Packaging structure and manufacturing equipment thereof

Abstract

The present disclosure provides a manufacturing apparatus for a package structure, which includes a mold and a spring needle. The mold includes a mold cavity for receiving a semiconductor device and an injection port for injecting a package adhesive into the mold cavity. The spring needle is disposed in the mold cavity for facing a surface of the semiconductor device, wherein a top end of the spring needle is telescopically protruded from the surface, and when the semiconductor device is disposed in the mold cavity, the spring needle abuts an upper surface of the semiconductor device, and the package adhesive injected into the mold cavity covers the semiconductor device and surrounds the spring needle to form a package structure. A package structure manufactured by the manufacturing apparatus is also provided.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to a packaging structure and a manufacturing apparatus thereof. BACKGROUND

[0002] Fingerprint recognition chip packaging structures can be installed in various electronic products, such as smart phones, mobile phones, tablet computers, notebook computers, etc., to identify the fingerprints of users. Existing fingerprint recognition chip packaging can be roughly divided into packaging methods using flexible circuit boards or hard circuit boards as carriers. The fingerprint recognition chip packaging structure of the flexible circuit board usually sets the sensing circuit for identifying the fingerprints of the user on the flexible circuit board, and the user performs fingerprint recognition by contacting the sensing circuit on the flexible circuit board. However, this packaging method transmits signals through the sensing circuit on the flexible circuit board to the fingerprint recognition chip, which is slower than the way of directly sensing fingerprints on the fingerprint recognition chip. Another common fingerprint recognition chip packaging structure mainly includes a circuit board, a fingerprint recognition chip, a plurality of solder wires, and a molding compound, wherein the sensing area for identifying the fingerprints of the user is mostly located on the active surface of the fingerprint recognition chip. The fingerprint recognition chip is usually attached to the circuit board with its back surface, and is electrically connected to the active surface of the fingerprint recognition chip and the circuit board through wire bonding. Therefore, when the molding compound is formed on the circuit board to cover the fingerprint recognition chip, the molding compound will cover the solder wires and part of the fingerprint recognition chip.

[0003] The thickness of the molding compound above the fingerprint recognition chip of such a packaging structure directly affects the sensing sensitivity of the fingerprint recognition chip. However, the current method can only manually measure whether the thickness of the entire molding compound meets the requirements after molding, and the thickness of the molding compound above the chip cannot be directly measured, which may lead to inaccurate test results and affect the yield of the packaging structure. SUMMARY

[0004] The present disclosure is directed to a packaging structure and a manufacturing apparatus thereof, which can measure the thickness of the molding compound above the chip during the process.

[0005] According to an embodiment of the present disclosure, a manufacturing apparatus of a packaging structure includes a mold and a pogo pin. The mold includes a mold cavity for accommodating a semiconductor device and an injection port for injecting a molding compound into the mold cavity. The pogo pin is disposed in the mold cavity for facing a surface of the semiconductor device, wherein a top end of the pogo pin is telescopically protruded from the surface, and when the semiconductor device is disposed in the mold cavity, the pogo pin abuts against an upper surface of the semiconductor device, and the molding compound injected into the mold cavity covers the semiconductor device and surrounds the pogo pin to form a packaging structure.

[0006] According to an embodiment of the present disclosure, a packaging structure includes a substrate, a chip, and a molding compound. The chip is disposed on the substrate and includes an active surface facing away from the substrate. The molding compound is disposed on the substrate and encapsulates the chip, wherein the molding compound includes a first opening, and the first opening extends from a top surface of the molding compound to the active surface of the chip.

[0007] Based on the above, the manufacturing apparatus of the present disclosure is provided with the ejector pin on the inner surface of the mold, so that when the semiconductor device is disposed in the cavity of the mold for encapsulation, the ejector pin abuts against the upper surface of the semiconductor device, so that the thickness of the molding compound above the chip and / or the maximum thickness of the molding compound can be obtained by the opening depth of the molding compound caused by the ejector pin or the elastic element extension amount of the ejector pin. Therefore, in such a configuration, the packaging structure formed by the manufacturing apparatus of the present disclosure can measure the above thickness information during the manufacturing process, without the need for drilling measurement after the completion of the packaging structure or only for obtaining in a way of estimation. Therefore, the manufacturing apparatus of the present embodiment can effectively improve the detection efficiency and accuracy of the packaging structure. BRIEF DESCRIPTION OF DRAWINGS

[0008] The accompanying drawings are included to provide a further understanding of the present disclosure and are incorporated in and constitute a part of this specification. The drawings illustrate embodiments of the present disclosure and, together with the description, serve to explain the principles of the present disclosure.

[0009] Figures 1 to 4 is a manufacturing process flow diagram of a packaging structure according to an embodiment of the present disclosure;

[0010] Figure 5 is a block diagram of an element of a manufacturing apparatus of a packaging structure according to an embodiment of the present disclosure;

[0011] Figure 6 is a working situation diagram of a manufacturing apparatus of a packaging structure according to an embodiment of the present disclosure.

[0012] BRIEF DESCRIPTION OF DRAWINGS

[0013] 100: manufacturing apparatus

[0014] 110: mold

[0015] 1101, 1102: working unit

[0016] 112: upper mold

[0017] 1121: surface

[0018] 114: lower mold

[0019] 116: injection port

[0020] 120a: ejector pin, first ejector pin

[0021] 120b: second spring needle

[0022] 122a, 122b: needle body

[0023] 124a, 124b: elastic member

[0024] 130: sensor

[0025] 140: processor

[0026] 200: package structure

[0027] 2001, 2002: package structure unit

[0028] 201: semiconductor device

[0029] 210: substrate

[0030] 212: upper surface of substrate

[0031] 220: chip

[0032] 222: active surface

[0033] 224: back surface

[0034] 230: molding compound

[0035] 231: top surface

[0036] 232: first opening

[0037] 233: bottom surface

[0038] 234: second opening

[0039] 240: lead

[0040] 250: passive element

[0041] 260: light-transmissive adhesive material

[0042] 270: adhesive layer

[0043] D1, D2: distance

[0044] L1, L2: length

[0045] S1: mold cavity

[0046] SL: scribe line DETAILED DESCRIPTION

[0047] Reference will now be made in detail to the exemplary embodiments of the present disclosure, examples of which are illustrated in the accompanying drawings. Wherever possible, the same reference numbers will be used in the drawings and the description to refer to the same or like parts.

[0048] The foregoing and other technical contents, features, and effects of this disclosure will be clearly presented in the following detailed description of the embodiments with reference to the accompanying drawings. The directional terms mentioned in the following embodiments, such as "up," "down," "front," "back," "left," and "right," are only for reference to the directions in the accompanying drawings. Therefore, the directional terms used are for illustrative purposes and not for limiting this disclosure. Furthermore, in the following embodiments, the same or similar elements will be referred to by the same or similar reference numerals.

[0049] Figures 1 to 4 This is a schematic diagram illustrating the manufacturing process of a packaging structure according to an embodiment of the present disclosure. Please refer to [the diagram first]. Figure 1 In some embodiments, the fabrication process of the packaging structure may include the following steps. First, provide, for example... Figure 1 The fabrication apparatus 100 shown includes a mold 110 and at least one spring pin (shown as two spring pins 120a and 120b, but not limited thereto). In some embodiments, the mold 110 may include a cavity S1 and an injection port 116, wherein the cavity S1 is used to accommodate the semiconductor device 201, and the injection port 116 is used to inject molding compound (such as...) Figure 2 The molding compound 230 shown is injected into the cavity S1. In one embodiment, the mold 110 may include an upper mold 112 and a lower mold 114. The lower mold 114 is used to receive the bottom surface of the semiconductor device 201 (e.g., the bottom surface of the substrate 210 of the semiconductor device 201), while the upper mold 112 is located above the semiconductor device 201, so that a hollow cavity S1 is formed between the upper mold 112 and the lower mold 114. In this embodiment, the injection port 116 may be provided in the upper mold 112, but this embodiment is not limited thereto. In other embodiments, the injection port 116 may also be provided in the lower mold 114 or other suitable locations, as long as an appropriate amount of molding compound can be injected into the cavity S1.

[0050] In some embodiments, the semiconductor device 201 can include a substrate 210 and a chip 220 disposed on the substrate 210, where the chip 220 can be attached to the substrate upper surface 212 via an adhesive layer 270. The adhesive layer 270 can include a die attach film (DAF) or other suitable adhesive layer. In the present embodiment, the chip 220 can include an active surface 222 and a back surface 224 opposite the active surface 222. The chip 220 is attached to the substrate 110 with the back surface 224 and with the active surface 222 facing away from the substrate 210 to be electrically connected to the substrate 210 by wire bonding, that is, the semiconductor device 201 of the present embodiment is connected between the substrate 210 and the active surface 222 of the chip by the wire 240. In an embodiment, the semiconductor device 201 can further include passive elements 250 (e.g., resistors, capacitors, etc.) or other electronic elements, which can be disposed on the substrate 210 together with the chip 220.

[0051] In some embodiments, a pogo pin (shown as two pogo pins 120a, 120b, but not limited thereto) can be disposed in the mold cavity S1 to be directed toward the surface 1121 of the semiconductor device 201. Also, the top end of the pogo pin 120a, 120b can be freely retractable to protrude from the surface 1121. In an embodiment, the pogo pin 120a, 120b can include a pin body 122a, 122b and a spring 124a, 124b connected between the pin body 122a, 122b and the surface 1121, and in the state that the pogo pin 120a, 120b is not forced, the top end of the pin body 122a, 122b can protrude from the surface 1121, so that the top end of the pin body 122a, 122b is adapted to press the spring 124a, 124b inward in the direction of the surface 1121 under external force. For example, the pogo pin 120a, 120b can be a pogo pin, but the present disclosure is not limited thereto.

[0052] Next, please refer to Figure 2The semiconductor device 201 is disposed in the cavity S2 of the mold 110, and the pogo pins 120a, 120b abut against the upper surface of the semiconductor device 201. In this embodiment, the manufacturing apparatus 100 includes a first pogo pin 120a and a second pogo pin 120b. Specifically, the first pogo pin 120a is disposed in the central region of the surface 1121 and corresponds to the chip 220, and the second pogo pin 120b is disposed in the peripheral region of the surface 1121 and is located beside the chip 220. The length L2 of the second pogo pin 120b is substantially greater than the length L1 of the first pogo pin 120a. When the semiconductor device 201 is disposed in the cavity S1, the first pogo pin 120a abuts against the active surface 222 of the chip 220, and the second pogo pin 120b abuts against the upper surface 212 of the substrate. However, the present disclosure is not limited thereto. In other embodiments, the manufacturing apparatus 100 can have only the pogo pin 120a, which abuts against the active surface 222 of the chip 220. Alternatively, the manufacturing apparatus 100 can have more pogo pins to abut against different height surfaces of the semiconductor device 201, respectively.

[0053] Next, the molding compound 230 is injected into the cavity S1 through the injection port 116 until the cavity S1 is filled, so that the molding compound 230 covers the semiconductor device 201 and surrounds the pogo pins 120a, 120b. In this way, the molding compound 230 can protect the semiconductor device 201 from being damaged by moisture or contamination from the external environment. In an embodiment, the molding compound 230 can include an epoxy molding compound (EMC), but the present disclosure is not limited thereto.

[0054] Next, please refer to Figure 3 After the molding compound 230 is cured, the semiconductor device 201 encapsulated by the molding compound 230 can be removed from the mold 110 to form a semiconductor device 201 as shown in FIG. 2B. Figure 3The encapsulation structure is shown, wherein the molding compound 230 of the encapsulation structure is disposed on the substrate 210 and encapsulates at least the chip 220. In the present embodiment, since the molding compound 230 encapsulates the semiconductor device 201 by surrounding the first ejection pin 120a and the second ejection pin 120b, the molding compound 230 formed by the manufacturing apparatus 100 can include a first opening 232 and a second opening 234 corresponding to the first ejection pin 120a and the second ejection pin 120b, respectively, wherein the first opening 232 extends from the top surface 231 of the molding compound 230 to the active surface 222 of the chip 220, and the second opening 234 is located beside the chip 220 and extends from the top surface 231 of the molding compound 230 to the bottom surface 233 of the molding compound 230 (or to the upper surface 212 of the substrate 210). In an embodiment where the manufacturing apparatus 100 only has the first ejection pin 120a, the molding compound 230 can correspond to include only the first opening 232 extending from the top surface 231 of the molding compound 230 to the active surface 222 of the chip 220. In other words, the number and location of the openings of the molding compound 230 correspond to the number and location of the ejection pins of the manufacturing apparatus 100, respectively.

[0055] In this configuration, the depths of the first opening 232 and the second opening 234 can be measured by a distance measuring device such as a 3D laser measuring instrument to obtain the distance D1 from the top surface 231 of the molding compound 230 to the active surface 222 of the chip 220 and the distance D2 from the top surface 231 of the molding compound 230 to the bottom surface 233 of the molding compound 230. Then, the light-transmissive adhesive 260 can be disposed on the top surface 231 of the molding compound 230 and fill the first opening 232 and the second opening 234 to form the encapsulation structure 200 as shown. Figure 4 Figure 4 In an embodiment, the light-transmissive adhesive 260 can include an optical clear adhesive (OCA) or other suitable light-transmissive adhesive.

[0056] In this way, the encapsulation structure formed by the manufacturing apparatus 100 can measure the thickness of the molding compound 230 above the chip 220 (i.e., the distance D1) and the maximum thickness of the molding compound 230 (i.e., the distance D2) during the manufacturing process without the need for drilling and measuring after the completion of the encapsulation structure or obtaining the values by estimation. Therefore, the manufacturing apparatus 100 of the present embodiment can effectively improve the detection efficiency and accuracy of the encapsulation structure.

[0057] Figure 5 ​is a component block diagram of a manufacturing apparatus of a packaging structure according to an embodiment of the present disclosure. It must be noted that the manufacturing apparatus 100 of the packaging structure of the present embodiment is similar to the manufacturing apparatus 100 of the foregoing embodiments, and thus the present embodiment adopts the component designations and some contents of the foregoing embodiments, wherein the same designations are used to represent the same or similar components, and the same technical contents are omitted. For the omitted contents, reference can be made to the foregoing embodiments, and the present embodiment will not be repeated. The following will describe the differences between the manufacturing apparatus 100 of the present embodiment and the manufacturing apparatus 100 of the foregoing embodiments.

[0058] Please refer to Figure 2 and Figure 5 In the present embodiment, the manufacturing apparatus 100 can further include a sensor 130 and a processor 140 coupled to the sensor 130. The sensor 130, for example, is a sensing element for measuring distance change, and can be coupled to the elastic members 124a, 124b of the pogo pins 120a, 120b, respectively, to sense the deformation amount of the elastic members 124a, 124b when the needle bodies 122a, 122b abut against the upper surfaces of the semiconductor devices 201 (e.g., the active surfaces 222 of the chips 220 and the upper surfaces 212 of the substrates), and the processor can calculate the distances D1, D2 from the surface 1121 of the mold 110 (which can also be regarded as the upper surface of the molding compound 230) to the upper surfaces of the semiconductor devices 200 (e.g., the active surfaces 222 of the chips 220 and the upper surfaces 212 of the substrates) according to the deformation amount of the elastic members 124a, 124b. In this way, the manufacturing apparatus 100 can measure the thickness of the molding compound 230 above the chips 220 (i.e., the distance D1) and the maximum thickness of the molding compound 230 (i.e., the distance D2) when the pogo pins 120a, 120b abut against the semiconductor devices 201, and does not need to use additional distance measuring devices for measurement, thereby further improving the detection efficiency and accuracy of the packaging structure 200.

[0059] Figure 6 is a working situation diagram of a manufacturing apparatus of a packaging structure according to an embodiment of the present disclosure. It must be noted that the manufacturing apparatus 100 of the packaging structure of the present embodiment is similar to the manufacturing apparatus 100 of the foregoing embodiments, and thus the present embodiment adopts the component designations and some contents of the foregoing embodiments, wherein the same designations are used to represent the same or similar components, and the same technical contents are omitted. For the omitted contents, reference can be made to the foregoing embodiments, and the present embodiment will not be repeated. The following will describe the differences between the manufacturing apparatus 100 of the present embodiment and the manufacturing apparatus 100 of the foregoing embodiments.

[0060] In the present embodiment, the mold 110 of the manufacturing apparatus 100 can include a plurality of working units 1101, 1102. The present embodiment only shows two working units 1101, 1102 for illustration, but is not limited thereto. In the present embodiment, the substrate 210 of the semiconductor device can carry a plurality of chips 220, which respectively correspond to the plurality of working units 1101, 1102. In this way, the manufacturing apparatus 100 can encapsulate the plurality of chips 220 in batches at one time, so as to simultaneously form a plurality of packaging structure units 2001, 2002 connected to each other. Then, the plurality of packaging structure units 2001, 2002 are separated by cutting along the cutting line SL, so as to form a plurality of packaging structures (for example, the packaging structure 200 shown in the figure) independent of each other. Figure 4 In the present embodiment, the pogo pin 120a, 120b can be arranged in one of the plurality of working units 1101, 1102 (for example, the working unit 1101, but is not limited thereto), so as to measure one of the plurality of packaging structure units 2001, 2002 (for example, the packaging structure unit 2001, but is not limited thereto) manufactured in batches, and then the pogo pin 120a, 120b can be used to sample the thickness (i.e., the distance D1) of the molding compound 230 above the chip 220 and the maximum thickness (i.e., the distance D2) of the molding compound 230 of the packaging structure 200 formed in the batch. In other possible embodiments, the present disclosure can randomly arrange a plurality of pogo pins 120a, 120b in different working units for sampling measurement of the batch, that is, the number and position of the pogo pins 120a, 120b in the present disclosure can be determined according to the required measurement accuracy.

[0061] In summary, the manufacturing apparatus of the present disclosure is arranged with a pogo pin on the inner surface of the mold. In this way, when the semiconductor device is arranged in the cavity of the mold for encapsulation, the pogo pin will abut against the upper surface of the semiconductor device, so that the thickness of the molding compound above the chip and / or the maximum thickness of the molding compound can be obtained by the opening depth of the molding compound caused by the pogo pin or by the extension and retraction amount of the elastic member of the pogo pin. Therefore, in such a configuration, the packaging structure formed by the manufacturing apparatus of the present disclosure can measure the above thickness information during the manufacturing process, without the need for drilling and measuring after the completion of the packaging structure, or only being able to obtain it in a way related to the size of the product (such as the semiconductor device) and the mold. Therefore, the manufacturing apparatus of the present embodiment can effectively improve the detection efficiency and accuracy of the packaging structure.

[0062] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present disclosure, and are not intended to limit the present disclosure; although the present disclosure has been described in detail with reference to the above embodiments, those skilled in the art should understand that the technical solutions recorded in the above embodiments can still be modified, or some or all of the technical features can be replaced by equivalents; and these modifications or replacements do not make the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present disclosure.

Claims

1. A device for manufacturing a packaging structure, characterized in that, include: A mold includes a cavity for receiving a semiconductor device and an injection port for injecting molding compound into the cavity; At least one spring pin is disposed in the cavity to face the surface of the semiconductor device and includes a pin body and an elastic member connecting the pin body and the surface, wherein the tip of the at least one spring pin is telescopically protruding from the surface, and when the semiconductor device is disposed in the cavity, the at least one spring pin abuts against the upper surface of the semiconductor device, and the molding compound injected into the cavity covers the semiconductor device and surrounds the at least one spring pin to form an encapsulation structure; as well as A sensor, coupled to the elastic element, senses the amount of deformation of the elastic element when the needle body abuts against the upper surface of the semiconductor device.

2. The equipment for manufacturing the packaging structure according to claim 1, characterized in that, It also includes a processor coupled to the sensor to calculate the distance from the surface to the upper surface of the semiconductor device based on the amount of deformation.

3. The equipment for manufacturing the packaging structure according to claim 1, characterized in that, The at least one spring pin includes a first spring pin disposed in the central region of the surface and a second spring pin disposed in the peripheral region of the surface, wherein the length of the second spring pin is greater than the length of the first spring pin.

4. The equipment for manufacturing the packaging structure according to claim 3, characterized in that, The semiconductor device includes a substrate and a chip disposed on the substrate, and the upper surface of the semiconductor device includes the active surface of the chip. When the semiconductor device is disposed in the cavity, the first spring pin abuts against the active surface.

5. The equipment for manufacturing the packaging structure according to claim 4, characterized in that, The upper surface of the semiconductor device includes the upper surface of the substrate of the substrate. When the semiconductor device is disposed in the cavity, the second spring pin is located next to the chip and abuts against the upper surface of the substrate.

6. A packaging structure manufactured using the packaging structure manufacturing equipment as described in claim 1, characterized in that, include: Substrate; A chip disposed on the substrate and including an active surface facing away from the substrate; A molding compound disposed on the substrate and encapsulating the chip, wherein the molding compound includes a first opening and the first opening extends from the top surface of the molding compound to the active surface of the chip; as well as A translucent adhesive material is used to fill the first opening.

7. The packaging structure according to claim 6, characterized in that, The molding compound also includes a second opening, which is located next to the chip and extends from the top surface to the bottom surface of the molding compound.

8. The packaging structure according to claim 7, characterized in that, The light-transmitting adhesive is disposed on the top surface of the molding compound and fills the first opening and the second opening.

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