Circuit board cooling device

Abstract

The embodiment of the present application provides a kind of circuit board cooling device, including substrate and cooling component, the substrate includes first plane and first cavity, the first plane is uniformly provided with a series of positioning holes, the first cavity is communicated between the positioning hole, the substrate further includes first air inlet, is located in the side of the first plane, the first air inlet is communicated with the first cavity.The cooling component includes first structural member and second structural member, the second structural member is movably connected with the first structural member, the third cavity is arranged in the second structural member, the first structural member is provided with second cavity, positioning protrusion and second air inlet, the positioning protrusion is detachably arranged in the positioning hole, the second air inlet, the second cavity and the third cavity are sequentially communicated.The circuit board cooling device provided in the present application is set by having the substrate and cooling component with cooling function, so that the fine of the cooling process of circuit board is improved, and the operation precision is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of circuit board processing equipment, and particularly relates to a circuit board cooling device. BACKGROUND

[0002] In a PCBA (Printed Circuit Board Assembly), the processing of a PCB (Printed Circuit Board) involves frequent heating of various components, and a large amount of heat is generated in the process. Most existing PCBs adopt a double-sided layout, and if heat dissipation is not timely, the components that are not currently processed, especially those on the back, will heat up, resulting in defects such as poor contact and performance degradation.

[0003] Existing PCB cooling devices generally blow air to cool the entire circuit board, which cannot accurately control the temperature of the processing area. On the other hand, the cooling is controlled manually, which is not stable enough and has a high risk of operation errors, and also wastes cold air. SUMMARY

[0004] In view of the above, it is necessary to provide a circuit board cooling device to solve the above problems.

[0005] The present application provides a circuit board cooling device, which includes a substrate and a cooling assembly. The substrate includes a first plane and a first cavity. A series of positioning holes are uniformly arranged on the first plane, and the positioning holes are connected to the first cavity. The substrate also includes a first air inlet arranged on one side of the first plane, and the first air inlet is connected to the first cavity.

[0006] The cooling assembly includes a first structure and a second structure. The second structure is movably connected to the first structure, and the second structure has a third cavity. The first structure has a second cavity, a positioning protrusion, and a second air inlet. The positioning protrusion is detachably arranged in the positioning hole. The second air inlet, the second cavity, and the third cavity are sequentially connected.

[0007] In this way, the entire circuit board can be cooled through the first air inlet, or the circuit board can be locally cooled through the second air inlet in the cooling assembly. The cooling can be inserted at any position of the substrate according to actual needs through the cooperation between the positioning protrusion and the positioning hole. The height of the cooling assembly can also be adjusted by moving the second structure to adapt to the processing needs of different components of the circuit board, improve the precision of the cooling process, and improve the operation precision and versatility.

[0008] In a possible implementation, the second structural member is detachably connected with an air outlet plate at one end away from the first structural member, and a plurality of air holes are formed in the air outlet plate and communicate with the third cavity.

[0009] In a possible implementation, the first structural member is provided with an isolation plate on the side close to the base plate, and the isolation plate is used to isolate the first cavity from the second cavity.

[0010] In a possible implementation, the first structural member is provided with a connecting groove, and the second structural member comprises a protruding connecting part provided with a through hole, the through hole communicating with the second cavity and the third cavity, and the connecting part is movably arranged in the connecting groove.

[0011] In a possible implementation, the support assembly further comprises a first positioning member, and the support plate is provided with a positioning groove, and the first positioning member is partially arranged in the positioning groove.

[0012] In a possible implementation, the support assembly further comprises a first positioning member, and the support plate is provided with a positioning groove, and the first positioning member is partially arranged in the positioning groove.

[0013] In a possible implementation, the positioning assembly further comprises a second positioning member, and the base plate is provided with a first mounting hole, and the positioning frame is provided with a second mounting hole, and the second positioning member passes through the second mounting hole and the first mounting hole at the same time.

[0014] In a possible implementation, the positioning assembly further comprises a second positioning member, and the base plate is provided with a first mounting hole, and the positioning frame is provided with a second mounting hole, and the second positioning member passes through the second mounting hole and the first mounting hole at the same time.

[0015] In a possible implementation, the base plate is provided with a plurality of cooling assemblies.

[0016] In a possible implementation, the positioning protrusion is made of magnetic material.

[0017] The circuit board cooling device provided in the present application is provided with a base plate and cooling assemblies with cooling functions, and the circuit board is cooled in a targeted manner, so that the cooling process of the circuit board is refined, and the operation precision is improved. BRIEF DESCRIPTION OF DRAWINGS

[0018] Figure 1 is a structural schematic view of the circuit board cooling device of the first embodiment of the present application.

[0019] Figure 2 is Figure 1 is a sectional view of the base plate of the circuit board cooling device shown in the figure.

[0020] Figure 3 is Figure 1 A cross-sectional view of the cooling assembly in the circuit board cooling device shown in FIG. 1.

[0021] Figure 4 is Figure 1 An exploded structural view of the cooling assembly in the circuit board cooling device shown in FIG. 1.

[0022] Figure 5 is Figure 1 A structural view of the positioning assembly and the supporting assembly in the circuit board cooling device shown in FIG. 1.

[0023] Figure 6 is Figure 1 A structural view of the circuit board cooling device from another perspective shown in FIG. 1.

[0024] Figure 7 is a structural view of the circuit board cooling device according to the second embodiment of the present application.

[0025] Explanation of main component symbols

[0026] Circuit board cooling device 100

[0027] Base plate 10

[0028] First plane 11

[0029] Positioning hole 111

[0030] First cavity 12

[0031] First air inlet 13

[0032] First mounting hole 14

[0033] Cooling assembly 20

[0034] First structural member 21

[0035] Second cavity 211

[0036] Second air inlet 212

[0037] Positioning protrusion 213

[0038] Connecting groove 214

[0039] Isolation plate 215

[0040] Step surface 216

[0041] Second structural member 22

[0042] Third cavity 221

[0043] Air outlet plate 222

[0044] Vent hole 2221

[0045] Connecting portion 223

[0046] Through hole 2231

[0047] Support assembly 30

[0048] Support plate 31

[0049] Positioning groove 311

[0050] Connecting plate 32

[0051] Fourth mounting hole 321

[0052] First positioning member 33

[0053] Third positioning member 34

[0054] Positioning assembly 40

[0055] Positioning frame 41

[0056] Second mounting hole 411

[0057] Third mounting hole 412

[0058] Power member 42

[0059] Connecting rod 421

[0060] Second positioning member 43 DETAILED DESCRIPTION

[0061] In order to make the purposes, technical solutions and advantages of the present application more clear, the present application is further described in detail below with reference to the drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and not used to limit the present application. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative labor fall within the scope of the present application.

[0062] In the description of the application, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise" and the like indicate the orientation or positional relationship shown in the drawings based on the orientation or positional relationship, and are only for the convenience of describing the application and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the application. In addition, the terms "first", "second" are only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first", "second" can explicitly or implicitly include one or more of the features. In the description of the application, the meaning of "a plurality of" is two or more, unless otherwise explicitly specified and limited.

[0063] In the description of the application, it should be noted that unless otherwise explicitly specified and limited, the terms "mounting", "connecting", "connecting" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be mechanically connected, or it can be electrically connected or can communicate with each other; it can be directly connected, or indirectly connected through an intermediate medium, or it can be the internal communication or interaction relationship of two elements. For those skilled in the art, the specific meaning of the above terms in the application can be understood according to the specific circumstances.

[0064] In the present application, unless otherwise explicitly specified and limited, the "upper" or "lower" of the first feature to the second feature can include the direct contact of the first and second features, or the contact of the first and second features through another feature between them. Moreover, the "upper", "upper" and "upper" of the first feature to the second feature include the first feature above and obliquely above the second feature, or only indicate that the horizontal height of the first feature is higher than that of the second feature. The "below", "below" and "below" of the first feature to the second feature include the first feature above and obliquely above the second feature, or only indicate that the horizontal height of the first feature is less than that of the second feature.

[0065] The following disclosure provides many different embodiments, or examples, for implementing different structures of the present application. For the purpose of simplifying the present application, the components and arrangements of the specific examples are described. Of course, they are only examples and are intended to be illustrative of the application and not a limitation of the application. In addition, the present application can repeat reference numerals and / or letters in different examples and this repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and / or configurations discussed. Moreover, the present application provides various examples of specific processes and materials, but one of ordinary skill in the art can readily recognize that other processes and / or materials can be used.

[0066] Referring to Figure 1 , Figure 2 and Figure 3 , the first embodiment of the present application provides a circuit board cooling device 100, which comprises a base plate 10 and a cooling assembly 20. The base plate 10 comprises a first plane 11 and a first cavity 12. A series of positioning holes 111 are uniformly arranged on the first plane 11, and the positioning holes 111 are connected with the first cavity 12. The base plate 10 further comprises a first air inlet 13 arranged on one side of the first plane 11, and the first air inlet 13 is connected with the first cavity 12.

[0067] The cooling assembly 20 comprises a first structural member 21 and a second structural member 22. The second structural member 22 is telescopically connected with the first structural member 21. The second structural member 22 is provided with a third cavity 221. The first structural member 21 is provided with a second cavity 211, a positioning protrusion 213 and a second air inlet 212. The positioning protrusion 213 is detachably arranged in the positioning hole 111. The second air inlet 212, the second cavity 211 and the third cavity 221 are sequentially connected.

[0068] It should be explained that the first air inlet 13 and the second air inlet 212 can be connected with a blowing device (not shown in the figure). The blowing device blows cold air to cool the circuit board (not shown in the figure) through the base plate 10 or the cooling assembly 20. For the cooling path of the base plate 10, the cold air enters the first cavity 12 through the first air inlet 13, and then blows to the circuit board through the positioning holes 111. For the cooling assembly 20, the cold air enters the second cavity 211 through the second air inlet 212, and then blows to the circuit board through the third cavity 221.

[0069] The cooling assembly 20 is detachably connected with the positioning hole 111 on the base plate 10 through the positioning protrusion 213. When the entire circuit board needs to be blown, the cooling assembly 20 can be detached, and the base plate 10 cools the entire circuit board through the positioning holes 111. When a specific area of the circuit board needs to be cooled, the cooling assembly 20 can be installed on the corresponding positioning hole 111 on the base plate 10, so as to change the position of the cooling assembly 20 on the base plate 10.

[0070] To enable the cooling assembly 20 to be fixed at multiple locations of the substrate 10, the positioning holes 111 can be symmetrically arranged on the substrate 10. In the embodiment, the positioning holes 111 are uniformly arranged and have the same size. In other embodiments, positioning holes 111 of different sizes and arrangements can be used to achieve the purpose of fixing the cooling assembly 20 at multiple locations of the substrate 10.

[0071] Meanwhile, the size and shape of the cooling assembly 20, especially the second structural member 22, can be designed and changed according to actual needs to adapt to different sizes of components and different cooling processes.

[0072] Please refer to Figure 3 and Figure 4 In an embodiment, the end of the second structural member 22 away from the first structural member 21 is detachably connected with an air outlet plate 222, and a plurality of ventilation holes 2221 are formed in the air outlet plate 222, which are communicated with the third cavity 221 to blow cold air to the circuit board. The detachably arranged air outlet plate 222 can be replaced with different sizes and shapes of mesh according to specific needs during use, which realizes fine adjustment of blowing force and range and improves the application range.

[0073] In an embodiment, the first structural member 21 is provided with a partition plate 215 close to the substrate 10, which is used to isolate the first cavity 12 and the second cavity 211. The arrangement of the partition plate 215 ensures that when the circuit board is cooled by the cooling assembly 20, the cold air will not enter the first cavity 12 through the positioning holes 111 to dissipate, thereby reducing the air pressure at the air outlet plate 222, causing waste of cold air and reduction of efficiency, ensuring that the cold air is used for cooling when the cooling assembly 20 is used, improving work efficiency and reducing energy consumption.

[0074] In an embodiment, the first structural member 21 is provided with a connecting groove 214, and the second structural member 22 includes a protruding connecting part 223, which is provided with a through hole 2231 communicated with the second cavity 211 and the third cavity 221, and the connecting part 223 is movably arranged in the connecting groove 214. A stepped surface 216 is formed between the connecting groove 214 and the second cavity 211, which is used to limit the displacement of the connecting part 223.

[0075] It should be explained that the connecting part 223 is substantially a cylinder in the embodiment, and the diameter is smaller than the side length of the second structural member 22. By sliding the connecting part 223 in the connecting groove 214, the space occupied by the connecting part 223 can be reduced, the volume of a single cooling assembly 20 can be reduced, and the installation and positioning of the cooling assembly 20 can be avoided by mutual interference between adjacent cooling assemblies 20. Meanwhile, the telescopic connection can enable the user to adjust the cooling assembly 20 according to specific needs, further improving the application range.

[0076] In an embodiment, the support assembly 30 is further included, which comprises the support plate 31 and the connecting plate 32 connected with each other. The connecting plate 32 is arranged on one side of the base plate 10, and the support plate 31 is parallel to the base plate 10. In the first embodiment of the present application, the connecting plate 32 is arranged on the opposite sides of the base plate 10. The support plate 31 and the connecting plate 32 are connected and used for supporting the circuit board. The length of the connecting plate 32 is greater than the height of the cooling assembly 20, so as to avoid the collision between the bottom of the circuit board and the top of the cooling assembly 20.

[0077] Please refer to Figure 1 and Figure 5 In an embodiment, the support assembly 30 further comprises the first positioning member 33. The support plate 31 is provided with the positioning groove 311, which is used for partially containing the first positioning member 33. In the embodiment, the first positioning member 33 is a bolt, one end of which is arranged upwards through the positioning groove 311 and used for positioning the circuit board. The circuit board is provided with the corresponding through hole for containing the first positioning member 33. In this way, the circuit board is prevented from being deviated during the operation, and the processing precision is improved.

[0078] Please continue to refer to Figure 1 , Figure 5 and Figure 6 In an embodiment, the positioning assembly 40 is further included, which comprises the positioning frame 41 and the power member 42. The base plate 10 is connected with the positioning frame 41, and the power member 42 is connected with the positioning frame 41 and drives the positioning frame 41 to move in the vertical direction. Please refer to Figure 1 The positioning frame 41 can be arranged on one side and supported from one side of the base plate 10, or arranged on both sides and supported from both sides of the bottom of the base plate 10, such as the second embodiment of the present application shown in Figure 7 The power member 42 can drive the positioning frame 41 through the connecting rod 421, which is connected with the positioning frame 41 and the connecting plate 32. The power member 42 includes, but is not limited to, a working device of the pneumatic, hydraulic or oil pressure type, for the purpose of power output.

[0079] Please continue to refer to Figure 5 and Figure 6 In an embodiment, the positioning assembly 40 further comprises the second positioning member 43. The base plate 10 is provided with the first mounting hole 14, and the positioning frame 41 is provided with the second mounting hole 411. The second positioning member 43 is arranged through the second mounting hole 411 and the first mounting hole 14. In the first embodiment, the second mounting hole 411 is long strip-shaped, so as to adjust the position of the second positioning member 43. Meanwhile, two second mounting holes 411 are arranged on each side of the positioning frame 41, and two second positioning members 43 are arranged on each second mounting hole 411. In this way, the connection strength between the positioning assembly 40 and the base plate 10 is further improved.

[0080] Please continue to refer to Figure 5In an embodiment, the support assembly 30 comprises a third positioning member 34, the positioning frame 41 is provided with a third mounting hole 412, the connecting plate 32 is provided with a fourth mounting hole 321, and the third positioning member 34 passes through the third mounting hole 412 and the fourth mounting hole 321 at the same time. In the first embodiment, two third mounting holes 412 are arranged on each side of the positioning frame 41, and each third mounting hole 412 is arranged with two third positioning members 34. The third mounting hole 412 is in a strip shape, so as to facilitate the adjustment of the position of the third positioning member 34. In this way, the connection strength between the support assembly 30 and the positioning assembly 40 is further enhanced.

[0081] Please continue to refer to Figure 1 The substrate 10 is provided with a plurality of cooling assemblies, and six cooling assemblies 20 are arranged in the first embodiment of the present application. The specific positions and quantities of the cooling assemblies 20 can be changed according to the specific process requirements, and the sizes and structures of the second structural member 22 and the air outlet plate 222 in the cooling assembly 20 can be designed according to the needs to adapt to specific requirements.

[0082] In an embodiment, the positioning protrusion 213 is made of magnetic material, and the connection stability of the cooling assembly 20 and the substrate 10 is improved by magnetic connection, so as to avoid deviation or dislocation under the driving of the cold air sweeping.

[0083] In the embodiment, the extension and retraction of the cooling assembly 20, the lifting of the substrate 10, and the start and stop of the air blowing device are controlled by the control module, specific parameters can be formed according to specific requirements, the operation process is standardized, the error caused by manual operation is reduced, and the processing precision is improved.

[0084] It is obvious for those skilled in the art that the present application is not limited to the details of the above-mentioned exemplary embodiments, and the present application can be implemented in other specific forms without departing from the spirit or essential characteristics of the present application. Therefore, the embodiments should be regarded as exemplary and non-limiting from any point of view.

[0085] The above embodiments are only used to illustrate the technical solutions of the present application and are not limited. Although the present application has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solutions of the present application can be modified or replaced equivalently without departing from the spirit and scope of the present application.

Claims

1. A circuit board cooling device, characterized by, The application relates to a cooling device for a circuit board. The cooling device comprises a substrate and a cooling assembly. The substrate comprises a first plane and a first cavity. The first plane is provided with a series of positioning holes. The first cavity is communicated between the positioning holes. The first plane is provided with a first air inlet.

2. The circuit board cooling device according to claim 1, wherein The first air inlet is communicated with the first cavity.

3. The circuit board cooling device of claim 2, wherein, The cooling assembly comprises a first structure and a second structure.

4. The circuit board cooling device of claim 1, wherein, The second structure is movably connected with the first structure.

5. The circuit board cooling device of claim 1, wherein, The second structure is provided with a third cavity.

6. The circuit board cooling device of claim 5, wherein The first structure is provided with a second cavity, a positioning protrusion and a second air inlet.

7. The circuit board cooling device of claim 1, wherein, The positioning protrusion is detachably arranged in the positioning hole.

8. The circuit board cooling device of claim 7, wherein, The second air inlet, the second cavity and the third cavity are communicated in sequence.

9. The circuit board cooling device of claim 1, wherein, The first air inlet and the second air inlet are connected with a blowing device.

10. The circuit board cooling device of claim 1, wherein, The blowing device blows cold air. The cold air enters the first cavity through the first air inlet of the substrate. The cold air is blown to the circuit board through the positioning hole. The cold air enters the second cavity through the second air inlet of the cooling assembly. The cold air is blown to the circuit board through the third cavity. When the circuit board is blown in whole, the cooling assembly is detached. The substrate cools the whole circuit board through the positioning hole. When a specific area of the circuit board is cooled, the cooling assembly is arranged on the corresponding positioning hole of the substrate to cool the specific area of the circuit board. The second structure is detachably connected with an air outlet plate at one end away from the first structure. The air outlet plate is provided with a plurality of air holes. The air holes are communicated with the third cavity. The first structure is provided with a separation plate on the side close to the substrate. The separation plate is used for separating the first cavity and the second cavity. The first structure is provided with a connecting groove. The second structure comprises a protruding connecting part. The connecting part is provided with a through hole. The through hole is communicated with the second cavity and the third cavity. The connecting part is movably arranged in the connecting groove. The application further comprises a supporting assembly. The supporting assembly comprises a supporting plate and a connecting plate. The connecting plate is arranged on one side of the substrate. The supporting plate is arranged in parallel with the substrate. The supporting assembly further comprises a first positioning part. The supporting plate is provided with a positioning groove. The first positioning part is partially arranged in the positioning groove. The application further comprises a positioning assembly. The positioning assembly comprises a positioning frame and a power part. The substrate is connected with the positioning frame. The power part is connected with the positioning frame and drives the positioning frame to move. The positioning assembly further comprises a second positioning part. The substrate is provided with a first mounting hole. The positioning frame is provided with a second mounting hole. The second positioning part is simultaneously arranged in the second mounting hole and the first mounting hole. The substrate is provided with a plurality of cooling assemblies. The positioning protrusion is made of magnetic material.

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