An epoxy resin potting adhesive for electronic components and a preparation method thereof

CN116694279BActive Publication Date: 2026-02-27ANHUI ZHONGBO NEW MATERIALS CO LTD
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Patent Information

Application Number
CN202310714617.9
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2023-06-16
Publication Date
2026-02-27
Estimated Expiration
2043-06-16

AI Technical Summary

Technical Problem

Traditional epoxy resin potting processes are prone to generating air bubbles and uneven mixing, resulting in inconsistent material properties and poor degassing and wetting effects.

Method used

The mixture of resin and curing agent components is ultrasonically treated, antioxidants and modified fillers are added, nano-silica is used to improve compatibility, and ultrasonic treatment is applied to impregnate the infused material to improve uniformity and impact resistance.

Benefits of technology

This process achieves uniform mixing of materials, reduces bubble formation, improves the antioxidant properties and mechanical strength of the potting compound, shortens the impregnation time, and enhances the potting effect.

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Abstract

The application discloses an epoxy resin potting adhesive for electronic components and a preparation method thereof, and relates to the technical field of potting adhesives.The application comprises a resin component and a curing agent component, wherein the resin component comprises bisphenol A type epoxy resin, active diluent and purple paste; and the curing agent component comprises methylhexahydrophthalic anhydride, antioxidant, modified filler and dodecyl triethyl ammonium bromide.The self-made antioxidant and modified filler are added to improve the impact strength and oxidation resistance of the material, and the ultrasonic treatment is introduced in the preparation process of the resin component and the curing agent component and the use process of the potting adhesive to avoid the generation of air bubbles due to stirring, shorten the infiltration time, improve the infiltration effect, and reduce the decline of the material performance caused by uneven potting.
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Citation Information

Patent Citations

  • Epoxy resin encapsulation adhesive and use thereof

    CN101372608A

  • Epoxy resin embedding glue and method for producing the same

    CN101508825A