Maintenance device, vacuum processing system and maintenance method

Abstract

The maintenance device includes: a shell having an opening portion, the opening portion has a size corresponding to the second opening and closing door of a vacuum processing device in which a first opening and closing door and a second opening and closing door are provided in a processing container, the first opening and closing door is used for bringing in and out of substrates, and the second opening and closing door is different from the first opening and closing door, and the opening portion can be airtightly installed on the second opening and closing door; a decompression mechanism for decompressing the interior of the shell; and a suction mechanism arranged inside the shell, which can enter the processing container through the opening portion and suction the attachments of the object in the processing container.

Description

Technical Field

[0001] The invention relates to a maintenance device, a vacuum processing system and a maintenance method. Background Art

[0002] Vacuum processing apparatuses are known that place substrates such as semiconductor wafers (hereinafter referred to as "wafers") in a vacuum processing chamber to perform various substrate processes. In order to reduce downtime, such vacuum processing apparatuses require cleaning the processing chamber without exposing the chamber to the atmosphere.

[0003] In this regard, the following technology is disclosed in Patent Document 1: In a processing container, in addition to a first opening and closing door for sending substrates in and out, a second opening and closing door on which a maintenance device having an adsorption unit can be installed is provided, and the processing container is cleaned by having the adsorption unit adsorb unnecessary items in the processing container.

[0004] Prior art literature

[0005] Patent Literature

[0006] Patent Document 1: Japanese Patent Application Publication No. 2018-133464 Summary of the Invention

[0007] Technical problem to be solved by the invention

[0008] The present invention provides a technology capable of efficiently cleaning the interior of a processing container without opening the container to the atmosphere.

[0009] Means for solving technical problems

[0010] A maintenance device according to one embodiment of the present invention includes: a shell having an opening portion, the opening portion having a size corresponding to the second opening and closing door of a vacuum processing device in which a first opening and closing door and a second opening and closing door are provided in a processing container, the first opening and closing door being used for bringing in and out of substrates, the second opening and closing door being different from the first opening and closing door, and the opening portion being airtightly mounted on the second opening and closing door; a decompression mechanism for decompressing the interior of the shell; and a suction mechanism arranged inside the shell, which can enter the processing container through the opening portion and suction attachments of an object in the processing container.

[0011] Effects of the Invention

[0012] According to the present invention, it is possible to efficiently clean the inside of a processing container without opening the container to the atmosphere. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1This is a diagram schematically showing a plasma etching apparatus according to an embodiment.

[0014] Figure 2 It is a cross-sectional view schematically showing the maintenance device according to the embodiment.

[0015] Figure 3 It is a diagram showing the details of the suction mechanism according to the embodiment.

[0016] Figure 4 This is a diagram showing an example of the arrangement of the suction port, the supply port, the irradiation unit, and the imaging unit according to the embodiment.

[0017] Figure 5 This is a diagram showing another example of the arrangement of the suction port, the supply port, the irradiation unit, and the imaging unit according to the embodiment.

[0018] Figure 6 This is a flowchart showing an example of processing operations of the vacuum processing system according to the embodiment.

[0019] Figure 7A This is a diagram for explaining an example of the operation when the edge ring is carried out from the processing container and the mounting table is cleaned.

[0020] Figure 7B This is a diagram for explaining an example of the operation when the edge ring is carried out from the processing container and the mounting table is cleaned.

[0021] Figure 8 This is a flowchart showing an example of a process for cleaning a stage.

[0022] Figure 9A This is a diagram for explaining an example of the operation when the edge ring is introduced into the processing container.

[0023] Figure 9B This is a diagram for explaining an example of the operation when the edge ring is introduced into the processing container.

[0024] Figure 9C This is a diagram for explaining an example of the operation when the edge ring is introduced into the processing container.

[0025] Figure 10 This is a flowchart showing an example of a process for correcting the position of the edge ring after it is fed.

[0026] Figure 11 1 is a diagram showing an example of an imaging position of an imaging unit. DETAILED DESCRIPTION

[0027] Hereinafter, embodiments of the maintenance device, vacuum processing system, and maintenance method of the present invention will be described in detail with reference to the accompanying drawings. In the accompanying drawings, identical or corresponding parts are denoted by the same reference numerals. Furthermore, the processing device of the present invention is not limited to this embodiment.

[0028] [Structure of the device to be maintained]

[0029] The maintenance target device, which is the target of maintenance by the maintenance device, is described below. The maintenance target device is a vacuum processing device that places substrates such as wafers in a vacuum processing chamber and performs predetermined substrate processing. In this embodiment, the maintenance target device is described as a plasma etching device that performs plasma etching on substrates. However, the maintenance target device is not limited to plasma etching devices.

[0030] Figure 1 This diagram schematically illustrates a plasma etching apparatus according to an embodiment. Plasma etching apparatus 10 includes a processing vessel 30 that is airtight and electrically grounded. Processing vessel 30 is cylindrical and made, for example, of aluminum with an anodized film formed on its surface. Processing vessel 30 defines a processing space where plasma is generated. A stage 31 capable of horizontally supporting a wafer W is housed within processing vessel 30.

[0031] The mounting table 31 has a substantially cylindrical shape with a bottom surface facing vertically, and its upper surface serves as a mounting surface 36 d. The mounting surface 36 d of the mounting table 31 is slightly smaller than the wafer W. The mounting table 31 includes a base 33 and an electrostatic chuck 36 .

[0032] The susceptor 33 is made of a conductive metal such as aluminum. The susceptor 33 functions as a lower electrode and is supported on an insulator support 34 provided at the bottom of the processing chamber 30 .

[0033] A convex substrate mounting portion is formed in the upper center portion of the electrostatic chuck 36. The upper surface of this substrate mounting portion serves as a mounting surface 36d capable of mounting the wafer W. The electrostatic chuck 36 is disposed in the center of the mounting table 31 when viewed from above. The electrostatic chuck 36 is an example of a mounting portion capable of mounting a substrate. The electrostatic chuck 36 includes an electrode 36a and an insulator 36b. The electrode 36a is disposed within the insulator 36b, and a DC power supply 42 is connected to the electrode 36a. The electrostatic chuck 36 is configured to attract the wafer W by Coulomb force by applying a DC voltage from the DC power supply 42 to the electrode 36a. Furthermore, the electrostatic chuck 36 is provided with a heater 36c within the insulator 36b. The heater 36c can be supplied with electrical power via a power supply mechanism (described later) to control the temperature of the wafer W.

[0034] In addition, an outer peripheral portion formed by an insulator 36b and lower than the loading surface 36d is provided around the loading surface 36d of the loading table 31, and the upper surface of the outer peripheral portion is an ER loading surface 36f for loading the edge ring 35. An edge ring 35 formed of, for example, single crystal silicon is provided on the ER loading surface 36f of the loading table 31. The electrostatic chuck 36 has a pair of electrodes 36g and 36h at a position overlapping with the edge ring 35 when viewed from above. The pair of electrodes 36g and 36h are provided inside the insulator 36b. The electrostatic chuck 36 is configured to be able to adsorb the edge ring 35 by using Coulomb force by applying a DC voltage to the pair of electrodes 36g and 36h from a DC power supply not shown in the figure. In addition, Figure 1 In the example shown, a pair of electrodes 36g and 36h are provided in the electrostatic chuck 36, but a pair of electrodes 36g and 36h may be provided in a ring-shaped dielectric body separate from the electrostatic chuck 36. Figure 1 In the example shown, a pair of electrodes 36g and 36h constitutes a bipolar electrode, but a monopolar electrode may be used instead of the pair of electrodes 36g and 36h. Furthermore, a cylindrical inner wall member 37 made of, for example, quartz is provided to surround the mounting table 31 and the support table 34.

[0035] The power supply rod 50 is connected to the susceptor 33. A first RF power supply 40a is connected to the power supply rod 50 via a first matching unit 41a, and a second RF power supply 40b is connected to the power supply rod 50 via a second matching unit 41b. The first RF power supply 40a is a power supply for plasma generation and can supply high-frequency electric power of a predetermined frequency to the susceptor 33 of the mounting table 31. The second RF power supply 40b is a power supply for ion introduction (biasing) and can supply high-frequency electric power of a predetermined frequency lower than that of the first RF power supply 40a to the susceptor 33 of the mounting table 31.

[0036] A flow path 33d is formed within the susceptor 33. One end of the flow path 33d is connected to the heat transfer fluid inlet pipe 33b, and the other end of the flow path 33d is connected to the heat transfer fluid outlet pipe 33c. The plasma etching apparatus 10 is configured to control the temperature of the mounting table 31 by circulating a heat transfer fluid, such as a highly insulating, low-viscosity fluorine-based inert liquid or pure water, through the flow path 33d. Alternatively, the plasma etching apparatus 10 may be configured to provide flow paths within the susceptor 33 corresponding to the areas where the wafer W and edge ring 35 are respectively mounted, thereby enabling independent temperature control of the wafer W and edge ring 35. Alternatively, the plasma etching apparatus 10 may be configured to supply a heat transfer gas to the back side of the wafer W and edge ring 35 to independently control the temperature. For example, a gas supply pipe for supplying a heat transfer gas (backside gas) such as helium to the back side of the wafer W may be provided through the mounting table 31. The gas supply pipe is connected to a gas supply source. With these structures, the wafer W held by the electrostatic chuck 36 on the upper surface of the mounting table 31 by suction can be controlled to a predetermined temperature.

[0037] On the other hand, a shower head 46 serving as an upper electrode is provided above the mounting table 31 so as to face the mounting table 31 in parallel. The shower head 46 and the mounting table 31 function as a pair of electrodes (an upper electrode and a lower electrode).

[0038] The showerhead 46 is mounted on the top wall of the processing container 30. The showerhead 46 includes a main body 46a and an upper top plate 46b that serves as an electrode plate. The showerhead 46 is supported on the top of the processing container 30 via an insulating member 47. The main body 46a is made of a conductive material, such as aluminum with an anodized film formed on its surface, and is configured to detachably support the upper top plate 46b at its lower portion.

[0039] A gas diffusion chamber 46c is provided within the main body 46a. A plurality of gas flow holes 46d are formed at the bottom of the main body 46a, positioned below the gas diffusion chamber 46c. Furthermore, gas inlet holes 46e are provided in the upper top plate 46b, overlapping with the gas flow holes 46d and extending through the thickness of the upper top plate 46b. This structure allows the processing gas supplied to the gas diffusion chamber 46c to be dispersed and supplied into the processing container 30 in a spray-like manner via the gas flow holes 46d and the gas inlet holes 46e.

[0040] A gas inlet port 46g for introducing a process gas into the gas diffusion chamber 46c is formed in the main body 46a. The gas inlet port 46g is connected to one end of a gas supply pipe 45a. The other end of the gas supply pipe 45a is connected to a process gas supply source 45 for supplying process gas. A mass flow controller (MFC) 45b and an on-off valve V2 are provided in sequence on the gas supply pipe 45a from the upstream side. The process gas for plasma etching is supplied from the process gas supply source 45 to the gas diffusion chamber 46c via the gas supply pipe 45a, and is dispersed and supplied into the process container 30 in a spray shape from the gas diffusion chamber 46c via the gas flow hole 46d and the gas inlet port 46e.

[0041] The shower head 46, which serves as the upper electrode, is electrically connected to a variable DC power supply 48b via a low-pass filter (LPF) 48a. The variable DC power supply 48b is configured to be able to be turned on / off by an on / off switch 48c. The current / voltage of the variable DC power supply 48b and the on / off operation of the on / off switch 48c are controlled by a control unit 90, which will be described later. Furthermore, as will be described later, when high frequencies are applied to the mounting table 31 from the first RF power supply 40a and the second RF power supply 40b to generate plasma in the processing space, the control unit 90 turns on the on / off switch 48c as needed to apply a predetermined DC voltage to the shower head 46, which serves as the upper electrode.

[0042] Furthermore, a cylindrical ground conductor 30a is provided so as to extend from the side wall of the processing container 30 to a position above the height position of the shower head 46. The cylindrical ground conductor 30a has a ceiling at its upper portion.

[0043] An exhaust port 81 is formed at the bottom of the processing container 30 and is connected to an exhaust device 83 via an exhaust pipe 82. The exhaust device 83 includes a vacuum pump and can reduce the pressure in the processing container 30 to a predetermined vacuum level by operating the vacuum pump.

[0044] On the other hand, a first opening and closing door 84 for loading and unloading wafers W is provided on a side wall within the processing chamber 30. A gate valve G is provided on the first opening and closing door 84 for opening and closing the first opening and closing door 84. The first opening and closing door 84 is connected to the vacuum transfer chamber via the gate valve G while maintaining airtightness, enabling wafers W to be loaded and unloaded into and out of the vacuum transfer chamber while maintaining a vacuum atmosphere.

[0045] A deposit guard 86 is provided along the inner wall of the side of the processing container 30. The deposit guard 86 prevents reaction products (deposits) generated by the etching process using plasma from adhering to the processing container 30. The deposit guard 86 is detachable.

[0046] The plasma etching apparatus 10 having the above-described structure can be comprehensively controlled by the control unit 90. The control unit 90 is, for example, a computer and can control each unit of the plasma etching apparatus 10. The plasma etching apparatus 10 can be comprehensively controlled by the control unit 90.

[0047] However, in the plasma etching apparatus 10, reaction products and particles accumulate as deposits within the processing vessel 30, and therefore, the processing vessel 30 must be cleaned regularly. In the plasma etching apparatus 10, when the processing vessel 30 is opened to the atmosphere for cleaning, considerable time (downtime) is required to adjust the temperature and control the moisture content within the processing vessel 30 before resuming etching of the wafer W. This results in reduced productivity of the plasma etching apparatus 10. Therefore, to reduce downtime, it is preferable to clean the processing vessel 30 without opening the processing vessel 30 to the atmosphere.

[0048] Furthermore, the plasma etching apparatus 10 includes consumable components that are gradually consumed by repeated etching processes using plasma. An example of a consumable component is an edge ring 35 disposed on the outer periphery of a wafer W placed on the mounting surface 36d of the mounting table 31. Edge ring 35 is worn away by exposure to the plasma and, therefore, requires regular replacement. Such consumable components are typically replaced by opening the processing vessel 30 to the atmosphere. However, in the plasma etching apparatus 10, replacing consumable components while opening the processing vessel 30 to the atmosphere results in downtime. Therefore, to reduce downtime, it is preferable to replace consumable components without opening the processing vessel 30 to the atmosphere.

[0049] Therefore, in the plasma etching apparatus 10, in addition to the first opening and closing door 84 for carrying in and out the wafer W, an opening and closing door for cleaning the inside of the processing container 30 and replacing consumable parts is provided in the processing container 30. For example, in the plasma etching apparatus 10, as shown in FIG. Figure 1 As shown, a second opening and closing door 95 is provided on the side of the mounting table 31 on which the wafer W is mounted, opposite to the first opening and closing door 84. The second opening and closing door 95 is airtightly sealed by a cover 96. Furthermore, a maintenance device 100, described later, can be detachably mounted on the second opening and closing door 95. When performing maintenance such as cleaning the interior of the processing container 30 or replacing consumable parts, the operator mounts the maintenance device 100 on the plasma etching apparatus 10 to be maintained.

[0050] [Structure of maintenance device]

[0051] Next, the structure of the maintenance device 100 according to the embodiment will be described. Figure 2 It is a cross-sectional view schematically showing the maintenance device 100 according to the embodiment. Figure 2 The maintenance device 100 is shown mounted on the plasma etching apparatus 10. The plasma etching apparatus 10 is shown simplified in the following figures. The structure of the maintenance device 100 will be described below, along the flow of cleaning the mounting table 31, which is an object within the processing container 30, and replacing the edge ring 35, which is a consumable component.

[0052] The maintenance device 100 includes a housing 101 having an opening 101A formed therein. The opening 101A has dimensions corresponding to the second opening and closing door 95 of the plasma etching apparatus 10. The dimensions corresponding to the second opening and closing door 95 are dimensions sufficient to allow the suction mechanism 110 and edge ring 35 (described later) to be moved between the housing 101 and the processing vessel 30, or to be transported in and out, via the second opening and closing door 95. The dimensions corresponding to the second opening and closing door 95 may be any dimensions as long as they allow the suction mechanism 110 and edge ring 35 to be moved between the housing 101 and the processing vessel 30, or to be transported in and out. The housing 101 is provided with sealing members such as O-rings around the opening 101A in the portion that contacts the plasma etching apparatus 10. The housing 101 is mounted on a transport vehicle 102. The transport vehicle 102 transports the maintenance device 100 to the location of the plasma etching apparatus 10, where the opening 101A of the housing 101 is positioned so that it corresponds to the second opening and closing door 95. Then, the opening portion 101A of the housing is airtightly attached to the second opening and closing door 95 by screwing or the like.

[0053] The housing 101 is composed of a first housing 101B and a second housing 101C communicating with the first housing 101B via an openable and closable opening and closing member 101D. A suction mechanism 110 described later is housed in the first housing 101B. An opening 101A is formed in the second housing 101C.

[0054] The first housing 101B is connected to a first pipe 103A provided with a first valve 104A. The second housing 101C is connected to a second pipe 103B provided with a second valve 104B. The first pipe 103A and the second pipe 103B are connected to the vacuum pump 103 via a common pipe 103C. The vacuum pump 103 is mounted on a loading platform 102A provided in the transport vehicle 102. The second pipe 103B branches off into a leakage pipe 103D midway to the common pipe 103C. A leakage valve 104D is provided in the leakage pipe 103D. The vacuum pump 103, the first pipe 103A, the second pipe 103B, and the common pipe 103C constitute a pressure reducing mechanism for reducing the pressure inside the housing 101. The maintenance device 100 can use the decompression mechanism to reduce the pressure inside the housing 101 to a predetermined vacuum level, making it equal to the pressure inside the processing container 30 , and then remove the cover 96 to connect the housing 101 and the processing container 30 through the opening 101A and the second opening and closing door 95 .

[0055] Furthermore, the maintenance device 100 includes a suction mechanism 110 inside the housing 101 (first housing 101B) for sucking objects adhering to the mounting table 31 in the processing container 30 .

[0056] Figure 3 1 is a diagram showing details of the suction mechanism 110 according to the embodiment. The suction mechanism 110 includes a robot arm 111 , a suction port 112 provided at the front end of the robot arm 111 , a supply port 113 , an irradiation unit 114 , and an imaging unit 115 .

[0057] The robotic arm 111 consists of an arm 121 formed by connecting two arm elements via a joint, a support 122 that supports the arm 121 rotatably and elevatably, and a head 123 located at the distal end of the arm 121. The robotic arm 111 can be extended or retracted by extending the two arm elements of the arm 121 linearly or overlapping them. The robotic arm 111 can move the head 123 at the distal end of the arm 121 vertically by raising or lowering the arm 121 using the support 122. The robotic arm 111 can extend the two arm elements of the arm 121 toward the opening 101A, allowing the head 123 to approach the platform 31 through the opening 101A. The movement of the robotic arm 111 is comprehensively controlled by a control unit (not shown). The control unit includes a user interface capable of receiving various operational instructions and displaying operational status. The operator can provide operational instructions to the user interface. Operational instructions, for example, individually specify the movement of the robotic arm 111. Alternatively, the operation instruction may specify a series of actions. For example, the operation instruction may specify a series of actions of the robot arm 111 when sucking an object attached to the mounting table 31 as a suction instruction.

[0058] The head portion 123 is provided with a suction port 112, a supply port 113, an irradiation unit 114, and an imaging unit 115. The positions of the suction port 112, the supply port 113, the irradiation unit 114, and the imaging unit 115 will be described later.

[0059] When the head 123 approaches the mounting table 31, the suction port 112 can suck the attached matter on the mounting table 31. Specifically, the suction port 112 is connected to the exhaust device 131 on the mounting table 102A via an exhaust pipe 131A provided with a valve 131B and extending through the robot arm 111. The exhaust operation of the exhaust device 131 suctions the attached matter on the mounting table 31.

[0060] By bringing the head 123 close to the stage 31, the supply port 113 can supply gas to the stage 31. The gas supplied from the supply port 113 is an inert gas, a gas that can react with the attachments to facilitate the suction of the attachments on the stage 31, or a gas that can react with the attachments to vaporize the attachments. As an inert gas, for example, Ar, N2 or dry air can be used. When using an inert gas, the gas flow rate is appropriately set so that the attachments attached to the stage 31 can be blown away. As a gas that can react with the attachments to facilitate the suction of the attachments from the stage 31, or a gas that can react with the attachments to vaporize the attachments, for example, nitrogen trifluoride gas (NF3), fluorine gas (F2) and the like can be listed. The suction port 112 can suction the attachments together with the gas supplied from the supply port 113. The supply port 113 is connected to a gas supply source (not shown) via a pipe running through the robot arm 111, and can supply the gas supplied from the gas supply source to the stage 31.

[0061] By bringing the head 123 close to the mounting table 31, the irradiation unit 114 can irradiate the mounting table 31 with plasma, thereby removing deposits from the mounting table 31. The irradiation unit 114 can reduce the adhesion of the deposits or vaporize the deposits by causing ions and / or radicals in the plasma to react with the deposits. The deposits with reduced adhesion or vaporized deposits are then detached from the mounting table 31 and sucked through the suction port 112. For example, the irradiation unit 114 can irradiate the mounting table 31 with plasma generated by applying high-frequency electric power to a gas such as an oxygen-containing gas (O2, CO2, etc.), a gas containing an oxygen-containing gas and a rare gas (such as a gas containing O2 and Ar), or a fluorine-containing gas (such as CF4). Alternatively, the irradiation unit 114 can irradiate the mounting table 31 with a laser, or with both plasma and laser light. The laser can be any laser that can heat the deposits and reduce their adhesion. The laser can also be a laser with a wavelength that can vaporize the deposits. For example, a semiconductor laser having a wavelength of 808 nm, a laser spot area of ​​0.5 to 3 mm, and a laser power of 200 W may be used. Alternatively, the irradiation unit 114 may irradiate the mounting table 31 with the laser in an environment in which a gas having the effect of reducing the adhesion of deposits and / or vaporizing deposits (e.g., ozone gas) is present.

[0062] The imaging unit 115 is, for example, an image sensor. By bringing the head 123 close to the stage 31, the imaging unit 115 can capture an image of the stage 31. Alternatively, the imaging unit 115 can capture an image of the stage 31 while irradiating light as needed. The operation of the imaging unit 115 can be comprehensively controlled by a control unit (not shown). The imaging unit 115 outputs an image obtained by capturing the stage 31 to the control unit. The control unit detects whether there is any attachment on the stage 31 from the captured image. When the control unit detects attachment from the captured image, it controls the exhaust device 131 to start suctioning the attachment from the suction port 112.

[0063] Exhaust pipe 131A is also equipped with a measuring device 132. Measuring device 132 measures the diameter and number of particles flowing through exhaust pipe 131A, and outputs information on the number of particles in each specified particle size category and the total number of particles to a control unit (not shown). While suction is being performed through suction port 112, the control unit monitors whether the number of particles in each specified particle size category and the total number of particles obtained from measuring device 132 are below a predetermined threshold value. If the number of particles in each specified particle size category and the total number of particles are below the predetermined threshold value, the control unit controls exhaust device 131 to stop suction from suction port 112.

[0064] Figure 4This is a diagram showing an example of the arrangement of the suction port 112 , the supply port 113 , the irradiation unit 114 , and the imaging unit 115 according to the embodiment. Figure 4 A diagram showing the head 123 of the robot arm 111 as viewed from the bottom. The head 123 is formed into a rectangular shape in which a pair of short sides are arranged to sandwich the arm 121 when viewed from above. The suction port 112 is provided along each short side at a position inside a pair of short sides of the head 123. The supply port 113 is provided at a position adjacent to one of the two suction ports 112, and the irradiation portion 114 is provided at a position adjacent to the other of the two suction ports 112. The imaging portion 115 is provided corresponding to the position of the long side on the side opposite to the arm 121 among the pair of long sides of the head 123. In addition, Figure 4 The positions of the suction port 112, the supply port 113, the irradiation unit 114 and the imaging unit 115 are just one example and are not limited thereto. Figure 5 As shown, the irradiation portion 114 is provided at a position on the inner side of a pair of short sides of the head portion 123 so as to surround the outer periphery of each of the supply port 113 and the irradiation portion 114 . Figure 5 This is a diagram showing another example of the arrangement of the suction port 112 , the supply port 113 , the irradiation unit 114 , and the imaging unit 115 according to the embodiment.

[0065] Return to Figure 2 The maintenance device 100 has a conveying mechanism 140 inside the housing 101 for conveying the edge ring 35 from the processing container 30 and for conveying the edge ring 35 into the processing container 30. The conveying mechanism 140 is composed of a multi-jointed arm 141, a support 142 that can support the arm 141 rotatably and liftably, and a fork 143 provided at the front end of the arm 141. The conveying mechanism 140 can be extended and retracted by extending the arm 141 linearly or overlapping each other. The conveying mechanism 140 can move the fork 143 at the front end of the arm 141 in the vertical direction by raising and lowering the arm 141 using the support 142. The operation of the conveying mechanism 140 can be comprehensively controlled by a control unit (not shown). The control unit has a user interface that can receive various operation instructions and display the operation status. The operator can give operation instructions to the user interface. The operation instruction is, for example, an operation instruction that specifies the operation of the conveying mechanism 140 individually. Alternatively, the operation instruction can specify a series of operations. For example, the operation instruction may be a conveyance instruction that specifies a series of operations of the conveyance mechanism 140 when conveying the edge ring 35 in and out.

[0066] Inside housing 101, as an example, three tiers of support platforms 105 are arranged at predetermined intervals. Two of the three tiers of support platforms 105 each have a replacement edge ring 35 placed on them. The remaining support platform 105 remains empty to hold a used edge ring 35. The replacement edge ring 35 can be, for example, a new, unused edge ring. Alternatively, the replacement edge ring 35 can be a partially used edge ring with a relatively low consumption.

[0067] Next, refer to Figure 6 Specific processing operations of the vacuum processing system including the plasma etching apparatus 10 and the maintenance apparatus 100 will be described. Figure 6 This is a flowchart showing an example of processing operations of the vacuum processing system according to the embodiment. Figure 6 The processing operations shown are mainly executed under the control of a control unit (not shown).

[0068] First, with the edge ring 35 placed on the mounting table 21 , dry cleaning of the processing container 30 is performed (step S101 ).

[0069] When the dry cleaning is completed, the maintenance device 100 is installed in the plasma etching device 10 (step S102 ).

[0070] When the installation of the maintenance device 100 is completed, the edge ring 35 is carried out of the processing container 30 (step S103 ).

[0071] Next, the mounting table 31 in the processing container 30 is cleaned by the maintenance device 100 (step S104 ).

[0072] When cleaning is completed, the edge ring 35 for replacement is placed into the processing container 30 (step S105 ).

[0073] Then, the position of the edge ring 35 is corrected (step S106 ).

[0074] Next, refer to Figure 7A 、 Figure 7B and Figure 8 An example of the operation when the edge ring 35 is sent out from the processing container 30 and the mounting table 31 is cleaned will be described. Figure 6 A and Figure 6 B is a diagram for explaining an example of the operation when the edge ring 35 is carried out from the processing container 30 and the mounting table 31 is cleaned. Figure 8 : is a flowchart showing an example of a process for cleaning the mounting table 31. Figure 8 Equivalent to Figure 6 The processing of step S104 in .

[0075] The operator moves the transport vehicle 102 to transport the maintenance device 100 to the position of the plasma etching device 10. At this time, the first valve 104A is controlled to be in the open state. Then, the vacuum pump 103 depressurizes the interior of the first shell 101B when the opening and closing component 101D is closed. In addition, the maintenance device 100 can also be configured to be automatically transported to the position of the plasma etching device 10 based on an instruction from the control unit 90 or an instruction from a remote controller. Next, the opening portion 101A of the shell 101 (second shell 101C) is airtightly mounted on the second opening and closing door 95. When the opening portion 101A of the shell 101 (second shell 101C) is mounted on the second opening and closing door 95, the first valve 104A is switched from the open state to the closed state, and the second valve 104B is controlled to be in the open state. Then, the vacuum pump 106 depressurizes the interior of the second shell 101C. This reduces the pressure inside both the first housing 101B and the second housing 101C, that is, the entire interior of the housing 101. Next, the opening and closing member 101D is opened, allowing the first housing 101B and the second housing 101C to communicate. The second valve 104B is then switched from open to closed.

[0076] The maintenance device 100 has a disassembly unit (not shown) inside the housing 101 for removing the cover 96 of the plasma etching device 10. Figure 6 As shown in Figure A, the removal unit removes the cover 96 from the second opening and closing door 95 and retracts the removed cover 96 to a retracted position within the housing 101. This establishes communication between the housing 101 and the processing container 30 via the opening 101A and the second opening and closing door 95. When the housing 101 and processing container 30 are in communication, lift pins (not shown) protrude from the mounting table 31, positioning the edge ring 35 above the mounting table 31. Furthermore, if the edge ring 35 is electrostatically attracted, the lift pins protrude after the electrostatic attraction is released, positioning the edge ring 35 above the mounting table 31. The transport mechanism 140, using the support portion 142, moves the fork 143 at the tip of the arm 141 to a height corresponding to the opening 101A. The transport mechanism 140 extends the arm 141 toward the opening 101A, moving the fork 143 below the edge ring 35 through the opening 101A. When the lift pins descend, the transport mechanism 140 receives the edge ring 35 supported by the lift pins using the fork 143. The transport mechanism 140 retracts the arm 141 while holding the edge ring 35, and transports the edge ring 35 out of the processing container 30.

[0077] Then, if Figure 7AAs shown by the dotted line, the conveying mechanism 140 moves the fork 143 holding the edge ring 35 to a height corresponding to the empty support table 105. The conveying mechanism 140 moves the arm 141 toward the empty support table 105, moving the edge ring 35 above the empty support table 105. The conveying mechanism 140 lowers the arm 141 and deposits the edge ring 35 on the empty support table 105.

[0078] Then, if Figure 7B As shown, the robot arm 111 uses the support portion 122 to move the head 123 at the front end of the arm 121 to a height corresponding to the opening 101A. The robot arm 111 extends the arm 121 toward the opening 101A and moves the head 123 closer to the mounting table 31 through the opening 101A. Figure 8 As shown, the imaging unit 115 captures the mounting table 31 from above and outputs the captured image to the control unit (not shown) (step S111). Specifically, the imaging unit 115 captures the mounting surface 36d, outer peripheral surface 36e, and ER mounting surface 36f of the electrostatic chuck 36 and outputs the captured image to the control unit. The control unit compares the captured image with a reference image previously captured of a cleaned or new mounting table 31 to detect the presence of attached objects on the mounting table 31 (step S112). If attached objects are detected in the captured image (step S113: Yes), the control unit moves the suction port 112 to the location of the attached objects and controls the exhaust device 131 to initiate suction through the suction port 112. Consequently, attached objects on the mounting table 31 (i.e., attached objects remaining on the mounting surface 36d, outer peripheral surface 36e, and ER mounting surface 36f of the electrostatic chuck 36) are sucked into the suction port 112 (step S114). For example, when dry cleaning is performed with the edge ring 35 placed on the mounting table 31, reaction products are not completely removed and remain as deposits on the outer peripheral surface 36e of the electrostatic chuck 36. In this case, the control unit, for example, suctions the deposits remaining on the outer peripheral surface 36e of the electrostatic chuck 36 through the suction port 112.

[0079] Alternatively, the suction port 112 may be configured to suction the attached matter on the mounting table 31 while an inert gas is supplied from the shower head 46 of the plasma etching apparatus 10 into the processing container 30 and the interior of the housing 101. Examples of the inert gas include Ar, N2, and dry air. Furthermore, the source of the inert gas is not limited to the shower head 46; for example, a purge port (not shown) may be configured to supply gas when the processing container 30 is opened to the atmosphere.

[0080] While suction is being performed through the suction port 112, the control unit monitors whether the number of particles in each predetermined particle size category and the total number of particles obtained from the measuring device 132 are below a predetermined threshold value. If the number of particles is below the predetermined threshold value, the control unit controls the exhaust device 131 to stop suction through the suction port 112.

[0081] When the suction from the suction port 112 stops, the imaging unit 115 captures the mounting platform 31 again from above and outputs the captured image to the control unit (step S115). The control unit detects whether there is any attachment on the mounting platform 31 by comparing the captured image with a reference image previously captured of a cleaned or new mounting platform 31 (step S116). When the control unit detects attachment again from the captured image (step S117: yes), it controls the exhaust device 131 to start suction using the suction port 112. At this time, the supply port 113 supplies gas to the mounting platform 31 (step S118). The suction port 112 suctions the attachment together with the gas supplied from the supply port 113. When the number of particles in each specified particle size category and the total number of particles obtained from the measuring device 132 are below the threshold, the control unit controls the exhaust device 131 to stop suction from the suction port 112.

[0082] When the suction from the suction port 112 stops, the imaging unit 115 again images the stage 31 from above and outputs the obtained image to the control unit (step S119). The control unit detects whether there is any attachment on the stage 31 by comparing the captured image with a reference image obtained by previously capturing a cleaned or new stage 31 (step S120). When the control unit detects attachment again from the captured image (step S121: yes), it controls the exhaust device 131 and starts suction using the suction port 112. At this time, the irradiation unit 114 irradiates the stage 31 with plasma, laser, or both plasma and laser to remove the attachment from the stage 31 (step S122). The suction port 112 sucks the attachment removed from the stage 31. Alternatively, the control unit may use the suction port 112 to suck the attachment after irradiating the stage 31 with one or both of plasma and laser using the irradiation unit 114. When the number of particles obtained from the measuring device 132 is equal to or smaller than a threshold value, the control unit controls the exhaust device 131 to stop suction from the suction port 112 .

[0083] When suction from the suction port 112 stops, the imaging unit 115 captures the stage 31 from above again and outputs the captured image to the control unit (step S123). The control unit detects whether there is any attachment on the stage 31 by comparing the captured image with a reference image previously captured of a cleaned or new stage 31 (step S124). If the control unit detects attachment again from the captured image (step S125: Yes), it notifies the operator of the vacuum processing system of an alarm (step S126). The operator who receives the alarm opens the processing container 30 to the atmosphere and performs maintenance including cleaning the stage 31.

[0084] If no attached matter is detected from the captured image (step S113: No, step S117: No, step S121: No, step S125: No), the control unit ends the process of cleaning the mounting table 31. In this way, the mounting table 31 is cleaned.

[0085] When cleaning of the mounting table 31 is completed, the robot arm 111 retracts the arm portion 121 to return the suction port 112 , the supply port 113 , the irradiation portion 114 , and the imaging portion 115 to their original positions inside the housing 101 .

[0086] Next, refer to Figures 9A to 9C An example of the operation of carrying the edge ring 35 for replacement into the processing container 30 will be described. Figures 9A to 9C This is a diagram for explaining an example of the operation when the edge ring 35 is introduced into the processing container 30 . Figure 10 : is a flowchart showing an example of processing for correcting the position of the edge ring 35 after being fed. Figure 10 Equivalent to Figure 6 The processing of step S106 in .

[0087] When the replacement edge ring 35 is introduced into the processing container 30, as shown in FIG. Figure 9A As shown, the conveying mechanism 140 moves the fork 143 to a height corresponding to the support table 105 on which the replacement edge ring 35 is placed. The conveying mechanism 140 moves the arm 141 toward the replacement edge ring 35, holding the replacement edge ring 35 with the fork 143. While holding the replacement edge ring 35, the conveying mechanism 140 moves the arm 141 toward the opening 101A.

[0088] Then, if Figure 9A As shown by the dotted line, the transport mechanism 140 moves the fork 143 to a height corresponding to the opening 101A. The transport mechanism 140 extends the arm 141 toward the opening 101A and transports the replacement edge ring 35 to the top of the mounting table 31 through the opening 101A.

[0089] When the fork 143 holding the replacement edge ring 35 reaches above the mounting platform 31, lift pins (not shown) protrude from the mounting platform 31, transferring the replacement edge ring 35 from the fork 143 to the lift pins. Once the replacement edge ring 35 has been transferred from the fork 143 to the lift pins, the transport mechanism 140 retracts the arm 121, returning the fork 143 to its original position within the housing 101. The lift pins supporting the replacement edge ring 35 descend, placing the replacement edge ring 35 on the outer periphery of the mounting platform 31.

[0090] Then, if Figure 9B As shown, the robot arm 111 moves the head 123 to a height corresponding to the opening 101A. The robot arm 111 extends the arm 121 toward the opening 101A, and moves the head 123 closer to the mounting table 31 through the opening 101A. Figure 10 As shown, the imaging unit 115 captures images of the gap between the replacement edge ring 35 and the electrostatic chuck 36 of the mounting table 31 at multiple positions along the circumference (step S131). For example, the imaging unit 115 sequentially captures images of the gap between the replacement edge ring 35 and the electrostatic chuck 36 of the mounting table 31 at multiple imaging positions set at equal intervals along the circumference of the mounting table 31.

[0091] Figure 11 1 is a diagram showing an example of an imaging position of the imaging unit 115 . Figure 11 This is equivalent to a top view of the edge ring 35 for replacement and the electrostatic chuck 36 of the mounting table 31 as viewed from above. Figure 8 In the figure, the mounting surface 36d of the mounting table 31 is shown as a disk, and the replacement edge ring 35 is shown as a ring around the mounting surface 36d. The imaging unit 115 has four imaging positions P set at equal intervals of 90 degrees in the circumferential direction of the mounting table 31. Furthermore, the number of imaging positions P in the circumferential direction of the mounting table 31 may be set to three or fewer, or five or more. Furthermore, the imaging unit 115 may also capture the gap between the replacement edge ring 35 and the electrostatic chuck 36 of the mounting table 31.

[0092] Return to Figure 9B The imaging unit 115 captures the gap between the edge ring 35 for replacement and the electrostatic chuck 36 of the mounting table 31 at multiple positions in the circumferential direction and outputs the captured images to a control unit (not shown). Figure 10As shown, the control unit compares the captured image with a correction reference image obtained by previously capturing the edge ring 35 in a non-deflected state (step S132), and calculates the amount of deviation between the gap width and the reference width at multiple circumferential positions (step S133). The reference width is, for example, the gap width previously measured when the center of the replacement edge ring 35 is aligned with the center of the electrostatic chuck 36.

[0093] Next, the control unit determines whether the calculated offset is within the allowable value (step S134). If the calculated offset is outside the allowable value (step S134: No), the control unit controls the conveying mechanism 140 to correct the position of the replacement edge ring 35 by the calculated offset (step S135). That is, when the lifting pins (not shown) protrude from the mounting table 31 and the replacement edge ring 35 is placed above the mounting table 31, the conveying mechanism 140 Figure 9C As shown, the fork 143 moves to a height corresponding to the opening 101A. The conveying mechanism 140 then extends the arm 141 toward the opening 101A, moving the fork 143 through the opening 101A to below the replacement edge ring 35. As the lift pins descend, the conveying mechanism 140 receives the replacement edge ring 35 supported on the lift pins using the fork 143. While holding the replacement edge ring 35, the conveying mechanism 140 moves the arm 141 horizontally to achieve a calculated offset of zero. When the replacement edge ring 35 moves to a point where the offset is zero, the lift pins protrude from the mounting table 31, transferring the replacement edge ring 35 from the fork 143 to the lift pins. Once the replacement edge ring 35 has been transferred from the fork 143 to the lift pins, the conveying mechanism 140 retracts the arm 121, returning the fork 143 to its original position within the housing 101. The lift pins supporting the replacement edge ring 35 descend, placing the replacement edge ring 35 on the outer periphery of the mounting table 31. After correcting the offset, the control unit may return the process to step S131, where the imaging unit 115 may capture an image of the gap between the replacement edge ring 35 and the electrostatic chuck 36 of the mounting table 31 to confirm whether the offset is within the allowable value (steps S131 to S134). Alternatively, if the offset is outside the allowable value, the control unit may perform the correction again as described above to reduce the offset of the replacement edge ring 35 to zero (step S135).

[0094] If the calculated deviation amount is within the allowable value (step S134 : Yes), the control unit ends the process, thereby completing the delivery of the replacement edge ring 35 into the processing container 30 .

[0095] When the edge ring 35 is completely introduced into the processing vessel 30, the maintenance device 100 controls the removal unit to attach the cover 96 to the second opening and closing door 95. Then, with the opening and closing member 101D closed, the leakage valve 104D is opened to release the second housing 101C to the atmosphere. After performing maintenance within the processing vessel 30 in this order, the operator moves the transport vehicle 102 to separate the maintenance device 100 from the plasma etching apparatus 10. Alternatively, the maintenance device 100 may be configured to automatically separate from the plasma etching apparatus 10 and be automatically transported to a predetermined location based on an instruction from the control unit 90 or a remote instruction.

[0096] As described above, the maintenance device 100 of the embodiment includes a housing 101 having an opening 101A formed therein. The opening 101A has a size corresponding to that of the second opening and closing door 95 of the plasma etching apparatus 10, and the opening 101A can be airtightly attached to the second opening and closing door 95. Furthermore, the maintenance device 100 includes a suction mechanism 110 disposed within the housing 101. The suction mechanism 110 can enter the processing vessel 30 through the opening 101A and suction any debris attached to an object (for example, the stage 31) within the processing vessel 30. Thus, the maintenance device 100 can efficiently clean the interior of the processing vessel 30 without exposing the processing vessel to the atmosphere.

[0097] The suction mechanism 110 includes a robot arm 111, the tip of which is capable of approaching an object within the processing container 30 via the opening 101A. The suction mechanism 110 also includes a suction port 112 provided at the tip of the robot arm 111 (for example, a head 123) for sucking matter attached to the object within the processing container 30. Thus, the maintenance device 100 can use the suction port 112 to suck matter attached to the object near the processing container 30.

[0098] The suction port 112 also sucks the deposited matter while inert gas is supplied into the processing container 30. Thus, the maintenance device 100 can use the suction port 112 to suck the deposited matter together with the inert gas.

[0099] The suction mechanism 110 also includes a supply port 113 provided at the front end of the robot arm 111 for supplying gas to the object in the processing container 30. Thus, the maintenance device 100 can use the inert gas to blow off deposits from the object in the processing container 30 and use the suction port 112 to suck the deposits together with the inert gas.

[0100] The suction mechanism 110 further includes an irradiation unit 114 disposed at the front end of the robot arm 111, which is configured to irradiate the object within the processing container 30 with one or both of plasma and laser light to remove deposits from the object within the processing container 30. Thus, the maintenance device 100 can use the suction port 112 to suction deposits removed from the object within the processing container 30.

[0101] The suction mechanism 110 further includes an imaging unit 115 provided at the front end of the robot arm 111 for imaging the object in the processing container 30. Thus, the maintenance device 100 can obtain an image that can be used to detect the presence of attached matter.

[0102] Maintenance device 100 also includes an exhaust device 131 connected to suction port 112 via an exhaust pipe 131A, and a meter 132 for measuring the number of particles flowing through exhaust pipe 131A. Exhaust device 131 stops suction from suction port 112 when the number of particles in each specified particle size category and the total number of particles measured by meter 132 fall below predetermined thresholds. This allows maintenance device 100 to stop suction from suction port 112 at an appropriate timing.

[0103] Furthermore, the target object within the processing container 30 is a mounting table 31 having an electrostatic chuck 36 capable of mounting a wafer W and an outer peripheral portion capable of mounting an edge ring 35. The maintenance device 100 further includes a transport mechanism 140. The transport mechanism 140 is disposed within the housing 101 and is capable of transporting the edge ring 35 from and into the processing container 30 via the opening 101A. This allows the maintenance device 100 to clean the processing container 30 and replace the edge ring 35 without exposing the container to the atmosphere.

[0104] Furthermore, the suction port 112 suctions any debris adhering to the outer peripheral surface of the mounting portion (e.g., the electrostatic chuck 36) of the mounting table 31 while the edge ring 35 has been transported from the processing container 30 by the transport mechanism 140. Thus, the maintenance device 100 can clean the outer peripheral surface of the mounting portion of the mounting table 31 that has been exposed due to the transport of the edge ring 35.

[0105] Furthermore, the conveying mechanism 140 conveys the replacement edge ring 35 into the processing container 30 and places it on the outer periphery of the mounting table 31. The maintenance device 100 further includes a control unit. The control unit uses the imaging unit 115 provided at the front end of the robot arm 111 to capture images of the gap between the replacement edge ring 35 and the mounting portion of the mounting table 31 at multiple circumferential positions. Based on the captured images, the control unit calculates the amount of deviation between the width of the gap and a reference width at each of the multiple circumferential positions. The control unit controls the conveying mechanism 140 to correct the position of the replacement edge ring 35 by the calculated deviation. This allows the maintenance device 100 to appropriately correct the position of the replacement edge ring 35 placed on the outer periphery of the mounting table 31.

[0106] (Variation)

[0107] In the above embodiment, the cleaning of the mounting table 31, which is an object within the processing vessel 30, is described as an example. However, the technology of the present invention is not limited to this. The maintenance device 100 can also clean components other than the mounting table 31, as long as the components are located within the processing vessel 3. Furthermore, the control unit may compare an image of a component within the processing vessel 30 captured by the imaging unit 115 with an image of a new component captured by the imaging unit 115, and determine whether a component within the processing vessel 30 is abnormal based on at least one of its surface condition, shape, and size. Furthermore, if the control unit determines that a component within the processing vessel 30 is abnormal, it may output a component replacement instruction.

[0108] Furthermore, in the above embodiment, the replacement of the edge ring 35 as a consumable component is described as an example. However, the technology of the present invention is not limited to this. The consumable component to be replaced may include, in addition to the edge ring 35, a cover ring (not shown) disposed on the outer periphery of the edge ring 35, or any other component that can be transported into and out of the processing container 30 by a transport mechanism such as a robot arm.

[0109] In the above embodiment, the suction mechanism 110 is described as including the suction port 112, the supply port 113, the irradiation unit 114, and the imaging unit 115 at the front end of the robot arm 111. However, the supply port 113, the irradiation unit 114, and the imaging unit 115 may not be provided in a group with the suction port 112. For example, any combination of the suction port 112 and the supply port 113, the suction port 112 and the irradiation unit 114, the suction port 112 and the imaging unit 115, the suction port 112, the supply port 113, and the irradiation unit 114, the suction port 112, the supply port 113, and the imaging unit 115, or the suction port 112, the irradiation unit 114, and the imaging unit 115 may be provided at the front end of the robot arm 111.

[0110] In addition, in the above embodiment, the case where both the suction mechanism 110 and the conveying mechanism 140 are arranged inside the housing 101 is described, but the technology of the present invention is not limited to this. For example, only the suction mechanism 110 may be arranged inside the housing 101, and a part of the robot arm 111 of the suction mechanism 110 may be replaced with a picker for edge ring replacement. In addition, for example, only the suction mechanism 110 may be arranged inside the housing 101, and a picker for edge ring replacement may be installed on the robot arm 111 of the suction mechanism 110. In this case, the edge ring 35 can be replaced using the picker for edge ring replacement. In addition, the replacement of the picker or the installation of the picker may be performed by an operator or by automatic replacement.

[0111] The embodiments disclosed herein are to be considered in all respects as illustrative and not restrictive, and the embodiments described above may be omitted, replaced, or modified in various ways without departing from the scope of the appended claims and their spirit.

[0112] Description of Reference Numerals

[0113] 10 plasma etching device, 30 processing container, 31 mounting table, 35 edge ring, 36 electrostatic chuck, 84 first opening and closing door, 95 second opening and closing door, 100 maintenance device, 101 shell, 101A opening, 110 suction mechanism, 111 robot arm, 112 suction port, 113 supply port, 114 irradiation unit, 115 imaging unit, 131 exhaust device, 131A exhaust pipe, 132 measuring instrument, 140 conveying mechanism.

Claims

1. A maintenance device, characterized in that: include: A housing having an opening, the opening having a size corresponding to a second opening and closing door of a vacuum processing apparatus having a first opening and closing door and a second opening and closing door provided in a processing container, the first opening and closing door being used for loading and unloading substrates, the second opening and closing door being different from the first opening and closing door, the opening being detachably and airtightly attached to the second opening and closing door; a decompression mechanism for decompressing the interior of the housing; and The suction mechanism is arranged inside the housing and can enter the processing container through the opening to suck the attached matter of the object in the processing container. The attraction mechanism comprises: an arm, the front end of which is capable of approaching the object in the processing container through the opening; and The suction port provided at the front end of the arm is used to suck the attachments of the object in the processing container. The object in the processing container is a mounting table having a mounting portion capable of mounting a substrate and an outer peripheral portion capable of mounting an edge ring. The maintenance device further includes a conveying mechanism disposed inside the housing, which is capable of conveying the edge ring from the processing container and conveying the edge ring into the processing container through the opening. The conveying mechanism conveys the edge ring for replacement into the processing container and places it on the outer periphery of the mounting table. The maintenance device also includes a control unit, which uses a shooting unit provided at the front end of the arm to shoot the gap between the replacement edge ring and the loading portion of the loading platform at multiple circumferential positions, calculates the offset between the width of the gap and the reference width at multiple circumferential positions based on the obtained shooting images, and controls the conveying mechanism to correct the position of the replacement edge ring according to the calculated offset.

2. The maintenance device according to claim 1, wherein: The suction port sucks the attached matter while inert gas is supplied into the processing container.

3. The maintenance device according to claim 1 or 2, characterized in that: The suction mechanism further includes a supply port provided at a front end of the arm for supplying gas to the object in the processing container.

4. The maintenance device according to claim 1 or 2, characterized in that: The suction mechanism further includes an irradiation portion provided at the front end of the arm for irradiating the object in the processing container with one or both of plasma and laser light to remove the attached matter from the object in the processing container.

5. The maintenance device according to claim 1 or 2, characterized in that: The suction mechanism further includes a photographing unit provided at a front end of the arm for photographing the object in the processing container.

6. The maintenance device according to claim 1 or 2, characterized in that: Also includes: an exhaust device connected to the suction port via an exhaust pipe; and a measuring device for measuring the amount of particles flowing in the exhaust pipe, The exhaust device stops suction from the suction port when the number of particles measured by the measuring device is equal to or less than a predetermined threshold value.

7. The maintenance device according to claim 1 or 2, characterized in that: The suction port sucks attached matter on the outer peripheral surface of the mounting portion of the mounting table in a state where the edge ring has been transported from the processing container by the transport mechanism.

8. A vacuum processing system comprising a vacuum processing device and a maintenance device, wherein: The vacuum processing device comprises: Processing containers; a first opening and closing door provided in the processing container for carrying substrates in and out; and A second opening and closing door provided on the processing container and capable of detachably mounting the maintenance device; The maintenance device comprises: a housing having an opening, the opening having a size corresponding to that of the second opening and closing door, and capable of being airtightly mounted to the second opening and closing door; a decompression mechanism for decompressing the interior of the housing; and The suction mechanism is arranged inside the housing and can enter the processing container through the opening to suck the attached matter of the object in the processing container. The attraction mechanism comprises: an arm, the front end of which is capable of approaching the object in the processing container through the opening; and The suction port provided at the front end of the arm is used to suck the attachments of the object in the processing container. The object in the processing container is a mounting table having a mounting portion capable of mounting a substrate and an outer peripheral portion capable of mounting an edge ring. The maintenance device further includes a conveying mechanism disposed inside the housing, which is capable of conveying the edge ring from the processing container and conveying the edge ring into the processing container through the opening. The conveying mechanism conveys the edge ring for replacement into the processing container and places it on the outer periphery of the mounting table. The maintenance device also includes a control unit, which uses a shooting unit provided at the front end of the arm to shoot the gap between the replacement edge ring and the loading portion of the loading platform at multiple circumferential positions, calculates the offset between the width of the gap and the reference width at multiple circumferential positions based on the obtained shooting images, and controls the conveying mechanism to correct the position of the replacement edge ring according to the calculated offset.

9. The vacuum processing system according to claim 8, wherein: The suction port sucks the attached matter while inert gas is supplied into the processing container.

10. The vacuum processing system according to claim 8 or 9, wherein: The suction mechanism further includes a supply port provided at a front end of the arm for supplying gas to the object in the processing container.

11. The vacuum processing system according to claim 8 or 9, wherein: The suction mechanism further includes an irradiation portion provided at the front end of the arm for irradiating the object in the processing container with one or both of plasma and laser light to remove the attached matter from the object in the processing container.

12. The vacuum processing system according to claim 8 or 9, wherein: The suction mechanism further includes a photographing unit provided at a front end of the arm for photographing the object in the processing container.

13. The vacuum processing system according to claim 8 or 9, wherein: The maintenance device also includes: an exhaust device connected to the suction port via an exhaust pipe; and a measuring device for measuring the amount of particles flowing in the exhaust pipe, The exhaust device stops suction from the suction port when the number of particles measured by the measuring device is equal to or less than a predetermined threshold value.

14. The vacuum processing system according to claim 8 or 9, wherein: The suction port sucks attached matter on the outer peripheral surface of the mounting portion of the mounting table in a state where the edge ring has been transported from the processing container by the transport mechanism.

Images