Method and apparatus for adjusting processor power, electronic device, storage medium

Abstract

Provided are a method and device for adjusting processor power, an electronic device, and a storage medium, the method comprising: determining temperature rise information of the processor; and when a core usage rate of the processor is greater than a first core usage rate threshold, adjusting a thermal design power (TDP) of the processor according to the temperature rise information.

Description

Technical Field

[0001] This application relates to the field of semiconductor chip technology, and more specifically, to a method and apparatus for adjusting processor power, electronic equipment, and storage medium. Background Technology

[0002] The performance of a processor is directly proportional to its operating frequency. The higher the operating frequency, the higher the power supply voltage required, and consequently, the greater the processor's power consumption.

[0003] When a processor operates at a high clock speed continuously, the chip temperature will continue to rise. Therefore, in order to ensure that the processor can operate safely and reliably, processor manufacturers often set a specific maximum power consumption value for each processor model based on its heat dissipation capacity and power consumption. This value is called Thermal Design Power (TDP).

[0004] The TDP setting helps protect the processor from damage due to overheating, but it also limits the processor's maximum performance, resulting in increased processing time when faced with a large number of tasks to be processed in a short period of time, which affects the user experience. Summary of the Invention

[0005] This application provides a method, apparatus, electronic device, and storage medium for adjusting processor power to solve the above-mentioned problems.

[0006] In a first aspect, a method for adjusting processor power is provided, the method comprising: determining temperature rise information of the processor; and adjusting the thermal design power (TDP) of the processor according to the temperature rise information when the core utilization rate of the processor is greater than a first core utilization rate threshold.

[0007] Optionally, determining the temperature rise information of the processor includes: determining the temperature of the processor and determining the temperature rise rate of the processor.

[0008] Optionally, determining the temperature rise rate of the processor includes: determining the load current of the processor; and determining the temperature rise rate of the processor based on the load current of the processor.

[0009] Optionally, the load current includes the average current of the processor in each clock cycle.

[0010] Optionally, adjusting the thermal design power (TDP) of the processor based on the temperature rise information includes: increasing the TDP of the processor from a first TDP to a second TDP when the temperature rise information indicates that the temperature of the processor is less than a first temperature threshold and the load current is less than a first current threshold.

[0011] Optionally, the method further includes: when the processor is operating at the second TDP, monitoring the number of errors occurring in the processor per unit time and the temperature of the processor; when the number of errors is greater than a first error threshold and / or the temperature of the processor is greater than a second temperature threshold, adjusting the thermal design power (TDP) of the processor from the second TDP to the first TDP.

[0012] In a second aspect, an apparatus for adjusting processor power is provided, the apparatus comprising: a determining module for determining temperature rise information of the processor; and a controlling module for adjusting the thermal design power (TDP) of the processor based on the temperature rise information when the core utilization rate of the processor is greater than a first core utilization rate threshold.

[0013] Optionally, determining the temperature rise information of the processor includes: determining the temperature of the processor, and determining the load current of the processor, and determining the temperature rise rate of the processor based on the load current of the processor.

[0014] Optionally, the control module is configured to: increase the thermal design power (TDP) of the processor from a first TDP to a second TDP when the temperature rise information indicates that the processor's temperature is less than a first temperature threshold and the load current is less than a first current threshold; the device further includes: a monitoring module, configured to monitor the number of errors occurring in the processor per unit time and the processor's temperature when the processor is operating at the second TDP; the control module is further configured to: adjust the thermal design power (TDP) of the processor from the second TDP to the first TDP when the number of errors is greater than a first error threshold and / or the processor's temperature is greater than a second temperature threshold.

[0015] Thirdly, an electronic device is provided, including a processor, the processor being configured to perform the following operations: determining temperature rise information of the processor; and adjusting the thermal design power (TDP) of the processor based on the temperature rise information when the core utilization rate of the processor is greater than a first core utilization rate threshold.

[0016] Optionally, the electronic device further includes: a temperature detection module for determining the temperature of the processor; a power management module for supplying power to the processor, the power management module including: a power conversion module for converting the input voltage into the supply voltage of the processor; a current detection module for detecting the output current of the power conversion module to obtain the load current value of the processor; and a control module for sending the load current value of the processor to the processor; the processor is configured to perform the following operations: receive the temperature of the processor sent by the temperature detection module, and receive the load current value sent by the control module, and determine the temperature rise rate of the processor based on the load current value.

[0017] Optionally, the processor is configured to perform the following operations: when the temperature rise information indicates that the processor's temperature is less than a first temperature threshold and the load current is less than a first current threshold, the processor's thermal design power (TDP) is increased from the first TDP to a second TDP; the electronic device further includes a monitoring module for monitoring the number of errors occurring in the processor per unit time; when the processor operates at the second TDP, the processor is further configured to perform the following operations: receiving the number of errors occurring in the processor per unit time sent by the monitoring module and the processor's temperature sent by the temperature detection module; when the number of errors is greater than a first error threshold and / or the processor's temperature is greater than a second temperature threshold, the processor's thermal design power (TDP) is adjusted from the second TDP to the first TDP.

[0018] Fourthly, a computer-readable storage medium is provided, the computer storage medium storing a computer program, which, when executed, implements the method described in the first aspect and any optional implementation thereof.

[0019] The method for adjusting processor power provided in this application embodiment uses the processor's core utilization rate to measure the processor's workload. When the processor needs to cope with short-term high-performance demands, it determines the timing for increasing the processor's thermal design power (TDP) based on conditions such as the processor's temperature rise information. This allows the processor to improve performance under heavy workloads, enhance user experience, and ensure that the processor can operate safely and reliably under high performance. Attached Figure Description

[0020] Figure 1 This is a schematic flowchart of a method for adjusting processor power provided in an embodiment of this application.

[0021] Figure 2 This is a schematic structural diagram of a power supply system for powering a processor, provided in an embodiment of this application.

[0022] Figure 3This is a schematic structural diagram of a device for adjusting processor power provided in an embodiment of this application.

[0023] Figure 4 This is a schematic structural diagram of the electronic device provided in the embodiments of this application. Detailed Implementation

[0024] To facilitate understanding of this application, it will be described in more detail below based on exemplary embodiments and in conjunction with the accompanying drawings. The same or similar reference numerals are used in the drawings to denote the same or similar modules. It should be understood that the drawings are merely illustrative, and the scope of protection of this application is not limited thereto.

[0025] The method provided in this application is applied to a processor to regulate its power. The processor is the core of an electronic device's computation and control, connecting various parts of the device via various interfaces and lines. It can execute instructions, programs, code sets, or instruction sets, as well as call external data, perform various functions of the electronic device, and process data. This application does not limit the specific type of processor; for example, it can be any of a central processing unit (CPU), a graphics processing unit (GPU), or a system-on-a-chip (SoC) that integrates both a CPU and a GPU.

[0026] The aforementioned processor is applied to an electronic device, which can be any of various types of computer system devices that are mobile or portable and perform wireless communication. For example, the electronic device can be a mobile phone or smartphone (e.g., an iPhone™-based phone or an Android™-based phone), a portable gaming device (e.g., Nintendo DS™, PlayStation Portable™, Gameboy Advance™, iPhone™), a laptop computer, a personal digital assistant (PDA), a portable internet device, a music player, and a data storage device, other handheld devices, and devices such as watches, in-ear headphones, pendants, and headphones. The electronic device can also be other wearable devices (e.g., electronic glasses, electronic clothing, electronic bracelets, electronic necklaces, electronic tattoos, electronic devices, smartwatches, or head-mounted displays (HMDs)).

[0027] In the semiconductor chip industry, because a large number of electronic components are integrated into a very small area, these components generate a significant amount of heat during chip operation. Therefore, the chip's heat dissipation capacity has become one of the main bottlenecks restricting the increase in chip frequency and the number of cores within a single chip. To ensure that the processor can operate reliably for extended periods, its power consumption is typically limited to a certain range to prevent hardware damage caused by excessive heat. However, limiting the processor's power consumption also imposes certain limitations on its performance.

[0028] In current designs, processor manufacturers typically set a specific maximum power consumption value for each processor model based on its heat dissipation capabilities and power characteristics. This value is called thermal design power (TDP).

[0029] The primary function of TDP (True Performance Density) is to guide the thermal design of the processor. Setting the TDP protects the processor, ensuring it maintains strong processing power while preventing damage from overheating. Simultaneously, by limiting the processor's maximum power consumption, a better balance is achieved between the cost of the cooling system and processing performance.

[0030] While TDP (True Performance Limit) settings offer the advantages mentioned above, they also limit the processor's maximum performance. In some business scenarios, such as when the processor needs to handle short-term high-performance demands while operating at its base frequency, existing processing mechanisms typically increase the processor's operating frequency beyond the base frequency to achieve greater processing power. A common practice in related technologies to increase the processor's operating frequency is to increase the processor's input voltage and / or input current. However, the higher the processor's input voltage and / or input current, the higher its power consumption. This additional power consumption during processor operation will then be converted into heat, resulting in significant heat generation from the processor.

[0031] For processors, the Thermal Design Power (TDP) mentioned earlier is essentially the red line for their power consumption. When a processor continuously operates at a frequency exceeding its base frequency, its power consumption is high. When the processor's operating power consumption approaches the maximum power consumption limited by the TDP, it will reduce power consumption by lowering the operating frequency, thus preventing the processor's power consumption from exceeding the TDP red line and avoiding damage due to overheating. However, this adjustment strategy will also affect the processor's performance and reliability, causing the processor to be unable to output power continuously and stably, further degrading the user experience.

[0032] With the development of heat dissipation technology, there are more and more ways to reduce processor temperature, and the cost of heat dissipation devices is also decreasing. This means that by lowering the processor's operating temperature, the processor can operate at higher power, thereby providing higher performance. Therefore, in related technologies, when addressing the short-term high-performance requirement mentioned earlier, the thermal design power (TDP) can be appropriately increased to raise the processor's power limit, enabling the processor to operate at stronger performance.

[0033] In related technologies, because processors cannot monitor their own power consumption in real time, it is difficult to accurately determine when to increase the Thermal Design Power (TDP). Currently, the widely adopted method in this field is to increase the TDP based on some key parameters of the processor. For example, by monitoring the processor utilization rate, when the processor utilization rate exceeds a threshold (e.g., 80%), it indicates that the processor core is nearing full load, and the margin for increasing the processor's computing power is small, which cannot meet the continued growth in performance requirements. At this time, in order to cope with the short-term demand for high performance, the TDP value can be increased to raise the upper limit of the processor's power consumption, thereby improving the processor's performance.

[0034] For example, processor temperature can be used as an important parameter when determining when to adjust TDP. By using a temperature sensor inside the processor to monitor its operating temperature, the difference between the processor's current temperature and its safe temperature threshold can be determined. When this difference is large, it indicates that the processor's temperature still has room for improvement, and the processor's power consumption limit can be increased, i.e., the TDP value can be increased to meet short-term high-performance demands. Conversely, when the difference between the processor's current temperature and its tolerable safe temperature threshold is small, it means that the processor's power consumption is already close to its current maximum power consumption. Increasing the TDP value further may cause irreversible damage to the processor.

[0035] It should be noted that the methods in the two examples above can also be combined. That is, when determining when to adjust TDP, both processor utilization and processor temperature can be considered simultaneously. When processor utilization is high and the difference between the processor temperature and the safe temperature threshold is large, the TDP value can be increased to obtain stronger processing power.

[0036] While the methods described above can determine the timing of TDP adjustment, they also have some drawbacks. First, relying on temperature sensors to detect processor temperature can lead to inaccurate temperature readings due to variations in the detection method and sensor precision. Second, in some cases, when the processor operates continuously at a high frequency, as mentioned earlier, a higher frequency means a higher input current, increasing processor power consumption and thus temperature rises more rapidly. If the processor's power limit is further increased when its temperature is already rising quickly, the processor's power consumption will quickly reach the maximum power consumption limit set by the increased TDP again. As mentioned earlier, when the processor's power consumption approaches its maximum, it will again cause the processor to reduce its frequency or shut down some cores, resulting in a poor user experience.

[0037] In view of the above problems, embodiments of this application provide a method and apparatus for adjusting processor power.

[0038] The method for adjusting processor power provided in the embodiments of this application will be described in detail below with reference to the accompanying drawings.

[0039] Figure 1 A schematic flowchart of a method for adjusting processor power according to an embodiment of this application is shown, such as... Figure 1 As shown, the method includes steps S110-S120.

[0040] In step S110, the temperature rise information of the processor is determined.

[0041] The temperature rise information may include, for example, the processor's current temperature and the processor's temperature rise rate.

[0042] The current temperature of the processor can be measured by the temperature of the processor's package or by the actual operating temperature (junction temperature) of the processor chip. This application does not limit this to any particular temperature.

[0043] It should be noted that the actual operating temperature of the processor chip is usually higher than the temperature of the package. If the temperature of the chip inside the processor exceeds the maximum junction temperature, the transistors and other components in the processor will be damaged. In other words, the junction temperature is a better indicator of the actual condition of the processor than the surface temperature of the package. Therefore, in some preferred embodiments, the current temperature of the processor can be the actual operating temperature of the processor chip.

[0044] When determining the temperature of the processor, a temperature sensor located outside the processor can be used to measure the temperature of the package casing; or, in some embodiments, the temperature sensor can be integrated inside the processor to obtain the processor's junction temperature.

[0045] In step S120, when the core utilization rate of the processor is greater than the first core utilization rate threshold, the thermal design power (TDP) of the processor is adjusted according to the temperature rise information.

[0046] As mentioned above, in related technologies, since processors cannot accurately obtain their own real-time power consumption (including the consumption of software processing instructions and hardware) during operation, the processor's operating status can only be indirectly determined by monitoring the processor's utilization rate and / or processor temperature.

[0047] Since the processor's core utilization rate can effectively reflect whether the processor's cores are currently busy, when the processor's core utilization rate exceeds a first core utilization rate threshold, it indicates that the processor's processing power is insufficient to meet short-term high-performance demands. The first core utilization rate threshold can be a fixed value, such as 80%; it can also be set based on the processor model or the performance parameters of the cooling system used to cool the processor. This application does not limit this setting.

[0048] In this embodiment of the application, the real-time power consumption of the processor can be determined by using the temperature rise information, and then the timing of adjusting the thermal design power (TDP) of the processor can be determined by using the real-time power consumption.

[0049] When the temperature rise information indicates that the processor has the conditions to adjust the thermal design power (TDP) in the current state, that is, the processor can work at a higher operating frequency to cope with a large number of pending tasks, the processor can be controlled to increase the value of the processor's thermal design power (TDP).

[0050] The method for adjusting processor power provided in this application embodiment uses the processor's core utilization rate to determine the processor's workload. When the processor needs to cope with short-term high-performance demands, it determines the timing for increasing the processor's thermal design power (TDP) based on conditions such as processor temperature rise information. This allows the processor to improve performance under heavy workloads, enhance user experience, and ensure that the processor can operate safely and reliably under high performance.

[0051] In some implementations, determining the processor's temperature rise information in step S110 above may include determining the processor's temperature and the processor's temperature rise rate.

[0052] In this embodiment, to ensure that the processor does not overheat and be damaged due to exceeding the thermal design power (TDP) limit, the processor temperature needs to be determined before increasing the TDP value. When the difference between the processor temperature and the safe temperature threshold at the current operating frequency is large, it indicates that the processor temperature still has room for improvement, and in this case, the processor power can be further increased. However, if the processor temperature is already close to the safe temperature threshold, it is not advisable to further increase the processor power.

[0053] The temperature of the aforementioned processor can be either the processor's casing temperature or the chip temperature; this application does not limit this. The processor's temperature can be obtained, for example, through a temperature sensor located externally to the processor or embedded within it. The embodiments of this application also do not limit the specific method for obtaining the processor's temperature.

[0054] The processor's temperature rise rate is an important indicator for determining whether to adjust the processor's power. As mentioned earlier, when the processor operates at a higher frequency, the processor experiences greater wear and tear, resulting in a faster temperature rise rate. If the processor's power limit is further increased at this time, the processor's power consumption will reach the maximum power consumption value limited by the increased thermal design power (TDP) again in a very short time.

[0055] Therefore, in this embodiment, when the processor needs to process a large number of tasks, the processor's temperature and temperature rise rate can be determined to decide whether the processor's power can be adjusted under the current conditions. For example, if the processor's temperature still has room for improvement, and the temperature rise rate is low, the thermal design power (TDP) can be increased to obtain stronger processing power; conversely, if the current temperature rise rate is high, the TDP should not be adjusted, otherwise the processor will reach its maximum power consumption again in a short period of time.

[0056] In some implementations, the processor's temperature rise rate can be determined based on the processor's load current. It is understood that the heat generated by the processor during operation is directly proportional to the processor's load current. That is, the higher the processor's load current, the more heat the processor generates, and the higher its temperature rise rate. Therefore, the processor's temperature rise rate can be determined by determining the processor's load current.

[0057] There are many ways to determine the processor's load current, such as using a current mirror, a coupled inductor, a series current sensing resistor, and digital sampling analysis. This application does not specifically limit the methods used.

[0058] It is understood that the output current of the power management module in the power supply system supplying power to the processor is equal to the processor's load current. Based on this, embodiments of this application provide a more easily implemented method, namely, the change in the processor's load current can be obtained by detecting the change in the output current of the processor's power management module.

[0059] The following is combined Figure 2 The power supply system shown provides a detailed explanation of the method for determining the processor's load current.

[0060] See Figure 2 The power supply system may include a power management module 21 and a processor 22 in the electronic device. The power management module 21 provides power to the processor. The power management module 21 includes a voltage conversion module 211, which converts the input voltage into an output voltage to power the processor. This input voltage can be provided by an input power source 23, such as a battery. The input terminal of the voltage conversion module 211 can be connected to the input power source 23, and the voltage conversion module 211 converts the output voltage of the input power source 23 into the voltage required by the processor. Figure 2 The voltage conversion module 211 shown is a Buck topology-based circuit. In some embodiments, the voltage conversion module 211 may also be a circuit with other topologies.

[0061] The voltage conversion module 211 includes multiple switching elements, inductors, and capacitors. Figure 1 For example, multiple switching elements include a first switching element Q1 and a second switching element Q2. The first terminal of the first switching element Q1 is connected to the input power supply 23, and the second terminal of the first switching element Q1 is connected to the first terminal of the second switching element Q2 and the first terminal of the inductor L, respectively. The second terminal of the second switching element Q2 is grounded. The second terminal of the inductor L is connected to the first terminal of the capacitor C and the processor 22, and the second terminal of the capacitor C is grounded.

[0062] When the first switching element Q1 is closed and the second switching element Q2 is open, the input power supply 23 stores energy in the inductor L, and the current flowing through the inductor L increases linearly to supply power to the processor 22 and charge the capacitor C at the same time. When the first switching element Q1 is open and the second switching element Q2 is closed, the inductor L discharges to the processor 22, and the current in the inductor L decreases linearly. At the same time, the capacitor C discharges to the processor to maintain the input current of the processor 22.

[0063] The power management module 21 may further include a control module 212, which is connected to the processor 22 and the voltage conversion module 211. The control module 212 can communicate with the processor 22 and adjust the output voltage of the voltage conversion module 211 according to the operating requirements of the processor 22. The control module 212 may be, for example, a power management integrated circuit (PMIC).

[0064] The control module 212 can be connected to the control terminals of the first switching element Q1 and the second switching element Q2. The control module 212 can receive control signals from the processor 22 and output pulse width modulation (PWM) signals to control the first switching element Q1 and the second switching element Q2, thereby adjusting the output voltage of the voltage conversion module 211. Specifically, the control module 212 can adjust the charging and discharging time of the inductor L and capacitor C by adjusting the duty cycle of the PWM signal, thereby adjusting the power supply voltage to the processor 22 and ensuring the normal operation of the processor 22.

[0065] The current sensing module 24 is used to detect the output current of the power supply system. The current sensing module 24 is also communicatively connected to the control module 212 in the power management module, enabling the current sensing module 24 to send the detected output current (i.e., the processor's load current) to the control module 212. The processor can communicate with the control module 212 to obtain the processor's load current from the control module.

[0066] There are many ways to implement the current detection module 24, and this embodiment does not limit this. For example, it can be based on any of the following methods: current mirror, coupled inductor, series resistor, or digital sampling. Figure 2 For example, Figure 2 The current sensing module 24 shown is connected in series across the inductor L of the voltage conversion module 211. By detecting the current difference across the inductor L, the output current of the power supply system can be determined. It should be understood that... Figure 2 The components and modules in the power supply system shown are examples only. Other methods that can achieve the above functions are within the protection scope of this application.

[0067] When determining the processor's temperature rise rate based on load current, a current sensing device can be used to detect the processor's load current, and the temperature rise rate can be determined based on the changes in this load current. It's understood that the processor's load current changes in real time during operation. Therefore, to reduce the computational load during current calculations, optimizations can be made to the load current acquisition process or the post-processing of the acquired real-time load current data. For example, the load current can be sampled at regular time intervals to reduce the amount of load current data measured.

[0068] However, in the above method of sampling load current at certain time intervals, the value of the time interval can have a certain impact on the accuracy of the collected data. Therefore, in order to ensure that the collected load current can accurately reflect the processor's operating state, in some implementations, the control module can be used to calculate the average current within each clock cycle, thereby determining the processor's temperature rise rate.

[0069] In some implementations, the processor's temperature rise rate can also be determined based on the processor's temperature. For example, the temperature sensor mentioned above can be used to collect the processor's temperature changes at the current moment and at a time earlier than the current moment, thereby determining the processor's temperature rise rate. Furthermore, based on the temperature rise rate, it can be determined whether to adjust the processor's power.

[0070] Since the processor's load current can accurately reflect the processor's temperature rise rate, in some embodiments, adjusting the processor's thermal design power (TDP) based on the temperature rise information in the aforementioned step S120 can be: when the temperature rise information indicates that the processor's temperature is less than a first temperature threshold and the load current is less than a first current threshold, the processor's TDP is increased from the first TDP to the second TDP.

[0071] The first temperature threshold can be a threshold determined based on the processor's safe temperature threshold. When the processor's temperature is lower than this threshold, it indicates that the processor's temperature still has room to rise; otherwise, it indicates that the processor's temperature is already close to the processor's safe temperature threshold.

[0072] The first temperature threshold can be set according to factors such as the processor's environment and heat dissipation conditions, and this application embodiment does not limit this. Taking heat dissipation conditions as an example, under good heat dissipation conditions, the first temperature threshold can be set to a higher value, such as 80% of the processor's safe temperature threshold; under poor heat dissipation conditions, the heat dissipation device cannot eliminate the heat dissipated by the processor in time. In this case, increasing the processor's thermal design power (TDP) may cause the processor's heat to accumulate and lead to overheating damage. Therefore, in this case, the first temperature threshold can be set to a lower value, such as 50% of the processor's safe temperature threshold.

[0073] The processor's load current reflects the processor's temperature rise rate, and the specific value of the first load current threshold can be set according to factors such as the processor's environment and heat dissipation conditions.

[0074] In some implementations, the first load current threshold should be set such that when the processor operates at this current, the processing capacity of the heat dissipation device matches the amount of heat generated by the processor. When the processor current exceeds this threshold, the processor temperature will continue to rise rapidly. Increasing the thermal design power (TDP) at this time will cause the processor to reach the safe temperature threshold more quickly.

[0075] Therefore, when the processor temperature is less than the first temperature threshold and the load current is less than the first current threshold, it indicates that the conditions for increasing the thermal design power (TDP) are met. The processor's TDP can be increased from the first TDP to the second TDP. The first TDP can be the processor's original preset value, and the second TDP can be determined by the processor's operating parameters, such as the amount of tasks to be processed or the processing capacity of the cooling system.

[0076] In some implementations, increasing the processor's thermal design power (TDP) from a first TDP to a second TDP leads to an increase in the processor's actual power consumption. In this case, it is also necessary to increase the processor's supply voltage to match the processor's power consumption with the second TDP. For example, when the power supply to the processor is... Figure 2 In the switching power supply shown, after increasing the processor's thermal design power (TDP), the processor's supply voltage can be increased by adjusting the duty cycle of the pulse width modulation (PWM) signals of the first and second switching elements Q1. For example, when the processor operates at a first TDP of 5W, the duty cycle of the pulse modulation signals of the switching elements is 50%, and the output voltage of the switching power supply is 2.5V. When the processor's TDP increases to 6W, the duty cycle of the pulse modulation signals of the switching elements needs to be increased to 60% to raise the output voltage of the switching power supply to 3V. This improves the processor's processing power.

[0077] In some implementations, processor reliability may be compromised when the processor operates at an increased second TDP. Therefore, after adjusting the TDP value, it is necessary to evaluate the processor's reliability at the current power level. Processor reliability can be evaluated based on the number of errors occurring per unit time and the processor's temperature.

[0078] The number of errors a processor makes per unit of time can be measured by monitoring the number of soft errors that occur within that unit of time. Soft errors, also known as soft mistakes, are errors caused by an incorrect signal or data.

[0079] In computer devices, soft errors can cause changes to instructions or data in a computer program. Soft errors are generally of two types: integrated circuit-level soft errors and system-level soft errors. Integrated circuit-level soft errors are typically caused by high-energy particles bombarding the integrated circuit. For example, radioactive atoms in the integrated circuit material may release alpha particles during decay, which then collide with the circuit. Because alpha ions carry a positive charge and energy, their impact on a memory cell can alter the value stored there. System-level soft errors are often caused by noise affecting the data being processed. The computer system interprets this noise as data bits, leading to errors in program addressing or processor code.

[0080] The methods for monitoring processor temperature have been described in detail above and will not be repeated here.

[0081] When the number of errors of the processor is greater than the first error threshold and / or the temperature of the processor is greater than the second temperature threshold, the thermal design power (TDP) of the processor is adjusted from the second TDP to the first TDP.

[0082] The second temperature threshold is similar to the first temperature threshold mentioned above, and can also be set according to factors such as the processor's environment and heat dissipation conditions. This application embodiment does not limit this. For example, the specific value of the second temperature threshold can be determined according to the quality of the heat dissipation conditions. When the heat dissipation conditions are ideal, the second temperature threshold can be set to a value close to the second safe temperature threshold when the processor is operating at the second TDP; conversely, when the heat dissipation conditions are not ideal, the second temperature threshold can be set to a smaller value to avoid overheating and damage to the processor.

[0083] When the processor is operating at the second TDP, in order to avoid overheating and damage to the processor, the thermal design power (TDP) of the processor can be adjusted from the second TDP to the first TDP if any of the above conditions are met.

[0084] It should also be noted that the method for adjusting processor power provided in this application is designed to meet short-term high-performance requirements. If the processor operates at high power for an extended period, it will accelerate processor wear and tear. Therefore, in some embodiments, the duration of processor operation at the second TDP can be monitored, or the proportion of the duration of operation at the second TDP to the total processor operating time can be monitored. If the aforementioned operating time or proportion is large, the processor can be controlled to reduce its thermal design power (TDP) to the initial first TDP.

[0085] The above text combined Figures 1-2 The method embodiments of this application are described in detail below, in conjunction with... Figures 3-4The apparatus embodiments of this application are described below. It should be understood that the descriptions of the apparatus embodiments correspond to the descriptions of the method embodiments; therefore, any parts not described in detail can be referred to the foregoing method embodiments.

[0086] Figure 3 A schematic structural diagram of a device 30 for adjusting processor power provided in an embodiment of this application. Figure 3 The device 30 includes: a determining module 31 and a control module 32.

[0087] The determination module 31 is used to determine the temperature rise information of the processor;

[0088] The control module 32 is used to adjust the thermal design power (TDP) of the processor according to the temperature rise information when the core utilization rate of the processor is greater than the first core utilization rate threshold.

[0089] Optionally, the determining module 31 is used to: determine the temperature of the processor and determine the temperature rise rate of the processor.

[0090] Optionally, determining the temperature rise rate of the processor includes: determining the load current of the processor; and determining the temperature rise rate of the processor based on the load current of the processor.

[0091] Optionally, the load current includes the average current of the processor in each clock cycle.

[0092] Optionally, the control module 32 is configured to: increase the thermal design power (TDP) of the processor from the first TDP to the second TDP when the temperature rise information indicates that the temperature of the processor is less than a first temperature threshold and the load current is less than a first current threshold.

[0093] Optionally, the device 30 further includes a monitoring module for monitoring the number of errors occurring in the processor per unit time and the temperature of the processor when the processor is operating at the second TDP.

[0094] The control module 32 is further configured to: adjust the thermal design power (TDP) of the processor from the second TDP to the first TDP when the number of errors is greater than a first error threshold and / or the temperature of the processor is greater than a second temperature threshold.

[0095] This application also provides an electronic device. Figure 4 This is a schematic diagram of the structure of the electronic device 40 provided in an embodiment of this application. Figure 4 The device 40 includes a processor 41.

[0096] The processor is configured to perform the following operations: determine the temperature rise information of the processor; and when the core utilization rate of the processor is greater than a first core utilization rate threshold, adjust the thermal design power (TDP) of the processor according to the temperature rise information.

[0097] Optionally, the electronic device further includes: a temperature detection module for determining the temperature of the processor; the processor is configured to perform the following operations: receive the temperature of the processor sent by the temperature detection module; and determine the temperature rise rate of the processor.

[0098] Optionally, the electronic device further includes: a power management module for supplying power to the processor; the power management module includes: a power conversion module for converting the input voltage into the processor's supply voltage; a current detection module for detecting the output current of the power conversion module to obtain the processor's load current value; and a control module for sending the processor's load current value to the processor. The processor is configured to perform the following operations: receive the load current value sent by the control module; and determine the processor's temperature rise information based on the load current value.

[0099] Optionally, the load current includes the average current of the processor in each clock cycle.

[0100] Optionally, the processor is configured to perform the following operations: when the temperature rise information indicates that the processor's temperature is less than a first temperature threshold and the load current is less than a first current threshold, the processor's thermal design power (TDP) is increased from a first TDP to a second TDP.

[0101] Optionally, the electronic device further includes: a monitoring module, configured to monitor the number of errors occurring in the processor per unit time; when the processor operates at the second TDP. The processor is further configured to perform the following operations: receive the number of errors occurring in the processor per unit time sent by the monitoring module and the temperature of the processor sent by the temperature detection module; when the number of errors is greater than a first error threshold and / or the temperature of the processor is greater than a second temperature threshold, adjust the thermal design power (TDP) of the processor from the second TDP to the first TDP.

[0102] This application also provides a computer-readable storage medium storing a computer program that, when executed, implements the aforementioned method steps.

[0103] In the several embodiments provided in this application, it should be understood that the disclosed systems, apparatuses, and methods can be implemented in other ways. For example, the apparatus embodiments described above are merely illustrative; for instance, the division of units is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the coupling or direct coupling or communication connection shown or discussed may be through some interfaces; the indirect coupling or communication connection between apparatuses or units may be electrical, mechanical, or other forms.

[0104] The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the units can be selected to achieve the purpose of this embodiment according to actual needs.

[0105] In addition, the functional units in the various embodiments of this application can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit.

[0106] In the above embodiments, implementation can be achieved entirely or partially through software, hardware, firmware, or any combination thereof. When implemented using software, it can be implemented entirely or partially in the form of a computer program product. The computer program product includes one or more computer instructions. When the computer program instructions are loaded and executed on a computer, all or part of the processes or functions described in the embodiments of this application are generated. The computer can be a general-purpose computer, a special-purpose computer, a computer network, or other programmable device. The computer instructions can be stored in a computer-readable storage medium or transmitted from one computer-readable storage medium to another. For example, the computer instructions can be transmitted from one website, computer, server, or data center to another website, computer, server, or data center via wired (e.g., coaxial cable, fiber optic, digital subscriber line (DSL)) or wireless (e.g., infrared, wireless, microwave, etc.) means. The computer-readable storage medium can be any available medium that a computer can read or a data storage device such as a server or data center that integrates one or more available media. The available media may be magnetic media (e.g., floppy disks, hard disks, magnetic tapes), optical media (e.g., digital video discs, DVDs) or semiconductor media (e.g., solid-state disks, SSDs), etc.

[0107] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A method for adjusting processor power, characterized in that, The method includes: Determine the temperature rise information of the processor; When the core utilization rate of the processor is greater than the first core utilization rate threshold, the thermal design power (TDP) of the processor is adjusted according to the temperature rise information. Determining the temperature rise information of the processor includes: Determine the temperature of the processor, and Determine the temperature rise rate of the processor; Determining the temperature rise rate of the processor includes: Determine the load current of the processor; The temperature rise rate of the processor is determined based on the processor's load current.

2. The method according to claim 1, characterized in that, The load current includes the average current of the processor in each clock cycle.

3. The method according to claim 1, characterized in that, The step of adjusting the thermal design power (TDP) of the processor based on the temperature rise information includes: When the temperature rise information indicates that the processor's temperature is less than a first temperature threshold and the load current is less than a first current threshold, the processor's thermal design power (TDP) is increased from the first TDP to the second TDP.

4. The method according to claim 3, characterized in that, The method further includes: When the processor operates at the second TDP, the number of errors occurring in the processor per unit time and the temperature of the processor are monitored. When the number of errors is greater than a first error threshold and / or the temperature of the processor is greater than a second temperature threshold, the thermal design power (TDP) of the processor is adjusted from the second TDP to the first TDP.

5. A device for adjusting processor power, characterized in that, The device includes: A determination module is used to determine the temperature rise information of the processor; A control module is used to adjust the thermal design power (TDP) of the processor based on the temperature rise information when the core utilization rate of the processor is greater than a first core utilization rate threshold. Determining the temperature rise information of the processor includes: Determine the temperature of the processor, and, Determine the load current of the processor, and based on the load current of the processor, determine the temperature rise rate of the processor.

6. The apparatus according to claim 5, characterized in that, The control module is used to: increase the thermal design power (TDP) of the processor from the first TDP to the second TDP when the temperature rise information indicates that the processor temperature is less than a first temperature threshold and the load current is less than a first current threshold; The device further includes: a monitoring module, used to monitor the number of errors occurring in the processor per unit time and the temperature of the processor when the processor is operating at the second TDP; The control module is further configured to: adjust the thermal design power (TDP) of the processor from the second TDP to the first TDP when the number of errors is greater than a first error number threshold and / or the temperature of the processor is greater than a second temperature threshold.

7. An electronic device, characterized in that, Includes a processor, the processor being configured to perform the following operations: Determine the temperature rise information of the processor; When the core utilization rate of the processor is greater than the first core utilization rate threshold, the thermal design power (TDP) of the processor is adjusted according to the temperature rise information. The electronic device also includes: A temperature detection module is used to determine the temperature of the processor; A power management module is used to supply power to the processor, the power management module comprising: A power conversion module is used to convert the input voltage into the power supply voltage of the processor; A current detection module is used to detect the output current of the power conversion module in order to obtain the load current value of the processor; A control module is used to send the load current value of the processor to the processor; The processor is used to perform the following operations: Receive the temperature of the processor sent by the temperature detection module, and, The system receives the load current value sent by the control module and determines the temperature rise rate of the processor based on the load current value.

8. The electronic device according to claim 7, characterized in that, The processor is configured to perform the following operations: when the temperature rise information indicates that the processor's temperature is less than a first temperature threshold and the load current is less than a first current threshold, the processor's thermal design power (TDP) is increased from the first TDP to the second TDP; The electronic device also includes a monitoring module for monitoring the number of errors that occur in the processor per unit time. When the processor operates at the second TDP, the processor is also configured to perform the following operations: receive the number of errors that occur in the processor per unit time sent by the monitoring module and the temperature of the processor sent by the temperature detection module; when the number of errors is greater than a first error threshold and / or the temperature of the processor is greater than a second temperature threshold, adjust the thermal design power (TDP) of the processor from the second TDP to the first TDP.

9. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores a computer program that, when executed, implements the method as claimed in any one of claims 1-4.

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