dissipating channels, so that the heat generated by the lamp plate is radiated outward through the back plate and the heat-dissipating layer, thereby effectively improving the heat dissipation efficiency and effectively reducing the risk of problems such as the shortening of the service life of the light-emitting elements, the burning out of the light-emitting elements, the damage of the lamp plate circuit caused by the expansion and deformation of the lamp plate and the like due to the slow heat dissipation of the lamp plate and the temperature rise. BRIEF DESCRIPTION OF DRAWINGS

[0025] Figure 1 is a longitudinal sectional structure schematic diagram of the backlight module provided by an embodiment of the present application;

[0026] Figure 2 is a disassembled structure schematic diagram of the back plate and the heat-dissipating assembly provided by an embodiment of the present application;

[0027] Figure 3is a structural schematic diagram of the heat-absorbing layer provided by an embodiment of the present application;

[0028] Figure 4 is a top view structural schematic diagram of the heat-conducting connecting layer provided by an embodiment of the present application;

[0029] Figure 5 is a longitudinal sectional structural schematic diagram of the backlight module provided by another embodiment of the present application;

[0030] Figure 6 is a structural schematic diagram of the backboard provided by an embodiment of the present application;

[0031] Figure 7 is a structural schematic diagram of the backboard provided by another embodiment of the present application;

[0032] Figure 8 is a structural schematic diagram of the backboard and the heat-absorbing layer provided by an embodiment of the present application;

[0033] Figure 9 is a structural schematic diagram of the heat-dissipating layer provided by an embodiment of the present application;

[0034] Figure 10 is a structural schematic diagram of the backboard and the heat-dissipating layer provided by an embodiment of the present application;

[0035] Figure 11 is a longitudinal sectional structural schematic diagram of the backlight module provided by yet another embodiment of the present application;

[0036] Figure 12 is a structural schematic diagram of the display device provided by an embodiment of the present application.

[0037] Reference signs:

[0038] 1-backlight module; 11-lamp plate; 111-light emitting element; 12-backboard; 121-inner side groove; 122-heat-dissipating channel; 123-outer side groove; 13-heat-dissipating assembly; 14-heat-absorbing layer; 141-grid; 142-screw hole; 143-heat-absorbing sheet; 144-first connecting part; 15-heat-dissipating layer; 151-heat-dissipating sheet; 152-second connecting part; 16-heat-conducting connecting layer; 161-first heat-conducting connecting layer; 162-second heat-conducting connecting layer; 163-metal heat-conducting part; 17-optical film; 18-optical glue layer; 2-display screen body; 3-frame glue. DETAILED DESCRIPTION

[0039] With reference to the drawings and embodiments, the technical solutions in the embodiments of the present application will be described clearly and completely. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work fall within the scope of the present application.

[0040] The terms "first", "second", "third" in the present application are only for descriptive purpose, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined with "first", "second", "third" can explicitly or implicitly include at least one of the features. In the description of the present application, the meaning of "a plurality of" is at least two, such as two, three, etc., unless otherwise explicitly and specifically limited. All directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of the present application are only used to explain the relative position relationship, movement condition, etc. between the components in a certain posture (as shown in the drawings), and if the certain posture changes, the directional indications also change accordingly. In addition, the terms "include" and "have" and any variations thereof are intended to cover non-exclusive inclusion. For example, a process, method, system, product or device including a series of steps or units is not limited to the listed steps or units, but can optionally include steps or units not listed, or can optionally include other steps or units inherent to the process, method, product or device.

[0041] In this document, reference to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the application. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are they necessarily mutually exclusive of one another. Those skilled in the art will appreciate that embodiments described herein can be combined with other embodiments.

[0042] The present application will be described in detail below with reference to the drawings and embodiments.

[0043] Please refer to Figures 1-2 , Figure 1 is a longitudinal sectional structure schematic diagram of a backlight module provided by an embodiment of the present application, Figure 2 is a disassembled structure schematic diagram of a back plate and a heat dissipation assembly. In the embodiment, a backlight module 1 is provided, which is used to provide a backlight source for a display panel. The display panel can be a liquid crystal display panel or an electrophoretic display panel, etc. which needs a backlight source.

[0044] In this embodiment, the backlight module 1 includes a backplate 12, a lamp panel 11, a heat dissipation assembly 13, and a thermally conductive connection layer 16. The backplate 12 supports the lamp panel 11, the heat dissipation assembly 13, the first thermally conductive connection layer 161, and the second thermally conductive connection layer 162. The lamp panel 11 is disposed on one side of the backplate 12 and emits light to provide a light source. The heat dissipation assembly 13 includes a heat-absorbing layer 14 and a heat-dissipating layer 15. The heat-absorbing layer 14 is disposed between the backplate 12 and the lamp panel 11 to absorb the heat generated by the lamp panel 11. The heat-dissipating layer 15 is disposed on the side of the backplate 12 away from the lamp panel 11, and this side is exposed to the air to dissipate the heat conducted to the heat dissipation layer 15 into the air, thereby reducing the temperature of the lamp panel 11 and minimizing the risk of deformation of the lamp panel 11 due to excessive heat, as well as shortened lifespan or burnout of the light-emitting elements 111 on the lamp panel 11.

[0045] like Figure 1 As shown, a thermally conductive connection layer 16 is disposed between the lamp panel 11 and the back plate 12. Specifically, the thermally conductive connection layer 16 includes a first thermally conductive connection layer 161 and a second thermally conductive connection layer 162. The first thermally conductive connection layer 161 connects the lamp panel 11 and the heat-absorbing layer 14, and covers the surface of the heat-absorbing layer 14 near the lamp panel 11, thereby increasing the contact area between the first thermally conductive connection layer 161 and the lamp panel 11 and the heat-absorbing layer 14, allowing the heat generated by the lamp panel 11 to be quickly conducted to the heat-absorbing layer 14. Meanwhile, the back plate 12 has multiple heat dissipation channels 122. The second thermally conductive connection layer 162 is disposed between the heat-absorbing layer 14 and the back plate 12, and connects the heat-absorbing layer 14 and the heat dissipation layer 15 through the multiple heat dissipation channels 122, so as to conduct the heat absorbed by the heat-absorbing layer 14 to the heat dissipation layer 15, thereby allowing the heat generated by the lamp panel 11 to radiate and dissipate heat into the air through the heat dissipation layer 15. Furthermore, the second thermally conductive connection layer 162 covers the surface of the heat-absorbing layer 14 near the back plate 12 to increase the contact area between the heat-absorbing layer 14 and the second thermally conductive connection layer 162. Further, the second thermally conductive connection layer 162 is connected to the heat dissipation layer 15 through multiple heat dissipation channels 122, increasing the contact area between the two layers. This allows the heat absorbed by the heat-absorbing layer 14 to be rapidly conducted to the heat dissipation layer 15 through the second thermally conductive connection layer 162, enabling the heat generated by the lamp board 11 to be dissipated into the outside air in a timely and rapid manner. This effectively improves heat dissipation efficiency and reduces the risk of problems such as shortened lifespan of the light-emitting element 111, burnt-out of the light-emitting element 111, and damage to the lamp board 11 circuitry due to expansion and deformation caused by slow heat dissipation of the lamp board 11.

[0046] In the embodiment, the lamp panel 11 can be a Mini LED lamp panel 11 or a Micro LED lamp panel 11, that is, the light emitting elements 111 on the lamp panel 11 can be Mini LEDs or Micro LEDs. In specific embodiments, to realize a large-size display panel, the lamp panel 11 in the backlight module 1 can be formed by splicing a plurality of sub-lamp panels 11, which can be specifically set according to actual needs, and no specific limitation is made thereto.

[0047] Please refer to Figure 3 , Figure 3 is a structural schematic diagram of the heat absorption layer provided in an embodiment of the present application. In the embodiment, the heat absorption layer 14 is in the form of a grid 141 sheet, which not only can increase the heat absorption area to rapidly absorb the heat generated by the lamp panel 11, but also can reduce the thickness of the heat absorption layer 14, which is conducive to the lightweight design of the backlight module 1. The size and shape of the grid 141 of the heat absorption layer 14 and the width between adjacent grids 141 of the heat absorption layer 14 can be set according to actual needs, and no specific limitation is made thereto. Specifically, the heat absorption layer 14 includes a plurality of heat absorption sheets 143 and a plurality of first connecting portions 144, and the plurality of heat absorption sheets 143 are connected through the first connecting portions 144; the heat absorption sheet 143 can be rectangular, circular, polygonal, elliptical or irregular, and the first connecting portion 144 is in the form of a long strip. In the embodiment, the heat absorption sheet 143 is rectangular, the rectangular heat absorption sheets 143 are arranged in an array, and the long sides of the opposite sides of any one rectangular heat absorption sheet 143 are parallel to the long sides of the opposite sides of other rectangular heat absorption sheets 143, that is, the length direction of each rectangular heat absorption sheet 143 is consistent with the length direction of other rectangular heat absorption sheets 143, and the space surrounded by the adjacent rectangular heat absorption sheets 143 and the adjacent first connecting portions 144 forms the above-mentioned grid 141 to provide a design space for the heat dissipation layer 15, so that the projection of the heat dissipation layer 15 on the back plate 12 is dislocated from the projection of the heat absorption layer 14 on the back plate 12, thereby making the backlight module 1 more lightweight, the heat dissipation path of the lamp panel 11 shorter, and the heat dissipation efficiency higher, and the heat dissipation layer 15 and the heat absorption layer 14 are dislocated from each other and do not block each other, thereby accelerating the heat dissipation rate and further improving the heat dissipation efficiency of the backlight module.

[0048] Specifically, the heat absorption layer 14 is fixed to the back plate 12 near the lamp plate 11 by fasteners, which can be screws, buckles, magnetic elements, etc. For example, the heat absorption layer 14 and the back plate 12 are provided with a plurality of screw holes 142, and then the screws are sequentially inserted through the screw holes 142 on the heat absorption layer 14 and the screw holes 142 on the back plate 12 to fix the heat absorption layer 14 to the back plate 12. Specifically, the heat absorption layer 14 is a copper sheet in a grid 141 shape, so as to quickly absorb the heat generated by the lamp plate 11 and conduct the absorbed heat to the heat dissipation layer 15 by the good heat conduction property of the copper sheet. Moreover, the heat absorption layer 14 is an integral structure, so as to facilitate the production and assembly of the heat absorption layer 14, and compared with a split structure, a smaller number of fasteners can be used to fix the heat absorption layer 14 to the back plate 12, so as to save costs.

[0049] Specifically, please refer to Figure 4 , Figure 4 is a top view structural schematic diagram of a heat conduction connection layer provided in an embodiment of the present application. In the embodiment, the heat conduction connection layer 16 covers the heat absorption layer 14 in the orthographic projection on the heat absorption layer 14, so that the heat conduction connection layer 16 can cover and wrap the heat absorption layer 14. Specifically, the heat conduction connection layer 16 is also in a grid shape, which can save materials while covering the heat absorption layer 14, so as to save production costs. It should be noted that the second heat conduction connection layer 162 has the same shape as the first heat conduction connection layer 161, and covers the surface of the heat absorption layer 14 near the back plate 12. In combination with Figure 1 In the embodiment, the first heat conduction connection layer 161 is connected with the second heat conduction connection layer 162, so that the heat absorption layer 14 is wrapped between the first heat conduction connection layer 161 and the second heat conduction connection layer 162. It can be understood that the first heat conduction connection layer 161 and the second heat conduction connection layer 162 are integrated, and the integrated first heat conduction connection layer 161 and the second heat conduction connection layer 162 are defined as the heat conduction connection layer below. The heat absorption layer 14 is wrapped in the heat conduction connection layer, so as to maximize the contact area between the heat conduction connection layer and the heat absorption layer 14, so that the heat generated by the lamp plate 11 can be quickly conducted to the heat absorption layer 14 through the heat conduction connection layer. It should be noted that the heat absorption layer 14 is in full contact with the first heat conduction connection layer 161, and the surface of the first heat conduction connection layer 161 near the lamp plate 11 is also in full contact with the lamp plate 11, so as to increase the contact area between the lamp plate 11 and the first heat conduction connection layer, so that the heat generated by the lamp plate 11 can be quickly conducted to the heat conduction connection layer 16, avoiding the problems of shortening the service life of the light emitting element 111, burning the light emitting element 111, damaging the circuit of the lamp plate 11 due to the expansion and deformation of the lamp plate 11, etc. caused by the accumulation of heat generated by the lamp plate 11 due to the untimely heat conduction.

[0050] In the embodiment, the first and second heat-conductive connecting layers 161 and 162 are heat-conductive silicone layers, which have high adhesive property and excellent heat conductivity, so that the first heat-conductive connecting layer 161 can be in close contact with the lamp panel 11 and the heat-absorbing layer 14 and is not easy to separate, thereby effectively improving the stability of the connection and enabling the heat generated by the lamp panel 11 to be quickly and effectively conducted to the heat-absorbing layer 14. Similarly, the second heat-conductive connecting layer 162 can be in close contact with the heat-absorbing layer 14, the back plate 12 and the heat-dissipating layer 15 and is not easy to separate, thereby improving the stability of the connection and enabling the heat absorbed by the heat-absorbing layer 14 to be quickly and effectively conducted to the heat-dissipating layer 15 and the back plate 12, further improving the heat dissipation efficiency of the lamp panel 11. Meanwhile, the heat-conductive silicone layer also has good elasticity and sealing property, which can improve the assembly stability of the backlight module 1.

[0051] In other embodiments, the first and second heat-conductive connecting layers 161 and 162 can also have other shapes, such as rectangular, rounded rectangular, circular, elliptical or other irregular shapes, without specific limitation as long as the above conditions are met.

[0052] Please refer to Figure 5 , Figure 5 is a longitudinal sectional structure schematic diagram of a backlight module provided by another embodiment of the present application. Different from the above embodiments, in the embodiment, the first and second heat-conductive connecting layers 161 and 162 are not connected, the first heat-conductive connecting layer 161 is arranged between the lamp panel 11 and the heat-absorbing layer 14 and connects the lamp panel 11 and the heat-absorbing layer 14, and the first heat-conductive connecting layer 161 covers the surface of the heat-absorbing layer 14 close to the lamp panel, so that the heat generated by the lamp panel 11 is quickly conducted to the heat-absorbing layer 14 through the first heat-conductive connecting layer 161; the second heat-conductive connecting layer 162 is arranged between the heat-absorbing layer 14 and the back plate 12 and connects the heat-absorbing layer 14 and the back plate 12, so that the heat absorbed by the heat-absorbing layer 14 is conducted to the back plate 12 through the second heat-conductive connecting layer 162, and is dissipated to the air through the back plate 12, and the heat can also be conducted to the heat-dissipating layer 15 through the back plate 12 and then radiated to the air through the heat-dissipating layer 15; further, the second heat-conductive connecting layer 162 passes through the plurality of heat-dissipating channels 122 on the back plate 12 and connects the heat-dissipating layer 15, so that the heat absorbed by the heat-absorbing layer 14 is quickly conducted to the heat-dissipating layer 15 through the second heat-conductive connecting layer 162 and then radiates the heat to the air through the heat-dissipating layer 15, thereby effectively improving the heat dissipation efficiency of the backlight module 1 and effectively reducing the risk of problems such as shortened service life of the light emitting element 111, burning of the light emitting element 111, damage of the circuit of the lamp panel 11 due to swelling and deformation of the lamp panel 11 and the like caused by the slow heat dissipation of the lamp panel 11 and the temperature rise.

[0053] Please refer to Figures 6-8 , Figure 6is a structural schematic diagram of a back plate provided by an embodiment of the present application, Figure 7 is a structural schematic diagram of a back plate provided by another embodiment of the present application, Figure 8 is a structural schematic diagram of a back plate and a heat absorption layer provided by an embodiment of the present application. In the embodiment, the back plate 12 is a metal back plate to improve the heat conduction performance of the back plate 12. The side of the back plate 12 close to the lamp plate 11 has an inner side groove 121, and the shape of the inner side groove 121 matches the shape of the heat absorption layer 14, so that the heat absorption layer 14 is embedded in the inner side groove 121 of the back plate 12, thereby saving space and reducing the overall thickness of the backlight module 1. Specifically, as shown in Figure 8 , the back plate 12 has a plurality of inner side grooves 121 that are staggered and interconnected, so as to form a shape matching the shape of the heat absorption layer 14, so that the heat absorption layer 14 can be completely embedded in the inner side groove 121. The depth of the inner side groove 121 is greater than the thickness of the heat absorption layer 14, so that the first heat conduction connecting layer 161 and the second heat conduction connecting layer 162 can also be arranged in the inner side groove 121, and the heat absorption layer 14 is covered between the first heat conduction connecting layer 161 and the second heat conduction connecting layer 162, further saving the space of the heat conduction connecting layer, reducing the thickness of the backlight module 1, and facilitating the arrangement of the heat conduction connecting layer, avoiding the overflow of the heat conduction silicone due to its flowability when the heat conduction connecting layer is applied. The depth of the inner side groove 121 can be set according to actual needs, which is not limited here.

[0054] Further, the back plate 12 has a plurality of heat dissipation channels 122, which are specifically through holes arranged on the back plate 12. The through holes are specifically arranged on the bottom wall of the inner side groove 121 of the back plate 12, so that the second heat conduction connecting layer 162 can extend to the through holes and be connected with the heat dissipation layer 15 through the through holes, so that the heat absorbed by the heat absorption layer 14 is conducted to the heat dissipation layer 15 on the other side of the back plate 12 through the second heat conduction connecting layer 162. Further, the heat dissipation layer 15 covers at least part of the through holes to increase the contact area of the second heat conduction connecting layer 162 with the heat dissipation layer 15, thereby improving the heat conduction rate and enhancing the heat dissipation efficiency of the backlight module 1. Specifically, the number, aperture size and shape of the through holes can be set according to actual needs, so that the heat absorbed by the heat absorption layer 14 can be rapidly conducted to the back plate 12 and the heat dissipation layer 15 on the other side of the back plate 12 through the second heat conduction connecting layer 162, so that the heat generated by the lamp plate 11 can be rapidly conducted to the back plate 12 and the heat dissipation layer 15 on the other side of the back plate 12, so as to dissipate the heat to the external air in time, avoiding the accumulation of heat generated inside the backlight module 1 and the resulting high internal temperature, which can easily cause the service life of the heating element of the lamp plate 11 to be shortened, the light emitting element 111 to be burned out, the lamp plate 11 to be expanded and deformed, and the circuit of the lamp plate 11 to be damaged.

[0055] As shown in Figure 6As shown, the heat dissipation channels 122 are circular through holes, and the diameter and number of the through holes can be set according to actual requirements. In this embodiment, the heat dissipation layer 15 covers the through holes to increase the contact area of the second heat-conductive connecting layer 162 with the heat dissipation layer 15, thereby improving the heat conduction rate and the heat dissipation efficiency of the backlight module 1. As shown, Figure 7 As shown, in this embodiment, the heat dissipation channels 122 are strip-shaped through holes extending along the inner grooves 121, and the length and width of the strip-shaped through holes can be set according to actual requirements; the heat dissipation layer 15 covers part of the through holes, and the strip-shaped through holes can further increase the contact area of the second heat-conductive connecting layer 162 with the heat dissipation layer 15, thereby further improving the heat conduction rate of the second heat-conductive connecting layer 162 to the heat dissipation layer 15 through the strip-shaped through holes and further improving the heat dissipation efficiency of the backlight module 1.

[0056] Please refer to Figures 9-10 , Figure 9 is a structural schematic diagram of a heat dissipation layer provided by an embodiment of the present application, Figure 10 is a structural schematic diagram of a back plate and a heat dissipation layer provided by an embodiment of the present application. In this embodiment, the heat dissipation layer 15 is fixed to the side of the back plate 12 away from the lamp plate 11, and is similar to the heat-absorbing layer 14. The heat dissipation layer 15 is fixed to the back plate 12 by fasteners, which can be screws, buckles, magnetic elements, etc. For example, a plurality of screw holes 142 are provided on the heat dissipation layer 15 and the back plate 12, and then screws are sequentially inserted through the screw holes 142 on the heat-absorbing layer 14 and the screw holes 142 on the back plate 12 to fix the heat-absorbing layer 14 to the back plate 12. The heat dissipation layer 15 at least partially covers the heat dissipation channels 122 on the back plate 12 to be connected with the second heat-conductive connecting layer 162, thereby absorbing the heat conducted by the second heat-conductive connecting layer 162 and radiating the heat to the air in time to avoid the accumulation of heat and cause the temperature of the lamp plate 11 to be too high. As shown, Figure 6 As shown, the heat dissipation channels 122 on the back plate 12 are a plurality of circular through holes, so that the heat dissipation layer 15 can cover all the through holes to maximize the contact area of the heat dissipation layer 15 with the heat-conductive connecting layer 16, thereby improving the heat conduction rate and further improving the heat dissipation efficiency of the backlight module 1. As shown, Figure 7 As shown, in this embodiment, the heat dissipation channels 122 on the back plate 12 are strip-shaped through holes extending along the inner grooves 121. Since the opening area of the through holes is large, the heat dissipation layer 15 can partially cover the strip-shaped through holes to save design space.

[0057] In the embodiment, the heat dissipation layer 15 comprises a plurality of heat dissipation fins 151 and a plurality of second connecting portions 152, the second connecting portions 152 are used for connecting adjacent heat dissipation fins 151 and cover the heat dissipation channels 122 on the back plate 12 and are connected with the second heat conduction connecting layer 162. The connecting portions 152 can be in a strip shape and extend along the shape of the side of the back plate 12 away from the lamp plate 11 to fit the back plate 12, which is conducive to the light and thin design of the backlight module 1, so that the backlight module 1 is more light and thin. The heat dissipation fins 151 extend along the extension direction of the back plate 12. The heat dissipation fins 151 can have the same shape as the grid 141 of the heat absorption layer 14, so that the heat dissipation fins 151 and the heat absorption fins 143 are staggered, so that the heat absorption fins 143 and the heat dissipation fins 151 do not block each other in the direction perpendicular to the back plate, thereby further improving the heat dissipation efficiency. Specifically, the shape of the heat dissipation fins 151 is consistent with the shape of the grid 141 of the heat absorption layer 14, which can be rectangular, polygonal or irregular, and a plurality of heat dissipation fins 151 are arranged in an array. Corresponding to the arrangement mode of the heat absorption layer 14, in the embodiment, the heat dissipation fins 151 are rectangular, the rectangular heat dissipation fins 151 are arranged in an array, and are arranged in the area projected on the back plate by the grid 141 of the heat absorption layer 14, so that the orthographic projection of the heat absorption fins 143 on the back plate 12 and the orthographic projection of the heat dissipation fins 151 on the back plate 12 are arranged in a staggered manner, that is, the heat absorption fins 143 and the heat dissipation fins 151 do not block each other in the direction perpendicular to the back plate 12, thereby improving the heat dissipation efficiency of the lamp plate 11.

[0058] In the embodiment, the heat dissipation fins 151 and the connecting portions 152 are in an integrated structure, or the heat dissipation layer 15 is in an integrated molding structure, or the heat dissipation layer 15 is in an integrated structure in which a plurality of heat dissipation fins 151 are connected to each other, so as to facilitate the production and assembly of the heat dissipation layer 15, and compared with a split structure, a smaller number of fasteners can be used to fix the heat dissipation layer 15 to the back plate 12, so as to save cost. Further, the surface area of the heat dissipation layer 15 exposed to air is greater than the area of the heat absorption layer 14; it should be noted that the area of the heat absorption layer 14 refers to the area of the side of the heat absorption layer 14 close to the lamp plate 11 or the area of the side close to the back plate 12. By making the surface area of the heat dissipation layer 15 exposed to air greater than the area of the heat absorption layer 14, the heat absorbed by the heat absorption layer 14 can be more quickly radiated to the air through the heat dissipation layer 15, so that the heat absorption layer 14 can also be quickly cooled, thereby avoiding that the internal environment temperature of the backlight module 1 is too high. Specifically, the surface of the side of the heat dissipation layer 15 away from the back plate 12 can be wavy, or the side of the heat dissipation layer 15 away from the back plate 12 is provided with a plurality of protrusions, so as to increase the surface area of the heat dissipation layer 15 exposed to air, so that the heat dissipation rate of the heat dissipation layer 15 is faster, and the amplitude between the wave peaks and wave troughs of the wavy shape or the height of the protrusions can be set according to actual needs, as long as it does not affect the thin design of the backlight module 1, and no specific limitation is made thereto. In the embodiment, the heat dissipation layer 15 is also a copper sheet, so as to quickly absorb the heat generated by the lamp plate 11 and conduct the absorbed heat to the heat dissipation layer 15 through the good heat conduction property of the copper sheet.

[0059] As Figure 10As shown, in this embodiment, the side of the back plate 12 away from the lamp plate 11 is also provided with outer side grooves 123. Specifically, the inner side grooves 121 on the side of the back plate 12 close to the lamp plate 11 can be seen as grid-shaped protrusions on the side of the back plate 12 away from the lamp plate 11, and the outer side grooves 123 are formed between the grid-shaped protrusions, that is, the concave-convex structure on the side of the back plate 12 away from the lamp plate 11 is opposite to that on the side of the back plate 12 close to the lamp plate 11, that is, the inner side grooves 121 on the side of the back plate 12 close to the lamp plate 11 are staggered with the outer side grooves 123 on the side of the back plate 12 away from the lamp plate 11. The heat dissipation fins 151 are arranged in the outer side grooves 123, and the connecting portions 152 extend along the protrusions between adjacent outer side grooves 123 to connect adjacent heat dissipation fins 151, form a complete integrated heat dissipation layer 15, and enable the heat dissipation layer 15 to save more space in the thickness direction of the back plate 12 when the heat dissipation layer 15 and the heat absorption layer 14 are assembled to the back plate 12, further providing a more advantageous technical solution for realizing the lightness and thinness of the backlight module 1; moreover, the heat absorption fins 143 are arranged in the inner side grooves 121 of the back plate 12, the heat dissipation fins are arranged in the outer side grooves 123 of the back plate 12, and the inner side grooves 121 and the outer side grooves 123 are arranged in a staggered manner on the back plate 12, so that the heat dissipation fins 151 and the heat absorption fins 143 do not block each other in the direction perpendicular to the back plate 12, heat can be more easily dissipated, and the heat dissipation efficiency of the backlight module 1 can be further effectively improved.

[0060] Please refer to Figure 11 , Figure 11 is a longitudinal sectional structure schematic diagram of a backlight module provided by another embodiment of the present application. In this embodiment, the backlight module 1 further comprises a metal heat conduction member 163, the metal heat conduction member 163 connects the heat absorption layer 14 and the heat dissipation layer 15 through the heat dissipation channels 122, and is connected with the second heat conduction connection layer 162. Specifically, the metal heat conduction member 163 can be a copper heat conduction member, and can be columnar or sheet-shaped or other irregular shapes, each heat dissipation channel 122 passes through a plurality of metal heat conduction members 163, and the specific shape, size and number can be set according to actual needs, and no specific limitation is made. The metal heat conduction member 163 can be integrally made with the heat absorption layer 14 or the heat dissipation layer 15 to improve the heat conduction efficiency of the metal heat conduction member 163, or can be separately made with the heat absorption layer 14 and the heat dissipation layer 15 and then assembled, and is connected with the second heat conduction connection layer 162 to make the metal heat conduction member 163 closely connected with the heat absorption layer 14 and the heat dissipation layer 15, so that the heat absorbed by the heat absorption layer 14 can also be conducted to the heat dissipation layer 15 through the metal heat conduction member 163, thereby increasing the effective heat conduction path and further improving the heat dissipation efficiency of the backlight module 1.

[0061] In the embodiment, the backlight module 1 further comprises an optical film 17 and an optical adhesive layer 18. The optical film 17 is arranged on the side of the lamp plate 11 away from the back plate 12, and is used to receive the emitted light of the lamp plate 11, so as to balance the light field of the emitted light, thereby improving the light output quality of the backlight module 1. The optical adhesive layer 18 is arranged on the side of the optical film 17 away from the lamp plate 11, and is used to encapsulate the optical film 17, so as to avoid scratching of the optical film 17.

[0062] The backlight module 1 provided by the embodiment of the present application has the following advantages. The first heat-conducting connecting layer 161 covers the surface of the heat-absorbing layer 14 close to the lamp plate 11 and the surface of the lamp plate 11 close to the heat-absorbing layer 14, so as to increase the contact area between the heat-absorbing layer 14 and the first heat-conducting connecting layer 161 and the contact area between the first heat-conducting connecting layer 161 and the lamp plate 11, thereby enabling the first heat-conducting connecting layer 161 to quickly conduct the heat generated by the lamp plate 11 to the heat-absorbing layer 14. Meanwhile, the second heat-conducting connecting layer 162 connects the heat-absorbing layer 14 and the back plate 12, and passes through the heat dissipation channel 122 in the back plate 12 to connect the heat-absorbing layer 14 and the heat dissipation layer 15. Therefore, the second heat-conducting connecting layer 162 can not only conduct the heat absorbed by the heat-absorbing layer 14 to the back plate 12 and then dissipate the heat through the back plate 12, but also conduct the heat absorbed by the heat-absorbing layer 14 to the heat dissipation layer 15 through the heat dissipation channel 122, so that the heat generated by the lamp plate 11 is radiated to the air through the heat dissipation layer 15. Therefore, the heat dissipation efficiency of the backlight module 1 is effectively improved, and the risk of problems such as shortening of the service life of the light emitting element 111, burning of the light emitting element 111, damage of the circuit of the lamp plate 11 caused by expansion and deformation of the lamp plate 11, and the like is effectively reduced.

[0063] Please refer to Figure 12 , Figure 12 is a structural schematic diagram of a display device provided by an embodiment of the present application. In the embodiment, a display device is provided, which comprises a display screen body 2, a backlight module 1 and a frame adhesive 3. The display screen body 2 is used to display images, and can be a liquid crystal display screen body 2 or an electrophoretic display screen body 2, etc. that needs a light source, so as to receive the light source provided by the backlight module 1, thereby displaying corresponding images.

[0064] The backlight module 1 is arranged on the side of the display screen body 2 receiving the light source, and the light emitting direction of the backlight module 1 is towards the display screen body 2 to provide the backlight source for the display screen body 2. The backlight module 1 and the display screen body 2 are connected and sealed by the frame glue 3. Specifically, the specific structure and function of the backlight module 1 are the same as or similar to the specific structure and function of the backlight module 1 involved in the above embodiments, and the same technical effects can be achieved. For details, refer to the above specific introduction, which will not be repeated here. The backlight module 1 provided in the embodiment can be a Mini LED lamp plate 11. The backlight module 1 can effectively improve the heat dissipation efficiency through the heat dissipation assembly 13 and the first and second heat conduction connection layers 161 and 162, reduce the working environment temperature of the light emitting element 111 on the lamp plate 11, and prolong the service life of the light emitting element 111. Moreover, the backlight module 1 can provide a more effective heat dissipation technical solution for realizing HDR2000-3000.

[0065] The above is only the embodiment of the present application, and does not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation using the content of the specification and drawings, or direct or indirect application in other related technical fields, is also included in the patent protection scope of the present application.

Claims

1. A backlight module, comprising: a backboard having a plurality of heat dissipation channels; a lamp plate arranged on one side of the backboard; a heat dissipation assembly comprising a heat absorbing layer and a heat dissipation layer; the heat absorbing layer is arranged between the backboard and the lamp plate for absorbing heat generated by the lamp plate; the heat dissipation layer is arranged on the side of the backboard away from the lamp plate; characterized in that the backlight module further comprises a first heat-conducting connecting layer and a second heat-conducting connecting layer, the first heat-conducting connecting layer connects the lamp plate and the heat absorbing layer, and covers the surface of the heat absorbing layer close to the lamp plate, so as to conduct the heat generated by the lamp plate to the heat absorbing layer; the second heat-conducting connecting layer passes through a plurality of heat dissipation channels and covers the surface of the heat absorbing layer close to the backboard, connects the heat absorbing layer and the heat dissipation layer, so as to conduct the heat absorbed by the heat absorbing layer to the heat dissipation layer; wherein the heat absorbing layer comprises a plurality of heat absorbing pieces and a plurality of first connecting parts, adjacent heat absorbing pieces are connected by the first connecting parts, and the first connecting parts are in strip shape; the heat dissipation layer comprises a plurality of heat dissipation pieces connected to each other and a second connecting part, the second connecting part is used for connecting the heat dissipation pieces, and the side of the heat dissipation layer away from the backboard is exposed to air, and the surface area of the heat dissipation layer exposed to air is greater than the area of the heat absorbing layer; a plurality of heat absorbing pieces are arranged in an array, and a plurality of heat dissipation pieces are arranged in an array; the side of the backboard close to the heat absorbing layer has an inner side groove, the shape of the inner side groove matches the shape of the heat absorbing layer, so that the heat absorbing layer is embedded in the inner side groove; the side of the backboard away from the lamp plate is provided with an outer side groove, the shape of the outer side groove matches the shape of the heat dissipation piece, so that the heat dissipation piece is embedded in the outer side groove; the inner side groove forms a grid-shaped protrusion on the side of the backboard away from the lamp plate, a plurality of grid-shaped protrusions form the outer side groove, the concave-convex structure of the side of the backboard close to the lamp plate is opposite to that of the side of the backboard away from the lamp plate, the outer side groove and the inner side groove are arranged in a staggered manner, so that the orthographic projection of the heat absorbing piece on the backboard and the orthographic projection of the heat dissipation piece on the backboard are arranged in a staggered manner; the heat dissipation piece is arranged in the outer side groove, and the second connecting part extends along the protrusion between adjacent outer side grooves.

2. The backlight module of claim 1, wherein, the first heat-conducting connecting layer and the second heat-conducting connecting layer are connected, and the heat absorbing layer is wrapped between the first heat-conducting connecting layer and the second heat-conducting connecting layer.

3. The backlight module of claim 1, wherein, the depth of the inner side groove is greater than the thickness of the heat absorbing layer, and the first heat-conducting connecting layer and the second heat-conducting connecting layer are arranged in the groove, so that the heat absorbing layer is wrapped between the first heat-conducting connecting layer and the second heat-conducting connecting layer.

4. The backlight module of claim 1, wherein, the heat dissipation channel is a through hole arranged on the backboard, and the heat dissipation layer covers at least part of the through hole.

5. The backlight module of claim 1, wherein, the backlight module further comprises a metal heat-conducting member, the metal heat-conducting member connects the heat absorbing layer and the heat dissipation layer through the heat dissipation channel, and is connected with the second heat-conducting connecting layer.

6. The backlight module of claim 1, wherein, The heat-absorbing layer and the heat-dissipating layer are copper sheets; the first and second heat-conducting connecting layers are heat-conducting silica gel layers; and the back plate is a metal back plate.

7. A display device, characterized by comprising: Comprise: A display screen body for displaying images; A backlight module arranged on one side of the display screen body for providing a backlight source for the display screen body, the backlight module being the backlight module according to any one of claims 1-6.

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