Condensate return system

Abstract

The application provides a condensate water backflow system, and relates to the technical field of semiconductors. The system comprises a semiconductor waste gas treatment device, an exhaust pipeline, a connecting piece, a condensate water backflow device and a plant service pipeline. The semiconductor waste gas treatment device is connected with one end of the exhaust pipeline and is used for treating gas. The other end of the exhaust pipeline is connected with one end of the plant service pipeline through the connecting piece. The condensate water backflow device is installed in one side of the plant service pipeline close to the connecting piece and is used for backflowing condensate water generated by the treated gas through the plant service pipeline. The condensate water generated by the gas through the plant service pipeline is backflowed through the condensate water backflow device, so that the amount of condensate water in the plant service pipeline is reduced, the amount of condensate water flowing into the equipment connected with the latter section of the plant service pipeline is reduced, and equipment failure is avoided.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor, and in particular to a condensate water backflow system. BACKGROUND

[0002] The semiconductor waste gas treatment equipment processes the process gas through chemical and physical reactions, including combustion and water washing process, and the gas discharged by the semiconductor waste gas treatment equipment has the characteristics of high temperature and high humidity.

[0003] The semiconductor waste gas treatment equipment uses a constant temperature stable environment (i.e. semiconductor plant environment), and the temperature is generally stable at 25℃. Therefore, the temperature of the semiconductor waste gas treatment equipment, the exhaust pipe and the plant pipe connected with the exhaust pipe is close to 25℃.

[0004] The gas with high temperature and high humidity flows through the exhaust pipe and the plant pipe with low temperature, and a large amount of condensate water is formed. Part of the condensate water in the plant pipe flows back into the exhaust pipe, and the other part of the condensate water flows into the equipment connected with the rear section of the plant pipe; wherein the condensate water flowing back into the exhaust pipe does not cause equipment failure, but the condensate water flowing into the equipment connected with the rear section of the plant pipe may cause equipment failure. SUMMARY

[0005] The present application provides a condensate water backflow system to solve the problem that the condensate water in the rear section of the plant pipe flows into the equipment connected with the rear section of the plant pipe, causing equipment failure.

[0006] The present application provides a condensate water backflow system, comprising: a semiconductor waste gas treatment equipment, an exhaust pipe, a connecting piece, a condensate water backflow device and a plant pipe; wherein,

[0007] The semiconductor waste gas treatment equipment is connected with one end of the exhaust pipe, and is used for processing gas;

[0008] The other end of the exhaust pipe is connected with one end of the plant pipe through the connecting piece;

[0009] The condensate water backflow device is installed on one side of the plant pipe close to the connecting piece, and is used for backflowing the condensate water generated by the processed gas through the plant pipe.

[0010] According to the condensate water backflow system provided by the present application, the condensate water backflow device comprises at least two variable cross-section circular rings placed at a preset interval; wherein the outer diameter of each variable cross-section circular ring is the same as the inner diameter of the plant pipe.

[0011] According to the condensate water return system provided by the present application, the variable cross-section circular ring comprises a front inner diameter and a rear inner diameter, the front inner diameter is the inner diameter close to the exhaust pipe, and the rear inner diameter is the inner diameter close to the plant service pipe, and the front inner diameter is larger than the rear inner diameter.

[0012] According to the condensate water return system provided by the present application, the variable cross-section circular ring close to the exhaust pipe is a front circular ring, the variable cross-section circular ring close to the plant service pipe is a rear circular ring, and the inner diameter of the front circular ring is larger than the inner diameter of the rear circular ring.

[0013] According to the condensate water return system provided by the present application, the variable cross-section circular ring close to the exhaust pipe is a front circular ring, the variable cross-section circular ring close to the plant service pipe is a rear circular ring, and the inner diameter of the front circular ring is larger than the inner diameter of the rear circular ring.

[0014] According to the condensate water return system provided by the present application, the rear inner diameter of the front circular ring is larger than the front inner diameter of the rear circular ring.

[0015] According to the condensate water return system provided by the present application, the condensate water return section flowing back into the exhaust pipe is determined based on the thickness of the front circular ring, the thickness of the rear circular ring, and the length between the rear inner diameter of the front circular ring and the front inner diameter of the rear circular ring.

[0016] According to the condensate water return system provided by the present application, a water storage area is formed between the front circular ring and the rear circular ring, and the water storage area is used for storing condensate water.

[0017] According to the condensate water return system provided by the present application, a filler is arranged between each variable cross-section circular ring, and the filler is used for increasing the amount of condensate water.

[0018] According to the condensate water return system provided by the present application, the filler comprises but is not limited to any one of the following: a Pall ring, a mesh fabric, and a porous medium.

[0019] According to the condensate water return system provided by the present application, the connection mode of the condensate water return device and the plant service pipe comprises but is not limited to any one of the following: welding, buckle fixing, and interference fit with a sealing ring.

[0020] The condensate water backflow system provided by the application comprises a semiconductor waste gas treatment device, an exhaust pipeline, a connecting piece, a condensate water backflow device and a plant service pipeline, wherein the semiconductor waste gas treatment device is connected with one end of the exhaust pipeline and is used for treating gas; the other end of the exhaust pipeline is connected with one end of the plant service pipeline through the connecting piece; the condensate water backflow device is installed in the plant service pipeline on the side close to the connecting piece and is used for backflowing condensate water generated by the treated gas through the plant service pipeline; the condensate water generated by the gas through the plant service pipeline is backflowed through the condensate water backflow device, so that the amount of condensate water in the plant service pipeline can be reduced, thereby reducing the amount of condensate water flowing into the equipment connected with the latter section of the plant service pipeline and avoiding equipment failure. BRIEF DESCRIPTION OF DRAWINGS

[0021] In order to more clearly illustrate the technical solutions in the application or prior art, the following will briefly introduce the drawings needed to be used in the embodiments or prior art description. Obviously, the drawings in the following description are some embodiments of the application, and other drawings can be obtained by those skilled in the art without creative effort.

[0022] Figure 1 FIG. 1 is a structural schematic diagram of the condensate water backflow system provided by the application.

[0023] Figure 2 FIG. 2 is a structural schematic diagram of the condensate water backflow device provided by the application.

[0024] Figure 3 FIG. 3 is a sectional view of the structure of the condensate water backflow device provided by the application. DETAILED DESCRIPTION

[0025] In order to make the objectives, technical solutions and advantages of the application clearer, the technical solutions in the application will be described clearly and completely in the following with reference to the drawings in the application. Obviously, the described embodiments are some embodiments of the application, rather than all the embodiments. Based on the embodiments in the application, all other embodiments obtained by those skilled in the art without creative effort belong to the protection scope of the application.

[0026] The condensate water backflow system provided by the application will be described below with reference to the drawings. Figures 1-3

[0027] Figure 1 FIG. 1 is a structural schematic diagram of the condensate water backflow system provided by the application, as shown in the figure, comprising a semiconductor waste gas treatment device 101, an exhaust pipeline 102, a connecting piece 103, a condensate water backflow device 104 and a plant service pipeline 105; wherein, Figure 1

[0028] ​​The semiconductor waste gas treatment equipment 101 is connected with one end of the exhaust pipeline 102, and is used for treating the gas;

[0029] The other end of the exhaust pipeline 102 is connected with one end of the plant pipeline 105 through the connecting piece 103;

[0030] The condensate water backflow device 104 is installed in the plant pipeline 105 near the connecting piece 103, and is used for backflowing the condensate water generated by the treated gas passing through the plant pipeline 105.

[0031] Specifically, the semiconductor waste gas treatment equipment 101 is connected with one end of the exhaust pipeline 102, and is used for treating the gas, generating the treated gas with high temperature and high humidity. The other end of the exhaust pipeline 102 is connected with one end of the plant pipeline 105 through the connecting piece 103; wherein the connecting piece 103 is a connecting elbow, and the connecting mode of the connecting piece 103 with the exhaust pipeline 102 and the plant pipeline 105 includes but is not limited to welding, buckle fixing, interference fit and interference fit with sealing ring, etc. The condensate water backflow device 104 is installed in the plant pipeline 105 near the connecting piece 103, and is used for backflowing the condensate water generated by the treated gas passing through the plant pipeline 105.

[0032] In practice, after the treated gas passes through the exhaust pipeline 102 and the plant pipeline 105, because the temperature of the exhaust pipeline 102 and the plant pipeline 105 is lower than the temperature of the treated gas, a large amount of condensate water will be generated in the exhaust pipeline 102 and the plant pipeline 105. Part of the condensate water generated in the plant pipeline 105 will backflow into the exhaust pipeline 102, and the other part will flow into the equipment connected to the rear section of the exhaust pipeline 102. The rear section of the plant pipeline 105 is connected with multiple equipment 106, and the equipment is in parallel relationship. The pump 107 at the end of the plant pipeline 105 provides negative pressure to suck out the gas discharged from each equipment 106. Affected by the airflow, the condensate water generated in the front section of the plant pipeline 105 will flow into the equipment 106 in the rear section of the plant pipeline 105.

[0033] Therefore, the condensate water backflow device 104 is installed in the plant pipeline 105 near the connecting piece 103, and is used for backflowing the condensate water generated by the plant pipeline 105, so as to avoid the condensate water generated by the plant pipeline 105 from flowing into the equipment 106 connected to the rear section of the plant pipeline 105, and causing failure of the equipment 106.

[0034] The condensate water backflow system comprises a semiconductor waste gas treatment device, an exhaust pipeline, a connecting piece, a condensate water backflow device and a plant service pipeline.

[0035] Optionally, the condensate water backflow device comprises at least two variable cross-section rings arranged at a preset interval.

[0036] Specifically, the condensate water backflow device comprises at least two variable cross-section rings arranged at a preset interval, so that a closed area is formed between the two variable cross-section rings, and the closed area can be used as a water storage area to store the generated condensate water. The outer diameter of each variable cross-section ring is the same as the inner diameter of the plant service pipeline, so that there is no gap between the variable cross-section ring and the plant service pipeline, thereby avoiding the condensate water generated by the gas flowing into the gap between the variable cross-section ring and the plant service pipeline, and the defect that the condensate water cannot be backflowed.

[0037] Optionally, the variable cross-section ring comprises a front inner diameter and a rear inner diameter, the front inner diameter is close to the inner diameter of the exhaust pipeline, and the rear inner diameter is close to the inner diameter of the plant service pipeline. The front inner diameter is greater than the rear inner diameter.

[0038] Optionally, the variable cross-section ring close to the exhaust pipeline is a front ring, and the variable cross-section ring close to the plant service pipeline is a rear ring. The inner diameter of the front ring is greater than the inner diameter of the rear ring.

[0039] Specifically, since the inner diameter of the front ring is greater than the inner diameter of the rear ring, the inner diameters of the plurality of variable cross-section rings decrease in turn from the connecting piece (connecting elbow) to the rear section of the plant service pipeline. The inner diameter surface of each variable cross-section ring has a certain slope, which can make the condensate water in the plant service pipeline backflow, and the condensate water can be recycled, thereby reducing resource waste.

[0040] Optionally, the rear inner diameter of the front ring is greater than the front inner diameter of the rear ring.

[0041] Specifically, the rear inner diameter of the front ring is greater than the front inner diameter of the rear ring, that is, the inner diameters of the plurality of variable cross-section rings decrease in turn, which effectively prevents the condensate water from flowing to the rear section of the plant service pipeline along the gas flow, thereby reducing the amount of condensate water flowing to the rear section of the plant service pipeline and avoiding equipment failure.

[0042] Figure 2 This is a schematic diagram of the condensate reflux device provided by the present invention, as shown below. Figure 2 As shown, a condensate recirculation device consisting of two variable cross-section rings is used as an example. The variable cross-section ring closer to the exhaust gas treatment equipment is the front ring, and the variable cross-section ring closer to the downstream equipment of the plant pipeline is the rear ring. The front and rear rings are placed at a preset distance on the side of the plant pipeline near the connecting parts. The outer diameter of the front and rear rings is the same as the inner diameter of the plant pipeline, so that the front and rear rings can be tightly connected to the inner diameter of the plant pipeline, thus preventing condensate from flowing into the gap between the inner diameter of the plant pipeline and the outer diameter of the front and rear rings during condensate recirculation.

[0043] Optionally, the condensate return section flowing back into the exhaust pipe is determined based on the thickness of the front ring, the thickness of the rear ring, and the length between the rear inner diameter of the front ring and the front inner diameter of the rear ring.

[0044] Specifically, the installation of the reflux device increases the reflux section of condensate flowing back into the exhaust pipe, thereby reducing the amount of condensate in the downstream section of the plant pipeline. The reflux section of condensate flowing back into the exhaust pipe is at least the sum of the thickness of the front ring, the thickness of the rear ring, and the length between the rear inner diameter of the front ring and the front inner diameter of the rear ring.

[0045] Optionally, a water storage area is formed between the front ring and the rear ring, and the water storage area is used to store condensate.

[0046] Specifically, a water storage area can be formed between the front and rear rings to store the returned condensate, preventing the condensate from flowing with the airflow to the later section of the plant pipeline. At the same time, when the water storage area is full, the condensate flows into the exhaust pipe along the slope of the front ring.

[0047] Figure 3 This is a cross-sectional view of the condensate recirculation device structure provided by the present invention, as shown below. Figure 3 As shown, still in Figure 2The two variable cross-section annular rings shown constitute a condensate backflow device, the front annular ring is installed on the straight pipe section after the connecting elbow and close to the elbow, and the rear annular ring is installed after the front annular ring and has a preset distance from the front annular ring; the thickness of the front annular ring is L1, the thickness of the rear annular ring is L2, and the thicknesses of the two can be the same or different; the front inner diameter D1 of the front annular ring and the rear inner diameter D2 of the front annular ring satisfy the relationship: D1>D2. The front inner diameter D3 of the rear annular ring and the rear inner diameter D4 of the rear annular ring satisfy the relationship: D3>D4. Further, D2 and D3 satisfy the relationship: D2>D3. L1, D1 and D2 satisfy the relationship: (D1-D2) / 2L1≥0.008; the preset distance between the front annular ring and the rear annular ring is L3, and the internal area corresponding to the preset distance between the front annular ring and the rear annular ring is called a water storage area, which is used to store condensate to avoid the condensate flowing to the rear section of the plant service pipeline along with the gas flow.

[0048] Optionally, each of the variable cross-section annular rings includes a filler for increasing the amount of condensate.

[0049] Specifically, a filler can be placed between each variable cross-section annular ring. Since the filler can increase the contact area of the gas and change the speed of the gas flow, the filler can further increase the condensate generation between each variable cross-section annular ring, thereby allowing more condensate to backflow.

[0050] Optionally, the filler includes but is not limited to any one of the following: a Pall ring, a mesh fabric, a porous medium.

[0051] Optionally, the connection mode of the condensate backflow device and the plant service pipeline includes but is not limited to any one of the following: welding, buckle fixing, interference fit with a sealing ring.

[0052] Further, the condensate backflow device backflows condensate by the following principles, reduces the condensate in the rear section of the plant service pipeline, prolongs the maintenance period of the equipment in the rear section of the plant service pipeline, and reduces the labor cost of maintenance, specifically including:

[0053] 1. Accelerate cooling. After the installation of the condensate backflow device, the average temperature of the cross section after the connecting piece (connecting elbow) decreases by at least 1℃, indicating that more condensate is generated in the plant service pipeline section, and the condensate in the rear section of the plant service pipeline is reduced through the condensate backflow device.

[0054] 2. Prolong the condensate backflow section. The condensate backflow section is determined by the inner diameter variable diameter relationship between each variable cross-section annular ring. For example, the section of the condensate that can backflow into the exhaust pipeline is increased by at least (L3+L1+L2) length (two variable cross-section annular rings), thereby reducing the condensate in the rear section of the plant service pipeline.

[0055] 3. The condensed water is intercepted in the water storage area. Since the inner diameter of the variable cross-section ring is smaller and smaller from the back, the condensed water droplets can be prevented from flowing to the equipment in the back section of the plant service pipeline along with the air flow. Meanwhile, when the water storage area is full, the condensed water flows into the exhaust pipeline along the slope of the first variable cross-section ring.

[0056] 4. The condensed water is adsorbed by the porous medium. The filler can further increase the amount of condensed water.

[0057] It should be noted that the material of the condensed water return device is not limited, and the materials used include but are not limited to stainless steel, polymer plastic, composite material, etc. When the size requirement is met, the variable cross-section ring can be a solid ring or a hollow ring.

[0058] Finally, it should be noted that the above examples are only used to illustrate the technical solutions of the present application, and are not limited thereto. Although the present application has been described in detail with reference to the foregoing examples, those skilled in the art should understand that the technical solutions described in the foregoing examples can still be modified, or some technical features can be replaced by equivalents. The modification or replacement does not make the essence of the corresponding technical solution deviate from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A condensate recirculation system, characterized in that, include: Semiconductor exhaust gas treatment equipment, exhaust pipes, connectors, condensate return devices, and plant piping; among which, The semiconductor waste gas treatment equipment is connected to one end of the exhaust pipe and is used to treat the gas; The other end of the exhaust pipe is connected to one end of the plant maintenance pipe via the connector. The condensate return device is installed on the side of the plant pipeline near the connector and is used to return the condensate generated by the treated gas passing through the plant pipeline. The condensate return device includes at least two variable cross-section rings placed at a preset interval; wherein the outer diameter of each variable cross-section ring is the same as the inner diameter of the plant pipeline. The variable cross-section ring closer to the exhaust pipe is the front ring, and the variable cross-section ring closer to the plant maintenance pipe is the rear ring. The inner diameter of the front ring is larger than the inner diameter of the rear ring.

2. The condensate recirculation system according to claim 1, characterized in that, The variable cross-section annulus includes a front inner diameter and a rear inner diameter. The front inner diameter is the inner diameter closer to the exhaust pipe, and the rear inner diameter is the inner diameter closer to the plant maintenance pipe. The front inner diameter is larger than the rear inner diameter.

3. The condensate recirculation system according to claim 1, characterized in that, The rear inner diameter of the front ring is larger than the front inner diameter of the rear ring.

4. The condensate recirculation system according to claim 3, characterized in that, The condensate return section flowing back into the exhaust pipe is determined based on the thickness of the front ring, the thickness of the rear ring, and the length between the rear inner diameter of the front ring and the front inner diameter of the rear ring.

5. The condensate recirculation system according to claim 1, characterized in that, The front ring and the rear ring form a water storage area, which is used to store condensate.

6. The condensate recirculation system according to any one of claims 1-5, characterized in that, Each of the variable cross-section rings includes a filler material used to increase the amount of condensate.

7. The condensate recirculation system according to claim 6, characterized in that, The filler includes, but is not limited to, any of the following: Pall rings, mesh fabric, or porous media.

8. The condensate recirculation system according to claim 1, characterized in that, The connection method between the condensate return device and the plant pipeline includes, but is not limited to, any of the following: welding, snap-fit ​​fixing, or interference fit with a sealing ring.

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