Method for manufacturing backing of underwater acoustic transducer

Abstract

The present invention discloses a method for manufacturing a backing of an underwater acoustic transducer, wherein the method for manufacturing the backing comprises the following steps: S1, arranging more than two monomer layers in a stacked manner, wherein glue is arranged between two adjacent monomer layers; S2, hot pressing the stacked monomer layers to release the deformation stress of each monomer layer during the curing process of the glue, wherein the glue between two adjacent monomer layers forms a bonding layer for bonding two adjacent monomer layers to obtain the backing, so that each monomer layer of the backing can be made of materials with different densities, so that the overall density of the backing can be set as needed.

Description

Technical Field

[0001] The invention relates to an underwater acoustic transducer used in sonar, and in particular to a method for manufacturing a backing of the underwater acoustic transducer. Background Art

[0002] The underwater acoustic transducer is an important component of the underwater acoustic system. Usually, the underwater transducer includes a shell, a backing layer, a piezoelectric layer, a matching layer and a sound-transmitting layer. The backing layer, the piezoelectric layer, the matching layer and the sound-transmitting layer are stacked in the housing cavity of the shell, wherein the backing layer is used to absorb the sound energy radiated into the probe by the piezoelectric layer due to vibration, and to prevent the sound energy from being reflected back and interfering with the piezoelectric layer. The above-mentioned function of the backing layer requires that the backing layer has an acoustic impedance that matches the material of the piezoelectric layer, and can greatly absorb the sound signal and attenuate it to a minimum. In addition, the application depth of the underwater acoustic transducer varies, including the possibility of using the underwater acoustic transducer in an environment with a depth of 0-10,000 meters, which requires the underwater acoustic transducer to be able to withstand a large water pressure and have a wide temperature operating range. The backing layer of the existing underwater acoustic transducer is usually made of a single material, resulting in a single acoustic impedance. At the same time, the material used to make the backing layer is generally a fixed type of material or an artificially synthesized fixed structure, which makes it difficult to meet the wide-band working range. In addition, the backing layer made of a single fixed type of material or an artificially synthesized fixed structure also has defects such as difficulty in balancing the transmission and receiving performances and difficulty in meeting different working conditions and environments. Summary of the invention

[0003] One object of the present invention is to provide a backing of an underwater acoustic transducer and a method for manufacturing the same, wherein the backing is obtained by hot-pressing and laminating two or more monomer layers, and in the process of curing the glue located in two adjacent monomer layers to form a bonding layer, the deformation stress of each of the monomer layers is released, so that the backing can be made of more than two materials to optimize the acoustic impedance performance of the backing.

[0004] One object of the present invention is to provide a backing of an underwater acoustic transducer and a method for manufacturing the same, wherein two or more monomer layers are arranged in a laminated manner by hot pressing, and in the process of curing the glue located in two adjacent monomer layers to form the bonding layer, the deformation stress of each monomer layer is released to obtain the backing. In this way, the acoustic impedance gradient of the backing can be designed according to the actual needs of the underwater acoustic transducer. For example, by changing the materials of each monomer layer, the backing can have different acoustic impedance gradients. In this way, the underwater acoustic transducer can achieve step attenuation of sound waves and improve the broadband and sensitivity of the underwater acoustic transducer.

[0005] One object of the present invention is to provide a backing of an underwater acoustic transducer and a method for manufacturing the same, wherein the backing is obtained by releasing the deformation stress of each of the monomer layers during the process of curing the glue located in two adjacent monomer layers to form the bonding layer, so that the backing can have a wide frequency working range.

[0006] One object of the present invention is to provide a backing of an underwater acoustic transducer and a method for manufacturing the same, wherein two or more monomer layers are arranged in a laminated manner by hot pressing, and in the process of curing the glue located in two adjacent monomer layers to form the bonding layer, the deformation stress of each monomer layer is released to obtain the backing, so that the backing can balance the transmission and receiving performances to meet the requirements of the underwater acoustic transducer in different working conditions and environments.

[0007] One object of the present invention is to provide a backing of an underwater acoustic transducer and a method for manufacturing the same, wherein two or more monomer layers are arranged in a laminated manner by hot pressing, and in the process of curing the glue located in two adjacent monomer layers to form the bonding layer, the deformation stress of each monomer layer is released to obtain the backing, so that the overall thickness of the backing can be designed according to the actual needs of the underwater acoustic transducer.

[0008] One object of the present invention is to provide a backing of an underwater acoustic transducer and a method for manufacturing the backing, wherein during the process of applying pressure to the monomer layers, the method for manufacturing the backing causes the temperature of the stacked monomer layers to change cyclically, so that the deformation stress of each monomer layer can be effectively released, so that each monomer layer has sufficient adhesion and thermal stability, ensuring that the backing can adapt to a wide temperature operating range.

[0009] One object of the present invention is to provide a backing of an underwater acoustic transducer and a method for manufacturing the same, wherein in the process of hot pressing the stacked monomer layers, a filler is used to fill the cracked monomer layers and / or the adhesive layer, so that the backing can have a higher structural strength and a smaller deformation after being compressed. The backing can provide sufficient supporting force for the front-end module (for example, piezoelectric element, matching layer and sound-transmitting layer) of the underwater acoustic transducer to meet the use requirements of the underwater acoustic transducer in different water pressure environments.

[0010] In order to meet at least one of the above purposes, the technical solution adopted by the present invention is: a method for manufacturing a backing of an underwater acoustic transducer, which comprises the following steps:

[0011] S1, arranging two or more monomer layers in a stacked manner, wherein glue is provided between two adjacent monomer layers;

[0012] S2, hot pressing the stacked monomer layers to release the deformation stress of each monomer layer during the curing process of the glue, wherein the glue between two adjacent monomer layers forms a bonding layer for bonding the two adjacent monomer layers to obtain the backing.

[0013] According to an embodiment of the present invention, in step S2, the pressure applied to the stacked monomer layers is a constant pressure, and the temperature of the stacked monomer layers is changed in a high-low temperature cycle.

[0014] According to one embodiment of the present invention, in step S2, during the process of applying pressure to the stacked monomer layers so as to compress the stacked monomer layers, a high and low temperature cycle is used to change the temperature of the stacked monomer layers.

[0015] According to one embodiment of the present invention, in step S2, after pressure is applied to the stacked monomer layers so that the stacked monomer layers are compressed and while the pressure is maintained, a high and low temperature cycle is used to change the temperature of the stacked monomer layers.

[0016] According to one embodiment of the present invention, in step S2, first, the press head is allowed to generate high temperature and low temperature alternately and cyclically, and secondly, the press head is allowed to apply pressure to the laminated monomer layers to hot-press the laminated monomer layers to produce the backing.

[0017] According to one embodiment of the present invention, in step S2, first, the press head is allowed to apply pressure to the stacked monomer layers, and secondly, the press head is allowed to generate high and low temperatures alternately and cyclically to hot-press the stacked monomer layers to obtain the backing.

[0018] According to an embodiment of the present invention, in step S2, while allowing the pressure head to apply pressure to the laminated monomer layers, the temperature control part near the pressure head is allowed to generate high temperature and low temperature alternately and cyclically.

[0019] According to an embodiment of the present invention, in step S2, firstly, a pressure head is allowed to apply pressure to the laminated monomer layers, and secondly, a temperature control part near the pressure head is allowed to generate high temperature and low temperature alternately and cyclically.

[0020] According to an embodiment of the present invention, a filler is used to fill the cracked monomer layer; and / or a filler is used to fill the cracked monomer layer and the adhesive layer.

[0021] According to an embodiment of the present invention, the filler is glue, and the type of the glue is the same as the type of the glue arranged between two adjacent monomer layers.

[0022] According to an embodiment of the present invention, in the step S1, firstly, glue is applied to each of the monomer layers respectively, and secondly, the monomer layers are stacked so that glue is provided between two adjacent monomer layers.

[0023] According to one embodiment of the present invention, in the step S1, first, glue is applied on the upper surface of the lower monomer layer, and secondly, another monomer layer is stacked on the upper surface of the monomer layer to which glue is applied, so that the monomer layers are arranged in a stacked manner and glue is provided between two adjacent monomer layers.

[0024] The method for manufacturing the backing of the present invention has at least the following beneficial effects:

[0025] First, the manufacturing method of the backing adopts the method of hot pressing the stacked monomer layers to make the backing. During the hot pressing process of the stacked monomer layers, the glue between the adjacent monomer layers is cured to form the bonding layer, and in this process, the deformation stress of each monomer layer is released. In this way, on the one hand, the backing can be made of more than two materials to optimize the acoustic impedance performance of the backing. On the other hand, the acoustic impedance gradient of the backing can be designed according to the actual needs of the underwater acoustic transducer. For example, by changing the materials of each of the monomer layers, the backing can have different acoustic impedance gradients. In this way, the underwater acoustic transducer can achieve gradient attenuation of sound waves and improve the broadband and sensitivity of the underwater acoustic transducer. On the other hand, the backing can have a wide-band working range. Fourthly, the backing can balance the transmission and reception performance to meet the needs of the underwater acoustic transducer in different working conditions and environments. Fifthly, the overall thickness of the backing can be designed according to the actual needs of the underwater acoustic transducer.

[0026] Second, the manufacturing method of the backing uses constant pressure to apply pressure to the stacked monomer layers and makes the temperature of the monomer layers change in a high and low temperature cycle, so that the deformation stress of each monomer layer can be effectively released, so that each monomer layer has sufficient adhesion and thermal stability, ensuring that the backing can adapt to a wide temperature working range.

[0027] Third, in the process of hot pressing the stacked monomer layers, the manufacturing method of the backing uses a filler (for example, glue) to fill the cracked monomer layers and / or the bonding layer, so that the backing can have a higher structural strength and a smaller deformation after being compressed. The backing can provide sufficient supporting force for the front-end module (for example, piezoelectric element, matching layer and sound-transmitting layer) of the underwater acoustic transducer to meet the use requirements of the underwater acoustic transducer in different water pressure environments.

[0028] Other advantages and beneficial effects of the present invention will be further disclosed in the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 It is a three-dimensional schematic diagram from one viewing angle of an underwater acoustic transducer according to a preferred embodiment of the present invention.

[0030] Figure 2 It is a stereoscopic schematic diagram of the underwater acoustic transducer from another perspective according to the above preferred embodiment of the present invention.

[0031] Figure 3 It is a schematic cross-sectional view of a position of the underwater acoustic transducer according to the above preferred embodiment of the present invention.

[0032] Figure 4 yes Figure 3 A magnified schematic diagram of the local location.

[0033] Figure 5 It is a schematic diagram of one of the steps of the method for manufacturing the backing of the underwater acoustic transducer according to the above preferred embodiment of the present invention.

[0034] Figure 6 It is a schematic diagram of step 2 of the method for manufacturing the backing of the underwater acoustic transducer according to the above preferred embodiment of the present invention.

[0035] Figure 7 It is a schematic diagram of step three of the method for manufacturing the backing of the underwater acoustic transducer according to the above preferred embodiment of the present invention.

[0036] Figure 8 It is a schematic diagram of step 4 of the method for manufacturing the backing of the underwater acoustic transducer according to the above preferred embodiment of the present invention.

[0037] Fig. 9 It is a schematic diagram of step five of the method for manufacturing the backing of the underwater acoustic transducer according to the above preferred embodiment of the present invention.

[0038] Fig.10 It is a schematic diagram of an enlarged local position of the backing of the underwater acoustic transducer according to the above preferred embodiment of the present invention.

[0039] Fig.11 It is a three-dimensional schematic diagram of a specific example of the backing of the underwater acoustic transducer according to the above preferred embodiment of the present invention.

[0040] Fig.12 It is a cross-sectional schematic diagram of another specific example of the backing of the underwater acoustic transducer according to the above preferred embodiment of the present invention.

[0041] Fig.13 It is a cross-sectional schematic diagram of another specific example of the backing of the underwater acoustic transducer according to the above preferred embodiment of the present invention.

[0042] Fig.14 It is a cross-sectional schematic diagram of another specific example of the backing of the underwater acoustic transducer according to the above preferred embodiment of the present invention.

[0043] Fig.15 It is a cross-sectional schematic diagram of another specific example of the backing of the underwater acoustic transducer according to the above preferred embodiment of the present invention.

[0044] In the figure:

[0045] 10. Shell; 11. Shell space; 12. Shell opening;

[0046] 20. backing; 21. monomer layer; 22. adhesive layer;

[0047] 30. Piezoelectric element;

[0048] 40. Matching layer;

[0049] 50. Sound-permeable layer;

[0050] 100, supporting platform; 101, supporting surface;

[0051] 200, pressure head; 201, pressure surface;

[0052] 300, temperature control department;

[0053] 400. Filler. Implementation

[0054] Before describing in detail any embodiment of the present invention, it should be understood that the present invention is not limited in its application to the construction and arrangement details of the components described below or illustrated in the following figures. The present invention can have other embodiments and can be practiced or carried out in various ways. In addition, it should be understood that the words and terms used here are for descriptive purposes and should not be considered restrictive. The use of "including" or "having" and its variations herein is intended to cover the items and their equivalents and additional items displayed below. Unless otherwise specified or limited, the terms "install", "connect", "support" and "couple" and their variations are widely used and cover direct installation and indirect installation, connection, support and connection. In addition, "connect" and "couple" are not limited to physical or mechanical connections or connections.

[0055] Furthermore, on the first aspect, in the disclosure of the present invention, the orientation or positional relationship indicated by terms such as "longitudinal", "transverse", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside" and "outside" are based on the orientation or positional relationship shown in the accompanying drawings, which are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore the above terms cannot be understood as limitations on the present invention; on the second aspect, the term "one" should be understood as "at least one" or "one or more", that is, in one embodiment, the number of an element may be one, while in another embodiment, the number of the element may be multiple, and the term "one" cannot be understood as a limitation on the quantity.

[0056] Attached Figures 1 to 4 An underwater acoustic transducer according to a preferred embodiment of the present invention is shown, which includes a shell 10, a backing 20, a piezoelectric element 30, a matching layer 40 and a sound-transmitting layer 50. The shell 10 has a shell space 11 and a shell opening 12 connected to the shell space 11. The backing 20, the piezoelectric element 30, the matching layer 40 and the sound-transmitting layer 50 are stacked in sequence. The backing 20, the piezoelectric element 30, the matching layer 40 and the sound-transmitting layer 50 are all accommodated in the shell space 11 of the shell 10, and the sound-transmitting layer 50 closes the shell opening 12 of the shell 10. That is, on the one hand, the backing 20 isolates the piezoelectric element 30 and the inner wall of the shell 10, and the backing 20 is used to absorb the acoustic signal and attenuate it to a minimum; on the other hand, when the underwater acoustic transducer is in water, the backing 20 supports the piezoelectric element 30, the matching layer 40 and the sound-transmitting layer 50, so as to meet the use requirements of the underwater acoustic transducer in different water pressure environments.

[0057] Different from the backing of the underwater acoustic transducer in the prior art, in the underwater acoustic transducer of the present invention, the backing 20 includes at least two monomer layers 21 and at least one adhesive layer 22, and the adhesive layer 22 is used to bond two adjacent monomer layers 21 so that these monomer layers 21 are arranged in a stacked manner. In this way, different materials can be selected for these monomer layers 21 of the backing 20 to optimize the acoustic impedance performance of the backing 20, and the acoustic impedance gradient of the backing 20 can be designed according to the actual needs of the underwater acoustic transducer. For example, by changing the materials of each of the monomer layers 21, the backing 20 can have different acoustic impedance gradients, so that the underwater acoustic transducer can achieve a gradient change of the sound wave to improve the broadband and sensitivity of the underwater acoustic transducer.

[0058] It is worth mentioning that the parameters of the backing 20 are directly related to the parameters of the underwater acoustic transducer. Therefore, it is necessary to determine the acoustic impedance gradient of the backing 20 and the thickness of the backing 20 based on the KLM transmission line theory (i.e., transducer transmission line theory) and wave theory (incident, refraction, emission) according to the type of the underwater acoustic transducer (for example, a dedicated transducer for transmission, a dedicated transducer for reception, a transducer for both transmission and reception), the operating frequency (high frequency, medium frequency, low frequency), the broadband requirement (wideband, narrowband), the emission response and sensitivity requirements, the water pressure resistance requirements, etc., and the backing 20 is manufactured by stacking more than two monomer layers 21, so that the acoustic impedance gradient of the backing 20 and the thickness of the backing 20 can easily meet the actual needs of different underwater acoustic transducers.

[0059] The performance of the underwater acoustic transducer is frequency-dependent, that is, if the frequencies of the underwater acoustic transducers of the same structure are inconsistent, the performance of the underwater acoustic transducers will also be different. The backing 20 plays a key role in the frequency of the underwater acoustic transducer. Therefore, the properties of the backing 20 will be adjusted according to the frequency and size of the supporting underwater acoustic transducer. The adjustment includes the thickness of the backing 20 and the thickness and material of each monomer layer 21 of the backing 20. The backing 20 is manufactured by stacking more than two monomer layers 21, so that the above-mentioned contents of the backing 20 can be adjusted more easily.

[0060] The change of acoustic impedance gradient refers to the linear increase or decrease of acoustic impedance, and also refers to the oscillatory change of acoustic impedance curve. Those skilled in the art should understand that the value of the acoustic impedance ratio of a material is the product of the material density and the sound velocity, that is, , It can be seen from the formula that the acoustic impedance ratio and the material density are proportional. When the sound velocity does not change significantly, the acoustic impedance ratio can be increased by increasing the density of the material. By adopting more than two of the monomer layers 21 in a stacked arrangement to manufacture the backing 20, the acoustic impedance gradient of the backing 20 can be easily controlled to meet the actual needs of different underwater acoustic transducers.

[0061] Preferably, the backing 20 of the underwater acoustic transducer includes n monomer layers 21, wherein the value range of n is: n≥3, so that the backing 20 can have a rich acoustic impedance change. For example, in some specific examples of the underwater acoustic transducer of the present invention, the acoustic impedance of the backing 20 changes in a manner that the acoustic impedance increases or decreases from one side to the other side, that is, In some other specific examples of the underwater acoustic transducer of the present invention, the acoustic impedance of the backing 20 changes in a manner that the internal acoustic impedance is the highest and decreases from the inside to the outside, that is, In some other specific examples of the underwater acoustic transducer of the present invention, the acoustic impedance of the backing 20 changes in a manner that the internal acoustic impedance is the lowest and increases from the inside to the outside, that is, .

[0062] Attached Figures 5 to 10 The manufacturing process of the backing 20 is shown.

[0063] Reference Figure 5 , two or more monomer layers 21 are arranged in a stacked manner, wherein glue is provided between two adjacent monomer layers 21. For example, in some embodiments of the present invention, first, glue is applied to each monomer layer 21, and then, the monomer layers 21 are arranged in a stacked manner, so that glue is provided between two adjacent monomer layers 21. In other embodiments of the present invention, first, glue is applied to the upper surface of the lower monomer layer 21, and then, another monomer layer 21 is stacked on the upper surface of the monomer layer 21 to which glue is applied, and this is repeated, and the monomer layers 21 are arranged in a stacked manner, and glue is provided between two adjacent monomer layers 21.

[0064] It is worth mentioning that the material and thickness of each monomer layer 21 and the number of monomer layers 21 are selected according to the design requirements of the backing 20, and the present invention is not limited in this regard. Figure 5In the stage shown, the five monomer layers are arranged in a stacked manner, so that after the backing 20 is manufactured, the backing 20 has a nine-layer structure, that is, the backing 20 includes five monomer layers 21 and four adhesive layers 22, and each of the adhesive layers 22 has a monomer layer 21 on both sides thereof.

[0065] It is worth mentioning that the type of glue disposed between two adjacent monomer layers 21 is not limited in the present invention. For example, in some specific examples of the present invention, the glue disposed between two adjacent monomer layers 21 may be epoxy glue, acrylic glue, rubber glue, etc. Preferably, the glue disposed between two adjacent monomer layers 21 may be a wide temperature slow drying type glue.

[0066] It is also worth mentioning that the specific method of applying glue to the monomer layer 21 is not limited in the present invention. For example, in a specific example of the present invention, a glue roller can be used to apply glue to the monomer layer 21.

[0067] Reference Figure 6 and Figure 7 The stacked monomer layers 21 are placed on a supporting platform 100, and a pressure head 200 is used to apply pressure to the monomer layers 21 so that the monomer layers 21 are compacted. It can be understood that the shape of the supporting surface 101 of the supporting platform 100 and the shape of the pressure surface 201 of the pressure head 200 determine the shapes of the opposite sides of the backing 20. Figure 6 and Figure 7 In the stage shown, the supporting surface 101 of the supporting platform 100 and the pressure surface 201 of the pressing head 200 are both planes, and the supporting surface 101 of the supporting platform 100 and the pressure surface 201 of the pressing head 200 are parallel to each other. Therefore, the opposite sides of the backing 20 are planes parallel to each other, that is, the backing 20 is flat as a whole.

[0068] It can also be understood that the pressure applied to the monomer layers 21 by the supporting platform 100 and the pressure head 200 is selected according to the design parameters of the backing 20 (e.g., overall thickness, acoustic impedance gradient) and the material type of each monomer layer 21. After the compression amount of the monomer layers 21 arranged in layers reaches the design value, the supporting platform 100 and the pressure head 200 cooperate with each other to maintain the pressure of the compressed monomer layers 21, that is, the pressure applied to the monomer layers 21 arranged in layers by the supporting platform 100 and the pressure head 200 is a constant pressure, so that the monomer layers 21 arranged in layers are continuously compressed and the pressure is no longer increased. Next, a temperature control unit 300 is allowed to cyclically generate high and low temperatures, so that the temperature change of the monomer layers 21 after being compressed and in the pressure-maintaining process is a high and low temperature cycle. In this way, the deformation amount of the monomer layers 21 can be ensured to be consistent, so as to conveniently control the deformation amount of the backing 20 as a whole. For example, in a specific example, the supporting platform 100 and the pressure head 200 cooperate with each other to apply a pressure greater than 10Mpa to the monomer layers 21, and the temperature of the temperature control unit 300 when generating high temperature is 60°C and the temperature when generating low temperature is -30°C. In this way, the underwater acoustic transducer equipped with the backing 20 can operate in an environment with a water depth of 1000 meters and a water temperature range of -30°C-60°C.

[0069] It is worth mentioning that the time for the supporting platform 100 and the pressure head 200 to maintain the pressure of the compressed stacked monomer layers 21 and the time for the temperature of the stacked monomer layers 21 to change in a high and low temperature cycle are determined according to the curing time of the glue arranged between two adjacent monomer layers 21.

[0070] In a specific example of the present invention, refer to the attached Figure 6 and Figure 7 , the temperature control part 300 is arranged on the pressure head 200, and the temperature control part 300 is far away from the monomer layers 21. For example, the temperature control part 300 is arranged on the side of the pressure head 200 far away from the pressure surface 201, so that the heat generated by the temperature control part 300 is transferred to the monomer layers 21 through the pressure head 200, so that the heat transfer efficiency can be guaranteed. It can be understood that since the temperature control part 300 generates high and low temperatures cyclically, the way in which the pressure head 200 transfers heat is also high and low temperature cyclic conduction, that is, the temperature of the pressure head 200 itself also presents high and low temperature cyclic changes.

[0071] Optionally, in some further specific examples of the present invention, the temperature control unit 300 can be arranged on the supporting platform 100, and the temperature control unit 300 is far away from the monomer layers 21. For example, the temperature control unit 300 is arranged on the side of the supporting platform 100 away from the supporting surface 101, so that the heat generated by the temperature control unit 300 is transferred to the monomer layers 21 via the pressure head 200, so that the heat transfer efficiency can be guaranteed. It can be understood that since the temperature control unit 309 generates high and low temperatures cyclically, the way in which the supporting platform 100 transfers heat is also high and low temperature cyclic conduction, that is, the temperature of the supporting platform 100 itself also presents high and low temperature cyclic changes.

[0072] Optionally, in some other specific examples of the present invention, the supporting platform 100 and the pressing head 200 are both provided with the temperature control part 300, and the temperature control part 300 arranged on the supporting platform 100 and the temperature control part 300 arranged on the pressing head 200 are both far away from the monomer layers 21, so that the heat generated by the temperature control part 300 arranged on the supporting platform 100 is conducted to the monomer layers 21 via the supporting platform 100, and the heat generated by the temperature control part 300 arranged on the pressing head 200 is conducted to the monomer layers 21 via the pressing head 200, so that the heat conduction efficiency can be guaranteed, and the bottom and top of the monomer layers 21 can be evenly heated, so as to facilitate controlling the overall quality of the backing 20.

[0073] Optionally, in some other specific examples of the present invention, the temperature control part 300 is independent of the supporting platform 100 and the pressing head 200. When the supporting platform 100 and the pressing head 200 cooperate with each other to compress the stacked monomer layers 21 and maintain the pressure of the compressed monomer layers 21, the temperature control part 300 cyclically generates high and low temperatures, and the heat generated by the temperature control part 300 is conducted to the monomer layers 21 through the air.

[0074] It is worth mentioning that in this specific example of the present invention, Figure 6 and Figure 7 , after the supporting platform 100 and the pressing head 200 cooperate with each other to compress the monomer layers 21 of the stacked layers to reach the designed compression amount, the temperature of the monomer layers 21 maintained under pressure is changed in a high and low temperature cycle. In other specific examples of the present invention, during the process in which the supporting platform 100 and the pressing head 200 cooperate with each other to compress the monomer layers 21 of the stacked layers to reach the designed compression amount, the temperature of the monomer layers 21 is changed in a high and low temperature cycle, that is, the process of compressing the monomer layers 21 of the stacked layers and the process of changing the temperature of the monomer layers 21 in a high and low temperature cycle are synchronized.

[0075] It is understandable that the monomer layers 21 and / or the adhesive layer 22 may crack due to excessive pressure or excessive temperature range on the laminated monomer layers 21. In order to ensure that the monomer layers 21 are compacted, the supporting platform 100 and the pressure head 200 cooperate with each other to maintain the pressure of the compressed laminated monomer layers 21 and to cycle the temperature of the monomer layers 21 through high and low temperatures. The filler 400 is used to fill the cracked monomer layers 21 and / or the adhesive layer 22. Figure 8 In this way, the internal stress of each monomer layer 21 can be uniformly released.

[0076] It is worth mentioning that in the process where the supporting platform 100 and the pressure head 200 cooperate with each other to maintain the pressure of the compressed laminated monomer layers 21 and to cycle the temperature of the monomer layers 21 between high and low temperatures, the specific method of filling the cracked monomer layers 21 and / or the adhesive layer 22 with fillers is not limited in the present invention. For example, in a specific example of the present invention, a fluid filler 400 is added to the gap between the supporting platform 100 and the pressure head 200, and the filler 400 surrounds the monomer layers 21. If the monomer layers 21 and / or the adhesive layers 22 are cracked, the fluidity of the filler 400 allows the filler 400 to penetrate into the cracked positions of the monomer layers 21 and / or the adhesive layers 22 to fill the cracked monomer layers 21 and / or the adhesive layers 22.

[0077] Optionally, in other embodiments of the present invention, after the supporting platform 100 and the pressing head 200 cooperate with each other to compress the stacked monomer layers 21 to reach the designed compression amount and the glue is cured to form the bonding layer 22, the pressing head 200 is moved away from the supporting platform 100 to check whether the monomer layer 21 at the top and the monomer layer 21 at the bottom of the backing 20 are cracked. If the monomer layer 21 at the top and the monomer layer 21 at the bottom of the backing 20 are not cracked, the backing 20 is completed, that is, the backing 20 does not need to be filled. If the monomer layer 21 at the top and the monomer layer 21 at the bottom of the backing 20 are not cracked, the backing 20 is completed, that is, the backing 20 does not need to be filled. If cracks exist in the monomer layer 21, the filler 400 is used to fill the cracked positions of the monomer layer 21. The fluidity of the filler 400 allows the filler 400 to penetrate into the interior of the backing 20 along the cracked positions to fill the cracked monomer layer 21 and / or the adhesive layer 22. Subsequently, the supporting platform 100 and the pressing head 200 are allowed to cooperate with each other to continue hot pressing the backing 20. The pressure applied by the supporting platform 100 and the pressing head 200 to the backing 20 is consistent with the pressure during pressure maintenance. The temperature change mode of the backing 20 is a high and low temperature cycle to solidify the filler 400 and release the internal stress of the backing 20 to obtain the backing 20.

[0078] It is also worth mentioning that the type of the filler 400 is not limited in the present invention. For example, the filler 400 can be a flexible glue or a hard glue. The glue can be epoxy resin, polyurethane, quick-drying glue, etc. Preferably, the type of the filler 400 is consistent with the type of the glue disposed between two adjacent monomer layers 21, so as to facilitate controlling the acoustic impedance gradient of the backing 20 within the designed range.

[0079] Reference Fig. 9 and Fig.10After the glue and the filler 400 disposed on the two adjacent monomer layers 21 are cured, the backing 20 is obtained. At this time, after the pressure head 200 moves away from the top of the supporting platform 100, the shape of the backing 20 will not change. It can be understood that since the supporting surface 101 of the supporting platform 100 and the pressure surface 201 of the pressure head 200 are both planes, and the supporting surface 101 of the supporting platform 100 and the pressure surface 201 of the pressure head 200 are parallel to each other, the opposite sides of the backing 20 are planes parallel to each other, that is, the backing 20 as a whole is in the shape of a flat plate. The edge of the backing 20 can be cut so that the shape of the backing 20 meets the actual assembly requirements of the underwater acoustic transducer. For example, the edge of the backing 20 can be cut into straight edges so that the backing 20 is formed as shown in the attached Fig.11 Optionally, the edge of the backing 20 can also be cut into a circle so that the backing 20 forms a cylinder. The edge of the backing 20 can be cut by laser cutting, water cutting, stamping, etc.

[0080] As required, the backing 20 may also be made into Fig.12 The semicircular tube type shown, Fig.13 The semi-elliptical tube type shown in Fig.14 The wave type shown, such as Fig.15 For example, if the backing 20 is to be made into a stepped shape as shown in FIG. Fig.12 The semicircular tube type shown in Figures 6 to 8 In the stage shown, the supporting surface 101 of the supporting platform 100 is a semicircular convex surface, and the pressing surface 201 of the pressing head 200 is a semicircular concave surface. The supporting surface 101 of the supporting platform 100 and the pressing surface 201 of the pressing head 200 cooperate with each other to compact the stacked monomer layers 21 into a Fig.12 The semicircular tube type shown.

[0081] According to another aspect of the present invention, the present invention further provides a method for manufacturing the backing 20, wherein the method for manufacturing the backing 20 comprises the following steps:

[0082] S1, arranging two or more monomer layers 21 in a stacked manner, wherein glue is provided between two adjacent monomer layers 21; and

[0083] S2, hot pressing the stacked monomer layers 21 to release the deformation stress of each monomer layer 21 during the curing process of the glue, wherein the glue between two adjacent monomer layers 21 forms the bonding layer 20 for bonding two adjacent monomer layers 21 to obtain the backing 20.

[0084] That is to say, the manufacturing method of the backing 20 of the present invention adopts the method of hot pressing the stacked monomer layers 21 to make the backing 20. During the hot pressing process of the stacked monomer layers 21, the glue between the adjacent monomer layers 21 is cured to form the bonding layer 22, and in this process, the deformation stress of each monomer layer 21 is released. In this way, on the one hand, the backing 20 can be made of more than two materials to optimize the acoustic impedance performance of the backing 20, and on the other hand, the acoustic impedance gradient of the backing 20 can be adjusted according to the The actual needs of the underwater acoustic transducer are designed. For example, by changing the materials of each of the monomer layers 21, the backing 20 can have different acoustic impedance gradients. In this way, the underwater acoustic transducer can achieve gradient attenuation of sound waves and improve the broadband and sensitivity of the underwater acoustic transducer. On the other hand, the backing 20 can have a wide-band working range. Fourthly, the backing 20 can balance the transmission and receiving performances to meet the needs of the underwater acoustic transducer in different working conditions and environments. Fifthly, the overall thickness of the backing 20 can be designed according to the actual needs of the underwater acoustic transducer.

[0085] Preferably, the method of setting glue between two adjacent monomer layers 21 is not limited in the manufacturing method of the backing 20 of the present invention. For example, in some embodiments, first, glue is applied to each monomer layer 21, and then, the monomer layers 21 are arranged in layers, so that glue is provided between two adjacent monomer layers 21. In other embodiments, first, glue is applied to the upper surface of the lower monomer layer 21, and then, another monomer layer 21 is stacked on the upper surface of the monomer layer 21 to which glue is applied, so that the monomer layers 21 are arranged in layers and glue is provided between two adjacent monomer layers 21.

[0086] Further, in the step S2, the pressure applied to the monomer layers 21 arranged in layers is a constant pressure, and the temperature of the monomer layers 21 arranged in layers is changed in a high-low temperature cycle. The manufacturing method of the backing 20 of the present invention uses a constant pressure to apply pressure to the monomer layers 21 arranged in layers and to change the temperature of the monomer layers 21 arranged in layers in a high-low temperature cycle, so that the deformation stress of each monomer layer 21 can be effectively released, so that each monomer layer 21 has sufficient adhesion and thermal stability, ensuring that the backing 20 adapts to a wide temperature working range. For example, in a specific example of the manufacturing method of the backing 20 of the present invention, the pressure on the monomer layers 21 arranged in layers is greater than 10Mpa, the temperature at high temperature is 60°C, and the temperature at low temperature is -30°C, so that the underwater acoustic transducer equipped with the backing 20 can work in an environment with a water depth of 1000 meters, and the water temperature range is -30°C-60°C.

[0087] It is worth mentioning that, in the step S2, the process of applying pressure to the monomer layers 21 arranged in layers and the process of causing the temperature of the monomer layers 21 to change in a high-low temperature cycle can be synchronous or asynchronous, which is selected according to needs. For example, in some specific examples of the method for manufacturing the backing 20 of the present invention, in the step S2, in the process of applying pressure to the monomer layers 21 arranged in layers so that the monomer layers 21 arranged in layers are compressed, the temperature of the monomer layers 21 is caused to change in a high-low temperature cycle. In some other embodiments of the method for manufacturing the backing 20 of the present invention, in the step S2, after applying pressure to the monomer layers 21 arranged in layers so that the monomer layers 21 arranged in layers are compressed and while the pressure is maintained, the temperature of the monomer layers 21 is caused to change in a high-low temperature cycle. In some other embodiments of the method for manufacturing the backing 20 of the present invention, in the step S2, first, the press head 200 is allowed to generate high temperature and low temperature alternately and cyclically, and secondly, the press head 200 is allowed to apply pressure to the stacked monomer layers 21 to hot-press the stacked monomer layers 21 to obtain the backing 20.

[0088] Furthermore, in step S2, the filler 400 is used to fill the cracked monomer layer 21 and / or the adhesive layer 22, so that the backing 20 can have a higher structural strength and a smaller deformation after being compressed, and the backing 20 can provide sufficient support for the front-end modules such as the piezoelectric element 30, the matching layer 40 and the sound-transmitting layer 50 of the underwater acoustic transducer, so as to meet the use requirements of the underwater acoustic transducer in different water pressure environments. Preferably, the filler 400 is glue, and the type of glue is the same as the type of glue arranged between two adjacent monomer layers 21.

[0089] It should be understood by those skilled in the art that the embodiments of the present invention described above and shown in the accompanying drawings are only examples and do not limit the present invention. The purpose of the present invention has been fully and effectively achieved. The functional and structural principles of the present invention have been demonstrated and explained in the embodiments, and the embodiments of the present invention may be deformed or modified in any way without departing from the principles.

Claims

1. A method for manufacturing a backing of an underwater acoustic transducer, characterized in that: The method for manufacturing the backing comprises the following steps: S1, arranging two or more monomer layers in a stacked manner, wherein glue is provided between two adjacent monomer layers; S2, placing the stacked monomer layers on a supporting platform, using a pressure head to apply pressure to the monomer layers so that the monomer layers are compacted, and after the compression amount reaches the designed value, the supporting platform and the pressure head cooperate with each other to maintain the pressure of the compressed monomer layers so that the pressure applied to the monomer layers is a constant pressure; S3, the temperature control unit cyclically generates high and low temperatures, so that the temperature of the compressed and pressure-maintaining monomer layers changes in a high-low temperature cycle, so as to release the deformation stress of each monomer layer during the curing process of the glue, wherein the glue between two adjacent monomer layers forms a bonding layer for bonding the two adjacent monomer layers; S4, when the monomer layers and the adhesive layer are cracked, a filler is filled into the cracked monomer layers and the adhesive layer, wherein the filler is glue, and the supporting platform and the pressure head again apply the same pressure as that during the above pressure holding to the monomer layers and the temperature control unit to cyclically generate high and low temperatures, so that the temperature change mode of the compressed monomer layers in the pressure holding process is a high and low temperature cycle; The supporting platform and the pressure head cooperate with each other to apply a pressure greater than 10 MPa to the monomer layers, and the temperature of the temperature control part when generating high temperature is 60°C, and the temperature when generating low temperature is -30°C.

2. The method for manufacturing a backing according to claim 1, characterized in that: The number of the monomer layers is more than three, and the acoustic impedance of the backing changes in a manner that the acoustic impedance increases or decreases from one side to the other side.

3. The method for manufacturing a backing according to claim 1, characterized in that: The number of the monomer layers is more than three, and the acoustic impedance of the backing changes in a manner that the internal acoustic impedance is the highest and decreases from the inside to the outside.

4. The method for manufacturing a backing according to claim 2, characterized in that: The number of the monomer layers is more than three, and the acoustic impedance of the backing changes in a manner that the internal acoustic impedance is the lowest and increases from the inside to the outside.

5. The method for manufacturing a backing according to claim 1, characterized in that: The type of glue is the same as the type of glue arranged between two adjacent monomer layers.

6. The method for manufacturing a backing according to any one of claims 1 to 4, characterized in that: In the step S1 , firstly, glue is applied to each of the monomer layers respectively, and then, the monomer layers are stacked so that glue is disposed between two adjacent monomer layers.

7. The method for manufacturing a backing according to any one of claims 1 to 4, characterized in that: In step S1, first, glue is applied on the upper surface of the lower monomer layer, and then another monomer layer is stacked on the upper surface of the monomer layer coated with glue, so that the monomer layers are stacked and glue is provided between two adjacent monomer layers.

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