A light strip dispensing process

Abstract

A light bar dispensing process includes the following steps: first add the mixed glue into a vacuum degassing mixer, then add the fluorescent powder, vacuum degassing and stirring to mix evenly, remove the remaining bubbles in the fluorescent glue and the bubbles in the dispensing machine cavity, test the fluorescent glue on the machine, add the fluorescent glue into the dispensing machine cavity, load the material to be dispensed into the feeding rack, debug the position of the Y / Z / W three-axis of the dispensing head of the dispensing machine, and use the dispensing machine camera to align the material to be dispensed, set the number of chip recognitions according to the number of lights of the material to be dispensed, and then use the recognition chip image alignment correction method to determine the needle position for dispensing, and then bake the material after dispensing, and the dispensing is completed after the dispensing is taken out of the oven to obtain a light bar with good dispensing. The dispensing process of this application enables the chip to be completely covered by glue, thereby ensuring that the glue completely blocks the chip.

Description

Technical Field

[0001] The invention relates to a light bar glue dispensing process, belonging to the technical field of semiconductor lighting. Background Art

[0002] Glue dispensing is a process, also known as gluing, coating, pouring, dripping, etc. It is to apply, pour, and drip electronic glue, oil or other liquids onto the product to make the product stick, pour, insulate, fix, and have a smooth surface.

[0003] The die bonder uses a nozzle to suck the chip on the wafer from the die supply position, and then moves it to the die bonding position on the lead frame, and accurately installs the chip on the lead frame to achieve die bonding. The wafer is installed in the wafer ring, and the chip is ejected by the die removal mechanism, and the nozzle sucks and moves the chip. The lead frame is transported to the mounting position through the conveying mechanism. After the die bonding is completed, the lead frame is pushed into the material box for unloading. At present, the traditional chip bonding process mainly pre-coats liquid glue on the chip carrier, then places the chip on it, and finally cures the glue to fix the chip. To complete this process, a dispensing module is required.

[0004] Usually when gluing the chip carrier, it is necessary to visually inspect the glue dispensing position to ensure that the glue dispensing position is correct. The existing light bar glue dispensing process usually equips a glue dispensing mechanism with a visual detector. After the visual detector detects the glue dispensing position, the glue dispensing mechanism starts to dispense glue. Since the speed of the visual detector is greater than the speed of glue dispensing, the visual detector needs to wait until the glue dispensing is completed before it can detect the next glue dispensing work area. This not only affects the glue dispensing efficiency, but also requires a visual detector to be equipped for a glue dispensing mechanism, resulting in high production costs. In addition, the existing technology uses the pad as the image recognition standard, but due to the supplier's sheet ink printing problem, the pad will be offset, so its camera is replaced with a higher precision, and the image recognition is changed to chip recognition, so that its positioning is more accurate and will not be accidentally offset, resulting in the phenomenon that the glue dispensed often cannot completely cover the chip during glue dispensing. Summary of the invention

[0005] In view of the above-mentioned deficiencies of the prior art, an object of the present invention is to provide a light bar glue dispensing process, so that the chip can be completely covered by glue, thereby ensuring that the glue completely covers the chip.

[0006] According to a first embodiment of the present invention, a light bar dispensing process is provided, comprising the following steps:

[0007] (1) Preparation of fluorescent glue: first add the mixed glue into a vacuum degassing mixer, then add the fluorescent powder, vacuum degassing and stirring to mix evenly to obtain fluorescent glue;

[0008] (2) Exhaust: Pour a small amount of the fluorescent glue prepared in step (1) into the glue barrel of the glue dispenser, first close the lower pipe valve, place the glue pressing block, close and seal the glue barrel cover, vacuum to remove the remaining bubbles in the fluorescent glue, turn off the vacuum pump, and then slowly open the air release valve. After the air pressure returns to normal, open the lower pipe valve and close the air release valve, then open the pressurized pipe to increase the pressure until the pipe pressure is stable. After adjusting the glue dispensing pressure plate, roller and needle, adjust the glue dispensing machine cavity, glue width and height, and put a small amount of the fluorescent glue prepared in step (1) on the machine for testing to eliminate the bubbles in the glue dispensing machine cavity, and then add fluorescent glue to the glue dispensing machine cavity for standby use;

[0009] (3) Glue dispensing: Load the material to be dispensed into the feeding rack, adjust the position of the Y / Z / W axis of the glue dispensing head of the glue dispensing machine, and use the glue dispensing machine camera to align the material to be dispensed. Set the number of chip recognitions according to the number of lights on the material to be dispensed, determine the needle position by recognizing the chip image, and then use the image alignment correction method to determine the glue dispensing time and position. The glue dispensing machine controls the glue dispensing head to dispense the material to be dispensed;

[0010] (4) The material dispensed in step (3) is baked, and the dispensed light strip is obtained after the material is taken out of the oven.

[0011] Furthermore, as a more preferred embodiment of the present invention, in step (1), the mass ratio of the mixed glue to the phosphor is 30-35:1.

[0012] Furthermore, as a more preferred embodiment of the present invention, in step (1), the mixed glue includes one-component silica gel and zirconium oxide beads, and the mass ratio of the one-component silica gel to the zirconium oxide beads is 3-5:0.06-0.1; the one-component silica gel is GRT_S2450 semi-thixotropic silica gel; and the diameter of the zirconium oxide beads is 20±1 mm.

[0013] Furthermore, as a more preferred embodiment of the present invention, the preparation method of the mixed glue is: firstly put the single-component silica gel into a vacuum degassing mixer, add zirconium oxide beads under stirring, continue to degas and stir evenly, and obtain the mixed glue.

[0014] Further, as a more preferred embodiment of the present invention, in step (1), the phosphor is a rare earth dual-color phosphor, including red powder and green powder, the mass ratio of red powder to green powder is 0.8-1:2.5-3, and the red powder is europium-activated yttrium oxide (Y 2 O 3 :Eu), green powder is cerium and terbium activated aluminate (MgAl 11 O 19 :Ce,Tb).

[0015] Furthermore, as a more preferred embodiment of the present invention, in step (2), the needle is 2 to 3 mm away from the plate to avoid damage to the needle due to improper adjustment of the needle and to avoid scratching the chip resistor with the needle.

[0016] Furthermore, as a more preferred embodiment of the present invention, in step (2), the vacuuming time is 28 to 32 minutes; the pressure is to control the air pressure in the pipeline to be stable at above 200 MPa.

[0017] Furthermore, as a more preferred embodiment of the present invention, in step (3), the number of chips recognized is 3 for 480 lights, 2 for 320 lights, and 1 for 280 lights.

[0018] Furthermore, as a more preferred embodiment of the present invention, in step (4), the baking is first performed in a tunnel furnace that is preheated 5 to 10 minutes in advance for a short baking, and then the material is centrally placed into the furnace, and after being taken out of the furnace, a winder is used to wind the material into a roll, and the material is suspended in the air with an iron rod and then placed in an oven for a long baking.

[0019] Furthermore, as a more preferred embodiment of the present invention, the tunnel furnace is a long tunnel furnace, and the long tunnel furnace is divided into four different chambers, and the baking temperatures of the four chambers are 100±5℃, 120±5℃, 160±5℃, and 100±5℃, respectively.

[0020] Furthermore, as a more preferred embodiment of the present invention, the conditions for long baking in the oven are: temperature of 160°C±5°C, time of 115 to 125 minutes.

[0021] GRT_S2450 is a single-component platinum-catalyzed addition-type semi-thixotropic silicone rubber. It is a single-component silicone rubber specially used for soft light strips. The product has high transparency, good adhesion, ultra-low volatility, moderate viscosity, suitable for fast dispensing, and outstanding adhesion. It is used for MLCOB / FCOB flexible light strips and is suitable for most flexible circuit boards. The use of single-component silicone rubber makes it easy to mix the phosphor into a syringe, which can be directly put on the dispensing machine for batch production. It can dispense glue continuously on infinitely long boards, thereby reducing the use of two-component mixing and degassing processes, saving labor and equipment, and improving production efficiency and product consistency. The GRT_S2450 semi-thixotropic silicone rubber used does not need to be baked for a long time, and only needs to be baked in the tunnel furnace for 14 to 17 minutes before it can be taken out of the oven.

[0022] The GRT_S2450 semi-thixotropic silica gel used was purchased from Zhuhai Gu Ruitai Composite Materials Co., Ltd.

[0023] Compared with the prior art, the technical solution provided by this application has the following advantages:

[0024] (1) The dispensing process of the present application adopts an image point correction method as an image recognition standard during the dispensing process. During recognition, three chips are used as an identification unit, and the connection line of the three chips is the dispensing track. In this way, the chip can be completely covered by glue. By identifying the chip rather than the pad, it is ensured that the chip is completely covered by glue.

[0025] (2) This application uses a one-component silicone. It has a fast curing time, increases the curing speed, has strong colloid adhesion, and reduces the production time of subsequent baking. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 Schematic diagram of the effect of glue spotting in the glue spotting process of the light bar in Example 1 of the present application. DETAILED DESCRIPTION

[0027] In order to enable those skilled in the art to better understand the technical solutions in the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of this application.

[0028] It should be noted that the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "multiple" and "several" is two or more, unless otherwise clearly and specifically defined.

[0029] It should be noted that the structures, proportions, sizes, etc. illustrated in the drawings of this specification are only used to match the contents disclosed in the specification for people familiar with this technology to understand and read, and are not used to limit the conditions under which this application can be implemented. Therefore, they have no substantive technical significance. Any structural modification, change in proportional relationship or adjustment of size should still fall within the scope of the technical content disclosed in this application without affecting the effects and purposes that can be achieved by this application.

[0030] According to a first embodiment of the present invention, a light bar dispensing process is provided, comprising the following steps:

[0031] (1) Preparation of fluorescent glue: first add the mixed glue into a vacuum degassing mixer, then add the fluorescent powder, vacuum degassing and stirring to mix evenly to obtain fluorescent glue;

[0032] (2) Exhaust: Pour a small amount of the fluorescent glue prepared in step (1) into the glue barrel of the glue dispenser, first close the lower pipe valve, place the glue pressing block, close and seal the glue barrel cover, vacuum to remove the remaining bubbles in the fluorescent glue, turn off the vacuum pump, and then slowly open the air release valve. After the air pressure returns to normal, open the lower pipe valve and close the air release valve, then open the pressurized pipe to increase the pressure until the pipe pressure is stable. After adjusting the glue dispensing pressure plate, roller and needle, adjust the glue dispensing machine cavity, glue width and height, and put a small amount of the fluorescent glue prepared in step (1) on the machine for testing to eliminate the bubbles in the glue dispensing machine cavity, and then add fluorescent glue to the glue dispensing machine cavity for standby use;

[0033] (3) Glue dispensing: Load the material to be dispensed into the feeding rack, adjust the position of the Y / Z / W axis of the glue dispensing head of the glue dispensing machine, and use the glue dispensing machine camera to align the material to be dispensed. Set the number of chip recognitions according to the number of lights on the material to be dispensed, determine the needle position by recognizing the chip image, and then use the image alignment correction method to determine the glue dispensing time and position. The glue dispensing machine controls the glue dispensing head to dispense the material to be dispensed;

[0034] (4) The material dispensed in step (3) is baked, and the dispensed light strip is obtained after the material is taken out of the oven.

[0035] It should be noted that the prior art uses pads as the image recognition standard, but due to the ink printing problem of the supplier's sheet materials, the pads will be offset, so the camera is replaced with a higher precision one, and the image recognition is changed to chip recognition to make its positioning more accurate and avoid accidental offset, resulting in the phenomenon that the glue dispensed often fails to completely cover the chip when dispensing. This application uses an image point correction method as the image recognition standard. During recognition, three are used as an identification unit, and the three chip connections are the glue dispensing track, so that the chip can be completely covered by glue, and the chip is identified instead of the pad, thereby ensuring that the glue completely blocks the chip. And a single-component silicone is selected. The curing time is fast, the curing speed is increased, the colloid adhesion is strong, and the production time of subsequent baking is reduced.

[0036] Specifically, in the embodiment of the present invention, in step (1), the mass ratio of the mixed glue to the phosphor is 30-35:1.

[0037] The rotation speed of vacuum degassing and stirring is 600-1300r / s, the vacuum degree is 50-100Pa, the revolution-rotation ratio is 1:04-1, and the vacuum degassing and stirring degassing time is set according to the amount of fluorescent glue in the glue cylinder, as shown in Table 1 below.

[0038] Table 1 Relationship between degassing time and fluorescent glue amount

[0039] Serial number Fluorescent glue amount Degassing time (min) 1 ≦5 kg 10 2 5 kg ≧ 10 kg 15 3 10kg≧15kg 20 4 15kg≧20kg 30

[0040] Specifically, in an embodiment of the present invention, in step (1), the mixed glue includes single-component silica gel and zirconia beads, and the mass ratio of the single-component silica gel to the zirconia beads is 3-5:0.06-0.1; the single-component silica gel is GRT_S2450 semi-thixotropic silica gel; and the diameter of the zirconia beads is 20±1 mm.

[0041] Specifically, in an embodiment of the present invention, the preparation method of the mixed glue is: firstly put the single-component silica gel into a vacuum degassing mixer, add zirconium oxide beads under stirring, continue to degas and stir evenly, and obtain the mixed glue.

[0042] Specifically, in an embodiment of the present invention, in step (1), the phosphor is a rare earth dual-color phosphor, including red powder and green powder, the mass ratio of red powder to green powder is 0.8~1:2.5~3, the red powder is europium-activated yttrium oxide (Y2O3:Eu), and the green powder is cerium and terbium-activated aluminate (MgAl11O19:Ce,Tb).

[0043] Before preparing the mixed glue each time, shake the phosphor for more than 30 seconds, and stir it evenly after preparation to prevent any particles in the mixed glue to avoid adverse conditions in the appearance and luminescence of the colloid after dispensing.

[0044] Specifically, in the embodiment of the present invention, in step (2), the needle is 2 to 3 mm away from the plate to avoid damage to the needle due to improper adjustment of the needle and to avoid scratching the chip resistor with the needle.

[0045] Specifically, in the embodiment of the present invention, in step (2), the vacuuming time is 28 to 32 minutes; the pressure is to control the air pressure in the pipeline to be stable at above 200 MPa.

[0046] In step (2), the powder dispensing machine is debugged with a machine adjustment product. During the operation, only the height of the dispensing needle needs to be adjusted. After the production line is empty, a section of material is tested under a microscope to see if the chip resistor is scratched. Use a machine adjustment product to test whether the machine cavity is tilted. According to the colloid width requirements: 8mm board width: 3.1mm-3.7mm, 5mm board width: 2.2mm-2.6mm; colloid height requirements: 8mm board width: 1.4mm-2.0mm, 5mm board width: 1.0mm-1.5mm; confirm the machine glue volume (20~21) and dispensing head height (85000~98000) parameters.

[0047] Specifically, in the embodiment of the present invention, in step (3), the number of chips recognized is 3 for 480 lights, 2 for 320 lights, and 1 for 280 lights.

[0048] Specifically, in the embodiment of the present invention, in step (4), the baking is first performed in a tunnel furnace that is preheated 5 to 10 minutes in advance for a short baking, and then the material is centrally placed into the furnace. After being taken out of the furnace, the material is rolled up using a winder, and then suspended in the air with an iron rod and placed in an oven for a long baking.

[0049] To explain specifically, in an embodiment of the present invention, the tunnel furnace is a long tunnel furnace, and the long tunnel furnace is divided into four different chambers, and the baking temperatures of the four chambers are 100±5°C, 120±5°C, 160±5°C, and 100±5°C, respectively.

[0050] Specifically, in the embodiment of the present invention, the conditions for long baking in the oven are: temperature of 160° C.±5° C., and time of 115 to 125 minutes.

[0051] Example 1

[0052] A light bar dispensing process, comprising the following steps:

[0053] (1) Preparation of fluorescent glue: first add the mixed glue into a vacuum degassing mixer, then add the fluorescent powder, vacuum degassing and stirring to mix evenly to obtain fluorescent glue;

[0054] The mass ratio of the mixed glue to the fluorescent powder is 30:1; the mixed glue includes single-component silica gel and zirconium oxide beads, and the mass ratio of the single-component silica gel to the zirconium oxide beads is 3:0.06; the single-component silica gel is GRT_S2450 semi-thixotropic silica gel; the diameter of the zirconium oxide beads is 20±1mm; the preparation method of the mixed glue is: firstly put the single-component silica gel into a vacuum degassing mixer, add zirconium oxide beads under stirring, continue to degas and stir evenly, and obtain the mixed glue; the fluorescent powder is a rare earth dual-color fluorescent powder, including red powder and green powder, the mass ratio of red powder to green powder is 0.8:2.5, the red powder is europium-activated yttrium oxide (Y 2 O 3 :Eu), green powder is cerium and terbium activated aluminate (MgAl 11 O 19 :Ce,Tb);

[0055] (2) Exhaust: Pour a small amount of the fluorescent glue prepared in step (1) into the glue barrel of the glue dispenser, first close the lower pipe valve, place the glue pressing block, close and seal the glue barrel cover, vacuum to remove the remaining bubbles in the fluorescent glue, turn off the vacuum pump, and then slowly open the air release valve. After the air pressure returns to normal, open the lower pipe valve and close the air release valve, then open the pressurized pipe to increase the pressure until the pipe pressure is stable. After adjusting the glue dispensing pressure plate, roller and needle, adjust the glue dispensing machine cavity, glue width and height, and put a small amount of the fluorescent glue prepared in step (1) on the machine for testing to eliminate the bubbles in the glue dispensing machine cavity, and then add fluorescent glue to the glue dispensing machine cavity for standby use;

[0056] The needle is 2mm away from the plate to avoid damage to the needle due to improper adjustment and scratching of the chip resistor by the needle; the vacuuming time is 28min; the pressure is to control the air pressure in the pipeline to be stable above 200Mpa;

[0057] (3) Glue dispensing: Load the material to be dispensed into the feeding rack, debug the position of the Y / Z / W three-axis of the glue dispensing head of the glue dispensing machine, and use the glue dispensing machine camera to align the material to be dispensed. Set the number of chips to be recognized according to the number of lights of the material to be dispensed, determine the needle position by recognizing the chip image, and then use the image alignment correction method to determine the glue dispensing time and position. The glue dispensing machine controls the glue dispensing head to dispense the material to be dispensed; the number of chips to be recognized is 3 for 480 lights, 2 for 320 lights, and 1 for 280 lights;

[0058] (4) baking the material after glue dispensing in step (3), taking it out of the oven and completing glue dispensing, thereby obtaining a glue-dispensed light strip;

[0059] In step (4), the baking is first performed in a tunnel furnace that has been preheated for 5 minutes in advance for a short baking, and then the material is centrally placed in the furnace. After being taken out of the furnace, the material is rolled up using a winder, and then suspended in the air with an iron rod and placed in an oven for a long baking. The tunnel furnace is a long tunnel furnace, and the long tunnel furnace is divided into four different chambers, and the baking temperatures of the four chambers are 100±5°C, 120±5°C, 160±5°C, and 100±5°C, respectively. The conditions for the long baking in the oven are: temperature of 160°C±5°C, and time of 115 minutes.

[0060] Example 2

[0061] A light bar dispensing process, comprising the following steps:

[0062] (1) Preparation of fluorescent glue: first add the mixed glue into a vacuum degassing mixer, then add the fluorescent powder, vacuum degassing and stirring to mix evenly to obtain fluorescent glue;

[0063] The mass ratio of the mixed glue to the phosphor is 35:1; the mixed glue includes single-component silica gel and zirconium oxide beads, and the mass ratio of the single-component silica gel to the zirconium oxide beads is 5:0.1; the single-component silica gel is GRT_S2450 semi-thixotropic silica gel; the diameter of the zirconium oxide beads is 20±1mm; the preparation method of the mixed glue is: first put the single-component silica gel into a vacuum degassing mixer, add zirconium oxide beads under stirring, continue to degas and stir evenly to obtain the mixed glue; the phosphor is a rare earth dual-color phosphor, including red powder and green powder, the mass ratio of red powder to green powder is 1:3, the red powder is europium-activated yttrium oxide (Y 2 O 3 :Eu), green powder is cerium and terbium activated aluminate (MgAl 11O 19 :Ce,Tb);

[0064] (2) Exhaust: Pour a small amount of the fluorescent glue prepared in step (1) into the glue barrel of the glue dispenser, first close the lower pipe valve, place the glue pressing block, close and seal the glue barrel cover, vacuum to remove the remaining bubbles in the fluorescent glue, turn off the vacuum pump, and then slowly open the air release valve. After the air pressure returns to normal, open the lower pipe valve and close the air release valve, then open the pressurized pipe to increase the pressure until the pipe pressure is stable. After adjusting the glue dispensing pressure plate, roller and needle, adjust the glue dispensing machine cavity, glue width and height, and put a small amount of the fluorescent glue prepared in step (1) on the machine for testing to eliminate the bubbles in the glue dispensing machine cavity, and then add fluorescent glue to the glue dispensing machine cavity for standby use;

[0065] The needle is 3mm away from the plate to avoid damage to the needle due to improper adjustment and scratching of the chip resistor by the needle; the vacuuming time is 32min; the pressure is to control the air pressure in the pipeline to be stable above 200Mpa;

[0066] (3) Glue dispensing: Load the material to be dispensed into the feeding rack, debug the position of the Y / Z / W three-axis of the glue dispensing head of the glue dispensing machine, and use the glue dispensing machine camera to align the material to be dispensed. Set the number of chips to be recognized according to the number of lights of the material to be dispensed, determine the needle position by recognizing the chip image, and then use the image alignment correction method to determine the glue dispensing time and position. The glue dispensing machine controls the glue dispensing head to dispense the material to be dispensed; the number of chips to be recognized is 3 for 480 lights, 2 for 320 lights, and 1 for 280 lights;

[0067] (4) baking the material after glue dispensing in step (3), taking it out of the oven and completing glue dispensing, thereby obtaining a glue-dispensed light strip;

[0068] In step (4), the baking is first performed in a tunnel furnace preheated for 10 minutes in advance for a short baking, and then the material is centrally placed into the furnace. After being taken out of the furnace, the material is rolled up using a winder, and then suspended in the air with an iron rod and placed in an oven for a long baking. The tunnel furnace is a long tunnel furnace, and the long tunnel furnace is divided into four different chambers, and the baking temperatures of the four chambers are 100±5°C, 120±5°C, 160±5°C, and 100±5°C, respectively. The conditions for the long baking in the oven are: temperature of 160±5°C, and time of 125 minutes.

[0069] Example 3

[0070] A light bar dispensing process, comprising the following steps:

[0071] (1) Preparation of fluorescent glue: first add the mixed glue into a vacuum degassing mixer, then add the fluorescent powder, vacuum degassing and stirring to mix evenly to obtain fluorescent glue;

[0072] The mass ratio of the mixed glue to the fluorescent powder is 33:1; the mixed glue includes single-component silica gel and zirconium oxide beads, and the mass ratio of the single-component silica gel to the zirconium oxide beads is 4:0.08; the single-component silica gel is GRT_S2450 semi-thixotropic silica gel; the diameter of the zirconium oxide beads is 20±1mm; the preparation method of the mixed glue is: firstly put the single-component silica gel into a vacuum degassing mixer, add zirconium oxide beads under stirring, continue to degas and stir evenly, and obtain the mixed glue; the fluorescent powder is a rare earth dual-color fluorescent powder, including red powder and green powder, the mass ratio of red powder to green powder is 0.9:2.8, the red powder is europium-activated yttrium oxide (Y 2 O 3 :Eu), green powder is cerium and terbium activated aluminate (MgAl 11 O 19 :Ce,Tb);

[0073] (2) Exhaust: Pour a small amount of the fluorescent glue prepared in step (1) into the glue barrel of the glue dispenser, first close the lower pipe valve, place the glue pressing block, close and seal the glue barrel cover, vacuum to remove the remaining bubbles in the fluorescent glue, turn off the vacuum pump, and then slowly open the air release valve. After the air pressure returns to normal, open the lower pipe valve and close the air release valve, then open the pressurized pipe to increase the pressure until the pipe pressure is stable. After adjusting the glue dispensing pressure plate, roller and needle, adjust the glue dispensing machine cavity, glue width and height, and put a small amount of the fluorescent glue prepared in step (1) on the machine for testing to eliminate the bubbles in the glue dispensing machine cavity, and then add fluorescent glue to the glue dispensing machine cavity for standby use;

[0074] The needle is 2.5mm away from the plate to avoid damage to the needle due to improper adjustment and scratching of the chip resistor by the needle; the vacuuming time is 30min; the pressure is to control the air pressure in the pipeline to be stable above 200Mpa;

[0075] (3) Glue dispensing: Load the material to be dispensed into the feeding rack, debug the position of the Y / Z / W three-axis of the glue dispensing head of the glue dispensing machine, and use the glue dispensing machine camera to align the material to be dispensed. Set the number of chips to be recognized according to the number of lights of the material to be dispensed, determine the needle position by recognizing the chip image, and then use the image alignment correction method to determine the glue dispensing time and position. The glue dispensing machine controls the glue dispensing head to dispense the material to be dispensed; the number of chips to be recognized is 3 for 480 lights, 2 for 320 lights, and 1 for 280 lights;

[0076] (4) baking the material after glue dispensing in step (3), taking it out of the oven and completing glue dispensing, thereby obtaining a glue-dispensed light strip;

[0077] In step (4), the baking is first performed in a tunnel furnace preheated for 8 minutes in advance for a short baking, and then the material is centrally placed into the furnace. After being taken out of the furnace, the material is rolled up using a winder, and then suspended in the air with an iron rod and placed in an oven for a long baking. The tunnel furnace is a long tunnel furnace, and the long tunnel furnace is divided into four different chambers, and the baking temperatures of the four chambers are 100±5°C, 120±5°C, 160±5°C, and 100±5°C, respectively. The conditions for the long baking in the oven are: temperature of 160±5°C, and time of 120 minutes.

[0078] Example 4

[0079] A light bar dispensing process, comprising the following steps:

[0080] (1) Preparation of fluorescent glue: first add the mixed glue into a vacuum degassing mixer, then add the fluorescent powder, vacuum degassing and stirring to mix evenly to obtain fluorescent glue;

[0081] The mass ratio of the mixed glue to the fluorescent powder is 31:1; the mixed glue includes single-component silica gel and zirconium oxide beads, and the mass ratio of the single-component silica gel to the zirconium oxide beads is 3.5:0.07; the single-component silica gel is GRT_S2450 semi-thixotropic silica gel; the diameter of the zirconium oxide beads is 20±1mm; the preparation method of the mixed glue is: firstly put the single-component silica gel into a vacuum degassing mixer, add zirconium oxide beads under stirring, continue to degas and stir evenly, and obtain the mixed glue; the fluorescent powder is a rare earth dual-color fluorescent powder, including red powder and green powder, and the mass ratio of red powder to green powder is 0.85:2.6, and the red powder is europium-activated yttrium oxide (Y 2 O 3 :Eu), green powder is cerium and terbium activated aluminate (MgAl 11 O 19 :Ce,Tb);

[0082] (2) Exhaust: Pour a small amount of the fluorescent glue prepared in step (1) into the glue barrel of the glue dispenser, first close the lower pipe valve, place the glue pressing block, close and seal the glue barrel cover, vacuum to remove the remaining bubbles in the fluorescent glue, turn off the vacuum pump, and then slowly open the air release valve. After the air pressure returns to normal, open the lower pipe valve and close the air release valve, then open the pressurized pipe to increase the pressure until the pipe pressure is stable. After adjusting the glue dispensing pressure plate, roller and needle, adjust the glue dispensing machine cavity, glue width and height, and put a small amount of the fluorescent glue prepared in step (1) on the machine for testing to eliminate the bubbles in the glue dispensing machine cavity, and then add fluorescent glue to the glue dispensing machine cavity for standby use;

[0083] The needle is 2.3mm away from the plate to avoid damage to the needle due to improper adjustment and scratching of the chip resistor by the needle; the vacuuming time is 29min; the pressure is to control the air pressure in the pipeline to be stable above 200Mpa;

[0084] (3) Glue dispensing: Load the material to be dispensed into the feeding rack, debug the position of the Y / Z / W three-axis of the glue dispensing head of the glue dispensing machine, and use the glue dispensing machine camera to align the material to be dispensed. Set the number of chips to be recognized according to the number of lights of the material to be dispensed, determine the needle position by recognizing the chip image, and then use the image alignment correction method to determine the glue dispensing time and position. The glue dispensing machine controls the glue dispensing head to dispense the material to be dispensed; the number of chips to be recognized is 3 for 480 lights, 2 for 320 lights, and 1 for 280 lights;

[0085] (4) baking the material after glue dispensing in step (3), taking it out of the oven and completing glue dispensing, thereby obtaining a glue-dispensed light strip;

[0086] The baking is first carried out in a tunnel furnace preheated for 6 minutes in advance for a short baking, and then the material is sent into the center of the furnace. After coming out of the furnace, it is rolled up by a winder, suspended in the air with an iron rod, and then put into the oven for long baking; the tunnel furnace is a long tunnel furnace, and the long tunnel furnace is divided into four different chambers, and the baking temperatures of the four chambers are 100±5℃, 120±5℃, 160±5℃, and 100±5℃ respectively; the conditions for long baking in the oven are: temperature of 160℃±5℃, time of 118min.

[0087] Example 5

[0088] A light bar dispensing process, comprising the following steps:

[0089] (1) Preparation of fluorescent glue: first add the mixed glue into a vacuum degassing mixer, then add the fluorescent powder, vacuum degassing and stirring to mix evenly to obtain fluorescent glue;

[0090] The mass ratio of the mixed glue to the fluorescent powder is 34:1; the mixed glue includes single-component silica gel and zirconium oxide beads, and the mass ratio of the single-component silica gel to the zirconium oxide beads is 4.5:0.09; the single-component silica gel is GRT_S2450 semi-thixotropic silica gel; the diameter of the zirconium oxide beads is 20±1mm; the preparation method of the mixed glue is: firstly put the single-component silica gel into a vacuum degassing mixer, add zirconium oxide beads under stirring, continue to degas and stir evenly, and obtain the mixed glue; the fluorescent powder is a rare earth dual-color fluorescent powder, including red powder and green powder, and the mass ratio of red powder to green powder is 0.95:2.9, and the red powder is europium-activated yttrium oxide (Y 2 O 3 :Eu), green powder is cerium and terbium activated aluminate (MgAl 11 O 19 :Ce,Tb);

[0091] (2) Exhaust: Pour a small amount of the fluorescent glue prepared in step (1) into the glue barrel of the glue dispenser, first close the lower pipe valve, place the glue pressing block, close and seal the glue barrel cover, vacuum to remove the remaining bubbles in the fluorescent glue, turn off the vacuum pump, and then slowly open the air release valve. After the air pressure returns to normal, open the lower pipe valve and close the air release valve, then open the pressurized pipe to increase the pressure until the pipe pressure is stable. After adjusting the glue dispensing pressure plate, roller and needle, adjust the glue dispensing machine cavity, glue width and height, and put a small amount of the fluorescent glue prepared in step (1) on the machine for testing to eliminate the bubbles in the glue dispensing machine cavity, and then add fluorescent glue to the glue dispensing machine cavity for standby use;

[0092] The needle is 2.8mm away from the plate to avoid damage to the needle due to improper adjustment and scratching of the chip resistor by the needle; the vacuuming time is 31min; the pressure is to control the air pressure in the pipeline to be stable above 200Mpa;

[0093] (3) Glue dispensing: Load the material to be dispensed into the feeding rack, debug the position of the Y / Z / W three-axis of the glue dispensing head of the glue dispensing machine, and use the glue dispensing machine camera to align the material to be dispensed. Set the number of chips to be recognized according to the number of lights of the material to be dispensed, determine the needle position by recognizing the chip image, and then use the image alignment correction method to determine the glue dispensing time and position. The glue dispensing machine controls the glue dispensing head to dispense the material to be dispensed; the number of chips to be recognized is 3 for 480 lights, 2 for 320 lights, and 1 for 280 lights;

[0094] (4) baking the material after glue dispensing in step (3), taking it out of the oven and completing glue dispensing, thereby obtaining a glue-dispensed light strip;

[0095] The baking is first carried out in a tunnel furnace that is preheated 5 to 10 minutes in advance for a short baking, and then the material is sent into the furnace in the center. After coming out of the furnace, it is rolled up by a winder, suspended in the air with an iron rod, and then put into the oven for long baking; the tunnel furnace is a long tunnel furnace, and the long tunnel furnace is divided into four different chambers, and the baking temperatures of the four chambers are 100±5℃, 120±5℃, 160±5℃, and 100±5℃ respectively; the conditions for long baking in the oven are: temperature of 160℃±5℃, time of 123min.

[0096] Use the method of Example 1 to dispense glue on the light strip, use a remote tester to check the appearance of the material, observe whether the test data is within the required target map, whether the fluorescent glue is evenly distributed, and the format result is as follows: Figure 1 shown.

[0097] By adopting the embodiment scheme of the present application for glue dispensing, it was found that the material wafer can be completely covered by the glue, the glue can completely cover the chip, the colloid is smooth and round, and has strong adhesion, and the material does not have height difference, overflowing glue, large and small glue, snaking glue, dragging glue, carrying glue, surface glue and bottom glue.

[0098] To sum up, this application adopts the image point correction method as the image recognition standard. During recognition, three chips are used as an identification unit, and the three chip connection lines are used as glue dispensing tracks, so that the chip can be completely covered by glue. By identifying the chip rather than the pad, it is ensured that the glue completely blocks the chip.

[0099] The above description of the disclosed embodiments enables those skilled in the art to implement or use the present invention. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to the embodiments shown herein, but rather to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A light bar dispensing process, characterized in that: The following steps are involved: (1) Preparation of fluorescent glue: first add the mixed glue into a vacuum degassing mixer, then add the fluorescent powder, vacuum degassing and stirring to mix evenly to obtain fluorescent glue; (2) Exhaust: Pour a small amount of the fluorescent glue prepared in step (1) into the glue barrel of the glue dispenser, first close the valve of the lower pipe, place the glue pressing block, close and seal the lid of the glue barrel, draw out the remaining bubbles in the fluorescent glue by vacuuming, turn off the vacuum pump, and then slowly open the air release valve. After the air pressure returns to normal, open the valve of the lower pipe and close the air release valve, then open the pressurized pipe to increase the pressure until the pipe pressure is stable. After adjusting the glue dispensing plate, roller and needle, adjust the glue dispensing machine cavity, glue width and height, put a small amount of the fluorescent glue prepared in step (1) on the machine for testing, remove the bubbles in the glue dispensing machine cavity, and then add fluorescent glue to the glue dispensing machine cavity for standby use; (3) Glue dispensing: Load the material to be dispensed into the feed rack, debug the position of the Y / Z / W axis of the glue dispensing head of the glue dispensing machine, and use the glue dispensing machine camera to align the material to be dispensed. Set the number of chips to be identified according to the number of lights on the material to be dispensed, determine the needle position by identifying the chip image, and then use the image alignment correction method to determine the dispensing time and dispensing position. Three chips are used as an identification unit, and the connection line of the three chips is the dispensing track. The glue dispensing machine controls the glue dispensing head to dispense the material to be dispensed; (4) Bake the material dispensed in step (3), take it out of the oven and dispense it, and obtain a dispensed light strip; Wherein, in step (1), the mass ratio of the mixed glue to the phosphor is 30-35:1; Wherein, in step (1), the mixed glue comprises single-component silica gel and zirconium oxide beads, and the mass ratio of the single-component silica gel to the zirconium oxide beads is 3-5:0.06-0.1; the single-component silica gel is GRT_S2450 semi-thixotropic silica gel; the diameter of the zirconium oxide beads is 20±1 mm; the preparation method of the mixed glue is: firstly put the single-component silica gel into a vacuum degassing mixer, add the zirconium oxide beads under stirring, continue to degas and stir evenly, and obtain the mixed glue.

2. The light bar dispensing process according to claim 1, characterized in that: In step (1), the phosphor is a rare earth dual-color phosphor, including red powder and green powder, the mass ratio of red powder to green powder is 0.8-1:2.5-3, the red powder is europium-activated yttrium oxide, and the green powder is cerium- and terbium-activated aluminate.

3. The light bar dispensing process according to claim 2, characterized in that: In step (2), the needle tip is 2 to 3 mm away from the plate to avoid damage to the needle tip due to improper adjustment of the needle tip and to avoid scratching the chip resistor with the needle tip.

4. The light bar dispensing process according to claim 3, characterized in that: In step (2), the vacuuming time is 28 to 32 minutes; the pipeline pressure is controlled to stabilize the air pressure in the pipeline at above 200 MPa.

5. The light bar dispensing process according to claim 4, characterized in that: In step (4), the baking conditions are as follows: first, the material is short-baked in a tunnel furnace that has been preheated for 5 to 10 minutes in advance, and then the material is placed in the center of the furnace. After it is taken out of the furnace, it is rolled up using a winder, and then suspended in the air with an iron rod and placed in an oven for long baking.

6. The light bar dispensing process according to claim 5, characterized in that: The tunnel furnace is a long tunnel furnace, which is divided into four different chambers. The baking temperatures of the four chambers are 100±5°C, 120±5°C, 160±5°C, and 100±5°C, respectively.

7. The light bar dispensing process according to claim 5, characterized in that: The conditions for long baking in the oven are: temperature of 160° C.±5° C., and time of 115 to 125 minutes.

Images