Oven Probe and Method for Insulation Adjustment of Oven Probe

Abstract

The present invention relates to the field of temperature detection technology, and discloses an oven probe and a heat insulation adjustment method for the oven probe. The oven probe includes a probe housing, a ceramic tube sleeve, a circuit board assembly, and a first temperature sensor. The probe housing is at least partially hollow to form a probe tube. The probe tube includes a meat temperature needle tube and a positive electrode sleeve arranged at intervals. The ceramic tube sleeve is used to connect and separate the meat temperature needle tube and the positive electrode sleeve. The circuit board assembly is arranged in the meat temperature needle tube. The first temperature sensor is arranged on the side of the meat temperature needle tube away from the positive electrode sleeve. The first temperature sensor is electrically connected to the circuit board assembly. In the present invention, a ceramic tube sleeve is arranged between the meat temperature needle tube inserted into the food and the positive electrode sleeve exposed outside the food. The ceramic tube sleeve adopts a heat insulation material to divide the meat temperature needle tube and the positive electrode sleeve, isolate the space flow between the meat temperature needle tube and the positive electrode sleeve, slow down the spread of heat from the positive electrode sleeve to the meat temperature needle tube, and can achieve the effect of protecting the circuit board assembly.

Description

Technical Field

[0001] The invention relates to the technical field of temperature detection, and in particular to an oven probe and a heat insulation adjustment method of the oven probe. Background Art

[0002] With the improvement of living standards, cooking methods are becoming more and more diverse, and ovens are entering more and more households. In order to confirm the doneness of food to be cooked, an oven probe is usually inserted into the food to be cooked to detect the temperature inside the food to be cooked.

[0003] Since the oven probe includes some electronic components that are easily damaged under high temperature conditions, these electronic components together constitute a circuit board assembly that controls the oven probe. Therefore, a conventional oven probe usually assembles the circuit board assembly for controlling the oven probe at the insertion end of the oven probe so that when the oven probe measures the temperature of the food, the circuit board assembly can be inserted into the food. Since food has a blocking effect on external heat, the circuit board assembly can be prevented from being damaged due to continuous heat absorption and the temperature exceeding the tolerable threshold.

[0004] However, even so, the temperature of the oven can still spread to the insertion end of the oven probe through the portion of the oven probe exposed outside the food, thereby causing the temperature of the circuit board assembly located at the insertion end of the oven probe to continue to rise and be damaged. Summary of the invention

[0005] The main purpose of the present invention is to provide an oven probe, aiming to solve the problem that the circuit board assembly of the current oven probe is easily damaged due to high temperature.

[0006] To achieve the above object, the present invention provides an oven probe, the oven probe comprising:

[0007] The probe housing is at least partially hollow to form a probe tube, wherein the probe tube includes a meat temperature needle tube and a positive electrode sleeve arranged at intervals;

[0008] A ceramic tube sleeve, used to connect and separate the meat temperature needle tube and the positive electrode sleeve;

[0009] A circuit board assembly is disposed in the meat temperature needle tube; and

[0010] The first temperature sensor is arranged on the side of the meat temperature needle tube away from the positive electrode sleeve, and the first temperature sensor is electrically connected to the circuit board assembly.

[0011] Optionally, a heat-insulating interlayer is formed on the tube wall of the probe tube, and a heat-absorbing medium is filled in the heat-insulating interlayer.

[0012] Optionally, the heat absorbing medium comprises cooling oil; and / or,

[0013] The oven probe further includes a thickness adjusting device for adjusting the thickness of the heat insulation interlayer.

[0014] Optionally, the ceramic tube sleeve includes a window layer and ceramic layers provided at both ends of the window layer, and the ceramic layers are respectively used for connecting with the meat temperature needle tube and the positive electrode sleeve;

[0015] The material of the ceramic layer includes heat insulation ceramic;

[0016] The color of the window layer can change with temperature.

[0017] Optionally, a temperature-sensitive color-changing coating is coated on the outer surface of the window layer; and / or,

[0018] The window layer is made of a transparent material, and a solution cavity is formed inside the window layer, and the solution cavity is filled with temperature-sensitive color-changing ink.

[0019] Optionally, a light sensor is provided on one side of the ceramic tube sleeve close to the meat temperature needle tube;

[0020] The oven probe further includes an indicator light, and the indicator light is provided on one side of the positive electrode sleeve away from the ceramic tube sleeve, and the indicator light is electrically connected to the light sensor and the circuit board assembly.

[0021] Optionally, a wire passing hole for communicating the meat temperature needle tube and the positive electrode sleeve is provided on the ceramic tube sleeve;

[0022] The circuit board assembly includes an antenna, and the antenna extends to the positive electrode sleeve through the wire passing hole;

[0023] The oven probe further includes a second temperature sensor, and the second temperature sensor is provided on one side of the positive electrode sleeve facing away from the ceramic tube sleeve, and the second temperature sensor is electrically connected to the antenna.

[0024] Optionally, the antenna and the wire passing hole are sealed and connected through a sealing block;

[0025] Wherein, an installation groove is provided at the top of the ceramic tube sleeve, and the wire passing hole is provided at the bottom of the installation groove;

[0026] The sealing block includes:

[0027] A ceramic block, the ceramic block is clamped in the installation groove, and the ceramic block is provided with a first through hole corresponding to the wire passing hole; and,

[0028] A thermally expandable rubber, provided on the lower end surface of the ceramic block, the thermally expandable rubber is provided with a second through hole corresponding to the first through hole, and the outer surface of the thermally expandable rubber abuts against the wire passing hole.

[0029] To achieve the above object, the present invention further provides a heat insulation adjustment method for an oven probe. Using the above oven probe, the oven probe further includes a third temperature sensor for detecting the temperature of the circuit board assembly;

[0030] The heat insulation adjustment method for the oven probe includes the following steps:

[0031] Obtain a first temperature on the surface of the circuit board assembly through the third temperature sensor;

[0032] When the first temperature does not meet the preset condition, obtain a second temperature of the first temperature sensor;

[0033] Calculate a first temperature difference between the first temperature and the second temperature;

[0034] Determine a thickness change strategy according to the first temperature difference;

[0035] Determine the action parameters of the thickness adjustment device according to the thickness change strategy;

[0036] Control the action of the thickness adjustment device according to the action parameters.

[0037] Optionally, the difference A between the first temperature and the second temperature;

[0038] The determining the thickness change strategy according to the first temperature difference includes:

[0039] When 0°C ≤ A ≤ 10°C, the thickness change amount B, B = -2 mm;

[0040] When 10°C ≤ A ≤ 20°C, the thickness change amount B, B = -1 mm;

[0041] When 20°C ≤ A ≤ 30°C, the thickness change amount B, B = 0 mm;

[0042] When 30°C ≤ A ≤ 40°C, the thickness change amount B, B = 1 mm;

[0043] When 40°C ≤ A ≤ 50°C, the thickness change amount B, B = 2 mm.

[0044] In the technical solution of the present invention, the oven probe is divided into a meat temperature needle tube and a positive electrode sleeve. A first temperature sensor and a circuit board assembly are arranged in the meat temperature needle tube. A circuit is integrated in the circuit board assembly. The first temperature sensor and the circuit board assembly can be inserted into food along with the meat temperature needle tube. The first temperature sensor assembly is used to measure the temperature inside the food and transmit the measured data into the circuit board assembly. At this time, since the entire meat temperature needle tube is wrapped by food, the heat of the food will not accumulate in the meat temperature needle tube. At this time, the positive electrode sleeve is exposed outside the food. Therefore, in order to isolate the heat from being transferred from the positive electrode sleeve to the meat temperature needle tube, a ceramic sleeve is arranged between the positive electrode sleeve and the meat temperature needle tube. The ceramic sleeve is made of a heat-insulating material to divide the meat temperature needle tube and the positive electrode sleeve, so as to isolate the space flow between the meat temperature needle tube and the positive electrode sleeve, thereby slowing down the spread speed of heat from the positive electrode sleeve to the meat temperature needle tube, avoiding the temperature of the circuit board assembly arranged in the meat temperature needle tube from rising too fast, and thus achieving the purpose of protecting the circuit board assembly. Description of the Drawings

[0045] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on the structures shown in these drawings.

[0046] Figure 1 A cross-sectional view of an embodiment of the oven probe provided by the present invention;

[0047] Figure 2 A cross-sectional view of an embodiment of the thickness adjustment device of the oven probe provided by the present invention;

[0048] Figure 3 A cross-sectional view of another embodiment of the thickness adjustment device of the oven probe provided by the present invention;

[0049] Figure 4 For Figure 1 A cross-sectional view of an embodiment of the ceramic sleeve;

[0050] Figure 5 A first process schematic diagram of an embodiment of the heat insulation adjustment method of the oven probe provided by the present invention;

[0051] Figure 6 A second process schematic diagram of an embodiment of the heat insulation adjustment method of the oven probe provided by the present invention.

[0052] Explanation of the reference numerals in the drawings:

[0053]

[0054]

[0055] The realization, functional features and advantages of the present invention will be further described in conjunction with the embodiments with reference to the accompanying drawings. Detailed Embodiments

[0056] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0057] It should be noted that all directional indications (such as up, down, left, right, front, back...) in the embodiments of the present invention are only used to explain the relative positional relationship and movement conditions between components in a specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indications will also change accordingly.

[0058] In the present invention, unless otherwise clearly defined and limited, terms such as "connection" and "fixation" should be understood in a broad sense. For example, "fixation" can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two elements or the interaction relationship between two elements, unless otherwise clearly limited. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific situations.

[0059] In addition, in the present invention, descriptions such as "first" and "second" are only for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include at least one of such features. The meanings of "and / or" and "and / or" appearing throughout the text are the same, both indicating including three parallel solutions. Taking "A and / or B" as an example, it includes solution A, solution B, or the solution where A and B are satisfied simultaneously. In addition, the technical solutions between the embodiments can be combined with each other, but it must be based on the fact that those of ordinary skill in the art can implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such a combination of technical solutions does not exist and is not within the protection scope required by the present invention.

[0060] With the improvement of living standards, cooking methods are becoming more and more diverse, and ovens are entering more and more households. In order to confirm the doneness of food to be cooked, an oven probe is usually inserted into the food to be cooked to detect the temperature inside the food to be cooked.

[0061] Since the oven probe includes some electronic components that are easily damaged under high temperature conditions, these electronic components together constitute a circuit board assembly that controls the oven probe. Therefore, a conventional oven probe usually assembles the circuit board assembly for controlling the oven probe at the insertion end of the oven probe so that when the oven probe measures the temperature of the food, the circuit board assembly can be inserted into the food. Since food has a blocking effect on external heat, the circuit board assembly can be prevented from being damaged due to continuous heat absorption and the temperature exceeding the tolerable threshold.

[0062] However, even so, the temperature of the oven can still spread to the insertion end of the oven probe through the portion of the oven probe exposed outside the food, thereby causing the temperature of the circuit board assembly located at the insertion end of the oven probe to continue to rise and be damaged.

[0063] In order to solve the above problems, the present invention proposes an oven probe, which aims to solve the problem that the current oven probe circuit board assembly is easily damaged by high temperature, wherein: Figures 1 to 4 A cross-sectional view of an oven probe according to an embodiment of the present invention.

[0064] Please refer to Figure 1 The oven probe 1000 includes: a probe shell 1, a ceramic tube sleeve 2, a circuit board assembly 3 and a first temperature sensor 4. The probe shell 1 is at least partially hollow to form a probe tube. The probe tube includes a meat temperature needle tube 11 and a positive electrode sleeve 12 arranged at intervals. The ceramic tube sleeve 2 is used to connect and separate the meat temperature needle tube 11 and the positive electrode sleeve 12. The circuit board assembly 3 is arranged in the meat temperature needle tube 11. The first temperature sensor 4 is arranged on the side of the meat temperature needle tube 11 away from the positive electrode sleeve 12. The first temperature sensor 4 is electrically connected to the circuit board assembly 3.

[0065] In the technical solution of the present invention, the oven probe 1000 is divided into a meat temperature needle tube 11 and a positive electrode sleeve 12. A first temperature sensor 4 and a circuit board assembly 3 are arranged in the meat temperature needle tube 11. A circuit is integrated in the circuit board assembly 3. The first temperature sensor 4 and the circuit board assembly 3 can be inserted into food along with the meat temperature needle tube 11. The first temperature sensor 4 is used to measure the temperature inside the food and transmit the measured data to the circuit board assembly 3. At this time, since the entire meat temperature needle tube 11 is wrapped by food, the heat of the food will not accumulate in the meat temperature needle tube 11. At this time, the positive electrode sleeve 12 is exposed outside the food. Therefore, in order to isolate the heat transfer from the positive electrode sleeve 12 to the meat temperature needle tube 11, a ceramic sleeve is arranged between the positive electrode sleeve 12 and the meat temperature needle tube 11. The ceramic sleeve is made of a heat insulation material to divide the meat temperature needle tube 11 and the positive electrode sleeve 12, so as to isolate the space flow between the meat temperature needle tube 11 and the positive electrode sleeve 12, and then slow down the spread speed of heat from the positive electrode sleeve 12 to the meat temperature needle tube 11, avoiding the temperature of the circuit board assembly 3 arranged in the meat temperature needle tube 11 from rising too fast, and thus achieving the purpose of protecting the circuit board assembly 3.

[0066] In order to slow down the spread speed of the heat of the oven to the inside of the probe tube, in an embodiment of the present invention, a heat insulation interlayer 13 is formed on the tube wall of the probe tube. An endothermic medium is filled in the heat insulation interlayer 13. The endothermic medium can partially absorb the heat transferred from the oven to the probe tube, so as to slow down the spread speed of the temperature from the oven to the probe tube, and thus achieve the purpose of protecting the circuit board assembly 3.

[0067] The endothermic medium can be water or cooling oil. Considering that the water absorption to generate water vapor will cause the probe housing 1 to soften, in an embodiment of the present invention, cooling oil is selected as the endothermic medium in the heat insulation interlayer 13.

[0068] It can be understood that when the external temperature of the oven probe 1000 is not high, the heat in the meat temperature needle tube 11 mainly comes from the self-heating of the circuit board assembly 3, and when the external temperature of the oven probe 1000 rises, the heat of the meat temperature needle tube 11 mainly comes from the heat radiation of the oven. Therefore, in view of the above phenomenon, in an embodiment of the present invention, the oven probe 1000 further includes a thickness adjusting device 5. The thickness adjusting device 5 is used to adjust the thickness of the heat insulation interlayer 13. Thus, when the oven temperature is not high, the thickness adjusting device 5 compresses the thickness of the heat insulation interlayer 13 to expand the internal space of the meat temperature needle tube 11, so as to leave space for the circuit board to dissipate heat. When the oven temperature rises, the thickness adjusting device 5 increases the thickness of the heat insulation interlayer 13 to increase the volume of the endothermic medium and slow down the spread speed of the heat outside the probe tube to the inside of the probe tube.

[0069] The thickness adjustment device 5 can adjust the heat insulation interlayer 13 in various ways. Please refer to Figure 2 , in an embodiment of the present invention, the heat insulation interlayer 13 includes a rigid layer 132 and flexible layers 131 provided at both ends of the rigid layer 132. The rigid layer 132 is connected to the meat temperature needle tube 11 through the flexible layers 131, and the rigid layer 132, the flexible layers 131 and the shell of the meat temperature needle tube 11 jointly enclose the heat insulation interlayer 13. Further, the meat temperature needle tube 11 is formed with a water storage cavity 58. The thickness adjustment device 5 includes: a shell 53, a first motor 51 and an impeller 52. The shell 53 is formed with an impeller cavity 531 and a motor cavity. The first motor 51 is installed in the motor cavity. The impeller is rotatably installed in the impeller cavity 531 and is drivingly connected to the first motor 51. The impeller cavity 531 is formed with a first water inlet 532 communicating with the water storage cavity 58 and a second water inlet 533 communicating with the heat insulation interlayer 13.

[0070] In specific applications, when the external temperature of the probe tube rises to a preset value, the first motor 51 will drive the impeller 52 to rotate counterclockwise to pump the heat-absorbing medium in the water storage cavity 58 into the heat insulation interlayer 13. The volume of the heat-absorbing medium in the heat insulation interlayer 13 increases and extrudes the rigid part and the flexible part outward. At this time, the flexible part undergoes elastic deformation so that the rigid part can move inward toward the inside of the probe tube. In this way, the purpose of thickening the heat insulation interlayer 13 is achieved. When the external temperature of the probe tube does not reach the preset value, that is, the heat inside the probe tube mainly comes from the heat generation of the circuit board assembly 3. At this time, the first motor 51 will drive the impeller to rotate clockwise to partially suck the heat-absorbing medium in the heat insulation interlayer 13 back into the water storage cavity 58. At this time, the volume of the heat-absorbing medium in the heat insulation interlayer 13 decreases, and the flexible part returns to its original state to drive the rigid part to move outward, thereby achieving the purpose of reducing the thickness of the heat insulation interlayer 13 and expanding the internal space of the probe tube.

[0071] In addition, the thickness adjustment device 5 can also adopt a motor and a lead screw 55. Specifically, please refer to Figure 3 , in another embodiment of the present invention, the heat insulation interlayer 13 is communicated with the water storage cavity 58. The thickness adjustment device 5 includes: a second motor 54, a lead screw 55, a flange 56 and a gear set 57. The second motor 54 is arranged inside the probe tube. The drive shaft of the second motor 54 and the lead screw 55 are respectively sleeved on the corresponding gears of the gear set 57. The gear set 57 is used to convert the driving force of the second motor 54 rotating around the vertical axis into the driving force rotating around the circumferential direction of the horizontal direction. The flange 56 is movably sleeved on the lead screw 55, and the flange 56 is fixedly connected to the rigid part.

[0072] In a specific application, the driving motor rotates to drive the gear set 57 to rotate. The rotation of the gear set 57 drives the lead screw 55 to rotate, and then drives the flange 56 sleeved on the lead screw 55 to rotate, and finally drives the hard part fixedly connected to the flange 56 to move. When the temperature outside the probe tube rises to a preset value, the second motor 54 will drive the hard parts to move closer to each other to increase the thickness of the heat insulation layer 13, and make the heat absorption medium located in the water storage cavity 58 flow into the heat insulation layer 13. When the temperature outside the probe tube is lower than the preset value, the second motor 54 will drive the hard parts to move away from each other to reduce the thickness of the heat insulation layer 13, and then compress the heat absorption medium originally located in the heat insulation layer 13 back into the water storage cavity 58 to achieve the purpose of increasing the internal space of the probe tube. It should be explained that the thread directions of the two lead screws 55 should be set to be opposite so that the two flanges 56 can have mirror-image movement strokes.

[0073] Furthermore, the material of the hard layer 132 should include all hard plastics such as polyethylene and polypropylene, and the flexible layer 131 should include any substances that can undergo elastic deformation such as elastic rubber and elastic leather. The present invention does not limit this.

[0074] To facilitate observing the temperature inside the meat temperature needle tube 11, in an embodiment of the present invention, the ceramic tube sleeve 2 includes a window layer 22 and ceramic layers 21 provided at both ends of the window layer 22. The ceramic layers 21 are respectively used to connect with the meat temperature needle tube 11 and the positive electrode sleeve. The material of the ceramic layer 21 includes heat-insulating ceramics. The low thermal conductivity of the heat-insulating ceramics can effectively reduce the heat transfer speed from the positive electrode sleeve 12 to the meat temperature needle tube 11. The window layer 22 has a color. In this way, an insertion marking line is formed on the probe to remind the user of the depth to which the probe should be inserted. Furthermore, the color of the window layer 22 can change with temperature. In this way, the user can better judge the temperature inside the meat temperature needle tube 11 according to the color of the window layer 22, so as to timely remove the probe from the oven to prevent damage to the circuit board assembly 3 due to excessive temperature inside the probe.

[0075] To enable the window layer 22 to change color with temperature, in an embodiment of the present invention, a temperature-sensitive color-changing coating is coated on the outer surface of the window layer 22, so that the surface color of the window layer 22 can change with temperature. In another embodiment of the present invention, the window layer 22 is made of a transparent material, and a solution cavity 221 is formed inside the window layer 22. The solution cavity 221 is filled with temperature-sensitive color-changing ink. The temperature-sensitive color-changing ink can be made from the temperature-sensitive color-changing coating to achieve the same effect as the temperature-sensitive color-changing coating.

[0076] To remind the user to insert the probe in place, in an embodiment of the present invention, a light sensor 6 is provided on one side of the ceramic tube sleeve 2 close to the meat temperature needle tube 11. The oven probe 1000 further includes an indicator light, which is arranged on the side of the positive electrode sleeve 12 away from the ceramic tube sleeve 2. The indicator light is electrically connected to the light sensor 6 and the circuit board assembly 3. In actual operation, the light sensor 6 can determine whether the meat temperature needle tube 11 is completely inserted into the food according to the presence or absence of light. If the meat temperature needle tube 11 is completely inserted into the food, the light sensor 6 will turn off the indicator light to inform the user that the meat temperature needle tube 11 has been completely inserted. When the meat temperature needle tube 11 is not completely inserted into the food, the light sensor 6 will control the indicator light to turn on to remind the user that the meat temperature needle tube 11 is not completely inserted into the food. In this way, it can be avoided that the user fails to insert the meat temperature needle tube 11 completely into the food due to improper operation, which may cause the internal temperature of the meat temperature needle tube 11 to rise rapidly and damage the circuit board assembly 3.

[0077] To detect the internal temperature of the oven, the oven probe 1000 further includes a second temperature sensor 8. Specifically, please refer to Figure 1 and Figure 4 , in an embodiment of the present invention, a battery 9 is arranged in the meat temperature needle tube 11. The battery 9 is connected to the circuit board assembly 3. A wire passing hole 23 for connecting the meat temperature needle tube 11 and the positive electrode sleeve 12 is arranged on the ceramic tube sleeve 2. The circuit board assembly 3 includes an antenna 31. The antenna 31 extends to the positive electrode sleeve through the wire passing hole 23. The oven probe 1000 further includes a second temperature sensor 8. The second temperature sensor 8 is arranged on the side of the positive electrode sleeve away from the ceramic tube sleeve 2. The second temperature sensor 8 is electrically connected to the antenna 31. Through the second temperature sensor 8, the temperature probe can detect the internal temperature of the oven. Further, the circuit board assembly 3 of the oven probe 1000 further includes a wireless signal transmission module. Through the wireless signal transmission module, the oven probe 1000 can transmit the internal temperature condition of the oven to the user's mobile terminal to facilitate the user to master the internal temperature condition of the oven at any time.

[0078] To prevent the heat of the positive electrode sleeve 12 from entering the meat temperature needle tube 11 through the wire passing hole 23, in an embodiment of the present invention, the antenna 31 and the wire passing hole 23 are sealingly connected through a sealing block 7. Wherein, an installation groove is provided at the top of the ceramic tube sleeve 2, and the wire passing hole 23 is provided at the bottom of the installation groove. The sealing block 7 includes: a ceramic block 71 and a thermally expandable rubber 72. The ceramic block 71 is clamped in the installation groove. The ceramic block 71 is provided with a first through hole corresponding to the wire passing hole 23. The thermally expandable rubber 72 is provided on the lower end surface of the ceramic block 71. The thermally expandable rubber 72 is provided with a second through hole corresponding to the first through hole. The outer surface of the thermally expandable rubber 72 abuts against the wire passing hole 23. The material of the ceramic block 71 is heat-insulating ceramic to slow down the heat transfer amount from the positive electrode sleeve 12 to the meat temperature needle tube 11. The thermally expandable rubber 72 can expand when heated when the temperature of the oven probe 1000 rises, so as to seal the wire passing hole 23 and prevent the heat of the positive electrode sleeve 12 from being transferred to the meat temperature needle tube 11.

[0079] The present invention also proposes a heat insulation adjustment method for an oven probe. Please refer to Figure 5 , Figure 5 which is a first process schematic diagram of an embodiment of the heat insulation adjustment method for the oven probe provided by the present invention. Wherein, the oven probe further includes a third temperature sensor for detecting the temperature of the circuit board assembly. The heat insulation adjustment method for the oven probe includes the following steps:

[0080] S10. Obtain a first temperature on the surface of the circuit board assembly through the third temperature sensor.

[0081] S20. When the first temperature does not meet the preset condition, obtain a second temperature of the first temperature sensor.

[0082] S30. Calculate a first temperature difference between the first temperature and the second temperature.

[0083] S40. Determine a thickness change strategy according to the first temperature difference.

[0084] S50. Determine the action parameters of the thickness adjustment device according to the thickness change strategy.

[0085] S60. Control the action of the thickness adjustment device according to the action parameters.

[0086] In the above embodiments, the system monitors the temperature of the circuit board assembly through the third temperature sensor. When the first temperature of the circuit board assembly does not meet the preset condition, that is, when the circuit board assembly starts to overheat, the system will obtain the second temperature through the first temperature sensor, and determine whether the heat of the current circuit board assembly mainly comes from its own self-heating or the radiation of the external oven by comparing the difference between the first temperature and the second temperature, that is, the difference between the temperature of the circuit board assembly and the food temperature. Then, based on this value, it decides whether to adjust the thickness of the heat insulation layer and by how much.

[0087] Please refer to Figure 6 , Figure 6 which is the second process schematic diagram of an embodiment of the heat insulation adjustment method of the oven probe provided by the present invention, and the difference A between the first temperature and the second temperature;

[0088] Determining the thickness change strategy according to the first temperature difference includes:

[0089] S401. When 0°C ≤ A ≤ 10°C, the thickness change amount B, B = -2 mm.

[0090] S402. When 10°C ≤ A ≤ 20°C, the thickness change amount B, B = -1 mm.

[0091] S403. When 20°C ≤ A ≤ 30°C, the thickness change amount B, B = 0 mm.

[0092] S404. When 30°C ≤ A ≤ 40°C, the thickness change amount B, B = 1 mm.

[0093] S405. When 40°C ≤ A ≤ 50°C, the thickness change amount B, B = 2 mm.

[0094] In this embodiment, a specific plan is made for the thickness adjustment of the heat insulation interlayer. That is, when the temperature difference A between the circuit board assembly and the food temperature satisfies 0°C ≤ A ≤ 10°C, at this time, the heat inside the meat temperature needle tube mainly comes from the self-heating of the circuit board assembly. Therefore, at this time, the thickness of the heat insulation interlayer should be minimized as much as possible, and the internal space of the meat temperature probe tube should be increased to facilitate the heat dissipation of the circuit board assembly. When 10°C ≤ A ≤ 20°C, the external temperature begins to rise at this time, but the heat inside the meat temperature needle tube still mainly comes from the heat generation of the circuit board assembly. At this time, it is still necessary to reduce the thickness of the heat insulation interlayer and increase the internal space of the meat temperature probe tube. When 20°C ≤ A ≤ 30°C, in the heat source of the meat temperature probe tube at this time, the heat generation of the circuit board assembly and the external heat each account for half, and the thickness of the heat insulation interlayer returns to its original state. When 30°C ≤ A ≤ 40°C, the heat of the meat temperature probe tube begins to mainly come from outside the probe tube. At this time, the thickness of the heat insulation interlayer should be increased to reduce the entry of external heat. When 40°C ≤ A ≤ 50°C, the internal heat of the meat temperature probe tube mainly comes from outside the probe tube, and at this time, the self-heating of the circuit board assembly can be ignored. Therefore, at this time, the thickness of the heat insulation interlayer needs to be increased to the maximum to slow down the spread of the external temperature into the meat temperature probe tube.

[0095] The above are only the preferred embodiments of the present invention, and do not limit the patent scope of the present invention. Any equivalent structural transformation made under the inventive concept of the present invention by using the content of the specification and drawings of the present invention, or directly / indirectly applied in other related technical fields, is included in the patent protection scope of the present invention.

Claims

1. An oven probe, characterized in that, include: The probe housing is at least partially hollow to form a probe tube, wherein the probe tube includes a meat temperature needle tube and a positive electrode sleeve arranged at intervals; A ceramic tube sleeve, used to connect and separate the meat temperature needle tube and the positive electrode sleeve; A circuit board assembly is disposed in the meat temperature needle tube; and A first temperature sensor is disposed on a side of the meat temperature needle tube away from the positive electrode sleeve, and the first temperature sensor is electrically connected to the circuit board assembly; The wall of the probe tube is formed with a heat-insulating interlayer, and the heat-insulating interlayer is filled with a heat-absorbing medium, and the heat-absorbing medium includes cooling oil; Furthermore, the oven probe further comprises a thickness adjusting device, and the thickness adjusting device is used to adjust the thickness of the thermal insulation interlayer; The oven probe further includes a third temperature sensor, and the third temperature sensor is used to detect the temperature of the circuit board assembly; The method for adjusting the thermal insulation of the oven probe comprises the following steps: Acquiring a first temperature of the surface of the circuit board assembly by means of the third temperature sensor; When the first temperature does not meet a preset condition, acquiring a second temperature of the first temperature sensor; calculating a first temperature difference between the first temperature and the second temperature; determining a thickness change strategy according to the first temperature difference; Determining the action parameters of the thickness adjustment device according to the thickness change strategy; The action of the thickness adjustment device is controlled according to the action parameters.

2. The oven probe according to claim 1, characterized in that, The ceramic tube sleeve comprises a window layer and ceramic layers arranged at both ends of the window layer, and the ceramic layers are used to connect with the meat temperature needle tube and the positive electrode sleeve respectively; The material of the ceramic layer includes thermal insulation ceramics; The color of the window layer can change with temperature.

3. The oven probe according to claim 2, characterized in that, The outer surface of the window layer is coated with a temperature-sensitive color-changing paint; And / or, the window layer is made of a transparent material, a solution cavity is formed in the window layer, and the solution cavity is filled with temperature-sensitive color-changing ink.

4. The oven probe according to claim 1, wherein, The ceramic tube sleeve is provided with a light sensor on one side close to the meat temperature needle tube; The oven probe further comprises an indicator light, which is arranged on a side of the positive sleeve away from the ceramic sleeve, and is electrically connected to the light sensor and the circuit board assembly.

5. The oven probe according to claim 1, characterized in that, The ceramic sleeve is provided with a wire hole for connecting the meat temperature needle tube and the positive electrode sleeve; The circuit board assembly includes an antenna, and the antenna extends to the positive electrode sleeve through the wire hole; The oven probe further includes a second temperature sensor, which is disposed on a side of the positive electrode sleeve away from the ceramic sleeve, and the second temperature sensor is electrically connected to the antenna.

6. The oven probe according to claim 5, characterized in that, The antenna is sealed and connected to the wire hole via a sealing block; Wherein, a mounting groove is arranged on the top of the ceramic sleeve, and the wire hole is arranged on the bottom of the mounting groove; The sealing block comprises: A ceramic block, the ceramic block being clamped in the mounting groove, the ceramic block being provided with a first through hole corresponding to the wire hole; and The heat expansion rubber is arranged on the lower end surface of the ceramic block. The heat expansion rubber is provided with a second through hole corresponding to the first through hole. The outer surface of the heat expansion rubber abuts against the wire hole.

7. A heat insulation adjustment method for an oven probe, using the oven probe as described in any one of claims 1-6, characterized in that, The oven probe further includes a third temperature sensor for detecting the temperature of the circuit board assembly; The heat insulation adjustment method of the oven probe includes the following steps: Obtain a first temperature on the surface of the circuit board assembly through the third temperature sensor; When the first temperature does not meet the preset condition, obtain a second temperature of the first temperature sensor; Calculate a first temperature difference between the first temperature and the second temperature; Determine a thickness change strategy according to the first temperature difference; Determine the action parameters of the thickness adjustment device according to the thickness change strategy; Control the action of the thickness adjustment device according to the action parameters.

8. The heat insulation adjustment method of the oven probe according to claim 7, characterized in that, The difference A between the first temperature and the second temperature; The determining the thickness change strategy according to the first temperature difference includes: When 0°C ≤ A ≤ 10°C, the thickness change amount B, B = -2 mm; When 10°C ≤ A ≤ 20°C, the thickness change amount B, B = -1 mm; When 20°C ≤ A ≤ 30°C, the thickness change amount B, B = 0 mm; When 30°C ≤ A ≤ 40°C, the thickness change amount B, B = 1 mm; When 40°C ≤ A ≤ 50°C, the thickness change amount B, B = 2 mm.

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