Integrated chip liquid cooling heat dissipation device

Abstract

The application relates to an integrated chip liquid cooling heat dissipation device, which comprises a chip packaging substrate, a heat dissipation flow channel bearing plate, a sealing top cover and a chip, the chip is located above the chip packaging substrate, the heat dissipation flow channel bearing plate is fixed above the chip, the sealing top cover is fixed above the heat dissipation flow channel bearing plate and connected with the chip packaging substrate; the heat dissipation flow channel bearing plate comprises a cold fluid distribution cavity, a heat dissipation flow channel and a hot fluid collection cavity which are sequentially communicated, a cold fluid inlet and a hot fluid outlet are arranged above the sealing top cover, the cold fluid inlet is communicated with the cold fluid distribution cavity, and the hot fluid outlet is communicated with the hot fluid collection cavity. Compared with the prior art, the application has the advantages of good heat dissipation effect, small volume and the like.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor phase change heat dissipation, in particular to an integrated chip liquid cooling heat dissipation device. BACKGROUND

[0002] The performance of a computer chip is closely related to its operating temperature. When the operating temperature is too high, the chip may exhibit unstable operation, accompanied by a risk of reduced service life and complete destruction of the chip. The main task of a heat dissipation device is to transfer the heat generated by the chip to the external environment to reduce the temperature of the chip and ensure its stable operation. In order to ensure that the chip works properly at a suitable temperature, the heat dissipation device plays a crucial role.

[0003] Although air-cooled heat sinks are widely used in the computer field at present, with the continuous improvement of chip performance, the heat control requirements become more and more stringent. The heat dissipation capacity of air-cooled heat sinks may not meet the requirements when facing some high heat flux density chips.

[0004] In this case, other more efficient heat dissipation technologies emerge as the times require, such as liquid cooling technology based on liquid phase working fluid convection heat transfer, which is recognized as one of the advanced technologies with great development potential for the next generation. By taking advantage of the high specific heat capacity of liquid working fluid and combining the physical characteristics of pressurized acceleration in closed channels, this technology not only significantly improves the heat transfer coefficient and realizes efficient suppression of chip temperature, but also effectively reduces the energy consumption and noise pollution required for heat dissipation. The application of this technology is of great significance to improve the performance, stability and reliability of semiconductor chips, and provides key support for the sustainable development of the semiconductor industry.

[0005] For example, Chinese patent CN111787776A discloses a liquid cooling heat dissipation device, which includes a liquid cooling device, a heat exchange device and a heat dissipation device. The liquid cooling device contains cooling liquid. The heat source to be cooled is placed in the cooling liquid of the liquid cooling device. The liquid cooling device and the heat dissipation device are respectively connected to the cold and hot sides of the heat exchange device. The liquid cooling device is connected to the hot side of the heat exchange device, and the heat dissipation device is connected to the cold side of the heat exchange device. After the liquid in the cold and hot sides of the heat exchange device is in indirect contact, the liquid in the cold side of the heat exchange device absorbs heat and vaporizes. The specific liquid vaporized by the heat dissipation device is compressed into liquid after cooling, and the cooled liquid continues to circulate into the heat exchange device.

[0006] However, in the current application of technology, the traditional liquid cooling heat dissipation device is often large in size, which is difficult to adapt to the demand for miniaturization of chips. The present application proposes an integrated miniaturized liquid cooling heat dissipation device, which plays an important role in improving cooling performance and reducing system size. SUMMARY

[0007] The present application aims at overcoming the defects of the prior art, i.e., the liquid cooling heat dissipation device is usually large in size and difficult to adapt to the demand for chip miniaturization, and provides an integrated chip liquid cooling heat dissipation device which is high in heat dissipation capacity and high in integration.

[0008] The object of the present application can be achieved by the following technical solutions.

[0009] An integrated chip liquid cooling heat dissipation device comprises a chip packaging substrate, a heat dissipation flow channel bearing plate, a sealing top cover and a chip, the chip is located above the chip packaging substrate, the heat dissipation flow channel bearing plate is fixed above the chip, the sealing top cover is fixed above the heat dissipation flow channel bearing plate and connected to the chip packaging substrate.

[0010] The heat dissipation flow channel bearing plate comprises a cold fluid distribution cavity, a heat dissipation flow channel and a hot fluid collection cavity which are sequentially communicated, the sealing top cover is provided with a cold fluid inlet and a hot fluid outlet above, the cold fluid inlet is communicated with the cold fluid distribution cavity, and the hot fluid outlet is communicated with the hot fluid collection cavity.

[0011] Preferably, the heat dissipation flow channel of the heat dissipation flow channel bearing plate is located above the chip heat dissipation area, and the area of the heat dissipation flow channel is customized according to the size and shape of the chip.

[0012] Preferably, the number of the heat dissipation flow channels is multiple, the left end of each heat dissipation flow channel is communicated with the cold fluid distribution cavity, and the right end of each heat dissipation flow channel is communicated with the hot fluid collection cavity.

[0013] Preferably, each heat dissipation flow channel is distributed in parallel between the cold fluid distribution cavity and the hot fluid collection cavity, and the number and spacing of the heat dissipation flow channels are customized according to the size and heat flux density of the chip.

[0014] Preferably, the cold fluid distribution cavity and the hot fluid collection cavity are both cavity bodies of expansion structure, the bottom end of the cavity body of expansion structure is communicated with the heat dissipation flow channel, and the top end of the cavity body of expansion structure is communicated with the cold fluid inlet or the hot fluid outlet.

[0015] Preferably, brazing solder is arranged between the chip and the heat dissipation flow channel bearing plate, and the chip and the heat dissipation flow channel bearing plate are welded by brazing.

[0016] Preferably, fixed pins are arranged at both ends and the middle position below the sealing top cover, and the sealing top cover is welded and fixed on the chip packaging substrate by the fixed pins.

[0017] Preferably, a thread is arranged on the outside of the cold fluid inlet, the cold fluid inlet is connected to an external device by the thread, and the cold fluid inlet is fixed on the sealing top cover by welding.

[0018] Preferably, the outer side of the hot fluid outlet is provided with threads, and the hot fluid outlet is connected to an external device by threads, and the hot fluid outlet is fixed to the sealing top cover by welding.

[0019] Preferably, the ratio of the heat dissipation flow channel bearing plate to the shell thickness of the sealing top cover ranges from 0.1 to 10.

[0020] Compared with the prior art, the present application has the following advantages:

[0021] (1) The present application stacks the chip packaging substrate, the chip, the heat dissipation flow channel bearing plate and the sealing top cover from bottom to top in sequence, and performs integrated molding to obtain an integrated chip heat dissipation device; cooling liquid is injected into the cold fluid distribution cavity through the cold fluid inlet, the cooling liquid carries away the heat generated by the chip through the heat dissipation flow channel, the cooling liquid after absorbing heat enters the fluid collection cavity, and then is discharged to the outside of the heat dissipation device through the hot fluid outlet, so as to circulate repeatedly and complete the cooling of the chip. The compactness of the heat dissipation device is significantly improved, the cooling performance of the heat dissipation device is improved, and the uniformity and stability of the chip temperature are maintained.

[0022] (2) The present application not only effectively saves the internal space of the computer case to further improve the integration and expandability of the computer; moreover, the highly integrated design greatly simplifies the user installation process, reduces the risk of liquid leakage due to improper user installation, and enhances the compatibility of the heat sink to various case models.

[0023] (3) In the present application, a plurality of parallel and equidistantly distributed heat dissipation flow channels are arranged to improve the uniformity of the cooling liquid passing through each heat dissipation flow channel through the cold fluid inlet, so as to uniformly carry away the heat generated by the chip everywhere, and finally converge at the hot fluid outlet, so that the cooling of the chip everywhere is uniform and stable. BRIEF DESCRIPTION OF DRAWINGS

[0024] Figure 1 The structure schematic diagram of the overall structure of the heat dissipation device from the first perspective is provided for the present application.

[0025] Figure 2 The structure schematic diagram of the overall structure of the heat dissipation device from the second perspective is provided for the present application.

[0026] Figure 3 The cross-sectional structure schematic diagram of the heat dissipation device is provided for the present application.

[0027] Figure 4 The structure schematic diagram of the heat dissipation flow channel bearing plate is provided for the present application.

[0028] In the figure: 1, cold fluid inlet, 2, hot fluid outlet, 3, sealing top cover, 4, chip package substrate, 5, heat dissipation flow passage bearing plate, 51, cold fluid distribution cavity, 52, hot fluid collection cavity, 53, heat dissipation flow passage, 54, heat dissipation rib column, 6, soldering solder, 7, integrated circuit chip. DETAILED DESCRIPTION

[0029] In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the following will be combined with the accompanying drawings of the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described and shown in the accompanying drawings can be arranged and designed in various different configurations.

[0030] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but only represents selected embodiments of the present application. All other embodiments obtained by those of ordinary skill in the art based on the embodiments in the present application without creative labor are within the scope of protection of the present application.

[0031] It should be noted that: similar reference numerals and letters represent similar items in the following drawings, therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings.

[0032] In the description of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship when the product of the present application is usually placed, and are only for the convenience of describing the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the indicated device or element must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application.

[0033] It should be noted that the terms "first", "second" are only for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined with "first", "second" can explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "multiple" is two or more, unless otherwise specifically limited.

[0034] In addition, the terms "horizontal", "vertical" and the like do not mean that the components must be absolutely horizontal or vertical, but can be slightly inclined. For example, "horizontal" only means that its direction is relatively more horizontal than "vertical", and does not mean that the structure must be completely horizontal, but can be slightly inclined.

[0035] Embodiment 1

[0036] The embodiment provides an integrated chip liquid cooling heat dissipation device, as shown in the drawings, comprising a chip packaging substrate 4, a heat dissipation flow channel bearing plate 5, a sealing top cover 3 and a chip 7, the chip 7 is located above the chip packaging substrate 4, the heat dissipation flow channel bearing plate 5 is fixed above the chip 7, the sealing top cover 3 is fixed above the heat dissipation flow channel bearing plate 5 and is connected with the chip packaging substrate 4. Figures 1-4

[0037] The heat dissipation flow channel bearing plate 5 comprises a cold fluid distribution cavity 51, a heat dissipation flow channel 53 and a hot fluid collection cavity 52 which are sequentially communicated, and the top of the sealing top cover 3 is provided with a cold fluid inlet 1 and a hot fluid outlet 2, the cold fluid inlet 1 is communicated with the cold fluid distribution cavity 51, and the hot fluid outlet 2 is communicated with the hot fluid collection cavity 52.

[0038] Working principle: the chip packaging substrate 4, the chip 7, the heat dissipation flow channel bearing plate 5 and the sealing top cover 3 are stacked from bottom to top in sequence and are integrally formed to obtain an integrated chip heat dissipation device; cooling liquid is injected into the cold fluid distribution cavity 51 through the cold fluid inlet 1, the cooling liquid carries away the heat generated by the chip through the heat dissipation flow channel 53, the cooling liquid after absorbing heat enters the fluid collection cavity 52, and then is discharged to the outside of the heat dissipation device through the hot fluid outlet 2, so as to circulate repeatedly and complete the cooling of the chip.

[0039] The embodiment provides an integrated chip liquid cooling heat dissipation device, as shown in the drawings, comprising a chip packaging substrate 4, a heat dissipation flow channel bearing plate 5, a sealing top cover 3 and a chip 7, the chip 7 is located above the chip packaging substrate 4, the heat dissipation flow channel bearing plate 5 is fixed above the chip 7, the sealing top cover 3 is fixed above the heat dissipation flow channel bearing plate 5 and is connected with the chip packaging substrate 4.

[0040] Specifically, the heat dissipation flow channel 53 of the heat dissipation flow channel bearing plate 5 is located above the chip heat dissipation area, and the area of the heat dissipation flow channel is customized and designed according to the size and shape of the chip.

[0041] As a preferred embodiment, as shown in the drawings, the number of heat dissipation flow channels 53 is multiple, the left end of each heat dissipation flow channel 53 is communicated with the cold fluid distribution cavity 51, and the right end is communicated with the hot fluid collection cavity 52. Each heat dissipation flow channel 53 is distributed at equal intervals between the cold fluid distribution cavity 51 and the hot fluid collection cavity 52. Each heat dissipation flow channel 53 is distributed in parallel between the cold fluid distribution cavity 51 and the hot fluid collection cavity 52. Figure 4 ​​

[0042] By setting multiple parallel distributed heat dissipation flow channels, the cooling liquid passing through the cold fluid inlet can pass through each heat dissipation flow channel more evenly, so as to take away the heat generated at each part of the chip more evenly, and finally converge at the hot fluid outlet, so that the cooling of each part of the chip is uniform and stable. The number and spacing of the heat dissipation flow channels are customized according to the size and heat flux density of the chip.

[0043] As a preferred embodiment, the cold fluid distribution cavity 51 and the hot fluid collection cavity 52 are both expanded structure cavities, the bottom end of the expanded structure cavity is connected to the heat dissipation flow channel 53, and the top end of the expanded structure cavity is connected to the cold fluid inlet 1 or the hot fluid outlet 2.

[0044] Specifically, the chip 7 and the heat dissipation flow channel carrying plate 5 are provided with a solder 6, and the chip 7 and the heat dissipation flow channel carrying plate 5 are soldered.

[0045] As a preferred embodiment, the outside of the cold fluid inlet 1 is provided with threads, the cold fluid inlet 1 is connected to an external device through the threads, and the cold fluid inlet 1 is fixed on the sealing top cover 3 by welding. The outside of the hot fluid outlet 2 is provided with threads, the hot fluid outlet 2 is connected to an external device through the threads, and the hot fluid outlet 2 is fixed on the sealing top cover 3 by welding.

[0046] By screwing the cold fluid inlet 1 and the hot fluid outlet 2 with the external device, the sealing of the cooling liquid during transportation in the heat dissipation device is ensured, and the leakage during cooling is avoided to cause damage to the chip or other computer equipment, and the safety of the device as a whole is higher.

[0047] Specifically, the thickness ratio of the heat dissipation flow channel carrying plate 5 to the shell of the sealing top cover 3 is in the range of 0.1-10. To ensure the heat dissipation effect of the cooling liquid during flow and the sealing and safety of the heat dissipation device.

[0048] In combination with the above-mentioned various preferred embodiments, the present embodiment also provides an optimal embodiment, which is specifically:

[0049] An integrated chip liquid cooling heat dissipation device, comprising a cold fluid inlet 1, a hot fluid outlet 2, a sealing top cover 3 and a heat dissipation flow channel carrying plate 5, all components are welded into a complete sealed heat dissipation device by welding process and integrated molding technology.

[0050] As shown in Figure 4 The heat dissipation flow channel carrying plate 5 is provided with a cold fluid distribution cavity 51, a hot fluid collection cavity 52 and a heat dissipation flow channel 53. The structure of the heat dissipation flow channel carrying plate is customized according to the size and shape of the chip.

[0051] As Figure 4 shown, the heat dissipation flow channel 53 is composed of several parallel flow channels arranged in parallel, the number and spacing of which are customized according to the size and heat flux density of the chip.

[0052] As Figure 4 shown, the cold fluid distribution cavity 51 is connected with the cold fluid inlet 1, and is responsible for guiding the heat dissipation working medium to enter the heat dissipation flow channel 53 uniformly and orderly.

[0053] As Figure 4 shown, the hot fluid collection cavity 52 is connected with the hot fluid outlet 2, and is responsible for collecting and discharging the heat dissipation working medium in the heat dissipation flow channel 53.

[0054] As Figure 3 shown, the sealing top cover 3 is welded above the hot fluid distribution plate 5, and is provided with several fixed pins, which can fix the sealing top cover and the entire heat dissipation device welded thereon on the chip packaging substrate 4, and the sealing top cover 3 and the chip packaging substrate 4 together realize the packaging and protection of the integrated circuit chip (die, DIE) 7.

[0055] As Figure 2 shown, the cold fluid inlet 1 and the hot fluid outlet 2 are sealing threaded fluid inlets and outlets welded on the sealing top cover 3, which can be tightly connected with the external fluid pipeline, and the cold and hot fluid inlets and outlets input the cooling fluid into the heat dissipation device and output the heated fluid to the external environment.

[0056] The thickness ratio of the heat dissipation flow channel bearing plate 5 to the sealing top cover 3 is preferably 0.1-10.

[0057] The compact chip high-efficiency heat dissipation device is fixed with the chip packaging substrate 4 at the same time, and the heat dissipation flow channel bearing plate 5 is fixed on the top end of the integrated circuit chip (die, DIE) 7 through the brazing process 6.

[0058] In summary, the application provides an integrated chip liquid cooling heat dissipation device, comprising a cold fluid inlet 1, a hot fluid outlet 2, a sealing top cover 3 and a heat dissipation flow channel bearing plate 5, all components are welded into a complete sealed heat dissipation device by welding process integrated molding technology, the heat dissipation flow channel bearing plate 5 is provided with a cold fluid distribution cavity 51, a hot fluid collection cavity 52 and a heat dissipation flow channel 53, the heat dissipation flow channel 53 is composed of a plurality of parallel flow channels arranged in parallel, the cold fluid distribution cavity 51 guides the heat dissipation working medium to enter the heat dissipation flow channel 53 uniformly and orderly, and the hot fluid collection cavity 52 collects the heat dissipation working medium in the heat dissipation flow channel 53 and then discharges it uniformly. Compared with the prior art, the heat dissipation flow channel and the chip top cover are combined by welding process integrated molding technology, so that the cooling performance of the heat dissipation equipment is effectively improved, and the temperature of the chip is maintained uniform and stable. In addition, the integrated design of the heat dissipation device is beneficial to save the internal space of the case, and brings advantages in simplifying the installation process, enhancing the compatibility, reducing the risk of leakage and improving the design beauty, etc.

[0059] The preferred embodiments of the application are described in detail above. It should be understood that those skilled in the art can make many modifications and changes without creative labor based on the concept of the application. Therefore, any technical solution obtained by logical analysis, reasoning or limited experiment based on the prior art according to the concept of the application shall be within the protection scope determined by the claims.

Claims

1. An integrated chip liquid cooling heat sink, comprising: Chip packaging substrate (4), heat dissipation flow channel bearing plate (5), sealing top cover (3) and chip (7), the chip (7) is located above the chip packaging substrate (4), the heat dissipation flow channel bearing plate (5) is fixed above the chip (7), the sealing top cover (3) is fixed above the heat dissipation flow channel bearing plate (5), and the chip packaging substrate (4) is connected; The heat dissipation flow channel bearing plate (5) comprises a cold fluid distribution cavity (51), a heat dissipation flow channel (53) and a hot fluid collection cavity (52) in sequence, the top of the sealing top cover (3) is provided with a cold fluid inlet (1) and a hot fluid outlet (2), the cold fluid inlet (1) is communicated with the cold fluid distribution cavity (51), and the hot fluid outlet (2) is communicated with the hot fluid collection cavity (52); The cold fluid inlet (1), the hot fluid outlet (2), the sealing top cover (3) and the heat dissipation flow channel bearing plate (5) are welded into a complete sealing heat dissipation device by welding process and integral molding technology; The heat dissipation flow channel (53) of the heat dissipation flow channel bearing plate (5) is located above the chip heat dissipation area, and the area of the heat dissipation flow channel (53) is customized and designed according to the size and shape of the chip; The number of the heat dissipation flow channels (53) is multiple, the left end of each heat dissipation flow channel (53) is communicated with the cold fluid distribution cavity (51), and the right end is communicated with the hot fluid collection cavity (52); The heat dissipation flow channels (53) are parallelly distributed between the cold fluid distribution cavity (51) and the hot fluid collection cavity (52), and the number and spacing of the heat dissipation flow channels (53) are customized and designed according to the size and heat flux density of the chip; The cold fluid distribution cavity (51) and the hot fluid collection cavity (52) are both cavity bodies with expansion structure, the bottom end of the cavity body with expansion structure is communicated with the heat dissipation flow channel (53), and the top end of the cavity body with expansion structure is communicated with the cold fluid inlet (1) or the hot fluid outlet (2); The shell thickness ratio of the heat dissipation flow channel bearing plate (5) to the sealing top cover (3) ranges from 0.1 to 10.

2. The integrated chip liquid cooling heat sink of claim 1, wherein, The chip (7) and the heat dissipation flow channel bearing plate (5) are provided with brazing filler metal (6), and the chip (7) and the heat dissipation flow channel bearing plate (5) are welded by brazing.

3. The integrated chip liquid cooling heat sink of claim 1, wherein, Two ends and the middle position below the sealing top cover (3) are provided with fixed pins, and the sealing top cover (3) is welded and fixed on the chip packaging substrate (4) through the fixed pins.

4. The integrated chip liquid cooling heat sink of claim 1, wherein, The outer sides of the cold fluid inlet (1) and the hot fluid outlet (2) are provided with threads, and the cold fluid inlet (1) and the hot fluid outlet (2) are connected with external equipment through threads.

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