Electronic device including breakage detection wiring

Abstract

An electronic device including a break detection wiring is disclosed. The electronic device includes a display module including a front surface and a rear surface opposite the front surface, and including a module hole penetrating from the front surface to the rear surface, and an electronic module overlapping the module hole. The display module includes a break detection wiring including a hole wiring disposed in a hole region, and a first detection wiring and a second detection wiring of the break detection wiring connected to the hole wiring and disposed on different layers with a detection insulating layer interposed between the first detection wiring and the second detection wiring.

Description

[0001] This application is a divisional application of the invention filed on November 28, 2019, with application number 201911188724.2 and titled "Electronic device including breakage detection wiring".

[0002] Cross-reference to related applications

[0003] This application claims priority to Korean Patent Application No. 10-2018-0151886, filed on November 30, 2018, the disclosure of which is incorporated herein by reference in its entirety. Technical Field

[0004] This disclosure relates to an electronic device, and more specifically, to an electronic device with improved reliability. Background Technology

[0005] Electronic devices are activated in response to electrical signals. An electronic device may include a display module, which comprises a display panel for displaying images and / or an input detection component for sensing external input. Among various display panels, organic light-emitting display panels feature low power consumption, high brightness, and high response speed.

[0006] Some electronic devices may include electronic modules that receive external signals and / or provide output signals to external devices. These electronic modules may be coupled together with a display panel and a cover or similar object to form the electronic device. Summary of the Invention

[0007] This disclosure provides an electronic device capable of easily detecting potential cracks in a layer surrounding a hole region by including crack detection wiring disposed around a hole region where an electronic module is disposed.

[0008] An embodiment of the present invention provides an electronic device, comprising: a display module including a front surface and a rear surface opposite to the front surface, and including a module hole penetrating from the front surface to the rear surface; and an electronic module overlapping the module hole, wherein the display module includes: a display member including a substrate having a recess at least partially recessed to surround the module hole and pixels disposed on the substrate, and the display member being divided into an active region having pixels, a peripheral region adjacent to the active region, and a hole region at least partially surrounded by the active region; an input detection member disposed on the display member to detect external input, and including a detection insulating layer and a first conductive pattern and a second conductive pattern disposed on different layers, wherein the detection insulating layer is located between the first conductive pattern and the second conductive pattern; and a breakage detection wiring including a hole wiring spaced apart from the first conductive pattern and the second conductive pattern and disposed in the hole region, and a first detection wiring and a second detection wiring spaced apart from each other in a plane and extending from the hole region to the peripheral region to connect with the hole wiring, wherein the first detection wiring and the second detection wiring are disposed on different layers, and the detection insulating layer is located between the first detection wiring and the second detection wiring.

[0009] In one embodiment, the hole wiring on the plane may overlap with the groove.

[0010] In an embodiment, the first detection wiring may be disposed on the same layer as the first conductive pattern, and the second detection wiring may be disposed on the same layer as the second conductive pattern.

[0011] In an embodiment, the via wiring can be disposed on the same layer as either the first detection wiring or the second detection wiring.

[0012] In an embodiment, the display module may further include a dummy pattern disposed in the partition space, and the dummy pattern may be disposed on the same layer as the first detection wiring.

[0013] In an embodiment, the display module may further include a plurality of dummy patterns arranged at intervals from each other in a direction from the first detection wiring toward the second detection wiring.

[0014] In an embodiment, the first width of at least one of the first detection wiring and the second detection wiring may be greater than the second width of the hole wiring.

[0015] In an embodiment, the display module may include a flat portion disposed between the display member and the input detection member, wherein the flat portion may include: a flat organic film overlapping the hole region of the display member and a flat inorganic film covering the flat organic film and overlapping the active region and the hole region, wherein a first conductive pattern may be directly disposed on the flat inorganic film.

[0016] In an embodiment, the boundary between the active region and the hole region may have a step, and a portion of each of the first detection wiring and the second detection wiring may overlap with the boundary.

[0017] In an embodiment, the input detection component may include: a first detection electrode, including a first detection sensor extending in a first direction and a first connection pattern connected to the first detection sensor; a second detection electrode, including a second detection sensor extending in a second direction intersecting the first direction and a second connection pattern connected to the second detection sensor; and detection trace wiring connected to each of the first and second detection electrodes and extending to a peripheral region, wherein the first conductive pattern may include the first connection pattern, and wherein the second conductive pattern may include the first detection sensor, the second detection sensor, and the second connection pattern.

[0018] In an embodiment, the breakage detection wiring may include: an input trace wiring and an output trace wiring that are respectively connected to the first detection wiring and the second detection wiring and extend to the peripheral area, wherein the input trace wiring and the output trace wiring may be disposed on the same layer as the second conductive pattern.

[0019] In one embodiment, the first detection wiring can be connected to the first end of the hole wiring and the input trace wiring through at least one contact hole penetrating the detection insulation layer, wherein the second detection wiring can be directly connected to the second end of the hole wiring and the output trace wiring.

[0020] In an embodiment, the via wiring may include an opening curve of overall shape, wherein a first end of the via wiring may be connected to a first detection wiring, and a second end of the via wiring may be connected to a second detection wiring.

[0021] In an embodiment, the electronic module may include at least one of an audio output module, a light-emitting module, a light-receiving module, and a camera module.

[0022] In an embodiment of the present invention, an electronic device includes: a display member comprising a substrate, pixels disposed on the substrate, and a sealing portion covering the pixels, wherein the display member is divided into an active region having pixels, a peripheral region adjacent to the active region, and an aperture region at least partially surrounded by the active region; a planar portion disposed on the sealing portion and comprising a planar organic film overlapping the aperture region and a planar inorganic film covering the planar organic film and overlapping the active region and the aperture region; an input detection member disposed in the active region for detecting external input, comprising a first conductive pattern disposed on the planar inorganic film, a detection insulating layer covering the first conductive pattern, and a second conductive pattern disposed on a different layer from the first conductive pattern, wherein the detection insulating layer is disposed between the first conductive pattern and the second conductive pattern; and a breakage detection wiring comprising aperture wiring spaced apart from the first conductive pattern and the second conductive pattern and disposed in the aperture region, and a first detection wiring and a second detection wiring connected to the aperture wiring and disposed on a different layer, wherein the detection insulating layer is disposed between the first detection wiring and the second detection wiring, wherein the boundary between the active region and the aperture region has a step, and a portion of each of the first detection wiring and the second detection wiring overlaps with the boundary.

[0023] In one embodiment, the step may be formed from the end of the flat organic membrane adjacent to the sealing portion.

[0024] In an embodiment, the input detection component may further include a dummy pattern disposed on the same layer as the first detection wiring, and the dummy pattern may overlap with the boundary.

[0025] In an embodiment, the first detection wiring may be disposed on the same layer as the first conductive pattern, and the second detection wiring may be disposed on the same layer as the second conductive pattern.

[0026] In one embodiment, the first detection wiring can be connected to a first end of the hole wiring by passing through at least one contact hole defined by the detection insulation layer, wherein the second detection wiring can be directly connected to a second end of the hole wiring.

[0027] In an embodiment, the sealing portion may include a sealing organic membrane and a sealing inorganic membrane that seals the sealing organic membrane, and at least a portion of the flat organic membrane may overlap with the sealing organic membrane.

[0028] In an embodiment, the via wiring may include an opening curve of overall shape, wherein a first end of the via wiring may be connected to a first detection wiring, and a second end of the via wiring may be connected to a second detection wiring.

[0029] In one embodiment, the display module includes a module hole, and the substrate may include a groove surrounding the module hole and covered by a sealing portion by recessing at least a portion of the substrate, and the hole wiring may overlap with the groove in a plane. Attached Figure Description

[0030] The accompanying drawings are included to provide a further understanding of the inventive concept, and are incorporated in and constitute a part of this disclosure. The drawings illustrate exemplary embodiments of the inventive concept and, together with the detailed description, serve to explain the principles of the inventive concept. In the drawings:

[0031] Figure 1 This is an assembly perspective view of an electronic device according to an embodiment of the present invention;

[0032] Figure 2A This is an exploded perspective view of an electronic device according to an embodiment of the present invention.

[0033] Figure 2B yes Figure 2A A block diagram of an electronic device is shown in the figure;

[0034] Figure 3 It is shown schematically. Figure 2A The plan view of region XX′ shown in the figure;

[0035] Figure 4A This is a plan view of the input detection component according to an embodiment of the present invention;

[0036] Figure 4B It is along Figure 4A A cross-sectional view of the electronic device taken by line I-I';

[0037] Figure 5A This is an enlarged view of a portion of an electronic device according to an embodiment of the present invention;

[0038] Figure 5B It is along Figure 5A The cross-sectional view taken by line II-II' shown in the figure;

[0039] Figure 6A This is an enlarged view of a portion of an electronic device according to an embodiment of the present invention;

[0040] Figure 6B It is along Figure 6A The cross-sectional view taken by line III-III' shown in the figure;

[0041] Figure 7 This is an enlarged view of a portion of an electronic device according to an embodiment of the present invention;

[0042] Figure 8AThis is an enlarged view of a portion of an electronic device according to an embodiment of the present invention;

[0043] Figure 8B It is along Figure 8A The cross-sectional view shown is taken along line IV-IV'.

[0044] Figure 9A yes Figure 4A A magnified plan view of the area QQ; and

[0045] Figure 9B This is a plan view of the crack detection wiring according to an embodiment of the present invention. Detailed Implementation

[0046] In this disclosure, when a component (or region, layer, part, etc.) is described as being “on”, “connected to”, or “joined to” another component, it means that the component may be directly on, directly connected to, or joined to the other component, or that a third component may be present between the component and the other component.

[0047] The same reference numerals refer to the same elements. Additionally, in the accompanying drawings, the thickness, proportions, and dimensions of parts are exaggerated for the sake of effective description.

[0048] "And / or" includes all combinations of one or more combinations defined by the relevant component.

[0049] It will be understood that the terms "first" and "second" are used herein to describe various components, but these components should not be limited by these terms. The terms above are used only to distinguish one component from another. For example, a first component may be referred to as a second component without departing from the scope of the inventive concept of this disclosure, and vice versa. Unless the context clearly indicates otherwise, singular expressions include plural expressions.

[0050] Additionally, terms such as “lower,” “lower side,” “upper,” and “upper side” are used to describe the relationships of the configurations shown in the accompanying drawings. These terms are described as relative concepts based on the directions shown in the drawings and can vary depending on the orientation and configuration of the drawings.

[0051] Unless otherwise defined, all terms used herein (including technical and scientific terms) shall have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure pertains. Furthermore, terms defined in commonly used dictionaries shall be interpreted as having a meaning consistent with that in the context of the relevant art, and not as having an idealized or overly formal meaning, unless they are explicitly defined herein.

[0052] In various embodiments of the inventive concept, the terms "comprising" or "including" specify attributes, areas, fixed quantities, steps, processes, elements, and / or components, but do not exclude other attributes, areas, fixed quantities, steps, processes, elements, and / or components. Various exemplary embodiments of the inventive concept will be described below with reference to the accompanying drawings.

[0053] Figure 1 This is an assembly perspective view of an electronic device according to an embodiment of the present invention. Figure 2A This is an exploded perspective view of an electronic device according to an embodiment of the present invention. Figure 2B yes Figure 2A A block diagram of an electronic device is shown. Figure 3 It is shown schematically. Figure 2A The plan view of region XX′ is shown in the figure. Figure 4A This is a plan view of the input detection component according to an embodiment of the present invention. Figure 4B It is along Figure 4A A cross-sectional view of an electronic device taken by line I-I'. Figure 5A This is an enlarged view of a portion of an electronic device according to an embodiment of the present invention. Figure 5B It is along Figure 5A The cross-sectional view taken along line II-II' is shown in the figure. Reference will be made below. Figures 1 to 5B An electronic device based on the present invention is described.

[0054] refer to Figure 1 and Figure 2A An electronic device EA displays an image IM on a plane defined by a first direction D1 and a second direction D2, directed towards a third direction D3. The electronic device EA includes a window layer WM, a display module DM, an electronic module ID, and a cover shell EDC. The display module DM, according to the present invention, includes a display member DU and an input detection member TU. According to one embodiment, the display module DM includes at least one module hole HM defined by a front surface IS and a rear surface opposite to the front surface IS. Figure 2A The image shows a single module hole HM as an example. In other embodiments, the display module DM may include two or more module hole HMs corresponding to a respective electronic module ID.

[0055] A window layer WM is disposed on the display module DM to cover the front surface IS of the display module DM. The window layer WM includes a front surface FS exposed to the outside. The image IM displayed on the display component DU of the display module DM is viewed from the outside through the front surface FS of the window layer WM.

[0056] The window layer (WM) can have a single-layer or multi-layer structure. For example, the window layer (WM) can have a stacked structure of multiple plastic films bonded together by an adhesive, or it can have a stacked structure of a glass substrate and plastic films bonded together by an adhesive. The window layer (WM) can be optically transparent. For example, the window layer (WM) can include glass or plastic.

[0057] The front surface FS of the window layer WM can be divided into a transmissive region TA and a border region BZA. The transmissive region TA can correspond to the area that transmits light from the display module DM. The transmissive region TA can have a shape corresponding to the active region AA of the display module DM. For example, the transmissive region TA overlaps with all or at least a portion of the active region AA. Therefore, the image IM displayed in the active region AA of the display module DM can be visually identified through the transmissive region TA.

[0058] The border region BZA may correspond to a region with lower light transmittance compared to the transmission region TA. The border region BZA may define the shape of the transmission region TA. The border region BZA is adjacent to the transmission region TA, and according to an embodiment, the border region BZA may have a closed-line shape surrounding the transmission region TA. However, the inventive concept is not limited to this embodiment, and the border region BZA may be disposed only on one or more selected sides of the transmission region TA, or on one or more portions of one or more selected sides. In some embodiments, the border region BZA may be omitted. It is understood that the inventive concept of this disclosure is not limited to any particular embodiment.

[0059] The border area BZA can have a predetermined color. The border area BZA covers the peripheral area NAA of the display module DM to prevent the peripheral area NAA from being visually identified from the outside. For example, if light generated by the display component DU of the display module DM leaks into the peripheral area NAA, the light leaking into the border area BZA can be blocked, thereby preventing the light leaking into the peripheral area NAA from being seen from the outside.

[0060] The display element DU of the display module DM displays the image IM on the front surface IS of the display module DM. The front surface IS can be divided into an active region AA, a hole region PA, and a peripheral region NAA. The image IM is displayed in the active region AA. The peripheral region NAA is adjacent to the active region AA. The active region AA can correspond to the area in which the pixel PX of the display element DU, which will be described later, is disposed.

[0061] According to an embodiment, the hole region PA overlaps with the module hole HM. The hole region PA may correspond to a region at least partially surrounded by the active region AA. Although Figure 2AThe diagram illustrates a shape in which the hole region PA is completely surrounded by the active region AA, but one area of ​​the hole region PA may be surrounded by the active region AA, and the remaining area of ​​the hole region PA may be surrounded by the peripheral region NAA. It is understood that the inventive concept of this disclosure is not limited to any particular embodiment. In this example, the hole region PA overlaps with the module hole HM.

[0062] refer to Figure 2B The power module (PM) provides the power required for the overall operation of the electronic device (EA). The power module (PM) may include a battery module.

[0063] The electronic module ID includes various functional modules used to operate the electronic device EA. The electronic module ID may include a first electronic module EM1 and a second electronic module EM2.

[0064] The first electronic module EM1 can be directly mounted on a motherboard (not shown) that is electrically connected to the display module DM, or it can be mounted on a separate board and electrically connected to the motherboard via a connector (not shown) or the like.

[0065] The first electronic module EM1 may include a control module CM, a wireless communication module TM, an image input module IIM, an audio input module AIM, a memory MM, and an external interface OIP. Some modules may not be mounted on the motherboard, but can be electrically connected to the motherboard via flexible circuit boards or connectors.

[0066] The control module (CM) controls the overall operation of the electronic device (EA). The control module (CM) can be a microprocessor. For example, the control module (CM) activates or deactivates the display module (DM). The control module (CM) can also control other modules, such as the image input module (IIM) and the audio input module (AIM), based on touch signals received through the electronic device (EA).

[0067] The wireless communication module™ can send wireless signals to / receive wireless signals from another device via Bluetooth or Wi-Fi connection. For example, the wireless communication module™ can send / receive voice signals. The wireless communication module™ includes a transmitter TM1 for modulating and transmitting the signal to be transmitted and a receiver TM2 for modulating the received signal.

[0068] The image input module (IIM) processes the image signal and converts it into image data that can be displayed on the display module (DM).

[0069] In recording mode, voice recognition mode, etc., the audio input module AIM receives external sound signals through a microphone and converts the external sound signals into electronic voice data.

[0070] The memory MM can store data received from the wireless communication module TM, the image input module IIM, and the audio input module AIM, and can also delete used data from the memory MM. Additionally, data required for controlling the second electronic module EM2 can be stored in and / or deleted from the memory MM.

[0071] External interface (OIP) serves as an interface to one or more external devices, such as chargers, wired / wireless data ports, and card slots (e.g., memory cards, SIM / UIM cards).

[0072] The second electronic module EM2 may include an audio output module AOM, a light-emitting module LM, a light-receiving module LRM, and a camera module CMM. The modules included in the second electronic module EM2 can be directly mounted on the motherboard, or mounted on a separate substrate and electrically connected to the display module DM and / or electrically connected to the first electronic module EM1 via connectors.

[0073] The audio output module AOM converts audio data received from the wireless communication module TM or stored in the memory MM, and outputs the audio data, for example, using a speaker.

[0074] A light-emitting module (LM) generates and outputs light. The LM can output infrared light. The LM may include LED elements. A light-receiving module (LRM) detects infrared light. The LRM can be activated when a predetermined level or higher of infrared light is detected. The LRM may include a complementary metal-oxide-semiconductor (CMOS) sensor. After the infrared light generated by the LM is output, it is reflected by an external object (e.g., a user's finger or face), and the reflected infrared light can be incident on the LRM. A camera module (CMM) captures an image of the object.

[0075] In particular, Figure 2A The electronic module ID shown can be any one or more modules included in the second electronic module EM2. In this case, the first electronic module EM1 and the remaining modules of the second electronic module EM2 can be located in different positions and are not shown. For example, the electronic module ID can include at least one of the following: audio output module AOM, light emission module LM, light receiving module LRM, and camera module CMM.

[0076] According to one embodiment, the electronic module ID can be inserted into the module hole HM. Alternatively, the electronic module ID can be disposed adjacent to the module hole HM on the rear surface of the display member DU. In one embodiment, only one module included in the electronic module ID may be exposed to the outside through the module hole HM. For example, only the lens included in the camera module CMM may be exposed through the module hole HM. Alternatively, the electronic module ID may be disposed on the rear surface of the display member DU and spaced apart from the display member DU in a cross-sectional view.

[0077] The display component DU according to an embodiment of the present invention includes a module hole HM formed in the active region AA, such that no separate space for the electronic module ID is required in the peripheral region NAA. Therefore, the area of ​​the bezel region BZA can be reduced, thereby enabling an electronic device EA with a narrow bezel. Furthermore, when the electronic module ID is housed in the module hole HM, the electronic device EA can be implemented with a thin form factor.

[0078] Figure 3 The diagram exemplarily illustrates the relationship between pixels PX and module holes HM included in the display component DU of the display module DM.

[0079] According to one embodiment, a pixel PX is disposed in an active region AA of a display module DM. The pixel PX may be spaced apart from and surround an aperture region PA. Although not shown in the figures, pixels PX spaced apart from the aperture regions PA between pixels PX can be connected via signal lines passing through the aperture regions PA to receive the same signal.

[0080] Refer again Figure 2A The cover EDC can be attached to the window layer WM. The cover EDC provides the rear surface of the electronic device EA. The cover EDC is attached to the window layer WM to provide internal space. Figure 2B The display module DM, electronic module ID, and various modules / components shown can be housed within an internal space defined by the cover EDC and window layer WM. The cover EDC can comprise materials with relatively high rigidity. For example, the cover EDC can comprise multiple frames and / or plates made of glass, plastic, or metal. The cover EDC can stably protect the structure of the electronic device EA housed within the internal space from external impacts.

[0081] refer to Figure 2A and Figure 4AAccording to the present invention, an input detection component TU can be disposed on a display component DU. The input detection component TU may include a first detection electrode TE1, a second detection electrode TE2, a first detection trace wiring SL1, and a second detection trace wiring SL2 arranged on a plane. The input detection component TU includes a detection area for detecting external input and a non-detection area adjacent to the detection area. According to one embodiment, the detection area may overlap with an active area AA, and the non-detection area may overlap with a peripheral area NAA.

[0082] The first detection electrode TE1 extends along a first direction D1. Multiple first detection electrodes TE1 may be arranged along a second direction D2. Each first detection electrode TE1 includes multiple first detection sensors SP1 arranged along the first direction D1 and a first connection pattern BP1 disposed between the first detection sensors SP1 to connect adjacent first detection sensors SP1.

[0083] The second detection electrode TE2 can be arranged to be insulated from the first detection electrode TE1. The second detection electrode TE2 extends along a second direction D2. A plurality of second detection electrodes TE2 can be arranged along a first direction D1. The second detection electrode TE2 includes a plurality of second detection sensors SP2 arranged along the second direction D2 and a second connection pattern BP2 disposed between the second detection sensors SP2 to connect adjacent second detection sensors SP2. Each of the first detection electrode TE1 and the second detection electrode TE2 can have a grid shape.

[0084] The input detection component TU detects changes in the mutual capacitance between the first detection electrode TE1 and the second detection electrode TE2 to detect external input, or detects changes in the self-capacitance of each of the first detection electrode TE1 and the second detection electrode TE2 to detect external input. The input detection component TU, according to embodiments of the present invention, can detect external input in various ways and is not limited to any particular embodiment.

[0085] External inputs can include various types of inputs provided to the electronic device EA. Externally applied inputs can be provided in various forms. For example, external inputs can include non-contact external inputs (e.g., hovering) applied near or at a predetermined distance from the electronic device EA, as well as tactile inputs via a part of the human body (e.g., a user's hand). Furthermore, external inputs can take various forms such as force, pressure, and light, and are not limited to any particular form of input.

[0086] A first detection trace SL1 is connected to a corresponding one of the first detection electrodes TE1. A second detection trace SL2 is connected to a corresponding one of the second detection electrodes TE2. The first and second detection traces SL1 and SL2 can extend into the peripheral region NAA. For example, the first and second detection traces SL1 and SL2 can be located in a non-detection area overlapping the peripheral region NAA and are not visible from the outside.

[0087] For ease of description, Figure 4A Only a subset of the first detection trace wiring SL1 and the second detection trace wiring SL2, which are respectively connected to one of the first detection electrode TE1 and the second detection electrode TE2, are shown. For example, Figure 4A The diagram illustrates two first detection trace wirings SL1 connected to both ends of the first detection electrode TE1 located on the far left.

[0088] Simultaneously, according to one embodiment, a first detection electrode TE1 can be connected to two first detection traces SL1. The two first detection traces SL1, connected to one end and the other end of a first detection electrode TE1, can be separately and independently connected to a corresponding detection pad in the detection pad PD1. Therefore, even though the first detection electrode TE1 has a relatively longer length along the first direction D1 compared to the second detection electrode TE2, the electrical signal can be uniformly applied to the entire area. Thus, regardless of the shape and configuration of the first detection electrode TE1, the input detection member TU can provide a uniform external input detection environment across the entire detection area.

[0089] Similarly, the second detection electrode TE2 can also be connected to two second detection trace wirings SL2. In another embodiment, each of the first detection electrode TE1 and the second detection electrode TE2 can be connected to only one detection trace wiring SL1 or SL2. The input detection member TU according to embodiments of the present invention can be driven in various ways and is not limited to any particular embodiment.

[0090] Although not shown in the accompanying drawings, the detection pad PD1 of the input detection component TU can be connected to a touch flexible circuit board (not shown) located on one side of the peripheral area NAA. The touch flexible circuit board can be connected to the main circuit board (not shown). The main circuit board can receive signals from the input detection component TU.

[0091] The electronic device EA according to the present invention includes at least a breakage detection wiring HCD. The breakage detection wiring HCD may be disposed on the same layer as the input detection component TU. The breakage detection wiring HCD is positioned adjacent to the module aperture HM. Furthermore, the breakage detection wiring HCD is spaced apart from the detection electrodes TE1 and TE2 of the input detection component TU. Figure 4A For ease of explanation, the input detection component TU and the breakage detection wiring HCD are shown together.

[0092] A portion of the crack detection wiring HCD can extend to the peripheral area NAA and connect to one of the detection pads PD2. The detection pads PD2 include a first input pad PD-I1, a second input pad PD-I2, a first output pad PD-O1, and a second output pad PD-O2. The detection pads PD2 can be connected to a touch flexible circuit board (not shown) to receive signals from or output signals to the main circuit board (not shown).

[0093] The breakage detection wiring HCD includes a first input trace wiring HCD-I1, a second input trace wiring HCD-I2, a first output trace wiring HCD-O1, and a second output trace wiring HCD-O2. One end of the breakage detection wiring HCD has an opening curve shape surrounding the module via HM, and this end of the breakage detection wiring HCD is connected to one of the first input trace wiring HCD-I1 and the second input trace wiring HCD-I2. One end and the other end of the input trace wiring HCD-I1 and HCD-I2 extending to the peripheral area NAA are respectively connected to the first input pad PD-I1 and the second input pad PD-I2.

[0094] The other end of the break detection wiring HCD also has an open curve shape that connects to the first output trace wiring HCD-O1 and the second output trace wiring HCD-O2. One end and the other end of the output trace wirings HCD-O1 and HCD-O2 extending to the peripheral area NAA are respectively connected to the first output pad PD-O1 and the second output pad PD-O2.

[0095] According to an embodiment, the breakage detection wiring HCD can determine whether at least one of the layers disposed below the breakage detection wiring HCD is broken during the formation of the module via HM. For example, the module via HM is formed after the breakage detection wiring HCD is formed, and a signal is applied to the detection pad PD2 connected to the breakage detection wiring HCD to determine whether at least one of the layers forming the display module DM is broken.

[0096] exist Figure 4AIn the diagram, input trace routings HCD-I1 and HCD-I2 correspond to different portions of a single trace, but are referred to as the first input trace routing HCD-I1 and the second input trace routing HCD-I1 for ease of explanation. Similarly, output trace routings HCD-O1 and HCD-O2 correspond to different portions of a single trace, but are referred to as the first output trace routing HCD-O1 and the second output trace routing HCD-O2.

[0097] When a signal is applied to the first input pad PD-I1, the signal passes through the break detection wiring HCD surrounding the module via hole HM via the first input trace wiring HCD-I1 connected to the first input pad PD-I1. The signal can be transmitted to the first output pad PD-O1 via the first output trace wiring HCD-O1.

[0098] When no breakage occurs in any of the layers below the breakage detection wiring HCD, the signal is transmitted to the first output pad PD-O1. If a breakage occurs in any of the layers below the breakage detection wiring HCD, for example, in at least one of the right side of the input detection component TU and the via region PA in which the first input trace wiring HCD-I1 and the first output trace wiring HCD-O1 are arranged, the signal may not be transmitted to the first output pad PD-O1.

[0099] Furthermore, when a signal is applied to the second input pad PD-I2, the signal passes through the second input trace wiring HCD-I2 connected to the second input pad PD-I2 and then through the break detection wiring HCD surrounding the module hole HM. The signal can be transmitted to the second output pad PD-O2 via the second output trace wiring HCD-O2.

[0100] When no breakage occurs in any of the layers below the breakage detection wiring HCD, the signal is transmitted to the second output pad PD-O2. If a breakage occurs in any of the layers below the breakage detection wiring HCD, for example, in at least one of the left side of the input detection component TU and the via region PA in which the second input trace wiring HCD-I2 and the second output trace wiring HCD-O2 are arranged, the signal may not be transmitted to the second output pad PD-O2.

[0101] According to the present invention, the breakage detection wiring HCD disposed on the same layer as the input detection component TU can determine whether any layer included in the display module DM breaks during the formation of the module hole HM defined by the display module DM. Therefore, an electronic device EA with improved reliability can be provided.

[0102] refer to Figure 4BAccording to an embodiment, the display component DU includes a substrate BS, a pixel PX, a sealing portion TFE, a dam portion DMP, a first groove BR1, a second groove BR2, and a plurality of insulating layers.

[0103] The substrate BS may include a glass substrate, a metal substrate, or a flexible plastic substrate. However, the inventive concept is not limited thereto, and the substrate BS may be a substrate comprising a base layer containing organic materials.

[0104] For example, the organic material of the substrate BS may include at least one selected from polyimide, polyethylene naphthalate, polyethylene terephthalate, polyarylate, polycarbonate, polyetherimide, and polyethersulfone. Therefore, the substrate BS conceived according to the present invention may be rigid or flexible, and is not limited to any particular embodiment.

[0105] A barrier layer BI is disposed on a substrate BS. The barrier layer BI may cover the substrate BS. The barrier layer BI may be an insulating layer comprising an inorganic material. For example, the barrier layer BI may include alumina (Al₂O₃). x Titanium oxide (TiO) x ), silicon dioxide (SiO) x ), silicon oxynitride (SiO) x N y Zirconium oxide (ZrO) x ) and hafnium oxide (HfO) x At least one of the following. The barrier layer BI can be formed of multiple inorganic films. The barrier layer BI can prevent impurities from entering from the outside.

[0106] Although not shown in the accompanying drawings, the display component DU according to one embodiment may further include a buffer layer (not shown). The buffer layer may be disposed on the barrier layer BI. The buffer layer may comprise an inorganic or organic material. The buffer layer may have a higher adhesion force than the barrier layer BI relative to the semiconductor pattern SL or the first insulating layer IL1 of the transistor TR, which will be described later. Therefore, the transistor TR can be stably formed on the substrate BS.

[0107] According to one embodiment, a pixel PX includes a transistor TR and an organic light-emitting element ED connected to the transistor TR.

[0108] A transistor TR includes a semiconductor pattern SL, a control electrode CE, an input electrode IE, and an output electrode OE. The transistor TR controls the charge transfer in the semiconductor pattern SL through the control electrode CE, so as to output the electrical signal input from the input electrode IE through the output electrode OE.

[0109] A semiconductor pattern SL is disposed on a substrate BS. The semiconductor pattern SL may include at least one of crystalline semiconductor material, metal oxide semiconductor material, polycrystalline silicon, and amorphous silicon. Although a control electrode CE disposed on the semiconductor pattern SL is shown in a transistor TR according to one embodiment, the inventive concept is not limited thereto. The control electrode CE may be disposed on the substrate BS and may be covered by a first insulating layer IL1, and may have a bottom gate structure in which the semiconductor pattern SL is disposed on the first insulating layer IL1, but the inventive concept of this disclosure is not limited to any particular embodiment.

[0110] A first insulating layer IL1 may be disposed between the semiconductor pattern SL and the control electrode CE. The first insulating layer IL1 covers the substrate BS and the semiconductor pattern SL. The first insulating layer IL1 comprises an inorganic material and is not limited to any particular embodiment.

[0111] A control electrode CE is disposed on a semiconductor pattern SL. The control electrode CE is spaced apart from the semiconductor pattern SL, and a first insulating layer IL1 is disposed between the control electrode CE and the semiconductor pattern SL. The control electrode CE may at least partially overlap with the semiconductor pattern SL.

[0112] The second insulating layer IL2 may be disposed between the control electrode CE and the input electrode IE, and between the control electrode CE and the output electrode OE. The second insulating layer IL2 covers the first insulating layer IL1 and the control electrode CE. The second insulating layer IL2 comprises inorganic materials and is not limited to any particular embodiment.

[0113] The input electrode IE and the output electrode OE are disposed on the second insulating layer IL2. The input electrode IE and the output electrode OE are connected to the semiconductor pattern SL through the first insulating layer IL1 and the second insulating layer IL2, respectively. However, this is only an example, and in other embodiments, the input electrode IE and the output electrode OE may be directly connected to the semiconductor pattern SL.

[0114] The third insulating layer IH is disposed on the second insulating layer IL2. The third insulating layer IH can cover the transistor TR.

[0115] An organic light-emitting element (ED) includes a first electrode E1, a second electrode E2, a light-emitting layer EL, and a charge control layer OL. The first electrode E1 is disposed on a third insulating layer IH. The first electrode E1 can be electrically connected to a transistor TR through the third insulating layer IH. Multiple first electrodes E1 can be provided. At least a portion of each of the multiple first electrodes E1 can be exposed through an opening OP in the corresponding pixel definition layer PLE.

[0116] The second electrode E2 is disposed on the first electrode E1. The second electrode E2 may be configured to cover only a portion of the pixel defining layer PLE. However, the inventive concept is not limited thereto, and the second electrode E2 may extend to the hole region PA to cover the hole region PA.

[0117] For example, the second electrode E2 of each of the plurality of organic light-emitting elements (OLEDs) can be configured as a single, interconnected shape. Therefore, the same voltage can be supplied to each of the plurality of OLEDs via the common second electrode E2. Thus, a separate patterning process can be omitted to form the second electrode E2. On the other hand, this is merely an example, and in other embodiments, the second electrode E2 can be provided as a plurality to correspond to each of the openings OP or a group of openings OP.

[0118] The second electrode E2 may include an optically transparent transmission electrode. For example, the second electrode E2 may include at least one of indium zinc oxide (IZO), indium tin oxide (ITO), indium gallium oxide (IGO), indium gallium zinc oxide (IGZO), and any mixture / compound thereof. Thus, the display module DM displays the image IM on the front surface IS. However, this is merely an example, and depending on the orientation in which the image IM is displayed, the second electrode E2 may include a reflective electrode or a semi-transparent reflective electrode, and is not limited to any particular embodiment.

[0119] A light-emitting layer EL is disposed between a first electrode E1 and a second electrode E2. Multiple light-emitting layers EL can be provided and disposed in corresponding openings OP. An organic light-emitting element ED can generate light by activating the light-emitting layer EL according to the potential difference between the first electrode E1 and the second electrode E2. The region in which light is generated by the light-emitting layer EL can be defined as the light-emitting region PXA.

[0120] A charge control layer OL is disposed between the first electrode E1 and the second electrode E2. The charge control layer OL is configured to be adjacent to the light-emitting layer EL. In this embodiment, the charge control layer OL is shown disposed between the light-emitting layer EL and the second electrode E2. However, this is only an example. The charge control layer OL may be disposed between the light-emitting layer EL and the first electrode E1, and may be configured as multiple layers stacked along a third direction D3, with the light-emitting layer EL between these layers.

[0121] The charge control layer OL can have an integral shape that overlaps with the front surface of the substrate BS without the need for a separate patterning process.

[0122] The charge control layer OL can be located in the region other than the opening OP formed in the pixel-defining layer PLE. The charge control layer OL can improve luminous efficiency by controlling the movement of electrons. The charge control layer OL may include an electron transport layer and an electron injection layer.

[0123] Although not shown in the accompanying drawings, the pixel PX of the display component DU can be connected to a signal line (not shown), which in turn connects to a corresponding signal pad (not shown). The signal pad can be connected to a flexible circuit board (not shown) located on one side of the peripheral area NAA. The flexible circuit board may include driving elements, such as a data driving circuit including a driving chip for driving the pixel PX. The flexible circuit board can be connected to a main circuit board (not shown). The main circuit board may include a timing controller. The timing controller receives image signals and converts them into image data corresponding to the operation of the pixel PX. Additionally, the timing controller can receive various control signals, such as vertical synchronization signals, horizontal synchronization signals, master clock signals, and data enable signals, and can output control signals.

[0124] The sealing portion TFE is disposed on the organic light-emitting element ED. In this embodiment, the sealing portion TFE may include a first sealing inorganic film LIL, a sealing organic film OEL, and a second sealing inorganic film UIL.

[0125] A first sealing inorganic film LIL can be disposed on the portion of the second electrode E2 and the charge control layer OL exposed by the second electrode E2. A second sealing inorganic film UIL is disposed on the first sealing inorganic film LIL. The first sealing inorganic film LIL and the second sealing inorganic film UIL can be sealed with a sealing organic film OEL. Each of the first sealing inorganic film LIL and the second sealing inorganic film UIL may include an inorganic material. Examples of inorganic materials may include alumina (Al₂O₃). x ), silicon dioxide (SiO) x ), silicon nitride (SiN) x ), silicon oxynitride (SiO) x N y ), silicon carbide (SiC) x Titanium oxide (TiO) x Zirconium oxide (ZrO) x ) and zinc oxide (ZnO) x At least one of the following.

[0126] An organic sealing membrane (OEL) can be disposed between a first inorganic sealing membrane (LIL) and a second inorganic sealing membrane (UIL). The organic sealing membrane (OEL) can include organic materials. Examples of organic materials include at least one of epoxy resin, polyimide, polyethylene terephthalate, polycarbonate, polyethylene, and polyacrylate.

[0127] The first sealing inorganic film LIL and the second sealing inorganic film UIL may have an integral shape disposed on the front surface of the display component DU in a planar plane. Each of the first sealing inorganic film LIL and the second sealing inorganic film UIL may partially overlap with the sealing organic film OEL. Therefore, in some areas, the first sealing inorganic film LIL and the second sealing inorganic film UIL may be spaced apart from each other in the third direction D3, while the sealing organic film OEL is located between the first sealing inorganic film LIL and the second sealing inorganic film UIL, and in other areas, the first sealing inorganic film LIL and the second sealing inorganic film UIL may be in direct contact in the third direction D3. The sealing portion TFE seals the organic light-emitting element ED to protect the organic light-emitting element ED from foreign matter that may be introduced from the outside.

[0128] According to one embodiment, the display component DU may further include a dam portion DMP. The dam portion DMP may overlap with the via region PA. The dam portion DMP may extend along an edge adjacent to the via region PA at the boundary between the active region AA and the via region PA. The dam portion DMP may be surrounded by or disposed on at least one side of the active region AA, for example, on the side adjacent to a pad (not shown) or a drive circuit (not shown).

[0129] The dam portion DMP includes a first dam portion DMP1 and a second dam portion DMP2. The dam portion DMP can be disposed on the second insulating layer IL2. The first dam portion DMP1 may include the same material as the third insulating layer IH. The second dam portion DMP2 may include the same material as the pixel defining layer PLE. Figure 4B The dam portion DMP shown is formed from multiple layers including a first dam portion DMP1 and a second dam portion DMP2, but the inventive concept of this disclosure is not limited thereto. In some embodiments, the dam portion DMP may have a single-layer structure comprising at least one of the third insulating layer IH and the pixel defining layer PLE.

[0130] The dam section DMP can define the area in which liquid organic material diffuses during the process of forming the sealing organic membrane OEL. The sealing organic membrane OEL can be formed by an inkjet method in which liquid organic material is applied to a first sealing inorganic membrane LIL. In this case, the dam section DMP sets the boundary of the area in which the organic liquid material is applied and prevents the liquid organic material from overflowing outside the dam section DMP.

[0131] According to one embodiment, the display module DM includes a flat portion YP. The flat portion YP includes a flat organic film YOC and a flat inorganic film YIL.

[0132] A flat portion YP is disposed between the display component DU and the input detection component TU. A flat organic film YOC covers a portion of the display component DU. For example, the flat organic film YOC may be disposed on the display component DU that overlaps with the hole region PA. The flat organic film YOC is disposed between the display component DU overlapping the hole region PA and the input detection component TU to compensate for the step between the display component DU and the input detection component TU.

[0133] According to one embodiment, a step CD can be formed at the boundary between the active region AA and the aperture region PA. During the process of applying the planar organic film YOC onto the display component DU, the step CD may be formed due to one or more process errors. The step CD can be formed from the end of the planar organic film YOC adjacent to the sealing portion TFE.

[0134] The flat inorganic film YIL can cover the flat organic film YOC. The flat inorganic film YIL can have an integral shape that overlaps with the front surface of the display component DU.

[0135] The input detection component TU includes a first conductive pattern TML1, a second conductive pattern TML2, a first detection insulating layer TIL1, and a second detection insulating layer TIL2. According to one embodiment, the input detection component TU is disposed on a planar inorganic film YIL. For example, the first conductive pattern TML1 of the first conductive pattern TML1 and the second conductive pattern TML2 can be directly disposed on the planar inorganic film YIL.

[0136] The first detection insulating layer TIL1 is disposed on the flat inorganic film YIL to cover the first conductive pattern TML1.

[0137] The second conductive pattern TML2 in conductive patterns TML1 and TML2 can be directly disposed on the first detection insulating layer TIL1. The second conductive pattern TML2 can also be disposed on a different layer than the first conductive pattern TML1 via the first detection insulating layer TIL1. A portion of the second conductive pattern TML2 can be connected to the first conductive pattern TML1 via the first detection insulating layer TIL1.

[0138] The second detection insulating layer TIL2 is disposed on the first detection insulating layer TIL1 to cover the second conductive pattern TML2.

[0139] According to one embodiment, the first conductive pattern TML1 can be made from... Figure 4A The first connection pattern BP1 shown is formed. The second conductive pattern TML2 can be formed by... Figure 4A The first detection sensor SP1, the second detection sensor SP2, and the second connection pattern BP2 shown in the figure are formed.

[0140] However, the inventive concept of this disclosure is not limited thereto. Depending on the arrangement of the first detection electrode TE1 and the second detection electrode TE2 included in the input detection component TU, based on the first detection insulating layer TIL1, the pattern disposed below the first detection insulating layer TIL1 can be formed by the first conductive pattern TML1, and the pattern disposed on the first detection insulating layer TIL1 can be formed by the second conductive pattern TML2.

[0141] Each of the first conductive pattern TML1 and the second conductive pattern TML2 may not overlap with the light-emitting region PXA of the pixel PX. Therefore, the light provided by the display component DU can be seen by the user without interference from the input detection component TU.

[0142] According to one embodiment, the display component DU may include a first groove BR1 and a second groove BR2. The first groove BR1 and the second groove BR2 overlap with the hole region PA. A portion of an insulating layer including a barrier layer BI, a first insulating layer IL1 and a second insulating layer IL2, and a substrate BS are pressed from the upper surface of the charge control layer OL, and the exposed and recessed surfaces are covered by at least one of a first sealing inorganic film LIL and a second sealing inorganic film UIL, thereby forming the first groove BR1 and the second groove BR2.

[0143] For example, the first groove BR1 can be configured to be separate from the module hole HM, while the dam portion DMP is located between the first groove BR1 and the module hole HM. The first groove BR1 includes a first internal space BR-I1. A portion of the insulating layer, including the barrier layer BI, the first insulating layer IL1, and the second insulating layer IL2, and the substrate BS are pressed from the upper surface of the charge control layer OL, and the exposed and recessed surfaces are covered by a first sealing inorganic film LIL, thereby forming the first internal space BR-I1. The first internal space BR-I1 of the first groove BR1 can be filled with the sealing organic film OEL of the sealing portion TFE.

[0144] The second groove BR2 can be disposed between the dam portion DMP and the module hole HM. The second groove BR2 includes a second internal space BR-I2. A portion of the insulating layer including the barrier layer BI, the first insulating layer IL1 and the second insulating layer IL2, and the substrate BS are pressed from the upper surface of the charge control layer OL, and the exposed and recessed surfaces are covered by the first sealing inorganic film LIL and the second sealing inorganic film UIL, thereby forming the second internal space BR-I2. The second internal space BR-I2 of the second groove BR2 can be filled with a flat organic film YOC of the flat portion YP.

[0145] According to one embodiment, a first groove BR1 and a second groove BR2 arranged around the module aperture HM can block the movement path of moisture and oxygen that may be introduced from the module aperture HM. Therefore, a display module DM with improved reliability can be provided. Furthermore, by filling the internal space BR-I1 of the first groove BR1 and the internal space BR-I2 of the second groove BR2 with organic films such as a sealing organic film OEL and a planar organic film YOC, the first groove BR1 and the second groove BR2 can be provided with improved durability.

[0146] The module aperture HM can be defined by the inner surface GE of the end of the penetrating configuration in the configuration including the display module DM. For example, the penetrating and exposed ends including the end BS-E of the substrate BS, the end BI-E of the barrier layer BI, the end IL1-E of the first insulating layer IL1, the end IL2-E of the second insulating layer IL2, the end OL-E of the charge control layer OL, the end LIL-E of the first sealing inorganic film LIL, the end UIL-E of the second sealing inorganic film UIL, the end YOC-E of the planar organic film YOC, the end YIL-E of the planar inorganic film YIL, the end TIL1-E of the first detection insulating layer TIL1, and the end TIL2-E of the second detection insulating layer TIL2 can define the inner surface GE of the module aperture HM.

[0147] According to the inventive concept of this disclosure, a portion of the crack detection wiring HCD can be disposed on the same layer as at least one of the first conductive pattern TML1 and the second conductive pattern TML2. Figure 4B An embodiment is shown in which a portion of the break detection wiring HCD, cut along line I-I', is disposed on the same layer as the second conductive pattern TML2.

[0148] According to one embodiment, due to the stepped CD formed by the flat organic film YOC, a portion of the crack detection wiring HCD can be further separated from the substrate BS than the second conductive pattern TML2.

[0149] The crack detection wiring HCD can be disposed in a region that overlaps with at least one of the first groove BR1 and the second groove BR2. According to an embodiment, the crack detection wiring HCD can be disposed in the region where the thickness of the flat organic film YOC in the orifice region PA is greatest in the third direction D3. For example, the crack detection wiring HCD can overlap with the groove region GA corresponding to the region in which the second groove BR2 is disposed.

[0150] refer to Figure 5A and Figure 5BThe crack detection wiring HCD includes a first input trace wiring HCD-I1, a second input trace wiring HCD-I2, a first output trace wiring HCD-O1, a second output trace wiring HCD-O2, a hole wiring HCD-C, a first detection wiring HCD-R, and a second detection wiring HCD-L.

[0151] The via wiring HCD-C overlaps with the via region PA. For example, the via wiring HCD-C may overlap with the groove region GA of the second groove BR2 in which the via region PA is disposed. The via wiring HCD-C may have an opening curve that surrounds at least a portion of the module via HM in a plane. The via wiring HCD-C may be spaced apart from the detection electrodes TE1 and TE2 of the input detection component TU. Thus, the via wiring HCD-C may be configured to be spaced apart from the conductive patterns TML1 and TML2.

[0152] According to one embodiment, one end of the via wiring HCD-C is connected to a first detection wiring HCD-R, and the other end, spaced apart from that end of the via wiring HCD-C, is connected to a second detection wiring HCD-L.

[0153] The first detection wiring HCD-R and the second detection wiring HCD-L are spaced apart from each other in a plane by a separating space EG. Each of the first detection wiring HCD-R and the second detection wiring HCD-L extends from the via region PA through the active region AA to the peripheral region NAA.

[0154] For example, one end of the first detection wiring HCD-R is connected to one end of the hole wiring HCD-C disposed in the hole region PA, and the other end of the first detection wiring HCD-R is connected through the active region AA to the first input trace wiring HCD-I1 and the second input trace wiring HCD-I2 disposed in the peripheral region NAA.

[0155] One end of the second detection wiring HCD-L is connected to the other end of the hole wiring HCD-C located in the hole region PA, and the other end of the second detection wiring HCD-L is connected to the first output trace wiring HCD-O1 and the second output trace wiring HCD-O2 located in the peripheral region NAA through the active region AA.

[0156] A portion of each of the first detection wiring HCD-R and the second detection wiring HCD-L may overlap with the boundary between the active region AA and the via region PA.

[0157] According to one embodiment, the first detection wiring HCD-R can be disposed on a different layer than the second detection wiring HCD-L and the via wiring HCD-C. The first detection wiring HCD-R can be disposed separately from the second detection wiring HCD-L and the via wiring HCD-C, and a first detection insulating layer TIL1 is interposed between the first detection wiring HCD-R and the second detection wiring HCD-L and the via wiring HCD-C. The first detection wiring HCD-R and the via wiring HCD-C can be connected via a first contact hole CNT1 penetrating the first detection insulating layer TIL1.

[0158] The first detection wiring HCD-R can be disposed on a different layer than the first input trace wiring HCD-I1 and the second input trace wiring HCD-I2 through the first detection insulating layer TIL1. The first detection wiring HCD-R and the input trace wirings HCD-I1 and HCD-I2 can be connected via the second contact hole CNT2 that penetrates the first detection insulating layer TIL1.

[0159] According to one embodiment, the second detection wiring HCD-L can be disposed on the same layer as the via wiring HCD-C. The second detection wiring HCD-L and the via wiring HCD-C can be disposed on the first detection insulating layer TIL1. Therefore, the second detection wiring HCD-L can be directly connected to the via wiring HCD-C.

[0160] The second detection wiring HCD-L can be disposed on the same layer as the first output trace wiring HCD-O1 and the second output trace wiring HCD-O2. Therefore, the second detection wiring HCD-L can be directly connected to the first output trace wiring HCD-O1 and the second output trace wiring HCD-O2.

[0161] If the first detection wiring HCD-R and the second detection wiring HCD-L are located on the same layer, mutual electrical interference may degrade the reliability of fault detection. For example, when both the first detection wiring HCD-R and the second detection wiring HCD-L are located on the first detection insulating layer TIL1, they are connected to each other, allowing signals to be transmitted to the via wiring HCD-C to be transmitted directly from the first detection wiring HCD-R through the second detection wiring HCD-L without passing through the via wiring HCD-C. As a result, the reliability of the display module DM may be degraded in determining if a fault has occurred in the layer of the display module DM.

[0162] The first detection wiring HCD-R and the second detection wiring HCD-L can be formed using a conductive material through a photolithography process. If the first detection wiring HCD-R and the second detection wiring HCD-L are formed on the same layer, then due to the step CD at the boundary between the active region AA and the via region PA, a residual film is formed in the region where the conductive material is to be fully patterned, making it possible for the first detection wiring HCD-R and the second detection wiring HCD-L to be connected.

[0163] According to the present invention, the first detection wiring HCD-R and the second detection wiring HCD-L, connected to one end of the module hole HM, are spaced apart from each other in a plane by a separating space EG and disposed on different layers, while the first detection insulating layer TIL1 is located between the first detection wiring HCD-R and the second detection wiring HCD-L, so that the mutual interference between the active region AA and the hole region PA can be minimized. Therefore, the reliability of the display module DM used to determine the occurrence of cracks in the layers of the display module DM can be improved.

[0164] Figure 6A This is an enlarged view of a portion of an electronic device according to an embodiment of the present invention. Figure 6B It is along Figure 6A The figure shows a sectional view taken along line III-III'. The same reference numerals are used with respect to the reference numerals. Figures 1 to 5B The components described are the same as those described, and redundant descriptions of the same components are omitted.

[0165] The display module DM according to the embodiment (see also) Figure 4B It may include a first dummy pattern DM1 and a second dummy pattern DM2. The first dummy pattern DM1 and the second dummy pattern DM2 are configured to be separate from the break detection wiring HCD.

[0166] The first dummy pattern DM1 can be disposed on a plane in the partition space EG formed between the first detection wiring HCD-R and the second detection wiring HCD-L. The first dummy pattern DM1 is configured to be separate from the first detection wiring HCD-R and the second detection wiring HCD-L.

[0167] The first dummy pattern DM1 can be disposed on the same layer as the second detection wiring HCD-L and the first detection sensor SP1. The first dummy pattern DM1 can have the same grid shape as the first detection sensor SP1.

[0168] According to the present invention, since the first dummy pattern DM1 includes the same layer and the same shape as the first detection sensor SP1 disposed at the uppermost input detection member TU in the input detection member TU, the defect that the space between the first detection sensors SP1 spaced apart from each other can be prevented from being visually identified.

[0169] although Figure 6A A first dummy pattern DM1 is shown disposed between the partition spaces EG, but the inventive concept is not limited thereto, and the first dummy pattern DM1 can be used with the first detection sensor SP1 and the second detection sensor SP2 (see [reference]). Figure 4A The second connection pattern BP2 and the hole area PA are spaced apart and disposed in other areas on the first detection insulating layer TIL1.

[0170] The second dummy pattern DM2 includes a first sub-pattern DM2-1 and a second sub-pattern DM2-2. The second dummy pattern DM2 is disposed on the same layer as the first detection wiring HCD-R. The first sub-pattern DM2-1 may not overlap with the first detection wiring HCD-R and the second detection wiring HCD-L, and may be positioned to surround the via region PA, excluding the separation space EG. The second sub-pattern DM2-2 may not overlap with the first detection wiring HCD-R and the second detection wiring HCD-L, and may be disposed within the separation space EG.

[0171] A second dummy pattern DM2 is disposed on the flat inorganic film YIL and covered by the first detection insulating layer TIL1. The second dummy pattern DM2 is configured to surround the hole region PA, thereby blocking moisture and oxygen from flowing into the module hole HM through the module hole HM. Therefore, a display module DM with improved reliability can be provided.

[0172] Figure 7 This is an enlarged view of a portion of an electronic device according to an embodiment of the present invention. The same reference numerals are used interchangeably with those of the reference numerals. Figures 1 to 5B The components described are the same as those described, and redundant descriptions of the same components are omitted.

[0173] According to an embodiment, the breakage detection wiring HCD-1 includes a hole wiring HCD-C1, a first detection wiring HCD-R1, a second detection wiring HCD-L1, a first input trace wiring HCD-I1 and a second input trace wiring HCD-I2, as well as a first output trace wiring HCD-O1 and a second output trace wiring HCD-O2.

[0174] The via wiring HCD-C1 has a first width L1. At least one of the first detection wiring HCD-R1 and the second detection wiring HCD-L1 has a second width L2. According to one embodiment, the second width L2 may be greater than the first width L1.

[0175] The first detection sensor SP1 has a third width L3. According to one embodiment, the first width L1 of the via wiring HCD-C1 can be greater than or equal to the third width L3.

[0176] According to one embodiment, since the second width L2 of the first detection wiring HCD-R1 and the second detection wiring HCD-L1 is greater than the first width L1 of the via wiring HCD-C1 and the third width L3 of the first detection sensor SP1, the resistance value of the signal input from the first detection wiring HCD-R1 and the second detection wiring HCD-L1 to the via wiring HCD-C1 / the signal output from the via wiring can be reduced.

[0177] Figure 8A This is an enlarged view of a portion of an electronic device according to an embodiment of the present invention. Figure 8B It is along Figure 8A The figure shows a sectional view taken along line IV-IV'. The same reference numerals are used with respect to the reference numerals. Figures 1 to 5B The components described are the same as those described, and redundant descriptions of the same components are omitted.

[0178] According to an embodiment, the breakage detection wiring HCD-2 includes a hole wiring HCD-C2, a first detection wiring HCD-R2, a second detection wiring HCD-L2, a first input trace wiring HCD-I1 and a second input trace wiring HCD-I2, and a first output trace wiring HCD-O1 and a second output trace wiring HCD-O2.

[0179] The second detection wiring HCD-L2 and the via wiring HCD-C2 are disposed on a different layer than the first detection wiring HCD-R2. The first detection wiring HCD-R2 and the via wiring HCD-C2 can be connected through at least one contact hole.

[0180] For example, a portion of the first detection wiring HCD-R2 may extend in a shape corresponding to and overlap with a portion of the via wiring HCD-C2. The first detection wiring HCD-R2 may be connected to the via wiring HCD-C2 by penetrating the first sub-contact hole CNT1-1 and the second sub-contact hole CNT1-2 of the first detection insulating layer TIL1.

[0181] Figure 9A yes Figure 4A An enlarged plan view of area QQ'. The same reference numerals are used with the reference numerals. Figures 1 to 5B The components described are the same as those described, and redundant descriptions of the same components are omitted.

[0182] According to an embodiment, the breakage detection wiring HCD includes a hole wiring HCD-C, a first detection wiring HCD-R, a second detection wiring HCD-L, a first input trace wiring HCD-I1 and a second input trace wiring HCD-I2, and a first output trace wiring HCD-O1 and a second output trace wiring HCD-O2.

[0183] The via wiring HCD-C has an opening curve shape surrounding the module via HM. One end of the via wiring HCD-C is connected to a first detection wiring HCD-R, and the other end of the via wiring HCD-C is connected to a second detection wiring HCD-L. According to the present invention, the first detection wiring HCD-R and the second detection wiring HCD-L are disposed on different layers and are separated from each other in a plane. Therefore, the area where one end of the via wiring HCD-C faces each other can be an area that does not surround the module via HM.

[0184] According to the present invention, since the via wiring HCD-C has the shape of an opening curve surrounding the module via HM, the display module DM located in the region adjacent to the module via HM can be easily determined (see the invention). Figure 4A The occurrence of fractures in the layers.

[0185] Figure 9B This is a plan view of a crack detection wiring according to an embodiment of the present invention. The same reference numerals are used interchangeably with those of the reference numerals. Figures 1 to 5B The components described are the same as those described, and redundant descriptions of the same components are omitted.

[0186] According to an embodiment, the breakage detection wiring HCD includes a via wiring HCD-CA, a first detection wiring HCD-R, a second detection wiring HCD-L, a first input trace wiring HCD-I1 and a second input trace wiring HCD-I2, and a first output trace wiring HCD-O1 and a second output trace wiring HCD-O2.

[0187] The via wiring HCD-CA may include a first external wiring H1, a second external wiring H2, an internal wiring DC, and connecting wirings C1 and C2. The first external wiring H1, the second external wiring H2, the internal wiring DC, and the connecting wirings C1 and C2 are connected to each other to form an overall shape with an open curve.

[0188] The first external wiring H1 and the second external wiring H2 can be set separately from the module hole HM, while the internal wiring DC is located between the first external wiring H1 and the second external wiring H2 and the module hole HM. The internal wiring DC is set between the first external wiring H1 and the second external wiring H2 and the module hole HM, so as to be spaced apart from the first external wiring H1 and the second external wiring H2.

[0189] One end of the first external wiring H1 is connected to the second detection wiring HCD-L, and the other end of the first external wiring H1 is connected to one end of the internal wiring DC through the first connection wiring C1.

[0190] One end of the second external wiring H2 is connected to the first detection wiring HCD-R, and the other end of the second external wiring H2 is connected to the other end of the internal wiring DC through the second connection wiring C2.

[0191] The via wiring HCD-CA can have a shape that is symmetrical with respect to the centerline between the first detection wiring HCD-R and the second detection wiring HCD-L. Furthermore, the number of internal wiring DCs is not limited to one, as long as the internal wiring DCs have an overall shape with an opening curve.

[0192] According to one embodiment, by increasing the area of ​​the via wiring HCD-CA disposed in the via region PA, the display module DM disposed in the region adjacent to the module via HM can be easily determined (see [reference]). Figure 4A The occurrence of fractures in the layers.

[0193] According to the present invention, the crack detection wiring HCD disposed in the region adjacent to the module hole HM can effectively determine the occurrence of cracks in the layer of the display module DM.

[0194] Furthermore, mutual electrical interference between different parts of the breakage detection wiring HCD, which receives different signals, can be reduced by placing them on different layers. This allows for the provision of an electronic device EA with improved reliability.

[0195] Although exemplary embodiments of the inventive concept have been described, it is understood that the inventive concept should not be limited to these exemplary embodiments, and that various changes and modifications can be made by those skilled in the art within the scope and spirit of the inventive concept as claimed in the appended claims.

Claims

1. An electronic device, comprising: The display module is defined by a module hole that penetrates the display module. and Electronic modules overlapping with the module holes, The display module includes: The display component is divided into an active region, a peripheral region adjacent to the active region, and a hole region at least partially surrounded by the active region, and defines a groove that overlaps with and surrounds the hole region of the module hole. An input detection component is disposed on the display component and includes a detection insulating layer and a first conductive pattern and a second conductive pattern disposed on different layers, wherein the detection insulating layer is located between the first conductive pattern and the second conductive pattern; and The wiring includes hole wiring that overlaps with the hole region and first and second detection wiring that are spaced apart from each other and extend from the hole region to the peripheral region to connect with the hole wiring. The first detection wiring and the hole wiring are disposed on the detection insulating layer and directly connected, and the second detection wiring is disposed below the detection insulating layer and connected to the hole wiring through a contact hole defined in the detection insulating layer.

2. The electronic device of claim 1, wherein the hole wiring overlaps with the groove on the plane.

3. The electronic device according to claim 1, wherein the first detection wiring and the first conductive pattern are disposed on the same layer, and the second detection wiring and the second conductive pattern are disposed on the same layer.

4. The electronic device according to claim 1, wherein the display module further comprises: A dummy pattern is disposed on a plane between the first detection wiring and the second detection wiring, and the dummy pattern is disposed on the same layer as the first detection wiring.

5. The electronic device of claim 4, wherein the dummy pattern is provided as a plurality of dummy patterns, and The plurality of dummy patterns are arranged at intervals from each other in the direction from the first detection wiring toward the second detection wiring.

6. The electronic device of claim 1, wherein the first width of at least one of the first detection wiring and the second detection wiring is greater than the second width of the hole wiring.

7. The electronic device of claim 1, wherein the display module includes a flat portion disposed between the display member and the input detection member. The flat portion includes: A flat organic film overlapping the aperture region of the display component, and a flat inorganic film covering the flat organic film and overlapping the active region and the aperture region, and The first conductive pattern is directly disposed on the flat inorganic film.

8. The electronic device of claim 1, wherein the boundary between the active region and the aperture region has a step, and a portion of each of the first detection wiring and the second detection wiring overlaps with the boundary.

9. The electronic device of claim 1, wherein the input detection component comprises: The first detection electrode includes a first detection sensor extending in a first direction and a first connection pattern connected to the first detection sensor. The second detection electrode includes a second detection sensor extending in a second direction intersecting the first direction and a second connection pattern connecting the second detection sensor. and Detection trace wiring connected to each of the first and second detection electrodes and extending into the peripheral region. The first conductive pattern includes the first connection pattern, and The second conductive pattern includes the first detection sensor, the second detection sensor, and the second connection pattern.

10. The electronic device of claim 9, wherein the wiring comprises: The input trace wiring and output trace wiring are respectively connected to the first detection wiring and the second detection wiring and extend to the peripheral area. The input trace wiring and the output trace wiring are disposed on the same layer as the second conductive pattern.

11. The electronic device of claim 10, wherein the second detection wiring is connected to the input trace wiring through at least one contact hole penetrating the detection insulating layer. The first detection wiring is directly connected to the output trace wiring.

12. The electronic device of claim 10, wherein the via wiring includes an opening curve of integral shape. The first end of the hole wiring is connected to the first detection wiring, and the second end of the hole wiring is connected to the second detection wiring.

13. The electronic device according to claim 1, wherein the electronic module includes at least one of an audio output module, a light-emitting module, a light-receiving module, and a camera module.

14. An electronic device comprising: The display module includes a front surface and a rear surface opposite to the front surface, and includes a module hole penetrating from the front surface to the rear surface; and Electronic modules overlapping with the module holes, The display module includes: The display component includes a substrate having a recess at least partially recessed to surround the module hole and a pixel disposed on the substrate, and the display component is divided into an active region where the pixel is disposed, a peripheral region adjacent to the active region and a hole region at least partially surrounded by the active region. An input detection component is disposed on the display component to detect external input, and includes a detection insulating layer and a first conductive pattern and a second conductive pattern disposed on different layers, wherein the detection insulating layer is located between the first conductive pattern and the second conductive pattern; and The breakage detection wiring includes hole wiring spaced apart from the first conductive pattern and the second conductive pattern and disposed in the hole region, and a first detection wiring and a second detection wiring spaced apart from each other on a plane and extending from the hole region to the peripheral region to connect with the hole wiring. The first detection wiring and the second detection wiring are disposed on different layers, while the detection insulation layer is located between the first detection wiring and the second detection wiring.

15. The electronic device of claim 14, wherein the hole wiring overlaps with the groove on the plane.

16. The electronic device of claim 14, wherein the first detection wiring is disposed on the same layer as the first conductive pattern, and the second detection wiring is disposed on the same layer as the second conductive pattern.

17. The electronic device of claim 16, wherein the hole wiring is disposed on the same layer as either the first detection wiring or the second detection wiring.

18. The electronic device of claim 14, wherein the display module further comprises: A dummy pattern is set in the partition space, and the dummy pattern is set on the same layer as the first detection wiring.

19. The electronic device of claim 14, wherein the display module further comprises: Multiple dummy patterns are arranged at intervals in the direction from the first detection wiring toward the second detection wiring.

20. The electronic device of claim 14, wherein the first width of at least one of the first detection wiring and the second detection wiring is greater than the second width of the hole wiring.

21. The electronic device of claim 14, wherein the input detection component comprises: The first detection electrode includes a first detection sensor extending in a first direction and a first connection pattern connected to the first detection sensor. The second detection electrode includes a second detection sensor extending in a second direction intersecting the first direction and a second connection pattern connecting the second detection sensor. and Detection trace wiring connected to each of the first and second detection electrodes and extending into the peripheral region. The first conductive pattern includes the first connection pattern. The second conductive pattern includes the first detection sensor, the second detection sensor, and the second connection pattern. The breakage detection wiring includes: an input trace wiring and an output trace wiring respectively connected to the first detection wiring and the second detection wiring and extending to the peripheral region, and The input trace wiring and the output trace wiring are disposed on the same layer as the second conductive pattern.

22. The electronic device of claim 21, wherein the first detection wiring is connected to a first end of the hole wiring and the input trace wiring via at least one contact hole penetrating the detection insulating layer. The second detection wiring is directly connected to the second end of the hole wiring and the output trace wiring.

23. The electronic device of claim 14, wherein the via wiring includes an opening curve of integral shape. The first end of the hole wiring is connected to the first detection wiring, and the second end of the hole wiring is connected to the second detection wiring.

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