A method and system for detecting defects in a copper-plated board stack, and a storage medium

Abstract

The embodiment of the application discloses a copper-plated plate stacking defect detection method and system, and a storage medium, the method comprising: collecting a to-be-detected image; judging whether two adjacent clamping areas on a hanger in the to-be-detected image clamp copper-plated plates; if the two adjacent clamping areas on the hanger in the to-be-detected image clamp copper-plated plates, judging whether there is a copper-plated plate stacking defect according to images of the two adjacent clamping areas on the hanger. The application can quickly and effectively detect whether there is a copper-plated plate stacking defect on the hanger and the defect type, reduce material scratches caused by stacking, and improve the yield. Moreover, the application can realize 24-hour automatic detection of stacking defects on a production line without manual inspection, thereby reducing labor costs.

Description

Technical Field

[0001] The present invention relates to the field of circuit board manufacturing technology, and in particular to a method, system and storage medium for detecting defects in copper-plated board stacking. Background Technology

[0002] Double Vertical Continuity Plating (DVCP) is used for copper plating on circuit boards and is widely used in printed circuit board manufacturing processes. Before plating, the copper-plated boards need to be placed on racks. However, due to improper placement or rack gripper malfunctions, copper-plated boards in adjacent rack areas on the same rack may overlap. This overlap can lead to scratches and other problems. Therefore, it is necessary to detect overlap defects on the production line.

[0003] The existing method for detecting defects in copper-plated sheet stacking is through manual inspection. However, this method is not only inefficient and inaccurate, but also cannot achieve automatic detection of stacking defects on the production line 24 hours a day. Furthermore, at least two people are required to inspect the double-row vertical copper plating lines, resulting in high costs.

[0004] The above problems urgently need to be solved. Summary of the Invention

[0005] To address the related technical problems, this invention provides a method, system, and storage medium for detecting defects in copper-plated sheet stacks, thereby resolving the issues mentioned in the background section.

[0006] To achieve the above objectives, the embodiments of the present invention adopt the following technical solutions:

[0007] In a first aspect, embodiments of the present invention provide a method for detecting defects in copper-plated sheet stacks, comprising:

[0008] Acquire images to be detected, wherein the images to be detected include images of two adjacent columns of clamping areas on the hanger;

[0009] Determine whether two adjacent clamping areas on the hanger in the image to be detected both clamp copper-plated plates;

[0010] If two adjacent columns of clamping areas on the hanger in the image to be detected both hold copper-plated plates, then the presence of a copper-plated plate stacking defect can be determined based on the images of the two adjacent columns of clamping areas on the hanger.

[0011] Since the acquired image to be inspected includes images of two adjacent clamping areas on the rack, it is possible to determine whether both adjacent clamping areas on the rack are holding copper-plated plates. If the determination result is that not both adjacent clamping areas on the rack are holding copper-plated plates, then stacking defects are unlikely to occur, and subsequent copper-plated plate stacking defect detection steps are unnecessary. Only when the determination result is that both adjacent clamping areas on the rack in the image to be inspected are holding copper-plated plates will the presence of copper-plated plate stacking defects be determined based on the images of the two adjacent clamping areas on the rack. This copper-plated plate stacking defect detection method can quickly and effectively detect the presence of copper-plated plate stacking defects on the rack by using an image to be inspected that includes images of two adjacent clamping areas on the rack, reducing material scratches caused by stacking, allowing for timely rack repair, and improving productivity.

[0012] As an optional implementation, determining whether there is a copper plating board stacking defect based on the images of two adjacent clamping areas on the hanger includes:

[0013] Identify the outline of the copper-plated plate in the image of the two adjacent clamping areas on the hanger, and determine whether there is a copper-plated plate stacking defect based on the data of the copper-plated plate outline.

[0014] The image processing method for the adjacent clamping areas on the hanger is to identify the outline of the copper plate. The copper plate outline data can be used to quickly determine whether there is a stacking defect in the copper plate of the adjacent clamping areas on the hanger.

[0015] As an optional implementation, determining whether there is a copper plating board stacking defect based on the data of the copper plating board outline further includes:

[0016] The type of copper plating board stacking defect is determined based on the data of the copper plating board outline, wherein the type of copper plating board stacking defect includes full stacking and single-row stacking.

[0017] The type of copper plating board stacking defect is determined by identifying the outline data of the copper plating boards in the adjacent clamping areas of the image on the hanger. The type of stacking defect allows for quick identification of the cause. For example, if the defect is a full stack, the cause may be incorrect loading, requiring inspection of the loading process to quickly resolve the issue. If the defect is a single-column stack, the cause may be a problem with the clamps holding the copper plating boards on the hanger, requiring inspection of these clamps to quickly resolve the stacking defect.

[0018] As an optional implementation, determining whether there is a copper plating sheet stacking defect based on the data of the copper plating sheet outline includes:

[0019] Based on the data of the copper-plated plate contour, determine whether there are gaps between the copper-plated plate contours.

[0020] If there are gaps between the outlines of the copper-plated plates, it is determined that there is no defect in the stacking of copper-plated plates.

[0021] If there are no gaps between the outlines of the copper-plated plates, it is determined that there is a defect in the stacking of copper-plated plates.

[0022] By judging whether there are gaps between the outlines of copper-plated plates, it is possible to quickly determine whether there are defects in the stacking of copper-plated plates, reduce problems such as material scratches caused by stacking, and repair the rack in a timely manner to improve productivity.

[0023] As an optional implementation, determining the type of copper plating sheet stacking defects based on the data of the copper plating sheet outline includes:

[0024] Determine whether there are gaps between the copper-plated plate outlines based on the data of the copper-plated plate outlines;

[0025] If there is no gap between the outlines of the copper-plated plates, then determine whether the highest and lowest points of the two copper-plated plates in the outlines are the same.

[0026] If the highest and lowest points of two copper-plated plates in the outline are the same, then the type of copper-plated plate stacking defect is determined to be full stacking.

[0027] First, based on the data of the copper-plated board outline, determine whether there is a gap between the copper-plated board outlines. If there is no gap between the copper-plated board outlines, it is determined that there is a copper-plated board stacking defect. Then, further determine whether the highest and lowest points of the two copper-plated boards in the outline are the same. If the highest point data of the two copper-plated boards are the same and the lowest point data of the two copper-plated boards are also the same, it can be determined that neither copper-plated board is skewed. If there is a copper-plated board stacking defect and neither copper-plated board is skewed, the stacking defect type can be quickly and accurately determined to be full stacking. The cause of full stacking defect may be incorrect loading. At this time, the loading process of the copper-plated boards can be checked to quickly solve the copper-plated board stacking defect.

[0028] As an optional implementation, the step of determining whether the highest and lowest points corresponding to two copper-plated plates in the copper-plated plate outline are the same if there is no gap between the copper-plated plate outlines further includes:

[0029] If the highest and lowest points of two copper-plated plates in the outline are different, the type of copper-plated plate stacking defect is determined to be single-row stacking.

[0030] If the lowest point of the copper plate outline is determined, then the copper plate at the lowest point is the copper plate in the abnormal clamping state in the adjacent two columns of clamping area, and the other copper plate is the copper plate in the normal clamping state in the adjacent two columns of clamping area.

[0031] Determine whether the upper side length of the copper-plated plate in the normal clamping state and the copper-plated plate in the abnormal clamping state that do not overlap after overlapping is greater than the lower side length that does not overlap.

[0032] If the copper-plated board in the normal clamping state overlaps and intersects with the copper-plated board in the abnormal clamping state, and the length of the upper side that does not overlap is less than the length of the lower side that does not overlap, then when the copper-plated board in the abnormal clamping state is the left copper-plated board in the outline of the copper-plated board, the type of the single-column stack is determined to be the upper left stack; when the copper-plated board in the abnormal clamping state is the right copper-plated board in the outline of the copper-plated board, the type of the single-column stack is determined to be the upper right stack.

[0033] If the copper-plated board in the normal clamping state overlaps and intersects with the copper-plated board in the abnormal clamping state, and the upper side length of the non-overlapping side length is greater than the lower side length of the non-overlapping side length, then when the copper-plated board in the abnormal clamping state is the left copper-plated board in the outline of the copper-plated board, the type of the single-column stack is determined to be a lower left stack; when the copper-plated board in the abnormal clamping state is the right copper-plated board in the outline of the copper-plated board, the type of the single-column stack is determined to be a lower right stack.

[0034] The above process can quickly identify copper-plated boards in abnormal or normal clamping states in adjacent clamping areas on the rack, and also quickly determine the specific type of a single stack. Based on the specific type of the single stack, users can quickly locate the faulty gripper in adjacent clamping areas on the rack, thereby enabling rapid replacement or repair of faulty grippers, resolving copper-plated board stacking defects, and reducing material scratches caused by stacking.

[0035] As an optional implementation, the step of determining whether two adjacent clamping areas on the hanger in the image to be detected both clamp copper-plated plates further includes:

[0036] Obtain the hanger identification information in the image to be detected, and obtain the clamping information of the hanger based on the hanger identification information;

[0037] If the clamping information indicates that both adjacent clamping areas on the hanger are clamped, then it is determined whether both adjacent clamping areas on the hanger in the image to be detected are clamping copper-plated plates.

[0038] The clamping information of the hanger is obtained based on the hanger identification information. The judgment of whether both adjacent clamping areas on the hanger in the image to be inspected are clamped only occurs when the clamping information indicates that both adjacent clamping areas on the hanger are clamped with copper-plated plates. Since copper-plated plate stacking defects do not occur when the clamping information indicates that not both adjacent clamping areas on the hanger are clamped, there is no need to further judge whether both adjacent clamping areas on the hanger in the image to be inspected are clamped with copper-plated plates. By setting the above pre-judgment step for hanger clamping information, the number of subsequent invalid judgment processes is reduced, and the detection efficiency of copper-plated plate stacking defects is improved.

[0039] Secondly, embodiments of the present invention provide a copper-plated sheet stack defect detection system, which employs the copper-plated sheet stack defect detection method described in any one of the embodiments of the first aspect above, including:

[0040] An image acquisition module is used to acquire an image to be detected, wherein the image to be detected includes images of two adjacent clamping areas on the hanger;

[0041] The clamping status judgment module is used to determine whether two adjacent clamping areas on the hanger in the image to be detected are both clamping copper-plated plates;

[0042] The stacking defect judgment module is used to determine whether there is a copper-plated plate stacking defect when two adjacent columns of clamping areas on the hanger are clamped in the image to be detected.

[0043] The copper-plated plate stacking defect detection system, which includes an image acquisition module, a clamping status judgment module, and a stacking defect judgment module, can quickly and effectively detect whether there are copper-plated plate stacking defects on the rack, reduce material scratches caused by stacking, and allow for timely rack repair, thereby improving productivity.

[0044] As an optional implementation, the copper-plated sheet stack defect detection system further includes:

[0045] The clamping information acquisition module is used to acquire the bracket identification information in the image to be detected, and to acquire the clamping information of the bracket according to the bracket identification information. When the clamping information indicates that both adjacent clamping areas on the bracket are clamped, the clamping status judgment module is activated to determine whether both adjacent clamping areas on the bracket in the image to be detected are clamping copper-plated plates.

[0046] Since there is no copper plating stacking defect when the clamping information indicates that not both adjacent clamping areas on the hanger are clamped, there is no need to determine whether both adjacent clamping areas on the hanger in the image to be inspected are clamping copper plating. By setting up a clamping information acquisition module, subsequent invalid judgment processes are reduced, and the detection efficiency of copper plating stacking defects is improved.

[0047] Thirdly, embodiments of the present invention provide a computer-readable storage medium storing computer-executable instructions. When executed by a processor, the computer-executable instructions are used to implement the copper-plated plate stacking defect detection method described in any one of the first aspect embodiments, which can quickly and effectively detect whether there are copper-plated plate stacking defects on the hanger, and reduce material scratches caused by stacking. Attached Figure Description

[0048] To more clearly illustrate and understand the technical solutions in the embodiments of the present invention, the accompanying drawings used in the background technology and embodiment descriptions of the present invention will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the content of the embodiments of the present invention and these drawings without creative effort.

[0049] Figure 1 This is a flowchart of the copper-plated plate stack defect detection method provided in Embodiment 1 of the present invention;

[0050] Figure 2 This is a schematic diagram of the fully stacked state provided in an embodiment of the present invention;

[0051] Figure 3A This is a schematic diagram of the top-left stacked state provided in an embodiment of the present invention;

[0052] Figure 3B This is a schematic diagram of the upper right stacked state provided in an embodiment of the present invention;

[0053] Figure 3C This is a schematic diagram of the lower left stacking state provided in an embodiment of the present invention;

[0054] Figure 3D This is a schematic diagram of the lower right stacked state provided in an embodiment of the present invention;

[0055] Figure 4 This is a flowchart of the copper-plated plate stack defect detection method provided in Embodiment 2 of the present invention;

[0056] Figure 5 This is a schematic diagram of the copper-plated plate stack defect detection system provided in Embodiment 3 of the present invention;

[0057] Figure 6This is a schematic diagram of the copper-plated plate stack defect detection system provided in Embodiment 4 of the present invention. Detailed Implementation

[0058] To make the technical problems solved by the present invention, the technical solutions adopted, and the technical effects achieved clearer, the technical solutions of the embodiments of the present invention will be further described in detail below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0059] Example 1

[0060] Please refer to Figure 1 The above, Figure 1 This is a flowchart of a copper-plated board stack defect detection method according to Embodiment 1 of the present invention. As shown in the figure, the copper-plated board stack defect detection method 100 in this embodiment is applied to, but not limited to, double-row vertical copper plating lines, and includes:

[0061] S101. Acquire the image to be detected, wherein the image to be detected includes images of two adjacent columns of clamping areas on the hanger;

[0062] S102. Determine whether two adjacent columns of clamping areas on the hanger in the image to be detected both clamp copper-plated plates;

[0063] S103. If both adjacent columns of clamping areas on the hanger in the image to be detected are clamping copper-plated plates, then determine whether there is a copper-plated plate stacking defect based on the images of the adjacent columns of clamping areas on the hanger.

[0064] In this embodiment, since the acquired image to be detected includes images of two adjacent columns of clamping areas on the rack, the image to be detected can be used to determine whether both adjacent columns of clamping areas on the rack are holding copper-plated plates. When the determination result is that neither adjacent column of clamping areas on the rack is holding copper-plated plate material, the two adjacent columns of clamping areas on the rack are unlikely to have a stacking defect, and there is no need to perform the subsequent copper-plated plate stacking defect detection step. Only when the determination result is that both adjacent columns of clamping areas on the rack in the image to be detected are holding copper-plated plates will the image of the two adjacent columns of clamping areas on the rack be used to determine whether there is a copper-plated plate stacking defect.

[0065] The copper-plated plate stacking defect detection method 100 provided in this embodiment can quickly and effectively detect whether there are copper-plated plate stacking defects on the rack by using the image to be detected, which includes images of the clamping areas of two adjacent columns on the rack. This reduces problems such as material scratches caused by stacking, allows for timely rack repair, improves productivity, and enables automatic detection of stacking defects on the production line 24 hours a day, reducing labor costs.

[0066] For example, determining whether there is a copper-plated plate stacking defect based on images of two adjacent clamping areas on the hanger includes:

[0067] Identify the outline of the copper-plated plate in the image of the two adjacent clamping areas on the hanger, and determine whether there is a copper-plated plate stacking defect based on the data of the copper-plated plate outline.

[0068] In this embodiment, the image processing method for adjacent clamping areas on the hanger involves identifying the outline of the copper-plated plate. This copper-plated plate outline data allows for rapid determination of whether there is a stacking defect in the copper-plated plates in adjacent clamping areas. It is worth noting that the image processing method for adjacent clamping areas on the hanger is not limited to identifying the copper-plated plate outline; it can also identify other image information in the images of adjacent clamping areas, such as changes in the relative position of the copper-plated plate and the hanger, to determine whether a stacking defect exists.

[0069] For example, determining whether there is a copper plating board stacking defect based on the data of the copper plating board outline further includes:

[0070] The type of copper-plated sheet stacking defect is determined based on the data of the copper-plated sheet contour. The types of copper-plated sheet stacking defects include full stacking and single-row stacking. For example, each copper-plated sheet material on the hanger is clamped and fixed by two grippers (but this is not the only applicable method). Figure 2 As shown, Figure 2 This is a schematic diagram of the fully stacked state provided in an embodiment of the present invention. Figures 3A to 3D These are all schematic diagrams of single-row stacking, used as examples for ease of understanding. Whether it's a full stack or a single-row stacking defect, the explanation focuses on the stacking defects that may occur in the clamping areas of two adjacent rows on the same hanger. Figure 2 , Figures 3A to 3D In the bracket, 201 refers to the left copper-plated plate in the two adjacent clamping areas on the bracket, 202 refers to the right copper-plated plate in the two adjacent clamping areas on the bracket, taking the example that each copper-plated plate is clamped and fixed by two clamps (but not limited to this), 203 refers to the left clamp for clamping the left copper-plated plate, 204 refers to the right clamp for clamping the left copper-plated plate, 205 refers to the left clamp for clamping the right copper-plated plate, and 204 refers to the right clamp for clamping the right copper-plated plate.

[0071] In this embodiment, the type of copper plating board stacking defect is determined by identifying the outline data of the copper plating boards in the adjacent clamping areas of the image on the hanger. The type of stacking defect allows for a quick determination of the cause. For example, if the defect is a full stack, the cause is likely incorrect loading, requiring an inspection of the loading process to quickly resolve the defect. If the defect is a single-column stack, the cause is likely a problem with the clamps holding the copper plating boards on the hanger, requiring an inspection of the clamps to quickly resolve the defect.

[0072] For example, determining whether there is a copper plating board stacking defect based on the data of the copper plating board outline includes:

[0073] Based on the data of the copper-plated plate contour, determine whether there are gaps between the copper-plated plate contours.

[0074] If there are gaps between the outlines of the copper-plated plates, it is determined that there is no defect in the stacking of copper-plated plates.

[0075] If there are no gaps between the outlines of the copper-plated plates, it is determined that there is a defect in the stacking of copper-plated plates.

[0076] In this embodiment, as Figure 2 and Figures 3A to 3D As shown, regardless of whether it is a full stack or a single-row stack, as long as there is a copper plating board stacking defect, there will definitely be no gap between the outlines of the copper plating boards in the adjacent clamping areas of the rack. Conversely, when there is a gap between the outlines of the copper plating boards in the adjacent clamping areas of the rack, there will definitely be no copper plating board stacking defect. Therefore, by judging whether there is a gap between the outlines of the copper plating boards, it is possible to quickly determine whether there is a copper plating board stacking defect, thereby reducing problems such as material scratches caused by stacking, and allowing for timely repair of the rack and improvement of productivity.

[0077] For example, determining the type of copper plating sheet stacking defects based on the data of the copper plating sheet outline includes:

[0078] Determine whether there are gaps between the copper-plated plate outlines based on the data of the copper-plated plate outlines;

[0079] If there is no gap between the outlines of the copper-plated plates, then determine whether the highest and lowest points of the two copper-plated plates in the outlines are the same.

[0080] If the highest and lowest points of two copper-plated plates in the outline are the same, then the type of copper-plated plate stacking defect is determined to be full stacking.

[0081] In this embodiment, the presence of gaps between the copper-plated plate outlines is first determined based on the data of the copper-plated plate outlines. If no gaps exist, a copper-plated plate stacking defect is identified. Then, it is further determined whether the highest and lowest points corresponding to the two copper-plated plates in the outlines are the same. If the highest point data and the lowest point data are the same for both copper-plated plates, it can be determined that neither copper-plated plate is skewed. However, if both copper-plated plates have a copper-plated plate stacking defect and neither is skewed, then... Figure 2 As shown, the type of stacking defect can be quickly and accurately determined to be full stacking. The cause of full stacking defect is likely due to incorrect material loading. In this case, the loading process of copper-plated boards can be checked first to quickly resolve the stacking defect of copper-plated boards.

[0082] For example, if there is no gap between the copper-plated plate outlines, determining whether the highest and lowest points corresponding to the two copper-plated plates in the copper-plated plate outlines are the same further includes:

[0083] If the highest and lowest points of two copper-plated plates in the outline are different, the type of copper-plated plate stacking defect is determined to be single-row stacking.

[0084] If the lowest point of the copper plate outline is determined, then the copper plate at the lowest point is the copper plate in the abnormal clamping state in the adjacent two columns of clamping area, and the other copper plate is the copper plate in the normal clamping state in the adjacent two columns of clamping area.

[0085] Determine whether the upper side length of the copper-plated plate in the normal clamping state and the copper-plated plate in the abnormal clamping state that do not overlap after overlapping is greater than the lower side length that does not overlap.

[0086] If the copper-plated plate in the normal clamping state and the copper-plated plate in the abnormal clamping state overlap and intersect, and the length of the upper side that does not overlap is less than the length of the lower side that does not overlap, then when the copper-plated plate in the abnormal clamping state is the left copper-plated plate 201 in the outline of the copper-plated plate, as follows: Figure 3A As shown, the type of the single-column stack is determined to be top-left stack. When the copper-plated plate in the abnormal clamping state is the right-side copper-plated plate 202 in the outline of the copper-plated plate, as follows... Figure 3B As shown, the type of the single-column stack is determined to be top-right stack;

[0087] If the copper-plated plate in the normal clamping state and the copper-plated plate in the abnormal clamping state overlap and intersect, and the upper side length of the non-overlapping portion is greater than the lower side length of the non-overlapping portion, then when the copper-plated plate in the abnormal clamping state is the left copper-plated plate 201 in the outline of the copper-plated plate, as follows: Figure 3C As shown, the type of the single-column stack is determined to be a lower left stack. When the copper-plated plate in the abnormal clamping state is the right-side copper-plated plate 202 in the outline of the copper-plated plate, as follows... Figure 3DAs shown, the type of the single-column stack is determined to be bottom right stack.

[0088] The above process not only allows for the rapid identification of copper-plated boards in abnormal and normal clamping states within adjacent clamping areas of the rack, but also quickly determines the specific type of a single-column stack. Based on this type, the user can quickly locate the faulty gripper position within the adjacent clamping areas of the rack. Specifically, if the single-column stack type is upper left stack, such as... Figure 3A As shown, the faulty gripper in the adjacent two columns of clamping areas on the hanger can be directly located as the right gripper 204 of the copper-plated plate in an abnormal clamping state; if the single-column stack type is upper right stack, such as Figure 3B As shown, the faulty gripper in the adjacent two columns of clamping areas on the hanger can be directly located as the left gripper 205 of the copper-plated board in an abnormal clamping state; if the single-column stack type is the lower left stack, such as Figure 3C As shown, the faulty gripper in the adjacent two columns of clamping areas on the hanger can be directly located as the left gripper 203 of the copper-plated plate in an abnormal clamping state; if the single-column stack type is right-lower stack, such as Figure 3D As shown, the faulty gripper in the adjacent two columns of clamping areas on the hanger can be directly located as the right gripper 206 of the copper-plated board that is holding it in an abnormal clamping state. After locating the position of the faulty gripper in the adjacent two columns of clamping areas on the hanger, the faulty gripper can be quickly replaced or repaired, solving the problem of copper-plated board stacking defects and reducing material scratches caused by stacking. The fault of the gripper includes, but is not limited to, insufficient clamping force or gripper loosening.

[0089] For example, in specific applications, neural network models can be established for various types of stacking defects. After identifying the outline of the copper-plated plate in the adjacent clamping areas of the rack in the image, the neural network model can quickly identify the type of stacking defect in the adjacent clamping areas of the rack. This can quickly and effectively detect whether there are copper-plated plate stacking defects on the rack, reduce material scratches caused by stacking, and allow for timely rack repair, improving productivity. Moreover, it can achieve automatic detection of stacking defects on the production line 24 hours a day, reducing labor costs.

[0090] Example 2

[0091] like Figure 4 As shown, Figure 4 This is a flowchart of a copper plating laminate stack defect detection method provided in Embodiment 2 of the present invention. As shown in the figure, the copper plating laminate stack defect detection method 400 in this embodiment is applied to, but not limited to, double-row vertical copper plating lines, and includes:

[0092] S401. Acquire the image to be detected, wherein the image to be detected includes images of two adjacent columns of clamping areas on the hanger and hanger identification information;

[0093] S402. Obtain the hanger identification information in the image to be detected, and obtain the clamping information of the hanger based on the hanger identification information;

[0094] S403. If the clamping information indicates that both adjacent clamping areas on the hanger have clamped materials, then proceed to step S404.

[0095] S404. Determine whether two adjacent columns of clamping areas on the hanger in the image to be detected both clamp copper-plated plates;

[0096] S405. If both adjacent columns of clamping areas on the hanger in the image to be detected are clamping copper-plated plates, then determine whether there is a copper-plated plate stacking defect based on the images of the adjacent columns of clamping areas on the hanger.

[0097] In this embodiment, the clamping information of the hanger is obtained based on the hanger identification information. The judgment of whether both adjacent clamping areas on the hanger in the image to be inspected are clamped is only performed when the clamping information indicates that both adjacent clamping areas on the hanger are clamped with copper-plated plates. Since copper-plated plate stacking defects do not occur when the clamping information indicates that not both adjacent clamping areas on the hanger are clamped, there is no need to further judge whether both adjacent clamping areas on the hanger in the image to be inspected are clamped with copper-plated plates. By setting the above-mentioned pre-judgment step of hanger clamping information, the subsequent invalid judgment process is reduced, and the detection efficiency of copper-plated plate stacking defects is improved. In this embodiment, since the acquired image to be detected includes images of two adjacent columns of clamping areas on the rack, the image to be detected can be used to determine whether both adjacent columns of clamping areas on the rack are holding copper-plated plates. When the determination result is that neither adjacent column of clamping areas on the rack is holding copper-plated plate material, the two adjacent columns of clamping areas on the rack are unlikely to have a stacking defect, and there is no need to perform the subsequent copper-plated plate stacking defect detection step. Only when the determination result is that both adjacent columns of clamping areas on the rack in the image to be detected are holding copper-plated plates will the image of the two adjacent columns of clamping areas on the rack be used to determine whether there is a copper-plated plate stacking defect.

[0098] The copper-plated plate stacking defect detection method 400 provided in this embodiment can quickly and effectively detect whether there are copper-plated plate stacking defects on the rack by using the image to be detected, which includes images of the clamping areas of two adjacent columns on the rack. This reduces problems such as material scratches caused by stacking, allows for timely rack repair, improves productivity, and enables automatic detection of stacking defects on the production line 24 hours a day, reducing labor costs.

[0099] It should be noted that the specific implementation process of the copper-plated plate stack defect detection method 400 proposed in this embodiment can be found in the above embodiment 1, and its implementation principle and technical effect are the same, so it will not be repeated here.

[0100] Example 3

[0101] like Figure 5 As shown, Figure 5 This is a schematic diagram of the copper plating laminate stack defect detection system provided in Embodiment 3 of the present invention. As shown in the figure, the copper plating laminate stack defect detection system 500 in this embodiment is applied to, but not limited to, double-row vertical copper plating lines. This system adopts the copper plating laminate stack defect detection method 100 described in Embodiment 1 above, including:

[0102] Image acquisition module 501 is used to acquire an image to be detected, wherein the image to be detected includes images of two adjacent clamping areas on the hanger;

[0103] The clamping status judgment module 502 is used to determine whether two adjacent clamping areas on the hanger in the image to be detected are both clamping copper-plated plates.

[0104] The stacking defect judgment module 503 is used to determine whether there is a copper-plated plate stacking defect when two adjacent columns of clamping areas on the hanger are clamped in the image to be detected.

[0105] In this embodiment, the copper-plated plate stacking defect detection system 500, which includes an image acquisition module 501, a clamping status judgment module 502, and a stacking defect judgment module 503, can quickly and effectively detect whether there are copper-plated plate stacking defects on the rack, reduce material scratches caused by stacking, and repair the rack in a timely manner to improve productivity. Moreover, it can realize 24-hour automatic detection of stacking defects on the production line, reducing labor costs.

[0106] Example 4

[0107] like Figure 6 As shown, Figure 6 This is a schematic diagram of the copper plating laminate stack defect detection system provided in Embodiment 4 of the present invention. As shown in the figure, the copper plating laminate stack defect detection system 600 in this embodiment is applied to, but not limited to, double-row vertical copper plating lines. This system adopts the copper plating laminate stack defect detection method 200 described in Embodiment 2 above, including:

[0108] Image acquisition module 601 is used to acquire an image to be detected, wherein the image to be detected includes images of two adjacent clamping areas on the hanger and hanger identification information;

[0109] The clamping information acquisition module 602 is used to acquire the hanger identification information in the image to be detected, and acquire the clamping information of the hanger according to the hanger identification information. When the clamping information is that the clamping areas of two adjacent columns on the hanger are clamped, the clamping status judgment module is activated to determine whether the copper-plated plate is clamped in the two adjacent columns of clamping areas on the hanger in the image to be detected.

[0110] The clamping status judgment module 603 is used to determine whether two adjacent clamping areas on the hanger in the image to be detected are both clamping copper-plated plates.

[0111] The stacking defect judgment module 604 is used to determine whether there is a copper plating board stacking defect when two adjacent columns of clamping areas on the hanger are clamped in the image to be detected.

[0112] Since there is no copper plating stacking defect when the clamping information indicates that not both adjacent clamping areas on the hanger are clamped, there is no need to determine whether both adjacent clamping areas on the hanger in the image to be inspected are clamping copper plating. By setting up a clamping information acquisition module, subsequent invalid judgment processes are reduced, and the detection efficiency of copper plating stacking defects is improved.

[0113] In this embodiment, the copper-plated plate stacking defect detection system 600, which includes an image acquisition module 601, a clamping information acquisition module 602, a clamping status judgment module 603, and a stacking defect judgment module 604, can quickly and effectively detect whether there are copper-plated plate stacking defects on the rack, reduce material scratches caused by stacking, and repair the rack in a timely manner to improve productivity. Moreover, it can realize 24-hour automatic detection of stacking defects on the production line, reducing labor costs.

[0114] Example 5

[0115] This invention provides a computer-readable storage medium storing computer-executable instructions. When executed by a processor, these instructions implement the copper-plated plate stacking defect detection method described in either Embodiment 1 or Embodiment 2. This method can quickly and effectively detect whether there are copper-plated plate stacking defects on the rack, reducing problems such as material scratches caused by stacking. It allows for timely rack repair, improving productivity, and enables automatic detection of stacking defects on the production line 24 hours a day, reducing labor costs.

[0116] It should be noted that the aforementioned readable storage medium can be implemented by any type of volatile or non-volatile storage device or a combination thereof, such as static random access memory (SRAM), electrically erasable programmable read-only memory (EEPROM), erasable programmable read-only memory (EPROM), programmable read-only memory (PROM), read-only memory (ROM), magnetic storage, flash memory, magnetic disk, or optical disk. The readable storage medium can be any available medium accessible to general-purpose or special-purpose computers.

[0117] Note that the above description is merely a preferred embodiment of the present invention and the technical principles employed. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein, and various obvious changes, readjustments, and substitutions can be made without departing from the scope of protection of the present invention. Therefore, although the present invention has been described in detail through the above embodiments, the present invention is not limited to the above embodiments, and may include many other equivalent embodiments without departing from the concept of the present invention, the scope of which is determined by the scope of the appended claims.

Claims

1. A method for detecting a defect in a copper-plated board stack, characterized by, The method comprises the following steps: acquiring an image to be detected, wherein the image to be detected comprises images of two adjacent clamping areas on a hanger; judging whether the two adjacent clamping areas on the hanger in the image to be detected clamp copper-plated plates; if the two adjacent clamping areas on the hanger in the image to be detected clamp copper-plated plates, judging whether there is a copper-plated plate stacking defect according to the images of the two adjacent clamping areas on the hanger.

2. The copper plating sheet stack defect detection method according to claim 1, characterized by, The step of judging whether there is a copper-plated plate stacking defect according to the images of the two adjacent clamping areas on the hanger comprises the following steps: identifying copper-plated plate contours of the two adjacent clamping areas in the images of the two adjacent clamping areas on the hanger, and judging whether there is a copper-plated plate stacking defect according to data of the copper-plated plate contours.

3. The copper plating sheet stack defect detection method according to claim 2, characterized by, The step of judging whether there is a copper-plated plate stacking defect according to the data of the copper-plated plate contours further comprises the following steps: judging a type of the copper-plated plate stacking defect according to the data of the copper-plated plate contours, wherein the type of the copper-plated plate stacking defect comprises full stacking and single-column stacking; the full stacking refers to that neither of two adjacent copper-plated plates is skewed, and the two copper-plated plates exist a stacking defect of overlapping; the single-column stacking refers to that only one of the two adjacent copper-plated plates is skewed, and the two copper-plated plates exist a stacking defect of overlapping.

4. The copper plating sheet stack defect detection method according to claim 2, characterized by, The step of judging whether there is a copper-plated plate stacking defect according to the data of the copper-plated plate contours comprises the following steps: judging whether there is a gap between the copper-plated plate contours according to the data of the copper-plated plate contours; if there is a gap between the copper-plated plate contours, it is determined that there is no copper-plated plate stacking defect; if there is no gap between the copper-plated plate contours, it is determined that there is a copper-plated plate stacking defect.

5. The copper plating board stack defect detection method of claim 1, wherein, The step of judging whether the two adjacent clamping areas on the hanger in the image to be detected clamp copper-plated plates further comprises the following steps: acquiring hanger identification information in the image to be detected, and acquiring clamping information of the hanger according to the hanger identification information; if the clamping information is that the two adjacent clamping areas on the hanger have been clamped, judging whether the two adjacent clamping areas on the hanger in the image to be detected clamp copper-plated plates.

6. A defect detection system for copper-plated sheet stacks, characterized in that, The system adopts the copper-plated plate stacking defect detection method according to any one of claims 1 to 5, and comprises: an image acquisition module, configured to acquire an image to be detected, wherein the image to be detected comprises images of two adjacent clamping areas on a hanger; a clamping state judgment module, configured to judge whether the two adjacent clamping areas on the hanger in the image to be detected clamp copper-plated plates; a stacking defect judgment module, configured to, when the two adjacent clamping areas on the hanger in the image to be detected clamp copper-plated plates, judge whether there is a copper-plated plate stacking defect according to the images of the two adjacent clamping areas on the hanger.

7. The copper plated sheet stack defect detection system of claim 6, wherein, Further comprising: a clamping information acquisition module, configured to acquire hanger identification information in the image to be detected, and acquire clamping information of the hanger according to the hanger identification information, and when the clamping information is that the two adjacent clamping areas on the hanger have been clamped, the clamping state judgment module is activated to judge whether the two adjacent clamping areas on the hanger in the image to be detected clamp copper-plated plates.

8. A computer-readable storage medium, characterized in that, The computer readable storage medium stores computer execution instructions, and the computer execution instructions are used for realizing the copper plating plate stack defect detection method in any one of claims 1 to 5 when executed by the processor.

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